Electronic device

Abstract

An electronic device is provided. The electronic device includes: a display layer; a sensor layer disposed on the display layer and including a plurality of sensing electrodes; a sensor driving unit; a first dummy sensor section including a plurality of dummy electrodes; a first RC circuit electrically connected between the sensor driving portion and the first dummy sensor portion; and a flexible circuit board connected to the display layer, and on which the sensor driving portion and the first RC circuit are disposed. The sensor driving portion may be configured to receive a touch signal from the plurality of sensing electrodes and a first noise signal from the plurality of dummy electrodes, the first RC circuit may be configured to control a magnitude of the first noise signal, and the sensor driving portion may be configured to differentiate the touch signal and the first noise signal.

Description

[0001] This application claims the priority of Korean Patent Application No. 10-2023-0089375 filed on July 10, 2023 in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present disclosure herein relates to an electronic device with improved sensing reliability. Background Art

[0003] Multimedia electronic devices (such as televisions, mobile phones, tablet computers, navigators, and game consoles) include electronic devices for displaying images. Such electronic devices may include a sensor layer that can provide a touch-based input method that allows a user to easily input information or commands intuitively and conveniently, in addition to other input methods such as buttons, keyboards, and mice. The sensor layer can sense whether the user's body has touched the electronic device. Summary of the invention

[0004] The present disclosure provides an electronic device with improved sensing reliability.

[0005] An embodiment of the inventive concept provides an electronic device, comprising: a display layer; a sensor layer, which is arranged on the display layer and includes a plurality of sensing electrodes; a sensor driving unit, configured to drive the sensor layer; a first virtual sensor unit, including a plurality of virtual electrodes; a first RC circuit, electrically connected between the sensor driving unit and the first virtual sensor unit; and a flexible circuit board, connected to the display layer, and the sensor driving unit and the first RC circuit are arranged on the flexible circuit board, wherein the sensor driving unit is configured to receive touch signals from the plurality of sensing electrodes and receive first noise signals from the plurality of virtual electrodes, the first RC circuit is configured to control the size of the first noise signal, and the sensor driving unit is configured to differentiate the touch signal and the first noise signal.

[0006] In an embodiment, the plurality of virtual electrodes may include a first virtual electrode and a second virtual electrode, wherein the first virtual electrode and the second virtual electrode may be disposed at different layers from each other, and the first virtual electrode and the second virtual electrode may be disposed on a flexible circuit board.

[0007] In an embodiment, the electronic device may further include a second RC circuit electrically connected between the sensor driving part and the first dummy sensor part.

[0008] In an embodiment, each of the first RC circuit and the second RC circuit may include a passive element.

[0009] In an embodiment, each of the first RC circuit and the second RC circuit may include an active element, and the electronic device may further include a circuit controller configured to control the first RC circuit and the second RC circuit, wherein the circuit controller is disposed on the flexible circuit board.

[0010] In an embodiment, the sensor driving part may include a signal receiver including a first input terminal and a second input terminal, wherein the touch signal may be applied to the first input terminal of the signal receiver and the first noise signal may be applied to the second input terminal of the signal receiver.

[0011] In an embodiment, the sensor driving unit may include a first signal receiver and a second signal receiver, wherein each of the first signal receiver and the second signal receiver includes a first input terminal and a second input terminal, wherein the touch signal may be applied to the first input terminal of the first signal receiver, and the first noise signal may be applied to the first input terminal of the second signal receiver.

[0012] In an embodiment, the plurality of sensing electrodes may include a plurality of first sensing electrodes and a plurality of second sensing electrodes, the plurality of second sensing electrodes are insulated from the plurality of first sensing electrodes and intersect the plurality of first sensing electrodes, each of the plurality of first sensing electrodes may extend in a first direction, each of the plurality of second sensing electrodes may extend in a second direction intersecting the first direction, the plurality of first sensing electrodes and the plurality of second sensing electrodes may be configured to respectively define a plurality of channels, the first noise signal may include a plurality of noise values, the plurality of noise values ​​respectively correspond to the plurality of channels, and the sensor driving unit may be configured to digitally convert the plurality of noise values ​​into a plurality of digital noise signals, respectively.

[0013] In an embodiment, the sensor driving part may be configured to subtract an average value of the plurality of digital noise signals from the digital signal of the touch signal.

[0014] In an embodiment, the sensor driving part may be configured to subtract an average value of digital noise signals arranged in the first direction among the plurality of digital noise signals from the digital signal of the touch signal.

[0015] In an embodiment, the sensor driving section may be configured to subtract an average value of digital noise signals arranged in the second direction among the plurality of digital noise signals from the digital signal of the touch signal.

[0016] In an embodiment, the touch signal may be provided in plurality, the plurality of touch signals may correspond to a plurality of channels respectively, and the sensor driving unit may be configured to subtract a plurality of digital noise signals from digital signals of the plurality of touch signals respectively.

[0017] An embodiment of the inventive concept provides an electronic device, the electronic device comprising: a display layer; a sensor layer disposed on the display layer and comprising a plurality of sensing electrodes; a sensor driving unit configured to drive the sensor layer; a first virtual sensor unit comprising a plurality of virtual electrodes; a first RC circuit electrically connected between the sensor driving unit and the first virtual sensor unit; and a flexible circuit board connected to the display layer, and the sensor driving unit and the first RC circuit are disposed on the flexible circuit board, wherein the sensor driving unit is configured to receive a touch signal from the plurality of sensing electrodes and receive a first noise signal from the plurality of virtual electrodes, the first RC circuit is configured to control the size of the first noise signal, and the sensor driving unit is configured to differentiate the touch signal and the first noise signal, wherein the sensor layer comprises an active area and a peripheral area disposed around the active area, the sensor layer is driven in units of a sensing frame, wherein the sensing frame comprises a first segment, a second segment, and a third segment, and the sensor driving unit is configured to receive a touch signal in a self-touch method in each of the first segment and the second segment, and receive a touch signal in a mutual touch method in the third segment.

[0018] In an embodiment, the first RC circuit can be configured to operate in units of sensing frames and include passive elements, the first RC circuit can be configured to control the magnitude of the first noise signal in a 1-1 sampling segment corresponding to the first segment during the sensing frame, the first RC circuit can be configured to control the magnitude of the first noise signal in a 1-2 sampling segment corresponding to the second segment during the sensing frame, and the first RC circuit can be configured to control the magnitude of the first noise signal in a 1-3 sampling segment corresponding to the third segment during the sensing frame.

[0019] In an embodiment, the 1-1 sampling section may be smaller than the first section, the 1-2 sampling section may be smaller than the second section, and the 1-3 sampling section may be smaller than the third section.

[0020] In an embodiment, the effective area may include a first area, a second area, and a third area arranged in a second direction, the third segment may include a 3-1 segment receiving a signal corresponding to the first area, a 3-2 segment receiving a signal corresponding to the second area, and a 3-3 segment receiving a signal corresponding to the third area, the first RC circuit may be configured to operate in units of sensing frames and include active elements, the first RC circuit may be configured to control the size of the first noise signal in a 2-1 sampling segment corresponding to the 3-1 segment during the sensing frame, the first RC circuit may be configured to control the size of the first noise signal in a 2-2 sampling segment corresponding to the 3-2 segment during the sensing frame, and the first RC circuit may be configured to control the size of the first noise signal in a 2-3 sampling segment corresponding to the 3-3 segment during the sensing frame.

[0021] In an embodiment, the electronic device may further include a second virtual sensor unit disposed on the flexible circuit board, wherein the sensor driving unit may be configured to receive a second noise signal from the second virtual sensor unit, and the sensor driving unit may be configured to subtract the first noise signal and the second noise signal from the touch signal.

[0022] An embodiment of the inventive concept provides an electronic device, which includes: a display layer; a sensor layer, which is arranged on the display layer and includes a plurality of sensing electrodes; a sensor driving unit, configured to drive the sensor layer; a first virtual sensor unit, including a plurality of virtual electrodes; a first RC circuit, electrically connected between the sensor driving unit and the first virtual sensor unit; and a flexible circuit board, which is connected to the display layer, and the sensor driving unit and the first RC circuit are arranged on the flexible circuit board, wherein the sensor driving unit is configured to receive a touch signal from the plurality of sensing electrodes and a first noise signal from the plurality of virtual electrodes, the first RC circuit is configured to control the size of the first noise signal, and the sensor driving unit is configured to differentiate the touch signal and the first noise signal, wherein the sensor layer includes an effective area and a peripheral area arranged around the effective area, and the first virtual sensor unit is arranged in the peripheral area.

[0023] In an embodiment, the electronic device may further include an RC line configured to control a magnitude of the first noise signal and disposed on the sensor layer, wherein the RC line may be connected between the sensor driving part and the first dummy sensor part.

[0024] In an embodiment, the sensor layer may include an active area and a peripheral area disposed around the active area, and the RC line may be disposed in the peripheral area. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate embodiments of the inventive concept and together with the description serve to explain the principles of the inventive concept.

[0026] In the attached picture: Figure 1 is a perspective view of an electronic device according to an embodiment of the inventive concept; Figure 2 is a schematic block diagram of an electronic device according to an embodiment of the inventive concept; Figure 3A is a cross-sectional view of an electronic device according to an embodiment of the inventive concept; Figure 3B is a cross-sectional view of an electronic device according to an embodiment of the inventive concept; Figure 4is a cross-sectional view of a display module according to an embodiment of the inventive concept; Figure 5 is a plan view of a sensor layer according to an embodiment of the inventive concept; Fig. 6A is a plan view of a display layer, a flexible substrate, and a sensor driving part according to an embodiment of the inventive concept; Figure 6B is a plan view of a display layer, a flexible substrate, and a sensor driving part according to an embodiment of the inventive concept; Figure 7 According to the embodiment of the invention, Fig. 6A A cross-sectional view taken along line II'; Fig. 8A According to the embodiment of the invention Fig. 6A An exploded perspective view of area AA'; Figure 8B The present invention is a diagram showing an embodiment of the present invention. Fig. 6A An exploded perspective view of the area corresponding to the area AA'; Fig. 9 is a circuit diagram showing an electrical connection relationship between a sensor layer, a display signal line, and a sensor signal line according to an embodiment of the inventive concept; Fig. 10A is a view illustrating operations of a sensor layer and a control part according to an embodiment of the inventive concept; Fig. 10B is a view illustrating operations of a sensor layer and a control part according to an embodiment of the inventive concept; Fig.11 is a conceptual diagram for explaining operations of a sensor layer and an RC circuit according to an embodiment of the inventive concept; FIG. 12A to FIG. 12F is a view for explaining a digital touch signal, a digital noise signal, and a reduction signal according to an embodiment of the inventive concept; Fig.13 are views for explaining operations of a sensor layer, a flexible circuit board, and a sensor driving part according to an embodiment of the inventive concept; Fig.14 are views for explaining operations of a sensor layer, a flexible circuit board, and a sensor driving part according to an embodiment of the inventive concept; and Fig.15 are views for explaining operations of a sensor layer, a flexible circuit board, and a sensor driving part according to an embodiment of the inventive concept. DETAILED DESCRIPTION

[0027] In this specification, it will also be understood that when a component (or region, layer, part) is referred to as being "on", "connected to" or "coupled to" another component, it can be directly disposed on / directly connected to / directly coupled to the other component, or an intervening third component may also be present.

[0028] The same reference numerals refer to the same elements throughout. In addition, in the drawings, the thickness, proportion and size of the components are exaggerated for clarity of description. The term "and / or" includes any and all combinations of one or more related elements.

[0029] It will be understood that although terms such as "first" and "second" are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one component from other components. For example, an element referred to as a first element in one embodiment may be referred to as a second element in another embodiment without departing from the scope of the appended claims. Unless otherwise mentioned, terms in the singular may include plural forms.

[0030] In addition, “under”, “below”, “over”, and “upper” etc. are used to explain the relative relationship of elements shown in the drawings. Terms may be relative concepts and are described based on directions expressed in the drawings.

[0031] The meaning of “include” or “comprising” specifies a property, a fixed number, a process, an operation, an element, a component or a combination thereof, but does not exclude other properties, fixed numbers, processes, operations, elements, components or a combination thereof.

[0032] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the inventive concept belongs. In addition, unless expressly defined herein, terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with that in the context of the relevant technology.

[0033] Hereinafter, embodiments of the inventive concept will be described with reference to the accompanying drawings.

