Circuit connection system and electronic equipment
By using the design of combining conductive elastic parts and brackets in the circuit connection system, the stress caused by absorption temperature changes is adaptively adjusted, and the problem of fatigue cracking of the solder joints of the crystal oscillator and the printed circuit board is solved, and the long-term reliability of the circuit connection is improved .
Patent Information
- Application Number
- CN202310843972.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-11
- Publication Date
- 2025-01-14
AI Technical Summary
Due to the difference in thermal expansion coefficient of the solder joints between the crystal oscillator and the printed circuit board, the solder joints are repeatedly shear stress during the temperature change, resulting in fatigue and cracking of the solder joints, affecting the long-term reliability of the circuit connection.
The circuit connection system is adopted for combining conductive elastic parts and brackets. One end of the elastic parts is in conductive contact with the crystal oscillator and the other end is electrically connected to the printed circuit board. The elastic parts adaptively adjust the stress changes caused by the absorption temperature change to avoid solder joint fatigue. .
It effectively extends the service life of the circuit connection system, avoids cracking of solder joints, and ensures the normal operation and reliability of the circuit.
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Figure CN119317026A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of circuit connection technology, and in particular to a circuit connection system and electronic equipment. Background Art
[0002] The crystal oscillator is the core device for the CPU to start up and work normally. The crystal oscillator can be installed on the printed circuit board (PCB) using surface mount technology (SMT). However, due to the large difference between the thermal expansion coefficient (CTE) of the base material of the crystal oscillator and the thermal expansion coefficient of the printed circuit board, in actual use, due to changes in the environment and equipment temperature, the base of the crystal oscillator and the printed circuit board will expand differently, causing the solder connecting the two to produce long-term repeated shear stress, causing solder joint fatigue, and ultimately leading to solder joint cracking and failure. Summary of the invention
[0003] The purpose of the present application is to provide a circuit connection system and electronic equipment to solve the problem of solder joint fatigue cracking caused by a crystal oscillator connected by surface mounting on a printed circuit board during long-term temperature changes.
[0004] The first aspect of the present application provides a circuit connection system, which includes a first component, a second component and a bracket, wherein an elastic member is provided on the bracket, the elastic member is made of a conductive material, one end of the elastic member is in conductive contact with the first component, one end of the first component facing away from the elastic member is in contact with the bracket, and the other end of the elastic member is electrically connected to the second component.
[0005] In the present application, there is no physical connection between the first device and the elastic member. When the ambient temperature changes, due to the different expansion states of the first device and the second device, a positional offset will occur between the first device and the second device due to the action of tangential stress. At this time, since there is no physical constraint between the first device and the elastic member, the first device and the elastic member can be adaptively adjusted to absorb stress changes, thereby completely solving the problem of fatigue cracking of the solder joint between the first device and the second device caused by long-term temperature changes, thereby improving the service life of the circuit connection system.
[0006] In a possible implementation manner, a receiving space is provided in the bracket, and the first component is disposed in the receiving space.
[0007] Among them, after the first device is set in the accommodating space, the first device can be protected by the inner wall of the accommodating space. At the same time, it is also convenient to press the first device through the structure on the top of the bracket, so that the first conductive part on the first device can maintain a reliable contact state with the elastic part, thereby ensuring the normal operation of the circuit.
[0008] In a possible implementation, the bracket includes a bottom plate, a side plate and a top plate, the two ends of the side plate are respectively connected to the bottom plate and the top plate, and the bottom plate, the side plate and the top plate enclose the accommodation space; the elastic member is connected to the bottom plate, the first end of the elastic member is arranged in the accommodation space and is in conductive contact with the first device; the second end of the elastic member is arranged outside the bracket for electrical connection with the second device. The bracket has a simple structure, is easy to assemble, and occupies little space.
[0009] In a possible implementation, the bottom plate is provided with a first through hole, and at least a portion of the elastic member is installed in the first through hole. By providing the first through hole on the bottom plate, it is convenient to arrange the elastic member between the first device and the second device, thereby facilitating the reduction of the space for connection between the first device and the second device, facilitating the miniaturization design of the circuit connection system, and facilitating the reduction of the size of the elastic member.
[0010] In one possible implementation, one end of the top plate is rotatably connected to the side plate, and a first protrusion is provided on the top plate, and the first protrusion is used to contact one end of the first device away from the elastic member, so that the first device can be stably pressed on the elastic member to ensure that the first device maintains contact with the elastic member, thereby ensuring the effectiveness of the circuit.
