Packaging piece, chip and electronic device

Abstract

The embodiment of the invention provides a packaging piece, a chip and an electronic device. The packaging piece comprises a substrate, a first tube core, a second tube core, a first structural piece and a second structural piece, wherein the first tube core, the second tube core, the first structural piece and the second structural piece are arranged on the substrate; a first dielectric material is arranged between the first tube core and the second tube core; the first structural component is arranged on one side, far away from the substrate, of the first tube core, and the first tube core is located in an orthographic projection area of the first structural component on the surface of the substrate; the second structural member is arranged on the side, away from the substrate, of the second tube core, the second tube core is located in the orthographic projection area of the second structural member on the surface of the substrate, and an air gap is formed between the first structural member and the second structural member. The first structural member and the second structural member in the packaging member can assist the first tube core and the second tube core to dissipate heat respectively. The first tube core and the second tube core are not directly connected or contacted, and the first structural member and the second structural member are not directly connected or contacted, so that the influence of thermal crosstalk between the tube cores can be reduced, and the heat dissipation effect is improved.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of chips, and more specifically, to a package, a chip, and an electronic device. Background Art

[0002] At present, multiple dies can be integrated in a chip, such as a multi-chip module (MCM) or a 2.5-dimensional (2.5D) package with an interposer. Since each die is a heat source, thermal crosstalk is easily generated between multiple dies. If a component is a 3D (3D) package, the thermal crosstalk will further increase the thermal problem of the 3D component, resulting in an adverse effect on the 3D component. In order to facilitate the thermal management of the chip, a current prior art solution is to set a heat dissipation structure above multiple dies in a chip so that multiple dies share the same heat dissipation resource. However, when the power consumption and / or junction temperature specifications between different dies are quite different, the heat dissipation resources are allocated according to the dies with larger power consumption or lower junction temperature specifications, which is easy to cause a waste of heat dissipation resources. Another prior art solution is to remove the metal protective shell (lid) and thermal interface material (TIM) above multiple dies in a chip, thereby reducing the thermal resistance of the package. However, the chip in this solution still needs to contact the heat sink outside the chip through the TIM, resulting in thermal crosstalk between multiple dies inside the chip, and the heat dissipation effect is not optimal.

[0003] Therefore, how to reduce the impact of thermal crosstalk between multiple dies in a chip and thus improve the heat dissipation effect has become an urgent problem to be solved. Summary of the invention

[0004] Embodiments of the present application provide a package, a chip, and an electronic device. The package can reduce the influence of thermal crosstalk between multiple tube cores inside the package through multiple structural parts, thereby improving the heat dissipation effect.

[0005] In a first aspect, a package is provided. The package includes: a substrate, and a first tube core, a second tube core, a first structure member and a second structure member arranged on the substrate, a first dielectric material is arranged between the first tube core and the second tube core; the first structure member is arranged on a side of the first tube core away from the substrate, and the first tube core is located in an orthographic projection area of ​​the first structure member on the surface of the substrate; the second structure member is arranged on a side of the second tube core away from the substrate, and the second tube core is located in an orthographic projection area of ​​the second structure member on the surface of the substrate, and an air gap is provided between the first structure member and the second structure member.

[0006] In the embodiment of the present application, the first structural member in the package can assist the first tube core in heat dissipation, and the second structural member can assist the second tube core in heat dissipation. Since the first tube core and the second tube core are not directly connected or directly in contact, and the first structural member and the second structural member are not directly connected or directly in contact, thermal isolation between the first tube core and the second tube core can be achieved, thereby reducing the impact of thermal crosstalk between the first tube core and the second tube core, thereby improving the heat dissipation effect.

[0007] In combination with the first aspect, in certain implementations of the first aspect, the edge of the first structural member includes a first bending portion bent toward the substrate, and the first bending portion is connected to the substrate; and / or, the edge of the second structural member includes a second bending portion bent toward the substrate, and the second bending portion is connected to the substrate.

[0008] In the embodiment of the present application, the first structural member can be connected to the substrate through the first bending portion of the edge, so as to be fixed on the substrate to avoid moving or sliding on the surface of the substrate. Similarly, the second structural member can be connected to the substrate through the second bending portion of the edge, so as to be fixed on the substrate to avoid moving or sliding on the surface of the substrate.

[0009] In combination with the first aspect, in some implementations of the first aspect, the first bending portion and / or the second bending portion is stepped.

[0010] In the embodiment of the present application, the first structural member can be connected to the substrate through the first bent portion in a stepped shape, increasing the contact area at the connection with the substrate, thereby adjusting the stress of the substrate to avoid warpage or deformation of the substrate. Similarly, the second structural member can be connected to the substrate through the second bent portion in a stepped shape, increasing the contact area at the connection with the substrate, thereby adjusting the stress of the substrate to avoid warpage or deformation of the substrate.

[0011] In combination with the first aspect, in certain implementations of the first aspect, the first structural member includes a first protruding structure protruding toward the substrate, and the first protruding structure is connected to the substrate; and / or the second structural member includes a second protruding structure protruding toward the substrate, and the second protruding structure is connected to the substrate.

[0012] In the embodiment of the present application, in addition to the first bending portion, the first structural member can also be connected to the substrate through the first protruding structure, so as to adjust the stress of the substrate and prevent the substrate from warping or deformation. Similarly, the second structural member can also be connected to the substrate through the second bending portion and the second protruding structure, so as to achieve the effect of adjusting the stress of the substrate.

[0013] In combination with the first aspect, in some implementations of the first aspect, the second structural member is provided with an opening, and the first structural member is located in the opening of the second structural member.

[0014] In combination with the first aspect, in some implementations of the first aspect, the package further includes a third tube core, the third tube core is disposed on the substrate, and the third tube core is located in the orthographic projection area of ​​the first structure member or the second structure member on the surface of the substrate.

[0015] In an embodiment of the present application, tube cores with relatively small differences in performance (such as power consumption and / or junction temperature specifications) can be divided into a group, so that when multiple tube cores are included in a package, the number of structural parts can be reduced, avoiding the inability to provide air gaps between the structural parts due to the large number of structural parts, resulting in the inability to reduce the impact of thermal crosstalk between the tube cores.

[0016] In combination with the first aspect, in some implementations of the first aspect, the package further includes a first heat sink, which is disposed on a side of the first structure away from the substrate, and a surface of the first heat sink close to the substrate is connected to a surface of the first structure away from the substrate.

[0017] In the embodiment of the present application, the heat dissipated by the first tube core can be transferred to the first structural member, and the heat dissipated by the first structural member can be transferred to the first heat sink, so that the first heat sink can assist the first tube core in dissipating heat.

[0018] In combination with the first aspect, in some implementations of the first aspect, the first heat sink is not in contact with the second structural member.

[0019] In the embodiment of the present application, the first heat sink is not in direct contact or connection with the second structural member, so that the first heat sink can be used only to assist the first tube core in dissipating heat, thereby avoiding the mutual transfer of heat dissipated by the first tube core and the heat dissipated by the second tube core, thereby reducing the impact of thermal crosstalk between the tube cores.

[0020] In combination with the first aspect, in some implementations of the first aspect, the package further includes a second heat sink, which is disposed on a side of the second structure away from the substrate, and a surface of the second heat sink close to the substrate is connected to a surface of the second structure away from the substrate.

