A bonding device and bonding method for microfluidic chip packaging

Abstract

The present invention relates to the field of chip bonding, and in particular to a bonding device for microfluidic chip packaging and a bonding method thereof. The device comprises a material storage component, a cleaning component is installed on the top of the material storage component, an auxiliary component is installed on the outer wall, two groups of protective components are symmetrically installed on the inner wall of the auxiliary component, and a material taking component is installed on one side wall of the material storage component; the present invention drives the sealing box to be clamped with the bonding table, starts two groups of eighth electric push rods to push two groups of protective suction cups down, respectively abuts on the top surface of a group of microfluidic chips, and condenses through condensation blocks to speed up the bonding progress, starts the third motor to drive the distance sensor to rotate during the rapid prototyping process, and warns through the distance sensor when depression or protrusion occurs during the bonding process of the two groups of microfluidic chips, thereby improving the bonding effect of the device and the quality effect of the microfluidic chip packaging.

Description

Technical Field

[0001] The invention belongs to the technical field of chip bonding, and in particular relates to a bonding device and a bonding method for microfluidic chip packaging. Background Art

[0002] Microfluidic chips, also known as chip laboratories, can integrate multiple functions such as sampling, reaction, separation and detection on one chip.

[0003] After searching, in the prior art, Chinese patent publication number: CN221476202U, authorization publication date: 2024-08-06, discloses a dual-station microfluidic chip bonding device, including a device body, the device body is configured with an operating space, a rotating platform is arranged in the operating space, a first hot plate and a second hot plate are arranged on the rotating platform, and an upper hot plate and a cooling plate are also arranged in the operating space; the above embodiment improves the chip bonding production rhythm and improves the production efficiency.

[0004] But the device still has the following defects:

[0005] When depressions or protrusions occur during the bonding process of a microfluidic chip, a rapid warning cannot be given through the monitoring structure, thereby reducing the bonding effect of the device. Summary of the invention

[0006] In view of the above problems, the present invention provides a bonding device for microfluidic chip packaging, which comprises a material storage component, a cleaning component is installed on the top of the material storage component, an auxiliary component is installed on the outer wall, two groups of protective components are symmetrically installed on the inner wall of the auxiliary component, a material taking component is installed on one side wall of the material storage component, and a bonding component is installed on the side wall away from the material taking component;

[0007] The auxiliary component includes a mounting shell, two groups of condensation blocks are symmetrically mounted on the top of the mounting shell, two groups of eighth electric push rods are symmetrically mounted on the bottom edge of the mounting shell, a group of protective suction cups are mounted on the output end of each group of the eighth electric push rods, and two groups of third motors are symmetrically mounted on the bottom of the mounting shell, and a group of distance sensors are transmission-connected to the output end of each group of the third motors;

[0008] When depression or protrusion occurs during the bonding process of two sets of microfluidic chips, a distance sensor will give an alarm.

[0009] Furthermore, the material storage assembly includes a working base plate, a material discharge box is installed on the top of the working base plate, and a plurality of bonding tables are installed on the top of the working base plate at equal intervals, and each group of bonding tables is symmetrically provided with a plurality of card connection holes.

[0010] Furthermore, the cleaning component includes a first fixed plate, the bottom of which is installed on the top of the working base plate, a first electric push rod is installed on the top of the first fixed plate, a first fixed block is installed on the output end of the first electric push rod, a first electric slide is installed on a side wall of the first fixed block, a second fixed block is transmission-connected to the output end of the first electric slide, and a second electric push rod is installed on a side wall of the second fixed block.

[0011] Furthermore, a second fixed plate is installed on the output end of the second electric push rod, an air pump is installed on one side wall of the second fixed plate, the output end of the air pump is connected to one end of a connecting pipe, the other end of the connecting pipe is connected to an inflatable bag structure, the outer wall of the connecting pipe is connected to a heating box, and the outer wall of the inflatable bag structure is sleeved with adsorption mud.

