Bonding equipment

Abstract

The embodiment of the invention provides a main pressure bonding device, and relates to the technical field of hot pressure bonding of silicon-based micro display products, the main pressure bonding device comprises a support, the support is provided with a bonding device used for bonding a substrate and a PCB, a first alignment device and a second alignment device used for aligning the substrate and the PCB, and a double-coiling device used for buffering during bonding; the first alignment device is located in front of the bonding device, the second alignment device is located behind the bonding device, and the double-winding device is located below the bonding device. By arranging the double material rolling devices, one or two layers of buffer materials can be selected and used according to product process requirements; the bonding device comprises a horizontal adjusting mechanism which can conveniently adjust the levelness of a pressure head, and further comprises a force measuring mechanism which can perform a pressure test and select the optimal pressure and temperature for bonding after a period of time or when products of different specifications are replaced; and the first alignment device and the second alignment device are arranged at the front and the back, so that high-precision alignment is carried out on the substrate and the PCB, and the final bonding precision is high.

Description

Technical Field

[0001] The present application relates to the technical field of FOB bonding, and in particular to a pressure bonding device. Background Art

[0002] In the field of display panel manufacturing, FOB bonding machine is a kind of machine that uses machine vision alignment, precision motion control and other technologies to bond the printed circuit board PCB and the flexible circuit board FPC through anisotropic conductive film ACF, and achieve fine-pitch PCB and FPC bonding under certain heat and pressure conditions. Before the PCB and FPC are bonded, the FPC and the glass substrate are connected as a whole; during bonding, the glass substrate and part of the PCB are adsorbed and fixed, and the exposed part of the PCB is aligned with the vertical direction of the PPC, and the pressure head and the pressing table cooperate to complete the bonding.

[0003] However, the temperature and pressure required for bonding between glass substrates, FPCs, and PCBs of different specifications are different. Insufficient pressure often results in poor bonding results or excessive temperature scalds the product, resulting in batch defects. Therefore, when performing FOB bonding, a layer of special material such as Teflon is usually laid under the pressure head before the pressure head is pressed down. However, depending on the process requirements, one or two layers of buffer material can be used for buffering before the pressure head is pressed down for bonding. Summary of the invention

[0004] The present invention proposes a pressure bonding device to solve the problem in the prior art that during the pressure bonding process for display panels of different specifications, the temperature of the pressure head is too high, causing burns, or the pressure is insufficient, causing product defects. Therefore, one or two layers of buffer materials are selectively used to buffer the pressure head before the pressure bonding. At the same time, the problem of uneven levelness of the pressure head plane and inappropriate pressure is solved.

[0005] To solve the above problems, the technical solution adopted by the present invention is: A pressure bonding device comprises a bracket, on which a bonding device for bonding a substrate and a PCB, a first alignment device for aligning the substrate and the PCB, a second alignment device, and a double-rolling device for buffering during bonding are arranged; the first alignment device is located in front of the bonding device, the second alignment device is located behind the bonding device, and the double-rolling device is located below the bonding device; The double-rolling device includes a left side plate, a right side plate, and a first rolling unit and a second rolling unit that are independent of each other. The first rolling unit includes a first feeding mechanism for providing a first buffer material, a first driving mechanism for driving the first feeding mechanism, and a first recovery mechanism for recovering the first buffer material; the second rolling unit includes a second feeding mechanism for providing a second buffer material, a second driving mechanism for driving the second feeding mechanism, and a second recovery mechanism for recovering the second buffer material; the first buffer material or the second buffer material passes through the bonding device, or the first buffer material and the second buffer material pass through the bonding device simultaneously and in parallel.

[0006] As a further embodiment of the above, the first feeding mechanism includes a first winding shaft and a first reel for installing the first buffer material; the second feeding mechanism includes a second winding shaft and a second reel for installing the second buffer material, and the first feeding mechanism and the second feeding mechanism are arranged between the left plate and the right plate.

[0007] As a further implementation of the above, the first recovery mechanism includes multiple winding rods and a first recovery rod, the first recovery rod is provided with a first card slot, and after the first buffer material passes around the multiple winding rods, the head end is inserted into the first card slot; the second recovery mechanism includes multiple winding rods and a second recovery rod, the second recovery rod is provided with a second card slot, and after the second buffer material passes around the multiple winding rods, the head end is inserted into the second card slot.

[0008] As a further embodiment of the above, the first driving mechanism includes a first driving member, a first gear, a second gear and a second connecting plate, the first gear is fixed on the main shaft of the first driving member, the first driving member is fixed to the second connecting plate, the second connecting plate is parallel to the outer side of the left side plate, the second gear is connected to the left side of the first recovery rod, and the first gear is meshed with the second gear; The second driving mechanism includes a second driving member, a third gear, a fourth gear and a third connecting plate. The second driving member is connected to the third gear. The second driving member is fixed to the third connecting plate. The third connecting plate is arranged parallel to the outer side of the right side plate. The third gear is fixed on the main shaft of the second driving member. The fourth gear is connected to the left side of the second recovery rod, and the third gear is meshed with the fourth gear.

[0009] As a further implementation of the above, a third bearing is sleeved on the right side of the second recovery rod and the right side plate, a third bearing seat is sleeved on the third bearing, and the third bearing seat is clamped on the right side plate; a fourth bearing is sleeved on the left side of the second recovery rod and the left side plate, a fourth bearing seat is sleeved on the fourth bearing, and the fourth bearing seat is clamped on the left side plate.

