A LED lamp chip welding tool with precise positioning of thermal conductive solder

Abstract

The present invention relates to the technical field of welding equipment, and discloses a welding tool for LED lamp chips with precise alignment of thermal conductive solder, including a transmission part, the transmission part is located below the inner wall of the working chamber, the inner wall of the transmission part is connected to a positioning part by transmission, a chip is placed above the positioning part, and the transmission part includes a loading area, a correction area and a printing area arranged in sequence from left to right. The invention is provided with a support plate, the support plate drives the inner support, the positioning block and the positioning rod to move upward synchronously, the positioning block is arranged on the four sides of the outer wall of the support plate, the support plate moves smoothly under the restriction of the slot, when the magnetic member moves the support plate and the chip carried by the support plate to the lower surface of the printing template, the limit plate moves along the limit slot, the limit plate drives the limit block to move, the limit block moves to engage with the second fixing slot, the support plate is fully engaged by the limit blocks and the second fixing slot arranged on the four sides, and the movement of the support plate moves the corrected chip smoothly to the desired position.

Description

Technical Field

[0001] The invention relates to the technical field of welding equipment, and in particular to a welding tool for LED lamp chips with precise alignment of thermal conductive solder. Background Art

[0002] Nowadays, LED lamps are widely used in many fields. Different application scenarios have different performance requirements for LED lamps, and the quality of chip welding directly determines whether the lamps can adapt to these special requirements. Usually, the LED lamp chip is accurately positioned and placed on the corresponding pad position of the PCB board, and then a suitable welding process such as reflow soldering, wave soldering or manual soldering is used to use thermal conductive solder to firmly connect the chip pins to the pads. In order to ensure the precise alignment of the thermal conductive solder, a printed template is usually used in the chip welding process. The welding tooling includes a printed template, a scraper assembly, a template positioning and fixing structure, a PCB board bearing and positioning structure, an auxiliary support and adjustment structure, and a solder adding device.

[0003] In the large-scale, continuous chip welding production process, long-term high-frequency use will inevitably cause the surfaces between these positioning components to gradually wear out, making the originally tightly matched tolerance larger and the positioning accuracy decrease accordingly. Each time the solder is printed, the scraper will repeatedly scrape on the template surface, and the relative position between the template and the PCB board will deviate, resulting in the solder not being accurately printed on the corresponding pad position, resulting in misalignment, causing the welding quality to decline, affecting the subsequent electrical connection between the chip and the PCB board and the normal function of the product, requiring rework, and reducing production efficiency. In addition, PCB boards of different types, thicknesses and surface materials have different fits with the template, solder adsorption and penetration characteristics, etc. If the template itself is not flat enough or does not fit tightly with the PCB board, it will also cause different solder penetrations in different areas, resulting in uneven distribution. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, the present invention provides an LED lamp chip welding tool with precise positioning of thermal conductive solder, which can effectively solve the problem of inaccurate positioning of thermal conductive solder during the coating process in the prior art.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0006] The present invention provides a LED lamp chip welding tool with precise positioning of thermal conductive solder, comprising:

[0007] Working chamber;

[0008] A scraper, wherein the scraper is located above the inner wall of the working chamber;

[0009] A printing section, wherein the scraper is located directly above the printing section;

[0010] A transmission part, the transmission part is located below the inner wall of the working chamber, the inner wall of the transmission part is connected to the positioning part in a transmission manner, a chip is placed above the positioning part, the transmission part includes a loading area, a correction area and a printing area arranged from left to right, the sides of the loading area, the correction area and the printing area are all provided with movable grooves, the inner wall of the movable groove on the side of the correction area is provided with a magnetic piece, the side of the magnetic piece is fixedly connected with a damping block, and the center of the inner wall of the printing area is fixedly connected with a telescopic rod;

[0011] The positioning part is set as a separation structure, and the positioning part includes a positioning frame that is transmission-connected to the inner wall of the transmission part, and the inner wall of the positioning frame is provided with a slide groove, and the inner wall of the positioning frame is slidably connected with a support member that ensures the smooth movement of the chip, and the bottom end of the support member is engaged with the top end of the telescopic rod;

[0012] Wherein, the inner wall of the slide groove is provided with a correction piece for correcting the chip position.

