Chip integrated high-precision coherent detection transceiver module and detection method
By integrating lasers and calibration circuits on the optical waveguide chip in the coherent detection module, combining the temperature control component and the Hilbert transformation algorithm, the accuracy offset and calculation cost problems caused by discrete components are solved, and high-precision micrometers are achieved Level measurement improves the stability and accuracy of the system.
Patent Information
- Application Number
- CN202410420767.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-09
- Publication Date
- 2025-01-10
AI Technical Summary
The measurement deviation problems caused by the existing coherent detection modules due to the accuracy offset of discrete components, mismatch between calculation costs and accuracy improvements, and deviations in the usage conditions.
The chip integrated high-precision coherent detection transceiver module is adopted to achieve real-time calibration and high frequency resolution by integrating lasers, measurement paths and calibration paths on the optical waveguide chip, combined with temperature control components and Hilbert transformation algorithm.
It achieves measurement accuracy at micron or even nanometers, breaks through the frequency grid effect limitations of traditional technology, improves the stability and accuracy of the system, and reduces the calculation cost.
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Figure CN119291709A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of coherent detection technology, and in particular to a chip-integrated high-precision coherent detection transceiver module and a detection method. Background Art
[0002] Coherent detection technology usually uses laser as carrier, converting the traditional distance-flight time measurement into distance-frequency measurement, effectively utilizing the high coherence and high bandwidth of laser light sources. Applied in the field of laser radar, it has the advantages of anti-electromagnetic, anti-background interference, high detection accuracy, and multi-dimensional information acquisition.
[0003] Chip-level silicon photonics technology can integrate multiple devices onto a microchip, achieving high integration of optoelectronic components such as lasers, modulators, and detectors at the micro-nano scale, greatly reducing the size of the transceiver module as a whole, thus providing a realistic path for the mass production, miniaturization, and modularization of the module. At the same time, miniaturized modules provide more reliable device performance and greater cost reduction space.
[0004] The coherent detection module in the prior art has the following defects:
[0005] 1. Traditional coherent detection modules are based on discrete components or semi-chip and semi-discrete components. Each discrete component is relatively fixed by manual or machine, and there are mounting tolerances. During use, the stress release of the adhesive glue and other problems will cause accuracy deviation;
[0006] 2. Traditional coherent detection technology demodulates the target distance or position information based on Fourier transform. Since Fourier transform is only applicable to the solution of stationary signals or non-time-varying signals, if the signal is time-varying, then the frequency obtained by Fourier transform will not reflect the change of signal frequency over time. Its accuracy is usually limited by the number of points involved in Fourier transform or the size of a frequency grid, which is usually in the order of centimeters or millimeters. The smaller the frequency grid, the higher the frequency resolution, but the exponential increase in the number of points involved in Fourier transform means a significant increase in computing power, which leads to an exponential increase in computing costs, and the benefits of improved accuracy do not match the increased costs;
[0007] 3. Traditional coherent detection technology needs to work under strict preset working conditions. During use, the consistency between the working conditions and the preset calibration conditions needs to be strictly controlled. Once the use conditions deviate, large measurement deviations will occur. Summary of the invention
[0008] The purpose of this application is to overcome the problems of accuracy offset caused by discrete components in the prior art, the mismatch between calculation cost and accuracy improvement benefits, and the large measurement deviation easily caused by deviation in usage conditions, and to provide a chip-integrated high-precision coherent detection transceiver module and detection method.
[0009] In a first aspect, a chip-integrated high-precision coherent detection transceiver module is provided, comprising a metal butterfly-shaped package tube shell for packaging an integrated optical waveguide chip, a transceiver lens is arranged at one end of the metal butterfly-shaped package tube shell, a laser, a measurement path and a calibration path are arranged on the integrated optical waveguide chip, and a temperature control component is arranged in the metal butterfly-shaped package tube shell;
[0010] Wherein, the measuring path comprises a first coupler, the input end of the first coupler is connected to the output end of the laser, the output end of the first coupler is connected to the transceiver lens, both ends of the first coupler are connected to a first coupler / mixer to input the optical signal reflected by the target object and the optical signal emitted by the laser into the first coupler / mixer for interference to generate an amplitude modulation signal containing target distance information, the output end of the first coupler / mixer is connected to a first balanced detector for photoelectric conversion, and the output end of the first balanced detector is electrically connected to the pin of the metal butterfly package tube shell;
[0011] The calibration circuit includes a second coupler, the input end of the second coupler is connected to the output end of the laser, the two output ends of the second coupler are respectively connected to the second coupler / mixer and the delay coil, and the output end of the second coupler is connected to the input end of the second coupler / mixer, the output end of the delay coil is connected to the input end of the second coupler / mixer, the output end of the second coupler / mixer is connected to the second balanced detector for photoelectric conversion, and the output end of the second balanced detector is electrically connected to the pins of the metal butterfly package tube shell.