[0034] Figure 1 is a perspective view of an electronic device according to an embodiment of the inventive concept.

[0035] Reference Figure 1, the electronic device 1000 may be a device activated according to an electrical signal. The electronic device 1000 may include various embodiments. For example, the electronic device 1000 may be used in large electronic devices (such as televisions, monitors, or external billboards) and small and medium-sized electronic devices (such as personal computers, notebook computers, personal digital terminals, car navigation units, game consoles, portable electronic devices, and cameras). In addition, these are only presented as examples, and the electronic device 1000 may also be used in other electronic devices without departing from the concept of the inventive concept. For the sake of brevity and clarity, the electronic device 1000 including a smart phone will be described as a non-limiting example.

[0036] In various embodiments, the electronic device 1000 may have a display surface 1000-F parallel to a plane defined by each of a first direction DR1 and a second direction DR2 crossing the first direction DR1. The display surface 1000-F may include a display area 1000-T and a non-display area 1000-B.

[0037] In various embodiments, the image 1000-I may be displayed in the display area 1000-T and viewed from a third direction DR3. The third direction DR3 may be a thickness direction. The image 1000-I may include a still image and a dynamic image. Figure 1 , the image 1000 -I is shown as a watch and an icon, as an example. The display surface 1000 -F displaying the image 1000 -I may correspond to the front surface of the electronic device 1000 .

[0038] In various embodiments, the front surface (or top surface) or the rear surface (or bottom surface) of each member may be defined based on the direction along which the image 1000-I is displayed. The front surface and the rear surface may face each other in the third direction DR3 with a thickness therebetween. The normal direction of each of the front surface and the rear surface may be parallel to the third direction DR3. In this specification, the term "on a plane" may mean when viewed in the third direction DR3.

[0039] The image 1000 -I may not be displayed in the non-display area 1000 -B.

[0040] In various embodiments, the electronic device 1000 according to an embodiment of the inventive concept may sense a user's input applied from outside the electronic device 1000. For example, the electronic device 1000 may sense a user's body 2000 applied from the outside. The user's input may include various types of external inputs, such as a part of the user's body 2000, light, heat, or pressure. The electronic device 1000 may also sense an input applied to a side surface or a rear surface of the electronic device 1000 according to the structure of the electronic device 1000.

[0041] Figure 2 is a schematic block diagram of an electronic device according to an embodiment of the inventive concept.

[0042] Reference Figure 2 , the electronic device 1000 may include a display layer 100 , a sensor layer 200 , a display driving part 100C, a sensor driving part 200C, and a controller 1000C.

[0043] In various embodiments, the display layer 100 may be configured to generate an image. The display layer 100 may be an emissive display layer, but is not limited thereto, wherein, for example, the display layer 100 may be an organic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer. The emissive layer of the organic light-emitting display layer may include an organic light-emitting material. The emissive layer of the quantum dot light-emitting display layer may include quantum dots and quantum rods, etc. The emissive layer of the micro-LED display layer may include micro-LEDs. The emissive layer of the nano-LED display layer may include nano-LEDs.

[0044] In various embodiments, the sensor layer 200 may be disposed on the display layer 100, wherein the sensor layer 200 may cover the display layer 100. The sensor layer 200 may sense an external input applied from the outside. The sensor layer 200 may detect an external input of a body 2000 of a user.

[0045] In various embodiments, the controller 1000C may control the overall operation of the electronic device 1000, where, for example, the controller 1000C may control the operation of the display driving part 100C and the sensor driving part 200C. The controller 1000C may include at least one microprocessor, and the controller 1000C may be referred to as a host.

[0046] In various embodiments, the display driving unit 100C may control the display layer 100. The controller 1000C may further include a graphics controller, wherein the graphics controller may be integrated with the controller 1000C. The display driving unit 100C may receive image data RGB and a control signal D-CS from the controller 1000C. The control signal D-CS may include various signals, wherein, for example, the control signal D-CS may include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock signal, and a data enable signal.

[0047] In various embodiments, the display driving part 100C may generate a vertical synchronization signal and a horizontal synchronization signal for controlling a timing of providing a signal to the display layer 100 based on the control signal D-CS.

[0048] In various embodiments, the sensor driving part 200C may control the sensor layer 200. The sensor driving part 200C may receive a control signal I-CS from the controller 1000C. The control signal I-CS may include a clock signal.

[0049] In various embodiments, the sensor driving unit 200C may calculate external input coordinate information based on the signal received from the sensor layer 200, and provide a coordinate signal I-SS having the coordinate information to the controller 1000C. The controller 1000C may perform an operation corresponding to the user input based on the coordinate signal I-SS. For example, the controller 1000C may operate the display driving unit 100C to display a new application image on the display layer 100 based on the coordinate signal I-SS.

[0050] Figure 3A is a cross-sectional view of an electronic device according to an embodiment of the inventive concept.

[0051] Reference Figure 3A , the electronic device 1000 may include a display layer 100 and a sensor layer 200. The display layer 100 may include a base layer 110, a circuit layer 120, a light emitting element layer 130, and an encapsulation layer 140, wherein the base layer 110, the circuit layer 120, the light emitting element layer 130, and the encapsulation layer 140 may be sequentially stacked.

[0052] In various embodiments, the base layer 110 may be a member providing a surface on which the circuit layer 120 is disposed. The base layer 110 may be a glass substrate, a metal substrate, or a polymer substrate. However, embodiments of the inventive concept are not limited thereto. For example, the base layer 110 may be an inorganic layer, an organic layer, or a composite layer.

[0053] In various embodiments, the base layer 110 may have a multi-layer structure. For example, the base layer 110 may include a first synthetic resin layer, a silicon oxide (SiO x ) layer, an amorphous silicon (a-Si) layer disposed on the silicon oxide layer, and a second synthetic resin layer disposed on the amorphous silicon layer. The silicon oxide layer and the amorphous silicon layer may be referred to as a substrate barrier layer.

[0054] In various embodiments, each of the first synthetic resin layer and the second synthetic resin layer may include a polyimide resin. Each of the first synthetic resin layer and the second synthetic resin layer may include at least one of an acrylate resin, a methacrylate resin, a polyisoprene resin, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyamide resin, and a perylene resin. In this specification, a "~~" resin is represented as including a functional group "~~".

[0055] In various embodiments, the circuit layer 120 may be disposed on the base layer 110. The circuit layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer 110 in a manner such as coating or vapor deposition, and the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned by a plurality of photolithography processes. Thereafter, the semiconductor pattern, the conductive pattern, and the signal line included in the circuit layer 120 may be disposed.

[0056] In various embodiments, the light emitting element layer 130 may be disposed on the circuit layer 120. The light emitting element layer 130 may include a light emitting element, wherein, for example, the light emitting element layer 130 may include an organic light emitting material, quantum dots, quantum rods, micro LEDs, or nano LEDs.

[0057] In various embodiments, the encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may protect the light emitting element layer 130 from moisture, oxygen, and foreign substances such as dust particles.

[0058] In various embodiments, the sensor layer 200 may be disposed on the display layer 100 through a continuous process. The sensor layer 200 may be directly disposed on the display layer 100, wherein directly disposed indicates that no third component is disposed between the sensor layer 200 and the display layer 100. A separate bonding member may not be disposed between the sensor layer 200 and the display layer 100, wherein the sensor layer 200 is directly disposed on the display layer 100. Alternatively, the sensor layer 200 may be bonded to the display layer 100 through a bonding member, wherein the bonding member may include a commonly used binder or adhesive.

[0059] Figure 3B is a cross-sectional view of an electronic device according to an embodiment of the inventive concept.

[0060] Reference Figure 3B , the electronic device 1000-1 may include a display layer 100-1 and a sensor layer 200-1. The display layer 100-1 may include a base substrate 110-1, a circuit layer 120-1, a light emitting element layer 130-1, a package substrate 140-1, and a bonding member 150-1.

[0061] In various embodiments, each of the base substrate 110 - 1 and the encapsulation substrate 140 - 1 may be a glass substrate, a metal substrate, or a polymer substrate, but is not particularly limited thereto.

[0062] In various embodiments, the bonding member 150-1 may be disposed between the base substrate 110-1 and the encapsulation substrate 140-1, wherein the bonding member 150-1 may be between the circuit layer 120-1 and the encapsulation substrate 140-1. The bonding member 150-1 may bond the encapsulation substrate 140-1 to the base substrate 110-1 or the circuit layer 120-1. The bonding member 150-1 may include an inorganic material or an organic material. For example, the inorganic material may include a glass frit seal, and the organic material may include a photocurable resin or a photoplasticized resin; however, the material forming the bonding member 150-1 is not limited thereto.

[0063] In various embodiments, the sensor layer 200-1 may be directly disposed on the encapsulation substrate 140-1. Directly disposed indicates that no third component is disposed between the sensor layer 200-1 and the encapsulation substrate 140-1. A separate adhesive member may not be disposed between the sensor layer 200-1 and the display layer 100-1; however, embodiments of the inventive concept are not limited thereto. For example, an adhesive layer may be further disposed between the sensor layer 200-1 and the encapsulation substrate 140-1.

[0064] Figure 4 is a cross-sectional view of a display module according to an embodiment of the inventive concept. Figure 4 In the description of Figure 3A The same components described in and their descriptions are omitted.

[0065] Reference Figure 4 , the electronic device 1000 may include a display layer 100, a sensor layer 200, an anti-reflection layer 300, an adhesive layer ADH, and a window 400. The display layer 100, the sensor layer 200, the anti-reflection layer 300, the adhesive layer ADH, and the window 400 may be sequentially stacked.

[0066] In various embodiments, at least one inorganic layer may be disposed on the top surface of the base layer 110. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be disposed as a multilayer, wherein the multilayer inorganic layer may constitute a barrier layer and / or a buffer layer.

[0067] In various embodiments, the display layer 100 may include a buffer layer BFL, wherein the buffer layer BFL may improve the bonding force between the base layer 110 and the semiconductor pattern. The buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL may include a structure in which silicon oxide layers and silicon nitride layers are alternately stacked.

[0068] In various embodiments, a semiconductor pattern may be disposed on the buffer layer BFL. The semiconductor pattern may correspond to one of a plurality of patterns of a semiconductor layer disposed on the buffer layer BFL. The semiconductor pattern may include a metal oxide. In an embodiment, the semiconductor pattern may include polycrystalline silicon. However, embodiments of the inventive concept are not limited thereto, and the semiconductor pattern may include amorphous silicon, low temperature polycrystalline silicon, or an oxide semiconductor.

[0069] In various embodiments, the oxide semiconductor may include a crystalline oxide semiconductor or an amorphous oxide semiconductor. For example, the oxide semiconductor may include an oxide of a metal such as zinc (Zn), indium (In), gallium (Ga), tin (Sn), titanium (Ti) or a mixture of a metal such as zinc (Zn), indium (In), gallium (Ga), tin (Sn), titanium (Ti) and their oxides. The oxide semiconductor may include indium tin oxide (ITO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO), indium zinc oxide (IZO), indium oxide (InO), titanium oxide (TiO), indium zinc tin oxide (IZTO), zinc tin oxide (ZTO), etc.

[0070] In various embodiments, the semiconductor pattern may include a plurality of regions classified according to whether the metal oxide is reduced. The region in which the metal oxide is reduced (hereinafter, referred to as the reduction region) has a higher conductivity than the region in which the metal oxide is not reduced (hereinafter, referred to as the non-reduction region). The reduction region may be used as a source / drain or a signal line of a transistor. The non-reduction region may be used as a semiconductor region (or channel) of a transistor. In other words, a portion of the semiconductor pattern may be a semiconductor region of a transistor, another portion may be a source / drain region of a transistor, and another portion may be a signal transmission region.

[0071] In various embodiments, each of the pixels may have an equivalent circuit including five transistors, two capacitors, and a light emitting element, and the equivalent circuit diagram of the pixel may be modified in various forms. Figure 4 , one transistor 100PC and a light emitting element 100PE provided in a pixel are shown as an example.

[0072] In various embodiments, the source region SC, the active region AL, and the drain region DR of the transistor 100PC may be provided by a semiconductor pattern. The source region SC and the drain region DR may extend from the active region AL in opposite directions in cross section.

