Operating Method, Device and Electronic Device of Heat Dissipation Device on Server

Abstract

An embodiment of the present application provides a method, a device, and an electronic device for operating a heat dissipation device on a server. The server includes: server components, a first controller, and a heat dissipation device. A first operating system and a second operating system are deployed on the first controller. The method includes: the heat dissipation device starts running at a target duration after the server is powered on; the heat dissipation device runs according to the operating parameters output by the first controller. Through the present application, the problem that the heat dissipation device has poor timeliness in dissipating heat from the server in the powered-on state is solved, and thus the effect of the heat dissipation device having timeliness in dissipating heat from the server in the powered-on state is achieved.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of computers, and more particularly, to a method and apparatus for operating a heat dissipation device on a server and an electronic device. Background Art

[0002] The heat dissipation condition of a server has a crucial impact on the component life and business operation of the server. During the use of the server, it may be in a state of being powered on but not running properly. However, in the current related technologies, in such a state, an effective control strategy for the heat dissipation device has not been proposed, resulting in the heat that may be generated on the server in such a state not being processed in time, which may affect the normal operation of the server.

[0003] In view of the problems in the related technologies, such as the poor timeliness of the heat dissipation device in dissipating heat from the server in the powered-on state, no effective solution has been proposed. Summary of the Invention

[0004] Embodiments of the present application provide a method and apparatus for operating a heat dissipation device on a server and an electronic device, so as to at least solve the problem of poor timeliness of the heat dissipation device in dissipating heat from the server in the powered-on state in the related technologies.

[0005] According to an embodiment of the present application, a method for operating a heat dissipation device on a server is provided. The server includes: server components, a first controller, and a heat dissipation device. The first controller is deployed with a first operating system and a second operating system. The method includes: the heat dissipation device starts to operate from a target duration after the server is powered on, where the target duration is the startup duration of the first operating system, and the startup duration of the first operating system is less than the startup duration of the second operating system;

[0006] The heat dissipation device operates according to the operation parameters output by the first controller, where the operation parameters output by the first controller are determined according to the server state of the server, the component state of the server components, and the temperature of the server.

[0007] In an exemplary embodiment, when the server state is used to indicate that the server is powered on but not turned on, the operation parameters output by the first controller are determined according to the component state of the server components belonging to the first type, the component temperature of the server components belonging to the first type, and the ambient temperature of the server, where the server components belonging to the first type are the server components that generate heat after the server is powered on;

[0008] When the server status is used to indicate that the server is in the startup process, the operating parameters output by the first controller are determined according to the component status of the server components belonging to the first type, the component temperature of the server components belonging to the second type, and the ambient temperature of the server, where the server components belonging to the second type are the server components that allow the operating system controlling the heat dissipation device to obtain the component temperature during the startup process of the server.

[0009] In an exemplary embodiment, the operating parameters output by the first controller are determined according to the component status of the server components belonging to the first type, the component temperature of the server components belonging to the first type, and the ambient temperature of the server, including:

[0010] When the component status of the server components belonging to the first type is used to indicate that the server is configured with the server components belonging to the first type, the operating parameters output by the first controller are the first operating parameter or the second operating parameter, where the ambient temperature of the server and the first operating parameter conform to the first heat dissipation curve, and the first heat dissipation curve is used to indicate the first conversion relationship between the ambient temperature of the server and the operating parameters of the heat dissipation device, and the second operating parameter is calculated according to the component temperature of the server components belonging to the first type.

[0011] In an exemplary embodiment, the operating parameters output by the first controller are determined according to the component status of the server components belonging to the first type, the component temperature of the server components belonging to the first type, and the ambient temperature of the server, and also include one of the following:

[0012] When the component status of the server components belonging to the first type is used to indicate that the server is not configured with the server components belonging to the first type, the operating parameters output by the first controller are the target parameter value;

[0013] When the component status of the server components belonging to the first type is used to indicate that the server is not configured with the server components belonging to the first type, the operating parameters output by the first controller are the third operating parameter, where the ambient temperature of the server and the third operating parameter conform to the second heat dissipation curve, and the second heat dissipation curve is used to indicate the second conversion relationship between the ambient temperature of the server and the operating parameters of the heat dissipation device, and the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the first conversion relationship for the same ambient temperature of the server is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the second conversion relationship.

[0014] In an exemplary embodiment, the server components belonging to the first type include: a plurality of candidate server components, the first heat dissipation curve includes a plurality of heat dissipation curves corresponding to the plurality of candidate server components one by one, and the higher the operating power consumption of a candidate server component, the higher the heat dissipation performance of the heat dissipation device corresponding to the operating parameters on the corresponding heat dissipation curve at the same ambient temperature of the server;

[0015] The first operating parameter is the operating parameter of the target server component configured on the server among the plurality of candidate server components on the corresponding heat dissipation curve.

[0016] In an exemplary embodiment, the server components belonging to the first type include: an Open Compute Project network card and / or an intelligent network card, the heat dissipation device includes: a fan, the operating parameter of the heat dissipation device includes: the rotation speed duty ratio of the fan, and the first heat dissipation curve includes: a first curve corresponding to the Open Compute Project network card and a second curve corresponding to the intelligent network card;

[0017] When the Open Compute Project network card is configured on the server, the first curve includes: when the ambient temperature of the server is less than or equal to the first temperature, the rotation speed duty ratio is the first duty ratio; when the ambient temperature of the server is greater than or equal to the second temperature, the rotation speed duty ratio is the second duty ratio; when the ambient temperature of the server is greater than the first temperature and less than the second temperature, the rotation speed duty ratio is linearly related to the ambient temperature of the server between the first duty ratio and the second duty ratio;

[0018] When the intelligent network card is configured on the server, the second curve includes: when the ambient temperature of the server is less than or equal to the first temperature, the rotation speed duty ratio is the third duty ratio; when the ambient temperature of the server is greater than or equal to the second temperature, the rotation speed duty ratio is the fourth duty ratio; when the ambient temperature of the server is greater than the first temperature and less than the second temperature, the rotation speed duty ratio is linearly related to the ambient temperature of the server between the third duty ratio and the fourth duty ratio;

[0019] Wherein, the third duty ratio is greater than the first duty ratio, and the fourth duty ratio is greater than the second duty ratio.

[0020] In an exemplary embodiment, when both the Open Compute Project network card and the intelligent network card are configured on the server, the first operating parameter is the operating parameter corresponding to the ambient temperature of the server on the second curve.

[0021] In an exemplary embodiment, the operating parameters output by the first controller are determined based on the component status of server components of the first type in the server components, the component temperature of server components of the second type, and the ambient temperature of the server, including:

[0022] When the component status of server components of the first type is used to indicate that server components of the first type are configured on the server, the operating parameters output by the first controller are the fourth operating parameter or the fifth operating parameter. Among them, the ambient temperature of the server and the fourth operating parameter conform to a third heat dissipation curve, and the third heat dissipation curve is used to indicate a third conversion relationship between the ambient temperature of the server and the operating parameters of the heat dissipation device. The fifth operating parameter is calculated based on the component temperature of server components of the second type;

[0023] When the component status of server components of the first type is used to indicate that server components of the first type are not configured on the server, the operating parameters output by the first controller are the sixth operating parameter or the seventh operating parameter. Among them, the ambient temperature of the server and the sixth operating parameter conform to a fourth heat dissipation curve, and the fourth heat dissipation curve is used to indicate a fourth conversion relationship between the ambient temperature of the server and the operating parameters of the heat dissipation device. The seventh operating parameter is calculated based on the component temperature of server components of the second type. The heat dissipation performance of the heat dissipation device corresponding to the operating parameter of the same ambient temperature of the server under the third conversion relationship is higher than that of the heat dissipation device corresponding to the operating parameter under the fourth conversion relationship.

[0024] In an exemplary embodiment, the server components of the first type include: Open Compute Project network cards and / or smart network cards. The heat dissipation device includes: fans. The operating parameters of the heat dissipation device include: the rotation speed duty cycle of the fans. The third heat dissipation curve includes: a first curve corresponding to the Open Compute Project network card and a second curve corresponding to the smart network card;

[0025] The third heat dissipation curve includes: when the ambient temperature of the server is less than or equal to the first temperature, the rotation speed duty cycle is the fifth duty cycle; when the ambient temperature of the server is greater than or equal to the second temperature, the rotation speed duty cycle is the sixth duty cycle; when the ambient temperature of the server is greater than the first temperature and less than the second temperature, the rotation speed duty cycle is linearly related to the ambient temperature of the server between the fifth duty cycle and the sixth duty cycle;

[0026] The fourth heat dissipation curve includes: when the ambient temperature of the server is less than or equal to the first temperature, the duty cycle of the rotation speed is the seventh duty cycle; when the ambient temperature of the server is greater than or equal to the second temperature, the duty cycle of the rotation speed is the eighth duty cycle; when the ambient temperature of the server is greater than the first temperature and less than the second temperature, the duty cycle of the rotation speed is linearly related to the ambient temperature of the server between the seventh duty cycle and the eighth duty cycle;

[0027] Wherein, the fifth duty cycle is greater than the seventh duty cycle, and the sixth duty cycle is greater than the eighth duty cycle.

[0028] In an exemplary embodiment, a second controller is further deployed on the server, and the method further includes:

[0029] When the server is powered on but not started and the first controller fails to start, the heat dissipation device starts to operate after the second controller starts;

[0030] When server components of the first type are configured on the server, the heat dissipation device operates according to first preset parameters, where the server components of the first type are server components that generate heat after the server is powered on;

[0031] When the server components of the first type are not configured on the server, the heat dissipation device operates according to second preset parameters, where the heat dissipation performance of the heat dissipation device corresponding to the first preset parameters is higher than the heat dissipation performance of the heat dissipation device corresponding to the second preset parameters.

[0032] In an exemplary embodiment, the method further includes:

[0033] When the first controller fails to start, the server is in the power-on state, and server components of the first type are configured on the server, the heat dissipation device operates according to third preset parameters;

[0034] When the first controller fails to start, the server is in the power-on state, and server components of the first type are not configured on the server, the heat dissipation device operates according to fourth preset parameters, where the heat dissipation performance of the heat dissipation device corresponding to the third preset parameters is higher than the heat dissipation performance of the heat dissipation device corresponding to the fourth preset parameters.

[0035] In an exemplary embodiment, the heat dissipation device operates according to the operation parameters output by the first controller, including:

[0036] The heat dissipation device operates according to the operating parameters output by the first operating system in the first stage, where the first stage is the stage from the completion of the startup of the first operating system to the completion of the startup of the second operating system;

[0037] The heat dissipation device operates according to the operating parameters output by the second operating system in the second stage, where the second stage is the stage from the completion of the startup of the second operating system to the completion of the server's boot-up.

[0038] In an exemplary embodiment, the heat dissipation device operates according to the operating parameters output by the first operating system in the first stage, including:

[0039] The operating parameters of the heat dissipation device rise to the heat dissipation operating parameters determined by the first operating system at a reference time after starting to operate, where there is a time interval between the reference time and the first time.

[0040] In an exemplary embodiment, the operating parameters of the heat dissipation device rise to the heat dissipation operating parameters determined by the first operating system at a reference time after the first time, including:

[0041] After the first time, the operating parameters of the heat dissipation device start from an initial value and rise from the current operating parameter to the next current operating parameter every target time period until they rise to the heat dissipation operating parameter;

[0042] Wherein, when the difference between the heat dissipation operating parameter and the current operating parameter is greater than or equal to the step operating parameter, the rising amount of the operating parameter is the step operating parameter; when the difference between the heat dissipation operating parameter and the current operating parameter is less than the step operating parameter, the rising amount of the operating parameter is the difference between the heat dissipation operating parameter and the current operating parameter.

[0043] According to another embodiment of the present application, a control device for a heat dissipation device on a server is provided. The server includes: server components, a first controller, and a heat dissipation device. The first operating system and the second operating system are deployed on the first controller. The device includes: a first operation module for the heat dissipation device to start operating at a target duration after the server is powered on, where the target duration is the startup duration of the first operating system, and the startup duration of the first operating system is less than the startup duration of the second operating system; a second operation module for the heat dissipation device to operate according to the operating parameters output by the first controller, where the operating parameters output by the first controller are determined according to the server state of the server, the component state of the server components, and the temperature of the server.

[0044] According to another embodiment of the present application, there is also provided a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above method embodiments when running.

[0045] According to another embodiment of the present application, there is also provided an electronic device including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in any of the above method embodiments.

