Electronic device and manufacturing method thereof

Abstract

An electronic device is provided. The electronic device includes a substrate and a conductive layer disposed on the substrate. The conductive layer is patterned by a plurality of operation processes, the plurality of operation processes comprise: providing a shielding substrate, the shielding substrate comprises a first substrate and a patterned substrate, and the width of the first substrate is greater than the width of the patterned substrate in a profile map; the plurality of operation flows also comprise the following steps of: correspondingly arranging the shielding substrate and the substrate; performing exposure and development processes on the conductive layer to pattern the conductive layer; and removing the shielding substrate.

Description

[0001] This application is a divisional application. The application date of the original application is September 23, 2020, the application number is 202011008554.8, and the name of the invention is shielding substrate and its manufacturing method. Technical Field

[0002] An electronic device is provided. The electronic device includes: a substrate and a conductive layer disposed on the substrate. The conductive layer is patterned by a plurality of operation processes, and the plurality of operation processes include: providing a shielding substrate, wherein the shielding substrate includes a first substrate and a patterned substrate, and in a cross-sectional view, the width of the first substrate is greater than the width of the patterned substrate. The plurality of operation processes also include: arranging the shielding substrate corresponding to the substrate; performing an exposure and development process on the conductive layer to pattern the conductive layer; and removing the shielding substrate. Background Art

[0003] Currently, multiple shields are commonly required to perform photolithography processes to manufacture thin-film transistors (TFT), liquid crystal displays, organic light-emitting diodes (OLED) displays, and / or other devices. However, the cost of developing different types of shields is relatively high, and redesigning the multiple shields can be time-consuming and complex. These disadvantages can be detrimental to the development of new products. Therefore, a new shield structure is needed. Summary of the invention

[0004] Some embodiments of the present invention provide an electronic device, comprising: a substrate and a conductive layer disposed on the substrate. The conductive layer is patterned by a plurality of operation processes, the plurality of operation processes comprising: providing a shielding substrate, wherein the shielding substrate comprises a first substrate and a patterned substrate, and in a cross-sectional view, the width of the first substrate is greater than the width of the patterned substrate. The plurality of operation processes also comprise: disposing the shielding substrate corresponding to the substrate; performing an exposure and development process on the conductive layer to pattern the conductive layer; and removing the shielding substrate.

[0005] Some embodiments of the present invention provide a method for manufacturing an electronic device, comprising: providing a base; providing a conductive layer, disposed on the aforementioned base; providing a shielding substrate, wherein the aforementioned shielding substrate comprises a first substrate and a patterned substrate, and in a cross-sectional view, the width of the aforementioned first substrate is greater than the width of the aforementioned patterned substrate; disposing the aforementioned shielding substrate corresponding to the aforementioned base; performing an exposure and development process on the aforementioned conductive layer to pattern the aforementioned conductive layer; and removing the aforementioned shielding substrate.

[0006] In order to make the above and other purposes, features and advantages of the present invention more obvious and understandable, some embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The various aspects of the present invention may be fully understood from the following detailed description in conjunction with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, various features are not drawn to scale and are for illustration purposes only. In fact, the dimensions of the components may be arbitrarily enlarged or reduced to clearly illustrate the features of the present invention.

[0008] Figure 1 A flow chart showing a method of manufacturing a shield substrate according to some embodiments of the present invention.

[0009] Figure 2 A flow chart showing a method of manufacturing a target substrate according to some embodiments of the present invention.

[0010] Figures 3A-3F A cross-sectional schematic diagram showing a process of manufacturing a patterned substrate according to some embodiments of the present invention.

[0011] Figure 4A-4B A cross-sectional schematic diagram showing a process of manufacturing a shielding substrate according to some embodiments of the present invention.

[0012] Figure 5A-5B A cross-sectional schematic diagram showing a process of manufacturing a shielding substrate according to some embodiments of the present invention.

[0013] Figure 6 Schematic cross-sectional view showing an intermediate stage of manufacturing a target substrate according to some embodiments of the present invention.

