Photomask protective film assembly, photomask assembly, photomask box and photomask protective film measuring method

Abstract

The invention provides a photomask protective film assembly, a photomask assembly, a photomask box and a photomask protective film measuring method. A photomask pellicle assembly may include: a photomask pellicle frame configured to provide a first opening; the photomask protective film is arranged on the photomask protective film frame; and a plurality of mask pellicle electrodes arranged along an edge of the mask pellicle and spaced apart from each other. The photomask pellicle may include a photomask pellicle boundary having a quadrilateral or rectangular frame shape and a photomask pellicle membrane on and coupled to a top surface of the photomask pellicle boundary. Each photomask pellicle electrode may include a contact member on and in contact with a top surface of the photomask pellicle membrane.

Description

Technical Field

[0001] The present disclosure relates to a pellicle assembly, a reticle assembly, a reticle case, a pellicle measurement method, and a reticle measurement method, and in particular, to a pellicle assembly, a reticle assembly, a reticle case, a pellicle measurement method, and a reticle measurement method provided to sense a state of a pellicle or a reticle. Background Art

[0002] Semiconductor devices can be manufactured by various processes. For example, semiconductor devices can be manufactured by an exposure process, an etching process, a deposition process and / or a plating process. In the exposure process, a mask can be used to form a desired pattern on a wafer. In order to protect the mask from external contaminants, a mask pellicle can be located on the mask and connected to the mask. The mask pellicle can be provided in the form of a thin film. In the case where the mask pellicle is damaged, defects may be generated on the wafer after the exposure process. Summary of the invention

[0003] An embodiment of the inventive concept provides a reticle pellicle assembly, a reticle assembly, a reticle box, a reticle pellicle measurement method, and a reticle measurement method, which are provided to sense defects in a reticle pellicle and / or a reticle.

[0004] An embodiment of the inventive concept provides a reticle pellicle assembly, a reticle assembly, a reticle box, a reticle pellicle measurement method, and a reticle measurement method, which are provided to estimate the life of a reticle pellicle.

[0005] An embodiment of the inventive concept provides a reticle pellicle assembly, a reticle assembly, a reticle box, a reticle pellicle measuring method, and a reticle measuring method for measuring a reticle pellicle and / or a reticle even during transportation or storage of the reticle or the reticle.

[0006] According to an embodiment of the present inventive concept, a mask pellicle assembly may include: a mask pellicle frame configured to provide a first opening; a mask pellicle on the mask pellicle frame; and a plurality of mask pellicle electrodes arranged along an edge of the mask pellicle and spaced apart from each other. The mask pellicle may include a mask pellicle boundary having a quadrilateral or rectangular frame shape and a mask pellicle film located on a top surface of the mask pellicle boundary and coupled to the top surface of the mask pellicle boundary. Each mask pellicle electrode may include a contact member located on a top surface of the mask pellicle film and in contact with the top surface of the mask pellicle film.

[0007] According to an embodiment of the present inventive concept, a mask assembly may include: a mask configured for an exposure process; a stage configured to support the mask; and a plurality of mask electrodes between the mask and the stage. The mask may include a top surface and a bottom surface spaced apart from the top surface, the top surface including a mask pattern thereon. Each mask electrode may contact the bottom surface of the mask, and the plurality of mask electrodes may be arranged along an edge of the bottom surface of the mask and spaced apart from each other.

[0008] According to an embodiment of the present inventive concept, a photomask box may include a lower POD and an upper POD located on and coupled to the lower POD. The lower POD may include: a lower POD body configured to provide a lower insertion space; and a plurality of lower support electrodes extending upward from a bottom surface of the lower POD body defining the lower insertion space. When viewed in a plan view, the plurality of lower support electrodes may be arranged along corners of a quadrilateral or rectangular shape and spaced apart from each other.

[0009] According to one embodiment of the present invention, a mask pellicle measurement method may include: supplying current to two mask pellicle electrodes, the two mask pellicle electrodes being included in a plurality of mask pellicle electrodes arranged along an edge of a mask pellicle film and spaced apart from each other; measuring a potential difference between a pair of mask pellicle electrodes selected from the plurality of mask pellicle electrodes; and measuring the impedance of the mask pellicle film.

[0010] According to one embodiment of the present invention, a mask measurement method may include: supplying current to two mask electrodes, the two mask electrodes being included in a plurality of mask electrodes arranged along an edge of a bottom surface of the mask and spaced apart from each other; measuring a potential difference between a pair of mask electrodes selected from the plurality of mask electrodes; and measuring the impedance of the mask. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic diagram illustrating an exposure apparatus according to an embodiment of the present inventive concept.

[0012] Figure 2 is a perspective view illustrating a photomask assembly according to an embodiment of the inventive concept.

[0013] Figure 3 is an exploded perspective view illustrating a photomask assembly according to an embodiment of the inventive concept.

[0014] Figure 4 is a cross-sectional view illustrating a photomask assembly according to an embodiment of the inventive concept.

[0015] Figure 5 It is shown Figure 4 An enlarged cross-sectional view of portion X.

[0016] Figure 6 is a plan view illustrating a mask pellicle assembly according to an embodiment of the inventive concept.

[0017] Figure 7 is a flowchart illustrating a mask pellicle measurement method according to an embodiment of the inventive concept.

[0018] Figure 8 is a flowchart illustrating a reticle measurement method according to an embodiment of the present inventive concept.