[0012] In some possible implementations, the temperature control component includes a semiconductor cooler and a heat conductor, the semiconductor cooler is arranged between the integrated optical waveguide chip and the metal butterfly packaging tube shell, and heat conductors are arranged between the semiconductor cooler and the integrated optical waveguide chip and the metal butterfly packaging tube shell.
[0013] In some possible implementations, the heat conductive member is thermal grease or a graphene heat conductive sheet.
[0014] In some possible implementations, a silicon thermistor is disposed on the integrated optical waveguide chip near the laser, and both the silicon thermistor and the semiconductor cooler are connected to an external control module through pins of a metal butterfly package tube shell.
[0015] In some possible implementations, the metal butterfly-shaped package tube shell is made of alloy or metal ceramic, and a gold-plated layer is disposed on the surface of the metal butterfly-shaped package tube shell.
[0016] In some possible implementations, the optical waveguide between the first coupler and the transceiver lens is provided with a first delay coil.
[0017] In some possible implementations, the first coupler and the second coupler are both 2×2 couplers.
[0018] In some possible implementations, the integrated optical waveguide chip is manufactured based on a standard silicon photonics CMOS process, the laser is a semiconductor laser, and the laser is integrated on the surface of the integrated optical waveguide chip by heterogeneous integration.
[0019] In a second aspect, a chip-integrated high-precision coherent detection transceiver module device is provided, comprising the coherent detection transceiver module as described in the first aspect, and the coherent detection method comprises:
[0020] The temperature inside the metal butterfly package tube shell is controlled within a preset threshold range by means of a control group component;
[0021] The laser is controlled to operate by a periodic current driving signal to generate a periodic continuous linear frequency modulated optical signal;
[0022] The optical signal is divided into two paths through the optical waveguide and enters the measurement path and the calibration path respectively;
[0023] The optical signal entering the measurement path is divided into two optical signals through the first coupler. One optical signal is coupled by the transceiver lens and emitted into space. After being reflected by the target, it is coaxially received by the transceiver lens again and returns to the first coupler / mixer. The other optical signal directly enters the first coupler / mixer. The two optical signals interfere in the first coupler / mixer to generate a first amplitude modulation signal containing target distance information. The first amplitude modulation signal is received by the first balanced detector and converted into an electrical signal and output through the pins of the metal butterfly package tube shell.
[0024] The optical signal entering the calibration path is divided into two optical signals through the second coupler. One optical signal enters the second coupler / mixer after passing through the second delay coil of fixed length, and the other optical signal directly enters the second coupler / mixer. The two optical signals interfere in the second coupler / mixer to generate a second amplitude modulated signal containing the length information of the delay coil of the calibration path. The second amplitude modulated signal is received by the second balanced detector, converted into an electrical signal, and output through the pins of the metal butterfly package tube shell.
[0025] The mixed time domain signal waveforms output by the measurement path and the calibration path are processed by the host computer using the Hilbert transform algorithm to demodulate the instantaneous frequency versus time relationship diagrams of the measurement path and the calibration path.
[0026] In some possible implementations, the preset threshold range is 22°C-28°C.
[0027] This application has the following beneficial effects:
[0028] 1. This application integrates the laser, measurement path and calibration path on the same integrated optical waveguide chip, achieving high integration based on the integrated optical waveguide chip. At the same time, adding a calibration path based on the integrated optical waveguide chip can provide real-time feedback on measurement deviations caused by changes in the working environment and calibrate the measurement value in real time;
[0029] 2. This application improves the traditional frequency demodulation algorithm process, and uses the Hilbert transform algorithm to calculate the average value of the signal frequency change over a period of time. In theory, it can achieve ultra-high frequency resolution without being limited by the uncertainty principle, thereby breaking through the frequency grid effect limitation of the traditional Fourier transform algorithm when processing time-varying signals. Combined with the chip integration stability and calibration compensation of the chip calibration path, the test accuracy of the entire module can be measured to reach the micron or even nanometer level. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] The drawings constituting a part of the present application are used to provide a further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application.