[0046] According to another embodiment of the present application, there is also provided a computer program product including a computer program, wherein the computer program implements the steps in any of the above method embodiments when executed by a processor.

[0047] Through the present application, a dual operating system (i.e., the first operating system and the second operating system) is deployed on the first controller in the server. When the server is powered on, the first controller starts to boot. The first operating system completes booting at the first time after the boot time of the first controller. The first operating system starts to control the operation of the heat dissipation device, enabling the heat dissipation device to operate as soon as possible after the server is powered on to dissipate the heat generated by the server at this time. The second operating system completes booting at the second time after the first time. The control right of the heat dissipation device is transferred from the first operating system to the second operating system, and the second operating system conducts more comprehensive control over the heat dissipation device. Therefore, the technical problem that the heat dissipation device has poor timeliness in dissipating heat from the server in the powered-on state can be solved, and the technical effect of improving the timeliness of the heat dissipation device in dissipating heat from the server in the powered-on state can be achieved. Description of the Drawings

[0048] Figure 1 is a hardware structure block diagram of a server device for a control method of a heat dissipation device on a server according to an embodiment of the present application;

[0049] Figure 2 is a flowchart of a control method of a heat dissipation device on a server according to an embodiment of the present application;

[0050] Figure 3 is a flowchart of an operation method of a heat dissipation device on a server according to an embodiment of the present application;

[0051] Figure 4 is a schematic diagram of a RTOS system controlling a server heat dissipation system according to an embodiment of the present application;

[0052] Figure 5 is a schematic diagram of the architecture of a BMC according to an embodiment of the present application;

[0053] Figure 6Schematic diagram of the control and operation of a heat dissipation device according to an embodiment of the present application;

[0054] Figure 7 Schematic diagram of the RTOS control and operation of a heat dissipation device according to an embodiment of the present application;

[0055] Figure 8 Schematic diagram of the BMC control and operation of a heat dissipation device according to an embodiment of the present application;

[0056] Figure 9 Schematic diagram of the CPLD control and operation of a heat dissipation device according to an embodiment of the present application;

[0057] Figure 10 Block diagram of the control device of the heat dissipation device on the server according to an embodiment of the present application. Detailed implementation manners

[0058] In the following, embodiments of the present application will be described in detail with reference to the accompanying drawings and in conjunction with the embodiments.

[0059] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence.

[0060] The method embodiments provided in the embodiments of the present application can be executed on a server device or a similar computing device. Taking running on a server device as an example, Figure 1 Hardware block diagram of the server device of a control method of the heat dissipation device on the server according to an embodiment of the present application. As Figure 1 shown, the server device may include one or more ( Figure 1 only one is shown in the figure) processors 102 (the processor 102 may include, but is not limited to, a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a memory 104 for storing data. Among them, the above-mentioned server device may further include a transmission device 106 for communication functions and an input / output device 108. Those of ordinary skill in the art can understand that, Figure 1 the structure shown in the figure is only schematic, and it does not limit the structure of the above-mentioned server device. For example, the server device may further include more or fewer components than Figure 1 shown in the figure, or have a different configuration from Figure 1 shown in the figure.

[0061] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the control method of the heat dissipation device on the server in the embodiments of the present application. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, the above-mentioned method is implemented. The memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memories, or other non-volatile solid-state memories. In some instances, the memory 104 may further include a memory remotely provided with respect to the processor 102, and these remote memories can be connected to the server device through a network. Examples of the above-mentioned network include but are not limited to the Internet, enterprise intranets, local area networks, mobile communication networks, and combinations thereof.

[0062] The transmission device 106 is used to receive or send data via a network. Specific examples of the above-mentioned network may include a wireless network provided by a communication provider of the server device. In one instance, the transmission device 106 includes a network adapter (abbreviated as NIC for Network Interface Controller), which can be connected to other network devices through a base station and thus can communicate with the Internet. In one instance, the transmission device 106 can be a radio frequency (abbreviated as RF) module, which is used to communicate with the Internet wirelessly.

[0063] In this embodiment, a control method for a heat dissipation device on a server is provided. The server includes: server components, a first controller, and a heat dissipation device. A first operating system and a second operating system are deployed on the first controller. Figure 2 It is a flowchart of the control method for the heat dissipation device on the server according to the embodiments of the present application, as Figure 2 shown. The process includes the following steps:

[0064] Step S202, the first controller starts to boot when the server is powered on;

[0065] Step S204, the first operating system controls the operation of the heat dissipation device starting from a first time after the startup time of the first controller, where the first time is the time when the first operating system completes startup;

[0066] Step S206, the first operating system stops controlling the operation of the heat dissipation device at a second time after the first time, where the second time is the time when the second operating system completes startup;

[0067] Step S208, the second operating system controls the operation of the heat dissipation device starting from the second time.

[0068] Through the above steps, a dual operating system (i.e., the first operating system and the second operating system) is deployed on the first controller in the server. When the server is powered on, the first controller starts to boot. At the first moment after the boot time of the first controller, the first operating system completes the boot, and the first operating system starts to control the operation of the heat dissipation device, which can enable the heat dissipation device to operate as soon as possible after the server is powered on to dissipate the heat generated by the server at this time. At the second moment after the first moment, the second operating system completes the boot, and the control right of the heat dissipation device is transferred from the first operating system to the second operating system, and the second operating system conducts more comprehensive control over the heat dissipation device. Therefore, the technical problem of poor timeliness of the heat dissipation device for dissipating heat from the server in the powered-on state can be solved, and the technical effect of improving the timeliness of the heat dissipation device for dissipating heat from the server in the powered-on state can be achieved.

[0069] Optionally, in this embodiment, the above first operating system and second operating system can be, but are not limited to, two heterogeneous or homogeneous operating systems, that is, the types of the first operating system and the second operating system can be the same or different.

[0070] Taking the first operating system and the second operating system as heterogeneous operating systems as an example, the first operating system and the second operating system can be operating systems with different sensitivities to response time. For example, the first operating system is more sensitive to response time than the second operating system. Or, the first operating system and the second operating system can be operating systems with different resource occupation amounts. For example, the first operating system occupies less resources for the service than the second operating system. The first operating system is an operating system that boots faster than the second operating system.

[0071] The above first operating system and second operating system can be, but are not limited to, two heterogeneous operating systems deployed on the controller of the embedded system, that is, the embedded operating system. The embedded operating system can be divided into a real-time operating system (RTOS) and a non-real-time operating system according to the sensitivity to response time. The real-time operating system can include, but is not limited to, Free RTOS (Free Real-Time Operating System) and RT Linux (RealTime Linux), and the non-real-time operating system can include, but is not limited to, contiki (Contiki Operating System), HeliOS (Helix Operating System), and Linux (Linux Operating System), etc.

[0072] The above-mentioned first controller may, but is not limited to, include the Baseboard Management Controller (BMC) of the server. The second operating system is the main operating system of the BMC, and the first operating system is the auxiliary operating system of the BMC. The above-mentioned heat dissipation device may, but is not limited to, include a fan, a heat dissipation plate, a heat dissipation pipe, and so on. The operation control of the first controller over the heat dissipation device may, but is not limited to, include the control of the operation parameters of the heat dissipation device by the first controller. For example, if the heat dissipation device is a fan, the first controller can control the duty cycle of the fan speed. If the heat dissipation device is a heat dissipation plate, a heat dissipation pipe, etc., the first controller can control the operation parameters such as the flow rate or velocity of the condensation substance.

[0073] The above-mentioned first time is the time when the first operating system completes startup, and the second time is the time when the second operating system completes startup. The first operating system starts up faster than the second operating system, which can enable the heat dissipation device to start running as soon as possible after the server is powered on. At the second time when the second operating system completes startup, the control right of the heat dissipation device is transferred from the first operating system to the second operating system. As the main operating system of the first controller, the second operating system can control the heat dissipation device more comprehensively.

[0074] In an optional example, in the above step S204, the first operating system may, but is not limited to, control the operation of the heat dissipation device starting from the first time after the startup time of the first controller in the following manner: when the first operating system has completed startup and the server has not completed booting, the first operating system controls the operation of the heat dissipation device according to the server state of the server, the component state of the server components, the component temperature of the server components, and the ambient temperature of the server; the first operating system detects the system state of the second operating system.

[0075] When the first operating system completes startup, if the server has not completed booting, the first operating system may, but is not limited to, control the operation of the heat dissipation device according to the server state of the server, the component state of the server components, the component temperature of the server components, and the ambient temperature of the server.

[0076] In this embodiment, the server state may, but is not limited to, refer to the situation where the server is powered on and booted. It may, but is not limited to, include: the server is powered on but not booted, the server is powered on and has been booted but the boot process is not completed, the server is powered on and the boot process has been completed, the server is restarted, etc. The component state of the server components may, but is not limited to, be used to indicate the configuration of the server components, etc. For example, whether the configured server components will generate heat under the current server state. The component temperature of the server components may, but is not limited to, be collected by temperature sensors deployed for the server components, and the ambient temperature of the server may, but is not limited to, be collected by temperature sensors deployed for the environment where the server is located.

[0077] The system state of the second operating system may, but is not limited to, be used to indicate the startup situation of the second operating system. For example, whether the second operating system has completed startup.

[0078] After the server is powered on and before normal operation, the server will stay in the S5 state for a period of time (i.e., the server is powered on but the boot operation has not been executed (such as the power-on button has not been triggered)) and the state during the boot process (i.e., the server is powered on and the boot operation has been executed (such as the power-on button has been triggered)); it takes a certain amount of time for the first controller to start and control the heat dissipation device (i.e., the startup time of the second operating system). Before the first controller starts up, the first operating system controls the operation of the heat dissipation device according to the server state, the component state of the server components, the component temperature of the server components, and the ambient temperature of the server, etc., realizing refined control of server heat dissipation.

[0079] In an optional example, the first operating system may, but is not limited to, stop controlling the operation of the heat dissipation device at a second time after a first time in the following manner: when it is detected that the system state is the state of having completed startup and the server has not completed booting, the first operating system determines that the second time has arrived; the first operating system stops controlling the operation of the heat dissipation device.

[0080] If the first operating system detects that the system state of the second operating system is the state of having completed startup and the server has not completed booting, it determines that the second time has been reached, and the first operating system stops controlling the operation of the heat dissipation device. The control right of heat dissipation is handed over to the second operating system.

[0081] In an optional example, the second operating system may, but is not limited to, control the operation of the heat dissipation device starting from the second time in the following manner: after startup is completed, the second operating system starts to control the operation of the heat dissipation device according to the server state, the component state of the server components, the component temperature of the server components, and the ambient temperature of the server.

[0082] The component temperature of the server components that the second operating system can obtain will be more than that of the server components that the first operating system can obtain, and heat dissipation can be performed more accurately in the stage where the second operating system controls the heat dissipation device than the first operating system.

[0083] In this embodiment, a method for operating a heat dissipation device on a server is also provided. Figure 3 It is a flowchart of the method for operating a heat dissipation device on a server according to an embodiment of the present application, as Figure 3 shown, the process includes the following steps:

[0084] Step S302, the heat dissipation device starts to operate from the target duration after the server is powered on, where the target duration is the startup duration of the first operating system, and the startup duration of the first operating system is less than the startup duration of the second operating system;

[0085] Step S304, the heat dissipation device operates according to the operating parameters output by the first controller, where the operating parameters output by the first controller are determined according to the server state of the server, the component state of the server components, and the temperature of the server.

[0086] Through the above steps, a dual operating system (i.e., the first operating system and the second operating system) is deployed on the first controller in the server. The heat dissipation device starts to operate from the target duration after the server is powered on, and the target duration is the startup duration of the first operating system. On the first controller, the startup duration of the first operating system is less than the startup duration of the second operating system, so that the heat dissipation device can operate as soon as possible after the server is powered on to dissipate the heat generated on the server at this time. The heat dissipation device operates according to the operating parameters output by the first controller, and the operating parameters are determined according to the server state of the server, the component state of the server components, and the temperature of the server, so that the heat dissipation device can operate more precisely and accurately to dissipate heat for the server. Therefore, the technical problem that the heat dissipation device has poor timeliness in dissipating heat for the server in the powered-on state can be solved, and the technical effect of improving the timeliness of the heat dissipation device in dissipating heat for the server in the powered-on state can be achieved.

