A headset

Abstract

An embodiment of the present specification provides an earphone, comprising: two speaker assemblies and a connector; the connector is used to connect the two speaker assemblies, and the connector provides a clamping force to fix the two speaker assemblies on the user's head through bending deformation, and the connector includes a shell having an accommodating cavity, and a capacitive sensor is provided in the accommodating cavity, and the capacitive sensor is used to identify the bending state of the connector, wherein the capacitive sensor includes a shielding structure, the potential of the shielding structure always remains unchanged, and is used to reduce the influence of external electric fields on the capacitive sensor.

Description

Technical Field

[0001] This specification relates to the field of acoustic technology, and in particular to a headset. Background Art

[0002] In the current headphone market, sensors are widely used for wear detection in products such as headphones. These sensors can detect when a user puts on or takes off headphones and adjust the working state of the headphones accordingly, greatly improving the user experience.

[0003] Currently, the sensors used for wear detection are primarily contact sensors. However, due to factors such as sweat and accidental touch, contact sensors suffer from low accuracy in headphone wear detection. Using a bend sensor to detect headphone wear based on the deformation of the headphone connection structure when the headphone is worn offers higher accuracy. Among bend sensors, capacitive sensors are widely used for wear detection due to their low hysteresis, high linearity, and high sensitivity. However, when relying on small deformations caused by wear to change the capacitance value, due to the structural limitations, the absolute value of the capacitance and the detection value caused by small deformations are very small. Based on the detection principle of capacitive sensors, their detection results are easily affected by external electric field fluctuations, causing the detection value to be easily confused with external errors, thereby reducing the accuracy of the capacitive sensor. For example, when a person, acting as a conductor, approaches a capacitive sensor, the electric field distribution changes, causing the capacitance value to change, resulting in inaccurate detection results. Therefore, electromagnetic shielding is required for the capacitive sensor in the headphone to block external influences and accurately identify the headphone wear state. Summary of the Invention

[0004] An embodiment of the present specification may provide an earphone, comprising: two speaker assemblies and a connector; the connector is used to connect the two speaker assemblies, the connector provides a clamping force to fix the two speaker assemblies on the user's head through bending deformation, the connector includes a shell having an accommodating cavity, a capacitive sensor is provided in the accommodating cavity, the capacitive sensor is used to identify the bending state of the connector, wherein the capacitive sensor includes a shielding structure, the potential of the shielding structure always remains unchanged, and is used to reduce the influence of external electric fields on the capacitive sensor.

[0005] In some embodiments, the connector includes two ear hook components and a rear hook component, the two speaker components are connected to the rear hook component through the two ear hook components, and the capacitive sensor is located in the accommodating cavity formed by the rear hook component.

[0006] In some embodiments, the capacitive sensor further includes a first electrode plate, the shielding structure serves as a second electrode plate of the capacitive sensor and forms a capacitor with the first electrode plate, the second electrode plate has a cavity, and the first electrode plate is disposed in the cavity.

[0007] In some embodiments, the first electrode plate and the second electrode plate are flexible conductors, and a flexible substrate is filled in the space between the first electrode plate and the second electrode plate.

[0008] In some embodiments, the first electrode plate includes a plurality of spaced-apart sub-electrode plates.

[0009] In some embodiments, the plurality of sub-electrode plates are electrically connected to each other via wires.

[0010] In some embodiments, the capacitive sensor further includes a first electrode plate and a second electrode plate, the shielding structure is a conductor having a cavity, and the first electrode plate and the second electrode plate are disposed in the cavity.

[0011] In some embodiments, the conductor includes any one of conductive glue, flexible conductive cloth, and conductive film.

[0012] In some embodiments, the rear suspension assembly further includes a skeleton structure, and the capacitive sensor is disposed in close contact with the skeleton structure.

[0013] In some embodiments, the cavity has no opening.

[0014] In some embodiments, the skeleton structure is a conductor skeleton, the cavity has an opening, and the opening faces the conductor skeleton.

[0015] In some embodiments, the earphones further include a wiring, and the wiring is disposed in the accommodating cavity of the rear hanging component.

[0016] In some embodiments, the earphones further include a platform structure, the platform structure is disposed on the rear hanging component, and the capacitive sensor is fixed on the platform structure.

[0017] In some embodiments, the platform structure is a solid conductor.

[0018] In some embodiments, the capacitive sensor is a differential capacitive sensor.

[0019] Additional features will be described in part in the following description and will become apparent to those skilled in the art by reference to the following and accompanying drawings, or may be learned by practice or operation of the examples. The features of this specification may be realized and obtained by practicing or using the various aspects of the methods, tools, and combinations described in the following detailed examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] This specification will be further described in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting, and in these embodiments, like numbers represent like structures, wherein:

[0021] Figure 1A is a schematic structural diagram of an exemplary headset according to some embodiments of this specification;

[0022] Figure 1B is a schematic structural diagram of an exemplary headset according to some embodiments of this specification;

[0023] Figure 2 is a schematic diagram of a circuit module of an exemplary headset according to some embodiments of this specification;

[0024] Figure 3 is a schematic structural diagram of an exemplary capacitive sensor according to some embodiments of this specification;

[0025] Figure 4 is a schematic structural diagram of an exemplary capacitive sensor according to other embodiments of this specification;

[0026] Figure 5 is a schematic structural diagram of an exemplary capacitive sensor according to other embodiments of this specification;

[0027] Figure 6 is a schematic structural diagram of an exemplary capacitive sensor according to other embodiments of this specification;

[0028] Figure 7 is a schematic cross-sectional structural diagram of a connector of an exemplary headset according to some embodiments of this specification;

[0029] Figure 8 is a schematic cross-sectional structural diagram of a connector of an exemplary headset according to other embodiments of this specification;

[0030] Figure 9A is a schematic cross-sectional structural diagram of a connector of an exemplary headset according to other embodiments of this specification;

[0031] Figure 9B is a schematic cross-sectional structural diagram of a connector of an exemplary headset according to other embodiments of this specification;

[0032] Figure 10 is a schematic diagram of a platform structure of a connector of an exemplary headset according to some embodiments of this specification;

[0033] Figure 11 is a schematic cross-sectional structural diagram of a connector of an exemplary headset according to other embodiments of this specification;

[0034] Figure 12 is a schematic diagram of a circuit module of an exemplary headset according to other embodiments of this specification;

[0035] Figure 13A is a schematic diagram of an exemplary headset in a free-standing state according to some embodiments of this specification;

[0036] Figure 13B is a schematic diagram of an exemplary headset in a normal wearing state according to some embodiments of this specification;

[0037] Figure 13C is a schematic diagram of an exemplary headset in an abnormal wearing state according to some embodiments of this specification;

[0038] Figure 14A is a schematic diagram of an exemplary headset in a free-standing state according to some embodiments of this specification;

[0039] Figure 14B is a schematic diagram of an exemplary headset in a normal wearing state according to some embodiments of this specification;

[0040] Figure 14C This is a schematic diagram of an exemplary headset in an abnormal wearing state according to some embodiments of this specification. DETAILED DESCRIPTION

[0041] In order to more clearly illustrate the technical solutions of the embodiments of this specification, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of this specification. For ordinary technicians in this field, this specification can also be applied to other similar scenarios based on these drawings without paying any creative work. It should be understood that these exemplary embodiments are provided only to enable technicians in the relevant fields to better understand and implement this specification, and do not limit the scope of this specification in any way. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

[0042] As used in this specification and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not specifically refer to the singular and may also include the plural, unless the context clearly indicates an exception. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been explicitly identified, and these steps and elements do not constitute an exclusive list. The method or apparatus may also include other steps or elements. The term "based on" means "at least in part based on." The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment."

