Intelligent Inkjet Method and Equipment

Abstract

The present invention relates to the technical field of intelligent inkjet devices, and specifically discloses an intelligent inkjet method and device, including a bottom plate and a device body. The bottom plate is arranged at the bottom of the device body. A first placement plate and a second placement plate are respectively installed on the top of the bottom plate. An inkjet box body is installed on the top of the device body. An inkjet device is installed inside the inkjet box body. A moving plate is installed on the top of the device body. A limiting mechanism is installed on the top of the moving plate. The limiting mechanism includes two first limiting plates and two second limiting plates. An auxiliary testing mechanism is arranged inside both of the two first limiting plates. In this invention, after placing the semiconductor circuit board on the top of the moving plate, the four sides of the semiconductor circuit board can be pushed and limited by the limiting mechanism, ensuring that the semiconductor circuit board is placed in the center on the top of the moving plate, facilitating the subsequent precise inkjet printing of the semiconductor circuit board by the device, and indirectly improving the quality and efficiency of the inkjet printing of the semiconductor circuit board by the device.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor circuit board production, and particularly to an intelligent inkjet method and device. Background Art

[0002] An intelligent inkjet device refers to an inkjet device integrated with intelligent technology, featuring automation, high efficiency, precision, and multi-functionality. Such devices typically adopt digital inkjet printing technology, precisely controlling the inkjet head through a computer for printing, and are applicable to various application scenarios, such as advertising, exhibition display, textile printing and dyeing, decoration, and semiconductor circuit board production. In semiconductor circuit board packaging and flexible electronics manufacturing, it is necessary to use an inkjet printing device to print identification and recognition information on the semiconductor circuit board packaging, such as the manufacturer name, product model, production batch number, etc. These information are very important for product traceability and quality control.

[0003] When the existing intelligent inkjet devices are in use, although they can perform precise printing through a computer and a pre-set program, during the process of automatically placing the semiconductor circuit board on the top of the placement table of the device by a transfer manipulator, the semiconductor circuit board will generate slight vibrations when it lands on the top of the placement table, resulting in the situation that the semiconductor circuit board is prone to positional deviation after landing on the top of the placement table. When the device performs inkjet printing on the semiconductor circuit board, it will cause printing skew or misalignment. Manual adjustment requires precisely aligning the position of the semiconductor circuit board, which is time-consuming, laborious, inefficient, and not easy to adjust to the precise angle, greatly reducing the inkjet printing quality and efficiency of the device for the semiconductor circuit board. Summary of the Invention

[0004] The purpose of the present invention is to solve the drawbacks existing in the prior art and propose an intelligent inkjet method and device.

[0005] To achieve the above purpose, the present invention adopts the following technical solutions:

[0006] An intelligent inkjet device, including a bottom plate and a device body, the bottom plate is arranged at the bottom of the device body, a first placement plate and a second placement plate are respectively installed on the top of the bottom plate, an inkjet box body is installed on the top of the device body, an inkjet device is installed inside the inkjet box body, a moving plate for placing a semiconductor circuit board is slidably installed on the top of the device body, a limiting mechanism for correcting and limiting the four sides of the semiconductor circuit board to be printed is installed on the top of the moving plate, the limiting mechanism includes two first limiting plates and two second limiting plates arranged around the top of the moving plate, and an auxiliary testing mechanism for assisting the inkjet device to perform regular tests is arranged inside both of the two first limiting plates.

[0007] Optionally, a first sliding groove is formed at the top of the device body, a first sliding block is installed inside the first sliding groove, and the moving plate is installed on the top of the first sliding block.

[0008] Optionally, two first grooves are formed at the top of the moving plate, a first double-headed screw is rotatably installed inside each of the two first grooves, and two first moving blocks are installed on the outer walls of the two first double-headed screws.

[0009] Optionally, mounting plates are connected to the tops of the two first moving blocks through electric telescopic rods, both ends of the two first limiting plates are rotatably connected to the mounting plates close to them, hair dryers are installed at the bottoms of the two first limiting plates, and a plurality of air outlets are formed at the bottoms of the two hair dryers.

[0010] Optionally, cleaning pads are installed on the tops of the two first limiting plates, and a plurality of liquid discharge ports are formed at the tops of the two first limiting plates close to the cleaning pads.

[0011] Optionally, the auxiliary testing mechanism includes rectangular grooves formed inside the two first limiting plates, winding rollers are rotatably installed inside the two rectangular grooves, thin films are wound on the surfaces of the two winding rollers, through grooves are formed on the outer walls of one sides of the two first limiting plates, and one ends of the two thin films away from the winding rollers extend out through the through grooves.

[0012] Optionally, notches adapted to the thickness of the thin films are formed inside the two cleaning pads, one ends of the two thin films located outside the first limiting plates are inserted into the corresponding notches, and one ends of the two thin films away from the winding rollers are connected with connecting plates after passing through the notches, receiving grooves adapted to the connecting plates are formed on the outer walls of one sides of the two cleaning pads, and electromagnets are preset inside the two connecting plates.

[0013] Optionally, a second groove is further formed at the top of the moving plate, a second double-headed screw is rotatably installed inside the second groove, two second moving blocks are installed on the outer wall of the second double-headed screw, and the two second limiting plates are installed on the tops of the corresponding second moving blocks.

[0014] Optionally, second sliding grooves are formed on the outer walls of the sides where the two second limiting plates are close to each other, second sliding blocks are installed inside the two second sliding grooves, rotating plates are rotatably installed at the ends of the two second sliding blocks away from the second sliding grooves, and rubber pads are bonded to the outer walls of the sides of the two rotating plates away from the second sliding blocks.

