An environmentally friendly semiconductor constant temperature heating purification board

Abstract

The invention relates to the technical field of building board materials, and more specifically to an environmentally friendly semiconductor constant temperature heating purification board, comprising: a purification layer, a semiconductor heating film, a heat conducting layer, a heat dissipation layer, an installation groove, a heat insulating layer, a protective side plate, an installation baffle, a conduction block, a conduction gasket, a limit latch, and a connecting spring; by wrapping the semiconductor heating film in an aluminum heat conducting layer inside the semiconductor heating film, the heat conducting layer is divided into an inner heat conducting layer and an outer heat conducting layer, and the semiconductor heating film is located between the inner heat conducting layer and the outer heat conducting layer, so that the heat generated by the semiconductor heating film on the side away from the room will also be conducted to the outer heat conducting layer at the first time, and then the heat will be conducted inwardly through the contact position between the outer heat conducting layer and the inner heat conducting layer, and a plurality of wall bodies composed of the invention generate heat together under the regulation of a temperature control system installed indoors, thereby playing a role in quickly and evenly regulating the indoor constant temperature heating under low energy consumption.

Description

Technical Field

[0001] The invention relates to the technical field of building boards, in particular to an environmentally friendly semiconductor constant-temperature heating and purification board. Background Art

[0002] Purification board is a composite board made of color-coated board and stainless steel as panel materials, also called clean board. It was originally used in the medical and pharmaceutical industries to ensure a sterile environment. With the advancement of technology and the development of the times, the materials and processes of purification boards are constantly upgraded, and the application field is gradually expanding. Today, purification boards not only ensure a sterile production environment in the medical, pharmaceutical and food processing industries, but are also used in the electronics and high-tech manufacturing industries to provide the necessary clean environment for experiments and technical operations, promoting scientific and technological progress and industrial upgrading.

[0003] In demanding industries such as pharmaceuticals and semiconductor manufacturing, many chemical reactions and biological processes not only need to be carried out in a clean and sterile environment, but are also extremely sensitive to temperature. Temperature fluctuations may cause reaction failure or product quality degradation. From the perspective of scientific research and product development, multiple variables including temperature need to be strictly controlled in the laboratory to ensure the repeatability and reliability of experimental results. Therefore, not only a purification plate is needed to maintain a clean and sterile environment, but also equipment is needed to ensure constant temperature.

[0004] Air conditioners and electric heaters are commonly used heating equipment, but each has its own shortcomings when used in the above occasions. Although the air conditioning system can provide stable temperature control, it will bring dusty air from the outside into the room, affecting the cleanliness. In addition, although the filters of the air conditioning system can partially solve this problem, frequent replacement and maintenance increase costs and complexity. Although electric heaters are simple to operate, they usually have high energy consumption and uneven heating. For environments that require precise temperature control, electric heaters cannot provide sufficient temperature consistency, which may affect the stability and reliability of experimental and production processes.

[0005] In view of this, in order to overcome the above technical problems, the present invention proposes an environmentally friendly semiconductor constant temperature heating and purification plate. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art, the technical solution adopted by the present invention to solve the technical problem is: the environmentally friendly semiconductor constant temperature heating purification plate described in the present invention comprises a purification layer, and the purification layer is used to purify the air;

[0007] Also includes:

[0008] A semiconductor heating film, which is installed inside the purification layer, and both sides of the semiconductor heating film are connected to the heating circuit;

[0009] A heat-conducting layer, wherein the heat-conducting layer is made of a heat-conducting metal material, and the heat-conducting layer is divided into an inner heat-conducting layer far away from the purification layer and an outer heat-conducting layer close to the purification layer, wherein the inner heat-conducting layer and the outer heat-conducting layer wrap the semiconductor heating film inside;

[0010] The heat dissipation layer is connected to the inner heat-conducting layer and is used to dissipate the heat conducted by the heat-conducting layer into the air.

[0011] Preferably, a plurality of thin grooves are evenly formed in the middle of the semiconductor heating film, and a mounting groove having the same shape and size as the semiconductor heating film is formed on the surface of the outer heat conducting layer.

