A time-frequency shaping femtosecond laser conformal antenna patterning on-line processing monitoring device

Abstract

The application discloses a kind of based on cross-scale space-time frequency shaping femtosecond laser's conformal antenna component manufacturing system and method, belong to micro-nano processing technical field.The system includes ultrafast laser excitation module, laser pulse time / frequency shaping module, pulse detection module, online monitoring module and focusing high-speed scanning galvanometer module.Through the system, realize high selectivity, large format, three-dimensional precision machining to conformal antenna circuit pattern, ensure that substrate is undamaged.Processing process is combined with femtosecond laser time-frequency shaping technology, adjustable pulse sequence and high-speed galvanometer system are used to realize the layering scanning and accurate removal of heterogeneous multilayer structure, avoid the problems of material damage, low size accuracy and other problems existing in prior art.The application also integrates online depth monitoring function, significantly improves processing efficiency and forming quality, and is suitable for high-precision patterning of complex curved surface heterogeneous thin film materials.

Description

Technical Field

[0001] This invention relates to a conformal antenna component manufacturing system and method based on cross-scale spatiotemporal frequency shaping femtosecond laser, belonging to the field of micro-nano fabrication technology. Background Technology

[0002] With the increasing demands for high-speed flight and long-range reconnaissance / jamming from various aircraft, missiles, and satellites in the aerospace field, as well as the ever-increasing requirements for the integration of communication equipment, the protruding structure of traditional rigid non-conformal antennas can affect the aerodynamic performance of fighter jets. Excessively large antenna cross-sections are also detrimental to aircraft stealth, failing to meet the ever-growing requirements of advanced aircraft applications. Conformal antennas, which can perfectly integrate with the shape of aircraft and other weapon platforms, have emerged and are increasingly widely used. High-performance conformal antennas possess characteristics such as low profile, flexible installation location, and large antenna aperture, offering significant advantages in advanced aircraft applications. They are key functional components of aerospace equipment, and their stability and reliability directly determine the performance and service life of the equipment.

[0003] The curved composite thin film material required for conformal antennas is a composite material consisting of a substrate material and a multilayer film structure, and is a typical anisotropic, heterogeneous, and laminated material. Ceramic / polymer substrates and metal thin films have vastly different mechanical, thermal, electrical, and optical properties, making them typical difficult-to-process materials. To avoid performance degradation and structural deformation caused by moisture absorption and deliquescence of the substrate material, dry, low-damage processing is a fundamental requirement. Current additive manufacturing methods (metal sputtering, screen printing, flexible film transplantation technology) suffer from significant material damage, rough processing surfaces, low dimensional accuracy, and difficulties in fabricating microstructures and surface micro / nanostructures due to increasing manufacturing demands. Therefore, there is an urgent need for novel non-contact processing methods with high material removal resolution (down to the sub-micron level) and the ability to process low-heat-affected zones to achieve high-quality conformal antenna fabrication. Summary of the Invention

[0004] Conformal antennas typically consist of numerous receiving / transmitting elements on a surface, requiring high-precision patterning of circuits on each element. To address issues such as element distortion and complex processes in existing conformal antenna manufacturing, and to achieve high selectivity, large format, high precision, substrate-free, and three-dimensional patterned manufacturing of curved heterogeneous thin-film circuits, the main objective of this invention is to provide a conformal antenna component manufacturing system and method based on cross-scale spatiotemporal frequency shaping femtosecond lasers. This method simplifies the process, utilizing ultrafast lasers paired with a five-axis high-speed galvanometer system, and employing a designed processing position control algorithm for the curved surface to achieve one-time large-format three-dimensional patterning of the conformal antenna.

[0005] Meanwhile, the manufacturing system proposed in this invention integrates an online depth monitoring function, which greatly simplifies the complex process of existing conformal antenna manufacturing, realizes one-time forming and inspection of conformal antenna manufacturing, avoids positioning errors caused by multiple clamping due to off-site detection, and improves manufacturing yield and efficiency.