[0087] In this embodiment, the server state can, but is not limited to, refer to the situation of the server being powered on and booted. It can, but is not limited to, include: the server is powered on but not booted, the server is powered on and has been booted but the boot process is not completed, the server is powered on and the boot process has been completed, the server is restarted, etc. The component state of server components can, but is not limited to, be used to indicate the configuration of server components, etc. For example, whether the configured server components will generate heat under the current server state. The component temperature of server components can, but is not limited to, be collected by temperature sensors deployed for server components, and the ambient temperature of the server can, but is not limited to, be collected by temperature sensors deployed for the environment where the server is located.

[0088] In this embodiment, the above target duration can, but is not limited to, refer to the duration between the power-on time of the server and the above first time. That is, the heat dissipation device can dissipate heat for the server in a timely manner when the first operating system completes startup after the server is powered on.

[0089] In an optional example, the operation of the heat dissipation device can be controlled according to the server state of the server, the component state of server components, the component temperature of server components, and the ambient temperature of the server in the following ways, but is not limited thereto: detecting the server state of the server; when the server state indicates that the server is powered on but not booted, controlling the operation of the heat dissipation device according to the component state of server components belonging to the first type, the component temperature of server components belonging to the first type, and the ambient temperature of the server, where server components belonging to the first type are server components that generate heat after the server is powered on; when the server state indicates that the server is in the boot process, controlling the operation of the heat dissipation device according to the component state of server components belonging to the first type, the component temperature of server components belonging to the second type, and the ambient temperature of the server, where server components belonging to the second type are server components that allow the operating system controlling the heat dissipation device to obtain the component temperature during the server boot process.

[0090] Among the server components that can be deployed on the server, some server components generate heat when the server is powered on but not booted. In this embodiment, such server components can, but are not limited to, be referred to as server components belonging to the first type. For example, server components that support the Network Controller – Sideband Interface (NCSI) function, including Open Compute Project (OCP) network cards, smart network cards, etc.

[0091] Different server components have different presence signals, and the operating system can detect the presence signals of different components to determine the configuration of server components on the server.

[0092] If the server status is different, different heat dissipation strategies can be used to control the heat dissipation device, but not limited to this. If the server is powered on but not turned on, the heat dissipation device can be controlled according to the configuration of server components that generate heat in this server status, the component temperature, and the ambient temperature. If the server is in the process of booting, the heat dissipation device can be controlled according to the configuration of server components that generate heat in the powered-on state, the component temperature, the component temperature of server components for which the operating system controlling the heat dissipation device can obtain the component temperature in this state, and the ambient temperature.

[0093] In an optional example, the operating system responsible for controlling the heat dissipation device on the first controller obtains the operating parameters of the heat dissipation device based on factors in each dimension and outputs them to the heat dissipation device. The heat dissipation device dissipates heat for the server according to the operating parameters output by the first controller. For example, when the server status indicates that the server is powered on but not turned on, the operating parameters output by the first controller are determined according to the component status of server components belonging to the first type, the component temperature of server components belonging to the first type, and the ambient temperature of the server, where the server components belonging to the first type are server components that generate heat after the server is powered on; when the server status indicates that the server is in the process of booting, the operating parameters output by the first controller are determined according to the component status of server components belonging to the first type, the component temperature of server components belonging to the second type, and the ambient temperature of the server, where the server components belonging to the second type are server components that allow the operating system controlling the heat dissipation device to obtain the component temperature during the server boot process.

[0094] Through the above steps, the heat dissipation device of the server can start running in time after the server is powered on, and the first controller can control the operating parameters of the heat dissipation device according to different statuses of the server combined with different reference factors, so that the resources consumed during the operation process of the heat dissipation device can match the status of the server, reducing resource waste, and improving the flexibility of heat dissipation device control while ensuring the timeliness of heat dissipation device operation.

[0095] In an optional example, a first heat dissipation curve and a first heat dissipation configuration are also configured on the first controller. The first heat dissipation curve is used to indicate a first conversion relationship between the ambient temperature of the server and the operating parameters of the heat dissipation device. The first heat dissipation configuration is used to indicate the parameter configuration in the operating parameter algorithm corresponding to the server components belonging to the first type. The operating parameter algorithm is used to calculate the operating parameters of the heat dissipation device based on the component temperature of the server components. The operation of the heat dissipation device can be controlled, but not limited to, in the following manner: detecting the component status of the server components belonging to the first type on the server; when the detected component status of the server components belonging to the first type is used to indicate that the server components belonging to the first type are configured on the server, calling the first heat dissipation curve to convert the ambient temperature of the server into the first operating parameter, and calling the first heat dissipation configuration to calculate the second operating parameter according to the component temperature of the server components belonging to the first type; determining the target operating parameter according to the first operating parameter and the second operating parameter; and controlling the operation of the heat dissipation device according to the target operating parameter.

[0096] Optionally, in this embodiment, the first heat dissipation curve can be, but not limited to, any curve form that conforms to the server heat dissipation law. For example: the first conversion relationship can be, but not limited to, including a linear relationship, then the first heat dissipation curve can be, but not limited to, a straight line, or a piecewise straight line. The first conversion relationship can be, but not limited to, including an exponential relationship, then the first heat dissipation curve can be, but not limited to, an exponential curve. The operating parameter algorithm can be, but not limited to, any function algorithm that conforms to the server heat dissipation law. For example: the Proportion Integration Differentiation (PID) control speed regulation algorithm.

[0097] In an optional example, from the perspective of the operation of the heat dissipation device, the operating parameters output by the first controller are determined according to the component status of the server components belonging to the first type, the component temperature of the server components belonging to the first type, and the ambient temperature of the server, including: when the component status of the server components belonging to the first type is used to indicate that the server components belonging to the first type are configured on the server, the operating parameters output by the first controller are the first operating parameter or the second operating parameter, where the ambient temperature of the server and the first operating parameter conform to the first heat dissipation curve, and the first heat dissipation curve is used to indicate the first conversion relationship between the ambient temperature of the server and the operating parameters of the heat dissipation device, and the second operating parameter is calculated according to the component temperature of the server components belonging to the first type.

[0098] In this embodiment, the conversion relationships indicated by the respective heat dissipation curves can be designed based on, but not limited to, the server configuration, the model of the heat dissipation device, and the operating performance of the heat dissipation device. For example: If the heat dissipation device is a fan, then the conversion relationships indicated by the respective heat dissipation curves can be designed based on, but not limited to, the server configuration, the model of the fan, and the PQ characteristic curve. The PQ characteristic curve is one of the key curves describing the performance of the cooling fan. Here, P represents the static pressure (Pressure) generated by the fan, and Q represents the air volume (Airflow) of the fan. The PQ characteristic curve shows the static pressure values that the fan can provide at different air volumes. Specifically, when the air volume increases, the static pressure of the fan usually decreases; conversely, when the air volume decreases, the static pressure of the fan increases. This relationship is represented by a downward-sloping curve on the PQ curve.

[0099] For example: As shown in Table 1, the conversion relationship between the ambient temperature and the fan speed duty cycle parameter is presented. This conversion relationship can be, but is not limited to, the curve PWM = k * Inlet + b, where PWM is the speed duty cycle, Inlet is the ambient temperature, and in a certain corresponding relationship, multiple straight lines can be spliced simultaneously. Under different states and different configurations, the air volume requirements of the heat dissipation components are different, and different logics can be achieved by adjusting the magnitudes of k and b; for example, in the S5 state (i.e., the state where the server is powered on but not started), when there is an intelligent network card in the configuration, the air volume requirement is greater than when there is an OCP network card, and the value of b can be increased correspondingly; when there is an intelligent network card in the configuration, during the boot process, each component is gradually powered on, and the air volume requirement is greater than that in the S5 state, and the values of both k and b can be adjusted simultaneously. When the temperature is lower than the minimum temperature value defined by the Inlet curve, the corresponding PWM takes the PWM corresponding to the defined minimum temperature; when the temperature is higher than the minimum value defined by the Inlet curve, the corresponding PMW takes the PWM corresponding to the defined maximum temperature. When multiple curves or algorithms are called simultaneously in a certain state and a certain configuration, the maximum fan speed output by parallel merging of multiple curves or algorithms can be given to the fan.

[0100] Table 1

[0101]

[0102] In an optional example, different server components of the first type correspond to different heat dissipation curves. At the same ambient temperature of the server, the higher the operating power consumption of the server components of the first type, the higher the generated heat, and the higher the heat dissipation performance of the heat dissipation device corresponding to the operating parameters on the corresponding heat dissipation curve, thus ensuring a better heat dissipation effect. For example: The server components of the first type include: multiple candidate server components, and the first heat dissipation curve includes multiple heat dissipation curves corresponding one by one to the multiple candidate server components. The higher the operating power consumption of the candidate server component, the higher the heat dissipation performance of the heat dissipation device corresponding to the operating parameters on the corresponding heat dissipation curve at the same ambient temperature of the server; The first heat dissipation curve can be called in the following ways, but not limited to, to convert the ambient temperature of the server into the first operating parameter: Determine the target server component configured on the server from the multiple candidate server components; Call the target heat dissipation curve corresponding to the target server component from the multiple heat dissipation curves to convert the ambient temperature of the server into the first operating parameter.

[0103] Optionally, in this embodiment, the multiple candidate server components can include, but are not limited to: components supporting the NCSI function (including OCP network cards, smart network cards, etc.), 54V power supply modules in AI models (a type of graphics processing unit GPU model), etc. Compared with the OCP network card, the smart network card has a slightly lower power consumption and relatively lower heat dissipation performance requirements, while the smart network card has a high power consumption and large heat dissipation performance requirements.

[0104] In an optional example, from the operation of the heat dissipation device, the server components of the first type include: multiple candidate server components, and the first heat dissipation curve includes multiple heat dissipation curves corresponding one by one to the multiple candidate server components. The higher the operating power consumption of the candidate server component, the higher the heat dissipation performance of the heat dissipation device corresponding to the operating parameters on the corresponding heat dissipation curve at the same ambient temperature of the server; The first operating parameter is the operating parameter of the target server component configured on the server on the corresponding heat dissipation curve among the multiple candidate server components.

[0105] In an optional example, multiple candidate server components may but are not limited to include: Open Compute Project network cards and smart network cards. The multiple heat dissipation curves include: a first curve corresponding to the Open Compute Project network card and a second curve corresponding to the smart network card. At the same ambient temperature of the server, the heat dissipation performance of the heat dissipation device corresponding to the operating parameters on the first curve is lower than that of the heat dissipation device corresponding to the operating parameters on the second curve. The target heat dissipation curve corresponding to the target server component can be called from the multiple heat dissipation curves to convert the ambient temperature of the server into the first operating parameter in the following ways but are not limited to this: when the Open Compute Project network card is configured on the server, the first curve is called from the multiple heat dissipation curves to convert the ambient temperature of the server into the first parameter, where the first operating parameter includes the first parameter; when the smart network card is configured on the server, the second curve is called from the multiple heat dissipation curves to convert the ambient temperature of the server into the second parameter, where the first operating parameter includes the second parameter.

[0106] Optionally, in this embodiment, the conversion relationship can be obtained by but is not limited to splicing multiple straight lines. When the temperature is between the minimum temperature and the maximum temperature, the heat dissipation curve based on the ambient temperature Inlet can adopt a linear relationship; when the temperature is lower than the minimum temperature value defined by the Inlet curve, the corresponding PWM takes the PWM corresponding to the defined minimum temperature; when the temperature is higher than the minimum value defined by the Inlet curve, the corresponding PMW takes the PWM corresponding to the defined maximum temperature.

[0107] In an optional example, from the perspective of the operation of the heat dissipation device, the server components belonging to the first type include: Open Compute Project network cards and / or smart network cards. The heat dissipation device includes: a fan. The operating parameters of the heat dissipation device include: the rotation speed duty cycle of the fan. The first heat dissipation curve includes: the first curve corresponding to the Open Compute Project network card and the second curve corresponding to the smart network card. When the Open Compute Project network card is configured on the server, the first curve includes: when the ambient temperature of the server is less than or equal to the first temperature, the rotation speed duty cycle is the first duty cycle; when the ambient temperature of the server is greater than or equal to the second temperature, the rotation speed duty cycle is the second duty cycle; when the ambient temperature of the server is greater than the first temperature and less than the second temperature, the rotation speed duty cycle is linearly related to the ambient temperature of the server between the first duty cycle and the second duty cycle. When the smart network card is configured on the server, the second curve includes: when the ambient temperature of the server is less than or equal to the first temperature, the rotation speed duty cycle is the third duty cycle; when the ambient temperature of the server is greater than or equal to the second temperature, the rotation speed duty cycle is the fourth duty cycle; when the ambient temperature of the server is greater than the first temperature and less than the second temperature, the rotation speed duty cycle is linearly related to the ambient temperature of the server between the third duty cycle and the fourth duty cycle. Among them, the third duty cycle is greater than the first duty cycle, and the fourth duty cycle is greater than the second duty cycle.