[0015] Optionally, an intelligent inkjet method, the inkjet method includes the above inkjet device, and the inkjet method further includes the following steps:

[0016] Step 1: Place the semiconductor circuit board to be inkjet printed on the top of the first placement plate, and use the transfer manipulator to place the semiconductor circuit board on the top of the first placement plate on the top of the moving plate. Control the first slider to drive the moving plate and the semiconductor circuit board placed on its top to move into the inkjet box together. After inkjet printing a preset pattern on the top of the semiconductor circuit board with the inkjet device, control the first slider to drive the moving plate and the semiconductor circuit board to move back to the original position. Then, use the transfer manipulator to transfer the inkjet printed semiconductor circuit board from the top of the moving plate to the top of the second placement plate to complete the inkjet printing work on the semiconductor circuit board;

[0017] Step 2: After transferring the semiconductor circuit board to the top of the moving plate with the transfer manipulator, control the two first double-headed screws to drive the two corresponding first moving blocks to move towards each other, driving the two first limiting plates to move towards each other, and control the second double-headed screw to rotate, driving the two second limiting plates to move towards each other. During the process of moving towards each other, the two first limiting plates can push and limit the two sides of the semiconductor circuit board, and the two second limiting plates moving towards each other can push and limit the other two sides of the semiconductor circuit board to ensure that the semiconductor circuit board is placed in the center position on the top of the moving plate;

[0018] Step 3: After the two first limiting plates push and limit the two sides of the semiconductor circuit board on the top of the moving plate, control the two first limiting plates to rotate and adjust, driving the air blowing heads originally located at the bottom of the two first limiting plates to rotate to the closer side, and multiple air blowing ports on the two air blowing heads are all facing the top of the semiconductor circuit board. Control the multiple air blowing ports on the two air blowing heads to blow air towards the semiconductor circuit board to accelerate the drying of the ink on the surface of the semiconductor circuit board;

[0019] Step 4: After drying the inkjet printed ink on the surface of the semiconductor circuit board with multiple air blowing ports, control the two first limiting plates to rotate and adjust, driving the air blowing heads installed on the outer walls of one side of the two first limiting plates to rotate to the farther side, and the air blowing ports on the two air blowing heads blow air towards the tops of the first placement plate and the second placement plate respectively to clean the tops of the semiconductor circuit board to be processed and the processed semiconductor circuit board together;

[0020] Step Five: If double-sided printing is required for the semiconductor circuit board, after the inkjet device performs inkjet printing on the top of the semiconductor circuit board, the moving plate drives the semiconductor circuit board to move back to its original position. Control the two second limiting plates to move away from each other. Then control the two second sliders to move to the ends of the second sliding grooves together. Next, control the rubber pads on the side where the two second limiting plates are close to each other to abut against both sides of the semiconductor circuit board. Control the two rotating plates to rotate synchronously, driving the clamped semiconductor circuit board to rotate and turn over. As the two rotating plates drive the semiconductor circuit board to rotate downward to a horizontal state and contact the top of the moving plate, the automatic turning-over operation of the semiconductor circuit board is completed.

[0021] The beneficial effects of the present invention are as follows:

[0022] 1. In this invention, after the transfer manipulator places the semiconductor circuit board on the top of the moving plate, through the limiting mechanism arranged on the top of the moving plate, it can push and limit the four sides of the semiconductor circuit board respectively, so as to ensure that the semiconductor circuit board is placed in the center position on the top of the moving plate, which is convenient for the subsequent inkjet device to accurately inkjet print on the surface of the semiconductor circuit board, and indirectly improves the quality and efficiency of the inkjet printing of the semiconductor circuit board by the device.

[0023] 2. In this invention, after the two first limiting plates push and limit the two sides of the semiconductor circuit board on the top of the moving plate, control the two first limiting plates to rotate and adjust, driving the air blowers originally located at the bottoms of the two first limiting plates to rotate to the closer side. At this time, multiple air outlets on the two air blowers all face the top of the semiconductor circuit board. After the top of the semiconductor circuit board is inkjet printed by the inkjet device, control the multiple air outlets on the two air blowers to blow air towards the semiconductor circuit board, which can accelerate the drying of the ink on the surface of the semiconductor circuit board and reduce the adverse effects caused by the slow drying speed of the ink.

[0024] 3. In this invention, after the inkjet device inkjet prints on the surface of the semiconductor circuit board, control the two first limiting plates to rotate and adjust, driving the air blowers installed on the outer walls of one side of the two first limiting plates to rotate to the farther side. At this time, the air outlets on the two air blowers blow air towards the tops of the first placement plate and the second placement plate respectively, which can clean the top of the semiconductor circuit board to be processed and the top of the processed semiconductor circuit board together, facilitating the subsequent inkjet printing of the semiconductor circuit board to be processed and the placement of the processed semiconductor circuit board on the top of the second placement plate.

[0025] 4. In this invention, when the device is not in use, in order to prevent the ink of the inkjet device from curing, it is necessary to regularly control the inkjet device to perform several inkjet printing operations. When the device needs to perform an inkjet printing test, with the aid of the auxiliary test mechanism provided inside the two first limit plates, the inkjet device can perform an inkjet printing test on the surfaces of the two unfolded films of the auxiliary test mechanism, without the need to additionally use paper for the inkjet printing test, reducing the waste of paper, and the entire inkjet printing test has a high degree of automation and does not require additional manual assistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] For the convenience of those skilled in the art to understand, the present invention will be further described below in conjunction with the accompanying drawings.

