Polishing apparatus and polishing method

Abstract

The invention provides a grinding device and a grinding method, and belongs to the technical field of device grinding. The device comprises a support; the driving module is mounted on the bracket; the grinding tool is connected with the driving module, and the driving module is used for driving the grinding tool to grind the to-be-ground surface of the to-be-ground part; the bearing part is used for placing a to-be-ground part; the liquid container is arranged in the support, the bearing piece is arranged in the liquid container, and a liquid medium used for bearing the bearing piece is arranged in the liquid container; the driving module can drive the bearing piece to move up and down in the liquid container so as to adjust the grinding force of the grinding tool on the piece to be ground. According to the grinding device, the grinding force can be flexibly adjusted in the grinding process, and the applicability of the grinding device is improved.

Description

Technical Field

[0001] The present application relates to the field of device grinding technology, and in particular to a grinding device and a grinding method. Background Art

[0002] Grinding is a precision machining method used to improve the surface quality and shape accuracy of workpieces. Device grinding refers to the process of finishing the surface of the workpiece to be ground by relative motion between the grinding device and the workpiece to be ground under a certain pressure. This machining method can be used to process various metal and non-metal materials. In the manufacture or maintenance of mechanical equipment, before a specific area on the surface of an object is tightly connected or sealed with other objects or components, it is usually necessary to grind the sealing surface of the sealed object to ensure the accuracy of the seal, for example, grinding the sealing surface of the valve disc and valve seat of the valve, grinding the sealing surface of the assembly step of the flange, etc.

[0003] At present, the grinding process is mainly divided into manual grinding and automatic grinding (also called mechanical grinding). With the development of social industrial technology and the needs of special working scenarios (such as grinding in radioactive environments, super-hardened alloy grinding, etc.), automatic grinding has gradually replaced manual grinding in a wider range of fields. However, the automatic grinding method of the related art usually grinds the grinding tool and the workpiece to be ground in a relatively fixed manner. At this time, if the surface to be ground of the workpiece to be ground is a plane, it can be ground normally, but if the surface to be ground of the workpiece to be ground is a special plane such as a conical surface or a spherical surface, the grinding force cannot be adaptively adjusted, thereby affecting the grinding effect of special planes such as conical surfaces and spherical surfaces. Therefore, how to provide a grinding device that can flexibly adjust the grinding force of special planes such as conical surfaces and spherical surfaces during the grinding process has become a technical problem that needs to be solved urgently. Summary of the invention

[0004] The main purpose of the embodiments of the present application is to propose a grinding device and a grinding method, which can flexibly adjust the grinding force of special planes such as conical surfaces and spherical surfaces during the grinding process, thereby improving the applicability of the grinding device.

[0005] To achieve the above-mentioned purpose, a first aspect of an embodiment of the present application provides a grinding device, the device comprising:

[0006] Bracket;

[0007] A driving module is installed on the bracket;

[0008] A grinding tool connected to the driving module, wherein the driving module is used to drive the grinding tool to grind the surface to be ground of the workpiece;

[0009] A carrier, used for placing the workpiece to be ground; and

[0010] A liquid container is arranged in the bracket, the carrier is arranged in the liquid container, and a liquid medium for carrying the carrier is arranged in the liquid container;

[0011] The driving module can drive the carrier to move up and down in the liquid container to adjust the grinding force of the grinding tool on the workpiece to be ground.

[0012] In some embodiments, the central symmetry axis of the grinding tool, the central symmetry axis of the carrier, and the central symmetry axis of the workpiece to be ground are on the same straight line.

[0013] In some embodiments, the grinding device further comprises:

[0014] A liquid level detection component, used to detect the change of the liquid level in the liquid container and output a control signal;

[0015] The driving module is in communication with the controller and can drive the carrier to move according to the control signal.

[0016] In some embodiments, the liquid level detection component includes:

[0017] a liquid level sensor, mounted on the bracket and extending into the liquid container, for detecting changes in the liquid level; and

[0018] The controller is connected to the liquid level sensor for calculating the grinding force according to the liquid level change data of the liquid level sensor and outputting the control signal.

[0019] In some embodiments, the grinding device further comprises:

[0020] a water inlet control valve, connected to the controller for communication, the water inlet control valve being used to control the flow rate of the liquid medium injected into the liquid container; and

[0021] A drainage control valve is communicatively connected to the controller, and the drainage control valve is used to control the flow rate of the liquid medium discharged from the liquid container.

[0022] In some embodiments, the carrier is marked with scales, and different scales correspond to different grinding forces.

[0023] In some embodiments, the outer surface of the carrier is spherical or hemispherical.

[0024] In some embodiments, when the surface to be ground of the workpiece to be ground is a conical surface or a spherical surface, the grinding head of the grinding tool is adapted to the surface to be ground of the workpiece to be ground.

[0025] In some embodiments, the workpiece to be ground can abut against the inner wall of the carrier to fix the workpiece to be ground.

[0026] To achieve the above object, a second aspect of the embodiments of the present application provides a grinding method, which is applied to the grinding device as described in any embodiment of the first aspect above, and the method comprises:

[0027] Install the workpiece to be ground into the carrier;

[0028] Using a driving module to drive the carrier to move to a preset position in the liquid container;

[0029] The driving module drives the grinding tool to grind the surface to be ground of the workpiece to be ground.

[0030] In some embodiments, the driving module drives the grinding tool to grind the surface to be ground of the workpiece to be ground, specifically including:

[0031] The driving module drives the grinding tool to rotate around a first rotation direction by a first rotation angle, and drives the grinding tool to grind the workpiece in a positive direction;

[0032] The driving module drives the grinding tool to rotate around a second rotation direction by a second rotation angle, and drives the grinding tool to reversely grind the workpiece to be grinded;

[0033] The first rotation direction is opposite to the second rotation direction, and the first rotation angle is smaller than the second rotation angle.

[0034] The present application proposes a grinding device and a grinding method. By placing a carrier in a liquid container, the present application can utilize buoyancy loading to achieve contact between the grinding tool and the workpiece to be ground placed in the carrier, and the driving module can drive the carrier to move up and down in the liquid container, thereby changing the volume of the displaced liquid. Since the buoyancy of the workpiece to be ground is positively correlated with the volume of the displaced liquid, the buoyancy of the workpiece to be ground can be changed. Since the grinding force of the workpiece to be ground is equal to the difference between the buoyancy and the gravity, and the gravity of the workpiece to be ground is constant, the grinding force of the workpiece to be ground is changed, thereby achieving flexible adjustment of the grinding force during the grinding process. Therefore, compared to the related art method of grinding the grinding tool and the workpiece to be ground in a relatively fixed manner, the present application utilizes the buoyancy of the liquid to achieve grinding of special planes with dimensional changes such as conical surfaces and spherical surfaces, and the grinding force can be flexibly adjusted during the grinding process, thereby improving the applicability of the grinding device. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is a schematic cross-sectional structure diagram of a grinding device provided in an embodiment of the present application;

[0036] Figure 2 is a schematic diagram of a partial cross-sectional structure of a grinding device provided in an embodiment of the present application;

[0037] Figure 3 is another schematic cross-sectional structure diagram of a grinding device provided in an embodiment of the present application;

[0038] Figure 4 It is a flow chart of a grinding method provided in an embodiment of the present application.

