Determination method and device for defect level of electrical equipment and storage medium

Abstract

The invention discloses an electrical equipment defect grade determination method and device and a storage medium. Relates to the technical field of data processing, the technical field of electronic information and other related technical fields. The method comprises the following steps: acquiring a first target infrared image and a second target infrared image when target equipment runs; determining target equipment type information corresponding to the target equipment according to the first target infrared image and the second target infrared image; and determining the defect level of the target equipment according to a target defect threshold value corresponding to the target equipment type information, the first target infrared image and the second target infrared image. Through the method and the device, the problem of relatively low efficiency of determining the defect level of the target equipment due to the fact that the defect level of the target equipment is determined manually in related technologies is solved.

Description

Technical Field

[0001] The present application relates to the fields of data processing technology, electronic information technology and other related technical fields, and in particular to a method and device for determining a defect level of electrical equipment and a storage medium. Background Art

[0002] With the continuous expansion of the scale of the power grid and the continuous growth of power load, the safe and stable operation of substations as the core component of the power system is of vital importance. During the operation of electrical equipment, local overheating usually occurs due to current flow, poor contact, aging and other reasons. If not discovered and handled in time, it may cause equipment damage, fire and even large-scale power outages. Therefore, it is an urgent need to realize real-time and accurate temperature monitoring of electrical equipment to ensure the safe operation of substations. Infrared temperature measurement technology has been widely used in temperature monitoring of electrical equipment in substations due to its unique advantages. At present, the infrared temperature measurement process is usually manual temperature measurement and defect identification. A few substations also use intelligent inspection robots for infrared temperature measurement, but the final result requires manual judgment of whether there are abnormalities or defects. In each infrared temperature measurement result recognition process, due to manual judgment, omissions or misjudgments often occur. In addition, when there are many corresponding abnormal infrared points, the identification staff needs to compare and record them in multiple ways, which is very inefficient.

[0003] With regard to the problem that the defect level of the target device is determined manually in the related art, resulting in low efficiency in determining the defect level of the target device, no effective solution has been proposed so far. Summary of the invention

[0004] The main purpose of the present application is to provide a method and device for determining the defect level of electrical equipment, a storage medium and an electronic device, so as to solve the problem that the defect level of the target equipment is determined manually in the related art, resulting in low efficiency in determining the defect level of the target equipment.

[0005] In order to achieve the above-mentioned purpose, according to one aspect of the present application, a method for determining the defect level of electrical equipment is provided. The method comprises: obtaining a first target infrared image and a second target infrared image of a target device when it is running, wherein the first target infrared image is an infrared image of a heating part of the target device when it is running, and the second target infrared image is an infrared image of the target device when it is running; determining target device type information corresponding to the target device based on the first target infrared image and the second target infrared image; determining the defect level of the target device based on the target defect threshold corresponding to the target device type information, the first target infrared image, and the second target infrared image.

[0006] Furthermore, determining the target device type information corresponding to the target device based on the first target infrared image and the second target infrared image includes: detecting the first target infrared image through a target detection algorithm to obtain first device type information corresponding to the first target infrared image; detecting the second target infrared image through the target detection algorithm to obtain second device type information corresponding to the second target infrared image; and determining the target device type information corresponding to the target device based on the first device type information and the second device type information.

[0007] Furthermore, determining the target device type information corresponding to the target device based on the first device type information and the second device type information includes: judging whether the first device type information and the second device type information are the same, and obtaining a judgment result; if the judgment result indicates that the first device type information and the second device type information are the same, determining the first device type information or the second device type information as the target device type information; if the judgment result indicates that the first device type information and the second device type information are not the same, obtaining the third device type information input by the target object; and determining the third device type information as the target device type information corresponding to the target device.

[0008] Furthermore, determining the defect level of the target device based on the target defect threshold corresponding to the target device type information, the first target infrared image and the second target infrared image includes: obtaining the ambient temperature of the environment in which the target device is located; performing temperature recognition on the first target infrared image through a target recognition algorithm to obtain a first hotspot temperature corresponding to the heating part; performing temperature recognition on the second target infrared image through the target recognition algorithm to obtain a second hotspot temperature corresponding to the heating part and a third hotspot temperature corresponding to a part other than the heating part; determining the defect level of the target device based on the target defect threshold, the ambient temperature, the first hotspot temperature, the second hotspot temperature and the third hotspot temperature.

[0009] Further, determining the defect level of the target device based on the target defect threshold, the ambient temperature, the first hotspot temperature, the second hotspot temperature and the third hotspot temperature includes: determining the target hotspot temperature of the target device based on the first hotspot temperature and the second hotspot temperature; calculating based on the target hotspot temperature, the third hotspot temperature and the ambient temperature to obtain a target relative temperature difference of the target device; determining the defect level of the target device based on the target defect threshold, the target hotspot temperature and the target relative temperature difference.

[0010] Furthermore, after determining the defect level of the target device based on the target defect threshold corresponding to the target device type information, the first target infrared image and the second target infrared image, the method also includes: determining a target processing strategy corresponding to the target device based on the defect level; and adjusting the target device based on the target processing strategy.

[0011] Furthermore, obtaining a first target infrared image and a second target infrared image when the target device is running includes: obtaining a first initial infrared image and a second initial infrared image when the target device is running; performing image processing on the first initial infrared image and the second initial infrared image to obtain a processed first initial infrared image and a processed second initial infrared image; performing thermal imaging analysis on the processed first initial infrared image and the processed second initial infrared image to obtain the first target infrared image and the second target infrared image.