[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0032] Figure 1 It is a structural schematic diagram of a chip-integrated high-precision coherent detection transceiver module according to an embodiment of the present application;
[0033] Figure 2 It is a structural schematic diagram of a measurement path in a chip-integrated high-precision coherent detection transceiver module according to an embodiment of the present application;
[0034] Figure 3 It is a structural schematic diagram of a calibration circuit in a chip-integrated high-precision coherent detection transceiver module according to an embodiment of the present application;
[0035] Figure 4 It is a partial cross-sectional view of a semiconductor cooler in a chip-integrated high-precision coherent detection transceiver module according to an embodiment of the present application;
[0036] Figure 5 This is an ideal linear frequency modulation signal waveform diagram output by the laser in the embodiment of the present application;
[0037] Figure 6 This is a waveform diagram of a mixed time domain signal output by the first balanced detector in an embodiment of the present application;
[0038] Figure 7 is a waveform diagram of the Hilbert transform of the output signal in the embodiment of the present application;
[0039] Figure 8 It is a waveform diagram of calculating the frequency average value in the frequency flat linear region after Hilbert transform in the embodiment of the present application.
[0040] Reference numerals:
[0041] 10. Metal butterfly package tube shell; 20. Integrated optical waveguide chip; 30. Transceiver lens; 40. Laser; 50. Measurement path; 51. First coupler; 52. First coupler / mixer; 53. First balanced detector; 54. First delay coil; 60. Calibration path; 61. Second coupler; 62. Second coupler / mixer; 63. Second balanced detector; 64. Second delay coil; 70. Temperature control component; 71. Semiconductor refrigerator; 72. Heat conductor; 73. Silicon thermistor. DETAILED DESCRIPTION
[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0043] Example
[0044] A chip-integrated high-precision coherent detection transceiver module according to Embodiment 1 of the present application is as follows: Figure 1 As shown, it includes a metal butterfly package tube shell 10 for packaging an integrated optical waveguide chip 20, one end of the metal butterfly package tube shell 10 is provided with a transceiver lens 30, the integrated optical waveguide chip 20 is provided with a laser 40, a measurement path 50 and a calibration path 60, and a temperature control component 70 is provided in the metal butterfly package tube shell 10. Specifically, the temperature control component 70 includes a semiconductor cooler 71 and a heat conducting member 72, and the semiconductor cooler 71 is provided between the integrated optical waveguide chip 20 and the metal butterfly package tube shell 10, as shown in FIG. Figure 4As shown, a heat conductor 72 is provided between the semiconductor cooler 71 and the integrated optical waveguide chip 20 and the metal butterfly package tube shell 10. A silicon thermistor 73 is provided on the integrated optical waveguide chip 20 near the laser 40. The silicon thermistor 73 and the semiconductor cooler 71 are connected to an external control module through the pins of the metal butterfly package tube shell 10. The silicon thermistor 73 can measure the temperature near the laser 40 and transmit it to the external control module in the form of an electrical signal. The external control module can be a device or component with data processing function such as a processor or a control circuit. The external control module can automatically control the operation of the semiconductor cooler 71 according to the silicon thermistor 73 and a preset threshold range, so that the working environment in the metal butterfly package tube shell 10 and the laser 40 are maintained within a suitable working temperature range.
[0045] In the above embodiment, the heat conductor 72 is thermal grease or graphene heat conductive sheet, and the heat conductor 72 is used to transfer heat between the semiconductor refrigerator 71 and the integrated optical waveguide chip 20 and the metal butterfly packaging tube shell 10. The integrated optical waveguide chip 20 is manufactured based on the standard silicon photonics CMOS process.
[0046] In order to increase the heat dissipation performance of the metal butterfly package tube shell 10, the metal butterfly package tube shell 10 generally includes a rectangular shell and dual in-line pins. The metal butterfly package tube shell 10 is made of alloy or metal ceramic. The surface of the metal butterfly package tube shell 10 is provided with a gold-plated layer, so that the metal butterfly package tube shell 10 can have better heat dissipation performance.
[0047] like Figure 1 As shown, the laser 40 is generally a semiconductor laser 40, and is integrated on the surface of the integrated optical waveguide chip 20 by heterogeneous integration to provide a light source for the entire module.