[0108] For example, taking the heat dissipation device including: a fan, the operating parameters of the heat dissipation device including: the rotation speed duty cycle PWM of the fan, and the ambient temperature of the server being Inlet as an example, the first heat dissipation curve includes: the first curve corresponding to the Open Compute Project network card and the second curve corresponding to the smart network card;

[0109] When the Open Compute Project network card is configured on the server, the first curve can be but is not limited to ;

[0110] When the smart network card is configured on the server, the second curve can be but is not limited to 。

[0111] Optionally, in this embodiment, when both the Open Compute Project network card and the smart network card are configured on the server, the first operating parameter is the operating parameter corresponding to the ambient temperature of the server on the second curve.

[0112] Take a 2U server as an example. When the server is in S5 state and there is an OCP network card in the configuration, it is evaluated that appropriate air volume is needed for heat dissipation. In the corresponding Inlet-2 curve (i.e. the first curve mentioned above), PWM=k2*Inlet+b2, k2=3, b2=-30, and the corresponding Inlet-2 correspondence (Inlet_Temp, PWM) is (20,30), (25,45), (30,60), (35,75); when Inlet≤20C, PWM=30, when Inlet≥ When the temperature is 35°C, PWM=75; when there is a smart network card in the configuration, it is evaluated that a higher air volume is required for heat dissipation. The corresponding Inlet-3 curve (that is, the second curve mentioned above) PWM=k3*Inlet+b3, k3=3, b3=-20, and the corresponding Inlet-3 correspondence (Inlet_Temp, PWM) is (20,40), (25,55), (30,70), (35,85); when Inlet≤20°C, PWM=40, and when Inlet≥35°C, PWM=85.

[0113] In an optional example, the first type of server component may include but is not limited to: multiple candidate server components, the first heat dissipation configuration may include but is not limited to multiple heat dissipation configurations corresponding to the multiple candidate server components; the first heat dissipation configuration may be called but is not limited to calculate the second operating parameter according to the component temperature of the server component belonging to the first type in the following manner: determining the target server component configured on the server from the multiple candidate server components; calling the target heat dissipation configuration corresponding to the target server component from the multiple heat dissipation configurations to calculate the second operating parameter according to the component temperature of the target server component.

[0114] In an optional example, the multiple candidate server components may include, but are not limited to: an open computing project network card and a smart network card, and the multiple cooling configurations include: a first configuration corresponding to the open computing project network card and a second configuration corresponding to the smart network card; the target cooling configuration corresponding to the target server component may be called from the multiple cooling configurations to calculate the second operating parameter according to the component temperature of the target server component in the following manner, but is not limited to: when the open computing project network card is configured on the server, the first configuration is called from the multiple cooling configurations to calculate the third parameter according to the component temperature of the open computing project network card, wherein the second operating parameter includes the third parameter; when the smart network card is configured on the server, the second configuration is called from the multiple cooling configurations to calculate the fourth parameter according to the component temperature of the smart network card, wherein the second operating parameter includes the fourth parameter.

[0115] In an optional example, the operating parameter algorithm is used to calculate the operating parameters of the heat dissipation device based on the component temperature of the server component at the sampling moment, the component temperature at the historical moment, and the operating parameters corresponding to the historical sampling moment; the first heat dissipation configuration can be called, but is not limited to, calculating the second operating parameter according to the component temperature of the server component belonging to the first type in the following manner: calling the first heat dissipation configuration and substituting it into the operating parameter algorithm to obtain the target operating parameter algorithm; obtaining the first component temperature of the server component belonging to the first type at the sampling moment, the second component temperature at the historical moment, and the historical operating parameters corresponding to the historical sampling moment, where the historical operating parameters are the operating parameters corresponding to the server component belonging to the first type calculated by the operating parameter algorithm at the historical sampling moment; substituting the first component temperature, the second component temperature, and the historical operating parameters into the target operating parameter algorithm to obtain the second operating parameter.

[0116] For the component temperature of the server component in the server, PID speed regulation can be used, but is not limited to it. In the PID calculation, the formula is PWM(k)=PWM(k - 1)+▽PWM; ▽PWM=Kp*[T(k)-T(k - 1)]+Ki(T(k)-Tsp)+Kd*[[T(k)-T(k - 1)]-[T(k - 1)-T(k - 2)]]. PWM(k) is the PWM at the kth moment, PWM(k - 1) is the virtual PWM calculated by the temperature sensor at the (k - 1)th moment (i.e., the historical operating parameters corresponding to the above historical sampling moment), Tsp is the set regulation point, that is, during operation, the highest temperature value that the component temperature is expected to reach, and T(k), T(k - 1), and T(k - 2) are the temperature values of the temperature sensor at the kth, (k - 1)th, and (k - 2)th moments respectively.

[0117] Among them, Kp*[T(k)-T(k - 1)] is the differential term, which represents the difference between the temperature at the kth moment and the temperature at the (k - 1)th moment. When the component temperature changes, this term can be used to respond quickly: when the component temperature rises, this term is positive, which can increase the corresponding fan speed; when the component temperature drops, this term is negative, which can decrease the corresponding fan speed; for components such as CPUs and GPUs, when the power consumption changes greatly, the temperature will also change greatly. Generally, a relatively large value of Kp (usually 6 - 12) is set in this term to increase the fan speed change brought by this term and avoid temperature overshoot.

[0118] Ki(T(k)-Tsp) is the integral term, which represents the difference between the temperature at the kth moment and the regulation point temperature: when the component temperature is higher than the regulation point, this term is positive, which can increase the corresponding fan speed; when the component temperature is lower than the regulation point, this term is negative, which can decrease the corresponding fan speed; the regulation point in this term determines the stable value of the temperature during the regulation process.

[0119] Kd*[[T(k)-T(k-1)]-[T(k-1)-T(k-2)]] is the differential term, representing the temperature difference at time k and the temperature difference at time k-1, which is the difference between these two.

[0120] When it comes to the OCP network card, set the regulation point Tsp of the OCP network card component temperature to 85°C, Kp = 6.0, Ki = 0.3, Kd = 0.1 (i.e., the above first configuration), and the corresponding optical module temperature Tsp is 62°C, Kp = 5.5, Ki = 0.2, Kd = 0.1; when it comes to the intelligent network card, set the regulation point Tsp of the intelligent network card component temperature to 90°C, Kp = 7.0, Ki = 0.3, Kd = 0.2 (i.e., the above second configuration), and the corresponding optical module temperature Tsp is 62°C, Kp = 5.0, Ki = 0.3, Kd = 0.1.

[0121] In an optional example, if there is no server component of the first type configured on the server, the cooling device can either not operate or operate with a relatively small air volume in the powered-on but not yet booted state (i.e., the S5 state) of the server. For example: after detecting the component state of the server component of the first type on the server, in the case where the detected component state of the server component of the first type indicates that there is no server component of the first type configured on the server, the cooling device does not operate. Or, a second cooling curve is also configured on the first controller, and the second cooling curve is used to indicate the second conversion relationship between the ambient temperature of the server and the operating parameters of the cooling device. The cooling performance of the cooling device corresponding to the operating parameters under the first conversion relationship for the same ambient temperature of the server is higher than that of the cooling device corresponding to the operating parameters under the second conversion relationship; after detecting the component state of the server component of the first type on the server, in the case where the detected component state of the server component of the first type indicates that there is no server component of the first type configured on the server, call the second cooling curve to convert the ambient temperature of the server into the third operating parameter; control the operation of the cooling device according to the third operating parameter.

[0122] In an optional example, from the perspective of the operation of the heat dissipation device, when the component state of the server component belonging to the first type is used to indicate that the server component belonging to the first type is not configured on the server, the operating parameter output by the first controller is the target parameter value; or, when the component state of the server component belonging to the first type is used to indicate that the server component belonging to the first type is not configured on the server, the operating parameter output by the first controller is the third operating parameter, where the ambient temperature of the server and the third operating parameter conform to the second heat dissipation curve, and the second heat dissipation curve is used to indicate the second conversion relationship between the ambient temperature of the server and the operating parameter of the heat dissipation device. The heat dissipation performance of the heat dissipation device corresponding to the operating parameter of the same server ambient temperature under the first conversion relationship is higher than that of the heat dissipation device corresponding to the operating parameter under the second conversion relationship.

[0123] Taking a 2U server as an example, when the server is in the S5 state and there are no components that need heat dissipation, such as OCP network cards and intelligent network cards, in the configuration, it is evaluated that there is no air volume requirement and the fan may not run. Then, in the Inlet-1 curve (i.e., the above-mentioned second heat dissipation curve) PWM = k1*Inlet + b1, k1 = 0, b1 = 0, and the corresponding Inlet-1 correspondence (Inlet_Temp, PWM) is (20, 0), (25, 0), (30, 0), (35, 0). Or, k1 = 0, b1 = 5, and the corresponding Inlet-1 correspondence (Inlet_Temp, PWM) is (20, 5), (25, 5), (30, 5), (35, 5). Or, k1 = 1, b1 = -20, and the corresponding Inlet-1 correspondence (Inlet_Temp, PWM) is (20, 0), (25, 5), (30, 10), (35, 15).

[0124] Taking the first controller as BMC, the first operating system as the RTOS real-time operating system, and the second operating system as Linux as an example, in order to make full use of the computing power resources of BMC, it deploys the RTOS real-time operating system. According to the BMC Linux / RTOS heterogeneous dual-system parallel technology, data exchange between multiple cores and multiple systems is realized. The ambient temperature and component temperature are collected through the PECI bus, and signal acquisition control at the millisecond level can be achieved. Subsequently, dynamic control of temperature and heat dissipation is realized through closed-loop feedback, so as to accurately control the heat dissipation resources to meet the minimum resources of the heat dissipation requirements and reduce the ineffective power consumption. For example: Figure 4 It is a schematic diagram of a server heat dissipation system controlled by an RTOS system according to an embodiment of the present application, as Figure 4As shown, the RTOS system collects the component temperature from the temperature sensors deployed on various hardware components such as the CPU deployed on the server, and collects the ambient temperature from the temperature sensors deployed in the server's cooling system. The fan speed of the fan deployed in the cooling system is adjusted according to the component temperature and the ambient temperature. At the same time, the RTOS system also has the function of regulating the performance of various hardware components.

[0125] In an optional example, when the first operating system controls the operation of the cooling device, if the second operating system is starting up and has the ability to collect temperature parameters during its startup process, then the parameters such as the ambient temperature and component temperature required by the first operating system can, but are not limited to, be collected by the second operating system and transmitted to the first operating system through inter-core communication. For example, in the case where the operating system controlling the cooling device is the first operating system, the ambient temperature of the server can be converted into a first operating parameter by calling a first cooling curve, and a second operating parameter can be calculated by calling a first cooling configuration according to the component temperature of the server components belonging to the first type in the following ways, but are not limited to: during the startup process of the second operating system, the second operating system collects the ambient temperature of the server and the component temperature of the server components belonging to the first type; the second operating system sends the collected ambient temperature of the server and the component temperature of the server components belonging to the first type to the first operating system; the first operating system calls the first cooling curve to convert the ambient temperature of the server into a first operating parameter, and the first operating system calls the first cooling configuration to calculate the second operating parameter according to the component temperature of the server components belonging to the first type.

[0126] In an optional example, the inter-core communication method can, but is not limited to, be a method combining shared memory and interrupt request. For example: A target storage space is also deployed on the server, and the target storage space allows the first operating system and the second operating system to access. The second operating system can send the collected ambient temperature of the server and the component temperature of the server components belonging to the first type to the first operating system in the following ways, but are not limited to: the second operating system writes the collected ambient temperature of the server and the component temperature of the server components belonging to the first type into the target storage space; the second operating system sends an interrupt request to the first operating system; the first operating system responds to the interrupt request and reads the ambient temperature of the server and the component temperature of the server components belonging to the first type from the target storage space.

[0127] Taking the first controller as BMC, the first operating system as the RTOS real-time operating system, and the second operating system as Linux as an example, Figure 5 is a schematic diagram of the architecture of a BMC according to an embodiment of the present application, as Figure 5As shown in the figure, RTOS and Linux are deployed in BMC, and the two communicate through shared memory combined with inter-core communication. BMC is connected to the flash memory (NOR Flash), interface controller (SD / EMMC), hard disk (DDR), out-of-band interface (MAC), central processing unit (CPU), fan (FAN), sensor (Sensor) and integrated south bridge (PCH) on the server.