[0012] In order to achieve the above-mentioned purpose, according to another aspect of the present application, a device for determining the defect level of electrical equipment is provided. The device comprises: an acquisition unit, used to acquire a first target infrared image and a second target infrared image of a target device when it is in operation, wherein the first target infrared image is an infrared image of a heating part of the target device when it is in operation, and the second target infrared image is an infrared image of the target device when it is in operation; a first determination unit, used to determine the target device type information corresponding to the target device based on the first target infrared image and the second target infrared image; a second determination unit, used to determine the defect level of the target device based on the target defect threshold corresponding to the target device type information, the first target infrared image and the second target infrared image.

[0013] Furthermore, the first determination unit includes: a first detection module, used to detect the first target infrared image through a target detection algorithm to obtain first device type information corresponding to the first target infrared image; a second detection module, used to detect the second target infrared image through the target recognition algorithm to obtain second device type information corresponding to the second target infrared image; a first determination module, used to determine the target device type information corresponding to the target device based on the first device type information and the second device type information.

[0014] Furthermore, the first determination module includes: a judgment submodule, used to judge whether the first device type information and the second device type information are the same, and obtain a judgment result; a first determination submodule, used to determine the first device type information or the second device type information as the target device type information if the judgment result indicates that the first device type information and the second device type information are the same; an acquisition submodule, used to acquire the third device type information input by the target object if the judgment result indicates that the first device type information and the second device type information are not the same; and a second determination submodule, used to determine the third device type information as the target device type information corresponding to the target device.

[0015] Furthermore, the second determination unit includes: a first acquisition module, used to acquire the ambient temperature of the environment in which the target device is located; a first identification module, used to perform temperature identification on the first target infrared image through a target identification algorithm, and obtain a first hotspot temperature corresponding to the heating part; a second identification module, used to perform temperature identification on the second target infrared image through the target identification algorithm, and obtain a second hotspot temperature corresponding to the heating part and a third hotspot temperature corresponding to a part other than the heating part; a second determination module, used to determine the defect level of the target device based on the target defect threshold, the ambient temperature, the first hotspot temperature, the second hotspot temperature and the third hotspot temperature.

[0016] Furthermore, the second determination module includes: a third determination submodule, used to determine the target hotspot temperature of the target device based on the first hotspot temperature and the second hotspot temperature; a calculation submodule, used to calculate based on the target hotspot temperature, the third hotspot temperature and the ambient temperature to obtain the target relative temperature difference of the target device; and a fourth determination submodule, used to determine the defect level of the target device based on the target defect threshold, the target hotspot temperature and the target relative temperature difference.

[0017] Furthermore, the device also includes: a third determination unit, which is used to determine the target processing strategy corresponding to the target device based on the defect level after determining the defect level of the target device based on the target defect threshold corresponding to the target device type information, the first target infrared image and the second target infrared image; and an adjustment unit, which is used to adjust the target device based on the target processing strategy.

[0018] Furthermore, the acquisition unit includes: a second acquisition module, used to acquire a first initial infrared image and a second initial infrared image of the target device when it is running; a first processing module, used to perform image processing on the first initial infrared image and the second initial infrared image to obtain a processed first initial infrared image and a processed second initial infrared image; a second processing module, used to perform thermal imaging analysis on the processed first initial infrared image and the processed second initial infrared image to obtain the first target infrared image and the second target infrared image.

[0019] In order to achieve the above-mentioned purpose, according to one aspect of the present application, a computer-readable storage medium is provided, wherein the storage medium stores a program, wherein when the program is running, the device where the storage medium is located is controlled to execute any one of the above-mentioned methods for determining the defect level of electrical equipment.

[0020] In order to achieve the above-mentioned purpose, according to another aspect of the present application, an electronic device is also provided, the electronic device includes one or more processors and a memory, and the memory is used to store the method for determining the defect level of electrical equipment described in any one of the above-mentioned methods implemented by one or more processors.

[0021] Through this application, the following steps are adopted: obtain the first target infrared image and the second target infrared image of the target device when it is running, wherein the first target infrared image is the infrared image of the heating part of the target device when it is running, and the second target infrared image is the infrared image of the target device when it is running; determine the target device type information corresponding to the target device based on the first target infrared image and the second target infrared image; determine the defect level of the target device based on the target defect threshold corresponding to the target device type information, the first target infrared image and the second target infrared image. Through this application, the problem of determining the defect level of the target device by manual means in the related art, resulting in relatively low efficiency in determining the defect level of the target device, is solved. In this solution, the target device type information of the target device is determined by comparing the first target infrared image and the second target infrared image of the target device at different phases, and then the defect level of the target device is comprehensively determined by combining the target defect threshold corresponding to the target device type information and the two target infrared images. Through the first target infrared image and the second target infrared image of the target device at different phases, the target device type information of the target device is accurately determined. At the same time, according to the relationship between the first target infrared image, the second target infrared image and the target defect threshold, the defect level corresponding to the target device is automatically determined, avoiding the inaccuracy caused by manual identification and other problems, thereby improving the efficiency of determining the defect level of the target device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings constituting a part of the present application are used to provide a further understanding of the present application. The illustrative embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0023] Figure 1 is a flow chart of a method for determining a defect level of an electrical device provided in an embodiment of the present application;

[0024] Figure 2 is a schematic diagram of a method for determining a defect level of electrical equipment provided in an embodiment of the present application;

[0025] Figure 3 is a schematic diagram of a device for determining a defect level of electrical equipment according to an embodiment of the present application;

[0026] Figure 4 is a schematic diagram of an electronic device provided according to an embodiment of the present application. DETAILED DESCRIPTION

[0027] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0028] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0029] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0030] For the convenience of description, some nouns or terms involved in the embodiments of the present application are explained below:

[0031] Temperature rise: The difference between the surface temperature of the device under test and the surface temperature of the ambient temperature reference body.

[0032] Temperature difference: The temperature difference between different devices under test or different parts of the same device under test.