[0011] In a possible implementation, an opening is provided on a side of the bracket, the opening is communicated with the accommodation space, and an end of the first component away from the elastic member contacts the top plate. In the process of assembling the first component into the bracket, the first component can be placed into the accommodation space from the lateral opening of the bracket, thereby facilitating the assembly operation.
[0012] In a possible implementation, the bracket includes a base plate and a side plate, one end of the side plate is connected to the base plate, and the accommodating space is enclosed between the side plate and the base plate, and the end of the side plate away from the base plate is an open end; the inner wall of the side plate is provided with a second protrusion, and the end of the first device away from the elastic member is in contact with the second protrusion.
[0013] Among them, the second protrusion is a material that can undergo a certain elastic deformation. When the first device is installed in the bracket, the first device can be pressed into the bracket from the opening by a certain external force. The first device will first interfere with the second protrusion. The second protrusion will be slightly elastically deformed due to the squeezing of the first device, so that the first device can continue to move into the accommodating space in the bracket. When the part of the first device that interferes with the second protrusion is completely separated from the second protrusion, the second protrusion resumes its deformation and can be pressed on the side of the first device away from the elastic member, so that the projection of the second protrusion in the thickness direction of the first device partially overlaps with the projection of the first device, so that the first device can be reliably pressed on the elastic member to ensure the effectiveness of the circuit between the first device and the elastic member.
[0014] In a possible implementation, a guiding slope is provided on the side of the second protrusion away from the elastic member, and a limiting surface is provided on the side of the second protrusion facing the elastic member, and the limiting surface is used to contact and limit the side of the first component away from the elastic member.
[0015] Among them, when the first component is installed in the accommodating space of the bracket, the guide slope can provide guidance for the movement of the first component to avoid jamming, and at the same time can facilitate the compression and deformation of the second protrusion. When the part on the first component that interferes with the second protrusion is completely separated from the second protrusion, the second protrusion restores the deformation, so that the limiting surface of the second protrusion can be pressed against the first component to ensure the stability of the first component in the bracket, and at the same time ensure that the first component can be in reliable contact with the elastic member.
[0016] In a possible implementation, a soldering pad is provided on the second device, and one end of the elastic member away from the first device is soldered to the soldering pad. The soldering pad can be used as a specific form of the second conductive part described above, and solder paste can be printed on the soldering pad. The elastic member on the bracket can be a metal conductive material, and the second end of the elastic member can be soldered to the soldering pad through solder paste through a reflow soldering process, thereby ensuring a reliable connection and fixation between the elastic member and the second device, and ensuring the effectiveness of the circuit.
[0017] In a possible implementation, one end of the elastic member away from the first device is in conductive contact with the second device. There is no physical connection between the second end of the elastic member and the second conductive portion. When the elastic member and the second device are affected by stress changes, the elastic member and the second device can be adaptively adjusted to absorb the stress changes, thereby completely solving the problem of fatigue cracking of the solder joint between the first device and the second device caused by long-term temperature changes, and improving the service life of the circuit connection system.
[0018] In a possible implementation, the bracket is provided with a fixing portion, and the bracket is fixedly connected to the second device through the fixing portion. The fixing portion may be a structure independently mounted on the bracket, or may be a structure integrally formed with the bracket, and the fixing portion may realize relative fixation of the position of the bracket and the second device, and may ensure that the elastic member and the second conductive portion of the second device maintain a stable contact state, thereby ensuring the circuit validity between the elastic member and the second device.
[0019] In a possible implementation, a second through hole is provided on the second component, a third protrusion is provided on the fixing portion, the fixing portion passes through the second through hole, and the third protrusion is clamped on a side of the second component away from the first component.
[0020] The third protrusion or fixing part has a certain elastic deformation ability. When the bracket and the second device are assembled, the fixing part can be inserted into the second through hole, and in the process of the bracket continuously moving in the direction close to the second device, the third protrusion can be squeezed by the inner wall of the second through hole, so that the third protrusion or fixing part can undergo a certain elastic deformation. When the third protrusion moves to the end extending out of the second through hole away from the first device, the third protrusion or fixing part recovers the deformation, so that the third protrusion can be clamped on the end of the second device away from the first device, thereby ensuring the reliability of the contact between the elastic member and the second conductive part.