[0043] In the description of this specification, it should be understood that the terms "front", "rear", "ear hook", "rear hook", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this specification and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this specification.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout this specification, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0045] In this specification, unless otherwise specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this specification based on specific circumstances.

[0046] An embodiment of the present specification provides an earphone (also referred to as an acoustic output device) comprising two speaker assemblies and a connector. The connector is used to connect the two speaker assemblies. The connector provides a clamping force to fix the two speaker assemblies to the user's head by bending deformation. The connector includes a housing having an accommodating cavity, in which a capacitive sensor is disposed. The capacitive sensor is used to identify the bending state of the connector. The capacitive sensor includes a shielding structure, the potential of which remains constant and is used to reduce the influence of the external electric field on the capacitive sensor. The capacitive sensor with a shielding structure can accurately detect the bending state of the connector between the speaker assemblies, thereby analyzing the current placement state of the earphone (e.g., normal wearing state, abnormal wearing state, or free placement state), thereby further adjusting the working state of one or more electronic components of the earphone (e.g., Bluetooth module, battery, etc.) according to the current placement state of the earphone. In some embodiments, multiple sensors (e.g., sensors of the same or different types) can also be used to detect the current placement state of the acoustic output device (e.g., earphones, smart glasses, etc.), thereby improving the accuracy of wearing detection of the acoustic output device.

[0047] The earphones provided in the embodiments of this specification are described in detail below with reference to the accompanying drawings.

[0048] Figure 1A It is a schematic diagram of the structure of the earphone shown in some embodiments of this specification.

[0049] In some embodiments, the earphone 100 may be a bone conduction earphone, an air conduction earphone, or a bone-air conduction combined earphone. In some embodiments, the earphone 100 may be an open earphone. In some embodiments, the earphone 100 may include a headphone, a back-hook earphone, a single-ear earhook earphone, etc. In some embodiments of the present application, a bone conduction earphone with two speaker assemblies will be described as an example, which does not limit the scope of the present application. Figure 1A The earphone 100 may include two speaker assemblies 110 , a connector 120 , and a capacitive sensor 210 .

[0050] The two speaker assemblies 110 can be used to convert audio signals (i.e., electrical signals) into mechanical vibration signals (i.e., acoustic signals), thereby outputting sound to the user. In some embodiments, the speaker assembly 110 can include various types, such as electromagnetic type (e.g., dynamic coil type, moving iron type, etc.), piezoelectric type, inverse piezoelectric type, electrostatic type, etc., which is not limited in this application.

[0051] The connector 120 can be used to connect the two speaker assemblies 110. The connector 120 can serve as a fixing device to keep the earphone 100 fixed relative to the user. Specifically, the connector 120 can have a certain deformation ability and the ability to recover deformation, and it can provide a clamping force to fix the two speaker assemblies 110 to the user's head or neck through bending deformation. In some embodiments, the connector 120 may include a head-mounted connector or a rear-hanging connector. For example, when the connector 120 is a head-mounted connector, the user can place the connector 120 on the top of the head, so that the earphone 100 is fixed relative to the user. When the connector 120 is a rear-hanging connector, the user can place the connector 120 behind the user's head or behind the neck, so that the earphone 100 is fixed relative to the user. For example, when the user wears the earphones 100 normally, the connector 120 can be fixed behind the user's head, and when the user is not using the earphones 100, the user can hang the earphones 100 around the neck. At this time, the connector 120 can be fixed behind the user's neck (that is, the earphones 100 are in an abnormal wearing state). In some embodiments, the connection between the connector 120 and the two speaker assemblies 110 can include injection molding, welding, riveting, bolts, bonding, snap-on connection, etc. or any combination thereof. In some embodiments, the connector 120 may include a housing having a housing cavity, which can be used to accommodate one or more components of the earphones 100, for example, a communication cable for transmitting signals to the two speaker assemblies 110, a capacitive sensor 210, etc.

[0052] Reference Figure 1A In some embodiments, the connector 120 may include two ear hook components 121 and a back-hanging component 122. The ear hook component 121 may cooperate with the user's auricle so that the headset 100 can be hung on the user's ear. The back-hanging component 122 may be placed behind the user's neck or head (for example, when the user wears the headset 100 normally, the back-hanging component 122 may be fixed behind the user's head, and when the user is not using the headset 100, the user may hang the headset 100 around the neck, at which point the back-hanging component 122 may be fixed behind the user's neck). The ear hook component 121 and the back-hanging component 122 may cooperate to provide a clamping force that fixes the two speaker components 110 to the user's head or ears, so that the headset 100 can be stably hung on the user's ears and not easily fall off. The two speaker components 110 may be connected to the back-hanging component 122 respectively via the two ear hook components 121. In some embodiments, the capacitive sensor 210 may be disposed in the accommodation cavity formed by the back-hanging component 122. It should be noted that, when the earphone 100 is a headphone, the connector 120 can directly connect the two speaker assemblies 110 and provide a clamping force to fix the two speaker assemblies 110 on the user's head. In this case, the connector 120 may not include the ear hook assembly 121.

[0053] Since the degree of curvature of the connector 120 (e.g., the back-hanging component 122) may change when the user wears the headset, in some embodiments, in order to accurately detect the curvature of the connector 120 and thereby accurately determine the current placement state of the headset 100 (e.g., normal wearing state or abnormal wearing state), the capacitive sensor 210 may be disposed at a portion of the connector 120 (e.g., the back-hanging component 122) where the curvature changes relatively significantly, for example, where the symmetry plane of the back-hanging component 122 intersects the back-hanging component 122, i.e., the middle portion of the back-hanging component 122. It should be noted that, in the embodiments of this specification, the symmetry plane of the back-hanging component 122 may refer to a symmetry plane formed with the two ends of the back-hanging component 122 as symmetry points.

[0054] In some embodiments, in order to further ensure accurate detection of the bending state of the connector 120 and thus accurately determine the current placement state of the headset 100 (e.g., normal wearing state or abnormal wearing state), the sensitive direction of the capacitive sensor 210 can also be made consistent with the bending deformation direction of the connector 120 (e.g., the rear hanging component 122) during wearing. The bending deformation direction of the connector 120 (e.g., the rear hanging component 122) can refer to the direction in which the curvature radius corresponding to the connector 120 (or the rear hanging component 122) changes the most during wearing. It can be understood that by making the sensitive direction of the capacitive sensor 210 consistent with the bending direction of the connector 120 or the rear hanging component 122, the capacitive sensor 210 can best respond to changes in the bending state of the connector 120 or the rear hanging component 122, thereby improving the accuracy of detecting the placement state of the headset 100.

[0055] In some embodiments, reference Figure 1A At least one of the two ear hook components 121 may further include an earphone compartment 130. In some embodiments, the earphone compartment 130 may be used to store or accommodate one or more components of the earphone 100 (e.g., processing circuitry, control circuitry, Bluetooth module, battery, etc.).

[0056] The capacitive sensor 210 can be used to identify the bending state of the connector 120. The bending state of the connector 120 can cause the capacitance value of the capacitive structure in the capacitive sensor 210 to change. The capacitance value (also called the bending signal of the capacitive sensor 210) can reflect the bending degree of the connector 120, and further reflect the current usage state of the headset 100. In some embodiments, the length of the electrode plate of the capacitive sensor 210 can be 0.1 cm-2 cm, for example, 0.5 cm, 0.8 cm, 1 cm, etc. In some embodiments, the capacitive sensor 210 can include a shielding structure ( Figure 1A(not shown), the potential of the shielding structure remains unchanged, thereby reducing the influence of the external electric field on the capacitive sensor 210.

