Display panel, preparation method thereof and display device

Abstract

The application provides a display panel, a preparation method thereof and a display device. The display panel comprises: a substrate comprising a conductive layer and a via, the via exposing part of the conductive layer; an isolation structure located on a side of the substrate having the via, the isolation structure comprising a plurality of isolation openings; a plurality of light emitting units, the light emitting unit comprising a plurality of light emitting devices, the light emitting device being at least partially located in the isolation opening, the light emitting device comprising a first electrode layer, the first electrode layer extending into the via and contacting the conductive layer, the plurality of light emitting devices comprising a first light emitting device; an encapsulation layer located on a side of the isolation structure away from the substrate, the encapsulation layer comprising a plurality of first encapsulation portions; the orthographic projection of the first encapsulation portion on the substrate covering the orthographic projection of the first light emitting device on the substrate; wherein, in at least part of the adjacent light emitting units, the orthographic projection of the first encapsulation portion on the substrate covers the orthographic projection of at least one via on the substrate.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to display panels, their manufacturing methods, and display devices. Background Technology

[0002] With the development of display technology, Organic Light Emitting Diode (OLED) display products have gained a significant share of the high-end display market in recent years due to their excellent picture quality and wide range of applications. OLED display panels have advantages such as thinness, flexibility, high contrast, and wide color gamut, and have gradually secured a place in the small-size display field. Consequently, users' demands for the display performance of OLED display panels are also increasing. Summary of the Invention

[0003] In view of this, embodiments of this application provide a display panel, a method for manufacturing the same, and a display device.

[0004] The first aspect of this application provides a display panel, including:

[0005] The substrate includes a conductive layer and vias, with the vias exposing portions of the conductive layer.

[0006] An isolation structure is located on the side of the substrate with vias, and the isolation junction includes multiple isolation openings;

[0007] Multiple light-emitting unit groups, each light-emitting unit group including multiple light-emitting devices, each light-emitting device being at least partially located in an isolation opening, each light-emitting device including a first electrode layer extending into a via and contacting a conductive layer, the multiple light-emitting devices including the first light-emitting device;

[0008] The encapsulation layer is located on the side of the isolation structure away from the substrate, and the encapsulation layer includes a plurality of first encapsulation portions; the orthographic projection of the first encapsulation portion on the substrate covers the orthographic projection of the first light-emitting device on the substrate.

[0009] In at least some of the adjacent light-emitting unit groups, the first encapsulation portion extends outward from the isolation opening and is connected to the side of the isolation structure away from the substrate, and the orthographic projection of the first encapsulation portion on the substrate covers the orthographic projection of at least one via on the substrate.

[0010] In one embodiment, the first light-emitting device includes a first light-emitting functional layer and a second electrode layer stacked together, wherein the first light-emitting functional layer is located on the side of the second electrode layer closer to the substrate.

[0011] In at least some adjacent light-emitting unit groups, a first light-emitting functional layer extends outward from the isolation opening and is connected to the side of the isolation structure away from the substrate, and the orthographic projection of the first light-emitting functional layer on the substrate covers the orthographic projection of at least one via on the substrate; and / or, a second electrode layer extends outward from the isolation opening and is connected to the side of the isolation structure away from the substrate, and the orthographic projection of the second electrode layer on the substrate covers the orthographic projection of at least one via on the substrate.

[0012] Preferably, the first electrode layer is located between the substrate and the isolation structure, and is at least partially exposed to the isolation opening;

[0013] Preferably, the orthographic projection of the isolation structure onto the plane of the substrate covers the orthographic projection of the via onto the plane of the substrate.

[0014] In one embodiment, the plurality of light-emitting devices further include: a second light-emitting device and a third light-emitting device;

[0015] The encapsulation layer also includes a second encapsulation portion and a third encapsulation portion. The orthographic projection of the second encapsulation portion on the substrate covers the orthographic projection of the second light-emitting device on the substrate, and the orthographic projection of the third encapsulation portion on the substrate covers the orthographic projection of the third light-emitting device on the substrate.

[0016] In one embodiment, the orthographic projection of the second package portion onto the substrate overlaps the orthographic projection of at least one via onto the substrate; and / or,

[0017] The orthographic projection of the third encapsulation portion on the substrate covers the orthographic projection of at least one via on the substrate.

[0018] In one embodiment, the second light-emitting device includes a second light-emitting functional layer and a third electrode layer stacked together, wherein the second light-emitting functional layer is located on the side of the third electrode layer closer to the substrate.

[0019] The orthographic projection of the second light-emitting functional layer on the substrate covers the orthographic projection of at least one via on the substrate; and / or, the orthographic projection of the third electrode layer on the substrate covers the orthographic projection of at least one via on the substrate.

[0020] In one embodiment, the third light-emitting device includes a third light-emitting functional layer and a fourth electrode layer stacked together, wherein the third light-emitting functional layer is located on the side of the fourth electrode layer closer to the substrate.

[0021] The orthographic projection of the third light-emitting functional layer on the substrate covers the orthographic projection of at least one via on the substrate; and / or, the orthographic projection of the fourth electrode layer on the substrate covers the orthographic projection of at least one via on the substrate.

[0022] In one embodiment, in the same light-emitting unit group, the second light-emitting device and the third light-emitting device are located on the same side of the first light-emitting device.

[0023] In one embodiment, one light-emitting device corresponds to one via. The via is located on the side of the first light-emitting device close to the second and third light-emitting devices, or the via is located between the second and third light-emitting devices, or the via corresponding to the first light-emitting device is located on the side of the first light-emitting device close to the second and third light-emitting devices, and the via corresponding to the second and third light-emitting devices is located between the second and third light-emitting devices.

[0024] In one embodiment, the light-emitting unit group is arranged along a first direction and a second direction, the first direction intersecting the second direction; in the same light-emitting unit group, the second light-emitting device and the third light-emitting device are arranged along the second direction, and in the first direction, the second light-emitting device and the third light-emitting device are located on one side of the first light-emitting device;

[0025] Preferably, in the second direction, in at least some of the adjacent light-emitting unit groups, the first encapsulation portion extends outward from the isolation opening and is connected to the side of the isolation structure away from the substrate;

[0026] Preferably, the first direction and the second direction are perpendicular to each other.

[0027] In one embodiment, the first light-emitting device includes a first sub-light-emitting device and a second sub-light-emitting device arranged along a second direction, wherein the first sub-light-emitting device and the second sub-light-emitting device correspond to the same via.

[0028] Preferably, in the same light-emitting unit group, the via is located on the side of the first sub-light-emitting device closer to the second sub-light-emitting device, or the via is located on the side of the third light-emitting device closer to the first and second sub-light-emitting devices.

[0029] In one embodiment, the isolation structure includes a first part and a second part stacked together, the first part being located on the side of the second part away from the substrate, and the orthographic projection of the second part on the substrate being located within the orthographic projection of the first part on the substrate.

[0030] Preferably, the isolation structure further includes a third part located on the side of the second part closer to the substrate, wherein the orthographic projection of the second part on the substrate is within the orthographic projection range of the third part on the substrate.

