MEMS sensor, preparation method of MEMS sensor and electronic equipment

Abstract

The embodiment of the invention discloses an MEMS sensor, a preparation method of the MEMS sensor and electronic equipment, the MEMS sensor comprises a substrate and an MEMS chip, the substrate is provided with a containing groove, the substrate comprises a side wall and a bottom wall which are connected, the containing groove is defined by the side wall and the bottom wall, the substrate is provided with a first opening and a third opening, and the first opening and the third opening are communicated with each other. The third opening is located in the bottom wall, the first end of the first opening is communicated with the outside, and the second end of the first opening is communicated with one side of the third opening; and the MEMS chip is arranged in the accommodating groove, and a back cavity of the MEMS chip is communicated with the third opening. Therefore, external sound signals or vibration signals can sequentially pass through the openings in the side wall and the bottom wall and act on the MEMS chip from the back cavity of the MEMS chip, so that a bottom sound inlet or air inlet structure can be formed, and the acoustic performance of the MEMS sensor is improved.

Description

Technical Field

[0001] The present invention relates to the field of micro-electromechanical technology, and more specifically, to a MEMS sensor, a method for preparing the MEMS sensor, and an electronic device. Background Art

[0002] MEMS sensors are structures manufactured based on micro-electro-mechanical systems (MEMS) technology. Simply put, MEMS sensors can use semiconductor materials to form capacitors and integrate capacitors on micro silicon wafers. Products formed using MEMS technology have the characteristics of small size and high sensitivity, and MEMS sensors also have good radio frequency interference (RFI) and electromagnetic interference (EMI) suppression capabilities.

[0003] However, for the current MEMS sensor structure, most of them simply stack the MEMS chip and the ASIC chip on a substrate, and then open a sound hole on the shell to form a top sound intake design, which makes the acoustic performance of the MEMS sensor poor. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a MEMS sensor, a method for preparing a MEMS sensor and a new technical solution for electronic equipment.

[0005] According to one aspect of the present invention, a MEMS sensor is provided.

[0006] The MEMS sensor comprises:

[0007] A base, wherein the base has a receiving groove, the base includes a side wall and a bottom wall connected to each other, the side wall and the bottom wall enclose the receiving groove, the base is respectively provided with a first opening and a third opening, and the third opening is located on the bottom wall, a first end of the first opening is communicated with the outside, and a second end of the first opening is communicated with one side of the third opening;

[0008] A MEMS chip is disposed in the containing groove, and a back cavity of the MEMS chip is communicated with the other side of the third opening.

[0009] Optionally, a second opening is further provided on the side wall, a first end of the second opening is communicated with the outside, and a second end of the second opening is communicated with the third opening.

[0010] Optionally, part of the first opening and part of the second opening are respectively located on the side wall, another part of the first opening and another part of the second opening are located on the bottom wall, and the first opening and the second opening are respectively connected to two sides of the third opening.

[0011] Optionally, along the extension direction of the third opening, a cross-section of the third opening is rectangular, arc-shaped or S-shaped.

[0012] Optionally, along the extension direction of the first opening, a cross-section of the first opening is Z-shaped, S-shaped or L-shaped.

[0013] Optionally, the second opening has the same shape as the first opening.

[0014] Optionally, an ASIC chip is also included, and the ASIC chip is arranged in the receiving groove.

[0015] Optionally, the ASIC chip is arranged at the bottom of the receiving groove, or the ASIC chip is arranged on the MEMS chip.

[0016] Optionally, an ASIC chip is further included, the substrate has a receiving cavity, and the ASIC chip is located in the receiving cavity.

[0017] Optionally, a breathable membrane is further included, wherein the breathable membrane is disposed on the substrate, and the breathable membrane can cover the first end of the first opening and the first end of the second opening.

[0018] Optionally, the first end of the first opening is opposite to the first end of the second opening, and the breathable membrane can cover the first end of the first opening, the first end of the second opening and close the receiving groove.

[0019] Optionally, the first end of the first opening and the first end of the second opening face the same direction, the breathable membrane is annular, and the MEMS sensor further comprises a cover plate, which is located on the inner side of the breathable membrane and can close the accommodating groove.