[0057] In some embodiments, the capacitance sensor 210 may be a differential capacitance sensor. By performing differential operations on the differential capacitance sensor, temperature drift and other common-mode signals can be removed, thereby further improving the accuracy and reliability of the detection results of the capacitance sensor 210. In addition, by using a differential capacitance sensor to remove temperature drift, it is possible to avoid the need for calibration using a temperature sensor, thereby reducing the hardware cost of the headset 100 to a certain extent. For more descriptions of the shielding structure, please refer to other places in this specification, such as Figures 3 to 11 The related descriptions will not be repeated here.

[0058] In some embodiments, the capacitive sensor 210 may be disposed in the middle of the accommodating cavity of the connector 120 (ie, the capacitive sensor 210 is at the same or substantially the same distance from the two speaker assemblies 110 ). For example, Figure 1A In some embodiments, the capacitive sensor 210 may also be disposed near one of the two speaker assemblies 110, for example, Figure 1A It should be noted that, in this specification, position A, position B and position C are only exemplary descriptions and are not intended to limit specific positions.

[0059] Figure 1B is a schematic diagram of the structure of an exemplary headset shown in some embodiments of this specification. In some embodiments, the headset 100 can also be as follows Figure 1B For example, the single-ear earphones shown in FIG. Figure 1B As shown, the earphone 100B may include a hook portion 11, a connecting portion 12 and a retaining portion 13. The connecting portion 12 connects the hook portion 11 and the retaining portion 13 so that the earphone 100B is curved in three-dimensional space when it is not worn (that is, it is freely placed). In other words, in three-dimensional space, the hook portion 11, the connecting portion 12 and the retaining portion 13 are not coplanar. With such an arrangement, when the earphone 100B is in a normal wearing state, the hook portion 11 can be mainly used to hang between the back side of the user's ear and the head, and the retaining portion 13 can be mainly used to contact the front side of the user's ear, thereby allowing the retaining portion 13 and the hook portion 11 to cooperate to clamp the ear. As an example, the connecting portion 12 can extend from the head to the outside of the head, and then cooperate with the hook portion 11 to provide the retaining portion 13 with a pressing force on the front side of the ear.

[0060] Since the bending degree of the connecting portion 12 and / or the hook portion 11 (e.g., the area near the connection position of the connecting portion 12 and the hook portion 11) may change when the user wears the headset 100B, the capacitive sensor 210 may be set at a location where the bending degree of the connecting portion 12 and / or the hook portion 11 changes relatively greatly to detect the current placement state of the headset 100B (e.g., normal wearing state or non-wearing state). Further, the capacitive sensor 210 may include a shielding structure ( Figure 1B (not shown), the potential of the shielding structure remains unchanged, thereby reducing the influence of the external electric field on the capacitive sensor 210.

[0061] Figure 2 Schematic diagram of the circuit module of the earphone shown in some embodiments of this specification. Figure 2 In some embodiments, the earphone 100 may further include a processing circuit 220 and a control circuit 230. The processing circuit 220 may be electrically connected to the capacitive sensor 210 and the control circuit 230. The processing circuit 220 may determine the bending state of the connector 120 based on the bending signal detected by the capacitive sensor 210. Specifically, the processing circuit 220 may determine the equivalent curvature radius of the connector 120 based on the bending signal detected by the capacitive sensor 210, thereby determining the bending state (or degree of bending) of the connector 120. Exemplarily, in some embodiments, the mapping relationship between the bending signal and the equivalent curvature radius of the connector 120 may be pre-configured based on experimental data. The processing circuit 220 may determine the equivalent curvature radius of the connector 120 based on the bending signal detected by the capacitive sensor 210 and the mapping relationship, thereby determining the bending state (or degree of bending) of the connector 120. It should be noted that in the embodiments of this specification, when the earphone 100 is as follows Figure 1AIn the bone conduction earphones shown, due to the limitation of the shape of the rear hanging component 122 (for example, the shape of the titanium wire), the measurement of the equivalent radius of curvature is easier to achieve than simple stress measurement, and its measurement results are more reliable. In addition, the equivalent radius of curvature can establish a more stable mapping relationship between the placement state of the bone conduction earphones, and is not easily interfered by factors such as pressure and shaking, thereby making the wearing detection more accurate. Further, the processing circuit 220 can determine the placement state of the earphone 100 based on the bending state of the connector 120. In some embodiments, the placement state of the earphone 100 may include one of a normal wearing state, an abnormal wearing state, or a free placement state. The normal wearing state may refer to the state of the earphone 100 when the user wears the earphone 100 normally to play audio; the free placement state may refer to the state when the earphone 100 is not worn by the user; the abnormal wearing state may refer to other states of the earphone 100 other than the normal wearing state and the free placement state, for example, the state when the user hangs the earphone 100 around the neck. For more descriptions on the determination of the placement state of the earphone 100, please refer to other places in this specification, such as Figure 12 、 Figures 13A-13C 、 Figures 14A-14C The description thereof will not be repeated here.

[0062] The control circuit 230 can adjust the working state of one or more electronic components (e.g., a Bluetooth module, a battery, etc.) of the headset 100 based on the determination result of the processing circuit 220. Specifically, when the headset 100 is in a normal wearing state, the control circuit 230 can control at least one of the one or more electronic components to be in an awake state, and when the headset 100 is in an abnormal wearing state or a free placement state, the control circuit 230 can control at least one of the one or more electronic components to be in a low-power working state or a disabled state. For example, when it is determined that the headset 100 is in a normal wearing state, the control circuit 230 can control the headset 100 to enter an awake state (i.e., connect the battery to the circuit); conversely, when it is determined that the headset 100 is in an abnormal wearing state or a free placement state, the control circuit 230 can control the headset 100 to be in a standby state (i.e., disconnect the battery from the circuit). For another example, when it is determined that the headset 100 is in a normal wearing state, the control circuit 230 may control the Bluetooth module to enable the Bluetooth function. Conversely, when it is determined that the headset 100 is in an abnormal wearing state or a free-standing state, the control circuit 230 may control the Bluetooth module to disable the Bluetooth function. For another example, when it is determined that the headset 100 is in a normal wearing state, the control circuit 230 may control the headset 100 to automatically play music. Conversely, when it is determined that the headset 100 is in an abnormal wearing state or a free-standing state, the control circuit 230 may control the headset 100 to stop playing music.

[0063] In some embodiments, the processing circuit 220 can also determine the user's head circumference based on the bending signal detected by the capacitive sensor 210, thereby determining the force between the speaker assembly 110 and the user's head or ear. Furthermore, the processing circuit 220 can optimize the acoustic output algorithm of the two speaker assemblies 110 based on the force between the speaker assembly 110 and the user's head or ear, and adjust the audio output signal so that the user obtains the best sound effect and wearing experience. For example, the equivalent radius of curvature of each connector 120 can correspond to a head circumference. The processing circuit 220 can determine the user's head circumference based on the determined equivalent radius of curvature of the connector 120. The size of the head circumference can reflect the size of the force between the speaker assembly 110 and the user's head or ear. The larger the head circumference, the greater the force between the speaker assembly 110 and the user's head or ear. When the force between the speaker assembly 110 and the user's head or ear is less than a certain value, the loss of low-frequency signals in the audio signal transmitted to the skin by the speaker assembly 110 may be relatively large. At this time, the output gain of the low-frequency signals can be increased in the acoustic output algorithm of the speaker assembly 110 to balance it, thereby avoiding the problem of reducing the low-frequency signals in the output signal of the speaker assembly 110 due to wearing problems, thereby improving the user experience.