[0033] Relative temperature difference: The percentage of the temperature difference between two corresponding measuring points to the temperature rise of the hotter measuring point.

[0034] Infrared temperature measurement technology: It is a non-contact temperature measurement technology based on the principle of thermal radiation of objects. It does not require direct contact with the object being measured. It has the advantages of fast measurement speed, wide range, and no interference with equipment operation. It is particularly suitable for temperature monitoring of electrical equipment in high-voltage and high-current environments such as substations.

[0035] Equipment defects: refers to abnormal equipment quality phenomena that occur during the manufacturing, transportation, construction, installation, operation and maintenance stages of production equipment, including non-compliance with national laws and regulations, national (industry) mandatory provisions, violation of enterprise standards or "countermeasures" requirements, non-compliance with design or technical agreement requirements, failure to achieve the expected appearance or use function, and threats to personal safety, equipment safety and power grid safety. Equipment defects are divided into emergency defects, major defects, general defects and other defects according to their severity.

[0036] It should be noted that the relevant information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data for display, data for analysis, etc.) involved in this disclosure are all information and data authorized by the user or fully authorized by all parties. For example, an interface is set between this system and the relevant user or organization. Before obtaining relevant information, it is necessary to send an acquisition request to the aforementioned user or organization through the interface, and obtain relevant information after receiving the consent information fed back by the aforementioned user or organization.

[0037] The present invention is described below in conjunction with preferred implementation steps. Figure 1 is a flow chart of a method for determining a defect level of an electrical device according to an embodiment of the present application, such as Figure 1 As shown, the method comprises the following steps:

[0038] Step S101, obtaining a first target infrared image and a second target infrared image of a target device when it is running, wherein the first target infrared image is an infrared image of a heating part of the target device when it is running, and the second target infrared image is an infrared image of the target device when it is running.

[0039] Optionally, when the target device is running, an infrared camera or a thermal imager is used to capture local infrared photos of the target device in a heating state (i.e., heating phase) and infrared photos of the three-phase device (including the heating phase) to obtain a first target infrared image and a second target infrared image, respectively.

[0040] Step S102: determining target device type information corresponding to the target device according to the first target infrared image and the second target infrared image.

[0041] Optionally, a hotspot detection algorithm, a hotspot segmentation algorithm, deep learning or other network models are used to identify device type information of the target device in the first target infrared image and the second target infrared image.

[0042] It should be noted that a picture library is established in advance for each device type. After the picture is input, the parts of the components on the device are delineated. In subsequent use, the system will automatically call the picture library for judgment and identification. The more pictures input to the picture library and the more typical they are, the higher the judgment accuracy will be.

[0043] Step S103 , determining the defect level of the target device according to the target defect threshold corresponding to the target device type information, the first target infrared image, and the second target infrared image.

[0044] Optionally, the first target infrared image and the second target infrared image are comprehensively analyzed, and the analysis result is compared with the target defect threshold to determine the defect level of the target device.

[0045] In summary, the target device type information of the target device is determined by comparing the first target infrared image and the second target infrared image of the target device at different phases, and the defect level of the target device is comprehensively determined by combining the target defect threshold corresponding to the target device type information and the two target infrared images. The target device type information of the target device is accurately determined by the first target infrared image and the second target infrared image of the target device at different phases, and the defect level corresponding to the target device is automatically determined according to the relationship between the first target infrared image, the second target infrared image and the target defect threshold, avoiding the inaccuracy caused by manual identification and other problems, thereby improving the efficiency of determining the defect level of the target device.

[0046] Optionally, in the method for determining the defect level of electrical equipment provided in an embodiment of the present application, determining the target device type information corresponding to the target device based on the first target infrared image and the second target infrared image includes: detecting the first target infrared image through a target detection algorithm to obtain first device type information corresponding to the first target infrared image; detecting the second target infrared image through a target detection algorithm to obtain second device type information corresponding to the second target infrared image; and determining the target device type information corresponding to the target device based on the first device type information and the second device type information.

[0047] In an optional embodiment, a target detection algorithm such as a hotspot detection algorithm, a hotspot segmentation algorithm, deep learning or other network models is used to perform image segmentation and detection on the first target infrared image to determine the first device type information corresponding to the target device in the first target infrared image. Similarly, a target detection algorithm such as a hotspot detection algorithm or a hotspot segmentation algorithm is used to perform image segmentation and detection on the second target infrared image to determine the second device type information corresponding to the target device in the second target infrared image.

[0048] It should be noted that, taking the voltage transformer as an example: the voltage transformer can be specifically divided into: cast voltage transformer, oil-immersed voltage transformer, SF6 voltage transformer, capacitive voltage transformer, photoelectric voltage transformer, etc.

[0049] Through the target detection algorithm, the automatic detection and identification of equipment type information in infrared images can be achieved, reducing manual intervention and workload and improving efficiency.

[0050] Optionally, in the method for determining the defect level of electrical equipment provided in an embodiment of the present application, determining the target device type information corresponding to the target device based on the first device type information and the second device type information includes: judging whether the first device type information and the second device type information are the same, and obtaining a judgment result; if the judgment result indicates that the first device type information and the second device type information are the same, determining the first device type information or the second device type information as the target device type information; if the judgment result indicates that the first device type information and the second device type information are different, obtaining the third device type information input by the target object; and determining the third device type information as the target device type information corresponding to the target device.

[0051] In an optional embodiment, it is determined whether the first device type information and the second device type information are the same: if the first device type information and the second device type information are the same, it indicates that the detection results of the two infrared images are consistent, and therefore any one of the first device type information or the second device type information is determined as the target device type information; if the first device type information and the second device type information are different, it indicates that there is a deviation in the detection results of the two infrared images, and therefore the manual judgment stage is entered, and the third device type information input by the staff is determined as the target device type information corresponding to the target device.