[0006] The objective of this invention is achieved through the following technical solution.

[0007] The present invention discloses an online processing and monitoring device for conformal antenna patterning using time-frequency shaping femtosecond lasers, comprising:

[0008] Firstly, a precision machining system for heterogeneous materials based on cross-scale spatiotemporal shaping femtosecond laser composite processing includes an ultrafast laser excitation module, a laser pulse time / frequency shaping module, a pulse detection module, an online depth monitoring module, and a focusing high-speed scanning galvanometer module arranged sequentially along the laser optical path.

[0009] The ultrafast laser excitation module includes a femtosecond laser (1) for generating the desired femtosecond pulsed laser beam.

[0010] A laser pulse time / frequency shaping module, including a programmable dispersion control filter, a birefringent crystal, and a bbo crystal, is used to generate a THz-GHz-MHz shaped ultrafast laser pulse sequence spanning time scales. The shaping includes the laser center wavelength, the pulse sequence spanning time scale interval, the laser pulse width, the sub-pulse laser energy, and the repetition frequency of the macropulse and sub-pulse.

[0011] The pulse detection module, including an autocorrelation instrument and a spectrometer, is used to detect the spectral information and pulse shape of the shaped pulse sequence in real time and to establish a parameter library required for processing.

[0012] The depth online monitoring module includes a 4f optical handling system and a miniature fiber optic spectrometer, used for signal acquisition of the plasma emission spectrum of the material in the laser-acting region during the processing, and to obtain depth information in real time during the processing.

[0013] The high-speed scanning galvanometer module, including a high-speed processing galvanometer, a focusing field mirror, and a three-axis high-precision displacement stage, is used to focus the shaping laser pulse sequence and precisely control the position of the focused spot to achieve point removal.

[0014] The ultrafast laser beam emitted by the laser excitation module passes through the laser time / frequency shaping module, the laser spatial domain shaping module, and the focusing high-speed scanning galvanometer module to form the processing optical path;

[0015] Secondly, this invention provides a method for circuit patterning of a three-dimensional conformal antenna based on cross-scale time-frequency shaping femtosecond laser, comprising the following steps:

[0016] Step 1: Surface pretreatment of the three-dimensional curved conformal antenna substrate: The substrate material is mechanically polished one side at a time using 280# to 2000# sandpaper until there are no obvious scratches under an optical microscope. Copper, nickel and gold composite films are deposited on the surface in sequence using a magnetron sputtering coating device. The components to be processed are ultrasonically cleaned with anhydrous ethanol and dried.

[0017] Step 2: Clamp the sample using a fixture and fix it on a three-degree-of-freedom displacement platform;

[0018] Step 3: Write the surface patterned circuit path of the component to be processed into G-code and input it into the displacement stage control program. Move the displacement stage to determine the focal position at the starting point of the processing path.

[0019] Step 4: Adjust the processing optical path to perform heterogeneous material circuit patterning processing. By adjusting the femtosecond laser, time-domain shaping module, and frequency-domain shaping module, the repetition frequency of macropulses / subpulses, subpulse laser energy, laser pulse width, and laser center wavelength of the processing pulse sequence are controlled. The scanning speed, scanning trajectory, and scanning position are adjusted by adjusting the high-speed scanning galvanometer and the three-degree-of-freedom displacement stage.

[0020] Step four specifically includes:

[0021] 1) The pulsed laser generated by the femtosecond laser can achieve arbitrary adjustment of the energy and polarization of a single pulse through a half-wave plate and a Glan prism.

[0022] 2) By using a programmable dispersion control filter, a programmed radio frequency signal is loaded onto the acousto-optic crystal, thereby adjusting the dispersion of the pulsed laser to achieve an arbitrary pulse width between 50 and 2000 femtoseconds.