[0064] It should be noted that, in some embodiments of the present specification, the headset 100 can obtain audio signals through wired communication and / or wireless communication. For example, in some embodiments, the headset 100 may also include a cable and a connector. The connector can be used to connect to other devices (such as mobile phones, computers, etc.) to obtain audio data. The audio data can be transmitted to the two speaker assemblies 110 via a cable for output, thereby converting the electrical signal into an acoustic signal. For another example, in some embodiments, the headset 100 may include a wireless communication module ( Figure 1A (not shown). The headset 100 can receive audio data from other devices through the wireless communication module and output sound through the two speaker assemblies 110. Exemplary wireless communication modules may include a Bluetooth module, an infrared communication module, a WiFi module, a ZigBee module, and the like.

[0065] Figure 3 Schematic diagram of the structure of a capacitive sensor according to some embodiments of this specification. Figure 4 Schematic diagram of the structure of a capacitive sensor according to other embodiments of this specification.

[0066] Reference Figure 3In some embodiments, the capacitive sensor 210 may include a first electrode plate 211 and a shielding structure 213. The shielding structure 213 may also serve as a second electrode plate of the capacitive sensor 210 and together with the first electrode plate 211 form a capacitor. For example, the first electrode plate 211 and at least a portion of the second electrode plate formed by the shielding structure 213 may be parallel to each other to form a capacitor. Specifically, as Figure 3 As shown, the area of ​​the first electrode plate 211 may be smaller than the area of ​​the second electrode plate formed by the shielding structure 213. The second electrode plate formed by the shielding structure 213 has a cavity 2132, and the first electrode plate 211 may be disposed in the cavity 2132.

[0067] In some embodiments, the shielding structure 213 (e.g., the second electrode plate) can be a closed setting or a non-closed setting. The closed setting can be understood as the cavity 2132 formed by the shielding structure 213 having no opening. It should be noted that the closed setting of the shielding structure 213 can mean that the shielding structure 213 is surrounded by conductors except for the tiny gaps caused by the necessary signal leads. The non-closed setting can be understood as the cavity 2132 formed by the shielding structure 213 having an opening. In some embodiments, the opening can be oriented perpendicular to the facing direction of the two electrode plates (i.e., Figure 3 AA' direction) (for example, the opening is facing Figure 3 direction ZZ' shown in FIG. 1 ). For example, Figure 3 As shown, the cavity 2132 of the second electrode plate formed by the shielding structure 213 has an opening 2134, and the opening 2134 is located at one end of the first electrode plate 211. For another example, Figure 4 As shown, the second electrode plate formed by the shielding structure 213 completely or substantially completely covers the first electrode plate 211. In other words, the cavity 2132 of the second electrode plate formed by the shielding structure 213 does not have an opening. In some embodiments, the size of the opening 2134 may affect the shielding effect of the non-enclosed shielding structure 213. Therefore, the size of the opening 2134 can be designed according to actual needs and is not specifically limited in this specification.

[0068] Furthermore, by setting the potential (or electric potential) of the shielding structure 213 (i.e., the second electrode plate) to a fixed value (i.e., it always remains unchanged), the electric field lines of the capacitive sensor 210 can be leaked into the air as little as possible, thereby reducing the impact of the external electric field on the capacitive sensor 210 and improving the detection accuracy of the capacitive sensor 210. In some embodiments, in order to ensure that the potential of the shielding structure 213 of the capacitive sensor 210 is a fixed value, the shielding structure 213 can be connected to the reference potential terminal. It should be noted that, in some embodiments, the reference potential may refer to an end of the headset 100 at which the potential is constant, and its potential value may be equal to or not equal to 0. When the potential of the reference potential terminal is 0, the reference potential terminal may also be referred to as the ground terminal (GND). In some embodiments, when the shielding structure 213 is connected to the ground terminal (GND), the same potential difference can be created between the shielding structure 213 (i.e., the second electrode plate) and the first electrode plate 211, and since the electric field lines of the shielding structure 213 are perpendicular to its surface, the electric field lines between the second electrode plate formed by the shielding structure 213 and the first electrode plate 211 are guaranteed not to change, thereby making the capacitive sensor 210 unaffected by the outside world. In some embodiments, the impedance between the shielding structure 213 and the reference potential in the processing circuit 220 can be limited so as not to be affected by the outside world, so that the potential of the shielding structure 213 of the capacitive sensor 210 is a fixed value. Exemplarily, an excitation signal having the same potential as the first electrode plate 211 can be applied to the shielding structure 213 (i.e., the second electrode plate) by active excitation, so that the potential difference between the shielding structure 213 and the first electrode plate 211 is zero. It can be understood that when the shielding structure 213 (i.e., the second electrode plate) and the first electrode plate 211 have the same electric potential, there is no electric field line distribution between the shielding structure 213 and the first electrode plate 211. At this time, the impedance between the shielding structure 213 and the reference potential in the processing circuit 220 will not be affected by external factors.

[0069] In some embodiments, in order to adapt to the detection of the bending state of the earphone 100, the first electrode plate 211 and the second electrode plate formed by the shielding structure 213 can be a flexible conductor. The flexible conductor can refer to an object with a certain degree of flexibility and capable of conducting electricity. In some embodiments, the flexible conductor can include a fluid conductor or a non-fluid conductor. In some embodiments, the fluid conductor can include liquid metal, or a conductive solution with fluidity based on conductor particles (for example, metal particles, carbon nanotubes, etc.) and a fluid solvent. In some embodiments, the non-fluid conductor can include a non-fluid conductive coating obtained by doping conductor particles and a non-fluid flexible solvent after curing. Exemplary conductor particles can include carbon black, carbon nanotubes, graphene, silver powder, copper powder, etc. Exemplary non-fluid flexible solvents after curing can include epoxy resin, polyvinyl chloride (PVC), polyimide resin, phenolic resin, etc.

[0070] In some embodiments, in order to ensure absolute insulation between the two electrode plates of the capacitive sensor 210 during deformation, the surfaces of the first electrode plate 211 and / or the second electrode plate formed by the shielding structure 213 can be respectively coated with insulating materials. In some embodiments, in order to ensure absolute insulation between the two electrode plates of the capacitive sensor 210 during deformation, the space between the first electrode plate 211 and the second electrode plate formed by the shielding structure 213 can be filled with a flexible substrate 215. The flexible substrate 215 is an insulating material, which is used to divide the first electrode plate 211 and the second electrode plate formed by the shielding structure 213 into two parts that do not contact each other. For example, in some embodiments, the flexible substrate 215 may include one or more flexible insulating materials such as hot melt adhesive, silicone, silicone rubber, PDMS (Polydimethylsiloxane, polydimethylsiloxane) and the like.

[0071] In some embodiments, the capacitive sensor 210 may further include a lead (not shown), which may be connected to the first electrode plate 211 and the second electrode plate formed by the shielding structure 213, respectively, to thereby lead out the signal on the second electrode plate formed by the first electrode plate 211 and the shielding structure 213. In some embodiments, the lead may be connected to the processing circuit 220, and the processing circuit 220 may determine the current bending state of the connector 120 based on the signal output by the lead and the mapping relationship between the signal and the degree of bending of the connector 120.

[0072] By using a shielding structure as the second electrode plate of the capacitive sensor, electromagnetic shielding can be achieved, reducing the interference of the external electric field on the capacitive sensor, while effectively reducing the difficulty of the processing technology for setting the shielding structure for the capacitive sensor, and to a certain extent reducing the overall thickness and cost of the capacitive sensor and the shielding structure, which is beneficial to industrial production.

[0073] Figure 5 Schematic diagram of the structure of a capacitive sensor according to other embodiments of this specification.

