Temperature Control Method and Equipment for DMF Recovery Device

Abstract

The embodiments of the present application relate to the field of DMF recovery, and disclose a temperature control method and device based on a DMF recovery device. The method includes: obtaining the actual pressure and actual temperature of a preset temperature measurement point in the DMF recovery device; determining the temperature after pressure compensation according to the actual pressure, actual temperature and a preset temperature-pressure compensation model; wherein, the temperature-pressure compensation model is used to determine the influence value of pressure change on temperature according to the actual pressure, the reference pressure and the pressure compensation coefficient, and determine the temperature after pressure compensation according to the influence value and the actual temperature; controlling the temperature in the tower to be maintained at a set value according to the temperature after pressure compensation. It can at least solve the technical problems that the existing control technology of distillation columns has unreasonable temperature target setting and unstable product purity control.

Description

Technical Field

[0001] This application relates to the field of information technology, and particularly to a temperature control method and device based on a DMF recovery device. Background Art

[0002] In actual production, the requirement for rectification accuracy is that the overhead product needs to meet the design requirements of product quality, while the composition of the bottom product generally does not affect the product quality. Therefore, in order to meet the needs of the production process, relatively high requirements are often imposed on both the bottom temperature and the overhead temperature.

[0003] N,N-dimethylformamide, abbreviated as DMF, is a colorless and transparent liquid that is miscible with water, alcohols, ethers, ketones, esters, and aromatic hydrocarbons. It is relatively stable in water, but decomposes when heated or in the presence of strong bases. Industrially, multi-effect evaporation is used to recover DMF from wastewater to obtain a crude DMF product, which is then rectified to obtain high-purity refined DMF. Since DMF is easily decomposed by heat, a two-column process is adopted for the rectification section, namely a rectification column and a deacidification column. The main structure of the rectification column includes a column body, trays, a reboiler, a condenser, a reflux pipeline, and automatic control, on-site instruments, and accessories. These devices are combined to complete the rectification process. Since temperature plays a crucial role in the rectification process, existing technologies highly integrate temperature detection and control to improve the accuracy of temperature control.

[0004] However, the inventors found that there are at least the following technical problems in the related technologies: During the process of temperature detection and control, the influence of changes in the measurement environment on temperature is ignored, making it impossible for temperature to be used as an accurate control reference for the rectification column. Conventional control means can only set a fixed temperature target value and cannot cope with environmental changes, thus reducing the working efficiency of the DMF recovery rectification column. In summary, in the related technologies, the existing control technology for rectification columns has technical problems such as unreasonable temperature target setting and unstable product purity control. Summary of the Invention

[0005] An object of this application is to provide a temperature control method and device based on a DMF recovery device, at least to solve the technical problems of unreasonable temperature target setting and unstable product purity in the existing control technology for rectification columns.

[0006] To achieve the above object, some embodiments of this application provide the following aspects:

[0007] In a first aspect, some embodiments of the present application further provide a temperature control method based on a DMF recovery device, the method comprising: obtaining the actual pressure and actual temperature of a preset temperature measurement point in the DMF recovery device; determining the temperature after pressure compensation according to the actual pressure, actual temperature and a preset temperature-pressure compensation model; wherein, the temperature-pressure compensation model is used to determine the influence value of pressure change on temperature according to the actual pressure, the reference pressure and the pressure compensation coefficient, and determine the temperature after pressure compensation according to the influence value and the actual temperature; controlling the temperature in the tower to be maintained at a set value according to the temperature after pressure compensation.

[0008] In a second aspect, some embodiments of the present application further provide an electronic device, the electronic device comprising: one or more processors; and a memory storing computer program instructions, the computer program instructions, when executed, causing the processors to perform the steps of the method as described above.

[0009] Compared with the related art, in the solution provided by the embodiments of the present application, by obtaining the actual pressure and actual temperature of a preset temperature measurement point in the DMF recovery device, and determining the temperature after pressure compensation according to the actual pressure, actual temperature and a preset temperature-pressure compensation model; wherein, the temperature-pressure compensation model is used to determine the influence value of pressure change on temperature according to the actual pressure, the reference pressure and the pressure compensation coefficient, and determine the temperature after pressure compensation according to the influence value and the actual temperature, and then controlling the temperature in the tower to be maintained at a set value according to the temperature after pressure compensation. It can be seen that the present application can achieve precise monitoring of the operating state of the DMF recovery device by establishing a temperature-pressure model compensation model. It can be understood that during the operation process in the tower, pressure fluctuations are inevitable, and the pressure fluctuations will directly affect the temperature in the tower. The present application can reduce the error generated by the temperature control system through pressure compensation. Since the present application combines the pressure compensation coefficient, it can correct the temperature measurement value in real time while controlling the temperature in the tower to be maintained at a relatively accurate set value, thereby solving the technical problems in the related art that the temperature target setting of the rectification tower control technology is unreasonable and the product purity control is unstable. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplary illustrations do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements, unless otherwise stated, and the drawings in the drawings do not constitute a proportional limitation.

