Semiconductor packaging mold

Abstract

The invention relates to a semiconductor packaging mold, and belongs to the technical field of semiconductor packaging molds. The semiconductor packaging mold comprises a first mold body and a second mold body, the second mold body is slidably installed on one side of the first mold body, a plurality of mold cavities are formed in the first mold body and the second mold body respectively, and an injection opening is fixedly formed in the top of the second mold body; the packaging demolding mechanism comprises a contact plate, a contact assembly and a circulating assembly which are arranged in the multiple mold cavities; when the first mold and the second mold are packaged, the contact plate is retracted to the inner wall of the mold cavity, at the moment, the cooling liquid continuously passes through the interior of the contact plate, so that the contact plate continuously keeps low temperature, epoxy resin continuously makes contact with the low-temperature contact plate during packaging, rapid cooling and solidification are conducted, the packaging time is shortened, and the phenomenon that the epoxy resin adheres to the inner wall of the mold cavity is reduced; and the contact plate is synchronously far away from the inner wall of the mold cavity to carry out auxiliary demolding on the packaged semiconductor.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging molds, and in particular to a semiconductor packaging mold. Background Art

[0002] Semiconductor packaging molds are special mold equipment used in semiconductor device packaging processes. Their main function is to encapsulate core components such as chips, lead frames, substrates, etc. in materials such as epoxy resin or ceramics to protect the chips from the external environment and to connect the chips to external circuits.

[0003] As shown in the reference case "A semiconductor packaging mold" announcement number "CN110556303B", it can meet the needs of rapid fixation of semiconductor chips of different sizes; it is beneficial to the heat dissipation of semiconductor chips, improves the service life of semiconductor chips, and also plays an all-round protective role for semiconductor chips.

[0004] During the encapsulation process, epoxy resin is injected into the mold cavity and directly contacts the inner wall of the mold cavity, and is cooled by the inner wall of the mold cavity. However, since the encapsulation process is carried out continuously, the temperature of the inner wall of the mold cavity will gradually increase with the continuous injection of epoxy resin, causing the cooling effect of the mold cavity to gradually decrease, resulting in the subsequent injection of epoxy resin. The cooling effect is reduced when it contacts the inner wall of the mold cavity. Due to insufficient cooling, the epoxy resin is more likely to adhere to the inner wall of the mold cavity, which increases the difficulty of demolding and affects the encapsulation efficiency. Summary of the invention

[0005] Based on this, it is necessary to provide a semiconductor packaging mold for the problem that during the epoxy resin injection packaging process, the epoxy resin needs to be completely cooled and solidified before demolding. Since the packaging process is carried out continuously, the temperature of the inner wall of the mold cavity will gradually increase with the continuous injection of epoxy resin, which makes the cooling effect of the mold cavity gradually decrease, resulting in the subsequent injection of epoxy resin. The cooling effect is reduced when it contacts the inner wall of the mold cavity, and due to insufficient cooling, the epoxy resin is more likely to adhere to the inner wall of the mold cavity, which increases the difficulty of demolding and affects the packaging efficiency.

[0006] A semiconductor packaging mold comprises: a first mold and a second mold, wherein the second mold is slidably mounted on one side of the first mold, a plurality of mold cavities are arranged inside the first mold and the second mold, and an injection port is fixedly mounted on the top of the second mold; a packaging demolding mechanism, wherein the packaging demolding mechanism comprises a contact plate, a contact assembly and a circulation assembly arranged inside the plurality of mold cavities, the contact assembly is arranged on one side of the contact plate, and the circulation assembly is arranged inside the first mold and the second mold; wherein the contact assembly comprises a plurality of fixed tubes fixedly mounted on the bottom of the mold cavity, a plurality of guide rods are fixedly mounted on the bottom of the contact plate, the plurality of guide rods are respectively slidably connected to the plurality of fixed tubes, and a plurality of cooling plates are fixedly mounted on the bottom of the contact plate.

