Wafer and seal ring assembly and alignment inspection process

Abstract

The present invention discloses a detection process for assembly and alignment of a wafer and a sealing ring, which includes an assembly step of the wafer and the sealing ring and an image alignment step. On the one hand, the present invention completes the assembly of the wafer, the sealing ring and the hanger based on the synchronization of the sealing ring and the wafer and the self-centering alignment under zero torque, so as to reduce the sealing failure rate caused by the separation of the sealing ring and the wafer; on the other hand, the reflection imaging principle formed by the light beam is adopted, and the entire sealing ring is gradually sent to the light beam detection area along the radial direction of the annular array in combination with the hanger, so as to more accurately piece together the imaged outer contour sample and the outer contour pair sample formed by all the sealing rings located in the light beam detection area, and at the same time, the concentric alignment of the inner and outer contours of the sealing ring is judged based on the outer contour sample to form a preliminary judgment, and then the outer contour sample and the outer contour pair sample are compared and analyzed to calibrate the center position of the sealing ring to form a verification judgment, so as to obtain a more accurate detection result.

Description

Technical Field

[0001] The invention belongs to the field of detection technology, and in particular relates to a detection process for assembly and alignment calibration of a wafer and a sealing ring. Background Art

[0002] At present, for the assembly of wafers and sealing rings, the wafer is first aligned to ensure that the center of the subsequent wafer is aligned with the center of the mounting groove on the hanger; then the wafer is transferred to the loading suction cup, and the loading suction cup is driven to flip and cooperate with the mounting groove on the hanger to transfer the wafer and adsorb it on the hanger; then, the sealing ring is loaded into the mounting groove on the hanger and the sealing ring is kept in contact with the edge of the wafer to form a seal, and the seal is locked with the hanger as it rotates around its own center line.

[0003] However, whether the sealing ring is installed in place or whether there is a deviation in the center will directly affect the subsequent electroplating process. Therefore, it is necessary to further calibrate and detect the wafer sealing ring. In conventional detection, a visual camera is used to take pictures, and then the pictures are compared and analyzed. Finally, the alignment accuracy is determined based on the analysis results. Obviously, there are the following technical defects:

[0004] 1) Visual cameras have limitations such as angle and focal length, and cannot guarantee the accuracy of the acquired photo information. As a result, the detection error rate is large, and the detection results cannot be effectively verified, resulting in the sealing failing to meet the requirements of subsequent electroplating implementation.

[0005] 2) During image acquisition, it is easy to be affected by external interference (such as beam interference, hanger shaking, etc.), so the image quality obtained cannot meet the detection needs.

[0006] 3) During the rotational transfer, the sealing ring is twisted relative to the wafer and the hanger, and the edge of the wafer is pressed to form a seal between the sealing ring and the wafer. However, the sealing ring itself will be twisted during the rotational assembly. Therefore, the sealing ring maintains a movement tendency to restore its natural state for sealing, resulting in a low service life. Once subjected to external force, it is easy to cause relative displacement between the sealing ring and the wafer. Summary of the invention

[0007] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide an improved detection process for assembly and alignment of a wafer and a sealing ring.

[0008] In order to solve the above technical problems, the technical solution adopted by the present invention is as follows: a detection process for assembly and alignment of a wafer and a sealing ring, which comprises the following steps:

[0009] S1. Assembly of wafer and sealing ring

[0010] Press the wafer and the sealing ring onto the assembly carrier from the edge, flip the assembly carrier to a vertical state, and then twist the assembly carrier to assemble the wafer and the sealing ring onto the hanger;

[0011] S2. Image alignment calibration

[0012] (1) Image acquisition

[0013] (2) Image analysis

[0014] Comparing the object obtained in step (1) to calibrate the posture and center position of the sealing ring, in particular, in step S1, the wafer is aligned with the center of the sealing ring and attached to the sealing ring based on negative pressure, and then the wafer and the sealing ring are rotated synchronously to be assembled on the hanger;