[0021] In the embodiment of the present application, the heat dissipated by the second tube core can be transferred to the second structural member, and the heat dissipated by the second structural member can be transferred to the second heat sink, so that the second tube core can be assisted in heat dissipation by the second heat sink.

[0022] In combination with the first aspect, in some implementations of the first aspect, the second heat sink is not in contact with the first structural member.

[0023] In the embodiment of the present application, the second heat sink is not in direct contact or connection with the first structural member, so that the second heat sink can be used only to assist the second tube core in dissipating heat, thereby avoiding the mutual transfer of heat dissipated by the first tube core and the heat dissipated by the second tube core, thereby reducing the impact of thermal crosstalk between the tube cores.

[0024] In combination with the first aspect, in some implementations of the first aspect, an air gap is provided between the first heat sink and the second heat sink.

[0025] In the embodiment of the present application, the first heat sink and the second heat sink are not in direct contact or directly connected, so that no heat is transferred between the first heat sink and the second heat sink, thereby reducing the impact of thermal crosstalk between the tube cores.

[0026] In combination with the first aspect, in certain implementations of the first aspect, the second heat sink includes a first heat dissipation part and a second heat dissipation part, the surface of the first heat dissipation part close to the substrate is connected to the surface of the second structural member away from the substrate, and the second heat dissipation part is arranged at an angle to the first heat dissipation part in a plane parallel to the substrate.

[0027] In the embodiment of the present application, the second heat sink may be provided with a first heat sink portion and a second heat sink portion, thereby increasing the heat sink area and improving the heat sink effect. Furthermore, by adjusting the angle between the first heat sink portion and the second heat sink portion, the heat sink air ducts of the second heat sink and the first heat sink do not affect each other, thereby further improving the heat sink effect.

[0028] In combination with the first aspect, in some implementations of the first aspect, the second radiator forms a first avoidance space, and the first radiator is located in the first avoidance space.

[0029] In the embodiment of the present application, the first radiator can be arranged in the first avoidance space of the second radiator so that the heat dissipation ducts of the two radiators do not affect each other, and the space can be reasonably utilized, thereby reducing the overall volume of the package.

[0030] In combination with the first aspect, in some implementations of the first aspect, the first heat sink includes a protruding portion protruding toward the substrate, and the protruding portion is accommodated in the first avoidance space.

[0031] In combination with the first aspect, in some implementations of the first aspect, a surface of the protrusion close to the substrate is connected to a surface of the first structure member away from the substrate.

[0032] In the embodiment of the present application, the first heat sink can be connected to the first structure through the protrusion accommodated in the first avoidance space, thereby assisting the first tube core in heat dissipation. The first heat sink can also include other parts besides the protrusion, thereby increasing the heat dissipation area and improving the heat dissipation effect.

[0033] In a second aspect, a chip is provided, comprising the package as described in the first aspect or any possible implementation of the first aspect.

[0034] In a third aspect, an electronic device is provided. The electronic device includes the package described in the first aspect or any possible implementation of the first aspect. Alternatively, the electronic device includes the chip described in the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic cross-sectional view of a package.

[0036] Figure 2 is a schematic top view of a package according to an embodiment of the present application.

[0037] Figure 3 is a schematic cross-sectional view of a package according to an embodiment of the present application.

[0038] Figure 4 is a schematic cross-sectional view of a package according to another embodiment of the present application.

[0039] Figure 5 is a schematic top view of a package according to another embodiment of the present application.

[0040] Figure 6 is a schematic top view of a package according to another embodiment of the present application.

[0041] Figure 7 is a schematic cross-sectional view of a package according to another embodiment of the present application.

[0042] Figure 8 is a schematic top view of a package according to another embodiment of the present application.

[0043] Fig. 9 is a schematic cross-sectional view of a package according to another embodiment of the present application.

[0044] Fig.10 is a schematic top view of a package according to another embodiment of the present application.

[0045] Fig.11 is a schematic top view of a package according to another embodiment of the present application.

[0046] Fig.12 is a schematic cross-sectional view of a package according to another embodiment of the present application.

[0047] Fig.13 is a schematic top view of a package according to another embodiment of the present application.

[0048] Fig.14 It is a schematic structural diagram of a radiator according to an embodiment of the present application.

[0049] Fig.15 It is a schematic diagram of the structure of a heat sink and a connector according to an embodiment of the present application. DETAILED DESCRIPTION

[0050] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0051] In the embodiments of the present application, words such as "exemplary" and "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of the word "exemplary" is intended to present concepts in a concrete way.

[0052] The business scenario described in the embodiments of the present application is intended to more clearly illustrate the technical solutions of the embodiments of the present application, and does not constitute a limitation on the technical solutions provided in the embodiments of the present application. A person of ordinary skill in the art can appreciate that, with the evolution of technology, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0053] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0054] In the embodiments of the present application, "at least one" refers to one or more, and "plurality" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can be represented by: including the existence of A alone, the existence of A and B at the same time, and the existence of B alone, where A and B can be singular or plural. The character " / " generally indicates that the previous and subsequent associated objects are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can be represented by: a, b, c, ab, ac, bc, or abc, where a, b, c can be single or multiple.

[0055] The technical solution in the embodiment of the present application can be applied to a package or chip including multiple dies. The embodiment of the present application does not limit the type of each die in the multiple dies, for example, it can be a logic chip, a high bandwidth memory chip (HBM), etc.

[0056] Figure 1 is a schematic diagram of a package. Figure 1 The package 100 in the embodiment includes a substrate 110, a first tube die 120 and a second tube die 130. The first tube die 120 or the second tube die 130 may be, for example, a logic chip or an HBM. The first tube die 120 and the second tube die 130 are arranged on the substrate 110 and connected to the substrate 110. The first tube die 120 and the second tube die 130 both generate heat during operation, resulting in a thermal crosstalk problem between the two tube die.

[0057] exist Figure 1 In the embodiment, the direction from the first tube core 120 to the second tube core 130 is the y-axis direction, and the direction from the substrate 110 to the first tube core 120 is the z-axis direction.

[0058] Figure 2 It is a schematic top view of a package provided in an embodiment of the present application. Figure 2 The package 200 in the embodiment includes a substrate 210, a first tube die 220, a second tube die 230, a first structure member 240 and a second structure member 250. The first tube die 220, the second tube die 230, the first structure member 240 and the second structure member 250 are all disposed on the substrate 210.

[0059] like Figure 2 As shown, the direction from the first tube core 220 to the second tube core 230 is the y-axis direction, and the direction perpendicular to the y-axis direction on the plane where the substrate 210 is located is the x-axis direction. In addition, the direction from the substrate 210 to the first tube core 220 is the z-axis direction ( Figure 2 not shown).

[0060] The embodiment of the present application does not limit the specific type of the substrate 210. For example, the substrate 210 can be a substrate, a printed circuit board (PCB), etc.

[0061] The embodiment of the present application does not limit the specific types of the first die 220 and the second die 230. For example, the first die 220 and / or the second die 230 may be a logic chip or an HBM. The first die 220 and the second die 230 may be dies of the same type or different types. The package 200 may include multiple first dies and / or multiple second dies.

[0062] A first dielectric material may be filled between the first tube core 220 and the second tube core 230, that is, the first tube core 220 and the second tube core 230 are not directly connected or directly in contact. The first dielectric material may fix the first tube core 220 and the second tube core 230, so that the first tube core 220 and the second tube core 230 are not easy to move. The first dielectric material may also have a heat insulation effect, so that the heat emitted by the first tube core 220 and the second tube core 230 is not easy to transfer to each other. The embodiment of the present application does not limit the specific type or composition of the first dielectric material.