[0007] The contact assembly also includes a spring fixedly installed at one end of the guide rod, the other end of the spring is fixedly connected to the inner wall of the fixed tube, and a plurality of contact blocks are fixedly installed on the surface of the contact plate, and the plurality of contact blocks are slidably connected to the inner walls of adjacent mold cavities, and the plurality of mold cavities of the first mold and the second mold are aligned with each other.

[0008] The first mold and the second mold are each provided with an active cavity inside, and the same driving plate is provided at the bottom of two adjacent mold cavities. The driving plate is slidably installed inside the active cavity, and the driving plate is located between multiple fixed tubes. A collision block is provided on one side of the multiple fixed tubes, and the multiple collision blocks are fixedly connected to the adjacent driving plates.

[0009] A motor is fixedly installed on one side of the first mold and the second mold, and the output end of the motor extends to the inside of the corresponding active cavity and is fixedly connected to a driving rod. A plurality of reciprocating screws are fixedly installed on the surface of the driving rod. The plurality of reciprocating screws respectively penetrate a plurality of driving plates inside the active cavity, and the reciprocating screws are slidably connected to the corresponding driving plates.

[0010] The inner bottom wall of the mold cavity is arranged in an isosceles trapezoidal shape, the bottom of the contact plate is adapted to the shape of the inner bottom wall of the mold cavity, and a sealing ring is fixedly installed on the outer side of the contact plate.

[0011] One side of the plurality of cooling plates extends into the interior of the active cavity, and the plurality of cooling plates are located on one side of the driving plate.

[0012] A guide tube is fixedly installed inside the cooling plate, and multiple connecting tubes are fixedly installed on both sides of the guide tube. The other ends of the multiple connecting tubes extend out of the cooling plate, and one side of the guide tube is located inside the contact plate.

[0013] The circulation component includes a circulation pump fixedly installed on one side of the first mold and the second mold. A plurality of flow grooves are opened on the surface of the driving plate, and the edges of the plurality of flow grooves are all set to be rounded.

[0014] An output pipe is fixedly installed at the output end of the circulation pump, one end of which extends into the interior of the active cavity, and an input pipe is fixedly installed at the input end of the circulation pump, the other end of which is connected to the interior of the active cavity.

[0015] The plurality of cooling plates are respectively located in adjacent flow grooves, and the cooling plates and the flow grooves are arranged in a cross shape.

[0016] The semiconductor packaging mold described above can efficiently cool and assist in demolding during semiconductor packaging through a packaging demolding mechanism. Specifically, during packaging, the contact plate is retracted to the inner wall of the mold cavity. At this time, coolant continuously passes through the inside of the contact plate, so that the contact plate is continuously kept at a low temperature, allowing the epoxy resin to continuously contact the low-temperature contact plate during packaging, and quickly cool down and solidify, thereby reducing the packaging time and reducing adhesion to the inner wall of the mold cavity. When the first mold and the second mold are separated, the contact plate simultaneously moves away from the inner wall of the mold cavity to assist in demolding the packaged semiconductor.

[0017] When the contact plate contacts the mold cavity, the starting motor drives the driving rod to rotate, which can make the reciprocating screw drive the corresponding driving plate to move back and forth, continuously bringing the collision block into contact and collision with the adjacent fixed tube. The impact vibration is transmitted to the contact plate through the internal guide rod, which can reduce the adhesion of epoxy resin on the inner wall of the mold cavity and the generation of bubbles to improve the packaging effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0020] Figure 2 It is a schematic diagram of the packaging demoulding mechanism structure of the present invention;

[0021] Figure 3 It is a schematic diagram of the structure of the active cavity and the driving plate of the present invention;

[0022] Figure 4 It is a schematic diagram of the mold cavity and fixed tube structure of the present invention;

[0023] Figure 5 It is a schematic diagram of the guide rod and the fixed tube structure of the present invention;

[0024] Figure 6 It is a schematic diagram of the cooling plate and guide tube structure of the present invention;

[0025] Figure 7 It is a schematic diagram of the collision block and the fixed tube structure of the present invention;

[0026] Figure 8 It is a schematic structural diagram of the first mold and the driving plate of the present invention;

[0027] Fig. 9 It is a schematic diagram of the circulation pump and the first mold structure of the present invention.

