5G optical module housing structure and 5G optical module
The new structural design of the base and cover solves the problems of low assembly efficiency and misalignment of the 5G optical module housing, achieving efficient and stable assembly and heat dissipation effects.
Patent Information
- Application Number
- CN202411722047.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-28
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2044-11-28
AI Technical Summary
The existing 5G optical module housing needs to be aligned and snapped together during assembly, resulting in low assembly efficiency and easy misalignment.
It adopts a new structural design of the base and cover. The base includes a fixing part, a connecting part and a bayonet part. The cover includes a plug-in plate part, a rotating shaft and a plug-in part. The rotating shaft is inserted into the slot and rotated, and the plug-in part is inserted into the card slot for fixation, realizing convenient assembly.
The assembly efficiency and precision of the optical module housing are improved, misalignment is avoided, and the structural stability and heat dissipation effect of the optical module are ensured.
Smart Images

Figure CN119291863B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of optical module production, and more specifically, to a 5G optical module housing structure and a 5G optical module. Background Art
[0002] With the rapid development of 5G technology, the performance and stability of optical modules, core components of data transmission, have become increasingly important. As a key structure that protects and supports the internal components of optical modules, the optical module housing not only provides physical protection but also influences the module's overall heat dissipation performance and electromagnetic shielding effectiveness. The high-speed, high-data-volume transmission requirements of 5G communications present new challenges in optical module housing design. The structural design and manufacturing process of the optical module housing are directly related to the operating efficiency and lifespan of the optical module.
[0003] With advancements in manufacturing technology, the production efficiency and precision of optical module housings are continuously improving. Currently, 5G optical module housings primarily feature a snap-fit housing structure. This requires production through press-fitting, making it difficult to align the upper and lower housings during press-fitting, impacting assembly efficiency. For example, patent CN114063226B (application number: CN202010780696.X) provides an optical module housing comprising a first housing and a second housing. The first housing comprises a first base plate and sidewalls thereon; the second housing comprises a second base plate and a heat dissipation structure comprising two fins extending along the length of the housing on either side of the second base plate; the second housing is capped onto the first housing, with the first base plate, the sidewalls on either side of the first base plate, and the second base plate forming a cavity; the fins on either side of the second base plate are at least partially attached to one side of the sidewall, providing a thermal connection between the fins and the side surfaces of the sidewall. The shell in patent CN114063226B reduces the contact thermal resistance between the two shells, but still needs to be aligned and then snapped together during assembly. The assembly of the optical module shell needs to be aligned before assembly, resulting in low assembly efficiency of the 5G optical module shell and easy misalignment. Summary of the Invention
[0004] The purpose of this application is to provide a 5G optical module shell structure and a 5G optical module, which solves the technical problems that the assembly of the optical module shell needs to be aligned before assembly, the assembly efficiency is low, and dislocation is easy to occur, and achieves the technical effect of improving the assembly efficiency of the optical module shell and making the optical module shell less likely to be dislocated.
[0005] A 5G optical module shell structure provided in an embodiment of the present application includes: a base, including a fixing part, a connecting part and a bayonet part, and fixing ports for fixing the optoelectronic component are provided on both sides of the fixing part, and the cross-section of the fixing part is a rectangular frame structure, the contact of the optoelectronic component is provided at one end of the base where the fixing part is located, and the end of the base where the bayonet part is located is used to connect the pull ring, the connecting part is provided with a slot arranged along the length direction of the base, and the bayonet part is provided with a card slot arranged along the length direction of the base; a cover body, including an insert plate part, a rotating shaft and a plug-in part, the insert plate part is provided at the top of the side wall of the first end of the cover body, the plug-in part is provided at the bottom of the side wall of the second end of the cover body, the rotating shaft is provided at the bottom of the side wall in the middle of the cover body, the insert plate part is used to be inserted into the fixing part, and the side wall of the cover body forms an inclined wedge-shaped part from the insert plate part to the rotating shaft, the rotating shaft can be inserted into the slot and can rotate in the slot, and the plug-in part is used to be inserted into the card slot to fix the cover body.
[0006] In a possible implementation, a rounded corner portion is provided at an end of the wedge-shaped portion close to the rotating shaft, and the rounded corner portion enables the inserting plate portion to rotate around the rotating shaft when the rotating shaft is located in the slot.
