Subsequent placement of ground points

Abstract

There is described a method of adding a ground point to a pre-existing dissipative coating, comprising the following sequential steps: i) placing a conductive insert (1) in the pre-existing dissipative coating (2); ii) placing a conductive layer (3) on the pre-existing dissipative coating (2) in the vicinity of the conductive interposer (1); iii) fastening the electrically conductive layer (3) to the electrically conductive insert (1); iv) connecting the conductive layer (3) and / or the conductive insert (1) to an equipotential bond. The present invention provides a method of safely and quickly installing an added ground point of a pre-existing dissipative coating or system without removing the pre-existing dissipative coating or system.

Description

Technical Field

[0001] The present invention relates to a method for adding grounding points to dissipative coating systems, particularly dissipative floor coating systems. Prior art

[0002] Many sectors of industry today place stringent demands on optimum environmental conditions. Particularly in this regard, protection against uncontrolled electrostatic charging and discharge is of paramount importance.

[0003] Electrostatic charging and discharging occurs as a result of contact, friction or separation of two materials. In the process, one material becomes positively charged and the other negatively charged. In the case of floor coatings, this charge is generated by foot traffic or wheel traffic, for example using rubber soles or rubber wheels. Charging can also occur by blowing air over an insulating surface, such as paint or coatings.

[0004] Therefore, in sensitive areas, floors and walls are required to have a low ground resistance, which dissipates the electrostatic charge immediately and in a controlled manner. For such static dissipative coatings, there are many standards containing test methods for evaluating the suitability of the coating in terms of electrostatic or electrical performance.

[0005] For example, DIN EN 61340-4-1:2016-04 describes a test method for determining the electrical resistance of floor coverings and floor paving. In DIN EN 61340-4-5:2019-04, electrostatic safety is assessed in conjunction with the electrical resistance and chargeability of people, footwear and floor coverings.

[0006] Coating systems are known which have ESD protection (ESD = “electrostatic discharge”), ie which have protection against electrostatic discharge. Dissipative systems based on epoxy resins or polyurethanes are usually used.

[0007] Floors made of synthetic resins are generally not conductive or dissipative. However, there are several options for achieving ESD properties.

[0008] First, solid conductive particles such as conductive carbon black may be added to the synthetic resin composition to impart conductivity.

[0009] Another option is to use organic salts that are soluble in the synthetic resin matrix and provide sufficient conductivity or to use ionic liquids.

[0010] Another option is to add carbon fibers or carbon nanotubes to the synthetic resin composition to obtain electrical conductivity.

[0011] WO 2014 / 108310 A1 describes a multi-component composition for dissipative floor coating systems and a process for producing the same, which is used on substrates to prevent electrostatic discharge.

[0012] In the prior art, a dissipative coating is applied on top of a non-dissipative substrate (usually a non-dissipative synthetic resin layer). However, before applying the dissipative coating, a grounding device for grounding the coating system must be installed on top of the non-dissipative substrate. In order to electrically connect the static dissipative coating, the grounding device is connected to an equipotential bonding / ground potential.

[0013] Such grounding arrangements are known to the person skilled in the art and the person skilled in the art can easily implement them. The grounding arrangement can be formed, for example, by a grounding conductor or an arrangement of grounding conductors, which are connected to an equipotential bonding. The equipotential bonding or ground potential bonding can occur via one or more ground connections.

[0014] Suitable grounding conductors include, for example, copper tapes and / or so-called conductor sets, which are installed to dissipate the potential. Self-adhesive copper strips can be used, which can be applied to the non-dissipative layer in a simple manner. Conductor sets are commercially available; for example, Conductive Set. This conductive set consists of copper tape, washers and threaded rods. In this way a so-called grounding point is established. This can be done, for example, at Figure 1-3 After the dissipative coating is applied and cured, this ground point can be grounded by a skilled electrician ( Figure 4 ).

[0015] However, in the prior art, these ground conductors and grounding points are provided before the dissipative coating is applied. Currently there is no solution to provide additional grounding points for pre-existing dissipative coatings or systems without removing the pre-existing dissipative coating. It would be an important advantage if existing pre-existing dissipative coatings such as ESD flooring could be subsequently grounded. Summary of the invention

[0016] It is therefore an object of the present invention to provide a method for safely and quickly installing an added grounding point for a pre-existing dissipative coating or system without removing the pre-existing dissipative coating or system.

