Wafer debonding apparatus and control method

Abstract

The application discloses a kind of wafer de-bonding device and control method, device includes: device main body is equipped with multiple processing bin;Multiple sample bin, processing bin is equipped with insertion port, sample bin can be inserted from insertion port and is sealedly connected with insertion port, and sample bin is arranged in at least one inner flow port, sample cavity is communicated with processing cavity by inner flow port;Middle, device main body is also equipped with multiple heating structures and multiple image acquisition structures, wafer de-bonding device also includes control mechanism, control mechanism is electrically connected with multiple heating structures and can control multiple heating structures to heat treatment liquid in multiple processing cavities, control mechanism is electrically connected with multiple image acquisition structures and can control multiple image acquisition structures to collect the image of sample wafer in multiple sample cavities and according to the image of sample wafer analyze the processing state of sample wafer.The application will not cause safety risk to outside experiment personnel, and it is favorable to improve processing rate and processing effect, and the degree of automation of device is high.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of geological exploration research, in particular to a thin section degumming device and a control method. BACKGROUND

[0002] Rock is the direct carrier of various geological processes and the most direct and effective physical data for studying various geological processes. Making rock samples into thin sections for microscopic observation is the most basic research method. In shale gas exploration research, thin section observation is also indispensable. Due to the difficulty of sampling deep shale gas rock samples, only a very limited number of existing samples can be studied, which requires improving the reusability of rock samples. Thin section degumming is a means to improve the reusability of rock samples. As the name implies, it is to remove the Canada balsam wrapped around the rock thin section for easy storage and restore it to a clean and pure state, so that the rock thin section that has been observed can be reused as a research sample for other experiments.

[0003] However, the existing thin section degumming device cannot meet the requirements of many advanced experiments after degumming treatment of the rock thin section. For example, the residual Canada balsam on the thin section has fluorescence characteristics, which will have a serious impact on the inclusion laser Raman experiment. Therefore, the thin section degumming treatment that meets the requirements of advanced experiments is now manually operated. However, the degumming liquid used in the degumming process is an organic solvent, which is often highly volatile and weakly toxic, posing a safety risk to the experimenters. In addition, due to the strong volatility of the degumming liquid, to avoid accidents, the degumming process is usually carried out at room temperature, resulting in a long and slow experimental process. In addition, rock thin sections are generally 0.1 mm thick and are not easy to store. During manual degumming operation, the thin section often breaks and the sample is damaged. SUMMARY

[0004] The purpose of the present application is to provide a thin section degumming device and a control method to solve the technical problem that the rock thin section after degumming treatment by the existing thin section degumming device cannot meet the requirements and needs to be manually degummed.

[0005] The above-mentioned purpose of the present application can be realized by using the following technical solutions:

[0006] The present application provides a kind of wafer debonding device, comprising: device main body is equipped with multiple processing bin, the processing bin has processing cavity for accommodating processing liquid;Multiple sample bin, the processing bin is equipped with insertion port, the sample bin can be inserted into the processing cavity from the insertion port and is sealedly connected with the insertion port, the sample bin has sample cavity for placing sample wafer, and the sample bin is equipped with at least one inner flow port, the sample cavity is communicated with the processing cavity through the inner flow port;Middle, the device main body is also equipped with multiple heating structures and multiple image acquisition structures, the wafer debonding device further includes control mechanism, the control mechanism is electrically connected with multiple heating structures and can control multiple heating structures to heat the processing liquid in multiple processing cavities, the control mechanism is electrically connected with multiple image acquisition structures and can control multiple image acquisition structures to collect the image of the sample wafer in multiple sample cavities and analyze the processing state of the sample wafer according to the image of the sample wafer.

[0007] In an embodiment of the present application, the wafer debonding device further includes a leveling mechanism, the leveling mechanism includes a level and multiple lifting support structures, the level is installed on the device main body and can detect the inclination angle of the device main body relative to the horizontal direction, and the multiple lifting support structures are installed on the device main body and can adjust the inclination angle of the device main body relative to the horizontal direction by lifting.

[0008] In an embodiment of the present application, the wafer debonding device further includes multiple blank slides for carrying the sample wafer, the sample bin is relatively provided with two limiting guide rails in the horizontal direction, the blank slide can be slidably inserted between the two limiting guide rails, the sample bin is provided with multiple wafer limiting members movable in the horizontal direction, the multiple wafer limiting members are located above the two limiting guide rails, and the multiple wafer limiting members can limit the sample wafer between the wafer limiting members and the blank slide by moving towards the inner side of the two guide rails to above the sample wafer.

[0009] In an embodiment of the present application, the processing bin is provided with a temperature detection structure, and the control mechanism is electrically connected with the temperature detection structure and can control the heating temperature of the heating structure according to the detection signal of the temperature detection structure.

[0010] In an embodiment of the present application, multiple indication structures are installed on the device main body, the multiple indication structures are one-to-one corresponding to the multiple sample bins, the indication structure includes a start indication lamp and a stop indication lamp, and the control mechanism is electrically connected with the indication structure and can control the opening and closing of the start indication lamp and the stop indication lamp, respectively.

[0011] In the embodiment of the present application, the plurality of heating structures are correspondingly arranged below the plurality of processing chambers; the top surface of the sample chamber is provided with a placing opening for placing the sample sheet into the sample cavity, and the image acquisition structure is arranged in the processing chamber and above the placing opening.

[0012] In the embodiment of the present application, the device body is provided with a liquid pipeline structure and at least one liquid inlet and outlet, the processing chamber is provided with at least one external flow port, the liquid inlet and outlet are in communication with the liquid pipeline structure, and the liquid pipeline structure is in communication with the external flow ports of the respective processing chambers.