[0019] Fig. 9 is an exploded perspective view illustrating a reticle pod according to an embodiment of the inventive concept.

[0020] Fig.10 is a cross-sectional view illustrating a reticle pod according to an embodiment of the present inventive concept.

[0021] Fig.11 It is shown Fig.10 An enlarged cross-sectional view of portion Y of FIG.

[0022] Fig.12 is a flowchart illustrating a mask pellicle measurement method according to an embodiment of the inventive concept.

[0023] Fig.13 is a flowchart illustrating a reticle measurement method according to an embodiment of the present inventive concept. DETAILED DESCRIPTION

[0024] Example embodiments of the inventive concept will now be described more fully with reference to the accompanying drawings, in which example embodiments are shown. The same reference numerals in the accompanying drawings represent the same elements, and therefore their description will be omitted. As used herein, the term "and / or" includes any and all combinations of one or more related listed items. Note that aspects described with respect to one embodiment may be incorporated into different embodiments, although not specifically described therefor. That is, all embodiments and / or features of any embodiment may be combined in any manner and / or combination.

[0025] Figure 1 is a schematic diagram illustrating an exposure apparatus according to an embodiment of the present inventive concept.

[0026] Reference Figure 1, an exposure device SY may be provided. The exposure device SY may be used to perform an exposure process on a substrate. That is, the exposure device SY may be configured to perform an exposure process in which the substrate is exposed to light to form a pattern thereon. For example, the exposure device SY may be configured to expose the substrate to extreme ultraviolet (EUV) light. In other words, the exposure device SY may be an EUV exposure device. The exposure device SY may include a light source portion 1, a focusing portion 2, a projection portion 4, a control unit 9, and a substrate chuck 8. In some embodiments, the mask assembly MA may be located in the exposure device SY.

[0027] The light source part 1 may be configured to generate extreme ultraviolet light (e.g., having a wavelength of 100 nm or less). More specifically, the light source part 1 may generate light having a wavelength of 13.5 nm. However, embodiments of the inventive concept are not limited to this example, and in one embodiment, the light source part 1 may be configured to generate light having a wavelength of 100 nm to 300 nm.

[0028] The focusing portion 2 can guide the light 11 generated in the light source portion 1 so that the light 11 is reflected by the mask assembly MA. To this end, the focusing portion 2 may include a converging optical system 22. The converging optical system 22 may include, for example, a lens and / or a reflector. The converging optical system 22 may be configured to guide the light 11 to the mask assembly MA by converging or reflecting the light 11. The light 11 may be incident on the mask assembly MA through the focusing portion 2. In one embodiment, the light 11 may be incident on the mask assembly MA at an angle, that is, the light 11 may be incident at an angle that deviates from a line perpendicular to the surface of the mask assembly MA. The mask assembly MA may be movable within the exposure device SY. For example, when the light 11 is incident on the mask assembly MA through the focusing portion 2, the mask assembly MA may be moved horizontally under the control of the control unit 9. The light 11 reflected from the mask assembly MA may be propagated to the projection portion 4.

[0029] The projection part 4 can be configured to project the light 11 reflected from the mask assembly MA onto the substrate WF. To this end, the projection part 4 can include a projection optical system 42. The projection optical system 42 can include a lens and / or a reflector. In one embodiment, the projection optical system 42 can be configured to project the light 11 onto the substrate WF in a reduced projection manner.

[0030] The substrate chuck 8 can support the substrate WF. In this specification, the term "substrate" can be used to represent a silicon (Si) wafer, but the embodiments of the present invention are not limited to this. The substrate chuck 8 can be configured to fasten the substrate WF to a specific position. To this end, the substrate chuck 8 may include an electrostatic chuck (ESC), but the embodiments of the present invention are not limited to this example. That is, the substrate chuck 8 may include a vacuum chuck or the like. When the mask assembly MA is located in the exposure device SY, the substrate WF can be loaded on the substrate chuck 8. The mask assembly MA can be used to form a pattern on the substrate WF loaded on the substrate chuck 8. This will be described in more detail below.

[0031] Figure 2 is a perspective view showing a photomask assembly according to an embodiment of the inventive concept, Figure 3 is an exploded perspective view illustrating a photomask assembly according to an embodiment of the inventive concept.

[0032] In this specification, reference numerals D1, D2, and D3 will be used to represent a first direction, a second direction, and a third direction that are not parallel to each other, respectively. The first direction D1 may be referred to as a vertical direction or an upward direction. In addition, each of the second direction D2 and the third direction D3 may be referred to as a horizontal direction, respectively.

[0033] Reference Figure 2 and Figure 3 The mask assembly MA may include a mask 51 , a stage 53 , a mask electrode 55 and a mask pellicle assembly 3 .

[0034] The photomask 51 may be used for an exposure process. More specifically, the photomask 51 may be provided to include a mask pattern 51a (eg, Figure 5 ), which is used in Figure 1 The desired pattern is formed on the substrate WF. That is, the mask 51 may be a photomask. In one embodiment, the mask 51 may be used for an exposure process performed using EUV light, but the embodiments of the inventive concept are not limited to this example. When viewed in a plan view, the mask 51 may have a rectangular shape. The mask 51 will be described in more detail below.