[0017] Thus, the present invention relates to a method of adding a grounding point to a pre-existing dissipative coating, comprising the following sequence of steps:

[0018] i. placing a conductive insert (1) in a pre-existing dissipative coating (2);

[0019] ii. placing a conductive layer (3) on the pre-existing dissipative coating (2) near the conductive insert (1);

[0020] iii. fastening the conductive layer (3) to the conductive insert (1);

[0021] iv. Connecting the conductive layer (3) and / or the conductive insert (1) to equipotential bonding.

[0022] Equipotential bonding, ground potential, or ground is used herein as a reference point in a circuit for measuring voltage, a common return path for current, or a direct physical connection to ground.

[0023] Preferred embodiments of the composition are reproduced in the dependent claims. The invention is explained in full below.

[0024] BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1-Figure 4 : Installation of grounding points during application of an ESD coating system according to the prior art.

[0026] Figure 5-Figure 12 : Adding a ground point to a pre-existing ESD coating system according to the present invention.

[0027] A certain embodiment of the present invention

[0028] Preferably, the term "conductive" as used herein means greater than 10 4 S / m, preferably greater than 10 5 Conductivity in S / m.

[0029] Dissipative coatings may also be referred to as static dissipative coatings. Compared to non-dissipative coatings or insulating coatings, they allow the generated static charges to be carried away. For this reason, dissipative coatings have a certain electrical conductivity. Dissipative coatings and non-dissipative coatings are known to those skilled in the art.

[0030] The dissipative capacity of a pre-existing dissipative coating (2) can be determined, for example, by the resistance of the layer to ground. As used herein, unless otherwise stated, the resistance to ground of a pre-existing dissipative coating (2) is preferably determined in accordance with standard DIN EN 61340-4-1:2016-04. Here, and in accordance with standards DIN EN 61340-4-1:2016-04 and DIN EN 61340-5-1:2017-07, if the coating has a resistance of less than 10 9 A coating having a resistance to ground of 10 ohms is considered dissipative or electrostatically dissipative. A coating having a greater resistance to ground is not dissipative. More preferably, a coating having a resistance to ground of 10 4 -10 8 Ohm, 10 is most preferred 6 -10 7 Ohms of ground resistance.

[0031] Here, the earth resistance of the coating in the installed form is determined as described in DIN EN 61340-4-1:2016-04.

[0032] The ground resistance and the system resistance according to the DIN EN 61340 series of standards can vary within wide limits, as long as there is a dissipative capacity. For example, the pre-existing dissipative coating (2) suitably has a resistance of less than 10 9 ohm ground resistance or system resistance, and preferably not more than 5×10 8 Ohm; the grounding resistance may be preferably located at 10 4 Ohm to 5×10 8 According to DIN EN 61340-5-1:2017-07, the voltage that allows an individual to acquire a charge under the defined conditions described in DIN EN 61340-4-5:2019-04 (called "body voltage") is preferably limited to less than 100 volts.

[0033] The thickness of the pre-existing dissipative coating (2) can likewise vary within wide ranges and can be selected depending on the final application. Preferably, the layer thickness of the pre-existing dissipative coating (2) is less than 7 mm, suitably in the range of 0.5 to 5 mm, preferably 0.75 to 3 mm, most preferably 1 to 2 mm.

[0034] Preferably, the pre-existing dissipative coating (2) is a dissipative floor coating or a dissipative floor sealant coating, preferably in clean rooms, production facilities, assembly facilities, laboratories, shops (especially solvent shops) and medical offices.

[0035] Preferably, the pre-existing dissipative coating (2) is made of a cured reaction resin or reaction resin blend, which optionally contains one or more additives, the reaction resins for the respective dissipative coating being independently selected from epoxy resins, polyurethanes, polyureas, mixtures of polyurethanes and polyureas, polymethacrylates, polyacrylates and cementitious hybrid systems, in particular cementitious epoxy hybrid systems and cementitious polyurethane hybrid systems. Preferably, the pre-existing dissipative coating (2) is made of a cured epoxy resin, in particular a two-component epoxy resin composition.

