Wafer scrubbing equipment, scrubbing system, polishing equipment and wafer cleaning method

Abstract

The embodiment of the invention provides wafer scrubbing equipment, a scrubbing system, polishing equipment and a wafer cleaning method. The wafer scrubbing equipment comprises a motor, a telescopic module, a pressure sensor, a scrubbing brush and a controller, the motor and the telescopic module are respectively connected with the scrubbing brush; the controller is electrically connected with the telescopic module and the pressure sensor; wherein the motor is used for driving the scrubbing brush to rotate, so that the scrubbing brush scrubs a wafer; the pressure sensor is used for detecting the acting force between the scrubbing brush and the telescopic module and transmitting a detection result to the controller; and the controller is used for controlling the telescopic module to execute a telescopic action according to the detection result, so that the telescopic module drives the scrubbing brush to move along the direction of the rotation axis to adjust the acting force between the scrubbing brush and the wafer, and the pressure applied by the scrubbing brush to the surface of the wafer can be kept constant.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor manufacturing technology, and in particular to a wafer scrubbing device, a wafer scrubbing system, a polishing device, and a wafer cleaning method. Background Art

[0002] After polishing the wafer, it is usually necessary to use a scrubbing brush in a scrubbing module to scrub the wafer surface to remove impurities on the wafer surface. When using the scrubbing brush to clean the wafer surface, the brush head of the scrubbing brush can apply a constant pressure to the wafer surface to evenly scrub the wafer surface to ensure the effect of scrubbing the wafer. However, in the related art, when the brush head is pressed down to the wafer surface to scrub the wafer, the pressure applied by the brush head to the wafer surface cannot be kept constant. Summary of the invention

[0003] In view of this, embodiments of the present application provide a wafer scrubbing device, a wafer scrubbing system, a polishing device and a wafer cleaning method to at least partially solve the above problems.

[0004] According to a first aspect of an embodiment of the present application, a wafer scrubbing device is provided, comprising: a motor, a telescopic module, a pressure sensor, a scrubbing brush and a controller; the motor and the telescopic module are respectively connected to the scrubbing brush; the controller is electrically connected to the telescopic module and the pressure sensor; wherein the motor is used to drive the scrubbing brush to rotate so that the scrubbing brush scrubs the wafer; the pressure sensor is used to detect the force between the scrubbing brush and the telescopic module, and transmit the detection result to the controller; the controller is used to control the telescopic module to perform a telescopic action according to the detection result, so that the telescopic module drives the scrubbing brush to move along the direction of the rotation axis to adjust the force between the scrubbing brush and the wafer.

[0005] In a possible implementation, the scrubbing brush includes a brush head and a first rotating shaft, the brush head is connected to the first end of the first rotating shaft; the telescopic module is connected to the second end of the first rotating shaft; the motor is connected to the first rotating shaft through a transmission assembly; the transmission assembly includes a rotating shaft seat sleeved outside the first rotating shaft, and the motor is connected to the rotating shaft seat; the rotating shaft seat and the first rotating shaft are movably connected, and the first rotating shaft can move axially along the rotation axis in the rotating shaft seat; and a clamping structure that is clamped to the first rotating shaft is provided on the rotating shaft seat, and when the rotating shaft seat rotates around the rotation axis driven by the transmission assembly, the rotating shaft seat drives the first rotating shaft to rotate around the rotation axis through the clamping structure.

[0006] In a possible implementation, the clamping structure includes a limit bearing, which is installed on the rotating shaft seat through a second rotating shaft, and the axis of the second rotating shaft is perpendicular to the rotation axis; the limit bearing includes an inner wheel surface in contact with the second rotating shaft and an outer wheel surface opposite to the inner wheel surface; the first rotating shaft is provided with a clamping surface for abutting against the outer wheel surface; the limit bearing is clamped with the clamping surface of the first rotating shaft through the outer wheel surface.

[0007] In a possible implementation, the device further includes a guide sleeve, wherein the guide sleeve is disposed in the rotating shaft seat, the first rotating shaft is disposed in the guide sleeve, and the guide sleeve is used to limit the first rotating shaft from moving in a direction other than the first rotating shaft.

[0008] In a possible implementation, the transmission assembly includes a first transmission wheel, a second transmission wheel and a transition piece; the first transmission wheel is sleeved outside the rotating shaft seat, and the second transmission wheel is connected to the output shaft of the motor; and the first transmission wheel and the second transmission wheel are connected through the transition piece.

[0009] In a possible implementation, a magnetic module is provided between the telescopic module and the first rotating shaft, and the telescopic module is connected to the second end of the first rotating shaft through the magnetic module; wherein the magnetic module is used to adsorb the second end of the first rotating shaft through magnetic force.

[0010] In a possible implementation manner, the magnetic attraction module is in contact with the second end of the first rotating shaft, and the contact form between the magnetic attraction module and the second end of the first rotating shaft is point contact.

[0011] In a possible implementation, the pressure sensor is located between the telescopic module and the magnetic module, the telescopic module is connected to the pressure sensor, and the pressure sensor is connected to the magnetic module.

[0012] In one possible implementation, the device includes a shell, the first rotating shaft is at least partially located in the shell, and the brush head is located outside the shell; the shell includes a mounting through hole, and the first end of the first rotating shaft is connected to the brush head via a connecting block located in the mounting through hole; a first protective cover covering the mounting through hole is provided between the brush head and the connecting block, and a second protective cover is provided on the shell and is sleeved on the first protective cover and the outside of the brush head.

[0013] According to a second aspect of the embodiments of the present application, a wafer scrubbing system is provided, comprising the wafer scrubbing device in any one of the embodiments of the first aspect described above.

[0014] According to a third aspect of the embodiments of the present application, a polishing device is provided, comprising the wafer scrubbing device in the embodiment of the second aspect mentioned above.

[0015] According to the fourth aspect of the embodiment of the present application, a wafer cleaning method is provided, which utilizes the wafer scrubbing equipment described in the previous aspects to perform wafer cleaning, and the wafer cleaning method includes: positioning the wafer at the wafer scrubbing equipment; pressing the scrubbing brush against the surface of the wafer; and driving the scrubbing brush to rotate to scrub the wafer.

[0016] In a possible implementation, the wafer cleaning method further includes: detecting the force between the scrubbing brush and the telescopic module; and controlling the telescopic module to perform a telescopic action according to the force between the scrubbing brush and the telescopic module to adjust the force between the scrubbing brush and the wafer.