[0007] In another possible implementation, the length of the slot is greater than that of the card slot, the cross-section of the rotating shaft is circular, one end of the slot close to the fixing portion is circular, and the plug-in portion and the card slot are rectangular.
[0008] In another possible implementation, the fixing portion and the inserting plate portion are connected by fixing screws.
[0009] In another possible implementation, the fixing opening includes multiple groups of positioning bumps, the bottoms of the multiple groups of positioning bumps are provided with support portions for supporting the optoelectronic components, and the multiple groups of positioning bumps are used to fix the optoelectronic components in the length direction of the base.
[0010] In another possible implementation, a first thermally conductive silicone rubber for heat conduction is provided on the top of the inner side wall of the fixing portion, and a second thermally conductive silicone rubber for cooperating with the fixing port is provided on the bottom of the inserting plate portion.
[0011] In another possible implementation, a bottom heat dissipation fin is provided on a side of the bottom surface of the base away from the optoelectronic component, and a third thermally conductive silicone for conducting heat is provided between the bottom surface of the base and the optoelectronic component.
[0012] In another possible implementation, a gap is provided between the end of the bottom heat dissipation fin and the card slot, and the length of the gap is 5 mm to 10 mm.
[0013] In another possible implementation, a top heat dissipation fin is provided on the top of the cover body, and the top heat dissipation fin extends from the plug-in plate portion to the plug-in portion. A yield portion forming a step structure is provided at one end of the top heat dissipation fin located on the plug-in plate portion.
[0014] The embodiment of the present application further provides a 5G optical module, comprising any of the above-mentioned 5G optical module housing structures, and further comprising a pull ring connected to one end of the base 1 where the bayonet portion 13 is located.
[0015] Compared with the prior art, the embodiments of the present application have the following beneficial effects:
[0016] The embodiment of the present application provides a 5G optical module shell structure, including a base and a cover body, the base including a fixing part, a connecting part and a bayonet part, and fixing ports for fixing the optoelectronic component are provided on both sides of the fixing part, and the cross-section of the fixing part is a rectangular frame structure, the contacts of the optoelectronic component are provided at one end of the base where the fixing part is located, and the end of the base where the bayonet part is located is used to connect the pull ring, the connecting part is provided with a slot arranged along the length direction of the base, and the bayonet part is provided with a card slot arranged along the length direction of the base; the cover body includes an insert plate part, a rotating shaft and a plug-in part, the insert plate part is provided at the top of the side wall of the first end of the cover body, the plug-in part is provided at the bottom of the side wall of the second end of the cover body, the rotating shaft is provided at the bottom of the side wall in the middle of the cover body, the insert plate part is used to be inserted into the fixing part, and the side wall of the cover body forms an inclined wedge-shaped part from the insert plate part to the rotating shaft, the rotating shaft can be inserted into the slot and can rotate in the slot, and the plug-in part is used to be inserted into the card slot to fix the cover body. The 5G optical module shell structure in the embodiment of the present application can facilitate the assembly of the cover body into the fixed part by inserting the rotating shaft into the slot and rotating in the slot, and at the same time, the plug-in part is inserted into the card slot to fix the cover body, thereby facilitating the fixation of the base and the cover body, thereby improving the assembly efficiency and assembly accuracy of the optical module shell. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0018] Figure 1 A schematic diagram of the main exploded structure of a 5G optical module housing structure provided in an embodiment of the present application;
[0019] Figure 2 A schematic diagram of the assembly process of a 5G optical module housing structure provided in an embodiment of the present application;
[0020] Figure 3 A schematic diagram of the assembled structure of a 5G optical module housing provided in an embodiment of the present application;
[0021] Figure 4 for Figure 3A schematic diagram of the local structure at point A of the assembled state of a 5G optical module housing structure;
[0022] Figure 5 A schematic diagram of a top view of the base of a 5G optical module housing structure provided in an embodiment of the present application;
[0023] Figure 6 A schematic diagram of the exploded structure of a 5G optical module housing structure provided in an embodiment of the present application from the left side;
[0024] Figure 7 A schematic diagram of the main exploded structure of another 5G optical module housing structure provided in an embodiment of the present application;
[0025] Figure 8 A schematic diagram of an exploded structure from the left side of another 5G optical module housing structure provided in an embodiment of the present application;
[0026] Figure 9 A schematic diagram of the left-side assembly structure of a 5G optical module housing structure provided in an embodiment of the present application;
[0027] In the figure, 1. base; 11. fixing part; 111. fixing port; 111a. positioning protrusion; 111b. supporting part; 112. fixing screw; 113. first thermal conductive silicone; 12. connecting part; 121. slot; 13. bayonet part; 131. card slot; 14. bottom heat dissipation fin; 141. third thermal conductive silicone; 2. cover; 21. plug-in board part; 211. second thermal conductive silicone; 22. rotating shaft; 23. plug-in part; 24. wedge-shaped part; 241. rounded corner part; 25. top heat dissipation fin; 251. clearance part; 3. optoelectronic component. DETAILED DESCRIPTION
[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.