[0039] Reference numerals:

[0040] 110 - bracket, 120 - bearing member, 130 - liquid container, 140 - grinding tool, 150 - driving module, 160 - part to be ground, 170 - liquid medium, 180 - liquid level sensor, 190 - controller, 191 - water inlet control valve, 192 - water discharge control valve. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0042] It should be noted that, although the functional modules are divided in the device schematic diagram and the logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first", "second", etc. in the specification, claims and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0044] Before further describing the embodiments of the present application in detail, the nouns and terms involved in the embodiments of the present application are explained. The nouns and terms involved in the embodiments of the present application are subject to the following interpretations:

[0045] Grinding: It is a precision machining method used to improve the surface quality and shape accuracy of workpieces. Grinding can use grinding tools and abrasives to remove a very thin layer of metal from the surface of the workpiece, and this machining method can be used for various metal and non-metal materials to process planes, internal and external cylindrical surfaces, conical surfaces, convex and concave spherical surfaces, threads, tooth surfaces and other surfaces.

[0046] Device grinding: refers to the process of finishing the surface of the workpiece by relative motion between the grinding device and the workpiece under a certain pressure. This processing method can be used to process various metal and non-metal materials.

[0047] Grinding force: also known as grinding load, refers to the force applied by the grinding tool (such as a grinding wheel or a grinding disc) to the workpiece during the grinding process. The magnitude and distribution of this force have an important influence on the grinding effect and processing quality. Too little grinding force may lead to poor processing results, while too much grinding force may cause overheating, wear or damage to the workpiece surface. Therefore, the grinding force needs to be precisely controlled during the grinding process to achieve the best processing effect.

[0048] Rigid loading: refers to the rigid contact force between the grinding tool and the workpiece, that is, the grinding tool will not be significantly deformed or displaced when subjected to external force. This loading method is usually used for grinding processes that require high precision and high rigidity, such as precision grinding and ultra-precision grinding. Rigid loading can provide a stable grinding force, which is conducive to ensuring machining accuracy, but it has high rigidity requirements for the grinding tool and workpiece, and is prone to generate large vibrations and noise.

[0049] Semi-rigid loading: refers to the contact force between the grinding tool and the workpiece has a certain elasticity, that is, the grinding tool will deform or displace to a certain extent when subjected to external force. This loading method is usually used for grinding processes that require a certain elasticity, such as flexible grinding, creep feed grinding, etc. Semi-rigid loading can reduce vibration and noise during the grinding process and improve processing quality and efficiency, but the stability of the grinding force is relatively poor.

[0050] Self-centering: refers to the technology that the grinding tool can automatically adjust its position during the grinding process to keep it aligned with the center of the workpiece. This technology can effectively avoid eccentricity during the grinding process and further improve the accuracy and quality of grinding.

[0051] In the manufacture or maintenance of mechanical equipment, before a specific area on the surface of an object is tightly connected or sealed with other objects or components, the sealing surface of the sealed object can usually be ground to ensure the accuracy of the seal, for example, the sealing surface grinding of the valve disc and valve seat of the valve, the sealing surface grinding of the assembly step of the flange, etc.

[0052] At present, the grinding process is mainly divided into manual grinding and automatic grinding (also known as mechanical grinding). With the development of social industrial technology and the needs of special working scenarios (such as grinding in radioactive environments, super-hardened alloy grinding, etc.), automatic grinding has gradually replaced manual grinding in a wider range of fields. However, the automatic grinding method of the related technology usually grinds the grinding tool and the workpiece to be ground in a relatively fixed manner, and most of the automatic grinding processes are concentrated on plane grinding. The development of related grinding processes in other spatial shapes such as conical surfaces and spherical surfaces is still imperfect, and it is impossible to adaptively adjust the grinding force for the size changes of special planes such as conical surfaces and spherical surfaces. Therefore, how to provide a grinding device that can flexibly adjust the grinding force during the grinding process has become a technical problem that needs to be solved urgently.

[0053] Based on this, the embodiments of the present application provide a grinding device and a grinding method, which can flexibly adjust the grinding force during the grinding process to improve the applicability of the grinding device.

[0054] The grinding method provided in the embodiment of the present application can be applied to the terminal, can also be applied to the server side, and can also be software running in the terminal or the server side. In some embodiments, the terminal can be a smart phone, a tablet computer, a laptop computer, a desktop computer, etc.; the server side can be configured as an independent physical server, or a server cluster or distributed system composed of multiple physical servers, and can also be configured as a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (Content Delivery Network, CDN) and big data and artificial intelligence platforms; the software can be an application that implements the grinding method, etc., but is not limited to the above forms.

[0055] The present application can be used in many general or special computer system environments or configurations. For example: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronic devices, network personal computers (Personal Computer, PC), minicomputers, mainframe computers, distributed computing environments including any of the above systems or devices, etc. The present application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. The present application can also be practiced in distributed computing environments, in which tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules can be located in local and remote computer storage media including storage devices.

[0056] See also Figure 1 , Figure 1 1 is a schematic cross-sectional view of a grinding device provided in an embodiment of the present application. The grinding device 100 may specifically include: a bracket 110, a carrier 120, a liquid container 130, a grinding tool 140 and a driving module 150. Figure 1 The specific structure of the grinding device 100 is described in detail.

[0057] A driving module 150 is mounted on the bracket 110;

[0058] The grinding tool 140 is connected to the driving module 150, and the driving module 150 is used to drive the grinding tool 140 to grind the surface to be grinded of the grinding piece 160;

[0059] The carrier 120 is used to place the workpiece 160 to be ground; and

[0060] The liquid container 130 is disposed in the bracket 110 , the carrier 120 is disposed in the liquid container 130 , and a liquid medium 170 for carrying the carrier 120 is disposed in the liquid container 130 ;

[0061] The driving module 150 can drive the carrier 120 to move up and down in the liquid container 130 to adjust the grinding force of the grinding tool 140 on the grinding object 160. The following is a detailed description of each component:

[0062] Specifically, the support 110 refers to a structure that supports or fixes the elements or devices included in the grinding device. The support 110 can be connected to the grinding tool 140 and the driving module 150 to ensure that the grinding tool 140 and the driving module 150 can work normally, and the present application does not specifically limit the structure, material and shape of the support 110.