[0074] In some embodiments, reference Figure 5The first electrode plate 211 may include a plurality of spaced-apart sub-electrode plates, for example, sub-electrodes 2112, 2114, and 2116. In some embodiments, the plurality of sub-electrode plates may be independent of one another (for example, the plurality of sub-electrode plates and the second electrode plate formed by the shielding structure 213 are separated by a flexible substrate 215), and each electrode plate may output its signal through its corresponding lead (or wire). The processing circuit 220 may process the signals output by each lead separately to determine the current placement state of the earphone 100. For example, the processing circuit 220 may determine the current degree of bending of the corresponding part based on the signals output by the sub-electrode plates at different positions. The processing circuit 220 may determine the current placement state of the earphone 100 based on the degree of bending of each part. For example, for a single-ear earhook earphone 100B, different sub-electrode plates may be evenly or unevenly distributed in the hook-shaped portion 11 and / or the connecting portion 12. For each sub-electrode plate, the processing circuit 220 may determine the degree of bending of each position based on its output signal. Only when the bending degree of the sub-electrode plates at each position exceeds the threshold degree, the processing circuit 220 can determine that the earphone 100 is in a normal wearing state. In some embodiments, the multiple sub-electrode plates and the second electrode plate formed by the shielding structure 213 can have the same or different distances.

[0075] In some embodiments, multiple sub-electrode plates can also be electrically connected to each other via wires. In other words, multiple sub-electrode plates can be connected in series via wires. After being connected in series via the wires, the multiple sub-electrode plates can output their signals via only one lead. The lead can be electrically connected to any sub-electrode plate. This arrangement can prevent the capacitive sensor 210 from being easily broken during the bending and deformation of the rear-hanging component 122 of the earphone 100, thereby increasing the service life of the capacitive sensor 210.

[0076] Figure 6 Schematic diagram of the structure of a capacitive sensor according to other embodiments of this specification.

[0077] Reference Figure 6 In some embodiments, the capacitive sensor 210 may include a first electrode plate 211, a second electrode plate 212, and a shielding structure 213. The shielding structure 213 may be a conductor (e.g., a metal conductor and / or a non-metallic conductor) having a cavity. The first electrode plate 211 and the second electrode plate 212 may be disposed in the cavity within the shielding structure 213. In some embodiments, the shielding structure 213 may be a closed configuration or a non-closed configuration, for details, see Figure 3 or Figure 4 , I will not go into details here.

[0078] In some embodiments, the first electrode plate 211 and the second electrode plate 212 may be arranged symmetrically in the horizontal and vertical directions (including the ZZ′ direction and the AA′ direction), or may be offset as required.

[0079] In some embodiments, to enable the capacitive sensor 210 to be suitable for detecting whether the headset 100 is worn, the conductor of the shielding structure 213 is made to have a certain degree of elasticity so that it can deform with the deformation of the back hanging component 122 of the headset 100. Exemplary conductors may include conductive glue, flexible conductive cloth, conductive film (e.g., conductive silver paste film, conductive carbon paste film), etc.

[0080] In some embodiments, in order to meet the supporting performance and clamping performance of the connecting member 120 during use, a skeleton structure (such as Figure 7 The skeleton structure 270 may have a certain hardness or rigidity, and can provide the clamping force required by the user when wearing it through its ability to deform and recover. For example, in some embodiments, the skeleton structure may include a metal structure such as titanium wire, titanium-nickel wire (sheet), etc.

[0081] In some embodiments, the stiffness of the skeleton structure in the bending direction of the rear hanging component 122 can be greater than the stiffness of the capacitive sensor 210 in the bending direction of the rear hanging component 122, so that the skeleton structure can provide a clamping force to fix the two speaker components 110 to the user's head through bending deformation. In some embodiments, in order to further ensure that the capacitive sensor 210 can accurately detect the change in the bending state of the connecting member 120, the capacitive sensor 210 can be fitted with the skeleton structure. It should be noted that in some embodiments, after the capacitive sensor 210 is fitted with the skeleton structure, if the skeleton structure is a conductor, such as made of titanium wire, the skeleton structure can serve as a part of the capacitive sensor 210 (such as the shielding structure 213 of the aforementioned capacitive sensor), and the two together play a role in detecting the change in the bending state of the connecting member 120.

[0082] Figure 7 1 is a schematic diagram of the cross-sectional structure of the connector of the earphones according to some embodiments of this specification. Figure 8 1 is a schematic diagram of the cross-sectional structure of the connector of the earphone according to other embodiments of this specification.

[0083] Reference Figure 7In some embodiments, the connector 120 may include a housing 123. The housing 123 may form a housing cavity 125. In some embodiments, a wiring 260, a skeleton structure 270, and a capacitive sensor 210 may be housed in the housing cavity 125. The wiring 260 may refer to a cable arranged inside the housing cavity 125, which may be used to transmit audio signals, bending signals detected by the capacitive sensor 210, and control signals for controlling the operating status of components such as the two speaker assemblies 110 and the Bluetooth module.

[0084] In some embodiments, the housing 123 can be made of a hard material with a certain hardness or rigidity, which can have a certain degree of deformation and provide the clamping force required when worn by the user. In some embodiments, the hard material can include a metal material or a non-metallic material, such as an aluminum alloy, a nickel-titanium alloy, or a plastic. In some embodiments, the outer contour of the housing 123 can be a regular shape such as a cylinder, an elliptical cylinder, a prism (such as a quadrangular prism, a pentagonal prism, a hexagonal prism, etc.), or other irregular shapes.

[0085] Reference Figure 7 and Figure 8 In some embodiments, the trace 260 and the capacitive sensor 210 can be separated on both sides of the skeleton structure 270. In some embodiments, in order to prevent the trace 260, the skeleton structure 270, and the capacitive sensor 210 from shaking or colliding in the accommodating cavity 125 due to external forces, thereby generating noise or affecting the detection results of the capacitive sensor 210, the trace 260 and the capacitive sensor 210 can be fixed to the inner wall of the accommodating cavity 125 by bonding, clamping, or other fixing methods. In some embodiments, in order to further avoid the aforementioned problems, a filler can be used to fill the gap in the accommodating cavity 125. For example, the gap can be filled with silicone, sponge, etc. It should be noted that in this specification, the shape of the trace 260 is only an example. In some other embodiments, the trace 260 can have other shapes, for example, it can be cylindrical, elliptical, prismatic, etc.

[0086] In some embodiments, reference Figure 7 , the capacitive sensor 210 may not have an opening. That is, after the shielding structure 213 of the capacitive sensor 210 completely or substantially completely covers the capacitive structure in the capacitive sensor 210, it is then fitted together with the skeleton structure 270. In this case, the skeleton structure 270 may be a conductor skeleton (which has conductive properties) or a non-conductor skeleton (which does not have conductive properties). It is understood that in the case of a Figure 7 In the earphone 100 of the connector shown, the shielding structure 213 provides electromagnetic shielding for the capacitive sensor 210 , thereby reducing the influence of external electric fields on the capacitive sensor 210 .

[0087] In some embodiments, reference Figure 8 , the skeleton structure 270 can be a conductor skeleton. In this case, the cavity formed by the shielding structure 213 of the capacitance sensor 210 can have an opening, and the opening can be oriented toward the skeleton structure 270. That is, when the shielding structure 213 of the capacitance sensor 210 partially covers the capacitance structure in the capacitance sensor 210, the opening of the shielding structure 213 is closed by fitting the opening of the shielding structure 213 to the skeleton structure 270, thereby shielding the interference of the external electric field. It can be understood that in the case of a device having Figure 8 In the earphone 100 of the connector shown, the shielding structure 213 and the skeleton structure 270 together provide electromagnetic shielding for the capacitive sensor 210 , thereby reducing the influence of external electric fields on the capacitive sensor 210 .

[0088] Figure 9A and Figure 9B 1 is a schematic diagram of the cross-sectional structure of the connector of the earphones according to some embodiments of this specification.

[0089] Reference Figure 9A and Figure 9B In some embodiments, the trace 260 and the capacitive sensor 210 may be located on the same side of the skeleton structure 270. The capacitive sensor 210 may be located between the trace 260 and the skeleton structure 270, and a portion of the capacitive sensor 210 may be aligned with the trace 260 and the skeleton structure 270.