[0029] It should be noted that when a component or structure is referred to as being “fixed to” or “disposed on” another component or structure, it may be directly on the other component or structure or indirectly on the other component or structure. When a component or structure is referred to as being “connected to” another component or structure, it may be directly connected to the other component or structure or indirectly connected to the other component or structure.
[0030] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or a component or structure referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.
[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.
[0032] The existing optical module housing still needs to be aligned and then snapped together and fixed during assembly. The assembly of the optical module housing needs to be aligned before assembly, resulting in low assembly efficiency of the 5G optical module housing and easy misalignment.
[0033] Based on the above reasons, an embodiment of the present application provides a 5G optical module shell structure, including a base and a cover body, the base including a fixing part, a connecting part and a bayonet part, and fixing ports for fixing the optoelectronic component are provided on both sides of the fixing part, and the cross-section of the fixing part is a rectangular frame structure, and the contacts of the optoelectronic component are provided at one end of the base where the fixing part is located, and the end of the base where the bayonet part is located is used to connect the pull ring, the connecting part is provided with a slot arranged along the length direction of the base, and the bayonet part is provided with a card slot arranged along the length direction of the base; the cover body includes an insert plate part, a rotating shaft and a plug-in part, the insert plate part is provided at the top of the side wall of the first end of the cover body, the plug-in part is provided at the bottom of the side wall of the second end of the cover body, the rotating shaft is provided at the bottom of the side wall in the middle of the cover body, the insert plate part is used to be inserted into the fixing part, and the side wall of the cover body forms an inclined wedge-shaped part from the insert plate part to the rotating shaft, the rotating shaft can be inserted into the slot and can rotate in the slot, and the plug-in part is used to be inserted into the card slot to fix the cover body. The 5G optical module shell structure in the embodiment of the present application can facilitate the assembly of the cover body into the fixed part by inserting the rotating shaft into the slot and rotating in the slot, and at the same time, the plug-in part is inserted into the card slot to fix the cover body, thereby facilitating the fixation of the base and the cover body, thereby improving the assembly efficiency and assembly accuracy of the optical module shell.
[0034] In some scenarios, a 5G optical module housing structure of an embodiment of the present application can be applied to an optical module, which can improve the assembly efficiency of the 5G optical module housing and avoid dislocation of the 5G optical module.
[0035] The following is a detailed description of a 5G optical module housing structure provided in an embodiment of the present application with reference to specific examples.
[0036] Figure 1 This is a schematic diagram of the main exploded structure of a 5G optical module housing structure provided in an embodiment of the present application. Figure 2 This is a schematic diagram of the assembly process of a 5G optical module housing structure provided in an embodiment of the present application. Figure 3 This is a schematic diagram of the assembled structure of a 5G optical module housing structure provided in an embodiment of the present application. Figure 4 for Figure 3 A schematic diagram of the local structure of a 5G optical module housing structure in the assembled state at A, as shown in FIG. Figures 1 to 4 As shown, the shell structure of the 5G optical module includes a base 1 and a cover 2. The base 1 includes a fixing portion 11, a connecting portion 12 and a bayonet portion 13. Fixing ports 111 for fixing the optoelectronic component 3 are provided on both sides of the fixing portion 11. The cross-section of the fixing portion 11 is a rectangular frame structure. The contacts of the optoelectronic component 3 are provided at one end of the base 1 where the fixing portion 11 is located. The end of the base 1 where the bayonet portion 13 is located is used to connect the pull ring. The connecting portion 12 is provided with a slot 121 arranged along the length direction of the base 1, and the bayonet portion 13 is provided with a card groove 131 arranged along the length direction of the base 1. The cover body 2 includes an insert plate portion 21, a rotating shaft 22 and an inserting portion 23. The insert plate portion 21 is arranged at the top of the side wall of the first end of the cover body 2, the inserting portion 23 is arranged at the bottom of the side wall of the second end of the cover body 2, and the rotating shaft 22 is arranged at the bottom of the side wall in the middle of the cover body 2. The insert plate portion 21 is used to be inserted into the fixing portion 11, and the side wall of the cover body 2 forms an inclined wedge portion 24 from the insert plate portion 21 to the rotating shaft 22. The rotating shaft 22 can be inserted into the slot 121 and can rotate in the slot 121. The inserting portion 23 is used to be inserted into the card slot 131 to fix the cover body 2.