[0027] Figure 1 Schematic diagram of the overall structure of the intelligent inkjet device proposed by the present invention;

[0028] Figure 2 is Figure 1 Schematic diagram of the structure from another angle;

[0029] Figure 3 Schematic diagram of the structure of the present invention excluding the moving plate;

[0030] Figure 4 Schematic diagram of the structure at the bottom of the moving plate of the present invention;

[0031] Figure 5 Schematic diagram of the structure of the moving plate of the present invention;

[0032] Figure 6 Schematic diagram of the structure of the limit mechanism and the moving plate separated from each other in the present invention;

[0033] Figure 7 Schematic diagram of the structure of the two second limit plates in the present invention;

[0034] Figure 8 Schematic diagram of the structure of one of the first limit plates in the present invention;

[0035] Figure 9 Schematic diagram of the structure at the bottom of the first limit plate in the present invention;

[0036] Figure 10 is Figure 9 Schematic diagram of the structure from another angle;

[0037] Figure 11 Cross-sectional view of the structure of the first limit plate in the present invention;

[0038] Figure 12 is Figure 11 Schematic diagram of the structure of the winding roller and the cleaning pad separated from the first limit plate in

[0039] In the figure: 1, bottom plate; 2, equipment body; 3, inkjet box body; 4, first placement plate; 5, second placement plate; 6, moving plate; 7, first chute; 8, first slider; 9, first groove; 10, second groove; 11, first double-headed screw; 12, second double-headed screw; 13, second limiting plate; 14, mounting plate; 15, first limiting plate; 16, second moving block; 17, first moving block; 18, second chute; 19, second slider; 20, rotating plate; 21, electric telescopic rod; 22, cleaning pad; 23, air blowing head; 24, air blowing port; 25, film; 26, connecting plate; 27, rectangular groove; 28, winding roller; 29, liquid discharge port; 30, through groove; 31, notch. Detailed implementation manners

[0040] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0041] Referring to Figures 1 - 12 , the intelligent inkjet device includes a bottom plate 1 and an equipment body 2. The bottom plate 1 is arranged at the bottom of the equipment body 2. The top of the bottom plate 1 is respectively provided with a first placement plate 4 and a second placement plate 5. The top of the equipment body 2 is provided with an inkjet box body 3. An inkjet device is installed inside the inkjet box body 3. A moving plate 6 for placing a semiconductor circuit board is slidably installed on the top of the equipment body 2. A limiting mechanism for correcting and limiting the four sides of the semiconductor circuit board to be printed is installed on the top of the moving plate 6. The limiting mechanism includes two first limiting plates 15 and two second limiting plates 13 arranged around the top of the moving plate 6. An auxiliary test mechanism for assisting the inkjet device to perform regular tests is arranged inside both of the two first limiting plates 15. The inkjet device is used inside the inkjet box body 3, which is a technical solution already disclosed in the prior art and will not be elaborated here; and the print head of the inkjet device contains a microprocessor and a drive circuit, and these circuits are usually made of semiconductor materials and are used to control the operation of the nozzle and the ejection of ink droplets; two sets of lifting devices are preset on the top of the bottom plate 1, and the telescopic ends of the two sets of lifting devices are respectively connected to the bottom ends of the first placement plate 4 and the second placement plate 5, so as to drive the first placement plate 4 and the second placement plate 5 to adjust the height on the top of the bottom plate 1, facilitating the adsorption and transfer of the semiconductor circuit board by the transfer manipulator; and buffer soft pads are bonded to the tops of the first placement plate 4 and the second placement plate 5, which can avoid the rigid contact between the semiconductor circuit board to be inkjet printed and after inkjet printing and the tops of the first placement plate 4 and the second placement plate 5.

[0042] As a technical optimization solution of the present invention, a first chute 7 is provided at the top of the equipment body 2. A first slider 8 is installed inside the first chute 7, and the moving plate 6 is installed on the top of the first slider 8. A first linear motor is preset inside the first chute 7. The first linear motor can drive the first slider 8 to move back and forth inside the first chute 7, and then drive the moving plate 6 to move back and forth on the top of the equipment body 2, so that the moving plate 6 can drive the semiconductor circuit board placed on its top to move into the inkjet box body 3. The inkjet device located inside the inkjet box body 3 can perform inkjet printing processing on the surface of the semiconductor circuit board.

[0043] As a technical optimization solution of the present invention, two first grooves 9 are provided at the top of the moving plate 6. A first double-headed screw 11 is rotatably installed inside each of the two first grooves 9, and two first moving blocks 17 are installed on the outer walls of the two first double-headed screws 11. Two first driving motors are preset on one outer wall of the moving plate 6. The output ends of the two first driving motors are respectively connected to one end of the two first double-headed screws 11, so as to be able to drive the two first double-headed screws 11 to rotate inside the corresponding first grooves 9, and drive the two corresponding first moving blocks 17 to move towards or away from each other on the surface of the first double-headed screw 11.

[0044] As a technical optimization solution of the present invention, mounting plates 14 are connected to the tops of the two first moving blocks 17 through electric telescopic rods 21. Both ends of the two first limiting plates 15 are rotatably connected to the mounting plates 14 close to them. Blowing heads 23 are installed at the bottoms of the two first limiting plates 15, and a plurality of air outlets 24 are provided at the bottoms of the two blowing heads 23. When the telescopic ends of the electric telescopic rods 21 expand and contract, the heights of the mounting plates 14 and the corresponding first limiting plates 15 can be adjusted; and second driving motors are preset inside two of the mounting plates 14. The output ends of the two second driving motors are respectively connected to the rotating parts of the corresponding first limiting plates 15, so as to be able to drive the two first limiting plates 15 to rotate and adjust; the two blowing heads 23 are both connected to an external preset blowing device through preset first hoses, so that the external blowing device can discharge the blown wind outwards through a plurality of air outlets 24 to accelerate the drying of the ink for inkjet printing on the surface of the semiconductor circuit board.