[0014] Figure 7 A perspective schematic diagram showing a shielding substrate and a target substrate according to some embodiments of the present invention.

[0015] Figure 8 A schematic cross-sectional view of a shielding substrate according to some embodiments of the present invention is shown.

[0016] Fig. 9 A schematic cross-sectional view of a shielding substrate according to some embodiments of the present invention is shown.

[0017] Fig.10 A schematic cross-sectional view of a shielding substrate according to some embodiments of the present invention is shown.

[0018] Fig.11 A schematic cross-sectional view of a shielding substrate according to some embodiments of the present invention is shown.

[0019] Fig.12 A schematic cross-sectional view of a shielding substrate according to some embodiments of the present invention is shown.

[0020] Fig.13 A schematic cross-sectional view of a shielding substrate according to some embodiments of the present invention is shown.

[0021] Fig.14 A flow chart showing a method of manufacturing an electronic device according to some embodiments of the present invention.

[0022] Explanation of symbols:

[0023] 100: Method

[0024] 102, 104, 105, 106, 108, 110, 112, 114, 116, 118: Operation

[0025] 200: Method

[0026] 201, 202, 204, 206, 207, 208, 209, 210: Operation

[0027] 300: Shielding substrate

[0028] 310: first substrate

[0029] 320: Optical layer

[0030] 330: Patterned substrate

[0031] 331: First base

[0032] 332: Pattern

[0033] 333: Shielding layer

[0034] 334: Photoresist layer

[0035] 350: Target substrate

[0036] 360: Second base

[0037] 370: Material layer

[0038] 380: Photoresist layer

[0039] 381: Exposed part

[0040] 382: Covered part

[0041] 400: Shielding substrate

[0042] 410: first substrate

[0043] 420: Optical layer

[0044] 430: Patterned substrate

[0045] 431: First base

[0046] 432: Pattern

[0047] 500: Shielding substrate

[0048] 510: first substrate

[0049] 520: Optical layer

[0050] 530: Patterned substrate

[0051] 531: First base

[0052] 532: Pattern

[0053] 600: Shielding substrate

[0054] 610: first substrate

[0055] 620: Optical layer

[0056] 630: Patterned substrate

[0057] 631: First base

[0058] 632: Pattern

[0059] 640: Protective layer

[0060] 700: Shielding substrate

[0061] 710: first substrate

[0062] 720: Optical layer

[0063] 730: Patterned substrate

[0064] 731: First base

[0065] 732: Pattern

[0066] 740: Protective layer

[0067] 800: Shielding substrate

[0068] 810: first substrate

[0069] 820: Optical layer

[0070] 830: Patterned substrate

[0071] 831: First base

[0072] 832: Pattern

[0073] 840: Protective layer

[0074] 845: Adhesive

[0075] 900: Shielding substrate

[0076] 910: first substrate

[0077] 920: Optical layer

[0078] 930: Patterned substrate

[0079] 931: First base

[0080] 932: Pattern

[0081] 940: Protective layer

[0082] 945: Adhesive

[0083] 1000:Method

[0084] 1001, 1002, 1004, 1006, 1007, 1008, 1009, 1010, 1012: Operation DETAILED DESCRIPTION

[0085] The following describes the shielding substrate and the method for manufacturing the target substrate according to the embodiment of the present invention. However, it is easy to understand that the embodiment of the present invention provides many suitable inventive concepts and can be implemented in a wide variety of specific backgrounds. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific way, and are not used to limit the scope of the present invention.

[0086] In addition, relative terms such as "below" or "bottom" and "above" or "top" may be used in the embodiments to describe the relative relationship of one component to another component in the drawings. It is understood that if the device in the drawings is turned upside down, the component described on the "below" side will become the component on the "above" side.