[0037] like Figures 1 to 4 As shown, structurally, the base 1 is the bottom fixing structure of the optical module housing, and the optoelectronic component 3 of the optical module can be installed and fixed through the base 1.
[0038] Structurally, the base 1 includes a fixing part 11, a connecting part 12 and a bayonet part 13. The fixing part 11, the connecting part 12 and the bayonet part 13 are arranged in sequence on the base 1. Fixing ports 111 for fixing the optoelectronic component 3 are provided on both sides of the fixing part 11. The optoelectronic component 3 can be fixed through the fixing ports 111.
[0039] For example, a support structure for supporting the optoelectronic component 3 may be provided on the base 1 at one end away from the fixing portion 11 , so as to facilitate supporting and fixing the optoelectronic component 3 when the optical module is assembled.
[0040] Structurally, the cross section of the fixing portion 11 is a rectangular frame structure, so that a complete external shell structure of the optical module can be formed at the fixing portion 11 in the circumferential direction, making the structure of the fixing portion 11 more stable.
[0041] Structurally, the optoelectronic assembly 3's contacts are located at the end of the base 1 where the fixed portion 11 resides. This allows the end where the fixed portion 11 resides to be inserted into a switch, enabling the corresponding contacts of the optoelectronic assembly 3 to exchange data with the switch. Because the optical module's fixed portion 11 forms a complete outer shell around the circumference of the module, the fixed portion 11 achieves higher structural precision, ensuring the optical module's manufacturing accuracy and making it suitable for higher-speed optical modules.
[0042] Structurally, one end of the base 1 where the bayonet portion 13 is located is used to connect the pull ring. The pull ring can be used to pull the base 1 to pull the optical module. The optical module forms a complete external shell structure of the optical module in the circumferential direction at the fixing portion 11, which can ensure the structural stability of the optical module when removing the optical module from the switch.
[0043] like Figure 1 As shown, the connecting portion 12 is provided with a slot 121 arranged along the length direction of the base 1, and the bayonet portion 13 is provided with a card slot 131 arranged along the length direction of the base 1. The cover 2 can be fixed by the slot 121 and the card slot 131.
[0044] like Figure 1 As shown, the cover body 2 includes an inserting plate portion 21 , a rotating shaft 22 and an inserting portion 23 , and the inserting plate portion 21 , the rotating shaft 22 and the inserting portion 23 are sequentially arranged on the cover body 2 .
[0045] like Figures 1 to 4 As shown, the inserting plate portion 21 is provided at the top of the side wall of the first end of the cover body 2 , and the inserting plate portion 21 is used to be inserted into the fixing portion 11 , so that the inserting plate portion 21 can cooperate with the cover body 2 to fix the inserting plate portion 21 .
[0046] like Figures 1 to 4 As shown, the plug-in portion 23 is provided at the bottom of the side wall of the second end of the cover body 2 , and the plug-in portion 23 is used to be inserted into the card slot 131 to fix the cover body 2 , so that the plug-in portion 23 can cooperate with the card slot 131 to fix the cover body 2 .
[0047] like Figures 1 to 4 As shown, the shaft 22 is arranged at the bottom of the side wall in the middle of the cover body 2, and the side wall of the cover body 2 forms an inclined wedge-shaped portion 24 from the plug-in plate portion 21 to the shaft 22. The cover body 2 can be inserted into the fixing portion 11 at an angle through the wedge-shaped portion 24, which is convenient for assembling the optical module. The shaft 22 can be inserted into the slot 121 and can rotate in the slot 121.
