Half-bridge module having insulating connection surface between two transistor strip sections

Abstract

The half-bridge module (M) has a carrier (T) having a conductor track layer. The printed conductor layer has a first transistor strip section (LA), a second transistor strip section (HA) and an intermediate section (ZA), each extending in a first direction (R1). The intermediate section (ZA) is arranged between the first transistor strip section (LA) and the second transistor strip section (HA). A connection surface section (VF) of the first surface (F1) also extending in the first transistor strip section (LA) extends in an intermediate section (ZA). Connecting surfaces (P) insulated from the connecting surface sections alternate with the connecting surface sections in a first direction (R1).

Description

Background Art

[0001] A vehicle with an electric drive has an electric motor, the windings of which are energized in a switchable manner. In order to be able to achieve the required power, which is usually more than 100 kW, high currents of usually more than 100 amperes and operating voltages of usually more than 100 V, especially 800 V, are used. As a result, the windings are switched and energized using power transistors that generate switching edges with high current swings in a short time. In particular, in order to achieve even shorter switching edges or higher current rise rates of the transistors, extremely fast switching transistors, such as SiC transistors, are used. In order to be able to use such fast switching transistors effectively, in particular, very low-inductive wiring is required, in which the signal transit time can also be taken into account for reliable switching. The object of the present invention is to show the possibility of wiring high-performance transistors into a half-bridge in a low-inductive manner. Summary of the invention

[0002] This object is achieved by a half-bridge module according to claim 1. Further properties, features, embodiments and advantages are derived from the dependent claims, the description and the drawings.

[0003] It is proposed to subdivide the conductor track layer of the carrier into two strip sections and an intermediate section between the strip sections. These sections are strip-shaped and extend in the same direction. Therefore, these strips (perpendicular to the longitudinal direction of the strips) are stacked, wherein the intermediate section is between the strip sections mentioned above. The two strip sections on both sides of the intermediate section are provided for transistors, which can be applied there as bare chips (semiconductor components without housings), for example. A low total inductance is achieved in that an insulating connection surface is present in the intermediate section, which enables a direct and short connection into the upper first strip section due to its proximity, and a power contact field can be provided on the other hand, which is directly adjacent to the lower (second) strip section, so that the contact point on the insulating connection surface can be directly next to the contact point of the second strip section. Thus, a contact possibility of the insulating connection surface and the lower second strip section is provided, which guarantees a very small area between the connection surface and the second strip section, because the connection surface and the second strip section are directly adjacent. On the other hand, it is ensured that the current connection from the connection surface to the upper first strip section can also be very short, because the insulating connection surface also adjoins the first (upper) strip section or adjoins said first (upper) strip section. Thus, a low-inductance connection is obtained by the connection surface adjoining two strip sections. The first and second strip sections are arranged on both sides of the connection surface.

[0004] The first surface extends in the (upper) first strip section and further comprises a connection surface section extending into the middle section, preferably up to the (lower) second strip section. This enables a direct, low-inductance connection of the potential of the first surface to a contact point in the (lower) second strip section. Due to the connection surface section, the first surface adjoins the (lower) second strip section, making very short connections possible. The terms "lower" and "upper" relate, for example, to Figure 1 The top view of the module shown in Figure 1 The longitudinal direction of the carrier or conductor track layer runs from left to right. The term "strip section" is also used in short form as "strip." The strips are aligned with one another, in particular in a direction perpendicular to the first direction (ie perpendicular to the longitudinal direction).

[0005] Thus, in the middle section, connection surface sections (especially as part of the first surface extending in the first strip) and insulating connection surfaces alternate along the extension of the strip (i.e. along the first direction or longitudinal direction). The insulating connection surface and the first surface extending on the first strip section and the middle section are adjacent to the (lower) second strip section, but are preferably electrically separated from the (lower) second strip section via grooves in the printed conductor layer. For the connection surface section (i.e. part of the first surface), this means a very short connection possibility with the second (lower) strip section, and for the insulating connection surface, this means a contact possibility very close to the contact possibility of the second (lower) strip section. As a result, the feed devices to these contact locations can be very close to each other. Low inductance results from the close laying of the feed devices.

[0006] Finally, a connection surface section of the first surface, which also extends in the (upper) first strip section, enables a contact point for a feed device that is located essentially in the center between the first and second strip sections. The contact points for the feed device are thus arranged approximately the same width from components such as transistors that are located in or on the strip section. This results in approximately the same signal transit times to transistors in different strip sections. As a result, the switching edge generated by the component on or in the first strip section arrives at the contact section on the connection surface section approximately at the same time as the switching edge that occurs in or on the second strip section. This avoids asymmetry during control, so that the signal transit times do not have to be adapted in the control. Instead, the time symmetry of the components of the two strips results only from the layout of the printed conductor layer. The terms used here relate in particular to Figure 1 , which will be discussed in more detail in the description of the figures. The strip segments described here can in particular be equipped with transistors and are therefore also referred to as transistor strip segments.

[0007] The conductor track layer described here has the following layout, which has a first surface, a second surface and an insulating connection surface. These three elements are separated from each other in the conductor track layer and are electrically separated, in particular, by the structure of the conductor track layer. Therefore, the surfaces of the conductor track layer are separated; the structure of the conductor track layer provides an electrical separation of the surfaces. The separation of the surfaces can be provided by etching or milling or other structured shaping measures.

[0008] The printed conductor layer is furthermore geometrically divided into two strip sections and an intermediate section therebetween. This division into sections is only imaginary or functional, and these faces are physically and especially electrically separated from each other in the printed conductor layer. Being divided into strips does not necessarily mean electrical subdivision, but does not exclude the electrical subdivision. The strip sections and the intermediate section are directly arranged in a row (in a direction perpendicular to the first direction). These sections preferably completely cover the carrier or its power region. In particular, these sections are aligned in a direction perpendicular to the first direction. Like the face, the section relates to the maximum side of the carrier (i.e. in a top view, not a cross section). The printed conductor layer is especially the conductive outer layer of the carrier. The strip sections, in particular, extend from the outer edge of the printed conductor layer to the intermediate section respectively. These outer edges extend along the first direction, and in particular extend along the longest edge of the carrier. The strip sections and the intermediate section preferably extend from one side of the printed conductor layer to the opposite side, wherein these sides are perpendicular to the outer edge. In the case of a rectangular carrier, the sides are the shorter sides of the rectangle and the outer edges are the longer sides of the rectangle.

[0009] The first surface extends over the first strip section and over a connecting surface section extending from the first strip section into the middle section and in particular adjacent to the second strip section. The connecting surface section and the part of the first surface located in the first strip section are preferably electrically connected to each other by an integral construction or also by an electrical connection element. The first surface is electrically insulated from the second surface (by the structure of the printed conductor layer) because the printed conductor layer has a gap between the first surface and the second surface, which extends through the entire thickness of the printed conductor layer. The gap or the resulting groove extends between the second surface and the connecting surface section.

[0010] On the one hand, the insulating connection surface is surrounded by a connection surface section of the first surface (within the middle section) and by (a part of) the first surface extending in the first strip section, and further surrounded by (a section of) the second surface. The second surface can have an edge extending essentially along the first direction (the strip section or the middle section also extends along the first direction). The first surface and the connection surface reach this edge (except for the electrically isolating trench). The edge parallel to this can correspond to the outer edge.

