Camera module and electronic device

Abstract

The invention discloses a camera module and an electronic device. The camera module comprises a main body and a circuit board assembly. The circuit board assembly comprises a first circuit board and a second circuit board connected with the first circuit board, the first circuit board is connected with the main body, the second circuit board is a flexible circuit board, the second circuit board comprises a bending part, and the bending part is located in a space formed by the outer contour of the main body. In the camera module provided by the embodiment of the invention, the bending part is located in the space formed by the outer contour of the main body, so that the outer contour size of the camera module is reduced, the space occupation of the camera module is further reduced, and the miniaturization design requirement of the camera module is met.

Description

Technical Field

[0001] The present application relates to the technical field of electronic devices, and in particular to a camera module and an electronic device. Background Art

[0002] With the rapid development of the industry, the miniaturization of electronic devices has become a design trend. Electronic devices include mobile phones, etc. Based on user needs, more and more mobile phones are equipped with high-performance camera modules. Since the space inside the mobile phone reserved for the camera module is small, the miniaturization design of the camera module is becoming more and more important. Therefore, how to reduce the space occupied by the camera module is a problem that technicians in this field continue to study. Summary of the invention

[0003] The present application provides a method for manufacturing a cover plate, a cover plate, and an electronic device.

[0004] The camera module of the embodiment of the present application includes:

[0005] main body;

[0006] A circuit board assembly, the circuit board assembly comprising a first circuit board and a second circuit board connected to the first circuit board, the first circuit board being connected to the main body, the second circuit board being a flexible circuit board, the second circuit board comprising a bending portion, and the bending portion being located within a space formed by an outer contour of the main body.

[0007] In the camera module of the embodiment of the present application, the bending portion is located in the space formed by the outer contour of the main body, thereby reducing the outer contour size of the camera module, and further reducing the space occupied by the camera module, meeting the miniaturization design requirements of the camera module.

[0008] The electronic device of the embodiment of the present application includes:

[0009] case;

[0010] The camera module described in the above embodiment is connected to the shell.

[0011] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0013] Figure 1 is a structural schematic diagram of a camera module according to an embodiment of the present application;

[0014] Figure 2 is a structural schematic diagram of a camera module according to an embodiment of the present application;

[0015] Figure 3 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0016] Figure 4 is a structural schematic diagram of a camera module according to an embodiment of the present application;

[0017] Figure 5 yes Figure 4 A magnified view of part A of the camera module;

[0018] Figure 6 is a structural schematic diagram of a camera module according to an embodiment of the present application;

[0019] Figure 7 is a structural schematic diagram of a camera module according to an embodiment of the present application;

[0020] Figure 8 is a structural schematic diagram of a camera module according to an embodiment of the present application;

[0021] Fig. 9 yes Figure 8 A magnified view of part B of the camera module;

[0022] Fig.10 is a structural schematic diagram of a camera module according to an embodiment of the present application;

[0023] Fig.11 is a structural schematic diagram of a camera module according to an embodiment of the present application;

[0024] Fig.12 yes Fig.11 An enlarged view of part C of the camera module.

[0025] Description of reference numerals:

[0026] Camera module 100; main body 10; outer contour 11 of the main body; circuit board assembly 20; first circuit board 21; second circuit board 22; bending portion 220; connector 101; first side 210; second side 211; connecting portion 221; pad 102; third side 12; fourth side 13; first portion 212; second portion 213; avoidance space 214; groove 103; third circuit board 24; fourth circuit board 25; first connecting surface 240; second connecting surface 241; support member 104; drive module 14; lens 15; window 16; electronic device 1000; housing 200. DETAILED DESCRIPTION

[0027] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0029] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0030] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0031] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0032] See also Figure 1 and Figure 2 The camera module 100 of the embodiment of the present application includes a main body 10 and a circuit board assembly 20. The circuit board assembly 20 includes a first circuit board 21 and a second circuit board 22 connected to the first circuit board 21. The first circuit board 21 is connected to the main body 10. The second circuit board 22 is a flexible circuit board. The second circuit board 22 includes a bending portion 220. The bending portion 220 is located in the space formed by the outer contour 11 of the main body 10.

[0033] In the camera module 100 of the embodiment of the present application, the bending portion 220 is located in the space formed by the outer contour 11 of the main body 10, thereby reducing the overall size of the camera module 100, and further reducing the space occupied by the camera module 100, meeting the miniaturization design requirements of the camera module 100.

