A cleaning device for wafer thinning apparatus

Abstract

This application relates to the field of semiconductor chip manufacturing technology, and in particular to a cleaning device for a wafer thinning apparatus. The device includes a housing, a placement device for placing a wafer body, and a cleaning device for cleaning the wafer body. A control unit is fixedly connected to the front left side of the housing. The cleaning device is fixedly connected inside the housing. Laterally arranged trays are installed on both the front and rear sides of the cleaning device. An electrically telescopic unit is fixedly connected to the top of the cleaning device. In this application, through the housing, control unit, feed trough, electrically telescopic unit, wafer body, placement device, cleaning device, and mounting unit, the thinned wafer body can be installed by the placement device, and then inserted into the cleaning device under the action of the mounting unit. The cleaning device then cleans the wafer body, allowing for the cleaning of a large number of wafer bodies at once, thus increasing the cleaning speed.

Description

Technical Field

[0001] This application relates to the field of semiconductor chip manufacturing technology, specifically to a cleaning device for a wafer thinning apparatus. Background Technology

[0002] Electrical components are typically composed of several parts, the most important of which is the semiconductor chip responsible for control. Semiconductor chips are made by etching and wiring on semiconductor wafers to create semiconductor devices that can perform certain functions. In the production of semiconductor chips, wafers are first produced. After the wafers are produced, in order to reduce the size of the chips and improve the success rate, the wafers usually need to be thinned. After thinning, in order to facilitate the cleaning of the wafers, a cleaning device is usually set on the thinning device, so that the wafers can be directly removed from the thinning device and placed into the cleaning equipment for cleaning.

[0003] Traditional wafer cleaning equipment typically involves placing the wafer directly into a holding device, followed by placing both the holding device and the wafer into the cleaning equipment. The wafer surface is then cleaned using an ultrasonic cleaning unit and cleaning fluid within the equipment. However, the holding device, which is used to limit the wafer's position, is usually placed directly inside the ultrasonic cleaning unit. This makes it difficult to clean the areas where the wafer contacts the holding device, resulting in cleaning dead zones. Therefore, to address these issues, a cleaning device for wafer thinning apparatus is proposed. Summary of the Invention

[0004] The purpose of this application is to provide a cleaning device for a wafer processing thinning apparatus to solve the problem that the contact area between the wafer and the holding device is not easy to clean.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] A cleaning device for a wafer thinning apparatus includes a housing, a placement device for placing a wafer body, and a cleaning device for cleaning the wafer body. A control unit is fixedly connected to the front left side of the housing. The cleaning device is fixedly connected inside the housing. Horizontally arranged trays are installed on both the front and rear sides of the cleaning device. An electrically telescopic unit is fixedly connected to the top of the cleaning device. The top of the electrically telescopic unit is fixedly connected to the housing. A feed chute is provided on the top left side of the housing. Two placement devices are arranged front and rear inside the cleaning device. Mounting units are fixedly connected to both the front and rear sides of the placement devices.

[0007] Preferably, the placement device includes a limiting body, support rods, crossbars, fixed shafts, rubber rings, a top frame, and clamping plates. Four vertically arranged and evenly distributed support rods are fixedly connected to the bottom of the limiting body. Two support rods are fixedly connected to the left and right sides of the crossbars in groups of two. The two crossbars are respectively fixedly connected to the front and rear ends of two parallel and longitudinally arranged fixed shafts. A longitudinally arranged fixed shaft is fixedly connected inside the top frame. Evenly distributed rubber rings are fixedly connected to the outside of the fixed shafts. Three rubber rings are arranged in groups of three on the outside of a wafer body. Evenly distributed and longitudinally arranged clamping plates are fixedly connected to the left and right sides of the bottom of the top frame. The top frame is located on top of the limiting body.

[0008] Preferably, the limiting body includes a fixed frame, rubber blocks, a fixed plate, and fixed balls. The top of the fixed frame has evenly distributed through slots. The inner walls of the front and rear sides of the through slots of the fixed frame have installation slots. The installation slots of the fixed frame contain rubber blocks. The locking plate is disposed in the through slots of the fixed frame. The rubber blocks are arranged in pairs on the front and rear sides of the locking plate. The side of the rubber block closest to the locking plate is fixedly connected to the fixed plate. The side of the rubber block away from the locking plate has a horizontally arranged and evenly distributed first deformation slot. The side of the fixed plate closest to the locking plate is fixedly connected to two left and right fixed balls. The front and rear sides of the locking plate have horizontally arranged and arc-shaped locking slots. The side of the fixed ball away from the fixed plate is disposed in the locking slot of the locking plate. The side of the locking plate away from the top frame is arc-shaped.