[0013] Furthermore, the outer wall of the positioning frame is symmetrically provided with positioning grooves, the inner wall of the positioning groove is provided with a movable part, the inner wall of the positioning frame is provided with a card slot, the support part includes a positioning block slidably connected to the card slot, the inner wall of the positioning block is movably connected with a positioning rod, the inner wall of the positioning block is fixedly connected with a support plate, the outer wall of the support plate is symmetrically provided with a fixing groove 2, the inner wall of the fixing groove 2 is slidably connected with a connecting rod, the inner wall of the support plate is provided with an inner support part, and the outer surface of the inner support part is tightly fitted with the side of the positioning rod.

[0014] Furthermore, the outer wall of the positioning frame is symmetrically provided with positioning grooves, the inner wall of the positioning groove is provided with a movable part, the inner wall of the positioning frame is provided with a card slot, the support part includes a positioning block slidably connected to the card slot, the inner wall of the positioning block is movably connected with a positioning rod, the inner wall of the positioning block is fixedly connected with a support plate, the outer wall of the support plate is symmetrically provided with a fixing groove 2, the inner wall of the fixing groove 2 is slidably connected with a connecting rod, the inner wall of the support plate is provided with an inner support part, and the outer surface of the inner support part is tightly fitted with the side of the positioning rod.

[0015] Furthermore, the inner support member includes a connecting rod embedded in the inner wall of the second fixing groove, one end of the connecting rod is tightly fitted with a fixing frame, a cross is fixedly connected to the middle of the fixing frame, the outer end of the cross passes through the support plate and is fixedly connected to one end of the positioning rod.

[0016] Furthermore, the printing part includes a printing template that is attached to the upper surface and the lower surface of the scraper, and the side of the printing template is fixedly connected to a limiting member, and the limiting member includes a side plate fixedly connected to both ends of the printing template, and limiting grooves are evenly arranged on opposite sides of the side plate, and the inner wall of the limiting groove is slidably connected to the limiting plate, and the other end of the limiting plate is fixedly connected to a limiting block that engages with the second fixed groove.

[0017] Furthermore, the correction part includes a fixed block embedded in the inner wall of the slide groove, the top of the fixed block is fixedly connected to an adjusting block, the fixed block is rotatably connected to a movable block in the x-axis direction, the fixed block is elastically connected to an elastic part in the y-axis direction, a fixed groove 1 is opened on the inner wall of the adjusting block, and a movable part is slidably connected to the inner wall of the fixed groove 1.

[0018] Furthermore, the movable part includes a magnet magnetically connected to the magnetic part, the other end of the magnet is fixedly connected to the round block, the other end of the round block is fixedly connected to a connecting shaft at the center, the other end of the connecting shaft is fixedly connected to an eccentric block, and the rotation center of the eccentric block does not coincide with the center of the eccentric block.

[0019] Furthermore, in an initial state, the moving track of the round block does not coincide with the extension line of the damping block, and after the round block moves toward the damping block under the magnetic action of the magnetic member, the moving track of the round block coincides with the extension line of the damping block.

[0020] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0021] The present invention is provided with a support plate. When the positioning part moves to the printing area position, the telescopic rod extends to push the lower surface of the support plate, and the support plate drives the inner support, the positioning block and the positioning rod to move upward synchronously. The positioning blocks are arranged on the four sides of the outer wall of the support plate. The support plate with uniform force moves smoothly under the restriction of the slot. When the magnetic part moves the support plate and the chip carried by the support plate to the lower surface of the printing template, the limit plate moves along the limit slot. The movement of the limit plate drives the movement of the limit block. The limit block moves to engage with the second fixed slot. The support plate is fully engaged with the limit blocks and the second fixed slot arranged on the four sides. The movement of the support plate moves the calibrated chip smoothly to the required position.

[0022] The present invention is provided with a support member, and after the second fixing groove is engaged with the limit block, the limit block squeezes the connecting rod, the connecting rod moves in the cavity of the support plate, the connecting rod squeezes the fixing frame, the fixing frame moves up to drive the cross to move up, the cross moves up to drive the positioning rod to move up, the positioning rod moves up along the inner wall of the positioning block, and as the second fixing groove engages with the limit block, the positioning rod moves up to squeeze the lower surface of the chip, so that the chip fits tightly to the lower surface of the printing template, thereby compensating for the gap error between the printing template and the chip caused by the chip's own structure, avoiding deviation in the relative position, resulting in the phenomenon of misalignment of the solder not being able to be accurately printed at the corresponding pad position, and improving the accuracy of solder alignment.