[0034] See also Figure 3 The camera module 100 of the embodiment of the present application is applied to an electronic device 1000, and the camera module 100 is used to provide a camera function for the electronic device 1000. The electronic device 1000 includes but is not limited to a smart phone, a tablet computer, a smart home device (such as a smart doorbell, a smart surveillance camera), a laptop computer, a car rearview camera, a drone, an AR / VR device, a smart watch, and the like.

[0035] For ease of description, the electronic device 1000 is described below as a smartphone. The smartphone includes a housing 200 and a camera module 100, and the camera module 100 is connected to the housing 200. The camera module 100 and the housing 200 may be connected by bonding, threading, spring clamping, spring gasket, etc.

[0036] In one embodiment, the camera module 100 can be fixedly connected to the mobile phone housing 200 using an adhesive or glue. This method can provide a firm connection and is also convenient for assembly and disassembly. Common adhesives include double-sided adhesives, engineering adhesives, etc.

[0037] In one embodiment, the camera module 100 is fixedly connected to the mobile phone housing 200 by screws. The screws can pass through holes on the module and the housing 200 and are fixed by tightening. This connection method provides strong stability and reliability.

[0038] In one embodiment, the camera module 100 is connected to the mobile phone housing 200 through a spring clamping mechanism. This mechanism uses elastic force to fix the camera module 100 in the housing 200, while providing a certain buffering and shockproof effect. The spring clamping usually uses a metal sheet, a spring or a plastic clamping piece.

[0039] In one embodiment, the camera module 100 is connected to the mobile phone housing 200 via an elastic gasket. The elastic gasket can provide a certain pressure to make the module fit tightly on the housing 200. This connection method can improve the waterproof and dustproof performance of the mobile phone.

[0040] The main body 10 may be a main structural part of the camera module 100, and the outer contour of the main body 10 occupies a larger part of the outer contour of the camera module 100. The circuit board assembly 20 may be arranged on one side of the main body 10, and a connector 101 may be arranged between the circuit board assembly 20 and the main body 10, and the connector 101 may be arranged on one or more sides of the main body 10 facing the circuit board assembly 20.

[0041] Furthermore, a plurality of slots may be provided on the main body 10, and the slots are used for the connector 101 to be engaged with the main body 10, so as to prevent the connector 101 from exceeding the space formed by the outer contour 11 of the main body 10. The space formed by the outer contour 11 of the main body 10 may be the space of the main body 10 toward the circuit board assembly 20.

[0042] The circuit board assembly 20 can be used to transmit electrical signals, connect electronic components and realize the functions of the camera module 100. The first circuit board 21 can be a PCB (Printed Circuit Board), which is a rigid circuit board composed of insulating material and copper foil circuit layers. The number of PCBs can be multiple, such as two, three, four or even more.

[0043] The second circuit board 22 can be an FPC (Flexible Printed Circuit). FPC is a flexible, thin circuit board composed of a flexible substrate (usually a polyester film) and a conductive circuit. FPC can be bent and folded according to the shape and size of the camera module 100. FPC can also set a corresponding bending radius according to the spacing between different first circuit boards 21. For example, the bending radius of FPC can be determined by simulation analysis. FPC can extend from one side of a PCB and connect to one side of another PCB. Among them, the extension line refers to the connection method in which the FPC extends from the PCB.

[0044] Furthermore, the FPC may include a bending portion 220, and the bending portion 220 enables the FPC to connect to some PCBs arranged in a specific direction. For example, the FPC connects two PCBs stacked up and down through the bending portion 220, and the arrangement of the bending portion 220 reduces the area occupied by the two PCBs in some directions (such as the length direction and width direction of the PCBs, etc.), thereby reducing the space occupied by the circuit board assembly 20, and further reducing the space occupied by the camera module 100.

[0045] The bending portion 220 is located in the space formed by the outer contour 11 of the main body 10, or in other words, the edge of the bending portion 220 does not exceed any side surface of the main body 10. In this way, the size of the outer contour 11 of the main body 10 is substantially the same as the outer contour size of the camera module 100, and the outer contour size of the camera module 100 is easy to control, thereby facilitating the miniaturization design of the camera module 100.

[0046] In addition, the circuit board assembly 20 also includes a BTB (Board-to-Board) connector. In the camera module 100, the BTB connector is often used to connect the circuit board of the camera module 100 with the main board of a mobile phone or other circuit boards of other devices. It provides reliable electrical connection and mechanical support to ensure normal signal transmission and data exchange between the camera module 100 and other systems.