[0009] Preferably, the bottom of the top frame is tightly fitted with the fixing frame, the bottom of the support rod is located below the bottom of the wafer body, and the two fixing frames are respectively located on the front and rear sides of the cleaning device.

[0010] Preferably, the cleaning device includes an ultrasonic cleaning body, a positioning shaft, a support body, a push rod, and a pushing body. The support body is fixedly connected to the center of the bottom of the ultrasonic cleaning body. Support plates are fixedly connected to both the front and rear sides of the ultrasonic cleaning body. A pushing body is located on the top of the support body. A push rod is installed inside the support body, and the top of the push rod is rotatably connected to an electric telescopic body. The pushing body includes a push plate, a connecting rod, and a limiting plate. Vertically arranged connecting rods are fixedly connected to the left and right sides of the bottom of the push plate. A horizontally arranged limiting plate is fixedly connected to the end of the connecting rod away from the push plate. A through hole is opened in the center of the push plate, and the push rod passes through the through hole. Four evenly distributed and vertically arranged positioning shafts are fixedly connected to the top of the push plate. Two vertically arranged positioning shafts are fixedly connected to the left and right sides of the top of the support plate. An installation body is provided above both the pushing body and the support plate.

[0011] The mounting body includes a mounting block, an elastic tube, and an elastic seat. An elastic tube is fixedly connected inside the mounting block. An elastic seat is provided at the bottom of the elastic tube. A third deformation groove is evenly distributed inside the elastic seat. A fourth deformation groove is evenly distributed inside the elastic tube. The bottom of the elastic tube and the elastic seat fit together. The positioning shaft passes through the elastic tube and the elastic seat. The four mounting blocks are fixedly connected to the fixed frame.

[0012] Preferably, the support body includes a base, springs, eccentric wheels, a rotating shaft, and a mounting shaft. Vertically arranged grooves are provided on both the left and right sides of the base. Springs arranged symmetrically front to back are fixedly connected to the bottom of each groove. Two springs are positioned on the front and back sides of the limiting plate. A placement groove is provided at the top of the center of the base. Two vertically placed eccentric wheels, front to back, are located within the placement groove. A mounting shaft is fixedly connected below the central axis of the two eccentric wheels. A rotating shaft is located on the outer side above the central axis of the eccentric wheels. The end of the rotating shaft away from the eccentric wheels is installed inside the base. A push rod is located on the outer side of the mounting shaft. A second deformation groove is evenly distributed within the rubber ring. The bottom of the upper rubber ring does not adhere to the wafer body.

[0013] Preferably, the front and rear ends of the limiting plate are arc-shaped, and the arc-shaped positions at the front and rear ends of the limiting plate are respectively in close contact with two spring sheets. The top of the eccentric wheel is in close contact with the push plate, the bottom of the push plate is in close contact with the base, and the distance from the axis of the rotating shaft to the axis of the eccentric wheel is the same as the distance from the axis of the mounting shaft to the axis of the eccentric wheel.

[0014] Compared with the prior art, the beneficial effects of this application are:

[0015] 1. In this application, by setting up a shell, control body, feed trough, electric telescopic body, wafer body, placement device, cleaning device and mounting body, the thinned wafer body can be installed by the placement device, and then the cleaning device is installed under the action of the mounting body, and the wafer body is cleaned by the cleaning device. In this way, a large number of wafer bodies can be cleaned at one time, making the cleaning speed faster.

[0016] 2. In this application, a frame can be formed by setting a fixed frame, a rubber block, a first deformation groove, a fixed plate, a fixed ball, a through groove, an installation groove, a support rod, a crossbar, a fixed shaft, a rubber ring, a top frame, a clamping plate, and a clamping slot. The wafer body is then placed inside the rubber ring outside the fixed shaft at the bottom. The top frame is then installed on top of the fixed frame. The top frame drives the clamping plate to insert into the through groove opened in the fixed frame. At this time, the rubber block pushes the fixed plate with its own elasticity to clamp the fixed ball into the clamping slot opened in the clamping plate, thereby positioning the clamping plate and the top frame. At this time, the three rubber rings are evenly distributed on the outside of the wafer body to limit the wafer body. At the same time, the volume of the outer frame can be reduced, the flow rate of the cleaning fluid on the outside of the wafer body can be increased, and the cleaning efficiency of the wafer body can be improved. Meanwhile, the bottom of the support rod can be placed directly on the table, which is convenient for placing the wafer body.