[0012] Furthermore, the material picking assembly includes a third fixed plate, one end of the third fixed plate is installed on a side wall of the working base plate, a third electric push rod is installed on one side wall of the third fixed plate, a fourth fixed plate is installed on the output end of the third electric push rod, a fifth fixed plate is installed on the top of the fourth fixed plate, and a second electric slide is installed on one side wall of the fifth fixed plate.

[0013] Furthermore, a fourth electric push rod is transmission-connected to the output end of the second electric slide, a first motor is installed on the output end of the fourth electric push rod, a vacuum box is transmission-connected to the output end of the first motor, a vacuum suction cup is connected to the bottom of the vacuum box, and a vacuum pump is installed on the outer wall of the vacuum box.

[0014] Furthermore, the bonding assembly includes a sixth fixed plate, one end of the sixth fixed plate is installed on a side wall of the working base plate, a fifth electric push rod is installed on one side wall of the sixth fixed plate, a seventh fixed plate is installed on the output end of the fifth electric push rod, a third electric slide is installed on one side wall of the seventh fixed plate, a sixth electric push rod is transmission-connected to the output end of the third electric slide, and a bonding structure is installed on the output end of the sixth electric push rod.

[0015] Furthermore, the auxiliary component also includes an eighth fixed plate, one end of the eighth fixed plate is installed on the outer wall of the working base plate, a second motor is installed on the top of the eighth fixed plate, the output end of the second motor is transmission-connected with a ninth fixed plate, a fourth electric slide is installed on one side wall of the ninth fixed plate, the output end of the fourth electric slide is transmission-connected with a seventh electric push rod, a sealing box is installed on the output end of the seventh electric push rod, a plurality of groups of clamping rods are installed at equal intervals on the bottom edge of the sealing box, the clamping rods are movably clamped with the clamping holes, and the mounting shell is installed on the inner wall of the sealing box.

[0016] Furthermore, the protective component includes a socket plate, one end of each group of the socket plates is installed on an inner wall of one side of the sealing box, one end of a group of compression springs is installed on an inner wall of one side of each group of the socket plates, a group of sliding plates is installed on the other end of each group of the compression springs, a connecting plate is installed on one side wall of the sliding plate, two groups of slideways are symmetrically opened on one side wall of the connecting plate, each group of the slideways is slidably connected with a group of sliding blocks, an elastic clamping plate is connected between the two groups of sliding blocks, and a group of protective pads is installed on one side wall of each group of the elastic clamping plates.

[0017] A bonding method for a bonding device for microfluidic chip packaging, the bonding method comprising:

[0018] Place the microfluidic chip into the material storage component for pre-bonding;

[0019] Start the material removal component to move the microfluidic chip to the bonding table;

[0020] Start the bonding component to perform bonding work;

[0021] The eighth electric push rod is started to push the protective suction cup against the surface of the microfluidic chip, and then the condensation block is started to perform condensation;

[0022] The third motor is started to drive the distance sensor to rotate, so as to monitor the bonding of the two sets of microfluidic chips.

[0023] The beneficial effects of the present invention are:

[0024] 1. Drive the sealing box and the bonding table to be connected, start the two sets of eighth electric push rods to push the two sets of protective suction cups down, respectively contact the top surface of a set of microfluidic chips, and condense through the condensation block to speed up the bonding progress. In the process of rapid prototyping, start the third motor to drive the distance sensor to rotate. When the two sets of microfluidic chips are concave or convex during the bonding process, the distance sensor will give an alarm, which improves the bonding effect of the device and the quality effect of the microfluidic chip packaging.

[0025] 2. Start the ninth electric push rod to drive the sliding plate to slide in the socket plate. Start to squeeze the compression spring during the sliding process. When the two sets of protective suction cups are in contact with the surface of the microfluidic chip, the magnetic connection between the first electromagnetic block and the second electromagnetic block is disengaged. When the compression spring senses that the pressure disappears, it starts to rebound. During the rebound process, it drives the two sets of elastic clamping plates to contact the side walls of the microfluidic chip, which performs a passive squeezing operation on the two sets of microfluidic chips, thereby improving the bonding progress between the two sets of microfluidic chips, improving the protection effect and speeding up the work progress.