[0047] See also Figure 4 and Figure 5 In some embodiments, the first circuit board 21 includes a first side surface 210 and a second side surface 211 connected to the first side surface 210, the area of ​​the first side surface 210 is greater than the area of ​​the second side surface 211, the second circuit board 22 includes a connecting portion 221 connected to the bending portion 220, the first side surface 210 is connected to the main body 10, and the second side surface 211 is connected to the connecting portion 221.

[0048] In this way, the connecting portion 221 can make the connection transition between the first circuit board 21 and the second circuit board 22 smooth, and can be designed in a variety of ways. For example, the direction and distance of the bending portion 220 relative to the first circuit board 21 can be adjusted; the first side surface 210 is a larger side surface on the first circuit board 21, and is connected to the main body 10 by the first side surface 210, which can enhance the connection stability between the first circuit board 21 and the main body 10.

[0049] Specifically, the shape of the first circuit board 21 can be a regular shape such as a cuboid or a cube, or an irregular shape. Taking the first circuit board 21 as a cuboid, for example, the thickness of the cuboid is smaller than its width and length, the first side surface 210 is a larger surface of the cuboid, the second side surface 211 is a smaller surface of the cuboid, and the first side surface 210 and the second side surface 211 can be connected by a line, or the first side surface 210 and the second side surface 211 have a common edge.

[0050] The connection portion 221 of the second circuit board 22 can be formed on the second side surface 211 of the first circuit board 21. The bending portion 220 of the second circuit board 22 can flexibly change the angle by bending. By reasonably designing the connection portion 221 and the bending portion 220, the space occupied by the circuit board assembly 20 can be optimized. The second circuit board 22 can be connected from the second side surface 211 and extend in a desired direction, so as to connect other circuit elements of the circuit board assembly 20, or any other circuit elements.

[0051] The connection between the first side surface 210 and the main body 10 may be a flexible pin connection, a welding connection, a flexible connector connection, a socket connection, etc. In this way, the main body 10 may be connected to the first circuit board 21, and a part of the structure of the main body 10 may respond to instructions transmitted by the first circuit board 21.

[0052] In one embodiment, the first side surface 210 is connected to the main body 10 by elastic pins, and the spring pins are usually fixed on the first circuit board 21 and contact the pins on the main body 10 by pressure to establish an electrical connection. The spring pins have compressible and elastic properties and can provide reliable electrical connection and mechanical support.

[0053] In one embodiment, the first side surface 210 is connected to the main body 10 by an elastic connector, which may be a flexible connector, such as an FPC. This connection method allows a certain degree of relative movement between the main body 10 and the first circuit board 21. It is worth noting that when this connection method is adopted, it is necessary to ensure that the FPC cannot exceed the space defined by the outer contour 11 of the main body 10.

[0054] In one embodiment, the first side surface 210 is connected to the main body 10 by a socket, specifically, a socket is used as an interface, a socket can be provided on the first circuit board 21, and corresponding pins can be provided on the main body 10, and the socket is inserted into the corresponding pins. The socket usually has a conductive contact to form a reliable electrical connection between the main board and the motor. This connection method is suitable for situations where frequent replacement or maintenance is required, because the first circuit board 21 can be easily inserted or removed.

[0055] See also Figure 5 In some embodiments, a soldering pad 102 is disposed on the main body 10 , and the main body 10 is soldered to the first side surface 210 via the soldering pad 102 .

[0056] It is understandable that the connector usually requires additional space and has certain size and height requirements. The solder pad 102 connection mode can effectively reduce the use of connectors because the solder pad 102 allows the main body 10 to be directly soldered to the first circuit board 21.

[0057] In addition, the connector often requires a certain thickness in the module design, including the space of the connector itself and the first circuit board 21 associated therewith. The connection method of the pad 102 can minimize the distance between the first circuit board 21 and the main body 10, thereby reducing the overall thickness. This is particularly important for the mobile phone camera module 100 that pursues a thinner design. Therefore, by using the pad 102 connection, space can be saved and a miniaturized design of the camera module 100 can be achieved.

[0058] Specifically, the pad 102 may be disposed at a position of the main body 10 close to the first side surface 210 , and the number of the pad 102 may be multiple, for example, the number of the pad 102 is two, three, four or even more.