[0010] As a further implementation of the above, the first recovery mechanism includes a first detection component for detecting the use length of the first buffer material; the second recovery mechanism includes a second detection component for detecting the use length of the second buffer material.

[0011] As a further implementation of the above, the bonding device includes a heating mechanism, a horizontal adjustment mechanism, a force measuring mechanism, a third driving mechanism, and a fourth driving mechanism. The heating mechanism includes a pressure head for bonding and a heating block fixed above the pressure head. Insulation plates for heat insulation are provided above and behind the heating block. A plurality of embedding holes are provided in the middle of the heating block, and a plurality of first adjustment holes are provided in the upper part of the heating block, and a plurality of heating elements are embedded in the embedding holes. The horizontal adjustment mechanism includes a horizontal adjustment plate and a horizontal adjustment element. A plurality of second adjustment holes are provided on the horizontal adjustment plate, and the first adjustment hole corresponds to the second adjustment hole in the vertical direction. The horizontal adjustment element is installed on the horizontal adjustment plate through the second adjustment hole, and the bottom of the second adjustment hole is embedded in the embedding hole and connected to the heating block.

[0012] As a further embodiment of the above, the third driving mechanism includes a third driving member, a first guide rail, and a first mounting plate. The third driving member is arranged above the bracket, the first mounting plate is arranged on the front of the bracket, and the first mounting plate is provided with the first guide rail; the fourth driving mechanism includes a fourth driving member, a second guide rail, a second mounting plate, a third mounting plate, a fourth mounting plate, and a fifth mounting plate. The second mounting plate is fixed on the first guide rail, the second guide rail is fixed on the second mounting plate, the third mounting plate is arranged parallel to the heating block, the fourth mounting plate is arranged between the third mounting plate and the heating block, and the third mounting plate and the heating block are fixedly connected. The fourth driving member is fixed on the third mounting plate, the fifth mounting plate is fixed on the second guide rail, and the third mounting plate, the fourth mounting plate and the heating block are fixed on the fifth mounting plate. The third driving member and the first guide rail drive the pressure head to perform the first step of vertical movement in the vertical direction, and the fourth driving member and the second guide rail drive the pressure head to perform the second step of vertical movement in the vertical direction.

[0013] As a further implementation of the above, the force measuring mechanism includes a pressure seat, a pressure gauge, a third connecting rod, a sixth mounting plate, and a pressing piece. The pressure seat is fixed on the first mounting plate and is located above the fourth driving member. The pressure gauge is fixed on the pressure seat. The sixth mounting plate is provided above the pressure seat. The pressing piece is fixed in the middle of the sixth mounting plate. The sixth mounting plate is provided parallel to the fourth mounting plate in a vertical direction. The sixth mounting plate is fixedly connected to the fourth mounting plate by the third connecting rod. When measuring pressure, the pressing piece directly contacts the pressure gauge.

[0014] As a further implementation of the above, the first alignment device includes a fifth driving mechanism and a first image processing mechanism, the fifth driving mechanism includes a fifth driving member and a third guide rail, the first image processing mechanism includes a first camera, a first light source and a controller, the first camera is connected to the first light source, the first camera is fixedly connected to the third guide rail, the fifth driving member is connected to the third guide rail, the first camera shoots the marking points of the substrate, the first light source provides light, and the controller receives image information; the second alignment device includes a second image processing mechanism and a sixth driving mechanism, the sixth driving mechanism includes a sixth driving member and a fourth guide rail, the second image processing mechanism includes a second light source and a second camera, the second light source is fixedly connected to the second camera, the fourth guide rail is connected to the sixth driving member, and the second camera is connected to the fourth guide rail; the second light source provides light, the second camera shoots the marking points of the PCB, and the controller receives the relative position of the PCB and the substrate for compensation to complete the correction.

[0015] As a further implementation of the above, a plurality of fifth guide rails are further provided at the bottom of the bracket, a seventh driving member is provided on the fourth connecting plate, a plurality of fifth connecting plates and a sixth connecting plate are fixed on the fifth guide rail, the fifth connecting plate is connected to the second connecting plate, the sixth connecting plate is connected to the third connecting plate, and a plurality of buffer members are further provided under the fifth guide rail. When the seventh driving member drives the fifth guide rail to move in a vertical direction, the fifth connecting plate and the bottom of the sixth connecting plate directly contact the buffer member to perform a buffering action.

[0016] As a further implementation of the above, the first feeding mechanism includes a blowing rod, and the blowing rod is provided with a plurality of blowing holes, and the blowing holes blow toward the bonding area between the substrate and the PCB.

[0017] As a further implementation of the above, the first recovery mechanism includes a first limit assembly, a second limit assembly and a third limit assembly, and the first limit assembly and the second limit assembly simultaneously limit the vertical movement of the two ends of the first recovery rod; the third limit assembly limits the front and rear movement of the first recovery rod; the second recovery mechanism includes a fourth limit assembly, a fifth limit assembly and a sixth limit assembly, and the fourth limit assembly and the fifth limit assembly limit the vertical movement of the two ends of the second recovery rod; the sixth limit assembly limits the front and rear movement of the second recovery rod.

[0018] As a further implementation of the above, a first damper is provided in the middle sleeve of the first winding shaft, a first damping cover is provided on the first winding shaft, the first reel includes a plurality of first mounting holes and a second mounting hole, the first damper and the first damping cover are connected through the first mounting hole, a plurality of first flat areas are provided on the outer surface of the first reel, a first elastic member is provided on the first flat area, and the first elastic member is fixed to the outer surface of the first reel through the second mounting hole.