[0011] The connection surface section and the insulating connection surface reach all the way to the second surface. However, the connection surface section and the insulating connection surface are electrically insulated from the second surface by structures in the printed conductor layer. Between the first surface, the second surface and the connection surface, the printed conductor layer has insulating structures extending through the entire thickness of the printed conductor layer. These structures are preferably recesses, such as gaps or grooves. The distance obtained between these surfaces can correspond to the minimum creepage distance, so as to ensure that the surfaces are fully insulated from each other.

[0012] The first surface, the second surface and the connection surface extend in the same conductor track layer. The conductor track layer is therefore structured only by grooves separating the second surface from the first surface and the connection surface and by grooves separating the insulating connection surface from the first surface. In particular, the connection surface and the connection surface section can be repeated several times in succession along the first direction, so that a connection that is symmetrical with respect to the transit time can be achieved. This ensures, in particular, that the components on the first surface and the components on the second surface are electrically contacted in the same manner (i.e. with respect to the inductance per unit length of the connection, with respect to the transit time and with respect to the resistance of the connection).

[0013] One side of the conductor track layer preferably constitutes the outside of the carrier. In other words, the conductor track layer is preferably not the middle layer of the multilayer carrier, but constitutes the upper side or the lower side of the carrier. The carrier also has an insulator layer, on which the conductor track layer is applied. The conductor track layer is in particular a metal layer, for example a layer made of copper or copper material or of aluminum or aluminum material. The insulator can be a plastic, a plastic composite material or preferably a ceramic insulator. The carrier can be constructed as a circuit board, for example a printed circuit board, a DCB circuit board or an IMS circuit board. The carrier can be constructed as a single layer, wherein the layer is composed of the conductor track layer, or can be constructed as a multilayer, wherein one of the two layers is composed of the conductor track layer. Other conductive layers can also be arranged in the carrier, wherein the conductor track layer is the outer layer of the carrier. The outer layer can be provided with an insulating coating. The coating is removed at the contact position for the lead or the region where the device is to be fastened.

[0014] The printed conductor layer is constructed as structured, i.e. forms a printed conductor structure. These printed conductor structures include a first face, a second face and / or an insulating connection face as described herein. In particular, the printed conductor layer extends in a plane. When the carrier is constructed with a single layer, it can be connected to a heat sink on the side of the carrier that faces away from the printed conductor layer. The insulating layer of the carrier can be connected to the heat sink, or the conductive layer of the carrier can be connected to the heat sink arranged on the opposite side of the printed conductor layer. The half-bridge module can be arranged in an equipped or unequipped manner.

[0015] The carrier is used in particular in a half-bridge module. The (equipped) half-bridge module has a plurality of high-side transistors connected in parallel to each other and a plurality of low-side transistors connected in parallel. The high-side transistor is connected in series with the low-side transistor via a connection point. The connection point can be used as a phase terminal or a load terminal, and the two ends of the series circuit can be connected to a supply voltage, i.e., to two supply potentials. When using this design, the high-side transistor can be placed on the second strip section (or on the second face), and the low-side transistor can be arranged on the first strip section (or on the first face, preferably in the first strip section). Since the two strip sections mentioned are suitable for placing transistors, these strips are also referred to as transistor strips.

[0016] The carrier can have a rectangular shape, wherein the long side corresponds to the first direction along which the strip sections also extend. The first strip section, the middle section and the second strip section are arranged in a row transversely thereto. The carrier can also have a power section, on which the strip section and the middle section are located, and the carrier can also have at least one other section, for example for connection technology, filters, control, etc. However, the carrier is preferably terminated at the edge of the two strip sections. The strip sections are arranged opposite each other, wherein the edges perpendicular thereto terminate the strip section and the middle section in the longitudinal direction. The first direction preferably extends along the longer edge of the rectangular shape of the carrier, but can also extend along the shorter edge of the rectangular shape of the carrier.

[0017] Therefore, a half-bridge module with a carrier is proposed, and the carrier has a printed conductor layer. The carrier is especially applied to the insulating layer and has an uncovered surface (upper side), which is opposite to the side (lower side) of the printed conductor layer adjacent to the insulating layer. The printed conductor layer has three sections in the form of strips. These strips extend along a first direction respectively. The strips extend parallel to each other in this direction. The printed conductor layer has a first transistor strip section, a second transistor strip section and an intermediate section (which can also be called a strip intermediate section because it has a strip shape like the other two strip sections). The shape of the strip section is especially a rectangular shape, wherein the length of each rectangle corresponds to the length of the printed conductor layer, and the sum of the widths of the strip section and the intermediate section together yields the width of the printed conductor layer.

[0018] The printed conductor layer is structured and constructed according to the layout mentioned above. The middle section is located between the first transistor strip section and the second transistor strip section. Therefore, there is an arrangement transversely to the first direction, that is, along the width of the printed conductor layer: the first transistor strip section, the middle section and the second transistor strip section. These sections are especially related to the plane in which the printed conductor layer extends. Therefore, the strips extend on the same surface or in the same plane. The strip sections and the middle section preferably fill the printed conductor layer for the most part or completely. The strip sections and the middle section are functional subdivisions of the printed conductor layer, and are not necessarily electrical subdivisions. In particular, there is a first surface that extends not only in the first strip section but also in the middle section, wherein there is no electrical subdivision between the surface subsection extending in the middle section and the surface subsection extending in the first strip section.

[0019] The connection surface section of the first surface extends in the middle section. The first surface also extends in the first transistor stripe section. The connection surface section is electrically connected to the surface extending in the first stripe section. Preferably, the first stripe section is substantially completely or at least mostly filled with the first surface, wherein in the middle section only a sub-region of the middle section is covered by the first surface (and constitutes the connection surface section).

[0020] In the middle section, there are also insulating connecting surfaces. These insulating connecting surfaces are filled exactly the same as the sub-regions of the middle section. However, these sub-regions do not overlap with the connecting surface sections. In particular, the connecting surface sections are electrically separated from the connecting surfaces. The electrical separation or insulation between the connecting surface and the connecting surface section relates to a printed conductor layer that can have a separation structure in the printed conductor layer for electrical separation. In other words, the connecting surface and the connecting surface section are insulated in the following manner, that is, the surface representing the connecting surface of the printed conductor layer is separated from the connecting surface section in the printed conductor layer. However, this does not necessarily mean that these two faces can be electrically connected to each other outside the printed conductor layer, for example, indirectly electrically connected via components, etc. Therefore, the connecting surface is insulated from the connecting surface section so that the printed conductor layer itself does not establish a connection between these two faces or face sections. The insulation of the connecting surface relative to the connecting surface section is produced by the entity separation in the printed conductor layer, for example, in the form of a groove being arranged between the connecting surface and the connecting surface section. In the same way, the second surface (the same conductor track layer) in the second strip section can be separated both from the connection area section and from the connection area.

[0021] In the middle section, the insulating connection surface and the connection surface section alternate along a first direction. The first direction extends along the longitudinal direction of the strip section or the longitudinal direction of the printed conductor layer or the carrier or the middle section. The first direction is perpendicular to the second direction. The first direction and the second direction are the directions in which the printed conductor layer extends in a planar manner. Both directions are perpendicular to the extension of the thickness of the printed conductor layer.

