An ion implanter with a target plate scanning motion mechanism

Abstract

The present application discloses an ion implanter with a target plate scanning motion mechanism, and relates to the technical field of ion implantation equipment. The present application adds a strip-shaped soft pad on the target plate so that the strip-shaped soft pad is closely attached to the surface of the clamping block closest to the wafer, and sets rollers at both ends of the strip-shaped soft pad so that the rollers are rotatably connected to the target plate; sets a plurality of reversing wheels in the axial direction and the thickness direction of the target plate to guide the direction of the strip-shaped soft pad and cooperates with two rollers to ensure that the strip-shaped soft pad is always in a straight state; when the soft pad contacting the wafer and the abutment body needs to be replaced, controls the rollers to rotate and realizes the overall movement of the strip-shaped soft pad; realizes the technical effect that the ion implanter has the function of automatically replacing the soft pad on the target plate safely, conveniently and efficiently, and the replacement process will not affect the normal operation of the production line.

Description

Technical Field

[0001] The invention relates to the technical field of ion implantation equipment, in particular to an ion implantation machine with a target plate scanning motion mechanism. Background Art

[0002] The ion implanter obtains the required ions from an ion source, and accelerates the ion beam to be used for ion implantation of semiconductor materials, large-scale integrated circuits and devices. In order to ensure the uniformity of the ion dose injected into the silicon wafer, the scanning motion of the target disk must be well controlled. The scanning motion method of the target disk is: the ion beam is stationary, the target disk must rotate at a uniform speed to adjust the injection tilt angle, and also make a reciprocating translation motion up and down.

[0003] When ions are implanted into the wafer, a target plate (loading plate) is required to support and place the wafer. When the wafer is installed on the loading plate, a plurality of slidable clamping blocks (contact bodies) are generally used to clamp and fix the wafer. It is relatively convenient to clamp and fix the wafer using a plurality of slidable clamping blocks, but the hard clamping blocks are also easy to squeeze and damage the wafer from the edge of the wafer. Generally, a soft silicone cushion is installed and fixed at the position where the clamping block contacts the wafer to alleviate the impact.

[0004] The use of silicone pads can avoid extrusion damage to the wafer, but although silicone can resist ion impact and high temperature to a certain extent, it will still cause certain damage due to extrusion deformation, high temperature and impact after repeated use and needs to be replaced, otherwise it is easy to affect the clamping effect and thus affect the ion implantation of the wafer;

[0005] In the prior art, replacing the above-mentioned soft pads requires manual participation, which is a cumbersome, dangerous, time-consuming and labor-intensive process and requires suspending the production line, thus affecting operating efficiency and being detrimental to high-quality and efficient processing of wafers.

[0006] Therefore, there is a need for an ion implanter with a target plate scanning motion mechanism and a function of automatically replacing the soft pad on the target plate in a safe, convenient and efficient manner. Summary of the invention

[0007] The embodiment of the present application provides an ion implanter with a target plate scanning motion mechanism, thereby solving the technical problems in the prior art that the process of replacing the soft pad on the target plate of the ion implanter is cumbersome, highly dangerous, requires manual participation, and requires the production line to be shut down for replacement, thereby affecting the wafer processing efficiency; and achieves the technical effect that the ion implanter has the function of automatically replacing the soft pad on the target plate in a safe, convenient and efficient manner, and the replacement process will not affect the normal operation of the production line.

[0008] The embodiment of the present application provides an ion implanter with a target plate scanning motion mechanism, including an ion source, a target plate assembly, and a target plate shift assembly;

[0009] The target disc assembly comprises a target disc body, a clamping assembly, a reversing wheel and a spacer replacement assembly;

[0010] The target plate body is in the shape of a plate, and a center groove is provided at the center of the top;

[0011] The clamping assembly is positioned on the top surface of the target plate body and is a combination of radially arranged guide rails and clamping blocks or a telescopic rod; a resistance body is positioned at the position where the clamping assembly directly contacts the spacer replacement assembly;

[0012] The reversing wheels are rotatably connected to the top surface of the target plate body, and there are multiple reversing wheels;

[0013] The septum replacement assembly includes a strip-shaped septum, a first barrel, and a second barrel;

[0014] The strip-shaped spacer abuts against all the reversing wheels and the abutting body, and the two ends are respectively wound and positioned on the first cylinder and the second cylinder;

[0015] The first tube and the second tube are connected to the top surface of the target plate body by rotating around their own axes, and the first tube and the second tube and the belt-shaped spacer form a circle on the top surface of the target plate body.