[0012] Preferably, the heat dissipation layer and the inner heat conductive layer are integrally formed, and the heat dissipation layer is composed of honeycomb heat dissipation structures that are evenly and equidistantly arranged.

[0013] Preferably, a heat insulation layer is installed between the purification layer and the heat conductive layer, a cross-shaped connecting protrusion is provided on the side of the outer heat conductive layer close to the purification layer, and the heat insulation layer is connected to the outer purification layer through the connecting protrusion; the ratio of the thickness of the heat insulation layer to the thickness of the outer heat conductive layer is greater than 1.

[0014] Preferably, the outer heat-conducting layer and the inner heat-conducting layer are connected by a silicone adhesive added with a heat-conducting filler; and the heat-insulating layer and the connecting protrusion and the purification layer are connected by a polyurethane adhesive.

[0015] Preferably, the purification layer, the heat-conducting layer, the heat-dissipating layer and the heat-insulating layer are detachably connected to protective side plates at both end side walls, and an installation baffle is fixedly connected to the outer end of one side of the protective side plate.

[0016] Preferably, one end of the heat-conducting layer is fixedly connected with a conduction block, and the conduction block extends outward through the protective side plate, and a conduction groove penetrating the protective side plate is provided at a corresponding position of the other end of the protective side plate without the conduction block.

[0017] Preferably, a conductive gasket is fixedly connected to the end of the conductive block, and the sum of the length of the conductive block extending out of the protective side plate and the thickness of the conductive gasket is greater than the depth of the conductive groove.

[0018] Preferably, the protective side plate is provided with limit grooves which are symmetrically distributed up and down, wherein a limit pin is rotatably connected in the limit groove on the protective side plate on the side where the conduction block extends, a torsion spring is installed at the rotation axis of the limit pin, and the extension length of the limit pin is the same as the depth of the limit groove in the protective side plate on the other side.

[0019] Preferably, a connecting spring is fixedly connected to the upper edge of the protective side plate, and the connecting spring is used to connect the heating circuit of the semiconductor heating film with the outside world; the connecting spring and the limiting groove are respectively located at the outer edge and inner edge of the protective side plate.

[0020] The beneficial effects of the present invention are as follows:

[0021] 1. The semiconductor heating film is wrapped in an aluminum heat-conducting layer inside, and the heat-conducting layer is divided into an inner heat-conducting layer and an outer heat-conducting layer. The semiconductor heating film is located between the inner heat-conducting layer and the outer heat-conducting layer. Therefore, the heat generated by the semiconductor heating film on the side facing away from the indoor room will be conducted to the outer heat-conducting layer in the first time, and then the heat will be conducted inwardly through the contact position between the outer heat-conducting layer and the inner heat-conducting layer, thereby improving the actual indoor heating effect of the semiconductor heating film.

[0022] 2. A conduction block made of the same material as the heat-conducting layer but long enough to pass through the protective side plate is installed on one side of the heat-conducting plate. When installing on a wall, the staff can insert the protruding part of the conduction block into another protective side plate of the present invention along the installation baffle, so that adjacent heat-conducting layers are in contact with each other through the conduction block. Therefore, even if there is obstruction by equipment or materials, the heat generated by the semiconductor heating film here can be dissipated into the air through the adjacent heat-conducting layer and the heat dissipation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below in conjunction with the accompanying drawings.

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a schematic diagram of the overall structure of the present invention from another angle;

[0026] Figure 3 yes Figure 2 A local enlarged view of point A in FIG.

[0027] Figure 4 is a side sectional view of the present invention;

[0028] Figure 5 It is a three-dimensional exploded view of the heat-conducting layer and its structure of the present invention;

[0029] Figure 6 It is a three-dimensional exploded view of the heat-conducting layer and its structure from another perspective of the present invention.

[0030] In the figure: 1. purification layer; 2. semiconductor heating film; 3. heat conducting layer; 4. inner heat conducting layer; 5. outer heat conducting layer; 6. heat dissipation layer; 7. mounting groove; 8. heat insulating layer; 9. connecting protrusion; 10. protective side plate; 11. mounting baffle; 12. conduction block; 13. conduction groove; 14. conduction gasket; 15. limit groove; 16. limit pin; 17. connecting spring. DETAILED DESCRIPTION

[0031] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention will be further explained below in conjunction with the accompanying drawings and specific implementation methods.