[0048] When assembling the optical module housing, Figure 2 As shown, the optoelectronic component 3 can be first placed on the fixing port 111 and fixed through the fixing port 111; the cover body 2 can be inserted into the fixing portion 11 at an angle through the inclined structure at the wedge-shaped portion 24, and at the same time, the rotating shaft 22 is inserted into the slot 121 and can rotate in the slot 121, so that the cover body 2 is rotated to a position parallel to the base 1.
[0049] like Figure 3 As shown, after the cover body 2 is rotated to a position parallel to the base 1, the cover body 2 can then be pushed horizontally onto the base 1. The plug-in portion 23 is used to be inserted into the card slot 131 to fix the cover body 2. The rotating shaft 22 slides in the slot 121 to fix the rotating shaft 22, and the assembly of the cover body 2 and the base 1 can be achieved, thereby improving the assembly efficiency of the cover body 2 and the base 1. The optical module housing is not a snap-fit structure, so that the optical module housing is not prone to misalignment.
[0050] The beneficial effect brought about by the above implementation method is that the optical module forms a complete external shell structure of the optical module in the circumferential direction at the fixing part, so that the structural accuracy of the fixing part is higher, the manufacturing accuracy of the optical module can be guaranteed, and it is suitable for use in higher-speed optical modules.
[0051] The beneficial effect brought about by the above-mentioned implementation method is that one end of the base where the bayonet portion is located is used to connect the pull ring, and the optical module forms a complete external shell structure of the optical module in the circumferential direction at the fixed portion, which can ensure the structural stability of the optical module when removing the optical module from the switch and avoid damage to the optical module.
[0052] The beneficial effect brought about by the above implementation is that the plug-in part can be inserted into the fixing part to fix the plug-in part, and the plug-in part can cooperate with the card slot to fix the cover, thereby ensuring the fixing stability of the optical module housing.
[0053] The beneficial effect brought about by the above-mentioned implementation method is that the cover body can be inserted into the fixed part at an angle through the inclined structure at the wedge-shaped part, and at the same time the rotating shaft is inserted into the slot and can rotate in the slot. After the cover body is rotated to a position parallel to the base, the cover body can then be pushed horizontally onto the base, which can realize the assembly of the cover body and the base and improve the assembly efficiency of the cover body and the base. The optical module shell is not a snap-fit structure, so that the optical module shell is not prone to misalignment.
[0054] In some implementations, a rounded corner portion 241 is provided at the end of the wedge-shaped portion 24 close to the rotating shaft 22 . The rounded corner portion 241 enables the inserting plate portion 21 to rotate around the rotating shaft 22 when the rotating shaft 22 is located in the slot 121 .
[0055] like Figure 1 and Figure 2 As shown, the end of the wedge-shaped portion 24 close to the rotating shaft 22 is provided with a rounded corner portion 241. By providing the rounded corner portion 241, the rounded corner portion 241 enables the inserting plate portion 21 to rotate around the rotating shaft 22 when the rotating shaft 22 is located in the slot 121, thereby facilitating the assembly of the cover body 2 and the base 1.
[0056] For example, the fillet radius of the fillet portion 241 may be 100 mm to 120 mm.
[0057] The beneficial effect brought about by the above implementation method is that the rounded corner portion enables the inserting plate portion to rotate around the rotating shaft when the rotating shaft is located in the slot, which facilitates the assembly of the cover and the base and improves the assembly efficiency of the cover and the base.
[0058] In some implementations, the length of the slot 121 is greater than the length of the card slot 131, the cross-section of the rotating shaft 22 is circular, the end of the slot 121 close to the fixing portion 11 is circular, and the plug-in portion 23 and the card slot 131 are rectangular.
[0059] like Figures 1 to 3 As shown, the length of the slot 121 is greater than the length of the card slot 131, so that when the plug-in portion 23 is inserted into the card slot 131 to fix the cover body 2, the shaft 22 can always slide in the slot 121, further ensuring the efficiency of assembling the cover body and the base.