[0063] The grinding tool 140 is a tool used to grind, polish or file the surface to be ground of the grinding piece 160. The grinding tool 140 generally includes a grinding wheel, a grinding wheel or a grinding belt, and is used for surface processing of workpieces of different shapes and sizes. The grinding tool 140 can be determined according to the geometric shape of the sealing surface of the grinding piece 160. Figure 1 As shown, in one embodiment, the grinding tool 140 may include a conical head. In practical applications, because the grinding tool 140 processes the conical surface in a manner that is usually performed by turning a cylindrical bar, a cylindrical section (such as Figure 1 In order to ensure the strength of the grinding tool 140 for grinding the conical surface, a square is shown in the figure. In addition, the cylinder can also be removed according to actual application requirements, which is not limited here.

[0064] The driving module 150 refers to a structure that provides power and motion control functions for the grinding tool 140. The driving module 150 can provide the grinding tool 140 with a rotation speed and a rotation mode to drive the grinding tool 140 to perform a grinding operation. The driving module 150 of the present application includes a driving motor, which can be used to drive the grinding tool 140 to grind the surface to be ground of the grinding piece 160. Of course, in other embodiments, the driving module 150 may include a cylinder and a transmission assembly, and the cylinder converts the linear motion into rotational motion through the transmission assembly, and the transmission assembly may be a gear rack structure. The driving module 150 can drive the bearing member 120 to move up and down in the liquid container 130, change the influence of the buoyancy on the bearing member 120, and thus better adjust the grinding force of the grinding tool 140 on the grinding piece 160.

[0065] The carrier 120 refers to a structure for placing the workpiece 160 to be ground. Different from the grinding process used in the related art (such as manual, lever or spring loading), the present application adopts a buoyancy loading method, and since mechanical parts are usually made of metal materials, which are dense and difficult to float in the liquid medium 170, the present application designs a carrier 120 specifically for carrying the workpiece 160 to be ground, so that the workpiece 160 to be ground can float in the liquid medium 170. Among them, the carrier 120 can be made of materials with good buoyancy characteristics and certain mechanical strength, such as polystyrene (foam) and plastic, and the carrier 120 has a regular shape.

[0066] Specifically, the carrier 120 can be a hollow sphere, hemisphere, cube, cylinder or other structure that is symmetrical about the central axis and can carry the workpiece 160 to be ground, and the size requirement of the carrier 120 is to be able to place the workpiece 160 to be ground, which is not specifically limited here. Preferably, the outer surface of the carrier 120 can be spherical or hemispherical, because under this structure, the plane projection of the carrier 120 in the liquid medium 170 is a circle, the force is uniform, and when the carrier 120 is immersed in the liquid medium 170, it will rotate around an axis perpendicular to the liquid surface, which can reduce the grinding resistance, improve the stability of grinding, and effectively improve the anti-interference ability of the grinding device. In addition, because the outer surface of the carrier 120 is a sphere or a hemisphere, when the workpiece 160 to be ground is placed tilted, the position correction can also be automatically performed to improve the anti-interference ability and stability of the grinding device. The specific working principle is as follows:

[0067] First, the carrier 120 is placed in the liquid medium 170, and then the workpiece 160 to be ground is placed on the carrier 120. Since the liquid medium 170 is provided in the liquid container 130, the buoyancy of the workpiece 160 to be ground can be calculated according to the Archimedean principle and the following formula 1:

[0068] F f =ρgV (Formula 1)

[0069] In Formula 1, F f represents the buoyancy of the workpiece 160 to be ground, ρ is the liquid density of the liquid medium 170, g is the gravitational acceleration, and V is the volume of the liquid displaced after the workpiece 160 to be ground is placed in the carrier 120 (that is, the volume of the displaced liquid can be converted into the volume of the liquid immersed in the carrier 120 after the workpiece 160 to be ground is placed in the carrier 120).

[0070] Through force analysis of the workpiece 160 to be ground, it can be seen that the calculation process of the grinding force of the workpiece 160 to be ground is as shown in the following formula 2:

[0071] F=F f -G=ρgV-mg (Formula 2)

[0072] In Formula 2, F represents the grinding force of the workpiece 160 to be ground, and F f represents the buoyancy of the workpiece 160 to be ground, G represents the gravity of the workpiece 160 to be ground, and m represents the mass of the workpiece 160 to be ground. The mass of the supporting member 120 can be ignored due to its special structure. However, if it cannot be ignored, the weight of the supporting member 120 can be further subtracted to improve the accuracy of the grinding force calculation.

[0073] The present application drives the carrier 120 to move up and down in the liquid container 130 through the driving module 150, thereby changing the volume of the displaced liquid medium 170. Since the buoyancy of the workpiece 160 to be ground is positively correlated with the volume of the displaced liquid, the buoyancy of the workpiece 160 to be ground can be changed. Since the grinding force of the workpiece 160 to be ground is equal to the difference between the buoyancy and the gravity, and the gravity of the workpiece 160 to be ground is constant, the grinding force of the workpiece 160 to be ground is changed, thereby achieving flexible adjustment of the grinding force during the grinding process.

[0074] In one embodiment of the present application, when grinding the workpiece 160, the central symmetry axis of the grinding tool 140, the central symmetry axis of the supporting member 120 and the central symmetry axis of the workpiece 160 coincide with each other. Subsequently, when the supporting member 120 with the workpiece 160 placed thereon is placed in the liquid container 130, the buoyancy, grinding force and gravity acting on the workpiece 160 are in the same straight line, thereby achieving a self-centering effect of the grinding tool 140, the supporting member 120 and the workpiece 160.

[0075] It should be noted that a spatial shape sealing surface refers to a specific area on the surface of an object, which has a complex geometric shape and is used to be tightly connected or sealed with other objects or components, such as the valve flap, valve seat and other sealing surfaces of a valve. Many grinding processes in related technologies usually require relatively complex pre-processes such as centering and alignment before grinding the spatial shape sealing surface, which is time-consuming and labor-intensive, that is, the maintenance work of the operators is more difficult. The present application uses buoyancy loading to achieve quantitative control of grinding force, that is, by placing the carrier 120 with the workpiece 160 to be ground in the liquid container 130, since the liquid container 130 contains liquid, the carrier 120 will fit more closely with the abrasive 140 due to its own buoyancy, and this buoyancy can make the central symmetry axis of the abrasive 140, the central symmetry axis of the carrier 120 and the central symmetry axis of the workpiece 160 to be ground on the same straight line, thereby ensuring that the workpiece 160 to be ground and the carrier 120 float in the liquid medium 170, and are only subjected to vertical forces, and no forces in other directions, thus forming a self-centering effect. In this way, even if lateral forces occur in special occasional situations such as travel vibrations and collisions, the centering effect can be quickly restored due to the spatial geometric structure (conical surface, spherical surface, etc.) and position of the contact between the workpiece 160 to be ground and the abrasive 140.

