A thin film material for capacitor and preparation method thereof

Abstract

The present application relates to the technical field of metal evaporation film, and specifically discloses a thin film material for capacitors and a preparation method thereof. A preparation method for a thin film material for capacitors, comprising the following steps: S1: Plasma treatment is performed on the surface of a substrate, and the substrate is set aside after the treatment; a precursor liquid is evenly applied on the surface of the substrate after plasma treatment, and the substrate is placed in a vacuum drying oven and heated to 75°C. After reacting for 5 hours, a stress layer is formed on the surface of the substrate, and then the substrate is taken out and soaked in a mixture of deionized water and anhydrous ethanol for 20 minutes to dissolve and fall off the stress layer, and finally washed and dried for use; S2: Under high vacuum conditions, the copper alloy is placed in an electric heating boat for heating, melting and sublimation to form a coating on the surface of the substrate. The thin film material for capacitors prepared by the present application has the advantages of strong adhesion, round metallic luster and high brightness.

Description

Technical Field

[0001] The present application relates to the technical field of metal vapor-deposited films, and more specifically, to a thin film material for capacitors and a preparation method thereof. Background Art

[0002] Metal-plated polymer film is a vacuum evaporation process that heats and sublimates metal, and then adheres to the surface of the polymer film substrate to form a coating. Metal-plated polymer film has excellent comprehensive properties such as relative dielectric constant, working field strength, and dielectric loss tangent value, and is widely used in capacitors in flexible DC transmission, rail transportation and other fields.

[0003] As the capacity and voltage level of electronic power capacitors gradually increase, the performance of capacitors is also increasing. How to improve the reliability and safety of capacitors has become an important issue, which puts higher requirements on the performance of metal-plated polymer films. An important problem faced by metal-plated polymer films is the strength of the bonding between the metal coating and the polymer film. If the bonding between the metal coating and the polymer film is weak, cracks, peeling and other undesirable phenomena are likely to occur after long-term use, resulting in aging or failure of the capacitor's performance. Summary of the invention

[0004] In order to further enhance the bonding strength between the metal plating layer and the capacitor film material, the present application provides a capacitor film material and a preparation method thereof.

[0005] In a first aspect, the present application provides a method for preparing a capacitor thin film material, using the following technical solution:

[0006] A method for preparing a capacitor film material, characterized in that it comprises the following steps:

[0007] S1: washing and drying the surface of the substrate, and then performing surface treatment; the surface treatment comprises the following steps:

[0008] 1) The washed and dried substrate is sent into a vacuum chamber, and a treatment gas with a pressure of 0.05 MPa is filled into the vacuum chamber, and then plasma treatment is performed, and the substrate is set aside after treatment;

[0009] 2) 150 g of deionized water, 20 g of amino acid derivative, 35 g of carbomer, 15 g of maleimide, 3.5 g of polyethylene glycol, and 50 mL of γ-aminopropyltriethoxysilane were mixed evenly, stirred at 60 ° C for 30 min, and then ammonia water was added to adjust the pH value to 9.5 to prepare a precursor solution;

[0010] 3) The precursor liquid is evenly applied on the surface of the substrate after plasma treatment, and the substrate is placed in a vacuum drying oven and heated to 75°C. After reacting for 5 hours, a stress layer is formed on the surface of the substrate. The substrate is then taken out and immersed in a mixture of deionized water and anhydrous ethanol for 20 minutes to dissolve and fall off the stress layer. The substrate is finally washed and dried for standby use;

[0011] S2: Under high vacuum conditions, the copper alloy is placed in an electric heating boat to heat, melt and sublime to form a coating on the surface of the substrate;

[0012] S3: Perform aging treatment on the substrate after evaporation, and then obtain the finished product after cutting and inspection.

[0013] By adopting the above technical solution, the surface of the substrate is first cleaned to remove oil and dust on the surface, and then plasma treatment is performed. The surface of the substrate is bombarded by gas ions and electrons. On the one hand, the surface of the substrate is further deeply cleaned, and on the other hand, polar groups can be introduced on the surface of the substrate to enhance the bonding strength between the substrate and the coating during the subsequent evaporation process.