[0017] 3. In this application, by setting the mounting block, elastic tube and elastic seat, the elastic seat can be first fitted on the outside of the positioning shaft, and then the mounting block with elastic tube can be fitted on the outside of the positioning shaft. At this time, the bottom of the mounting block is in contact with the elastic seat, and the elastic force of the elastic tube limits the mounting block, which facilitates the installation of the fixed frame and facilitates the placement of the wafer body in the ultrasonic cleaning body.

[0018] 4. In this application, the ultrasonic cleaning body, positioning shaft, support body and pushing body can support the mounting block, thereby supporting the fixing frame, so that the wafer body set below the fixing frame can be suspended in the ultrasonic cleaning body. Then, the surface of the wafer body is cleaned by the ultrasonic cleaning body and cleaning fluid, so that the wafer body is kept clean.

[0019] 5. In this application, through the provided electric telescopic body, base, slide, spring, placement groove, eccentric wheel, rotating shaft, mounting shaft, push rod, pushing body, push plate, connecting rod, limiting plate, and through hole, the electric telescopic body can drive the push rod to move up and down. The push rod drives the eccentric wheel to rotate outside the rotating shaft through the mounting shaft. At the same time, the eccentric wheel pushes the push plate to move upward, thereby driving the mounting block above the push plate to move, causing the limiting body to move. Under the action of the elastic tube, elastic seat, third deformation groove, and fourth deformation groove, the mounting block is limited and elastic force is provided. After the eccentric wheel rotates one revolution, the spring... The push plate moves the limiting plate downwards, and the limiting plate drives the push plate to reset downwards via the connecting rod, thereby realizing the swing of the limiting body. At the same time, because the rubber ring set above does not contact the wafer body, and there is a distance between the rubber ring set at the top and the wafer body, the wafer body can swing between the three rubber rings, allowing the wafer body to briefly leave the rubber rings, thus enabling cleaning around the wafer body and improving the cleaning effect. At the same time, the rubber rings can increase their deformation through the second deformation groove, preventing the wafer body from hitting the rubber rings and causing damage. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this application;

[0021] Figure 2 This is a schematic diagram of the installation structure of the electric telescopic body of this application;

[0022] Figure 3 This is a schematic diagram of the installation structure of the device used in this application;

[0023] Figure 4 This is a schematic diagram of the assembly structure of the wafer body of this application;

[0024] Figure 5 This is a schematic diagram showing the position of the rubber ring and the wafer body in this application;

[0025] Figure 6 This is a schematic diagram of the structure of the rubber ring in this application;

[0026] Figure 7 This is a schematic diagram of the installation structure of the card plate in this application;

[0027] Figure 8 This is a schematic diagram of the mounting structure of the fixing plate in this application;

[0028] Figure 9 This is a schematic diagram of the installation structure for fixing the ball in this application;

[0029] Figure 10 This is a schematic diagram of the cleaning device of this application;

[0030] Figure 11 This is a structural diagram of the main body of the installation in this application;

[0031] Figure 12 This is a schematic diagram of the reed mounting structure of this application;

[0032] Figure 13 This is a schematic diagram of the installation structure of the eccentric wheel in this application;

[0033] Figure 14 This is a schematic diagram of the mounting structure for the mounting shaft in this application.