[0035] The stage 53 can support the photomask 51. That is, the photomask 51 can be set on the stage 53 and supported by the stage 53. To this end, the stage 53 may include an electrostatic chuck (ESC). In this case, the stage 53 may include a chuck electrode (not shown). The electrostatic force applied by the stage 53 can be used to fasten the photomask 51 to a specific position on the stage 53. However, the embodiments of the present invention are not limited to this example, and in one embodiment, the stage 53 may include a vacuum chuck or the like. When viewed in a plan view, the stage 53 may have a rectangular shape, but the embodiments of the present invention are not limited to this example. The stage 53 will be described in more detail below.

[0036] The mask electrode 55 may be connected to the mask 51. For example, the mask electrode 55 may be in contact with the bottom surface of the mask 51. Current may be supplied to the mask 51 through the mask electrode 55. The mask electrode 55 may be formed of or include at least one or more conductive materials. For example, the mask electrode 55 may be formed of or include one or more metallic materials. More specifically, the mask electrode 55 may be formed of or include copper (Cu), silver (Ag) and / or platinum (Pt). At least a portion of the mask electrode 55 may be located between the mask 51 and the stage 53. In one embodiment, a plurality of mask electrodes 55 may be provided. The mask electrodes 55 may be arranged along the edge of the mask 51 and may be spaced apart from each other. For example, the mask electrodes 55 may be arranged along the edge of the bottom surface of the mask 51 and may be spaced apart from each other. More specifically, the mask electrodes 55 may be arranged along the four corners of the mask 51 and may be spaced apart from each other. In the following description, for the sake of brevity, the mask electrodes 55 will be referred to as a single element unless the context clearly indicates otherwise. The mask electrodes 55 will be described in more detail below.

[0037] The pellicle assembly 3 may be located on the reticle 51 and coupled to the reticle 51. The pellicle assembly 3 may include a pellicle 31, a pellicle frame 33, and a pellicle electrode 35.

[0038] The mask pellicle 31 may be located on the mask pellicle frame 33. The mask pellicle 31 may be fastened to a specific position of the mask 51 by the mask pellicle frame 33. The mask pellicle 31 may include a mask pellicle film 311 and a mask pellicle boundary 313.

[0039] The pellicle film 311 may protect the reticle 51. More specifically, the pellicle film 311 may protect the mask pattern 51a (eg, see Figure 5) from the influence of pollutants such as particles. The pellicle membrane 311 may be supported by the pellicle boundary 313. For example, the pellicle membrane 311 may be located on the top surface of the pellicle boundary 313 and connected to the top surface of the pellicle boundary 313. When viewed in a plan view, the pellicle membrane 311 may have a quadrilateral or rectangular shape, but the embodiments of the present invention are not limited to this example. The pellicle membrane 311 may contain carbon. More specifically, the pellicle membrane 311 may include graphite, graphene, carbon nanotubes (CNTs), carbon nanohorns, nanocarbon flakes, nanocrystalline graphite, amorphous carbon, diamond-like carbon (DLC), hydrocarbons and / or graphene oxides. However, the embodiments of the present invention are not limited to this example, and in one embodiment, the pellicle membrane 311 may be formed of various materials having high transmittance to EUV light or include various materials having high transmittance to EUV light. That is, the pellicle film 311 may include molybdenum (Mo), ruthenium (Ru), zirconium (Zr), zirconium carbide (ZrC), boron (B), boron carbide (BxCy), boron nitride (BN), titanium (Ti), tungsten (W), tungsten sulfide (WxSy), niobium (Nb), aluminum (Al), tin (Sn), zinc (Zn) and / or nickel (Ni). If the pellicle film 311 is used for other purposes, other suitable materials may be used for the pellicle film 311.

[0040] The pellicle boundary 313 may support the pellicle film 311. The pellicle film 311 may be fixedly coupled to the top surface of the pellicle boundary 313. The pellicle boundary 313 may have a shape of a quadrilateral or rectangular frame. Therefore, at the center of the pellicle boundary 313, a portion of the pellicle film 311 may be exposed toward the reticle 51. The pellicle boundary 313 will be described in more detail below.

[0041] The mask pellicle frame 33 may support the mask pellicle 31. The mask pellicle 31 may be fastened to a specific position on the mask 51 by the mask pellicle frame 33. The mask pellicle frame 33 may provide a first opening 33h. When viewed in a plan view, the first opening 33h may have a quadrilateral or rectangular shape. The mask pellicle film 311 may be exposed to the mask 51 through the first opening 33h. Light may pass through the mask pellicle film 311 and may be incident on the mask 51. Light reflected by the mask 51 may pass through the mask pellicle film 311 again.

[0042] The mask film electrode 35 may be connected to the mask film 31. For example, the mask film electrode 35 may be connected to the mask film 311 and / or the mask film boundary 313. More specifically, at least a portion of the mask film electrode 35 may be provided on the top surface of the mask film 311 and may be in contact with the top surface of the mask film 311. The mask film electrode 35 may be formed of one or more conductive materials or include one or more conductive materials. For example, the mask film electrode 35 may be formed of one or more metallic materials or include one or more metallic materials. More specifically, the mask film electrode 35 may be formed of copper (Cu), silver (Ag) and / or platinum (Pt) or include copper (Cu), silver (Ag) and / or platinum (Pt). In one embodiment, a plurality of mask film electrodes 35 may be provided. The mask film electrodes 35 may be arranged along the edge of the mask film 31 and may be spaced apart from each other. For example, the mask film electrodes 35 may be arranged along the edge of the top surface of the mask film 311 and may be spaced apart from each other. More specifically, the mask film electrodes 35 may be arranged along the four corners of the mask film 311 and may be spaced apart from each other. In the following description, for the sake of brevity, the mask film electrodes 35 will be referred to as a single element unless the context clearly indicates otherwise. The mask film electrodes 35 will be described in more detail below.