[0011] Figure 1 It is an exemplary flowchart of a temperature control method based on a DMF recovery device provided by some embodiments of the present application;

[0012] Figure 2 In a temperature control method based on a DMF recovery device provided according to some embodiments of the present application, it is a comparison chart of the effects of key temperature points of the second concentration tower before and after the temperature-pressure compensation model is put into use;

[0013] Figure 3 In a temperature control method based on a DMF recovery device provided according to some embodiments of the present application, it is a comparison chart of the effects of key temperature points of the rectification tower before and after the temperature-pressure compensation model is put into use;

[0014] Figure 4 In a temperature control method based on a DMF recovery device provided according to some embodiments of the present application, it is an exemplary flowchart of step S101;

[0015] Figure 5 In a temperature control method based on a DMF recovery device provided according to some embodiments of the present application, it is an exemplary flowchart of the construction method of the temperature-pressure compensation model;

[0016] Figure 6 In a temperature control method based on a DMF recovery device provided according to some embodiments of the present application, it is an exemplary flowchart for determining the reference temperature value of a preset temperature measurement point in the equipment manual according to the standard pressure, the actual temperature, and the preset model setting conditions;

[0017] Figure 7 It is an exemplary structural diagram of an electronic device provided according to some embodiments of the present application. Specific Embodiments

[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application.

[0019] First Embodiment

[0020] The first embodiment of the present application relates to a temperature control method based on a DMF recovery device. As Figure 1 shown, the method may include the following steps, as Figure 1 shown:

[0021] Step S101, obtaining the actual pressure and actual temperature of a preset temperature measurement point in the DMF recovery device;

[0022] Step S102: Determine the temperature after pressure compensation based on the actual pressure, actual temperature, and a preset temperature-pressure compensation model. The temperature-pressure compensation model is used to determine the influence value of pressure change on temperature according to the actual pressure, reference pressure, and pressure compensation coefficient, and determine the temperature after pressure compensation based on the influence value and the actual temperature.

[0023] Step S103: Control the temperature inside the tower to maintain at a set value according to the temperature after pressure compensation.

[0024] The following will elaborate on each of the above steps in detail.

[0025] Specifically for Step S101 and Step S102, in some examples, a preset number of temperature measurement points can be set at the top and bottom of each concentration tower and at the top and bottom of the rectification tower in the DMF recovery device, so as to implement temperature-pressure compensation control based on the temperature-pressure compensation model using these temperature measurement points. Exemplarily, the number of the temperature measurement points can be, but is not limited to, 8, 10, etc., and this embodiment does not make specific limitations on this.

[0026] Exemplarily, temperature sensors and pressure sensors can be arranged inside the tower. The controller of the DMF recovery device can read the real-time data of the pressure sensor and temperature sensor inside the tower through the OPC communication protocol, so as to obtain the actual pressure and actual temperature. Then, the controller can calculate the temperature after pressure compensation using the function provided by the temperature-pressure compensation model with these measured actual pressure and actual temperature. That is to say, in some examples, the temperature after pressure compensation can be the final temperature value calculated by the controller for adjusting temperature control.

[0027] Exemplarily, the pressure compensation coefficient Kp corresponding to the DMF recovery device can be determined through the historical data of the DMF recovery device and Aspen full-process simulation. This process may include: collecting the historical data of the DMF recovery device under different operating conditions, including key parameters such as temperature and pressure, analyzing these data to find the relationship between temperature and pressure, using chemical process simulation software such as Aspen Plus, according to the collected data and the physical and chemical principles of the chemical process, simulating the operation process of the device, and through the comparison of the simulation results and the actual data, adjusting the value of the pressure compensation coefficient Kp until the simulation results match the actual data, so as to determine the optimal pressure compensation coefficient Kp value. Once the pressure compensation coefficient Kp is determined, it can be used in the pressure compensation control formula to calculate the temperature after pressure compensation. The formula helps the controller calculate the temperature value considering the pressure influence based on the actually measured temperature and pressure, as well as the reference pressure, so as to more accurately control the temperature inside the tower. Through this method, it can be ensured that the temperature control of the DMF recovery device is more precise, adapts to pressure changes, and improves the operation efficiency and safety of the entire device.

[0028] Specifically for step S103, in some examples, the temperature after pressure compensation can be used as a feedback signal and input into the distributed control system (DCS) to adjust the temperature control, ensure that the temperature inside the tower is maintained at the set value, and thus improve the accuracy of temperature control and the operation efficiency of the device.

[0029] Optionally, in some embodiments, the temperature-pressure compensation model specifically determines the temperature after pressure compensation through the following function:

[0030]

[0031] Wherein, the represents the temperature after pressure compensation, the represents the actual temperature, the represents the pressure compensation coefficient, the represents the actual pressure, the represents the reference pressure, represents the influence value.

[0032] Specifically, in some examples, the can represent the actual temperature measured at the top of the first concentration tower, which is the temperature value measured by the temperature sensor in real time; the can represent the actual pressure measured at the top of the first concentration tower, which is the pressure value measured by the pressure sensor in real time. The reference pressure is a preset pressure value used to compare with the actual pressure to calculate the influence of pressure change on temperature. In the formula, Indicates the difference between the actual pressure and the reference pressure. Exemplarily, the first concentration tower in the DMF recovery device can be the starting point of the entire recovery process, and the performance and control accuracy of the first concentration tower have a direct impact on subsequent recovery and purification steps. Therefore, by precisely controlling the temperature and pressure of the first concentration tower, the entire recovery process can be ensured to operate efficiently and safely.