[0045] As a technical optimization solution of the present invention, cleaning pads 22 are installed on the tops of the two first limiting plates 15, and a plurality of liquid discharge ports 29 are provided on the tops of the two first limiting plates 15 close to the cleaning pads 22. Corresponding cavities are preset inside the two first limiting plates 15, and the two first limiting plates 15 are both connected to an external preset liquid discharge device through preset second hoses, so that the external liquid discharge device can discharge the volatile cleaning agent for cleaning the ink through a plurality of liquid discharge ports 29 into the cleaning pads 22.

[0046] As a technical optimization solution of the present invention, the auxiliary testing mechanism includes rectangular grooves 27 opened inside two first limiting plates 15. A winding roller 28 is rotatably installed inside each of the two rectangular grooves 27. A film 25 is wound on the surface of each of the two winding rollers 28. Through grooves 30 are opened on the outer wall of one side of each of the two first limiting plates 15. One end of each of the two films 25 away from the winding roller 28 extends out through the through groove 30. Third driving motors are preset inside each of the two first limiting plates 15. The output ends of the two third driving motors are respectively connected to the rotating parts of the two winding rollers 28, so as to drive the two winding rollers 28 to rotate and adjust inside the corresponding rectangular grooves 27, so that the two films 25 can be respectively rotated and wound or unwound by the corresponding winding rollers 28.

[0047] As a technical optimization solution of the present invention, notches 31 adapted to the thickness of the film 25 are opened inside each of the two cleaning pads 22. One end of each of the two films 25 outside the first limiting plate 15 is inserted into the corresponding notch 31. A connecting plate 26 is connected to one end of each of the two films 25 away from the winding roller 28 after passing through the notch 31. Receiving grooves adapted to the connecting plate 26 are opened on the outer wall of one side of each of the two cleaning pads 22. Electromagnets are preset inside each of the two connecting plates 26. During the process of the two winding rollers 28 winding the film 25, the film 25 is driven to frictionally contact the notch 31 inside the cleaning pad 22, so that the cleaning agent adsorbed inside the cleaning pad 22 can contact the surface of the film 25. Control the rotation of the two first limiting plates 15 to drive the two connecting plates 26 to rotate to a position close to each other. As the two first limiting plates 15 move and abut, drive the two connecting plates 26 to abut against each other, and generate magnetism by energizing the internal electromagnets, so that they can be magnetically attracted and fixed.

[0048] As a technical optimization solution of the present invention, a second groove 10 is further opened on the top of the moving plate 6. A second double-headed screw 12 is rotatably installed inside the second groove 10. Two second moving blocks 16 are installed on the outer wall of the second double-headed screw 12. Each of the two second limiting plates 13 is installed on the top of the corresponding second moving block 16. A fourth driving motor is preset inside the second groove 10. The output end of the fourth driving motor is connected to one end of the second double-headed screw 12, so as to drive the second double-headed screw 12 to rotate inside the second groove 10, drive the two second moving blocks 16 to move in a direction close to or away from each other, and then drive the two second limiting plates 13 to synchronously move and adjust on the top of the moving plate 6.

[0049] As a technical optimization solution of the present invention, on the outer walls of the closer sides of the two second limiting plates 13, second sliding grooves 18 are respectively formed. In the interiors of the two second sliding grooves 18, second sliding blocks 19 are respectively installed. At the ends of the two second sliding blocks 19 away from the second sliding grooves 18, rotating plates 20 are respectively rotatably installed. On the outer walls of the two rotating plates 20 away from the second sliding blocks 19, rubber pads are adhesively attached. In the interiors of the two second sliding grooves 18, second linear motors are respectively preset. The two second linear motors can drive the two second sliding blocks 19 to move back and forth in the corresponding second sliding grooves 18, so as to drive the two rotating plates 20 to move synchronously for adjustment; in the interiors of the two second sliding blocks 19, driving devices are respectively preset. The output ends of the driving devices are respectively connected to the rotating parts of the two rotating plates 20, so as to be able to drive the two rotating plates 20 to rotate for adjustment; the outer walls of the closer sides of the two rotating plates 20 are flush with the outer walls of the corresponding sides of the two second limiting plates 13, so that the rubber pads arranged on the outer walls of the closer sides of the two rotating plates 20 protrude on one side of the corresponding second limiting plates 13. During the process of the two second limiting plates 13 pushing and limiting the two sides of the semiconductor circuit board, the two rubber pads are driven to contact the two sides of the semiconductor circuit board first. After the two first limiting plates 15 push and limit the two sides of the rectangular semiconductor circuit board, at this time, the semiconductor circuit board is placed neatly on the top of the moving plate 6. By moving the two second limiting plates 13 towards the closer direction, the two rubber pads are driven to push the other two sides of the semiconductor circuit board, which can ensure that the semiconductor circuit board can be placed in the middle position on the top of the moving plate 6.