[0043] Figure 4 is a cross-sectional view showing a photomask assembly according to an embodiment of the inventive concept, Figure 5 It is shown Figure 4 An enlarged cross-sectional view of part X, Figure 6 is a plan view illustrating a mask pellicle assembly according to an embodiment of the inventive concept.

[0044] Reference Figure 4 , Figure 5 and Figure 6 The photomask film electrode 35 may include a contact member 351 and a support member 353 .

[0045] The contact member 351 may be provided on the top surface 311u of the mask pellicle film 311 and may contact the top surface 311u of the mask pellicle film 311. The contact member 351 may be located on the mask pellicle boundary 313. More specifically, the contact member 351 may contact the top surface 311u of the mask pellicle film 311 at a position spaced apart from the mask pellicle boundary 313. The mask pellicle boundary 313 may support the contact member 351. Therefore, even when the contact member 351 contacts the mask pellicle film 311, the possibility of the mask pellicle film 311 being damaged by the contact member 351 may be prevented or reduced.

[0046] The support member 353 may be located on the mask pellicle frame 33. The support member 353 may be supported by the mask pellicle frame 33. More specifically, the support member 353 may be supported by the mask pellicle frame 33 in a state where the support member 353 is in contact with the top surface 33u of the mask pellicle frame 33. The mask pellicle electrode 35 may be electrically connected to an external power source (not shown) through an external connection terminal (not shown) connected to the support member 353. The contact member 351 may extend from the support member 353 toward the mask pellicle film 311. The width of the contact member 351 in the horizontal direction may not be greater than the width of the mask pellicle boundary 313 in the horizontal direction. However, the embodiments of the inventive concept are not limited to this example.

[0047] The level of the top surface of the pellicle boundary 313 may be higher than that of the top surface 33u of the pellicle frame 33 in the D1 direction. Therefore, the thickness of the support member 353 may be greater than that of the contact member 351. However, embodiments of the inventive concept are not limited to this example.

[0048] The pellicle frame 33 may further provide a coupling hole (not shown). The coupling hole may be recessed upward from the bottom surface of the pellicle frame 33. The coupling member 6 may be inserted into the coupling hole. The pellicle frame 33 may be positioned on the reticle 51 and coupled to the reticle 51 by the coupling member 6 inserted into the coupling hole.

[0049] The photomask 51 may include a top surface 51u and a bottom surface 51b. A mask pattern 51a may be provided on the top surface 51u of the photomask 51. The mask pattern 51a may be exposed to the photomask pellicle 311 through the first opening 33h. The bottom surface 51b of the photomask 51 may be spaced apart from the top surface 51u of the photomask 51 in a downward direction. The mask electrode 55 may contact the bottom surface 51b of the photomask 51.

[0050] The stage 53 may include a top surface 53u. The top surface 53u of the stage 53 may include a flat surface 53u1 and a support surface 53u2. A protrusion structure 55a may be provided on the support surface 53u2. The protrusion structure 55a may support the photomask 51. More specifically, the top surface of the protrusion structure 55a may contact the bottom surface 51b of the photomask 51 so that the photomask 51 is supported by the protrusion structure 55a. The flat surface 53u1 may at least partially surround the support surface 53u2.

[0051] The photomask electrode 55 may include an insertion member 551 and a coupling member 553. The insertion member 551 may be located between the flat surface 53u1 and the bottom surface 51b of the photomask 51. The insertion member 551 on the flat surface 53u1 may contact the bottom surface 51b of the photomask 51. The coupling member 553 may extend from the insertion member 551 to an area outside the photomask 51. Therefore, the coupling member 553 may be exposed to an external area around the photomask 51. The photomask electrode 55 may be electrically connected to an external power source (not shown) through an external coupling terminal (not shown) connected to the coupling member 553.

[0052] Figure 7 is a flowchart illustrating a mask pellicle measurement method according to an embodiment of the inventive concept.

[0053] Reference Figure 7 , a mask film measurement method Sa can be provided. The mask film measurement method Sa can be a reference Figures 1 to 6 Described (e.g. Figure 2 ) mask pellicle assembly 3 measurement (for example, Figure 3 The present invention relates to a method for measuring the physical and chemical properties of the mask pellicle film 311. More specifically, the mask pellicle measuring method Sa may be a method for measuring the physical and chemical properties of the mask pellicle film 311 using electrical impedance tomography (EIT). To this end, the mask pellicle measuring method Sa may include placing the mask pellicle assembly in an exposure device (in Sa1), supplying current to the mask pellicle electrode (in Sa2), measuring the potential difference between a pair of mask pellicle electrodes (in Sa3), measuring the impedance of the mask pellicle film (in Sa4), and detecting defects of the mask pellicle film (in Sa5).

[0054] Reference Figure 1 , Figure 2 and Figure 7 , placing the pellicle assembly into the exposure device (in Sa1) may include placing the pellicle assembly 3 located on and coupled to the reticle 51 into the exposure device SY. When the pellicle assembly MA is placed in the exposure device SY, the pellicle electrode 35 may be electrically connected to an external power source. When (for example, Figure 3 When the pellicle film 311 is placed in the exposure device SY, the current supply to the pellicle electrode (in Sa2) can be performed. That is, the current can be supplied to the pellicle electrode 35 in the exposure device SY.