[0032] like Figures 1 to 6 As shown, an embodiment of the present invention provides an environmentally friendly semiconductor constant temperature heating purification plate, comprising a purification layer 1, wherein the purification layer 1 is used to purify air;

[0033] Also includes:

[0034] A semiconductor heating film 2, wherein the semiconductor heating film 2 is installed inside the purification layer 1, and both sides of the semiconductor heating film 2 are connected to the heating circuit;

[0035] A heat-conducting layer 3, wherein the heat-conducting layer 3 is made of a heat-conducting metal material, and the heat-conducting layer 3 is divided into an inner heat-conducting layer 4 far away from the purification layer 1 and an outer heat-conducting layer 5 close to the purification layer 1, wherein the inner heat-conducting layer 4 and the outer heat-conducting layer 5 wrap the semiconductor heating film 2 inside;

[0036] The heat dissipation layer 6 is connected to the inner heat-conducting layer 4 and is used to dissipate the heat conducted by the heat-conducting layer 3 into the air.

[0037] As an embodiment of the present invention, a plurality of fine grooves are evenly formed in the middle of the semiconductor heating film 2 , and a mounting groove 7 having the same shape and size as the semiconductor heating film 2 is formed on the surface of the outer heat conducting layer 5 .

[0038] As an implementation mode of the present invention, the heat dissipation layer 6 is integrally formed with the inner heat conducting layer 4 , and the heat dissipation layer 6 is composed of a honeycomb heat dissipation structure that is evenly and equidistantly arranged.

[0039] When constructing a laboratory or workplace with a sterile constant temperature environment, the purification layer 1 cooperates with the structures with different functions such as filtering, adsorption, and antibacterial constructed inside it to purify the indoor air, thereby first ensuring the sterile conditions of the environment; and when the work is carried out and the indoor temperature environment needs to be maintained at a constant temperature, the switch of the heating circuit of the semiconductor heating film 2 is turned on to energize it and start to generate heat. During the heating process, the semiconductor heating film 2 generates heat by utilizing the resistance properties of the semiconductor material. The pure resistance circuit and the excellent electrical conductivity and thermal conductivity of the semiconductor heating film 2 bring it an electric-to-heat conversion efficiency of up to 99.45%, with almost no energy loss, thereby consuming less power. On the basis, a large amount of heat is provided; in addition, the thin film structure adopted by the semiconductor heating film 2 has a large surface area, which can provide a relatively uniform heat distribution, so that it can quickly and evenly conduct the heat away, avoiding the formation of local overheating or cold spots, which not only improves the overall thermal efficiency, but also reduces the heat loss caused by local heat concentration; the heat of the semiconductor heating film 2 will be freely dissipated on its front and back sides during the power-on heating process, which causes the heat generated by the side of the semiconductor heating film 2 facing the purification layer 1 to be conducted to the purification layer 1, and will not be used for indoor heating, resulting in a decrease in the actual indoor heating effect of the semiconductor heating film 2. For this reason, the semiconductor heating film 2 is designed to be wrapped with an aluminum material inside it. The heat conducting layer 3 is divided into an inner heat conducting layer 4 and an outer heat conducting layer 5, and the semiconductor heating film 2 is located between the inner heat conducting layer 4 and the outer heat conducting layer 5, so that the heat generated by the semiconductor heating film 2 on the side facing away from the room will be conducted to the outer heat conducting layer 5 at the first time, and then the heat will be conducted inwardly through the contact position between the outer heat conducting layer 5 and the inner heat conducting layer 4, thereby improving the actual indoor heating effect of the semiconductor heating film 2; the multiple sections of fine grooves opened in the middle of the semiconductor heating film 2 match the protrusions of the mounting grooves 7 opened on the surface of the outer heat conducting layer 5, thereby making the contact between the semiconductor heating film 2 and the outer heat conducting layer 5 more complete, and also increasing the contact area between the inner heat conducting layer 4 and the outer heat conducting layer 5, thereby improving the semiconductor heating film 2. The heat conduction efficiency between the internal heat-conducting film 2 and the heat-conducting layer 3 is improved, so that the internal heat-conducting layer 4 can obtain enough heat to transfer to the heat dissipation layer 6, so as to quickly and evenly dissipate the heat into the room with the help of the heat dissipation layer 6. The multiple walls composed of the present invention generate heat together under the regulation of the temperature control system installed in the room, thereby playing a role in quickly and evenly regulating the indoor temperature with low energy consumption; in particular, the heat dissipation layer 6 adopts a honeycomb structure design, which can not only ensure that the heat flux of the heat dissipation layer 6 is sufficient to quickly dissipate the heat transferred by the heat-conducting layer 3 into the indoor air by virtue of its huge surface area, but also provide sufficient support for the board by virtue of its own structural characteristics, thereby improving the durability of the board.