[0050] As a technical optimization solution of the present invention, an intelligent inkjet method, the inkjet method includes the inkjet device described above, and the inkjet method further includes the following steps:

[0051] Step 1: Place the semiconductor circuit board to be inkjet-printed on the top of the first placement plate 4, and use the transfer manipulator to place the semiconductor circuit board on the top of the first placement plate 4 on the top of the moving plate 6. Control the first slider 8 to drive the moving plate 6 and the semiconductor circuit board placed on its top to move into the inkjet box body 3 together. After using the inkjet device to inkjet-print a preset pattern on the top of the semiconductor circuit board, control the first slider 8 to drive the moving plate 6 and the semiconductor circuit board to move back to the original position. Then, use the transfer manipulator to transfer the inkjet-printed semiconductor circuit board from the top of the moving plate 6 to the top of the second placement plate 5 to complete the inkjet-printing work on the semiconductor circuit board;

[0052] Step 2: After the semiconductor circuit board is transported to the top of the moving plate 6 by the transfer manipulator and placed, control the two first double-headed screws 11 to drive the two corresponding first moving blocks 17 to move towards each other, drive the two first limiting plates 15 to move towards each other, and control the second double-headed screw 12 to rotate to drive the two second limiting plates 13 to move towards each other. During the process of the two first limiting plates 15 moving towards each other, they can push and limit the two sides of the semiconductor circuit board. When the two second limiting plates 13 move towards each other, they can push and limit the other two sides of the semiconductor circuit board to ensure that the semiconductor circuit board is placed in the center position on the top of the moving plate 6;

[0053] Step 3: After the two first limiting plates 15 push and limit the two sides of the semiconductor circuit board on the top of the moving plate 6, control the two first limiting plates 15 to rotate and adjust, drive the air blowing heads 23 originally located at the bottom of the two first limiting plates 15 to rotate to the closer side, and the multiple air blowing ports 24 on the two air blowing heads 23 all face the top of the semiconductor circuit board. Control the multiple air blowing ports 24 on the two air blowing heads 23 to blow air towards the semiconductor circuit board to accelerate the drying of the ink on the surface of the semiconductor circuit board;

[0054] Step 4: After the ink jet-printed on the surface of the semiconductor circuit board is dried by means of the multiple air blowing ports 24, control the two first limiting plates 15 to rotate and adjust, drive the air blowing heads 23 installed on the outer walls of one side of the two first limiting plates 15 to rotate to the farther side, and the air blowing ports 24 on the two air blowing heads 23 blow air towards the tops of the first placement plate 4 and the second placement plate 5 respectively to clean the tops of the semiconductor circuit board to be processed and the processed semiconductor circuit board together;

[0055] Step 5: If the semiconductor circuit board needs to be double-sided printed, after the ink jet printer jets ink on the top of the semiconductor circuit board, the moving plate 6 drives the semiconductor circuit board to move back to the original position. Control the two second limiting plates 13 to move away from each other. Then control the two second sliders 19 to move to the ends of the second sliding grooves 18 together. Then control the rubber pads on the closer sides of the two second limiting plates 13 to abut against the two sides of the semiconductor circuit board. Control the two rotating plates 20 to rotate synchronously to drive the clamped semiconductor circuit board to rotate and turn over. As the two rotating plates 20 drive the semiconductor circuit board to rotate downward to a horizontal state and contact the top of the moving plate 6, the automatic turning-over work of the semiconductor circuit board is completed.

[0056] In the present invention, when the user uses the device, such as Figure 1As shown, during the actual use of the device, a transfer manipulator with a vacuum chuck is preset on the left side of the device body 2. The semiconductor circuit board to be inkjet printed is placed on the top of the first placement plate 4. The transfer manipulator adsorbs the semiconductor circuit board on the top of the first placement plate 4 and places it on the top of the moving plate 6. Control the first slider 8 to move inside the first chute 7, driving the moving plate 6 and the semiconductor circuit board placed on its top to move into the inkjet box body 3 together. After inkjet printing the preset identification and recognition information on the top of the semiconductor circuit board by means of the inkjet device, control the first slider 8 to slide and reset inside the first chute 7, driving the moving plate 6 and the semiconductor circuit board to move and reset. Then, the transfer manipulator adsorbs the inkjet printed semiconductor circuit board from the top of the moving plate 6 and transfers it to the top of the second placement plate 5. The inkjet printed semiconductor circuit board is transferred to other subsequent processing production lines by other relevant transfer devices, and thus the entire inkjet printing work on the semiconductor circuit board can be completed.

[0057] After the semiconductor circuit board on the top of the first placement plate 4 is transferred to the top of the moving plate 6 and placed by the transfer manipulator, in order to ensure that the subsequent inkjet printed pattern is located at the center position of the semiconductor circuit board and improve the accuracy of inkjet printing, the two first double-headed screws 11 can be controlled to rotate together, driving the two corresponding first moving blocks 17 to move in the approaching direction, driving the two mounting plates 14 and the first limiting plate 15 to move in the approaching direction on the top of the moving plate 6, and synchronously controlling the second double-headed screw 12 to rotate, driving the two second moving blocks 16 and the second limiting plate 13 to move in the approaching direction. Since the width of the semiconductor circuit board is adapted to the length of the two second limiting plates 13, when the two first limiting plates 15 move in the approaching direction, they can push and limit the two sides of the semiconductor circuit board, ensuring that the two sides of the semiconductor circuit board and the two ends of the two second limiting plates 13 are in a straight line state. With the two second limiting plates 13 moving in the approaching direction, they can push and limit the other two sides of the semiconductor circuit board, thereby ensuring that the semiconductor circuit board is placed at the center position on the top of the moving plate 6, facilitating the subsequent inkjet device to accurately inkjet print on the surface of the semiconductor circuit board.