[0023] 3) By altering the radio frequency (RF) signal, a periodic density Bragg grating structure is generated inside the acousto-optic crystal using a transducer. This causes the pulsed laser to periodically generate first-order Bragg diffraction light that enters the slow axis during propagation along the fast axis of the acousto-optic crystal, thus forming a high-repetition-frequency pulse sequence at the THz level. By adjusting the periodic time interval of the RF signal, the pulse interval can be controlled, obtaining an arbitrarily adjustable repetition-frequency pulse sequence within the GHz to MHz range.

[0024] 4) By changing the power of the radio frequency signal, the intensity of the loaded periodic sound wave can be adjusted, thereby generating a free high repetition rate pulse sequence with arbitrarily adjustable pulse interval and pulse energy.

[0025] 5) By controlling the insertion of the BBO crystal and the corresponding bandpass filter into the optical path through an electric switch, frequency domain modulation of the reference wavelength, frequency doubling, and frequency third harmonic can be achieved.

[0026] Step 5: Adjust the electric displacement stage to control the shaping pulse laser to focus at the interface of the film material processing. Adjust the top imaging subsystem to make the laser focus point coincide with the imaging focus point. Adjust the computer control software to start the scanning trajectory. Monitor the processing depth information through the online monitoring module and observe the processing morphology in situ through the CCD camera.

[0027] Compared with the prior art, the beneficial effects of the present invention are:

[0028] 1. The conformal antenna surface circuit patterning femtosecond laser processing method disclosed in this invention can achieve high selectivity and large-format precision processing of curved heterogeneous thin film circuits, overcome the problems of significant material damage layer and low dimensional accuracy in existing processing technology, and provide a dry, low-damage femtosecond laser processing method for surface patterning circuits.

[0029] 2. The manufacturing system proposed in this invention integrates online depth removal monitoring, enabling real-time acquisition of material and depth information during processing, thus achieving precise removal of heterogeneous film materials. This effectively overcomes material damage caused by under-processing or over-processing, achieving one-time forming and inspection of conformal antennas. Furthermore, by avoiding multiple clamping and positioning errors caused by misaligned detection, this system significantly improves manufacturing yield and efficiency.

[0030] 3. The time-frequency shaping device of this invention possesses powerful shaping capabilities. Combined with an acousto-optic dispersive programmable filter and a nonlinear crystal, it can generate pulse sequences with adjustable parameters. Compared with existing methods for generating pulse sequences using cascaded Michelson interferometers and cascaded birefringent crystals, this method overcomes the problems of difficult sub-pulse beam combining, complex optical path debugging, fixed sub-pulse intervals, and limited energy adjustment in existing technologies. This method can flexibly adjust the sub-pulse intervals, maintain the spectral phase of the sub-pulses, and freely control the sub-pulse energy, achieving more flexible energy deposition control, thereby optimizing dimensional accuracy and reducing residual stress during processing. This method is also applicable to other processing requirements, such as deep hole structure processing and micro-area welding processing, improving processing quality. Attached Figure Description

[0031] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0032] Figure 1 This is a schematic diagram of the optical path of the time-frequency shaping femtosecond laser composite processing system for achieving layer-by-layer removal of heterogeneous materials provided in an embodiment of the present invention;

[0033] Among them, 1-Ultrafast laser, 2-Half-wave plate, 3-Glan prism, 4-Acousto-optic dispersive programmable filter, 5-Beam splitter, 6-BBO crystal, 7-Filter, 8-Shutter, 9-Reflector, 10-Aperture, 11-Aperture, 12-Reflector, 13-Diclon mirror, 14-Semi-transparent mirror, 15-Lens, 16-Illumination source, 17-Industrial imaging camera, 18-Reflector, 19-Diclon mirror, 20-Galvanometer, 21-Field mirror, 22-Reflector, 23-Bandpass filter, 24-Convex lens, 25-Fiber optic spectrometer, 26-Translation stage, 27-Sample, 28-Nonlinear crystal, 29-Photodetector, 04-Autocorrelation pulse detection module. Detailed Implementation

[0034] The present invention will now be described in further clarity and completeness with reference to the accompanying drawings and embodiments. The described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0035] Example 1

[0036] Figure 1 The diagram shows the optical path of the conformal antenna component manufacturing system based on cross-scale spatiotemporal frequency shaping femtosecond laser in this embodiment. It includes an ultrafast laser excitation module 01, a laser pulse temporal domain shaping module 02, a laser pulse frequency domain shaping module 03, a pulse detection module 04, an online monitoring module 05, and a focusing high-speed scanning galvanometer module 06 arranged sequentially along the laser optical path.