[0060] like Figures 1 to 3 As shown, the cross section of the rotating shaft 22 is circular, and the end of the slot 121 close to the fixed part 11 is circular, so that the rotating shaft 22 with a circular cross section can easily rotate smoothly in the slot 121, and the ends of the rotating shaft 22 and the slot 121 can cooperate with each other, which is convenient for assembling the base 1 and the cover 2.
[0061] like Figures 1 to 3 As shown, the plug-in portion 23 and the card slot 131 are rectangular in shape, so that the plug-in portion 23 and the card slot 131 can cooperate with each other to be stably positioned.
[0062] The beneficial effect brought about by the above implementation is that when the plug-in portion is inserted into the slot to fix the cover body, the rotating shaft always slides in the slot, further ensuring the efficiency of assembling the cover body and the base.
[0063] The beneficial effect brought about by the above implementation method is that the rotating shaft with a circular cross-section is convenient for smooth rotation in the slot, and the ends of the rotating shaft and the slot can cooperate with each other, which facilitates the assembly of the base and the cover, ensuring the assembly accuracy of the base and the cover.
[0064] The beneficial effect brought about by the above implementation is that the rectangular plug-in portion and the card slot enable the plug-in portion and the card slot to cooperate with each other for stable positioning.
[0065] In some implementations, the fixing portion 11 and the inserting plate portion 21 are connected by fixing screws 112 .
[0066] like Figure 4 As shown, when the fixing portion 11 and the plug-in plate portion 21 are plugged together, the fixing portion 11 and the plug-in plate portion 21 are connected by fixing screws 112 , which can ensure that the fixing portion 11 and the plug-in plate portion 21 are stably connected and fixed.
[0067] For example, the number of the fixing screw 112 used to fix the fixing portion 11 and the inserting plate portion 21 may be one.
[0068] The beneficial effect brought about by the above implementation manner is that when the fixing portion and the plug-in plate portion are plugged in and connected by fixing screws, it is possible to ensure that the fixing portion and the plug-in plate portion are stably connected and fixed.
[0069] The beneficial effect brought about by the above-mentioned implementation method is that when the fixing part and the plug-in part are plugged in, the number of fixing screws used to fix the fixing part and the plug-in part is greatly reduced, thereby improving the stability of the connection between the base and the cover body and improving the assembly efficiency of the optical module housing.
[0070] In some implementations, the fixing opening 111 includes multiple groups of positioning bumps 111a, the bottoms of which are provided with support portions 111b for supporting the optoelectronic components 3. The multiple groups of positioning bumps 111a are used to fix the optoelectronic components 3 in the length direction of the base 1.
[0071] Figure 5 A schematic diagram of a top view of a base of a 5G optical module housing structure provided in an embodiment of the present application is shown in FIG. Figure 5 As shown, the fixing opening 111 includes multiple groups of positioning protrusions 111a, which are used to fix the optoelectronic component 3 in the length direction of the base 1, so that the multiple groups of positioning protrusions 111a can cooperate with each other to assemble the optoelectronic component 3 in the horizontal direction.
[0072] like Figure 4 As shown, the bottom of the multiple groups of positioning protrusions 111 a is provided with a supporting portion 111 b for supporting the optoelectronic component 3 . The supporting portion 111 b can support the optoelectronic component 3 , making it easier to assemble the optoelectronic component 3 .
[0073] The beneficial effect brought about by the above implementation is that the optoelectronic component 3 can be supported by the support portion, which facilitates the assembly of the optoelectronic component.
[0074] In some implementations, a first thermally conductive silicone rubber 113 for heat conduction is provided on the top of the inner side wall of the fixing portion 11 , and a second thermally conductive silicone rubber 211 for cooperating with the fixing port 111 is provided on the bottom of the inserting plate portion 21 .
[0075] Figure 6 This is a left-side exploded structural diagram of a 5G optical module housing structure provided in an embodiment of the present application. Figure 7 This is a schematic diagram of the main exploded structure of another 5G optical module housing structure provided in an embodiment of the present application. Figure 8 This is a schematic diagram of the exploded structure of another 5G optical module housing structure provided in an embodiment of the present application from the left side. Figure 9 A left-view assembly structure diagram of a 5G optical module housing structure provided in an embodiment of the present application is shown in FIG. Figures 1 to 9 As shown, a first thermally conductive silicone rubber 113 for heat conduction is provided on the top of the inner wall of the fixing portion 11. The first thermally conductive silicone rubber 113 can cooperate with each other to conduct heat at the top of the fixing portion 11 and the plug-in portion 21, thereby ensuring that the heat on the plug-in portion 21 is smoothly transferred to the fixing portion 11, and then the heat is transferred to the base 1.