[0036] Preferably, the pre-existing dissipative coating (2) contains one or more conductive additives selected from carbon fibers, carbon nanotubes, carbon powder, graphite powder, silicon carbide, metal oxides, ammonium salts, heavy metal-containing or metal-containing fillers, especially antimony-containing and tin-containing fillers based on titanium dioxide or mica and ionic liquids, preferably selected from carbon fibers, carbon nanotubes, carbon powder, graphite powder, most preferably carbon fibers.

[0037] In step i), a conductive insert (1) is placed in a pre-existing dissipative coating (2). Preferably, the conductive insert (1) is made of metal.

[0038] It is further preferred that the conductive insert (1) is selected from a rod, a nail and a screw. Preferably, the conductive insert (1) is a rod, most preferably a threaded rod. It is further preferred that the conductive insert (1) has a length of 40-100 mm, preferably 50-70 mm, and a diameter of 4-10 mm, preferably 5-7 mm.

[0039] Advantageously, in step i), the conductive insert (1) is placed in the pre-existing dissipative coating (2) by drilling a hole (4) in the pre-existing dissipative coating (2) and placing the conductive insert (1) in said hole (4).

[0040] Preferably, the holes (4) have a diameter of 4-12 mm, preferably 6-10 mm, and a depth of >40 mm, preferably >50 mm, more preferably >50-100 mm. Preferably, the holes (4) penetrate the entire thickness of the pre-existing dissipative coating (2).

[0041] In step ii), a conductive layer (3) is placed on said pre-existing dissipative coating (2) in the vicinity of said conductive insert (1).

[0042] The conductive layer (3) is used to provide good electrical conduction between the conductive insert (1) and the pre-existing dissipative coating (2). Preferably, the conductive layer (3) is made of metal.

[0043] It is further preferred that the conductive layer (3) is a washer, preferably having a diameter of 10 mm - 100 mm, preferably 20 mm - 80 mm, more preferably 40 mm - 80 mm.

[0044] It may be advantageous if the electrically conductive insert ( 1 ) is in direct contact with the electrically conductive layer ( 3 ).

[0045] It may also be advantageous for the conductive material (5) to be in direct contact with a pre-existing dissipative coating (2) and conductive layer (3) and / or conductive insert (1).

[0046] Preferably, this conductive material (5) is selected from conductive powders (preferably metal powders or graphite powders), conductive tapes (preferably metal tapes or adhesive tapes) and conductive coatings (preferably selected from graphite powders and conductive coatings).

[0047] The conductive coating is preferably a conductive coating containing conductive carbon black and epoxy-based coating. Another preferred conductive coating is a paste-like conductive coating containing conductive powder, preferably metal powder or graphite powder, more preferably conductive metal powder, most preferably copper powder.

[0048] More preferably, the conductive material (5) is selected from graphite powder and conductive coating, wherein the preferred conductive coating is selected from conductive coatings containing conductive carbon black and epoxy-based coatings, and paste-like conductive coatings containing copper powder.

[0049] In one embodiment, the most preferred conductive material (5) is a conductive coating comprising conductive carbon black and an epoxy-based coating and is available, for example, from Sika Switzerland under the name -220W Conductive or -221W Conductive is commercially available.

[0050] In another embodiment, the most preferred conductive material (5) is a paste conductive coating containing copper powder and is commercially available, for example, under the name 4404 Kontaktpaste Cu from Aeronix, Germany, which is a synthetic metal saponified paste with 50% by weight copper pigment. The advantage of this system is the ease of applying such a paste conductive coating. It can be applied, for example, by means of a syringe loaded with the paste conductive coating. This allows for precise and fast application. If a one-component composition is used, no mixing is required prior to application.

[0051] From the experimental part it can be seen that variant No. 2 using graphite powder as conductive material and variant No. 3 using conductive primer "Sikafloor-220W Conductive" as conductive material lead to the best results both in the measurement of the ground resistance and in the system test.

[0052] It is further preferred that the application location of the conductive material (5) is limited to an area less than 15 cm, preferably less than 10 cm, more preferably less than 5 cm from the location of the conductive insert (1), most preferably it is limited to the area of ​​the pre-existing dissipative coating (2) covered by the conductive layer (3). This is for example Figure 6 and 12 as shown in .

[0053] In step iii), the conductive layer (3) is fastened, preferably mechanically fastened, to the conductive insert (1), preferably by fastening with nuts, more preferably by fastening with self-locking nuts. This is for example done in Figure 8 as shown in .