[0048] like Figure 2 As shown, the measuring path 50 includes a first coupler 51, the input end of the first coupler 51 is connected to the output end of the laser 40, the output end of the first coupler 51 is connected to the transceiver lens 30, both ends of the first coupler 51 are connected to the first coupler / mixer 52 so as to input the optical signal reflected by the target object and the optical signal emitted by the laser 40 into the first coupler / mixer 52 for interference to generate an amplitude modulated signal containing target distance information, the output end of the first coupler / mixer 52 is connected to a first balanced detector 53 for photoelectric conversion, and the output end of the first balanced detector 53 is electrically connected to the pin of the metal butterfly package tube shell 10.
[0049] In the above embodiment, the linear frequency modulated optical signal emitted by the laser 40 is divided into two optical signals through the 2×2 first coupler 51. One signal is coupled through the optical waveguide and the transceiver lens 30 and emitted into space, and is reflected by the target, and is coaxially received by the transceiver lens 30 again, and then returns to the first coupler / mixer 52 through the optical waveguide. The other optical signal directly enters the first coupler / mixer 52 through the optical waveguide; the two optical signals interfere in the first coupler / mixer 52 to generate an amplitude modulated signal containing target distance information, which is received by the first balanced detector 53 and converted into an electrical signal and output through the pins of the metal butterfly package tube shell 10.
[0050] like Figure 2 As shown, for the case where the target distance is particularly close, a first delay coil 54 can be compensated on the optical waveguide output to the space, that is, the first delay coil 54 is set in the optical waveguide between the first coupler 51 and the transceiver lens 30 to make the measured target frequency stay away from the lower frequency high noise floor spectrum area.
[0051] like Figure 3 As shown, the calibration circuit 60 includes a second coupler 61, the input end of the second coupler 61 is connected to the output end of the laser 40, the two output ends of the second coupler 61 are respectively connected to the second coupler / mixer 62 and the delay coil, and the output end of the second coupler 61 is connected to the input end of the second coupler / mixer 62, the output end of the delay coil is connected to the input end of the second coupler / mixer 62, the output end of the second coupler / mixer 62 is connected to the second balanced detector 63 for photoelectric conversion, and the output end of the second balanced detector 63 is electrically connected to the pin of the metal butterfly package tube shell 10.
[0052] In the above embodiment, the linear frequency modulated optical signal output by the laser 40 is divided into two optical signals through the 2×2 second coupler 61. One optical signal enters the second coupling / mixer 62 after passing through the optical waveguide delay coil of fixed length, and the other optical signal directly enters the second coupling / mixer 62 through the optical waveguide; the two optical signals interfere with each other in the second coupling / mixer 62 to generate an amplitude modulated signal containing the length information of the second delay coil 64 of the calibration path 60, which is received by the second balanced detector 63 and converted into an electrical signal and output through the pins of the metal butterfly package tube shell 10.
[0053] In the above embodiment, the laser 40, the measuring path 50, the detector, etc. are all integrated on the same chip, realizing high integration based on the integrated optical waveguide chip 20. At the same time, adding a calibration path 60 based on the integrated optical waveguide chip 20 can provide real-time feedback on the measurement deviation caused by the change of the working environment and calibrate the measurement value in real time. The high-precision coherent detection transceiver module in this embodiment realizes high chip integration, small size, batch production, low cost, and high reliability.
[0054] A chip-integrated high-precision coherent detection method involved in Embodiment 2 of the present application includes:
[0055] S100, controlling the temperature in the metal butterfly package tube shell 10 within a preset threshold range through a control group component;
[0056] Specifically, after power is turned on, the temperature control device placed in the metal butterfly packaging tube shell 10 starts to work and keeps the temperature basically constant. In this embodiment, the temperature is set in the range of 22°C-28°C. Preferably, the temperature is set near the typical value of room temperature 25°C. It can also be set higher or lower, mainly limited by the working environment and the normal operating temperature of the laser 40.
[0057] S200, controlling the laser 40 to operate by a periodic current driving signal to generate a periodic continuous linear frequency modulated optical signal;
[0058] Specifically, the laser 40 receives a periodic current driving signal input from the outside through the pins of the metal butterfly package tube shell 10, and generates a periodic continuous linear frequency modulated optical signal.