[0087] It is understood that although the terms "first", "second", etc. may be used herein to describe various components, layers and / or parts, these components, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, layers and / or parts. Therefore, a first component, layer and / or part discussed below may be referred to as a second component, layer and / or part without departing from the teachings of some embodiments of the present invention. In addition, for the sake of brevity, the terms "first", "second", etc. may not be used in the specification to distinguish different components. Without violating the scope defined by the attached claims, the first component and / or second component recorded in the claims may be interpreted as any component that meets the description in the specification.

[0088] In addition, the term "in the range between the A value and the B value" used herein is intended to cover the numerical range between the A value and the B value, and also includes the A value and the B value themselves.

[0089] Figure 1 A flow chart showing a method 100 for manufacturing a shielding substrate according to some embodiments of the present invention. In operation 102, a first substrate is provided. In some embodiments, the material of the first substrate may include glass, quartz, polyimide (PI), polyethylene terephthalate (PET), any other suitable material, or a combination of the foregoing, but is not limited thereto. In operation 104, a shielding layer is provided on the first substrate. For example, the material of the shielding layer may include a conductive material, an insulating material, or any other suitable material, as long as the shielding layer can be used to form a pattern, but is not limited thereto. In some embodiments, the shielding layer may be a dark material, which may help form a pattern, but is not limited thereto.

[0090] In operation 105, the shielding layer is patterned to form a pattern, and the first substrate and the pattern form a patterned substrate. In one embodiment, operation 105 may include operations 106, 108, and 110. In operation 106, a photoresist layer is provided on the shielding layer. In operation 108, an exposure and development process is performed on the photoresist layer to perform a subsequent etching process to form a patterned photoresist layer. Next, in operation 110, an etching process is performed on the shielding layer to form a pattern on the first substrate. In some embodiments, the pattern of the shielding layer may be the same as the pattern of the patterned photoresist layer, and those skilled in the art may adjust these patterns as needed, which will not be described in further detail below. After the etching process is completed, the photoresist layer is removed, and the pattern will remain on the first substrate. At this point, a patterned substrate (including the first substrate and the pattern disposed thereon) is formed.

[0091] In some embodiments, in operation 105 , the masking layer may be patterned by a laser direct imaging process without performing exposure, development, and etching processes, and a corresponding pattern may still be formed on the first substrate.

[0092] After the shielding layer is patterned (i.e., operation 105), in operation 112, the patterned substrate may be cut into a suitable size. In some embodiments, in operation 112, the area of ​​the first substrate may be greater than or equal to the area of ​​the patterned substrate. It should be noted that operation 112 is optional. In operation 116, an optical layer is provided on the patterned substrate or on the first substrate, wherein the refractive index of the optical layer ranges from greater than or equal to 1 and less than or equal to 2.3. In another embodiment, the refractive index of the optical layer ranges from greater than or equal to 1.45 and less than or equal to 1.55. In some embodiments, the refractive index of the optical layer may be substantially similar to the refractive index of glass. In operation 118, the patterned substrate and the first substrate are combined to form a shielding substrate. In some embodiments, the optical layer may include a transparent adhesive, a coating (e.g., SiO x 、SiN x, Nb2O5, Al2O3, etc.), liquid crystal, refractive index matching liquid (such as oil), any other suitable material or combination of the foregoing, but not limited thereto. After operation 118, the first substrate and / or the patterned substrate may be selectively cut so that the size (such as area or width) of the first substrate is the same as or different from the size of the patterned substrate. It should be noted that the above steps of the method 100 provided herein are provided as examples, and those skilled in the art may adjust the method 100 as needed. That is, additional operations may be performed, some operations may be omitted, and / or the order of operations may be changed.

[0093] Figure 2 A flow chart showing a method 200 for manufacturing a target substrate according to some embodiments of the present invention. In operation 201, a shielding substrate is provided. For example, the shielding substrate is made by the above-mentioned method 100, but the present invention is not limited to this. The shielding substrate described in operation 201 may refer to any substrate with a shield disposed thereon. In operation 202, a second substrate is provided, and a material layer may be disposed on the second substrate. For example, the material layer may include a conductive material, an insulating material, any other suitable material, or a combination of the foregoing. In some embodiments, the insulating material may be a transparent material or a dark material. For example, the material of the second substrate may include glass, quartz, polyimide (PI), polyethylene terephthalate (PET), any other suitable transparent material, or a combination of the foregoing, but is not limited thereto. In operation 204, the shielding substrate (e.g., the shielding substrate formed through method 100) and the second substrate are arranged correspondingly.