[0033] Specifically, in some examples, the pressure compensation coefficient is a proportionality coefficient used to represent the degree of influence of unit pressure change on temperature. That is to say, if the pressure changes by one unit, the temperature will correspondingly change by one unit. In some examples, the pressure compensation coefficient can be determined according to actual process conditions and equipment characteristics, and the embodiments of the present application do not make specific limitations on this.

[0034] Optionally, in some embodiments, the method for determining the pressure compensation coefficient may include:

[0035] Obtain the standard pressure and actual temperature of a preset temperature measurement point in the DMF recovery device; wherein, the standard pressure and the actual temperature are data provided in the equipment manual of the DMF recovery device under standard conditions;

[0036] Determine the pressure compensation coefficient according to the standard pressure and the actual temperature.

[0037] Specifically, in some examples, standard data can be obtained, that is, obtain the standard pressure and actual temperature of the preset temperature measurement point from the equipment manual of the DMF recovery device. These data represent the pressure and temperature values under standard conditions, such as usually the design or optimal operating conditions. Then, during actual operation, measure or record the actual temperature of the preset temperature measurement point in the DMF recovery device. This can be obtained through real-time monitoring by a temperature sensor. Then use the standard pressure and actual temperature to determine the pressure compensation coefficient. This coefficient can be used to adjust the output of the model to reflect the influence of actual pressure changes on temperature. The calculation of the pressure compensation coefficient may include the following steps: Based on physical laws or empirical formulas, determine the theoretical influence of pressure change on temperature; compare the difference between the actual temperature and the standard temperature to determine the actual influence of pressure change on temperature under actual conditions; combine the theoretical influence and the actual influence to calculate the pressure compensation coefficient that can adjust the model output under standard conditions to actual conditions.

[0038] Further, in some examples, the calculated pressure compensation coefficient is applied to the temperature-pressure compensation model to adjust the model output so that it more accurately reflects the temperature change under actual pressure conditions. Optionally, in practical applications, the effect of the pressure compensation coefficient can be verified. For example, the coefficient can be further adjusted to meet specific accuracy requirements. By this method, it can be ensured that the DMF recovery device can perform effective temperature control under different pressure conditions, thereby improving the safety and efficiency of operation.

[0039] In addition, in some examples, the advanced process control system's (APC) controller can execute a series of feedback correction measures to correct any deviations and ensure the effective execution of the control strategy by monitoring the data of the system operation state in real time and performing correction adjustments. Using this control method, the APC controller can accurately control the top temperature of each concentration tower, the top temperature of the rectification tower, the side draw temperature, and the liquid level of the rectification tower, ensuring the stable operation of each tower in the best state. This not only significantly reduces energy consumption and increases product yield but also guarantees the safety and reliability of operation.

[0040] It is not difficult to find that, compared with the related technology, in the solution provided by the embodiment of the present application, by obtaining the actual pressure and actual temperature of the preset temperature measurement points in the DMF recovery device, and according to the actual pressure, actual temperature, and the preset temperature-pressure compensation model, the temperature after pressure compensation is determined; wherein, the temperature-pressure compensation model is used to determine the influence value of the pressure change on the temperature according to the actual pressure, the reference pressure, and the pressure compensation coefficient, and determine the temperature after pressure compensation according to the influence value and the actual temperature, and then control the temperature in the tower to be maintained at the set value according to the temperature after pressure compensation. It can be seen that the present application can achieve precise monitoring of the operation state of the DMF recovery device by establishing a temperature-pressure model compensation model. It can be understood that during the operation process in the tower, pressure fluctuations are inevitable, and the pressure fluctuations will directly affect the temperature in the tower. The present application can reduce the error generated by the temperature control system through pressure compensation. Since the present application combines the pressure compensation coefficient, it can correct the temperature measurement value in real time while controlling the temperature in the tower to be maintained at a relatively accurate set value, thereby solving the technical problems in the related technology that the temperature target setting of the rectification tower control technology is unreasonable and the product purity control is unstable.

[0041] It is worth emphasizing that specifically, reference can be made to Figure 2 and Figure 3 as shown, Figure 2 which is the comparison chart of the key temperature points of the second concentration tower before and after the temperature-pressure compensation model is put into use, Figure 3It is a comparison diagram of the effects of key temperature points of the distillation column before and after the application of the temperature-pressure compensation model. It can be seen that the present application can effectively solve the technical problem of unreasonable temperature target setting in the control technology of the distillation column in the related art.

[0042] Second Embodiment

[0043] The second embodiment of the present application relates to a temperature control method based on a DMF recovery device. The second embodiment is an improvement based on the first embodiment. The specific improvement lies in that: in the second embodiment of the present application, a specific implementation manner for obtaining the actual pressure and actual temperature of a preset temperature measurement point in the DMF recovery device is provided.

[0044] Optionally, in some embodiments, the obtaining of the actual pressure and actual temperature of the preset temperature measurement point in the DMF recovery device, that is, step S101 may include the following steps, as Figure 4 shown:

[0045] Step S1011, determining the operation parameters of the tower in the DMF recovery device and the preset model input method;

[0046] Step S1012, determining the actual pressure and actual temperature of the preset temperature measurement point according to the operation parameters, the preset model input method, and the soft measurement model.

[0047] Optionally, in some embodiments, the operation parameters include any of the following combinations: bottom liquid temperature, top tower temperature, top tower pressure, the top tower temperature is a set temperature, and the top tower pressure is a set pressure; the preset model input method includes: predicting the actual temperature and actual pressure of the preset temperature measurement point in the tower according to at least one of the operation parameters included in the tower in the DMF recovery device.