[0023] The present invention is provided with a correction piece. After the chip sliding along the adjustment block is corrected to the central position, the elastic recovery elastic piece can squeeze the side of the chip. Therefore, during the movement of the positioning part, the chip can not only be restored to the precise central position, but also ensure the stability of the chip structure during the movement. A plurality of magnetic pieces and damping blocks are fixedly connected to the inner wall of the movable groove. During the process of the positioning part moving to the correction area, the correction piece undergoes multiple deformations in the X-axis and Y-axis directions. With multiple correction adjustments, the chip is gradually adjusted to the precise central position to ensure the accuracy of the adjustment.

[0024] The present invention is provided with a positioning part. When the round block moves to the position of the extended line of the damping block, the round block contacts the damping block as the positioning frame moves. The round block rotates under the damping effect of the damping block. The rotation of the round block drives the connecting shaft to rotate. The rotation of the connecting shaft drives the eccentric block to rotate. The eccentric block rotates eccentrically with the connecting shaft as the center. The rotation of the eccentric block pushes the fixed block upward. The upward movement of the fixed block drives the adjusting block to move upward. The two fixed blocks in the X-axis direction are stretched due to the deformation of the elastic member. The two fixed blocks in the Y-axis direction that first contact the damping block move upward first. The two fixed blocks in the Y-axis direction move upward to drive the movable block to rotate. When the movable block rotates, the two fixed blocks in the Y-axis direction that first contact the damping block move upward, while the two fixed blocks symmetrical to it do not change position. Therefore, when the positioning frame enters the correction area, the correction member is deformed in the X-axis and Y-axis directions to correct the chip placed on the positioning frame to the central position, thereby ensuring the accuracy of the chip position before printing.

[0025] The present invention is provided with a movable part. In the initial state, that is, when the positioning part is located at the loading area position, the size of the correction part is the minimum size, the chip size is larger than the correction part of the minimum size, and the chip falls on the correction part. When the positioning frame moves to the correction area position, the magnet is subjected to the magnetic attraction of the magnetic part, and the magnetic part drives the magnet to move, and the magnet drives the round block to move. The movement of the round block drives the connecting shaft to move, and the movement of the connecting shaft drives the eccentric block to move. The round block moves to a position coincident with the extension line of the damping block, and the movement of the eccentric block drives the fixed block to move. The movement of the fixed block drives the elastic deformation of the elastic part in the Y-axis direction, and the Y-axis size between the correction parts increases. When the chip falls on the positioning part, it will be positionally offset due to mechanical vibration, airflow influence, surface condition of the placement plate, electrostatic effect, human factors and other reasons. When the size of the correction part increases, the chip with position offset will fall along the inside of the adjustment block, and gradually move the chip to the middle position of the positioning part. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 It is a schematic cross-sectional view of the overall structure of the device according to an embodiment of the present invention;

[0028] Figure 2 A schematic diagram of a transmission unit connection structure according to an embodiment of the present invention;

[0029] Figure 3 A schematic diagram of a connection structure of a positioning portion according to an embodiment of the present invention;

[0030] Figure 4 It is a schematic diagram of the structure of the positioning part of an embodiment of the present invention;

[0031] Figure 5 A schematic diagram of a connection structure of a correction piece according to an embodiment of the present invention;

[0032] Figure 6 A schematic diagram of a connection structure of movable parts according to an embodiment of the present invention;

[0033] Figure 7 This is a schematic diagram of the connection structure between the support member and the printing part when the chip is in the material brushing state according to an embodiment of the present invention;

[0034] Figure 8 This is a schematic diagram of the split structure of the position limiting member according to an embodiment of the present invention;

[0035] Fig. 9It is a perspective schematic diagram of the internal structure of the support plate according to an embodiment of the present invention.