[0031] In one embodiment, the display panel further includes: a pixel defining layer located between the substrate and the isolation structure, wherein the orthographic projection of the pixel defining layer on the plane of the substrate covers the orthographic projection of the via on the plane of the substrate;

[0032] Preferably, the substrate further includes a substrate and a planarization layer, wherein the substrate is located on the side of the planarization layer opposite to the pixel defining layer, and the planarization layer has vias;

[0033] Preferably, the encapsulation layer comprises an inorganic material.

[0034] A second aspect of this application provides a display panel, comprising:

[0035] The substrate includes a conductive layer and vias, with the vias exposing portions of the conductive layer.

[0036] An isolation structure is located on the side of the substrate with vias, and the isolation structure includes multiple isolation openings;

[0037] Multiple light-emitting unit groups, each light-emitting unit group including multiple light-emitting devices, each light-emitting device being at least partially located in an isolation opening, each light-emitting device including a first electrode layer extending into a via and contacting a conductive layer, the multiple light-emitting devices including the first light-emitting device;

[0038] The encapsulation layer is located on the side of the isolation structure away from the substrate. The encapsulation layer includes a plurality of first encapsulation portions. The first encapsulation portions are mesh structures. The orthographic projection of the first encapsulation portions on the substrate covers the orthographic projection of a plurality of first light-emitting devices on the substrate and the orthographic projection of at least one via on the substrate.

[0039] A third aspect of this application provides a method for manufacturing a display panel, comprising:

[0040] A substrate with a conductive layer and vias is provided, wherein the vias expose a portion of the conductive layer;

[0041] A first electrode layer is prepared on the side of the substrate with a via, and the first electrode layer extends into the via and contacts the conductive layer.

[0042] An isolation structure is fabricated on the side of the first electrode layer away from the substrate, and the isolation structure includes multiple isolation openings;

[0043] A first light-emitting functional layer and a second electrode layer are sequentially fabricated in the isolation opening to obtain the first light-emitting device in a group of multiple light-emitting units.

[0044] An encapsulation layer comprising multiple first encapsulation portions is prepared on the side of the isolation structure away from the substrate, wherein the orthographic projection of the first encapsulation portion on the substrate covers the orthographic projection of the first light-emitting device on the substrate.

[0045] In at least some of the adjacent light-emitting unit groups, the first encapsulation portion extends outward from the isolation opening and is connected to the side of the isolation structure away from the substrate, and the orthographic projection of the first encapsulation portion on the substrate covers the orthographic projection of at least one via on the substrate.

[0046] In one embodiment, sequentially fabricating a first light-emitting functional layer and a second electrode layer within an isolation opening includes:

[0047] A first light-emitting functional material layer and a second conductive layer are sequentially prepared on the side of the isolation structure away from the substrate. The orthogonal projections of the first light-emitting functional material layer and the second conductive layer on the substrate cover the isolation opening and the orthogonal projection of the isolation structure on the substrate.

[0048] The second conductive layer and the first light-emitting functional material layer are patterned, and the first light-emitting functional material layer and the second conductive layer at the corresponding isolation opening positions of the second light-emitting device and the third light-emitting device are removed to obtain the first light-emitting device.

[0049] In the same light-emitting unit group, the second light-emitting device and the third light-emitting device are located on the same side of the first light-emitting device.

[0050] A fourth aspect of this application provides a display device, including the display panel described above, or including a display panel prepared by the preparation method described above.

[0051] According to the display panel provided in the embodiments of this application, between two adjacent light-emitting unit groups, the first encapsulation part is connected to each other on the side of the isolation structure away from the substrate, which helps to reduce the suspension between the first encapsulation part and the isolation structure and effectively reduces the risk of peeling of the first encapsulation part; at the same time, the first encapsulation part covers at least one via, which can effectively protect the first electrode layer in the via from corrosion, thereby avoiding the failure of the light-emitting device and improving the manufacturing yield of the display panel. Attached Figure Description

[0052] Figure 1 This is a top view of the display panel in one embodiment of this application.

[0053] Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure of the display panel along the AA' direction.

[0054] Figure 3 This is a top view of the display panel in another embodiment of this application.

[0055] Figure 4 for Figure 3 A schematic diagram of a cross-sectional structure of the display panel along the BB' direction.

[0056] Figure 5 for Figure 3 A schematic diagram of another cross-sectional structure of the display panel along the BB' direction.

[0057] Figure 6 This is a top view of the display panel in another embodiment of this application.

[0058] Figure 7 This is a top view of the display panel in another embodiment of this application.

[0059] Figure 8 This is a top view of the display panel in another embodiment of this application.

[0060] Figure 9This is a top view of the display panel in another embodiment of this application.

[0061] Figure 10 This is a top view of the display panel in another embodiment of this application.

[0062] Figure 11 for Figure 3 A schematic diagram of another cross-sectional structure of the display panel along the BB' direction.

[0063] Figure 12 This is a cross-sectional structural diagram of an isolation structure according to an embodiment of this application.

[0064] Figure 13 This is a cross-sectional structural diagram of an isolation structure according to another embodiment of this application.

[0065] Figure 14 This is a cross-sectional structural diagram of an isolation structure according to another embodiment of this application.

[0066] Figure 15 This is a schematic diagram of the process for manufacturing a display panel in one embodiment of this application. Detailed Implementation

[0067] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0068] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In some instances, methods and means well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0069] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0070] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0071] The first aspect of this application provides a display panel, as shown in the reference... Figures 1 to 4The schematic diagram of the display panel shown includes: a substrate 100, including a conductive layer 110 and a via 120, the via 120 exposing a portion of the conductive layer 110; an isolation structure 200 located on the side of the substrate 100 with the via 120, the isolation structure 200 having multiple isolation openings 210; and multiple light-emitting unit groups 300, each light-emitting unit group 300 including multiple light-emitting devices 310, each light-emitting device 310 being at least partially located in the isolation openings 210, each light-emitting device 310 including a first electrode layer 301 extending into the via 120 and contacting the conductive layer 110; and multiple light-emitting devices... 310 includes a first light-emitting device 311; an encapsulation layer 400 located on the side of the isolation structure 200 away from the substrate 100, the encapsulation layer 400 including a plurality of first encapsulation portions 410; the orthographic projection of the first encapsulation portion 410 on the substrate 100 covers the orthographic projection of the first light-emitting device 311 on the substrate 100; wherein, in at least some of the adjacent light-emitting unit groups 300, the first encapsulation portion 410 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 away from the substrate 100, and the orthographic projection of the first encapsulation portion 410 on the substrate 100 covers the orthographic projection of at least one via 120 on the substrate 100.

[0072] It should be noted that the light-emitting unit group 300 includes a light-emitting device 310 located in the isolation opening 210, and also includes a light-emitting device 310 located outside the isolation opening 210.

[0073] According to the display panel provided in the embodiments of this application, between two adjacent light-emitting unit groups 300, the first encapsulation part 410 is connected to each other on the side of the isolation structure 200 away from the substrate 100, which helps to reduce the suspension between the first encapsulation part 410 and the isolation structure 200 and effectively reduces the risk of peeling of the first encapsulation part 410; at the same time, the first encapsulation part 410 covers at least one via 120, which can effectively protect the first electrode layer 301 in the via 120 from corrosion, thereby avoiding the failure of the light-emitting device 310 and improving the manufacturing yield of the display panel.