[0022] The first strip section, the middle section and the second strip section are arranged in a row with each other along the second direction. In other words, in the second direction, the area of ​​the first face located in the first strip section, the connecting face sections and connecting faces alternating in the first direction and the second face or the second strip section are arranged in a row again. Since the connecting face sections and connecting faces alternate in the first direction (and in the middle section), it is particularly concluded that the first strip section, the connecting face section and the second strip section are arranged in a row in the first longitudinal position, while the first strip section, the connecting face and the second strip section are arranged in a row in the second longitudinal position. In a first cross section perpendicular to the first direction, the first face (including the connecting face section) can be adjacent to the second face, while in a second cross section perpendicular to the first direction, the first face, the connecting face and the second face are arranged in a row. The first cross section and the second cross section are at different positions in the first direction (i.e., the longitudinal direction).

[0023] Preferably, the connection surface section is adjacent to the second transistor strip section. The second surface of the printed conductor layer, which extends mostly or substantially completely into the second strip section, is electrically insulated from the connection surface section (which belongs to the first surface). The connection surface is preferably also adjacent to the first transistor strip section, but is preferably electrically separated from the first surface extending (especially) in the first strip section. The connection surface is electrically separated from the connection surface section in the printed conductor layer. The surface mentioned here is especially the conductive surface of the conductive layer composed of the printed conductor layer. These sections relate to the geometric division of the printed conductor layer and should not necessarily be understood as electrically separated sub-areas of the printed conductor layer. The first surface extends in the first strip section and (as a connection surface section) extends in the middle section (and therefore there is a connection between the surface areas of different strips), while the second surface extends in the second strip section, so that the surface in the second strip section is separated from the middle section and separated from the first strip section in the printed conductor layer. The surface in the first strip section and the surface in the middle section are arranged separately from the surface in the second strip section. The separation is provided by separating structures in the conductor track layer.

[0024] The connecting surface section or the first surface and / or the connecting surface is adjacent to the second transistor strip section, but is not electrically connected to the second surface located in the second strip section (by means of a printed conductor layer). The connecting surface is in particular adjacent to the second strip section, but is not connected to the second surface located in the second strip section (by means of a printed conductor layer). Preferably, the connecting surface is arranged to be electrically separated from the first surface by the printed conductor layer, in particular from the part of the first surface located in the first strip section and from the connecting surface section. The printed conductor layer can thus play a separating role in that the printed conductor layer is structured in the printed conductor or pad or has a separating structure, such as a recess between the surfaces to be separated. The printed conductor layer plays an insulating role in particular in that the printed conductor layer has grooves or recesses extending through the entire thickness of the printed conductor layer. These grooves or gaps or recesses provide a physical separation between the surfaces, surface sections or surface sub-areas of the printed conductor layer. However, the carrier comprises at least one insulating layer to which the conductor track layer is fastened, so that despite the physical separation in the conductor track layer there is a mechanical connection (which is, however, electrically insulating).

[0025] The connection surface section preferably widens toward the second transistor strip section. In other words, the portion of the first surface representing the connection surface section widens toward the second transistor strip section. Therefore, the widening occurs along the second direction or perpendicular to the first direction, especially in the plane of the printed conductor layer. Alternatively or in combination therewith, the connection surface tapers toward the second transistor strip section. In this case, the reduced width is called tapering. This tapering or reduced width also involves extension along the second direction. Widening or tapering refers to the size of the relevant surface or section in the longitudinal direction, that is, along the first direction. Alternatively, the width of the connection surface section can remain the same or also decrease from the first strip section to the second strip section. In the same way, the connection surface can be widened from the first strip section to the second strip section, or the width remains the same. Here, the size in the longitudinal direction (=first direction) is also considered to be the width. As an alternative possibility, it can be provided that the connection surface has a greater width at the position where it adjoins the first strip section than at the position or edge where it adjoins the second surface or the second strip section. Between these locations, the extension can also be discontinuous or a taper and widening can be provided. Furthermore, the width of the connection surface section is preferably smaller at the location where it adjoins the first strip section than at the edge with which the connection surface section adjoins the second strip section or the second surface. The thickness of the conductor track layer is preferably constant (except for the locations where the conductor track layer has the recess).

[0026] The connection surface can have a plurality of connection parts in the area adjacent to the first strip section. At least one connector can extend from each connection part into the first strip section, preferably extending to the mounting surface for the device or extending to the device itself. In addition, the connection surface can have a link part, especially with a connection element provided for contacting the supply potential. In addition, the connection surface section can have a plurality of connection parts in the area adjacent to the second strip section of the connection surface section. At least one connector can extend from each connection part into the second strip section, especially extending to the mounting surface for the device or extending to the device itself. If a plurality of connectors extend from the connection part, these connectors can be connected to a plurality of devices in one of the strip sections or lead to a plurality of mounting surfaces in the relevant strip section. In addition, a plurality of connectors extending from the same connection part can be connected to the same device in one of the strip sections or lead to the same mounting surface, so as to increase the current carrying capacity thereby. A plurality of connector groups can extend from at least one connection surface and / or from at least one connection surface section, wherein each group has a plurality of connectors, which are provided for connecting the same device or extending toward the same mounting surface.

[0027] Preferably, the first surface and / or the second surface are each a continuous surface. In particular, the subregion of the first surface extending in the first strip section is a continuous surface together with the connecting surface section (or is at least directly electrically connected). The subregion of the first surface extending in the first strip section is in particular configured as a continuous strip, in particular configured as a continuous strip along the first direction (and also along the second direction).

[0028] The connecting surface section also belonging to the first surface is not continuous in the first direction, but alternates with the connecting surface. The connecting surface section extends from the sub-region of the first surface extending in the first strip section, that is, from the continuous strip toward the second transistor strip section. The connecting surface section especially extends all the way to the second surface. The connecting surface section therefore has an edge opposite to the second surface or the second strip section (the edge can extend along the first direction). In particular, there is a groove (or other separation structure) between the edge of the connecting surface section pointing to the second surface or the second strip section and the second strip section or the second surface itself in the printed conductor layer. The second surface can have an edge opposite to the edge of the connecting surface section. The edge of the connecting surface arranged on the side of the second surface or the second strip section is also preferably extended substantially along the first direction. The continuous structure of the connecting surface section and the sub-region of the first surface extending into the first strip section can realize, for example, a particularly simple electrical connection of the device in the first strip section with the contact or connecting element in the connecting surface section.

[0029] The second face is arranged in the second strip section. The second face is constructed to be conductive, for example, made of copper material, aluminum material or other conductive materials. The second face is constructed as a continuous face in the first direction. The second face is insulated from the first face, that is, in particular from the connection face section and from the connection face (by means of a separation structure in the printed conductor layer). Preferably, there is a groove between the connection face section and the connection face of the second face on the one hand and the first face on the other hand, and the groove preferably extends through the entire thickness of the printed conductor layer. The second face can have a mounting face for a transistor. The transistor or the associated mounting face is preferably arranged along the first direction. The transistor can extend along a row or along multiple rows along the first direction. These rows extend along the first direction. It is obtained that the mounting faces can be offset perpendicular to the first direction, especially periodically or alternately offset. This is especially obtained when the mounting faces are arranged in multiple rows (parallel rows) along the first direction. The mounting faces are therefore arranged in rows in the second face along the first direction, especially along one or more rows. These rows extend along the first direction. Embodiments of half-bridge modules with mounting surfaces are in particular unequipped half-bridge modules, wherein the arrangement of the mounting surface on the second surface, however, already ensures a small distance from the connection surface and the connection surface section, resulting in a low-inductance layout. The mounting surface is in particular designed for equipping with SMD components such as transistors.