[0028] Reference numerals:

[0029] 1100, first mold; 110, mold cavity; 120, movable cavity; 200, second mold; 210, injection port; 300, package demoulding mechanism; 310, contact plate; 320, contact assembly; 321, fixed tube; 322, guide rod; 323, contact block; 324, spring; 325, drive plate; 326, collision block; 327, motor; 328, drive rod; 329, reciprocating screw; 3210, sealing ring; 3211, cooling plate; 3212, guide tube; 3213, connecting tube; 330, circulation assembly; 331, circulation pump; 332, flow trough; 333, output tube; 334, input tube. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of the present invention are for illustrative purposes only and do not represent the only implementation method.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0033] In the present invention, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0034] Unless otherwise defined, all technical and scientific terms used in the specification of the present invention have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in the specification of the present invention includes any and all combinations of one or more related listed items.

[0035] Combine the following Figure 1-Figure 9 A semiconductor packaging die of the present invention is described.

[0036] like Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 8 As shown, in one embodiment, a semiconductor packaging mold includes: a first mold 100 and a second mold 200, the second mold 200 is slidably installed on one side of the first mold 100, a plurality of mold cavities 110 are arranged inside the first mold 100 and the second mold 200, and an injection port 210 is fixedly installed on the top of the second mold 200; a packaging demolding mechanism 300, the packaging demolding mechanism 300 includes a contact plate 310, a contact component 320 and a circulation component 330 arranged inside the plurality of mold cavities 110, the contact component 320 is arranged on one side of the contact plate 310, and the circulation component 330 is arranged inside the first mold 100 and the second mold 200; wherein, the contact component 320 includes a plurality of fixed tubes 321 fixedly installed at the bottom of the mold cavity 110, a plurality of guide rods 322 are fixedly installed at the bottom of the contact plate 310, and the plurality of guide rods 322 are respectively slidably connected with the plurality of fixed tubes 321, and a plurality of cooling plates 3211 are fixedly installed at the bottom of the contact plate 310.

[0037] In this embodiment, when in use, the semiconductor to be packaged is placed in the corresponding mold cavity 110, and then the first mold 100 and the second mold 200 are closed, and epoxy resin is injected for packaging. The packaging demolding mechanism 300 can be used to efficiently cool the injected epoxy resin and assist in demolding. Specifically, the contact component 320 allows the contact plate 310 to be retracted to the inner wall of the mold cavity 110 during packaging and contact the epoxy resin, so that the contact plate 310 is quickly cooled by the cooling plate 3211, which helps the epoxy resin to solidify quickly, reduces the packaging time, reduces the adhesion of the packaging material to the inner wall of the mold cavity 110, and improves the demolding efficiency. When the first mold 100 and the second mold 200 are separated, the contact plate 310 is synchronously moved away from the inner wall of the mold cavity 110 to assist in demolding. When the contact plate 310 is in use, the circulation component 330 can circulate and guide the coolant in the first mold 100 and the second mold 200, so that the coolant can better cool the mold cavity 110 and the contact plate 310.

[0038] like Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 7 As shown, the contact assembly 320 also includes a spring 324 fixedly mounted on one end of the guide rod 322, the other end of the spring 324 is fixedly connected to the inner wall of the fixed tube 321, a plurality of contact blocks 323 are fixedly mounted on the surface of the contact plate 310, and the plurality of contact blocks 323 are all slidably connected to the inner walls of adjacent mold cavities 110, and the plurality of mold cavities 110 of the first mold 100 and the second mold 200 are aligned with each other.