[0076] Furthermore, in order to always maintain the self-centering effect, the carrier 120 of the present application does not contact the edge of the liquid container 130 containing the liquid medium 170 or any other equipment during the grinding process. As for the liquid medium 170, the present application requires that the selected liquid medium 170 needs to be able to float the carrier 120 with the workpiece 160 to be ground as a whole, so as to adjust the grinding force through buoyancy later.

[0077] It should be noted that, since the workpiece 160 to be ground in the present application is generally a structure symmetrical about the central axis, that is, it can be a structure obtained by rotating one circle about the central axis of symmetry, such as Figure 1 As shown, the workpiece 160 to be ground is a valve flap structure with a central axis symmetry. Because when the workpiece 160 to be ground is ground, the central axis of the mold, the central axis of symmetry of the carrier 120 and the central axis of symmetry of the workpiece 160 to be ground coincide with each other, so at this time the workpiece 160 to be ground is only subjected to a downward gravity and an upward buoyancy. Therefore, the force analysis of the workpiece 160 to be ground shows that the calculation process of the grinding force of the workpiece 160 to be ground is as shown in the above formula 2. In addition, the carrier 120 designed in the present application can place the workpiece 160 to be ground therein.

[0078] In one embodiment of the present application, the liquid container 130 may be a rectangular parallelepiped, a vertical cylinder, etc. of a regular shape, so as to facilitate determination of the cross-sectional area of ​​the liquid container 130, and thus facilitate calculation of the change in the liquid level height. Moreover, since the maximum cross-section of the liquid container 130 is larger than the maximum cross-section of the carrier 120, the carrier 120 may be placed better. In addition, the liquid container 130 may also be an irregularly shaped structure, that is, the current change in the liquid level height may be calculated through experimental data, which is not limited here.

[0079] It should be noted that the present application can change the liquid density of the liquid medium 170 by replacing the liquid medium 170, thereby changing the buoyancy, that is, the liquid medium 170 can be adjusted according to actual needs, which is not limited here. However, in order to ensure the high efficiency of grinding adjustment, the liquid medium 170 is usually not replaced during one grinding.

[0080] In one embodiment of the present application, the outer surface of the carrier 120 may be spherical or hemispherical. Since there may be a slight change in relative position each time the workpiece 160 to be ground is placed in the carrier 120, the carrier 120 of the present application may set the inner and outer structures to be the same structure, and the inner and outer structures may be equidistant, thereby avoiding the influence of the change in the relative position of the workpiece 160 to be ground and the carrier 120 on the self-centering effect. In addition, because the carrier 120 is a structure symmetrical about the central axis, it can avoid other eccentricity or component forces caused by irregular structure, thereby ensuring the self-centering effect of the grinding device.

[0081] For example, the carrier 120 can be a hemispherical shape with equal wall thickness (i.e., the inner structural surface supporting the workpiece 160 to be ground and the outer structural surface contacting the liquid medium 170 are both hemispherical and the two structural surfaces are equidistant), or, the carrier 120 can be a spherical shape with equal wall thickness (i.e., the carrier 120 includes an opening for placing the workpiece 160 to be ground and the grinding tool 140, and after the workpiece 160 to be ground and the grinding tool 140 are placed, the opening is closed for grinding), and no specific limitation is made here.

[0082] It should be noted that the workpiece 160 can abut against the inner wall of the carrier 120 to fix the workpiece 160. Since the carrier 120 is usually made of a material with a relatively rough surface, a large friction force will be generated between the workpiece 160 and the carrier 120 after the workpiece 160 abuts against the inner wall of the carrier 120, thereby preventing the unstable shaking of the workpiece 160 from affecting the grinding effect during the grinding process of the grinding tool 140.

[0083] It should be noted that if the size or weight of the workpiece 160 to be ground is too small, the friction between the workpiece 160 to be ground and the carrier 120 will be reduced, affecting the grinding effect. At this time, you can choose to add a counterweight to the workpiece 160 to be ground, or make a size-matching mounting groove on the carrier 120 to increase the friction between the workpiece 160 to be ground and the carrier 120. Among them, the principle of placing the counterweight is to increase the weight of the workpiece 160 to be ground, and the specific placement position can be determined according to the form of the counterweight. For example, if an annular counterweight block is used to increase the counterweight, the set annular counterweight block can be placed on the upper part of the workpiece 160 to be ground (and be careful not to block the surface to be ground); if it is a three-claw chuck type counterweight, the workpiece 160 to be ground can be clamped from the lower part of the workpiece 160 to be ground and then placed in the carrier 120 as a whole. It should be noted that the added counterweight can be centrally symmetrical, so that when the workpiece 160 to be ground is ground, the central symmetry axis of the counterweight in the gravity direction can be made to coincide with the central symmetry axis of the workpiece 160 to be ground. In addition, the size-matching installation groove can also be used to place the workpiece 160 to be ground. For example, a installation groove can be dug out on the carrier 120 according to the size of the workpiece 160 to be ground, and then the workpiece 160 to be ground can be placed in the slot to increase the contact area between the carrier 120 and the workpiece 160 to be ground, and achieve interference fit. In this way, the workpiece 160 to be ground and the carrier 120 can be more closely fitted, thereby avoiding relative movement between the carrier 120 and the workpiece 160 to be ground, and improving the stability of grinding.

[0084] It should be noted that, when the present application implements grinding, the friction between the workpiece 160 to be ground and the carrier 120 is greater than the friction between the carrier 120 and the liquid medium 170 , and is also greater than the friction between the grinding tool 140 and the workpiece 160 to be ground.

[0085] In some embodiments, when the surface to be ground of the workpiece 160 to be ground is a conical surface or a spherical surface, the grinding head of the grinding tool 140 is adapted to the surface to be ground of the workpiece 160 to be ground. It should be noted that the meaning of adaptation is that when the surface to be ground is a conical surface, the longitudinal section shape of the grinding head of the grinding tool 140 is conical, and when the surface to be ground is a spherical surface, the longitudinal section shape of the grinding head of the grinding tool 140 is arc-shaped, wherein the longitudinal section is a section along the length direction of the rod of the grinding tool 140. It can be seen from this that the present application can flexibly adjust the longitudinal section shape of the grinding head of the grinding tool 140 according to the geometric shape of the surface to be ground of the workpiece 160 to be ground, so as to achieve grinding of special planes such as conical surfaces and spherical surfaces.

[0086] In some embodiments, the driving module 150 of the present application further includes a lifting motor, which is connected to the grinding tool 140. The lifting motor is a motor device for controlling the lifting of the grinding tool 140, and the lifting motor can control the grinding tool 140 to move up and down according to the received signal, thereby adjusting the grinding force of the grinding tool 140 on the grinding piece 160.