[0073] Figure 4 A portion of a connection signal line SCL formed of a semiconductor pattern is shown. Although not particularly shown, the connection signal line SCL may be connected to the drain region DR of the transistor 100PC on a plane.

[0074] In various embodiments, the first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 may be disposed on the plurality of pixels PX (see Fig. 6A ) are stacked to cover the semiconductor pattern. The first insulating layer 10 may include an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In various embodiments, the first insulating layer 10 may include a single-layer silicon oxide layer. The insulating layer of the circuit layer 120 to be described later and the first insulating layer 10 may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. The inorganic layer may include at least one of the above materials, but is not limited thereto.

[0075] In various embodiments, the gate GT of the transistor 100PC may be disposed on the first insulating layer 10, wherein the first insulating layer 10 may separate the gate GT from the active area AL. The gate GT may overlap the active area AL. The gate GT may be part of a metal pattern. The gate GT may be used as a mask in a process of doping a semiconductor pattern.

[0076] In various embodiments, the second insulating layer 20 may be disposed on the first insulating layer 10 and cover the gate GT. The second insulating layer 20 may overlap with a plurality of pixels. The second insulating layer 20 may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In various embodiments, the second insulating layer 20 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0077] In various embodiments, the third insulating layer 30 may be disposed on the second insulating layer 20, wherein the third insulating layer 30 may cover the second insulating layer 20. The third insulating layer 30 may be a single layer or a multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0078] In various embodiments, the first connection electrode CNE1 may be disposed on the third insulating layer 30 , wherein the first connection electrode CNE1 may be electrically connected to the connection signal line SCL through a contact hole CNT- 1 passing through the first insulating layer 10 to the third insulating layer 30 .

[0079] In various embodiments, a fourth insulating layer 40 may be disposed on the third insulating layer 30, wherein the fourth insulating layer 40 may cover at least a portion of the first connection electrode CNE1. The fourth insulating layer 40 may be a single silicon oxide layer. A fifth insulating layer 50 may be disposed on the fourth insulating layer 40, wherein the fifth insulating layer 50 may cover the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0080] In various embodiments, the second connection electrode CNE2 may be disposed on the fifth insulating layer 50 , wherein the second connection electrode CNE2 may be electrically connected to the first connection electrode CNE1 through a contact hole CNT- 2 passing through the fourth insulating layer 40 and the fifth insulating layer 50 .

[0081] In various embodiments, the sixth insulating layer 60 may be disposed on the fifth insulating layer 50, wherein the sixth insulating layer 60 may cover at least a portion of the second connection electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0082] In various embodiments, the light emitting element layer 130 may be disposed on the circuit layer 120, wherein the light emitting element layer 130 may include a light emitting element 100PE and a pixel defining layer 70. For example, the light emitting element layer 130 may include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro LED, or a nano LED. Hereinafter, the light emitting element 100PE is described as an example of an organic light emitting element, but is not limited thereto.

[0083] In various embodiments, the light emitting element 100PE may include a first electrode AE, an emission layer EL, and a second electrode CE.

[0084] In various embodiments, the first electrode AE ​​may be disposed on the sixth insulating layer 60. The first electrode AE ​​may be electrically connected to the second connection electrode CNE2 through a contact hole CNT-3 passing through the sixth insulating layer 60.

[0085] In various embodiments, the pixel defining layer 70 may be disposed on the sixth insulating layer 60 and cover a portion of the first electrode AE. An opening 70-OP is defined in the pixel defining layer 70, wherein the opening 70-OP of the pixel defining layer 70 exposes at least a portion of the first electrode AE.

[0086] In various embodiments, display area 1000-T (see Figure 1 ) may include an emission region PXA and a non-emission region NPXA adjacent to the emission region PXA, wherein the non-emission region NPXA may be on an opposite side of the emission region PXA. The non-emission region NPXA may surround the emission region PXA. In various embodiments, the emission region PXA may correspond to a portion of the region of the first electrode AE ​​exposed by the opening 70-OP.

[0087] In various embodiments, the emission layer EL may be disposed on the first electrode AE, wherein the emission layer EL may be disposed in a region corresponding to the opening 70-OP. The emission layer EL may be separated in each of the pixels. The emission layer EL may emit light having at least one of blue, red, and green; however, embodiments of the inventive concept are not limited thereto. For example, the emission layer EL may be commonly disposed to be connected to the pixel, wherein the emission layer EL may provide blue light or white light.

[0088] The second electrode CE may be disposed on the emission layer EL. The second electrode CE may have an integral shape and may be commonly disposed in a plurality of pixels.

[0089] In various embodiments, a hole control layer may be disposed between the first electrode AE ​​and the emission layer EL. The hole control layer may be disposed in the emission region PXA and the non-emission region NPXA. The hole control layer may include a hole transport layer and may further include a hole injection layer. The electron control layer may be disposed between the emission layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may further include an electron injection layer. The hole control layer and the electron control layer may be disposed in the pixel by using an open mask or an inkjet process.

[0090] In various embodiments, the encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may include an inorganic layer, an organic layer, and an inorganic layer stacked sequentially, but the layers constituting the encapsulation layer 140 are not limited thereto. The inorganic layer may protect the light emitting element layer 130 from moisture and oxygen, and the organic layer may protect the light emitting element layer 130 from foreign matter such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic organic layer, but embodiments of the inventive concept are not limited thereto.

[0091] In various embodiments, the sensor layer 200 may include a base layer 201 , a first conductive layer 202 , a sensing insulating layer 203 , a second conductive layer 204 , and a cover insulating layer 205 .

[0092] In various embodiments, the base layer 201 may have a single-layer structure or a multi-layer structure in which a plurality of layers are stacked in the third direction DR3.

[0093] In various embodiments, the first conductive layer 202 and the second conductive layer 204 may each have a single-layer structure or a multi-layer structure in which a plurality of layers are stacked in the third direction DR3.

[0094] In various embodiments, the first conductive layer 202 having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as poly (3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, graphene, and the like.

[0095] In various embodiments, the conductive layer having a multi-layer structure may include a metal layer. The metal layer may have a three-layer structure of titanium / aluminum / titanium. The conductive layer having a multi-layer structure may include at least one metal layer and at least one transparent conductive layer.

[0096] In various embodiments, the sensing insulating layer 203 and / or the capping insulating layer 205 may include an inorganic layer, which may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0097] In various embodiments, the sensing insulating layer 203 and / or the cover insulating layer 205 may include an organic layer. The organic layer may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0098] In various embodiments, a parasitic capacitor Cb may be provided between the sensor layer 200 and the second electrode CE. The parasitic capacitor Cb may also be referred to as a substrate capacitance. As the distance between the sensor layer 200 and the second electrode CE becomes closer, the value (e.g., farad) of the parasitic capacitor Cb may increase. As the capacitance of the parasitic capacitor Cb increases, the ratio of the capacitance change to the reference value may decrease. The capacitance change may indicate an input to the input unit (e.g., the user's body 2000 (reference value)). Figure 2 )) Capacitance change before and after.

[0099] In various embodiments, the sensor driving unit 200C (see Figure 2 ) A leveling operation may be performed to remove a value corresponding to the capacitance of the parasitic capacitor Cb from the sensed signal. A ratio of a change in the capacitance of the capacitor to a reference value may be increased by the leveling operation, thereby improving sensing sensitivity.

[0100] In various embodiments, the anti-reflection layer 300 may be disposed on the sensor layer 200. The anti-reflection layer 300 may include a spacer layer 310, a plurality of color filters 320, and a planarization layer 330.

[0101] In various embodiments, the separation layer 310 may be disposed to overlap the conductive pattern of the second conductive layer 204. The cover insulating layer 205 may be between the separation layer 310 and the second conductive layer 204. In various embodiments, the cover insulating layer 205 may be omitted.

[0102] In various embodiments, the partition layer 310 may prevent external light from being reflected by the second conductive layer 204. The material forming the partition layer 310 is not particularly limited as long as it is a material that absorbs light. The partition layer 310 may be a layer having a black color and may include a black colorant. The black component may include a black dye and / or a black pigment. The black component may include carbon black, a metal (such as chromium) or an oxide thereof.

[0103] In various embodiments, a partition opening 310-OP may be defined in the partition layer 310. The partition opening 310-OP may overlap the emission layer EL. A color filter 320 may correspond to the partition opening 310-OP, wherein the color filter 320 may transmit light provided from the emission layer EL overlapping the color filter 320.

[0104] In various embodiments, the planarization layer 330 may cover the separation layer 310 and the color filter 320. The planarization layer 330 may include an organic material, and may provide a flat surface on a top surface of the planarization layer 330. In embodiments, the planarization layer 330 may be omitted.

[0105] In an embodiment, the anti-reflection layer 300 may include a reflection control layer instead of the color filter 320. For example, in Figure 4 In the embodiment of the present invention, the color filter 320 may be omitted, and a reflection control layer may be added to replace the omitted color filter 320. The reflection control layer may selectively absorb light in a wavelength range (band) of light reflected from the inside of the display panel and / or the electronic device or light incident from the outside of the display panel and / or the electronic device.

[0106] For example, the reflection control layer can absorb light in a first wavelength range of about 490nm to about 505nm and a second wavelength range of about 585nm to about 600nm, so that the transmittance in the first wavelength range and the second wavelength range is about 40% or less. The reflection control layer can absorb light having a wavelength outside the wavelength range of red light, green light and blue light emitted from the emission layer EL. The reflection control layer can absorb light having a wavelength that does not belong to the wavelength range of red light, green light or blue light emitted from the emission layer EL to prevent the brightness of the display panel and / or the electronic device from decreasing or minimize the brightness of the display panel and / or the electronic device. In addition, at the same time, the degradation of the luminous efficiency of the display panel and / or the electronic device can be prevented or minimized, and visibility can be improved.

[0107] In various embodiments, the reflection control layer may be provided with an organic material layer including a dye, a pigment, or a combination thereof. The reflection control layer may include tetraazaporphyrin (TAP) compounds, porphyrin compounds, metal porphyrin compounds, oxazine compounds, squarylium compounds, triarylmethane compounds, polymethine compounds, tetraquinone compounds, phthalocyanine compounds, azo compounds, perylene compounds, xanthene compounds, diiminium compounds, dipyrromethene compounds, cyanine compounds, and combinations thereof.

[0108] In an embodiment, the reflection control layer may have a transmittance of about 64% to about 72%.The transmittance of the reflection control layer may be adjusted according to the amount of pigment and / or dye contained in the reflection control layer.

[0109] In an embodiment of the inventive concept, the anti-reflection layer 300 may include a polarizing film instead of the separator 310, the plurality of color filters 320, and the planarization layer 330. For example, the anti-reflection layer 300 may include a retarder and a polarizer. The retarder may be a film-type retarder or a liquid crystal coating retarder, and may include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer may also be a film-type and may include a stretchable synthetic resin film. Each of the retarder and the polarizer may also include a protective film. The retarder and the polarizer themselves or the protective film may be defined as a base layer of the anti-reflection layer 300.

[0110] In various embodiments, the adhesive layer ADH may be disposed between the anti-reflection layer 300 and the window 400 , wherein the adhesive layer ADH may include an optically transparent adhesive, an optically transparent adhesive resin, or a pressure sensitive adhesive (PSA).

[0111] In various embodiments, the window 400 may be disposed on the anti-reflection layer 300. The window 400 may include an optically transparent insulating material, wherein, for example, the window 400 may include glass or plastic. The window 400 may have a single-layer structure or a multi-layer structure. For example, the window 400 may include a plurality of plastic films bonded to each other using an adhesive, or include a glass substrate and a plastic film bonded to each other using an adhesive.

[0112] Figure 5 is a plan view of a sensor layer according to an embodiment of the inventive concept.

[0113] Reference Figure 5 , the sensor layer 200 may include an active area AR and a peripheral area NAR positioned around the active area AR. The active area AR may be an area activated according to an electrical signal. The active area AR may be an area configured to sense an input applied from the outside. The active area AR may be aligned with the display layer 100 (see Fig. 6A ) display area DP-DA (see Fig. 6A ). The peripheral region NAR may overlap with the display layer 100 (see Fig. 6A ) of the display peripheral area DP-NDA (see Fig. 6A ) overlap.

[0114] In various embodiments, the active area AR may include a first area AR1 , a second area AR2 , and a third area AR3 sequentially arranged in the second direction DR2 .