[0014] In addition, the present application applies a precursor liquid on the surface of the substrate. Under appropriate temperature conditions, the carboxyl groups on the amino acid derivatives and the carbomer molecules form supramolecular interactions with the amino groups of γ-aminopropyltriethoxysilane. Then, the γ-aminopropyltriethoxysilane undergoes a hydrolysis and polycondensation reaction under alkaline conditions. Under the cross-linking action of maleimide, the applied precursor liquid is dried and solidified to form a stress layer. Since the substrate itself is an elastic material, a double-layer stress difference is generated between the stress layer and the substrate, thereby forming micro-nano wrinkles on the surface of the substrate, which greatly increases the specific surface area of ​​the substrate surface and the number of reactive and contact sites. In the subsequent evaporation process, the interfacial force between the copper plating layer and the substrate surface is stronger.

[0015] In addition, during the evaporation process, the micro-nano wrinkles on the surface of the substrate can also absorb and disperse stress, avoid deformation of the substrate due to thermal stress generated during the evaporation process, reduce the thickness difference of the deposited coating, and help form a coating with uniform thickness, density, and strong adhesion. In the subsequent use process, the coating is not easy to peel off, break down, and other undesirable phenomena.

[0016] Preferably, the amino acid derivative is one or more of phthalylglycine and N-benzoylglycine.

[0017] Further preferably, the amino acid derivative consists of phthalylglycine and N-benzoylglycine in a mass ratio of 1.5:1.

[0018] By adopting the above technical solution, the type ratio of amino acid derivatives is optimized and adjusted, the molecular steric hindrance of the amino acid derivatives is adjusted, and the supramolecular interaction between the amino acid derivatives and γ-aminopropyltriethoxysilane is enhanced, which is beneficial to the construction of the stress layer.

[0019] Preferably, the carbomer is one or more of carbomer 940, carbomer 941, and carbomer 980.

[0020] By adopting the above technical scheme, testing and screening the types of carbomer, adjusting the viscosity of the precursor solution and the number of carboxyl groups per unit molecular weight, the interaction between the carboxyl groups and the amino groups is further enhanced, promoting the lateral and longitudinal growth of the supramolecular network system, and making the anisotropy of the stress layer better.

[0021] Preferably, in step S3, the copper alloy comprises the following components in mass percentage: 99.6% copper and 0.4% rare earth elements.

[0022] By adopting the above technical solution, compared with pure copper, the use of copper alloy as the evaporation material can avoid oxidation during the evaporation process to a greater extent. Rare earth elements can absorb oxygen and have a good deoxidation effect, effectively preventing the generation of oxides when copper is heated and reducing the oxidation rate of copper. Moreover, after doping the coating with trace amounts of rare earth elements, the strength, hardness, toughness and corrosion resistance of the coating can be improved, and the bonding strength between the coating and the substrate is also improved.

[0023] Preferably, the rare earth element is one or more of yttrium, lanthanum, cerium, rhenium and samarium.

[0024] By adopting the above technical solution, the type composition of rare earth elements is optimized and adjusted, the amount of copper oxide generated is further reduced, and the wrinkling and deformation of the coating caused by copper oxide can be better suppressed.

[0025] Preferably, in step 1), the processing gas is composed of argon and oxygen in a volume ratio of 1:3.5.

[0026] By adopting the above technical solution, the proportion composition of the processing gas is tested and screened, and more polar groups are introduced on the surface of the substrate to enhance the bonding strength between the stress layer and the substrate, and between the coating and the substrate.

[0027] Preferably, in step S3, the high vacuum condition is a pressure less than 2.0×10 -4 mbar.

[0028] By adopting the above technical solution, the vacuum conditions are optimized and adjusted, the amount of copper oxide generated is further reduced, the deposition quality of the coating is improved, and the density and uniformity of the coating as well as the bonding strength with the substrate are increased.

[0029] Preferably, in step S1, the thickness of the substrate is 12 μm.

[0030] In a second aspect, the present application provides a thin film material for capacitors, which is prepared by the above-mentioned preparation method.

[0031] In summary, this application has the following beneficial effects:

[0032] 1. During the evaporation process of the substrate, copper will be oxidized to produce copper oxide. During the formation of copper oxide, stress will be generated in the coating, resulting in strong deformation. This deformation will cause cracking of the coating and a decrease in density. The present application forms a stress layer on the surface of the substrate through a precursor liquid, thereby constructing micro-nano wrinkles on the surface of the substrate. The micro-nano wrinkles are used to absorb and disperse the stress generated during the copper oxidation process and the evaporation process of the substrate, thereby greatly improving the bonding strength between the substrate and the coating.