[0048] Specifically, in some examples, the operation parameters may include the bottom liquid temperature, the top tower temperature, and the top tower pressure. It can be understood that these parameters are the basic conditions for the normal and stable operation of the tower, and directly affect product quality and energy consumption, etc. Specifically, the bottom liquid temperature is related to the temperature control in the concentration process; the top tower temperature can be used as a set temperature and is a key parameter for the operation of the distillation column, affecting product quality and energy consumption; the top tower pressure can be used as a set pressure and is the basic condition for the normal and stable operation of the tower. Once it fluctuates, it will affect the change of the parameters of the whole tower and even the whole system.

[0049] Specifically, in some examples, the preset model input method is used to represent how to input the operation parameters into the soft sensor model. Exemplarily, through the preset model input method, the actual temperature and actual pressure of a preset temperature measurement point in the column can be predicted based on the operation parameters (bottom liquid temperature, top temperature, top pressure) of the column in the DMF recovery device. These operation parameters can be used as input variables of the soft sensor model, and the actual temperature and actual pressure of the preset temperature measurement point can be predicted or estimated through the calculation of the model.

[0050] Exemplarily, the soft sensor model can be obtained by establishing the relationship between the input parameters and the output results. Optionally, in some embodiments, the soft sensor model includes at least one of a neural network soft sensor model, a fuzzy inference soft sensor model, a least squares support vector machine model, a Kalman filter model, a generalized regression neural network model, an ensemble learning model, a support vector regression model, and a partial least squares method model.

[0051] Specifically, in some examples, the soft sensor model in the DMF recovery device can collect the bottom liquid temperature, top temperature, and top pressure, etc., through process parameters (such as temperature and pressure sensor readings), and predict the actual temperature and actual pressure of the preset temperature measurement point. Exemplarily, the relationship between the input parameters and the output results can be established through a mathematical method, such as the least squares method, to obtain the soft sensor model.

[0052] It is not difficult to find that, compared with the related art, in the embodiments of the present application, by determining the operation parameters (bottom liquid temperature, top temperature, top pressure) of the column and the preset model input method, and combining with the soft sensor model, the actual temperature and actual pressure of the preset temperature measurement point in the column of the DMF recovery device can be predicted. Doing so can help relevant personnel monitor and control the operation of the column more accurately, so as to achieve the purpose of further optimizing the performance of the DMF recovery device.

[0053] The third embodiment

[0054] The third embodiment of the present application relates to a temperature control method based on a DMF recovery device. The third embodiment is an improvement based on the first embodiment. The specific improvement lies in that: in the third embodiment of the present application, another method for determining the influence value is provided.

[0055] Specifically, in some embodiments, the influence value can be specifically determined by the following formula:

[0056]

[0057] wherein, the represents the coefficient of thermal expansion, and the represents a constant term, and the constant term is used to characterize other factors affecting temperature.

[0058] Optionally, in some embodiments, the factor for characterizing other factors affecting temperature is specifically density. Correspondingly, the method for constructing the temperature-pressure compensation model may include the following steps, as Figure 5 shown:

[0059] Step S201, construct a temperature-pressure compensation model training set according to the preset process parameters of the DMF recovery device; the preset process parameters include: recovery temperature, bottom temperature, top and bottom pressures, feed rate, kettle liquid volume, bottom kettle liquid discharge rate; the training set contains a number of process parameters, and each process parameter includes a reference temperature, a reference pressure, and a reference density;

[0060] Step S202, substitute the reference temperature, reference pressure, and reference density in the training set into the initial temperature-pressure compensation model to train the temperature-pressure compensation model.

[0061] Specifically, in some examples, the preset process parameters include the recovery temperature, bottom temperature, top and bottom pressures, feed rate, kettle liquid volume, and bottom kettle liquid discharge rate. These parameters are key variables in the operation of the DMF recovery device, and they directly affect the performance and efficiency of the device

[0062] Specifically, in some examples, the reference temperature, reference pressure, and reference density included in each process parameter are key inputs for model training. These reference values represent the standards or expected values under specific process conditions and are used for comparison and correction with actual values.

[0063] Specifically, in some examples, the reference temperature, reference pressure, and reference density in the training set can be substituted into the initial temperature-pressure compensation model, and the model parameters can be adjusted through the training process to enable it to accurately predict or correct the actual temperature and pressure. Exemplarily, the temperature-pressure compensation model can be trained through a machine learning algorithm, such as a BP neural network. After training, the temperature-pressure compensation model can predict the actual temperature and actual pressure at the preset temperature measurement point based on the input actual process parameters (including actual temperature and actual pressure). Since this prediction process considers other factors affecting temperature such as density, more accurate compensation results can be provided.

[0064] It can be seen that in this embodiment, the temperature-pressure compensation model is constructed by collecting and organizing the key process parameters of the DMF recovery device, using these parameters to construct a training set, and training and optimizing the model through the training set, ultimately achieving accurate prediction and compensation of the actual temperature and pressure, which helps to improve the operation accuracy and efficiency of the DMF recovery device.