[0074] In one embodiment, in the same light-emitting unit group 300, the orthographic projection of the first encapsulation portion 410 on the substrate 100 covers the orthographic projection of all vias 120 on the substrate 100.

[0075] In one embodiment, the first light-emitting device 311 includes a first light-emitting functional layer 302 and a second electrode layer 303 stacked together, with the first light-emitting functional layer 302 located on the side of the second electrode layer 303 closer to the substrate 100. In at least some adjacent light-emitting unit groups 300, the first light-emitting functional layer 302 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 opposite to the substrate 100, and the orthogonal projection of the first light-emitting functional layer 302 on the substrate 100 covers the orthogonal projection of at least one via 120 on the substrate 100. In another embodiment, in at least some adjacent light-emitting unit groups 300, the second electrode layer 303 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 opposite to the substrate 100, and the orthogonal projection of the second electrode layer 303 on the substrate 100 covers the orthogonal projection of at least one via 120 on the substrate 100. In another embodiment, in at least some adjacent light-emitting unit groups 300, a first light-emitting functional layer 302 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 opposite to the substrate 100, and the orthogonal projection of the first light-emitting functional layer 302 on the substrate 100 covers the orthogonal projection of at least one via 120 on the substrate 100; and a second electrode layer 303 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 opposite to the substrate 100, and the orthogonal projection of the second electrode layer 303 on the substrate 100 covers the orthogonal projection of at least one via 120 on the substrate 100. Thus, the first light-emitting functional layer 302 and / or the second electrode layer 303 can effectively protect the first electrode layer 301 in the via, further reducing the risk of light-emitting unit group failure.

[0076] In one embodiment, the first electrode layer 301 is located between the substrate 100 and the isolation structure 200, and is at least partially exposed to the isolation opening 210.

[0077] In one embodiment, refer to Figure 5 The schematic diagram of the display panel shown shows that the orthographic projection of the isolation structure 200 onto the plane of the substrate 100 covers the orthographic projection of the via 120 onto the plane of the substrate 100. Therefore, the isolation structure 200 can effectively protect the first electrode layer 301 in the via, further reducing the risk of failure of the light-emitting unit group.

[0078] In one embodiment, refer to Figure 6 The schematic diagram of the display panel shown in the top view includes multiple light-emitting devices 310, including a second light-emitting device 312 and a third light-emitting device 313; the encapsulation layer 400 also includes a second encapsulation portion 420 and a third encapsulation portion 430, the orthographic projection of the second encapsulation portion 420 on the substrate 100 covering the orthographic projection of the second light-emitting device 312 on the substrate 100, and the orthographic projection of the third encapsulation portion 430 on the substrate 100 covering the orthographic projection of the third light-emitting device 313 on the substrate 100. It should be noted that... Figures 6 to 10 as well as Figure 1 and Figure 3 In the top-down view, the first light-emitting device 311 is located below the first packaging section 410 and cannot be seen. The second light-emitting device 312 is located in the second packaging section.

[0079] Below 420, the second light-emitting device 312 cannot be seen, and the third light-emitting device 313 is located below the third package portion 430, so the third light-emitting device 313 cannot be seen. Therefore, the use of dashed lines to represent the first light-emitting device 311, the second light-emitting device 312, and the third light-emitting device 313 should not be construed as a limitation of this application.

[0080] For example, the light-emitting device 310 includes light-emitting devices of various colors, such as a red light-emitting device R, a green light-emitting device G, and a blue light-emitting device B. For example, the first light-emitting device 311 is a blue light-emitting device B, the second light-emitting device 312 is a red light-emitting device R, and the third light-emitting device 313 is a green light-emitting device G. Of course, the above possible configurations of the light-emitting devices are merely examples and should not be construed as limiting this application. The colors of the first light-emitting device 311, the second light-emitting device 312, and the third light-emitting device 313 can be flexibly selected according to actual circumstances, and will not be elaborated further here.

[0081] In one embodiment, refer to Figure 6 The orthographic projection of the second package portion 420 on the substrate 100 covers the orthographic projection of at least one via 120 on the substrate 100. In another embodiment, referring to... Figure 7 The schematic diagram of the top view of the display panel shown shows that the orthographic projection of the third encapsulation portion 430 on the substrate 100 covers the orthographic projection of at least one via 120 on the substrate 100. In another embodiment, the orthographic projection of the second encapsulation portion 420 on the substrate 100 covers the orthographic projection of at least one via 120 on the substrate 100, and the orthographic projection of the third encapsulation portion 430 on the substrate 100 covers the orthographic projection of at least one via 120 on the substrate 100. Therefore, the second encapsulation portion 420 and / or the third encapsulation portion 430 can further enhance the protection of the first electrode layer 301 in the via 120, and better prevent the first electrode layer 301 from being corroded.

[0082] In one embodiment, the second light-emitting device 312 includes a second light-emitting functional layer and a third electrode layer stacked together, with the second light-emitting functional layer located on the side of the third electrode layer closer to the substrate; the orthogonal projection of the second light-emitting functional layer on the substrate 100 covers the orthogonal projection of at least one via 120 on the substrate 100. In another embodiment, the orthogonal projection of the third electrode layer on the substrate 100 covers the orthogonal projection of at least one via 120 on the substrate 100. In yet another embodiment, the orthogonal projection of the second light-emitting functional layer on the substrate 100 covers the orthogonal projection of at least one via 120 on the substrate 100, and the orthogonal projection of the third electrode layer on the substrate 100 also covers the orthogonal projection of at least one via 120 on the substrate 100. Therefore, the second light-emitting functional layer and the third electrode layer of the second light-emitting device 312 can further enhance the protection of the first electrode layer 301 in the via 120, and better prevent the first electrode layer 301 from being corroded.

[0083] In one embodiment, the third light-emitting device 313 includes a third light-emitting functional layer and a fourth electrode layer stacked together, with the third light-emitting functional layer located on the side of the fourth electrode layer closest to the substrate 100; the orthogonal projection of the third light-emitting functional layer on the substrate 100 covers the orthogonal projection of at least one via 120 on the substrate 100. In another embodiment, the orthogonal projection of the fourth electrode layer on the substrate 100 covers the orthogonal projection of at least one via 120 on the substrate 100. In yet another embodiment, the orthogonal projection of the third light-emitting functional layer on the substrate 100 covers the orthogonal projection of at least one via 120 on the substrate 100, and the orthogonal projection of the fourth electrode layer on the substrate 100 covers the orthogonal projection of at least one via 120 on the substrate 100. Thus, the third light-emitting functional layer and the fourth electrode layer of the third light-emitting device 313 can further enhance the protection of the first electrode layer 301 in the via 120, and better prevent the first electrode layer 301 from being corroded.