[0036] The numbers in the figure represent: 1, working chamber; 2, scraper; 3, printing part; 31, printing template; 32, limiting member; 321, side plate; 322, limiting groove; 323, limiting plate; 324, limiting block; 4, transmission part; 41, feeding area; 42, correction area; 421, magnetic member; 422, damping block; 43, printing area; 431, telescopic rod; 45, movable groove; 5, positioning part; 51, positioning frame; 511, positioning groove; 512, card slot; 52. Slide groove; 53. Correction part; 531. Adjustment block; 532. Fixed block; 533. Elastic part; 534. Movable block; 535. Fixed groove one; 54. Support member; 541. Support plate; 542. Positioning block; 543. Positioning rod; 544. Fixed groove two; 545. Connecting rod; 546. Fixed frame; 547. Cross; 55. Movable part; 551. Eccentric block; 552. Connecting shaft; 553. Round block; 554. Magnet; 6. Chip. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] The present invention will be further described below in conjunction with the embodiments.

[0039] Example:

[0040] See also Figure 1-Figure 9 The present invention provides a technical solution for LED lamp chip welding tooling with precise positioning of thermal conductive solder: Figure 1 As shown, a scraper 2 is slidably connected to the upper inner wall of the working chamber 1, and a printing part 3 is arranged below the scraper 2. Figure 7 As shown, the printing part 3 includes a printing template 31 and a limiting member 32. Solder is placed on the upper surface of the printing template 31. The limiting member 32 is fixedly connected to the outer side of the printing template 31. The limiting member 32 is arranged on the inner wall of the working chamber 1. The scraper 2 reciprocates to place the solder on the upper surface of the printing template 31 on the surface of the chip 6 through the through hole opened in the printing template 31.

[0041] like Figure 1 and Figure 2As shown, a transmission part 4 is arranged below the inner wall of the working chamber 1, and a positioning part 5 is slidably connected to the inner wall of the transmission part 4. The transmission part 4 is arranged as a loading area 41, a correction area 42 and a printing area 43 from left to right, and movable grooves 45 are opened on the sides of the loading area 41, the correction area 42 and the printing area 43. When the positioning part 5 is located at the loading area 41, the chip 6 is loaded, and the inner wall of the movable groove 45 located outside the correction area 42 is fixedly connected with a magnetic piece 421, and the side of the magnetic piece 421 is fixedly connected with a damping block 422. When the positioning part 5 moves to the correction area 42, the internal structure of the positioning part 5 is magnetically connected to the magnetic piece 421, and the structural deformation of the positioning part 5 corrects the chip 6 placed above. After the positioning part 5 completes the deformation in the correction area 42 and moves to the printing area 43, a telescopic rod 431 is fixedly connected to the middle of the inner wall of the printing area 43. The telescopic rod 431 is extended to push the chip 6 to the bottom of the printing template 31 to complete the solder coating operation.

[0042] refer to Figure 1 , Figure 3 and Figure 4 The positioning part 5 includes a positioning frame 51 that is attached to the inner wall of the transmission part 4. The inner wall of the positioning frame 51 is provided with a slide groove 52. The outer wall of the slide groove 52 is provided with a positioning groove 511. The inner wall of the positioning groove 511 is movably connected with a movable member 55. Figure 6 and Figure 5 As shown, the movable part 55 includes a round block 553 embedded in the inner wall of the eccentric block 551, a magnet 554 is fixedly connected to the side of the round block 553, the magnet 554 is magnetically connected to the magnetic member 421, the outer side of the round block 553 is damping-connected to the outer side of the damping block 422, the other end of the round block 553 is fixedly connected to the connecting shaft 552, the other end of the connecting shaft 552 is fixedly connected to the eccentric block 551, the eccentric block 551 rotates around the connecting shaft 552, and the rotation center of the eccentric block 551 does not coincide with the center of the circle of the eccentric block 551.

[0043] refer to Figure 4 and Figure 5The inner wall of the slide groove 52 is slidably connected with a correction member 53, and the correction member 53 includes a fixed block 532 slidably connected with the inner wall of the slide groove 52, and the fixed block 532 is set as an L-shaped block. The top of the fixed block 532 is fixedly connected with an adjustment block 531, and the upper surface of the adjustment block 531 is set as an inclined surface inclined inwardly. The inner wall of the fixed block 532 is provided with a fixed groove 535, and the inner wall of the fixed groove 535 is provided with an eccentric block 551. The eccentric block 551 can rotate eccentrically on the inner wall of the fixed groove 535. The fixed groove 535 is provided with It is a T-shaped slot, and the slot size on the outside of the T-shaped slot is smaller than the size of the eccentric block 551. The inner wall of the positioning slot 511 is rotatably connected with a round block 553. A slot 512 is provided in the middle of the positioning frame 51. The inner wall of the slot 512 is engaged with a support member 54. The fixed block 532 is rotatably connected with a movable block 534 in the X-axis direction. The other end of the movable block 534 is fixedly connected with another fixed block 532. The fixed block 532 is elastically connected with an elastic member 533 in the Y-axis direction. The other end of the elastic member 533 is elastically connected with the fixed block 532. In the initial state, the round block 553 is located on the inner wall of the positioning slot 511, and the outer end of the round block 553 is embedded in the inner wall of the movable slot 45, and does not contact the extension line of the damping block 422.

