Resin cooling and drying system

Abstract

The invention discloses a resin cooling and drying system, and belongs to the technical field of resin material production and processing, the resin cooling and drying system comprises a trough, a plurality of air conveying pipelines are symmetrically arranged on the left and right inner side walls of the trough, cold air dryers matched with the air conveying pipelines are symmetrically arranged on the left and right outer side walls of the trough, and an electric heater is arranged in the trough. A temperature sensing control device body is arranged in the trough body, and the cold air drying machine, the electric heater and the temperature sensing control device body are all electrically connected with a control device. According to the resin cooling and drying system, a traditional water cooling mode is abandoned, the temperature in the trough is reduced through the cold air drying machine, moisture is reduced, the dryness is improved to a certain degree, and resin can be produced and processed in the rainy season in summer.

Description

Technical Field

[0001] The invention relates to the technical field of resin material production and processing, and in particular to a resin cooling and drying system. Background Art

[0002] The application of resin in the field of electric poles is mainly reflected in its unique performance and advantages. Resin-cast dry-type transformers have high mechanical strength, corrosion resistance, light weight, and are easy to install. They are suitable for power distribution and transmission systems and can work stably for a long time in a wide range of operating environments. Epoxy resin composite poles and crossarms can meet the material requirements of overhead transmission towers due to their excellent mechanical properties, electrical insulation and weather resistance. Compared with traditional reinforced concrete poles and fully galvanized steel towers, they have lighter weight and lower maintenance costs. These characteristics make resins more and more widely used in the field of electric poles and become an indispensable material in the construction of modern power facilities.

[0003] However, the requirements for temperature and humidity during the resin production process are very important, because the temperature and humidity conditions directly affect the performance and stability of the resin. Too low a temperature will slow down the curing speed of the resin, and may even cause the resin to freeze, affecting its mechanical strength and service life; too high a temperature will cause thermal decomposition of the resin, reducing the exchange capacity and service life; too high a humidity will cause the resin to absorb moisture, causing plasticization, swelling and hydrolysis, reducing the glass transition temperature of the resin, and further affecting its strength and stiffness; too low a humidity may cause the resin to dry too quickly, affecting the molding effect and product quality. Due to the abundant rainfall in summer, temperature and humidity are key factors affecting resin production and quality. Therefore, the traditional water cooling method of controlling temperature is not suitable for resin production requirements. Based on this, the present invention proposes a resin cooling and drying system. Summary of the invention

[0004] The purpose of the present invention is to provide a resin cooling and drying system to solve the above-mentioned problems.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] The present invention discloses a resin cooling and drying system, comprising a material trough, wherein a plurality of air ducts are symmetrically arranged on the left and right inner walls of the material trough, a cold air dryer matched with the air ducts is symmetrically arranged on the left and right outer walls of the material trough, an electric heater is arranged inside the material trough, a temperature sensing control device body is arranged inside the material trough, and the cold air dryer, the electric heater and the temperature sensing control device body are all electrically connected to a control device.

[0007] Furthermore, the cold air dryer includes a fan 1, a heat sink 1, a semiconductor refrigeration sheet, a heat sink 2 and a fan 2 which are arranged in sequence.

[0008] Furthermore, the heat sink 1 is a straight-surface heat sink.

[0009] Furthermore, the second heat sink is a curved heat sink.

[0010] Furthermore, the interior of the material trough is in an inverted trapezoidal structure.

[0011] Compared with the prior art, the beneficial technical effects of the present invention are:

[0012] The resin cooling and drying system of the invention detects the resin temperature in the material tank through the temperature sensor control device body, turns on the cold air dryer, and the cold air dryer generates low-temperature dry air and transports it to the material tank through the air duct to reduce the temperature in the material tank. When the specified temperature is reached, the cold air dryer automatically shuts down. That is, the resin cooling and drying system of the invention abandons the traditional water cooling method, and uses the cold air dryer to lower the temperature in the material tank, reduce the generation of moisture, and improve the dryness to a certain extent, so that the resin can be produced and processed even in the summer when there is abundant rain. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention will be further described below in conjunction with the accompanying drawings.