[0128] Based on the real-time acquisition of sensor temperature data through the RTOS system, before the BMC Linux system is started, the RTOS collects and controls the system temperature; during the BMC Linux system startup phase, Linux collects sensor temperature information, and then passes it to the RTOS through shared memory, and the RTOS performs fan control; when the BMC Linux system is fully started, the Linux system collects sensor temperature and implements temperature control itself. At the same time, when the BMC Linux system fails or restarts, the RTOS can quickly take over the cooling system and accurately control the fan speed.

[0129] Among the three control firmwares of RTOS, BMC Linux and CPLD, BMC has the advantages of high control accuracy and high logic complexity, but BMC takes a long time to start up. When BMC has not started up, fan control cannot be achieved. Both RTOS and CPLD have the characteristics of fast startup, and can start up and control the fan in 3-5S. In addition, RTOS can also obtain the ambient temperature and the temperature of some important components. After obtaining the temperature, RTOS can perform refined control calculations and fan speed output according to these temperatures.

[0130] When the server is in the boot-up process, the heat dissipation device can also be controlled by combining the heat dissipation curve with the operating parameter algorithm. For example: A third heat dissipation curve, a fourth heat dissipation curve, and a second heat dissipation configuration are also configured on the first controller. The third heat dissipation curve is used to indicate the third conversion relationship between the ambient temperature of the server and the operating parameters of the heat dissipation device. The fourth heat dissipation curve is used to indicate the fourth conversion relationship between the ambient temperature of the server and the operating parameters of the heat dissipation device. The heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the third conversion relationship for the same ambient temperature of the server is higher than that of the heat dissipation device corresponding to the operating parameters under the fourth conversion relationship. The second heat dissipation configuration is used to indicate the parameter configuration in the operating parameter algorithm corresponding to the server components belonging to the second type; The operation of the heat dissipation device can be controlled, but not limited to, in the following ways according to the component status of the server components belonging to the first type, the component temperature of the server components belonging to the second type, and the ambient temperature of the server: Detect the component status of the server components belonging to the first type on the server; When it is detected that the component status is used to indicate that the first type of server components are configured on the server, convert the ambient temperature of the server into the fourth operating parameter, and call the second heat dissipation configuration to calculate the fifth operating parameter according to the component temperature of the server components belonging to the second type; Determine the reference operating parameter according to the fourth operating parameter and the fifth operating parameter; Control the operation of the heat dissipation device according to the reference operating parameter; When it is detected that the component status is used to indicate that the first type of server components are not configured on the server, call the fourth heat dissipation curve to convert the ambient temperature of the server into the sixth operating parameter, and call the second heat dissipation configuration to calculate the seventh operating parameter according to the component temperature of the second type of server components; Determine the device operating parameter according to the sixth operating parameter and the seventh operating parameter; Control the operation of the heat dissipation device according to the device operating parameter.

[0131] In an optional example, from the perspective of the operation of the heat dissipation device, when the component status of the server components belonging to the first type is used to indicate that the server is configured with server components belonging to the first type, the operating parameter output by the first controller is the fourth operating parameter or the fifth operating parameter. Among them, the ambient temperature of the server and the fourth operating parameter conform to the third heat dissipation curve, and the third heat dissipation curve is used to indicate the third conversion relationship between the ambient temperature of the server and the operating parameter of the heat dissipation device. The fifth operating parameter is calculated based on the component temperature of the server components belonging to the second type; when the component status of the server components belonging to the first type is used to indicate that the server is not configured with server components belonging to the first type, the operating parameter output by the first controller is the sixth operating parameter or the seventh operating parameter. Among them, the ambient temperature of the server and the sixth operating parameter conform to the fourth heat dissipation curve, and the fourth heat dissipation curve is used to indicate the fourth conversion relationship between the ambient temperature of the server and the operating parameter of the heat dissipation device. The seventh operating parameter is calculated based on the component temperature of the server components belonging to the second type. The heat dissipation performance of the heat dissipation device corresponding to the operating parameter under the third conversion relationship of the same server ambient temperature is higher than that of the heat dissipation device corresponding to the operating parameter under the fourth conversion relationship.

[0132] In an optional example, from the perspective of the operation of the heat dissipation device, the server components belonging to the first type include: Open Compute Project network cards and / or smart network cards. The heat dissipation device includes: fans. The operating parameters of the heat dissipation device include: the rotation speed duty cycle of the fans. The third heat dissipation curve includes: the first curve corresponding to the Open Compute Project network card and the second curve corresponding to the smart network card; the third heat dissipation curve includes: when the ambient temperature of the server is less than or equal to the first temperature, the rotation speed duty cycle is the fifth duty cycle, when the ambient temperature of the server is greater than or equal to the second temperature, the rotation speed duty cycle is the sixth duty cycle, and when the ambient temperature of the server is greater than the first temperature and less than the second temperature, the rotation speed duty cycle is linearly related to the ambient temperature of the server between the fifth duty cycle and the sixth duty cycle; the fourth heat dissipation curve includes: when the ambient temperature of the server is less than or equal to the first temperature, the rotation speed duty cycle is the seventh duty cycle, when the ambient temperature of the server is greater than or equal to the second temperature, the rotation speed duty cycle is the eighth duty cycle, and when the ambient temperature of the server is greater than the first temperature and less than the second temperature, the rotation speed duty cycle is linearly related to the ambient temperature of the server between the seventh duty cycle and the eighth duty cycle; among them, the fifth duty cycle is greater than the seventh duty cycle, and the sixth duty cycle is greater than the eighth duty cycle.

[0133] For example, server components belonging to the first type include: Open Compute Project network cards and / or smart network cards, the cooling device includes: a fan, the operating parameter of the cooling device includes: the duty cycle PWM of the fan speed, the ambient temperature of the server is Inlet, and the third cooling curve includes: the first curve corresponding to the Open Compute Project network card and the second curve corresponding to the smart network card;

[0134] The third cooling curve can be but is not limited to being ;

[0135] The fourth cooling curve can be but is not limited to being .

[0136] Taking a 2U server as an example, when the server is in the boot process and there is no smart network card or OCP network card in the configuration, it is evaluated that a slightly lower air volume is required for heat dissipation. For the Inlet-4 curve (i.e., the above-mentioned fourth cooling curve) PWM = k4*Inlet + b4, k4 = 3, b4 = -25, and the corresponding Inlet-4 correspondence (Inlet_Temp, PWM) is (20, 35), (25, 50), (30, 65), (35, 80); when Inlet ≤ 20°C, PWM = 35, when Inlet ≥ 35°C, PWM = 80; when there is a smart network card in the configuration, it is evaluated that a higher air volume is required for heat dissipation. For the Inlet-5 curve (i.e., the above-mentioned third cooling curve) PWM = k5*Inlet + b5, k5 = 3, b5 = -15, and the corresponding Inlet-5 correspondence (Inlet_Temp, PWM) is (20, 45), (25, 60), (30, 75), (35, 90); when Inlet ≤ 20°C, PWM = 45, when Inlet ≥ 35°C, PWM = 90.

[0137] Taking the OCP network card and smart network card, which belong to the first type of server components, as examples, the startup time of the first operating system is about 3 - 5 seconds. When components that need to dissipate heat in the S5 state, such as OCP network cards and smart network cards, are not installed in the server configuration, when the server is powered on, the server enters the S5 state, and the fan does not rotate. When the ambient temperature of the server is increased or decreased, the fan speed does not change and remains at 0 speed. When the ambient temperature is maintained at 25°C, when the power button is pressed, the fan speed duty cycle increases to 50%. When the ambient temperature of the server is increased, the fan speed correspondingly increases. It can be found that the corresponding relationship between the ambient temperature and the fan speed generally shows a linear relationship, and at the same ambient temperature, the fan speed duty cycle during the startup process is higher than that in the S5 state. When the ambient temperature rises above 35°C and then continues to rise, the fan speed no longer increases. When the ambient temperature drops below 20°C and then continues to drop, the fan speed duty cycle no longer decreases. About 1.5 - 3 minutes after the power button is pressed, the BIOS Post is completed, and the temperatures of components such as the CPU can be successively read in the web BMC. The speed during the startup process fails, and the fan speed decreases.

[0138] When the OCP network card is installed in the server configuration and the smart network card is not installed, when the server is powered on, the server enters the S5 state, and the fan starts to rotate about 3 - 5 seconds after power-on. When the ambient temperature is maintained at 25°C, the fan speed duty cycle is 45%. When the ambient temperature of the server is increased, the fan speed correspondingly increases. It can be found that the corresponding relationship between the ambient temperature and the fan speed generally shows a linear relationship. When the ambient temperature rises above 35°C and then continues to rise, the fan speed no longer increases. When the ambient temperature drops below 20°C and then continues to drop, the fan speed duty cycle no longer decreases. When the ambient temperature is maintained at 25°C, when the power button is pressed (the subsequent state description is the same as the startup process phenomenon without an OCP network card), the fan speed duty cycle increases to 50%. When the ambient temperature of the server is increased, the fan speed correspondingly increases. It can be found that the corresponding relationship between the ambient temperature and the fan speed generally shows a linear relationship, and at the same ambient temperature, the fan speed duty cycle during the startup process is higher than that in the S5 state. When the ambient temperature rises above 35°C and then continues to rise, the fan speed no longer increases. When the ambient temperature drops below 20°C and then continues to drop, the fan speed duty cycle no longer decreases. About 1.5 - 3 minutes after the power button is pressed, the BIOS Post is completed, and the temperatures of components such as the CPU can be successively read in the web BMC. The speed during the startup process fails, and the fan speed decreases.

[0139] When installing a smart network card when the OCP network card is not installed in the server, power on the server. The server enters the S5 state. The fan starts running about 3 - 5 seconds after power on. When the ambient temperature is maintained at 25°C, the fan speed duty cycle is 55%. When the ambient temperature of the server is increased, the fan speed correspondingly increases. It can be found that the corresponding relationship between the ambient temperature and the fan speed generally shows a linear relationship. And at the same ambient temperature, the fan speed duty cycle in the S5 state with a smart network card is higher than that in the S5 state with an OCP network card. When the ambient temperature rises above 35°C and then continues to rise, the fan speed no longer increases. When the ambient temperature drops below 20°C and then continues to drop, the fan speed duty cycle no longer decreases. When the ambient temperature is maintained at 25°C, when the power-on button is pressed, the fan speed duty cycle increases to 60%. When the ambient temperature of the server is increased, the fan speed correspondingly increases. It can be found that the corresponding relationship between the ambient temperature and the fan speed generally shows a linear relationship. And at the same ambient temperature, the fan speed during the power-on process is higher than that in the S5 state. When the ambient temperature rises above 35°C and then continues to rise, the fan speed no longer increases. When the ambient temperature drops below 20°C and then continues to drop, the fan speed duty cycle no longer decreases. About 1.5 - 3 minutes after pressing the power-on button, the BIOS Post is completed, and the temperatures of components such as the CPU can be successively read in the web BMC. The rotation speed during the power-on process fails, and the fan speed decreases.

[0140] When both an OCP network card and a smart network card are installed in the configuration (the subsequent status description is the same as the phenomenon of installing a smart network card in the server), power on the server. The server enters the S5 state, and the fan starts to run about 3 - 5 seconds after power on. When the ambient temperature is maintained at 25°C, the fan speed duty cycle is 55%. When the ambient temperature of the server is increased, the fan speed correspondingly increases. It can be found that the corresponding relationship between the ambient temperature and the fan speed generally shows a linear relationship. And at the same ambient temperature, the fan speed duty cycle in the S5 state with a smart network card is higher than that in the S5 state with an OCP network card. When the ambient temperature rises above 35°C and then continues to rise, the fan speed no longer increases. When the ambient temperature drops below 20°C and then continues to drop, the fan speed duty cycle no longer decreases. When the ambient temperature is maintained at 25°C, when the power-on button is pressed, the fan speed duty cycle increases to 60%. When the ambient temperature of the server is increased, the fan speed correspondingly increases. It can be found that the corresponding relationship between the ambient temperature and the fan speed generally shows a linear relationship. And at the same ambient temperature, the fan speed duty cycle during the power-on process is higher than that in the S5 state. When the ambient temperature rises above 35°C and then continues to rise, the fan speed no longer increases. When the ambient temperature drops below 20°C and then continues to drop, the fan speed duty cycle no longer decreases. About 1.5 - 3 minutes after pressing the power-on button, the BIOS Post is completed, and the temperatures of components such as the CPU can be successively read in the web BMC. The rotation speed during the power-on process fails, and the fan speed decreases.