[0013] In the embodiment of the present application, the processing liquid is a gelatinizing liquid or a cleaning liquid, the number of liquid inlets and outlets is four, the four liquid inlets and outlets are in communication with the liquid pipeline structure through a main control valve, two of the liquid inlets and outlets are used for injection and discharge of the gelatinizing liquid, and the other two liquid inlets and outlets are used for injection and discharge of the cleaning liquid; the number of external flow ports of the respective processing chambers is two, one of the external flow ports is an external inlet, and the other is an external outlet, the liquid pipeline structure comprises a main injection pipeline, a main discharge pipeline, a plurality of branch injection pipelines, and a plurality of branch discharge pipelines, the input end of the main injection pipeline and the output end of the main discharge pipeline are in communication with the main control valve, the main injection pipeline is in communication with the external inlets of the respective processing chambers through the plurality of branch injection pipelines, and each branch injection pipeline is provided with a branch control valve, and the input end of the main discharge pipeline is in communication with the external outlets of the respective processing chambers through the plurality of branch discharge pipelines.

[0014] The present application also provides a control method for sheet gelatinizing, which is used for controlling the sheet gelatinizing device, and comprises the following steps: injecting a gelatinizing liquid into a processing chamber, so that the gelatinizing liquid flows into a sample chamber to gelatinize a sample sheet; the sample sheet comprises a sample and a gelatinizing liquid wrapped outside the sample; acquiring a gelatinizing image of the sample sheet; obtaining a gelatinizing image of the sample sheet; and judging whether the sample sheet is completely gelatinized according to the changes of the gelatinizing image of the sample sheet.

[0015] In an embodiment of the present application, the control method further comprises: before the ungluing, staining the sample slice with a colloidal dye; the ungluing image is a color image with a plurality of pixels; the obtaining of the colloidal edge and the sample edge of the ungluing image comprises the following steps: processing the color image into a gray-scale ungluing image; determining the gray-scale value and the coordinates of each pixel of the gray-scale ungluing image; arranging the gray-scale value of each pixel of the gray-scale ungluing image according to its coordinates to determine the low threshold value and the high threshold value of the gray-scale value; extracting the coordinates of the pixel whose gray-scale value is greater than the low threshold value and less than the high threshold value in the gray-scale ungluing image, and recording as the coordinates of the colloidal edge in the gray-scale ungluing image; extracting the coordinates of the pixel whose gray-scale value is greater than or equal to the high threshold value in the gray-scale ungluing image, and recording as the coordinates of the sample edge in the gray-scale ungluing image.

[0016] In an embodiment of the present application, the judging whether the sample slice is unglued according to the changes of the colloidal edge and the sample edge comprises the following steps: calculating the difference between the initial coordinates and the current coordinates of the colloidal edge, and recording as the coordinate change value of the colloidal edge; calculating the difference between the initial coordinates and the current coordinates of the sample edge, and recording as the coordinate change value of the sample edge; until the coordinate change value of the colloidal edge and the coordinate change value of the sample edge both meet the preset condition, judging that the sample slice is unglued.

[0017] In an embodiment of the present application, the control method further comprises the following steps: after judging that the sample slice is unglued, discharging the ungluing solution in the processing chamber, and injecting a cleaning solution into the processing chamber to make the cleaning solution flow into the sample chamber to clean the sample slice; collecting a cleaning image of the sample slice; processing the cleaning image into a gray-scale cleaning image; determining the gray-scale value and the coordinates of each pixel of the gray-scale cleaning image; extracting the coordinates of the pixel whose gray-scale value is greater than or equal to the high threshold value in the gray-scale cleaning image, and recording as the coordinates of the sample edge in the gray-scale cleaning image; obtaining a gray-scale background image outside the sample edge in the gray-scale cleaning image according to the coordinates of the sample edge in the gray-scale cleaning image; and judging whether the sample slice is cleaned according to the change of the gray-scale background image.

[0018] In an embodiment of the present application, the judging whether the sample slice is cleaned according to the change of the background image in the cleaning image comprises the following steps: determining the gray-scale value of each pixel of the gray-scale background image; if the gray-scale value of each pixel of the gray-scale background image is less than or equal to the low threshold value, judging that the sample slice is cleaned.

[0019] The present application has the following characteristics and advantages:

[0020] The wafer debonding device of the present application installs multiple sample bins in multiple processing bins by insertion and seals the insertion port of the processing bin, so that the processing liquid in the processing bin can flow into the sample bin through the inner flow port of the sample bin to debond the sample wafer without causing safety risks to the experimental personnel outside, isolating the opportunity for the experimental personnel to directly contact the processing liquid and maximizing personnel and experimental safety.

[0021] The wafer debonding device of the present application heats the processing liquid in the multiple processing bins by providing multiple heating structures, thereby facilitating improved processing rate and processing effect.

[0022] The wafer debonding device of the present application acquires images of the sample wafer in the multiple sample bins by providing multiple image acquisition structures, so that the control structure can analyze the state of the sample wafer according to the images of the sample wafer. On the one hand, it can determine whether debonding is complete during debonding according to the images, and on the other hand, it can acquire images of the sample wafer during the cleaning process after debonding is complete, and then determine whether cleaning is complete according to the image changes outside the sample edge in the images, thereby improving the degree of automation of the device and avoiding frequent manual operations that can cause sample damage.

[0023] The wafer debonding control method of the present application acquires debonding images of the sample wafer during the debonding process, and then acquires the sample edge and the gel edge from the debonding images, so as to determine whether the sample wafer is debonded according to the changes of the sample edge and the gel edge.