[0034] In the diagram: 1. Outer shell; 2. Control unit; 3. Feed chute; 4. Electric telescopic unit; 5. Wafer unit; 6. Placement device; 61. Limiting unit; 611. Fixing frame; 612. Rubber block; 613. First deformation groove; 614. Fixing plate; 615. Fixing ball; 616. Through groove; 617. Mounting groove; 62. Support rod; 63. Crossbar; 64. Fixing shaft; 65. Rubber ring; 66. Top frame; 67. Card plate; 68. Second deformation groove; 69. Card slot; 7. Support plate; 8. Cleaning Cleaning device; 81. Ultrasonic cleaning body; 82. Positioning shaft; 83. Support body; 831. Base; 832. Slide groove; 833. Spring; 834. Placement groove; 835. Eccentric wheel; 836. Rotating shaft; 837. Mounting shaft; 84. Push rod; 85. Pushing body; 851. Push plate; 852. Connecting rod; 853. Limiting plate; 854. Through hole; 9. Mounting body; 91. Mounting block; 92. Elastic tube; 93. Elastic seat; 94. Third deformation groove; 95. Fourth deformation groove. Detailed Implementation

[0035] Please see Figure 1-14 This application provides a technical solution:

[0036] A cleaning device for a wafer thinning apparatus includes a housing 1, a placement device 6 for placing a wafer body 5, and a cleaning device 8 for cleaning the wafer body 5. A control body 2 is fixedly connected to the front left side of the housing 1. The cleaning device 8 is fixedly connected inside the housing 1. Horizontally arranged support plates 7 are installed on both the front and rear sides of the cleaning device 8. An electric telescopic body 4 is fixedly connected to the top of the cleaning device 8, and the top of the electric telescopic body 4 is fixedly connected to the housing 1. A feed chute 3 is opened on the top left side of the housing 1. The cleaning device 8 has two placement devices 6 arranged front and rear. Mounting bodies 9 are fixedly connected to both the front and rear sides of the placement devices 6. With this arrangement, the thinned wafer body 5 can be installed through the placement devices 6, and then loaded into the cleaning device 8 under the action of the mounting bodies 9. The cleaning device 8 cleans the wafer body 5, thereby enabling the cleaning of a large number of wafer bodies 5 at one time, making the cleaning speed faster.

[0037] like Figure 1-9As shown, the placement device 6 includes a limiting body 61, support rods 62, crossbars 63, fixing shafts 64, rubber rings 65, a top frame 66, and a clamping plate 67. Four vertically arranged and evenly distributed support rods 62 are fixedly connected to the bottom of the limiting body 61. Two support rods 62 are fixedly connected in groups to the left and right sides of the crossbars 63. The two crossbars 63 are respectively fixedly connected to the front and rear ends of two parallel and longitudinally arranged fixing shafts 64. The longitudinally arranged fixing shafts 64 are fixedly connected inside the top frame 66. Evenly distributed rubber rings 65 are fixedly connected to the outside of the fixing shafts 64. Three rubber rings 65 are arranged in groups on the outside of a wafer body 5. Evenly distributed and longitudinally arranged rubber rings are fixedly connected to the left and right sides of the bottom of the top frame 66. A clamping plate 67 and a top frame 66 are disposed on top of a limiting body 61. The limiting body 61 includes a fixing frame 611, rubber blocks 612, a fixing plate 614, and a fixing ball 615. The top of the fixing frame 611 has evenly distributed through slots 616. The inner walls of both the front and rear sides of the through slots 616 of the fixing frame 611 have mounting slots 617. Rubber blocks 612 are disposed within the mounting slots 617 of the fixing frame 611. The clamping plate 67 is disposed within the through slots 616 of the fixing frame 611. Two rubber blocks 612 are disposed on the front and rear sides of the clamping plate 67 respectively. A fixing plate 614 is fixedly connected to the side of the rubber block 612 closest to the clamping plate 67. A horizontally arranged and… The first deformation grooves 613 are evenly distributed. Two fixed balls 615 arranged left and right are fixedly connected to the side of the fixing plate 614 near the clamping plate 67. The clamping plate 67 has horizontally arranged arc-shaped slots 69 on both its front and rear sides. The fixed balls 615 are positioned in the slots 69 on the side of the clamping plate 67 away from the fixing plate 614. The side of the clamping plate 67 away from the top frame 66 is arc-shaped. The bottom of the top frame 66 is tightly fitted with the fixing frame 611. The bottom of the support rod 62 is located below the bottom of the wafer body 5. The two fixing frames 611 are respectively located on the front and rear sides of the cleaning device 8. This arrangement forms a frame consisting of the fixing frames 611, support rod 62, crossbar 63, and fixing shaft 64. The wafer body 5 is then placed... The rubber ring 65 is placed inside the fixed shaft 64 located below. Then, the top frame 66 is installed on top of the fixed frame 611. The top frame 66 drives the clamping plate 67 to be inserted into the through slot 616 opened in the fixed frame 611. At this time, the rubber block 612 pushes the fixed plate 614 through its own elasticity to clamp the fixed ball 615 into the slot 69 opened in the clamping plate 67, thereby positioning the clamping plate 67 and the top frame 66. At this time, the three rubber rings 65 are evenly distributed on the outside of the wafer body 5 to limit the wafer body 5. At the same time, it can reduce the volume of the outer frame, increase the flow rate of the cleaning fluid on the outside of the wafer body 5, and improve the cleaning efficiency of the wafer body 5. Meanwhile, the bottom of the support rod 62 can be placed directly on the table, which is convenient for placing the wafer body 5.