[0059] See also Figure 6 and Figure 7 In some embodiments, the main body 10 includes a third side surface 12 and a fourth side surface 13 opposite to the third side surface 12, the third side surface 12 is close to the bending portion 220, the pads 102 are arranged on the third side surface 12 and / or the fourth side surface 13 along the first direction h, the number of pads 102 on the fourth side surface 13 is greater than the number of pads 102 on the third side surface 12, the bending portion 220 and the pads 102 on the third side surface 12 are staggered in the second direction v, the first direction h is perpendicular to the second direction v, and the outer contour 11 of the main body 10 includes the third side surface 12 and the fourth side surface 13.

[0060] In this way, the number of pads 102 on the third side surface 12 is small and they are staggered with the bending portion 220 , so that the bending portion 220 has more design space, thereby optimizing the space occupied by the circuit board assembly 20 and satisfying the miniaturization requirements of the camera module 100 .

[0061] Specifically, the shape of the main body 10 can be a regular shape such as a cuboid, a cube, or an irregular shape. Taking the main body 10 as a cuboid as an example, the third side 12 and the fourth side 13 can be two opposite sides of the cuboid, the third side 12 and the fourth side 13 can be the outer surface of the main body 10, the third side 12 and the fourth side 13 can be a part of the outer contour 11 of the main body 10, and the circuit board assembly 20 can be arranged between the third side 12 and the fourth side 13. The first direction h can be the width direction of the cuboid, and the second direction v can be the length direction of the cuboid.

[0062] In this way, the pads 102 disposed on the third side surface 12 and the fourth side surface 13 can be connected to the circuit board assembly 20. Further, the pads 102 can be connected to the first side surface 210 of the first circuit board 21.

[0063] The pad 102 can be arranged on the third side surface 12 along the first direction h, the pad 102 can also be arranged on the third side surface 12 and the fourth side surface 13 along the first direction h, and the pad 102 can also be arranged on the fourth side surface 13 along the first direction h. It can be understood that the arrangement of the pad 102 requires a welding space to be reserved on the first side surface 210. Therefore, the bending portion 220 and the pad 102 on the third side surface 12 are staggered in the second direction v, so that the welding space can avoid affecting the bending angle of the bending portion 220, so that the bending portion 220 has a larger design space, so that the bending portion 220 can be located in the space formed by the outer contour 11 of the main body 10.

[0064] The pad 102 is a structure for connecting the main body 10 and the first circuit board 21. Since the first side 210 needs to reserve a welding space, the number of pads 102 on the third side 12 close to the bending portion 220 should be as small as possible, and in order to meet the requirements of electrical connection, the pads 102 can be set as much as possible on the fourth side 13.

[0065] See also Figure 8 and Fig. 9 In some embodiments, the first circuit board 21 includes a first part 212 and a second part 213 connected to a side of the first part 212, the first part 212 and the second part 213 define an avoidance space 214, the connecting portion 221 is at least partially located in the avoidance space 214, the pad 102 on the third side 12 is connected to the second part 213, and the first part 212 and the second part 213 both include a portion of the second side 211.

[0066] In this way, the avoidance space 214 can provide a design space for the bending portion 220 and the connecting portion 221 , so that the bending portion 220 and the connecting portion 221 are located in the space formed by the outer contour 11 of the main body 10 .

[0067] Specifically, the second side surface 211 may be a curved surface or an inclined surface. The end surface of the first portion 212 and the second portion 213 close to the main body 10 may include a portion of the second side surface 211. The length of the first portion 212 may be less than the length of the second portion 213, and the first portion 212 may be away from the main body 10 relative to the second portion 213. The transition between the first portion 212 and the second portion 213 may be a rounded transition.

[0068] The second part 213 can be regarded as a structure formed by eliminating part of the material of the first circuit board 21, and the avoidance space 214 can be a virtual space formed after eliminating the part of the material. The connecting portion 221 can be led out from the end face of one side of the first circuit board 21 and extend to any angle. The connecting portion 221 can be partially or completely located in the avoidance space 214. Optionally, the connecting portion 221 can be completely located in the avoidance space 214. In this way, the connecting portion 221 can obtain a larger design space, so that the space occupied by the connecting portion 221 can be optimized, and the space occupied by the circuit board assembly 20 can be optimized.

[0069] See also Figure 6 and Figure 7 In some embodiments, a groove 103 is provided on the third side surface 12 and / or the fourth side surface 13 , and the pad 102 is provided in the groove 103 .