[0019] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides a pressure bonding device, which can select one or two layers of buffer material according to product process requirements by setting a double coil device; the bonding device includes a horizontal adjustment mechanism, which can conveniently adjust the horizontality of the pressure head, and also includes a force measuring mechanism, which can first perform a pressure test after a period of time or when different specifications of products are replaced, and select the optimal pressure and temperature bonding solution; a first alignment device and a second alignment device are set at the front and back to perform high-precision alignment on the substrate and the PCB board, so that the final bonding accuracy is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solution proposed in the present invention, it is described in detail below in combination with the embodiments and drawings. It should be understood that the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, these drawings can be changed under the concept of the present invention.

[0021] Figure 1 An assembly stereogram of the pressure bonding device provided by the present invention; Figure 2 A partial assembly stereogram from another perspective of the pressure bonding device provided by the present invention; Figure 3 A partial assembly perspective view of the double-rolling device provided by the present invention; Figure 4 A partially enlarged assembly stereogram of the double-rolling device provided by the present invention; Figure 5A partial assembly stereogram from another perspective of the double-rolling device provided by the present invention; Figure 6 A partial assembly perspective view of the double-rolling device provided by the present invention; Figure 7 A three-dimensional diagram of the assembly of the first tape reel provided by the present invention; Figure 8 An assembly stereogram of the first reel provided by the present invention; Fig. 9 An assembly stereogram of the bracket provided by the present invention; Fig.10 An assembly stereogram of a first alignment device provided by the present invention; Fig.11 An assembly stereogram of a second alignment device provided by the present invention; Fig.12 The present invention is a three-dimensional assembly diagram of the bonding device provided by the present invention.

[0022] 1. Bracket; 101. Fifth guide rail; 102. Seventh driving member; 103. Fifth connecting plate; 104. Sixth connecting plate; 105. Buffer member; 106. Left side plate; 1061. First connecting rod; 1062. Second connecting rod; 1063. First connecting plate; 107. Right side plate; 2. Double winding device; 201. First winding shaft; 2011. First mounting hole; 2012. Second mounting hole; 2013. First elastic member; 2014. First flat area; 2015. First buffer material; 202. First retaining ring; 203. First reel; 204. Second retaining ring; 205. First damping cover; 206. Third retaining ring; 207. First winding rod; 207 1. Fourth retaining ring; 208. Second winding rod; 209. Blowing rod; 211. Third winding rod; 212. Fourth winding rod; 213. Fifth winding rod; 214. First recovery rod; 2141. First elongated groove; 2151. First stop block; 2152. First moving block; 2161. Second stop block; 2162. Second moving block; 2171. First limiting member; 2172. First damping guide rod; 2173. First damping seat; 2174. First elastic limiting member; 2181. First code disk; 2182. First detection member; 221. First driving member; 222. First gear; 223. Second gear; 224. Second connecting plate; 225. Third 1. a connecting plate; 231. a second take-up shaft; 2311. a second buffer material; 232. a second reel; 233. a sixth take-up rod; 234. a seventh take-up rod; 235. an eighth take-up rod; 241. a ninth take-up rod; 242. a tenth take-up rod; 243. a second recovery rod; 2431. a second elongated groove; 2461. a second stopper; 2462. a second damping guide rod; 2463. a second elastic stopper; 2471. a second detection member; 2472. a second code disk; 251. a second drive member; 252. a fourth gear; 253. a fourth connecting plate; 3. a bonding device; 301. a third drive member; 302. a first guide rail; 303. a first mounting plate; 311. a Four driving members; 312, second guide rail; 313, second mounting plate; 314, third mounting plate; 315, fourth mounting plate; 316, fifth mounting plate; 321, heating block; 322, heat insulation plate; 323, heating member; 331, horizontal adjustment plate; 332, horizontal adjustment member; 341, pressure seat; 342, pressure gauge; 343, third connecting rod; 344, pressing member; 345, sixth mounting plate; 4, first alignment device; 401, first light source; 402, first camera; 411, fifth driving member; 412, third guide rail; 5, second alignment device; 501, second light source; 502, second camera; 511, sixth driving member; 512, fourth guide rail. DETAILED DESCRIPTION

[0023] The present invention provides a pressure bonding device, comprising: a bracket 1, on which a bonding device 3 is provided for bonding a substrate and a PCB; a first alignment device 4, which performs alignment by photographing a marking point of the substrate; a second alignment device 5, which performs alignment by photographing a marking point of the PCB; a double-roll device 2, which is used for buffering by a single layer or a double layer of buffer material before the bonding device 3 performs bonding; the first alignment device 4 is arranged in front of the bonding device 3, the second alignment device 5 is arranged behind the bonding device 3, and the double-roll device 2 is arranged below the bonding device 3.

[0024] Please also read Figure 1-Figure 2 In this embodiment, the double-rolling device 2 includes a first rolling unit and a second rolling unit. The first rolling unit includes a first buffer material 2015, a first feeding mechanism for providing the first buffer material 2015, a first driving mechanism for driving the first feeding mechanism, and a first recovery mechanism for recovering the first buffer material 2015; the second rolling unit includes a second buffer material 2311, a second feeding mechanism for providing the second buffer material 2311, a second driving mechanism for driving the second feeding mechanism, and a second recovery mechanism for recovering the second buffer material 2311.