[0017] The wafer scrubbing device provided in the embodiment of the present application includes a motor, a telescopic module, a pressure sensor, a scrubbing brush, and a controller, etc. The motor and the telescopic module are respectively connected to the scrubbing brush, and the controller is respectively electrically connected to the telescopic module and the pressure sensor. The scrubbing brush can be driven to rotate by the motor so that the scrubbing brush scrubs the wafer, and the force between the scrubbing brush and the telescopic module can be detected by the pressure sensor, and the detection result can be transmitted to the controller. The controller can control the telescopic module to perform a telescopic action according to the detection result, so that the telescopic module drives the scrubbing brush to move along the rotation axis direction to adjust the force between the scrubbing brush and the wafer. The force between the scrubbing brush and the wafer can be adjusted in real time according to the detection results fed back by the pressure sensor. When the force between the scrubbing brush and the wafer is greater than the target force, the force between the scrubbing brush and the wafer can be reduced. When the force between the scrubbing brush and the wafer is less than the target force, the force between the scrubbing brush and the wafer can be increased so that the force between the scrubbing brush and the wafer is maintained at the target force, thereby maintaining the pressure applied by the brush head of the scrubbing brush to the wafer surface constant. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0019] Figure 1 is a schematic diagram of the internal structure of a wafer scrubbing system provided in an optional embodiment of the present application; Figure 2It is a cross-sectional schematic diagram of a partial structure of a wafer scrubbing device provided in an optional embodiment of the present application; Figure 3 is a cross-sectional schematic diagram of a partial structure of another wafer scrubbing device provided in an optional embodiment of the present application; Figure 4 It is a partial structural schematic diagram of a wafer scrubbing device provided in an optional embodiment of the present application; Figure 5 yes Figure 4 Another angle diagram of the partial structure of the wafer scrubbing equipment; Figure 6 yes Figure 4 Another angle schematic diagram of the partial structure of the wafer scrubbing equipment.

[0020] Reference numerals: 01. Wafer scrubbing system; 11. Chuck; 12. Retaining ring; 13. Chuck rotating shaft; 14. First rotating device; 15. First lifting device; 16. Box; 100. Wafer scrubbing equipment; 110. Scrubbing brush; 111. Brush head; 112. First rotating shaft; 1121. Rotating axis; 1122. Ball crown structure; 1123. Clamping surface; 1131. Rotating shaft seat; 1132. Limit bearing; 1133. Second rotating shaft; 1134. First transmission wheel; 1135. Second transmission wheel; 1136. Transition piece; 114. Guide sleeve; 120. Swing arm; 121. swing arm lifting shaft; 122. second rotating device; 123. second lifting device; 124. mounting plate; 130. motor; 131. output shaft of motor; 140. telescopic module; 150. pressure sensor; 160. magnetic module; 170. housing; 171. mounting through hole; 172. connecting block; 173. first protective cover; 174. second protective cover; 181. fixing plate; 182. telescopic module connecting plate; 183. limit block; 184. rotating bearing; 185. locking nut; 186. bearing fixing seat; 187. limit plate. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0022] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "an" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0023] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0024] According to a first aspect of an embodiment of the present application, a wafer scrubbing device for wafer scrubbing is provided to at least partially solve the above-mentioned problem. The wafer scrubbing device can be applied to Figure 1 The wafer scrubbing system shown in FIG. Figure 1 As shown, the wafer scrubbing system 01 may include a chuck 11, a retaining ring 12, a chuck shaft 13, a first rotating device 14, a first lifting device 15, a housing 16, and a wafer scrubbing device 100. The chuck 11 is used to fix the wafer, and may be a vacuum chuck 11 that utilizes vacuum to absorb the wafer. The retaining ring 12 is sleeved outside the chuck 11, and is used to prevent the wafer on the chuck 11 from detaching from the chuck 11. The chuck shaft 13 is connected to the chuck 11 and the retaining ring 12, and is used to drive the chuck 11 and the retaining ring 12 to rotate. The first rotating device 14 and the first lifting device 15 are respectively connected to the chuck shaft 13, and the first rotating device 14 is used to drive the chuck shaft 13 to rotate, for example, around Figure 1 The first rotating device 14 can be a motor such as a servo motor or other suitable equipment. The first lifting device 15 is used to drive the chuck shaft 13 to rise and fall, for example, along Figure 1 The first lifting device 15 can be a motor such as a voice coil motor or other suitable equipment. The box 16 can be used to accommodate the chuck 11, the retaining ring 12, the chuck shaft 13, the first rotating device 14, the first lifting device 15 and other components.

[0025] like Figure 1 and Figure 2As shown, the wafer scrubbing device 100 may include a scrubbing brush 110, a swing arm 120, a swing arm lifting shaft 121, a second rotating device 122, a second lifting device 123, etc. The scrubbing brush 110 is used to scrub the wafer fixed on the chuck 11, and the scrubbing brush 110 can be installed at one end of the swing arm 120. The other end of the swing arm 120 can be provided with Figure 2 The mounting plate 124 is connected to the swing arm lifting shaft 121 through the mounting plate 124. The swing arm lifting shaft 121 is used to drive the swing arm 120 to swing around it and drive the swing arm 120 to lift. The second rotating device 122 and the second lifting device 123 are respectively connected to the swing arm lifting shaft 121. The second rotating device 122 is used to drive the swing arm lifting shaft 121 to rotate, for example, around Figure 1 The second rotating device 122 can also be a motor such as a servo motor or other suitable equipment. The second lifting device 123 is used to drive the swing arm lifting shaft 121 to move up and down, for example, along Figure 1 The second lifting device 123 can also be a motor such as a voice coil motor or other suitable equipment.

[0026] Please refer to the attached Figure 2-6 The wafer scrubbing device 100 for wafer scrubbing provided in an embodiment of the present application is described in detail.

[0027] like Figure 2 and Figure 3 As shown, an embodiment of the present application provides a wafer scrubbing device 100 for wafer scrubbing, including: a motor 130, a telescopic module 140, a pressure sensor 150, a scrubbing brush 110 and a controller.

[0028] The motor 130 and the telescopic module 140 are connected to the scrubbing brush 110, respectively. The controller is electrically connected to the telescopic module 140 and the pressure sensor 150, respectively. It should be understood that the connection (or connection) in the embodiment of the present application can be either direct connection or indirect connection, which is within the protection scope of the embodiment of the present application. The motor 130, the telescopic module 140, the pressure sensor 150, the scrubbing brush 110 and the controller can all be installed on the swing arm 120.