[0063] In some embodiments, the upper surface of the first die 220 and / or the second die 230 may be planar or non-planar. The upper surface of the first die 220 is the surface of the first die 220 away from the substrate 210. The upper surface of the second die 230 is the surface of the second die 230 away from the substrate 210.

[0064] When the upper surfaces of the first tube core 220 and the second tube core 230 are planes, the height of the upper surface of the first tube core 220 relative to the upper surface of the substrate 210 and the height of the upper surface of the second tube core 230 relative to the upper surface of the substrate 210 may be the same or different, and the embodiments of the present application are not limited to this.

[0065] The first structural member 240 is disposed on a side of the first tube core 220 away from the substrate 210. That is, in the z-axis direction, the substrate 210 is disposed at the bottom layer, the first tube core 220 is disposed at the upper layer of the substrate 210, and the first structural member 240 is disposed at the upper layer of the first tube core 220. The first tube core 220 is located within the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210. The orthographic projection is a projection generated by parallel projection lines perpendicular to the substrate 210, and the orthographic projection area is an area formed by the orthographic projection. In other words, the upper surface of the first tube core 220 can be covered by the orthographic projection of the first structural member 240 toward the substrate 210.

[0066] The first structure member 240 can be used for heat conduction or heat dissipation, and thus can be used to receive heat from the first tube core 220. The embodiment of the present application does not limit the specific material of the first structure member 210.

[0067] In some embodiments, a first heat conductive material is filled between the first structure 240 and the first tube core 220. The first heat conductive material is used to transfer the heat emitted by the first tube core 220 to the first structure 240. The embodiment of the present application does not limit the specific type or composition of the first heat conductive material.

[0068] The second structure 250 is disposed on a side of the second tube core 230 away from the substrate 210. That is, in the z-axis direction, the substrate 210 is disposed at the bottom layer, the second tube core 230 is disposed at the upper layer of the substrate 210, and the second structure 250 is disposed at the upper layer of the second tube core 230. The second tube core 230 is located within the orthographic projection area of ​​the second structure 250 on the surface of the substrate 210. In other words, the upper surface of the second tube core 230 can be covered by the orthographic projection of the second structure 250 toward the substrate 210.

[0069] The second structural member 250 can be used for heat conduction or heat dissipation, and thus can be used to receive heat from the second tube core 230. The embodiment of the present application does not limit the specific material of the second structural member 250. The materials of the first structural member 240 and the second structural member 250 can be the same or different, and the embodiment of the present application does not limit this. The package 200 may include multiple first structural members and / or multiple second structural members, and an air gap is set between each structural member.

[0070] In some embodiments, a second heat-conducting material is filled between the second structural member 250 and the second tube core 230. The second heat-conducting material is used to transfer the heat emitted by the second tube core 230 to the second structural member 250. The embodiment of the present application does not limit the specific type or composition of the second heat-conducting material. The first heat-conducting material and the second heat-conducting material can be the same or different.

[0071] There is an air gap between the first structure member 240 and the second structure member 250. That is, the first structure member 240 and the second structure member 250 are not directly connected or directly contacted, so that a heat insulation effect can be achieved, thereby preventing the heat generated by the first tube core 220 and the second tube core 230 from being transferred to each other, that is, reducing the influence of thermal crosstalk between the first tube core 220 and the second tube core 230.

[0072] In some embodiments, the upper surface of the first structure member 240 and / or the second structure member 250 may be a plane or a non-plane. The upper surface of the first structure member 240 is the surface of the first structure member 240 away from the substrate 210. The upper surface of the second structure member 250 is the surface of the second structure member 250 away from the substrate 210.

[0073] When the upper surfaces of the first structural member 240 and the second structural member 250 are planes, the height of the upper surface of the first structural member 240 relative to the upper surface of the substrate 210 and the height of the upper surface of the second structural member 250 relative to the upper surface of the substrate 210 may be the same or different, and the embodiments of the present application are not limited to this.

[0074] Optionally, the edge of the first structure member 240 may include a first bending portion bent toward the substrate 210 , and the first bending portion is connected to the substrate 210 .

[0075] In some embodiments, the first structure member 240 may include at least one first bending portion, and each first bending portion may be bent toward the substrate 210. Each first bending portion may be connected to the substrate 210.

[0076] In some embodiments, the cross section of the first bending portion along the plane where the x-axis and the z-axis are located can be a straight line, such as Figure 3 When the section of the first bending portion along the plane where the x-axis and the z-axis are located is a straight line, the first bending portion can be arranged at an angle with the substrate, and the angle can be an acute angle, a right angle or an obtuse angle.

[0077] Figure 3 It is a cross-sectional schematic diagram of the package provided in an embodiment of the present application. Figure 3 It is a schematic diagram of a section along the plane where the x-axis and the z-axis are located. Figure 3 The invention comprises a substrate 210, a first tube core 220 and a first structural member 240. The first tube core 220 is arranged on the substrate 210, and the first tube core 220 is located in the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210. The two edges of the first structural member 240 each include a first bending portion 241, and each first bending portion 241 is bent toward the substrate 210. The cross section of each first bending portion 241 along the plane where the x-axis and the z-axis are located is linear, and each first bending portion 241 is arranged at a right angle to the substrate 210. That is, each first bending portion 241 is vertically connected to the substrate 210 in a straight line.

[0078] In some embodiments, the cross section of the first bending portion along the plane where the x-axis and the z-axis are located can be non-linear, and the non-linear shape includes a folded line shape and a curved line shape. A schematic diagram of a cross section of the first bending portion along the plane where the x-axis and the z-axis are located being a folded line shape is shown in FIG. Figure 4 shown.

[0079] Figure 4 It is another cross-sectional schematic diagram of the package provided in the embodiment of the present application. Figure 4 It is a schematic diagram of a section along the plane where the x-axis and the z-axis are located. Figure 4 The substrate 210, the first tube core 220 and the first structural member 240 are included. The first tube core 220 is arranged on the substrate 210, and the first tube core 220 is located in the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210. The two edges of the first structural member 240 each include a first bending portion 241, and each first bending portion 241 is bent toward the substrate 210. Each first bending portion 241 is stepped, and each first bending portion 241 is connected to the substrate 210 at the bottom in the z-axis direction. In other words, each first bending portion 241 can be "L"-shaped, and the bottom of the "L" shape is connected to the substrate 210. That is, the cross-section of each first bending portion 241 along the plane where the x-axis and the z-axis are located is a broken line.

[0080] When the first structural member 240 includes a plurality of first bending portions, the shapes of each first bending portion may be the same. Alternatively, the shapes of at least two of the plurality of first bending portions may be different, which is not limited in the embodiment of the present application.

[0081] Optionally, the edge of the second structure member 250 may include a second bent portion bent toward the substrate 210 , and the second bent portion is connected to the substrate 210 .

[0082] In some embodiments, the second structural member 250 may include at least one second bending portion, and the shapes of each second bending portion may be the same. Alternatively, the shapes of at least two of the plurality of second bending portions may be different.