[0055] Reference Figure 6 and Figure 7, supplying current to the mask film electrodes (in Sa2) may include supplying current to two mask film electrodes 35 included in the mask film electrodes 35. In one embodiment, the two mask film electrodes 35 to which current is applied may be adjacent to each other. More specifically, if current is supplied to one of the mask film electrodes 35, the current may flow to the outside through the other of the mask film electrodes 35. Supplying current to the two mask film electrodes 35 may be performed sequentially for all the mask film electrodes 35.

[0056] Measuring the potential difference between a pair of mask pellicle electrodes (in Sa3) can be performed on two adjacent mask pellicle electrodes 35 in the mask pellicle electrodes. However, the embodiments of the present invention are not limited to this example, and in one embodiment, measuring the potential difference between a pair of mask pellicle electrodes (in Sa3) can be performed on two non-adjacent mask pellicle electrodes 35 in the mask pellicle electrodes 35. Measuring the potential difference between a pair of mask pellicle electrodes (in Sa3) can be performed during the supply of current to the mask pellicle electrodes (in Sa2). Measuring the potential difference between a pair of mask pellicle electrodes (in Sa3) can be performed on several pairs of mask pellicle electrodes at the same time. That is, the potential difference can be measured from several pairs of mask pellicle electrodes during the supply of current to the mask pellicle electrodes (in Sa2).

[0057] Measuring the impedance of the pellicle film (in Sa4) can be performed using the current supplied to the pellicle electrodes and the measured potential difference. Thus, the impedance and / or conductivity can be measured from several regions of the pellicle film 311.

[0058] Defect detection of the pellicle film (in Sa5) may be performed using information about the measured impedance and / or conductivity of the pellicle film 311. For example, information about the impedance and / or conductivity of the pellicle film 311 may be used to find the location of a hole formed in the pellicle film 311. In other embodiments, information about the impedance and / or conductivity of the pellicle film 311 may be used to find areas of the pellicle film 311 where defects are likely to exist. More specifically, information about the impedance and / or conductivity of the pellicle film 311 may be used to cumulatively collect data about areas of the pellicle film 311 where holes are expected to occur. The collected data may be used to estimate the life of the pellicle film 311.

[0059] Figure 8 is a flowchart illustrating a reticle measurement method according to an embodiment of the present inventive concept.

[0060] Reference Figure 8, a mask measuring method Sb may be provided. The mask measuring method Sb may include placing a mask assembly into an exposure device (in Sb1), supplying current to a mask electrode (in Sb2), measuring a potential difference between a pair of mask electrodes (in Sb3), measuring impedance of the mask (in Sb4), and detecting defects on a bottom surface of the mask (in Sb5).

[0061] Reference Figure 1 , Figure 2 and Figure 8 , placing the mask assembly into the exposure device (in Sb1) may include placing the mask assembly MA in the exposure device SY. When the mask assembly MA is placed in the exposure device SY, the mask electrode 55 may be electrically connected to an external power source. When the mask assembly MA is placed in the exposure device SY, supplying current to the mask electrode (in Sb2) may be performed. That is, in the exposure device SY, current may be supplied to the mask electrode 55.

[0062] Reference Figure 2 and Figure 8 , supplying current to the mask electrode (in Sb2) may include supplying current to two mask electrodes 55 included in the mask electrodes 55. In one embodiment, the two mask electrodes 55 to which current is supplied may be adjacent to each other. More specifically, if current is supplied to one of the paired mask electrodes 55, the current may flow to the outside through the other of the mask electrodes 55. Supplying current to the two mask electrodes 55 may be performed sequentially for all the mask electrodes 55.

[0063] Measuring the potential difference between a pair of mask electrodes (in Sb3) may be performed on two adjacent mask electrodes in the mask electrodes 55. However, embodiments of the present inventive concept are not limited to this example, and in one embodiment, measuring the potential difference between a pair of mask electrodes (in Sb3) may be performed on two mask electrodes in the mask electrodes 55 that are not adjacent to each other. Measuring the potential difference between a pair of mask electrodes (in Sb3) may be performed during the supply of current to the mask electrodes (in Sb2). Measuring the potential difference between a pair of mask electrodes (in Sb3) may be performed on several pairs of mask electrodes at the same time. That is, the potential difference may be measured from several pairs of mask electrodes during the supply of current to the mask electrodes (in Sb2).

[0064] Measuring the impedance of the mask (in Sb4) can be performed using the current supplied to the mask electrode and the measured potential difference. Therefore, the impedance measurement can be performed on several areas of the bottom surface 51b of the mask 51. In one embodiment, the impedance measurement can be performed on all areas of the bottom surface 51b of the mask 51.

[0065] Defect detection of the bottom surface of the photomask (in Sb5) may be performed using information about the measured impedance of the bottom surface 51b of the photomask 51. For example, information about the measured impedance of the bottom surface 51b of the photomask 51 may be used to find an area of ​​the bottom surface 51b of the photomask 51 to which contaminants are attached. In other embodiments, information about the impedance of the bottom surface 51b of the photomask 51 may be used to find a damaged area of ​​the bottom surface 51b of the photomask 51.