[0029] The motor 130 is used to drive the scrubbing brush 110 to rotate so that the scrubbing brush 110 scrubs the wafer; the pressure sensor 150 is used to detect the force between the scrubbing brush 110 and the telescopic module 140, and transmit the detection result to the controller; the controller is used to control the telescopic module 140 to perform a telescopic action according to the detection result, so that the telescopic module 140 drives the scrubbing brush 110 to move along the direction of the rotation axis 1121 to adjust the force between the scrubbing brush 110 and the wafer. It should be understood that the rotation axis 1121 in the embodiment of the present application refers to the straight line where the rotation axis of the scrubbing brush 110 rotates, that is, Figure 3The axis indicated by 1121.

[0030] By driving the scrubbing brush 110 to rotate and move along the direction of the rotation axis 1121 respectively through the motor 130 and the telescopic module 140, the complex movement of the scrubbing brush 110 can be decomposed into two simple movements of rotation and movement along the direction of the rotation axis 1121, so that the rotation and movement along the direction of the rotation axis 1121 of the scrubbing brush 110 can be controlled respectively, thereby reducing the difficulty of controlling the movement of the scrubbing brush 110 along the direction of the rotation axis 1121, that is, reducing the difficulty of adjusting the force between the scrubbing brush 110 and the wafer, which can help to keep the force applied by the brush head 111 to the wafer surface constant.

[0031] As a feasible implementation, the telescopic module 140 may include a mechanical or hydraulic telescopic device.

[0032] For example, in some optional embodiments, the telescopic module 140 may include a voice coil motor, such as a servo-controlled voice coil motor, etc., which can be used to drive the scrubbing brush 110 to move along the direction of the rotation axis.

[0033] A voice coil motor is a direct drive motor with the characteristics of simple structure, small size, high speed, high acceleration and fast response, etc. The embodiment of the present application may adopt a voice coil motor that performs a driving action along a straight line when driving.

[0034] In the embodiment of the present application, the telescopic module 140 may include a voice coil motor, so that the scrubbing brush 110 can be directly driven in a straight line by the voice coil motor to move the scrubbing brush 110 along the direction of the rotation axis. There is no need to set up a conversion structure for converting the driving direction, which is beneficial to simplifying the structure of the telescopic module 140 and reducing the space occupied by the telescopic module 140.

[0035] The scrubbing brush 110 can abut against the wafer fixed on the chuck 11 through the top of the brush head 111 , so as to scrub the surface of the wafer by driving the brush head 111 to rotate.

[0036] It should be understood that the force between the scrubbing brush 110 and the telescopic module 140 is the pressure applied by the scrubbing brush 110 to the telescopic module 140 or the pressure applied by the telescopic module 140 to the scrubbing brush 110, and the two are a pair of equal interaction forces. In addition, the pressure applied by the scrubbing brush 110 to the telescopic module 140 originates from the reaction force of the wafer on the scrubbing brush 110 when the scrubbing brush 110 applies pressure to the wafer, so the force between the scrubbing brush 110 and the telescopic module 140 is equal to the pressure applied by the scrubbing brush 110 to the wafer.

[0037] The detection result transmitted to the controller by the pressure sensor 150 may include the detected force between the scrubbing brush 110 and the telescopic module 140. After receiving the detected force, the controller may compare the detected force with the preset target force. When the detected force is greater than the target force, the telescopic module 140 may be controlled to retract, thereby driving the scrubbing brush 110 to move along the rotation axis 1121 in a direction away from the wafer to reduce the force between the scrubbing brush 110 and the telescopic module 140; when the detected force is less than the target force, the telescopic module 140 may be controlled to extend, thereby driving the scrubbing brush 110 to move along the rotation axis 1121 in a direction close to the wafer to increase the force between the scrubbing brush 110 and the telescopic module 140; until the detected force is equal to the target force, so that the pressure applied by the scrubbing brush 110 to the wafer can be equal to the target force. It should be understood that the preset target force is the constant force that needs to be maintained between the scrubbing brush 110 and the telescopic module 140. The target force can be a single force or a force range, both of which are within the protection scope of the embodiments of the present application.

[0038] The wafer scrubbing device 100 provided in the embodiment of the present application includes a motor 130, a telescopic module 140, a pressure sensor 150, a scrubbing brush 110, and a controller, etc. The motor 130 and the telescopic module 140 are respectively connected to the scrubbing brush 110, and the controller is respectively electrically connected to the telescopic module 140 and the pressure sensor 150. The scrubbing brush 110 can be driven to rotate by the motor 130 so that the scrubbing brush 110 scrubs the wafer. The force between the scrubbing brush 110 and the telescopic module 140 can be detected by the pressure sensor 150, and the detection result can be transmitted to the controller. The controller can control the telescopic module 140 to perform a telescopic action according to the detection result, so that the telescopic module 140 drives the scrubbing brush 110 to move along the direction of the rotation axis 1121 to adjust the force between the scrubbing brush 110 and the wafer. The force between the scrubbing brush 110 and the wafer can be adjusted in real time according to the detection result fed back by the pressure sensor 150. When the force between the scrubbing brush 110 and the wafer is greater than the target force, the force between the scrubbing brush 110 and the wafer can be reduced. When the force between the scrubbing brush 110 and the wafer is less than the target force, the force between the scrubbing brush 110 and the wafer can be increased so that the force between the scrubbing brush 110 and the wafer is maintained at the target force, thereby maintaining the pressure applied by the brush head 111 of the scrubbing brush 110 to the wafer surface constant.

[0039] like Figure 3As shown, in some optional embodiments, the scrubbing brush 110 includes a brush head 111 and a first rotating shaft 112, the brush head 111 is connected to the first end of the first rotating shaft 112; the telescopic module 140 is connected to the second end of the first rotating shaft 112; the motor 130 is connected to the first rotating shaft 112 through a transmission assembly; the transmission assembly includes a rotating shaft seat 1131 sleeved outside the first rotating shaft 112, and the motor 130 is connected to the rotating shaft seat 1131. It should be noted that the "connection" described in the embodiments of the present application can be a direct connection or an indirect connection, and the embodiments of the present application do not limit the specific implementation method of the "connection".