[0024] The wafer debonding control method of the present application acquires cleaning images of the sample wafer during the cleaning process after debonding is complete, and then determines whether the sample wafer is cleaned according to the image changes outside the sample edge in the cleaning images. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0026] Figure 1 is the internal structure side view of the device body in the present application;

[0027] Figure 2 is the installation schematic diagram of the sample wafer placed in the sample bin in the present application;

[0028] Figure 3 is the overall schematic diagram of the wafer debonding device in the present application;

[0029] Figure 4 is the internal structure plan view of the device body in the present application;

[0030] Figure 5 is the color image of the sample sheet collected in the initial state in the present application;

[0031] Figure 6 is the gray scale image of the sample sheet in the initial state in the present application;

[0032] Figure 7 is the histogram of the gray scale value in the present application;

[0033] Figure 8 is the gray scale image of the sample sheet when the debonding is completed in the present application;

[0034] Figure 9 is the gray scale image of the sample sheet when the cleaning is completed in the present application.

[0035] In the figure:

[0036] 1, device body;

[0037] 11, processing bin; 111, processing cavity; 112, insertion port; 113, outer flow passage; 114, outer liquid inlet; 115, outer liquid outlet; 116, observation window; 117, guide groove;

[0038] 12, heating structure; 13, image collection structure; 14, temperature detection structure;

[0039] 15, indication structure; 151, start indication lamp; 152, stop indication lamp;

[0040] 16, liquid pipeline structure; 161, main injection pipeline; 162, main discharge pipeline; 163, branch injection pipeline; 164, branch discharge pipeline; 165, branch control valve;

[0041] 17, liquid inlet and outlet; 18, main path control valve;

[0042] 2, sample bin; 21, sample cavity; 22, inner flow passage; 221, inner liquid inlet; 222, inner liquid outlet; 23, limiting guide rail; 24, sheet limiting member; 25, guide rail; 26, sealing cover plate; 27, fixing member; 28, placement port;

[0043] 3, leveling mechanism; 31, level; 32, lifting support structure; 321, coarse adjustment roller; 322, fine adjustment roller; 323, support screw; 324, support base;

[0044] 4, control mechanism; 41, control module; 42, power-on interface; 43, communication interface;

[0045] 5. Blank slide;

[0046] 6. Sample slice; 61. Sample; 62. Gel; 63. Sample slide;

[0047] 7. Image of sample slice; 71. Sample image; 72. Gel image; 73. Pixel. DETAILED DESCRIPTION

[0048] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0049] Embodiment one

[0050] As shown in Figure 1 and Figure 2 , the present application provides a slice gelatinization device, comprising: a device main body 1, provided with a plurality of treatment bins 11, the treatment bin 11 has a treatment cavity 111 for containing a treatment liquid; a plurality of sample bins 2, the treatment bin 11 is provided with an insertion port 112, the sample bin 2 can be inserted into the treatment cavity 111 from the insertion port 112 and is in sealed connection with the insertion port 112, the sample bin 2 has a sample cavity 21 for placing a sample slice 6, and the sample bin 2 is provided with at least one inner flow port 22, the sample cavity 21 is in communication with the treatment cavity 111 through the inner flow port 22; wherein, the device main body 1 is further provided with a plurality of heating structures 12 and a plurality of image acquisition structures 13, and the slice gelatinization device further comprises a control mechanism 4, the control mechanism 4 is in electrical connection with the plurality of heating structures 12 and can control the plurality of heating structures 12 to heat the treatment liquid in the plurality of treatment cavities 111, the control mechanism 4 is in electrical connection with the plurality of image acquisition structures 13 and can control the plurality of image acquisition structures 13 to acquire images 7 (shown in Figure 5 ) of the sample slice in the plurality of sample cavities 21 and determine the treatment state of the sample slice 6 according to the images 7 of the sample slice.

[0051] As shown in Figure 2 and Figure 3 , the slice gelatinization device of the present application installs the plurality of sample bins 2 in the plurality of treatment bins 11 by the insertion mode and seals the insertion port 112 of the treatment bin 11, so that the treatment liquid in the treatment bin 11 can flow into the sample bin 2 through the inner flow port 22 of the sample bin 2 to perform gelatinization treatment on the sample slice 6 without causing safety risks to the experimental personnel outside, which isolates the opportunity for the experimental personnel to directly contact the treatment liquid and maximally guarantees the safety of personnel and experiments.

[0052] Specifically, as shown in Figure 2As shown, the sample sheet 6 includes a sample 61 and a gel 62 wrapping the sample 61. In addition, the sample sheet 6 also includes a sample slide 63, and the sample 61 is fixed on the sample slide 63 by the gel 62. The processing liquid in the processing chamber 11 can be a gel-removing liquid used for gel-removing, or can be a cleaning liquid used for cleaning after gel-removing. The number of the inner flow-through ports 22 on the sample chamber 2 is multiple, at least one inner flow-through port 22 is used as an inner liquid inlet port 221 for the processing liquid flowing into the sample chamber 2, and at least one inner flow-through port 22 is used as an inner liquid outlet port 222 for the processing liquid flowing out of the sample chamber 2. In the embodiment, a plurality of inner liquid inlet ports 221 are arranged on one side of the sample chamber 2, and one inner liquid outlet port 222 is arranged on the bottom of the sample chamber 2. In the gel-removing process, the gel-removing liquid is relatively stationary in the sample chamber 2, while in the cleaning process, the cleaning liquid is injected into the sample chamber 2 from the inner liquid inlet ports 221 at a specific speed, and the gel-removing liquid is discharged from the inner liquid outlet port 222, and then after the gel-removing liquid is completely discharged, the cleaning liquid continues to be injected into the sample chamber 2 from the inner liquid inlet ports 221 at the same speed, and the cleaning liquid in the sample chamber 2 is discharged from the inner liquid outlet port 222 at the same speed, so that the cleaning liquid in the sample chamber 2 keeps flowing and is constantly renewed, thereby cleaning the sample sheet 6.