[0038] like Figure 1 , 2As shown in Figures 3 and 10, the cleaning device 8 includes an ultrasonic cleaning body 81, a positioning shaft 82, a support body 83, a push rod 84, and a pushing body 85. The support body 83 is fixedly connected to the bottom center of the ultrasonic cleaning body 81. The support plates 7 are fixedly connected to both the front and rear sides of the ultrasonic cleaning body 81. The pushing body 85 is provided on the top of the support body 83. The push rod 84 is installed inside the support body 83. The top of the push rod 84 is rotatably connected to the electric telescopic body 4. Through this setting, the mounting block 91 can be supported, thereby supporting the fixing frame 611. The wafer body 5 set below the fixing frame 611 can be suspended in the ultrasonic cleaning body 81. Then, the surface of the wafer body 5 is cleaned by the ultrasonic cleaning body 81 and the cleaning fluid, so that the wafer body 5 is kept clean.

[0039] like Figure 10-14As shown, the pushing body 85 includes a push plate 851, a connecting rod 852, and a limiting plate 853. Vertically arranged connecting rods 852 are fixedly connected to the left and right sides of the bottom of the push plate 851. A horizontally arranged limiting plate 853 is fixedly connected to the end of the connecting rod 852 away from the push plate 851. A through hole 854 is opened at the center of the push plate 851, and the push rod 84 passes through the through hole 854. Four evenly distributed and vertically arranged positioning shafts 82 are fixedly connected to the top of the push plate 851. Two vertically arranged positioning shafts 82 are fixedly connected to the left and right sides of the top of the support plate 7. An installation body 9 is provided above both the pushing body 85 and the support plate 7. The installation body 9 includes an installation block 91, an elastic tube 92, and an elastic seat 93. An elastic tube 92 is fixedly connected inside the frame 611. An elastic seat 93 is located at the bottom of the elastic tube 92. The elastic seat 93 has evenly distributed third deformation grooves 94, and the elastic tube 92 has evenly distributed fourth deformation grooves 95. The bottom of the elastic tube 92 and the elastic seat 93 are in close contact. A positioning shaft 82 passes through the elastic tube 92 and the elastic seat 93. Four mounting blocks 91 are fixedly connected to the fixing frame 611. With this arrangement, the elastic seat 93 can be first fitted onto the outside of the positioning shaft 82, and then the mounting blocks 91 with the elastic tube 92 can be fitted onto the outside of the positioning shaft 82. At this time, the bottom of the mounting block 91 is in contact with the elastic seat 93. The elastic force of the elastic tube 92 limits the position of the mounting block 91, facilitating the installation of the fixing frame 611 and also facilitating... The wafer body 5 is placed inside the ultrasonic cleaning body 81. The support body 83 includes a base 831, springs 833, eccentric wheels 835, a rotating shaft 836, and a mounting shaft 837. Vertically arranged grooves 832 are provided on both the left and right sides of the base 831. Springs 833, symmetrically arranged front and back, are fixedly connected to the bottom of the grooves 832 in the base 831. The two springs 833 are located on the front and back sides of the limiting plate 853. A placement groove 834 is provided at the top of the center of the base 831. Two vertically arranged eccentric wheels 835, front and back, are located in the placement groove 834. A mounting shaft 837 is fixedly connected below the central axis of the two eccentric wheels 835. A rotating shaft 837 is provided on the outer side above the central axis of the eccentric wheels 835. Shaft 836, with one end of the shaft away from the eccentric wheel 835, is installed inside the base 831. A push rod 84 is located on the outer side of the mounting shaft 837. A rubber ring 65 has evenly distributed second deformation grooves 68. The bottom of the upper rubber ring 65 is not in contact with the wafer body 5. The front and rear ends of the limiting plate 853 are arc-shaped, and the arc-shaped positions at the front and rear ends of the limiting plate 853 are in close contact with two spring sheets 833 respectively. The top of the eccentric wheel 835 is in contact with the push plate 851, and the bottom of the push plate 851 is in close contact with the base 831. The distance from the center of the shaft 836 to the center of the eccentric wheel 835 is the same as the distance from the center of the mounting shaft 837 to the center of the eccentric wheel 835. With this configuration, the push rod 84 can be moved up and down by the electric telescopic body 4.Push rod 84 drives eccentric wheel 835 to rotate outside of rotating shaft 836 via mounting shaft 837. Simultaneously, eccentric wheel 835 pushes push plate 851 upwards, which in turn moves mounting block 91 above push plate 851, causing limiting body 61 to move. Under the action of elastic tube 92, elastic seat 93, third deformation groove 94, and fourth deformation groove 95, mounting block 91 is limited and elastically supported. After eccentric wheel 835 rotates one revolution, spring 833 pushes limiting plate 853 downwards. Limiting plate 853, via connecting rod 852, causes push plate 851 to reset downwards. This allows the limiting body 61 to swing. Simultaneously, because the upper rubber ring 65 does not contact the wafer body 5, and a distance is maintained between the top rubber ring 65 and the wafer body 5, the wafer body 5 can swing between the three rubber rings 65, allowing it to briefly leave the rubber rings 65. This facilitates cleaning around the wafer body 5, improving the cleaning effect. Furthermore, the second deformation groove 68 increases the deformation of the rubber rings 65, preventing damage from impacts with the wafer body 5.