[0084] In one embodiment, refer to Figure 6 In the same light-emitting unit group 300, the second light-emitting device 312 and the third light-emitting device 313 are located on the same side of the first light-emitting device 311. Therefore, there is a gap between the second light-emitting device 312 and the third light-emitting device 313, which facilitates the interconnection of the first encapsulation portion 410 of the first light-emitting device 311 on the side of the isolation structure 200 away from the substrate 100. This effectively reduces the risk of a gap between the isolation structure 200 and the first encapsulation portion 410, and significantly reduces the risk of peeling of the first encapsulation portion 410.

[0085] In one embodiment, one light-emitting device 310 corresponds to one via 120, and the via 120 is located on the side of the first light-emitting device 311 near the second light-emitting device 312 and the third light-emitting device 313 (see details). Figure 1Alternatively, via 120 may be located between the second light-emitting device 312 and the third light-emitting device 313; or, via 120 corresponding to the first light-emitting device 311 may be located on the side of the first light-emitting device 311 closest to the second light-emitting device 312 and the third light-emitting device 313, and vias corresponding to the second light-emitting device 312 and the third light-emitting device 313 may be located between the second light-emitting device 312 and the third light-emitting device 313 (see details). Figure 3 Therefore, the arrangement of the vias 120 allows the first encapsulation part 410 to cover all the vias 120, and the first encapsulation part 410 provides excellent protection for the first electrode layer 301 in the vias 120.

[0086] In one embodiment, refer to Figure 6 The isolation opening 210 corresponding to the first light-emitting device 310 is provided with a recess 211, and the via 120 corresponding to the first light-emitting device 310 is at least partially located in the recess 211. Therefore, the recess 211 makes it easier to set the via 120 and hardly affects the display effect.

[0087] In one embodiment, refer to Figure 1 The light-emitting unit group 300 is arranged along a first direction a and a second direction b, and the first direction a and the second direction b intersect. In the same light-emitting unit group 300, the second light-emitting device 312 and the third light-emitting device 313 are arranged along the second direction b, and in the first direction a, the second light-emitting device 312 and the third light-emitting device 313 are located on one side of the first light-emitting device 311. Therefore, the arrangement of the vias 120 combined with the arrangement of the light-emitting devices 310 makes it easier for the first encapsulation part 410 to cover all the vias 120, and the first encapsulation part 410 provides excellent protection for the first electrode layer 301 in the vias 120.

[0088] In a preferred embodiment, the first direction a and the second direction b are perpendicular to each other. This makes it easier to manufacture the display panel, reduces manufacturing difficulty, and improves the yield rate of the display panel.

[0089] In one embodiment, refer to Figure 8 The schematic diagram of the top view of the display panel shown shows that, in the second direction b, in at least some of the adjacent light-emitting unit groups 300, the first encapsulation portion 410 extends outward from the isolation opening 210 and is connected to the isolation structure 200 on the side facing away from the substrate 100. Thus, the first encapsulation portions 410 of two adjacent first light-emitting devices 311 are connected together on the side of the isolation structure 200 facing away from the substrate 100, effectively preventing any gaps between the first encapsulation portion 410 and the isolation structure 200 between two adjacent first light-emitting devices 311, reducing the risk to the glass of the first encapsulation portion 410, and improving the yield of the display panel.

[0090] In one embodiment, refer to Figure 9 The schematic diagram of the top view of the display panel shown illustrates that the first light-emitting device 311 includes a first sub-light-emitting device 3111 and a second sub-light-emitting device 3112 arranged along the second direction b. The first sub-light-emitting device 3111 and the second sub-light-emitting device 3112 correspond to the same via 120. Exemplarily, the first electrode layer 301 of the first sub-light-emitting device 3111 and the second sub-light-emitting device 3112 is the same electrode layer, and this first electrode layer 301 contacts the conductive layer 110 through a via 120. Exemplarily, there is a gap between the first sub-light-emitting device 3111 and the second light-emitting device 3112. In this case, referring to... Figure 10 The second encapsulation portion 420 of the second light-emitting device 312 in two adjacent light-emitting unit groups 300 can be connected to each other on the side of the isolation structure 200 away from the substrate 100; or, the third encapsulation portion 430 of the third light-emitting device 313 in two adjacent light-emitting unit groups 300 can be connected to each other on the side of the isolation structure 200 away from the substrate 100. The design is more flexible and diverse, and it is more conducive to realizing the protection of the first electrode layer 301 in the via 120 by the encapsulation layer 400.

[0091] In one embodiment, in the same light-emitting unit group 300, the via 120 is located on the side of the first sub-light-emitting device 3111 closer to the second sub-light-emitting device 3112 (see reference). Figure 9 Alternatively, via 120 is located on the side of the third light-emitting device 313 closest to the first sub-light-emitting device 3111 and the second sub-light-emitting device 3112 (see reference). Figure 10 Therefore, the placement of via 120 is more diverse, which is beneficial for the encapsulation layer 400 to protect the first electrode layer 301 in via 120.

[0092] For example, taking the first light-emitting device 311 as an example, one of the first electrode layer 301 and the second electrode layer 303 is an anode, and the other is a cathode. Taking the first electrode layer 301 as the anode and the second electrode layer 303 as the cathode as an example, the first light-emitting functional layer 302 includes a light-emitting layer, and may further include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron-blocking layer (EBL) located between the first electrode layer 301 and the light-emitting layer, and at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole-blocking layer (HBL) located between the light-emitting layer and the second electrode layer 303. The structures of other light-emitting devices can refer to the structure of the first light-emitting device 311, and will not be described in detail here.

[0093] In one embodiment, refer to Figure 12 and Figure 13 The schematic diagram of the isolation structure shown shows that the isolation structure 200 includes a first part 201 and a second part 202 stacked together. The first part 201 is located on the side of the second part 202 away from the substrate 100, and the orthographic projection of the second part 202 on the substrate 100 is located within the orthographic projection of the first part 201 on the substrate 100.

[0094] For example, the second part 202 can be designed as an independent film layer, meaning there is no physical interface within the second part 202, and all parts are made of the same material, such as aluminum. Alternatively, the second part 202 can be designed as being composed of at least two stacked film layers. For example, the second part 202 is formed by stacking two conductive film layers. The materials of the two conductive film layers can be molybdenum and aluminum, respectively, and the conductive film layer made of molybdenum is located between the substrate 100 and the conductive film layer made of aluminum. For example, the second part 202 includes a conductive sub-part, or the second part 202 itself is a conductive structure. The material of the first part 201 can be an organic material, an inorganic material, or a metallic material. If the first part 201 is a metallic material, the material of the first part 201 can be titanium.

[0095] In one embodiment, refer to Figure 14 The schematic diagram of the isolation structure shown shows that the isolation structure 200 also includes a third part 203, which is located on the side of the second part 202 close to the substrate 100. The orthographic projection of the second part 202 on the substrate 100 is within the orthographic projection range of the third part 203 on the substrate 100.

[0096] In one implementation, the third part 203 includes a conductive material. Exemplarily, the light-emitting layer is spaced apart from the isolation structure 200; more specifically, the light-emitting layer is spaced apart from the third part 203.

[0097] For example, the second part 202 is a conductive film layer made of aluminum, and the third part 203 is a conductive film layer made of molybdenum. In this case, the cross-section of the isolation structure 200 is I-shaped.