[0115] In various embodiments, the sensor layer 200 may include a base layer 201, a plurality of sensing electrodes SP, and a plurality of sensing lines TL1 and TL2. The plurality of sensing electrodes SP may be disposed in the active region AR, and the plurality of sensing lines TL1 and TL2 may be disposed in the peripheral region NAR.

[0116] In various embodiments, the base layer 201 may be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. The base layer 201 may be an organic layer including epoxy resin, acrylic resin, or imide resin. The base layer 201 may be directly disposed on the display layer 100 (see Figure 4 ). The base layer 201 may be bonded to the display layer 100 (see Figure 4 ).

[0117] In various embodiments, the plurality of sensing electrodes SP may include a plurality of first sensing electrodes TE1 and a plurality of second sensing electrodes TE2, wherein the first sensing electrodes TE1 may be adjacent to the second sensing electrodes TE2. The plurality of second sensing electrodes TE2 may be electrically insulated from the plurality of first sensing electrodes TE1 and intersect the plurality of first sensing electrodes TE1. The sensor layer 200 may acquire information about external input through capacitance changes between the plurality of first sensing electrodes TE1 and the plurality of second sensing electrodes TE2.

[0118] In various embodiments, each of the plurality of first sensing electrodes TE1 may extend in the first direction DR1, and the plurality of first sensing electrodes TE1 may be arranged in the second direction DR2. Each of the first sensing electrodes TE1 may include a plurality of first sensing patterns SP1 and a plurality of first connection patterns BSP1. Each of the plurality of first connection patterns BSP1 may electrically connect two adjacent first sensing patterns SP1 to each other. The plurality of first sensing patterns SP1 and the plurality of first connection patterns BSP1 may have a mesh structure. The plurality of first sensing patterns SP1 may be referred to as a plurality of first sensing portions SP1. The plurality of first connection patterns BSP1 may be referred to as a plurality of first connection portions BSP1. The plurality of first sensing electrodes TE1 may be referred to as a plurality of sensing electrodes.

[0119] In various embodiments, each of the second sensing electrodes TE2 may extend in the second direction DR2, and the plurality of second sensing electrodes TE2 may be arranged in the first direction DR1. Each of the plurality of second sensing electrodes TE2 may include a plurality of second sensing patterns SP2 and a plurality of second connection patterns BSP2. Each of the plurality of second connection patterns BSP2 may electrically connect two adjacent second sensing patterns SP2 to each other. The plurality of second sensing patterns SP2 and the plurality of second connection patterns BSP2 may have a mesh structure. The plurality of second sensing patterns SP2 may be referred to as a plurality of second sensing portions SP2. The plurality of second connection patterns BSP2 may be referred to as a plurality of second connection portions BSP2.

[0120] In various embodiments, the plurality of first connection patterns BSP1 may be disposed on a layer different from a layer on which the plurality of second connection patterns BSP2 are disposed, wherein the first connection patterns BSP1 may be on a layer above or below the second connection patterns BSP2. The plurality of second connection patterns BSP2 may be electrically insulated from the plurality of first sensing electrodes TE1 and intersect with the plurality of first sensing electrodes TE1. For example, the plurality of first connection patterns BSP1 may be electrically insulated from the plurality of second connection patterns BSP2, respectively, and intersect with the plurality of second connection patterns BSP2.

[0121] In various embodiments, each of the plurality of first sensing electrodes TE1 and the plurality of second sensing electrodes TE2 may define a plurality of channels CH. In response to an external input applied to one or more of the plurality of channels CH, the sensor layer 200 may transmit a touch signal TS (see Fig. 9 ) is sent to the sensor driver 200C (see Figure 2 ).

[0122] Figure 5 It is shown that the plurality of sensing electrodes SP have a rectangular shape, but is not limited thereto. For example, the plurality of sensing electrodes SP may have a polygonal shape.

[0123] In various embodiments, the plurality of sensing electrodes SP may include a conductive material, wherein, for example, the conductive material may include a metal or an alloy thereof. The metal may include gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), platinum (Pt), and the like. The plurality of sensing electrodes SP may be made of a transparent conductive material. The transparent conductive material may include silver nanowires (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), antimony zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO 2 ), carbon nanotubes and graphene, etc. The plurality of sensing electrodes SP may be provided as a single layer or a multilayer.

[0124] In various embodiments, the plurality of sensing lines TL1 and TL2 may include a plurality of first sensing lines TL1 and a plurality of second sensing lines TL2. The plurality of first sensing lines TL1 may be electrically connected to the plurality of first sensing electrodes TE1, respectively. The plurality of second sensing lines TL2 may be electrically connected to the plurality of second sensing electrodes TE2, respectively.

[0125] In various embodiments, the plurality of sensing lines TL1 may be electrically connected to the plurality of first sensing pads TD1 through contact holes, respectively (see Fig. 6A ). The plurality of second sensing lines TL2 may be electrically connected to the plurality of second sensing pads TD2 through contact holes, respectively (see Fig. 6A ).

[0126] Fig. 6A is a plan view of a display layer, a flexible substrate, and a sensor driving part according to an embodiment of the inventive concept.

[0127] Reference Fig. 6A The electronic device 1000 may include a display layer 100, a power pattern VDD, a data driver DIC, a flexible circuit board CF, a sensor driving part 200C, a virtual sensor part VSP, a first RC circuit RC1, a second RC circuit RC2, a display signal line L1, a sensor signal line L2, a virtual sensor signal line L3 and a connector CNT.

[0128] In various embodiments, a display area DP-DA and a display peripheral area DP-NDA adjacent to the display area DP-DA may be defined on the display layer 100. The display area DP-DA may be an area in which an image is displayed. A plurality of pixels PX may be disposed in the display area DP-DA. The display peripheral area DP-NDA may be an area in which a driving circuit or a driving line is disposed. The pixel PX may not be disposed in the display peripheral area DP-NDA.

[0129] In various embodiments, the display layer 100 may include a base layer 110 , a plurality of pixels PX, a plurality of signal lines GL, DL, PL, and EEL, a plurality of display pads (also referred to as “pads”) P1 and P2 , and a plurality of sensing pads PDT.

[0130] In various embodiments, each of the pixels PX may display one of the primary colors or one of the mixed colors. The primary (primary) colors may include red, green, or blue. The mixed colors may include various colors, such as white, yellow, cyan, or magenta. However, embodiments of the inventive concept are not limited to the colors displayed by the pixels PX.

[0131] In various embodiments, a plurality of signal lines GL, DL, PL, and EEL may be disposed on the base layer 110. The plurality of signal lines GL, DL, PL, and EEL may be connected to a plurality of pixels PX to transmit electrical signals to the plurality of pixels PX. The plurality of signal lines GL, DL, PL, and EEL include a plurality of scan lines GL, a plurality of data lines DL, a plurality of power lines PL, and a plurality of emission control lines EEL. However, this is merely an example, and the configuration of the signal lines GL, DL, PL, and EEL according to the embodiments of the inventive concept is not limited thereto. For example, the plurality of signal lines GL, DL, PL, and EEL according to the embodiments of the inventive concept may further include an initialization voltage line.

[0132] In various embodiments, the power pattern VDD may be disposed in the display peripheral area DP-NDA. The power pattern VDD may be electrically connected to a plurality of power lines PL. Each of the plurality of pixels PX may receive a power voltage ELVDD provided through the power line PL.

[0133] In various embodiments, a plurality of display pads P1 and P2 may be provided in the display peripheral area DP-NDA. The display pads P1 and P2 may include a first pad P1 and a second pad P2. The first pad P1 may be provided in plurality. The plurality of first pads P1 may be connected to a plurality of data lines DL, respectively. The second pad P2 may be connected to a power pattern VDD and electrically connected to a power line PL. The display layer 100 may provide an externally provided electrical signal to a plurality of pixels PX through the plurality of display pads P1 and P2. In addition to the first pad P1 and the second pad P2, the plurality of display pads P1 and P2 may further include a pad for receiving other electrical signals.

[0134] In various embodiments, the data driver DIC may be installed in the display peripheral area DP-NDA. The data driver DIC may be a timing control circuit in the form of a chip. The data driver DIC may respond to the image data RGB (see Figure 2 ) and outputs grayscale voltages to the plurality of data lines DL according to frame data of the display layer 100. The plurality of data lines DL may be electrically connected to the plurality of first pads P1 via the data driver DIC, respectively. However, this is only an example, and the data driver DIC may be mounted on a film separated from the display layer 100. The data driver DIC may be electrically connected to the plurality of display pads P1 and P2 through the film.

[0135] In various embodiments, a plurality of sensing pads PDT may be disposed in the display peripheral area DP-NDA. The plurality of sensing pads PDT may be electrically connected to the sensor layer 200 (see Figure 5 ) of a plurality of sensing electrodes SP (see Figure 5 ). The plurality of sensing pads PDT may include a plurality of first sensing pads TD1 and a plurality of second sensing pads TD2.

[0136] In various embodiments, the flexible circuit board CF may be physically and electrically connected to the display layer 100. The flexible circuit board CF may be electrically connected to the plurality of display pads P1 and P2 and the plurality of sensing pads PDT.

[0137] In various embodiments, the sensor driving part 200C, the dummy sensor part VSP, the first RC circuit RC1 , the second RC circuit RC2 , and the connector CNT may be disposed on the flexible circuit board CF.

[0138] In various embodiments, the sensor driving unit 200C may drive the sensor layer 200 (see Figure 5 ). The sensor driving part 200C may be electrically connected to the plurality of sensing pads PDT.

[0139] In various embodiments, the display signal line L1 may be electrically connected between the display layer 100 and the controller 1000C (see Figure 2), where, for example, the display signal line L1 may be electrically connected between the plurality of display pads P1 and P2 and the connector CNT. The display signal line L1 may transmit and receive a data signal DATA (see Fig. 9 ). The display signal line L1 may be disposed on the flexible circuit board CF. The display signal line L1 may be referred to as a MIPI line.

[0140] In various embodiments, the connector CNT may electrically connect the controller 1000C to the display layer 100 .

[0141] In various embodiments, the sensor signal line L2 may be disposed on the flexible circuit board CF. The sensor signal line L2 may be electrically connected between the sensor layer 200 and the sensor driving unit 200C. For example, the sensor signal line L2 may be connected between the plurality of sensing pads PDT and the sensor driving unit 200C. Figure 5 ) can send a touch signal TS through the sensor signal line L2 (see Fig. 9 ), wherein the sensor driving unit 200C can be driven from a plurality of sensing electrodes (SP (see Figure 5 )) receives the touch signal TS (see Fig. 9 ). When viewed in a plan view, the sensor signal line L2 may cross the display signal line L1. The touch signal TS (see Fig. 9 ) can include noise.

[0142] In various embodiments, the virtual sensor signal line L3 may be disposed on the flexible circuit board CF. The virtual sensor signal line L3 may be electrically connected between the virtual sensor portion VSP and the sensor driving portion 200C, wherein, for example, the virtual sensor signal line L3 may be connected to a plurality of virtual electrodes VM (see Figure 7 ) and the sensor driving unit 200C. Multiple virtual electrodes VM (see Figure 7 ) can send the first noise signal NS1 through the virtual sensor signal line L3 (see Fig. 10A ), wherein the sensor driving unit 200C can be configured to drive a plurality of virtual electrodes VM (see Figure 7 ) receives the first noise signal NS1 (see Fig. 10A ). When viewed in a plan view, the virtual sensor signal line L3 may cross the display signal line L1, and the first noise signal NS1 (see Fig. 10A ) may include noise. The virtual sensor signal line L3 may be electromagnetically shielded except for a portion crossing the display signal line L1.

[0143] In various embodiments, the virtual sensor portion VSP may include a plurality of virtual electrodes VM (see Figure 7 ). Multiple virtual electrodes VM (see Figure 7) may be electrically connected to the first RC circuit RC1. The first RC circuit RC1 may be electrically connected to the sensor driving part 200C. That is, the first RC circuit RC1 may be connected between the sensor driving part 200C and the dummy sensor part VSP.

[0144] In various embodiments, multiple virtual electrodes VM (see Figure 7 ) may be electrically connected to the second RC circuit RC2. The second RC circuit RC2 may be electrically connected to the sensor driving part 200C. That is, the second RC circuit RC2 may be connected between the sensor driving part 200C and the virtual sensor part VSP.