[0021] In a possible implementation, the elastic member is a conductive metal material or a conductive non-metallic elastic material. When the elastic member is a metal material, the CTE of the metal material is close to the CTE of the second conductive part, which can ensure that the elastic member and the second conductive part have similar degrees of thermal expansion when affected by the ambient temperature, thereby reducing the risk of cracking of the solder joint. When the elastic member is a conductive non-metallic elastic material, it can be formed into a solid block structure, which can achieve contact and conduction with the first conductive part and the second conductive part at the same time, thereby completely avoiding the adverse problems caused by the solder joint.
[0022] In a possible implementation manner, the first component is a crystal oscillator, and the second component is a printed circuit board.
[0023] In a possible implementation, the elastic member is provided in plurality and is discretely provided between the first device and the second device. Each elastic member has a relatively small volume and a relatively small area of the contact portion with the first device and the second device. Compared with the large-area welding connection between the first device and the second device, when the elastic member with a relatively small area is welded to the second conductive portion of the second device, the stress generated by the change of ambient temperature between the elastic member and the second conductive portion is also relatively small, thereby reducing the stress pulling at the welding portion between the elastic member and the second conductive portion, thereby ensuring the reliability of the connection between the elastic member and the second device and extending the service life.
[0024] The second aspect of the present application also provides an electronic device, which includes the circuit connection system provided by the first aspect of the present application.
[0025] It should be understood that the foregoing general description and the following detailed description are exemplary only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 A schematic diagram of the structure of a circuit connection system provided by an embodiment of the present application;
[0027] Figure 2 A schematic diagram of the structure of a circuit connection system provided in another embodiment of the present application (top plate closed);
[0028] Figure 3 A schematic diagram of the structure of a circuit connection system provided in another embodiment of the present application (with the top plate opened);
[0029] Figure 4 A schematic diagram of the assembly of the bracket and the first device provided in an embodiment of the present application;
[0030] Figure 5 A schematic diagram of the structure of a circuit connection system provided in yet another embodiment of the present application;
[0031] Figure 6 A schematic diagram of the structure of the bracket provided in the embodiment of the present application;
[0032] Figure 7 A schematic diagram of the structure of a circuit connection system provided in yet another embodiment of the present application;
[0033] Figure 8 A schematic diagram of the structure of a circuit connection system provided in another embodiment of the present application;
[0034] Fig. 9 A schematic diagram of the structure of a circuit connection system provided in another embodiment of the present application;
[0035] Fig.10A schematic diagram of the structure of a circuit connection system provided in another embodiment of the present application.
[0036] Reference numerals:
[0037] 1- first device;
[0038] 11- a first conductive portion;
[0039] 12- oscillation circuit;
[0040] 13- base;
[0041] 2- second device;
[0042] 21- a second conductive portion;
[0043] 22- a second through hole;
[0044] 3- Bracket;
[0045] 31- bottom plate;
[0046] 32-side panels;
[0047] 33-top plate;
[0048] 331- first protrusion;
[0049] 34a-opening;
[0050] 34b-opening;
[0051] 35- Accommodation space;
[0052] 36- second protrusion;
[0053] 361-guide ramp;
[0054] 362-limiting surface;
[0055] 37-fixed part;
[0056] 38-third protrusion;
[0057] 4- elastic member;
[0058] 41 - first end;
[0059] 42 - second end;
[0060] 5-Solder paste;
[0061] 6-Structural parts;
[0062] Z-thickness direction.
[0063] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION
[0064] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.
[0065] In the description of this application, unless otherwise clearly specified and limited, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0066] Figure 1 A schematic diagram of a circuit connection system according to an embodiment of the present invention is shown in FIG. Figure 1 The embodiment of the present application provides a circuit connection system, which can be applied to electronic products such as wireless base stations, vehicle-mounted electronics, semiconductors, photovoltaic equipment, aerospace equipment, and medical equipment. The circuit connection system includes a first device 1 and a second device 2, which can be electrically connected through a conductive material to achieve a circuit function.
[0067] Exemplarily, the first device 1 may be a crystal oscillator (hereinafter referred to as crystal oscillator), which may include an oscillation circuit 12 and a base 13, wherein the oscillation circuit 12 is disposed on the base 13, and the second device 2 may be a printed circuit board (PCB), and the base 13 of the crystal oscillator may be electrically connected to the PCB. Of course, in some other embodiments, the first device 1 and the second device 2 may also be other devices with long life and high reliability requirements. In this embodiment, for ease of description, the first device 1 is a crystal oscillator and the second device 2 is a PCB as an example for description.