[0058] After the two first limit plates 15 push and limit the two sides of the semiconductor circuit board on the top of the moving plate 6, the rotation adjustment of the two first limit plates 15 between the corresponding two mounting plates 14 can be controlled, driving the air blowing heads 23 originally located at the bottoms of the two first limit plates 15 to rotate to the closer side. At this time, the multiple air blowing ports 24 on the two air blowing heads 23 all face the top of the semiconductor circuit board. After the top of the semiconductor circuit board is inkjet printed by the inkjet device, the multiple air blowing ports 24 on the two air blowing heads 23 can be controlled to blow air towards the semiconductor circuit board, which can accelerate the drying of the ink on the surface of the semiconductor circuit board and reduce the adverse effects caused by the slow ink drying speed.

[0059] After the inkjet device in the above-mentioned inkjets the surface of the semiconductor circuit board, and dries the inkjet printed on the surface of the semiconductor circuit board through the multiple air blowing ports 24, the rotation adjustment of the two first limit plates 15 between the corresponding two mounting plates 14 can be controlled, driving the air blowing heads 23 mounted on the outer walls of one sides of the two first limit plates 15 to rotate to the farther side. At this time, the air blowing ports 24 on the two air blowing heads 23 blow air towards the tops of the first placement plate 4 and the second placement plate 5 respectively, which can clean the top of the semiconductor circuit board to be processed, and clean the top of the processed semiconductor circuit board together, facilitating the inkjet printing of the semiconductor circuit board to be processed subsequently, and facilitating the placement of the processed semiconductor circuit board on the top of the second placement plate 5;

[0060] And during the process of the two first limit plates 15 driving the air blowing heads 23 to rotate and blow air, the telescopic ends of the corresponding two electric telescopic rods 21 can be controlled to extend upward, driving the height of the corresponding first limit plate 15 to increase, so that it can be convenient for the corresponding first limit plate 15 to drive the air blowing head 23 to rotate downward at a larger angle, so as to facilitate the multiple air blowing ports 24 to blow and clean the surface of the semiconductor circuit board with a lower position on the tops of the first placement plate 4 and the second placement plate 5.

[0061] If the semiconductor circuit board needs to be printed on both sides, after the inkjet device prints ink on the top of the semiconductor circuit board, the movable plate 6 drives the semiconductor circuit board to move and reset. At this time, the two second limiting plates 13 can be controlled to move in the direction away from each other, so that the outer walls on the side close to the two second limiting plates 13 are separated from the other two sides of the semiconductor circuit board, and the rubber pads on the side close to the two rotating plates 20 are also separated from the other two sides of the semiconductor circuit board. Then, the two second sliding blocks 19 are controlled to move in the same direction inside the corresponding second slide groove 18 to the end of the second slide groove 18, and then the two second limiting plates 13 are controlled to move in the direction close to each other, so that the outer walls on the side close to the two second limiting plates 13 and the rubber pads on the side close to the two rotating plates 20 are separated from the semiconductor circuit board. The other two sides of the road plate are in contact with each other, and at this time, the two rubber pads are in contact with the corner positions on the other two sides of the semiconductor circuit board, and the two rotating plates 20 are controlled to rotate synchronously, thereby driving the clamped semiconductor circuit board to rotate and turn over, so that the semiconductor circuit board rotates to abut against the top of one of the first limit plates 15, and then the two second sliders 19 are controlled to move toward the other end inside the corresponding second slide grooves 18, driving the clamped semiconductor circuit board to move back between the two second limit plates 13, as the two rotating plates 20 drive the semiconductor circuit board, which is in an inclined state at this time, to rotate downward to a horizontal state and contact with the top of the movable plate 6, the automatic turning over of the semiconductor circuit board can be completed, which is convenient for the subsequent inkjet equipment to perform inkjet printing on the other side of the semiconductor circuit board.

[0062] If the transfer robot arranged on the left side of the equipment fails during use, making it impossible to automatically place the semiconductor circuit board on the top of the movable plate 6, and the semiconductor circuit board after inkjet printing is removed from the top of the movable plate 6, the semiconductor circuit board to be processed can be manually placed on the top of the movable plate 6. After the semiconductor circuit board is inkjet printed, the telescopic ends of two of the electric telescopic rods 21 close to the second placement plate 5 can be controlled to extend upward together, pushing one of the first limit plates 15 close to the second placement plate 5 to move upward, so that there is a gap between one of the first limit plates 15 and the movable plate 6, and the two second limit plates 13 move in the approaching direction, driving the two rotating plates 20 to approach each other. After the rubber pads on one side clamp and fix the two sides of the semiconductor circuit board, as the two second sliders 19 drive the rotating plate 20 and the clamped semiconductor circuit board to move toward the second placement plate 5, the semiconductor circuit board can pass through the gap between one of the first limiting plates 15 and the movable plate 6 until most of the semiconductor circuit board itself is separated from the movable plate 6. The second placement plate 5 is controlled to move upward to a position flush with the top of the movable plate 6, and the two second limiting plates 13 are controlled to move in opposite directions. At this time, the semiconductor circuit board can move from the top of the movable plate 6 to the top of the second placement plate 5 for placement, thereby achieving the effect of assisting automatic unloading of the semiconductor circuit board after inkjet printing, thereby improving the applicability of the limiting mechanism.