[0087] In some embodiments, Figure 1 As shown, the grinding device of the present application also includes:

[0088] The liquid level detection component is used to detect the change of the liquid level in the liquid container 130 and output a control signal.

[0089] It should be noted that the liquid level detection component refers to a device for detecting the liquid level height of the liquid medium 170 in the liquid container 130. In other words, the present application can detect the change of the grinding force applied to the workpiece 160 in real time according to the liquid level detection component, so as to realize the real-time detection of the grinding force during the grinding process.

[0090] It should be noted that grinding force plays a vital role in grinding quality assurance and grinding process quantification, but the related technology cannot accurately and in real time detect the change of grinding force (also called grinding load) during the grinding process. The present application sets the carrier 120 in the liquid container 130, grinds the grinding piece 160 by buoyancy loading, and can detect the change of grinding force in real time according to the liquid level change data, flexibly adjust the grinding force of the grinding tool 140 on the grinding piece 160, and can accurately and in real time detect the grinding force. In addition, since the related technology usually adopts a rigid or semi-rigid grinding force loading method, it is easy to have insufficient anti-interference ability and stability during the grinding process. The present application is based on a buoyancy loading type grinding device, which can realize self-centering grinding of the size changes of special planes such as conical surfaces and spherical surfaces, improve the anti-interference ability and stability of the grinding process, and can flexibly adjust the grinding force during the grinding process, thereby improving the applicability of the grinding device.

[0091] See also Figure 2 , Figure 2 1 is a partial cross-sectional structural diagram of a grinding device provided in an embodiment of the present application. The carrier 120 of the present application may be marked with scales, and different scales correspond to different grinding forces.

[0092] It should be noted that the liquid level detection function of the liquid level detection component can also be realized by the carrier 120, that is, the liquid level detection component can determine the liquid level change data by the operator visually observing the liquid level scale, so that the driving module 150 can adjust the grinding force of the abrasive 140 on the workpiece to be ground 160 according to the liquid level change data. Since the liquid level scale (i.e., contour scale) can be drawn on the carrier 120, and different liquid level scales can correspond to different grinding forces, at this time, the grinding force corresponding to the current workpiece to be ground 160 can be directly and quickly determined according to the liquid level scale immersed in the liquid. The present application determines the change in volume when the carrier 120 is immersed in the liquid by the liquid level scale. Although the determination speed is fast, in order to meet the needs of visual observation, there will be a certain line width between the drawn liquid level scales, so in actual applications, the contour lines cannot be drawn very densely, so the liquid level information it provides is stepped.

[0093] In the above embodiment, the present application can obtain the liquid level change data by visually observing the scale on the carrier 120, or can obtain the liquid level change data by automatic detection by the liquid level sensor 180, so as to control the drive module 150 to adjust the grinding force of the grinding tool 140 on the grinding object 160 according to the liquid level change data.

[0094] It should be noted that no matter which method is used to achieve liquid level detection, the corresponding relationship between the volume of displaced liquid, liquid level change and grinding force can be obtained through theoretical calculation or experimental method.

[0095] In some embodiments, see Figure 3 , Figure 3 is another cross-sectional structural schematic diagram of the grinding device provided in the embodiment of the present application. Figure 1 and Figure 3 As shown, the liquid level detection component of the present application may specifically include:

[0096] A liquid level sensor 180 is mounted on the bracket 110 and extends into the liquid container 130 to detect changes in the liquid level; and

[0097] The controller 190 is in communication connection with the liquid level sensor 180 and is used to calculate the magnitude of the grinding force according to the liquid level change data of the liquid level sensor 180 and output a control signal.

[0098] It should be noted that the drive module 150 is connected to the controller 190 in communication, and can drive the carrier 120 to move according to the control signal. The drive module 150 can be a servo motor, and the controller 190 can receive signals from devices such as terminals or servers set externally as in the present application, so as to accurately set the control parameters of the servo motor, thereby realizing the accurate grinding of the grinding tool 140 on the grinding piece 160. Among them, the servo motor is a motor that can accurately control the position, speed and acceleration. The servo motor has the characteristics of high precision, high speed, high responsiveness and high stability, and can maintain a stable position and speed in high-speed motion, and realize accurate position and speed control. The servo motor also has the advantages of small size, light weight, high efficiency and long life. In addition, the drive module 150 of the present application can also be an AC asynchronous motor, a permanent magnet synchronous motor, etc., which are not limited here.

[0099] Among them, the liquid level sensor 180 can be a non-contact liquid level sensor (such as a laser liquid level sensor, an ultrasonic liquid level sensor, etc.), and the non-contact liquid level sensor uses optical principles or ultrasonic reflection principles to measure the liquid height without directly contacting the liquid medium 170. The liquid sensor can also be other contact sensors, which are not limited here. In this way, after determining the current liquid level change height, the liquid level change height can be multiplied by the horizontal cross-sectional area of ​​the liquid container 130 to obtain the volume of the displaced liquid. The detection accuracy of this method is relatively high, and is only limited by the detection accuracy of the liquid level sensor 180, so it can better achieve an accuracy of 0.01 mm. In addition, using the liquid level sensor 180 for liquid level detection can obtain liquid level information in the form of continuous information.

[0100] In the above embodiment, the present application uses buoyancy loading and utilizes a liquid level detection component to detect the liquid medium 170, so as to quickly determine the current grinding force of the workpiece 160 to be ground, thereby achieving flexible adjustment of the grinding force.

[0101] It should be noted that the controller 190 of the present application can determine the first grinding force of the grinding tool 140 on the workpiece 160 to be ground based on the detected liquid level change data, and adjust the grinding force of the grinding tool 140 on the workpiece 160 to be ground based on the comparison result between the first grinding force and the preset grinding force.

[0102] The liquid level change data refers to the difference between the liquid level height when the workpiece 160 to be ground is placed in the carrier 120 and the liquid level height when the workpiece 160 to be ground is not placed in the carrier 120. The controller 190 can determine the volume of liquid displaced by the abrasive tool 140 when the workpiece 160 to be ground is placed according to the detected liquid level change data and the cross-sectional area corresponding to the carrier 120, and determine the first grinding force of the abrasive tool 140 on the workpiece 160 to be ground according to the above formulas 1 and 2. The preset grinding force refers to the magnitude of the grinding force required for the current grinding of the workpiece 160 to be ground. Further, the controller 190 can adjust the grinding force of the abrasive tool 140 on the workpiece 160 to be ground according to the comparison result of the first grinding force and the preset grinding force. For example, if the first grinding force is less than the preset grinding force, the grinding force of the abrasive tool 140 on the workpiece 160 to be ground can be adjusted to increase; if the first grinding force is less than the preset grinding force, the grinding force of the abrasive tool 140 on the workpiece 160 to be ground can be adjusted to decrease.