[0014] Figure 1 This is a front view of the resin cooling and drying system of the present invention;

[0015] Figure 2 This is the structure diagram of the cold air dryer;

[0016] Description of reference numerals: 1. material trough; 2. cold air dryer; 3. electric heater; 4. air delivery duct; 5. temperature sensor control device body;

[0017] 201. Fan 1; 202. Heat sink 1; 203. Semiconductor cooling sheet; 204. Heat sink 2; 205. Fan 2. DETAILED DESCRIPTION

[0018] like Figure 1 As shown, a resin cooling and drying system includes a material tank 1, the material tank 1 has an inverted trapezoidal structure, and the resin material is placed in the material tank 1. A plurality of air ducts 4 are symmetrically installed on the left and right inner walls of the material tank 1, and a cold air dryer 2 matched with the air duct 4 is symmetrically installed on the left and right outer walls of the material tank 1. An electric heater 3 is installed inside the material tank 1, and a temperature sensing control device body 5 is installed in the tank of the material tank 1. The cold air dryer 2, the electric heater 3 and the temperature sensing control device body 5 are all electrically connected to the control device. The control device is used to receive the temperature signal of the temperature sensing control device body 5 and control the opening state of the cold air dryer 2 and the electric heater 3.

[0019] like Figure 2As shown, the cold air dryer 2 includes a fan 1 201, a heat sink 1 202, a semiconductor cooling sheet 203, a heat sink 204 and a fan 205 which are installed in sequence. The fan 1 201 and the fan 2 205 generate wind flow through the rotation of the fan blades, thereby generating convection to the air inside the trough 1, thereby achieving the purpose of cooling.

[0020] The heat sink 1 202 is a straight-face heat sink, which is in direct contact with the air through a large metal surface, and can quickly transfer heat to the air, thereby effectively reducing the temperature of the component.

[0021] The second heat sink 204 is a curved heat sink, so that heat can be dissipated from multiple directions, resulting in a better heat dissipation effect.

[0022] The semiconductor cooling chip 203 is also called a thermoelectric cooling chip, which is a heat pump. It has the advantage of no sliding parts and is used in some places where space is limited, reliability is high, and there is no refrigerant pollution. By using the Peltier effect of semiconductor materials, when direct current passes through a thermocouple made of two different semiconductor materials in series, heat can be absorbed and released at both ends of the thermocouple respectively, so as to achieve the purpose of cooling.

[0023] The working process of the present invention is as follows:

[0024] First, when the temperature of the resin in the material tank 1 is higher than the set temperature range, the temperature sensor control device body 5 transmits a signal to the control device, and the control device controls the cold air dryer 2 to turn on; then, the outside air generates wind flow through the rotation of the fan blades of the second fan 205, and then passes through the heat sink 204 for the first heat dissipation, the semiconductor cooling sheet 203 for the second heat dissipation, and the heat sink 1 202 for the third heat dissipation, and then becomes low-temperature dry air, and under the action of the fan 1 201, it is transported to the material tank 1 through the air supply pipe 4 to reduce the temperature in the material tank 1. When the temperature in the material tank 1 reaches the specified temperature, the cold air dryer 2 is turned off;

[0025] Finally, when the temperature in the material tank 1 is lower than the set temperature range, the temperature sensor control device body 5 transmits the received signal to the control device, and the control device controls the electric heater 3 to turn on, and the material tank 1 increases the temperature. When the temperature in the material tank 1 reaches the specified temperature, the electric heater 3 is turned off, thereby achieving the purpose of controlling the temperature and dryness of the resin in the material tank 1.

[0026] The embodiments described above are only descriptions of the preferred modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. A resin cooling and drying system, characterized in that: The invention comprises a material trough (1), wherein a plurality of air supply pipes (4) are symmetrically arranged on the left and right inner walls of the material trough (1), a cold air dryer (2) matched with the air supply pipes (4) is symmetrically arranged on the left and right outer walls of the material trough (1), an electric heater (3) is arranged inside the material trough (1), a temperature sensing control device body (5) is arranged inside the material trough (1), and the cold air dryer (2), the electric heater (3) and the temperature sensing control device body (5) are all electrically connected to a control device.

2. The resin cooling and drying system according to claim 1, characterized in that: The cold air dryer (2) comprises a fan 1 (201), a heat sink 1 (202), a semiconductor cooling fin (203), a heat sink 2 (204) and a fan 2 (205) which are arranged in sequence.

3. The resin cooling and drying system according to claim 2, characterized in that: The heat sink 1 (202) is a straight heat sink.

4. The resin cooling and drying system according to claim 2, characterized in that: The second heat sink (204) is a curved heat sink.

5. The resin cooling and drying system according to claim 1, characterized in that: The inside of the material trough (1) is in an inverted trapezoidal structure.

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