[0037] Specifically, it includes a femtosecond laser (1) for generating the required femtosecond pulsed laser beam; a half-wave plate (2) and a Glan prism (3) for changing the polarization direction of the initial emitted laser and adjusting the energy of a single pulsed laser; an acousto-optic programmable dispersion filter (4) for time-domain shaping of the original pulse at the GHZ-MHZ level (picosecond-nanosecond pulse interval) to generate a cross-time-domain pulse sequence with adjustable interval; an anti-reflection coating is deposited on the front surface of the beam splitter (5), and a beam splitting film is deposited on the rear surface of the beam splitter. After the pulse sequence passes through the beam splitter (5), it is split into two beams with an energy ratio of 90:10. The transmitted beam 1 is incident on the pulse detection module 04, and the number of sub-pulses of the shaped pulse sequence is measured based on the pulse intensity autocorrelation signal. The reflected light beam 2 is incident on the frequency domain shaping module (6) placed at a distance L on the side of the beam splitter. The frequency domain shaping module consists of a nonlinear crystal (6) and a bandpass filter (7) with a switcher. It selectively passes through different wavelength components such as frequency doubling, frequency combining, and frequency mixing generated in the nonlinear crystal, so as to realize the selectable center wavelength of the incident laser pulse and meet the needs of different material processing processes.

[0038] The BBO crystal (6) and the bandpass filters (7) with different center wavelengths mounted on the rotary switching frame are installed together on the single-axis precision manual displacement stage, which can be translated along the direction of the vertical main optical path to achieve selective use of the frequency domain shaping module; the mechanical optical switch (8) is used to control the laser to pass through or cut off the processing optical path; the outgoing pulse sequence is continuously reflected by the mirrors (9, 12, 18) and enters the high-speed scanning galvanometer system; the aperture (10, 11) is used to collimate the optical path to ensure that the processing laser that finally enters the focusing field lens of the galvanometer system is incident normally.

[0039] The online monitoring module 05 includes an optical monitoring module and a depth monitoring module. The optical monitoring module consists of a dichroic mirror (13), a semi-transparent mirror (14), a convex lens (15), an illumination source (16), and an imaging CCD (17). The semi-transparent mirror is used to guide the illumination light into the processing optical path and through the illumination light reflected from the sample surface. The convex lens (15) is used to converge the light for imaging. The CCD (17) is placed at the focal length of the convex lens for imaging and acquisition of the sample surface. The depth monitoring module consists of a dichroic mirror (19), a bandpass filter (23), a convex lens (24), and a fiber optic spectrometer (25). The dichroic mirror (19) is used to selectively pass the returned plasma emission spectrum and illumination light. The bandpass filter (23) is used to further filter the processing light and illumination light reflected back from the sample surface, passing through the light band where the plasma emission spectrum is located. The convex lens (24) is used to converge the plasma emission signal into the fiber optic spectrometer to acquire spectral information.

[0040] The specific processing steps include the following:

[0041] Step 1: Surface pretreatment of the three-dimensional curved conformal antenna substrate: The substrate material is mechanically polished one side at a time using 280# to 2000# sandpaper until there are no obvious scratches under an optical microscope. Copper, nickel and gold composite films are deposited on the surface in sequence using a magnetron sputtering coating device. The components to be processed are ultrasonically cleaned with anhydrous ethanol and dried.

[0042] Step 2: Clamp the sample using a fixture and fix it on a three-degree-of-freedom displacement platform;

[0043] Step 3: Write the surface patterned circuit path of the component to be processed into G-code and input it into the displacement stage control program. Move the displacement stage to determine the focal position at the starting point of the processing path.