[0066] In a pellicle assembly, a pellicle assembly, a pellicle measurement method, and a pellicle measurement method according to an embodiment of the present invention, a damaged portion on a pellicle can be detected. For example, it can be checked whether there are defects (e.g., holes) in the pellicle film and the location of such defects. In addition, it is possible to find areas of the pellicle film where one or more defects are likely to exist, and estimate the life of the pellicle film. Therefore, it is possible to prevent or reduce the possibility of defects on the substrate and contamination problems of the exposure device that may occur when performing an exposure process using a damaged pellicle film.

[0067] In a pellicle assembly, a pellicle assembly, a pellicle measurement method, and a pellicle measurement method according to an embodiment of the present inventive concept, a defect on a bottom surface of a reticle can be detected. More specifically, it can be determined whether there is a defect such as a scratch on the bottom surface of the reticle. Therefore, a reticle cleaning operation can be performed at an appropriate time, which allows an exposure process to be efficiently performed using the reticle without unnecessary interruptions.

[0068] Fig. 9 is an exploded perspective view showing a reticle box according to an embodiment of the inventive concept, Fig.10 is a cross-sectional view showing a reticle box according to an embodiment of the present invention, Fig.11 It is shown Fig.10 An enlarged cross-sectional view of portion Y of FIG.

[0069] Reference Fig. 9 , Fig.10 and Fig.11 A mask box 7 may be provided. The mask box 7 may be configured to temporarily store the mask assembly MA (eg, see Figure 2 ). In addition, the mask box 7 can be used for transporting the mask assembly MA. To this end, the mask box 7 can include a lower box 71 and an upper box 73.

[0070] The lower case 71 may include a lower case body 711 , a lower supporting electrode 713 , and a supporting member 715 .

[0071] The lower box body 711 may provide a lower insertion space 711h. The lower insertion space 711h may be formed to be recessed downward from the top surface of the lower box body 711. The downwardly recessed surface of the lower box body 711 will be referred to as a bottom surface 711b. A portion of the lower insertion space 711h may be defined by the bottom surface 711b. When viewed in a plan view, the lower insertion space 711h may have a quadrilateral or rectangular shape, but embodiments of the inventive concept are not limited to this example.

[0072] The lower support electrode 713 may extend upward from the bottom surface 711b. In other embodiments, the lower support electrode 713 may extend vertically (D1 direction) to penetrate the lower box body 711. The lower support electrode 713 may be formed of or include one or more conductive materials. For example, the lower support electrode 713 may be formed of or include one or more metallic materials. More specifically, the lower support electrode 713 may be formed of or include copper (Cu), silver (Ag) and / or platinum (Pt). The lower support electrode 713 may be connected to (for example, Figure 3 The lower support electrode 713 is in contact with the photomask pellicle 311. In this case, the lower support electrode 713 may be referred to as a photomask pellicle electrode. In one embodiment, a plurality of lower support electrodes 713 may be provided. When viewed in a plan view, the lower support electrodes 713 may be arranged along quadrilateral or rectangular corners and may be spaced apart from each other. However, in the following description, for the sake of brevity, the lower support electrode 713 will be referred to as a single element.

[0073] The support member 715 may extend upward from the bottom surface 711b. The support member 715 may at least partially surround the lower support electrode 713. To this end, the support member 715 may have a hollow cylindrical shape. The support member 715 may be formed of or include one or more insulating materials. The level of the upper end of the support member 715 may not be higher than the level of the upper end of the lower support electrode 713 in the D1 direction. In one embodiment, a plurality of support members 715 may be provided. At least some of the support members 715 may be provided to at least partially surround the lower support electrode 713, as described above. However, unlike the above-described embodiment, other support members in the support member 715 may not surround the lower support electrode 713.

[0074] The upper case 73 may include an upper case body 731 , an upper supporting electrode 733 , and an upper supporting member 735 .

[0075] The upper box body 731 may provide an upper insertion space 731h. The upper insertion space 731h may be formed to be recessed upward from the bottom surface of the upper box body 731. The upwardly recessed surface of the upper box body 731 will be referred to as an inner top surface 731c. A portion of the upper insertion space 731h may be defined by the inner top surface 731c. When viewed in a plan view, the upper insertion space 731h may have a quadrilateral or rectangular shape, but embodiments of the inventive concept are not limited to this example.

[0076] The upper support electrode 733 may extend upward from the inner top surface 731c. In other embodiments, the upper support electrode 733 may extend vertically (D1 direction) to penetrate the upper box body 731. The upper support electrode 733 may be formed of or include one or more conductive materials. For example, the upper support electrode 733 may be formed of or include one or more metallic materials. More specifically, the upper support electrode 733 may be formed of or include copper (Cu), silver (Ag) and / or platinum (Pt). The upper support electrode 733 may be in contact with the photomask 51 (e.g., see Figure 4 ) is in contact with the bottom surface 51b of the upper support electrode 733. In this case, the upper support electrode 733 may be referred to as a mask electrode. In one embodiment, a plurality of upper support electrodes 733 may be provided. When viewed in a plan view, the upper support electrodes 733 may be arranged along quadrilateral or rectangular corners and may be spaced apart from each other. However, in the following description, for the sake of brevity, the upper support electrode 733 will be referred to as a single element.

[0077] The upper support member 735 may extend downward from the inner top surface 731c. The upper support member 735 may be provided to at least partially surround the upper support electrode 733. To this end, the upper support member 735 may have a hollow cylindrical shape. The upper support member 735 may be formed of or include an insulating material. In one embodiment, a plurality of upper support members 735 may be provided. At least some of the upper support members 735 may be provided to at least partially surround the upper support electrode 733, as described above. However, unlike the above-described embodiment, other upper support members in the upper support member 735 may not surround the upper support electrode 733.