[0015] In step S2, the optical path unit used includes a plurality of optical path emitting components distributed in a circular array, and an optical path reflecting component aligned with the center of the circular array, wherein the light beams emitted by the plurality of the optical path emitting components form a light beam detection area; the image processing unit used includes a visual camera aligned with the center of the optical path reflecting component and located below the optical path reflecting component, and an image processor. In step (1) image acquisition, the entire sealing ring is gradually sent to the light beam detection area along the radial direction of the circular array by the hanger, and the contour information of the sealing ring is continuously imaged on the optical path emitting component during the reflection of the light beam, and then the visual camera acquires the image to piece together the imaged outer contour sample and the outer contour pair sample formed by all the sealing rings located in the light beam detection area; in step (2) image analysis, the concentric alignment of the inner and outer contours of the sealing ring is first determined by the outer contour sample, and then the outer contour sample and the outer contour pair sample are compared and analyzed to calibrate the center position of the sealing ring.

[0016] Preferably, in step S1, the wafer is sucked and pressed onto the sealing ring based on negative pressure, so as to reduce the deviation rate of the sealing ring and the wafer during assembly and improve the accuracy of alignment assembly.

[0017] Furthermore, the sealing ring is also installed on the assembly carrier by negative pressure adsorption, and the assembly is performed under the premise that the two are kept motionless.

[0018] According to a specific implementation and preferred aspect of the present invention, the assembly carrier includes a carrier body having an assembly surface, a first adsorption ring and a second adsorption ring formed on the assembly surface, wherein the first adsorption ring and the second adsorption ring are concentric, and the first adsorption ring is located at the periphery of the second adsorption ring, the first adsorption ring is used for adsorption of the sealing ring, and the second adsorption ring is used for adsorption of the wafer. Based on the adsorption and fixation formed by the concentric rings, the firmness of the wafer and the sealing ring alignment is greatly improved, and the wafer and the sealing ring can also maintain synchronous movement (that is, no relative displacement occurs).

[0019] According to another specific implementation and preferred aspect of the present invention, in step S1, the sealing ring assembly unit used also includes an assembly power component that drives the assembly carrier to rotate around its own axis, and a flipping power component that drives the assembly carrier to flip so that the wafer and the sealing ring face the carrier, wherein a wafer hanger is provided on the carrier, and the wafer and the sealing ring flipped toward the wafer hanger are loaded or unloaded under the drive of the assembly power component. Rotational assembly or rotational disassembly is satisfied to improve the disassembly efficiency of the wafer sealing ring assembly.

[0020] Preferably, the rotation axis formed by the assembly power component and the rotation axis formed by the flip power component are arranged to intersect. Here, the two rotation axes intersect at one point, which can reduce the movement space required for assembling the vehicle and facilitate improving the compactness of the structure.

[0021] Furthermore, the sealing ring assembly unit also includes a translational force component that drives the assembly carrier to reciprocate along the center line direction of the assembly carrier.

[0022] In some specific embodiments, a guide channel extending vertically and matching the wafer hanger is formed on the carrier, the wafer hanger is inserted into the guide channel, and a transfer device is used to drive the wafer hanger to move up and down along the guide channel.

[0023] Preferably, the wafer and the sealing ring are loaded into a mounting groove on a wafer hanger; the image processor detects whether the centers of the wafer and the sealing ring are aligned with the center of the mounting groove based on edge comparison between the sealing ring and the mounting groove.

[0024] According to another specific implementation and preferred aspect of the present invention, in step (2) image analysis, the outer contour sample is formed by continuous dynamic splicing or segmented image splicing. Whether the information is obtained dynamically or statically, the required outer contour sample can be formed, and the alignment of the inner and outer contours of the outer contour sample itself can also detect the center position of the circle.

[0025] According to another specific implementation and preferred aspect of the present invention, in step (2) image analysis, the outer contour of the sample is acquired by a visual camera based on the alignment of the center of the sealing ring with the center of the light beam detection area, ensuring accurate acquisition of verification information, so that the result formed is more accurate.

[0026] According to another specific implementation and preferred aspect of the present invention, each of the optical path emitting components includes an emitting body for emitting a light beam, and a light-transmitting cover disposed on the emitting body and capable of transmitting light, wherein the center line of the light-transmitting cover intersects the center line of the annular array; the angle between the center line of the light-transmitting cover and the center line of the annular array is equal to the refraction angle formed by the light beam passing through the light-transmitting cover. In this way, the light beams formed can be relatively concentrated or overlapped and emitted in an annular shape, and there is no interference between the light beams.