[0094] In operation 206, the material layer is patterned. In the present embodiment, operation 206 may include operation 207, operation 208, and operation 209. In operation 207, a photoresist layer is provided on the material layer. In operation 208, an exposure and development process is performed on the photoresist layer for a subsequent etching process. Next, the photoresist layer can be transformed into a patterned photoresist layer that conforms to the design pattern of the shielding substrate. Then, in operation 209, an etching process is performed, and the photoresist layer is removed to form a pattern on a second substrate. In some embodiments, forming a target substrate may include providing other shielding substrates and repeating operations 202 to 210 to form at least another pattern on a second substrate. In operation 210, the shielding substrate is removed after operation 206, leaving the second substrate as a target substrate.

[0095] Figures 3A-3F A cross-sectional schematic diagram showing a process for manufacturing a patterned substrate 330 according to some embodiments of the present invention. Figure 3A As shown, a first substrate 331 is provided. Then, a shielding layer 333 is formed on the first substrate 331. Figure 3B As shown. Afterwards, Figure 3C-3DAs shown, a photoresist layer 334 is provided on the shielding layer 333, and an exposure and development process is performed to pattern the photoresist layer. An etching process is performed on the shielding layer 333, and a pattern 332 is formed on the first substrate 331. In addition, the patterned photoresist layer 334 is removed to form a patterned substrate. Figure 3F As shown, the patterned substrate can be cut after the etching process is completed to form a patterned substrate 330. It should be noted that those skilled in the art can determine whether to perform a cutting process according to the design. In some embodiments, the patterned substrate 330 is formed without performing a cutting process.

[0096] Figure 4A-4B A cross-sectional schematic diagram showing a process for manufacturing a shielding substrate according to some embodiments of the present invention. Figure 4A-4B As shown, an optical layer 320 is disposed on a first substrate 310, and then the first substrate 310 and a patterned substrate 330 are assembled to form a shielding substrate. In this embodiment, the optical layer 320 is separated from the pattern 332. The following paragraphs will describe the shielding substrate in this embodiment in detail.

[0097] Figure 5A-5B A cross-sectional schematic diagram showing a process for manufacturing a shielding substrate according to some embodiments of the present invention. Figure 5A-5B As shown, an optical layer 320 is provided on a patterned substrate 330, and then a first substrate 310 and a patterned substrate 330 are assembled to form a shielding substrate. In this embodiment, the optical layer 320 is in contact with the pattern 332. The following paragraphs will describe the shielding substrate in this embodiment in detail.

[0098] Figure 4B and Figure 5B FIG. 4 is a cross-sectional view of a shielding substrate 300 according to some embodiments of the present invention. Figure 4B As shown in FIG. 5B, the shielding substrate 300 includes a first substrate 310, an optical layer 320, and a patterned substrate 330. The optical layer 320 is disposed between the first substrate 310 and the patterned substrate 330. For example, the optical layer 320 may include: a transparent adhesive, a sputtered film (e.g., SiO x 、SiN x , Nb2O5, Al2O3, etc.), liquid crystal, refractive index matching liquid (such as oil), any other suitable material or combination of the foregoing, but not limited thereto. In some embodiments, the refractive index range of the optical layer may be greater than or equal to 1 and less than or equal to 2.3. In other embodiments, the refractive index range of the optical layer may be greater than or equal to 1.45 and less than or equal to 1.55. In some embodiments, the refractive index of the optical layer is substantially similar to the refractive index of glass. Through the above design, the light transmittance of the shielding substrate 300 can be improved.