[0016] Furthermore, the diameter of the central groove is larger than the diameter of the wafer to be positioned;

[0017] The central groove has a built-in wafer lifting assembly; the wafer lifting assembly is a combination of an electric telescopic rod and a circular plate placed horizontally and fixed on the top of the electric telescopic rod; the electric telescopic rod of the wafer lifting assembly coincides with the axis of the central groove, and the electric telescopic rod drives the circular plate to rise and fall when it is extended or retracted, and when it is raised to the longest state, the circular plate is not higher than the clamping assembly.

[0018] Furthermore, the target plate assembly also includes a top cover plate assembly;

[0019] The top cover plate assembly is positioned on the top surface of the target plate body, and comprises a top plate and a support frame;

[0020] The top plate is a hard plate body, and a round through hole is provided at the center thereof;

[0021] The top plate is parallel to the top surface of the target plate body;

[0022] The support frame is a hard plate body or a hard rod body, the length direction is the same as the thickness direction of the target plate body, there are multiple support frames, they are arranged close to the edge of the target plate body, and the bottom is fixed on the target plate body; the top plate is fixed on the top of the support frame.

[0023] Furthermore, reversing wheels are positioned on both sides of the clamping block and both sides of the telescopic rod body, and the existence of these reversing wheels makes the belt-shaped spacers close to the abutment body arranged in a U shape.

[0024] Further, the clamping assembly is three radially arranged guide rails positioned on the top surface of the target plate body and a clamping block sliding along the guide rails under the coordinated control of the control unit and the power assembly;

[0025] The clamping block clamps the wafer as it moves toward the center of the target plate body;

[0026] A resisting body is positioned on the surface of the clamping block close to the center of the target plate body; the resisting body positioned on the clamping block is fixed on the clamping block or is integrally formed with the clamping block.

[0027] Further, the clamping assembly includes a telescopic rod body;

[0028] The telescopic rod body is an electric push rod, which is arranged radially around the center line of the central groove and fixed on the top surface of the target plate body;

[0029] An abutment body is positioned at the end of the telescopic rod body close to the central groove, and the abutment body moves as the telescopic rod body is extended and retracted;

[0030] When the telescopic rod is extended, the wafer is clamped;

[0031] The abutment body is in direct contact with the strip-shaped spacer, and the surface in contact with the strip-shaped spacer is smooth; the abutment body positioned on the telescopic rod body is fixed on the telescopic rod body or is integrally formed with the telescopic rod body.

[0032] Furthermore, the abutment body is a cylinder whose axial direction is the same as the thickness direction of the target plate body.

[0033] Furthermore, the abutment body includes a abutment wheel and a bearing frame;

[0034] The abutment wheel is a cylindrical wheel body whose axial direction is the same as the thickness direction of the target plate body, and is connected to the bearing frame body by rotation around its own axis;

[0035] The bearing frame is a plate body with a U-shaped longitudinal section, which is fixed on the end of the telescopic rod body close to the center of the target plate body or on the surface of the clamping block close to the center of the target plate body.

[0036] Preferably, it also includes an auxiliary belt assembly and a pump air assembly;

[0037] The strip-shaped spacer, the first tube and the second tube form a closed circle on the top surface of the target plate body; the strip-shaped spacer wound on the first tube abuts against the strip-shaped spacer wound on the second tube;

[0038] The auxiliary belt assembly includes a guide rotating rod, a bottom rotating column and a maintenance auxiliary belt;

[0039] The guide rotating rods are arranged transversely, and there are four of them, all of which rotate around their own axes;

[0040] There are two bottom rotating columns, namely a first rotating column and a second rotating column, both of which are positioned on the bottom surface of the target plate body;

[0041] The maintenance auxiliary belt is a rubber belt with one side coated with adhesive, which passes through between the top plate and the target plate body, and the two ends are respectively wound around and positioned on the first rotating column and the second rotating column;

[0042] Exposure holes are arranged at equal intervals on the maintenance auxiliary belt; the interval between the exposure holes is greater than 1.3 times the diameter of the central groove; the adhesive surface of the maintenance auxiliary belt faces the target plate body;

[0043] The pump air component is positioned at the bottom of the target plate body; the bottom of the central groove is provided with a hole communicated with the pump air component.