[0070] It is understandable that the pad 102 will inevitably occupy space when connected to the first circuit board 21, so that the welding structure may exceed the space formed by the outer contour 11 of the main body 10. Therefore, the groove 103 can accommodate the pad 102, so that the probability of the structure exceeding the space formed by the outer contour 11 of the main body 10 during welding is reduced, thereby satisfying the miniaturization design of the camera module 100.

[0071] Specifically, the third side surface 12 may be provided with a groove 103, or the fourth side surface 13 may be provided with a groove 103, or the third side surface 12 and the fourth side surface 13 may be provided with a groove 103. The groove 103 may be provided at one end of the third side surface 12 and the fourth side surface 13 close to the circuit board assembly 20, and the shape of the groove 103 may be a regular shape such as a square or an ellipse, or may be an irregular shape.

[0072] See also Figure 2 In some embodiments, the circuit board assembly 20 is located in a space formed by the outer contour 11 of the main body 10 .

[0073] It can be understood that in the circuit board assembly 20, the bending portion 220 will exceed the space formed by the outer contour 11 of the main body 10 due to the bending angle and other reasons. The bending portion 220 and the pad 102 on the third side surface 12 are staggered in the second direction v, so that the bending portion 220 can obtain more design space, so that the circuit board assembly 20 can be located in the space formed by the outer contour of the main body 10, thereby satisfying the miniaturization design of the camera module 100.

[0074] See also Fig.10 , Fig.11 and Fig.12 In some embodiments, the circuit board assembly 20 also includes a third circuit board 24 and a fourth circuit board 25, the fourth circuit board 25 is a flexible circuit board, the third circuit board 24 includes a first connecting surface 240 and a second connecting surface 241 substantially perpendicularly connected to the first connecting surface 240, the first connecting surface 240 is connected to the second circuit board 22, the second connecting surface 241 is connected to the fourth circuit board 25, the third circuit board 24 is stacked with the first circuit board 21, and the extension direction j2 of the fourth circuit board 25 is substantially parallel to the thickness direction j2 of the third circuit board 24.

[0075] In this way, the third circuit board 24 is stacked with the first circuit board 21 and connected through the second circuit board 22, and the extension direction j2 of the fourth circuit board 25 is roughly parallel to the thickness direction j2 of the third circuit board 24. Such a circuit board assembly 20 can arrange as many circuit boards as possible within the space formed by the outer contour, increase the functionality of the circuit board assembly 20, and meet the miniaturization design requirements of the camera module 100.

[0076] Specifically, the third circuit board 24 may be a PCB, one end of the second circuit board 22 may be formed on the first connection surface 240, and a line may be led out from the first connection surface 240. The fourth circuit board 25 may be an FPC, one end of the fourth circuit board 25 may be formed on the second connection surface 241, and a line may be led out from the second connection surface 241.

[0077] The third circuit board 24 may be in a regular shape such as a cuboid or a cube, or in an irregular shape. Taking the third circuit board 24 as a cuboid as an example, the first connection surface 240 and the second connection surface 241 may be two adjacent surfaces of the cuboid.

[0078] The first circuit board 21 and the third circuit board 24 can be stacked along the thickness direction j2 of the third circuit board 24, and the thickness direction j2 of the third circuit board 24 can be perpendicular to the first direction h and the second direction v. A support member 104 can be provided between the first circuit board 21 and the third circuit board 24, and the support member 104 can be a gasket, etc. The gasket can directly contact the first circuit board 21 and the third circuit board 24, so as to stabilize the connection between the first circuit board 21 and the third circuit board 24, avoid the third circuit board 24 from being suspended relative to the first circuit board 21, and reduce the probability of damage to the third circuit board 24.

[0079] The fourth circuit board 25 can be led out from the second connection surface 241, and the extension direction j2 of the fourth circuit board 25 is substantially parallel to the thickness direction j2 of the third circuit board 24. In this way, the fourth circuit board 25 is substantially perpendicular to the third circuit board 24, which optimizes the space occupied by the circuit board assembly 20, so that the entire circuit board assembly 20 can be located within the space formed by the outer contour 11 of the main body 10, thereby meeting the miniaturization design requirements of the camera module 100.

[0080] In some embodiments, the main body 10 includes a driving module 14 and a lens 15 . The driving module 14 is electrically connected to the circuit board assembly 20 via the pad 102 . The driving module 14 is used to drive the lens 15 .

[0081] The connection method of the solder pad 102 can effectively reduce the use of connectors, because the solder pad 102 can enable the driving module 14 to be directly soldered to the circuit board assembly 20, thereby achieving electrical connection and reducing the space occupied by the connection structure between the driving module 14 and the circuit board assembly 20, thereby meeting the miniaturization design requirements of the camera module 100.