[0026] 3. Start the second electric push rod to push the inflatable bag structure into the surface opening of the microfluidic chip, and then start the air pump to expand the inflatable bag structure in the opening of the microfluidic chip, thereby driving the adsorption mud glue to absorb impurities in the opening of the microfluidic chip, and then start the first electric slide to drive the adsorption mud glue to move horizontally, and clean several groups of openings of the microfluidic chip in turn, thereby improving the surface cleaning effect of the microfluidic chip and improving the subsequent microfluidic chip bonding precision effect.

[0027] 4. Start the third electric push rod to push the vacuum suction cup to move above the discharge box, then start the second electric slide to drive the vacuum suction cup to move to the top of the discharge box, then start the fourth electric push rod to push the vacuum suction cup to adsorb the microfluidic chip. To improve the limiting effect, start the vacuum pump to evacuate the air in the vacuum box, and then evacuate the air between the microfluidic chip and the vacuum suction cup, thereby improving the convenient limiting effect of the device.

[0028] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 A schematic structural diagram of a bonding device according to an embodiment of the present invention is shown;

[0031] Figure 2 A schematic structural diagram of a material storage assembly according to an embodiment of the present invention is shown;

[0032] Figure 3 A schematic diagram of the structure of a cleaning component according to an embodiment of the present invention is shown;

[0033] Figure 4 It shows a schematic structural diagram of a material taking assembly according to an embodiment of the present invention;

[0034] Figure 5 A schematic diagram of the structure of a bonding assembly according to an embodiment of the present invention is shown;

[0035] Figure 6 A schematic diagram of the structure of an auxiliary component according to an embodiment of the present invention is shown;

[0036] Figure 7 A schematic cross-sectional view of a sealing box according to an embodiment of the present invention is shown;

[0037] Figure 8 A schematic diagram of the structure of a protection component according to an embodiment of the present invention is shown;

[0038] Fig. 9 A schematic cross-sectional view of a socket plate according to an embodiment of the present invention is shown.

[0039] In the figure: 1. material storage assembly; 101. working bottom plate; 102. material discharge box; 103. bonding table; 104. clamping hole; 2. cleaning assembly; 201. first fixed plate; 202. first electric push rod; 203. first fixed block; 204. first electric slide; 205. second fixed block; 206. second electric push rod; 207. second fixed plate; 208. air pump; 209. connecting pipe; 210. heating box ; 211, fixed tube; 212, inflatable bag structure; 213, adsorption mud glue; 3, material taking component; 301, third fixed plate; 302, third electric push rod; 303, fourth fixed plate; 304, fifth fixed plate; 305, second electric slide; 306, fourth electric push rod; 307, first motor; 308, vacuum box; 309, vacuum suction cup; 310, vacuum pump; 4, bonding component; 401, sixth Fixed plate; 402, fifth electric push rod; 403, seventh fixed plate; 404, third electric slide; 405, sixth electric push rod; 406, bonding structure; 5, auxiliary components; 501, eighth fixed plate; 502, second motor; 503, ninth fixed plate; 504, fourth electric slide; 505, seventh electric push rod; 506, sealing box; 507, clamping rod; 508, mounting shell; 509, condensation block; 510, eighth electric push rod; 511, protective suction cup; 512, third motor; 513, distance sensor; 6, protective components; 601, socket plate; 602, compression spring; 603, sliding plate; 604, ninth electric push rod; 605, first electromagnetic block; 606, second electromagnetic block; 607, connecting plate; 608, slideway; 609, sliding block; 610, elastic clamping plate; 611, protective cushion layer. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] The embodiment of the present invention provides a bonding device for microfluidic chip packaging. It includes a storage component 1, exemplarily, such as Figure 1 As shown, a cleaning component 2 is installed on the top of the material storage component 1, and an auxiliary component 5 is installed on the outer wall, two groups of protective components 6 are symmetrically installed on the inner wall of the auxiliary component 5, a material picking component 3 is installed on one side wall of the material storage component 1, and a bonding component 4 is installed on the side wall away from the material picking component 3.