[0044] Preferably, after cleaning, the strip-shaped spacer and the abutment body are controlled to shift and cooperate with the air pump assembly to pump air into the central groove, and at the same time, the bottom rotating column is controlled to rotate and pull the maintenance auxiliary belt to assist the maintenance auxiliary belt to detach from the strip-shaped spacer.

[0045] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0046] A strip-shaped soft pad is added to the target disk, so that the strip-shaped soft pad is closely attached to the surface of the clamping block closest to the wafer, and rollers are arranged at both ends of the strip-shaped soft pad, so that the rollers are rotatably connected to the target disk; a plurality of reversing wheels in the axial direction and the thickness direction of the target disk are arranged to guide the direction of the strip-shaped soft pad and cooperate with the two rollers to ensure that the strip-shaped soft pad is always in a straight state; when the soft pad contacting the wafer and the abutment body needs to be replaced, the roller is controlled to rotate to realize the overall movement of the strip-shaped soft pad; the technical problems in the prior art that the replacement process of the soft pad on the target disk of the ion implanter is complicated, highly dangerous, requires manual participation, and requires the production line to be stopped for replacement, thereby affecting the wafer processing efficiency are effectively solved; thereby, the technical effect that the ion implanter has the function of automatically replacing the soft pad on the target disk safely, conveniently and efficiently and the replacement process will not affect the normal operation of the production line is realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 is a schematic diagram of the structure of the target plate assembly;

[0048] Figure 2 is a schematic diagram of the appearance of the target plate assembly;

[0049] Figure 3 A schematic diagram of the positional relationship between the target plate assembly and the target plate shift assembly;

[0050] Figure 4 It is a structural schematic diagram of a strip-shaped spacer;

[0051] Figure 5 is a schematic diagram of the bottom structure of the target plate assembly;

[0052] Figure 6 It is a schematic diagram of the positional relationship between the auxiliary belt assembly and the target plate assembly;

[0053] Figure 7 Schematic diagram of the position relationship of the bottom rotating column;

[0054] Figure 8 A schematic diagram of the layout relationship of the maintenance auxiliary belt;

[0055] Fig. 9 A schematic diagram of the positional relationship between the guide rotating rod and the target plate assembly;

[0056] Fig.10 It is a schematic diagram of the overall structure of the auxiliary belt assembly;

[0057] Fig.11 A simplified diagram of the structure of the maintenance auxiliary belt;

[0058] Fig.12 Schematic diagram of the deformation state of the maintenance auxiliary belt.

[0059] In the figure:

[0060] Target plate assembly 100, target plate body 110, center groove 111, wafer lifting assembly 112, telescopic rod body 121, abutment wheel 122, carrying frame 123, reversing wheel 130, belt-shaped spacer 141, first cylinder 142, second cylinder 143, top plate 151, support frame 152, target plate shifting assembly 200, auxiliary belt assembly 300, guide rotating rod 310, first rotating column 321, second rotating column 322, maintenance auxiliary belt 330, exposure hole 331, pump air assembly 400. DETAILED DESCRIPTION

[0061] To facilitate the understanding of the present invention, the present application will be described more comprehensively below with reference to the relevant drawings; the drawings show preferred embodiments of the present invention, but the present invention can be implemented in many different forms and is not limited to the embodiments described herein; on the contrary, the purpose of providing these embodiments is to enable a more thorough and comprehensive understanding of the disclosed content of the present invention.

[0062] It should be noted that the terms “vertical”, “horizontal”, “up”, “down”, “left”, “right” and similar expressions used in this document are only for illustrative purposes and do not represent the only implementation method.

[0063] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which the present invention belongs; the terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the term "and / or" used herein includes any and all combinations of one or more related listed items.

[0064] Embodiment 1

[0065] like Figures 1 to 3 As shown, the ion implanter with a target plate scanning motion mechanism of the present application includes an ion source, a target plate assembly 100, a target plate shifting assembly 200, a power assembly and a control unit.