[0033] 2. In this application, copper alloy is preferably used as the evaporation material, and rare earth elements are used to weaken the oxidation of copper, further reduce the amount of copper oxide generated in the coating, reduce the deformation and stress caused by the formation of copper oxide, and improve the quality and adhesion of the coating.

[0034] 3. The capacitor film material prepared by the preparation method of the present application has high coating bonding strength, strong adhesion, round metallic luster, high brightness, is not easy to crack, peel off, or break down during use, and has high stability and life. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a micrograph of the capacitor film material of Example 1 of the present application.

[0036] Figure 2 This is a micrograph of the capacitor film material of Example 2 of the present application.

[0037] Figure 3 This is a micrograph of the capacitor film material of Example 3 of the present application.

[0038] Figure 4 This is a microscopic photograph of the capacitor film material of Comparative Example 1 of the present application.

[0039] Figure 5 This is a micrograph of the capacitor film material of Comparative Example 2 of the present application.

[0040] Figure 6 This is a microscopic photograph of the capacitor film material of Comparative Example 3 of the present application. DETAILED DESCRIPTION

[0041] The present application is further described in detail below with reference to the embodiments.

[0042] Unless otherwise specified, the raw materials used in the examples and comparative examples of the present application are all commercially available.

[0043] Example 1

[0044] The method for preparing the capacitor film material of this embodiment comprises the following steps:

[0045] S1: The substrate surface is rinsed with deionized water and ethanol, blown dry with clean air for standby use, and then surface treatment is performed;

[0046] The surface treatment of this embodiment includes the following steps:

[0047] 1) The washed and dried substrate is sent into a vacuum chamber, and the substrate is placed parallel to the glow electrode and the counter electrode, and a processing gas with a pressure of 0.05 MPa is filled into the vacuum chamber. The processing gas is high-purity argon gas, and then a high voltage is applied between the glow electrode and the counter electrode for plasma treatment, and the substrate is ready for use after treatment;

[0048] 2) 150 g of deionized water, 20 g of an amino acid derivative, 35 g of carbomer, 15 g of maleimide, 3.5 g of polyethylene glycol, and 50 mL of γ-aminopropyltriethoxysilane were placed in a stirring vessel, mixed and stirred at 60° C. and 350 rpm for 30 min, and then ammonia water was added to adjust the pH value to 9.5 to prepare a precursor solution;

[0049] 3) The precursor liquid is evenly applied on the surface of the substrate after plasma treatment, and the substrate is placed in a vacuum drying oven and heated to 75°C. After reacting for 5 hours, a stress layer is formed on the surface of the substrate. The average thickness of the stress layer is 0.5 mm. Then, the substrate is taken out and immersed in a mixture of deionized water and anhydrous ethanol for 20 minutes to dissolve and fall off the stress layer. Finally, the substrate is washed and dried for standby use;

[0050] S2: When the air pressure is less than 3.0×10 -4 Under high vacuum conditions of mbar, the copper alloy was placed in an electric heating boat for heating, melting and sublimation to form a coating on the surface of the substrate with a thickness of 0.2μm.

[0051] S3: Perform aging treatment on the substrate after evaporation, and then obtain the finished product after cutting and inspection.

[0052] The amino acid derivative is N-benzoylglycine. The carbomer is carbomer 980. The copper alloy is composed of 99.6% copper and 0.4% aluminum by mass. The thickness of the substrate is 12 μm, and the material of the substrate is PET.

[0053] The capacitor film material of this embodiment is prepared by the above-mentioned preparation method.