[0083] In some embodiments, similar to the first bending portion, the cross-section of the second bending portion along the plane where the x-axis and the z-axis are located can be linear or non-linear. Figure 3 or Figure 4 The first bending portion 241 in FIG. 2 is similar and will not be described again here.

[0084] When the first structural member 240 includes a first bend and the second structural member 250 includes a second bend, the shapes of the first bend and the second bend may be the same or different. When the first structural member 240 includes a first bend and the second structural member 250 includes a plurality of second bends, the first bend may be the same or different in shape from at least one of the plurality of second bends. Similarly, when the first structural member 240 includes a plurality of first bends and the second structural member 250 includes a second bend, the second bend may be the same or different in shape from at least one of the plurality of first bends. When the first structural member 240 includes a plurality of first bends and the second structural member 250 includes a plurality of second bends, each first bend may be the same or different in shape from at least one of the plurality of second bends.

[0085] Optionally, the first structure member 240 may include a first protruding structure protruding toward the substrate 210 , and the first protruding structure is connected to the substrate 210 .

[0086] In some embodiments, the first structure member 240 may include at least one first protruding structure, each of which is connected to the substrate 210 .

[0087] In some embodiments, the cross section of the first protrusion structure along the plane where the x-axis and the z-axis are located can be a straight line, such as Figure 4When the cross section of the first protrusion structure along the plane where the x-axis and the z-axis are located is a straight line, the first protrusion structure can be arranged at an angle with the substrate, and the angle can be an acute angle, a right angle or an obtuse angle.

[0088] like Figure 4 As shown, Figure 4 The first structural member 240 in the embodiment further includes a first protruding structure 242. The first protruding structure 242 protrudes toward the substrate 210. The cross section of the first protruding structure 242 along the plane where the x-axis and the z-axis are located is linear, and the first protruding structure 242 is arranged at a right angle to the substrate 210. That is, the first protruding structure 242 is vertically connected to the substrate 210 in a straight line.

[0089] In some embodiments, the cross section of the first protrusion structure along the plane where the x-axis and the z-axis are located can be non-linear, and the non-linear shape includes a folded line shape and a curved line shape. Figure 4 The structure of the first bending portion 241 is similar to that shown in FIG. 2 and will not be repeated here.

[0090] When the first structural member 240 includes a plurality of first protruding structures, each of the first protruding structures may have the same shape. Alternatively, at least two of the plurality of first protruding structures may have different shapes, which is not limited in the embodiment of the present application.

[0091] Optionally, the second structure member 250 may include a second protruding structure protruding toward the substrate 210 , and the second protruding structure is connected to the substrate 210 .

[0092] In some embodiments, the second structural member 250 may include at least one second protruding structure, and each second protruding structure may have the same shape. Alternatively, at least two of the plurality of second protruding structures may have different shapes.

[0093] In some embodiments, similar to the first protruding structure, the cross-section of the second protruding structure along the plane where the x-axis and the z-axis are located can be linear or non-linear. Figure 4 The first protrusion structure 242 or the first bending portion 241 is similar and will not be described again here.

[0094] When the first structural member 240 includes a first protruding structure and the second structural member 250 includes a second protruding structure, the shapes of the first protruding structure and the second protruding structure may be the same or different. When the first structural member 240 includes a first protruding structure and the second structural member 250 includes a plurality of second protruding structures, the first protruding structure may be the same or different in shape from at least one of the plurality of second protruding structures. Similarly, when the first structural member 240 includes a plurality of first protruding structures and the second structural member 250 includes a second protruding structure, the second protruding structure may be the same or different in shape from at least one of the plurality of first protruding structures. When the first structural member 240 includes a plurality of first protruding structures and the second structural member 250 includes a plurality of second protruding structures, each first protruding structure may be the same or different in shape from at least one of the plurality of second protruding structures.

[0095] Optionally, the orthographic projection areas of the first structure member 240 and the second structure member 250 on the surface of the substrate 210 may partially overlap or not overlap at all. When the orthographic projection areas of the first structure member 240 and the second structure member 250 on the surface of the substrate 210 do not overlap at all, Figure 2 or Figure 5 When the orthographic projection areas of the first structural member 240 and the second structural member 250 partially overlap on the surface of the substrate 210, as shown in FIG. Figure 6 shown.

[0096] In some embodiments, the first structure member 240 and the second structure member 250 may be arranged side by side so that the orthographic projection areas of the first structure member 240 and the second structure member 250 on the surface of the substrate 210 do not overlap at all. Figure 2 shown.

[0097] In some embodiments, the second structural member 250 may be provided with an opening, and the first structural member 240 may be located in the opening of the second structural member 250, so that the orthographic projection areas of the first structural member 240 and the second structural member 250 on the surface of the substrate 210 do not overlap at all or partially overlap, such as Figure 5 or Figure 6 shown.

[0098] Figure 5 It is a schematic top view of a package provided in an embodiment of the present application. Figure 5The substrate 210, the first tube core 220, the second tube core 230, the first structure 240 and the second structure 250 are included. The orthographic projection area of ​​the first structure 240 on the surface of the substrate 210 is the first area, and the orthographic projection area of ​​the opening of the second structure 250 on the surface of the substrate 210 is the second area. The first tube core 220 is located in the first area. The second tube core 230 is located in the orthographic projection area of ​​the second structure 250 except the opening on the surface of the substrate 210. The first area is located in the second area. The length of the first area in the x-axis direction is less than the length of the second area in the x-axis direction, and the length of the first area in the y-axis direction is less than the length of the second area in the y-axis direction. In other words, the area of ​​the first area is less than the area of ​​the second area. That is, the orthographic projection areas of the first structure 240 and the second structure 250 on the surface of the substrate 210 do not overlap at all.

[0099] Figure 6 It is a schematic top view of a package provided in an embodiment of the present application. Figure 6 The substrate 210, the first tube core 220, the second tube core 230, the first structure 240 and the second structure 250 are included. The orthographic projection area of ​​the first structure 240 on the surface of the substrate 210 is the first area, and the orthographic projection area of ​​the opening of the second structure 250 on the surface of the substrate 210 is the second area. The first tube core 220 is located in the first area. The second tube core 230 is located in the orthographic projection area of ​​the second structure 250 except the opening on the surface of the substrate 210. A part of the first area is located in the second area, and another part of the first area is located in the second area. The length of the first area in the x-axis direction is greater than or equal to the length of the second area in the x-axis direction, that is, the orthographic projection areas of the first structure 240 and the second structure 250 on the surface of the substrate 210 partially overlap.

[0100] For example, when the orthographic projection areas of the first structure member 240 and the second structure member 250 on the surface of the substrate 210 partially overlap, the length of the first area in the x-axis direction may be greater than or equal to the length of the second area in the x-axis direction, such as Figure 6 Alternatively, when the orthographic projection areas of the first structural member 240 and the second structural member 250 on the surface of the substrate 210 partially overlap, the length of the first area in the y-axis direction may be greater than or equal to the length of the second area in the y-axis direction. Alternatively, when the orthographic projection areas of the first structural member 240 and the second structural member 250 on the surface of the substrate 210 partially overlap, the area of ​​the first area may be greater than or equal to the area of ​​the second area.