[0020] Optionally, a cover plate is further included, which is circumferentially connected to the side wall and can close the accommodating groove.

[0021] According to another aspect of the present invention, there is provided a method for preparing a MEMS sensor, comprising:

[0022] A substrate is manufactured, wherein the substrate has a receiving groove, the substrate comprises a side wall and a bottom wall connected to each other, the side wall and the bottom wall enclose the receiving groove, a first opening and a third opening are respectively provided on the substrate, and the third opening is located on the bottom wall, a first end of the first opening is connected to the outside, and a second end of the first opening is connected to one side of the third opening;

[0023] A MEMS chip is manufactured, wherein the MEMS chip is disposed in the receiving groove, and a back cavity of the MEMS chip is communicated with the other side of the third opening.

[0024] Optionally, it also includes:

[0025] A second opening is opened on the substrate, and a first end of the second opening is connected to the outside, and a second end of the second opening is connected to the third opening.

[0026] According to yet another aspect of the present invention, an electronic device is provided, comprising the above-mentioned MEMS sensor.

[0027] One technical effect of the embodiments of the present disclosure is:

[0028] The MEMS sensor includes a substrate and a MEMS chip, the substrate has a receiving groove, the substrate includes connected side walls and a bottom wall, the side walls and the bottom wall surround the receiving groove, the substrate is respectively provided with a first opening and a third opening, and the third opening is located on the bottom wall, the first end of the first opening is connected to the outside, and the second end of the first opening is connected to one side of the third opening; the MEMS chip is arranged in the receiving groove, and the back cavity of the MEMS chip is connected to the third opening. In this way, external sound signals or vibration signals can act on the MEMS chip through the openings on the side walls and the bottom wall in turn and from the back cavity of the MEMS chip, thereby forming a bottom sound or air intake structure, which is convenient for improving the acoustic performance of the MEMS sensor.

[0029] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0031] Figure 1 is a schematic diagram of a MEMS sensor according to an embodiment of the present disclosure;

[0032] Figure 2 is a schematic diagram of another MEMS sensor according to an embodiment of the present disclosure.

[0033] Description of reference numerals:

[0034] 1. Base; 11. Side wall; 111. First opening; 112. Second opening; 12. Bottom wall; 121. Third opening; 13. Accommodating groove; 2. MEMS chip; 21. Back cavity; 3. ASIC chip; 4. Breathable membrane; 5. Cover plate. DETAILED DESCRIPTION

[0035] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0036] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0037] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.

[0038] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0039] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0040] An embodiment of the present invention provides a MEMS sensor, which may be a MEMS microphone or a MEMS speaker.

[0041] like Figure 1 and Figure 2 As shown, the MEMS sensor provided by the embodiment of the present invention includes:

[0042] A substrate 1, wherein the substrate 1 has a receiving groove 13, the substrate 1 includes a side wall 11 and a bottom wall 12 connected to each other, the side wall 11 and the bottom wall 12 enclose the receiving groove 13, the substrate 1 is respectively provided with a first opening 111 and a third opening 121, and the third opening 121 is located on the bottom wall 12, a first end of the first opening 111 is communicated with the outside, and a second end of the first opening 111 is communicated with one side of the third opening 121;

[0043] The MEMS chip 2 is disposed in the receiving groove 13 , and the back cavity 21 of the MEMS chip 2 is communicated with the other side of the third opening 121 .

[0044] Specifically, the substrate 1 can be a PCB (Printed Circuit Board) substrate. On the one hand, the substrate 1 serves as the structural basis of the MEMS sensor, and the PCB substrate can be used to support related electronic components. On the other hand, the PCB substrate usually has good thermal conductivity, which helps to quickly dissipate the heat generated by the electronic components and maintain the stable operation of the MEMS sensor.

[0045] like Figure 1 and Figure 2 As shown, a receiving groove 13 is formed in the substrate 1, that is, the substrate 1 adopts a slotted design. The receiving groove 13 is used to receive and assemble other electronic components such as a MEMS chip (Micro-Electro-Mechanical Systems) 2 and an ASIC chip (Application Specific Integrated Circuit) 3, so that the internal space of the substrate 1 can be fully utilized, which is convenient for reducing the overall height of the MEMS sensor and facilitating the miniaturization and integration of the MEMS sensor.