[0099] Figure 6A cross-sectional schematic diagram showing an intermediate stage of manufacturing a target substrate 350 according to some embodiments of the present invention. In the present embodiment, a second substrate 360 ​​is provided, and a material layer 370 is disposed on the second substrate 360. For example, the material layer 370 may include a metal material, an insulating material, any other suitable material, or a combination thereof. In order to perform an etching process on the material layer 370 on the second substrate 360 ​​to form the target substrate 350, a photoresist layer 380 is formed on the material layer 370. The shielding substrate 300 may be arranged corresponding to the second substrate 360. In the present embodiment, the shielding substrate 300 may be arranged directly above the second substrate 360.

[0100] The photoresist layer 380 may be subjected to an exposure process through the shielding substrate 300. Thus, the photoresist layer 380 includes an exposed portion 381 and a covered portion 382, ​​wherein the exposed portion 381 may be exposed to the pattern 332, and the covered portion 382 may be covered by the pattern 332. In some embodiments, the photoresist layer 380 includes a positive photoresist, so that the exposed portion 381 may be removed and the covered portion 382 may be retained on the material layer 370. In other embodiments, the photoresist layer 380 includes a negative photoresist, so that the exposed portion 381 may be retained on the material layer 370 and the covered portion 382 may be removed.

[0101] exist Figure 6 , the pattern 332 is disposed to be away from the optical layer 320. In other words, the pattern 332 does not contact the optical layer 320. It should be noted that the pattern 332 may be disposed between the optical layer 320 and the first substrate 331. In one embodiment, the pattern 332 is disposed between the second substrate 360 ​​and the first substrate 331. In one embodiment, the first substrate 331 is disposed between the pattern 332 and the second substrate 360. In one embodiment, the first substrate 310, the optical layer 320, and the first substrate 331 may be transparent, but the pattern 332 may be opaque, so that the shielding substrate 300 may be used as a shield for the exposure process performed on the photoresist layer 380. For example, the material of the first substrate 310 and / or the first substrate 331 may include glass, quartz, polyimide (PI), polyethylene terephthalate (PET), any other suitable transparent material, or a combination of the foregoing, but is not limited thereto. In addition, the material of the second substrate 360 ​​may include glass, quartz, polyimide (PI), polyethylene terephthalate (PET), any other suitable transparent material, or a combination thereof, but is not limited thereto.

[0102] Figure 7 A three-dimensional schematic diagram of a shielding substrate 300 and a target substrate 350 according to some embodiments of the present invention is shown. Figure 7As shown, after performing an exposure process on the photoresist layer 380, the shielding substrate 300 can be removed and reused. That is, the shielding substrate 300 can be arranged on another second substrate and used to form another device. Then, an etching process is performed on the material layer 370 through the remaining photoresist layer 380, and the remaining photoresist layer 380 is removed after the etching process is completed, thereby forming a patterned material layer 370 (corresponding to another pattern of the pattern 332) on the second substrate 360. It should be noted that the shape of the pattern 332 in the present embodiment is a schematic example, and those skilled in the art can arbitrarily adjust the shape of the pattern 332 as needed. In addition, additional operations can also be performed on the target substrate 350, and for the sake of brevity, they will not be further discussed in the following paragraphs.

[0103] Figure 8 The cross-sectional view of the shielding substrate 400 according to some embodiments of the present invention is shown. It should be noted that the shielding substrate 400 in this embodiment may include Figure 4B , 5B For easy identification, these same or similar parts are represented by similar numbers and will not be discussed in detail in the following paragraphs. For example, the shielding substrate 400 includes a first substrate 410, an optical layer 420 and a patterned substrate 430. The shielding substrate 400 in this embodiment is the same as Figure 4B , 5B The difference between the shielding substrate 300 shown in the figure is that the area of ​​the first substrate 410 is larger than the area of ​​the patterned substrate 430, wherein the area of ​​the first substrate 410 and the area of ​​the patterned substrate 430 are measured in a horizontal plane (e.g., an XY plane). Figure 4B , 5B The difference between the illustrated shield substrates 300 is that the width of the first substrate 410 is greater than the width of the patterned substrate 430, wherein the width of the first substrate 410 and the width of the patterned substrate 430 are measured in the X direction or the Y direction. In some embodiments, the patterned substrate 430 can be cut before being assembled with the first substrate 410. In other embodiments, the patterned substrate 430 can be cut after being assembled with the first substrate 410. The patterned substrate 430 reveals a portion of the first substrate 410, which is configured to fix or align the first substrate 410 during an exposure process performed using the shield substrate 400.