[0145] In various embodiments, the virtual sensor portion VSP may convert the first noise signal NS1 (see Fig. 10A ) is sent to the sensor driving unit 200C. That is, the sensor driving unit 200C can generate a plurality of virtual electrodes VM (see Figure 7 ) receives the first noise signal NS1 (see Fig. 10A ).

[0146] In various embodiments, each of the first RC circuit RC1 and the second RC circuit RC2 may include a passive element. A passive element may be an element having a function of consuming, storing or transmitting electrical energy. For example, a passive element may include a resistor, a capacitor and / or an inductor.

[0147] In various embodiments, the first RC circuit RC1 and the second RC circuit RC2 may control the first noise signal NS1 (see Fig. 10A For example, the first RC circuit RC1 and the second RC circuit RC2 can convert the first noise signal NS1 (see Fig. 10A ) is controlled to be similar to the touch signal TS (see Fig. 9 For example, each of the first RC circuit RC1 and the second RC circuit RC2 may have a predetermined RC value.

[0148] In various embodiments, the sensor driving unit 200C may receive the first noise signal NS1 (see Fig. 10A ) and touch signal TS (see Fig. 9 ) to perform differentiation. This will be described later.

[0149] Figure 6B is a plan view of a display layer, a flexible substrate, and a sensor driving part according to an embodiment of the inventive concept. Figure 6B In the description of Fig. 6A The same components as described above are described, and their description is omitted.

[0150] Reference Figure 6B , electronic device 1000 (see Figure 1 ) may also include a display layer 100, a power pattern VDD, a data driver DIC, a flexible circuit board CF, a sensor driving unit 200C, a virtual sensor unit VSP, a first RC circuit RC1-1, a second RC circuit RC2-1, a display signal line L1, a sensor signal line L2, a virtual sensor signal line L3, a connector CNT and a circuit controller RCC.

[0151] In various embodiments, each of the first RC circuit RC1-1 and the second RC circuit RC2-1 may include an active element. An active element may refer to an element having a function of amplifying or converting electrical energy. For example, an active element may include an amplifier, a diode, and / or a transistor.

[0152] When the first RC circuit RC1-1 and the second RC circuit RC2-1 include active elements, the circuit controller RCC may be further disposed on the flexible circuit board CF. The circuit controller RCC may control each of the first RC circuit RC1-1 and the second RC circuit RC2-1 to have a predetermined RC value. For example, each of the first RC circuit RC1-1 and the second RC circuit RC2-1 may have a variable RC value.

[0153] Figure 7 According to the embodiment of the invention, Fig. 6A A cross-sectional view taken along line II'.

[0154] Reference Fig. 6A and Figure 7 , the virtual sensor part VSP may include a plurality of virtual electrodes VM, a first insulating layer VL1, and a second insulating layer VL2. A first virtual electrode VM1 to be described below may be disposed on the flexible circuit board CF.

[0155] In various embodiments, the plurality of virtual electrodes VM may include a first virtual electrode VM1 and a second virtual electrode VM2. The first insulating layer VL1 may be disposed on the first virtual electrode VM1. The second virtual electrode VM2 may be disposed on the first insulating layer VL1, wherein the first insulating layer VL1 separates the first virtual electrode VM1 from the second virtual electrode VM2. The second insulating layer VL2 may be disposed on the second virtual electrode VM2. The first virtual electrode VM1 and the second virtual electrode VM2 may be disposed on different layers.

[0156] In various embodiments, the capacitor CV may be disposed between the first virtual electrode VM1 and the second virtual electrode VM2. The capacitance of the capacitor CV may be designed to be equal to that of the first sensing electrode TE1 (see FIG. 1 ). Figure 5 ) and the second sensing electrode TE2 (see Figure 5) have substantially the same capacitance.

[0157] In various embodiments, each of the first virtual electrode VM1 and the second virtual electrode VM2 may have a single-layer structure or a multi-layer structure stacked in the third direction DR3. Each of the first virtual electrode VM1 and the second virtual electrode VM2 may be referred to as a conductive layer.

[0158] In various embodiments, the conductive layer having a single-layer structure may include a metal layer or a transparent conductive layer, wherein the metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof, and the transparent conductive layer may include a transparent conductive oxide (such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as poly (3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, graphene, and the like.

[0159] In various embodiments, the conductive layer having a multi-layer structure may include a metal layer. The metal layer may have a three-layer structure of titanium / aluminum / titanium. The conductive layer having a multi-layer structure may include at least one metal layer and at least one transparent conductive layer.

[0160] At least one of the first insulating layer VL1 and the second insulating layer VL2 may include an inorganic layer. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0161] At least one of the first insulating layer VL1 and the second insulating layer VL2 may include an organic layer. The organic layer may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin. The plurality of virtual electrodes VM may be electromagnetically shielded by the first insulating layer VL1 and the second insulating layer VL2 so that external environmental noise is not introduced.

[0162] Fig. 8A According to the embodiment of the invention Fig. 6A An exploded perspective view of area AA'.

[0163] Reference Fig. 6A and Fig. 8A , the display signal line L1 and the sensor signal line L2 may be disposed on the flexible circuit board CF. For example, the sensor signal line L2 may be disposed on the flexible circuit board CF, and the display signal line L1 may be disposed on the sensor signal line L2. The display signal line L1 and the sensor signal line L2 may be spaced apart from each other in the third direction DR3.

[0164] The display signal line L1 and the sensor signal line L2 may cross and overlap each other when viewed in a plan view. A predetermined interference capacitor CC may be provided between the display signal line L1 and the sensor signal line L2.

[0165] In various embodiments, a separate layer for shielding an electromagnetic field may not be provided between the display signal line L1 and the sensor signal line L2. As a result, the number of layers provided on the flexible circuit board CF may be reduced, and thus, the thickness of the flexible circuit board CF may be reduced. In addition, the degree of freedom may be increased when designing the layers provided on the flexible circuit board CF. Therefore, an electronic device 1000 having improved reliability may be provided (see Figure 1 ).

[0166] Figure 8B According to the embodiment of the invention Fig. 6A An exploded perspective view of area AA'.

[0167] Reference Fig. 6A and Figure 8B , the display signal line L1-1, the sensor signal line L2-1 and the ground layer GND may be arranged on the flexible circuit board CF. For example, the sensor signal line L2-1 may be arranged on the flexible circuit board CF, the ground layer GND may be arranged on the sensor signal line L2-1, and the display signal line L1-1 may be arranged on the ground layer GND. The display signal line L1-1 and the sensor signal line L2-1 may be spaced apart from each other in the third direction DR3, and the ground layer GND is between the display signal line L1-1 and the sensor signal line L2-1.

[0168] In various embodiments, the ground layer GND may be disposed between the display signal line L1-1 and the sensor signal line L2-1, wherein the ground layer GND may separate the display signal line L1-1 from the sensor signal line L2-1. The ground layer GND may be configured to minimize electrical interference between the display signal line L1-1 and the sensor signal line L2-1. The ground layer GND may have a mesh structure for impedance matching of the display signal line L1-1. However, the shape of the ground layer GND is not limited thereto. For example, the ground layer GND may be configured as a solid plate, or the ground layer GND may be configured as a plurality of parts.

[0169] When viewed in a plan view, the display signal line L1-1 and the sensor signal line L2-1 may cross and overlap each other. A predetermined interference capacitor CC-1 may be provided between the display signal line L1-1 and the sensor signal line L2-1.

[0170] Fig. 9 is a circuit diagram illustrating an electrical connection relationship among a sensor layer, a display signal line, and a sensor signal line according to an embodiment of the inventive concept.

[0171] Reference Figure 4 , Fig. 6A and Fig. 9 , the first sensing line TL1 may have a first sensing resistor Ra. A touch signal TS may be provided to the first sensing line TL1.

[0172] In various embodiments, the parasitic capacitor Cb may be included in the first sensing electrode TE1 (see Figure 5 ) between the first sensing portion SP1 and the second electrode CE and the first parasitic capacitor Cb-1 between the second sensing electrode TE2 (see Figure 5 ) and the second parasitic capacitor Cb-2 between the second sensing part SP2 and the second electrode CE.

[0173] In various embodiments, a capacitance change of the mutual capacitor Cm electrically connected between the first sensing part SP1 and the second sensing part SP2 may occur at a corresponding point according to the external input TC. The sensing capacitor Ct may be electrically connected between the external input TC and the sensing electrode SP (e.g., SP2) according to the external input TC. The sensing capacitor Ct may include a first sensing capacitor disposed between the external input TC and the first sensing part SP1 and a second sensing capacitor disposed between the external input TC and the second sensing part SP2.

[0174] In various embodiments, the second sensing line TL2 may have a second sensing resistor Rb. A reception signal MS may be provided to the second sensing line TL2.

[0175] When an input is received from the outside, a component caused by the capacitance of each of the first sensing capacitor and the second sensing capacitor may be provided to the reception signal MS.

[0176] In various embodiments, the display signal line L1 may have a first resistor R1 and a second resistor R2. A data signal DATA may be provided to the display signal line L1.

[0177] In various embodiments, the sensor signal line L2 may have a third resistor Rc. A touch signal RS may be provided to the sensor signal line L2.

[0178] In various embodiments, the interference capacitor CC may be disposed between the display signal line L1 and the sensor signal line L2 .

[0179] Fig. 10A is a view illustrating an operation of a sensor driving part according to an embodiment of the inventive concept.

[0180] Reference Fig. 6A , Fig. 9 and Fig. 10AThe sensor driving part 200C may include a signal receiver 200C1, a converter 200C2 and a signal processor 200C3.

[0181] In various embodiments, the signal receiver 200C1 may include a first signal receiver SRV1 and a second signal receiver SRV2.

[0182] In various embodiments, the first signal receiver SRV1 may include a first operational amplifier AMP1 and a first capacitor CF1. The sensor signal line L2 may be connected to the first input terminal IN1 of the first operational amplifier AMP1 so that the touch signal RS is received by the first operational amplifier AMP1, and the touch signal RS may be an inverting input. The touch signal RS may be applied to the first input terminal IN1 of the first signal receiver SRV1. A reference signal Vref operating at a constant period may be input to the second input terminal IN2 of the first operational amplifier AMP1, and the reference signal Vref may be a non-inverting input. The first capacitor CF1 may be connected between the first input terminal IN1 of the first operational amplifier AMP1 and the output terminal Out of the first operational amplifier AMP1. The gain of the first operational amplifier AMP1 may correspond to the capacitance of the first capacitor CF1. The first capacitor CF1 may accumulate the voltage applied through the sensor signal line L2.

[0183] In various embodiments, the second signal receiver SRV2 may include a second operational amplifier AMP2 and a second capacitor CF2. The first noise signal NS1 may be received by the first input terminal IN1 of the second operational amplifier AMP2, and the first noise signal NS1 may be an inverting input. The first noise signal NS1 may be applied to the first input terminal IN1 of the second signal receiver SRV2. A reference signal Vref operating at a constant period may be input to the second input terminal IN2 of the second operational amplifier AMP2. The second capacitor CF2 may be connected between the first input terminal IN1 of the second operational amplifier AMP2 and the output terminal Out of the second operational amplifier AMP2. The gain of the second operational amplifier AMP2 may correspond to the capacitance of the second capacitor CF2. The second capacitor CF2 may accumulate a voltage corresponding to the applied first noise signal NS1.

[0184] In various embodiments, the converter 200C2 may include an analog-to-digital converter (ADC). The converter 200C2 may include a first converter ADC1 and a second converter ADC2. The converter 200C2 may convert an input analog signal into a digital signal. The first converter ADC1 may convert an analog signal corresponding to the touch signal RS into a digital touch signal DRS. The second converter ADC2 may convert an analog signal corresponding to the first noise signal NS1 into a digital noise signal DNS. The sensor driving unit 200C may be configured to differentiate an average value of a plurality of digital noise signals DNS from a digital touch signal DRS of the touch signal RS (e.g., subtract an average value of a plurality of digital noise signals DNS from a digital touch signal DRS of the touch signal RS).

[0185] In various embodiments, the signal processor 200C3 may perform signal processing on the conversion signal (digital signal) from the converter 200C2 and detect the external input according to the signal processing result. The signal processor 200C3 may differentiate the digital touch signal DRS and the digital noise signal DNS to output the noise reduction signal FS. For example, the signal processor 200C3 may perform signal processing on the conversion signal (digital signal) from the plurality of sensing electrodes SP (see Figure 5 ) The signal input through the signal receiver 200C1 and the converter 200C2 is comprehensively analyzed to detect the touch input. According to an embodiment, the signal processor 200C3 may be implemented as a microprocessor (MPU) or a microcontroller (MCU). The electronic device 1000 (see Figure 1 ) The external input can be determined based on the noise reduction signal FS.