[0059] S300, splitting the optical signal into two paths through the optical waveguide and entering the measurement path 50 and the calibration path 60 respectively;
[0060] Specifically, the periodic continuous linear frequency modulated optical signal generated in step S200 is transmitted along the optical waveguide on the integrated optical waveguide chip 20 and is split by the optical waveguide and simultaneously enters the optical waveguide loops of the measurement path 50 and the calibration path 60;
[0061] S400, the optical signal entering the measuring path 50 is divided into two optical signals through the first coupler 51, one optical signal is coupled by the transceiver lens 30 and transmitted into space, and after being reflected by the target, it is coaxially received by the transceiver lens 30 and returned to the first coupler / mixer 52, and the other optical signal directly enters the first coupler / mixer 52, and the two optical signals interfere in the first coupler / mixer 52 to generate a first amplitude modulated signal containing target distance information, and the first amplitude modulated signal is received by the first balanced detector 53 and converted into an electrical signal and output through the pins of the metal butterfly package tube shell 10;
[0062] S500, the optical signal entering the calibration path 60 is divided into two optical signals through the second coupler 61, one optical signal enters the second coupling / mixer 62 after passing through the second delay coil 64 with a fixed length, and the other optical signal directly enters the second coupling / mixer 62, and the two optical signals interfere in the second coupling / mixer 62 to generate a second amplitude modulated signal containing the length information of the delay coil of the calibration path 60, and the second amplitude modulated signal is received by the second balanced detector 63, converted into an electrical signal, and output through the pins of the metal butterfly package tube shell 10;
[0063] S600, the host computer uses the Hilbert transform algorithm to process the mixed time domain signal waveforms output by the measurement path 50 and the calibration path 60 respectively, so as to demodulate the instantaneous frequency versus time relationship diagrams of the measurement path 50 and the calibration path 60 respectively.
[0064] Take the periodic triangle wave frequency modulation signal as an example (the frequency modulation signal can also be a sawtooth wave), such as Figure 5 As shown; the mixed signal of the measurement path 50 and the calibration path 60 is converted into an electrical signal output by the first balanced detector 53 and the second balanced detector 63 respectively having the following Figure 6 The features shown contain the frequency information related to the spatial distance of the measurement target and the length of the second delay coil 64 of the calibration path 60. The external signal acquisition card synchronously acquires the mixed time domain signal waveforms of the measurement path 50 and the calibration path 60. At the same time, the host computer uses the Hilbert transform algorithm to process the acquired mixed time domain signal waveforms of the measurement path 50 and the calibration path 60, and demodulates the relationship diagram of the instantaneous frequency change of the measurement path 50 and the calibration path 60 over time, that is, the time spectrum of the mixed time domain signal. Due to the use of periodic triangular wave frequency modulation, each rising edge or falling edge of the triangular wave will correspond to a frequency trapezoid on the time spectrum, such as Figure 7 As shown, Figure 6 The Hilbert transform time spectrum. Figure 6 Corresponding to a complete triangle wave frequency modulation cycle, Figure 7 It contains two frequency trapezoids. The flat area of the frequency trapezoid corresponds to the instantaneous frequency fluctuations corresponding to the target space distance of the measurement path 50 and the delay coil length of the calibration path 60. Figure 8 As shown, the flat area data of the frequency trapezoid of the measurement path 50 and the calibration path 60 are respectively taken to statistically calculate the frequency average value during this period of time to obtain the signal frequency f of the measurement path 50 and the calibration path 60 测量路 and f 校准路 , the length of the calibration delay coil is recorded as L 校准路线圈 , the target test distance (round trip) is equal to the product of the ratio of the signal frequencies of the measurement path and the calibration path and the length of the delay coil of the calibration path, that is:
[0065] 2L= 测量路 / f 校准路 ·L 校准路线圈
[0066] In this embodiment, the signal frequencies of the measurement path and the calibration path are obtained by calculating the frequency mean value within a period of time through Hilbert transform spectrum statistics, and are not affected by the frequency grid effect of traditional Fourier transform. The relative changes caused by the environment, system, etc. will be equivalently fed back to the measurement path and the calibration path, and will not independently affect the measurement path or the calibration path. Through the ratio of the signal frequencies of the measurement path and the calibration path, the measurement frequency fluctuations caused by the environment, system, etc. can be eliminated, resulting in the measurement system having a high degree of robustness, thereby achieving high measurement accuracy at the micron level or even the nanometer level.
[0067] The above are only preferred specific implementations of the present application; however, the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and its improved ideas of the present application within the technical scope disclosed in the present application, which should be included in the protection scope of the present application.