[0042] For example, Figure 2 As shown, the material storage assembly 1 includes a working base plate 101, a material discharge box 102 is installed on the top of the working base plate 101, and a plurality of groups of bonding tables 103 are installed at equal intervals on the top of the working base plate 101, and each group of the bonding tables 103 is symmetrically provided with a plurality of groups of snap-in holes 104.

[0043] For example, Figure 3 As shown, the cleaning assembly 2 includes a first fixed plate 201, the bottom of the first fixed plate 201 is mounted on the top of the working base plate 101, a first electric push rod 202 is mounted on the top of the first fixed plate 201, a first fixed block 203 is mounted on the output end of the first electric push rod 202, a first electric slide 204 is mounted on a side wall of the first fixed block 203, a second fixed block 205 is transmission-connected to the output end of the first electric slide 204, and a first fixed block 206 is mounted on one side wall of the second fixed block 206. Two electric push rods 206, a second fixed plate 207 is installed on the output end of the second electric push rod 206, an air pump 208 is installed on one side wall of the second fixed plate 207, the output end of the air pump 208 is connected to one end of a connecting pipe 209, the other end of the connecting pipe 209 is connected to an inflatable bag structure 212, the outer wall of the connecting pipe 209 is connected to a heating box 210, a fixed pipe 211 is installed on the inner wall of the inflatable bag structure 212, and the outer wall of the inflatable bag structure 212 is sleeved with adsorption mud glue 213.

[0044] Start the fourth electric push rod 306 to drive the microfluidic chip out of the discharge box 102, then start the first electric push rod 202 to drive the inflatable bag structure 212 to move to the same height as the microfluidic chip, then start the second electric push rod 206 to push the inflatable bag structure 212 into the surface opening of the microfluidic chip, then start the air pump 208 to supply air to the connecting pipe 209, thereby causing the inflatable bag structure 212 to expand in the microfluidic chip opening, thereby driving the adsorption mud glue 213 to adhere to the inner wall of the microfluidic chip opening to absorb impurities in the opening, then start the first electric slide 204 to drive the adsorption mud glue 213 to translate, and clean several groups of openings of the microfluidic chip in turn, and subsequently start the first motor 307 to drive the microfluidic chip to rotate and clean, thereby improving the surface cleaning effect of the microfluidic chip and improving the subsequent precision effect of microfluidic chip bonding.

[0045] For example, Figure 4 As shown, the material picking component 3 includes a third fixed plate 301, one end of the third fixed plate 301 is installed on a side wall of the working base plate 101, a third electric push rod 302 is installed on one side wall of the third fixed plate 301, a fourth fixed plate 303 is installed on the output end of the third electric push rod 302, a fifth fixed plate 304 is installed on the top of the fourth fixed plate 303, a second electric slide 305 is installed on one side wall of the fifth fixed plate 304, a fourth electric push rod 306 is transmission-connected to the output end of the second electric slide 305, a first motor 307 is installed on the output end of the fourth electric push rod 306, a vacuum box 308 is transmission-connected to the output end of the first motor 307, a vacuum suction cup 309 is connected to the bottom of the vacuum box 308, and a vacuum pump 310 is installed on the outer wall of the vacuum box 308.

[0046] The microfluidic chip that needs to be packaged and bonded is placed in the discharge box 102, and then the pre-bonding work is started. The third electric push rod 302 is started to push the vacuum suction cup 309 to move above the discharge box 102, and then the second electric slide 305 is started to drive the vacuum suction cup 309 to move to the top of the discharge box 102, and then the fourth electric push rod 306 is started to push the vacuum suction cup 309 to adsorb the microfluidic chip. In order to improve the limiting effect, the vacuum pump 310 is started to evacuate the air in the vacuum box 308, and then the air between the microfluidic chip and the vacuum suction cup 309 is evacuated, thereby improving the convenient limiting effect of the device.