[0044] Step 4: Adjust the processing optical path to perform heterogeneous material circuit patterning processing. By adjusting the femtosecond laser, time-domain shaping module, and frequency-domain shaping module, control the repetition frequency of macropulses / subpulses, subpulse laser energy, laser pulse width, and laser center wavelength of the processing pulse sequence. Adjust the scanning speed, scanning trajectory, and scanning position by adjusting the high-speed scanning galvanometer and three-degree-of-freedom displacement stage. Control the shaping pulse laser to be focused at the film material processing interface, and observe the processing morphology in situ using a CCD camera.

[0045] Step four specifically includes:

[0046] 1) The optical path of the femtosecond laser processing subsystem is collimated to guide the emitted laser beam through each device sequentially. The emitted laser first enters the time / frequency shaping module, adjusting the position of the acousto-optic programmable dispersion filter to ensure that the incident light is perpendicular to the surface of the acousto-optic crystal. A radio frequency (RF) signal is set to generate a periodic dispersive acoustic field in the transducer. When the original pulsed laser is transmitted into the acousto-optic crystal, a single pulse can be converted into a pulse sequence with a pulse interval of 50-2000 femtoseconds. By changing the power of the RF signal, a free high-repetition-rate pulse sequence with arbitrarily adjustable pulse interval and pulse energy is generated. By adjusting the electric switch to control the insertion of the BBO crystal and the corresponding bandpass filter into the optical path, the laser wavelength of the fundamental frequency pulse sequence is changed, achieving the 515nm wavelength, 1ps pulse interval, 5-pulse sequence processing laser required in this embodiment. The emitted pulse sequence is continuously reflected by mirrors (9, 12, 18) into the high-speed scanning galvanometer system; apertures (10, 11) are used to collimate the optical path, ensuring that the processing laser entering the focusing field lens of the galvanometer system is orthogonally incident.

[0047] 2) Adjust the online monitoring module. In the optical monitoring module, the illumination light emitted by the topmost illumination source (16) passes through the semi-transparent mirror (14) and dichroic mirror (13) into the processing optical path to illuminate the sample to be processed and reflect it. The reflected illumination light then passes through the galvanometer system (20, 21) and dichroic mirror (13) and returns, and is transmitted at the semi-transparent mirror (14) to reach the industrial imaging camera (17). By adjusting the distance between the industrial imaging camera (17) and the convex lens, observe that the real-time image captured by the CCD appears as a clear image at the laser focusing plane. The laser-induced plasma emission light generated on the sample processing surface passes through the galvanometer system (20, 21) and dichroic mirror (19) into the depth monitoring module. The bandpass filter (23) selectively passes through the characteristic plasma emission light band of the gold / nickel / copper film, and is converged by the convex lens (24) into the fiber optic spectrometer (25). The characteristic spectrum is read in the computer software, and together with the film thickness of the processed sample and the removal depth of a single scan, the online removal depth monitoring function is realized.

[0048] 3) Samples to be processed, such as Figure 1As shown, the sample is placed on a motorized triaxial displacement stage. The Z-axis height of the motorized displacement stage is adjusted by computer to make the laser focusing focal plane coincide with the surface of the sample to be processed. In this embodiment, the conformal antenna substrate used in the processing is a curved composite film structure with a total of 4 layers. The substrate is a 4mm thick PEEK material, and the layering sequence is 8μm copper film, 1μm nickel film, and 0.5μm gold film.