[0039] Both the first mold 100 and the second mold 200 are provided with an active cavity 120, and the same driving plate 325 is provided at the bottom of the two adjacent mold cavities 110. The driving plate 325 is slidably installed inside the active cavity 120. The driving plate 325 is located between multiple fixed tubes 321. A collision block 326 is provided on one side of the multiple fixed tubes 321, and the multiple collision blocks 326 are fixedly connected to the adjacent driving plates 325.

[0040] A motor 327 is fixedly installed on one side of the first mold 100 and the second mold 200. The output end of the motor 327 extends to the inside of the corresponding active cavity 120 and is fixedly connected to a driving rod 328. A plurality of reciprocating screws 329 are fixedly installed on the surface of the driving rod 328. The plurality of reciprocating screws 329 respectively penetrate the plurality of driving plates 325 inside the active cavity 120, and the reciprocating screws 329 are slidably connected to the corresponding driving plates 325.

[0041] The inner bottom wall of the mold cavity 110 is set to an isosceles trapezoidal shape, the bottom of the contact plate 310 is adapted to the shape of the inner bottom wall of the mold cavity 110, and a sealing ring 3210 is fixedly installed on the outer side of the contact plate 310.

[0042] One side of the plurality of cooling plates 3211 extends to the inside of the active chamber 120 , and the plurality of cooling plates 3211 are located on one side of the driving plate 325 .

[0043] A guide tube 3212 is fixedly installed inside the cooling plate 3211 , and multiple connecting tubes 3213 are fixedly installed on both sides of the guide tube 3212 . The other ends of the multiple connecting tubes 3213 extend out of the cooling plate 3211 , and one side of the guide tube 3212 is located inside the contact plate 310 .

[0044] In this embodiment, multiple mold cavities 110 on the same horizontal line are interconnected, and the active cavity 120 is filled with coolant. When the first mold 100 and the second mold 200 are close to each other, the multiple mold cavities 110 on the upper and lower sides are close to each other synchronously, so that the contact blocks 323 located on the same vertical line contact each other, and the synchronous extrusion spring 324 moves the corresponding contact plate 310 to the inside of the adjacent mold cavity 110. When the contact plate 310 contacts the mold cavity 110, the multiple cooling plates 3211 and the guide rod 322 are synchronously moved to the inside of the active cavity 120 to increase the contact area with the coolant. At this time, the start motor 327 drives the drive rod 328 to rotate, and the drive rod 328 drives the reciprocating screw 329 to rotate, so that the reciprocating screw 329 can drive the corresponding drive plate 325 to reciprocate, and continuously bring the collision block 326 to contact and collide with the adjacent fixed tube 321, The impact vibration is transmitted to the contact plate 310 through the internal guide rod 322, which can reduce the adhesion of epoxy resin to the inner wall of the mold cavity 110 and reduce the generation of bubbles. The coolant circulates inside the active cavity 120 through the circulation component 330. When the coolant flows, it will enter the guide tube 3212 through the connecting pipe 3213 and flow from the inside of the contact plate 310 to keep the contact plate 310 at a low temperature, further improving the cooling effect of the contact plate 310 on the epoxy resin. When the first mold 100 and the second mold 200 are separated, the spring 324 will push the contact plate 310 away from the inner wall of the mold cavity 110 to assist in demolding. The inner bottom wall of the mold cavity 110 is an isosceles trapezoid, which matches the bottom shape of the contact plate 310, so that the contact plate 310 can fit tightly against the bottom wall of the mold cavity 110. The sealing ring 3210 on the outside of the contact plate 310 further enhances the sealing to prevent leakage of coolant or epoxy resin.

[0045] like Figure 2 , Figure 4 , Figure 8 and Fig. 9 As shown, the circulation component 330 includes a circulation pump 331 fixedly installed on one side of the first mold 100 and the second mold 200, and a plurality of flow grooves 332 are opened on the surface of the driving plate 325, and the edges of the plurality of flow grooves 332 are all set to be rounded.