[0027] Preferably, the light beams formed by the light-transmitting covers are spliced ​​in the annular circumferential direction to form the light beam detection area, and the light beam detection area is annular, and the center of the sealing ring and the center of the light beam detection area are located on the same straight line. Further, the inner and outer contours of the sealing ring are both located within the light beam detection area. Here, according to conventional optical calculations, the setting of the angle of the light-transmitting cover is determined to compensate for the refraction of the light beam passing through the light-transmitting cover, which is simple, convenient and highly accurate.

[0028] Furthermore, the light-transmitting cover is rectangular, and in the orthographic projection in the extension direction of the center line of the annular array, the inner side of the light-transmitting cover is located inside the sealing ring, and the outer side is located outside the sealing ring. Here, it is ensured that each section of the sealing ring is in the light beam detection area.

[0029] Preferably, the light beam emitted by each light path emitting component is arranged perpendicular to the plane where the sealing ring is located. Under the irradiation of the vertical light beam, the formation of shadow parts is avoided, and the quality of the reflected image is effectively improved. The orientation of each light path emitting component is intersecting or parallel to the extension direction of the center line of the annular array. In practical applications, when emitting light beams, existing light path emitting components will inevitably produce refraction (the refraction angle is determined by the material of the light-transmitting element used). Therefore, the present application adjusts the orientation of the light beam emitting component according to the refraction of the light beam emitted by the light path emitting component used to ensure that the light beam can be emitted vertically to the sealing ring.

[0030] According to another specific implementation and preferred aspect of the present invention, in step S1, the wafer assembly unit used includes a wafer carrier, an alignment power component that drives the wafer carrier and drives the wafer to adjust its own center, and a lifting power component.

[0031] Preferably, the alignment power component includes a centering module for detecting the edge of the wafer to determine the center of the wafer, and an alignment module for driving the wafer carrier and aligning the center of the wafer with the center of the sealing ring; the centering module includes a plurality of detection cameras circumferentially spaced around the wafer carrier, the wafer is placed flat on the wafer carrier and the corresponding parts on the edge are kept within the detection area formed by each detection camera; and / or, the wafer has a first radial direction and a second radial direction, wherein the first radial direction and the second radial direction are arranged perpendicular to each other, the alignment module includes a first alignment power component for driving the wafer carrier to reciprocate along the first radial direction, and a second alignment power component for driving the wafer carrier to reciprocate along the second radial direction; the alignment module also includes a third alignment power component for driving the wafer carrier to rotate around its own center line direction.

[0032] Here, the wafer can be directly aligned and adjusted based on the sealing ring, and the wafer and the sealing ring can be accurately assembled during the lifting movement. At the same time, the center position of the wafer is determined by the edge of the wafer, and the centering accuracy is high. There are at least three detection cameras, that is, synchronous detection of at least three positions on the edge of the wafer is achieved to accurately determine the center of the wafer. In addition, the movement of the wafer carrier in the first radial direction and the second radial direction perpendicular to the wafer can quickly and accurately move to the centering position; at the same time, the wafer carrier rotates around its own center line to synchronously find the edge and calibrate the wafer.

[0033] According to another specific implementation and preferred aspect of the present invention, the wafer carrier has a plurality of vacuum adsorption holes distributed in an annular pattern, and the wafer is placed flat and adsorbed on the wafer carrier through the plurality of vacuum adsorption holes; a lifting channel is arranged in the middle of the wafer carrier, and the lifting power component includes a lifting suction cup arranged in the lifting channel, and a lifting power component driving the lifting suction cup to move up and down along the lifting channel. When aligning, the lifting suction cup is in the lifting channel, and when assembling, the lifting suction cup is adsorbed on the bottom surface of the wafer and moves upward to drive the wafer to be assembled on the assembly carrier. Here, the wafer can be assembled with the sealing ring while being aligned with the sealing ring, and at the same time, the structure is simple, and it is easy to install and implement.