[0101] When the first structure member 240 and the second structure member 250 partially overlap in the orthographic projection area on the surface of the substrate 210, a cross-sectional schematic diagram of the package is as follows: Figure 7shown. Figure 7 It is a cross-sectional schematic diagram of the package provided in an embodiment of the present application. Figure 7 It is a schematic diagram of a section along the plane where the x-axis and the z-axis are located. Figure 7 The substrate 210, the first tube core 220, the first structural member 240 and the second structural member 250 are included. The first tube core 220 is located in the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210. The edge of the first structural member 240 includes a first bending portion 241, and the first bending portion 241 is stepped. The first bending portion 241 is formed with a second avoidance space 243, and the second avoidance space 243 is located on the side of the first bending portion 241 away from the first tube core 220. The edge portion of the second structural member 250 can be accommodated in the second avoidance space 243. In addition, there is an air gap between the edge portion of the second structural member 250 and the first bending portion 241, that is, the edge portion of the second structural member 250 is not directly connected or directly in contact with the first bending portion 241.

[0102] Optionally, the package 200 may further include at least one third tube core. The third tube core may be arranged on the substrate 210. The third tube core is located within the orthographic projection area of ​​the first structure member 240 or the second structure member 250 on the surface of the substrate 210. That is, the first structure member 240 or the second structure member 250 may be provided with at least one tube core within the orthographic projection area of ​​the surface of the substrate 210. Similar to the first tube core 220 and the second tube core 230, the embodiment of the present application does not limit the specific type of the third tube core. The third tube core may be the same or different from the type of the first tube core 220 and / or the second tube core 230.

[0103] When the third tube core is arranged in the orthographic projection area of ​​the second structure 250 on the surface of the substrate 210, the third tube core and the second tube core 230 can be arranged on the same side or different sides of the first tube core 220, which is not limited in the embodiment of the present application.

[0104] For example, the third die may be disposed on a side of the first die 220 away from the second die 230, such as Figure 6 shown. Figure 6 The substrate 210 further includes a third tube core 260. The third tube core 260 is disposed in the orthographic projection area of ​​the second structure 250 on the surface of the substrate 210. In addition, the first tube core 220 is disposed between the second tube core 230 and the third tube core 260.

[0105] In some embodiments, the specific positions of the first die, the second die, and the third die can be determined according to any one or more properties of the first die, the second die, and the third die, such as power consumption, junction temperature specification, height, etc. The junction temperature specification of each die may include the long-term maximum operating temperature specification, the extreme maximum operating temperature specification, or the high reliability recommended temperature specification of each die, etc., which is not limited in the embodiments of the present application. It should be understood that the specific positions of the first die, the second die, and the third die can also be determined according to other properties or other performances of the first die, the second die, and the third die, and the embodiments of the present application do not limit the specific properties or specific performances.

[0106] For example, assuming that the power consumption difference between the third die 260 and the first die 220 is less than the first preset threshold, the third die 260 can be disposed together with the first die 220 in the orthographic projection area of ​​the first structure member 240 on the surface of the substrate 210. Alternatively, assuming that the difference in junction temperature specifications between the third die 260 and the first die 220 is less than the second preset threshold, the third die 260 can be disposed together with the first die 220 in the orthographic projection area of ​​the first structure member 240 on the surface of the substrate 210. Alternatively, assuming that the power consumption difference between the third die 260 and the first die 220 is less than the first preset threshold, and the difference in junction temperature specifications between the third die 260 and the first die 220 is less than the second preset threshold, the third die can be disposed together with the first die 220 in the orthographic projection area of ​​the first structure member 240 on the surface of the substrate 210. Alternatively, assuming that the heights of the third tube core 260 and the first tube core 220 are both less than the third preset threshold, and the height of the second tube core 230 is greater than or equal to the third preset threshold, the third tube core can be arranged together with the first tube core 220 in the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210. The embodiment of the present application does not limit the specific values ​​of the first preset threshold, the second preset threshold, and the third preset threshold, and can be set according to actual needs. The first preset threshold, the second preset threshold, and the third preset threshold can be the same, or at least two of the first preset threshold, the second preset threshold, and the third preset threshold can be different.

[0107] In some embodiments, the material, volume, thermal conductivity and other parameters of the structural parts corresponding to each tube core can be adjusted according to any one or more properties of each tube core, such as power consumption, junction temperature specification or height, so as to adjust the heat dissipation resources corresponding to each tube core as needed, thereby achieving a better heat dissipation effect without wasting heat dissipation resources. For example, the material, volume, thermal conductivity and other parameters of the first structural part can be adjusted according to any one or more properties of the first tube core, such as function, junction temperature specification or height, so as to achieve a better heat dissipation effect.

[0108] Optionally, the package 200 may further include at least one first heat sink. The first heat sink is disposed on a side of the first structure 240 away from the substrate 210, and a surface of the first heat sink close to the substrate 210 is connected to a surface of the first structure 240 away from the substrate 210. The first heat sink may receive heat from the first structure 240, thereby assisting the first die 220 in heat dissipation.

[0109] In some embodiments, the first structural member 240 partially overlaps with the orthographic projection area of ​​the first heat sink on the surface of the substrate 210. The embodiment of the present application does not limit the size relationship between the first heat sink and the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210. For example, the orthographic projection area of ​​the first heat sink on the surface of the substrate 210 may be less than or equal to the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210. Alternatively, the orthographic projection area of ​​the first heat sink on the surface of the substrate 210 may be greater than the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210, such as Figure 8 shown.

[0110] Figure 8 It is a schematic top view of a package provided in an embodiment of the present application. Figure 8 The invention comprises a substrate 210, a first tube core 220, a first structure 240, and a first heat sink 270. The first tube core 220 is located in the orthographic projection area of ​​the first structure 240 on the surface of the substrate 210, and the first structure 240 is located in the orthographic projection area of ​​the first heat sink 270 on the surface of the substrate 210.

[0111] In some embodiments, the first heat sink 270 is not in contact with the second structure 250. That is, the first heat sink 270 and the second structure 250 are not in direct or indirect contact, so that the first heat sink 270 does not receive heat from the second die 230, thereby reducing the influence of thermal crosstalk between the first die 220 and the second die 230.

[0112] In some embodiments, the second structural member 250 and the first heat sink 270 partially overlap or do not overlap in the orthographic projection area of ​​the substrate 210 surface. When the second structural member 250 and the first heat sink partially overlap in the orthographic projection area of ​​the substrate 210 surface, there is an air gap between the second structural member 250 and the first heat sink 270. When the second structural member 250 and the first heat sink 270 do not overlap in the orthographic projection area of ​​the substrate 210 surface, the second structural member 250 and the first heat sink 270 have an air gap. Figure 8 shown.

[0113] like Figure 8 As shown, Figure 8The heat sink 270 further includes a second tube core 230 and a second structure member 250. The second tube core 230 is located in the orthographic projection area of ​​the second structure member 250 on the surface of the substrate 210. The second structure member 250 and the first structure member 240 are arranged side by side, and an air gap is provided at the portion where the second structure member 250 and the first structure member 240 are close to each other, so that the orthographic projection area of ​​the second structure member 250 and the first heat sink 270 on the surface of the substrate 210 does not overlap at all.

[0114] In some embodiments, the first heat sink 270 is directly connected to the first structural member 240. Alternatively, the first heat sink 270 is connected to the first structural member 240 via a third heat conductive material, such as Fig. 9 shown.