[0103] In some embodiments, the present application can change the size of the carrier 120 so that the volume of the carrier 120 immersed in the liquid changes, thereby adjusting the grinding force of the abrasive tool 140 on the workpiece 160 to be ground. This is because the height of the abrasive tool 140 is fixed, and the abrasive tool 140 and the workpiece 160 to be ground are in contact with each other during the grinding process. At this time, if the carrier 120 is reduced in size, the volume of the liquid displaced is reduced, the buoyancy is reduced, and the grinding force of the abrasive tool 140 on the workpiece 160 to be ground will be reduced.

[0104] In other embodiments, the present application can adjust the grinding force of the abrasive tool 140 on the object to be ground 160 by changing the density of the liquid medium 170. For example, by increasing the density of the liquid medium 170, the buoyancy increases, and the contact between the abrasive tool 140 and the object to be ground 160 becomes tighter, that is, the grinding force of the abrasive tool 140 on the object to be ground 160 increases.

[0105] In some embodiments, the grinding device provided by the present application further includes: an image acquisition component, which is used to obtain the liquid level scale of the carrier 120 currently immersed in the liquid medium 170 in real time when the liquid level detection component is implemented by the carrier 120. Among them, the image acquisition component can be an underwater camera. For example, in the case of a large water depth or a relatively turbid water body, an underwater camera can be used to observe the scale line. The underwater camera can transmit the underwater image to the controller 190 on the water surface, and the controller 190 can analyze the image to accurately obtain the position of the current liquid level scale, thereby determining the current liquid level change data. For another example, the image acquisition component can also be a laser rangefinder, which can emit a laser beam and measure the time and speed of the laser propagation underwater to determine the position of the underwater object, that is, the present application can adjust the angle of the laser so that the emitted laser can be irradiated on the liquid level scale on the surface of the carrier 120, and then the accurate liquid level scale can be obtained by reading the data on the laser rangefinder, thereby determining the current liquid level change data.

[0106] It should be noted that the liquid level change data of the present application can provide operators with quantitative process parameters to facilitate the control of grinding quality, and can also provide data support and feedback signals for the expansion of automation functions.

[0107] In some embodiments, the present application also has a large space for expanding automation functions, that is, the grinding force determined based on the collected liquid level change data can be combined with the added functional components to realize real-time automatic adjustment of the grinding force. Among them, the functional component can be a lifting motor, so that the volume of the carrier 120 immersed in the liquid can be changed by adjusting the height of the grinding tool 140, thereby adjusting the grinding force of the grinding tool 140 on the grinding piece 160. Specifically, the controller 190 can also send a lifting adjustment signal to the driving module 150 according to the comparison result of the first grinding force and the preset grinding force, and the driving module 150 can adjust the lifting of the grinding tool 140 according to the lifting adjustment signal to adjust the grinding force of the grinding tool 140 on the grinding piece 160. For example, if the first grinding force is less than the preset grinding force, the controller 190 sends a lifting adjustment signal to the lifting motor to adjust the grinding tool 140 to descend, so as to adjust the grinding tool 140 to descend in the direction of the workpiece 160 to be ground, so that the volume of the supporting member 120 immersed in the liquid changes, thereby increasing the degree of grinding between the grinding tool 140 and the workpiece 160 to be ground during the grinding process, that is, increasing the grinding force of the grinding tool 140 on the workpiece 160 to be ground.

[0108] In some embodiments, Figure 3 As shown, the grinding device also includes:

[0109] A water inlet control valve 191 is in communication with the controller 190 , and the water inlet control valve 191 is used to control the flow rate of the liquid medium 170 injected into the liquid container 130 ; and

[0110] The drainage control valve 192 is in communication with the controller 190 , and is used to control the flow rate of the liquid medium 170 discharged from the liquid container 130 .

[0111] It should be noted that the functional components of the present application can also be a water inlet control valve 191 and a water discharge control valve 192. In this way, the controller 190 is also used to control the valve states of the water inlet control valve 191 and the water discharge control valve 192 according to the comparison result between the first grinding force and the preset grinding force, and adjust the total capacity of the liquid medium 170 in the liquid container 130 according to the valve state to adjust the grinding force of the grinding tool 140 on the workpiece 160 to be ground. It is understandable that the valve state can represent the valve opening degree of the water inlet control valve 191 and the water discharge control valve 192. For example, the valve state of the water inlet control valve 191 indicates that the valve is fully open, and the valve state of the water discharge control valve indicates that the valve is closed. At this time, the volume of the liquid medium 170 injected into the liquid container 130 increases rapidly, and because the height of the mold 140 is fixed, that is, the mold 140 will block the carrier 120 from floating up, increasing the volume of the liquid displaced by the carrier 120, thereby increasing the degree of grinding of the mold 140 and the workpiece 160 to be ground during the grinding process, that is, increasing the grinding force of the mold 140 on the workpiece 160. Therefore, the present application can adjust the total amount of liquid contained in the liquid container 130 by controlling the valve switch state of the water inlet control valve 191 and the water discharge control valve 192, that is, controlling the volume difference of the liquid medium 170 injected into and discharged from the liquid container 130, so as to achieve real-time automatic adjustment of the grinding force of the mold 140.

[0112] It should be noted that the present application may also set corresponding functional components according to other methods of adjusting the grinding force, which will not be described in detail here.

[0113] The grinding device provided by the present application provides a grinding process that can be applied to sealing surfaces of spatial geometric shapes such as conical surfaces and spherical surfaces, and can meet the needs of grinding scenarios that cannot be met by related technologies. Through the combination of the carrier 120, the liquid container 130, the liquid medium 170 and the grinding tool 140, the grinding force can be provided to the workpiece 160 to be ground by buoyancy loading, so as to accurately set the grinding force according to the grinding requirements, thereby improving the anti-interference ability and stability during the grinding process. Because the spatial axisymmetric geometry of the workpiece 160 to be ground and the carrier 120 can achieve the self-centering effect of the grinding tool 140 and the workpiece 160 to be ground, avoiding the complex pre-processes such as centering and alignment in related technologies. The grinding process is simple and does not require high maintenance skills and maintenance experience of the operator. In addition, the present application detects the change of the liquid level through the liquid level detection component, which can realize the real-time detection of the grinding force during the grinding process.

[0114] In some embodiments, see Figure 4 , Figure 4 1 is a flow chart of a grinding method provided in an embodiment of the present application. The grinding method may include but is not limited to steps S410 to S430. Figure 4 These three steps are introduced in detail.

[0115] Step S410, installing the workpiece 160 to be polished in the carrier 120;

[0116] Step S420, using the driving module 150 to drive the carrier 120 to move to a preset position in the liquid container 130;

[0117] In step S430 , the driving module 150 drives the grinding tool 140 to grind the surface to be ground of the grinding object 160 .