[0065] Further optionally, in some embodiments, after substituting the reference temperature, reference pressure, and reference density in the training set into the initial temperature-pressure compensation model to train the temperature-pressure compensation model, the method may further include:

[0066] According to the preset model setting conditions, correct the trained temperature-pressure compensation model until the trained temperature-pressure compensation model meets the preset accuracy test conditions, output the corrected temperature-pressure compensation model, and obtain the final temperature-pressure compensation model;

[0067] Among them, the preset model setting conditions include: the process parameters include the reference density, and the process parameters include: standard temperature, standard pressure, and standard density; the preset accuracy test conditions include: the trained temperature-pressure compensation model outputs the compensated temperature at the standard temperature.

[0068] Specifically, in some examples, the trained temperature-pressure compensation model can be corrected according to the preset model setting conditions. These preset conditions include the reference density in the process parameters, as well as the standard temperature, standard pressure, and standard density.

[0069] Specifically, in some examples, set the preset accuracy test conditions. For example, it can be that the trained temperature-pressure compensation model outputs the compensated temperature at the standard temperature to verify the accuracy of the model. Continuously correct the model until it meets the preset accuracy test conditions, and then output the corrected temperature-pressure compensation model as the final temperature-pressure compensation model. This process can ensure that the model can accurately predict the density change under different temperature and pressure conditions, so as to effectively compensate the operating parameters in the DMF recovery device. By this method, the operating accuracy and efficiency of the device can be improved, and the product quality and production safety can be ensured.

[0070] It is not difficult to find that in the embodiments of the present application, another method for determining the influence value is provided. Since the thermal expansion coefficient and the constant term for characterizing other factors affecting temperature are considered, it helps to improve the operating accuracy and efficiency of the DMF recovery device.

[0071] Fourth Embodiment

[0072] The fourth embodiment of the present application relates to a temperature control method based on a DMF recovery device. The fourth embodiment is an improvement on the basis of the third embodiment. The specific improvement lies in: the fourth embodiment of the present application provides a specific implementation manner for determining the reference temperature value of the preset temperature measurement point in the equipment manual.

[0073] Optionally, in some embodiments, the method further includes: determining a reference temperature value of a preset temperature measurement point in the equipment manual according to the standard pressure, the actual temperature, and the preset model setting conditions.

[0074] Specifically, in some examples, the standard pressure of the preset temperature measurement point can be obtained from the equipment manual of the DMF recovery device. This is the pressure value under standard conditions, such as the designed or optimal operating conditions. At the same time, the actual temperature of the preset temperature measurement point in the DMF recovery device is obtained or measured. Then, the model setting conditions are determined, and the setting conditions may include but are not limited to: the measurement range and accuracy of temperature and pressure, the response time of temperature and pressure, the control strategy of temperature and pressure, and the abnormal handling mechanism of temperature and pressure. Then, according to the standard pressure and the actual temperature, as well as the preset model setting conditions, the reference temperature value of the preset temperature measurement point in the equipment manual can be determined. It can be understood that the reference temperature value is the basis for the model to perform temperature compensation.

[0075] Exemplarily, the reference temperature value can be determined in the following way: using a physical model or an empirical formula, combining the standard pressure and the actual temperature, calculating the theoretical temperature under the standard pressure; comparing the difference between the actual temperature and the theoretical temperature to determine the required compensation amount; adjusting the theoretical temperature according to the preset model setting conditions to obtain the reference temperature value. Then, the determined reference temperature value is applied to the temperature-pressure compensation model for temperature compensation calculation.

[0076] Optionally, in some embodiments, determining the reference temperature value of the preset temperature measurement point in the equipment manual according to the standard pressure, the actual temperature, and the preset model setting conditions can further include the following steps, such as Figure 6 shown:

[0077] Step S301, calculating the standard temperature change value corresponding to the adjacent pressure and temperature in the DMF recovery device according to the actual temperature, the standard pressure, and the standard temperature value in the equipment manual;

[0078] Step S302, calculating the standard density change value corresponding to the standard temperature change value according to the standard temperature, the standard pressure, and the standard density;

[0079] Step S303, determining the reference temperature value of the preset temperature measurement point in the equipment manual according to the standard temperature, the standard density change value, and the standard temperature change value.

[0080] Specifically, in some examples, the actual temperature, the standard pressure, and the standard temperature value in the equipment manual are used to calculate the standard temperature change value corresponding to the adjacent pressure and temperature in the DMF recovery device. This can be carried out through the following formula:

[0081]

[0082] Among them, is a function used to calculate the standard temperature change value according to the actual temperature , standard pressure and standard temperature value to calculate the standard temperature change value .

[0083] Exemplarily, the actual temperature , represents the actual pressure; the standard temperature change value .

[0084] Substituting the actual temperature gives:

[0085]

[0086] Considering the characteristics of the gas state in the recovery device of the DMF, a coefficient determined by the characteristics of the recovery device of the DMF can be introduced for correction in this embodiment. The formula for the standard temperature change value can be:

[0087]

[0088] Specifically, in some examples, the standard density change value corresponding to the standard temperature change value is calculated using the standard temperature, standard pressure, and standard density. This can be done through the following formula:

[0089]

[0090] Among them, is a function used to calculate the standard density change value according to the standard temperature , standard pressure and standard density .

[0091] Exemplarily,

[0092] Among them, the represents the molar mass, the represents the molar gas constant, and the is a function representing the relationship between the standard temperature , standard pressure and the changed temperature. It is used to reflect how the temperature changes to a certain temperature under the given standard temperature and standard pressure conditions, such as . The is also a function representing the standard temperature and the standard pressure The relationship between the pressure after the change. It is used to reflect how the pressure changes to a certain pressure under the given standard temperature and standard pressure conditions, such as .