[0034] According to another specific implementation and preferred aspect of the present invention, the optical path unit further comprises a bracket formed with a detection window, wherein a plurality of optical path emitting components are distributed around the detection window; the optical path reflecting component comprises a plane mirror mounted on the bracket and extending up and down in an inclined manner, wherein the plane mirror can obtain partial or entire contour information reflected by the sealing ring through the detection window. Here, the structure is simple, and it is easy to install and implement.

[0035] Preferably, the upper side of the plane mirror passes through the detection window and emerges from the light path emitting component in the direction close to the sealing ring. Here, the light beam emitted by the light path emitting component is prevented from mistakenly entering the plane mirror under refraction to form reflection, thereby reducing interference with the image information obtained by the visual camera.

[0036] Due to the implementation of the above technical solution, the present invention has the following advantages compared with the prior art:

[0037] In the existing assembly and calibration of wafers and sealing rings, the accuracy of the acquired photo information cannot be guaranteed due to the limitations of angles, focal lengths, etc. of visual cameras. As a result, the detection error rate is relatively large, and the detection results cannot be effectively verified, resulting in the sealing failing to meet the requirements of subsequent electroplating implementation. At the same time, in image acquisition, it is easily affected by external interference (such as beam interference, hanger shaking, etc.), so the acquired image quality cannot meet the detection needs. In addition, in the rotational transfer, the sealing ring is rotated relative to the wafer and the hanger, and the wafer edge is pressed to form a seal between the sealing ring and the wafer. However, the rotational assembly will cause the sealing ring itself to The wafer is in a twisted state, so the sealing ring keeps the movement tendency to restore the natural state for sealing, which results in a short service life. Once subjected to external force, it is easy to cause relative displacement of the sealing ring and the wafer, etc. The present application designs the assembly and alignment detection process of the wafer and the sealing ring as a whole, and cleverly solves the shortcomings and defects of the prior art. After adopting the assembly and alignment detection process of the wafer and the sealing ring, firstly, the wafer and the sealing ring are pressed onto the assembly carrier from the edge, and the assembly carrier is turned over to a vertical state, and then the assembly carrier is twisted to assemble the wafer and the sealing ring onto the hanger; secondly, the wafer and the sealing ring are pressed together based on negative pressure. The wafer and the sealing ring are aligned and attached to the sealing ring, and then the wafer and the sealing ring are rotated synchronously to be assembled on the hanger; finally, the hanger gradually sends the entire sealing ring to the light beam detection area along the radial direction of the annular array, and continuously images the contour information of the sealing ring on the light path emitting component in the reflection of the light beam, and then the visual camera obtains the picture to piece together the imaged outer contour sample and the outer contour pair sample formed by all the sealing rings located in the light beam detection area, and at the same time, the outer contour sample and the outer contour pair sample are compared and analyzed to calibrate the center position of the sealing ring. Therefore, compared with the prior art, the present invention is based on the fact that the sealing ring and the wafer are kept synchronously and the torque is zero. The wafer, sealing ring and hanger are assembled by self-centering alignment to reduce the sealing failure rate caused by the separation of the sealing ring and the wafer; on the other hand, the reflection imaging principle formed by the light beam is adopted, and the entire sealing ring is gradually sent to the light beam detection area along the radial direction of the annular array in combination with the hanger, so as to more accurately piece together the imaged outer contour sample and the outer contour pair sample formed by all the sealing rings located in the light beam detection area, and at the same time, the concentric alignment of the inner and outer contours of the sealing ring is judged based on the outer contour sample to form a preliminary judgment, and then the outer contour sample and the outer contour pair sample are compared and analyzed to calibrate the center position of the sealing ring to form a verification judgment, so as to obtain a more accurate detection result. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 The structural intent of the wafer and seal ring inspection device of the present invention (assembly carrier vertical);

[0039] Figure 2 The structural intention of the wafer and sealing ring detection device of the present invention (from another perspective);

[0040] Figure 3 for Figure 1 Schematic diagram of the front view (assembly vehicle vertical);

[0041] Figure 4 for Figure 1 Schematic diagram of the front view (assembly vehicle level);

[0042] Figure 5 for Figure 1 A schematic diagram of the structure of the middle sealing ring assembly unit;

[0043] Figure 6 for Figure 1 The structural diagram of the wafer assembly unit;

[0044] Figure 7 for Figure 1 A schematic diagram of the structure of the detection device;

[0045] Figure 8 for Figure 7 The main view diagram in FIG.