[0098] The composition and preparation of the isolation structure 200 are detailed in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and C. Further descriptions are provided in N117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0099] In one embodiment, refer to Figure 1 The display panel also includes a pixel defining layer 500, located between the substrate 100 and the isolation structure 200, wherein the orthographic projection of the pixel defining layer 500 on the plane of the substrate 100 covers the orthographic projection of the via 120 on the plane of the substrate 100.

[0100] For example, refer to Figure 1 The pixel defining layer has multiple openings. The first electrode layer 301 is located between the pixel defining layer 500 and the substrate 100. A portion of the first light-emitting functional layer 302 is located in the opening of the pixel defining layer, and the remaining portion of the light-emitting layer 412 is located in the isolation opening 210 of the isolation structure. A portion of the second electrode layer 303 is located in the opening of the pixel defining layer, and the remaining portion of the second electrode layer 303 is located in the isolation opening 210 of the isolation structure.

[0101] It should be noted that the pixel delimiting layer is a conventional pixel delimiting layer in the existing technology, and will not be described in detail here.

[0102] In one embodiment, refer to Figure 11 The schematic diagram of the cross-sectional structure of the display panel shown shows that the substrate 100 also includes a substrate 101 and a planarization layer 102. The substrate 101 is located on the side of the planarization layer 102 away from the pixel defining layer 500, and the planarization layer 102 has a via 120.

[0103] Exemplarily, the substrate 100 includes a substrate 101, an active layer and a metal layer located between the substrate 101 and the planarization layer 102, and an insulating layer located between the active layer and the metal layer. It should be noted that the display panel includes a pixel driving circuit, which includes an active layer and a metal layer. The remaining structure of the pixel driving circuit can be referred to in the prior art and will not be described in detail here.

[0104] In one embodiment, the substrate may be a glass-based substrate. In another embodiment, the substrate may include an organic resin material such as epoxy resin, triazine, silicone resin, or polyimide. For example, the substrate may be an FR4 type printed circuit board (PCB) or a flexible PCB that is easily deformable. In one embodiment, the substrate may include a ceramic material such as silicon nitride, aluminum nitride, or aluminum oxide, or may include a metal or metal compound. For example, the substrate may be a metal core PCB (MCPCB) or a metal copper clad laminate (MCCL).

[0105] In one embodiment, the encapsulation layer 400 comprises an inorganic material. Exemplarily, the materials of the first encapsulation portion 410, the second encapsulation portion 420, and the third encapsulation portion 430 are inorganic materials, prepared by chemical vapor deposition (CVD). Exemplarily, the display panel further comprises an organic encapsulation layer and an inorganic encapsulation layer. The organic encapsulation layer is located on the side of the encapsulation layer 400 facing away from the substrate 100, and the inorganic encapsulation layer is located on the side of the organic encapsulation layer facing away from the substrate 100. The organic encapsulation layer comprises organic materials and is prepared by inkjet printing (IJP), while the inorganic encapsulation layer comprises inorganic materials and is prepared by chemical vapor deposition (CVD).

[0106] A second aspect of this application provides a display panel, as shown in [reference] Figure 8The schematic diagram of the cross-sectional structure of the display panel shown includes: a substrate 100, including a conductive layer 110 and a via 120, the via 120 exposing a portion of the conductive layer 110; an isolation structure 200 located on the side of the substrate 100 with the via 120, the isolation structure 200 having a plurality of isolation openings 210; and a plurality of light-emitting unit groups 300, each light-emitting unit group 300 including a plurality of light-emitting devices 310, the light-emitting devices 310 being at least partially located in the isolation openings 210, and each light-emitting device 310 including a first electrode layer 301. The first electrode layer 301 extends into the via 120 and contacts the conductive layer 110. The plurality of light-emitting devices 310 include the first light-emitting device 311. The encapsulation layer 400 is located on the side of the isolation structure 200 away from the substrate 100. The encapsulation layer 400 includes a plurality of first encapsulation portions 410. The first encapsulation portion 410 has a mesh structure. The orthographic projection of the first encapsulation portion 410 on the substrate 100 covers the orthographic projection of the plurality of first light-emitting devices 311 on the substrate 100 and the orthographic projection of at least one via 120 on the substrate 100.

[0107] It is understood that the first encapsulation portion 410 has a mesh structure and includes multiple through holes. The positions of the through holes correspond to the placement positions of the second and third light-emitting devices. The orthographic projection of the second light-emitting device on the substrate 100 is within the range of the orthographic projection of the through holes on the substrate 100, and the orthographic projection of the third light-emitting device on the substrate 100 is within the range of the orthographic projection of the through holes on the substrate 100. Except for the through holes, the rest of the first encapsulation portion 410 has a continuous structure.

[0108] According to the display panel of this embodiment, the mesh-like first encapsulation portion 410 facilitates the interconnection of the first encapsulation portion 410 between two adjacent light-emitting unit groups 300 on the side of the isolation structure 200 away from the substrate 100. This helps reduce the gap between the first encapsulation portion 410 and the isolation structure 200, effectively reducing the risk of peeling of the first encapsulation portion 410. At the same time, the first encapsulation portion 410 covers at least one via 120, which can effectively protect the first electrode layer 301 in the via 120 from corrosion, thereby preventing the light-emitting device 310 from failing and improving the manufacturing yield of the display panel.

[0109] It should be noted that the substrate, isolation structure, encapsulation layer, light-emitting unit group, and light-emitting device are the same as described above, and will not be repeated here.

[0110] In one embodiment, in the same light-emitting unit group 300, the orthographic projection of the first encapsulation portion 410 on the substrate 100 covers the orthographic projection of all vias 120 on the substrate 100.

[0111] In one embodiment, the first light-emitting device 311 includes a first light-emitting functional layer 302 and a second electrode layer 303 stacked together, with the first light-emitting functional layer 302 located on the side of the second electrode layer 303 closer to the substrate 100. In at least some adjacent light-emitting unit groups 300, the first light-emitting functional layer 302 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 opposite to the substrate 100, and the orthogonal projection of the first light-emitting functional layer 302 on the substrate 100 covers the orthogonal projection of at least one via 120 on the substrate 100. In another embodiment, in at least some adjacent light-emitting unit groups 300, the second electrode layer 303 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 opposite to the substrate 100, and the orthogonal projection of the second electrode layer 303 on the substrate 100 covers the orthogonal projection of at least one via 120 on the substrate 100. In another embodiment, in at least some adjacent light-emitting unit groups 300, a first light-emitting functional layer 302 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 opposite to the substrate 100, and the orthogonal projection of the first light-emitting functional layer 302 on the substrate 100 covers the orthogonal projection of at least one via 120 on the substrate 100; and a second electrode layer 303 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 opposite to the substrate 100, and the orthogonal projection of the second electrode layer 303 on the substrate 100 covers the orthogonal projection of at least one via 120 on the substrate 100. Thus, the first light-emitting functional layer 302 and / or the second electrode layer 303 can effectively protect the first electrode layer 301 in the via, further reducing the risk of light-emitting unit group failure.

[0112] In one embodiment, the first electrode layer 301 is located between the substrate 100 and the isolation structure 200, and is at least partially exposed to the isolation opening 210.