Claims
1. A chip-integrated high-precision coherent detection transceiver module, characterized in that: It comprises a metal butterfly-shaped package tube shell for packaging an integrated optical waveguide chip, one end of the metal butterfly-shaped package tube shell is provided with a transceiver lens, the integrated optical waveguide chip is provided with a laser, a measuring path and a calibration path, and a temperature control component is provided in the metal butterfly-shaped package tube shell; Wherein, the measuring path comprises a first coupler, the input end of the first coupler is connected to the output end of the laser, the output end of the first coupler is connected to the transceiver lens, both ends of the first coupler are connected to a first coupler / mixer to input the optical signal reflected by the target object and the optical signal emitted by the laser into the first coupler / mixer for interference to generate an amplitude modulation signal containing target distance information, the output end of the first coupler / mixer is connected to a first balanced detector for photoelectric conversion, and the output end of the first balanced detector is electrically connected to the pin of the metal butterfly package tube shell; The calibration circuit includes a second coupler, the input end of the second coupler is connected to the output end of the laser, the two output ends of the second coupler are respectively connected to the second coupler / mixer and the delay coil, and the output end of the second coupler is connected to the input end of the second coupler / mixer, the output end of the delay coil is connected to the input end of the second coupler / mixer, the output end of the second coupler / mixer is connected to the second balanced detector for photoelectric conversion, and the output end of the second balanced detector is electrically connected to the pins of the metal butterfly package tube shell.
2. The chip-integrated high-precision coherent detection transceiver module according to claim 1, characterized in that: The temperature control component comprises a semiconductor refrigerator and a heat conducting member. The semiconductor refrigerator is arranged between the integrated optical waveguide chip and the metal butterfly package tube shell. Heat conducting members are arranged between the semiconductor refrigerator, the integrated optical waveguide chip and the metal butterfly package tube shell.
3. The chip-integrated high-precision coherent detection transceiver module according to claim 2, characterized in that: The heat conducting member is heat conducting silicone grease or graphene heat conducting sheet.
4. The chip-integrated high-precision coherent detection transceiver module according to claim 2, characterized in that: A silicon thermistor is arranged on the integrated optical waveguide chip near the laser, and both the silicon thermistor and the semiconductor refrigerator are connected to an external control module through pins of a metal butterfly packaging tube shell.
5. The chip-integrated high-precision coherent detection transceiver module according to claim 1, characterized in that: The metal butterfly-shaped package tube shell is made of alloy or metal ceramic, and a gold-plated layer is arranged on the surface of the metal butterfly-shaped package tube shell.
6. The chip-integrated high-precision coherent detection transceiver module according to claim 1, characterized in that: The optical waveguide between the first coupler and the transceiver lens is provided with a first delay coil.
7. The chip-integrated high-precision coherent detection transceiver module according to claim 1, characterized in that: The first coupler and the second coupler are both 2×2 couplers.
8. The chip-integrated high-precision coherent detection transceiver module according to claim 1, characterized in that: The integrated optical waveguide chip is prepared based on a standard silicon photonics CMOS process, the laser is a semiconductor laser, and the laser is integrated on the surface of the integrated optical waveguide chip by a heterogeneous integration method.
9. A chip-integrated high-precision coherent detection method, characterized in that: Comprising the coherent detection transceiver module according to any one of claims 1 to 8, the coherent detection method comprising: The temperature inside the metal butterfly package tube shell is controlled within a preset threshold range by means of a control group component; The laser is controlled to operate by a periodic current driving signal to generate a periodic continuous linear frequency modulated optical signal; The optical signal is divided into two paths through the optical waveguide and enters the measurement path and the calibration path respectively; The optical signal entering the measurement path is divided into two optical signals through the first coupler. One optical signal is coupled by the transceiver lens and emitted into space. After being reflected by the target, it is coaxially received by the transceiver lens again and returns to the first coupler / mixer. The other optical signal directly enters the first coupler / mixer. The two optical signals interfere in the first coupler / mixer to generate a first amplitude modulation signal containing target distance information. The first amplitude modulation signal is received by the first balanced detector and converted into an electrical signal and output through the pins of the metal butterfly package tube shell. The optical signal entering the calibration path is divided into two optical signals through the second coupler. One optical signal enters the second coupler / mixer after passing through the second delay coil of fixed length, and the other optical signal directly enters the second coupler / mixer. The two optical signals interfere in the second coupler / mixer to generate a second amplitude modulated signal containing the length information of the delay coil of the calibration path. The second amplitude modulated signal is received by the second balanced detector, converted into an electrical signal, and output through the pins of the metal butterfly package tube shell. The mixed time domain signal waveforms output by the measurement path and the calibration path are processed by the host computer using the Hilbert transform algorithm to demodulate the instantaneous frequency versus time relationship diagrams of the measurement path and the calibration path.
10. A chip integrated high-precision coherent detection method according to claim 9, characterized in that: The preset threshold range is 22°C-28°C.