[0186] When the noise is measured using the noise line provided on the flexible circuit board CF without the dummy sensor part VSP, the noise is measured from the sensor layer 200 (see Figure 5 ) of a plurality of sensing electrodes SP (see Figure 5 ) The amplitude difference and phase difference between the touch signal measured and the noise signal may increase, so correction is required, and when using a plurality of sensing electrodes SP (see Figure 5 ) When measuring noise with a dummy electrode disposed adjacent to the dummy electrode, a capacitance change caused by a touch operation on the dummy electrode may also be measured, and the touch signal may be mistaken for a noise signal and removed. However, according to the inventive concept, the electronic device 1000 (see Figure 1 ) may include a virtual sensor part VSP disposed on the flexible circuit board CF. The sensor driving part 200C may receive the first noise signal NS1 received from the virtual sensor part VSP and the first noise signal NS2 received from the sensor layer 200 (see Figure 5) receives the touch signal RS and performs differentiation. Therefore, the sensor driving unit 200C can obtain the noise reduction signal FS in which only the noise signal is subtracted. Therefore, the electronic device 1000 (refer to Figure 1 ).

[0187] In various embodiments, the first noise signal NS1 may be subtracted from the touch signal RS to remove noise, wherein a separate layer for shielding an electromagnetic field may not be provided between the display signal line L1 and the sensor signal line L2. As a result, the number and surface area of ​​the layers provided on the flexible circuit board CF may be reduced. In addition, the degree of freedom may be increased when designing the layers provided on the flexible circuit board CF. Therefore, an electronic device 1000 having improved reliability may be provided (see Figure 1 ).

[0188] Fig. 10B is a view showing the operation of a sensor driving part according to an embodiment of the inventive concept. Fig. 10B In the description of Fig. 10A The same components as described above are described, and their description is omitted.

[0189] Reference Fig. 6A , Fig. 9 and Fig. 10B The sensor driving part 200C-1 may include a signal receiver 200C1-1, a converter 200C2 and a signal processor 200C3.

[0190] In various embodiments, the signal receiver 200C1 - 1 may include a third operational amplifier AMP3 , a third capacitor CF3 , and a fourth capacitor CF4 .

[0191] In various embodiments, the sensor signal line L2 may be connected to the first input terminal IN1 of the third operational amplifier AMP3, so the touch signal RS is received by the third operational amplifier AMP3. The touch signal RS may be received by the first input terminal IN1 of the signal receiver 200C1-1, and the touch signal RS may be an inverting input.

[0192] In various embodiments, the first noise signal NS1 may be applied to the second input terminal IN2 of the third operational amplifier AMP3, and the first noise signal NS1 may be a non-inverting input. The first noise signal NS1 may be applied to the second input terminal IN2 of the signal receiver 200C1-1.

[0193] In various embodiments, the third capacitor CF3 may be connected between the first input terminal IN1 of the third operational amplifier AMP3 and the output terminal Out of the third operational amplifier AMP3. The third capacitor CF3 may accumulate a voltage applied through the sensor signal line L2.

[0194] In various embodiments, the fourth capacitor CF4 may be connected between the second input terminal IN2 of the third operational amplifier AMP3 and the output terminal Out of the third operational amplifier AMP3. The fourth capacitor CF4 may accumulate a voltage corresponding to the applied first noise signal NS1.

[0195] In various embodiments, the third operational amplifier AMP3 may generate an analog signal that is a difference between the applied touch signal RS and the first noise signal NS1. As a result, the analog signal provided to the converter 200C2 may be the touch signal RS from which noise has been removed.

[0196] In various embodiments, the converter 200C2 may convert the analog signal into a digital signal. The signal processor 200C3 may receive and process the digital signal from the output terminal Out of the third operational amplifier AMP3. The digital signal may be the noise reduction signal FS-1. The electronic device 1000 (see Figure 1 ) The external input may be determined based on the noise reduction signal FS-1.

[0197] In various embodiments, the electronic device 1000 (see Figure 1 ) may include a virtual sensor part VSP disposed on the flexible circuit board CF. The sensor driving part 200C-1 may detect the first noise signal NS1 received from the virtual sensor part VSP and the first noise signal NS2 received from the sensor layer 200 (see Figure 5 ) receives a touch signal RS that is differentially received (eg, from the sensor layer 200 (see Figure 5 ) subtracts the first noise signal NS1 received from the virtual sensor part VSP from the touch signal RS received by the sensor driving part 200C-1. Therefore, the sensor driving part 200C-1 can obtain the noise reduction signal FS-1 from which the noise signal has been subtracted. Therefore, the electronic device 1000 with improved sensing reliability can be provided (see Figure 1 ).

[0198] In various embodiments, the first noise signal NS1 may be subtracted from the touch signal RS to remove noise, wherein a separate layer for shielding an electromagnetic field may not be provided between the display signal line L1 and the sensor signal line L2. As a result, the number and surface area of ​​the layers provided on the flexible circuit board CF may be reduced. In addition, the degree of freedom may be increased when designing the layers provided on the flexible circuit board CF. Therefore, an electronic device 1000 having improved reliability may be provided (see Figure 1 ).

[0199] Fig.11 is a conceptual diagram for explaining operations of a sensor layer and an RC circuit according to an embodiment of the inventive concept.

[0200] Reference Figure 5 , Fig. 6A and Fig.11 , the sensor layer 200 , the first RC circuit RC1 , and the sensor driving part 200C may be driven in units of a sensing frame SFR.

[0201] In various embodiments, the sensing frame SFR may include a first section SS1, a second section SS2, and a third section SS3. The sensor layer 200 and the sensor driving part 200C may be sequentially driven in the first section SS1, the second section SS2, and the third section SS3.

[0202] In the first and second sections SS1 and SS2 , the sensor driving part 200C may receive the touch signal RS in a self-touch method. The self-touch method may refer to a method in which a plurality of first sensing electrodes TE1 and a plurality of second sensing electrodes TE2 are integrated into one electrode to sense an external input.

[0203] In the third section SS3 , the sensor driving part 200C may receive the touch signal RS in a mutual touch method. The mutual touch method may refer to a method in which a plurality of first sensing electrodes TE1 and a plurality of second sensing electrodes TE2 are capacitively coupled to sense an external input.

[0204] The 1-1 sampling section ST1-1 may be synchronized with the first section SS1. The first RC circuit RC1 may control the size of the first noise signal NS1 in the 1-1 sampling section ST1-1 corresponding to the first section SS1 during the sensing frame SFR. Here, the first RC circuit RC1 may control the size of the first noise signal NS1 to be similar to the size of the touch signal RS received in the first section SS1. The 1-1 sampling section ST1-1 may be smaller than the first section SS1.

[0205] The 1-2 sampling section ST1-2 may be synchronized with the second section SS2. The first RC circuit RC1 may control the size of the first noise signal NS1 in the 1-2 sampling section ST1-2 corresponding to the second section SS2 during the sensing frame SFR. Here, the first RC circuit RC1 may control the size of the first noise signal NS1 to be similar to the size of the touch signal RS received in the second section SS2. The 1-2 sampling section ST1-2 may be smaller than the second section SS2.

[0206] In various embodiments, the 1-3 sampling section ST1-3 may be synchronized with the third section SS3. The first RC circuit RC1 may control the size of the first noise signal NS1 in the 1-3 sampling section ST1-3 corresponding to the third section SS3 during the sensing frame SFR. The first RC circuit RC1 may control the size of the first noise signal NS1 to be similar to the size of the touch signal RS received in the third section SS3. The 1-3 sampling section ST1-3 may be smaller than the third section SS3.

[0207] Since the first RC circuit RC1 may control the size of the first noise signal NS1, the first noise signal NS1 may have a plurality of noise values ​​respectively corresponding to the plurality of channels CH.

[0208] Reference Figure 5 , Figure 6B and Fig.11 , the sensor layer 200 , the first RC circuit RC1 - 1 , and the sensor driving part 200C may be driven in units of a sensing frame SFR.

[0209] In various embodiments, the third section SS3 may include a 3-1 section SS3-1, a 3-2 section SS3-2, and a 3-3 section SS3-3. A signal corresponding to the first area AR1 may be received in the 3-1 section SS3-1. A signal corresponding to the second area AR2 may be received in the 3-2 section SS3-2. A signal corresponding to the third area AR3 may be received in the 3-3 section SS3-3.

[0210] In various embodiments, the first RC circuit RC1-1 may control the size of the first noise signal NS1 in the 2-1st sampling section ST2-1 corresponding to the 3-1st section SS3-1 during the sensing frame SFR. Here, the first RC circuit RC1-1 may control the size of the first noise signal NS1 to be similar to the size of the touch signal RS received in the first area AR1 of the third section SS3.

[0211] In various embodiments, the first RC circuit RC1-1 may control the size of the first noise signal NS1 in the 2-2 sampling section ST2-2 corresponding to the 3-2 section SS3-2 during the sensing frame SFR. The first RC circuit RC1-1 may control the size of the first noise signal NS1 to be similar to the size of the touch signal RS received in the second area AR2 of the third section SS3.

[0212] In various embodiments, the first RC circuit RC1-1 may control the size of the first noise signal NS1 in the 2-3 sampling section ST2-3 corresponding to the 3-3 section SS3-3 during the sensing frame SFR. The first RC circuit RC1-1 may control the size of the first noise signal NS1 to be similar to the size of the touch signal RS received in the third area AR3 of the third section SS3.

[0213] Since the first RC circuit RC1 - 1 controls the size of the first noise signal NS1 , the first noise signal NS1 may have a plurality of noise values ​​respectively corresponding to the plurality of channels CH.

[0214] exist Fig.11 , although only the operation of the first RC circuit RC1 - 1 in the third section SS3 is illustrated, the first RC circuit RC1 - 1 may similarly operate in the first section SS1 and the second section SS2 .

[0215] FIG. 12A to FIG. 12F is a view for explaining a digital touch signal, a digital noise signal, and a noise reduction signal according to an embodiment of the inventive concept.

[0216] Reference Figure 7 , Fig. 10A , Fig.11 as well as FIG. 12A to FIG. 12F , the first noise signal NS1 may include a plurality of channels CH (see Figure 5 ) corresponding to multiple noise values. The converter 200C2 can convert the input analog signal into a digital signal. The converter 200C2 can digitally convert the multiple noise values ​​into digital noise signals DNS1-1, DNS1-2, DNS1-3 and DNS1-4.

[0217] In various embodiments, the signal processor 200C3 may receive the digital touch signal DRS and the digital noise signals DNS1 - 1 , DNS1 - 2 , DNS1 - 3 , and DNS1 - 4 to calculate the noise reduction signals FSa and FSb.

[0218] In various embodiments, the digital noise signals DNS1-1, DNS1-2, DNS1-3, and DNS1-4 may include a first digital noise signal DNS1-1, a second digital noise signal DNS1-2, a third digital noise signal DNS1-3, and a fourth digital noise signal DNS1-4.

[0219] In various embodiments, the digital touch group DRG may include multiple channels CH (see Figure 5) in each corresponding digital touch signal DRS. Reference numerals R1 to R7 may indicate seven first sensing electrodes among the plurality of first sensing electrodes TE1, and reference numerals T1 to T5 may indicate five second sensing electrodes among the plurality of second sensing electrodes TE2. FIG. 12A to FIG. 12F Only 35 channels CH are shown (see Figure 5 ), but according to the embodiment of the inventive concept, the channel CH (see Figure 5 ) is not limited to this number.

[0220] In various embodiments, the digital touch signal DRS may be a touch signal that is transmitted through a plurality of channels CH (see Figure 5 ) is a signal obtained by converting a plurality of analog touch signals RS corresponding to the touch signal RS into a digital signal, wherein the digital touch signal DRS may be a digital signal generated from the analog touch signal RS. The digital touch signal DRS may have a predetermined signal-to-noise ratio (SNR), wherein, for example, the signal-to-noise ratio (SNR) of the digital touch signal DRS may be about 20 dB.