[0082] Specifically, the lens 15 may be a periscope lens, and the main function of the driving module 14 is to control and drive the movement of the periscope lens to achieve functions such as focal length adjustment, zooming, and autofocus. The driving module and the circuit board assembly 20 may be provided with a soldering pad 102, wherein the soldering pad 102 of the driving module may be provided on the third side 12 and / or the fourth side 13 of the main body 10. The driving module 14 may be a stepping motor and an electromagnetic assembly, and both the stepping motor and the electromagnetic assembly may be selected or customized according to requirements.

[0083] In one embodiment, the stepper motor drives the lens 15 in response to the control current and pulse signal transmitted by the circuit board assembly 20. The stepper motor driving module 14 is suitable for the motion control of the lens 15 requiring higher precision and reliability.

[0084] In one embodiment, the electromagnetic assembly responds to the control current and magnetic field transmitted by the circuit board assembly 20 to drive the lens 15. The electromagnetic assembly driving method can achieve smooth movement and fast response, which is suitable for larger lens 15 assemblies and applications requiring fast zoom.

[0085] The main body 10 may also be provided with a window 16, which may be provided on a side away from the circuit board assembly 20. The window 16 is a light-transmitting window in the camera module 100, through which the lens 15 may receive external light and transmit the light to the corresponding image sensor. The function of the window 16 is to ensure that light can smoothly enter the lens 15, thereby realizing the function of image acquisition.

[0086] In addition, the window 16 can be made of a light-transmitting material, such as glass or plastic, to protect the lens 15. It can prevent dust, scratches and other substances from damaging the lens 15, and maintain the clarity and image quality of the lens 15. Of course, the window 16 can also be a through hole.

[0087] In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0088] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A camera module, characterized in that: include: main body; A circuit board assembly, the circuit board assembly comprising a first circuit board and a second circuit board connected to the first circuit board, the first circuit board being connected to the main body, the second circuit board being a flexible circuit board, the second circuit board comprising a bending portion, and the bending portion being located within a space formed by an outer contour of the main body.

2. The camera module according to claim 1, characterized in that: The first circuit board includes a first side surface and a second side surface connected to the first side surface, the area of ​​the first side surface is greater than the area of ​​the second side surface, the second circuit board includes a connecting portion connected to the bending portion, the first side surface is connected to the main body, and the second side surface is connected to the connecting portion.

3. The camera module according to claim 2, characterized in that: A welding pad is arranged on the main body, and the main body is welded to the first side surface through the welding pad.

4. The camera module according to claim 3, characterized in that: The main body includes a third side surface and a fourth side surface opposite to the third side surface, the third side surface is close to the bending portion, the solder pads are arranged on the third side surface and / or the fourth side surface along a first direction, the number of the solder pads on the fourth side surface is greater than the number of the solder pads on the third side surface, the bending portion and the solder pads on the third side surface are staggered in a second direction, the first direction is perpendicular to the second direction, and the outer contour of the main body includes the third side surface and the fourth side surface.

5. The camera module according to claim 4, characterized in that: The first circuit board includes a first part and a second part connected to a side of the first part, the first part and the second part define an avoidance space, the connecting portion is at least partially located in the avoidance space, the pad on the third side is connected to the second part, and the first part and the second part both include a portion of the second side.

6. The camera module according to claim 4, characterized in that: The third side surface and / or the fourth side surface is provided with a groove, and the pad is arranged in the groove.

7. The camera module according to claim 4, characterized in that: The circuit board assembly is located in a space formed by the outer contour of the main body.

8. The camera module according to claim 3, characterized in that: The main body comprises a driving module and a lens. The driving module is electrically connected to the circuit board assembly via the pad, and the driving module is used to drive the lens.

9. The camera module according to claim 1, characterized in that: The circuit board assembly also includes a third circuit board and a fourth circuit board, the fourth circuit board is a flexible circuit board, the third circuit board includes a first connecting surface and a second connecting surface substantially perpendicularly connected to the first connecting surface, the first connecting surface is connected to the second circuit board, the second connecting surface is connected to the fourth circuit board, the third circuit board is stacked with the first circuit board, and the extension direction of the fourth circuit board is substantially parallel to the thickness direction of the third circuit board.

10. An electronic device, characterized in that: include: case; The camera module described in any one of claims 1 to 9 is connected to the shell.

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