[0054] Example 2

[0055] The method for preparing the capacitor film material of this embodiment comprises the following steps:

[0056] S1: The substrate surface is rinsed with deionized water and ethanol, blown dry with clean air for standby use, and then surface treatment is performed;

[0057] The surface treatment of this embodiment includes the following steps:

[0058] 1) The washed and dried substrate is sent into a vacuum chamber, and the substrate is placed parallel to the glow electrode and the counter electrode, and a processing gas with a pressure of 0.05 MPa is filled into the vacuum chamber. The processing gas is composed of argon and oxygen in a volume ratio of 1:3.5, and then a high voltage is applied between the glow electrode and the counter electrode for plasma treatment, and the substrate is set aside after treatment;

[0059] 2) 150 g of deionized water, 20 g of an amino acid derivative, 35 g of carbomer, 15 g of maleimide, 3.5 g of polyethylene glycol, and 50 mL of γ-aminopropyltriethoxysilane were placed in a stirring vessel, mixed and stirred at 60° C. and 350 rpm for 30 min, and then ammonia water was added to adjust the pH value to 9.5 to prepare a precursor solution;

[0060] 3) The precursor liquid is evenly applied on the surface of the substrate after plasma treatment, and the substrate is placed in a vacuum drying oven and heated to 75°C. After reacting for 5 hours, a stress layer is formed on the surface of the substrate. The average thickness of the stress layer is 0.5 mm. Then, the substrate is taken out and immersed in a mixture of deionized water and anhydrous ethanol for 20 minutes to dissolve and fall off the stress layer. Finally, the substrate is washed and dried for standby use;

[0061] S2: When the air pressure is less than 2.0×10 -4 Under high vacuum conditions of mbar, the copper alloy was placed in an electric heating boat for heating, melting and sublimation to form a coating on the surface of the substrate with a thickness of 0.2μm.

[0062] S3: Perform aging treatment on the substrate after evaporation, and then obtain the finished product after cutting and inspection.

[0063] The amino acid derivative is N-benzoylglycine. The carbomer is carbomer 940. The copper alloy is composed of 99.6% copper and 0.4% lanthanum by mass. The thickness of the substrate is 12 μm, and the material of the substrate is PET.

[0064] The capacitor film material of this embodiment is prepared by the above-mentioned preparation method.

[0065] Example 3

[0066] The method for preparing the capacitor film material of this embodiment comprises the following steps:

[0067] S1: The substrate surface is rinsed with deionized water and ethanol, blown dry with clean air for standby use, and then surface treatment is performed;

[0068] The surface treatment of this embodiment includes the following steps:

[0069] 1) The washed and dried substrate is sent into a vacuum chamber, and the substrate is placed parallel to the glow electrode and the counter electrode, and a processing gas with a pressure of 0.05 MPa is filled into the vacuum chamber. The processing gas is composed of argon and oxygen in a volume ratio of 1:3.5, and then a high voltage is applied between the glow electrode and the counter electrode for plasma treatment, and the substrate is set aside after treatment;

[0070] 2) 150 g of deionized water, 20 g of an amino acid derivative, 35 g of carbomer, 15 g of maleimide, 3.5 g of polyethylene glycol, and 50 mL of γ-aminopropyltriethoxysilane were placed in a stirring vessel, mixed and stirred at 60° C. and 350 rpm for 30 min, and then ammonia water was added to adjust the pH value to 9.5 to prepare a precursor solution;

[0071] 3) The precursor liquid is evenly applied on the surface of the substrate after plasma treatment, and the substrate is placed in a vacuum drying oven and heated to 75°C. After reacting for 5 hours, a stress layer is formed on the surface of the substrate. The average thickness of the stress layer is 0.5 mm. Then, the substrate is taken out and immersed in a mixture of deionized water and anhydrous ethanol for 20 minutes to dissolve and fall off the stress layer. Finally, the substrate is washed and dried for standby use;

[0072] S2: When the air pressure is less than 2.0×10 -4 Under high vacuum conditions of mbar, the copper alloy was placed in an electric heating boat for heating, melting and sublimation to form a coating on the surface of the substrate with a thickness of 0.2μm.

[0073] S3: Perform aging treatment on the substrate after evaporation, and then obtain the finished product after cutting and inspection.

[0074] The amino acid derivatives are composed of phthalylglycine and N-benzoylglycine in a mass ratio of 1.5:1. The carbomer is carbomer 940. The copper alloy is composed of 99.6% copper and 0.4% rare earth elements, and the rare earth elements are composed of yttrium, lanthanum, and cerium in a mass ratio of 2:1:1. The thickness of the substrate is 12 μm, and the material of the substrate is PET.

[0075] The capacitor film material of this embodiment is prepared by the above-mentioned preparation method.