[0046] Specifically, the substrate 1 may include a side wall 11 and a bottom wall 12, which are connected and together form a semi-enclosed receiving groove 13. The receiving groove 13 may be designed with a top opening to facilitate the entry of external sound signals or vibration signals. The size and shape of the receiving groove 13 need to be customized according to the specific size and layout of the MEMS chip 2 to ensure that the MEMS chip 2 can be firmly installed therein.

[0047] At predetermined positions on the substrate 1, the first opening 111 and the third opening 121 can be respectively opened by using precision processing techniques such as laser cutting, mechanical drilling or micro-machining. Figure 1 and Figure 2 As shown, one end of the first opening 111 is directly connected to the external environment for receiving external sound signals or vibration signals; the other end of the first opening 111 is connected to the third opening 121 on the bottom wall 12 so that the external sound signals or vibration signals can be smoothly transmitted to the MEMS chip 2.

[0048] Among them, the third opening 121 can be located on the bottom wall 12. On the one hand, it is convenient for the third opening 121 to be directly connected with the back cavity 21 of the MEMS chip 2, so as to reduce the loss of external sound signals or vibration signals, reduce attenuation and distortion, and thus improve the sensing accuracy of the MEMS chip 2; on the other hand, arranging the third opening 121 on the bottom wall 12 also facilitates the opening of the third opening 121, thereby reducing the processing difficulty of the MEMS sensor.

[0049] The third opening 121 can be opposite to the back cavity 21 of the MEMS chip 2, so that external sound signals or vibration signals can be directly transmitted to the back cavity 21 of the MEMS chip 2, which is convenient for the MEMS chip 2 to respond quickly. According to the actual design, the third opening 121 can be rectangular, arc-shaped, circular or other shapes.

[0050] like Figure 1 and Figure 2 As shown, part of the first opening 111 is located on the side wall 11 to facilitate communication with the outside world; another part of the first opening 111 is located on the bottom wall 12 to facilitate communication with the third opening 121, thereby forming a sound or air intake channel of the outside world - first opening 111 - third opening 121 - MEMS chip 2. Moreover, since the external signal sequentially passes through the side wall 11 and the bottom wall 12 and acts on the back cavity 21 of the MEMS chip 2, a bottom sound intake or air intake structure can be formed, which can also improve the reliability of the MEMS sensor.

[0051] The external signal sequentially passes through the side wall 11 and the bottom wall 12 and acts on the MEMS chip 2 from the back cavity 21, so that the openings on the side wall 11 and the bottom wall 12 and the back cavity 21 together form the front cavity of the MEMS chip 2, and the receiving groove 13 in the substrate 1 forms the back cavity of the MEMS chip 2. The size of the receiving groove 13 can be adjusted as required, so that the size of the back cavity of the MEMS chip 2 can be adjusted to adjust the signal-to-noise ratio of the MEMS chip 2 and the ability to pick up external signals, and thus the acoustic performance of the MEMS sensor can be adjusted.

[0052] In addition, the openings on the side wall 11 and the bottom wall 12 can form sound or air intake channels, so as to make full use of the internal space of the substrate 1; on the other hand, the design of the openings on the substrate 1 can also reduce the weight of the substrate 1 itself, thereby reducing the weight of the MEMS sensor and facilitating the lightweight development of the MEMS sensor.

[0053] Furthermore, by controlling the size, shape and position relationship between the first opening 111 and the third opening 121, it is possible to effectively control the frequency, direction and other characteristics of the external signal. This design enables the MEMS sensor to more sensitively capture external signals of a specific frequency or direction, and also suppress unnecessary background noise interference.

[0054] Optionally, a second opening 112 is further formed on the substrate 1 , a first end of the second opening 112 is communicated with the outside, and a second end of the second opening 112 is communicated with the third opening 121 .