[0115] Fig. 9 It is a cross-sectional schematic diagram of the package provided in an embodiment of the present application. Fig. 9 It is a schematic diagram of the cross section along the plane where the x-axis and z-axis are located. Fig. 9 The present invention comprises a substrate 210, a first tube core 220, a first structural member 240, a third thermally conductive material and a first heat sink 270. In the z-axis direction, the substrate 210 is located at the bottom layer, the first tube core 220 and the first structural member 240 are located at the upper layer of the substrate 210, and the first tube core 220 is located in the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210. The third thermally conductive material is located at the upper layer of the first structural member 240, and can connect the first structural member 240 and the first heat sink 270. That is, the first heat sink 270 is located at the upper layer of the third thermally conductive material. The third thermally conductive material can be used to transfer the heat in the first structural member 240 to the first heat sink 270, thereby helping the first tube core 220 to dissipate heat. The embodiment of the present application does not limit the specific type or composition of the third thermally conductive material.

[0116] Optionally, the package 200 may further include at least one second heat sink. The second heat sink is disposed on a side of the second structure 250 away from the substrate 210, and a surface of the second heat sink close to the substrate 210 is connected to a surface of the second structure 250 away from the substrate 210. The second heat sink may receive heat from the second structure 250, thereby assisting the second die 230 in heat dissipation.

[0117] In some embodiments, the second structural member 250 partially overlaps with the orthographic projection area of ​​the second heat sink on the surface of the substrate 210. The embodiment of the present application does not limit the size relationship between the area of ​​the orthographic projection area of ​​the second heat sink and the second structural member 250 on the surface of the substrate 210. For example, the area of ​​the orthographic projection area of ​​the second heat sink on the surface of the substrate 210 may be less than or equal to the area of ​​the orthographic projection area of ​​the second structural member 250 on the surface of the substrate 210. Alternatively, the area of ​​the orthographic projection area of ​​the second heat sink on the surface of the substrate 210 may be greater than the area of ​​the orthographic projection area of ​​the second structural member 250 on the surface of the substrate 210, such as Figure 8 shown.

[0118] Figure 8 A second radiator 280 is also included. Figure 8 The second tube core 230 is located in the orthographic projection area of ​​the second structure 250 on the surface of the substrate 210, and the second structure 250 is located in the orthographic projection area of ​​the second heat sink 280 on the surface of the substrate 210.

[0119] In some embodiments, the second heat sink 280 is not in contact with the first structure 240. That is, the second heat sink 280 is not in direct or indirect contact with the first structure 240, so that the second heat sink 280 does not receive heat from the first die 220, thereby reducing the influence of thermal crosstalk between the first die 220 and the second die 230.

[0120] In some embodiments, the first structural member 240 and the second heat sink 280 partially overlap or completely do not overlap in the orthographic projection area of ​​the substrate 210 surface. When the first structural member 240 and the second heat sink 280 partially overlap in the orthographic projection area of ​​the substrate 210 surface, there is an air gap between the first structural member 240 and the second heat sink 280. When the first structural member 240 and the second heat sink 280 completely do not overlap in the orthographic projection area of ​​the substrate 210 surface, there is an air gap between the first structural member 240 and the second heat sink 280. Figure 8 shown. Figure 8 The second structure member 250 and the first structure member 240 are arranged side by side, and the orthographic projection areas of the first structure member 240 and the second heat sink 280 on the surface of the substrate 210 do not overlap at all.

[0121] In some embodiments, the second heat sink 280 is directly connected to the second structural member 250. Alternatively, the second heat sink 280 is connected to the second structural member 250 through a fourth thermal conductive material. Fig. 9 The fourth heat-conducting material can be used to transfer the heat in the second structural member 250 to the second heat sink 280, thereby helping the second tube core 230 to dissipate heat. The embodiment of the present application does not limit the specific type or composition of the fourth heat-conducting material.

[0122] It should be understood that the first thermally conductive material, the second thermally conductive material, the third thermally conductive material and the fourth thermally conductive material may be the same thermally conductive material. Alternatively, at least two of the first thermally conductive material, the second thermally conductive material, the third thermally conductive material and the fourth thermally conductive material may be different thermally conductive materials, which is not limited in the embodiments of the present application.

[0123] In some embodiments, there is an air gap between the first heat sink 270 and the second heat sink 280. That is, the first heat sink 270 and the second heat sink 280 are not in direct contact or directly connected, so that the first heat sink 270 does not receive heat from the second heat sink 280, thereby reducing the impact of thermal crosstalk between the first die 220 and the second die 230.

[0124] In some embodiments, the orthographic projection areas of the first heat sink 270 and the second heat sink 280 on the surface of the substrate 210 partially overlap or do not overlap at all. For example, a schematic diagram of the orthographic projection areas of the first heat sink 270 and the second heat sink 280 on the surface of the substrate 210 not overlapping at all is shown in FIG. Figure 8 or Fig.10 The schematic diagram of the partial overlap of the orthographic projection area of ​​the first heat sink 270 and the second heat sink 280 on the surface of the substrate 210 is shown in FIG. Fig.11 , Fig.12 or Fig.13 shown.

[0125] exist Figure 8 In the embodiment, the first heat sink 270 and the second heat sink 280 are arranged side by side, and an air gap is provided at the portion where the first heat sink 270 and the second heat sink 280 are close to each other, so that the orthographic projection areas of the first heat sink 270 and the second heat sink 280 on the surface of the substrate 210 do not overlap at all.

[0126] In some embodiments, the second heat sink may form a first avoidance space, and the first heat sink may be located in the first avoidance space. For example, the entire structure of the first heat sink may be located in the first avoidance space, so that the orthographic projection areas of the first heat sink and the second heat sink on the substrate surface do not overlap at all, such as Fig.10 Alternatively, a portion of the structure of the first heat sink may be located in the first avoidance space, and another portion of the structure of the first heat sink may be located on the side of the second heat sink away from the substrate, so that the orthographic projection areas of the first heat sink and the second heat sink on the substrate surface partially overlap, as shown in FIG. Fig.11 shown.

[0127] When the second heat sink can form the first avoidance space, the second heat sink may include a first heat sink and a second heat sink. The surface of the first heat sink close to the substrate is connected to the surface of the second structure away from the substrate, and the second heat sink is arranged at an angle with the first heat sink in a plane parallel to the substrate, such as Fig.10 , Fig.11 , Fig.13 The angle can be an acute angle, a right angle or an obtuse angle.

[0128] Fig.10 It is a schematic top view of a package provided in an embodiment of the present application. Fig.10 The heat sink 270 includes a substrate 210, a first tube core 220, a second tube core 230, a first structural member 240, a second structural member 250, a first heat sink 270 and a second heat sink 280. The second heat sink 280 can form a first avoidance space. That is, the second heat sink 280 can include a first heat dissipation portion and a second heat dissipation portion, and the first heat dissipation portion and the second heat dissipation portion are arranged at an angle to form the first avoidance space. The first heat dissipation portion is connected to the second structural member 250, that is, the surface of the first heat dissipation portion close to the substrate 210 is connected to the surface of the second structural member 250 away from the substrate 210. The entire structure of the first heat sink 270 is located in the first avoidance space, and the first heat sink 270 is connected to the first structural member 240. There is an air gap between the first heat sink 270 and the second heat sink 280, so that the first heat sink 270 and the second heat sink 280 do not overlap at all in the orthographic projection area on the surface of the substrate 210.