[0030] Preferably, the first face also has a mounting surface in the first strip section. These mounting surfaces are suitable for transistors, i.e., they are constructed for SMD mounting of bare chip transistors or for equipping transistors based on other connection technologies, as the aforementioned mounting surfaces. The mounting surfaces are arranged in rows along the first direction. Like the aforementioned mounting surfaces, these mounting surfaces are arranged in rows at a distance along the first direction and are not directly attached to each other. The mounting surfaces can be arranged in one or more rows extending along the first direction. In other words, the mounting surfaces can be arranged at different heights with respect to the direction perpendicular to the first direction, i.e., they can alternately have different distances from the center line along the first direction. A half-bridge module with such a mounting surface is particularly unequipped. The mounting surface is constructed for high current applications, i.e., for continuous currents of at least 10A or at least 100A. This also applies to transistors when the module is equipped.

[0031] A very low-ohmic connection that can be produced cost-effectively is produced by the connection area section of the first surface extending from the first strip section toward the second strip section (and therefore in the middle section). Furthermore, the above-described arrangement of the mounting surface in the first strip section automatically results in a short connection section to the connection surface that is located in the middle section, whereby a connection to the first surface or to a component or connection element on the connection surface can be realized in a low-inductance manner.

[0032] A connecting element group is preferably arranged on the first surface, on the connecting surface and in the second strip section (i.e. on the second surface). The connecting element group on the first surface is preferably located in the first strip section and therefore along the strip of the first surface, the strip of the first surface extends continuously in the first direction. Each connecting element group preferably has a plurality of connecting elements arranged in a row along the first direction (with a distance). A group can also have a plurality of connecting element subgroups, each of which is arranged in a row along a row in the first direction, but wherein these rows are offset from each other perpendicular to the first direction. The connecting element can be constructed as a sintering pad, a contact surface, a solder connection pad, a welding surface, a connecting pin, a connecting sheet block or a fastening hole. The connecting element especially has a planar section extending on the printed conductor surface, so that a planar connection with the printed conductor layer is obtained. A connecting pin can be provided, which is, for example, pressed into the printed conductor surface, or fastened on the printed conductor surface (for example, by welding, such as friction welding, or solder connection or sintering, etc.). The connecting element is conductive. Preferably, leads are used, in particular connecting sheet metal blocks, wherein the leads have end sections fastened in a planar manner to the conductor track surface. For each first surface, for each second surface and for the connecting surface, preferably a plurality of end sections or contact locations are provided for each of these, in order to distribute the connections of the leads. Contact locations belonging to the same potential are preferably arranged in a row (spaced apart) along a first direction. In one example, the connecting element is configured as a fastening hole, for example, in order to be connected by means of a screw connection or a press-fit pin connection or a groove connection.

[0033] Elements which are electrically connected to each other via a conductor track layer and which are arranged in a row in a first direction or extend in this direction are preferably referred to as a connection element group. If the second strip section or the second surface is provided for a positive DC voltage supply potential and the connection surface is provided for a negative DC voltage supply potential, a low inductance is obtained simply by the proximity of the relevant connection elements. In particular, the connection elements of the first surface can be assigned to the phase potential, wherein a connection surface for the phase is obtained on one side at the first surface and a connection element on the second strip section and on the connection surface assigned to the DC voltage supply potential is obtained on the other side. In this way, the coupling of the clock control signal at the phase potential with the potential of the supply voltage can be prohibited or reduced. The connection elements of the phase potential are preferably located outside the region extending from the connection elements of the first supply potential to the connection elements of the second supply potential.

[0034] The semiconductor module with the connection pads is preferably unequipped. However, as mentioned, the arrangement of the connection pads results in a low-inductance connection possibility and, in general, a low-inductance layout.

[0035] One embodiment provides that the group of connecting elements located on the first surface is arranged in the middle section. In other words, in the case of these embodiments, the group of connecting elements located on the first surface is located on the connection surface section. As a result, for these connecting elements, a current path to the mounting surface on the first surface is obtained, which is, for example, roughly the same length as the current path to the mounting surface (for transistors) on the second surface. Due to this symmetry, improved signal characteristics are obtained, especially in the case of edges with high rise speeds, and also related to the connection resistance of the mounting surface / transistor. One embodiment provides that the group of connecting elements located on the first surface is located in the center between a row of mounting surfaces in the first strip section and a row of mounting surfaces in the second strip section. The deviation from the center preferably does not exceed 20 mm, 15 mm, 10 mm or 5 mm.

[0036] The first connector preferably starts from the connection surface. These first connectors extend in particular into the first strip section. The connector is preferably located on the upper side of the carrier or on the printed conductor layer. The connector starts from the area of ​​the connection surface facing the first strip section. The connector extends into the first strip section and can be connected to the contact surface there. These contact surfaces can be part of the first surface, but can also be constructed for application devices. In particular, the end of the connector opposite to the connection surface is constructed for physical connection to the contact surface of the device. The first connector can start from the connection surface and extend into the first strip section (or extend across the half space), or multiple connectors can be connected to the same connection surface and extend to different parts of the first strip section. Thus, multiple elements in the strip section can be connected to the same connection surface.

[0037] Other embodiments provide that the half-bridge module has a second connector, which is connected to the connection surface section. The second connector extends from these connection surface sections above the carrier into the second strip section. In this case, the second connector extends from the connection surface section into the second strip section in a half space above the carrier or the printed conductor layer. The second connector has an end, which is opposite to the connection surface section and is set up for connection to an element in the second strip section, for example, to a contact part of the strip section or preferably to a contact surface (such as a metallized surface of a device) configured to connect a device in the second strip section. A plurality of second connectors can extend from the connection surface section into the second strip section.

[0038] The connector is in particular configured as a bonding wire or bonding strip and can be made of an electrically conductive material such as a copper material or an aluminum material. In particular, the second connector is connected to the connection surface section in the region adjacent to the second strip section. The connector can be configured as a single piece or multiple pieces, in particular with end contact elements and conductors connecting these end contact elements to each other. The end contact elements can be configured, for example, as pins, screw elements or connecting sheet metal blocks or also as conductor ends on the joint.

[0039] The half-bridge module can be configured as a partially equipped, equipped or unequipped module. In particular, the half-bridge module can be equipped with surface mount devices, i.e., SMD devices. The half-bridge module can be equipped with first and second transistors as an equipped half-bridge module. The first surface of the printed conductor layer located in the first strip section can be equipped with a first transistor. In other words, the first transistor is arranged on a surface section of the first surface located in the first strip section, i.e., in a section of the first strip section that is continuous along the first direction. The second surface extending in the second strip section can be equipped with a second transistor. Since these strip sections are configured to be equipped with transistors in the case of an unequipped half-bridge module, and the strip sections are equipped with transistors in the case of an equipped half-bridge module, these strip sections can also be referred to as first and second transistor strip sections. In addition to being equipped with the aid of SMD technology, it is also possible to be equipped using interlaced technology or embedded technology.