[0068] When considering electrically connecting a crystal oscillator to a PCB, it is generally considered to weld the crystal oscillator and the PCB to achieve electrical connection. However, the base 13 of the crystal oscillator is generally made of aluminum oxide or aluminum nitride, and the thermal expansion coefficient (CTE) of the material is generally between 6 and 8 ppm / °C, while the PCB is generally made of epoxy resin material, and its comprehensive CTE is generally between 15 and 21 ppm / °C. When welding the base 13 of the crystal oscillator to the PCB, due to the large difference in CTE and serious mismatch, as the temperature changes during the use of the product, the solder joints between the crystal oscillator and the PCB will produce repeated cycles of thermal stress due to CTE mismatch. During long-term use, the solder joints will produce fatigue cracks, thereby affecting the long-term reliability life of the product.
[0069] To this end, in this embodiment, a conductive elastic member 4 is used to achieve connection between the first device 1 and the second device 2 having a large CTE difference, so that at least one end of the elastic member 4 can be in conductive contact with the first device 1, instead of being connected and fixed by welding. As a result, when the ambient temperature changes, the contact position between the first device 1 and the elastic member 4 can be adaptively adjusted, which can completely avoid the problem of solder joint cracking and extend the service life.
[0070] In this embodiment, refer to Figure 1 The circuit connection system includes a bracket 3, on which the elastic member 4 is arranged, the elastic member 4 is a conductive material, one end of the elastic member 4 is in conductive contact with the first device 1, the end of the first device 1 away from the elastic member 4 is in contact with the bracket 3, and the other end of the elastic member 4 is electrically connected to the second device 2. For the sake of convenience, the part of the first device 1 used for conductive contact with the elastic member 4 is defined as the first conductive part 11, and the part of the second device 2 used for electrical connection with the elastic member 4 is defined as the second conductive part 21.
[0071] Among them, the bracket 3 can be pressed on the top of the first device 1 in the thickness direction Z of the first device 1, and at least a part of the first conductive part 11 is arranged at the bottom of the first device 1, and can maintain contact with one end of the elastic member 4. Among them, for the sake of convenience of explanation, the top of the first device 1 can be defined as the end of the first device 1 away from the second device 2, and the bottom of the first device 1 is the end of the first device 1 close to the second device 2. The first device 1 and the second device 2 can be stacked in the vertical direction or arranged side by side in the horizontal direction, and this embodiment does not impose any restrictions on this.
[0072] In the present embodiment, there is no physical connection between the first device 1 and the elastic member 4. When the ambient temperature changes, due to the different expansion states of the first device 1 and the second device 2, a positional offset will occur between the first device 1 and the second device 2 due to the action of the tangential stress. At this time, since there is no physical constraint between the first device 1 and the elastic member 4, the first device 1 and the elastic member 4 can be adaptively adjusted to absorb the stress change, thereby completely solving the problem of fatigue cracking of the solder joint between the first device 1 and the second device 2 caused by long-term temperature changes, and improving the service life of the circuit connection system. At the same time, the elastic force of the elastic member 4 can ensure that the elastic member 4 is in reliable contact with the first device 1, thereby ensuring the normal operation of the circuit.
[0073] In one implementation, the second conductive part 21 of the second device 2 can be fixed to the elastic member 4 by welding, or can be electrically connected to the elastic member 4 by conductive contact. When the second conductive part 21 of the second device 2 is fixed to the elastic member 4 by welding, the CTE of the second conductive part 21 of the second device 2 is close to the CTE of the elastic member 4, that is, the second conductive part 21 and the elastic member 4 are similarly affected by changes in ambient temperature, thereby ensuring the reliability of the connection between the elastic member 4 and the second conductive part 21, and avoiding the problem of fatigue cracking of solder joints. In addition, when the second conductive part 21 of the second device 2 is also in conductive contact with the elastic member 4, the elastic member 4 and the second conductive part 21 can also absorb the stress changes caused by the influence of ambient temperature through adaptive adjustment, thereby extending the service life of the circuit connection system.