[0141] It can be seen that the RTOS can quickly control the fan, and the control is more precise, greatly reducing the time required for power-on and reducing the heat dissipation risk, system power consumption, and fan noise during the power-on process.

[0142] In an optional example, when the first operating system controls the heat dissipation device, the operating parameters of the scattering device can, but are not limited to, gradually rising to the operating parameters corresponding to the current temperature parameters, thereby reducing the noise generated by the heat dissipation device after the server is powered on. For example: The first operating system can control the operation of the heat dissipation device starting from the first time after the start time of the first controller in the following ways, but not limited to: The first operating system determines the heat dissipation operation parameters starting from the first time; The first operating system controls the operating parameters of the heat dissipation device to rise to the heat dissipation operation parameters at the third time, where there is a time interval between the third time and the first time.

[0143] The way that the operating parameters rise to the heat dissipation operation parameters at the third time can, but is not limited to, be a smooth linear rise, or can, but is not limited to, be a smooth stepped rise.

[0144] In an alternative example, the operating parameters of the heat dissipation device can be, but are not limited to, increased to the heat dissipation operating parameters at the third time by the following method: The first operating system uses the operating parameters as the starting value as the initial current operating parameter, and repeats the following steps until the operating parameters of the heat dissipation device are the heat dissipation operating parameters: Calculate the difference between the heat dissipation operating parameters and the current operating parameter; In the case where the difference is greater than or equal to the step operating parameter, send the next current operating parameter to the heat dissipation device after the target time period, where the next current operating parameter is the sum of the current operating parameter and the step operating parameter; In the case where the difference is less than the step operating parameter, send the heat dissipation operating parameter to the heat dissipation device after the target time period.

[0145] Optionally, in this embodiment, the above starting value can be, but is not limited to, 0, or can also be a relatively small value, such as: a value less than 5, a value less than 10, etc. The step operating parameter can be determined according to specific circumstances, for example: the step operating parameter can be, but is not limited to, 5.

[0146] In an alternative example, from the perspective of the operation of the heat dissipation device, the heat dissipation device can be, but is not limited to, operated according to the operating parameters output by the first controller in the following way: The heat dissipation device operates according to the operating parameters output by the first operating system in the first stage, where the first stage is the stage from when the first operating system has completed startup to when the second operating system has completed startup; The heat dissipation device operates according to the operating parameters output by the second operating system in the second stage, where the second stage is the stage after the second operating system has completed startup until the server has completed booting.

[0147] In an alternative example, from the perspective of the operation of the heat dissipation device, the heat dissipation device can be, but is not limited to, operated according to the operating parameters output by the first operating system in the first stage in the following way: The operating parameters of the heat dissipation device rise to the heat dissipation operating parameters determined by the first operating system at the reference time after starting to operate, where there is a time interval between the reference time and the first time.

[0148] In an alternative example, from the perspective of the operation of the heat dissipation device, after the first time, the operating parameters of the heat dissipation device start from the starting value and rise from the current operating parameter to the next current operating parameter every target time period until they rise to the heat dissipation operating parameters; where, in the case where the difference between the heat dissipation operating parameters and the current operating parameter is greater than or equal to the step operating parameter, the rising amount of the operating parameter is the step operating parameter; in the case where the difference between the heat dissipation operating parameters and the current operating parameter is less than the step operating parameter, the rising amount of the operating parameter is the difference between the heat dissipation operating parameters and the current operating parameter.

[0149] Taking the first operating system as RTOS and the heat dissipation device as a fan as an example, after AC power-on, the fan speed starts to be calculated smoothly from 0 duty, increasing by 5% duty every 10 seconds. This speed is called the "smooth speed"; the "target speed" controlled by RTOS refers to the speed value calculated using the corresponding Inlet curve in the current scenario. When the target speed - smooth speed ≥ 5%, it is output according to the smooth speed. When the target speed - smooth speed < 5%, it continues at the current smooth speed for another 10 seconds, and then the output is directly adjusted according to the fan speed corresponding to the inlet. If the BMC takes over the fan control right during the RTOS smoothing process, the BMC no longer performs the smoothing mechanism and directly outputs the current target speed.

[0150] In an optional example, a second controller is also deployed on the server. The second controller can monitor the startup situation of the first controller, so as to take over the control right of the heat dissipation device in a timely manner, ensuring that even if the first controller fails to start successfully, the heat dissipation device can still dissipate heat from the server. For example: when the server is powered on, the second controller starts; the second controller monitors the startup result of the first controller; in the case where the startup result indicates that the first controller fails to start, the second controller identifies the server state of the server; in the case where the identified server state is powered on but not booted, the second controller detects the component state of the server components belonging to the first type on the server, where the server components belonging to the first type are the server components that generate heat after the server is powered on; in the case where the detected component state indicates that the server is configured with the server components of the first type, the second controller controls the heat dissipation device to operate according to the eighth operating parameter; in the case where the detected component state indicates that the server is not configured with the server components of the first type, the second controller controls the heat dissipation device to operate according to the ninth operating parameter, where the heat dissipation performance of the heat dissipation device corresponding to the same server at the eighth operating parameter is higher than that at the ninth operating parameter.

[0151] In this embodiment, the second controller may include, but is not limited to, a Complex Programmable Logic Device (CPLD for short).

[0152] In an optional example, from the perspective of the operation of the heat dissipation device, if a second controller is also deployed on the server, when the server is powered on but not started and the first controller fails to start, the heat dissipation device starts running after the second controller starts; when server components of the first type are configured on the server, the heat dissipation device operates according to first preset parameters, where the server components of the first type are server components that generate heat after the server is powered on; when server components of the first type are not configured on the server, the heat dissipation device operates according to second preset parameters, where the heat dissipation performance of the heat dissipation device corresponding to the first preset parameters is higher than that of the heat dissipation device corresponding to the second preset parameters.

[0153] In an optional example, the second controller can also control the heat dissipation device differently according to whether server components of the first type are configured on the server. For example: after the second controller identifies the operating state of the server, when the identified operating state is the state of being in the startup phase, the second controller detects the component state of the server components of the first type on the server; when the detected component state indicates that server components of the first type are configured on the server, the second controller controls the heat dissipation device to operate according to tenth operating parameters; when the detected component state indicates that server components of the first type are not configured on the server, the second controller controls the heat dissipation device to operate according to eleventh operating parameters, where the heat dissipation performance of the heat dissipation device corresponding to the same server's ambient temperature under the tenth operating parameters is higher than that under the eleventh operating parameters.

[0154] In an optional example, from the perspective of the operation of the heat dissipation device, when the first controller fails to start, the server is in the startup phase state, and server components of the first type are configured on the server, the heat dissipation device operates according to third preset parameters; when the first controller fails to start, the server is in the startup phase state, and server components of the first type are not configured on the server, the heat dissipation device operates according to fourth preset parameters, where the heat dissipation performance of the heat dissipation device corresponding to the third preset parameters is higher than that of the heat dissipation device corresponding to the fourth preset parameters.

[0155] In an optional example, the first controller is connected to the heat dissipation device through the second controller, and the second controller can be used to control the transmission of operating parameters. For example: the second controller checks whether the heartbeat of the first operating system is normal; when it is detected that the heartbeat of the first operating system is abnormal, it checks whether the heartbeat of the second operating system is normal; when it is detected that the heartbeat of the second operating system is abnormal, it determines that the startup of the first controller fails; when it is detected that the heartbeat of the first operating system is normal, it determines that the startup of the first controller is successful; when the startup result is used to indicate that the startup of the first controller fails, the second controller discards the operating parameters sent by the first controller that it receives and identifies the operating state of the server; after the second controller monitors the startup result of the first controller, when the startup result is used to indicate that the startup of the first controller is successful, the second controller sends the operating parameters sent by the first controller that it receives to the heat dissipation device.

[0156] Taking the OCP network card and intelligent network card, which belong to the first type of server components, as an example, the startup duration of the second controller is about 3 - 5 seconds. When the BMC chip is removed, there is no BMC in the server to control the fan; when components that need heat dissipation in the S5 state, such as the OCP network card and intelligent network card, are not installed in the server configuration, when the server is powered on, the server enters the S5 state and the fan does not rotate. When the ambient temperature of the server is increased or decreased, the fan speed does not change and remains at 0 speed. When the ambient temperature is maintained at 25°C, when the power-on button is pressed, the fan speed duty cycle increases to 50% duty. When the ambient temperature of the server is increased or decreased, the fan speed does not change. The fan speed duty cycle during the startup process is higher than that in the S5 state. About 5 minutes after the power-on button is pressed, the fan speed is increased to about 80% duty.

[0157] When the BMC chip is removed, there is no BMC in the server to control the fan; when the OCP network card is installed in the server configuration and the intelligent network card is not installed, when the server is powered on, the server enters the S5 state and the fan starts to rotate about 3 - 5 seconds after power-on. When the ambient temperature is maintained at 25°C, the fan speed duty cycle is 45% duty. When the ambient temperature of the server is increased or decreased, the fan speed does not change and always remains at 45% duty speed. When the ambient temperature is maintained at 25°C, when the power-on button is pressed (the subsequent state description is the same as the startup process phenomenon without the OCP network card in point 5), the fan speed duty cycle increases to 50% duty. When the ambient temperature of the server is increased or decreased, the fan speed does not change. The fan speed duty cycle during the startup process is higher than that in the S5 state. About 5 minutes after the power-on button is pressed, the fan speed is increased to about 80% duty.

[0158] When the BMC chip is removed, there is no BMC in the server to control the fan; when the OCP network card is not installed in the server configuration and the intelligent network card is installed, the server is powered on, and the server enters the S5 state. The fan starts running about 3 - 5 seconds after power-on. When the ambient temperature is maintained at 25°C, the fan speed duty cycle is 55%. When the ambient temperature of the server is increased or decreased, the fan speed does not change and always maintains a speed of 55% duty cycle. When the ambient temperature is maintained at 25°C, when the power button is pressed, the fan speed duty cycle increases to 60%. When the ambient temperature of the server is increased or decreased, the fan speed does not change. The fan speed duty cycle during the power-on process is higher than that in the S5 state. About 5 minutes after the power button is pressed, the fan speed is increased to approximately 80% duty cycle.

[0159] When the BMC chip is removed, there is no BMC in the server to control the fan; when both the OCP network card and the intelligent network card are installed in the server configuration (the subsequent state description is the same as the power-on process phenomenon when the OCP network card is not installed and the intelligent network card is installed in point 7), the server is powered on, and the server enters the S5 state. The fan starts running about 3 - 5 seconds after power-on. When the ambient temperature is maintained at 25°C, the fan speed duty cycle is 55%. When the ambient temperature of the server is increased or decreased, the fan speed does not change and always maintains a speed of 55% duty cycle. When the ambient temperature is maintained at 25°C, when the power button is pressed, the fan speed duty cycle increases to 60%. When the ambient temperature of the server is increased or decreased, the fan speed does not change. The fan speed duty cycle during the power-on process is higher than that in the S5 state. About 5 minutes after the power button is pressed, the fan speed is increased to approximately 80% duty cycle.

[0160] In an alternative embodiment, taking the first controller as the BMC, the first operating system as RTOS, the second operating system as Linux (representing the BMC), the second controller as CPLD, and the heat dissipation device as the fan as an example, the control and operation of the heat dissipation device of the server in different states are as follows:

[0161] Figure 6 It is a schematic diagram of the control and operation of a heat dissipation device according to an embodiment of the present application, as Figure 6As shown in the figure, after the server is powered on, if the RTOS starts successfully, the RTOS controls the fan and monitors whether the BMC has completed startup. If the RTOS fails to start successfully, the CPLD controls the fan and monitors whether the BMC has completed startup. If the BMC has completed startup, the BMC Linux controls the fan. During the process where the CPLD controls the fan and monitors whether the BMC has completed startup, if the RTOS starts successfully, the CPLD transfers the control right of the fan to the RTOS, and the RTOS controls the fan.