[0090] In some embodiments, as Figure 9A As shown, the capacitive sensor 210 may not have an opening. That is, after the shielding structure 213 of the capacitive sensor 210 completely or substantially completely covers the capacitive structure in the capacitive sensor 210, it is then fitted together with the skeleton structure 270. In this case, the skeleton structure 270 can be a conductive skeleton (which has conductive properties) or a non-conductive skeleton (which does not have conductive properties). It can be understood that in the case of a Figure 9A In the earphone 100 of the connector shown, the shielding structure 213 provides electromagnetic shielding for the capacitive sensor 210 , thereby reducing the influence of external electric fields on the capacitive sensor 210 .

[0091] In some embodiments, reference Figure 9B , the skeleton structure 270 can be a conductor skeleton. The cavity formed by the shielding structure 213 of the capacitance sensor 210 can have an opening, and the opening can be oriented toward the skeleton structure 270. That is, when the shielding structure 213 of the capacitance sensor 210 partially covers the capacitance structure in the capacitance sensor 210, the opening of the shielding structure 213 is closed by fitting the opening of the shielding structure 213 with the skeleton structure 270 to shield the interference of the external electric field. It can be understood that in the case of a device having Figure 9BIn the earphone 100 of the connector shown, the shielding structure 213 and the skeleton structure 270 together provide electromagnetic shielding for the capacitive sensor 210 , thereby reducing the influence of external electric fields on the capacitive sensor 210 .

[0092] In some embodiments, to ensure that the capacitive sensor 210 is better connected and fixed to the skeleton structure 270 and / or the trace 260 , the shielding structure 213 may wrap the skeleton structure 270 and / or the trace 260 together.

[0093] Figure 10 Schematic diagram of the platform structure of the connector of the earphones according to some embodiments of this specification. Figure 11 1 is a schematic diagram of the cross-sectional structure of the connector of the earphone according to other embodiments of this specification.

[0094] In some embodiments, if the capacitive sensor 210 is directly placed in the rear-mounted component 122, the sensor may undergo irreversible plastic deformation during use due to excessive deformation of the rear-mounted component 122, thereby causing sensor hysteresis or damage. Therefore, to avoid the aforementioned problems and make the installation of the capacitive sensor 210 (e.g., a capacitive sensor) more convenient and reliable, the headset 100 may further include a platform structure 300. It will be understood that the platform structure 300 can reduce the deformation of the capacitive sensor 210 to a certain extent, thereby preventing damage or reduced performance due to excessive deformation.

[0095] Reference Figure 10 or Figure 11 The platform structure 300 can be disposed in the rear suspension assembly 122 and used to mount the capacitive sensor 210. Specifically, the platform structure 300 can be disposed on the skeleton structure 270, and the capacitive sensor 210 can be disposed on the platform structure.

[0096] In some embodiments, the platform structure 300 can be made of metal or non-metallic materials. When the platform structure 300 is made of metal, it can work together with the shielding structure 213 of the capacitive sensor 210 to provide electromagnetic shielding for the capacitive sensor 210, thereby reducing the impact of external electric fields on the capacitive sensor 210. In this case, the cavity formed by the shielding structure 213 of the capacitive sensor 210 can have an opening, and the opening can be oriented toward the platform structure 300. In other words, when the shielding structure 213 of the capacitive sensor 210 partially covers the capacitive structure in the capacitive sensor 210, the opening of the shielding structure 213 is closed by fitting the shielding structure 213 to the platform structure 300, thereby shielding against interference from external electric fields.

[0097] In some embodiments, the platform structure 300 can be integrally formed with the skeleton structure 270 (eg, titanium wire). In some embodiments, the platform structure 300 can be a separate component that can be fitted to the skeleton structure 270, for example, by gluing.

[0098] Figure 12 Schematic diagram of a circuit module of an earphone according to other embodiments of this specification.

[0099] In some embodiments, the earphone 100 may further include a touch sensor 240. The touch sensor 240 may be disposed within the housing of the at least one speaker assembly 110 or as an example. Figure 1A The earphone compartment 130 is shown. The contact sensor 240 can be used to identify whether the earphone compartment 130 is close to or in contact with the user (e.g., in contact with the user's skin). In some embodiments, the earphones 100 may include two left and right earphone compartments 130. To improve the accuracy of wearing detection, a contact sensor 240 may be provided in each of the left and right earphone compartments 130. The contact signals detected by both contact sensors 240 are used to jointly determine whether the earphone compartment 130 is close to or in contact with the user. For example, the processing circuit 220 determines that the earphone compartment 130 is close to or in contact with the user only when both left and right contact sensors 240 detect that the user is close to or in contact with the user. In some embodiments, the contact sensor 240 may include one or more of a capacitive proximity sensor, a pressure sensor (e.g., a thin film pressure sensor), an infrared sensor, a laser sensor, and the like. It should be noted that different types of contact sensors may employ different operating principles and may use different parameters to determine whether a corresponding component is in contact with the user. For example, a pressure sensor may determine that the corresponding component is in contact with the user when the detected pressure is greater than a pressure threshold; whereas, it may determine that the corresponding component is not in contact with the user when the detected pressure is less than the pressure threshold. For another example, for an infrared sensor, when the detected distance is greater than a distance threshold, it can be determined that the corresponding component is in contact with the user; and when the detected distance is less than the distance threshold, it is determined that the corresponding component is not in contact with the user.

[0100] It should be noted that when the touch sensor 240 is a capacitive proximity sensor, the capacitive proximity sensor may also include a shielding structure. The potential of the shielding structure may remain constant and is used to reduce the influence of the external electric field on the capacitive proximity sensor.

[0101] The processing circuit 220 can determine the current placement state of the earphone 100 based on the bending signal collected by the capacitive sensor 210 and the contact signal collected by the contact sensor 240. For more information on combining the bending signal of the capacitive sensor 210 and the contact signal of the contact sensor 240 to determine the placement state of the earphone 100, please refer to this specification. Figures 13A-13Cand Figures 14A-14C The description is not repeated here.

[0102] In some embodiments, to reduce power consumption of the headset 100 and / or the touch sensor 240, the touch sensor 240 can be placed in a sleep state by default. When the bending signal collected by the capacitive sensor 210 indicates that the equivalent radius of curvature of the connector 120 is greater than or equal to a preset threshold, the processing circuit 220 can control the touch sensor 240 to collect a touch signal. In some embodiments, to reduce power consumption of the headset 100 and / or the touch sensor 240, the processing circuit 220 can receive and process the touch signal from the touch sensor 240 only when the bending signal collected by the capacitive sensor 210 indicates that the equivalent radius of curvature of the connector 120 is greater than or equal to a preset threshold. The preset threshold can be greater than the equivalent radius of curvature when the headset 100 is placed freely.

[0103] In some embodiments, the headset 100 may not include the connector 120. In this case, the headset 100 may be one or more of open-ear headphones, smart glasses, single-ear earphones, single-ear in-ear headphones (e.g., true wireless Bluetooth headphones), etc. In this case, the headset 100 may not include the capacitive sensor 210, but may include at least two other types of sensors (e.g., two contact sensors). The processing circuit 220 may collaboratively determine whether the headset 100 is in a normal wearing state based on the signals detected by the at least two other types of sensors. By way of example only, the headset 100 may include a first contact sensor and a second contact sensor. The first contact sensor and the second contact sensor may be of the same or different types. For example, the first contact sensor may be an infrared sensor, and the second contact sensor may be a thin-film pressure sensor. In some embodiments, the first and second contact sensors may be located at any suitable location on the headset 100. For example, the first and second contact sensors may be located simultaneously in the housing of the same speaker assembly 110 or separately in the housings of two speaker assemblies 110. For another example, for smart glasses, the first contact sensor and the second contact sensor can be simultaneously disposed in one temple or separately disposed in two temples. For another example, for smart glasses, the first contact sensor can be disposed on the temple, and the second contact sensor can be disposed on the nose pad. The processing circuit 220 can directly determine whether the headset 100 is in a normal wearing state based on the contact signals collected by the first contact sensor and the second contact sensor. For example, the processing circuit 220 determines that the headset 100 is in a normal wearing state only when the first contact sensor and the second contact sensor simultaneously detect that the user is approaching or in contact with the user.