[0104] Fig. 9 The cross-sectional view of the shielding substrate 500 according to some embodiments of the present invention is shown. It should be noted that the shielding substrate 500 in this embodiment may include Figure 4B , 5BFor easy identification, the plurality of identical or similar parts are represented by similar numbers and will not be discussed in detail in the following paragraphs. For example, the shielding substrate 500 includes a first substrate 510, an optical layer 520 and a patterned substrate 530. The shielding substrate 500 in this embodiment is similar to the shielding substrate 300 shown in FIG. Figure 4B , 5B The difference between the shielding substrate 300 shown in the figure is that the pattern 532 of the patterned substrate 530 faces the first substrate 510 and contacts the optical layer 520. In this embodiment, a portion of the optical layer 520 is disposed between the pattern 532 and the first substrate 510. In one embodiment, the pattern 532 may directly contact the first substrate 510, so that the optical layer 520 will not be disposed directly under the pattern 532.

[0105] like Fig. 9 As shown, the size of the patterned substrate 530 corresponds to the size (eg, area or width) of the first substrate 510. However, this embodiment is only an example. In some other embodiments, the size of the patterned substrate 530 may be larger or smaller than the size of the first substrate 510.

[0106] Fig.10 The cross-sectional view of the shielding substrate 600 according to some embodiments of the present invention is shown. It should be noted that the shielding substrate 600 in this embodiment may include Figure 4B , 5B For easy identification, these same or similar parts are represented by similar numbers and will not be discussed in detail in the following paragraphs. For example, the shielding substrate 600 includes a first substrate 610, an optical layer 620 and a patterned substrate 630. The shielding substrate 600 in this embodiment is the same as or similar to the shielding substrate 300 shown in FIG. Figure 4B , 5B The difference between the shielding substrates 300 shown is that the shielding substrate 600 further includes a protective layer 640 disposed on the side of the patterned substrate 630. That is, from the perspective of the horizontal direction (e.g., parallel to the X-axis that is perpendicular to the Z-axis), the protective layer 640 may overlap with the first substrate 610, the optical layer 620 and / or the patterned substrate 630.

[0107] like Fig.10As shown, the size of the patterned substrate 630 corresponds to the size of the first substrate 610. However, in some other embodiments, the size of the patterned substrate 630 may be larger or smaller than the size of the first substrate 610. In some embodiments where the size of the patterned substrate 630 is different from the size of the first substrate 610, the protective layer 640 may be conformably disposed on the side of the first substrate 610 and / or the side of the patterned substrate 630. In some other embodiments, the protective layer 640 may not directly contact one of the side of the first substrate 610 and / or the side of the patterned substrate 630.

[0108] In some embodiments, the protective layer 640 may also partially cover the upper side and / or lower side of the shielding substrate 600. That is, when viewed along the normal direction (e.g., parallel to the Z-axis), the protective layer 640 may partially overlap at least one of the first substrate 610, the optical layer 620, and the patterned substrate 630. In some embodiments, the protective layer 640 surrounds the first substrate 610, the optical layer 620, and / or the patterned substrate 630. For example, the protective layer 640 may include glue, mechanical parts, any other suitable materials, parts, or a combination of the foregoing. With the above design, the shielding substrate 600 can be protected from damage caused by foreign matter.