[0040] The shaft seat 1131 and the first shaft 112 may be movably connected, and the first shaft 112 may move axially along the axis of rotation 1121 in the shaft seat 1131. Furthermore, by sleeve-arranging the shaft seat 1131 outside the first shaft 112, the first shaft 112 may be guided to move along the axis of rotation 1121, and the first shaft 112 may be restricted from moving in directions other than the axis of rotation 1121 to a certain extent, so as to ensure the stable rotation of the first shaft 112. Furthermore, a clamping structure clamped with the first shaft 112 is provided on the shaft seat 1131. When the shaft seat 1131 rotates around the axis of rotation 1121 driven by the transmission assembly, the shaft seat 1131 drives the first shaft 112 to rotate around the axis of rotation 1121 through the clamping structure.

[0041] The first rotating shaft 112 may be provided with a matching structure that is engaged with the locking structure of the rotating shaft seat 1131. The locking structure and the matching structure may be two structures that are concave and convex respectively, or may be other suitable structures, as long as the locking can be achieved and the first rotating shaft 112 can be allowed to move along the rotation axis 1121.

[0042] In the embodiment of the present application, the scrubbing brush 110 includes a brush head 111 and a first rotating shaft 112, wherein the brush head 111 is connected to a first end of the first rotating shaft 112; and the telescopic module 140 is connected to a second end of the first rotating shaft 112. The motor 130 is connected to the first rotating shaft 112 through a transmission assembly; the transmission assembly includes a rotating shaft seat 1131 sleeved outside the first rotating shaft 112, and the motor 130 is connected to the rotating shaft seat 1131. The rotating shaft seat 1131 is movably connected to the first rotating shaft 112, and the first rotating shaft 112 can move axially along the rotation axis 1121 in the rotating shaft seat 1131. The shaft seat 1131 is provided with a clamping structure clamped with the first shaft 112. When the shaft seat 1131 rotates around the rotation axis 1121 driven by the transmission assembly, the shaft seat 1131 drives the first shaft 112 to rotate around the rotation axis 1121 through the clamping structure, so that the first shaft 112 can drive the brush head 111 to rotate; and, since the first shaft 112 can move axially along the rotation axis 1121 in the shaft seat 1131, the controller can control the telescopic module 140 to drive the first shaft 112 to move axially along the rotation axis 1121, so that the first shaft 112 can abut the brush head 111 against the surface of the wafer. That is, the embodiment of the present application can control the movement of the brush head 111 along the rotation axis 1121 while driving the brush head 111 to rotate around the rotation axis 1121, so as to adjust the force applied by the brush head 111 to the wafer during the process of the brush head 111 scrubbing the wafer surface.

[0043] like Figure 2 As shown, in some optional embodiments, the telescopic module 140, the pressure sensor 150 and the scrubbing brush 110 are located on the rotation axis 1121. The output shaft 131 of the motor 130 is parallel to the rotation axis 1121 of the scrubbing brush 110, and the orthographic projection of the motor 130 on the rotation axis 1121 is located in the area where one or more of the telescopic module 140, the pressure sensor 150 and the scrubbing brush 110 are located on the rotation axis 1121.

[0044] In the embodiment of the present application, the telescopic module 140 , the pressure sensor 150 and the scrubbing brush 110 are located on the rotation axis 1121 , which can facilitate the pressure sensor 150 to detect the force between the telescopic module 140 and the scrubbing brush 110 . By setting the output shaft 131 of the motor 130 parallel to the rotation axis 1121 of the scrubbing brush 110, the motor 130 can be offset relative to the telescopic module 140, the pressure sensor 150 and the scrubbing brush 110, that is, set to the side of the telescopic module 140, the pressure sensor 150 and the scrubbing brush 110, and by setting the orthographic projection of the motor 130 on the rotation axis 1121 to be located in the area on the rotation axis 1121 where one or more of the telescopic module 140, the pressure sensor 150 and the scrubbing brush 110 are located, the position of the motor 130 in the direction of the rotation axis 1121 can be made not to exceed the range of the telescopic module 140, the pressure sensor 150 and the scrubbing brush 110, thereby avoiding the increase in the size of the wafer scrubbing equipment 100 in the direction of the rotation axis 1121 due to the motor 130, which is conducive to the miniaturization of the wafer scrubbing equipment 100.

[0045] As a feasible implementation method, the clamping structure includes: Figure 4 The limit bearing 1132 shown. The limit bearing 1132 is installed on the shaft seat 1131 through the second shaft 1133, and the axis of the second shaft 1133 can be set perpendicular to the rotation axis 1121. The limit bearing 1132 includes an inner wheel surface in contact with the second shaft 1133 and an outer wheel surface opposite to the inner wheel surface; the first shaft 112 is provided with a clamping surface 1123 for abutting against the outer wheel surface. The clamping surface 1123 serves as a matching structure of the limit bearing 1132, and the limit bearing 1132 can be clamped with the clamping surface 1123 of the first shaft 112 through the outer wheel surface.

[0046] The number of the limit bearing 1132 can be one or more. Matching with the shape of the outer wheel surface can be understood as possible, the outer wheel surface of the limit bearing 1132 can be a cylindrical surface, the clamping surface 1123 of the first rotating shaft 112 can be a plane, or the outer wheel surface of the limit bearing 1132 and the clamping surface 1123 of the first rotating shaft 112 can be a convex surface and a concave surface respectively, as long as the clamping of the limit bearing 1132 and the first rotating shaft 112 can be achieved and the first rotating shaft 112 can be allowed to move along the rotation axis 1121.

[0047] In the embodiment of the present application, the clamping structure may include a limit bearing 1132 , and the limit bearing 1132 is installed on the shaft seat 1131 through the second shaft 1133 , and the axis of the second shaft 1133 is perpendicular to the rotation axis 1121 . The limit bearing 1132 includes an inner wheel surface in contact with the second rotating shaft 1133 and an outer wheel surface opposite to the inner wheel surface; a clamping surface 1123 for abutting against the outer wheel surface is provided on the first rotating shaft 112; the limit bearing 1132 is clamped with the clamping surface 1123 of the first rotating shaft 112 through the outer wheel surface. Since the outer wheel surface of the limit bearing 1132 can rotate around the second rotating shaft 1133, when the first rotating shaft 112 moves along the rotation axis 1121, the friction between the clamping surface 1123 of the first rotating shaft 112 and the limit bearing 1132 can be reduced through the rotation of the outer wheel surface of the limit bearing 1132, thereby improving the efficiency of the first rotating shaft 112 moving along the rotation axis 1121.