[0076] Comparative Example 1

[0077] The preparation method of the capacitor film material of this comparative example comprises the following steps:

[0078] S1: The substrate surface is rinsed with deionized water and ethanol, blown dry with clean air for standby use, and then surface treatment is performed;

[0079] The surface treatment of this comparative example includes the following steps: sending the washed and dried substrate into a vacuum chamber, placing the substrate parallel to the glow electrode and the counter electrode, and filling the vacuum chamber with a processing gas with a pressure of 0.05MPa, the processing gas is high-purity argon gas, and then applying a high voltage between the glow electrode and the counter electrode for plasma treatment, and standby after treatment;

[0080] S2: When the air pressure is less than 3.0×10 -4 Under high vacuum conditions of mbar, the copper alloy was placed in an electric heating boat for heating, melting and sublimation to form a coating on the surface of the substrate with a thickness of 0.2μm.

[0081] S3: Perform aging treatment on the substrate after evaporation, and then obtain the finished product after cutting and inspection.

[0082] The copper alloy is composed of 99.6% copper and 0.4% aluminum by mass. The thickness of the substrate is 12 μm, and the material of the substrate is PET.

[0083] The capacitor film material of this comparative example is prepared by the above-mentioned preparation method.

[0084] Comparative Example 2

[0085] The preparation method of the capacitor film material of this comparative example comprises the following steps:

[0086] S1: The substrate surface is rinsed with deionized water and ethanol, blown dry with clean air for standby use, and then surface treatment is performed;

[0087] The surface treatment of this comparative example comprises the following steps:

[0088] 1) The washed and dried substrate is sent into a vacuum chamber, and the substrate is placed parallel to the glow electrode and the counter electrode, and a processing gas with a pressure of 0.05 MPa is filled into the vacuum chamber. The processing gas is high-purity argon gas, and then a high voltage is applied between the glow electrode and the counter electrode for plasma treatment, and the substrate is ready for use after treatment;

[0089] 2) 150 g of deionized water, 20 g of an amino acid derivative, 35 g of carbomer, 15 g of maleimide, 3.5 g of polyethylene glycol, and 50 mL of γ-aminopropyltriethoxysilane were placed in a stirring vessel, mixed and stirred at 60° C. and 350 rpm for 30 min, and then ammonia water was added to adjust the pH value to 9.5 to prepare a precursor solution;

[0090] 3) The precursor liquid is evenly applied on the surface of the substrate after plasma treatment, and the substrate is placed in a vacuum drying oven and heated to 75°C. After reacting for 5 hours, a stress layer is formed on the surface of the substrate. The average thickness of the stress layer is 0.5 mm. Then, the substrate is taken out and immersed in a mixture of deionized water and anhydrous ethanol for 20 minutes to dissolve and fall off the stress layer. Finally, the substrate is washed and dried for standby use;

[0091] S2: When the air pressure is less than 3.0×10 -4 Under high vacuum conditions of mbar, pure copper is placed in an electric heating boat for heating, melting and sublimation to form a coating on the surface of the substrate with a thickness of 0.2μm.

[0092] S3: Perform aging treatment on the substrate after evaporation, and then obtain the finished product after cutting and inspection.

[0093] The amino acid derivative is N-benzoylglycine, the carbomer is carbomer 980, the thickness of the substrate is 12 μm, and the material of the substrate is PET.

[0094] The capacitor film material of this comparative example is prepared by the above-mentioned preparation method.

[0095] Comparative Example 3

[0096] The preparation method of the capacitor film material of this comparative example comprises the following steps:

[0097] S1: The substrate surface is rinsed with deionized water and ethanol, blown dry with clean air for standby use, and then surface treatment is performed;

[0098] The surface treatment of this comparative example includes the following steps: sending the washed and dried substrate into a vacuum chamber, placing the substrate parallel to the glow electrode and the counter electrode, and filling the vacuum chamber with a processing gas with a pressure of 0.05MPa, the processing gas is high-purity argon gas, and then applying a high voltage between the glow electrode and the counter electrode for plasma treatment, and standby after treatment;

[0099] S2: When the air pressure is less than 3.0×10 -4 Under high vacuum conditions of mbar, pure copper is placed in an electric heating boat for heating, melting and sublimation to form a coating on the surface of the substrate with a thickness of 0.2μm.

[0100] S3: Perform aging treatment on the substrate after evaporation, and then obtain the finished product after cutting and inspection.