[0047] For example, Figure 5As shown, the bonding assembly 4 includes a sixth fixed plate 401, one end of the sixth fixed plate 401 is installed on a side wall of the working base plate 101, a fifth electric push rod 402 is installed on one side wall of the sixth fixed plate 401, a seventh fixed plate 403 is installed on the output end of the fifth electric push rod 402, a third electric slide 404 is installed on one side wall of the seventh fixed plate 403, a sixth electric push rod 405 is transmission-connected to the output end of the third electric slide 404, and a bonding structure 406 is installed on the output end of the sixth electric push rod 405.

[0048] After the surface of the microfluidic chip is cleaned, the third electric push rod 302 is started to cooperate with the second electric slide 305 to move to the top of one group of bonding tables 103, and then the fourth electric push rod 306 is started to place it on the bonding table 103. Then, the material picking component 3 is started to take another group of microfluidic chips, perform the same preparation work, and place it on one end of the microfluidic chip on the bonding table 103 to start the bonding work.

[0049] The fifth electric push rod 402 is started to push the bonding structure 406 to move above the two groups of microfluidic chips, and then the third electric slide 404 is started to adjust the position so that the output end of the bonding structure 406 is located directly above the two groups of microfluidic chips, and then the sixth electric push rod 405 is started to push the bonding structure 406 down to perform bonding.

[0050] For example, Figure 6 and Figure 7 As shown, the auxiliary component 5 includes an eighth fixed plate 501, one end of the eighth fixed plate 501 is mounted on the outer wall of the working base plate 101, a second motor 502 is mounted on the top of the eighth fixed plate 501, the output end of the second motor 502 is connected to the ninth fixed plate 503 in a transmission manner, a fourth electric slide 504 is mounted on one side wall of the ninth fixed plate 503, the output end of the fourth electric slide 504 is connected to the seventh electric push rod 505 in a transmission manner, a sealing box 506 is mounted on the output end of the seventh electric push rod 505, and the sealing box 506 has equal spacing at the bottom edge. A plurality of groups of clamping rods 507 are installed, and the clamping rods 507 are movably clamped with the clamping holes 104. A mounting shell 508 is installed on the inner wall of the sealing box 506. Two groups of condensation blocks 509 are symmetrically installed on the top of the mounting shell 508. Two groups of eighth electric push rods 510 are symmetrically installed on the bottom edge of the mounting shell 508. A group of protective suction cups 511 are installed on the output end of each group of the eighth electric push rods 510. Two groups of third motors 512 are symmetrically installed on the bottom of the mounting shell 508. A group of distance sensors 513 are transmission-connected to the output end of each group of the third motors 512.

[0051] After the bonding work is completed, the two groups of microfluidic chips are in a high temperature state and are inconvenient to move. The second motor 502 is started to drive the sealing box 506 to rotate to the top of the bonding table 103, and then the seventh electric push rod 505 is started to drive the sealing box 506 to descend, so that the clamping rod 507 is clamped with the clamping hole 104, and then the two groups of eighth electric push rods 510 are started to push the two groups of protective suction cups 511 to descend, respectively contacting the top surface of a group of microfluidic chips, and then condensing through the condensation block 509 to speed up the bonding progress, and in the process of rapid prototyping, the third motor 512 is started to drive the distance sensor 513 to rotate. When depression or protrusion occurs during the bonding process of the two groups of microfluidic chips, an alarm is given through the distance sensor 513, which improves the bonding effect of the device while improving the quality effect of the microfluidic chip packaging.

[0052] For example, Figure 8 and Fig. 9 As shown, the protection component 6 includes a socket plate 601, one end of each group of the socket plates 601 is installed on the inner wall of one side of the sealing box 506, one end of a group of compression springs 602 is installed on the inner wall of one side of each group of the socket plates 601, and a group of sliding plates 603 is installed on the other end of each group of compression springs 602. Each group of sliding plates 603 is slidably connected in the socket plate 601, and a group of ninth electric push rods 604 are installed on the top of each group of the socket plates 601, and a group of ninth electric push rods 604 are installed on the output end of each group of the ninth electric push rods 604. An electromagnetic block 605, a second electromagnetic block 606 is installed on the top of each group of sliding plates 603, the first electromagnetic block 605 is magnetically connected to the second electromagnetic block 606, a connecting plate 607 is installed on one side wall of the sliding plate 603, two groups of slideways 608 are symmetrically opened on one side wall of the connecting plate 607, each group of the slideways 608 is slidably connected with a group of sliding blocks 609, an elastic clamping plate 610 is connected between the two groups of sliding blocks 609, and a group of protective pad layers 611 are installed on one side wall of each group of the elastic clamping plates 610.