[0025] Please also read Figure 7-Figure 8The left side plate 106 and the right side plate 107 are connected by a first connecting rod 1061, a second connecting rod 1062, and a first connecting plate 1063, and are fixed at the front section, the middle section, and the rear section respectively. When a layer of buffer material is selected to be used, the first tape reel 201 stuck between the left plate 106 and the right plate 107 is taken out, and the first reel 203 is installed on the first tape reel 201, and the first reel 201 and the first reel 203 are fixed by the first retaining ring 202 and the second retaining ring 204 to prevent the first reel 203 from moving axially along the first tape reel 201. The inner diameter of the first retaining ring 202 is larger than the diameter of the first tape reel 201 and the outer diameter is smaller than the inner diameter of the first reel 203. The inner diameter of the second retaining ring 204 is larger than the diameter of the first tape reel 201 and the outer diameter is smaller than the outer diameter of the first retaining ring 202. After the first retaining ring 202 is installed on both sides of the first reel 203, the second retaining ring 204 is inserted into both sides of the first tape reel 201 and fixed; a first damper is sleeved in the middle of the first tape reel 201, and a There is a first damping cover 205, the first reel 203 includes a plurality of second mounting holes 2012 and the second mounting holes 2012, the first damper is connected to the first damping cover 205 through the second mounting holes 2012, the outer surface of the first reel 203 is provided with a plurality of first grooves, the bottom surface of the first groove is provided with a first elastic member 2013, the first elastic member 2013 is fixedly installed on the bottom surface of the first groove through the second mounting holes 2012, and the first elastic member 2013 is slightly higher than the outer surface of the first reel 203, when the first buffer material 2015 is installed, the inner wall of the first buffer material 2015 is supported by the first elastic member 2013, and third retaining rings 206 for fixing the first buffer material 2015 are provided on both sides of the first reel 203, and the third retaining rings 206 can be adjusted in the X direction according to the width of the first buffer material 2015. A first damper is provided in the middle sleeve of the first winding shaft 201, a first damping cover 205 is provided on the first winding shaft 201, the first reel 203 includes a plurality of first mounting holes 2011 and second mounting holes 2012, the first damper and the first damping cover 205 are connected via the first mounting holes 2011, a plurality of first flat areas 2014 are provided on the outer surface of the first reel 203, a first elastic member 2013 is provided on the first flat area 2014, and the first elastic member 2013 is fixed to the outer surface of the first reel 203 via the second mounting holes 2012.

[0026] Please also read Figure 3 , Figure 5 , Figure 6In this embodiment, the first feeding mechanism includes a blowing rod 209, a first tape rod 207, and a second tape rod 208. The first recovery mechanism includes a third tape rod 211, a fourth tape rod 212, a fifth tape rod 213, and a first recovery rod 214. The first tape rod 207 is sleeved with a fourth retaining ring 2071 for limiting the first buffer material 2015. When the first buffer material 2015 bypasses the first tape rod 207, according to the width of the first buffer material 2015, the fourth retaining ring 2071 is used to limit the first buffer material 2015. The positions of both sides can be adjusted along the X direction. The first recycling rod 214 is provided with a first elongated groove 2141. The starting section of the recycled first buffer material 2015 enters the first elongated groove 2141. The first buffer material 2015 is rolled and recycled through the first recycling rod 214. The first buffer material 2015 passes through the lower surfaces of the first roll-up rod 207 and the second roll-up rod 208, the upper surface of the third roll-up rod 211, the lower surface of the fourth roll-up rod 212, and the upper surface of the fifth roll-up rod 213. The blowing rod 209 is provided with a plurality of The blowing hole is provided with a blow hole, and the blowing direction of the blow hole is adjusted by rotating the blow rod 209 to blow the blow hole toward the bonding area between the substrate and the PCB; the first roll rod 207 is located obliquely below the first roll drum 203, the blow rod 209 is located below the first roll rod 207 and in front of the first roll rod 207, the second roll rod 208 is located behind the first roll rod 207 and is higher than the first roll rod 207, the third roll rod 211 is located behind the second roll rod 208 and is higher than the second roll rod 208, and the fourth roll rod 212 is located behind the third roll rod 211 The fifth tape rod 213 is located behind the fourth tape rod 212 and in front of the first recovery rod 214, and is higher than the fourth tape rod 212 and the first recovery rod 214; a first bearing is sleeved at the left side of the first recovery rod 214 and the fixed part of the left plate 106, a first bearing seat is sleeved on the first bearing, and the first bearing seat is clamped on the left plate 106; a second bearing is sleeved at the right side of the first recovery rod 214 and the fixed part of the right plate 107, a second bearing seat is sleeved on the second bearing, and the second bearing seat is clamped on the right plate 107; The first driving mechanism includes a first driving member 221, a first gear 222, a second gear 223, and a second connecting plate 224. The first driving member 221 is connected to the first gear 222, and the first driving member 221 is fixed to the second connecting plate 224. The second connecting plate 224 is arranged in parallel on the outer side of the left side plate 106. The second gear 223 is connected to the outer end of the first recovery rod 214. The first gear 222 is fixedly connected to the main shaft of the first driving member 221. The first gear 222 and the second gear 223 are meshed for transmission, driving the first recovery rod 214 to rotate clockwise to wind and recycle the used first buffer material 2015.