[0052] It should be noted that, taking the insulator category in electrical equipment as an example: multiple infrared images are input into the model for detection, and the system automatically identifies the heating part of the electrical equipment as an insulator. At this time, a prompt pops up, "Are you sure it is an insulator category?" If yes, then subsequent processing will be carried out; if not, then the equipment category can be manually selected and then subsequent processing will be carried out.

[0053] Through the above steps, the device type information in the first target infrared image and the second target infrared image can be effectively determined, and the final target device type information can be determined according to different situations.

[0054] Optionally, in the method for determining the defect level of electrical equipment provided in an embodiment of the present application, determining the defect level of the target equipment based on the target defect threshold, the first target infrared image and the second target infrared image corresponding to the target equipment type information includes: obtaining the ambient temperature of the environment in which the target equipment is located; performing temperature recognition on the first target infrared image through a target recognition algorithm to obtain a first hotspot temperature corresponding to the heating part; performing temperature recognition on the second target infrared image through a target recognition algorithm to obtain a second hotspot temperature corresponding to the heating part and a third hotspot temperature corresponding to a part other than the heating part; determining the defect level of the target equipment based on the target defect threshold, the ambient temperature, the first hotspot temperature, the second hotspot temperature and the third hotspot temperature.

[0055] In an optional embodiment, first, the ambient temperature of the environment in which the target device is located is obtained by manual or automatic positioning of an infrared thermometer. Then, the first target infrared image is scanned, identified and extracted by OCR technology (i.e., target recognition algorithm) to obtain the data with the highest temperature in the first target infrared image (i.e., the first hotspot temperature); the second target infrared image is scanned, identified and extracted by OCR technology (i.e., target recognition algorithm) to obtain the data with the highest temperature (i.e., the second hotspot temperature) and the data with the lowest temperature in the second target infrared image, and the temperature at this time is set as the normal phase temperature (i.e., the third hotspot temperature). Finally, the defect level of the target device is comprehensively determined by the relationship between the target defect threshold, ambient temperature, first hotspot temperature, second hotspot temperature and third hotspot temperature.

[0056] It should be noted that the automatic positioning method of the infrared thermometer is to turn on the infrared thermometer, and then automatically obtain the ambient temperature of the target device's environment from the meteorological platform according to the positioning. The manual method is to determine the ambient temperature of the target device's environment according to the input of the staff. However, if the ambient temperature changes, the automatic positioning method of the infrared thermometer will automatically modify the ambient temperature value, while the manual method requires the staff to manually modify it again.

[0057] It should be noted that the part with the highest temperature in the infrared image is usually the brightest part of the entire image, and the element with the largest temperature value can also be found through the temperature matrix and other related algorithms.

[0058] Through the target recognition algorithm, the first hot spot temperature, the second hot spot temperature and the third hot spot temperature can be obtained quickly and accurately.

[0059] Optionally, in the method for determining the defect level of electrical equipment provided in an embodiment of the present application, determining the defect level of the target equipment based on the target defect threshold, ambient temperature, a first hotspot temperature, a second hotspot temperature and a third hotspot temperature includes: determining the target hotspot temperature of the target equipment based on the first hotspot temperature and the second hotspot temperature; calculating based on the target hotspot temperature, the third hotspot temperature and the ambient temperature to obtain a target relative temperature difference of the target equipment; determining the defect level of the target equipment based on the target defect threshold, the target hotspot temperature and the target relative temperature difference.

[0060] In an optional embodiment, the larger hotspot temperature between the first hotspot temperature and the second hotspot temperature is selected as the target hotspot temperature. If the first hotspot temperature extracted by OCR technology is 43.1°C, the second hotspot temperature extracted by OCR technology is 52.9°C, and the third hotspot temperature extracted by OCR technology is 31.1°C, then the final 52.9°C (i.e., the second hotspot temperature) is selected as the target hotspot temperature. The target relative temperature difference of the target device is calculated according to the following formula:

[0061] δ t =(τ1-τ2) / τ1×100%=(T1-T2) / (T1-T0)×100%

[0062] Among them, τ1 and T1 are the temperature rise and temperature of the heating point (i.e., the target hot spot temperature), τ2 and T2 are the temperature rise and temperature of the normal corresponding point (i.e., the third hot spot temperature), and T0 is the temperature of the ambient temperature reference body (i.e., the ambient temperature).

[0063] Finally, the target hot spot temperature, target relative temperature difference and target defect threshold are judged by the system database and the final result (ie defect level) is output.

[0064] It should be noted that Table 1 is a corresponding table of heating defect discrimination (ie defect level) of cast voltage transformer in the voltage transformer provided according to the embodiment of the present application.

[0065] Table 1 Corresponding table of heating defect identification of cast voltage transformer in voltage transformer

[0066] Defective parts Defect appearance Defect level Ontology The overall and local temperature difference is greater than 4K major Primary terminal Hot spot temperature>110℃ or relative temperature difference δ≥95% urgent Primary terminal Hot spot temperature>80℃ or relative temperature difference δ≥80% major Primary terminal Temperature difference exceeds 15K generally

[0067] As shown in Table 1, if the defective part (i.e., the heating part) is at the primary terminal, and the hot spot temperature (i.e., the target hot spot temperature) is greater than 80°C or the relative temperature difference (i.e., the target relative temperature difference) δ is greater than or equal to 80%, as long as one of the conditions is met, the defect level will be automatically determined as a major defect.

[0068] It should be noted that defect rules are the standards for automatic defect identification. The ways to input rules include but are not limited to: import, copy and inherit historical rules, manual input and modification. According to the needs of defect identification standards, the rules are composed of four parts: equipment category, defect location, defect appearance and defect level. The defect rules of the system can be directly added, deleted or modified in the system, which is convenient for correction and update during use.