[0221] As an example, Fig. 12A The user's body 2000 (see Figure 2 ) is applied to the coordinates corresponding to T3 and R4. Here, the digital touch signal DRS may have a value of about 111, which may be greater than the value detected at the surrounding coordinates. As the distance from the coordinates corresponding to T3 and R4 increases, the digital touch signal DRS may have a lower value.

[0222] In various embodiments, the first digital noise group DNG1-1 may correspond to the digital touch group DRG. The first digital noise group DNG1-1 may include a plurality of channels CH (see Figure 5 The sensor driving unit 200C may digitally convert the plurality of noise values ​​into digital noise signals DNS1-1, DNS1-2, DNS1-3 and DNS1-4.

[0223] In various embodiments, the sensor driving unit 200C may differentiate the digital touch signal DRS and the first digital noise signal DNS1-1, wherein the sensor driving unit 200C may differentiate the average value of the plurality of digital noise signals (i.e., the first digital noise signal DNS1-1) from the digital touch signal DRS of the touch signal RS (e.g., subtract the average value of the plurality of digital noise signals (i.e., the first digital noise signal DNS1-1) from the digital touch signal DRS of the touch signal RS). As a result, the sensor driving unit 200C may output noise reduction signals FSa and FSb in which at least a portion of the noise is removed from the touch signal RS.

[0224] In the noise reduction signal group FSG corresponding to the digital touch group DRG, the noise reduction signals FSa and FSb may include a first noise reduction signal FSa and a second noise reduction signal FSb. The first noise reduction signal FSa may be a signal measured at a portion where a touch is applied, and the first noise reduction signal FSa may correspond to a digital touch signal DRS having coordinates corresponding to T3 and R4. The second noise reduction signal FSb may be defined as a signal measured at a position where a touch has not been applied. The portion corresponding to the second noise reduction signal FSb in the digital touch group DRG may be measured to be approximately 12, but the second noise reduction signal FSb in the noise reduction signal group FSG may be measured to be approximately 0. That is, it can be seen that the signal corresponding to the noise has been removed from the noise reduction signal group FSG.

[0225] In various embodiments, each of the noise reduction signals FSa and FSb may have a signal-to-noise ratio (SNR) greater than that of the digital touch signal DRS, wherein, for example, the signal-to-noise ratio (SNR) of each of the noise reduction signals FSa and FSb may be approximately 40 dB. Thus, an electronic device 1000 having improved sensing reliability may be provided (see Figure 1 ).

[0226] In various embodiments, the first digital noise group DNG1-1 may correspond to the digital touch group DRG. The second digital noise group DNG1-2 may include a plurality of channels CH (see Figure 5 The sensor driving unit 200C may digitally convert the plurality of noise values ​​into the second digital noise signal DNS1-2.

[0227] In various embodiments, the sensor driving unit 200C may differentiate the digital touch signal DRS and the second digital noise signal DNS1-2, wherein the sensor driving unit 200C may differentiate the average value of the noise values ​​arranged in the second direction DR2 among the plurality of noise values ​​from the touch signal RS (e.g., subtract the average value of the noise values ​​arranged in the second direction DR2 among the plurality of noise values ​​from the touch signal RS). As a result, the sensor driving unit 200C may output noise reduction signals FSa and FSb in which noise is at least partially removed from the touch signal RS.

[0228] In various embodiments, the third digital noise group DNG1-3 may correspond to the digital touch group DRG. The third digital noise group DNG1-3 may include a plurality of channels CH (see Figure 5The sensor driving unit 200C may digitally convert the plurality of noise values ​​into the third digital noise signal DNS1-3.

[0229] In various embodiments, the sensor driving unit 200C may differentiate the third digital noise signal DNS1-3 from the digital touch signal DRS. The sensor driving unit 200C may differentiate the average value of the noise values ​​arranged in the first direction DR1 among the plurality of noise values ​​from the touch signal RS (e.g., subtract the average value of the noise values ​​arranged in the first direction DR1 among the plurality of noise values ​​from the touch signal RS). As a result, the sensor driving unit 200C may output noise reduction signals FSa and FSb in which noise is removed from the touch signal RS.

[0230] In various embodiments, the fourth digital noise group DNG1-4 may correspond to the digital touch group DRG. The fourth digital noise group DNG1-4 may include a plurality of channels CH (see Figure 5 ) each corresponding fourth digital noise signal DNS1-4. The sensor driving section 200C may digitally convert the plurality of noise values ​​into fourth digital noise signals DNS1-4.

[0231] In various embodiments, the sensor driving unit 200C may differentiate the digital touch signal DRS and the fourth digital noise signals DNS1-4. That is, the sensor driving unit 200C may differentiate the plurality of fourth digital noise signals DNS1-4 from the digital touch signal DRS of the touch signal RS (e.g., subtract the plurality of fourth digital noise signals DNS1-4 from the digital touch signal DRS of the touch signal RS). As a result, the sensor driving unit 200C may output noise reduction signals FSa and FSb in which noise is removed from the touch signal RS.

[0232] In various embodiments, the data signal DATA (see Fig. 9 ) may be interfered with by the capacitor CC (see Fig. 9 ) interferes with the touch signal RS. The data signal DATA (see Fig. 9 ) may affect the interpretation of the touch signal RS; however, the sensor driving unit 200C can obtain the noise reduction signal FS by differentiating the touch signal RS and the first noise signal NS1. The noise reduction signal FS may have a greater signal-to-noise ratio (SNR) than that of the digital touch signal DRS. As a result, the electronic device 1000 (see Figure 1 ) touch sensitivity. Therefore, it is possible to provide an electronic device 1000 with improved sensing reliability (see Figure 1 ).

[0233] Fig.13 1 is a view for explaining the operation of a sensor layer, a flexible circuit board, and a sensor driving part according to an embodiment of the inventive concept. Fig.13 In the description of Figure 5 and Fig. 6A The same components as described above are described, and their description is omitted.

[0234] Reference Figure 5 , Fig. 6A and Fig.13 , electronic device 1000 (see Figure 1 ) may include a sensor layer 200, a flexible circuit board CF, a sensor driving part 200C, a first virtual sensor part VSP1, a first RC circuit RC1, a second RC circuit RC2, a display signal line L1, a sensor signal line L2, a virtual sensor signal line L3 and an RC line RCW.

[0235] In various embodiments, the sensor layer 200 may include an active area AR and a peripheral area NAR. The sensor layer 200 may include a sensing electrode SP. The sensing electrode SP may be provided in the active area AR, and the sensing electrode SP may be provided in plural.

[0236] In various embodiments, the plurality of sensing electrodes SP may transmit the touch signal TS ( Fig. 9 The sensor driving unit 200C may receive a touch signal TS from the plurality of sensing electrodes SP (see Fig. 9 ).

[0237] In various embodiments, the first virtual sensor part VSP1 may include a plurality of virtual electrodes VM (see Figure 7 ). Multiple virtual electrodes VM (see Figure 7 ) may be electrically connected to the RC line RCW and the first RC circuit RC1. The RC line RCW and the first RC circuit RC1 may be electrically connected to the sensor driving part 200C. That is, the RC line RCW and the first RC circuit RC1 may be connected between the sensor driving part 200C and the first virtual sensor part VSP1. The RC line RCW may be provided in the peripheral area NAR of the sensor layer 200. The first RC circuit RC1 may be omitted or simplified.

[0238] In various embodiments, multiple virtual electrodes VM (see Figure 7) may be electrically connected to the RC line RCW and the second RC circuit RC2. The RC line RCW and the second RC circuit RC2 may be electrically connected to the sensor driving part 200C. That is, the RC line RCW and the second RC circuit RC2 may be connected between the sensor driving part 200C and the first virtual sensor part VSP1. The second RC circuit RC2 may be omitted or simplified.

[0239] In various embodiments, the first virtual sensor portion VSP1 may convert the first noise signal NS1 (see Fig. 10A ) is transmitted to the sensor driving unit 200C.

[0240] In various embodiments, the RC line RCW may have a meander shape to control the first noise signal NS1 (see Fig. 10A ) size. For example, the RC line RCW can be the first noise signal NS1 (see Fig. 10A ) is controlled to be similar to the touch signal TS (see Fig. 9 ) size.

[0241] In various embodiments, the electronic device 1000 (see Figure 1 ) may include a first virtual sensor part VSP1 disposed on the flexible circuit board CF. The sensor driving part 200C may receive a first noise signal NS1 (see Fig. 10A ) and the touch signal RS received from the sensor layer 200 (see Fig. 10A ) is differentiated. Therefore, the sensor driving unit 200C can obtain a noise reduction signal FS from which only the noise signal is subtracted (see Fig. 10A ). Therefore, it is possible to provide an electronic device 1000 having improved sensing reliability (see Figure 1 ).

[0242] Fig.14 1 is a view for explaining the operation of a sensor layer, a flexible circuit board, and a sensor driving part according to an embodiment of the inventive concept. Fig.14 In the description of Figure 5 , Fig. 6A and Fig.13 The same components as described above are described, and their description is omitted.

[0243] Reference Figure 5 , Fig. 6A , Fig.13 and Fig.14 , electronic device 1000 (see Figure 1) may include a sensor layer 200, a flexible circuit board CF, a sensor driving part 200C, a first virtual sensor part VSP1-1, a first RC circuit RC1, a second RC circuit RC2, a display signal line L1, a sensor signal line L2, a virtual sensor signal line L3 and an RC line RCW.

[0244] In various embodiments, the first virtual sensor part VSP1-1 may include a plurality of virtual electrodes VM (see Figure 7 ). The first virtual sensor part VSP1-1 may be disposed in the peripheral area NAR of the sensor layer 200. When viewed in a plan view, the first virtual sensor part VSP1-1 may overlap the peripheral area NAR.

[0245] In various embodiments, the first virtual sensor unit VSP1-1 may generate the first noise signal NS1 (see Fig. 10A ) is transmitted to the sensor driving unit 200C.

[0246] In various embodiments, the electronic device 1000 (see Figure 1 ) may include a first virtual sensor part VSP1-1 disposed in the peripheral region NAR of the sensor layer 200. The sensor driving part 200C may receive a first noise signal NS1 (see Fig. 10A ) and the touch signal RS received from the sensor layer 200 (see Fig. 10A ) is differentiated. Therefore, the sensor driving unit 200C can obtain a noise reduction signal FS from which only the noise signal is subtracted (see Fig. 10A ). Therefore, it is possible to provide an electronic device 1000 having improved sensing reliability (see Figure 1 ).

[0247] Fig.15 is a perspective view for explaining the operation of a sensor layer, a flexible circuit board, and a sensor driving part according to an embodiment of the inventive concept. Fig.15 In the description of Figure 5 and 6A The same components as described above are described, and their description is omitted.

[0248] Reference Figure 5 , Fig. 6A and Fig.15 , electronic device 1000 (see Figure 1) may include a sensor layer 200, a flexible circuit board CF, a sensor driving part 200C, a first virtual sensor part VSP1, a second virtual sensor part VSP2, a 1st-a RC circuit RC1a, a 2nd-a RC circuit RC2a, a 1st-b RC circuit RC1b, a 2nd-b RC circuit RC2b, a first display signal line L1a, a second display signal line L1b, a sensor signal line L2 and a virtual sensor signal line L3.

[0249] In various embodiments, the plurality of sensing electrodes SP may transmit touch signals TS through the sensor signal lines L2 (see Fig. 9 The sensor driving unit 200C may receive a touch signal TS from the plurality of sensing electrodes SP (see Fig. 9 ).

[0250] In various embodiments, the first display signal line L1a may be electrically connected to the display layer 100 (see Figure 2 ) with controller 1000C (see Figure 2 ). For example, the first display signal line L1a may be connected to a plurality of display pads P1 and P2 (see Fig. 6A ) with connector CNT (see Fig. 6A ). The first display signal line L1a can send and receive a data signal DATA (see Fig. 9 ). The first display signal line L1a may be disposed on the flexible circuit board CF.

[0251] In various embodiments, the second display signal line L1b may be electrically connected to the display layer 100 (see Figure 2 ) with controller 1000C (see Figure 2 ). For example, the second display signal line L1b may be connected to a plurality of display pads P1 and P2 (see Fig. 6A ) with connector CNT (see Fig. 6A ). The second display signal line L1b can send and receive the data signal DATA (see Fig. 9 ). The second display signal line L1b may be disposed on the flexible circuit board CF.