[0027] Please also read Figure 4The first recovery mechanism includes a first limiting assembly, a second limiting assembly, and a third limiting assembly. The first limiting assembly includes a first stop block 2151 and a first moving block 2152. The first stop block 2151 is fixed on the left side plate 106, and the first moving block 2152 is fixed on the first stop block 2151. The first moving block 2152 is in contact with the first bearing seat and the contact area can be adjusted; the second limiting assembly includes a second stop block 2161 and a second moving block 2162. The second stop block 2161 is fixed on the right side plate 107, and the second moving block 2162 is fixed on the second stop block 2161. The second moving block 2162 is in contact with the second bearing seat and the contact area can be adjusted. When the first buffer material 2015 is moved at a fixed length, the first limiting assembly and the second limiting assembly simultaneously limit the first recovery rod 214 on both sides to prevent the first recovery rod 214 from being displaced upward, causing Slipping; the third limiting assembly includes a first damping guide rod 2172, a first damping seat 2173, a first elastic limiting member 2174, and a first limiting member 2171. The first damping seat 2173 is fixed to the inner side of the right side plate 107, the first damping guide rod 2172 and the first elastic limiting member 2174 are fixed to the first damping seat 2173, the first elastic limiting member 2174 is vertically connected to the first damping guide rod 2172, and one end of the first limiting member 2171 is fixed to the first connecting plate 1063. When the first recovery rod 214 recovers all the first buffer material 2015 and extracts it, one end of the first elastic limiting member 2174 supports the first recovery rod 214, and the other end of the first limiting member 2171 supports the first damping guide rod 2172 to prevent the first recovery rod 214 from moving forward and backward during material change, which is convenient for material change. The relative distance between the first limiting member 2171 and the first damping guide rod 2172 is adjustable.

[0028] The first recovery mechanism includes a first detection component for detecting the usage length of the first buffer material 2015, the first detection component includes a first code disk 2181 and a first detection member 2182, the first code disk 2181 is fixedly connected to the fifth winding rod 213 and is arranged on the left side of the left side plate 106, and a first detection member 2182 for reading the rotation amount of the first code disk 2181 is arranged above the first code disk 2181.

[0029] In this embodiment, when a double-layer buffer material is selected to be used, after the first feeding mechanism is installed, the second take-up shaft 231 stuck between the left plate 106 and the right plate 107 is taken out, and the second reel 232 is installed on the second take-up shaft 231, and the second damping cover and the second damper are installed through the third mounting hole, and the second elastic member is installed through the fourth mounting hole on the plurality of flat areas on the outer surface of the second reel 232, and the second take-up shaft 231 and the second reel 232 are fixed with the fifth and sixth retaining rings, and the second buffer material 2311 is installed on the second reel 232, and the second elastic member supports the inner wall of the second buffer material 2311 to prevent the generation of excess space shaking inside, and the seventh retaining ring fixes the second reel 232 and the second buffer material 2311 to prevent the second buffer material 2311 from shaking in the X direction.

[0030] After the second buffer material 2311 is installed, the second buffer material 2311 is passed around the upper surface of the sixth winding rod 233, around the lower surfaces of the seventh winding rod 234 and the eighth winding rod 235, around the upper surfaces of the ninth winding rod 241 and the tenth winding rod 242, and the starting end of the recovered second buffer material 2311 is wound into the second elongated groove 2431 and wound around the second recovery rod 243; a third bearing is sleeved at the right side of the second recovery rod 243 and the right side plate 107, a third bearing seat is sleeved on the third bearing, and the third bearing seat is clamped on the right side plate 107, and a third bearing seat is sleeved at the left side of the second recovery rod 243 and the left side plate 106. There is a fourth bearing, a fourth bearing seat is sleeved on the fourth bearing, and the fourth bearing seat is stuck in the left plate 106; the second driving member 251 is fixed to the third connecting plate 225, the third connecting plate 225 is located on the outer side of the right plate 107 and is parallel to the right plate 107, the fourth gear 252 is connected to the left side of the second recovery rod 243, the third gear is fixedly installed on the main shaft of the second driving member 251, the third gear and the fourth gear 252 are meshed and driven to drive the second recovery rod 243 to rotate clockwise, and the used second buffer material 2311 is wound and recovered, and the second damper will generate a reaction force to tighten the flat The second buffer material 2311; the third stop block is fixed on the right side plate 107, the third moving block is fixed on the third stop block, the third moving block is in contact with the third bearing seat and the contact area can be adjusted, the fourth stop block is fixed on the left side plate 106, the fourth moving block is fixed on the fourth stop block, the fourth moving block is in contact with the fourth bearing seat and the contact area can be adjusted, the second damping guide rod 2462 and the second elastic limiting member 2463 are fixed on the second damping seat, one end of the second elastic limiting member 2463 supports the second recovery rod 243, the second elastic limiting member 2463 is vertically connected to the second damping guide rod 2462, the first The second limit member 2461 is arranged on the second connecting plate 224, and one end of the first limit member 2171 supports the second damping guide rod 2462 to complete the three-step limit; when the second buffer material 2311 is used up, when the operator pulls out the second buffer material 2311 from the second recovery rod 243, the second recovery rod 243 will not be positionally shifted or loosened due to the three-step limit; a second code disk 2472 is fixed on one side of the ninth winding rod 241 and is arranged between the right side plate 107 and the third connecting plate 225. The second detection member 2471 can feedback the usage length of the second buffer material 2311 by reading the rotation amount of the second code disk 2472.