[0101] The thickness of the substrate is 12 μm, and the material of the substrate is PET.

[0102] The capacitor film material of this embodiment is prepared by the above-mentioned preparation method.

[0103] Performance testing

[0104] The capacitor film materials of Examples 1-3 and Comparative Examples 1-3 were tested by microphotographs. The test results are as follows: Figure 1-6 shown.

[0105] Samples were randomly taken from the capacitor film materials of Examples 1-3 and Comparative Examples 1-3, and the coating adhesion test was performed according to the test standard Q / FMDM-2010 (5.6). The test results are shown in Table 1.

[0106] Table 1 Adhesion test data of capacitor film material coatings of Examples 1-3 and Comparative Examples 1-3 of the present application

[0107] Serial number Use 3M tape to test the coating peeling Example 1 No obvious peeling of the coating Example 2 No obvious peeling of the coating Example 3 No obvious peeling of the coating Comparative Example 1 There are obvious peeling of the coating in many places Comparative Example 2 The coating is slightly peeled off Comparative Example 3 The coating is slightly peeled off

[0108] Analyze Examples 1-3 and Comparative Examples 1-3 and combine Figure 1-6 It can be seen that the capacitor film material prepared in the present application has very good uniformity and adhesion of the coating.

[0109] This specific embodiment is merely an explanation of the present application and is not a limitation of the present application. After reading this specification, those skilled in the art may make modifications to the present embodiment without any creative contribution as needed, but such modifications are protected by the patent law as long as they are within the scope of the claims of the present application.

Claims

1. A method for preparing a capacitor film material, characterized in that: The steps include: S1: washing and drying the surface of the substrate, and then performing surface treatment; the surface treatment comprises the following steps: 1) The washed and dried substrate is sent into a vacuum chamber, and a treatment gas with a pressure of 0.05 MPa is filled into the vacuum chamber, and then plasma treatment is performed, and the substrate is set aside after treatment; 2) 150 g of deionized water, 20 g of amino acid derivative, 35 g of carbomer, 15 g of maleimide, 3.5 g of polyethylene glycol, and 50 mL of γ-aminopropyltriethoxysilane were mixed evenly, stirred at 60 ° C for 30 min, and then ammonia water was added to adjust the pH value to 9.5 to prepare a precursor solution; 3) The precursor liquid is evenly applied on the surface of the substrate after plasma treatment, and the substrate is placed in a vacuum drying oven and heated to 75°C. After reacting for 5 hours, a stress layer is formed on the surface of the substrate. The substrate is then taken out and immersed in a mixture of deionized water and anhydrous ethanol for 20 minutes to dissolve and fall off the stress layer. The substrate is finally washed and dried for standby use; S2: Under high vacuum conditions, the copper alloy is placed in an electric heating boat to heat, melt and sublime to form a coating on the surface of the substrate; S3: Perform aging treatment on the substrate after evaporation, and then obtain the finished product after cutting and inspection.

2. The method for preparing a capacitor film material according to claim 1, characterized in that: The amino acid derivative is one or more of phthalylglycine and N-benzoylglycine.

3. The method for preparing a capacitor film material according to claim 2, characterized in that: The amino acid derivative is composed of phthalylglycine and N-benzoylglycine in a mass ratio of 1.5:

1.

4. The method for preparing a capacitor film material according to claim 1, characterized in that: The carbomer is one or more of carbomer 940, carbomer 941, and carbomer 980.

5. The method for preparing a capacitor film material according to claim 1, characterized in that: In step S3, the copper alloy includes the following components in mass percentage: 99.6% copper and 0.4% rare earth elements.

6. The method for preparing a capacitor film material according to claim 5, characterized in that: The rare earth element is one or more of yttrium, lanthanum, cerium, rhenium and samarium.

7. The method for preparing a capacitor film material according to claim 1, characterized in that: In the step 1), the processing gas is composed of argon and oxygen in a volume ratio of 1:3.

5.

8. The method for preparing a capacitor film material according to claim 1, characterized in that: In step S3, the high vacuum condition is that the pressure is less than 2.0×10 -4 mbar.

9. The method for preparing a capacitor film material according to claim 1, characterized in that: In the step S1, the thickness of the substrate is 12 μm.

10. A thin film material for capacitors, characterized in that: The invention is prepared by the preparation method according to any one of claims 1 to 9.

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