[0040] Workflow: When using this semiconductor wafer polishing equipment, first, please refer to... Figure 4-9 The polished wafer body 5 is placed between two rubber rings 65 through the fixing frame 611. At this time, the wafer body 5 is limited by the grooves provided in the rubber rings 65. After multiple wafer bodies 5 are placed, the retaining plate 67 provided at the bottom of the top frame 66 is inserted into the through slot 616 opened in the fixing frame 611. At this time, the retaining plate 67 pushes the fixing ball 615 to move through the bottom arc-shaped setting position. The fixing ball 615 pushes the fixing plate 614 to move. The fixing plate 614 pushes the rubber rings 65 to move. Block 612, the rubber block 612 deforms under the action of the first deformation groove 613 until the bottom of the top frame 66 is in contact with the fixed frame 611. At this time, the rubber block 612 returns to its shape, and at the same time, under the action of the rubber block 612, the fixed plate 614 and the fixed ball 615 are pushed back to their original positions. The fixed ball 615 is inserted into the slot 69 opened in the card plate 67, thereby limiting the card plate 67 and the top frame 66, realizing the installation of the rubber ring 65 set above. At this time, the rubber ring 65 set above is as follows. Figure 5 The device 6, which is not in contact with the wafer body 5, is then placed into the ultrasonic cleaning body 81 through the feed slot 3 opened in the outer casing 1. At this time, the mounting blocks 91 on both sides of the fixing frame 611 drive the elastic tube 92 to be fitted onto the outside of the positioning shaft 82 until the bottom of the mounting block 91 contacts the elastic seat 93. After both placement devices 6 are placed into the ultrasonic cleaning body 81, the outer casing 1 is controlled by the control body 2 to add cleaning fluid into the ultrasonic cleaning body 81. Then please refer to... Figure 10-14The ultrasonic cleaning body 81 is activated by the control body 2. At this time, the ultrasonic cleaning body 81 can clean the wafer body 5. During the cleaning process, because the space occupied by the fixed frame 611, support rod 62, crossbar 63, and fixed shaft 64 is relatively small, the wafer body 5 can come into contact with the cleaning fluid more easily, thereby improving the cleaning effect of the wafer body 5. Simultaneously, the electric telescopic body 4 is activated by the control body 2. The electric telescopic body 4 drives the push rod 84 to move. At this time, the push rod 84 drives the mounting shaft 837 to move. The mounting shaft 837 drives two eccentric wheels 835 to rotate outside the rotating shaft 836. The eccentric wheels 835 push the push plate 851 upward. The push plate 851 pushes the mounting block 91 to move through the elastic seat 93. The mounting block 91 drives the fixed frame 611 to move. At this time, the mounting block 91 squeezes the elastic seat 93, and the positioning shaft 82 squeezes the elastic tube 92. The elastic tube 92 and the elastic seat 93 deform and generate elastic force under the action of the third deformation groove 94 and the fourth deformation groove 95, respectively. Simultaneously, the push plate 851 drives the limiting plate 853 to move upward via the connecting rod 852. The limiting plate 853 pushes the spring 833 to deform through its arc-shaped ends. As the fixed frame 611 moves, the fixed frame 611 drives the rubber ring 65 to move via the support rod 62, the crossbar 63, and the fixed shaft 64. The rubber ring 65 drives the wafer body 5 to move. During the up-and-down movement, the wafer body 5 briefly leaves the rubber ring 65. At this time, all parts of the outer side of the wafer body 5 are exposed to the cleaning fluid, so that the parts of the wafer body 5 that were originally in contact with the rubber ring 65 can also be cleaned. During the downward movement of the push rod 84, the spring 833 pushes the limiting plate 853 to move downward. The limiting plate 853 drives the push plate 851 to move downward via the connecting rod 852, thereby resetting the fixed frame 611. After the wafer body 5 is cleaned, the cleaning fluid is discharged by controlling the main body 2, the ultrasonic cleaning main body 81 and the electric telescopic main body 4 are turned off, and then the wafer body 5 is taken out through the feed trough 3.