[0046] Fig. 9 for Figure 8 Schematic diagram of the left side;

[0047] Fig.10 for Figure 8 AA section view;

[0048] Among them: ①, carrier; 1, guide channel;

[0049] ②, assembly device; 2, wafer assembly unit; 20, wafer carrier; 21, alignment power component; a, centering module; a1, detection camera; b, alignment module; b1, first alignment power component; b11, first base; b12, second base; b2, second alignment power component; b20, third base; b3, third alignment power component; b30, rotating seat; b31, third power component; 22, lifting power component; c, lifting suction cup; d, lifting power component; t, lifting channel; 3, sealing ring assembly unit; 30, assembly carrier; f, carrier body; h1, first adsorption ring; h2, second adsorption ring; 31, assembly power component; 32, flipping power component; 33, translation power component;

[0050] ③, detection device; 4, carrier transfer device; 5, optical path unit; 50, bracket; k, detection window; 51, optical path emitting component; 510, emitting body; 511, light-transmitting cover; 52, optical path reflecting component; 520, plane mirror; 6, image processing unit; 60, visual camera;

[0051] M, sealing ring; J, wafer; G, hanger. DETAILED DESCRIPTION

[0052] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0053] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0054] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0055] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0056] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0057] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0058] like Figures 1 to 10 As shown, the wafer and sealing ring assembly and alignment detection process of this embodiment uses a wafer and sealing ring detection device including a carrier ①, an assembly device ②, and a detection device ③.

[0059] Specifically, the carrier ① is arranged along the up-down direction, and a guide channel 1 extending up and down is formed on the carrier ①, and the hanger G is installed in the guide channel 1 by moving up and down from opposite sides.

[0060] The assembly device ② is used to relatively assemble the sealing ring M, wafer J and hanger G, wherein the assembly is divided into step 1, the sealing ring M and wafer J are aligned and assembled to form a wafer sealing ring assembly; step 2, the wafer sealing ring assembly knob is assembled onto the hanger G.

[0061] In some specific embodiments, the assembly device ② includes a wafer assembly unit 2 and a sealing ring assembly unit 3, wherein the wafer assembly unit 2 includes a horizontally arranged wafer carrier 20, a positioning power component 21 that drives the wafer carrier 20 and drives the wafer J to adjust its own center, and a lifting power component 22; the sealing ring assembly unit 3 includes an assembly carrier 30 that is arranged above the wafer carrier 20 and is used for positioning and assembling the sealing ring M and the wafer J, an assembly power component 31 that drives the assembly carrier 30 to rotate around its own axis, and a flipping power component 32 that drives the assembly carrier 30 to flip so as to turn the sealing ring M and the wafer J toward the carrier 1, wherein the sealing ring M and the wafer J flipped toward the wafer hanger G are loaded or unloaded under the drive of the assembly power component 31.

[0062] In this example, the wafer carrier 20 has a plurality of vacuum adsorption holes distributed in an annular pattern, and the wafer J is placed flat and adsorbed on the wafer carrier 20 through the plurality of vacuum adsorption holes; a lifting channel t is provided in the middle of the wafer carrier 20, and the lifting power component 22 includes a lifting suction cup c provided in the lifting channel t, and a lifting power component d driving the lifting suction cup c to move up and down along the lifting channel t. During alignment, the lifting suction cup c is in the lifting channel t, and during assembly, the lifting suction cup c is adsorbed on the bottom surface of the wafer J and moves upward to drive the wafer to be assembled on the assembly carrier 30. Here, the wafer can be assembled with the sealing ring while being aligned with the sealing ring, and at the same time, the structure is simple, and it is easy to install and implement.

[0063] In the first assembly step, the assembly carrier 30 is horizontal and forms an assembly surface from the bottom surface, the sealing ring M is horizontally positioned on the bottom surface of the assembly carrier 30, the wafer J is placed on the wafer carrier 20, and the center position of the wafer J is adjusted based on the center position of the sealing ring M based on the alignment power component 21, wherein the alignment power component 21 includes a centering module a for detecting the edge of the wafer J to determine the center of the wafer, and an alignment module b for driving the wafer carrier 20 and driving the center of the wafer J to align with the center of the sealing ring M. The centering module a includes three detection cameras a1 distributed circumferentially around the wafer carrier 20, the wafer J is placed flat on the wafer carrier 20, and the edge of the wafer J emerges from the wafer carrier 20 and keeps the corresponding part on the edge in the detection area formed by the three detection cameras a1, and the center position of the wafer J is automatically found through the linkage of the three detection cameras a1.