[0063] When the device is not in use, in order to prevent the ink of the inkjet device from solidifying, it is necessary to regularly control the inkjet device to perform several inkjet printing operations. When the device needs an inkjet printing test, the two first limit plates 15 can be controlled to rotate and adjust between the corresponding two mounting plates 14, driving the two cleaning pads 22 to rotate to the bottom of the corresponding first limit plates 15 respectively, and the connecting plate 26 located on the outer wall of one side of the two cleaning pads 22 is rotated to the side where the two first limit plates 15 are close to each other, so that Figure 11The bottom of the film 25 located inside the cleaning pad 22 in the figure shown is the printing test surface for subsequent inkjet printing tests. Then, control the telescopic ends of multiple electric telescopic rods 21 to extend upward together, pushing the heights of the two first limiting plates 15 upward to be higher than the second limiting plate 13. At this time, control the rotation of the two first double-headed screws 11, driving the two corresponding first moving blocks 17 to move towards each other, which can then drive the two first limiting plates 15 to move towards each other above the two second limiting plates 13 until the connecting plates 26 on the closer sides of the two cleaning pads 22 move to a state of abutment. Then, control the electromagnets inside the two connecting plates 26 to be energized to generate magnetism, so that the two connecting plates 26 can be magnetically attracted and fixed to each other. Control the two winding rollers 28 to rotate inside the corresponding rectangular grooves 27, driving the two films 25 to unfold. As the two first limiting plates 15 move back to their original positions in the direction away from each other, they will drive the two films 25 to stretch and unfold on the top of the moving plate 6. At this time, control the moving plate 6 to move into the inkjet box body 3, and the inkjet device can perform inkjet printing tests on the surfaces of the two unfolded films 25, without the need to use paper for inkjet printing tests additionally, reducing paper waste.

[0064] After the work of inkjet printing test of the device is completed by means of the two unfolded films 25, at this time, the two cleaning pads 22 are respectively located at the bottoms of the corresponding first limiting plates 15. Control the external liquid discharge device to start, so that multiple liquid discharge ports 29 can discharge the cleaning agent into the cleaning pads 22 for adsorption and temporary storage. Control the two winding rollers 28 to wind and unfold the films 25 on their surfaces in turn inside the corresponding rectangular grooves 27, that is, when one winding roller 28 winds one film 25, the other winding roller 28 unfolds the other film 25, and control the two winding rollers 28 to alternately repeat the above steps, so as to achieve a state where the two films 25 are constantly pulled back and forth on the top of the moving plate 6, which can drive the two films 25 to move back and forth inside the corresponding notches 31, enabling the cleaning agent inside the two cleaning pads 22 to fully contact the ink on the printing test surface of the film 25. With the continuous friction between the cleaning pads 22 and the film 25, the ink on the surface of the film 25 can be quickly cleaned and removed, and the remaining liquid after cleaning can be automatically adsorbed by the cleaning pads 22, facilitating the film 25 to continue to assist the device in inkjet printing test work subsequently.

[0065] The two films 25 in the unfolded state on the top of the moving plate 6 can shield and protect the two second limiting plates 13, and at the same time, can also shield and protect the semiconductor circuit board placement area on the top of the moving plate 6, so that when the device is used subsequently, the staff only needs to clean other areas on the top of the moving plate 6, facilitating the device to quickly enter the subsequent inkjet printing work of semiconductor circuit boards.

[0066] Since the cleaning agent has a volatile property, after the cleaning agent is used in cooperation with the cleaning pad 22 to remove the ink on the surface of the thin film 25, at this time, the multiple drain ports 29 can be continuously controlled to discharge the cleaning agent into the cleaning pad 22. The excess cleaning agent then drips down onto the top of the moving plate 6. As the positions of the two first limit plates 15 above the moving plate 6 are adjusted, the cleaning agent can be evenly dripped onto different positions on the top of the moving plate 6. By controlling the two second limit plates 13 to move back and forth on the top of the moving plate 6, a certain range on the top of the moving plate 6 can be cleaned. After the telescopic ends of the multiple electric telescopic rods 21 retract downward and return to their original positions, the two cleaning pads 22 are driven to contact the moving plate 6, and by controlling the two first limit plates 15 to move on the top of the moving plate 6, positions that cannot be cleaned by the two second limit plates 13 can be further cleaned, facilitating the subsequent use of the moving plate 6.

[0067] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the present invention, so that those skilled in the relevant technical fields can well understand and utilize the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. Intelligent inkjet device, including a bottom plate (1) and a device body (2), characterized in that, The bottom plate (1) is arranged at the bottom of the equipment body (2). A first placement plate (4) and a second placement plate (5) are respectively installed on the top of the bottom plate (1). An inkjet box body (3) is installed on the top of the equipment body (2). An inkjet device is installed inside the inkjet box body (3). A moving plate (6) for placing a semiconductor circuit board is slidably installed on the top of the equipment body (2). A limiting mechanism for correcting and limiting the four sides of the semiconductor circuit board to be printed is installed on the top of the moving plate (6). The limiting mechanism includes two first limiting plates (15) and two second limiting plates (13) arranged around the top of the moving plate (6). An auxiliary testing mechanism for assisting the inkjet device to conduct regular tests is arranged inside both of the two first limiting plates (15). Cleaning pads (22) are installed on the tops of both of the two first limiting plates (15). A plurality of liquid discharge ports (29) are opened near the cleaning pads (22) on the tops of both of the two first limiting plates (15). The auxiliary testing mechanism includes rectangular grooves (27) opened inside both of the two first limiting plates (15). Winding rollers (28) are rotatably installed inside both of the two rectangular grooves (27). Films (25) are wound on the surfaces of both of the two winding rollers (28). Through grooves (30) are opened on the outer walls of one side of both of the two first limiting plates (15). One ends of the two films (25) far away from the winding rollers (28) both extend out through the through grooves (30). Notches (31) adapted to the thickness of the films (25) are opened inside both of the two cleaning pads (22). One ends of the two films (25) located outside the first limiting plates (15) are respectively inserted into the corresponding notches (31). One ends of the two films (25) far away from the winding rollers (28) both pass through the notches (31) and are connected with connecting plates (26). Receiving grooves adapted to the connecting plates (26) are opened on the outer walls of one side of both of the two cleaning pads (22). Electromagnets are preset inside both of the two connecting plates (26). A second groove (10) is also opened on the top of the moving plate (6). A second double-headed screw rod (12) is rotatably installed inside the second groove (10). Two second moving blocks (16) are installed on the outer wall of the second double-headed screw rod (12). Both of the two second limiting plates (13) are installed on the tops of the corresponding second moving blocks (16). Second sliding grooves (18) are opened on the outer walls of one side of both of the two second limiting plates (13) close to each other. Second sliding blocks (19) are installed inside both of the two second sliding grooves (18). Rotating plates (20) are rotatably installed at one ends of the two second sliding blocks (19) far away from the second sliding grooves (18). Rubber pads are bonded to the outer walls of one side of the two rotating plates (20) far away from the second sliding blocks (19).