[0162] The specific fan control process includes: Figure 7 It is a schematic diagram of the RTOS control and operation status of a heat dissipation device according to an embodiment of the present application. As Figure 7 shown, after the server is powered on, the RTOS and CPLD start first, and the CPLD checks whether the heartbeat of the RTOS is normal. The RTOS controls the fan prior to the CPLD. When the RTOS starts successfully, its corresponding heartbeat signal starts. After the CPLD receives the heartbeat signal transmitted by the RTOS and for a period of time or more, it can be determined that the RTOS has started successfully, and the CPLD does not receive the fan control right. If the RTOS starts successfully and successfully takes over the fan control right, at this time, the RTOS conducts the main control of the fan. The RTOS differentiates and adjusts the speed according to the server state, configuration (i.e., component state), ambient temperature that can be obtained, and component temperature of the current server. When the RTOS recognizes that the server is in the S5 state based on the state, it further discriminates the configuration. By determining whether there are components such as OCP network cards and intelligent network cards in the configuration, and by obtaining the ambient temperature, different ambient temperature curves are called respectively. Moreover, the RTOS can obtain the component temperature (such as OCP network card temperature) of some components through I2C. After obtaining the temperature, fine-grained fan control can be performed according to PID. When the RTOS recognizes that the server is in the startup process based on the state, it further discriminates the configuration. By determining whether there are components such as intelligent network cards in the configuration, and by obtaining the ambient temperature, different ambient temperature curves are called respectively. Compared with the S5 state, the RTOS can obtain the core temperature of more components (such as CPU temperature, memory temperature, PCH temperature, etc.) during the startup process. After obtaining the temperature, fine-grained fan control can be performed according to PID.

[0163] For example: when the RTOS recognizes that the server is in the S5 state according to the status: when there are no components that need heat dissipation in the S5 state, such as OCP network cards and intelligent network cards, in the configuration, the RTOS calls the Inlet-1 curve to perform linear speed regulation using the ambient temperature; when there is an OCP network card in the configuration, the RTOS calls the Inlet-2 curve to perform linear speed regulation using the ambient temperature, and at the same time performs PID speed regulation according to the OCP network card temperature obtained through I2C; when there is an intelligent network card in the configuration, the RTOS calls the Inlet-3 curve to perform linear speed regulation using the ambient temperature; when the RTOS recognizes that the server is in the startup process according to the status: when there is no intelligent network card in the configuration, the RTOS calls the Inlet-4 curve to perform linear speed regulation using the ambient temperature, and at the same time, after the temperatures of components such as the CPU and memory can be obtained, PID speed regulation is synchronized; when there is an intelligent network card in the configuration, the RTOS calls the Inlet-5 curve to perform linear speed regulation using the ambient temperature, and at the same time, after the temperatures of components such as the CPU and memory can be obtained, PID speed regulation is synchronized.

[0164] Figure 8 It is a schematic diagram of the BMC control and operation of a heat dissipation device according to an embodiment of the present application. As Figure 8 shown, the RTOS performs fan control and synchronously checks the BMC status. After the BMC starts up, the heartbeat signal corresponding to the BMC starts and lasts for more than a certain period of time. When the RTOS recognizes that the BMC heartbeat is normal, the RTOS hands over the fan control right to the BMC, and the BMC performs differentiated speed regulation according to the server state, configuration (i.e., component state), ambient temperature, and component temperature that the current server is in. When the BMC recognizes that the server is in the S5 state, it further discriminates the configuration. By judging whether there are components such as OCP network cards and intelligent network cards in the configuration, and using the obtained ambient temperature, different ambient temperature curves are called respectively. And compared with the RTOS, the BMC supports obtaining the core temperatures of more components (such as OCP network card temperature, intelligent network card temperature, etc.). After the temperature is obtained, fine-grained fan control can be performed according to PID. When the BMC recognizes that the server is in the startup process according to the status, it further discriminates the configuration. By judging whether there are components such as intelligent network cards in the configuration, and using the obtained ambient temperature, different ambient temperature curves are called respectively. And compared with the S5 state, the BMC can obtain the core temperatures of more components (such as CPU temperature, memory temperature, PCH temperature, PCIe card temperature, etc.) during the startup process. After the temperature is obtained, fine-grained fan control can be performed according to PID.

[0165] For example: When the BMC recognizes that the server is in the S5 state based on the status: When there are no components that need to dissipate heat in the S5 state, such as OCP network cards and intelligent network cards, in the configuration, the BMC calls the Inlet-1 curve to perform linear speed regulation using the ambient temperature; when there is an OCP network card in the configuration, the BMC calls the Inlet-2 curve to perform linear speed regulation using the ambient temperature, and at the same time performs PID speed regulation based on the OCP network card temperature obtained through I2C; when there is an intelligent network card in the configuration, the BMC calls the Inlet-3 curve to perform linear speed regulation using the ambient temperature, and at the same time performs PID speed regulation based on the intelligent network card temperature obtained through I2C; When the BMC recognizes that the server is in the boot process based on the status: When there is no intelligent network card in the configuration, the BMC calls the Inlet-4 curve to perform linear speed regulation using the ambient temperature, and at the same time, after the temperatures of components such as the CPU, memory, and PCIe network card can be obtained, PID speed regulation is synchronized; when there is an intelligent network card in the configuration, the BMC calls the Inlet-5 curve to perform linear speed regulation using the ambient temperature, and at the same time, after the temperatures of components such as the CPU, memory, and PCIe network card can be obtained, PID speed regulation is synchronized.

[0166] Figure 9 It is a schematic diagram of the CPLD control and operation of a heat dissipation device according to an embodiment of the present application, as Figure 9 shown. Second, after the server is powered on, RTOS and CPLD start first, and the CPLD will check whether the heartbeat of RTOS is normal. If the CPLD still cannot detect the RTOS heartbeat within a certain period of time after power-on, the CPLD determines that the RTOS startup fails, and then the CPLD controls the fan prior to RTOS and BMC. The CPLD performs differentiated speed regulation according to the current state and configuration of the server. When the CPLD recognizes that the server is in the S5 state based on the status, further configuration discrimination is performed. By judging whether there are components such as OCP network cards and intelligent network cards in the configuration, different fixed speed values are called respectively. When the CPLD recognizes that the server is in the boot process based on the status, further configuration discrimination is performed. By judging whether there are components such as intelligent network cards in the configuration, different fixed speed values are called respectively.

[0167] For example: when the CPLD recognizes that the server is in the S5 state based on the status: when there are no components such as OCP network cards and intelligent network cards that require heat dissipation in the S5 state in the configuration, the CPLD controls not to power on the fan, and the fan speed is 0; ② when there is an OCP network card in the configuration, the CPLD outputs at a fixed speed of 115 PWM; when there is an intelligent network card in the configuration, the CPLD outputs at a fixed speed of 140 PWM; when the BMC recognizes that the server is in the boot process based on the status: when there is no intelligent network card in the configuration, the CPLD outputs at a fixed speed of 128 PWM; when there is an intelligent network card in the configuration, the CPLD outputs at a fixed speed of 153 PWM.

[0168] The CPLD performs fan control and simultaneously checks the status of the BMC. When the BMC finishes starting up, the heartbeat signal corresponding to the BMC starts. When the CPLD recognizes that the BMC heartbeat is normal and lasts for more than a certain period of time, the CPLD hands over the fan control right to the BMC, and the BMC performs differentiated speed regulation according to the current state of the server, the configuration, and the component temperatures that can be obtained.

[0169] The CPLD performs fan control. When it checks that the BMC still has no heartbeat, it further checks the heartbeat of the RTOS. If it detects that the RTOS heartbeat is normal and lasts for more than a certain period of time, the CPLD hands over the fan control right to the RTOS, and the RTOS performs differentiated speed regulation according to the current state of the server, the configuration, and the component temperatures that can be obtained.

[0170] The CPLD performs fan control. When it checks that the BMC still has no heartbeat and the RTOS has no heartbeat, the CPLD continues to maintain fan control.

[0171] In summary, when the BMC performs fan control, it can obtain more component temperatures, the control logic is more complex, and the fan regulation is more refined. However, the BMC startup time is longer and it cannot start up and perform fan control in a short period of time; the RTOS can start up and perform fan control in a short period of time, and it can obtain the ambient temperature and the temperatures of some core components, and can achieve partial refined speed regulation; the CPLD can start up and monitor the BMC startup result and take over fan control in a short period of time. Through the coordinated action of the RTOS, CPLD, and BMC, it can not only ensure the fast and stable startup of the server, but also ensure the most refined fan control of the server at different stages, ensure that each component does not overheat and operates with high performance, and also ensure the reduction of system noise and fan power consumption.

[0172] Through the description of the above embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by means of software plus a necessary general hardware platform. Of course, it can also be implemented by hardware, but in many cases, the former is a better implementation method. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes several instructions to enable a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in various embodiments of the present application.

[0173] In this embodiment, a control device for a heat dissipation device on a server is further provided. The server includes: server components, a first controller, and a heat dissipation device. The first controller deploys a first operating system and a second operating system. This device is used to implement the above embodiments and preferred implementation methods, and those that have been described will not be repeated. As used below, the term "module" can be a combination of software and / or hardware that can achieve a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, implementation in hardware, or a combination of software and hardware is also possible and contemplated.

[0174] Figure 10 is a structural block diagram of a control device for a heat dissipation device on a server according to an embodiment of the present application. As Figure 10 shown, the device includes:

[0175] A first operation module 1002, configured to make the heat dissipation device start running at a target duration after the server is powered on, where the target duration is the startup duration of the first operating system, and the startup duration of the first operating system is less than the startup duration of the second operating system;

[0176] A second operation module 1004, configured to make the heat dissipation device run according to the operation parameters output by the first controller, where the operation parameters output by the first controller are determined according to the server state of the server, the component state of the server components, and the temperature of the server.

[0177] The control device for the heat dissipation device on the server is further configured to execute the steps in any of the above method embodiments.

[0178] It should be noted that the above-mentioned modules can be implemented by software or hardware. For the latter, it can be implemented in the following ways, but not limited to this: the above-mentioned modules are all located in the same processor; or, the above-mentioned modules are respectively located in different processors in any combination form.

[0179] Embodiments of the present application further provide a computer-readable storage medium storing a computer program, where the computer program is configured to execute the steps in any of the above method embodiments when running.

[0180] In an exemplary embodiment, the above computer-readable storage medium may include, but is not limited to, various media capable of storing a computer program, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disc.

[0181] Embodiments of the present application further provide an electronic device, including a memory and a processor, where the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in any of the above method embodiments.

[0182] In an exemplary embodiment, the above electronic device may further include a transmission device and an input / output device, where the transmission device is connected to the above processor, and the input / output device is connected to the above processor.

[0183] Embodiments of the present application further provide a computer program product, where the computer program product includes a computer program, and the computer program implements the steps in any of the above method embodiments when executed by a processor.

[0184] Embodiments of the present application further provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program, and the computer program implements the steps in any of the above method embodiments when executed by a processor.

[0185] Embodiments of the present application further provide a computer program, where the computer program includes computer instructions stored in a computer-readable storage medium; a processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, causing the computer device to execute the steps in any of the above method embodiments.

[0186] Specific examples in this embodiment may refer to the examples described in the above embodiments and exemplary embodiments, and will not be repeated here.

[0187] Obviously, those skilled in the art should understand that the above-mentioned modules or steps of the present application can be implemented by a general-purpose computing device. They can be concentrated on a single computing device or distributed on a network composed of multiple computing devices. They can be implemented by program codes executable by the computing device. Thus, they can be stored in a storage device and executed by the computing device. And in some cases, the steps shown or described can be executed in a sequence different from that here, or they can be separately fabricated into individual integrated circuit modules, or multiple modules or steps among them can be fabricated into a single integrated circuit module for implementation. In this way, the present application is not limited to any specific combination of hardware and software.

[0188] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the principle of the present application shall be included within the protection scope of the present application.