[0064] In some specific embodiments, the wafer J has a first radial direction and a second radial direction, wherein the first radial direction and the second radial direction are arranged perpendicularly, and the alignment module b includes a first alignment power member b1 for driving the wafer carrier 20 to reciprocate along the first radial direction, a second alignment power member b2 for driving the wafer carrier 20 to reciprocate along the second radial direction, and a third alignment power member b3 for driving the wafer carrier 20 to rotate around its own center line direction, wherein the first alignment power member b1 includes a first base b11, a second base b12 slidably connected to the first base b11 along the first radial direction, and a third alignment power member b3 for driving the second base b12 to reciprocate along the first radial direction. The first power member for reciprocating motion, three detection cameras a1 are fixed on the first base b11; the second power member b2 includes a third base b20 slidably connected to the second base b12 along the second radial direction, and a second power member driving the third base b20 to reciprocate along the second radial direction; the third alignment power member b3 includes a rotating seat b30 rotatably set on the third base b20 and extending vertically, and a third power member b31 fixedly set on the third base b20 and used to drive the rotating seat b30 to rotate around the vertical center line, wherein the upper end of the rotating seat b30 is fixedly connected to the bottom of the wafer carrier 20. In some specific embodiments, the first power member and the second power member can be any conventional linear drive mechanism, and the third power member b31 is belt-driven.

[0065] In some specific embodiments, the assembly carrier 30 includes a carrier body f, a first adsorption ring h1 and a second adsorption ring h2 formed on the assembly surface, wherein the first adsorption ring h1 and the second adsorption ring h2 are concentric, and the first adsorption ring h1 is located on the periphery of the second adsorption ring h2, the first adsorption ring h1 is used for adsorption of the sealing ring M, and the second adsorption ring h2 is used for adsorption of the wafer J. Based on the adsorption and fixation formed by the concentric rings, the firmness of the wafer and the sealing ring is greatly improved, and the wafer and the sealing ring can also maintain synchronous movement (that is, no relative displacement). The rotation axis formed by the assembly power component 31 is arranged to intersect with the rotation axis formed by the flipping power component 32; the sealing ring assembly unit 3 also includes a translational power component 33 that drives the assembly carrier 30 to reciprocate along its own center line direction. Here, the two rotation axes intersect at one point, which can reduce the movement space required for the assembly carrier and facilitate the improvement of the compactness of the structure.

[0066] In this example, the detection device ③ includes a transfer device 4, an optical path unit 5, and an image processing unit 6, wherein the transfer device 4 is located above the carrier ①, and drives the hanger G to move up and down along the up and down direction, the optical path unit 5 includes a bracket 50 formed with a detection window k, a plurality of optical path emitting components 51 installed on the bracket 50 and distributed in a ring array around the detection window k, and an optical path reflecting component 52 aligned with the center of the ring array as a reference, wherein the light beams emitted by the plurality of light path emitting components 51 form a light beam detection area; the center lines of the wafer J and the sealing ring M loaded on the wafer hanger G are parallel to the center line of the ring array, wherein the light beam detection area can cover the entire sealing ring M, and as the wafer hanger G moves, the wafer hanger G moves synchronously along the radial direction of the ring array, and the sealing ring M can remain partially or wholly in the light beam detection area. The image processing unit 6 includes a visual camera 60 aligned with the center of the light path reflecting component 52 and located below the light path reflecting component 52, and an image processor (not shown in the figure, but it is not difficult to imagine). As the wafer hanger G moves, the sealing ring M passes through the light beam detection area segment by segment, and the light path reflecting component 52 obtains the contour information reflected by the sealing ring M segment by segment. The visual camera 60 converts the contour information into image information and summarizes it to the image processor to piece together the entire sealing ring contour, and detects the center position of the sealing ring based on the sealing ring contour image.