[0053] In combination Figure 2 and Figure 3 As shown, the sample chamber 2 is generally in a drawer-like structure, which is made of corrosion-resistant material, and is heat-insulated to avoid the corrosion of the gel-removing liquid. One end of the sample chamber 2 is inserted into the processing chamber 11 from the insertion port 112, and the other end of the sample chamber 2 is provided with a sealing cover plate 26, which is sealed and covers the insertion port 112 and is detachably fixed on the device main body 1 by a plurality of fixing members 27. The plurality of sample chambers 2 are arranged in one-to-one correspondence with the plurality of processing chambers 11, and the number of the processing chambers 11 and the number of the sample chambers 2 are not specifically limited, which can be six as in the embodiment, or can be other numbers. In addition, in the embodiment of the present application, in order to facilitate the observation of the processing condition in the sample chamber 2, the sealing cover plate 26 has a transparent viewing area made of a glass plate.

[0054] In combination Figure 1 and Figure 4 As shown, the sheet gel-removing device of the present application is provided with a plurality of heating structures 12 to heat the processing liquid in the plurality of processing chambers 11, thereby facilitating the improvement of the processing rate and the processing effect.

[0055] Specifically, the number of heating structures 12 is not particularly limited, and one processing chamber 11 is provided in correspondence with at least one heating structure 12. The heating structure 12 includes but is not limited to an electromagnetic heating structure. In some embodiments of the present application, a plurality of heating structures 12 are installed one by one below a plurality of processing chambers 11, so that the heating structure 12 will not be in contact with the processing liquid to affect its service life. Alternatively, the heating structure 12 can also be provided in the wall of the processing chamber 11 or laid on the outer wall surface of the processing chamber 11. In addition, in order for the control mechanism 4 to better control the heating of the heating structure 12, a temperature detection structure 14 is provided in the processing chamber 11, and the control mechanism 4 is electrically connected with the temperature detection structure 14 to control the heating temperature of the heating structure 12 according to the detection signal of the temperature detection structure 14.

[0056] In combination with Figure 1 and Figure 5 It is shown that the wafer debonding device of the present application acquires the image 7 of the sample wafer in the plurality of sample chambers 2 through the plurality of image acquisition structures 13, so that the control mechanism 4 can analyze the state of the sample wafer 6 according to the image 7 of the sample wafer, on the one hand, it can judge whether the debonding is completed during the debonding process, on the other hand, it can also acquire the image of the sample wafer 6 during the cleaning process after the debonding is completed, and then judge whether the cleaning is completed according to the image change outside the sample edge in the image, thereby improving the automation degree of the device and avoiding frequent manual operation to cause damage to the sample 61.

[0057] Specifically, the number of image acquisition structures 13 is not particularly limited, and one processing chamber 11 is provided in correspondence with at least one image acquisition structure 13. The image acquisition structure 13 includes but is not limited to an image sensor. The control mechanism 4 includes a control module 41 installed on the device main body 1, which is electrically connected with the image acquisition structure 13, the heating structure 12 and the temperature detection structure 14, in addition, the control mechanism 4 further includes an analysis processing module and a communication interface 43 and a power supply interface 42 provided on the device main body 1, the control module 41 is electrically connected with the analysis processing module through the communication interface 43, and the control module 41 is electrically connected with the external power supply through the power supply interface 42. In combination with Figure 1 and Figure 2 It is shown that in some embodiments of the present application, the top surface of the sample chamber 2 has a placing opening 28 for placing the sample wafer 6 into the sample cavity 21, and the image acquisition structure 13 is installed in the processing chamber 11 and located above the placing opening 28. The liquid level of the processing liquid in the processing chamber 11 is lower than the height of the image acquisition structure 13. In an embodiment of the present application, in order to facilitate the observation of the debonding process of the sample wafer 6, the top surface of the processing chamber 11 is provided with an observation window 116. Alternatively, the image acquisition structure 13 can also be installed above the observation window 116.

[0058] The working process of the wafer debonding device includes: first, injecting the debonding liquid into the treatment bin 11, so that the debonding liquid flows into the sample bin 2 to debond the sample wafer 6; collecting the image 7 of the sample wafer (defined as a debonding image); obtaining the colloid edge and the sample edge of the debonding image; and judging whether the sample wafer 6 is debonded according to the changes of the colloid edge and the sample edge of the debonding image.

[0059] Specifically, before debonding, the colloid 62 of the sample wafer 6 is dyed, so that the collected debonding image is a color image with a plurality of pixel points 73, so as to better obtain the colloid edge and the sample edge of the debonding image, wherein the image 7 of the sample wafer includes a sample image 71 and a colloid image 72, the colloid edge is the edge of the colloid image 72, and the sample edge is the edge of the sample image 71; then the color image of the debonding image is processed into a gray debonding image; then the gray value and the coordinates of each pixel point 73 of the gray debonding image are determined; then the low threshold and the high threshold of the gray value are determined according to the gray value and the coordinates of each pixel point 73; the coordinates of the pixel points 73 with the gray value greater than the low threshold and less than the high threshold in the gray debonding image are extracted and recorded as the coordinates of the colloid edge of the gray debonding image; the coordinates of the pixel points 73 with the gray value greater than or equal to the high threshold in the gray debonding image are extracted and recorded as the coordinates of the sample edge of the gray debonding image. Further, the difference between the initial coordinates and the current coordinates of each pixel point 73 of the colloid edge of the gray debonding image is calculated and recorded as the coordinate change value of the colloid edge of the gray debonding image; the difference between the initial coordinates and the current coordinates of each pixel point 73 of the sample edge of the gray debonding image is calculated and recorded as the coordinate change value of the sample edge of the gray debonding image; until the coordinate change value of the colloid edge of the gray debonding image and the coordinate change value of the sample edge of the gray debonding image both meet the preset condition, it is judged that the sample wafer 6 is debonded.