[0129] In some embodiments, the second heat dissipation portion of the second heat sink 280 may be connected or disconnected to the second structure 250. That is, the surface of the second heat dissipation portion close to the substrate 210 and the surface of the second structure 250 away from the substrate 210 may be connected or disconnected.

[0130] When the second heat sink can form the first escape space, the first heat sink 270 can include a protrusion protruding toward the substrate 210. The protrusion can be accommodated in the first escape space, such as Fig.11 , 12 , as shown in 13.

[0131] Fig.11 It is a schematic top view of a package provided in an embodiment of the present application. Fig.11 The heat sink 270 includes a substrate 210 , a first tube core 220 , a second tube core 230 , a first structure member 240 , a second structure member 250 , a first heat sink 270 and a second heat sink 280 . Fig.11 The cross-sectional diagram of the package in FIG. Fig.12 As shown, Fig.12 is a schematic diagram of the section along the plane where the y-axis and z-axis are located. That is, Fig.11 and Fig.12 The packaging is the same as in.

[0132] like Fig.11 and Fig.12 As shown, the second heat sink 280 may include a first heat sink portion and a second heat sink portion, and the first heat sink portion and the second heat sink portion are arranged at an angle to form a first avoidance space. The first heat sink portion is connected to the second structural member 250, that is, the surface of the first heat sink portion close to the substrate 210 is connected to the surface of the second structural member 250 away from the substrate 210. The first heat sink 270 includes a protrusion protruding toward the substrate 210, and the protrusion is accommodated in the first avoidance space. The protrusion can be connected to the first structural member 240, that is, the surface of the protrusion close to the substrate 210 is connected to the surface of the first structural member 240 away from the substrate 210. There is an air gap between the first heat sink 270 and the second heat sink 280. From Fig.11 , Fig.12 It can also be seen that the orthographic projection area of ​​the first heat sink 270 on the surface of the substrate 210 partially overlaps with the orthographic projection area of ​​the first heat dissipation portion of the second heat sink 280 on the surface of the substrate 210. The orthographic projection area of ​​the first heat sink 270 on the surface of the substrate 210 and the orthographic projection area of ​​the second heat dissipation portion of the second heat sink 280 on the surface of the substrate 210 do not overlap at all.

[0133] When the second heat sink can form the first avoidance space, the second heat sink may include at least one first heat sink portion and at least one second heat sink portion, so that the second heat sink may form at least one first avoidance space. The second heat sink includes a first heat sink portion, a second heat sink portion and a first avoidance space. Fig.11 , Fig.12 The second heat sink includes a plurality of first heat dissipation parts, a plurality of second heat dissipation parts and a plurality of first avoidance spaces. Fig.13 , Fig.14 shown.

[0134] Fig.13 It is a schematic top view of a package provided in an embodiment of the present application. Fig.13The substrate 210, the first tube core 220, the second tube core 230, the first structural member 240, the second structural member 250, the third tube core 260, the first heat sink 270 and the second heat sink 280 are included. The second heat sink 280 includes a first heat dissipation portion 281, a first heat dissipation portion 282, a second heat dissipation portion 283 and a second heat dissipation portion 284, so that the second heat sink 280 can form a first avoidance space 285, a first avoidance space 286 and a first avoidance space 287. The first heat dissipation portion 281 and the first heat dissipation portion 282 are arranged side by side, the second heat dissipation portion 283 and the second heat dissipation portion 284 are arranged side by side, and the two opposite sides of each first heat dissipation portion are respectively connected to a second heat dissipation portion. The first avoidance space 285, the first avoidance space 286 and the first avoidance space 287 are located between the second heat dissipation portion 283 and the second heat dissipation portion 284. Furthermore, the first avoidance space 285 is located on a side of the first heat dissipation portion 281 away from the first heat dissipation portion 282, the first avoidance space 286 is located between the first heat dissipation portion 281 and the first heat dissipation portion 282, and the first avoidance space 287 is located on a side of the first heat dissipation portion 282 away from the first heat dissipation portion 281. The first heat sink 270 may include a protrusion protruding toward the substrate 210, the protrusion is accommodated in the first avoidance space 286, and the protrusion is connected to the first structural member 240. Alternatively, the first heat sink may include three protrusions protruding toward the substrate 210, the three protrusions are respectively accommodated in the first avoidance space 285, the first avoidance space 286, and the first avoidance space 287, and the protrusion accommodated in the first avoidance space 286 is connected to the first structural member 240. From Fig.13 It can also be seen that the orthographic projection area of ​​the first heat sink 270 on the surface of the substrate 210 partially overlaps with the orthographic projection areas of the first heat dissipation portion 281 and the first heat dissipation portion 282 on the surface of the substrate 210. The orthographic projection area of ​​the first heat sink 270 on the surface of the substrate 210 does not overlap with the orthographic projection areas of the second heat dissipation portion 283 and the second heat dissipation portion 284 on the surface of the substrate 210 at all.

[0135] For example, a three-dimensional schematic diagram of the first heat sink 270 and the second heat sink 280 is as follows: Fig.14 shown. Fig.14 It is a schematic diagram of the structure of the radiator provided in an embodiment of the present application. Fig.14 (a) is a schematic structural diagram of the first heat sink 270. The first heat sink 270 includes three protrusions protruding toward the substrate 210. Fig.14 (b) is a schematic structural diagram of the second radiator 280, which includes two first heat dissipation parts and two second heat dissipation parts, thereby forming three first avoidance spaces. Fig.14(c) is a schematic diagram of the upper surface of the structure after the first heat sink 270 and the second heat sink 280 are combined (i.e., the heat sink combination), and there is an air gap between the first heat sink 270 and the second heat sink 280. The upper surface of the heat sink combination is the surface away from the substrate 210. Fig.14 (d) is a schematic diagram of the lower surface of the heat sink assembly, and the lower surface of the heat sink assembly is the surface close to the substrate 210. Fig.14 The first heat sink 270 and Fig.13 The structure of the first radiator 270 is similar to that of Fig.14 The second heat sink 280 and Fig.13 The structure of the second radiator 280 is similar and will not be repeated here.

[0136] Optionally, the first heat sink 270 may be connected to the second structure 250 through a first connector, thereby being fixed to a side of the second structure 250 away from the substrate 210. Alternatively, the first heat sink 270 may be connected to the second heat sink 280 through a first connector, thereby being fixed to a side of the second heat sink 280 away from the substrate 210. Alternatively, the first heat sink 270 may be connected to the substrate 210 through a first connector, thereby being fixed to the substrate 210.

[0137] Optionally, the second heat sink 280 may be connected to the substrate 210 via a second connecting member, thereby being fixed on the substrate 210 .

[0138] The embodiments of the present application do not limit the specific types of the first connecting member and the second connecting member. For example, the first connecting member and / or the second connecting member may be a screw, a screw with a spring, etc. The first connecting member and the second connecting member may be the same or different, and the embodiments of the present application do not limit this.

[0139] When the first connecting member and the second connecting member are screws with springs, the bottom of the screw may be a spring. The screw may be a screw made of a low thermal conductivity material, such as hard plastic. Since the screw with a spring has poor thermal conductivity, the heat transfer between the two structures (such as the first heat sink and the second structural member, or the first heat sink and the second heat sink) through the screw with a spring can be reduced, thereby playing a heat insulation role.