[0066] For the convenience of description, the surface of the target plate assembly 100 close to the wafer clamped and positioned thereon is defined as the top surface;

[0067] The ion source is used to emit an ion beam toward the wafer positioned on the target disk assembly 100, which is fixed; the target disk shifting assembly 200 is used to drive the target disk assembly 100 to tilt, rotate and move up and down, and plays a role of bearing support; the power assembly is used to provide power for the operation of various components of the ion implanter, and the control unit plays a role of controlling the coordinated operation of various components of the ion implanter; the control unit is preferably a combination of a programmable logic controller and a control panel; the ion source, the target disk shifting assembly 200, the power assembly and the control unit are all prior art and are not described in detail here; the specific structure of the target disk shifting assembly 200 can refer to the target disk angle control and scanning motion mechanism in the ion implanter disclosed in the Chinese invention patent No. 200410009225.X.

[0068] The target plate assembly 100 includes a target plate body 110 , a clamping assembly, a reversing wheel 130 and a spacer replacement assembly.

[0069] The target plate body 110 is in the shape of a square plate or a circular plate, plays a bearing role, and its bottom is hinged to the top of the target plate displacement assembly 200; a center groove 111 is provided at the center of the top of the target plate body 110, and the center groove 111 is a circular groove; the diameter of the center groove 111 is larger than the diameter of the wafer to be positioned; a wafer lifting assembly 112 is built in the center groove 111; the wafer lifting assembly 112 is a combination of an electric telescopic rod and a circular plate horizontally placed and fixed on the top of the electric telescopic rod; the electric telescopic rod of the wafer lifting assembly 112 coincides with the axis of the center groove 111, and the electric telescopic rod drives the circular plate to rise and fall when it is extended and retracted, and when it is raised to the longest state, the circular plate is not higher than the clamping assembly; the circular plate is coaxial with the electric telescopic rod.

[0070] The clamping assembly is positioned on the top surface of the target plate body 110 and is used to clamp and fix the wafer by its own deformation. It is a combination of radially arranged guide rails and clamping blocks or a radially arranged telescopic rod body 121. A resistance body is positioned at the position where the clamping block and the telescopic rod body 121 are in direct contact with the spacer replacement assembly. The surface of the resistance body close to the center of the target plate body 110 is smooth and is in direct contact with the strip-shaped spacer 141.

[0071] The reversing wheel 130 is a cylindrical wheel body, which rotates around its own axis and is connected to the top surface of the target plate body 110, and the axial direction is the same as the thickness direction of the target plate body 110; there are multiple reversing wheels 130, which are used to guide the direction of the strip-shaped spacers 141 of the spacer replacement assembly so that other strip-shaped spacers 141 except the strip-shaped spacers 141 close to and tightly attached to the abutment body will not be located directly above the central groove 111 and will not affect the clamping of the wafer.

[0072] The septum replacement assembly includes a strip-shaped septum 141, a first cylinder 142, and a second cylinder 143;

[0073] like Figure 1 and Figure 4 As shown, the strip-shaped spacer 141 is a strip-shaped silicone soft pad, which abuts against all the reversing wheels 130 and the abutting body at the same time, and the two ends are respectively wound and positioned on the first cylinder 142 and the second cylinder 143; the first cylinder 142 and the second cylinder 143 are both reel structures, at least one of which has a built-in motor, which rotates around its own axis and is connected to the top surface of the target plate body 110; the axial direction of the first cylinder 142 and the second cylinder 143 is the same as the thickness direction of the target plate body 110; the strip-shaped spacer 141, the first cylinder 142 and the second cylinder 143 form a circle on the top surface of the target plate body 110.

[0074] Further, in order to avoid impact damage to the unused strip-shaped spacers 141, the target plate assembly 100 also includes a top cover plate assembly; the top cover plate assembly is positioned on the top surface of the target plate body 110, and includes a top plate 151 and a support frame 152; the top plate 151 is a hard plate body, and a round through hole with a size similar to that of the center groove 111 (the diameter difference does not exceed 2 cm) is provided at its center position; the top plate 151 is parallel to the top surface of the target plate body 110; the support frame 152 is a hard plate body or a hard rod body, and the length direction is the same as the thickness direction of the target plate body 110, and there are multiple support frames 152, which are arranged close to the edge of the target plate body 110, and the bottom is fixed on the target plate body 110; the top plate 151 is fixed to the top of the support frame 152.