[0069] It should be noted that when automatically identifying defects according to defect rules, at least two infrared images are imported, one of which is a normal image as a reference for comparison and judgment; in some cases, it can be directly judged according to the absolute temperature of the hot spot, in which case one image is sufficient for judgment. For example, in the judgment of heating defects of cast voltage transformers in the voltage transformer in Table 1, the major defect judgment rule is that the hot spot temperature is greater than 80°C or the relative temperature difference δ is greater than or equal to 80%. If the hot spot temperature is greater than 80°C and there is an obvious heating point, only one photo is needed for judgment; if it is not satisfied, multiple photos are required for comparison. To ensure that all types are adapted, it is set to input at least two infrared images, and at least one of them is a photo of three-phase equipment (including the heating phase).

[0070] The defect level of the target device can be determined quickly and accurately through the target defect threshold, target hot spot temperature and target relative temperature difference.

[0071] Optionally, in the method for determining the defect level of electrical equipment provided in an embodiment of the present application, after determining the defect level of the target equipment based on the target defect threshold, the first target infrared image and the second target infrared image corresponding to the target equipment type information, the method also includes: determining a target processing strategy corresponding to the target equipment based on the defect level; and adjusting the target equipment based on the target processing strategy.

[0072] In an optional embodiment, if the target device type information reaches a corresponding defect judgment value, the system will issue an alarm and output a corresponding defect report (ie, a target processing strategy) according to the defect judgment value.

[0073] It should be noted that the specific content of the defect report includes but is not limited to: equipment category, component location, defect manifestation, ambient temperature, defect level recommendation, and processing time limit reminder based on the defect level.

[0074] It should be noted that Table 2 is a defect handling time limit table provided according to an embodiment of the present application. As shown in Table 2:

[0075] Table 2 Defect handling time limit table

[0076]

[0077] The target processing strategy effectively facilitates relevant staff to judge the defect level and handle it in a timely manner according to the required time limit, thereby improving the work efficiency of the target equipment.

[0078] Optionally, in the method for determining the defect level of electrical equipment provided in an embodiment of the present application, obtaining a first target infrared image and a second target infrared image of the target equipment when it is running includes: obtaining a first initial infrared image and a second initial infrared image of the target equipment when it is running; performing image processing on the first initial infrared image and the second initial infrared image to obtain a processed first initial infrared image and a processed second initial infrared image; performing thermal imaging analysis on the processed first initial infrared image and the processed second initial infrared image to obtain a first target infrared image and a second target infrared image.

[0079] In an optional embodiment, a first initial infrared image and a second initial infrared image of the target device when it is running are collected by an infrared camera or an infrared thermal imager. The collected first initial infrared image and the second initial infrared image are subjected to image processing, including but not limited to: denoising, enhancement, edge detection and other operations, to obtain a processed first initial infrared image and a processed second initial infrared image. Thermal imaging analysis technology is used to perform thermal imaging analysis on the processed first initial infrared image and the processed second initial infrared image, identify the characteristics of the target device information, and obtain the first target infrared image and the second target infrared image.

[0080] Through the above steps, infrared images of the target device in different states can be obtained, processed and analyzed, so as to obtain thermal imaging information of the target device, which can help with fault diagnosis, anomaly detection, performance evaluation and other tasks.

[0081] It should be noted that Figure 2 Schematic diagram of a method for determining a defect level of an electrical device according to an embodiment of the present application. Figure 2 As shown, first, a first target infrared image and a second target infrared image (i.e., infrared temperature measurement image) of the target device during operation are collected by an infrared camera or an infrared thermal imager and other devices, and preprocessing operations are performed on them to eliminate the influence of noise and missing conditions on the image.

[0082] Then, the hotspot detection algorithm, hotspot segmentation algorithm, deep learning or other network models are used to identify the device type information of the target device in the infrared temperature measurement image. The first hotspot temperature, the second hotspot temperature and the third hotspot temperature of the first target infrared image and the second target infrared image are extracted through OCR technology, and the relative temperature difference is calculated by combining the above temperature values, relevant information and ambient temperature.

[0083] Finally, based on the defect standard library, the defect level corresponding to the target device is determined, and the defect report corresponding to the target device is output based on the abnormal defect report template.

[0084] The method for determining the defect level of electrical equipment provided in the embodiment of the present application is by obtaining a first target infrared image and a second target infrared image of the target equipment when it is running, wherein the first target infrared image is an infrared image of the heating part of the target equipment when it is running, and the second target infrared image is an infrared image of the target equipment when it is running; based on the first target infrared image and the second target infrared image, the target equipment type information corresponding to the target equipment is determined; based on the target defect threshold corresponding to the target equipment type information, the first target infrared image and the second target infrared image, the defect level of the target equipment is determined, which solves the problem of low efficiency in determining the defect level of the target equipment by manual means in the related art. In summary, in this scheme, the target equipment type information of the target equipment is determined by comparing the first target infrared image and the second target infrared image of the target equipment at different phases, and then the defect level of the target equipment is comprehensively determined by combining the target defect threshold corresponding to the target equipment type information and the two target infrared images. Through the first target infrared image and the second target infrared image of the target device at different phases, the target device type information of the target device is accurately determined. At the same time, according to the relationship between the first target infrared image, the second target infrared image and the target defect threshold, the defect level corresponding to the target device is automatically determined, avoiding the inaccuracy caused by manual identification and other problems, thereby improving the efficiency of determining the defect level of the target device.

[0085] It should be noted that the steps shown in the flowcharts of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and that, although a logical order is shown in the flowcharts, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0086] The embodiment of the present application also provides a device for determining the defect level of electrical equipment. It should be noted that the device for determining the defect level of electrical equipment in the embodiment of the present application can be used to execute the method for determining the defect level of electrical equipment provided in the embodiment of the present application. The device for determining the defect level of electrical equipment provided in the embodiment of the present application is introduced below.