[0118] In some embodiments, in step S410 to step S430, Figure 3 According to the grinding device of the above embodiment, after starting the driving module 150, the driving module 150 drives the carrier 120 to move to a preset position in the liquid container 130, and drives the grinding tool 140 to grind the surface to be ground of the grinding piece 160. At the same time, the liquid level detection component can detect the liquid level of the liquid medium 170 to obtain liquid level change data. And send the liquid level change data to the controller 190. Further, the controller 190 can calculate the magnitude of the grinding force according to the liquid level change data, and output a control signal to the driving module 150, so that the driving module 150 can drive the carrier 120 to move according to the grinding force in the received control signal, so as to adjust the grinding force of the grinding tool 140 on the grinding piece 160.

[0119] It should be noted that, before the present application grinds the surface to be grinded of the workpiece 160, the driving module 150 can be used to drive the carrier 120 to move to a preset position in the liquid container 130 to adjust the grinding force of the grinding tool 140 on the workpiece 160. This preset position indicates that the grinding force of the grinding tool 140 on the workpiece 160 can be the required grinding force. The manner in which the carrier 120 moves to the preset position in the liquid container 130 may include increasing or decreasing the capacity of the liquid medium 170 that carries the carrier 120 in the liquid container 130, thereby driving the carrier 120 to move to the preset position in the liquid container 130; or, the driving module 150 drives the abrasive tool 140 to move away from or close to the workpiece 160 to be ground, that is, adjusting the height of the abrasive tool 140 to drive the carrier 120 to move to the preset position in the liquid container 130; or, changing the size of the carrier 120 so that the volume of the carrier 120 immersed in the liquid changes, thereby driving the carrier 120 to move to the preset position in the liquid container 130; or, changing the density of the liquid medium 170, that is, different densities of the liquid medium 170 have different buoyancy on the carrier 120 and the workpiece 160 to be ground, so that the volume of the carrier 120 immersed in the liquid changes, thereby driving the carrier 120 to move to the preset position in the liquid container 130, which is not specifically limited here.

[0120] It should be noted that when the driving module 150 of the present application drives the grinding tool 140 to rotate, the carrier 120 and the workpiece to be ground 160 will rotate accordingly, but due to the gravity of the carrier 120 and the workpiece to be ground 160 themselves, their rotation is not synchronized with the rotation of the grinding tool 140. In this way, the present application can usually adopt a forward and reverse alternating method to generate relative motion between the workpiece to be ground 160 and the grinding tool 140, thereby achieving grinding of the workpiece to be ground 160. Among them, because the friction between the workpiece to be ground 160 (such as a metal valve flap) and the carrier 120 (such as foam) is very large, there is no relative motion (or a small relative motion, but it is negligible) between the carrier 120 and the workpiece to be ground 160.

[0121] It is understandable that, because during the grinding process, the workpiece 160 to be ground will rotate along with the rotation of the abrasive tool 140, and because the friction between the bearing member 120 and the workpiece 160 to be ground is very large, the bearing member 120 will also move along with the rotation of the abrasive tool 140 (because there is nothing to prevent the rotation of the bearing member 120). However, since the buoyancy loading mode adopted in the present application is not fixed, the conventional unidirectional rotation mode will cause the workpiece 160 to be ground (including the bearing member 120) to rotate along with the abrasive tool 140, which will produce a large inertia and eccentric force, thereby making it impossible to grind. Therefore, there needs to be friction between the abrasive tool 140 and the workpiece 160 to be ground in order to produce relative motion, thereby achieving the grinding of the workpiece 160 to be ground. Based on this, the present application can achieve grinding by adopting a reciprocating rotation method of the abrasive tool 140 in a forward and reverse rotation, that is, when the abrasive tool 140 is reversed, the bearing member 120 has inertia and will maintain the previous motion, so that the relative motion between the abrasive tool 140 and the workpiece 160 to be ground is generated. In this way, the alternating forward and reverse grinding of the grinding tool 140 will cause an angle difference between the forward rotation and the reverse rotation of the workpiece 160 to be ground (including the carrier 120). For example, the forward and reverse reciprocating rotation method of the grinding tool 140 can be: the grinding tool 140 first rotates forward (i.e., rotates clockwise) 60 degrees (60°), and then reverses (i.e., rotates counterclockwise) by 30°, and repeats the above two rotation operations to achieve the forward and reverse reciprocating alternation. In this way, the workpiece 160 to be ground (including the carrier 120) and the grinding tool 140 can maintain relative motion, and the grinding tool 140 can achieve relative clockwise rotation by alternating forward rotation of a large degree and reverse rotation of a small degree. After a period of time, the workpiece 160 to be ground (including the carrier 120) can rotate one circle, and so on. For another example, the forward and reverse reciprocating rotation method of the grinding tool 140 can also be: the grinding tool 140 first reverses 60°, and then rotates forward 30°, and repeats the above two rotation operations to achieve the forward and reverse reciprocating alternation. In this way, the mold 140 can achieve relative counterclockwise rotation by alternating between reverse rotation by a large degree and forward rotation by a small degree. In addition, the forward and reverse reciprocating rotation method of the mold 140 can also be: the mold 140 first rotates forward two circles (i.e., 720°) and then reverses one circle (i.e., 360°) repeatedly. The present application does not limit the specific rotation method and rotation degree of the forward and reverse reciprocating rotation method of the mold 140.

[0122] In some embodiments, the step of the driving module 150 driving the grinding tool 140 to grind the surface to be ground of the grinding member 160 may specifically include:

[0123] The driving module 150 drives the grinding tool 140 to rotate around the first rotation direction by a first rotation angle, and drives the grinding tool 140 to grind the workpiece 160 in a forward direction;

[0124] The driving module 150 drives the grinding tool 140 to rotate around the second rotation direction by a second rotation angle, and drives the grinding tool 140 to reversely grind the workpiece 160 to be grinded;

[0125] The first rotation direction and the second rotation direction are opposite directions, and the first rotation angle is smaller than the second rotation angle.

[0126] In the above embodiment, the controller 190 can determine the first grinding force of the grinding tool 140 on the workpiece 160 to be ground according to the liquid level change data, and the calculation process of the first grinding force has been described in detail in the above embodiment, and will not be repeated. Further, the controller 190 can adjust the grinding force of the grinding tool 140 on the workpiece 160 to be ground according to the comparison result of the first grinding force and the preset grinding force. Further, after determining the grinding force on the workpiece 160 to be ground, the driving module 150 can drive the grinding tool 140 to rotate around the first rotation direction by the first rotation angle, and drive the grinding tool 140 to grind the workpiece 160 in the forward direction. After the first time interval, the driving module 150 drives the grinding tool 140 to rotate around the second rotation direction by the second rotation angle, and drives the grinding tool 140 to grind the workpiece 160 in the reverse direction. After the second time interval, the driving module 150 repeats the above steps, that is, drives the grinding tool 140 to rotate around the first rotation direction by the first rotation angle again, and drives the grinding tool 140 to grind the workpiece 160 in the forward direction. The first time interval may be calculated from the rotation speed of the mold 140 and the first rotation angle, and the second time interval may be calculated from the rotation speed of the mold 140 and the second rotation angle.