[0075] Furthermore, reversing wheels 130 are positioned on both sides of the clamping block and both sides of the telescopic rod body 121 . The existence of these reversing wheels 130 enables the strip-shaped spacers 141 close to the abutment body to be arranged in a U shape.

[0076] Furthermore, the clamping assembly is composed of three radially arranged guide rails positioned on the top surface of the target plate body 110 and a clamping block that slides along the guide rails under the coordinated control of the control unit and the power assembly; the clamping block clamps the wafer when it moves toward the center of the target plate body 110; an abutment is positioned on the surface of the clamping block close to the center of the target plate body 110; the abutment positioned on the clamping block is fixed on the clamping block or is integrally formed with the clamping block.

[0077] Furthermore, the clamping assembly includes a telescopic rod body 121; the telescopic rod body 121 is an electric push rod, which is radially arranged around the center line of the center groove 111 and fixed on the top surface of the target plate body 110; a resistance body is positioned at the end of the telescopic rod body 121 close to the center groove 111, and the resistance body moves with the extension and retraction of the telescopic rod body 121; when the telescopic rod body 121 is extended, the wafer is clamped; the resistance body is in direct contact with the strip-shaped spacer 141, and the surface in contact with the strip-shaped spacer 141 is smooth; the resistance body positioned on the telescopic rod body 121 is fixed on the telescopic rod body 121 or is integrally formed with the telescopic rod body 121.

[0078] Furthermore, the abutment body is a cylinder whose axial direction is the same as the thickness direction of the target plate body 110 .

[0079] Furthermore, the abutment body comprises an abutment wheel 122 and a bearing frame 123; the abutment wheel 122 is a cylindrical wheel body whose axial direction is the same as the thickness direction of the target plate body 110, and is rotatably connected to the bearing frame 123 around its own axis; the bearing frame 123 is a plate body with a U-shaped longitudinal section, and is fixed to the end of the telescopic rod body 121 close to the center of the target plate body 110 or the surface of the clamping block close to the center of the target plate body 110; due to the reduced friction, the movement of the strip-shaped spacer 141 will be smoother.

[0080] Furthermore, the strip-shaped spacer 141 is made of silicone.

[0081] During use of the target plate assembly 100 of the embodiment of the present application, after the strip-shaped spacer 141 close to the resistance body has been used for a certain period of time (the time can be flexibly adjusted as needed), the first cylinder 142 and the second cylinder 143 are controlled to rotate, and the strip-shaped spacer 141 is moved, and then the strip-shaped spacer 141 close to the resistance body is replaced to avoid the clamping and fixing of the wafer due to damage and deformation of the strip-shaped spacer 141; the transportation of the wafer is achieved by a wafer transport robot, and after the wafer is clamped or adsorbed by the wafer to the resistance body, the resistance body is controlled to move toward the wafer to clamp and fix the wafer.

[0082] Since the strip-shaped spacer 141 is made of silicone and has elasticity, when clamping the wafer, the first cylinder 142 and / or the second cylinder 143 can be controlled to rotate and release the strip-shaped spacer 141 to cooperate with the clamping, or the resistance body can be directly controlled to move to deform the strip-shaped spacer 141 and then clamp it.

[0083] The wafer transported by the wafer transport robot can be clamped in a suspended state.

[0084] The wafer transported by the wafer transport robot can also be clamped after being placed on the wafer lifting assembly 112; in different wafer positioning processes, the utilization rate of the belt-shaped spacer 141 can be increased and the service life of the belt-shaped spacer 141 can be extended by changing the height of the wafer lifting assembly 112 (gradually lowering it).

[0085] Preferably, the abutment body can be controlled to move back and forth quickly in the clamping gap to hammer the strip-shaped spacer 141 , thereby cleaning the strip-shaped spacer 141 to a certain extent.

[0086] Preferably, the target plate body 110 is composed of two stacked plates, and the two stacked plates can rotate relatively around the axis of the central groove 111; the target plate body 110 has a built-in motor, and the motor drives the two plates constituting the target plate body 110 to rotate relatively.