Claims

1. A method for operating a heat dissipation device on a server, characterized in that: The server includes: server components, a first controller, and a heat dissipation device. A first operating system and a second operating system are deployed on the first controller. The method includes: The heat dissipation device starts running at a target duration after the server is powered on, where the target duration is the startup duration of the first operating system, and the startup duration of the first operating system is less than the startup duration of the second operating system; The heat dissipation device operates according to the operating parameters output by the first controller, where the operating parameters output by the first controller are determined according to the server state of the server, the component state of the server components, and the temperature of the server; Among them, the heat dissipation device operates according to the operating parameters output by the first controller, including: The heat dissipation device operates according to the operating parameters output by the first operating system in a first stage, where the first stage is from when the first operating system has completed startup to when the second operating system has completed startup. The operating parameters output by the first operating system are determined by the first operating system according to the component state of the server components belonging to the first type in the server components, the component temperature of the server components belonging to the first type, and the ambient temperature of the server when the server state indicates that the server is powered on but not turned on. The server components belonging to the first type are the server components that generate heat after the server is powered on; The heat dissipation device operates according to the operating parameters output by the second operating system in a second stage, where the second stage is from when the second operating system has completed startup to when the server has completed booting. The operating parameters output by the second operating system are determined by the second operating system according to the component state of the server components belonging to the first type in the server components, the component temperature of the server components belonging to the second type, and the ambient temperature of the server when the server state indicates that the server is in the process of booting. The server components belonging to the second type are the server components that allow the second operating system to obtain the component temperature during the server booting process; Among them, the number of server components that the second operating system allows to obtain the component temperature is greater than the number of server components that the first operating system allows to obtain the component temperature; Among them, the heat dissipation device operates according to the operating parameters output by the first operating system in the first stage, including: when the component state of the server components belonging to the first type indicates that the server is configured with the server components belonging to the first type, the operating parameters output by the first operating system are the first operating parameter or the second operating parameter. The ambient temperature of the server conforms to the first heat dissipation curve with the first operating parameter, and the first heat dissipation curve is used to indicate the first conversion relationship between the ambient temperature of the server and the operating parameters of the heat dissipation device. The second operating parameter is calculated according to the component temperature of the server components belonging to the first type; Among them, the server components belonging to the first type include: a plurality of candidate server components. The first heat dissipation curve includes a plurality of heat dissipation curves corresponding one by one to the plurality of candidate server components. The higher the operating power consumption of a candidate server component, the higher the heat dissipation performance of the heat dissipation device corresponding to the operating parameters on the corresponding heat dissipation curve at the same ambient temperature of the server. The operating parameters output by the first operating system are the first operating parameters or the second operating parameters, including: according to the component type of the server components belonging to the first type, the first operating system calls a candidate heat dissipation curve matching the component type from the first heat dissipation curve, converts the ambient temperature of the server into a candidate parameter, and the first operating parameter includes the candidate parameter.

2. The method according to claim 1, wherein the operating parameters output by the first controller are determined according to the component status of the server components belonging to the first type, the component temperature of the server components belonging to the first type, and the ambient temperature of the server, and further include one of the following: when the component status of the server components belonging to the first type is used to indicate that no server components belonging to the first type are configured on the server, the operating parameters output by the first controller are the target parameter values; when the component status of the server components belonging to the first type is used to indicate that no server components belonging to the first type are configured on the server, the operating parameters output by the first controller are the third operating parameters. Among them, the ambient temperature of the server and the third operating parameters conform to the second heat dissipation curve, and the second heat dissipation curve is used to indicate the second conversion relationship between the ambient temperature of the server and the operating parameters of the heat dissipation device. The heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the first conversion relationship at the same ambient temperature of the server is higher than that of the heat dissipation device corresponding to the operating parameters under the second conversion relationship.

3. The method according to claim 1, wherein the first operating parameter is the operating parameter of the target server component configured on the server among the plurality of candidate server components on the corresponding heat dissipation curve.

4. The method according to claim 1, wherein the server components belonging to the first type include: Open Compute Project network cards and / or intelligent network cards, the heat dissipation device includes: a fan, the operating parameters of the heat dissipation device include: the rotation speed duty cycle of the fan, and the first heat dissipation curve includes: the first curve corresponding to the Open Compute Project network card and the second curve corresponding to the intelligent network card; When the Open Compute Project network card is configured on the server, the first curve includes: when the ambient temperature of the server is less than or equal to the first temperature, the rotation speed duty ratio is the first duty ratio; when the ambient temperature of the server is greater than or equal to the second temperature, the rotation speed duty ratio is the second duty ratio; when the ambient temperature of the server is greater than the first temperature and less than the second temperature, the rotation speed duty ratio is linearly related to the ambient temperature of the server between the first duty ratio and the second duty ratio; When the intelligent network card is configured on the server, the second curve includes: when the ambient temperature of the server is less than or equal to the first temperature, the rotation speed duty ratio is the third duty ratio; when the ambient temperature of the server is greater than or equal to the second temperature, the rotation speed duty ratio is the fourth duty ratio; when the ambient temperature of the server is greater than the first temperature and less than the second temperature, the rotation speed duty ratio is linearly related to the ambient temperature of the server between the third duty ratio and the fourth duty ratio; Wherein, the third duty ratio is greater than the first duty ratio, and the fourth duty ratio is greater than the second duty ratio.

5. The method according to claim 4, wherein When the Open Compute Project network card and the intelligent network card are both configured on the server, the first operating parameter is the operating parameter corresponding to the ambient temperature of the server on the second curve.

6. The method according to claim 1, wherein The operating parameter output by the first controller is determined according to the component status of the server components belonging to the first type, the component temperature of the server components belonging to the second type, and the ambient temperature of the server, including: When the component status of the server components belonging to the first type is used to indicate that the server is configured with the server components belonging to the first type, the operating parameter output by the first controller is the fourth operating parameter or the fifth operating parameter, wherein the ambient temperature of the server and the fourth operating parameter conform to the third heat dissipation curve, and the third heat dissipation curve is used to indicate the third conversion relationship between the ambient temperature of the server and the operating parameter of the heat dissipation device, and the fifth operating parameter is calculated according to the component temperature of the server components belonging to the second type; When the component status of a server component belonging to the first type is used to indicate that no server component belonging to the first type is configured on the server, the operating parameter output by the first controller is the sixth operating parameter or the seventh operating parameter. Among them, the ambient temperature of the server conforms to the fourth heat dissipation curve with the sixth operating parameter, and the fourth heat dissipation curve is used to indicate the fourth conversion relationship between the ambient temperature of the server and the operating parameter of the heat dissipation device. The seventh operating parameter is calculated based on the component temperature of the server component belonging to the second type, and the heat dissipation performance of the heat dissipation device corresponding to the operating parameter of the same ambient temperature of the server under the third conversion relationship is higher than that of the heat dissipation device corresponding to the operating parameter under the fourth conversion relationship.

7. The method according to claim 6, wherein The server components belonging to the first type include: Open Compute Project network cards and / or intelligent network cards. The heat dissipation device includes: fans. The operating parameter of the heat dissipation device includes: the rotation speed duty ratio of the fans. The third heat dissipation curve includes: the first curve corresponding to the Open Compute Project network card and the second curve corresponding to the intelligent network card; The third heat dissipation curve includes: when the ambient temperature of the server is less than or equal to the first temperature, the rotation speed duty ratio is the fifth duty ratio; when the ambient temperature of the server is greater than or equal to the second temperature, the rotation speed duty ratio is the sixth duty ratio; when the ambient temperature of the server is greater than the first temperature and less than the second temperature, the rotation speed duty ratio is linearly related to the ambient temperature of the server between the fifth duty ratio and the sixth duty ratio; The fourth heat dissipation curve includes: when the ambient temperature of the server is less than or equal to the first temperature, the rotation speed duty ratio is the seventh duty ratio; when the ambient temperature of the server is greater than or equal to the second temperature, the rotation speed duty ratio is the eighth duty ratio; when the ambient temperature of the server is greater than the first temperature and less than the second temperature, the rotation speed duty ratio is linearly related to the ambient temperature of the server between the seventh duty ratio and the eighth duty ratio; Among them, the fifth duty ratio is greater than the seventh duty ratio, and the sixth duty ratio is greater than the eighth duty ratio.

8. The method according to claim 1, wherein A second controller is also deployed on the server, and the method further includes: When the server is powered on but not started, and the first controller fails to start, the heat dissipation device starts to operate after the second controller starts; When a server component belonging to the first type is configured on the server, the heat dissipation device operates according to the first preset parameter, where the server component belonging to the first type is a server component that generates heat after the server is powered on. When the server component of the first type is not configured on the server, the heat dissipation device operates according to a second preset parameter, where the heat dissipation performance of the heat dissipation device corresponding to the first preset parameter is higher than that of the heat dissipation device corresponding to the second preset parameter.

9. The method according to claim 8, wherein The method further includes: When the first controller fails to start, the server is in the power-on stage, and the server component of the first type is configured on the server, the heat dissipation device operates according to a third preset parameter; When the first controller fails to start, the server is in the power-on stage, and the server component of the first type is not configured on the server, the heat dissipation device operates according to a fourth preset parameter, where the heat dissipation performance of the heat dissipation device corresponding to the third preset parameter is higher than that of the heat dissipation device corresponding to the fourth preset parameter.

10. The method according to claim 1, wherein The heat dissipation device operates according to the operation parameters output by the first operating system in the first stage, including: The operation parameters of the heat dissipation device rise to the heat dissipation operation parameters determined by the first operating system at a reference time after starting to operate, where there is a time interval between the reference time and the first time.

11. The method according to claim 10, wherein The operation parameters of the heat dissipation device rise to the heat dissipation operation parameters determined by the first operating system at a reference time after the first time, including: After the first time, the operation parameters of the heat dissipation device start from an initial value and rise from the current operation parameter to the next current operation parameter every target time period until they rise to the heat dissipation operation parameter; Wherein, when the difference between the heat dissipation operation parameter and the current operation parameter is greater than or equal to the step operation parameter, the rising amount of the operation parameter is the step operation parameter; when the difference between the heat dissipation operation parameter and the current operation parameter is less than the step operation parameter, the rising amount of the operation parameter is the difference between the heat dissipation operation parameter and the current operation parameter.

12. An operating device for a heat dissipation device on a server, wherein The server includes: a server component, a first controller, and a heat dissipation device. The first operating system and the second operating system are deployed on the first controller. The device includes: A first operation module for starting the operation of the heat dissipation device at a target duration after the server is powered on, where the target duration is the startup duration of the first operating system, and the startup duration of the first operating system is less than the startup duration of the second operating system; A second operation module for the heat dissipation device to operate according to the operation parameters output by the first controller, where the operation parameters output by the first controller are determined according to the server state of the server, the component state of the server component, and the temperature of the server; Wherein, the second operation module is used for: The heat dissipation device operates according to the operating parameters output by the first operating system in the first stage, where the first stage is the stage from the completion of the startup of the first operating system to the completion of the startup of the second operating system. The operating parameters output by the first operating system are determined by the first operating system based on the component status of the server components belonging to the first type among the server components, the component temperature of the server components belonging to the first type, and the ambient temperature of the server when the server status indicates that the server is powered on but not turned on. The server components belonging to the first type are the server components that generate heat after the server is powered on; The heat dissipation device operates according to the operating parameters output by the second operating system in the second stage, where the second stage is the stage from the completion of the startup of the second operating system to the completion of the startup of the server. The operating parameters output by the second operating system are determined by the second operating system based on the component status of the server components belonging to the first type among the server components, the component temperature of the server components belonging to the second type, and the ambient temperature of the server when the server status indicates that the server is in the process of starting up. The server components belonging to the second type are the server components that allow the second operating system to obtain the component temperature during the startup process of the server; where the number of server components whose component temperatures can be obtained by the second operating system is greater than the number of server components whose component temperatures can be obtained by the first operating system; where the second operation module is further configured to: When the component status of the server components belonging to the first type indicates that the server is configured with server components belonging to the first type, the operating parameters output by the first operating system are the first operating parameters or the second operating parameters. The ambient temperature of the server conforms to the first heat dissipation curve with the first operating parameters. The first heat dissipation curve is used to indicate the first conversion relationship between the ambient temperature of the server and the operating parameters of the heat dissipation device. The second operating parameters are calculated based on the component temperature of the server components belonging to the first type; where the server components belonging to the first type include: a plurality of candidate server components. The first heat dissipation curve includes a plurality of heat dissipation curves corresponding one by one to the plurality of candidate server components. The higher the operating power consumption of the candidate server component, the higher the heat dissipation performance of the heat dissipation device corresponding to the operating parameters on the corresponding heat dissipation curve at the same ambient temperature of the server. The operating parameters output by the first operating system being the first operating parameters or the second operating parameters includes: according to the component type of the server components belonging to the first type, the first operating system calls the candidate heat dissipation curve matching the component type from the first heat dissipation curve, converts the ambient temperature of the server into candidate parameters, and the first operating parameters include the candidate parameters.

13. A computer-readable storage medium, characterized in that A computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the method described in any one of claims 1 to 11.

14. An electronic device, comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that when the processor executes the computer program, the steps of the method described in any one of claims 1 to 11 are implemented.

15. A computer program product, comprising a computer program, characterized in that when the computer program is executed by a processor, the steps of the method described in any one of claims 1 to 11 are implemented.

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