[0093] Specifically, in some examples, according to the standard temperature, the standard density change value, and the standard temperature change value, the reference temperature value of the preset temperature measurement point in the equipment manual is determined. This can be done through the following formula:

[0094]

[0095] where is a function used to determine the reference temperature value corresponding to the nth pressure value according to the standard temperature , the standard density change value and the standard temperature change value . Where n is a positive integer, and this process needs to be repeated for each pressure value to determine the reference temperature values of all preset temperature measurement points. .

[0096] Exemplarily

[0097] In the above example the function can be a function in the form of a linear combination is a coefficient determined by the characteristics of the recovery device of the DMF.

[0098] It can be understood that through the above process, it can be ensured that the DMF recovery device can perform effective temperature control under different pressure and temperature conditions, thereby improving the safety and efficiency of operation. Since the method takes into account the influence of density change on temperature, the temperature compensation is more accurate.

[0099] Optionally, in some embodiments, calculating the standard density change value corresponding to the standard temperature change value according to the standard temperature, the standard pressure, and the standard density may further include the following steps:

[0100] Determine the maximum and minimum values of the standard density in the equipment manual, and the corresponding maximum and minimum values of the standard temperature;

[0101] According to the standard temperature, the standard pressure, the maximum and minimum values of the standard density, calculate the standard density change value corresponding to the standard temperature change value under the standard pressure condition.

[0102] Specifically, in some examples, the maximum value of the standard density and the minimum value , and the maximum value of the corresponding standard temperature and the minimum value . These values are the limit values of density and temperature under standard pressure and standard operating conditions provided in the equipment manual.

[0103] Optionally, in some embodiments, calculating the standard density change value corresponding to the standard temperature change value according to the standard temperature, standard pressure, the maximum standard density value and the minimum standard density value may include:

[0104]

[0105] wherein, is the standard density change value corresponding to the standard temperature change value under standard pressure conditions; is a certain standard temperature value in the equipment manual; is the actually measured temperature value.

[0106] Specifically, obtaining the maximum value and the minimum value of the standard density in the equipment manual is used to define the possible change range of density under standard conditions. The standard temperature value and the actual temperature value of the preset temperature measurement point are used to define the change of temperature under actual conditions. Here, is the nth standard temperature value. Further, the standard density value at the actual temperature can be determined according to the calculated standard density change value and the nth standard density value , see the following formula:

[0107]

[0108] wherein, is the standard density value at the actual temperature; is the nth standard density value.

[0109] It should be noted that the calculation process is based on the premise that the change of density with temperature is linear, and it can be understood that this is reasonable within a certain range, especially for small temperature changes.

[0110] It can be understood that in this embodiment, the calculated standard density change value is based on the difference between the standard temperature and the actual temperature. This difference reflects the density change caused by the temperature change under the standard pressure. Applying the calculated standard density change value to the temperature-pressure compensation model to adjust the model output, so that it can more accurately reflect the density change under the actual temperature and pressure conditions. Through this process, it can be ensured that the operating parameters of the DMF recovery device can be effectively compensated under different temperature and pressure conditions, thereby improving the safety and efficiency of operation. This method takes into account the influence of density change on temperature, making the temperature compensation more accurate.

[0111] It should be noted that this embodiment can also be an improvement based on the first embodiment and / or the second embodiment.

[0112] It is not difficult to find that in the embodiments of the present application, by calculating the standard temperature change value corresponding to the adjacent pressure and temperature in the DMF recovery device according to the actual temperature, the standard pressure and the standard temperature value in the equipment manual; calculating the standard density change value corresponding to the standard temperature change value according to the standard temperature, standard pressure, and standard density; determining the reference temperature value of the preset temperature measurement point in the equipment manual according to the standard temperature, the standard density change value, and the standard temperature change value; a specific implementation method for determining the reference temperature value of the preset temperature measurement point in the equipment manual is provided, which is beneficial to making the temperature compensation more accurate.

[0113] The step division of the above various methods is only for clear description. When implemented, they can be combined into one step or some steps can be split into multiple steps. As long as the same logical relationship is included, they are all within the protection scope of the present application; adding insignificant modifications to the algorithm or process or introducing insignificant designs, but not changing the core design of its algorithm and process are all within the protection scope of this application.

[0114] In addition, some embodiments of the present application also provide an electronic device. The electronic device can be various forms of digital computers, such as laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, and so on. The electronic device can also be various forms of mobile devices, such as personal digital processors, cellular phones, smart phones, wearable devices, and other similar computing devices.

[0115] The electronic device includes: one or more processors; and a memory storing computer program instructions, and the computer program instructions, when executed, cause the processor to execute the steps of the method provided in any one or more of the above embodiments. Figure 7 An exemplary structural diagram of the electronic device is disclosed. As Figure 7As shown, the electronic device includes: one or more processors 1101, a memory 1102, and interfaces for connecting the components, including a high-speed interface and a low-speed interface. Each component is interconnected using different buses and can be mounted on a common motherboard or otherwise mounted as required. The processor can process instructions executed within the electronic device, including instructions stored in or on the memory to display graphical information of a GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories if needed. Similarly, multiple electronic devices can be connected, with each device providing some necessary operations (such as an array of servers, a set of blade servers, or a multi-processor system). Among them, the components, their connections and relationships, and their functions shown herein are merely examples and are not intended to limit the implementation of the present application described and / or claimed herein.