[0053] Before cooling the two groups of microfluidic chips, first start the ninth electric push rod 604 to drive the first electromagnetic block 605 and the second electromagnetic block 606 to be magnetically connected, and then start the ninth electric push rod 604 to drive the sliding plate 603 to slide in the socket plate 601. During the sliding process, the compression spring 602 begins to be squeezed, and the two groups of elastic clamping plates 610 are driven to move in opposite directions. Then, when the two groups of protective suction cups 511 are in contact with the surface of the microfluidic chip, the magnetic connection between the first electromagnetic block 605 and the second electromagnetic block 606 is disengaged. When the compression spring 602 senses that the pressure disappears, it begins to rebound. During the rebound process, the two groups of elastic clamping plates 610 are driven to contact the side wall of the microfluidic chip, which performs a passive squeezing operation on the two groups of microfluidic chips, thereby improving the bonding progress between the two groups of microfluidic chips, and providing protection through the protective pad layer 611 during squeezing, thereby improving the protection effect and speeding up the work progress.

[0054] The sealing box 506 is driven to be clamped with the bonding table, and two groups of eighth electric push rods 510 are started to push two groups of protective suction cups 511 down, respectively contacting the top surface of a group of microfluidic chips, and condensing through the condensation block 509 to speed up the bonding progress. During the rapid molding process, the third motor 512 is started to drive the distance sensor 513 to rotate. When depressions or protrusions appear during the bonding process of the two groups of microfluidic chips, an alarm is given through the distance sensor 513, which improves the bonding effect of the device and the quality effect of the microfluidic chip packaging.

[0055] Start the ninth electric push rod 604 to drive the sliding plate 603 to slide in the socket plate 601, and start to squeeze the compression spring 602 during the sliding process. When the two groups of protective suction cups 511 are in contact with the surface of the microfluidic chip, the magnetic connection between the first electromagnetic block 605 and the second electromagnetic block 606 is disengaged, and the compression spring 602 starts to rebound when it senses that the pressure disappears. During the rebound process, it drives the two groups of elastic clamping plates 610 to contact the side wall of the microfluidic chip, which performs a passive squeezing operation on the two groups of microfluidic chips, thereby improving the bonding progress between the two groups of microfluidic chips, improving the protection effect and speeding up the work progress.

[0056] The second electric push rod 206 is started to push the inflatable bag structure 212 into the surface opening of the microfluidic chip, and the air pump 208 is started to expand the inflatable bag structure 212 in the opening of the microfluidic chip, thereby driving the adsorption mud glue 213 to absorb impurities in the opening of the microfluidic chip, and then the first electric slide 204 is started to drive the adsorption mud glue 213 to move horizontally, and several groups of openings of the microfluidic chip are cleaned in turn, thereby improving the surface cleaning effect of the microfluidic chip and improving the precision effect of subsequent microfluidic chip bonding.

[0057] Start the third electric push rod 302 to push the vacuum suction cup 309 to move above the discharge box 102, then start the second electric slide 305 to drive the vacuum suction cup 309 to move to directly above the discharge box 102, then start the fourth electric push rod 306 to push the vacuum suction cup 309 to adsorb the microfluidic chip. To improve the limiting effect, start the vacuum pump 310 to evacuate the air in the vacuum box 308, and then evacuate the air between the microfluidic chip and the vacuum suction cup 309, thereby improving the convenient limiting effect of the device.