[0049] 4) The computer control software is used to set the required motion trajectory, enabling the femtosecond laser to cut / selectively remove material from the sample as needed, forming the conformal antenna surface circuit structure. Specifically, the motion trajectory is planned by focusing the shaping pulse laser at the interface of the film material, using a contour trajectory for scanning to reduce overscanning / underscanning caused by the galvanometer's acceleration and deceleration during trajectory segmentation. After one layer of trajectory scanning is completed, the focus is moved to the starting point of the trajectory, and then the removal depth distance after the z-axis shift is adjusted as the feed interval in the thickness direction. The contour trajectory is scanned again, and the above steps are repeated until the insulating substrate layer is reached, completing the patterning of the conformal antenna surface across the entire film depth and forming the required circuit structure. In this embodiment, the femtosecond laser has a center wavelength of 1030nm, a pulse width of 138fs, and a repetition frequency of 100kHz. The focusing lens used in this embodiment is a 160mm focal length flat lens. In this embodiment, the laser power during the femtosecond laser direct writing process is 2.1W, and the scanning speed is 1000mm / s. In this embodiment, the spacing between the contour trajectory processing lines during the femtosecond laser layer-by-layer scanning direct writing process is 15μm, the distance between each trajectory layer (i.e., the feed interval in the z-axis direction) is 1μm, and the number of feed layers is 10.

[0050] Step 5: After the circuit patterning is completed, the workpiece is ultrasonically cleaned, and the processed area is characterized. The processed part exposes the PEEK substrate with a surface roughness of Ra = 1.2 μm. Under a light microscope, there are no obvious optical changes and no carbonization. The Raman spectrum shows a slight broadening, indicating a change in crystallinity. No carbonization / graphitization characteristic peaks appear. XPS analysis shows that the ratio of C-C bonds to C=O does not change significantly, indicating that the surface metal film layer is selectively removed, ensuring that the physical properties of the PEEK substrate remain unchanged, thus achieving the goal of high-quality femtosecond laser processing of conformal antenna circuits.

[0051] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A method for circuit patterning fabrication of a three-dimensional conformal antenna based on cross-scale time-frequency shaping femtosecond laser, characterized in that: The curved conformal antenna substrate consists of two parts: a dielectric layer and a conductive composite film. The dielectric layer is made of polymer PEEK, and its energy absorption mechanism exhibits a clear variation with the laser's center wavelength. The conductive composite film is composed of a 10μm copper film, a 1μm nickel film, and a 0.5μm gold film, and its ablation threshold varies clearly with the time-domain shaping pulse delay and the number of pulses. Femtosecond lasers are shaped in both the time and frequency domains. In the time domain, the laser is divided into pulse sequences with intervals of 0.1-2 ps. In the frequency domain, the center wavelength of the laser is changed to achieve dual wavelengths of 1030nm and 515nm. By controlling the pulse wavelength, pulse delay, and number of pulses, the selective removal of surface circuitry on the conformal antenna and high-quality substrate processing are achieved. The specific method for selectively removing surface circuits of conformal antennas and achieving high-quality substrate processing by controlling pulse wavelength, pulse delay, and pulse number is as follows: Based on the variation law of ablation threshold of metal composite film and polymer substrate with time-domain shaping pulse delay and pulse number, the threshold differences of each component under the same conditions are distinguished, and the time-domain shaping femtosecond laser processing parameters are selected according to the change of processing depth; when removing surface metal composite film, time-domain shaping pulse delay and scanning speed with small threshold differences of different metal films under the same conditions are used to achieve consistent removal of heterogeneous materials. At the same time, an online monitoring module is used to collect plasma emission spectrum information and optical images of the processing area in real time to obtain depth information of metal composite film during processing; when processing the interface between substrate and metal film, frequency-domain shaping with small threshold differences under the same conditions is used to change the pulse center wavelength to control the substrate energy absorption mechanism and achieve carbon-free processing of polymer substrate; A time-frequency shaping femtosecond laser-based online processing and monitoring device for conformal antenna patterning. It includes an ultrafast laser excitation module, a laser pulse time-frequency shaping module, a pulse detection module, a depth online monitoring module, and a focusing high-speed scanning galvanometer module arranged sequentially along the laser optical path; The laser pulse time-frequency shaping module includes a programmable dispersion control filter and a BBO crystal. Based on the crystal acousto-optic effect and optical nonlinear effect, it generates a shaping ultrafast laser pulse sequence across time scales. The shaping ultrafast laser pulse sequence includes the laser center wavelength, the pulse sequence cross-scale time domain interval, the laser pulse width, the sub-pulse laser energy, and the repetition frequency of the macropulse and the sub-pulse. The pulse detection module includes an autocorrelation instrument and a spectrometer. After the laser pulse time-frequency shaping module, the laser beam is split proportionally by a beam splitter and introduced into the detection module. It is used to detect the spectral information and pulse shape of the shaped pulse sequence in real time and to establish a parameter library required for processing. The depth online monitoring module includes a 4f optical handling system and a miniature fiber optic spectrometer, used for signal acquisition of the plasma emission spectrum of the material in the laser-acting region during the processing, and to obtain depth information in real time during the processing. The focusing high-speed scanning galvanometer module includes a high-speed scanning galvanometer, a focusing field mirror, and a three-axis high-precision displacement stage, which is used to focus the shaping ultrafast laser pulse sequence and precisely control the position of the focused spot to achieve point removal. The ultrafast laser beam emitted by the ultrafast laser excitation module forms the processing optical path after passing through the laser pulse time-frequency shaping module and the focusing high-speed scanning galvanometer module.