[0087] Figure 3 Schematic diagram of a device for determining a defect level of an electrical device according to an embodiment of the present application. Figure 3 As shown, the device includes: an acquisition unit 301, a first determination unit 302, and a second determination unit 303.

[0088] An acquisition unit 301 is used to acquire a first target infrared image and a second target infrared image of a target device when the target device is in operation, wherein the first target infrared image is an infrared image of a heating part of the target device when the target device is in operation, and the second target infrared image is an infrared image of the target device when the target device is in operation;

[0089] A first determining unit 302 is used to determine target device type information corresponding to the target device according to the first target infrared image and the second target infrared image;

[0090] The second determining unit 303 is used to determine the defect level of the target device according to the target defect threshold corresponding to the target device type information, the first target infrared image and the second target infrared image.

[0091] The device for determining the defect level of electrical equipment provided in the embodiment of the present application comprises an acquisition unit 301 that acquires a first target infrared image and a second target infrared image of the target equipment when it is in operation, wherein the first target infrared image is an infrared image of the heating part of the target equipment when it is in operation, and the second target infrared image is an infrared image of the target equipment when it is in operation; the first determination unit 302 determines the target equipment type information corresponding to the target equipment based on the first target infrared image and the second target infrared image; the second determination unit 303 determines the defect level of the target equipment based on the target defect threshold corresponding to the target equipment type information, the first target infrared image and the second target infrared image, thereby solving the problem in the related art that the defect level of the target equipment is determined manually, resulting in a relatively low efficiency in determining the defect level of the target equipment. In this solution, the target equipment type information of the target equipment is determined by comparing the first target infrared image and the second target infrared image of the target equipment at different phases, and then the defect level of the target equipment is comprehensively determined by combining the target defect threshold corresponding to the target equipment information type and the two target infrared images. Through the first target infrared image and the second target infrared image of the target device at different phases, the target device type information of the target device is accurately determined. At the same time, according to the relationship between the first target infrared image, the second target infrared image and the target defect threshold, the defect level corresponding to the target device is automatically determined, avoiding the inaccuracy caused by manual identification and other problems, thereby improving the efficiency of determining the defect level of the target device.

[0092] Optionally, in the device for determining the defect level of electrical equipment provided in an embodiment of the present application, the first determination unit includes: a first detection module, used to detect a first target infrared image through a target detection algorithm to obtain first device type information corresponding to the first target infrared image; a second detection module, used to detect a second target infrared image through a target detection algorithm to obtain second device type information corresponding to the second target infrared image; and a first determination module, used to determine target device type information corresponding to the target device based on the first device type information and the second device type information.

[0093] Optionally, in the device for determining the defect level of electrical equipment provided in an embodiment of the present application, the first determination module includes: a judgment submodule, used to judge whether the first device type information and the second device type information are the same to obtain a judgment result; a first determination submodule, used to determine the first device type information or the second device type information as the target device type information if the judgment result indicates that the first device type information and the second device type information are the same; an acquisition submodule, used to acquire the third device type information input by the target object if the judgment result indicates that the first device type information and the second device type information are not the same; and a second determination submodule, used to determine the third device type information as the target device type information corresponding to the target device.

[0094] Optionally, in the device for determining the defect level of electrical equipment provided in an embodiment of the present application, the second determination unit includes: a first acquisition module, used to acquire the ambient temperature of the environment in which the target device is located; a first identification module, used to perform temperature recognition on the first target infrared image through a target recognition algorithm, and obtain a first hotspot temperature corresponding to the heating part; a second identification module, used to perform temperature recognition on the second target infrared image through a target recognition algorithm, and obtain a second hotspot temperature corresponding to the heating part and a third hotspot temperature corresponding to a part other than the heating part; a second determination module, used to determine the defect level of the target device based on the target defect threshold, ambient temperature, first hotspot temperature, second hotspot temperature and third hotspot temperature.

[0095] Optionally, in the device for determining the defect level of electrical equipment provided in an embodiment of the present application, the second determination module includes: a third determination submodule, used to determine the target hotspot temperature of the target device based on the first hotspot temperature and the second hotspot temperature; a calculation submodule, used to calculate based on the target hotspot temperature, the third hotspot temperature and the ambient temperature to obtain the target relative temperature difference of the target device; and a fourth determination submodule, used to determine the defect level of the target device based on the target defect threshold, the target hotspot temperature and the target relative temperature difference.

[0096] Optionally, in the device for determining the defect level of electrical equipment provided in an embodiment of the present application, the device also includes: a third determination unit, which is used to determine the defect level of the target equipment based on the target defect threshold corresponding to the target equipment type information, the first target infrared image and the second target infrared image, and then determine the target processing strategy corresponding to the target equipment based on the defect level; and an adjustment unit, which is used to adjust the target equipment based on the target processing strategy.

[0097] Optionally, in the device for determining the defect level of electrical equipment provided in an embodiment of the present application, the acquisition unit includes: a second acquisition module, used to acquire a first initial infrared image and a second initial infrared image of the target device when it is running; a first processing module, used to perform image processing on the first initial infrared image and the second initial infrared image to obtain a processed first initial infrared image and a processed second initial infrared image; and a second processing module, used to perform thermal imaging analysis on the processed first initial infrared image and the processed second initial infrared image to obtain a first target infrared image and a second target infrared image.

[0098] The device for determining the defect level of electrical equipment includes a processor and a memory. The above-mentioned acquisition unit 301, first determination unit 302, second determination unit 303, etc. are all stored in the memory as program units, and the processor executes the above-mentioned program units stored in the memory to realize efficient determination of the defect level of the electrical equipment.