[0104] In some embodiments, the headset 100 may include a contact sensor and an orientation sensor (e.g., a gyroscope). For example, for a single-ear earhook headset, the contact sensor may be positioned near the top of the auricle during normal wear. The processing circuit 220 determines that the headset 100 is in a normal wear state only when the contact sensor detects a user approaching or touching the user and the orientation sensor indicates that the headset is positioned vertically.

[0105] Figure 13A is a schematic diagram of an exemplary headset in a free-standing state according to some embodiments of this specification. Figure 13B This is a schematic diagram of an exemplary headset in a normal wearing state according to some embodiments of this specification. Figure 13C This is a schematic diagram of an exemplary headset in an abnormal wearing state according to some embodiments of this specification.

[0106] In some embodiments, reference Figures 13A-13C The contact sensor 240 can be arranged on the inner side of the earphone compartment 130 (ie, the side close to the human skin when the earphone 100 is in a normal wearing state). Figure 13A As shown in FIG), the equivalent curvature radius of the connecting member 120 is R0. When the earphone 100 is in a normal wearing state (as shown in FIG), the connecting member 120 has an equivalent curvature radius of R0. Figure 13B As shown in the figure, due to the support of the head, the equivalent curvature radius of the connector 120 increases to R1, that is, R1>R0. At this time, the earphone compartment 130 does not contact the user's head. When the earphone 100 is in an abnormal wearing state (for example, the user hangs the earphone 100 around the neck) (as shown in the figure), the equivalent curvature radius of the connector 120 increases to R1, that is, R1>R0. At this time, the earphone compartment 130 does not contact the user's head. Figure 13C As shown in the figure, due to the supporting effect of the neck, the equivalent radius of curvature of the connector 120 increases to R2, that is, R2>R0. Since the neck size is smaller than the head size, R1>R2>R0. At this time, the earphone compartment 130 is in contact with the user's neck (or close to the user's neck). Based on this, in some embodiments, the current equivalent radius of curvature of the connector 120 can be determined according to the bending signal generated by the capacitive sensor 210, and the contact state of the earphone compartment 130 and the user detected by the contact sensor 240 can be used to jointly determine the current placement state of the earphone 100.

[0107] As an example only, when the bending signal detected by the capacitive sensor 210 is a first bending signal indicating that the equivalent curvature radius of the connector 120 (or the rear hanging component 122) is greater than or equal to a preset threshold, the output of the capacitive sensor 210 may be 1 (i.e., the output is a high level); conversely, when the bending signal detected by the capacitive sensor 210 is a second bending signal indicating that the equivalent curvature radius of the connector 120 is less than the preset threshold, the output of the capacitive sensor 210 may be 0 (i.e., the output is a low level). Similarly, when the contact signal detected by the touch sensor 240 is a first contact signal indicating that the earphone compartment 130 is not in contact with the user (or the distance from the user is greater than a preset distance threshold), the output of the touch sensor 240 may be 1 (i.e., the output is a high level); conversely, when the contact signal detected by the touch sensor 240 is a second contact signal indicating that the earphone compartment 130 is in contact with the user (or the distance from the user is less than a preset distance threshold), the output of the touch sensor 240 may be 0 (i.e., the output is a low level).

[0108] It should be noted that, in some embodiments of the present specification, when the earphone 100 includes multiple capacitive sensors 210 disposed at different locations, a total bending signal may be determined based on the bending signals detected by the multiple capacitive sensors 210. For example, when the earphone 100 is disposed at a position such as Figure 1A When the bending signals detected by the capacitive sensors 210 at positions A, B, and C all indicate that the equivalent radius of curvature of the connector 120 (or rear-hanging component 122) is greater than or equal to a preset threshold, the total bending signal output by the multiple capacitive sensors 210 can be determined as a first bending signal (i.e., its value is 1). For another example, when the bending signal detected by the capacitive sensor 210 at position B indicates that the equivalent radius of curvature of the connector 120 (or rear-hanging component 122) is greater than or equal to the preset threshold, but the bending signals detected by the capacitive sensors 210 at positions A and C indicate that the equivalent radius of curvature of the connector 120 (or rear-hanging component 122) is equal to the equivalent radius of curvature when the earphone 100 is freely placed, it indicates that bending deformation may have occurred at position B due to accidental contact. In this case, the total bending signal output by the multiple capacitive sensors 210 can be determined as a second bending signal (i.e., its value is 0).

[0109] Furthermore, the processing circuit 220 can determine whether the headset 100 is in a normal wearing state based on the output of the capacitive sensor 210 and the output of the contact sensor 240, and thereby issue an instruction to the control circuit 230 based on whether the headset 100 is in a normal wearing state. The control circuit 230 can control the operating state of the headset 100 based on the received control instruction. In some embodiments, referring to Table 1, only when the bending signal is the first bending signal (i.e., its value is 1) and the contact signal is the first contact signal (i.e., its value is 1), the output of the processing circuit 220 can be 1, indicating that the headset 100 is determined to be in a normal wearing state. When the output of either the capacitive sensor 210 or the contact sensor 240 is 0, the output of the processing circuit 220 can be both 0, indicating that the headset 100 is determined to be in an abnormal wearing state or a free-standing state. Furthermore, the control circuit 230 can control the operating state of one or more components of the headset 100 based on the output of the processing circuit 220. For example, when the total output of the processing circuit 220 is 1, the control circuit 230 can control the headset 100 to enter the awake state; when the total output of the processing circuit 220 is 0, the control circuit 230 can control the headset 100 to remain in the standby state.

[0110] Table 1 Detection scheme of earphone placement status when contact sensor is placed in earphone compartment

[0111]

[0112] It should be noted that the output signals shown in Table 1 are merely exemplary. In some embodiments, other methods may be used to represent the bending signal detected by the capacitive sensor 210, the contact signal detected by the touch sensor 240, and the total output signal of the headset 100. For example, in some embodiments, when the contact signal detected by the touch sensor 240 is the aforementioned first contact signal, its output may be represented by 0 (i.e., the output is a low level). Conversely, when the contact signal detected by the touch sensor 240 is the aforementioned second contact signal, its output may be represented by 1 (i.e., the output is a high level).

[0113] Figure 14A is a schematic diagram of an exemplary headset in a free-standing state according to some embodiments of this specification. Figure 14B This is a schematic diagram of an exemplary headset in a normal wearing state according to some embodiments of this specification. Figure 14C This is a schematic diagram of an exemplary headset in an abnormal wearing state according to some embodiments of this specification.

[0114] In some embodiments, reference Figures 14A-14CThe contact sensor 240 can also be set inside the shell of at least one speaker assembly 110 (for example, the side close to the human skin when the earphone 100 is in a normal wearing state) to identify whether the speaker assembly 110 is in contact with the user (or close to the user). Figures 13A-13C The difference is that when the contact signal detected by the contact sensor 240 is a first contact signal indicating that the speaker assembly 110 is not in contact with the user (or the distance between the speaker assembly 110 and the user is greater than a preset distance threshold), the output of the contact sensor 240 can be 1 (i.e., the output is a high level); conversely, when the contact signal detected by the contact sensor 240 is a second contact signal indicating that the speaker assembly 110 is in contact with the user (or the distance between the speaker assembly 110 and the user is less than a preset distance threshold), the output of the contact sensor 240 can be 0 (i.e., the output is a low level).