[0055] like Figure 1 and Figure 2 As shown, the second opening 112 on the substrate 1 can form another sound or air inlet channel of the outside world - the second opening 112 - the third opening 121 - the MEMS chip 2, so as to form a double sound or air inlet channel, thereby improving the sensing accuracy of the MEMS chip 2 and the acoustic performance of the MEMS sensor. Moreover, the design of the double sound or air inlet channel also enhances the sensing capability of the MEMS sensor, so that the MEMS sensor can more sensitively capture external signals of a specific frequency or direction.

[0056] The second end of the second opening 112 can be connected to the second end of the first opening 111, that is, the second opening 112 and the first opening 111 pass through the side wall 11 and the bottom wall 12 of the substrate 1, which can facilitate the formation of the second opening 112 and the first opening 111. The first opening 111 is used to receive external signals on one side, and the second opening 112 is used to receive external signals on the other side, so as to enhance the sensing capability of the MEMS sensor.

[0057] Optionally, part of the first opening 111 and part of the second opening 112 are respectively located on the side wall 11 , another part of the first opening 111 and another part of the second opening 112 are located on the bottom wall 12 , and the first opening 111 and the second opening 112 are respectively connected to two sides of the third opening 121 .

[0058] like Figure 1 and Figure 2 As shown, part of the first opening 111 and part of the second opening 112 are located on the side wall 11 to facilitate communication with the outside; another part of the first opening 111 and another part of the second opening 112 are located on the bottom wall 12 to facilitate communication with the third opening 121, thereby forming a double sound or air intake channel of the outside-first opening 111-third opening 121-MEMS chip 2, and the outside-second opening 112-third opening 121-MEMS chip 2. Moreover, since the external signal sequentially passes through the side wall 11 and the bottom wall 12 and acts on the back cavity 21 of the MEMS chip 2, a bottom sound intake or air intake structure can be formed, and the reliability of the MEMS sensor can also be improved.

[0059] Optionally, along the extension direction of the third opening 121, the cross-section of the third opening 121 includes but is not limited to a rectangle, an arc and an S-shape. According to actual design requirements, the cross-sectional shape of the third opening 121 can be adjusted to adjust the transmission efficiency of the external signal between the substrate 1 and the MEMS chip 2.

[0060] Optionally, along the extension direction of the first opening 111, the cross-section of the first opening 111 is Z-shaped, S-shaped or L-shaped. According to actual design requirements, the cross-sectional shape of the first opening 111 can be adjusted so as to conveniently connect the outside world with the third opening 121, facilitating the MEMS sensor to sense external signals. Preferably, the cross-section of the first opening 111 is L-shaped, which can simplify the molding process of the first opening 111.

[0061] Optionally, the second opening 112 has the same shape as the first opening 111. On the one hand, it can facilitate the rapid molding of the two openings on the substrate 1 and reduce the difficulty of producing the MEMS sensor. On the other hand, setting the two openings on the substrate 1 to have the same shape can also ensure that the second opening 112 and the first opening 111 have basically the same ability to capture external signals, thereby improving the consistency of the sensing capability of the MEMS sensor.

[0062] Optionally, an ASIC chip 3 is further included. The ASIC chip 3 is arranged in the receiving groove 13, which can fully utilize the internal space of the substrate 1, thereby improving the space utilization rate of the MEMS sensor.

[0063] Optionally, the ASIC chip 3 is disposed at the bottom of the receiving groove 13 , or the ASIC chip 3 is disposed on the MEMS chip 2 .

[0064] like Figure 1 and Figure 2 As shown, the ASIC chip 3 is arranged at the bottom of the receiving groove 13 and is electrically connected to the MEMS chip 2, which can make full use of the internal space of the substrate 1 while conveniently assembling the ASIC chip 3, thereby improving the space utilization rate of the MEMS sensor. In addition, the ASIC chip 3 and the MEMS chip 2 are arranged at the bottom of the receiving groove 13 respectively, which can also facilitate the gold wire connection between the two and reduce the difficulty of wiring.

[0065] In another embodiment, the ASIC chip 3 may be stacked on the MEMS chip 2 to meet different usage requirements.