[0054] It is further preferred that no further coating, preferably a coating made of a cured reaction resin or reaction resin compound, more preferably a dissipative coating, is added on top of the conductive layer (3) after step ii) has been carried out, more preferably step iii) has been carried out.

[0055] In a particularly preferred method of adding a ground point to a pre-existing dissipative coating:

[0056] In step i), a hole (4) having a diameter of 6 mm to 10 mm and a depth of more than 50 mm is drilled in the pre-existing dissipative coating (2) and a metal rod, preferably a threaded rod, is placed in the hole (4); and

[0057] placing a metal washer around a metal rod, preferably a threaded rod, preferably with a diameter of 20 mm to 80 mm, more preferably 40 mm to 80 mm in step ii); and

[0058] in step iii) fastening the metal washer to a metal rod, preferably a threaded rod, by means of a nut; and

[0059] In step iv) the metal washers and / or the metal rods, preferably threaded rods, are connected to the equipotential bonding.

[0060] In the preferred method, it is further advantageous to place a conductive material (5) in direct contact with the pre-existing dissipative coating (2) and the conductive layer (3) and / or the conductive insert (1). The conductive material (5) is preferably selected from graphite powder and conductive paint, preferably a paint containing conductive carbon black and epoxy groups, which is added to the hole (4) or the metal rod, preferably a threaded rod, before placing the metal rod into the hole (4). Preferably, the conductive material (5) is placed between the metal washer and the pre-existing dissipative coating (2).

[0061] It is further preferred that the additional grounding points introduced according to the method described above are within 5-12m, preferably 8-10m of the pre-existing grounding points. It will be advantageous that the safety range / surface of the pre-existing ESD system must be extended over the pre-existing ESD floor lacking the necessary pre-existing grounding points. It is further advantageous that each additional grounding point according to the method described above is within 5-12m, preferably 8-10m of another additional grounding point.

[0062] It is also advantageous that the additional grounding point introduced according to the aforementioned method is at a distance of less than 1 m, preferably less than 0.5 m, more preferably less than 0.2 m from the wall or building support.

[0063] Another aspect of the invention is a dissipative coating system, more particularly a floor coating system, comprising added ground points obtained by the method as described above.

[0064] The following examples illustrate the present invention but are not intended to limit the scope of the invention in any way. Example

[0065] The commercial products used are as follows:

[0066] -2350ESD two-component epoxy ESD composition, Sika Germany.

[0067] -381ECF two-component epoxy ESD composition with carbon fiber, Sika Germany.

[0068] -220W Conductive two-component water-based epoxy composition, suitable as a conductive film under ESD coating, Sika Switzerland.

[0069] -221W Conductive two-component water-based epoxy composition, suitable as a conductive film under ESD coating, Sika Switzerland

[0070] -151LV two-component epoxy composition, suitable for waste paints from primers and / or floor coatings, Sika Germany

[0071] Graphite powder RS ​​PRO Graphite Schmiers toff Universal, coarse crystal natural graphite, Pressol GmbH, Germany

[0072] Conductive Tape Conductive Adhesive Transfer Tape 9713, 3M

[0073] Copper tape is used for copper foil adhesive tape for electrostatic conductive floor, width: 9mm, thickness 0.1mm.

[0074] Copper paste Synthetic metal saponification paste with 50 wt% copper pigment, 4404 Kontaktpaste CU, Aeronix, Germany

[0075] To investigate the performance of adding ground points to pre-existing dissipative coatings and compare them to initially installed ground points, 3 different systems including a pre-installed ESD coating (Sikafloor-2350ESD) were used. The results of the ESD measurements are shown in Tables 2-4.

[0076] The same ESD measurements were performed on an ESD coating mounted with carbon fibers ( -381ECF). The results of ESD measurement are shown in Table 5.

[0077] thickness:

[0078] -2350ESD 1.0mm

[0079] -381ECF 1.0mm

[0080] -220W Conductive 0.1mm

[0081] -221W Conductive 0.1mm

[0082] -151LV 0.5mm

[0083] The following types of added grounding points (No. 2-6, No. 2a-6a or No. 2b-6b respectively) were studied and compared with the originally installed grounding point (No. 1, No. 1a or No. 1b respectively).