[0040] As an embodiment of the present invention, a heat insulation layer 8 is further installed between the purification layer 1 and the heat conducting layer 3, and a cross-shaped connecting protrusion 9 is provided on the side of the outer heat conducting layer 5 close to the purification layer 1, and the heat insulation layer 8 is connected to the outer purification layer 1 through the connecting protrusion 9; the thickness ratio of the heat insulation layer 8 to the outer heat conducting layer 5 is greater than 1.

[0041] When in use, since both the outer heat-conducting layer 5 and the inner heat-conducting layer 4 are aluminum plates with extremely high thermal conductivity, even if the semiconductor heating film 2 and the purification layer 1 are separated by the outer heat-conducting layer 5, it is still impossible to avoid the heat conducted into the outer heat-conducting layer 5 from continuing to be transferred to the purification layer 1 connected thereto. For this reason, a cross-shaped connecting protrusion 9 is installed on the side of the outer heat-conducting layer 5 close to the purification layer 1, and a heat-insulating layer 8 with a thickness greater than that of the outer heat-conducting layer 5 is installed on the outer heat-conducting layer 5, thereby separating the outer heat-conducting layer 5 from the purification layer 1, and then reducing the contact area between the outer heat-conducting layer 5 and the heat-insulating layer 8 by the connecting protrusion 9, and selecting the heat-insulating layer 8 made of heat-insulating materials such as glass fiber to further reduce the heat loss caused by the heat in the outer heat-conducting layer 5 being conducted to the purification layer 1.

[0042] As an embodiment of the present invention, the outer heat-conducting layer 5 and the inner heat-conducting layer 4 are connected by a silicone resin adhesive added with a heat-conducting filler; the heat-insulating layer 8 is connected to the connecting protrusion 9 and the purification layer 1 by a polyurethane adhesive; by using adhesives with different thermal conductivity at different positions to bond the plates together, the heat-conducting capacity between the plates at the heat-conducting position and the heat-insulating capacity between the plates at the heat-insulating position can be better utilized, thereby further improving the indoor heating effect of the present invention.

[0043] As an embodiment of the present invention, the purification layer 1, the heat conducting layer 3, the heat dissipation layer 6 and the heat insulating layer 8 are detachably connected to a protective side plate 10 at both end side walls, and an installation baffle 11 is fixedly connected to the outer end of one side of the protective side plate 10.

[0044] As an embodiment of the present invention, a conduction block 12 is fixedly connected to one end of the heat conducting layer 3, and the conduction block 12 extends outward through the protective side plate 10. A conduction groove 13 penetrating the protective side plate 10 is opened at the corresponding position of the other end of the protective side plate 10 without the conduction block 12.

[0045] As an embodiment of the present invention, a conductive gasket 14 is fixedly connected to the end of the conductive block 12 , and the sum of the length of the conductive block 12 extending out of the protective side plate 10 and the thickness of the conductive gasket 14 is greater than the depth of the conductive slot 13 .