[0040] Each transistor has a first power path contact surface facing the printed conductor. The first power path contact surface is connected to the first surface. These contact surfaces are the contact surfaces of the transistor and are therefore connected to the emitter, collector, source or drain of the transistor. The transistor also has a second power path contact surface facing away from the first contact surface. Therefore, when the transistor is installed, the second contact surface is accessible from above and in particular constitutes a surface above the printed conductor layer. However, when the transistor is installed, the first contact surface is not accessible from above because the first contact surface is facing the printed conductor layer and is therefore covered by the transistor itself.

[0041] The second power path contact surface is also a contact surface connected to the collector, emitter, drain or source of the transistor. The first contact surface and the second contact surface are connected to different electrodes of the transistor. Thus, the first contact surface can be connected to the collector and the second contact surface to the emitter, or vice versa. The first contact surface can be connected to the source of the transistor and the second contact surface to the drain, or vice versa.

[0042] The connection of the second contact surface is arranged via a connector, in particular via the connector described in this article. The second contact surface of the first transistor arranged on the first surface is connected to the connection surface (in the middle section of the printed conductor layer). The second contact surface of the second transistor is connected to the connection surface section. The connection is direct and is guided in particular via the first and second connectors. The connector extends on the carrier. The first connector connecting the connection surface to the contact surface of the first transistor extends from the connection surface to the first strip section, in particular to the contact surface of the first transistor. The connector connected to the connection surface section extends all the way to the contact surface of the second transistor connected in the second strip section. The connector creates an electrically conductive connection between the contact surface of the transistor and the connection surface or the connection surface section. The connector can be directly adjacent to the contact surface, or there can be a connecting layer between the contact surface and the connector, such as a sintering layer, a solder transfer layer and / or a conductive buffer layer, for reducing mechanical stress. The above-mentioned contact surface (=metallized surface) is a power path contact surface.

[0043] The transistor can also have a signal contact surface as indicated in this document. The half-bridge module preferably has a half-bridge in an equipped form, which is composed of a low-side transistor element and a high-side transistor element and an internal connection between the transistor elements. Each transistor element of the half-bridge is preferably composed of a plurality of transistors connected in parallel. By connecting the transistors in parallel, several times the current carrying capacity of the transistor element to be obtained is obtained. The internal connection includes a first surface or at least a sub-region thereof. The internal connection is especially guided via a connection surface section. The internal connection can also include a connector, especially a connector extending from the connection surface section to the second strip section.

[0044] Embodiments provide that the internal connection between the transistor elements leads from the first contact surface of the first transistor to the first surface, in particular to a section of the first surface extending in the first strip section, wherein from there, the first surface continues to the first strip section. The internal connection continues from the connection surface section (i.e. from the first surface) by means of a connector leading to the second contact surface of the second transistor. Thus, starting from the first transistor or its contact surface, a part of the internal connection extends along a surface section of the first surface located in the first strip section, wherein the internal connection continues from there via a connection surface section, which also belongs to the first surface and is located in the middle section.

[0045] Since the connection surface section adjoins the second surface or the second strip section, only a short distance results for the connection to continue the internal connection from the connection surface section to the connector of the second transistor. The internal connection can also have a connection element, such as a soldering layer, a solder transfer layer, a sintering layer and / or a conductive buffer layer, located on the contact surface of the transistor to reduce mechanical stresses. Although the first transistor and the second transistor are located on the strip sections, wherein the intermediate section is located between the strip sections, a short and well-conductive connection provided by the printed conductor layer (as part of the internal connection) results via the connection surface section protruding from the first strip section to the second strip section.

[0046] Preferably, the two opposite ends of the half bridge are realized by a connection surface on the one hand and a second surface (in the second strip section) on the other hand. The connection surface and the second surface can each have a power contact field (or other connection element), for example in order to apply a supply DC voltage to the connection surface and the second surface. In particular, in this case, the connection surface constitutes a terminal for a negative supply potential and the second surface constitutes a terminal for a negative DC voltage supply potential. The power contact field arranged on the connection surface can constitute a negative terminal for the half bridge. The power contact field arranged on the second surface can constitute a positive terminal for the half bridge. The power contact field arranged on the first surface can constitute a phase terminal for the half bridge (and is connected to an internal connection of the half bridge).

[0047] The first surface can form a terminal for a connection point or for a phase potential or an AC potential. In particular, the first surface can be used as a load terminal.

[0048] The transistors may each have at least one signal contact surface. The signal contact surface of the first transistor is preferably arranged at the side of the transistor that faces away from the middle section, that is, facing outward (relative to the first direction) toward the longitudinal edge. The signal contact surface of the second transistor is preferably arranged at the side of the second transistor that faces away from the middle section, that is, toward the second longitudinal edge opposite to the first longitudinal edge. The signal contact surface can thus be contacted from the outside over a short path. The signal contact surface is in particular a control signal contact surface, such as a gate contact or a base contact. In addition, the signal contact surface can be used as a monitoring signal terminal, for example, as a temperature signal terminal or a current measurement terminal.

[0049] The half-bridge module can also have a filter circuit (in an unequipped, partially equipped or fully equipped form). In particular, the half-bridge module is equipped with a filter circuit that short-circuits the high-frequency signal component. The filter circuit can be constructed as a buffer filter. The filter circuit can be arranged in the second transistor strip section, in particular on the second surface. In addition, the filter circuit can be arranged on the connection surface. In addition, a filter circuit can be provided, which has not only at least one component on the second surface or in the second strip section but also at least one component on the connection surface (or connection surface section).

[0050] The half-bridge module is in particular a half-bridge module of an inverter module, wherein the inverter module comprises a plurality of half-bridge modules. The inverter module can be constructed as a vehicle traction inverter. The half-bridge module is in particular a high-voltage module having a nominal voltage greater than 60V or at least 200V, 400V or 800V. In addition, a vehicle-side charging circuit having a power factor correction filter can be provided, the power factor correction filter having at least one half-bridge module in the half-bridge module. Finally, a vehicle-side clock-controlled DC converter can be provided, whose operating switch is provided by the half-bridge module. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 , Figure 2a -c and Figure 3 For explaining an exemplary embodiment of a half-bridge module in more detail. DETAILED DESCRIPTION

[0052] Figure 1 The schematic top view shows a half-bridge module M having a carrier T on which a conductor track layer is located. The conductor track layer is structured into a plurality of surfaces F1 , F2 , ie is subdivided electrically and, for a more detailed description below, geometrically or functionally into a plurality of segments LA, ZA, HA.

[0053] The segments for geometrically subdividing the conductor track layer are a first strip segment LA, a second strip segment HA and an intermediate segment between the strip segments. In the example shown, the strip segment directly adjoins the intermediate segment. Thus, the entire surface or conductor track layer shown is subdivided into two strip segments and an intermediate segment with reference numerals LA, HA and ZA. The intermediate segment ZA also has a strip shape. These segments are aligned with each other perpendicularly to the first direction R1.