[0115] In some embodiments, as shown in Table 2, when the contact sensor 240 is disposed within the housing of the speaker assembly 110, the output of the processing circuit 220 is 1, indicating that the earphone 100 is in a normal wearing state, only when the bending signal detected by the capacitive sensor 210 is the aforementioned first bending signal (i.e., its value is 1) and the signal detected by the contact sensor 240 is the second contact signal (i.e., its value is 0). When the bending signal detected by the capacitive sensor 210 is the aforementioned second bending signal (i.e., its value is 0) and / or the signal detected by the contact sensor 240 is the first contact signal (i.e., its value is 1), indicating that the speaker assembly 110 is not in contact with the user (or the distance from the user is greater than a preset distance threshold), the output of the processing circuit 220 may be both 0, indicating that the earphone 100 is in an abnormal wearing state or a free-standing state. Furthermore, the control circuit 230 may control the operating state of one or more components of the earphone 100 based on the output of the processing circuit 220. For example, when the total output of the processing circuit 220 is 1, the control circuit 230 can control the headset 100 to enter the awake state; when the total output of the processing circuit 220 is 0, the control circuit 230 can control the headset 100 to remain in the standby state.

[0116] Table 2 Detection scheme for earphone placement when the contact sensor is placed in the speaker assembly housing

[0117]

[0118] As above, it should be noted that the output signals shown in Table 2 are merely exemplary. In some embodiments, other methods may be used to represent the bending signal detected by the capacitive sensor 210, the contact signal detected by the touch sensor 240, and the total output signal of the headset 100. For example, in some embodiments, when the contact signal detected by the touch sensor 240 is the aforementioned first contact signal, its output may be represented by 0 (i.e., the output is a low level); when the contact signal detected by the touch sensor 240 is the aforementioned second contact signal, its output may be represented by 1 (i.e., the output is a high level).

[0119] The beneficial effects that may be brought about by the embodiments of this specification include but are not limited to: (1) In some embodiments of this specification, by setting a shielding structure outside the capacitive sensor, the influence of the external electric field on the capacitive sensor can be reduced, thereby improving the accuracy of the detection result of the capacitive sensor; (2) In some embodiments of this specification, using a shielding structure as the second electrode plate of the capacitive sensor can achieve electromagnetic shielding, reduce the interference of the external electric field on the capacitive sensor, and effectively reduce the difficulty of the processing technology of setting the shielding structure for the capacitive sensor, and to a certain extent reduce the overall thickness and cost of the capacitive sensor and the shielding structure, thereby improving the product yield; (3) In some embodiments of this specification, by setting a platform structure for installing the capacitive sensor, the installation of the capacitive sensor can be made more convenient and reliable, and the capacitive sensor can be prevented from being damaged or reducing its working performance due to excessive deformation during the deformation of the ear hook component. It should be noted that different embodiments may have different beneficial effects. In different embodiments, the beneficial effects that may be produced may be any one or a combination of the above, or any other possible beneficial effects.

[0120] While the basic concepts have been described above, it will be apparent to those skilled in the art that the detailed disclosure is merely illustrative and does not limit this specification. Although not explicitly stated herein, various modifications, improvements, and revisions to this specification may be made by those skilled in the art. Such modifications, improvements, and revisions are suggested in this specification and remain within the spirit and scope of the exemplary embodiments of this specification.

Claims

1. A headset comprising: two speaker assemblies; A connector for connecting the two speaker assemblies, wherein the connector provides a clamping force to fix the two speaker assemblies to the user's head by bending deformation, the connector comprising a housing having an accommodating cavity, wherein a capacitive sensor and a communication cable for transmitting signals to the two speaker assemblies are provided in the accommodating cavity, the capacitive sensor being used to identify the bending state of the connector, wherein: The capacitive sensor includes a shielding structure, the potential of which remains constant and is used to reduce the influence of external electric fields on the capacitive sensor; The capacitive sensor also includes a first electrode plate, and the shielding structure serves as the second electrode plate of the capacitive sensor and forms a capacitor with the first electrode plate, the second electrode plate has a cavity, and the first electrode plate is arranged in the cavity; or, the capacitive sensor also includes a first electrode plate and a second electrode plate, the shielding structure is a conductor with a cavity, and the first electrode plate and the second electrode plate are arranged in the cavity.

2. The headset according to claim 1, wherein The connecting component includes two ear-hook components and a rear-hook component. The two speaker components are connected to the rear-hook component through the two ear-hook components respectively. The capacitive sensor is located in the accommodating cavity formed by the rear-hook component.

3. The earphone according to claim 2, wherein When the shielding structure serves as the second electrode plate of the capacitive sensor and forms a capacitor with the first electrode plate, the first electrode plate and the second electrode plate are flexible conductors, and the space between the first electrode plate and the second electrode plate is filled with a flexible substrate.

4. The earphone according to claim 2, wherein When the shielding structure serves as the second electrode plate of the capacitive sensor and forms a capacitor with the first electrode plate, the first electrode plate includes a plurality of sub-electrode plates that are spaced apart from each other.

5. The earphone according to claim 4, wherein The plurality of sub-electrode plates are electrically connected to each other through a first conductive line, and signals of the plurality of sub-electrode plates are output through a second conductive line connected to any one of the plurality of sub-electrode plates.

6. The earphone according to claim 4, wherein Each of the plurality of sub-electrode plates is electrically connected to a second conductive line, and signals of the plurality of sub-electrode plates are output through the second conductive line corresponding to each sub-electrode plate.

7. The earphone according to claim 2, wherein When the shielding structure is a conductor with a cavity, the conductor includes any one of conductive glue, flexible conductive cloth, and conductive film.

8. The earphone according to any one of claims 2 to 7, wherein: The rear hanging assembly further includes a skeleton structure, and the capacitive sensor is arranged in close contact with the skeleton structure.

9. The earphone according to claim 8, wherein The cavity is a closed structure.

10. The earphone according to claim 8, wherein The skeleton structure is a conductor skeleton, the cavity has an opening, and the opening faces the conductor skeleton.

11. The earphone according to any one of claims 2 to 10, wherein: The earphone further includes a platform structure, which is arranged on the rear hanging component, and the capacitive sensor is fixed on the platform structure.

12. The headset according to claim 11, wherein The platform structure is a solid conductor.

13. The earphone according to any one of claims 1 to 12, wherein: The capacitive sensor is a differential capacitive sensor.

14. A headset comprising: The hook portion is used to be hung between the back of the ear and the head of the user; a holding portion for contacting a front side of the ear portion; as well as The connecting portion is used to connect the hook portion and the holding portion and extends from the head to the outside of the head. When not wearing the earphone, the hook portion, the connecting portion and the holding portion are not coplanar in three-dimensional space, and thus cooperate with the hook portion to provide the holding portion with a pressing force on the front side of the ear. The hook portion or the connecting portion is provided with a capacitive sensor, and the capacitive sensor is used to identify the bending state of the hook portion or the connecting portion. The capacitive sensor includes a shielding structure, the potential of which remains constant and is used to reduce the influence of external electric fields on the capacitive sensor; The capacitive sensor also includes a first electrode plate, and the shielding structure serves as the second electrode plate of the capacitive sensor and forms a capacitor with the first electrode plate, the second electrode plate has a cavity, and the first electrode plate is arranged in the cavity; or, the capacitive sensor also includes a first electrode plate and a second electrode plate, the shielding structure is a conductor with a cavity, and the first electrode plate and the second electrode plate are arranged in the cavity.

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