[0140] Fig.15 It is a structural schematic diagram of a heat sink and a connector provided in an embodiment of the present application. Fig.15 The first heat sink 270 can be fastened to the second structure member 250, the second heat sink 280 or the substrate 210 through four first connecting members. Fig.15 The second heat sink 280 can be fastened to the base plate 210 through four second connecting members.

[0141] In some embodiments, the upper surface of the first heat sink 270 and / or the second heat sink 280 may be a plane or a non-plane. The upper surface of the first heat sink 270 is the surface of the first heat sink 270 away from the substrate 210. The upper surface of the second heat sink 280 is the surface of the second heat sink 280 away from the substrate 210.

[0142] When the upper surfaces of the first heat sink 270 and the second heat sink 280 are planes, the height of the upper surface of the first heat sink 270 relative to the upper surface of the substrate 210 and the height of the upper surface of the second heat sink 280 relative to the upper surface of the substrate 210 may be the same or different, and the embodiments of the present application are not limited to this.

[0143] Optionally, when the power consumption of the first tube core 220 is less than the fourth preset threshold, the first structural member 240 may be a heat sink. When the first structural member 240 is a heat sink, the first heat sink 270 may not be included in the package. Similarly, when the power consumption of the second tube core 230 is less than the fifth preset threshold, the second structural member 250 may be a heat sink. When the second structural member 250 is a heat sink, the second heat sink 280 may not be included in the package. The embodiment of the present application does not limit the specific values ​​of the fourth preset threshold and the fifth preset threshold, and can be set according to actual needs. The fourth preset threshold and the fifth preset threshold may be the same or different.

[0144] By measuring the temperature in the package in the embodiment of the present application and the package that shares the heat dissipation resource, the temperature data shown in Table 1 can be obtained.

[0145] Table 1 Temperature data table

[0146] Package First die Second die Package 1 88.19 94.85 Package 2 95.11 89.79

[0147] In Table 1, package 1 is a package in which multiple tube cores share the same heat dissipation resources, and package 2 is a package in the embodiment of the present application. The long-term maximum operating temperature specification of the first tube core is 105 degrees Celsius (℃), and the long-term maximum operating temperature specification of the second tube core is 95℃. If the temperature of the tube core exceeds the long-term maximum operating temperature specification of the tube core, the tube core is more easily damaged. It can be seen from Table 1 that the temperature margin of the first tube core in package 1 is 105-88.19=16.81℃, and the temperature margin of the second tube core is 95-94.85=0.15℃. The temperature margin of the first tube core in the package of the embodiment of the present application is 105-95.11=9.89℃, and the temperature margin of the second tube core is 95-89.79=5.21℃. In other words, although the temperature margin of the first tube core in package 1 is larger, the temperature margin of the second tube core is smaller, which makes the potential over-temperature risk of the second tube core greater and easier to be damaged. The first tube core and the second tube core in the embodiment of the present application both have a large temperature margin, so that the first tube core and the second tube core both have a small potential over-temperature risk, and thus are not easily damaged. That is, the package in the embodiment of the present application can reduce the impact of thermal crosstalk between the tube cores and improve the heat dissipation effect.

[0148] The present application also provides a method for preparing a package. The method includes: forming a substrate 210, a first tube core 220, a second tube core 230, a first structure 240, and a second structure 250; combining the substrate 210, the first tube core 220, the second tube core 230, the first structure 240, and the second structure 250 together to form a package. Figures 2 to 7 Alternatively, the method includes: forming a substrate 210 ; forming a first tube die 220 and a second tube die 230 on the substrate 210 ; and forming a first structure 240 and a second structure 250 on a side of the first tube die 220 and the second tube die 230 away from the substrate 210 .

[0149] In some embodiments, the method further includes: forming a first heat sink 270 and / or a second heat sink 280, and Figures 2 to 7 The packages shown are combined together to form Figures 8 to 13 Alternatively, the method further includes: forming a first heat sink 270 on a side of the first structure 240 away from the substrate 210 , and / or forming a second heat sink 280 on a side of the second structure 250 away from the substrate 210 .

[0150] The present application embodiment may also provide a chip. The chip includes Figures 2 to 13 Package shown.

[0151] The present application embodiment may also provide an electronic device. The electronic device includes Figures 2 to 13Alternatively, the electronic device includes the above chip.

[0152] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A package, characterized in that: include: A substrate, and a first tube core, a second tube core, a first structure member and a second structure member disposed on the substrate, wherein a first dielectric material is disposed between the first tube core and the second tube core; The first structural member is arranged on a side of the first tube core away from the substrate, and the first tube core is located in an orthographic projection area of ​​the first structural member on the surface of the substrate; The second structure member is arranged on a side of the second tube core away from the substrate, the second tube core is located in the orthographic projection area of ​​the second structure member on the surface of the substrate, and an air gap is provided between the first structure member and the second structure member.

2. The package according to claim 1, characterized in that The edge of the first structural member includes a first bent portion bent toward the substrate, and the first bent portion is connected to the substrate; and / or, The edge of the second structure member includes a second bent portion bent toward the substrate, and the second bent portion is connected to the substrate.

3. The package according to claim 2, characterized in that The first bending portion and / or the second bending portion is in a step shape.

4. The package according to any one of claims 1 to 3, characterized in that: The first structural member includes a first protruding structure protruding toward the substrate, and the first protruding structure is connected to the substrate; and / or, The second structural member includes a second protruding structure protruding toward the substrate, and the second protruding structure is connected to the substrate.

5. The package according to any one of claims 1 to 4, characterized in that: The second structural member is provided with an opening, and the first structural member is located in the opening of the second structural member.

6. The package according to any one of claims 1 to 5, characterized in that: The package also includes a third tube core, which is disposed on the substrate and is located within an orthographic projection area of ​​the first structure member or the second structure member on the surface of the substrate.

7. The package according to any one of claims 1 to 6, characterized in that: The package also includes a first heat sink, which is disposed on a side of the first structure away from the substrate, and a surface of the first heat sink close to the substrate is connected to a surface of the first structure away from the substrate.

8. The package according to claim 7, characterized in that The first heat sink is not in contact with the second structure.

9. The package according to claim 7 or 8, characterized in that: The package also includes a second heat sink, which is disposed on a side of the second structure away from the substrate, and a surface of the second heat sink close to the substrate is connected to a surface of the second structure away from the substrate.

10. The package according to claim 9, characterized in that The second heat sink does not contact the first structure.

11. The package according to claim 9 or 10, characterized in that: An air gap is provided between the first heat sink and the second heat sink.

12. The package according to any one of claims 9 to 11, characterized in that The second heat sink includes a first heat dissipation part and a second heat dissipation part. The surface of the first heat dissipation part close to the substrate is connected to the surface of the second structure away from the substrate. The second heat dissipation part is arranged at an angle with the first heat dissipation part in a plane parallel to the substrate.

13. The package according to any one of claims 9 to 12, characterized in that The second radiator forms a first avoidance space, and the first radiator is located in the first avoidance space.

14. The package according to claim 13, characterized in that The first heat sink includes a protruding portion protruding toward the substrate, and the protruding portion is accommodated in the first avoidance space.

15. The package according to claim 14, characterized in that A surface of the protrusion close to the substrate is connected to a surface of the first structure member away from the substrate.

16. A chip, characterized in that: Comprising the package as claimed in any one of claims 1 to 15.

17. An electronic device, characterized in that: A package comprising any one of claims 1 to 15, or a chip comprising the chip according to claim 16.

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