[0044] In the initial state, that is, when the positioning part 5 is located at the loading area 41, the size of the correction piece 53 is the minimum size, the size of the chip 6 is larger than the minimum size of the correction piece 53, and the chip 6 falls on the correction piece 53. When the positioning frame 51 moves to the correction area 42, the magnet 554 is attracted by the magnetic force of the magnetic piece 421, and the magnetic piece 421 drives the magnet 554 to move, and the magnet 554 drives the round block 553 to move. The movement of the round block 553 drives the connecting shaft 552 to move, and the movement of the connecting shaft 552 drives the eccentric block 551 to move. The round block 553 moves to a position that coincides with the extension line of the damping block 422, and the movement of the eccentric block 551 drives the fixed block 532 to move. The movement of the fixed block 532 drives the elastic piece 533 in the Y-axis direction to elastically deform, and the Y-axis dimension between the correction pieces 53 increases.

[0045] When the chip 6 falls on the positioning part 5, it will be displaced due to various reasons such as mechanical vibration, airflow, surface condition of the placement plate, static electricity and human factors. When the size of the correction piece 53 increases, the displaced chip 6 will fall along the inside of the adjustment block 531, gradually moving the chip 6 to the middle position of the positioning part 5.

[0046] When the round block 553 moves to the extension line position of the damping block 422, the round block 553 contacts the damping block 422 as the positioning frame 51 moves, and the round block 553 rotates due to the damping effect of the damping block 422. The rotation of the round block 553 drives the connecting shaft 552 to rotate, and the rotation of the connecting shaft 552 drives the eccentric block 551 to rotate. The eccentric block 551 rotates eccentrically around the connecting shaft 552. The rotation of the eccentric block 551 pushes the fixed block 532 upward, and the upward movement of the fixed block 532 drives the adjusting block 531 to move upward. The two fixed blocks 532 in the X-axis direction are deformed due to the elastic member 533. When the movable block 534 is stretched, the two fixed blocks 532 in the Y-axis direction that first contact the damping block 422 move upward first, and the two fixed blocks 532 in the Y-axis direction move upward to drive the movable block 534 to rotate. When the movable block 534 rotates, the two fixed blocks 532 in the Y-axis direction that first contact the damping block 422 move upward, while the two fixed blocks 532 symmetrical to it do not change position. Therefore, when the positioning frame 51 enters the correction area 42, the correction member 53 is deformed in the X-axis and Y-axis directions, and the chip 6 placed on the positioning frame 51 is corrected to the central position, thereby ensuring the accuracy of the position of the chip 6 before printing.

[0047] At the same time, after the chip 6 sliding along the adjustment block 531 is corrected to the central position, the elastic recovery elastic member 533 can squeeze the side of the chip 6. Therefore, during the movement of the positioning part 5, the chip 6 can not only be restored to the precise central position, but also ensure the stability of the chip 6 structure during the movement.

[0048] A plurality of magnetic parts 421 and damping blocks 422 are fixedly connected to the inner wall of the movable groove 45. When the positioning part 5 moves to the correction area 42, the correction part 53 undergoes multiple deformations in the X-axis and Y-axis directions. With multiple correction adjustments, the chip 6 is gradually adjusted to a precise central position to ensure the accuracy of the adjustment.