[0252] When viewed in a plan view, the sensor signal line L2 may cross the first display signal line L1a and the second display signal line L1b, and the touch signal TS (see Fig. 9 ) can include noise.

[0253] In various embodiments, the first virtual sensor part VSP1 may include a plurality of virtual electrodes VM (see Figure 7 ). The first virtual sensor part VSP1 may be disposed on the flexible circuit board CF.

[0254] In various embodiments, multiple virtual electrodes VM (see Figure 7 ) may be electrically connected to the 1-a RC circuit RC1a. The 1-a RC circuit RC1a may be electrically connected to the sensor driving unit 200C.

[0255] In various embodiments, multiple virtual electrodes VM (see Figure 7 ) can be electrically connected to the 2nd-a RC circuit RC2a. The 2nd-a RC circuit RC2a can be electrically connected to the sensor driving unit 200C.

[0256] In various embodiments, the first virtual sensor part VSP1 may transmit the first noise signal NS1 to the sensor driving part 200C. That is, the sensor driving part 200C may transmit the first noise signal NS1 to the sensor driving part 200C from the plurality of virtual electrodes VM (see Figure 7 ) receives a first noise signal NS1.

[0257] In various embodiments, each of the 1-a RC circuit RC1a and the 2-a RC circuit RC2a may include passive elements.

[0258] In various embodiments, the 1-aRC circuit RC1a and the 2-aRC circuit RC2a may control the magnitude of the first noise signal NS1. For example, the 1-aRC circuit RC1a and the 2-aRC circuit RC2a may control the magnitude of the first noise signal NS1 to be similar to the touch signal TS (see Fig. 9 ) size.

[0259] In various embodiments, the second virtual sensor part VSP2 may include a plurality of virtual electrodes VM (see Figure 7 ). The second virtual sensor part VSP2 may be disposed on the flexible circuit board CF.

[0260] In various embodiments, multiple virtual electrodes VM (see Figure 7 ) may be electrically connected to the 1-b RC circuit RC1b. The 1-b RC circuit RC1b may be electrically connected to the sensor driving unit 200C.

[0261] In various embodiments, multiple virtual electrodes VM (see Figure 7 ) may be electrically connected to the 2-b RC circuit RC2b. The 2-b RC circuit RC2b may be electrically connected to the sensor driving unit 200C.

[0262] In various embodiments, the second virtual sensor part VSP2 may transmit the second noise signal NS2 to the sensor driving part 200C. That is, the sensor driving part 200C may transmit the second noise signal NS2 to the sensor driving part 200C from the plurality of virtual electrodes VM (see Figure 7 ) receives a second noise signal NS2.

[0263] In various embodiments, each of the 1-b RC circuit RC1b and the 2-b RC circuit RC2b may include a passive element.

[0264] In various embodiments, the 1-b RC circuit RC1b and the 2-b RC circuit RC2b may control the magnitude of the second noise signal NS2. For example, the 1-b RC circuit RC1b and the 2-b RC circuit RC2b may control the magnitude of the second noise signal NS2 to be similar to the touch signal TS (see Fig. 9 ) size.

[0265] In various embodiments, the sensor driving unit 200C may generate a first noise signal NS1 and a second noise signal NS2 and a touch signal RS (see Fig. 9 ) is differentiated (eg, the first noise signal NS1 and the second noise signal NS2 are subtracted from the touch signal RS).

[0266] In various embodiments, the electronic device 1000 (see Figure 1 ) may include a first virtual sensor part VSP1 and a second virtual sensor part VSP2 disposed on the flexible circuit board CF. The sensor driving part 200C may detect a first noise signal NS1 received from the first virtual sensor part VSP1 and a second noise signal NS2 received from the second virtual sensor part VSP2 and a touch signal RS received from the sensor layer 200 (see Fig. 9 ) is differentiated (for example, the first noise signal NS1 received from the first virtual sensor part VSP1 and the second noise signal NS2 received from the second virtual sensor part VSP2 are subtracted from the touch signal RS received from the sensor layer 200). Therefore, the sensor driving part 200C can obtain the noise reduction signal FS from which only the noise signal is subtracted (see Fig. 10A ). Therefore, it is possible to provide an electronic device 1000 having improved sensing reliability (see Figure 1 ).

[0267] As described above, the sensor driving section may differentiate the noise signal and the touch signal measured using the virtual sensor section (e.g., subtract the noise signal measured using the virtual sensor section from the touch signal). Therefore, the sensor driving section may obtain a signal obtained by differentiating only the noise signal (e.g., subtracting only the noise signal). Therefore, an electronic device having improved sensing reliability may be provided.

[0268] It will be clear to those skilled in the art that various modifications and variations can be made in the inventive concept. Therefore, the inventive concept is intended to cover modifications and variations of the present invention as long as they fall within the scope of the attached claims and their equivalents. Therefore, the technical scope of the inventive concept should not be limited to what is described in the detailed description of the specification, but should be determined by the claims.

Claims

1. An electronic device, comprising: Display layer; A sensor layer, disposed on the display layer and comprising a plurality of sensing electrodes; a sensor driving unit, configured to drive the sensor layer; A first virtual sensor section includes a plurality of virtual electrodes; a first RC circuit electrically connected between the sensor driving unit and the first virtual sensor unit; as well as a flexible circuit board connected to the display layer, and the sensor driving unit and the first RC circuit are arranged on the flexible circuit board, The sensor driving unit is configured to receive a touch signal from the plurality of sensing electrodes and a first noise signal from the plurality of virtual electrodes. The first RC circuit is configured to control the magnitude of the first noise signal, and The sensor driving unit is configured to differentiate the touch signal and the first noise signal.

2. The electronic device according to claim 1, wherein: The plurality of virtual electrodes include a first virtual electrode and a second virtual electrode, wherein the first virtual electrode and the second virtual electrode are arranged at different layers from each other, and The first virtual electrode and the second virtual electrode are arranged on the flexible circuit board. 3 . The electronic device according to claim 1 , further comprising a second RC circuit electrically connected between the sensor driving section and the first dummy sensor section.

4. The electronic device according to claim 3, wherein: Each of the first RC circuit and the second RC circuit includes a passive element.

5. The electronic device according to claim 3, wherein: Each of the first RC circuit and the second RC circuit includes an active element, and The electronic device further includes a circuit controller configured to control the first RC circuit and the second RC circuit, wherein the circuit controller is disposed on the flexible circuit board.

6. The electronic device according to claim 1, wherein: The sensor driving unit includes a signal receiver, and the signal receiver includes a first input terminal and a second input terminal. wherein the touch signal is applied to the first input terminal of the signal receiver, and The first noise signal is applied to the second input terminal of the signal receiver.

7. The electronic device according to claim 1, wherein: The sensor driving unit includes a first signal receiver and a second signal receiver, wherein each of the first signal receiver and the second signal receiver includes a first input terminal and a second input terminal, wherein the touch signal is applied to the first input terminal of the first signal receiver, and The first noise signal is applied to the first input terminal of the second signal receiver.

8. The electronic device according to claim 1, wherein: The plurality of sensing electrodes include a plurality of first sensing electrodes and a plurality of second sensing electrodes, the plurality of second sensing electrodes being insulated from the plurality of first sensing electrodes and crossing the plurality of first sensing electrodes, Each of the plurality of first sensing electrodes extends in a first direction, Each of the plurality of second sensing electrodes extends in a second direction crossing the first direction, The plurality of first sensing electrodes and the plurality of second sensing electrodes are configured to define a plurality of channels, respectively, The first noise signal includes a plurality of noise values, the plurality of noise values ​​respectively corresponding to the plurality of channels, and The sensor driving section is configured to digitally convert the plurality of noise values ​​into a plurality of digital noise signals, respectively.

9. The electronic device according to claim 8, wherein: The sensor driving section is configured to subtract an average value of the plurality of digital noise signals from a digital signal of the touch signal.

10. The electronic device according to claim 8, wherein: The sensor driving section is configured to subtract an average value of digital noise signals arranged in the first direction among the plurality of digital noise signals from the digital signal of the touch signal.

11. The electronic device according to claim 8, wherein: The sensor driving section is configured to subtract an average value of digital noise signals arranged in the second direction among the plurality of digital noise signals from the digital signal of the touch signal.

12. The electronic device according to claim 8, wherein: The touch signal is set to be multiple, The plurality of touch signals correspond to the plurality of channels respectively, The sensor driving section is configured to respectively subtract the plurality of digital noise signals from the digital signals of the plurality of touch signals.

13. An electronic device, comprising: Display layer; A sensor layer, disposed on the display layer and comprising a plurality of sensing electrodes; a sensor driving unit, configured to drive the sensor layer; A first virtual sensor section includes a plurality of virtual electrodes; a first RC circuit electrically connected between the sensor driving unit and the first virtual sensor unit; as well as a flexible circuit board connected to the display layer, and the sensor driving unit and the first RC circuit are arranged on the flexible circuit board, The sensor driving unit is configured to receive a touch signal from the plurality of sensing electrodes and a first noise signal from the plurality of virtual electrodes. The first RC circuit is configured to control the magnitude of the first noise signal, and The sensor driving unit is configured to differentiate the touch signal and the first noise signal. The sensor layer includes an active area and a peripheral area arranged around the active area. The sensor layer is driven in units of sensing frames. The sensing frame includes a first segment, a second segment and a third segment, and The sensor driving section is configured to receive the touch signal in a self-touch method in each of the first section and the second section, and to receive the touch signal in a mutual touch method in the third section.

14. The electronic device according to claim 13, wherein: The first RC circuit is configured to operate in units of the sensing frame and includes a passive element, The first RC circuit is configured to control the magnitude of the first noise signal in a 1-1 sampling section corresponding to the first section during the sensing frame, The first RC circuit is configured to control the magnitude of the first noise signal in a 1-2 sampling section corresponding to the second section during the sensing frame, and The first RC circuit is configured to control a magnitude of the first noise signal in a 1-3 sampling section corresponding to the third section during the sensing frame.

15. The electronic device according to claim 14, wherein: The 1-1th sampling segment is smaller than the first segment, The 1-2 sampling segment is smaller than the second segment, and The 1st to 3rd sampling sections are smaller than the third section.

16. The electronic device according to claim 13, wherein: The effective area includes a first area, a second area, and a third area arranged in a second direction, The third section includes a 3-1 section for receiving a signal corresponding to the first area, a 3-2 section for receiving a signal corresponding to the second area, and a 3-3 section for receiving a signal corresponding to the third area. The first RC circuit is configured to operate in units of the sensing frame and includes an active element, The first RC circuit is configured to control the magnitude of the first noise signal in a 2-1 sampling section corresponding to the 3-1 section during the sensing frame, The first RC circuit is configured to control the magnitude of the first noise signal in a 2-2 sampling section corresponding to the 3-2 section during the sensing frame, and The first RC circuit is configured to control a magnitude of the first noise signal in a 2-3 sampling section corresponding to the 3-3 section during the sensing frame.

17. The electronic device according to claim 13, further comprising a second virtual sensor portion disposed on the flexible circuit board, in, The sensor driving section is configured to receive a second noise signal from the second virtual sensor section, and The sensor driving section is configured to subtract the first noise signal and the second noise signal from the touch signal.

18. An electronic device, comprising: Display layer; A sensor layer, disposed on the display layer and comprising a plurality of sensing electrodes; a sensor driving unit, configured to drive the sensor layer; A first virtual sensor section includes a plurality of virtual electrodes; a first RC circuit electrically connected between the sensor driving unit and the first virtual sensor unit; as well as a flexible circuit board connected to the display layer, and the sensor driving unit and the first RC circuit are arranged on the flexible circuit board, The sensor driving unit is configured to receive a touch signal from the plurality of sensing electrodes and a first noise signal from the plurality of virtual electrodes. The first RC circuit is configured to control the magnitude of the first noise signal, and The sensor driving unit is configured to differentiate the touch signal and the first noise signal. wherein the sensor layer comprises an active area and a peripheral area arranged around the active area, and The first dummy sensor section is disposed in the peripheral area.

19. The electronic device according to claim 18, further comprising an RC line configured to control the magnitude of the first noise signal and disposed on the sensor layer, in, The RC line is connected between the sensor driving section and the first dummy sensor section.

20. The electronic device according to claim 19, wherein: The sensor layer includes an active area and a peripheral area disposed around the active area, and The RC line is disposed in the peripheral region.

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