[0060] The gray value c of the pixel point 73 is: c=R*m r +G*m g +B*m b ; wherein R is the red value of the pixel point 73 in the RGB mode, G is the green value of the pixel point 73 in the RGB mode, B is the blue value of the pixel point 73 in the RGB mode, m r is the weighting coefficient corresponding to the red value, m g is the weighting coefficient corresponding to the green value, and m bThe weighting coefficients corresponding to the blue values ​​are shown below. The coordinates of pixel 73 include the horizontal coordinate 'a' and the vertical coordinate 'b'. Therefore, the coordinates and grayscale values ​​corresponding to each pixel 73 are represented as (a, b, c). The coordinates and grayscale values ​​corresponding to each pixel 73 are stored as a matrix and recorded as image data matrix P. Then, by traversing the image data matrix P according to the preset segmentation path, the horizontal and vertical coordinates of the traversed image data are reduced in dimensionality and only one is saved, represented as (a, c) or (b, c). Then, after arranging the horizontal or vertical coordinates of each pixel 73, the image is drawn as shown below. Figure 7 The histogram of grayscale values ​​of each pixel 73 is shown to determine the high threshold k and low threshold j. In this embodiment, the preset segmentation path includes segmentation paths A-A' and B-B' set along the two diagonals, segmentation path C-C' set along the horizontal midline, and segmentation path D-D' set along the vertical midline. Finally, the coordinates of pixels 73 with grayscale values ​​greater than the low threshold j and less than the high threshold k are extracted and recorded as the coordinates of the colloid edge. The coordinates of pixels 73 with grayscale values ​​greater than or equal to the high threshold k are extracted and recorded as the coordinates of the sample edge. At the beginning of degellation, the initial coordinates of each pixel 73 at the colloid edge are stored in a matrix and recorded as the coordinates of the colloid edge. The coordinate data matrix E0 stores the initial coordinates of each pixel 73 on the sample edge as a matrix and records it as the coordinate data matrix F0 of the sample edge; during the degellation process, the current coordinates of each pixel 73 on the colloid edge are stored as a matrix and recorded as the coordinate data matrix E of the colloid edge, and the current coordinates of each pixel 73 on the sample edge are stored as a matrix and recorded as the coordinate data matrix F of the sample edge; therefore, the coordinate change value ΔE of the colloid edge is E-E0, and the coordinate change value ΔF of the sample edge is F-F0; thus, by monitoring whether the coordinate change value ΔE of the colloid edge and the coordinate change value ΔF of the sample edge meet the preset conditions, it can be determined whether the sample sheet 6 has completed degellation.

[0061] Combination Figure 1 , Figure 8 and Figure 9As shown, the working process of the wafer debonding device also includes: when it is judged that the sample wafer 6 is debonded, the debonding liquid in the treatment bin 11 is discharged, and the cleaning liquid is injected into the treatment bin 11 to flow into the sample bin 2 to clean the sample 61; the image 7 of the sample wafer 6 is collected (defined as a cleaning image); the cleaning image is processed into a gray cleaning image; the gray value and the coordinate of each pixel point of the gray cleaning image are determined; the coordinates of the pixel points with the gray value greater than or equal to the high threshold value in the gray cleaning image are extracted and recorded as the coordinates of the sample edge in the gray cleaning image, that is, the working principle involved in obtaining the sample edge in the gray debonding image in the above debonding control process is the same, so the high threshold value k determined in the debonding process can be used to determine the coordinates of the sample edge in the gray cleaning image, and since the colloid is dissolved and broken by the debonding liquid, the colloid edge in the gray cleaning image does not need to be obtained in the cleaning process; the gray background image located outside the sample edge in the gray cleaning image is obtained according to the coordinates of the sample edge in the gray cleaning image; the gray value of each pixel point of the gray background image is determined; if the gray value of each pixel point of the gray background image is less than or equal to the low threshold value j, it is judged that the sample wafer 6 is cleaned.

[0062] As shown in Figure 5 and Figure 6 As shown, after the sample wafer 6 is debonded, the colloid 62 is dissolved and broken by the debonding liquid, part of the colloid 62 after being dissolved and broken is carried out by the debonding liquid, and the other part is attached to the surface of the sample glass slide 63, so that when the part of the dissolved colloid 62 is removed under the flow action of the cleaning liquid, the gray value of the image outside the sample 61 changes, so that whether the sample wafer 6 is cleaned can be judged according to the change of the gray background image.

[0063] As shown in Figure 1 and Figure 3 In order for the experimenter to know the debonding process in time, in the embodiment of the present application, a plurality of indication structures 15 are installed on the device main body 1, the plurality of indication structures 15 are arranged in one-to-one correspondence with the plurality of sample bins 2, the indication structure 15 includes a start indication lamp 151 and a stop indication lamp 152, the control mechanism 4 is electrically connected with the indication structure 15 and can control the opening and closing of the start indication lamp 151 and the stop indication lamp 152 respectively. During the process from the start of debonding to the completion of cleaning, the start indication lamp 151 is turned on and the stop indication lamp 152 is turned off; after the cleaning is completed, the start indication lamp 151 is turned off and the stop indication lamp 152 is turned on, so that the experimenter is prompted not to take out the sample bin 2 during the process from the start of debonding to the completion of cleaning, and the sample bin 2 is taken out after the cleaning is completed to take out the sample wafer 6 after debonding.