[0031] Please also read Fig. 9In this embodiment, a plurality of fifth guide rails 101 are further provided at the bottom of the bracket 1, a seventh driving member 102 is provided on the fourth connecting plate 253, a plurality of fifth connecting plates 103 and a sixth connecting plate 104 are fixed on the fifth guide rail 101, the fifth connecting plate 103 is connected to the second connecting plate 224, the sixth connecting plate 104 is connected to the third connecting plate 225, and a plurality of buffer members 105 are further provided under the fifth guide rail 101. When the seventh driving member 102 drives the fifth guide rail 101 to move in a vertical direction, the bottom of the fifth connecting plate 103 and the sixth connecting plate 104 directly contact the buffer member 105 for buffering action, thereby reducing the vibration caused by the descent and affecting the use of the first buffer material 2015 and the second buffer material 2311, and adjusting the distance between the buffer material and the substrate and the pressure head through the fifth guide rail 101.

[0032] Please also read Fig.12 In this embodiment, the heating mechanism includes a pressure head for bonding, a heating block 321 fixed above the pressure head, a heat insulation plate 322 for heat insulation is provided above and behind the heating block 321, a plurality of embedding holes are provided in the middle of the heating block 321, a plurality of first adjustment holes are provided in the upper part of the heating block 321, a plurality of heating elements 323 are embedded in the embedding holes, and the heating elements 323 generate heat and transfer heat to the pressure head; the horizontal adjustment mechanism includes a horizontal adjustment plate 331 and a horizontal adjustment element 332, a plurality of second adjustment holes are provided on the horizontal adjustment plate 331, the first adjustment holes correspond to the second adjustment holes in the vertical direction, the horizontal adjustment element 332 is installed on the horizontal adjustment plate 331 through the second adjustment holes, and the bottom of the second adjustment hole is embedded in the embedding hole and connected to the heating block 321.

[0033] Before bonding, the pressure head is quickly heated to the target temperature through the heating element 323 embedded in the heating block 321, and the heat is transferred to the pressure head below. The heating block 321 is insulated and kept warm by the insulation board 322 to prevent excessive heat from affecting surrounding components, and the heating block 321 is further insulated to prevent heat diffusion.

[0034] The horizontal adjustment mechanism includes a horizontal adjustment plate 331 and a horizontal adjustment member 332. The horizontal adjustment plate 331 is provided with a plurality of second adjustment holes. The first adjustment holes correspond to the second adjustment holes in the vertical direction. The horizontal adjustment member 332 is installed on the horizontal adjustment plate 331 through the second adjustment holes. The bottom of the second adjustment hole is embedded in the embedding hole and connected to the heating block 321.

[0035] When it is found that the bottom surface of the pressure head is uneven, the level adjustment can be completed by quickly adjusting the height of the level adjustment member 332. Sufficient space is left above the level adjustment member 332, which is convenient for the operator to adjust.

[0036] In this embodiment, the third driving mechanism includes a third driving member 301, a first guide rail 302, and a first mounting plate 303. The third driving member 301 is arranged above the bracket 1. The first mounting plate 303 is arranged on the front of the bracket 1, and the first mounting plate 303 is arranged on the first guide rail 302; the fourth driving mechanism includes a fourth driving member 311, a second guide rail 312, a second mounting plate 313, a third mounting plate 314, a fourth mounting plate 315, and a fifth mounting plate. The second mounting plate 313 is fixed on the first guide rail 302, and the second guide rail 312 is fixed on the second On the mounting plate 313, the third mounting plate 314 is arranged parallel to the heating block 321, the fourth mounting plate 315 is arranged between the third mounting plate 314 and the heating block 321, and is fixedly connected to the third mounting plate 314 and the heating block 321, the fourth driving member 311 is fixed to the third mounting plate 314, the fifth mounting plate is fixed to the second guide rail 312, the third mounting plate 314, the fourth mounting plate 315 and the heating block 321 are fixed to the fifth mounting plate, and a plurality of heat insulation plates 322 are arranged around the heating block 321, except for the connection of the pressure head of the heating block 321. The third driving member 301 and the first guide rail 302 drive the pressure head to perform the first step of vertical movement in the vertical direction, and the fourth driving member 311 and the second guide rail 312 drive the pressure head to perform the second step of vertical movement in the vertical direction.

[0037] In this embodiment, the force measuring mechanism includes a pressure seat 341, a pressure gauge 342, a third connecting rod 343, a sixth mounting plate 345, and a pressing piece 344. The pressure seat 341 is fixed on the first mounting plate 303 and is located above the fourth driving member 311. The pressure gauge 342 is fixed on the pressure seat 341. A sixth mounting plate 345 is provided above the pressure seat 341. A pressing piece 344 is fixed in the middle of the sixth mounting plate 345. The sixth mounting plate 345 is arranged parallel to the fourth mounting plate 315 in a vertical direction. The sixth mounting plate 345 and the fourth mounting plate 315 are fixedly connected by the third connecting rod 343. When measuring pressure, the pressing piece 344 directly contacts the pressure gauge 342. After a period of time or when changing to products of different specifications, the pressure seat 341 and the pressure gauge 342 are quickly fixed on the first mounting plate 303. When the third driving member 301 and the fourth driving member 311 drive the pressure head to move vertically, the pressing member 344 presses against the pressure gauge 342 to observe whether the feedback pressure value of the pressure gauge 342 meets the requirements.