[0048] like Figure 4 As shown, in some optional embodiments, the clamping structure includes four limit bearings 1132 evenly arranged around the first rotating shaft 112, and four clamping surfaces 1123 can be provided on the first rotating shaft 112, and the clamping surfaces 1123 correspond one-to-one to the limit bearings 1132.

[0049] In the embodiment of the present application, the clamping structure includes four limit bearings 1132 evenly arranged around the first rotating shaft 112, and the four clamping surfaces 1123 of the first rotating shaft 112. When the clamping structure and the first rotating shaft 112 are clamped and force is transmitted, the force between the clamping structure and the first rotating shaft 112 can be evenly dispersed on the four limit bearings 1132 and the four clamping surfaces 1123, which can effectively prevent the limit bearings 1132 or the clamping surfaces 1123 from being damaged due to stress concentration.

[0050] like Figure 3 As shown, in some optional embodiments, the wafer scrubbing equipment 100 further includes a guide sleeve 114, the guide sleeve 114 is disposed in the shaft seat 1131, and the first shaft 112 is disposed in the guide sleeve 114; the guide sleeve 114 is used to guide the first shaft 112 to move axially.

[0051] When the first rotating shaft 112 moves along the rotation axis 1121, there can be relative sliding between the first rotating shaft 112 and the guide sleeve 114, and the contact surface between the guide sleeve 114 and the first rotating shaft 112 can be made as smooth as possible, thereby reducing the friction resistance encountered by the first rotating shaft 112 moving along the rotation axis 1121.

[0052] In the embodiment of the present application, the first rotating shaft 112 can be guided to move along its axial direction by the guide sleeve 114, so that the first rotating shaft 112 can move along the rotation axis 1121 under the drive of the telescopic module 140, so as to adjust the force between the brush head 111 of the scrubbing brush 110 and the wafer under the drive of the first rotating shaft 112.

[0053] like Figure 2 and Figure 3 As shown, in some optional embodiments, the transmission assembly includes a first transmission wheel 1134, a second transmission wheel 1135 and a transition piece 1136; the first transmission wheel 1134 is sleeved outside the rotating shaft seat 1131, and the second transmission wheel 1135 is connected to the output shaft 131 of the motor 130; and the first transmission wheel 1134 and the second transmission wheel 1135 are connected via the transition piece 1136.

[0054] The first transmission wheel 1134 and the second transmission wheel 1135 can be transmission components such as gears or pulleys. The transition piece 1136 can be a transmission belt or a transition gear that meshes with the first transmission wheel 1134 and the second transmission wheel 1135 respectively. Exemplarily, when the transition piece 1136 is a transmission belt and the first transmission wheel 1134 and the second transmission wheel 1135 are gears, the transmission belt can be a chain that meshes with the gear teeth of the first transmission wheel 1134 and the second transmission wheel 1135, or can be a toothed belt with teeth that mesh with the gear teeth of the first transmission wheel 1134 and the second transmission wheel 1135. When the transition piece 1136 is a transmission belt and the first transmission wheel 1134 and the second transmission wheel 1135 are pulleys, the transmission belt can mesh with the first transmission wheel 1134 and the second transmission wheel 1135 through friction. Of course, the embodiment of the present application does not limit the specific form of the first transmission wheel 1134, the second transmission wheel 1135 and the transition piece 1136, as long as they can cooperate with each other to transmit force.

[0055] In the embodiment of the present application, the transmission assembly may include a first transmission wheel 1134, a second transmission wheel 1135 and a transition piece 1136; the first transmission wheel 1134 is sleeved outside the rotating shaft seat 1131, and the second transmission wheel 1135 is connected to the output shaft 131 of the motor 130; and the first transmission wheel 1134 and the second transmission wheel 1135 are connected through the transition piece 1136. The output shaft 131 of the motor 130 can output power through the second transmission wheel 1135, and transmit the power to the rotating shaft seat 1131 through the transition piece 1136 and the first transmission wheel 1134, and then drive the first rotating shaft 112 and the brush head 111 to rotate through the rotating shaft seat 1131. Furthermore, through the transition piece 1136, the first transmission wheel 1134 and the second transmission wheel 1135, the motor 130 can transmit power to the shaft seat 1131 in an indirect manner, that is, the motor 130 does not have to directly contact the shaft seat 1131, thereby reducing restrictions on the layout position of the motor 130 and making the layout of the motor 130 more flexible.

[0056] like Figure 3 As shown, in some optional embodiments, a magnetic module 160 is arranged between the telescopic module 140 and the first rotating shaft 112, and the telescopic module 140 is magnetically connected to the second end of the first rotating shaft 112 through the magnetic module 160; wherein the magnetic module 160 is used to adsorb the second end of the first rotating shaft 112 through magnetic force.

[0057] The magnetic attraction module 160 may include a magnet or other magnetic body, and a movable connection may be formed between the magnetic attraction module 160 and the first rotating shaft 112 based on magnetic attraction. When the motor 130 drives the scrubbing brush 110 to rotate, the first rotating shaft 112 may rotate relative to the magnetic attraction module 160. It should be understood that the magnetic attraction refers to the adsorption effect of magnetic material by magnetic force.

[0058] The material of the first rotating shaft 112 may include magnetic material, such as an iron-containing alloy, so that the magnetic suction module 160 can absorb the second end of the first rotating shaft 112 by magnetic force, so that when the telescopic module 140 drives the magnetic suction module 160 to move along the above-mentioned rotation axis 1121, the scrubbing brush 110 can be driven by the magnetic suction module 160 to move along the rotation axis 1121.

[0059] In the embodiment of the present application, a magnetic module 160 may be provided between the telescopic module 140 and the first rotating shaft 112, and the telescopic module 140 is connected to the second end of the first rotating shaft 112 through the magnetic module 160; wherein, the magnetic module 160 is used to adsorb the second end of the first rotating shaft 112 through magnetic force, and through the magnetic attraction of the magnetic module 160, a movable connection can be formed between the magnetic module 160 and the first rotating shaft 112 so that the first rotating shaft 112 can rotate relative to the magnetic module 160, without the need to provide a complex mechanical structure, which is conducive to simplifying the structural composition of the wafer scrubbing device 100 and reducing the cost of the wafer scrubbing device 100. When the telescopic module 140 is extended to push the first rotating shaft 112, the magnetic module 160 can play a role in transmitting force; when the telescopic module 140 is retracted to pull the first rotating shaft 112, the first rotating shaft 112 can be pulled up by the magnetic attraction force. The magnetic module 160 can form a relatively flexible magnetic connection with the first rotating shaft 112. During the circumferential rotation of the first rotating shaft 112, the magnetic module 160 and the pressure sensor 150 can remain stationary, thereby facilitating pressure monitoring while maintaining the magnetic connection and avoiding layout difficulties such as entanglement of the wiring of the pressure sensor 150.