[0058] Based on the above-mentioned bonding device for microfluidic chip packaging, an embodiment of the present invention further proposes a bonding method for a bonding device for microfluidic chip packaging. Exemplarily, the bonding method includes:

[0059] Place the microfluidic chip into the material dispensing box and start pre-bonding;

[0060] Start the third electric push rod to push the vacuum suction cup to move above the discharge box, and then start the second electric slide to drive the vacuum suction cup to move to the top of the discharge box;

[0061] Start the fourth electric push rod to push the vacuum suction cup to adsorb the microfluidic chip, and evacuate the air between the microfluidic chip and the vacuum suction cup;

[0062] Start the fourth electric push rod to drive the microfluidic chip out of the material discharging box, and then start the first electric push rod to drive the inflatable bag structure to move to a position at the same height as the microfluidic chip;

[0063] The second electric push rod is started to push the inflatable bag structure into the surface opening of the microfluidic chip, and then the air pump is started to supply air to the connecting pipe;

[0064] The inflatable bag structure expands in the opening of the microfluidic chip, driving the adsorption mud to adhere to the inner wall of the opening of the microfluidic chip to absorb impurities;

[0065] After the surface of the microfluidic chip is cleaned, the bonding table is moved, and the material taking component is started to take another set of microfluidic chips, perform the same preparation work, and then place them at one end of the microfluidic chip on the bonding table;

[0066] The fifth electric push rod is started to push the bonding structure to move above the two groups of microfluidic chips, and then the third electric slide is started to adjust the position;

[0067] Start the second motor to drive the sealing box and the bonding table to clamp, and start the two sets of eighth electric push rods to push the two sets of protective suction cups down;

[0068] The top surface of a set of microfluidic chips is impinged on and condensed by a condensation block;

[0069] The third motor is started to drive the distance sensor to rotate, so as to monitor the bonding of the two sets of microfluidic chips;

[0070] Starting the ninth electric push rod drives the first electromagnetic block to be magnetically connected with the second electromagnetic block, and drives the sliding plate to slide in the socket plate to squeeze the compression spring;

[0071] The magnetic connection between the first electromagnetic block and the second electromagnetic block is broken, and the compression spring starts to rebound after sensing the disappearance of the pressure;

[0072] The two sets of elastic clamping plates are driven to contact the side walls of the microfluidic chip, thereby performing a passive squeezing operation on the two sets of microfluidic chips.

[0073] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A bonding device for microfluidic chip packaging, comprising a material storage component, characterized in that: A cleaning component is installed on the top of the material storage component, and an auxiliary component is installed on the outer wall. Two sets of protective components are symmetrically installed on the inner wall of the auxiliary component. A material taking component is installed on one side wall of the material storage component, and a bonding component is installed on the side wall away from the material taking component. The auxiliary component includes a mounting shell, two groups of condensation blocks are symmetrically mounted on the top of the mounting shell, two groups of eighth electric push rods are symmetrically mounted on the bottom edge of the mounting shell, a group of protective suction cups are mounted on the output end of each group of eighth electric push rods, two groups of third motors are symmetrically mounted on the bottom of the mounting shell, and a group of distance sensors are transmission-connected to the output end of each group of third motors; When two sets of microfluidic chips are bonded together, a distance sensor will give an alarm if a depression or a bulge occurs. The cleaning assembly comprises a first fixed block, a first electric slide is installed on one side wall of the first fixed block, a second fixed block is transmission-connected to the output end of the first electric slide, and a second electric push rod is installed on one side wall of the second fixed block; A second fixing plate is installed on the output end of the second electric push rod, an air pump is installed on one side wall of the second fixing plate, the output end of the air pump is connected to one end of a connecting pipe, and the other end of the connecting pipe is connected to an inflatable bag structure; the outer wall of the connecting pipe is connected to a heating box, and the outer wall of the inflatable bag structure is sleeved with adsorption mud glue; The second electric push rod is started to push the inflatable bag structure into the surface opening of the microfluidic chip, and then the air pump is started to supply air to the connecting pipe; the inflatable bag structure expands in the opening of the microfluidic chip, driving the adsorption mud glue to adhere to the inner wall of the opening of the microfluidic chip to absorb impurities; The auxiliary component further comprises a sealing box, and the mounting shell is mounted on the inner wall of the sealing box.