[0099] The processor includes a kernel, which retrieves the corresponding program unit from the memory. One or more kernels can be set, and the defect level of the electrical equipment can be efficiently determined by adjusting the kernel parameters.

[0100] The memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM, and the memory includes at least one memory chip.

[0101] An embodiment of the present invention provides a computer-readable storage medium on which a program is stored. When the program is executed by a processor, a method for determining a defect level of an electrical device is implemented.

[0102] An embodiment of the present invention provides a processor, which is used to run a program, wherein the method for determining a defect level of an electrical device is executed when the program is run.

[0103] like Figure 4As shown, an embodiment of the present invention provides an electronic device, the device includes a processor, a memory, and a program stored in the memory and executable on the processor, and the processor implements the following steps when executing the program: obtaining a first target infrared image and a second target infrared image of a target device when it is running, wherein the first target infrared image is an infrared image of a heating part of the target device when it is running, and the second target infrared image is an infrared image of the target device when it is running; determining target device type information corresponding to the target device based on the first target infrared image and the second target infrared image; determining a defect level of the target device based on a target defect threshold corresponding to the target device type information, the first target infrared image, and the second target infrared image.

[0104] Optionally, determining the target device information corresponding to the target device based on the first target infrared image and the second target infrared image includes: detecting the first target infrared image through a target detection algorithm to obtain first device type information corresponding to the first target infrared image; detecting the second target infrared image through a target detection algorithm to obtain second device type information corresponding to the second target infrared image; and determining the target device type information corresponding to the target device based on the first device type information and the second device type information.

[0105] Optionally, determining the target device type information corresponding to the target device based on the first device type information and the second device type information includes: judging whether the first device type information and the second device type information are the same, and obtaining a judgment result; if the judgment result indicates that the first device type information and the second device type information are the same, determining the first device type information or the second device type information as the target device type information; if the judgment result indicates that the first device type information and the second device type information are different, obtaining the third device type information input by the target object; and determining the third device type information as the target device type information corresponding to the target device.

[0106] Optionally, determining the defect level of the target device based on the target defect threshold, the first target infrared image and the second target infrared image corresponding to the target device type information includes: obtaining the ambient temperature of the environment in which the target device is located; performing temperature recognition on the first target infrared image through a target recognition algorithm to obtain a first hotspot temperature corresponding to the heating part; performing temperature recognition on the second target infrared image through a target recognition algorithm to obtain a second hotspot temperature corresponding to the heating part and a third hotspot temperature corresponding to a part other than the heating part; determining the defect level of the target device based on the target defect threshold, the ambient temperature, the first hotspot temperature, the second hotspot temperature and the third hotspot temperature.

[0107] Optionally, determining the defect level of the target device based on the target defect threshold, ambient temperature, a first hotspot temperature, a second hotspot temperature and a third hotspot temperature includes: determining the target hotspot temperature of the target device based on the first hotspot temperature and the second hotspot temperature; calculating based on the target hotspot temperature, the third hotspot temperature and the ambient temperature to obtain a target relative temperature difference of the target device; determining the defect level of the target device based on the target defect threshold, the target hotspot temperature and the target relative temperature difference.

[0108] Optionally, after determining the defect level of the target device based on the target defect threshold corresponding to the target device type information, the first target infrared image and the second target infrared image, the method also includes: determining a target processing strategy corresponding to the target device based on the defect level; and adjusting the target device based on the target processing strategy.

[0109] Optionally, obtaining a first target infrared image and a second target infrared image when the target device is running includes: obtaining a first initial infrared image and a second initial infrared image when the target device is running; performing image processing on the first initial infrared image and the second initial infrared image to obtain a processed first initial infrared image and a processed second initial infrared image; performing thermal imaging analysis on the processed first initial infrared image and the processed second initial infrared image to obtain a first target infrared image and a second target infrared image.

[0110] The devices in this article can be servers, PCs, PADs, mobile phones, etc.

[0111] The present application also provides a computer program product, which, when executed on a data processing device, is suitable for executing a program that is initialized with the following method steps: obtaining a first target infrared image and a second target infrared image of a target device when it is running, wherein the first target infrared image is an infrared image of a heating part of the target device when it is running, and the second target infrared image is an infrared image of the target device when it is running; determining target device type information corresponding to the target device based on the first target infrared image and the second target infrared image; determining a defect level of the target device based on a target defect threshold corresponding to the target device type information, the first target infrared image, and the second target infrared image.

[0112] Optionally, determining the target device type information corresponding to the target device based on the first target infrared image and the second target infrared image includes: detecting the first target infrared image through a target detection algorithm to obtain first device type information corresponding to the first target infrared image; detecting the second target infrared image through a target detection algorithm to obtain second device type information corresponding to the second target infrared image; and determining the target device type information corresponding to the target device based on the first device type information and the second device type information.

[0113] Optionally, determining the target device type information corresponding to the target device based on the first device type information and the second device type information includes: judging whether the first device type information and the second device type information are the same, and obtaining a judgment result; if the judgment result indicates that the first device type information and the second device type information are the same, determining the first device type information or the second device type information as the target device type information; if the judgment result indicates that the first device type information and the second device type information are different, obtaining the third device type information input by the target object; and determining the third device type information as the target device type information corresponding to the target device.

[0114] Optionally, determining the defect level of the target device based on the target defect threshold, the first target infrared image and the second target infrared image corresponding to the target device type information includes: obtaining the ambient temperature of the environment in which the target device is located; performing temperature recognition on the first target infrared image through a target recognition algorithm to obtain a first hotspot temperature corresponding to the heating part; performing temperature recognition on the second target infrared image through a target recognition algorithm to obtain a second hotspot temperature corresponding to the heating part and a third hotspot temperature corresponding to a part other than the heating part; determining the defect level of the target device based on the target defect threshold, the first hotspot temperature, the second hotspot temperature and the third hotspot temperature.