[0038] Please also read Figure 10-11In this embodiment, the first alignment device 4 includes a fifth driving mechanism and a first image processing mechanism. The fifth driving mechanism includes a fifth driving member 411 and a third guide rail 412. The first image processing mechanism includes a first camera 402, a first light source 401 and a controller. The first camera 402 is connected to the first light source 401. The first camera 402 is fixedly connected to the third guide rail 412. The fifth driving member 411 is connected to the third guide rail 412. The first camera 402 shoots the marking point of the substrate, the first light source 401 provides light, and the controller receives the image information. The alignment device 5 includes a second image processing mechanism and a sixth driving mechanism. The sixth driving mechanism includes a sixth driving member 511 and a fourth guide rail 512. The second image processing mechanism includes a second light source 501 and a second camera 502. The second light source 501 is fixedly connected to the second camera 502. The fourth guide rail 512 is connected to the sixth driving member 511. The second camera 502 is connected to the fourth guide rail 512. The second light source 501 provides light, and the second camera 502 shoots the marking points of the PCB. The controller receives the relative position of the PCB and the substrate for compensation to complete the correction.

[0039] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0041] The above is a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A pressure bonding device, comprising a bracket (1), characterized in that: The bracket (1) is provided with a bonding device (3) for bonding the substrate and the PCB, a first alignment device (4) and a second alignment device (5) for aligning the substrate and the PCB, and a double-rolling device (2) for buffering during bonding; the first alignment device (4) is located in front of the bonding device (3), the second alignment device (5) is located behind the bonding device (3), and the double-rolling device (2) is located below the bonding device (3); The double-rolling device (2) includes a left side plate (106), a right side plate (107) and a first rolling unit and a second rolling unit that are independent of each other, wherein the first rolling unit includes a first feeding mechanism for providing a first buffer material (2015), a first driving mechanism for driving the first feeding mechanism, and a first recovery mechanism for recovering the first buffer material (2015); the second rolling unit includes a second feeding mechanism for providing a second buffer material (2311), a second driving mechanism for driving the second feeding mechanism, and a second recovery mechanism for recovering the second buffer material (2311); the first buffer material (2015) or the second buffer material (2311) passes through the bonding device (3) or the first buffer material (2015) and the second buffer material (2311) pass through the bonding device (3) at the same time and in parallel.

2. The pressure bonding device according to claim 1, characterized in that: The first feeding mechanism comprises a first winding shaft (201) and a first reel (203) on which the first buffer material (2015) is installed; the second feeding mechanism comprises a second winding shaft (231) and a second reel (232) on which the second buffer material (2311) is installed, and the first feeding mechanism and the second feeding mechanism are arranged between the left plate (106) and the right plate (107).

3. The pressure bonding device according to claim 2, characterized in that: The first recovery mechanism comprises a plurality of winding rods and a first recovery rod (214), the first recovery rod (214) being provided with a first card slot, and the head end of the first buffer material (2015) being inserted into the first card slot after passing around the plurality of winding rods; the second recovery mechanism comprises a plurality of winding rods and a second recovery rod (243), the second recovery rod (243) being provided with a second card slot, and the head end of the second buffer material (2311) being inserted into the second card slot after passing around the plurality of winding rods.

4. The pressure bonding device according to claim 3, characterized in that: The first driving mechanism comprises a first driving member (221), a first gear (222), a second gear (223) and a second connecting plate (224); the first gear (222) is fixedly arranged on the main shaft of the first driving member (221); the first driving member (221) is fixed to the second connecting plate (224); the second connecting plate (224) is arranged parallel to the outer side of the left side plate (106); the second gear (223) is connected to the left side of the first recovery rod (214); the first gear (222) is meshed with the second gear (223); The second driving mechanism comprises a second driving member (251), a third gear, a fourth gear (252) and a third connecting plate (225); the second driving member (251) is connected to the third gear; the second driving member (251) is fixed to the third connecting plate (225); the third connecting plate (225) is arranged parallel to the outer side of the right side plate (107); the third gear is fixed to the main shaft of the second driving member (251); the fourth gear is connected to the left side of the second recovery rod (243); and the third gear is meshed with the fourth gear (252).

5. The pressure bonding device according to claim 4, characterized in that: A third bearing is sleeved on the right side of the second recovery rod (243) where it is fixed to the right side plate (107), a third bearing seat is sleeved on the third bearing, and the third bearing seat is clamped on the right side plate (107); a fourth bearing is sleeved on the left side of the second recovery rod (243) where it is fixed to the left side plate (106), a fourth bearing seat is sleeved on the fourth bearing, and the fourth bearing seat is clamped on the left side plate (106).

6. The pressure bonding device according to claim 5, characterized in that: The first recovery mechanism comprises a first detection component for detecting the use length of the first buffer material (2015); the second recovery mechanism comprises a second detection component for detecting the use length of the second buffer material (2311).

7. The pressure bonding device according to claim 1, characterized in that: The bonding device (3) comprises a heating mechanism, a horizontal adjustment mechanism, a force measuring mechanism, a third driving mechanism, and a fourth driving mechanism. The heating mechanism comprises a pressure head for bonding and a heating block (321) fixed above the pressure head. A heat insulation plate (322) for heat insulation is provided above and behind the heating block (321). A plurality of embedding holes is provided in the middle of the heating block (321). A plurality of first adjustment holes is provided in the upper part of the heating block (321). A plurality of heating elements (323) are embedded in the embedding holes. The horizontal adjustment mechanism comprises a horizontal adjustment plate (331) and a horizontal adjustment element (332). A plurality of second adjustment holes are provided on the horizontal adjustment plate (331). The first adjustment holes correspond to the second adjustment holes in the vertical direction. The horizontal adjustment element (332) is installed on the horizontal adjustment plate (331) through the second adjustment holes. The bottom of the second adjustment hole is embedded in the embedding hole and connected to the heating block (321).