[0064] As shown in Figure 1 and Figure 3As shown, to ensure that the sample sheet 6 remains immersed in the degumming solution, the main body 1 of the device must be kept horizontal. In this embodiment of the invention, the sheet degumming device further includes a leveling mechanism 3. The leveling mechanism 3 includes a level 31 and multiple lifting support structures 32. The level 31 is mounted on the main body 1 and can detect the tilt angle of the main body 1 relative to the horizontal direction. The multiple lifting support structures 32 are mounted on the main body 1 and can adjust the tilt angle of the main body 1 relative to the horizontal direction by lifting. Specifically, the lifting support structure 32 includes a support screw 323, a support base 324, and a lifting adjustment roller. The main body 1 is provided with a mounting groove for mounting the lifting adjustment roller. The upper and lower ends of the lifting adjustment roller abut against the top and bottom surfaces of the mounting groove. The support screw 323 passes through the main body 1 and is threadedly connected to the lifting adjustment roller. By rotating the lifting adjustment roller to adjust its height on the support screw 323, the main body 1 can be moved up and down. The bottom end of the support screw 323 is mounted with a base.

[0065] The lifting adjustment rollers include a coarse adjustment roller 321 and a fine adjustment roller 322. The lifting screw has a coarse thread section that engages with the coarse adjustment roller 321 and a fine thread section that engages with the fine adjustment roller 322. The pitch of the coarse thread section is greater than the pitch of the fine thread section. Therefore, the adjustment amount by which the device body 1 is raised or lowered by one rotation of the coarse adjustment roller 321 is greater than the adjustment amount by which the device body 1 is raised or lowered by one rotation of the fine adjustment roller 322. The outer diameter of the coarse adjustment roller 321 is larger than the outer diameter of the fine adjustment roller 322 for easy identification. The number and arrangement of the lifting support structures 32 are not specifically limited. In this embodiment, the device body 1 is generally a cuboid structure, and four lifting support structures 32 are installed at the four corners of the device body 1.

[0066] like Figure 2As shown, in order to avoid the sample slice 6 from moving in the sample bin 2 and affecting the image recognition result and affecting the sample slice 6, the slice demounting device further comprises a plurality of blank slides 5 for carrying the sample slice 6, the sample bin 2 is provided with two limiting guide rails 23 arranged in the horizontal direction, the blank slide 5 can be slidably inserted between the two limiting guide rails 23, the sample bin 2 is provided with a plurality of slice limiting members 24 which can move in the horizontal direction, the plurality of slice limiting members 24 are located above the two limiting guide rails 23, and the plurality of slice limiting members 24 can limit the sample slice 6 between the slice limiting member 24 and the blank slide 5 by moving towards the inner side of the two guide rails 25 to be above the sample slice 6. During installation, the blank slide 5 is first slidably inserted between the two limiting guide rails 23, then the sample slice 6 is placed on the blank slide 5, and then the slice limiting member 24 is adjusted to move horizontally above the sample slice 6; after demounting is completed, the sample slice 6 utilizes the gravity and buoyancy to make the demounted sample slice 6 automatically and slowly and smoothly fall onto the blank slide 5, thereby effectively avoiding damage to the sample 61 on the sample slice 6; during disassembly, the blank slide 5 carrying the sample slice 6 is pulled out from the two limiting guide rails 23. The slice limiting member 24 can be a bolt as in the present embodiment.

[0067] In addition, as shown in Figure 2 and Figure 4 In order to guide the sample bin 2 to be inserted into the processing bin 11 in the horizontal direction and to be stably installed, the sample bin 2 is provided with two outer sides arranged in the horizontal direction, and the processing bin 11 is provided with two inner sides arranged in the horizontal direction; the two inner sides of the sample bin 2 and the two inner sides of the processing bin 11 are provided with two sliding cooperation structures; the sliding cooperation structure comprises a guide rail 25 and a guide groove 117, one of which is arranged on the outer side of the sample bin 2, and the other of which is arranged on the inner side of the processing bin 11. In the present embodiment, the two guide rails 25 are arranged on the two outer sides of the sample bin 2, and the two guide grooves 117 are arranged on the two inner sides of the processing bin 11.

[0068] As shown in Figure 3 and Figure 4 In order to further improve the safety of the experiment, the device main body 1 is provided with a liquid pipeline structure 16 and at least one liquid inlet and outlet 17, the processing bin 11 is provided with at least one outer flow passage 113, the liquid inlet and outlet 17 is in communication with the liquid pipeline structure 16, and the liquid pipeline structure 16 is in communication with the outer flow passage 113 of each processing bin 11. By connecting the liquid inlet and outlet 17 with the corresponding external pipeline, the injection and discharge of the processing liquid can be realized without opening the processing bin 11, thereby improving the safety of the experiment and facilitating the operation.

[0069] Specifically, the number of liquid inlets and outlets 17 is four, four liquid inlets and outlets 17 are connected with the liquid pipeline structure 16 through the main path control valve 18, two of which are used for the injection and discharge of the gelatinizing liquid, and the other two are used for the injection and discharge of the cleaning liquid; the number of the outer flow communication ports 113 of each processing chamber 11 is two, one of which is an outer liquid inlet 114, and the other is an outer liquid outlet 115; the liquid pipeline structure 16 includes a main injection pipeline 161, a main discharge pipeline 162, a plurality of branch injection pipelines 163, and a plurality of branch discharge pipelines 164, the input end of the main injection pipeline 161 and the output end of the main discharge pipeline 162 are connected with the main path control valve 18, the main injection pipeline 161 is connected with the outer liquid inlets 114 of the plurality of processing chambers 11 through the plurality of branch injection pipelines 163, and each branch injection pipeline 163 is provided with a branch control valve 165, and the input end of the main discharge pipeline 162 is connected with the outer liquid outlets 115 of the plurality of processing chambers 11 through the plurality of branch discharge pipelines 164. Among them, the main path control valve 18 and the branch control valve 165 are solenoid valves, the main path control valve 18 and each branch control valve 165 are electrically connected with the control mechanism 4, and the control mechanism 4 controls the opening and closing of the main path control valve 18 and each branch control valve 165 according to the gelatinizing process.