[0115] Optionally, determining the defect level of the target device based on the target defect threshold, ambient temperature, a first hotspot temperature, a second hotspot temperature and a third hotspot temperature includes: determining the target hotspot temperature of the target device based on the first hotspot temperature and the second hotspot temperature; calculating based on the target hotspot temperature, the third hotspot temperature and the ambient temperature to obtain a target relative temperature difference of the target device; determining the defect level of the target device based on the target defect threshold, the target hotspot temperature and the target relative temperature difference.

[0116] Optionally, after determining the defect level of the target device based on the target defect threshold corresponding to the target device type information, the first target infrared image and the second target infrared image, the method also includes: determining a target processing strategy corresponding to the target device based on the defect level; and adjusting the target device based on the target processing strategy.

[0117] Optionally, obtaining a first target infrared image and a second target infrared image when the target device is running includes: obtaining a first initial infrared image and a second initial infrared image when the target device is running; performing image processing on the first initial infrared image and the second initial infrared image to obtain a processed first initial infrared image and a processed second initial infrared image; performing thermal imaging analysis on the processed first initial infrared image and the processed second initial infrared image to obtain a first target infrared image and a second target infrared image.

[0118] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented in one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that include computer-usable program code.

[0119] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0120] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0121] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0122] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0123] The memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0124] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0125] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0126] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program code.

[0127] The above are only embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included within the scope of the claims of the present application.

Claims

1. A method for determining the defect level of electrical equipment, characterized in that: include: Acquire a first target infrared image and a second target infrared image when the target device is in operation, wherein the first target infrared image is an infrared image of a heating part of the target device when in operation, and the second target infrared image is an infrared image of the target device when in operation; Determining target device type information corresponding to the target device according to the first target infrared image and the second target infrared image; The defect level of the target device is determined according to the target defect threshold corresponding to the target device type information, the first target infrared image, and the second target infrared image.

2. The method according to claim 1, characterized in that: Determining the target device type information corresponding to the target device according to the first target infrared image and the second target infrared image includes: Detecting the first target infrared image by using a target detection algorithm to obtain first device type information corresponding to the first target infrared image; Detecting the second target infrared image by using the target detection algorithm to obtain second device type information corresponding to the second target infrared image; The target device type information corresponding to the target device is determined according to the first device type information and the second device type information.

3. The method according to claim 2, characterized in that Determining the target device type information corresponding to the target device according to the first device type information and the second device type information includes: Determine whether the first device type information and the second device type information are the same, and obtain a determination result; If the judgment result indicates that the first device type information and the second device type information are the same, determining the first device type information or the second device type information as the target device type information; If the judgment result indicates that the first device type information and the second device type information are different, obtaining third device type information input by the target object; The third device type information is determined as the target device type information corresponding to the target device.

4. The method according to claim 1, characterized in that: Determining the defect level of the target device according to the target defect threshold corresponding to the target device type information, the first target infrared image, and the second target infrared image includes: Obtaining the ambient temperature of the environment in which the target device is located; Performing temperature recognition on the first target infrared image by using a target recognition algorithm to obtain a first hot spot temperature corresponding to the heating part; Performing temperature recognition on the second target infrared image by using the target recognition algorithm to obtain a second hot spot temperature corresponding to the heating portion and a third hot spot temperature corresponding to a portion other than the heating portion; The defect level of the target device is determined according to the target defect threshold, the ambient temperature, the first hot spot temperature, the second hot spot temperature, and the third hot spot temperature.

5. The method according to claim 4, characterized in that Determining the defect level of the target device according to the target defect threshold, the ambient temperature, the first hot spot temperature, the second hot spot temperature, and the third hot spot temperature includes: Determining a target hotspot temperature of the target device according to the first hotspot temperature and the second hotspot temperature; Calculating according to the target hotspot temperature, the third hotspot temperature and the ambient temperature to obtain a target relative temperature difference of the target device; The defect level of the target device is determined according to the target defect threshold, the target hot spot temperature and the target relative temperature difference.

6. The method according to claim 1, characterized in that After determining the defect level of the target device according to the target defect threshold corresponding to the target device type information, the first target infrared image, and the second target infrared image, the method further includes: Determining a target processing strategy corresponding to the target device according to the defect level; The target device is adjusted according to the target processing strategy.

7. The method according to claim 1, characterized in that Acquiring a first target infrared image and a second target infrared image when the target device is running includes: Acquire a first initial infrared image and a second initial infrared image of the target device when it is running; Performing image processing on the first initial infrared image and the second initial infrared image to obtain a processed first initial infrared image and a processed second initial infrared image; Thermal imaging analysis is performed on the processed first initial infrared image and the processed second initial infrared image to obtain the first target infrared image and the second target infrared image.

8. A device for determining the defect level of electrical equipment, characterized in that: include: An acquisition unit, used to acquire a first target infrared image and a second target infrared image of a target device when the target device is in operation, wherein the first target infrared image is an infrared image of a heating part of the target device when the target device is in operation, and the second target infrared image is an infrared image of the target device when the target device is in operation; A first determining unit, configured to determine target device type information corresponding to the target device according to the first target infrared image and the second target infrared image; The second determining unit is configured to determine a defect level of the target device according to a target defect threshold corresponding to the target device type information, the first target infrared image, and the second target infrared image.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium includes a stored program, wherein when the program is executed, the storage medium is controlled to execute the method for determining the defect level of the electrical equipment according to any one of claims 1 to 7 on the device.

10. An electronic device, characterized in that: It includes one or more processors and a memory, wherein the memory is used to store one or more programs, wherein when the one or more programs are executed by the one or more processors, the one or more processors implement the method for determining the defect level of electrical equipment as described in any one of claims 1 to 7.

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