[0054] The strip sections LA, HA and the middle section ZA are shown in the form of (rectangular) strips, which extend with their longer dimension along a first direction R1. A second direction runs perpendicularly to the direction R1 in the plane of the drawing, along which the first strip section LA, the middle section ZA and the second strip section HA (in this order) are arranged in a row. The direction R1 extends along the length of the rectangular carrier shown, while the direction R2 extends in the width (i.e. along the shorter dimension of the rectangle). The entire surface or upper side of the carrier is divided into the sections LA, HA and ZA. It is also possible to provide a carrier which has a power region subdivided into the sections LA, ZA and HA in addition to at least one other region.

[0055] On the one hand, the first surface F1 extends in the first strip section LA, wherein the surface F1 substantially completely fills Figure 1. The surface F1 further extends in the middle section ZA and forms a connecting surface section VF. In the first strip section, the first surface is continuous (especially in the direction R1), while the first surface is repeatedly interrupted in the direction R1 in the middle section ZA (by the insulating connecting surface P). This results in a plurality of connecting surface sections VF, which belong to the first surface F1 and diverge from the continuous surface area of ​​the surface F1 in the first strip section. Other embodiments provide a two-part first surface, having a first part in section LA and a second part in section ZA (as a connecting surface section VF), wherein the first part and the second part are connected via a connecting element, but belong together to the same printed conductor surface.

[0056] Furthermore, a connection surface P extends in the central section ZA, which connection surface is electrically isolated from the first surface (ie, also from the connection surface section VF) (ie, can assume a different potential). Figure 1 The connection surface P also extends in the middle section ZA from the first strip section LA to the second strip section HA (and is electrically separated from the surface F2 in the middle section ZA in the conductor track plane). The extension of the connection surface P in the middle section ZA from the first strip section LA to the second strip section HA is perpendicular to the direction R1 (and along the carrier T).

[0057] The first face F1 and the connection face P are insulated relative to the second face F2. There is a gap L between the middle section ZA and the second strip section HA. The gap electrically separates the second face (and therefore the second strip section) from the first face F or its connection face section VF and from the connection face P. The gap L is shown in the form of a groove extending along the direction R1. The printed conductor layer is completely cut along the groove in its thickness. The connection face P is also insulated relative to the first face F1 in that the printed conductor layer has a gap extending along most of the outer edge of the connection face P. Therefore, the connection face is insulated relative to the connection face section VF and relative to the surface area of ​​the first face F1 extending in the first strip section LA by means of the groove. The connection face P (and the first face or its connection face section VF) is separated relative to the second face F2 by the gap L shown. This separation produces electrical insulation of the second face F2 from the first face F1 and electrical insulation of the second face F2 relative to the connection face P. For this purpose, the carrier T has an insulator layer, on which the printed conductor layer is constructed.

[0058] The conductor track layer is thus structured by the described grooves or recesses. The grooves or recesses define the layout of the conductor track layer. According to other views, the surface of the conductor track layer or its outer edge defines the layout of the conductor track layer or the half-bridge module.

[0059] In schematic Figure 1 , the connecting surface P has a substantially rectangular cross section. This also applies to the connecting surface section VF. However, this is one of many possibilities and should only be shown schematically: the connecting surface section VF and the connecting surface P together substantially completely fill the middle section ZA, so that the connecting surface section VF and the connecting surface P extend substantially all the way to the second face F2 or to the second strip section HA, and so that the connecting surface section VF and the connecting surface P can thus be brought into contact with the short connector V' from the second face F2.

[0060] Figure 2a-2c Some further embodiments of the geometrical configuration of the connecting surface P or the connecting surface section VF are schematically shown.

[0061] Figure 1 The embodiment of the half-bridge module M shown in is an equipped half-bridge module with a first transistor LT and a second transistor HT. The first transistor LT is arranged on a first face F1 in a first strip section LA. Thus, the first transistor is fastened to a sub-region of the first face F1 which is continuous along a direction R1 (or is located in the first strip section LA). The connecting face section VF extends from this continuous face region starting from the first face F1 toward the second strip section HA.

[0062] The second transistor HT is arranged on the second surface F2 and is therefore arranged in the second strip section HA. The second transistors HT are arranged in rows at regular intervals along the direction R1. The first transistors LT are also arranged in rows at regular intervals along the first direction R1 on the first surface F1 (in the first strip section LA). Two rows of transistors are obtained, which are located in opposite edge areas of the carrier T or the printed conductor surface (i.e. in the first and second strip sections LA, HA separated from each other). The connection surface section VF or the connection surface P extends between the first transistor on the one hand and the second transistor on the other hand. In other words, the second strip section extends between the rows of transistors LT, HT, wherein the surface or surface section provided there is used to connect the transistors.

[0063] Within the printed conductor layer, the connection surface P is electrically insulated from the first surface F1 (and also from the second surface F2). However, there is a connector V which connects the connection surface P to the transistor LT. A variant is shown in which the connection surface is connected to a plurality of transistors (here: two) via a plurality of connectors V (two are shown). To this end, each transistor LT has a power path contact surface OK, from which the connector V extends to the connection surface P. The power path contact surface OK is, in particular, a metallization layer of the transistor LT and relates to the power terminal (drain, source, emitter or collector) of the transistor. The connector V can, in particular, be a wire, a sheet metal block, a conductive bridge element, a bonding tape or a bonding strip, for example made of aluminum material or of copper material or of another electrically conductive material. A larger connection surface P is shown (in Figure 1 The three left connection surfaces P) are connected to two transistors or to two contact surfaces OK respectively. The connection surface P is smaller, that is, the connection surface located on the far right is smaller and is connected to only one transistor LT. The connection surface P can therefore be connected to different numbers of transistors at the same time, wherein the connection surface P can also be of different sizes.

[0064] The same applies to the connecting surface sections VF which may have different widths (dimensions in the direction R1), such as Figure 1 As shown in . The connection surface section VF shown on the far left is not as wide as the connection surface section VF that follows to the right. Here, the connection surface section VF is also connected to different numbers of transistors LT. Three larger connection surface sections are connected to two transistors LT, while the narrower connection surface section VF on the left is only connected to one transistor LT. Although the number or area size or width are different, no asymmetry is found in electrical terms. The second transistor HT also has a power path contact surface OK' respectively. These power path contact surfaces can be constructed like the power contact surface OK. The connection surface section VF is connected to the corresponding contact surface OK' of the transistor HT via the corresponding connector V'.

[0065] Each transistor LT is connected to one of the illustrated connection surfaces P. Each transistor LT is connected to one of the illustrated connection surface sections VF. However, additional connection surface sections or connection surfaces may be provided which have no connection to the transistors, ie no connection via the connectors V, V'.

[0066] Figure 1A plurality of groups of connecting elements 1, 2, 3 are shown. The first group of connecting elements 1 is located on the connecting surface section VF. Generally speaking, this group of connecting elements 1 is located on the first surface F1. Therefore, an embodiment can also be provided in which the first group of connecting elements 1 is not arranged in the middle section ZA on the first surface F as shown, but is arranged in the first strip section LA on the first surface F1. In other words, the connecting elements can also be located on a surface area of ​​the first surface F1 that is continuous in the direction R1, that is, located in the first strip section LA. Therefore, two possibilities for arranging the first group of connecting elements 1 can be arranged. Therefore, there is the possibility of arranging the first group of connecting elements 1 on the connecting surface section VF as shown, or placing the first connecting elements in the edge area of ​​the first strip section LA, which is facing away from the middle section ZA, as shown with the reference numeral 1'. Therefore, the first group of connecting elements 1' arranged between the transistors LT of the first strip section LA is shown. The first group of connecting elements 1 or the first group of connecting elements 1' comprises connecting elements that are arranged distributed (and spaced apart from each other) in the direction R1. The potential of the first surface can thus be connected at multiple locations to a (first) connecting conductor that conducts the potential of the first surface F1 . This is in particular a phase potential or load potential and corresponds electrically to the potential of the internal connection of the half bridge.