[0087] The technical solutions in the above embodiments of the present application have at least the following technical effects or advantages:

[0088] The invention solves the technical problems in the prior art that the replacement process of the soft pad on the target plate of the ion implanter is complicated, dangerous, requires manual participation, and requires the production line to be shut down for replacement, thereby affecting the wafer processing efficiency; and realizes the technical effect that the ion implanter has the function of automatically replacing the soft pad on the target plate safely, conveniently and efficiently, and the replacement process will not affect the normal operation of the production line.

[0089] Embodiment 2

[0090] Considering that in order to reduce cross contamination, maintain process stability, and ensure chip performance and reliability, the target plate generally needs to be manually cleaned regularly to maintain the high standards of the entire semiconductor manufacturing process; the manual cleaning process is cumbersome, time-consuming, and requires downtime for cleaning, which is not conducive to the efficient progress of the process. The embodiment of the present application adds an auxiliary belt assembly 300 and a pump gas assembly 400 on the basis of the above embodiment, and optimizes and improves the structure of other components, so as to achieve self-cleaning of the target plate by sticking removal, specifically:

[0091] like Figures 5 to 11 As shown, the number of the support frames 152 is 4, which are evenly distributed on the top surface of the target plate body 110 near the edge;

[0092] The strip-shaped spacer 141, the first tube 142 and the second tube 143 form a closed circle on the top surface of the target plate body 110, and the strip-shaped spacer 141 wound on the first tube 142 and the strip-shaped spacer 141 wound on the second tube 143 are in contact with each other;

[0093] The auxiliary belt assembly 300 includes a guide rotation rod 310, a bottom rotation column and a maintenance auxiliary belt 330;

[0094] The guide rotating rods 310 are hard round rods arranged transversely, and there are four of them, two ends of which are positioned on four support frames 152, and the other two ends are positioned on the side walls of the target plate body 110. All the guide rotating rods 310 rotate around their own axes to play a guiding role, and are used to guide the movement of the maintenance auxiliary belt 330 so as to prevent the maintenance auxiliary belt 330 from contacting the target plate body 110 when cleaning is not required; the axial directions of all the guide rotating rods 310 are the same and perpendicular to the thickness direction of the target plate body 110;

[0095] The bottom rotating column is a roller with a built-in motor, and there are two of them, namely, a first rotating column 321 and a second rotating column 322, both of which are positioned on the bottom surface of the target plate body 110; the axial directions of the first rotating column 321 and the second rotating column 322 are the same as the axial direction of the guide rotating rod 310, and are respectively used to reel in and release the maintenance auxiliary belt 330; the axial lengths of the guide rotating rod 310 and the bottom rotating column are both greater than the width of the maintenance auxiliary belt 330;

[0096] The maintenance auxiliary belt 330 is a rubber film belt with one side coated with self-adhesive, which has elasticity and is always in a straight state. It passes through between the top plate 151 and the target plate body 110, and the two ends are respectively wound and positioned on the first rotating column 321 and the second rotating column 322; the width of the maintenance auxiliary belt 330 is greater than 1.3 times the diameter of the central groove 111; the maintenance auxiliary belt 330 is provided with exposure holes 331 at equal intervals; the exposure holes 331 are round through holes, the diameter of which is greater than the diameter of the central groove 111, and the spacing between each other is greater than 1.3 times the diameter of the central groove 111; under normal conditions, the distance between the maintenance auxiliary belt 330 between the top plate 151 and the target plate body 110 and the top surface of the belt-shaped spacer 141 is less than 2 cm; the adhesive surface of the maintenance auxiliary belt 330 faces the target plate body 110;

[0097] The air pump assembly 400 is positioned at the bottom of the target plate body 110 and is a combination of an air pump, an air valve and an air pipe; a hole communicating with the air pump assembly 400 is provided at the bottom of the central groove 111 .