[0084]

[0085] Table 1

[0086] All added grounding points No. 2-6 were installed by drilling holes with a diameter of 8 mm and a depth of > 50-70 mm in the pre-existing dissipative coating (Sikafloor-2350ESD). Plastic plugs were inserted into the holes and metal threaded rods (pin rods, length 50 mm, diameter 5 mm) were placed into the holes. A metal washer with a diameter of 60 mm was placed around the metal threaded rod, a smaller metal washer was placed on top, and the metal washer was fastened to the metal threaded rod by a self-nut. The performance of the subsequently added grounding points was then tested by the following ESD measurements.

[0087] Fig.10 The installation grounding points No. 1-6 from the system Sikafloor-151 (SR-151) / Sikafloor-220W Conductive (SR-220WC) / Sikafloor-2350ESD (SR-2350ESD) measured in Tables 2-4 are shown.

[0088] Figure 1-4 The steps for installing a pre-existing ground point No. 1 are shown.

[0089] Figure 5-9 The steps of installing the added grounding point No. 2 using graphite powder as the conductive material (5) are shown. Figure 8-9 As can be seen in Figure 1, the use of graphite powder has the disadvantage that the graphite powder accumulates in pre-existing grooves and is not conditioned in pre-existing ESD floor coverings and causes visual impairment.

[0090] Figure 11-12The figure shows the steps of installing the added grounding point No. 3 using the conductive primer "Sikafloor-220W Conductive" as the conductive material (5). Fig.11 and 12 As shown, a conductive primer is added into the drilled hole and on the side of the metal washer that contacts the pre-existing ESD floor covering.

[0091] ESD measurements are performed according to the following standards

[0092] R G

[0093] According to DIN EN 61340-4-1:20 16-04 (measuring device used: Metro3000 + ESD electrode type 850 (weight: 2.50 kg, diameter: 65 mm, smooth rubber pad, Shore A 60)

[0094] System resistance test

[0095] Resistance measurement in combination with a person according to DIN EN 61340-4-5:2019-04 (measuring device used: Metriso 3000 + steel handle + ESD foot: Weeger ESD-Clog, size 43, article number: 48512-30)

[0096] Walking test

[0097] Voltage measurement in combination with a person according to DIN EN 61340-4-5:2019-04 (measuring device used: Warmbier WT 5000 + steel handle + ESD foot: Weeger ESD-Clog, size 43, article number: 48512-30)

[0098]

[0099] Table 2

[0100]

[0101] Table 3

[0102]

[0103]

[0104] In additional tests, R was measured by using the same setup as described in Table 2, first column (SR-151 / SR-220W Co. / SR-2350ESD). G , further analysis of the use of conductive coatings containing conductive carbon black and epoxy coatings ( The performance differences of ground points added using a conductive paste containing copper powder (4404 Kontakt Paste Cu, No. 7) were compared with those added using a conductive paste containing copper powder (4404 Kontakt Paste Cu, No. 7). The installation of the added ground points and ESD coating followed the same procedure as above. The following types of added ground points (No. 3d and No. 7d) were studied and compared with the originally installed ground point (No. 1d). G The measurement results are shown in Table 6.

[0105]

[0106] Table 6

[0107] Surprisingly it was found that the method of the present invention can be used for a wide range of different types of pre-existing ESD coatings with different settings and ESD coating compositions / types. Added grounding points of all 6 types (No. 2-7) will meet the ESD requirements of DIN EN 61340-5-1 and ANSI ESD S20.20.

[0108] It was further found that variant No. 2 using graphite powder as the conductive material and variant No. 3 using the conductive primer "Sikafloor-220W Conductive" as the conductive material produced the best results in both the measurement of the ground resistance and the system test.

[0109] It is further found in Table 6 that both variant No. 7 using a paste conductive coating containing copper powder as the conductive material and variant No. 3 using a conductive primer "Sikafloor-220W Conductive" as the conductive material lead to similar results in the measurement of ground resistance, being superior in the case of No. 3.

Claims

1. A method of adding a grounding point to a pre-existing dissipative coating, comprising the following steps in the following order: i) placing a conductive insert (1) in a pre-existing dissipative coating (2); ii) placing a conductive layer (3) on said pre-existing dissipative coating (2) adjacent said conductive insert (1); iii) fastening the conductive layer (3) to the conductive insert (1); iv) connecting the conductive layer (3) and / or the conductive insert (1) to equipotential bonding.