[0049] refer to Figure 4 , Figure 7 , Figure 8 and Fig. 9The inner wall of the card slot 512 is slidably connected with the card slot 512, and the inner wall of the card slot 512 is slidably connected with a positioning block 542. The other end of the positioning block 542 is fixedly connected to the middle of the outer wall of the support plate 541. The inner wall of the positioning block 542 is damped and slidably provided with a positioning rod 543. During the movement of the positioning part 5, the positioning rod 543 is located on the inner wall of the transmission part 4. In the initial state, the positioning block 542, the positioning rod 543 and the upper surface of the support plate 541 are flush. A groove is provided in the middle of the outer wall of the support plate 541. The inner wall of the groove is slidably connected with a cross 547. The side of the cross 547 is fixedly connected with a fixing frame 546. The fixing frame 5 The bottom end of the 46 corner is set as an inclined wedge block, which contacts the connecting rod 545. The connecting rod 545 includes an inclined block that fits the inclined wedge block. The other end of the inclined block is fixedly connected to a long rod, and a compression spring is sleeved on the outside of the long rod. The connecting rod 545, the fixing frame 546 and the cross 547 are internal support parts, and the internal support parts are set in the internal cavity of the support plate 541. The connecting rod 545 is located on the inner wall of the second fixing groove 544, and the second fixing groove 544 is located on the side of the support plate 541. The second fixing groove 544 is symmetrically arranged with the positioning block 542 as the center. In the initial state, the long rod is located on the inner wall of the second fixing groove 544 under the action of the compression spring.

[0050] The limiting member 32 includes a side plate 321 fixedly connected to the side of the printing template 31, and a limiting groove 322 is provided on the opposite side of the side plate 321. The limiting groove 322 is arranged opposite to the fixed groove 544. The inner wall of the limiting groove 322 is slidably connected to the limiting plate 323, and the outer wall of the limiting plate 323 is slidably connected to the limiting block 324. A magnetic strip is provided on the inner wall of the limiting groove 322, and the magnetic strip is magnetically connected to the back of the limiting plate 323. When the telescopic rod 431 pushes the chip 6 to the set position, there is magnetic repulsion between the magnetic strip and the limiting plate 323. When the telescopic rod 431 retracts the chip 6 after coating, there is magnetic attraction between the magnetic strip and the limiting plate 323, thereby moving the limiting block 324 to the inner wall of the limiting groove 322 without affecting the up and down movement of the chip 6 and the support member 54.

[0051] When the positioning part 5 moves to the position of the printing area 43, the telescopic rod 431 extends to push the lower surface of the support plate 541, and the support plate 541 drives the inner support, the positioning block 542 and the positioning rod 543 to move upward synchronously. The positioning blocks 542 are arranged on the four sides of the outer wall of the support plate 541. The support plate 541 with uniform force moves smoothly under the restriction of the slot 512. When the magnetic member 421 moves the support plate 541 and the chip 6 carried by the support plate 541 to the lower surface of the printing template 31, the limit plate 323 moves along the limit slot 322. The movement of the limit plate 323 drives the limit block 324 to move. The limit block 324 moves to engage with the fixed slot 2 544. The support plate 541 is fully engaged through the limit blocks 324 and the fixed slot 2 544 arranged on the four sides. The support plate 541 moves to smoothly move the calibrated chip 6 to the desired position.

[0052] The upper surfaces of the support plate 541, the positioning block 542 and the positioning rod 543 are flush. After the fixing groove 544 is engaged with the limit block 324, the limit block 324 squeezes the connecting rod 545, and the connecting rod 545 moves in the cavity of the support plate 541. The connecting rod 545 squeezes the fixing frame 546, and the fixing frame 546 moves up to drive the cross 547 to move up, and the cross 547 moves up to drive the positioning rod 543 to move up, and the positioning rod 543 moves up along the inner wall of the positioning block 542. As the fixing groove 544 engages with the limit block 324, the positioning rod 543 moves up to squeeze the lower surface of the chip 6, so that the chip 6 fits closely to the lower surface of the printing template 31, thereby compensating for the gap error between the printing template 31 and the chip 6 caused by the structure of the chip 6 itself, avoiding deviation in the relative position, resulting in the phenomenon of misalignment of the solder not being able to be accurately printed at the corresponding pad position, and improving the accuracy of the solder alignment.