8. The pressure bonding device according to claim 7, characterized in that: The third driving mechanism comprises a third driving member (301), a first guide rail (302), and a first mounting plate (303); the third driving member (301) is arranged above the bracket (1); the first mounting plate (303) is arranged on the front of the bracket (1); the first mounting plate (303) is arranged on the first mounting plate (303); the fourth driving mechanism comprises a fourth driving member (311), a second guide rail (312), a second mounting plate (313), a third mounting plate (314), a fourth mounting plate (315) and a fifth mounting plate (316); the second mounting plate (313) is fixed on the first guide rail (302); the second guide rail (312) is fixed on the second mounting plate (313); the third mounting plate (314) is arranged parallel to the heating block (321) ), the fourth mounting plate (315) is arranged between the third mounting plate (314) and the heating block (321), and fixedly connects the third mounting plate (314) and the heating block (321); the fourth driving member (311) is fixed on the third mounting plate (314), the fifth mounting plate (316) is fixed on the second guide rail (312), and the third mounting plate (314), the fourth mounting plate (315) and the heating block (321) are fixed on the fifth mounting plate (316); the third driving member (301) and the first guide rail (302) drive the pressure head to perform the first step of vertical movement in the vertical direction, and the fourth driving member (311) and the second guide rail (312) drive the pressure head to perform the second step of vertical movement in the vertical direction.

9. The pressure bonding device according to claim 8, characterized in that: The force measuring mechanism comprises a pressure seat (341), a pressure gauge (342), a third connecting rod (343), a sixth mounting plate (345), and a pressing piece (344); the pressure seat (341) is fixed on the first mounting plate (303) and is located above the fourth driving member (311); the pressure gauge (342) is fixed on the pressure seat (341); the sixth mounting plate (345) is provided above the pressure seat (341); the pressing piece (344) is fixed in the middle of the sixth mounting plate (345); the sixth mounting plate (345) is provided parallel to the fourth mounting plate (315) in a vertical direction; the sixth mounting plate (345) and the fourth mounting plate (315) are fixedly connected via the third connecting rod (343); when measuring pressure, the pressing piece (344) directly contacts the pressure gauge (342).

10. The pressure bonding device according to claim 1, characterized in that: The first alignment device (4) comprises a fifth driving mechanism and a first image processing mechanism, the fifth driving mechanism comprises a fifth driving member (411) and a third guide rail (412), the first image processing mechanism comprises a first camera (402), a first light source (401) and a controller, the first camera (402) is connected to the first light source (401), the first camera (402) is fixedly connected to the third guide rail (412), the fifth driving member (411) is connected to the third guide rail (412), the first camera (402) photographs a marking point on the substrate, the first light source (401) provides light, and the controller receives image information; the second alignment device The device (5) comprises a second image processing mechanism and a sixth driving mechanism, the sixth driving mechanism comprises a sixth driving member (511) and a fourth guide rail (512), the second image processing mechanism comprises a second light source (501) and a second camera (502), the second light source (501) is fixedly connected to the second camera (502), the fourth guide rail (512) is connected to the sixth driving member (511), and the second camera (502) is connected to the fourth guide rail (512); the second light source (501) provides light, the second camera (502) photographs the marking point of the PCB, and the controller receives the relative position of the PCB and the substrate for compensation to complete the correction.

11. The pressure bonding device according to claim 6, characterized in that: A plurality of fifth guide rails (101) are also provided at the bottom of the bracket (1), a seventh driving member (102) is provided on the fourth connecting plate (253), a plurality of fifth connecting plates (103) and a sixth connecting plate (104) are fixed on the fifth guide rail (101), the fifth connecting plate (103) is connected to the second connecting plate (224), the sixth connecting plate (104) is connected to the third connecting plate (225), and a plurality of buffer members (105) are also provided below the fifth guide rail (101), when the seventh driving member (102) drives the fifth guide rail (101) to move in a vertical direction, the bottoms of the fifth connecting plates (103) and the sixth connecting plates (104) directly contact the buffer members (105) to perform a buffering action.

12. The pressure bonding device according to claim 1, characterized in that: The first feeding mechanism comprises a blowing rod (209), the blowing rod (209) being provided with a plurality of blowing holes, the blowing holes blowing towards the bonding area between the substrate and the PCB.

13. The pressure bonding device according to claim 3, characterized in that: The first recovery mechanism comprises a first limiting assembly, a second limiting assembly and a third limiting assembly, wherein the first limiting assembly and the second limiting assembly simultaneously limit the vertical movement of both ends of the first recovery rod (214); the third limiting assembly limits the front-rear movement of the first recovery rod (214); the second recovery mechanism comprises a fourth limiting assembly, a fifth limiting assembly and a sixth limiting assembly, wherein the fourth limiting assembly and the fifth limiting assembly limit the vertical movement of both ends of the second recovery rod (243); the sixth limiting assembly limits the front-rear movement of the second recovery rod (243).

14. The pressure bonding device according to claim 2, characterized in that: A first damper is sleeved in the middle of the first winding shaft (201), a first damping cover (205) is provided on the first winding shaft (201), the first drum (203) comprises a plurality of first mounting holes (2011) and second mounting holes (2012), the first damper and the first damping cover (205) are connected via the first mounting holes (2011), a plurality of first flat areas (2014) are provided on the outer surface of the first drum (203), a first elastic member (2013) is provided on the first flat area (2014), and the first elastic member (2013) is fixed to the outer surface of the first drum (203) via the second mounting holes (2012).

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