[0070] Embodiment two

[0071] In combination with Figures 1 to 4 As shown in the figure, the present application also provides a control method for the sheet gelatinizing device. The specific structure, working principle and beneficial effects of the sheet gelatinizing device in this embodiment are the same as those in embodiment one, and the control method in this embodiment can be implemented by referring to the sheet gelatinizing device in embodiment one, which will not be repeated here.

[0072] In combination with Figures 5 to 8 As shown in the figure, the control method of the present application includes the following steps: injecting the gelatinizing liquid into the processing chamber 11, so that the gelatinizing liquid flows into the sample chamber 2 to gelatinize the sample sheet 6; wherein the sample sheet 6 includes a sample 61 and a gel 62 wrapped outside the sample 61; collecting the gelatinizing image of the sample sheet 6; obtaining the gel edge and the sample edge of the gelatinizing image; according to the change of the gel edge and the sample edge of the gelatinizing image, judging whether the sample sheet 6 is completed gelatinizing.

[0073] In the embodiment of the present application, the control method further comprises: before the debonding, staining the gel 62 of the sample sheet 6; the debonding image is a color image with a plurality of pixels 73; obtaining the gel edge and the sample edge of the debonding image comprises the following steps: processing the color image into a gray debonding image; determining the gray value and the coordinates of each pixel 73 of the gray debonding image; arranging the gray value of each pixel 73 of the gray debonding image according to its coordinates, determining the low threshold and the high threshold of the gray value; extracting the coordinates of the pixels 73 with the gray value greater than the low threshold and less than the high threshold in the gray debonding image, and recording as the coordinates of the gel edge of the gray debonding image; extracting the coordinates of the pixels 73 with the gray value greater than or equal to the high threshold in the gray debonding image, and recording as the coordinates of the sample edge of the gray debonding image;

[0074] In the embodiment of the present application, according to the changes of the gel edge and the sample edge of the debonding image, it is judged whether the sample sheet 6 is debonded; comprising the following steps: calculating the difference value between the initial coordinates and the current coordinates of the gel edge, and recording as the coordinate change value of the gel edge; calculating the difference value between the initial coordinates and the current coordinates of the sample edge, and recording as the coordinate change value of the sample edge; until the coordinate change value of the gel edge and the coordinate change value of the sample edge both meet the preset condition, it is judged that the sample sheet 6 is debonded.

[0075] In combination with the figures shown in Figure 8 and Figure 9 In the embodiment of the present application, the control method further comprises the following steps: after judging that the sample sheet 6 is debonded, discharging the debonding liquid in the treatment bin 11, and injecting the cleaning liquid into the treatment bin 11, so that the cleaning liquid flows into the sample bin 2 to clean the sample 61; collecting a cleaning image of the sample sheet 6; processing the cleaning image into a gray cleaning image; determining the gray value and the coordinates of each pixel of the gray cleaning image; extracting the coordinates of the pixels with the gray value greater than or equal to the high threshold in the gray cleaning image, and recording as the coordinates of the sample edge in the gray cleaning image, that is, the same as the working principle involved in obtaining the sample edge in the gray debonding image in the above debonding control process, so the high threshold determined in the debonding control process can be used to determine the coordinates of the sample edge in the gray cleaning image, and since the gel is dissolved and broken by the debonding liquid, the gel edge in the gray cleaning image does not need to be obtained in the cleaning process; according to the coordinates of the sample edge in the gray cleaning image, a gray background image outside the sample edge in the gray cleaning image is obtained; according to the changes of the gray background image, it is judged whether the sample sheet 6 is cleaned.

[0076] In the embodiment of the present application, according to the change of the background image in the cleaning image, whether the sample wafer is cleaned is determined, comprising the following steps: determining the gray value of each pixel point of the gray background image; if the gray value of each pixel point of the gray background image is less than or equal to the low threshold, it is determined that the sample wafer 6 is cleaned. That is, in the cleaning control process, the low threshold determined in the debonding control process can be used to analyze whether the gray background image has broken colloidal image, and when the gray value of each pixel point of the gray background image is less than or equal to the low threshold, it is indicated that the gray background image has no broken colloidal image, and therefore, the colloidal on the sample wafer 6 is cleaned, and the sample wafer 6 is cleaned.

[0077] The above merely illustrates some embodiments of the present application, and those skilled in the art can make various modifications or changes to the embodiments of the present application according to the disclosed content of the application file without departing from the spirit and scope of the present application.

Claims

1. A sheet delaminating apparatus characterized by comprising: The device body is provided with a plurality of processing cavities for containing processing liquid. The processing cavities are provided with insertion openings, and the sample cavities are capable of being inserted into the processing cavities from the insertion openings and being in sealed connection with the insertion openings. The device body is further provided with a plurality of heating structures and a plurality of image acquisition structures. The top surface of the sample cavity is provided with a placement opening for placing the sample slice into the sample cavity. The image acquisition structures are installed in the processing cavities and located above the placement openings. The control mechanism is in electrical connection with the heating structures and capable of controlling the heating structures to heat the processing liquid in the processing cavities. The control mechanism is in electrical connection with the image acquisition structures and capable of controlling the image acquisition structures to acquire images of the sample slices in the sample cavities and analyze the processing state of the sample slices according to the images of the sample slices. The slice gelatinization device further comprises a plurality of blank slides for carrying the sample slices. The sample cavities are provided with a plurality of slice limiting members capable of moving in the horizontal direction. The slice limiting members are located above the limiting guide rails.