[0113] In one embodiment, refer to Figure 5 The schematic diagram of the display panel shown shows that the orthographic projection of the isolation structure 200 onto the plane of the substrate 100 covers the orthographic projection of the via 120 onto the plane of the substrate 100. Therefore, the isolation structure 200 can effectively protect the first electrode layer 301 in the via, further reducing the risk of failure of the light-emitting unit group.

[0114] In one embodiment, refer to Figure 6 The schematic diagram of the top view of the display panel shown includes multiple light-emitting devices 310, including a second light-emitting device 312 and a third light-emitting device 313; the encapsulation layer 400 also includes a second encapsulation portion 420 and a third encapsulation portion 430, the orthographic projection of the second encapsulation portion 420 on the substrate 100 covers the orthographic projection of the second light-emitting device 312 on the substrate 100, and the orthographic projection of the third encapsulation portion 430 on the substrate 100 covers the orthographic projection of the third light-emitting device 313 on the substrate 100.

[0115] For example, the light-emitting device 310 includes light-emitting devices of various colors, such as a red light-emitting device R, a green light-emitting device G, and a blue light-emitting device B. For example, the first light-emitting device 311 is a blue light-emitting device B, the second light-emitting device 312 is a red light-emitting device R, and the third light-emitting device 313 is a green light-emitting device G. Of course, the above possible configurations of the light-emitting devices are merely examples and should not be construed as limiting this application. The colors of the first light-emitting device 311, the second light-emitting device 312, and the third light-emitting device 313 can be flexibly selected according to actual circumstances, and will not be elaborated further here.

[0116] In one embodiment, refer to Figure 6 The orthographic projection of the second package portion 420 on the substrate 100 covers the orthographic projection of at least one via 120 on the substrate 100. In another embodiment, referring to... Figure 7 The schematic diagram of the top view of the display panel shown shows that the orthographic projection of the third encapsulation portion 430 on the substrate 100 covers the orthographic projection of at least one via 120 on the substrate 100. In another embodiment, the orthographic projection of the second encapsulation portion 420 on the substrate 100 covers the orthographic projection of at least one via 120 on the substrate 100, and the orthographic projection of the third encapsulation portion 430 on the substrate 100 covers the orthographic projection of at least one via 120 on the substrate 100. Therefore, the second encapsulation portion 420 and / or the third encapsulation portion 430 can further enhance the protection of the first electrode layer 301 in the via 120, and better prevent the first electrode layer 301 from being corroded.

[0117] It should be noted that the structure of the display panel in this embodiment can be combined with the structure of the display panel described above, either as a whole or in part, and will not be elaborated further here.

[0118] The third aspect of this application provides a method for manufacturing a display panel, referring to... Figure 15 The diagram shows a process flow chart for manufacturing a display panel. The manufacturing process for the display panel includes the following steps.

[0119] S100: Provides a substrate having a conductive layer and vias, wherein the vias expose a portion of the conductive layer.

[0120] It should be noted that the substrate is the same as described above, and will not be repeated here.

[0121] S200: A first electrode layer is prepared on the side of the substrate with a via, the first electrode layer extending into the via and contacting the conductive layer.

[0122] It should be noted that the first electrode layer is consistent with the previous description, and will not be elaborated on further here.

[0123] S300: An isolation structure is prepared on the side of the first electrode layer away from the substrate. The isolation structure includes multiple isolation openings.

[0124] It should be noted that the isolation structure is consistent with the previous description, and will not be elaborated further here.

[0125] For example, the orthographic projection of the isolation structure on the plane of the substrate covers the orthographic projection of the via on the plane of the substrate. The preparation of the isolation structure on the side of the first electrode layer away from the substrate includes: preparing an entire isolation material layer on the side of the first electrode layer away from the substrate, performing patterning processing on the isolation material layer, removing the isolation material layer corresponding to the locations of the first light-emitting device, the second light-emitting device and the third light-emitting device, and obtaining an isolation structure with multiple isolation openings.

[0126] S400: The first light-emitting functional layer and the second electrode layer are sequentially fabricated in the isolation opening to obtain the first light-emitting device in a group of multiple light-emitting units.

[0127] It should be noted that the first light-emitting functional layer and the second electrode layer are consistent with the previous description, and will not be repeated here.

[0128] In one embodiment, the sequential fabrication of a first light-emitting functional layer and a second electrode layer within an isolation opening includes: sequentially fabricating a first light-emitting functional material layer and a second conductive layer on the side of the isolation structure facing away from the substrate, wherein the orthographic projections of the first light-emitting functional material layer and the second conductive layer on the substrate cover the isolation opening and the orthographic projections of the isolation structure on the substrate; patterning the second conductive layer and the first light-emitting functional material layer; removing the first light-emitting functional material layer and the second conductive layer at the isolation opening positions corresponding to the second and third light-emitting devices to obtain the first light-emitting device; and in the same light-emitting unit group, the second and third light-emitting devices are located on the same side of the first light-emitting device. Thus, in the above fabrication method, the first light-emitting functional layer and the second electrode layer of the obtained first light-emitting device cover the via, and the first light-emitting functional layers of the first light-emitting devices in adjacent light-emitting units are interconnected on the side of the isolation structure facing away from the substrate, and the second electrode layers of the first light-emitting devices are interconnected on the side of the isolation structure facing away from the substrate, which can effectively prevent the first electrode layer in the via from being corroded by the etching solution used in the subsequent fabrication processes of the second and third light-emitting devices.

[0129] S500: An encapsulation layer including multiple first encapsulation portions is prepared on the side of the isolation structure away from the substrate, wherein the orthogonal projection of the first encapsulation portion on the substrate covers the orthogonal projection of the first light-emitting device on the substrate.

[0130] It should be noted that the encapsulation layer and the first encapsulation part are the same as described above, and will not be repeated here.

[0131] It should be noted that, in at least some of the adjacent light-emitting unit groups, the first encapsulation portion extends outward from the isolation opening and is connected to the side of the isolation structure away from the substrate, and the orthographic projection of the first encapsulation portion on the substrate covers the orthographic projection of at least one via on the substrate.

[0132] In one specific embodiment, the method for manufacturing the display panel includes the following steps:

[0133] S1: Provide a substrate having a conductive layer and vias, wherein the vias expose a portion of the conductive layer.

[0134] S2: A first electrode layer is prepared on the side of the substrate with a via, and the first electrode layer extends into the via and contacts the conductive layer.

[0135] S3: An isolation structure is prepared on the side of the first electrode layer away from the substrate. The isolation structure includes multiple isolation openings.

[0136] S4: A first light-emitting functional material layer and a second conductive layer are sequentially fabricated on the side of the isolation structure facing away from the substrate. The orthogonal projections of the first light-emitting functional material layer and the second conductive layer on the substrate cover the orthogonal projections of the isolation opening and the isolation structure on the substrate. The second conductive layer and the first light-emitting functional material layer are patterned, and the first light-emitting functional material layer and the second conductive layer at the isolation opening positions corresponding to the second and third light-emitting devices are removed to obtain the first light-emitting device. Multiple first encapsulation portions are fabricated on the side of the isolation structure facing away from the substrate. The orthogonal projections of the first encapsulation portions on the substrate cover the orthogonal projections of the first light-emitting devices on the substrate.