[0074] In one implementation, the number of elastic members 4 can be multiple, and the multiple elastic members 4 can be discretely arranged between the first device 1 and the second device 2. Each elastic member 4 has a small volume, and the area of the contact part with the first device 1 and the second device 2 is small. Compared with the large-area welding connection between the first device 1 and the second device 2, when the elastic member 4 with a smaller area is welded to the second conductive part 21 of the second device 2, the stress generated by the change of ambient temperature between the elastic member 4 and the second conductive part 21 is also small, so that the stress pulling at the welding part between the elastic member 4 and the second conductive part 21 can be reduced, so that the reliability of the connection between the elastic member 4 and the second device 2 can be ensured, and the service life can be extended.
[0075] In one implementation, a receiving space 35 is provided in the bracket 3, and the first device 1 is provided in the receiving space 35. After the first device 1 is provided in the receiving space 35, the first device 1 can be protected by the inner wall of the receiving space 35, and it is also convenient to press the first device 1 by the structure at the top of the bracket 3, so that the first conductive part 11 on the first device 1 can maintain a reliable contact state with the elastic member 4, thereby ensuring the normal operation of the circuit.
[0076] In one implementation, the bracket 3 includes a bottom plate 31, a side plate 32 and a top plate, the two ends of the side plate 32 are respectively connected to the bottom plate 31 and the top plate, and the bottom plate 31, the side plate 32 and the top plate enclose the above-mentioned accommodation space 35. The elastic member 4 is connected to the bottom plate 31, the first end 41 of the elastic member 4 is arranged in the accommodation space 35, and is in conductive contact with the first device 1; the second end 42 of the elastic member 4 is arranged outside the bracket 3, and is used to be electrically connected to the second device 2. The bracket 3 has a simple structure, is easy to assemble, and occupies little space. Among them, the bracket 3 can be installed on a circuit board, or on other nearby structures, and the bracket 3 can be an independently designed structure.
[0077] When assembling the circuit connection system, in one embodiment, the first device 1 can be first installed in the accommodating space 35 of the bracket 3, so that the elastic member 4 is in contact with the first conductive portion 11 of the first device 1, and then the bracket 3 and the first device 1 are installed as a whole on the second device 2, so that the elastic member 4 is electrically connected to the second conductive portion 21 of the second device 2. In another embodiment, the bracket 3 can also be first installed on the second device 2, so that the elastic member 4 is electrically connected to the second conductive portion 21 of the second device 2, and then the first device 1 is installed in the accommodating space 35 of the bracket 3.
[0078] In addition, the bracket 3 does not need to be independently designed and processed. For example, the bracket 3 can reuse other nearby structures, so that the elastic member 4 is installed at a partial position of the other structure, and the first device 1 and the second device 2 are connected through the elastic member 4.
[0079] In one implementation, the bottom plate 31 is provided with a first through hole, and at least a portion of the elastic member 4 is installed in the first through hole. The elastic member 4 can pass through the first through hole, so that one end of the elastic member 4 can extend into the accommodating space 35, so as to contact the first conductive part 11 of the first device 1, and the other end of the elastic member 4 is arranged outside the bracket 3, so as to be electrically connected to the second conductive part 21 of the second device 2. Among them, by providing the first through hole on the bottom plate 31, it is convenient to arrange the elastic member 4 between the first device 1 and the second device 2, so as to reduce the space used for connection between the first device 1 and the second device 2, and to realize the miniaturized design of the circuit connection system, and at the same time, it is conducive to reducing the size of the elastic member 4.
[0080] In one implementation, Figure 2 A schematic diagram of a circuit connection system according to another embodiment of the present invention (top panel closed), referring to Figure 2, one end of the top plate is rotatably connected to the side plate 32, and a first protrusion 331 is provided on the top plate, and the first protrusion 331 is used to contact the end of the first device 1 away from the elastic member 4. Among them, the side plate 32 and the bottom plate 31 can be an integrally formed structure, and the side plate 32 can be arranged around the bottom plate 31 so that the side plate 32 and the bottom plate 31 enclose the above-mentioned accommodation space 35, and the side of the side plate 32 away from the bottom plate 31 is an open end, and an opening 34a can be formed on the end of the bracket 3 away from the second device 2. The top plate can rotate relative to the side plate 32, so that the above-mentioned opening 34a can be opened or closed.