2. The slice gelatinization device of claim 1, wherein The slice gelatinization device further comprises a leveling mechanism. The leveling mechanism comprises a level and a plurality of lifting support structures. The level is installed on the device body and capable of detecting the inclination angle of the device body relative to the horizontal direction. The lifting support structures are installed on the device body and capable of adjusting the inclination angle of the device body relative to the horizontal direction by lifting.

3. The slice gelatinization device of claim 1, wherein The processing cavities are provided with temperature detection structures. The control mechanism is in electrical connection with the temperature detection structures and capable of controlling the heating temperature of the heating structures according to the detection signals of the temperature detection structures.

4. The slice gelatinization device of claim 1, wherein The device body is provided with a plurality of indication structures. The indication structures comprise start indication lights and stop indication lights. The control mechanism is in electrical connection with the indication structures and capable of controlling the start and stop of the start indication lights and the stop indication lights, respectively.

5. The slice gelatinization device of claim 1, wherein The heating structures are installed one-to-one below the processing cavities.

6. The slice gelatinization device of claim 1, wherein The device body is provided with a liquid pipeline structure and at least one liquid inlet and outlet, the processing bin is provided with at least one outer flow passage, the liquid inlet and outlet are communicated with the liquid pipeline structure, and the liquid pipeline structure is respectively communicated with the outer flow passages of each processing bin.

7. The sheet ungluing device of claim 6, wherein The processing liquid is ungluing liquid or cleaning liquid, the number of the liquid inlets and outlets is four, and the four liquid inlets and outlets are communicated with the liquid pipeline structure through the main control valve, wherein two of the liquid inlets and outlets are used for injection and discharge of the ungluing liquid, and the other two are used for injection and discharge of the cleaning liquid; The number of the outer flow passages of each processing bin is two, one of the outer flow passages is an outer liquid inlet, and the other is an outer liquid outlet, the liquid pipeline structure comprises a main injection pipeline, a main discharge pipeline, a plurality of branch injection pipelines and a plurality of branch discharge pipelines, the input end of the main injection pipeline and the output end of the main discharge pipeline are respectively communicated with the main control valve, the main injection pipeline is respectively communicated with the outer liquid inlets of the plurality of processing bins through the plurality of branch injection pipelines, and each branch injection pipeline is provided with a branch control valve, and the input end of the main discharge pipeline is respectively communicated with the outer liquid outlets of the plurality of processing bins through the plurality of branch discharge pipelines.

8. A method of controlling the debonding of a sheet, characterized by, The control method for controlling the sheet ungluing device of any one of claims 1-7 comprises the following steps: Injecting ungluing liquid into the processing bin to make the ungluing liquid flow into the sample bin to perform ungluing treatment on the sample sheet, wherein the sample sheet comprises a sample and a colloid wrapped outside the sample; Collecting an ungluing image of the sample sheet; Obtaining a colloid edge and a sample edge of the ungluing image; According to the changes of the colloid edge and the sample edge of the ungluing image, determining whether the sample sheet is completed ungluing.

9. The control method according to claim 8, characterized by, The control method further comprises: before ungluing, staining the colloid of the sample sheet; and the ungluing image is a color image with a plurality of pixel points; The method for obtaining the colloid edge and the sample edge of the ungluing image comprises the following steps: Processing the color image into a gray-scale ungluing image; Determining the gray-scale value and coordinates of each pixel point of the gray-scale ungluing image; Arranging the gray-scale values of each pixel point in the gray-scale ungluing image according to their coordinates to determine a low threshold value and a high threshold value of the gray-scale value; Extracting the coordinates of the pixel points with a gray-scale value greater than the low threshold value and less than the high threshold value in the gray-scale ungluing image, and recording them as the coordinates of the colloid edge in the gray-scale ungluing image; Extracting the coordinates of the pixel points with a gray-scale value greater than or equal to the high threshold value in the gray-scale ungluing image, and recording them as the coordinates of the sample edge in the gray-scale ungluing image.

10. The control method according to claim 9, characterized by, The method for determining whether the sample sheet is completed ungluing according to the changes of the colloid edge and the sample edge comprises the following steps: Calculating the difference between the initial coordinates and the current coordinates of the colloid edge, and recording it as the coordinate change value of the colloid edge; Calculate the difference between the initial coordinates and the current coordinates of the sample edge, and record it as the coordinate change value of the sample edge; Until the coordinate change value of the colloidal edge and the coordinate change value of the sample edge meet the preset condition, it is judged that the sample wafer is completed.

11. The control method according to claim 9, characterized by, The control method further comprises the following steps: When it is judged that the sample wafer is completed, the debonding liquid in the treatment chamber is discharged, and the cleaning liquid is injected into the treatment chamber, so that the cleaning liquid flows into the sample chamber to clean the sample wafer; Collect the cleaning image of the sample wafer; Process the cleaning image into a gray cleaning image; Determine the gray value and coordinates of each pixel point of the gray cleaning image; Extract the coordinates of the pixel points with a gray value greater than or equal to the high threshold value in the gray cleaning image, and record them as the coordinates of the sample edge in the gray cleaning image; According to the coordinates of the sample edge in the gray cleaning image, obtain the gray background image outside the sample edge in the gray cleaning image; According to the change of the gray background image, it is judged whether the sample wafer is completed.

12. The control method according to claim 11, characterized by, The method comprises the following steps: Determine the gray value of each pixel point of the gray background image; If the gray value of each pixel point of the gray background image is less than or equal to the low threshold value, it is judged that the sample wafer is completed.

Images