[0137] S5: A second light-emitting functional material layer and a third conductive layer are sequentially fabricated on the side of the isolation structure facing away from the substrate. The orthogonal projections of the second light-emitting functional material layer and the third conductive layer on the substrate cover the orthogonal projections of the isolation opening and the isolation structure on the substrate. The second light-emitting functional material layer and the third conductive layer are patterned, retaining the second light-emitting functional material layer and the third conductive layer at the isolation opening position corresponding to the second light-emitting device, thus obtaining the second light-emitting device. Multiple second encapsulation portions are fabricated on the side of the isolation structure facing away from the substrate. The orthogonal projections of the second encapsulation portions on the substrate cover the orthogonal projections of the second light-emitting device on the substrate.

[0138] S6: A third light-emitting functional material layer and a fourth conductive layer are sequentially fabricated on the side of the isolation structure facing away from the substrate. The orthographic projections of the third light-emitting functional material layer and the fourth conductive layer on the substrate cover the orthographic projections of the isolation opening and the isolation structure on the substrate. The third light-emitting functional material layer and the fourth conductive layer are patterned, retaining the third light-emitting functional material layer and the fourth conductive layer at the isolation opening position corresponding to the third light-emitting device, thus obtaining the third light-emitting device. Multiple third encapsulation parts are fabricated on the side of the isolation structure facing away from the substrate. The orthographic projections of the third encapsulation parts on the substrate cover the orthographic projections of the third light-emitting device on the substrate. In the same light-emitting unit, the second light-emitting device and the third light-emitting device are located on the same side of the first light-emitting device.

[0139] In the above preparation process, the first light-emitting device and the first packaging part are prepared first. The first light-emitting functional layer and the second electrode in the first packaging part and the first light-emitting device can effectively protect the first electrode layer in the via from the corrosion of the etching solution used in the subsequent patterning process of the second and third light-emitting devices, avoid the failure of the light-emitting unit, and improve the yield of the display panel.

[0140] A fourth aspect of this application provides a display device, including the display panel described above, or including a display panel prepared by the preparation method described above.

[0141] It should be noted that, in addition to the display panel mentioned above, the display device may also include the structures that conventional display devices should have, such as touch panels, driver chips, and housings, which will not be elaborated on further here.

[0142] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0143] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A display panel, characterized by, The application relates to a substrate, an isolation structure, a plurality of light emitting unit groups and a packaging layer. The substrate comprises a conductive layer and a via hole exposing part of the conductive layer. The isolation structure is located on a side of the substrate with the via hole and comprises a plurality of isolation openings. The light emitting unit groups comprise a plurality of light emitting devices, which are at least partially located in the isolation openings and comprise a first electrode layer extending into the via hole and in contact with the conductive layer. The first light emitting device, the second light emitting device and the third light emitting device are included in the plurality of light emitting devices. The packaging layer is located on a side of the isolation structure away from the substrate and comprises a plurality of first packaging portions. The orthographic projection of the first packaging portion on the substrate covers the orthographic projection of the first light emitting device on the substrate. In at least some of the adjacent light emitting unit groups, the first packaging portion extends outward from the isolation opening and is connected on a side of the isolation structure away from the substrate, and the orthographic projection of the first packaging portion on the substrate covers the orthographic projection of at least one via hole on the substrate. In the same light emitting unit group, the second light emitting device and the third light emitting device are located on the same side of the first light emitting device.

2. The display panel of claim 1, wherein, One light emitting device corresponds to one via hole. The via hole is located on a side of the first light emitting device close to the second light emitting device and the third light emitting device, or the via hole is located between the second light emitting device and the third light emitting device. The via hole corresponding to the first light emitting device is located on a side of the first light emitting device close to the second light emitting device and the third light emitting device, and the via hole corresponding to the second light emitting device and the third light emitting device is located between the second light emitting device and the third light emitting device.

3. The display panel of claim 1 or 2, wherein, In the same light emitting unit group, the orthographic projection of the first packaging portion on the substrate covers the orthographic projection of all the via holes on the substrate.

4. The display panel of claim 1 or 2, wherein, The first light emitting device comprises a first light emitting functional layer and a second electrode layer arranged in a stack, and the first light emitting functional layer is located on a side of the second electrode layer close to the substrate. In at least some of the adjacent light emitting unit groups, the first light emitting functional layer extends outward from the isolation opening and is connected on a side of the isolation structure away from the substrate, and the orthographic projection of the first light emitting functional layer on the substrate covers the orthographic projection of at least one via hole on the substrate. The second electrode layer extends outward from the isolation opening and is connected on a side of the isolation structure away from the substrate, and the orthographic projection of the second electrode layer on the substrate covers the orthographic projection of at least one via hole on the substrate. The first electrode layer is located between the substrate and the isolation structure and is at least partially exposed to the isolation opening. The orthographic projection of the isolation structure on the substrate plane covers the orthographic projection of the via hole on the substrate plane.

5. The display panel of claim 1 or 2, wherein, The encapsulation layer further comprises a second encapsulation portion and a third encapsulation portion, a projection of the second encapsulation portion on the substrate covers a projection of the second light emitting device on the substrate, and a projection of the third encapsulation portion on the substrate covers a projection of the third light emitting device on the substrate.

6. The display panel of claim 5, wherein, A projection of the second encapsulation portion on the substrate covers a projection of at least one of the via holes on the substrate. And / or, A projection of the third encapsulation portion on the substrate covers a projection of at least one of the via holes on the substrate.

7. The display panel of claim 6, wherein, The second light emitting device comprises a second light emitting functional layer and a third electrode layer which are stacked, and the second light emitting functional layer is located on a side of the third electrode layer close to the substrate. A projection of the second light emitting functional layer on the substrate covers a projection of at least one of the via holes on the substrate. And / or, a projection of the third electrode layer on the substrate covers a projection of at least one of the via holes on the substrate.

8. The display panel of claim 6 or 7, wherein, The third light emitting device comprises a third light emitting functional layer and a fourth electrode layer which are stacked, and the third light emitting functional layer is located on a side of the fourth electrode layer close to the substrate. A projection of the third light emitting functional layer on the substrate covers a projection of at least one of the via holes on the substrate. And / or, a projection of the fourth electrode layer on the substrate covers a projection of at least one of the via holes on the substrate.

9. The display panel of claim 8, wherein, The isolation opening corresponding to the first light emitting device is provided with a recess, and the via hole corresponding to the first light emitting device is at least partially located in the recess.

10. The display panel of claim 1, wherein, The light emitting unit groups are arranged along a first direction and a second direction, the first direction intersects the second direction; in the same light emitting unit group, the second light emitting device and the third light emitting device are arranged along the second direction, and in the first direction, the second light emitting device and the third light emitting device are located on one side of the first light emitting device.

11. The display panel of claim 10, wherein, In at least part of the adjacent light emitting unit groups in the second direction, the first encapsulation portion extends outward from the isolation opening and is connected on a side of the isolation structure away from the substrate.