[0060] In some optional embodiments, the magnetic attraction module 160 contacts the second end of the first rotating shaft 112 , and the contact form between the magnetic attraction module 160 and the second end of the first rotating shaft 112 is point contact.

[0061] Under the magnetic attraction of the magnetic attraction module 160, the second end of the first rotating shaft 112 can contact the magnetic attraction module 160. Figure 4-6 As shown, the second end of the first rotating shaft 112 can be provided with a structure protruding from the second end of the first rotating shaft 112 toward the magnetic attraction module 160, so that the second end of the first rotating shaft 112 can contact the magnetic attraction module 160 in a point contact form through the structure. It should be understood that the above-mentioned point contact means that the contact part when the magnetic attraction module 160 contacts the second end of the first rotating shaft 112 is a point.

[0062] In the embodiment of the present application, the magnetic module 160 contacts the second end of the first rotating shaft 112, and the contact form between the magnetic module 160 and the second end of the first rotating shaft 112 is point contact, which can reduce the contact area between the first rotating shaft 112 and the magnetic module 160 through point contact, thereby reducing the friction resistance encountered by the first rotating shaft 112 during rotation. Moreover, since the point contact does not limit the relative rotation between the first rotating shaft 112 and the magnetic module 160, the point contact can allow the second end of the first rotating shaft 112 to swing to a certain extent relative to the magnetic module 160, so that the first rotating shaft 112 has a greater degree of freedom.

[0063] like Figure 4-6As shown, in some optional embodiments, the second end of the first rotating shaft 112 is provided with a spherical cap structure 1122, and the spherical cap structure 1122 can be used to contact the magnetic attraction module 160. The spherical cap structure 1122 protrudes from the second end of the first rotating shaft 112 toward the magnetic attraction module 160, and the point contact between the second end of the first rotating shaft 112 and the magnetic attraction module 160 can be achieved through the spherical cap structure 1122. It should be understood that the part of the spherical surface intercepted by the plane is the spherical cap, and the circle intercepted by the plane is the bottom of the spherical cap. In this embodiment, the bottom of the spherical cap structure 1122 is connected to the body of the first rotating shaft 112.

[0064] In the embodiment of the present application, a spherical cap structure 1122 is provided at the second end of the first rotating shaft 112 , and the spherical cap structure 1122 is used to contact the magnetic attraction module 160 , so that point contact can be formed with the magnetic attraction module 160 through any point on the spherical cap structure 1122 .

[0065] like Figure 3 As shown, in some optional embodiments, the pressure sensor 150 is located between the telescopic module 140 and the magnetic module 160. When the telescopic module 140 applies a force to the first rotating shaft 112, or the first rotating shaft 112 applies a force to the telescopic module 140, two adjacent ones of the telescopic module 140, the pressure sensor 150, the magnetic module 160 and the first rotating shaft 112 may offset each other to transmit force.

[0066] The telescopic module 140 can be connected to the first rotating shaft 112 through the pressure sensor 150 and the magnetic module 160. The force between the scrubbing brush 110 and the telescopic module 140 is equal to the force of the first rotating shaft 112 acting on the pressure sensor 150 through the magnetic module 160, or the force between the pressure sensor 150 and the telescopic module 140. Therefore, by setting the pressure sensor 150 between the telescopic module 140 and the magnetic module 160, the force between the scrubbing brush 110 and the telescopic module 140 can be detected by the pressure sensor 150. Of course, the pressure sensor 150 can also be set to other positions, such as at one end of the telescopic module 140 away from the first rotating shaft 112, etc., which are all within the protection scope of the embodiments of the present application.

[0067] In the embodiment of the present application, by arranging the pressure sensor 150 between the telescopic module 140 and the magnetic module 160, the pressure sensor 150 can be arranged on the force transmission path between the scrubbing brush 110 and the telescopic module 140, so as to accurately detect the force between the scrubbing brush 110 and the telescopic module 140.

[0068] like Figure 3As shown, in some optional embodiments, the wafer scrubbing device 100 may further include a stopper 183 located between the telescopic module 140 and the first rotating shaft 112, the stopper 183 includes an accommodation space, and a through hole is provided on one side of the stopper 183 close to the first rotating shaft 112, connecting the accommodation space with the outside of the stopper 183. The accommodation space is used to accommodate the pressure sensor 150, the through hole is used to accommodate the magnetic module 160, and the magnetic module 160 can move along the rotation axis 1121 in the through hole.

[0069] It should be understood that in order to prevent the magnetic module 160 from falling off from the through hole, the maximum distance between the second end of the first rotating shaft 112 and the limit block 183 along the direction of the rotation axis 1121 should be smaller than the size of the magnetic module 160 along the direction of the rotation axis 1121.

[0070] In the embodiment of the present application, the stopper 183 can accommodate the pressure sensor 150 and the magnetic module 160. By setting the stopper 183 between the telescopic module 140 and the first rotating shaft 112, the pressure sensor 150 and the magnetic module 160 can be set between the telescopic module 140 and the first rotating shaft 112, which can facilitate the installation of the pressure sensor 150 and the magnetic module 160. In addition, the magnetic module 160 can move along the rotation axis 1121 in the through hole, which can reduce the restrictions on the installation of the magnetic module 160 to a certain extent, making the installation of the magnetic module 160 more flexible.

[0071] like Figure 2 and Figure 3 As shown, in some optional embodiments, the wafer scrubbing equipment 100 also includes a shell 170, the first rotating shaft 112 is at least partially located in the shell 170, and the brush head 111 is located outside the shell 170; the shell 170 includes a mounting through hole 171, and the first end of the first rotating shaft 112 is connected to the brush head 111 through a connecting block 172 located in the mounting through hole 171; a first protective cover 173 covering the mounting through hole 171 is arranged between the brush head 111 and the connecting block 172, and a second protective cover 174 is arranged on the shell 170 and is sleeved on the first protective cover 173 and the outside of the brush head 111.