[0046] In addition to the staff, some equipment and spare materials are inevitably placed in the laboratory or workplace. The present invention located at the place where these equipment or materials are placed cannot normally dissipate heat to the indoor air because the heat dissipation position is blocked. Over time, it will cause local heat accumulation at this position, which is not conducive to indoor heating work. For this reason, a conduction block 12 made of the same material as the heat-conducting layer 3 but with a length sufficient to pass through the protective side plate 10 is installed on one side of the heat-conducting plate. When installing on the wall, the staff can insert the protruding part of the conduction block 12 into another protective side plate 10 of the present invention along the installation baffle 11, so that adjacent heat-conducting layers 3 are connected to each other through the conduction block 12. Therefore, even if there is an obstruction by equipment or materials, the heat generated by the semiconductor heating film 2 here can be dissipated into the air through the adjacent thermal conductive layer 3 and the heat dissipation layer 6, thereby playing a role in alleviating this local heat accumulation phenomenon; at the end of the conduction block 12, a conduction gasket 14 which also has good thermal conductivity but also has a certain deformability is fixedly connected. When the conduction block 12 is inserted into the conduction groove 13, the combined length of the conduction block 12 and the conduction gasket 14 is greater than the depth of the conduction groove 13, so that the conduction gasket 14 is deformed, ensuring that the conduction block 12 is in close contact with the side wall of another thermal conductive layer 3 through the conduction gasket 14, thereby improving the efficiency of heat conduction through the conduction block 12.

[0047] As an embodiment of the present invention, the protective side plate 10 is provided with limit grooves 15 which are symmetrically distributed up and down, wherein the limit groove 15 on the protective side plate 10 on the side where the conduction block 12 extends out is rotatably connected to a limit pin 16, and a torsion spring is installed at the rotation axis of the limit pin 16, and the extension length of the limit pin 16 is the same as the depth of the limit groove 15 in the protective side plate 10 on the other side.

[0048] As an embodiment of the present invention, a connecting spring 17 is fixedly connected to the upper edge of the protective side plate 10, and the connecting spring 17 is used to connect the heating circuit of the semiconductor heating film 2 with the outside world; the connecting spring 17 and the limiting groove 15 are respectively located at the outer edge and inner edge of the protective side plate 10.

[0049] During installation, a quick-release design is adopted by providing a limit groove 15 and a limit overhead on the protective side plate 10. The staff only needs to place one piece of the present invention against another installation baffle 11 of the present invention, and then align the position between the conduction block 12 and the conduction groove 13 to extend the limit pin 16 that extends out of the installation position limit groove 15 under the action of the torsion spring into the limit groove 15 of another present invention without a limit pin 16, and the installation can be successful; at this time, a group of connecting spring sheets 17 installed at the upper edge of the protective side plate 10 also contact each other to complete the connection of the heating circuit; if disassembly is required due to a malfunction or other reasons, the staff only needs to extend a thin sheet into the gap between the adjacent protective side plates 10 and slide upward until the limit pin 16 is pushed to rotate upward to disengage from the adjacent The limiting effect of the limiting pin 16 at this position can be cancelled. At this time, the thin sheet is no longer moved, but other thin sheets are taken to repeat the operation at several limiting pins 16 adjacent to the present invention. After the limiting cooperation between the four limiting pins 16 and the limiting slots 15 is completely cancelled, the protective side plate 10 is repeatedly pulled along the side where the conduction slot 13 is opened to remove it from this position; the quick-release design makes it possible to quickly replace the present invention even if a failure occurs, thereby minimizing the impact caused by the failure of the plate; the connecting spring 17 and the limiting slot 15 are respectively arranged at the outer edge and inner edge of the protective side plate 10, so that it is convenient for the staff to extend the thin sheet into the gap position to handle the limiting pin 16 during the disassembly work.