[0053] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A LED lamp chip welding tool with precise positioning of thermal conductive solder, characterized in that: include: Working chamber (1); A scraper (2), wherein the scraper (2) is located above the inner wall of the working chamber (1); A printing section (3), wherein the scraper (2) is located directly above the printing section (3); A transmission part (4), the transmission part (4) is located below the inner wall of the working chamber (1), the inner wall of the transmission part (4) is transmission-connected with a positioning part (5), a chip (6) is placed above the positioning part (5), the transmission part (4) comprises a loading area (41), a correction area (42) and a printing area (43) which are arranged in sequence from left to right, the sides of the loading area (41), the correction area (42) and the printing area (43) are all provided with movable grooves (45), the inner wall of the movable groove (45) located on the side of the correction area (42) is provided with a magnetic piece (421), the side of the magnetic piece (421) is fixedly connected with a damping block (422), and the center of the inner wall of the printing area (43) is fixedly connected with a telescopic rod (431); The positioning part (5) is arranged as a separation structure, and the positioning part (5) comprises a positioning frame (51) which is transmission-connected to the inner wall of the transmission part (4), a slide groove (52) is provided on the inner wall of the positioning frame (51), a support member (54) which is slidably connected to the inner wall of the positioning frame (51) to ensure the smooth movement of the chip (6), and the bottom end of the support member (54) is snap-connected to the top end of the telescopic rod (431); Wherein, the inner wall of the slide groove (52) is provided with a correction piece (53) for correcting the position of the chip (6); The correction member (53) comprises a fixed block (532) embedded in the inner wall of the slide groove (52); the top of the fixed block (532) is fixedly connected to an adjustment block (531); the fixed block (532) is rotatably connected to a movable block (534) in the x-axis direction; the fixed block (532) is elastically connected to an elastic member (533) in the y-axis direction; a fixed groove 1 (535) is formed on the inner wall of the adjustment block (531); and the inner wall of the fixed groove 1 (535) is slidably connected to a movable member (55).

2. According to claim 1, a LED lamp chip welding tool with precise positioning of thermal conductive solder, characterized in that: The outer wall of the positioning frame (51) is symmetrically provided with positioning grooves (511), the inner wall of the positioning groove (511) is provided with a movable part (55), the inner wall of the positioning frame (51) is provided with a clamping groove (512), the support member (54) comprises a positioning block (542) slidably connected to the clamping groove (512), the inner wall of the positioning block (542) is movably connected with a positioning rod (543), the inner wall of the positioning block (542) is fixedly connected with a support plate (541), the outer wall of the support plate (541) is symmetrically provided with a second fixing groove (544), the inner wall of the second fixing groove (544) is slidably connected with a connecting rod (545), the inner wall of the support plate (541) is provided with an inner support member, and the outer surface of the inner support member is tightly fitted with the side of the positioning rod (543).

3. The LED lamp chip welding tool with precise positioning of thermal conductive solder according to claim 2, characterized in that: The inner support member comprises a connecting rod (545) embedded in the inner wall of the second fixing groove (544); one end of the connecting rod (545) is tightly fitted with a fixing frame (546); a cross (547) is fixedly connected to the middle of the fixing frame (546); the outer end of the cross (547) passes through the supporting plate (541) and is fixedly connected to one end of the positioning rod (543).

4. The LED lamp chip welding tool with precise positioning of thermal conductive solder according to claim 2, characterized in that: The printing part (3) comprises a printing template (31) which is in contact with the upper surface and the lower surface of the scraper (2); a limiting member (32) is fixedly connected to the side of the printing template (31); the limiting member (32) comprises a side plate (321) fixedly connected to both ends of the printing template (31); limiting grooves (322) are evenly provided on opposite sides of the side plate (321); the inner wall of the limiting groove (322) is slidably connected to a limiting plate (323); and the other end of the limiting plate (323) is fixedly connected to a limiting block (324) engaged with the second fixing groove (544).

5. The LED lamp chip welding tool with precise positioning of thermal conductive solder according to claim 1, characterized in that: The movable part (55) comprises a magnet (554) magnetically connected to the magnetic part (421); the other end of the magnet (554) is fixedly connected to the circular block (553); the other end of the circular block (553) is fixedly connected to a connecting shaft (552) at the center of the circle; the other end of the connecting shaft (552) is fixedly connected to an eccentric block (551); the rotation center of the eccentric block (551) does not coincide with the center of the circle of the eccentric block (551).

6. The LED lamp chip welding tool with precise positioning of thermal conductive solder according to claim 5, characterized in that: In the initial state, the moving track of the circular block (553) does not coincide with the extension line of the damping block (422); after the circular block (553) moves toward the damping block (422) under the magnetic action of the magnetic member (421), the moving track of the circular block (553) coincides with the extension line of the damping block (422).

Images