[0127] It should be noted that the first rotation direction and the second rotation direction are opposite directions, and forward grinding and reverse grinding are relative concepts, that is, driving the grinding tool 140 forward and reverse is also relative, which only means that the two rotation modes are in different directions, and is not a specific limitation on the direction, and the forward direction indicates the direction in which the grinding tool 140 rotates as a whole after the forward and reverse rotation angles are offset. The first rotation direction can be clockwise or counterclockwise, and the second rotation direction can also be clockwise or counterclockwise, and the first rotation direction and the second rotation direction are opposite to each other, so as to realize the forward and reverse alternating rotation mode in the above embodiment.

[0128] It should be noted that the first rotation angle is smaller than the second rotation angle, so that in the process of realizing the alternating rotation of forward and reverse rotation, the grinding tool 140 will rotate and move in the first rotation direction as a whole after the angles of the forward and reverse rotations are offset, so as to grind the surface to be ground of the grinding piece 160 to be ground by the relative position change. For example, the first rotation direction is forward, the second rotation direction is reverse, the first rotation angle is 60°, and the second rotation angle is 30°. In this way, the grinding tool 140 can first rotate forward 60° and then reverse 30°, and repeat the above two rotation operations to realize the alternating forward and reverse rotation. In this way, the grinding tool 140 can realize the overall forward rotation by alternating a large degree of forward rotation and a small degree of reverse rotation.

[0129] The grinding method provided in the embodiment of the present application can realize the contact between the grinding tool 140 and the workpiece to be ground 160 placed in the carrier 120 by means of buoyancy loading, and can detect the change of the liquid level in the liquid container 130 through the liquid level sensor 180, so as to realize the real-time detection of the grinding force during the grinding process, and calculate the magnitude of the grinding force according to the liquid level change data of the liquid level sensor 180 through the controller 190, and output the control signal to the driving module 150. Further, the driving module 150 can drive the carrier 120 to move up and down in the liquid container 130 according to the received control signal, thereby changing the volume of the displaced liquid, and since the buoyancy of the workpiece to be ground 160 is positively correlated with the volume of the displaced liquid, the buoyancy of the workpiece to be ground 160 can be changed, and since the grinding force of the workpiece to be ground 160 is equal to the difference between the buoyancy and the gravity, and the gravity of the workpiece to be ground 160 is constant, the grinding force of the workpiece to be ground 160 is changed, thereby realizing the flexible adjustment of the grinding force during the grinding process. In this way, the present application can achieve flexible grinding force output during the grinding process by quantitatively controlling the grinding force. Compared with the grinding device and grinding method adopted in the related technology, the present application can make significant improvements in maintenance quality, maintenance cost, maintenance efficiency and personnel exposure dose, and flexibly adjust the grinding force during the grinding process, thereby improving the applicability of the grinding device.

[0130] The preferred embodiments of the present invention are described with reference to the accompanying drawings, but the scope of the present invention is not limited by the above. Any modification, equivalent substitution and improvement made by a person skilled in the art without departing from the scope and essence of the present invention should be within the scope of the present invention.

Claims

1. A grinding device, characterized in that: include: Bracket; A driving module is installed on the bracket; A grinding tool connected to the driving module, wherein the driving module is used to drive the grinding tool to grind the surface to be ground of the workpiece; A carrier, used for placing the workpiece to be ground; as well as A liquid container is arranged in the bracket, the carrier is arranged in the liquid container, and a liquid medium for carrying the carrier is arranged in the liquid container; The driving module can drive the carrier to move up and down in the liquid container to adjust the grinding force of the grinding tool on the workpiece to be ground.

2. The grinding device according to claim 1, characterized in that: The central symmetry axis of the grinding tool, the central symmetry axis of the carrier and the central symmetry axis of the workpiece to be ground are on the same straight line.

3. The grinding device according to claim 1, characterized in that: The grinding device also includes: A liquid level detection component, used to detect the change of the liquid level in the liquid container and output a control signal; The driving module is in communication with the controller and can drive the bearing to move according to the control signal.

4. The grinding device according to claim 3, characterized in that: The liquid level detection component comprises: a liquid level sensor, mounted on the bracket and extending into the liquid container, for detecting changes in the liquid level; and The controller is connected to the liquid level sensor for calculating the grinding force according to the liquid level change data of the liquid level sensor and outputting the control signal.

5. The grinding device according to claim 4, characterized in that: The grinding device also includes: a water inlet control valve, connected to the controller for communication, the water inlet control valve being used to control the flow rate of the liquid medium injected into the liquid container; and a drainage control valve, connected to the controller for communication, the drainage control valve being used to control the flow rate of the liquid medium discharged from the liquid container; The controller is used to control the valve opening of the water inlet control valve and the water discharge control valve.

6. The grinding device according to any one of claims 1 to 5, characterized in that: The carrier is marked with scales, and different scales correspond to different grinding forces.

7. The grinding device according to any one of claims 1 to 5, characterized in that: The outer surface of the bearing member is spherical or hemispherical.

8. The grinding device according to any one of claims 1 to 5, characterized in that: When the surface to be ground of the workpiece to be ground is a conical surface or a spherical surface, the grinding head of the grinding tool is matched with the surface to be ground of the workpiece to be ground.

9. The grinding device according to any one of claims 1 to 5, characterized in that: The workpiece to be ground can abut against the inner wall of the carrier to fix the workpiece to be ground.

10. A grinding method, characterized in that: Applied to the grinding device according to any one of claims 1 to 9, the method comprises: Install the workpiece to be ground into the carrier; Using a driving module to drive the carrier to move to a preset position in the liquid container; The driving module drives the grinding tool to grind the surface to be ground of the workpiece to be ground.

11. The method according to claim 10, characterized in that The driving module drives the grinding tool to grind the grinding surface of the workpiece to be ground, specifically including: The driving module drives the grinding tool to rotate around a first rotation direction by a first rotation angle, and drives the grinding tool to grind the workpiece in a positive direction; The driving module drives the grinding tool to rotate around a second rotation direction by a second rotation angle, and drives the grinding tool to reversely grind the workpiece to be grinded; The first rotation direction is opposite to the second rotation direction, and the first rotation angle is smaller than the second rotation angle.

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