[0081] Figure 3 A schematic diagram of a circuit connection system according to another embodiment of the present invention (the top plate is rotated to open), referring to Figure 3 When the first device 1 needs to be installed in the receiving space 35 of the bracket 3, the top plate can be rotated to open, so that the first device 1 can be easily placed in the receiving space 35 from the opening 34a, so that the first conductive part 11 of the first device 1 can contact the elastic member 4. Then, refer to Figure 2 The top plate can be rotated to close the opening 34a, and the first protrusion 331 on the top plate can be pressed on the end of the first device 1 away from the elastic member 4, so that the first device 1 can be stably pressed on the elastic member 4, so that the first conductive part 11 of the first device 1 can reliably contact the elastic member 4, thereby ensuring the normal operation of the circuit.
[0082] In one implementation, Figure 4 This is a schematic diagram of the assembly of the bracket 3 and the first device 1 provided in the embodiment of the present application, referring to Figure 4 The side of the bracket 3 is provided with an opening 34b, and the opening 34b is connected to the accommodation space 35. Figure 1 The end of the first device 1 away from the elastic member 4 is in contact with the top plate, and the top plate can generate a certain pressure on the first device 1, so that the first conductive part 11 of the first device 1 can be pressed against the elastic member 4 to ensure the reliability of the electrical connection between the first conductive part 11 and the elastic member 4.
[0083] In the process of assembling the first device 1 into the bracket 3, the first device 1 can be placed into the accommodation space 35 from the opening 34b on the side of the bracket 3, so as to facilitate the assembly operation. Optionally, as described above, the first device 1 can be placed into the bracket 3 from the opening 34b first, and then the whole formed by the bracket 3 and the first device 1 is electrically connected to the second device 2 through the elastic member 4. Optionally, the bracket 3 can also be electrically connected to the second device 2 through the elastic member 4 first, and then the first device 1 can be placed into the bracket 3 from the opening 34b.
[0084] In one implementation, Figure 5A schematic diagram of a circuit connection system according to another embodiment of the present invention is shown in FIG. Figure 5 The bracket 3 includes a bottom plate 31 and a side plate 32. One end of the side plate 32 is connected to the bottom plate 31, and a receiving space 35 is enclosed between the side plate 32 and the bottom plate 31. The end of the side plate 32 away from the bottom plate 31 is an open end. The open end of the side plate 32 can form an opening 34a on the bracket 3, and the first device 1 can be placed in the bracket 3 through the opening 34a. The inner wall of the side plate 32 is provided with a second protrusion 36, and the end of the first device 1 away from the elastic member 4 contacts the second protrusion 36. The second protrusion 36 is made of a material that can undergo a certain elastic deformation. When the first device 1 is installed in the bracket 3, the first device 1 can be pressed into the bracket 3 from the opening 34a by a certain external force. The first device 1 will first interfere with the second protrusion 36. The second protrusion 36 will undergo a slight elastic deformation due to the squeezing of the first device 1, so that the first device 1 can continue to move into the accommodating space 35 in the bracket 3. When the part of the first device 1 that interferes with the second protrusion 36 is completely separated from the second protrusion 36, the second protrusion 36 resumes its deformation and can be pressed on the side of the first device 1 away from the elastic member 4, so that the projection of the second protrusion 36 in the thickness direction Z of the first device 1 partially overlaps with the projection of the first device 1, so that the first device 1 can be reliably pressed on the elastic member 4, thereby ensuring the effectiveness of the circuit between the first device 1 and the elastic member 4.
[0085] in, Figure 6 The schematic diagram of the structure of the bracket 3 provided in the embodiment of the present application is shown in FIG. Figure 6 A guiding inclined surface 361 is provided on the side of the second protrusion 36 away from the elastic member 4, and a limiting surface 362 is provided on the side of the second protrusion 36 facing the elastic member 4. The limiting surface 362 is used to contact and limit the side of the first device 1 away from the elastic member 4. When the first device 1 is installed in the accommodating space 35 of the bracket 3, the guiding inclined surface 361 can provide guidance for the movement of the first device 1 to avoid jamming, and at the same time, it can facilitate the compression and deformation of the second protrusion 36. When the part of the first device 1 that interferes with the second protrusion 36 is completely separated from the second protrusion 36, the second protrusion 36 recovers its deformation, so that the limiting surface 362 of the second protrusion 36 can be pressed against the first device 1, so as to ensure the stability of the first device 1 in the bracket 3, and at the same time ensure that the first device 1 can reliably contact with the elastic member 4.