[0109] Fig.11 The cross-sectional view of the shielding substrate 700 according to some embodiments of the present invention is shown. It should be noted that the shielding substrate 700 in this embodiment may include Figure 7 The shielding substrate 700 includes a first substrate 710, an optical layer 720 and a patterned substrate 730. Fig.11 As shown, the size of the patterned substrate 730 corresponds to the size of the first substrate 710. However, in some other embodiments, the size of the patterned substrate 730 may be larger or smaller than the size of the first substrate 710. Similarly, in some embodiments where the size of the patterned substrate 730 is different from the size of the first substrate 710, the protective layer 740 may be conformably disposed on the side of the first substrate 710 and / or the patterned substrate 730. In some other embodiments, the protective layer 740 may not directly contact one of the side of the first substrate 71 and / or the side of the patterned substrate 730.

[0110] The shielding substrate 700 of this embodiment is Figure 7The difference between the shielding substrate 500 shown is that the shielding substrate 700 further includes a protective layer 740 disposed on the side of the first substrate 710 and / or the side of the patterned substrate 730. For example, the protective layer 740 may include glue, mechanical parts, any other suitable materials, parts, or a combination of the foregoing. The configuration of the protective layer 740 is similar to the configuration of the protective layer 640 described above, and will not be repeated below. It should be noted that in the present embodiment, the protective layer 740 does not contact the pattern 732, but is only used as an example. In some other embodiments, the protective layer 740 may contact the pattern 732.

[0111] Fig.12 The cross-sectional view of the shielding substrate 800 according to some embodiments of the present invention is shown. It should be noted that the shielding substrate 800 in this embodiment may include Figure 8 The shielding substrate 800 includes a first substrate 810, an optical layer 820, a patterned substrate 830, and a protective layer 840. For example, the protective layer 840 may include glue, mechanical parts, any other suitable materials, parts, or a combination thereof.

[0112] The shielding substrate 800 of this embodiment is Figure 8 The difference between the shielding substrate 600 shown is that the shielding substrate 800 further includes an adhesive 845 located outside the optical layer 820. In this embodiment, the adhesive 845 can be disposed between the first substrate 810 and the patterned substrate 830. In addition, the adhesive 845 can also be disposed between the optical layer 820 and the protective layer 840. With the above design, the structural strength of the shielding substrate 800 can be enhanced.

[0113] like Fig.12 As shown, the size of the patterned substrate 830 corresponds to the size of the first substrate 810. However, in some other embodiments, the size of the patterned substrate 830 may be larger or smaller than the size of the first substrate 810. In some embodiments where the size of the patterned substrate 830 is different from the size of the first substrate 810, the adhesive 845 may be aligned with the side of the first substrate 810 and / or one of the sides of the patterned substrate 830. In the above embodiment, the adhesive 845 may contact the protective layer 840. However, in some other embodiments, a gap may be formed between the adhesive 845 and the protective layer 840.

[0114] Fig.13 The cross-sectional view of the shielding substrate 900 according to some embodiments of the present invention is shown. It should be noted that the shielding substrate 900 in this embodiment may include Fig. 9The shielding substrate 900 includes a first substrate 910, an optical layer 920, a patterned substrate 930 and a protective layer 940. The shielding substrate 900 in this embodiment is the same as or similar to the shielding substrate 700 shown in FIG. Fig. 9 The difference between the shielding substrate 700 shown is that the shielding substrate 900 further includes an adhesive 945 located outside the optical layer 920. The configuration of the adhesive 945 is similar to the configuration of the adhesive 845 described above, and will not be repeated. It should be noted that in this embodiment, the adhesive 945 does not contact the pattern 932, but is only used as an example. In some other embodiments, the adhesive 945 can contact the pattern 932. In this way, the fixation between the patterned substrate 930 and the first substrate 910 can be enhanced.

[0115] Fig.14 A flow chart showing a method 1000 for manufacturing an electronic device according to some embodiments of the present invention. Method 1000 includes operations 1001 to 1010 for forming a target substrate, which is similar to the above-mentioned method 200. Method 1000 further includes operation 1012, wherein the target substrate formed after operation 1010 can be used to form an electronic device. The formed target substrate can be used as any suitable part of the electronic device. For example, the target substrate can be an array substrate, a touch substrate, a filter substrate, an antenna substrate, a circuit wiring substrate, or a printed circuit board in an electronic device. That is, the target substrate can be any substrate that requires shielding to perform exposure and development processes. The electronic device may include a display device, a sensing device, an antenna device, a splicing device, a touch device, other suitable electronic devices, or a combination of the foregoing, but is not limited thereto.