[0116] The electronic device may further include: an input device 1103 and an output device 1104. The processor 1101, the memory 1102, the input device 1103, and the output device 1104 can be connected via a bus or other means. Figure 7 Taking connection via a bus as an example.

[0117] The input device 1103 can receive input digital or character information and generate key signal inputs related to user settings and function controls of the electronic device, such as input devices like a touch screen, a keypad, a mouse, a trackpad, a touchpad, a pointing stick, one or more mouse buttons, a trackball, a joystick, etc. The output device 1104 can include a display device, an auxiliary lighting device (such as an LED), and a haptic feedback device (such as a vibration motor), etc. The display device can include, but is not limited to, a liquid crystal display (LCD), a light-emitting diode (LED) display, and a plasma display. In some embodiments, the display device can be a touch screen.

[0118] To provide interaction with the user, the electronic device can be a computer. The computer has: a display device for displaying information to the user (such as a CRT (cathode ray tube) or LCD (liquid crystal display) monitor); and a keyboard and a pointing device (such as a mouse or a trackball), through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (such as visual feedback, auditory feedback, or haptic feedback); and input from the user can be received in any form (including acoustic input, voice input, or haptic input).

[0119] In the embodiments of the present application, a computer program / instructions is stored on a computer-readable medium. When the computer program / instructions are executed by a processor, the steps of the method provided by any one or more of the above embodiments are implemented. The computer-readable medium may be included in the electronic device described in the above embodiments; or it may exist alone without being assembled into the device. The above computer-readable medium carries one or more computer-readable instructions.

[0120] The memory 1102 may be used as a non-transitory computer-readable storage medium and may be used to store non-transitory software programs, non-transitory computer-executable programs, and modules. By running the non-transitory software programs, instructions, and modules stored in the memory 1102, the processor 1101 executes various functional applications and data processing of the server to implement the program instructions / modules corresponding to the method provided by any one or more of the above embodiments in the embodiments of the present application.

[0121] The memory 1102 may include a program storage area and a data storage area. Among them, the program storage area may store an operating system and application programs required for at least one function; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory 1102 may include a high-speed random access memory and may also include a non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some embodiments, the memory 1102 may optionally include a memory remotely provided relative to the processor 1101, and these remote memories may be connected to the electronic device through a network. Examples of the above network include but are not limited to the Internet, an enterprise intranet, a local area network, a mobile communication network, and combinations thereof.

[0122] It should be noted that the computer-readable medium described in the present application may be a computer-readable signal medium, a computer-readable storage medium, or any combination of the two. The computer-readable medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the above. More specific examples of the computer-readable storage medium may include but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, the computer-readable medium may be any tangible medium that contains or stores a program, and the program may be used by or in combination with an instruction execution system, apparatus, or device.

[0123] A computer-readable medium includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. The information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassette tapes, magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information accessible by a computing device.

[0124] Computer program code for performing the operations of this application can be written in one or more programming languages or combinations thereof. The programming languages include object-oriented programming languages such as Java, Smalltalk, C++, and also include conventional procedural programming languages such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, executed as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computer (e.g., by using an Internet service provider to connect through the Internet).

[0125] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. For example, an application-specific integrated circuit (ASIC), a general-purpose computer, or any other similar hardware device can be used. In some embodiments, the software program of this application can be executed by a processor to implement the above steps or functions. Similarly, the software program of this application (including related data structures) can be stored in a computer-readable recording medium, such as a RAM memory, a magnetic or optical drive, or a floppy disk and similar devices. In addition, some steps or functions of this application can be implemented by hardware, for example, as a circuit that cooperates with a processor to execute each step or function.

[0126] The computer program product provided by the embodiments of the present application includes one or more computer programs / instructions. When the computer programs / instructions are executed by a processor, they entirely or partially generate the processes or functions described in the embodiments of the present application. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions may be transmitted from a website, computer, server, or data center to another website, computer, server, or data center in a wired manner (such as coaxial cable, optical fiber, digital subscriber line (DSL)) or a wireless manner (such as infrared, wireless, microwave, etc.). The computer-readable storage medium may be any available medium that can be accessed by a computer or a data storage device such as a server or a data center that includes one or more integrated available media. The available medium may be a magnetic medium (such as a floppy disk, a hard disk, a magnetic tape), an optical medium (such as a DVD), or a semiconductor medium (such as a solid state disk (SSD)), etc.

[0127] The flowcharts or block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of devices, methods, and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code that contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, and the combinations of blocks in the block diagram and / or flowchart, may be implemented by a dedicated hardware-based system for performing the specified functions or operations, or by a combination of dedicated hardware and computer instructions.

[0128] The scope of the present application is defined by the appended claims rather than the above description. Therefore, all changes that fall within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be construed as limiting the claims involved. In addition, it is obvious that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. The multiple units or devices stated in the apparatus claims may also be implemented by one unit or device through software or hardware. The words "first", "second", etc. are only used for descriptive distinction and do not represent any specific order, nor can they be understood as indicating or implying relative importance.

[0129] As described above, these are only specific embodiments of the present application. However, the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims, and the above embodiments should be regarded as exemplary and non-limiting.