[0086] In one implementation, referring to Figure 1, a soldering pad is provided on the second device 2, and one end of the elastic member 4 away from the first device 1 is soldered to the soldering pad. The soldering pad can be used as a specific form of the second conductive part 21 described above, and solder paste 5 can be printed on the soldering pad. The elastic member 4 on the bracket 3 can be a metal conductive material, and the second end 42 of the elastic member 4 can be soldered to the soldering pad through the solder paste 5 through the reflow soldering process, thereby ensuring that the elastic member 4 and the second device 2 are reliably connected and fixed, and ensuring the effectiveness of the circuit.
[0087] In one implementation, one end of the elastic member 4 away from the first device 1 is in conductive contact with the second device 2. In this embodiment, the second end 42 of the elastic member 4 is in conductive contact with the second conductive portion 21 of the second device 2, that is, there is no physical connection between the second end 42 of the elastic member 4 and the second conductive portion 21. When the elastic member 4 and the second device 2 are affected by stress changes, the elastic member 4 and the second device 2 can be adaptively adjusted to absorb the stress changes, thereby completely solving the problem of fatigue cracking of the solder joint between the first device 1 and the second device 2 caused by long-term temperature changes, and improving the service life of the circuit connection system.
[0088] In one implementation, Figure 7 A schematic diagram of a circuit connection system provided in another embodiment of the present application, referring to Figure 7 The bracket 3 is provided with a fixing portion 37, and the bracket 3 is fixedly connected to the second device 2 through the fixing portion 37. The fixing portion 37 can be a structure independently mounted on the bracket 3, or a structure integrally formed with the bracket 3. The fixing portion 37 can realize the relative fixation of the positions of the bracket 3 and the second device 2, and can ensure that the elastic member 4 and the second conductive portion 21 of the second device 2 maintain a stable contact state, thereby ensuring the circuit validity between the elastic member 4 and the second device 2.
[0089] In one implementation, referring to Figure 7 , the second device 2 is provided with a second through hole 22, the fixing portion 37 is provided with a third protrusion 38, the fixing portion 37 is penetrated in the second through hole 22, and the third protrusion 38 is clamped on the side of the second device 2 away from the first device 1. Among them, the third protrusion 38 or the fixing portion 37 has a certain elastic deformation ability. When the bracket 3 and the second device 2 are assembled, the fixing portion 37 can be penetrated into the second through hole 22, and in the process of the bracket 3 continuously moving in the direction close to the second device 2, the third protrusion 38 can be squeezed by the inner wall of the second through hole 22, so that the third protrusion 38 or the fixing portion 37 can undergo a certain elastic deformation. When the third protrusion 38 moves to the end extending out of the second through hole 22 away from the first device 1, the third protrusion 38 or the fixing portion 37 recovers the deformation, so that the third protrusion 38 can be clamped on the end of the second device 2 away from the first device 1, thereby ensuring the reliability of the contact between the elastic member 4 and the second conductive portion 21.
[0090] In some other embodiments, Figure 8 A schematic diagram of a circuit connection system according to another embodiment of the present invention is shown in FIG. Figure 8 The second device 2 is connected to an external structural member 6, and the structural member 6 may be a component outside the circuit connection system, such as a housing of other devices, a bracket 3, and other structures. In this embodiment, the structural member 6 may be used to press on the side of the bracket 3 away from the second device 2, thereby ensuring that the elastic member 4 on the bracket 3 can reliably contact the second device 2 and ensure the circuit effectiveness.
[0091] In some other embodiments, the bracket 3 may also be fixedly connected to the second device 2 by screws to ensure reliable contact between the elastic member 4 and the second conductive portion 21 .
[0092] In one implementation, the elastic member 4 may be a conductive metal material, for example, the elastic member 4 may be a metal spring sheet. Exemplarily, the elastic member 4 is a copper sheet, and the CTE of the copper material is close to the CTE of the PCB. When welding is used between the copper sheet and the soldering pad of the PCB, it can be ensured that the degree of thermal expansion of the copper sheet and the PCB is close when affected by the ambient temperature, thereby reducing the risk of cracking of the solder joints.