2. The method according to claim 1, wherein: The conductive layer (3) is a washer, preferably having a diameter of 10 mm - 100 mm, preferably 20 mm - 80 mm, more preferably 40 mm - 80 mm.

3. A method according to any one of the preceding claims, wherein: The ground resistance of the pre-existing dissipative coating (2) is less than 10 9 ohm.

4. A method according to any one of the preceding claims, wherein the layer thickness of the pre-existing dissipative coating is less than 7 mm, suitably in the range of 0.5 to 5 mm, preferably 0.75 to 3 mm, most preferably 1 to 2 mm.

5. The method according to any of the preceding claims, wherein the pre-existing dissipative coating contains one or more conductive additives selected from carbon fibers, carbon nanotubes, carbon powder, graphite powder, silicon carbide, metal oxides, ammonium salts, heavy metal-containing or metal-containing fillers, especially antimony-containing and tin-containing fillers based on titanium dioxide or mica and ionic liquids, preferably selected from carbon fibers, carbon nanotubes, carbon powder, graphite powder, most preferably carbon fibers.

6. A method according to any one of the preceding claims, wherein: The term conductive means greater than 10 at 20°C 4 S / m, preferably greater than 10 5 Conductivity in S / m.

7. A method according to any one of the preceding claims, wherein: The conductive insert (1) is selected from a rod, a nail and a screw, preferably, the conductive insert (1) is a rod, most preferably a threaded rod.

8. A method according to any one of the preceding claims, wherein: In step i), the conductive insert (1) is placed into the pre-existing dissipative coating (2) by drilling a hole (4) in the pre-existing dissipative coating (2) and placing the conductive insert (1) into the hole (4), preferably the hole (4) has a diameter of 4mm-12mm, preferably 6mm-10mm, and a depth greater than>40mm, preferably>50mm, more preferably>50mm-100mm.

9. A method according to any one of the preceding claims, wherein: Conductive material (5) is placed in direct contact with the pre-existing dissipative coating (2) and the conductive layer (3) and / or the conductive insert (1).

10. The method according to claim 9, wherein: The conductive material (5) is selected from conductive powder, conductive tape and conductive paint. The conductive powder is preferably metal powder or graphite powder. The conductive tape is preferably metal tape or adhesive tape. The conductive paint is preferably selected from graphite powder and conductive paint.

11. A method according to any one of the preceding claims, wherein: In step iii), the conductive layer (3) is mechanically fastened to said conductive insert (1), preferably by fastening with a nut, more preferably by fastening with a self-locking nut.

12. A method according to any one of the preceding claims, wherein: Step i), drilling a hole (4) with a diameter of 6 mm to 10 mm and a depth greater than 50 mm in the pre-existing dissipative coating (2), and placing a metal rod, preferably a threaded rod, into the hole (4); Step ii), placing a metal washer around a metal rod, preferably a threaded rod, preferably with a diameter of 20 mm to 80 mm, more preferably 40 mm to 80 mm; Step iii) fastening the metal washer to a metal rod, preferably a threaded rod, by means of a nut; Step iv) Connecting metal washers and / or metal rods, preferably threaded rods, to the equipotential bonding.

13. The method according to claim 12, wherein: Before placing the metal rod into the hole (4), a conductive material (5) is added to the hole (4) or the metal rod, the conductive material (5) is preferably selected from graphite powder and conductive paint, the conductive paint is preferably a paint containing conductive carbon black and epoxy groups, the metal rod is preferably a threaded rod, and / or preferably, the conductive material (5) is placed between the metal washer and the pre-existing dissipative coating (2).

14. A method according to any of the preceding claims, wherein no additional coating, preferably a coating made of a cured reactive resin or reactive resin compound, more preferably a dissipative coating, is added on top of the conductive layer (3) after step ii) has been carried out, more preferably after step iii) has been carried out.

15. A method according to any one of the preceding claims, wherein the additional grounding point introduced according to the method is within a distance of 5-12 m, preferably 8-10 m, from a pre-existing grounding point.

16. Dissipative coating system, more particularly a floor coating system, comprising an added ground point obtained by the method according to any one of claims 1 to 15.

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