[0076] like Figures 1 to 9 As shown, the bottom of the plug-in portion 21 is provided with a second thermally conductive silicone 211 for cooperating with the fixing port 111. The second thermally conductive silicone 211 can conduct heat between the bottom of the plug-in portion 21 and the optoelectronic component 3, so that the heat of the optoelectronic component 3 can be smoothly transferred to the plug-in portion 21, and then the heat on the plug-in portion 21 can be smoothly transferred to the fixing portion 11, thereby ensuring the heat dissipation effect of the optical module housing.
[0077] The beneficial effect brought about by the above implementation method is that the heat on the plug-in part is smoothly transferred to the fixing part through the first thermally conductive silicone, and then the heat is transferred to the base. Compared with the optical module housing with a snap-fit structure, the heat conduction area is increased and the heat dissipation effect of the optical module housing is improved.
[0078] The beneficial effect brought about by the above implementation method is that the optoelectronic component can transfer heat to the plug-in board part through the second thermally conductive silicone, and then the heat on the plug-in board part can be smoothly transferred to the fixing part, further ensuring the heat dissipation effect of the optical module housing.
[0079] In some implementations, a bottom heat dissipation fin 14 is provided on the side of the bottom surface of the base 1 away from the optoelectronic component 3 , and a third thermally conductive silicone 141 for heat conduction is provided between the bottom surface of the base 1 and the optoelectronic component 3 .
[0080] like Figures 6 and 7As shown, a bottom heat dissipation fin 14 is provided on the side of the bottom surface of the base 1 away from the optoelectronic component 3. The bottom heat dissipation fin 14 is used to dissipate heat from the bottom of the base 1. A third thermally conductive silicone 141 for heat conduction is provided between the bottom surface of the base 1 and the optoelectronic component 3. The third thermally conductive silicone 141 can conduct heat between the bottom surface of the base 1 and the optoelectronic component 3, thereby improving the thermal conductivity of the base 1 and the optoelectronic component 3.
[0081] Illustratively, the bottom heat dissipation fins on the base may be integrally formed with the base.
[0082] The beneficial effect brought about by the above implementation method is that the bottom heat dissipation fins are used to dissipate heat from the bottom of the base, and the third thermally conductive silicone can conduct heat between the bottom surface of the base and the optoelectronic component, thereby improving the heat dissipation effect of the base on the optoelectronic component.
[0083] The beneficial effect brought about by the above implementation is that the bottom heat dissipation fins on the base are integrally formed with the base, which can transfer the heat on the fixed part to the base, thereby improving the overall heat dissipation effect of the base.
[0084] In some implementations, a gap is provided between the end of the bottom heat dissipation fin 14 and the slot 131 , and the length of the gap is 5 mm to 10 mm.
[0085] like Figure 7 As shown, a gap L is provided between the end of the bottom heat dissipation fin 14 and the card slot 131, and the length of the gap L is 5mm to 10mm, so that there is no interference between the bottom heat dissipation fin 14 and the card slot 131, ensuring the convenience of the cover installation and the heat dissipation effect of the base 1.
[0086] The beneficial effect brought about by the above implementation method is that there will be no interference between the bottom heat dissipation fins and the card slots, which ensures the convenience of installing the cover body and at the same time can ensure the heat dissipation effect of the base.
[0087] In some implementations, a top heat dissipation fin 25 is provided on the top of the cover body 2. The top heat dissipation fin 25 extends from the plug-in portion 21 to the plug-in portion 23. The top heat dissipation fin 25 is located at one end of the plug-in portion 21 and is provided with a step-shaped accommodating portion.
[0088] like Figure 7 and Figure 8 As shown, the top of the cover body 2 is provided with a top heat dissipation fin 25, that is, the top of the cover body 2 at the plug-in part 21 and the plug-in part 23 are serrated heat dissipation fins, and the top heat dissipation fin 25 can dissipate heat from the top of the cover body 2, further improving the heat dissipation effect of the optical module housing.