[0066] Optionally, an ASIC chip 3 is further included, and a receiving cavity is provided in the substrate 1, and the ASIC chip 3 is located in the receiving cavity. That is, a receiving groove can be further provided in the substrate 1, the receiving groove forms a receiving cavity, and the ASIC chip 3 is placed in the receiving groove, so that the ASIC chip 3 is buried in the substrate 1, and the internal space of the substrate 1 can be fully utilized, thereby improving the space utilization rate of the MEMS sensor.

[0067] Optionally, a breathable membrane 4 is further included. The breathable membrane 4 is disposed on the substrate 1 , and the breathable membrane 4 can cover the first end of the first opening 111 and the first end of the second opening 112 .

[0068] Specifically, a breathable membrane 4 can be provided at one end of the first opening 111 connected to the outside and at one end of the second opening 112 connected to the outside. On the one hand, the breathable membrane 4 can shield the first opening 111 and the second opening 112 to prevent water stains, dirt and other foreign objects from entering the MEMS sensor through the first opening 111 and the second opening, thereby extending the service life of the MEMS sensor.

[0069] On the other hand, the provision of the breathable membrane 4 allows external sound signals or vibration signals to pass through the breathable membrane 4 and enter the first opening 111 and the second opening 112, thereby entering the corresponding sound inlet or air inlet channels, facilitating normal sensing of the MEMS sensor.

[0070] According to the specific positions and shapes of the first opening 111 and the second opening 112 , the breathable membrane 4 of different shapes, such as ring shape, sheet shape, etc., can be matched.

[0071] Optionally, the first end of the first opening 111 is opposite to the first end of the second opening 112 , and the breathable membrane 4 can cover the first end of the first opening 111 , the first end of the second opening 112 and close the receiving groove 13 .

[0072] like Figure 2 As shown, the cross-sections of the first opening 111 and the second opening 112 are both U-shaped, the first opening 111 and the second opening 112 are opposite to each other, and one end of the first opening 111 communicating with the outside and one end of the second opening 112 communicating with the outside are respectively facing the receiving groove 13.

[0073] A breathable membrane 4 may be provided on the substrate 1, and the breathable membrane 4 may be connected to the top of the receiving groove 13, so that the breathable membrane 4 can close the first opening 111, the second opening 112 and the receiving groove 13 to form a closed receiving space, thereby protecting the electronic components in the MEMS sensor. The breathable membrane 4 and the substrate 1 can enclose a closed receiving space, without the need for a separate housing, and thus reducing the production cost of the MEMS sensor.

[0074] In addition, the provision of the breathable membrane 4 on the substrate 1 enables external sound signals or vibration signals to pass through the breathable membrane 4 and enter the first opening 111 and the second opening 112, thereby entering the corresponding sound inlet or air inlet channels. The size of the breathable membrane 4 itself can enhance the signal capture capability of the MEMS chip 2, thereby also expanding the sensing range of the MEMS sensor.

[0075] Optionally, the first end of the first opening 111 and the first end of the second opening 112 face the same direction, the breathable membrane 4 is annular, and the MEMS sensor further includes a cover plate 5 , which is located on the inner side of the breathable membrane 4 and can close the receiving groove 13 .

[0076] like Figure 1 As shown, one end of the first opening 111 connected to the outside and the other end of the second opening 112 connected to the outside are respectively facing the outside, and a breathable membrane 4 is arranged at the first opening 111 and the second opening 112, which can form a sound intake or air intake channel while protecting the first opening 111 and the second opening 112 to prevent water stains, dirt and other foreign objects from entering the inside of the MEMS sensor through the first opening 111 and the second opening, thereby extending the service life of the MEMS sensor.

[0077] Since the first end of the first opening 111 and the first end of the second opening 112 are usually located on the side wall 11 , an annular breathable membrane 4 may be provided to cover the first opening 111 and the second opening 112 with an annular effective area.

[0078] like Figure 1 As shown, a cover plate 5 can be provided on the inner side of the breathable membrane 4. The cover plate 5 is mostly made of metal material. The cover plate 5 is used to close the receiving groove 13 and together with the base 1 form a closed receiving space, which can ensure that external sound signals or vibration signals can only pass through the breathable membrane 4 and enter the MEMS chip 2 from the first opening 111 and the second opening 112.

[0079] Optionally, a cover plate 5 is further included, wherein the cover plate 5 is circumferentially connected to the side wall 11 and can close the receiving groove 13 .