[0098] Under normal conditions, one of the exposed holes 331 of the maintenance auxiliary belt 330 coincides with the axis of the central groove 111, which does not affect the normal clamping of the wafer; when cleaning is required, the bottom rotating column is controlled to rotate so that the maintenance auxiliary belt 330 is displaced to cover the central groove 111 and to form a pancake-shaped space together with the target plate body 110 and the spacer replacement assembly; then the pump gas assembly 400 is controlled to operate to extract air, such as Fig.12 As shown, the maintenance auxiliary belt 330 is pressed against the top surface of the strip-shaped spacer 141 under the influence of negative pressure, and then is pressed against the side surface of the strip-shaped spacer 141 and the top surface of the target plate body 110 under the influence of negative pressure. Thereafter, the pump air component 400 is controlled to inflate and deflate air so that the maintenance auxiliary belt 330 performs a sticking and removing action under the influence of air pressure, thereby automatically completing the cleaning of the strip-shaped spacer 141 and the target plate body 110; finally, the components are reset; when cleaning next time, a section of the maintenance auxiliary belt 330 covering the central groove 111 is replaced.

[0099] After cleaning, the strip-shaped spacer 141 and the abutment body can be controlled to shift and cooperate with the pump assembly 400 to pump air into the central groove 111 , while controlling the bottom rotating column to rotate and pull the maintenance auxiliary belt 330 to assist the maintenance auxiliary belt 330 to detach from the strip-shaped spacer 141 .

[0100] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An ion implanter with a target disk scanning motion mechanism, comprising an ion source, a target disk assembly (100), and a target disk displacement assembly (200); characterized in that: The target disc assembly (100) comprises a target disc body (110), a clamping assembly, a reversing wheel (130) and a spacer replacement assembly; The target plate body (110) is plate-shaped, and a center groove (111) is provided at the center of the top; The clamping assembly is positioned on the top surface of the target plate body (110) and is a combination of radially arranged guide rails and clamping blocks or a telescopic rod (121); a resisting body is positioned at the position where the clamping assembly directly contacts the spacer replacement assembly; The reversing wheels (130) are rotatably connected to the top surface of the target plate body (110), and there are a plurality of them; The septum replacement assembly comprises a strip-shaped septum (141), a first tube (142) and a second tube (143); The strip-shaped spacer (141) contacts all the reversing wheels (130) and the contact body, and the two ends are respectively wound and positioned on the first cylinder (142) and the second cylinder (143); the strip-shaped spacer (141) is closely attached to the surface of the contact body closest to the wafer; The first tube (142) and the second tube (143) are connected to the top surface of the target plate body (110) by rotating around their own axes, and the two and the strip-shaped spacer (141) form a circle on the top surface of the target plate body (110); The reversing wheel (130) guides the direction of the belt-shaped spacer (141) and cooperates with the first cylinder (142) and the second cylinder (143) to ensure that the belt-shaped spacer (141) is always in a straight state; when the belt-shaped spacer (141) that contacts the wafer and the abutment body needs to be replaced, the first cylinder (142) and the second cylinder (143) are controlled to rotate to achieve the overall movement of the belt-shaped spacer (141).

2. The ion implanter with a target plate scanning motion mechanism according to claim 1, characterized in that: The diameter of the central groove (111) is larger than the diameter of the wafer to be positioned; The central groove (111) has a built-in wafer lifting assembly (112); the wafer lifting assembly (112) is a combination of an electric telescopic rod and a circular plate that is horizontally placed and fixed on the top of the electric telescopic rod; the electric telescopic rod of the wafer lifting assembly (112) coincides with the axis of the central groove (111); when the electric telescopic rod is extended or retracted, it drives the circular plate to move up and down; when the circular plate is raised to the longest state, the circular plate is not higher than the clamping assembly.

3. The ion implanter with a target plate scanning motion mechanism according to claim 1, characterized in that: The target plate assembly (100) further comprises a top cover plate assembly; The top cover plate assembly is positioned on the top surface of the target plate body (110), and comprises a top plate (151) and a support frame (152); The top plate (151) is a hard plate body, and a round through hole is provided at the center thereof; The top plate (151) is parallel to the top surface of the target plate body (110); The support frame (152) is a hard plate body or a hard rod body, and its length direction is the same as the thickness direction of the target plate body (110). There are multiple support frames (152) arranged close to the edge of the target plate body (110), and the bottom is fixed on the target plate body (110); the top plate (151) is fixed on the top of the support frame (152).