2. The intelligent inkjet device according to claim 1, wherein, A first sliding groove (7) is opened on the top of the equipment body (2). A first sliding block (8) is installed inside the first sliding groove (7). The moving plate (6) is installed on the top of the first sliding block (8).

3. The intelligent inkjet device according to claim 2, characterized in that, The top of the moving plate (6) is provided with two first grooves (9), and two first double-headed screws (11) are rotatably installed inside the two first grooves (9). Two first moving blocks (17) are installed on the outer walls of the two first double-headed screws (11).

4. The intelligent inkjet device according to claim 3, wherein, The tops of the two first moving blocks (17) are connected to a mounting plate (14) through electric telescopic rods (21). Both ends of the two first limiting plates (15) are rotatably connected to the adjacent mounting plate (14). A blowing head (23) is installed at the bottom of each of the two first limiting plates (15). A plurality of air outlets (24) are provided at the bottom ends of the two blowing heads (23).

5. Intelligent inkjet method, characterized in that, The inkjet method includes the inkjet device in claim 4 above, and the inkjet method further includes the following steps: Step 1: Place the semiconductor circuit board to be inkjet-printed on the top of the first placement plate (4), and use a transfer manipulator to place the semiconductor circuit board on the top of the first placement plate (4) on the top of the moving plate (6). Control the first slider (8) to drive the moving plate (6) and the semiconductor circuit board placed on its top to move into the inkjet box body (3) together. After inkjet-printing a preset pattern on the top of the semiconductor circuit board by means of the inkjet device, control the first slider (8) to drive the moving plate (6) and the semiconductor circuit board to move back to the original position, and then use the transfer manipulator to transfer the inkjet-printed semiconductor circuit board from the top of the moving plate (6) to the top of the second placement plate (5) to complete the inkjet printing work of the semiconductor circuit board; Step 2: After the semiconductor circuit board is transferred to the top of the moving plate (6) and placed by the transfer manipulator, control the two first double-headed screws (11) to drive the two corresponding first moving blocks (17) to move towards each other, drive the two first limiting plates (15) to move towards each other, and control the second double-headed screw (12) to rotate to drive the two second limiting plates (13) to move towards each other. During the process of the two first limiting plates (15) moving towards each other, they can push and limit the two sides of the semiconductor circuit board. When the two second limiting plates (13) move towards each other, they can push and limit the other two sides of the semiconductor circuit board to ensure that the semiconductor circuit board is placed in the center position on the top of the moving plate (6); Step 3: After the two first limiting plates (15) push and limit the two sides of the semiconductor circuit board on the top of the moving plate (6), control the two first limiting plates (15) to rotate and adjust, drive the blowing heads (23) originally located at the bottoms of the two first limiting plates (15) to rotate to the adjacent side, and the plurality of air outlets (24) on the two blowing heads (23) all face the top of the semiconductor circuit board. Control the plurality of air outlets (24) on the two blowing heads (23) to blow air towards the semiconductor circuit board to accelerate the drying of the ink on the surface of the semiconductor circuit board; Step 4: After drying the inkjet-printed ink on the surface of the semiconductor circuit board with multiple air outlets (24), control the rotation and adjustment of the two first limit plates (15), drive the air blowing heads (23) installed on the outer walls of one side of the two first limit plates (15) to rotate to the side away from each other, and the air outlets (24) on the two air blowing heads (23) blow air towards the tops of the first placement plate (4) and the second placement plate (5) respectively, to clean the tops of the semiconductor circuit board to be processed and the processed semiconductor circuit board together. Step 5: If double-sided printing is required for the semiconductor circuit board, after the inkjet device inkjet-prints on the top of the semiconductor circuit board, the moving plate (6) drives the semiconductor circuit board to move back to its original position, control the two second limit plates (13) to move in the direction away from each other, then control the two second sliders (19) to move together to the ends of the second sliding grooves (18), and then control the rubber pads on the sides of the two second limit plates (13) close to each other to abut against both sides of the semiconductor circuit board, control the two rotating plates (20) to rotate synchronously, drive the clamped semiconductor circuit board to rotate and turn over, and as the two rotating plates (20) drive the semiconductor circuit board to rotate downward to a horizontal state and contact the top of the moving plate (6), the automatic turning-over work of the semiconductor circuit board is completed.

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