[0078] Fig.12 is a flowchart illustrating a mask pellicle measurement method according to an embodiment of the inventive concept.

[0079] In the following description, for the sake of brevity, the previous reference Figures 1 to 11 The described elements may be identified with the same reference numerals without repeating their repeated descriptions.

[0080] Reference Fig.12, a mask film measurement method Sc can be provided. The mask film measurement method Sc can be used to measure the mask film using a reference Figures 9 to 11 Described reticle box 7 measurement reference Figures 2 to 6 The method of measuring physical and chemical properties of the pellicle film 311 is described. To this end, the pellicle measurement method Sc may include placing the pellicle assembly into a reticle box (in Sc1), supplying current to the pellicle electrodes (in Sc2), measuring a potential difference between a pair of pellicle electrodes (in Sc3), measuring the impedance of the pellicle film (in Sc4), and detecting defects of the pellicle film (in Sc5).

[0081] Reference Figures 9 to 11 and Figure 4 , placing the pellicle assembly into the reticle box (in Sc1) may include placing the reticle 51 connected to the pellicle assembly 3 into the reticle box 7. If the pellicle assembly 3 is placed into the reticle box 7, the top surface 311u of the pellicle film 311 may contact the lower support electrode 713. More specifically, on the pellicle boundary 313, the lower support electrode 713 may be provided on the top surface 311u of the pellicle film 311 and may contact the top surface 311u of the pellicle film 311. In other embodiments, the lower support electrode 713 may be provided on the top surface of the pellicle electrode 35 and may contact the top surface of the pellicle electrode 35.

[0082] Supplying current to the pellicle electrode (in Sc2), measuring the potential difference between a pair of pellicle electrodes (in Sc3), measuring the impedance of the pellicle film (in Sc4), and detecting defects of the pellicle film (in Sc5) can be compared with the reference Figure 7 In one embodiment, the lower support electrode 713 can be used as a reference in this process. Figure 4 The photomask film electrode 35 described above is an alternative to the role of the photomask film electrode 35. In this case, the photomask film assembly 3 may not include the photomask film electrode 35. In other embodiments, the photomask film electrode 35 may be supplied with current through the lower support electrode 713.

[0083] Fig.13 is a flowchart illustrating a reticle measurement method according to an embodiment of the present inventive concept.

[0084] In the following description, for the sake of brevity, the previous reference Figures 1 to 12 The described elements may be identified with the same reference numerals without repeating their repeated descriptions.

[0085] Reference Fig.13 , a mask measurement method Sd can be provided. The mask measurement method Sd can be a reference Figures 9 to 11 Described reticle box 7 measurement reference Figures 2 to 6 A method for measuring physical and chemical properties of a photomask 51 is described. To this end, the photomask measuring method Sd may include placing a photomask assembly into a photomask box (in Sd1), supplying current to a photomask electrode (in Sd2), measuring a potential difference between a pair of photomask electrodes (in Sd3), measuring impedance of the photomask (in Sd4), and detecting defects on a bottom surface of the photomask (in Sd5).

[0086] Reference Figure 4 , Fig.11 and Fig.13 , placing the mask assembly into the mask box (in Sd1) may include placing the mask 51 into the mask box 7. If the mask 51 is placed into the mask box 7, the bottom surface 51b of the mask 51 may contact the upper support electrode 733. In other embodiments, the upper support electrode 733 may be provided on the mask electrode 55 and may contact the mask electrode 55.

[0087] Supplying current to the mask electrode (in Sd2), measuring the potential difference between a pair of mask electrodes (in Sd3), measuring the impedance of the mask (in Sd4), and defect detection of the bottom surface of the mask (in Sd5) can be compared with the reference Figure 8 In one embodiment, the upper support electrode 733 can be used as a reference in this process. Figure 4 An alternative to the role of the photomask electrode 55 described above. In other embodiments, the photomask electrode 55 may be supplied with current through the upper support electrode 733.

[0088] In a pellicle assembly, a reticle assembly, a reticle box, a pellicle measuring method, and a reticle measuring method according to an embodiment of the present inventive concept, defects of the pellicle and / or the reticle can be detected during transportation or storage of the pellicle and / or the reticle. Therefore, defects in the pellicle and / or the reticle can be detected in advance before performing an exposure process. This can enable a manufacturing process to be performed relatively efficiently and quickly.

[0089] In a mask pellicle assembly, a mask assembly, a reticle pod, a mask pellicle measuring method, and a reticle measuring method according to an embodiment of the inventive concept, defects in a mask pellicle and / or a reticle may be detected.

[0090] In a reticle pellicle assembly, a reticle assembly, a reticle pod, a reticle pellicle measuring method, and a reticle measuring method according to an embodiment of the inventive concept, a lifetime of a reticle pellicle may be estimated.

[0091] In a pellicle assembly, a reticle assembly, a reticle box, a pellicle measuring method, and a reticle measuring method according to an embodiment of the inventive concept, the pellicle and / or the reticle may be measured during transportation or storage of the pellicle or the reticle.

[0092] While example embodiments of the present inventive concepts have been particularly shown and described, it will be understood by those skilled in the art that changes in form and details may be made therein without departing from the spirit and scope of the appended claims.

[0093] This application claims the priority of Korean Patent Application No. 10-2023-0088627 filed in the Korean Intellectual Property Office on July 7, 2023, the entire contents of which are incorporated herein by reference.