[0072] The brush head 111 and the first protective cover 173 can be installed on the connecting block 172, so that the connecting block 172 can provide a stable installation position for the brush head 111 and the first protective cover 173, thereby ensuring the normal use of the brush head 111 and the first protective cover 173. By covering the first protective cover 173 of the mounting through hole 171, it is possible to prevent impurities or dirt on the surface of the wafer from entering the mounting through hole 171 and entering the interior of the housing 170 of the wafer scrubbing device 100 through the mounting through hole 171 when scrubbing the wafer. By sleeved on the first protective cover 173 and the outside of the brush head 111, it is possible to prevent the cleaning liquid or impurities, dirt, etc. on the surface of the wafer from entering the mounting through hole 171 in a larger range, so as to avoid the impurities or dirt on the surface of the wafer from having adverse effects on the parts inside the housing of the wafer scrubbing device 100.

[0073] In the embodiment of the present application, the wafer scrubbing equipment 100 may also include components such as a fixing plate 181 , a telescopic module connecting plate 182 , a rotating bearing 184 , a locking nut 185 , a bearing fixing seat 186 , and a limiting plate 187 .

[0074] like Figure 3-Figure 6 As shown, a fixing plate 181 is provided between the end of the telescopic module 140 away from the pressure sensor 150 and the housing 170 of the wafer scrubbing device 100, and the position of the telescopic module 140 can be fixed by the fixing plate 181. The end of the telescopic module 140 close to the pressure sensor 150 is connected to a telescopic module connecting plate 182, and the pressure sensor 150 is mounted on the telescopic module connecting plate 182, and a limit block 183 for accommodating the pressure sensor 150 can be installed on the telescopic module connecting plate 182 to limit the movement of the pressure sensor 150. The rotating bearing 184 can be sleeved outside the rotating shaft seat 1131, and the rotating shaft seat 1131 can be fixed by the locking nut 185 to connect the rotating shaft seat 1131 with the inner ring of the rotating bearing 184, so that when the rotating shaft seat 1131 rotates, the inner ring of the rotating bearing 184 is driven to rotate relative to the outer ring of the rotating bearing 184, so that when the rotating shaft seat 1131 is installed by the rotating bearing 184, the resistance to the rotation of the rotating shaft seat 1131 can be reduced. A mounting position is set in the bearing fixing seat 186, and the rotating bearing 184 can be installed in the mounting position, and the displacement of the bearing can be limited by the limiting plate 187, so as to prevent the rotating bearing 184 from leaving the mounting position. The bearing fixing seat 186 can be connected to the housing 170 of the wafer scrubbing device 100, so that the bearing can be fixed in the wafer scrubbing device 100 by the bearing fixing seat 186 and the limiting plate 187.

[0075] like Figure 1 As shown, according to the second aspect of the embodiments of the present application, a wafer scrubbing system 01 is also provided, comprising the wafer scrubbing device 100 in any embodiment of the first aspect of the present application.

[0076] It should be understood that the wafer scrubbing system 01 of this embodiment and the embodiment of the aforementioned wafer scrubbing equipment 100 are based on the same inventive concept, and the specific implementation method and beneficial effects thereof can be referred to the above embodiments, which will not be described in detail here.

[0077] According to the third aspect of the embodiment of the present application, a polishing device is also provided, including the wafer scrubbing system 01 in the embodiment of the second aspect of the present application.

[0078] The polishing device of the embodiment of the present application may also include a polishing module, and the wafer is subjected to chemical mechanical polishing by the polishing module. It should be understood that chemical mechanical polishing (CMP), also known as chemical mechanical planarization (CMP), is a global flattening ultra-precision surface processing technology that can complete the chemical mechanical polishing of the wafer under the combined action of chemistry and mechanics.

[0079] Specifically, the polishing module may include a carrier head, a polishing disk, a liquid supply device, a trimmer and a polishing pad. The carrier head loads the wafer to be polished and abuts it against the polishing pad above the polishing disk so as to polish the wafer with the polishing pad. The liquid supply device supplies polishing liquid between the polishing pad and the wafer. The trimmer is used to trim the surface of the polishing pad. The polishing pad is placed on the polishing disk, and the carrier head and the trimmer can be located on both sides of the polishing pad respectively, so that when the carrier head polishes the wafer through the polishing pad, the trimmer can trim the polishing pad at the same time. After the wafer is polished, the wafer surface can be scrubbed by the above-mentioned wafer scrubbing device.

[0080] According to a fourth aspect of the embodiment of the present application, there is also provided a method for cleaning a wafer using the wafer scrubbing device of the aforementioned aspect, the wafer cleaning method comprising: S1: Positioning a wafer at the wafer scrubbing device 100 , specifically, loading the wafer onto the chuck 11 below the scrubbing brush 110 ; S2: placing the scrubbing brush 110 against the surface of the wafer. Specifically, the telescopic module 140 may be used to perform a telescopic action, thereby moving the scrubbing brush 110 toward the upper surface of the wafer. S3 : driving the scrubbing brush to rotate to scrub the wafer, for example, by the motor 130 .

[0081] In a further embodiment, the wafer cleaning method further comprises: S4: Detecting the force between the scrubbing brush 110 and the telescopic module 140 through a pressure sensor; S5: Control the telescopic module 140 to perform a telescopic action according to the force between the scrubbing brush 110 and the telescopic module 140, so that the telescopic module 140 drives the scrubbing brush 110 to move toward or away from the wafer along the rotation axis to adjust the force between the scrubbing brush 110 and the wafer.

[0082] It should be understood that the wafer cleaning method of the present application is not limited to the above-mentioned execution order. The order of the above-mentioned steps can be appropriately adjusted according to the actual working conditions. For example, steps S4 and S5 can be executed before step S3 to pre-adjust the force between the scrubbing brush 110 and the wafer. In addition, steps S4 and S5 can be executed in real time during the execution of step S3 to adjust the force between the scrubbing brush 110 and the wafer in real time.

[0083] It should be understood that the polishing equipment of this embodiment and the aforementioned wafer scrubbing equipment are based on the same inventive concept, and the specific implementation method and beneficial effects thereof can be referred to the above embodiments, which will not be described in detail here.