[0089] like Figure 7As shown, the top heat dissipation fins 25 extend from the plug-in board portion 21 to the plug-in portion 23 , so that the top heat dissipation fins 25 can extend from the plug-in board portion 21 to the plug-in portion 23 to dissipate heat for the cover 2 efficiently.
[0090] Structurally, the top heat dissipation fin 25 is provided with a step-shaped relief portion 251 at one end of the plug-in portion 21. The relief portion 251 can make way for the fixing portion 11, thereby ensuring the flatness of the top heat dissipation fin 25 when assembled on the fixing portion 11.
[0091] The beneficial effect brought about by the above implementation method is that the fixing portion can be made to give way by the giving portion, thereby ensuring the flatness of the top heat dissipation fins when assembled on the fixing portion.
[0092] An embodiment of the present application further provides a 5G optical module, comprising any of the above-mentioned 5G optical module housing structures, and further comprising a pull ring connected to one end of the base 1 where the bayonet portion 13 is located.
[0093] The beneficial effect brought about by the above implementation method is that the base can be pulled by the pull ring to pull the optical module, and a complete external shell structure of the optical module is formed in the circumferential direction at the fixed part of the optical module, which can ensure the structural stability of the optical module when removing the optical module from the switch.
[0094] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.
Claims
1. A 5G optical module housing structure, characterized in that: include: The base includes a fixing portion, a connecting portion, and a bayonet portion. The fixing portion has fixing openings on both sides for fixing the optoelectronic component. The cross-section of the fixing portion is a rectangular frame structure. The contacts of the optoelectronic component are provided at one end of the base where the fixing portion is located. The end of the base where the bayonet portion is located is used to connect to the pull ring. The connecting portion has a slot provided along the length of the base, and the bayonet portion has a card slot provided along the length of the base. The cover body includes an inserting plate portion, a rotating shaft and an inserting portion, the inserting plate portion is arranged at the top of the side wall of the first end of the cover body, the inserting portion is arranged at the bottom of the side wall of the second end of the cover body, and the rotating shaft is arranged at the bottom of the side wall in the middle of the cover body, the inserting plate portion is used to be inserted into the fixing portion, the side wall of the cover body forms an inclined wedge-shaped portion from the inserting plate portion to the rotating shaft, the rotating shaft can be inserted into the slot and can rotate in the slot, and the inserting portion is used to be inserted into the card slot to fix the cover body; the end of the wedge-shaped portion close to the rotating shaft is provided with a rounded corner portion, and the rounded corner portion enables the inserting plate portion to rotate around the rotating shaft when the rotating shaft is located in the slot; the length of the slot is greater than the length of the card slot, the cross-section of the rotating shaft is circular, the end of the slot close to the fixing portion is circular, and the plugging portion and the card slot are rectangular in shape; The fixing opening includes a plurality of positioning protrusions, the bottoms of which are provided with supporting portions for supporting the optoelectronic components, and the plurality of positioning protrusions are used to fix the optoelectronic components in the length direction of the base; A first thermally conductive silicone rubber is provided on the top of the inner side wall of the fixing portion for heat conduction, and a second thermally conductive silicone rubber is provided on the bottom of the plug-in portion for cooperating with the fixing port; A bottom heat dissipation fin is provided on the side of the bottom surface of the base away from the optoelectronic component, and a third thermal conductive silica gel for heat conduction is provided between the bottom surface of the base and the optoelectronic component.
2. The 5G optical module housing structure according to claim 1, wherein: The fixing portion and the inserting plate portion are connected by fixing screws.
3. The 5G optical module housing structure according to claim 2, wherein: A gap is provided between the end of the bottom heat dissipation fin and the card slot, and the length of the gap is 5mm to 10mm.
4. The 5G optical module housing structure according to claim 3, wherein: A top heat dissipation fin is provided on the top of the cover body. The top heat dissipation fin extends from the plug-in plate portion to the plug-in portion. One end of the top heat dissipation fin located at the plug-in plate portion is provided with a yielding portion forming a step structure.
5. A 5G optical module, characterized in that: The 5G optical module housing structure includes the structure described in any one of claims 1 to 4, and further includes a pull ring connected to one end of the base where the bayonet portion is located.
Citation Information
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