[0093] When the elastic member 4 is the metal spring sheet, it can be bent into a desired shape, and a first end 41 for conducting contact with the first device 1 and a second end 42 for electrically connecting with the second device 2 can be bent at both ends of the metal spring sheet. Figure 1 , the elastic member 4 can be bent into a U shape. Fig. 9 A schematic diagram of a circuit connection system according to another embodiment of the present invention is shown in FIG. Fig. 9 , the elastic member 4 can also be bent into a Z shape. Of course, in some other embodiments, the elastic member 4 can also be bent into other regular or irregular shapes, which is not limited in this embodiment.
[0094] In addition, the elastic member 4 may also be a conductive non-metallic elastic material. For example, Fig.10 A schematic diagram of a circuit connection system according to another embodiment of the present invention is shown in FIG. Fig.10 The material of the elastic member 4 can be conductive glue, which can form a block structure with elastic deformation ability. After the bracket 3 is fixed on the second device 2, the two sides of the elastic member 4 can be reliably abutted against the first conductive part 11 and the second conductive part 21 respectively, thereby ensuring the effectiveness of the circuit between the first device 1, the elastic member 4 and the second period.
[0095] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A circuit connection system, characterized in that: include: first device; a second device; A bracket is provided with an elastic member, the elastic member is made of conductive material, one end of the elastic member is in conductive contact with the first device, one end of the first device facing away from the elastic member is in contact with the bracket, and the other end of the elastic member is electrically connected to the second device.
2. The circuit connection system according to claim 1, characterized in that: An accommodating space is arranged in the bracket, and the first component is arranged in the accommodating space.
3. The circuit connection system according to claim 2, characterized in that: The bracket includes a bottom plate, a side plate and a top plate, the two ends of the side plate are respectively connected to the bottom plate and the top plate, and the bottom plate, the side plate and the top plate enclose the accommodation space; The elastic member is connected to the bottom plate, and a first end of the elastic member is disposed in the accommodation space and is in conductive contact with the first device; The second end of the elastic member is arranged outside the bracket and is used for being electrically connected to the second device.
4. The circuit connection system according to claim 3, characterized in that: The bottom plate is provided with a first through hole, and at least a portion of the elastic member is installed in the first through hole.
5. The circuit connection system according to claim 3, characterized in that: One end of the top plate is rotatably connected to the side plate, and a first protrusion is provided on the top plate. The first protrusion is used to contact an end of the first component away from the elastic member.
6. The circuit connection system according to claim 3, characterized in that: An opening is provided on a side of the bracket, the opening is communicated with the accommodating space, and one end of the first component away from the elastic member is in contact with the top plate.
7. The circuit connection system according to claim 2, characterized in that: The bracket comprises a bottom plate and a side plate, one end of the side plate is connected to the bottom plate, and the side plate and the bottom plate enclose the accommodation space, and one end of the side plate away from the bottom plate is an open end; A second protrusion is disposed on the inner wall of the side plate, and one end of the first component away from the elastic member contacts the second protrusion.
8. The circuit connection system according to claim 7, characterized in that: A guiding slope is arranged on the side of the second protrusion away from the elastic member, and a limiting surface is arranged on the side of the second protrusion facing the elastic member, and the limiting surface is used for contacting and limiting with the side of the first component away from the elastic member.
9. The circuit connection system according to any one of claims 1 to 8, characterized in that: A pad is disposed on the second component, and one end of the elastic member away from the first component is welded to the pad.
10. The circuit connection system according to any one of claims 1 to 8, characterized in that: One end of the elastic member away from the first component is in conductive contact with the second component.
11. The circuit connection system according to claim 10, characterized in that: The bracket is provided with a fixing portion, and the bracket is fixedly connected to the second component via the fixing portion.
12. The circuit connection system according to claim 11, characterized in that: The second device is provided with a second through hole, the fixing portion is provided with a third protrusion, the fixing portion passes through the second through hole, and the third protrusion is clamped on a side of the second device away from the first device.
13. The circuit connection system according to any one of claims 1 to 12, characterized in that: The elastic member is made of a conductive metal material or a conductive non-metallic elastic material.
14. The circuit connection system according to any one of claims 1 to 13, characterized in that: The first device is a crystal oscillator, and the second device is a printed circuit board.
15. The circuit connection system according to any one of claims 1 to 14, characterized in that: A plurality of elastic members are provided and are discretely arranged between the first component and the second component.
16. An electronic device, characterized in that: A circuit connection system comprising any one of claims 1-14.