[0084] It should be pointed out that, according to the needs of implementation, the various components / steps described in the embodiments of the present application can be split into more components / steps, or two or more components / steps or partial operations of components / steps can be combined into new components / steps to achieve the purpose of the embodiments of the present application.

[0085] Those of ordinary skill in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of the present application.

[0086] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A wafer scrubbing device, characterized in that: include: Motor, telescopic module, pressure sensor, scrubbing brush and controller; The motor and the telescopic module are respectively connected to the scrubbing brush; the controller is electrically connected to the telescopic module and the pressure sensor; Among them, the motor is used to drive the scrubbing brush to rotate so that the scrubbing brush scrubs the wafer; the pressure sensor is used to detect the force between the scrubbing brush and the telescopic module, and transmit the detection result to the controller; the controller is used to control the telescopic module to perform a telescopic action according to the detection result, so that the telescopic module drives the scrubbing brush to move along the direction of the rotation axis to adjust the force between the scrubbing brush and the wafer.

2. The wafer scrubbing equipment according to claim 1, characterized in that: The scrubbing brush comprises a brush head and a first rotating shaft, wherein the brush head is connected to a first end of the first rotating shaft; and the telescopic module is connected to a second end of the first rotating shaft; The motor is connected to the first rotating shaft through a transmission assembly; the transmission assembly includes a rotating shaft seat sleeved outside the first rotating shaft, and the motor is connected to the rotating shaft seat; The shaft seat and the first shaft are movably connected, and the first shaft can move axially along the rotation axis in the shaft seat; and a clamping structure that is clamped with the first shaft is provided on the shaft seat, and when the shaft seat rotates around the rotation axis driven by the transmission assembly, the shaft seat drives the first shaft to rotate around the rotation axis through the clamping structure.

3. The wafer scrubbing device according to claim 2, characterized in that: The clamping structure includes a limit bearing, and the limit bearing is installed on the rotating shaft seat through a second rotating shaft, and the axis of the second rotating shaft is perpendicular to the rotation axis; The limit bearing includes an inner wheel surface in contact with the second rotating shaft and an outer wheel surface opposite to the inner wheel surface; the first rotating shaft is provided with a clamping surface for abutting against the outer wheel surface; the limit bearing is clamped with the clamping surface of the first rotating shaft through the outer wheel surface.

4. The wafer scrubbing equipment according to claim 3, characterized in that: The clamping structure includes four limit bearings evenly arranged around the first rotating shaft. The first rotating shaft is provided with four clamping surfaces, and the clamping surfaces correspond to the limit bearings one by one.

5. The wafer scrubbing equipment according to claim 2, characterized in that: The device further comprises a guide sleeve, wherein the guide sleeve is arranged in the rotating shaft seat, the first rotating shaft is arranged in the guide sleeve, and the guide sleeve is used for guiding the first rotating shaft to move axially.

6. The wafer scrubbing device according to any one of claims 2 to 5, characterized in that: The telescopic module, the pressure sensor and the scrubbing brush are located on the rotation axis; the output shaft of the motor is parallel to the rotation axis of the scrubbing brush; and the orthographic projection of the motor on the rotation axis is located in the area on the rotation axis where one or more of the telescopic module, the pressure sensor and the scrubbing brush are located.

7. The wafer scrubbing device according to any one of claims 2 to 5, characterized in that: The transmission assembly includes a first transmission wheel, a second transmission wheel and a transition piece; The first transmission wheel is sleeved outside the rotating shaft seat, and the second transmission wheel is connected to the output shaft of the motor; and the first transmission wheel and the second transmission wheel are connected through the transition piece.

8. The wafer scrubbing equipment according to any one of claims 2 to 5, characterized in that: A magnetic attraction module is provided between the telescopic module and the first rotating shaft, and the telescopic module is magnetically connected to the second end of the first rotating shaft through the magnetic attraction module; wherein the magnetic attraction module is used to adsorb the second end of the first rotating shaft through magnetic force.

9. The wafer scrubbing equipment according to claim 8, characterized in that: The magnetic attraction module is in contact with the second end of the first rotating shaft, and the contact form between the magnetic attraction module and the second end of the first rotating shaft is point contact.

10. The wafer scrubbing equipment according to claim 9, characterized in that: The pressure sensor is located between the telescopic module and the magnetic attraction module.

11. The wafer scrubbing equipment according to claim 8, characterized in that: It also includes a limit block located between the telescopic module and the first rotating shaft, the limit block includes a receiving space, and a through hole connecting the receiving space with the outside of the limit block is provided on a side of the limit block close to the first rotating shaft; The accommodation space is used to accommodate the pressure sensor, the through hole is used to accommodate the magnetic attraction module, and the magnetic attraction module can move along the rotation axis in the through hole.

12. The wafer scrubbing equipment according to claim 9 or 10, characterized in that: The second end of the first rotating shaft is provided with a spherical cap structure, and the spherical cap structure is used to contact the magnetic attraction module.

13. The wafer scrubbing device according to any one of claims 2 to 5, characterized in that: The device comprises a housing, the first shaft is at least partially located in the housing, and the brush head is located outside the housing; The housing comprises a mounting through hole, and the first end of the first rotating shaft is connected to the brush head via a connecting block located in the mounting through hole; A first protective cover covering the mounting through hole is arranged between the brush head and the connecting block, and a second protective cover sleeved on the first protective cover and the outside of the brush head is arranged on the shell.

14. The wafer scrubbing device according to any one of claims 1 to 5, characterized in that: The telescopic module includes a voice coil motor, and the voice coil motor is used to drive the scrubbing brush to move along the direction of the rotation axis.

15. A wafer scrubbing system, characterized in that: A wafer scrubbing device comprising the wafer scrubbing device according to any one of claims 1 to 14.

16. A polishing device, characterized in that: Includes the wafer scrubbing system as described in claim 15.

17. A wafer cleaning method, which uses the wafer scrubbing device according to any one of claims 1 to 14 to clean the wafer, characterized in that: The wafer cleaning method comprises: Positioning the wafer at the wafer scrubbing device; placing the scrubbing brush against the surface of the wafer; The scrubbing brush is driven to rotate to scrub the wafer.

18. The wafer cleaning method according to claim 17, characterized in that: The wafer cleaning method further comprises: detecting the force between the scrubbing brush and the telescopic module; The telescopic module is controlled to perform a telescopic action according to the action force between the scrubbing brush and the telescopic module, so as to adjust the action force between the scrubbing brush and the wafer.

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