[0041] This document uses specific examples to illustrate the principles and implementation methods of this application. The examples are merely for the purpose of helping to understand the methods and core ideas of this application. The above descriptions are only preferred embodiments of this application. It should be noted that due to the limitations of written expression, while there are objectively infinite specific structures, those skilled in the art can make various improvements, modifications, or variations without departing from the principles of this application, and can also combine the above technical features in an appropriate manner. These improvements, modifications, variations, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of this application.

Claims

1. A cleaning device for a wafer thinning apparatus, comprising a housing (1), a placement device (6) for placing a wafer body (5), and a cleaning device (8) for cleaning the wafer body (5), characterized in that: The control body (2) is fixedly connected to the front left side of the outer shell (1). The cleaning device (8) is fixedly connected inside the outer shell (1). The cleaning device (8) has horizontally arranged trays (7) installed on both the front and rear sides. The top of the cleaning device (8) is fixedly connected to the electric telescopic body (4). The top of the electric telescopic body (4) is fixedly connected to the outer shell (1). The top left side of the outer shell (1) has a feeding groove (3). The cleaning device (8) has two placement devices (6) arranged in front and behind. The placement devices (6) have installation bodies (9) fixedly connected to both the front and rear sides. The placement device (6) includes a limiting body (61), support rods (62), crossbars (63), fixed shafts (64), rubber rings (65), a top frame (66), and a clamping plate (67). The bottom of the limiting body (61) is fixedly connected to four vertically arranged and evenly distributed support rods (62). The support rods (62) are fixedly connected in pairs to the left and right sides of the crossbars (63). The two crossbars (63) are fixedly connected to the front and rear ends of two parallel and longitudinally arranged fixed shafts (64). The top frame (66) is fixedly connected to the longitudinally arranged fixed shafts (64). The outer side of the fixed shafts (64) is fixedly connected to evenly distributed rubber rings (65). The rubber rings (65) are arranged in groups of three on the outer side of a wafer body (5). The bottom left and right sides of the top frame (66) are fixedly connected to evenly distributed and longitudinally arranged clamping plates (67). The top frame (66) is located on the top of the limiting body (61). The rubber ring (65) has a uniformly distributed second deformation groove (68) inside. The bottom of the upper rubber ring (65) is not in contact with the wafer body (5). There is a distance between the rubber ring (65) at the top and the wafer body (5), so that the wafer body (5) can swing between the three rubber rings (65) and the wafer body (5) can briefly leave the rubber ring (65). The limiting body (61) includes a fixed frame (611), rubber blocks (612), a fixed plate (614), and a fixed ball (615). The top of the fixed frame (611) is provided with uniformly distributed through grooves (616). The inner walls of the front and rear sides of the through grooves (616) of the fixed frame (611) are provided with mounting grooves (617). The mounting grooves (617) of the fixed frame (611) are provided with rubber blocks (612). The clamping plate (67) is set in the through grooves (616) of the fixed frame (611). The rubber blocks (612) are arranged in pairs on the front and rear sides of the clamping plate (67). 