4. The ion implanter with a target plate scanning motion mechanism as claimed in claim 3, characterized in that: Reversing wheels (130) are positioned on both sides of the clamping block and both sides of the telescopic rod body (121). The existence of these reversing wheels (130) enables the belt-shaped spacers (141) close to the abutment body to be arranged in a U shape.

5. The ion implanter with a target plate scanning motion mechanism according to any one of claims 1 to 4, characterized in that: The clamping assembly comprises three radially arranged guide rails positioned on the top surface of the target plate body (110) and a clamping block sliding along the guide rails under the coordinated control of a control unit and a power assembly; The clamping block clamps the wafer when moving toward the center of the target plate body (110); A resisting body is positioned on a surface of the clamping block close to the center of the target plate body (110); the resisting body positioned on the clamping block is fixed on the clamping block or is integrally formed with the clamping block.

6. The ion implanter with a target plate scanning motion mechanism according to any one of claims 1 to 4, characterized in that: The clamping assembly comprises a telescopic rod body (121); The telescopic rod body (121) is an electric push rod, which is arranged radially around the center line of the central groove (111) and is fixed on the top surface of the target plate body (110); An abutment body is positioned at the end of the telescopic rod body (121) close to the central groove (111), and the abutment body moves as the telescopic rod body (121) is extended or retracted; When the telescopic rod (121) is extended, the wafer is clamped; The abutment body is in direct contact with the strip-shaped spacer (141), and the surface in contact with the strip-shaped spacer (141) is smooth; the abutment body positioned on the telescopic rod body (121) is fixed on the telescopic rod body (121) or is integrally formed with the telescopic rod body (121).

7. The ion implanter with a target plate scanning motion mechanism according to claim 1, characterized in that: The abutment body is a cylinder whose axial direction is the same as the thickness direction of the target plate body (110).

8. The ion implanter with a target plate scanning motion mechanism as claimed in claim 1, characterized in that: The abutment body comprises an abutment wheel (122) and a bearing frame (123); The abutment wheel (122) is a cylindrical wheel body whose axial direction is the same as the thickness direction of the target plate body (110), and is rotatably connected to the bearing frame (123) around its own axis; The bearing frame (123) is a plate body with a U-shaped longitudinal section, and is fixed to the end of the telescopic rod body (121) close to the center of the target plate body (110) or to the surface of the clamping block close to the center of the target plate body (110).

9. The ion implanter with a target scanning motion mechanism according to claim 3 or 4, characterized in that: Also included are an auxiliary belt assembly (300) and a pump air assembly (400); The strip-shaped spacer (141), the first tube (142) and the second tube (143) form a closed circle on the top surface of the target plate body (110); the strip-shaped spacer (141) wound on the first tube (142) and the strip-shaped spacer (141) wound on the second tube (143) are in contact with each other; The auxiliary belt assembly (300) comprises a guide rotating rod (310), a bottom rotating column and a maintenance auxiliary belt (330); The guide rotating rods (310) are arranged transversely, and there are four of them, each of which rotates around its own axis; The number of the bottom rotating columns is two, namely a first rotating column (321) and a second rotating column (322), both of which are positioned on the bottom surface of the target plate body (110); The maintenance auxiliary belt (330) is a rubber belt with one side coated with adhesive, which passes through between the top plate (151) and the target plate body (110), and the two ends are respectively wound around and positioned on the first rotating column (321) and the second rotating column (322); The auxiliary maintenance belt (330) is provided with exposure holes (331) at equal intervals; the interval between the exposure holes (331) is greater than 1.3 times the diameter of the central groove (111); the adhesive surface of the auxiliary maintenance belt (330) faces the target plate body (110); The air pump component (400) is positioned at the bottom of the target plate body (110); and a hole communicating with the air pump component (400) is provided at the bottom of the central groove (111).

10. The ion implanter with a target plate scanning motion mechanism according to claim 9, characterized in that: After cleaning, the strip-shaped spacer (141) and the abutment body are controlled to shift and cooperate with the air pump assembly (400) to pump air into the central groove (111), and at the same time, the bottom rotating column is controlled to rotate and pull the maintenance auxiliary belt (330) to assist the maintenance auxiliary belt (330) to separate from the strip-shaped spacer (141).

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