[0080] Specifically, the cover plate 5 can also be connected to the side wall 11, and the cover plate 5 is located at the lower side of the first opening 111 and the second opening 112, so that the cover plate 5 can close the receiving groove 13 and together with the base 1 form a closed receiving space, which can ensure that external sound signals or vibration signals can only pass through the breathable membrane 4 and enter the MEMS chip 2 from the first opening 111 and the second opening 112, and can also reduce the overall height of the MEMS sensor.

[0081] The cover plate 5 is located at the lower side, and the breathable membrane 4 covering the first opening 111 and the second opening 112 is located at the upper side, so as to be suitable for different application environments.

[0082] The embodiment of the present invention further provides a method for preparing the aforementioned MEMS sensor, comprising:

[0083] A substrate 1 is manufactured, wherein the substrate 1 has a receiving groove 13, and the substrate 1 includes a side wall 11 and a bottom wall 12 connected to each other, wherein the side wall 11 and the bottom wall 12 enclose the receiving groove 13, and a first opening 111 and a third opening 121 are respectively provided on the substrate 1, and the third opening 121 is located on the bottom wall 12, wherein a first end of the first opening 111 is connected to the outside, and a second end of the first opening 111 is connected to one side of the third opening 121;

[0084] A MEMS chip 2 is manufactured. The MEMS chip 2 is disposed in the receiving groove 13 , and the back cavity 21 of the MEMS chip 2 is communicated with the other side of the third opening 121 .

[0085] like Figure 1 and Figure 2 As shown, the third opening 121 can be located on the bottom wall 12. On the one hand, it is convenient for the third opening 121 to be directly connected with the back cavity 21 of the MEMS chip 2, so as to reduce the loss of external sound signals or vibration signals, reduce attenuation and distortion, and thus improve the sensing accuracy of the MEMS chip 2; on the other hand, arranging the third opening 121 on the bottom wall 12 also facilitates the opening of the third opening 121, thereby reducing the processing difficulty of the MEMS sensor.

[0086] Part of the first opening 111 is located on the side wall 11 to facilitate communication with the outside world; another part of the first opening 111 is located on the bottom wall 12 to facilitate communication with the third opening 121, thereby forming a sound or air intake channel of the outside world - first opening 111 - third opening 121 - MEMS chip 2. Moreover, since the external signal sequentially passes through the side wall 11 and the bottom wall 12 and acts on the back cavity 21 of the MEMS chip 2, a bottom sound intake or air intake structure can be formed, which can also improve the reliability of the MEMS sensor.

[0087] The external signal sequentially passes through the side wall 11 and the bottom wall 12 and acts on the MEMS chip 2 from the back cavity 21, so that the openings on the side wall 11 and the bottom wall 12 and the back cavity 21 together form the front cavity of the MEMS chip 2, and the receiving groove 13 in the substrate 1 forms the back cavity of the MEMS chip 2. The size of the receiving groove 13 can be adjusted as required, so that the size of the back cavity of the MEMS chip 2 can be adjusted to adjust the signal-to-noise ratio of the MEMS chip 2 and the ability to pick up external signals, and thus the acoustic performance of the MEMS sensor can be adjusted.

[0088] Optionally, it also includes:

[0089] A second opening 112 is opened on the substrate 1 , and a first end of the second opening 112 is connected to the outside, and a second end of the second opening 112 is connected to the third opening 121 .

[0090] like Figure 1 and Figure 2 As shown, the second opening 112 on the substrate 1 can form another sound or air inlet channel of the outside world - the second opening 112 - the third opening 121 - the MEMS chip 2, so as to form a double sound or air inlet channel, thereby improving the sensing accuracy of the MEMS chip 2 and the acoustic performance of the MEMS sensor. Moreover, the design of the double sound or air inlet channel also enhances the sensing capability of the MEMS sensor, so that the MEMS sensor can more sensitively capture external signals of a specific frequency or direction.

[0091] The present invention also provides an electronic device, comprising the above-mentioned MEMS sensor, wherein the electronic device includes but is not limited to a mobile phone, a tablet and a computer.