Claims

1. A temperature control method based on a DMF recovery device, characterized in that, The method includes: Obtaining the actual pressure and actual temperature of a preset temperature measurement point in the DMF recovery device; Determining the temperature after pressure compensation according to the actual pressure, actual temperature and a preset temperature-pressure compensation model; wherein, the temperature-pressure compensation model is used to determine the influence value of pressure change on temperature according to the actual pressure, reference pressure and pressure compensation coefficient, and determine the temperature after pressure compensation according to the influence value and the actual temperature; Controlling the temperature in the tower to maintain at a set value according to the temperature after pressure compensation; Wherein, the temperature-pressure compensation model specifically determines the temperature after pressure compensation through a first function: ； The said represents the temperature after pressure compensation, the represents the actual temperature, the represents the pressure compensation coefficient, the represents the actual pressure, the represents the reference pressure, represents the influence value; Wherein, the influence value can be specifically determined by the following formula: ； Among them, the represents the coefficient of thermal expansion, and the represents the constant term, and the constant term is used to characterize other factors affecting temperature; Wherein, the factor used to characterize other factors affecting temperature is specifically density; Correspondingly, the construction method of the temperature-pressure compensation model includes: constructing a temperature-pressure compensation model training set according to the preset process parameters of the DMF recovery device; the preset process parameters include: recovery temperature, bottom temperature, top and bottom pressures, feed rate, bottom liquid volume, bottom kettle liquid discharge rate; the training set contains several process parameters, and each process parameter includes a reference temperature, reference pressure, and reference density; substituting the reference temperature, reference pressure, and reference density in the training set into the initial temperature-pressure compensation model to train the temperature-pressure compensation model.

2. The method according to claim 1, wherein The obtaining of the actual pressure and actual temperature of a preset temperature measurement point in the DMF recovery device includes: Determining the operating parameters of the tower in the DMF recovery device and a preset model input method; Determining the actual pressure and actual temperature of the preset temperature measurement point according to the operating parameters, the preset model input method and a soft measurement model; Wherein, the preset model input method includes: predicting the actual temperature and actual pressure of the preset temperature measurement point in the tower according to at least one of the operating parameters included in the DMF recovery device; the operating parameters include any combination of the following: bottom liquid temperature, top temperature, top pressure, the top temperature is a set temperature, and the top pressure is a set pressure.

3. The method according to claim 2, wherein The soft measurement model includes at least one of a neural network soft measurement model, a fuzzy inference soft measurement model, a least squares support vector machine model, a Kalman filter model, a generalized regression neural network model, an ensemble learning model, a support vector regression model, and a partial least squares method model.

4. The method according to claim 1, wherein After substituting the reference temperature, reference pressure, and reference density in the training set into the initial temperature-pressure compensation model to train the temperature-pressure compensation model, the method further includes: Modifying the trained temperature-pressure compensation model according to preset model setting conditions until the trained temperature-pressure compensation model meets the preset accuracy test conditions, outputting the modified temperature-pressure compensation model to obtain the final temperature-pressure compensation model.

5. The method according to claim 4, wherein The preset model setting conditions include: The process parameters include a reference density, and the process parameters include: standard temperature, standard pressure, standard density; The preset precision test conditions include: the compensated temperature at the standard temperature is output by the trained temperature-pressure compensation model.

6. The method according to claim 5, wherein The method further includes: determining a reference temperature value of a preset temperature measurement point in the equipment manual according to the standard pressure, the actual temperature, and the preset model setting conditions; Among them, the determining a reference temperature value of a preset temperature measurement point in the equipment manual according to the actual temperature and the preset model setting conditions includes: Calculating a standard temperature change value corresponding to adjacent pressures and temperatures in the DMF recovery device according to the actual temperature, the standard pressure, and the standard temperature value in the equipment manual; Calculating a standard density change value corresponding to the standard temperature change value according to the standard temperature, the standard pressure, and the standard density; Determining a reference temperature value of a preset temperature measurement point in the equipment manual according to the standard temperature, the standard density change value, and the standard temperature change value.

7. The method according to claim 6, characterized in that, The calculating a standard density change value corresponding to the standard temperature change value according to the standard temperature, the standard pressure, and the standard density includes: Determining the maximum and minimum standard densities in the equipment manual, as well as the corresponding maximum and minimum standard temperatures; Calculating a standard density change value corresponding to the standard temperature change value under the standard pressure condition according to the standard temperature, the standard pressure, the maximum and minimum standard densities.

8. The method according to claim 7, characterized in that, The calculating a standard density change value corresponding to the standard temperature change value under the standard pressure condition according to the standard temperature, the standard air pressure, the maximum and minimum standard densities includes: ； Wherein, is the maximum standard density in the equipment manual; is the minimum standard density in the equipment manual; is the standard temperature value of the preset temperature measurement point; is the actual temperature value of the preset temperature measurement point.

9. The method according to claim 1, characterized in that, The method for determining the pressure compensation coefficient includes: Obtaining the standard pressure and the actual temperature of a preset temperature measurement point in the DMF recovery device; wherein, the standard pressure and the actual temperature are data under the standard conditions provided in the equipment manual of the DMF recovery device; Determining a pressure compensation coefficient according to the standard pressure and the actual temperature.

10. An electronic device, characterized in that, The electronic device includes: One or more processors; and A memory storing computer program instructions that, when executed, cause the processor to perform the steps of the method according to any one of claims 1 to 9.

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