12. The display panel of claim 10, wherein, The first direction and the second direction are perpendicular to each other.

13. The display panel of claim 10, wherein, The first light emitting device comprises a first sub light emitting device and a second sub light emitting device arranged along the second direction, and the first sub light emitting device and the second sub light emitting device correspond to the same via hole.

14. The display panel of claim 13, wherein, The first sub light emitting device and the second sub light emitting device share the same first electrode layer.

15. The display panel of claim 13, wherein, In the same light emitting unit group, the via hole is located on a side of the first sub light emitting device close to the second sub light emitting device, or the via hole is located on a side of the third light emitting device close to the first sub light emitting device and the second sub light emitting device.

16. The display panel of claim 1, wherein, The isolation structure comprises a first portion and a second portion which are stacked, the first portion is located on a side of the second portion away from the substrate, and a projection of the second portion on the substrate is located within a projection of the first portion on the substrate.

17. The display panel of claim 16, wherein, The isolation structure further includes a third portion located on a side of the second portion close to the substrate, and a normal projection of the second portion on the substrate is located within a range of a normal projection of the third portion on the substrate.

18. The display panel of claim 1, wherein, The display panel further includes a pixel definition layer located between the substrate and the isolation structure, and a normal projection of the pixel definition layer on a plane where the substrate is located covers a normal projection of the via hole on the plane where the substrate is located.

19. The display panel of claim 18, wherein, The substrate further includes a substrate and a planarization layer, the substrate is located on a side of the planarization layer away from the pixel definition layer, and the planarization layer has the via hole.

20. The display panel of claim 18, wherein, The encapsulation layer includes an inorganic material.

21. A display panel, comprising: Comprise: A substrate comprising a conductive layer and a via hole exposing part of the conductive layer; An isolation structure located on a side of the substrate having the via hole, the isolation structure comprising a plurality of isolation openings; A plurality of light emitting unit groups, the light emitting unit groups comprising a plurality of light emitting devices, the light emitting devices being at least partially located in the isolation openings, the light emitting devices comprising a first electrode layer extending into the via hole and in contact with the conductive layer, the plurality of light emitting devices comprising a first light emitting device, a second light emitting device and a third light emitting device; An encapsulation layer located on a side of the isolation structure away from the substrate, the encapsulation layer comprising a plurality of first encapsulation portions; The first encapsulation portion is a mesh structure, and a normal projection of the first encapsulation portion on the substrate covers normal projections of the plurality of first light emitting devices on the substrate and at least one via hole on the substrate; In the same light emitting unit group, the second light emitting device and the third light emitting device are located on the same side of the first light emitting device; One of the light emitting devices corresponds to one of the via holes, the via hole is located on a side of the first light emitting device close to the second light emitting device and the third light emitting device, or the via hole is located between the second light emitting device and the third light emitting device, or the via hole corresponding to the first light emitting device is located on a side of the first light emitting device close to the second light emitting device and the third light emitting device, and the via holes corresponding to the second light emitting device and the third light emitting device are located between the second light emitting device and the third light emitting device; In the same light emitting unit group, a normal projection of the first encapsulation portion on the substrate covers normal projections of all the via holes on the substrate.

22. The display panel of claim 21, wherein, The first light emitting device comprises a first light emitting functional layer and a second electrode layer arranged in a stack, and the first light emitting functional layer is located on a side of the second electrode layer close to the substrate; In at least partially adjacent light emitting unit groups, the first light emitting functional layer extends outward from the isolation opening and connects on a side of the isolation structure away from the substrate, and a normal projection of the first light emitting functional layer on the substrate covers a normal projection of at least one via hole on the substrate; And / or, the second electrode layer extends outward from the isolation opening and is connected to a side of the isolation structure away from the substrate, and a projection of the second electrode layer on the substrate covers a projection of at least one of the via holes on the substrate.

23. The display panel of claim 22, wherein, The first electrode layer is located between the substrate and the isolation structure, and is at least partially exposed to the isolation opening.

24. The display panel of claim 22, wherein, A projection of the isolation structure on a plane in which the substrate is located covers a projection of the via holes on the plane in which the substrate is located.

25. The display panel of claim 21 or 22, wherein, The encapsulation layer further comprises a second encapsulation part and a third encapsulation part, a projection of the second encapsulation part on the substrate covers a projection of the second light emitting device on the substrate, and a projection of the third encapsulation part on the substrate covers a projection of the third light emitting device on the substrate.

26. The display panel of claim 25, wherein, A projection of the second encapsulation part on the substrate covers a projection of at least one of the via holes on the substrate. And / or, A projection of the third encapsulation part on the substrate covers a projection of at least one of the via holes on the substrate.

27. A method for manufacturing a display panel, characterized by, Comprise: A substrate with a conductive layer and a via hole exposing part of the conductive layer is provided; A first electrode layer is prepared on a side of the substrate with the via hole, the first electrode layer extends into the via hole and is in contact with the conductive layer; An isolation structure is prepared on a side of the first electrode layer away from the substrate, the isolation structure comprises a plurality of isolation openings; A first light emitting functional layer and a second electrode layer are sequentially prepared in the isolation opening to obtain a plurality of light emitting devices, and a plurality of light emitting unit groups are obtained; The plurality of light emitting devices comprises a first light emitting device, a second light emitting device and a third light emitting device; in the same light emitting unit group, the second light emitting device and the third light emitting device are located on the same side of the first light emitting device; one light emitting device corresponds to one via hole, the via hole is located on a side of the first light emitting device close to the second light emitting device and the third light emitting device, or the via hole is located between the second light emitting device and the third light emitting device, or the via hole corresponding to the first light emitting device is located on a side of the first light emitting device close to the second light emitting device and the third light emitting device, and the via hole corresponding to the second light emitting device and the third light emitting device is located between the second light emitting device and the third light emitting device; An encapsulation layer comprising a plurality of first encapsulation parts is prepared on a side of the isolation structure away from the substrate, a projection of the first encapsulation part on the substrate covers a projection of the first light emitting device on the substrate; Among at least some adjacent light emitting unit groups, the first encapsulation part extends outward from the isolation opening and is connected to a side of the isolation structure away from the substrate, and a projection of the first encapsulation part on the substrate covers a projection of at least one of the via holes on the substrate, and in the same light emitting unit group, a projection of the first encapsulation part on the substrate covers a projection of all the via holes on the substrate.

28. The method of claim 27, wherein, The sequentially preparing the first light-emitting functional layer and the second electrode layer in the isolation opening comprises: sequentially preparing a first light-emitting functional material layer and a second conductive layer on a side of the isolation structure away from the substrate, a normal projection of the first light-emitting functional material layer and the second conductive layer on the substrate covering a normal projection of the isolation opening and the isolation structure on the substrate; performing a patterning process on the second conductive layer and the first light-emitting functional material layer, removing the first light-emitting functional material layer and the second conductive layer at positions of the isolation opening corresponding to the second light-emitting device and the third light-emitting device, to obtain the first light-emitting device; In the same light-emitting unit group, the second light-emitting device and the third light-emitting device are located on the same side of the first light-emitting device.

29. A display device comprising: The display panel prepared by the preparation method of claim 27 or 28.

Images