2. The circuit patterning method for a three-dimensional conformal antenna based on cross-scale time-frequency shaping femtosecond laser according to claim 1, characterized in that: A method for high-quality substrate processing includes the following steps: Step 1: Surface pretreatment of the three-dimensional curved conformal antenna substrate: The substrate material is mechanically polished one side at a time using 280# to 2000# sandpaper until there are no obvious scratches under an optical microscope. Copper, nickel and gold composite films are deposited on the surface in sequence using a magnetron sputtering coating device. The components to be processed are ultrasonically cleaned with anhydrous ethanol and dried. Step 2: Clamp the sample using a fixture and fix it on a three-degree-of-freedom displacement platform; Step 3: Write the surface patterned circuit path of the component to be processed into G code and input it into the three-axis high-precision displacement stage control program. Move the three-axis high-precision displacement stage to determine that the focal position is located at the starting point of the processing path. Step 4: Adjust the processing optical path to perform heterogeneous material circuit patterning processing. By adjusting the ultrafast laser excitation module, laser pulse time-frequency shaping module, and pulse detection module, the repetition frequency of macropulses and subpulses, subpulse laser energy, laser pulse width, and laser center wavelength of the processing pulse sequence are controlled. By adjusting the high-speed scanning galvanometer and the three-axis high-precision displacement stage, the scanning speed, scanning trajectory, and scanning position are adjusted to control the shaping ultrafast laser pulse sequence to be focused at the interface of the film material processing. The processing morphology is observed in situ using a CCD camera. Step 5: Adjust the three-axis high-precision displacement stage, control the laser pulse time-frequency shaping module to focus on the interface of the film material processing, adjust the top imaging subsystem to make the laser focusing point and the imaging focus point coincide, adjust the computer control software to start the scanning trajectory, monitor the processing depth information through the online monitoring module, and observe the processing morphology in situ through the CCD camera.

3. The circuit patterning method for a three-dimensional conformal antenna based on cross-scale time-frequency shaping femtosecond laser according to claim 1, characterized in that: The focusing system is a 160mm focal length flat lens. During femtosecond laser direct writing, the laser power ranges from 0.5W to 2.5W, and the scanning speed ranges from 1mm / s to 1500mm / s. The centerline spacing of the contour trajectory scanning during laser direct writing is 5-30μm, and the z-axis feed step size is 1μm. During the processing of metal composite films, the parameters of the femtosecond laser pulse sequence are a 1030nm center wavelength, a 5-pulse sequence at 100kHz, and a sub-pulse interval of 1ps. The parameters of the femtosecond laser at the interface between the polymer substrate and the metal film are a 515nm center wavelength, a 50kHz double-pulse sequence, and a pulse interval of 2ps.

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