[0050] The above shows and describes the basic principles, main features and significant advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above specific embodiments. Without departing from the spirit and scope of the present invention, the present invention may also be modified and improved to adapt to different usage environments and customer needs. These modifications and improvements fall within the scope of protection of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. An environmentally friendly semiconductor constant temperature heating purification plate, comprising a purification layer (1), wherein the purification layer (1) is used to purify air; It is characterized in that Also includes: A semiconductor heating film (2), the semiconductor heating film (2) being installed on the inner side of the purification layer (1), and both sides of the semiconductor heating film (2) being connected to a heating circuit; A heat-conducting layer (3), the heat-conducting layer (3) being made of a heat-conducting metal material, the heat-conducting layer (3) being divided into an inner heat-conducting layer (4) away from the purification layer (1) and an outer heat-conducting layer (5) close to the purification layer (1), the inner heat-conducting layer (4) and the outer heat-conducting layer (5) wrapping the semiconductor heating film (2) inside; A heat dissipation layer (6), the heat dissipation layer (6) being connected to the inner heat conducting layer (4), and the heat dissipation layer (6) being used to dissipate heat conducted by the heat conducting layer (3) into the air.

2. The environmentally friendly semiconductor constant temperature heating purification plate according to claim 1 is characterized by: The semiconductor heating film (2) has a plurality of evenly spaced thin grooves in the middle thereof, and the outer heat conducting layer (5) has a mounting groove (7) on the surface thereof that has the same shape and size as the semiconductor heating film (2).

3. The environmentally friendly semiconductor constant temperature heating and purification plate according to claim 1 is characterized by: The heat dissipation layer (6) is integrally formed with the inner heat conducting layer (4), and the heat dissipation layer (6) is composed of honeycomb heat dissipation structures that are evenly and equidistantly arranged.

4. The environmentally friendly semiconductor constant temperature heating and purification plate according to claim 1 is characterized by: A heat insulating layer (8) is also installed between the purification layer (1) and the heat conducting layer (3); a cross-shaped connecting protrusion (9) is provided on the side of the outer heat conducting layer (5) close to the purification layer (1); the heat insulating layer (8) is connected to the outer purification layer (1) via the connecting protrusion (9); and the ratio of the thickness of the heat insulating layer (8) to the thickness of the outer heat conducting layer (5) is greater than 1.

5. The environmentally friendly semiconductor constant temperature heating and purification board according to claim 4 is characterized by: The outer heat-conducting layer (5) and the inner heat-conducting layer (4) are connected by a silicone adhesive to which a heat-conducting filler is added; and the heat-insulating layer (8) and the connecting protrusion (9) and the purification layer (1) are connected by a polyurethane adhesive.

6. The environmentally friendly semiconductor constant temperature heating and purification board according to claim 5 is characterized by: The purification layer (1), the heat-conducting layer (3), the heat-dissipating layer (6) and the heat-insulating layer (8) are detachably connected to a protective side plate (10) at both end side walls, and a mounting baffle (11) is fixedly connected to an outer end of one side of the protective side plate (10).

7. The environmentally friendly semiconductor constant temperature heating and purification board according to claim 6 is characterized by: One end of the heat-conducting layer (3) is fixedly connected to a conduction block (12), the conduction block (12) passes through the protective side plate (10) and extends outwards, and a conduction slot (13) penetrating the protective side plate (10) is provided at a corresponding position of the other end of the protective side plate (10) without the conduction block (12).

8. The environmentally friendly semiconductor constant temperature heating and purification board according to claim 7 is characterized by: A conductive gasket (14) is fixedly connected to the end of the conductive block (12), and the sum of the length of the conductive block (12) extending out of the protective side plate (10) and the thickness of the conductive gasket (14) is greater than the depth of the conductive groove (13).

9. The environmentally friendly semiconductor constant temperature heating and purification board according to claim 7, characterized in that: The protective side plate (10) is provided with limit grooves (15) symmetrically distributed in the upper and lower parts, wherein a limit pin (16) is rotatably connected in the limit groove (15) on the protective side plate (10) on the side where the conductive block (12) extends out, and a torsion spring is installed at the rotation axis of the limit pin (16), and the extension length of the limit pin (16) is the same as the depth of the limit groove (15) in the protective side plate (10) on the other side.

10. The environmentally friendly semiconductor constant temperature heating and purification plate according to claim 9, characterized in that: A connecting spring (17) is fixedly connected to the upper edge of the protective side plate (10), and the connecting spring (17) is used to connect the heating circuit of the semiconductor heating film (2) to the outside world; the connecting spring (17) and the limiting groove (15) are respectively located at the outer edge and inner edge of the protective side plate (10).

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