[0046] An output pipe 333 is fixedly installed at the output end of the circulation pump 331 , one end of which extends into the active chamber 120 , and an input pipe 334 is fixedly installed at the input end of the circulation pump 331 , the other end of which is connected to the inside of the active chamber 120 .

[0047] A plurality of cooling plates 3211 are respectively located in adjacent flow slots 332 , and the cooling plates 3211 and the flow slots 332 are arranged in a cross shape.

[0048] In this embodiment, multiple flow grooves 332 are all located on one side of multiple mold cavities 110, and multiple cooling plates 3211 and connecting pipes 3213 on one side of the mold cavity 110 are also located inside the flow grooves 332. The circulating pump 331 can allow the coolant to circulate between the multiple flow grooves 332. The rounded corners of the flow grooves 332 ensure that the coolant can pass through the flow grooves 332 more smoothly during the flow process. At the same time, the cross-shaped arrangement of the cooling plates 3211 and the flow grooves 332 increases the contact area between the coolant and the flow grooves 332, thereby improving the cooling effect of the coolant on the cooling plates 3211. The circulating pump 331 outputs the coolant through the output pipe 333, and then recovers the coolant through the input pipe 334, so that the coolant continues to flow inside the active cavity 120, thereby achieving uniform temperature distribution in the first mold 100 and the second mold 200 and improving the cooling efficiency.

[0049] Working principle: when the first mold 100 and the second mold 200 are close to each other, the multiple mold cavities 110 on the upper and lower sides are close to each other synchronously, so that the contact blocks 323 located on the same vertical line contact each other, and the synchronous extrusion spring 324 moves the corresponding contact plate 310 to the inside of the adjacent mold cavity 110. When the contact plate 310 contacts the mold cavity 110, the multiple cooling plates 3211 and the guide rod 322 are synchronously moved to the inside of the active cavity 120 to increase the contact area with the coolant. At this time, the start motor 327 drives the drive rod 328 to rotate, and the drive rod 328 drives the reciprocating screw 329 to rotate, so that the reciprocating screw 329 can drive the corresponding drive plate 325 to reciprocate, continuously. The collision block 326 contacts and collides with the adjacent fixed tube 321, and the impact vibration is transmitted to the contact plate 310 through the internal guide rod 322, which can reduce the adhesion of epoxy resin on the inner wall of the mold cavity 110 and reduce the generation of bubbles. The coolant circulates inside the active cavity 120 through the circulation component 330. When the coolant flows, it enters the guide tube 3212 through the connecting pipe 3213 and flows from the inside of the contact plate 310 to keep the contact plate 310 at a low temperature, further improving the cooling effect of the contact plate 310 on the epoxy resin. When the first mold 100 and the second mold 200 are separated, the spring 324 pushes the contact plate 310 away from the inner wall of the mold cavity 110 to assist demoulding;

[0050] The circulation pump 331 outputs the coolant through the output pipe 333, and then recovers the coolant through the input pipe 334, so that the coolant continues to flow inside the active cavity 120, thereby achieving uniform temperature distribution in the first mold 100 and the second mold 200 and improving the cooling efficiency. The rounded corners of the flow groove 332 ensure that the coolant passes through the flow groove 332 more smoothly during the flow process. At the same time, the cross-shaped arrangement of the cooling plate 3211 and the flow groove 332 increases the contact area between the coolant and the flow groove 332, thereby improving the cooling effect of the coolant on the cooling plate 3211.

[0051] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The above-described embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A semiconductor packaging mold, characterized in that: include: A first mold (100) and a second mold (200), wherein the second mold (200) is slidably mounted on one side of the first mold (100), a plurality of mold cavities (110) are arranged inside the first mold (100) and the second mold (200), and an injection port (210) is fixedly mounted on the top of the second mold (200); A packaging demoulding mechanism (300), the packaging demoulding mechanism (300) comprising a contact plate (310) disposed inside a plurality of mold cavities (110), a contact component (320) and a circulation component (330), the contact component (320) being disposed on one side of the contact plate (310), and the circulation component (330) being disposed inside a first mold (100) and a second mold (200); Wherein, the contact assembly (320) includes a plurality of fixed tubes (321) fixedly installed at the bottom of the mold cavity (110), a plurality of guide rods (322) are fixedly installed at the bottom of the contact plate (310), the plurality of guide rods (322) are respectively slidably connected to the plurality of fixed tubes (321), and a plurality of cooling plates (3211) are fixedly installed at the bottom of the contact plate (310).