[0092] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0093] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A MEMS sensor, characterized in that: include: A base (1), the base (1) having a receiving groove (13), the base (1) comprising a side wall (11) and a bottom wall (12) connected to each other, the side wall (11) and the bottom wall (12) enclosing the receiving groove (13), the base (1) being respectively provided with a first opening (111) and a third opening (121), and the third opening (121) being located on the bottom wall (12), the first end of the first opening (111) being in communication with the outside, and the second end of the first opening (111) being in communication with one side of the third opening (121); A MEMS chip (2), the MEMS chip (2) being arranged in the containing groove (13), and the back cavity (21) of the MEMS chip (2) being in communication with the other side of the third opening (121).

2. The MEMS sensor according to claim 1, characterized in that: The base (1) is also provided with a second opening (112), a first end of the second opening (112) being in communication with the outside, and a second end of the second opening (112) being in communication with the third opening (121).

3. The MEMS sensor according to claim 2, characterized in that: Part of the first opening (111) and part of the second opening (112) are respectively located on the side wall (11), another part of the first opening (111) and another part of the second opening (112) are located on the bottom wall (12), and the first opening (111) and the second opening (112) are respectively connected to two sides of the third opening (121).

4. The MEMS sensor according to claim 2, characterized in that: Along the extension direction of the third opening (121), the cross-section of the third opening (121) is rectangular, arc-shaped or S-shaped.

5. The MEMS sensor according to claim 3, characterized in that: Along the extension direction of the first opening (111), the cross section of the first opening (111) is Z-shaped, S-shaped or L-shaped.

6. The MEMS sensor according to claim 5, characterized in that: The second opening (112) has the same shape as the first opening (111).

7. The MEMS sensor according to claim 1, characterized in that: It also comprises an ASIC chip (3), wherein the ASIC chip (3) is arranged in the containing groove (13).

8. The MEMS sensor according to claim 7, characterized in that: The ASIC chip (3) is arranged at the bottom of the containing groove (13), or the ASIC chip (3) is arranged on the MEMS chip (2).

9. The MEMS sensor according to claim 1, characterized in that: It also comprises an ASIC chip (3); the substrate (1) has a receiving cavity, and the ASIC chip (3) is located in the receiving cavity.

10. The MEMS sensor according to claim 2, characterized in that: It also comprises a breathable membrane (4), wherein the breathable membrane (4) is arranged on the substrate (1), and the breathable membrane (4) is capable of covering the first end of the first opening (111) and the first end of the second opening (112).

11. The MEMS sensor according to claim 10, characterized in that: The first end of the first opening (111) is opposite to the first end of the second opening (112), and the breathable membrane (4) is capable of covering the first end of the first opening (111), the first end of the second opening (112) and closing the containing groove (13).

12. The MEMS sensor according to claim 10, characterized in that: The first end of the first opening (111) and the first end of the second opening (112) are oriented in the same direction, the air permeable membrane (4) is annular, and the MEMS sensor further comprises a cover plate (5), the cover plate (5) is located on the inner side of the air permeable membrane (4), and the cover plate (5) is capable of closing the receiving groove (13).

13. The MEMS sensor according to claim 10, characterized in that: It also includes a cover plate (5), which is circumferentially connected to the side wall (11) and can close the accommodating groove (13).

14. A method for preparing a MEMS sensor according to any one of claims 1 to 13, characterized in that: include: A substrate is manufactured, wherein the substrate has a receiving groove, the substrate comprises a side wall and a bottom wall connected to each other, the side wall and the bottom wall enclose the receiving groove, a first opening and a third opening are respectively provided on the substrate, and the third opening is located on the bottom wall, a first end of the first opening is connected to the outside, and a second end of the first opening is connected to one side of the third opening; A MEMS chip is manufactured, wherein the MEMS chip is disposed in the receiving groove, and a back cavity of the MEMS chip is communicated with the other side of the third opening.

15. The preparation method according to claim 14, characterized in that: Also includes: A second opening is opened on the substrate, and a first end of the second opening is connected to the outside, and a second end of the second opening is connected to the third opening.

16. An electronic device, characterized in that: A MEMS sensor comprising any one of claims 1 to 13.

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