[0067] Furthermore, a group of second connecting elements 2 is shown. Each connecting surface P shown has (at least) one connecting element 2. The connecting elements 2 are provided for connection to the same (second) connecting conductor, i.e., are connected to one another via this connecting conductor. The second connecting elements are provided for conducting the same potential, in particular a DC voltage supply potential (e.g. a negative supply potential). The group of second connecting elements 2 is located on the connecting surface P and therefore in the middle section ZA.

[0068] In the embodiment shown, the first group of connecting elements 1 and the second group of connecting elements 2 are arranged in two rows, which extend along the direction R1 and are located in the middle section ZA. The use of connecting elements arranged as shown with reference numeral 1 allows connection paths to the individual transistors LT, HT, which are approximately the same length. The connecting elements shown with reference numeral 1 ' enable connection to the first face F1 at locations facing away from the second strip section. In addition, these locations are at least half the width of the first strip section away from the connection face P or the connecting elements 2.

[0069] A group of third connecting elements 3 is arranged in the second strip section HA, that is, on the second face F2. These connecting elements are also arranged along rows extending in the direction R1. In general, different groups of connecting elements 1, 1', 2 and 3 can be arranged in multiple rows, which are staggered with each other approximately perpendicular to the direction R1 (especially along the carrier T).

[0070] The connector V is shown connecting the contact surface OK of the transistor LT to the connection surface P. In the same way, the connector V' is shown connecting the connection surface section VF to the contact surface OK' of the transistor HT. If the half-bridge module M is not equipped with transistors, only the following layout is possible: the connectors V, V' can be designed to be correspondingly short and can extend from the connection surface section VF or the connection surface P into the strip sections LA, LH. In the case of an unequipped embodiment, Figure 1 At the location where the transistor is drawn in, there is a mounting surface for the transistor or a connection element for the transistor, for example an electrically conductive connection element or the like.

[0071] Figure 1 The figure shows an equipped half-bridge module M with transistors which, in addition to the power contact surfaces OK, OK', also have a signal contact SK. A transistor is shown which has two signal contacts in each case. These signal contacts can be designed, for example, as gate terminals or Kelvin terminals (temperature signal terminals) or sensing terminals (current detection terminals). A transistor with three signal contact surfaces SK, SK' or with only one signal contact surface SK, SK' can also be provided.

[0072] Because in Figure 1 In the case of the layout of the printed conductor layer shown in , not only the connection surface P but also the connection surface section VF extends between the two strip sections LA and HA, so that a direct and short connection path is obtained not only for the transistors in the first strip section LA but also for the transistors in the second strip section HA, so as to realize a half bridge. The transistors LT shown are connected in parallel to each other. This also applies to the transistors HT in the second strip section HA. The parallel connection is obtained in the following manner, that is, the first transistors LT are installed on the same first surface F1, and in the following manner, that is, the second transistors HT are all installed on the second surface F2. In addition, the parallel connection of the first transistors LT is obtained in the following manner, that is, the connection conductors not shown or the short-circuit connections not shown contact the connection surface P together, thereby these connection surfaces are short-circuited. In addition, the parallel connection of the second transistors HT is obtained in the following manner, that is, each second transistor (via the connector V') is connected to the first surface F1 or to the connection surface section VF, and the first surface F1 or the connection surface section VF converges in the first strip section because the surface 1 is continuous there.

[0073] The connecting element 2 is in particular a connecting element of negative potential, and the connecting element 3 is a terminal for positive potential. These two potentials are the potentials of the supply DC voltage. The connecting element 1 constitutes a terminal for the potential of the connection point or internal connection between the two transistor elements of the half-bridge module shown, and the two transistor elements are derived from different transistor groups. The potential of the connecting element 1 can be used as a load terminal or a phase terminal, for example for a motor. This also applies to the connecting element 1 '. A first connecting conductor connected to the first connecting element 1 can be provided. The first connecting conductor can be a phase terminal of the half-bridge module. A second connecting conductor connected to the second connecting element 2 can be provided. The second connecting conductor can be a negative supply potential conductor of the half-bridge module. A third connecting conductor connected to the third connecting element 3 can be provided. The third connecting conductor can be a positive supply potential conductor of the half-bridge module.

[0074] A filter circuit, such as a buffer, can be provided, and the filter circuit can be arranged, for example, at the position indicated by the cross. These positions are in the edge region of the second face adjacent to the middle section (or the connection face P). For example, each filter circuit can be constructed as an SMD device mounted on the second face F2. In addition, the filter circuit can also be connected to the connection face by means of a bonding connection. If the filter circuit has a surface contact, the bonding connection can extend from the connection face P opposite to the filter circuit to the surface contact. This SMD device also has other contact surfaces, and the SMD device is mounted on the second face using the other contact surfaces. The filter circuit can also be located on the connection face P in the edge region of the connection face P adjacent to the second face.

[0075] Figure 2a , b and c show further geometrical embodiments for illustrating the connecting surface P or the connecting surface section VF. Figure 2a-2c The corresponding surface F1 corresponds to the first surface F1 within the first strip section LA and within the surface area of ​​the first surface F1 constituting the connecting surface section. The first sub-area of ​​the first surface F1 is located in the first strip section LA and is continuous in the direction R1. The connecting surface section VF leads from the first sub-area to the second strip section HA or to the second surface F2. In the middle section between the first surface area of ​​the surface F1 and the second surface F2, a connecting surface P is provided. It is schematically shown that the connecting surface section VF and the connecting surface P basically completely cover the middle section (also with a part of the printed conductor layer), wherein only the gap between the connecting surface section VF and the connecting surface P interrupts the originally continuous printed conductor layer.

[0076] exist Figure 2aIn the figure, the connecting surface P has a first area, which is adjacent to a continuous sub-area of ​​the first surface F1 and is essentially rectangular, followed by a gradually tapering section in the direction of the second surface F2. A trapezoidal-shaped tapering portion is shown. In the direction of the second surface F2, another sub-area follows, which is rectangular like the first sub-area, but is constructed to be narrower than the first sub-area. The connecting surface section VF shown in Figure 2 is constructed complementary to this. The connecting surface section VF shown extends essentially in a rectangular shape starting from a sub-area of ​​the first surface F1 located in the first strip section in the direction of the second surface F2, followed by a widened section. After the widened section, there is a sub-area that is also rectangular in the direction of the second surface F2, which is, however, wider than the first-mentioned sub-area. Therefore, Figure 2a An insulating connection surface P is shown in the form of a trapezoid, which is followed by rectangles of different sizes in a direction perpendicular to the pair of parallel sides of the trapezoid.

[0077] Figure 2b Another embodiment of the insulating connecting surface P is shown. The insulating connecting surface has a first rectangular sub-area, followed by a trapezoidal shape in the direction toward the second surface F2. Figure 2a Same as in Figure 2b In the embodiment of the invention, the adjacent connecting surface section VF in question is designed to be complementary to the connecting surface P. The subsequent trapezoidal shape, which tapers toward the second surface F2 , adjoins the second surface F2 .