2. The semiconductor packaging mold according to claim 1, characterized in that: The contact assembly (320) further comprises a spring (324) fixedly mounted on one end of the guide rod (322), the other end of the spring (324) being fixedly connected to the inner wall of the fixed tube (321), a plurality of contact blocks (323) being fixedly mounted on the surface of the contact plate (310), the plurality of contact blocks (323) being slidably connected to the inner walls of adjacent mold cavities (110), and the plurality of mold cavities (110) of the first mold (100) and the second mold (200) being aligned with each other.

3. The semiconductor packaging mold according to claim 1, characterized in that: Both the first mold (100) and the second mold (200) are provided with an active cavity (120), and the bottom of two adjacent mold cavities (110) are provided with a same driving plate (325), and the driving plate (325) is slidably installed inside the active cavity (120), and the driving plate (325) is located between a plurality of fixed tubes (321), and a collision block (326) is provided on one side of the plurality of fixed tubes (321), and the plurality of collision blocks (326) are fixedly connected to the adjacent driving plates (325).

4. The semiconductor packaging mold according to claim 3, characterized in that: A motor (327) is fixedly installed on one side of the first mold (100) and the second mold (200), and the output end of the motor (327) extends to the inside of the corresponding active cavity (120) and is fixedly connected to a driving rod (328), and a plurality of reciprocating screws (329) are fixedly installed on the surface of the driving rod (328), and the plurality of reciprocating screws (329) respectively penetrate a plurality of driving plates (325) inside the active cavity (120), and the reciprocating screws (329) are slidably connected to the corresponding driving plates (325).

5. The semiconductor packaging mold according to claim 1, characterized in that: The inner bottom wall of the mold cavity (110) is arranged in an isosceles trapezoidal shape, the bottom of the contact plate (310) is adapted to the shape of the inner bottom wall of the mold cavity (110), and a sealing ring (3210) is fixedly mounted on the outer side of the contact plate (310).

6. The semiconductor packaging mold according to claim 4, characterized in that: One side of the plurality of cooling plates (3211) extends to the interior of the active cavity (120), and the plurality of cooling plates (3211) are located on one side of the driving plate (325).

7. The semiconductor packaging mold according to claim 1, characterized in that: A guide tube (3212) is fixedly installed inside the cooling plate (3211), and a plurality of connecting tubes (3213) are fixedly installed on both sides of the guide tube (3212), and the other ends of the plurality of connecting tubes (3213) extend out of the cooling plate (3211), and one side of the guide tube (3212) is located inside the contact plate (310).

8. The semiconductor packaging mold according to claim 4, characterized in that: The circulation component (330) includes a circulation pump (331) fixedly mounted on one side of the first mold (100) and the second mold (200), and a plurality of flow grooves (332) are provided on the surface of the driving plate (325), and the edges of the plurality of flow grooves (332) are all configured to be rounded.

9. The semiconductor packaging mold according to claim 8, characterized in that: An output pipe (333) is fixedly installed at the output end of the circulation pump (331), one end of the output pipe (333) extends into the interior of the active chamber (120), and an input pipe (334) is fixedly installed at the input end of the circulation pump (331), the other end of the input pipe (334) is connected to the interior of the active chamber (120).

10. The semiconductor packaging mold according to claim 8, characterized in that: The plurality of cooling plates (3211) are respectively located in adjacent flow grooves (332), and the cooling plates (3211) and the flow grooves (332) are arranged in a cross shape.

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