12) A fixing plate (614) is fixedly connected to the side of the inner plate (67). The rubber block (612) is provided with a first deformation groove (613) that is horizontally arranged and evenly distributed on the side away from the plate (67). Two fixing balls (615) are fixedly connected to the side of the fixing plate (614) that is close to the plate (67). The front and rear sides of the plate (67) are provided with horizontally arranged arc-shaped slots (69). The side of the fixing ball (615) that is away from the fixing plate (614) is located in the slot (69) opened in the plate (67). The side of the plate (67) that is away from the top frame (66) is arc-shaped. The cleaning device (8) includes an ultrasonic cleaning body (81), a positioning shaft (82), a support body (83), a push rod (84), and a pushing body (85). The support body (83) is fixedly connected to the center of the bottom of the ultrasonic cleaning body (81). Support plates (7) are fixedly connected to both the front and rear sides of the ultrasonic cleaning body (81). A pushing body (85) is installed on the top of the support body (83). A push rod (84) is installed inside the support body (83). The top of the push rod (84) is rotatably connected to an electric telescopic body (4). The pushing body (85) includes a push plate (851), a connecting rod (852), and a limiting plate (853). The push plate (851) has vertically arranged connecting rods (852) fixedly connected to the bottom left and right sides. The end of the connecting rod (852) away from the push plate (851) is fixedly connected to a horizontally arranged limiting plate (853). A through hole (854) is opened at the center of the push plate (851). The push rod (84) passes through the through hole (854) opened in the push plate (851). Four evenly distributed and vertically arranged positioning shafts (82) are fixedly connected to the top of the push plate (851). Two vertically arranged positioning shafts (82) are fixedly connected to the top left and right sides of the support plate (7). An installation body (9) is provided above the pushing body (85) and the support plate (7). The mounting body (9) includes a mounting block (91), an elastic tube (92), and an elastic seat (93). The elastic tube (92) is fixedly connected inside the mounting block (91). An elastic seat (93) is provided at the bottom of the elastic tube (92). A third deformation groove (94) is evenly distributed inside the elastic seat (93). A fourth deformation groove (95) is evenly distributed inside the elastic tube (92). The bottom of the elastic tube (92) and the elastic seat (93) fit together. The positioning shaft (82) passes through the elastic tube (92) and the elastic seat (93). The four mounting blocks (91) are fixedly connected to the fixing frame (611).

2. The cleaning equipment of the wafer processing thinning apparatus according to claim 1, characterized in that: The bottom of the top frame (66) is tightly fitted with the fixing frame (611), the bottom of the support rod (62) is located below the bottom of the wafer body (5), and the two fixing frames (611) are respectively located on the front and rear sides of the cleaning device (8).

3. The cleaning equipment of the wafer processing thinning apparatus according to claim 1, characterized in that: The supporting body (83) includes a base (831), springs (833), an eccentric wheel (835), a rotating shaft (836), and a mounting shaft (837). Vertically arranged grooves (832) are provided on both the left and right sides of the base (831). Springs (833) arranged symmetrically front and back are fixedly connected to the bottom of the grooves (832) in the base (831). Two springs (833) are located on the front and back sides of the limiting plate (853). The top of the base (831) is located at the center. The base (831) has a placement slot (834). The placement slot (834) of the base (831) has two vertically placed eccentric wheels (835) that are divided into front and back. The mounting shaft (837) is fixedly connected below the central axis of the two eccentric wheels (835). A rotating shaft (836) is provided on the outer side above the central axis of the eccentric wheels (835). The end of the rotating shaft (836) away from the eccentric wheels (835) is installed in the base (831). A push rod (84) is provided on the outer side of the mounting shaft (837).

4. The cleaning equipment of the wafer processing thinning apparatus according to claim 3, characterized in that: The limiting plate (853) is arc-shaped at both ends. The arc-shaped positions at both ends of the limiting plate (853) are respectively in close contact with two springs (833). The top of the eccentric wheel (835) is in close contact with the push plate (851). The bottom of the push plate (851) is in close contact with the base (831). The distance from the axis of the rotating shaft (836) to the axis of the eccentric wheel (835) is the same as the distance from the axis of the mounting shaft (837) to the axis of the eccentric wheel (835).

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