Claims

1. A photomask pellicle assembly, comprising: a mask pellicle frame configured to provide a first opening; a photomask pellicle on the photomask pellicle frame; as well as A plurality of mask pellicle electrodes are arranged along the edge of the mask pellicle and are spaced apart from each other, The photomask pellicle comprises: A mask pellicle border having the shape of a quadrilateral or rectangular frame; and a pellicle membrane located on and coupled to a top surface of the pellicle boundary, Each of the mask pellicle electrodes includes a contact member located on a top surface of the mask pellicle and in contact with the top surface of the mask pellicle.

2. The pellicle assembly according to claim 1, wherein each of the pellicle electrodes further comprises a support member, the support member being located on the pellicle frame and supported by the pellicle frame, and A peripheral portion of the pellicle film is between the contact member and the pellicle boundary, and the contact member extends from the support member toward the pellicle film to contact the top surface of the pellicle film.

3. The pellicle assembly of claim 2, wherein the top surface of the pellicle border is between the peripheral portion of the pellicle film and the top surface of the pellicle frame, and The thickness of the supporting member is greater than the thickness of the contact member. 4 . The pellicle assembly of claim 1 , wherein the pellicle frame further provides a coupling hole recessed upward from a bottom surface of the pellicle frame.

5. The pellicle assembly of claim 1, wherein the pellicle film has a quadrilateral or rectangular shape when viewed in a plan view, and The plurality of mask pellicle electrodes are arranged along four corners of the mask pellicle and are spaced apart from each other.

6. A photomask assembly, comprising: A photomask configured for an exposure process; a stage configured to support the photomask; as well as A plurality of mask electrodes are provided between the mask and the stage, The photomask comprises: a top surface including a mask pattern thereon; and a bottom surface spaced apart from the top surface, wherein each of the photomask electrodes contacts the bottom surface of the photomask, and The plurality of mask electrodes are arranged along an edge of the bottom surface of the mask and are spaced apart from each other.

7. The photomask assembly according to claim 6, wherein the photomask has a quadrilateral or rectangular shape when viewed in a plan view, and The plurality of mask electrodes are arranged along four corners of the mask and are spaced apart from each other.

8. The reticle assembly of claim 6, wherein the stage further comprises an electrostatic chuck having a top surface configured to support the reticle, wherein the top surface of the electrostatic chuck comprises: a support surface on which a protruding structure configured to support the photomask is provided; and a flat surface at least partially surrounding the support surface, Each of the photomask electrodes includes an insert member located between the flat surface and the bottom surface of the photomask. 9 . The photomask assembly of claim 8 , wherein each of the photomask electrodes further comprises a coupling member extending from the insertion member to a region outside the photomask and exposed to the region outside the photomask.

10. The reticle assembly of claim 6, further comprising a reticle pellicle assembly located on and coupled to the reticle, The photomask pellicle assembly includes a photomask pellicle film.

11. The photomask assembly according to claim 10, wherein the photomask pellicle assembly further comprises: a pellicle frame configured to support the pellicle film; and A plurality of pellicle electrodes are arranged along the edge of the pellicle film and are spaced apart from each other.

12. A mask box, comprising: Lower the box; and an upper box, located on the lower box and connected to the lower box, Wherein the lower box comprises: A lower box body configured to provide a lower insertion space; and a plurality of lower support electrodes extending upward from a bottom surface of the lower box body defining the lower insertion space, Wherein when viewed in a plan view, the plurality of lower supporting electrodes are arranged along corners of a quadrilateral or rectangular shape and are spaced apart from each other.

13. The reticle box according to claim 12, wherein the lower box further comprises a plurality of support members extending upward from the bottom surface of the lower box body, and Wherein at least one of the plurality of support members at least partially surrounds a corresponding at least one of the plurality of lower support electrodes.

14. The reticle pod of claim 13, wherein each of the plurality of support members comprises an insulating material, and Each of the lower supporting electrodes comprises a conductive material.

15. The reticle box according to claim 13, wherein, in a case where the bottom surface of the lower box body defines a reference plane, a level of an upper end of each of the plurality of supporting members respectively at least partially surrounding the lower supporting electrodes is equal to or lower than a level of an upper end of each of the lower supporting electrodes.

16. The reticle box according to claim 12, wherein the upper box comprises: An upper box body, configured to provide an upper insertion space; and A plurality of upper support electrodes extending downward from an inner top surface of the upper box body defining the upper insertion space, Wherein when viewed in a plan view, the plurality of upper supporting electrodes are arranged along corners of a quadrilateral or rectangular shape and are spaced apart from each other.

17. A method for measuring a photomask film, comprising: supplying current to two pellicle electrodes included in a plurality of pellicle electrodes arranged along an edge of the pellicle film and spaced apart from each other; measuring a potential difference between a pair of pellicle electrodes selected from the plurality of pellicle electrodes; as well as The impedance of the pellicle film is measured. 18 . The pellicle measuring method according to claim 17 , wherein the two pellicle electrodes to which the current is supplied are adjacent to each other. 19 . The pellicle measuring method according to claim 18 , wherein supplying the current to the two pellicle electrodes is sequentially performed on all of the plurality of pellicle electrodes. 20 . The pellicle measuring method of claim 17 , wherein the measuring of the potential difference between the selected pair of pellicle electrodes is performed on two adjacent pellicle electrodes among the plurality of pellicle electrodes.

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