[0116] For simplicity, the target substrate illustrated in the present invention is formed using a single shielding substrate. However, in some embodiments, the target substrate may be formed by using multiple shielding substrates and performing multiple patterning processes. That is, some operations included in the method 200 and the method 1000 may be repeated, replaced, and / or omitted to form the target substrate and the electronic device as desired.

[0117] In summary, an embodiment of the present invention provides a shielding substrate having a patterned substrate. The patterned substrate can be formed by performing some processes (such as exposure and development processes and / or laser direct imaging processes). In this way, the pattern on the patterned substrate can be changed as needed whenever necessary, thereby making it easy to form a shielding substrate. In addition, the shielding substrate may further include a protective layer and / or an adhesive to better protect the shielding substrate or improve the structural strength of the shielding substrate. In addition, the shielding substrate can be used to further form a target substrate. The target substrate can be an array substrate, a touch substrate, an antenna substrate or any other target substrate formed by performing exposure and development processes that require shielding.

[0118] Although the embodiments of the present invention and their advantages have been disclosed as above, it should be understood that any person with ordinary knowledge in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person with ordinary knowledge in the art can understand from the disclosure of the present invention that the processes, machines, manufacturing, material compositions, devices, methods and steps currently or developed in the future can be used according to the present invention as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of the present invention includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps, and the features between the embodiments can be arbitrarily mixed and matched as long as they do not violate the spirit of the invention or conflict with each other. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present invention also includes the combination of each claim and embodiment.

Claims

1. An electronic device, characterized in that: include: a base; as well as A conductive layer is disposed on the substrate, and the conductive layer is patterned by a plurality of operation processes, the plurality of operation processes comprising: A shielding substrate is provided, wherein the shielding substrate comprises a first substrate and a patterned substrate, and in a cross-sectional view, the width of the first substrate is greater than the width of the patterned substrate; The shielding substrate is arranged corresponding to the base; performing an exposure and development process on the conductive layer to pattern the conductive layer; and The shielding substrate is removed.

2. The electronic device according to claim 1, wherein: The electronic device is one of a display device, a sensing device, an antenna device, a splicing device, and a touch device.

3. The electronic device according to claim 1, wherein: The combination of the base and the patterned substrate is used as one of an array substrate, a touch substrate, a filter substrate, an antenna substrate, a circuit wiring substrate or a printed circuit board.

4. The electronic device according to claim 1, wherein: The shielding substrate includes a transparent adhesive layer disposed between the patterned substrate and the first substrate.

5. The electronic device as claimed in claim 4, characterized in that: The width of the transparent adhesive layer is greater than the width of the first substrate.

6. The electronic device as claimed in claim 4, characterized in that: The refractive index of the transparent adhesive layer is greater than or equal to 1 and less than or equal to 2.

3.

7. A method for manufacturing an electronic device, characterized in that: include: providing a substrate; Providing a conductive layer disposed on the substrate; A shielding substrate is provided, wherein the shielding substrate comprises a first substrate and a patterned substrate, and in a cross-sectional view, the width of the first substrate is greater than the width of the patterned substrate; The shielding substrate is arranged corresponding to the base; Performing an exposure and development process on the conductive layer to pattern the conductive layer; as well as The shielding substrate is removed.

8. The method for manufacturing an electronic device according to claim 7, wherein: Before the exposure and development process is performed, a photoresist layer is formed on the conductive layer.

9. The method for manufacturing an electronic device according to claim 8, wherein: After the exposure and development processes are performed, an etching process is performed to pattern the photoresist layer.

10. The method for manufacturing an electronic device according to claim 7, wherein: After the exposure and development processes are performed, an etching process is performed to pattern the conductive layer.

Images