[0078] Figure 2c Another embodiment is shown with a trapezoidal connecting surface P, the wider side of the parallel side pair of the trapezoid adjoining the surface section of the first surface F1 located in the first strip section, while the shorter side of the parallel side pair of the trapezoid adjoining the second surface F2 (but not in contact with the second surface). It can also be seen here that the connecting surface section VF can generally be constructed to be complementary to the connecting surface P.

[0079] The groove between the connection surface P and the connection surface section VF extends around a large part of the connection surface P and preferably has a substantially constant width along this extension. The groove is also arranged between the second surface F2 on the one hand and the connection surface section VF and the connection surface P on the other hand. The groove can also be equipped with a constant width in the extension direction. The two grooves completely surround the connection surface P, so that the electrical insulation in the printed conductor layer generated by the grooves causes the connection surface P in the printed conductor layer to be an electrical island, that is, insulated in the structured printed conductor layer (from the surrounding area). In addition to the conductive surface, the structure responsible for the electrical interruption in the printed conductor layer also belongs to the printed conductor layer.

[0080] Figure 3An alternative embodiment of a filter circuit with a capacitor component C and a resistor component R is shown. Between the second surface F2 and the connection surface P, there is an intermediate island ZI, which is separated from the second surface F2 and the connection surface P and also from the first surface or the connection surface section VF by a trench. The intermediate island ZI is a conductive surface that is insulated from the adjacent area of ​​the printed conductor layer. The intermediate island ZI is located in the edge area of ​​the second strip segment HA facing the middle segment ZA, in the edge area of ​​the middle segment ZA facing the second strip segment HA, or in a region including both edge areas.

[0081] Starting from the second face F2, a resistor R bridges the gap between the second face F2 and the intermediate island ZI. In other words, the resistor R connects the second face F2 to the intermediate island. The intermediate island ZI is also connected to the connection surface P via a capacitor C, wherein the capacitor C bridges the gap between the intermediate island and the connection surface. The capacitor and the resistor can also be arranged at the interchanged position. A series RC element is obtained, via which the second face F2 is connected to the connection surface P. The RC element thus connects the two DC supply potentials of the module as a high-pass filter.

[0082] Figure 3 The filter circuit shown in FIG. 1 can be arranged in particular in Figure 1 The middle island is constructed as part of the printed conductor layer. In the same way, the second surface, the first surface and the connection surface constitute parts of the printed conductor layer, but these parts (within the printed conductor layer) are separated from each other.

Claims

1. A half-bridge module (M) having a carrier (T), the carrier having a printed conductor layer, the printed conductor layer having a first transistor strip segment (LA), a second transistor strip segment (HA) and a middle segment (ZA) each extending along a first direction (R1), wherein the middle segment (ZA) is arranged between the first transistor strip segment (LA) and the second transistor strip segment (HA), and wherein in the middle segment (ZA), connection surface segments (VF) of a first surface (F1) also extending in the first transistor strip segment (LA) and connection surfaces (P) insulated from the connection surface segments alternate in the first direction (R1).

2. The half-bridge module (M) according to claim 1, wherein the connection surface section (VF) adjoins the second transistor strip section (LA) and is insulated from the second transistor strip section and / or wherein the connection surface (P) adjoins the first transistor strip section (LA).

3. The half-bridge module (M) according to claim 1 or 2, wherein the connection surface section (VF) widens toward the second transistor strip section (HA) and / or wherein the connection surface (P) tapers toward the second transistor strip (HA).

4. A half-bridge module (M) according to claim 1, 2 or 3, wherein the first surface extends in the first transistor strip section (LA) as a continuous strip in the first direction (R1), wherein the connecting surface section (VF) extends from the continuous strip toward the second transistor strip section (HA).

5. A half-bridge module (M) according to any of the preceding claims, wherein a second surface (F2) extends in the second transistor strip section (HA), the second surface being insulated from the first surface (F1) and from the connection surface (P) and having a mounting surface for a transistor (HT), the mounting surface extending in one row or in multiple rows along a first direction (R1).

6. The half-bridge module (M) according to claim 1, wherein the first surface (F1) has mounting surfaces for transistors (HT) in the first transistor stripe section (LA), the mounting surfaces extending in one or more rows along the first direction (R1).

7. A half-bridge module (M) according to any of the preceding claims, wherein a group of connecting elements (1, 2, 3) are respectively arranged on the first surface (F1), on the connection surface (P) and in the second transistor strip section (HA), and the connecting elements are constructed as sintering pads, solder connection pads, welding surfaces, connecting pins, connecting sheet blocks or fastening holes.

8. A half-bridge module (M) according to claim 7, wherein the group of connecting elements (1) located on the first surface (F1) is arranged in the middle section (ZA) or is located with a deviation in the center between a row of transistor mounting surfaces in the first transistor strip section (LA) and a row of transistor mounting surfaces in the second transistor strip area (LA), wherein the deviation does not exceed 20 mm, 15 mm, 10 mm or 5 mm.

9. A half-bridge module (M) according to any of the preceding claims, comprising a first connector (V), which is connected to the connection surface (P) and extends from the connection surface (P) above the carrier (T) to the first transistor strip segment (LA), and the half-bridge module (M) further comprises a second connector (V'), which is connected to the connection surface segment (VF) and extends from the connection surface segment (VF) above the carrier (T) to the second transistor strip segment (HA).

10. A half-bridge module (M) according to any of the preceding claims, which is equipped with a first and a second transistor (LT, HT), wherein the first surface (F1) of the printed conductor layer in the first transistor strip section (LA) is equipped with a first transistor (LT), and the second surface (F2) extending in the second transistor strip section (HA) is equipped with a second transistor (HT).

11. The half-bridge module (M) according to claim 10, wherein A first power path contact surface of the first transistor (LT) is connected to the first surface (F1), A first power path contact surface of the second transistor (HT) is connected to the second surface (F2), A second power path contact surface (OK) of the first transistor (LT) is connected to the connection surface (P) via a first connector (V) extending above the carrier (T), and A second power path contact surface (OK′) of the second transistor (HT) is connected to the connection surface section (VF) via a second connector (V′) extending above the carrier (T).

12. A half-bridge module (M) according to claim 10 or 11, comprising a half-bridge, the half-bridge having a low-side transistor element, a high-side transistor element and an internal connection between the transistor elements, wherein the low-side transistor element is formed by the first transistor (LT), the high-side transistor element is formed by the second transistor (HT), and the internal connection includes the first face (F1).

13. A half-bridge module (M) according to claim 10, 11 or 12, wherein the first and second transistors (LT, HT) respectively have signal contact surfaces (SK, SK'), wherein the signal contact surface (SK) of the first transistor (LT) is arranged on the side of the first transistor (LT) facing away from the middle section (ZA), and the signal contact surface (SK') of the second transistor (LT) is arranged on the side of the second transistor (LT) facing away from the middle section (ZA).

14. The half-bridge module according to claim 1, wherein the half-bridge module is equipped with at least one filter circuit (F1; C, R), wherein the at least one filter circuit (F1; C, R) is arranged in the second transistor strip section (HA) and / or on the connection surface (P).

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