2. A bonding device for microfluidic chip packaging according to claim 1, characterized in that: The material storage assembly comprises a working bottom plate, a material discharge box is installed on the top of the working bottom plate, a plurality of groups of bonding tables are installed on the top of the working bottom plate at equal intervals, and each group of bonding tables is symmetrically provided with a plurality of groups of clamping holes.

3. A bonding device for microfluidic chip packaging according to claim 2, characterized in that: The cleaning assembly also includes a first fixed plate, the bottom of which is mounted on the top of the working base plate, a first electric push rod is mounted on the top of the first fixed plate, and the first fixed block is mounted on the output end of the first electric push rod.

4. A bonding device for microfluidic chip packaging according to claim 2, characterized in that: The material picking assembly includes a third fixed plate, one end of the third fixed plate is installed on a side wall of the working base plate, a third electric push rod is installed on one side wall of the third fixed plate, a fourth fixed plate is installed on the output end of the third electric push rod, a fifth fixed plate is installed on the top of the fourth fixed plate, and a second electric slide is installed on one side wall of the fifth fixed plate.

5. A bonding device for microfluidic chip packaging according to claim 4, characterized in that: The output end of the second electric slide is transmission-connected with a fourth electric push rod, the output end of the fourth electric push rod is installed with a first motor, the output end of the first motor is transmission-connected with a vacuum box, the bottom of the vacuum box is connected with a vacuum suction cup, and a vacuum pump is installed on the outer wall of the vacuum box.

6. A bonding device for microfluidic chip packaging according to claim 4, characterized in that: The bonding assembly includes a sixth fixed plate, one end of the sixth fixed plate is installed on a side wall of the working base plate, a fifth electric push rod is installed on one side wall of the sixth fixed plate, a seventh fixed plate is installed on the output end of the fifth electric push rod, a third electric slide is installed on one side wall of the seventh fixed plate, a sixth electric push rod is transmission-connected to the output end of the third electric slide, and a bonding structure is installed on the output end of the sixth electric push rod.

7. A bonding device for microfluidic chip packaging according to claim 2, characterized in that: The auxiliary component also includes an eighth fixed plate, one end of which is mounted on the outer wall of the working base plate, a second motor is mounted on the top of the eighth fixed plate, the output end of the second motor is transmission-connected to a ninth fixed plate, a fourth electric slide is mounted on one side wall of the ninth fixed plate, the output end of the fourth electric slide is transmission-connected to a seventh electric push rod, the sealing box is mounted on the output end of the seventh electric push rod, and a plurality of groups of clamping rods are evenly spacedly mounted on the bottom edge of the sealing box, the clamping rods are movably clamped to the clamping holes.

8. A bonding device for microfluidic chip packaging according to claim 7, characterized in that: The protective component includes a socket plate, one end of a group of compression springs is installed on the inner wall of one side of each group of socket plates, and a group of sliding plates is installed on the other end of each group of compression springs. One end of each group of the socket plates is installed on the inner wall of one side of the sealing box, a connecting plate is installed on one side wall of the sliding plate, and two groups of slideways are symmetrically opened on one side wall of the connecting plate. A group of sliding blocks are slidably connected in each group of the slideways, and an elastic clamping plate is connected between the two groups of sliding blocks. A group of protective pads are installed on one side wall of each group of the elastic clamping plates.

9. A bonding method of the bonding device for microfluidic chip packaging according to any one of claims 1 to 8, characterized in that: The bonding method comprises: Place the microfluidic chip into the material storage component for pre-bonding; Start the material removal component to move the microfluidic chip to the bonding table; Start the bonding component to perform bonding work; The eighth electric push rod is started to push the protective suction cup against the surface of the microfluidic chip, and then the condensation block is started to perform condensation; The third motor is started to drive the distance sensor to rotate, so as to monitor the bonding of the two sets of microfluidic chips.

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