[0067] In some specific embodiments, the light beam emitted by each light path emitting component 51 is arranged perpendicular to the plane where the sealing ring M is located. Under the irradiation of the vertical light beam, the shadow part is avoided, and the quality of the reflected image is effectively improved. At the same time, the direction of each light path emitting component 51 is intersected or parallel to the extension direction of the center line of the annular array. In practical applications, when the existing light path emitting component emits a light beam, refraction will inevitably occur (the refraction angle is determined by the material of the light-transmitting element used). Therefore, the present application adjusts the direction of the light beam emitting component according to the refraction of the light beam emitted by the light path emitting component used to ensure that the light beam can be vertically emitted to the sealing ring. In this example, each light path emitting component 51 includes an emitting body 510 for emitting a light beam, and a light-transmitting cover 511 arranged on the emitting body 510 and capable of transmitting light, wherein the center line of the light-transmitting cover 511 is arranged to intersect with the center line of the annular array; the angle between the center line of the light-transmitting cover 511 and the center line of the annular array is equal to the refraction angle formed by the light beam passing through the light-transmitting cover 511. Here, according to conventional optical calculations, the setting of the tilt angle of the light-transmitting cover is determined to compensate for the refraction of the light beam through the light-transmitting cover, which is simple, convenient and accurate. Further, the light-transmitting cover 511 is rectangular, and in the orthographic projection in the extension direction of the center line of the annular array, the inner side edge of the light-transmitting cover 511 is located on the inner side of the sealing ring M, and the outer side edge is located on the outer side of the sealing ring M. Here, it is ensured that each section on the sealing ring is in the light beam detection area. The light path reflection component 52 includes a plane mirror 520 mounted on the bracket 50 and extending up and down, wherein the plane mirror 520 can obtain part or all of the contour information reflected by the sealing ring M through the detection window k. Here, the structure is simple and easy to install and implement. It should be particularly noted that the plane mirror 520 can be a circular, rectangular or other polygonal reflector, as long as it can cover the entire sealing ring in the orthographic projection in the extension direction of the center line of the annular array. At the same time, the upper side edge of the plane mirror 520 passes through the detection window k in the direction close to the sealing ring M and emerges from the light path emission component 51. Here, the light beam emitted by the optical path emitting component is prevented from mistakenly entering the plane mirror and forming reflection under refraction, thereby reducing the interference with the image information obtained by the visual camera.

[0068] In summary, the implementation steps of this embodiment include:

[0069] S1. Assembly of wafer and sealing ring

[0070] Based on negative pressure, the wafer and the sealing ring are aligned and attached to the sealing ring, so that the wafer and the sealing ring are pressed onto the assembly carrier from the edge, and the assembly carrier is flipped to a vertical state, and then the wafer sealing ring assembly is aligned, and then the assembly carrier is twisted to assemble the wafer and the sealing ring onto the hanger;

[0071] S2. Image alignment calibration

[0072] The optical path unit used includes a plurality of optical path emitting components distributed in a circular array, and an optical path reflecting component aligned with the center of the circular array as a reference, wherein the light beams emitted by the plurality of the optical path emitting components form a light beam detection area; the image processing unit used includes a visual camera and an image processor aligned with the center of the optical path reflecting component and located below the optical path reflecting component, and in image acquisition, the entire sealing ring is gradually sent to the light beam detection area by a hanger along the radial direction of the circular array, and the contour information of the sealing ring is continuously imaged on the optical path emitting component in the reflection of the light beam, and then the visual camera acquires the picture to piece together the imaged outer contour sample and the outer contour pair sample formed by all the sealing rings located in the light beam detection area; in image analysis, the concentric alignment of the inner and outer contours of the sealing ring is first judged by the outer contour sample, and then the outer contour sample and the outer contour pair sample are compared and analyzed to calibrate the center position of the sealing ring.

[0073] In summary, after adopting the inspection process of assembly and alignment of the wafer and the sealing ring, first, the wafer and the sealing ring are pressed onto the assembly carrier from the edge, and the assembly carrier is flipped to a vertical state, and then the assembly carrier is twisted to assemble the wafer and the sealing ring onto the hanger; secondly, the wafer and the sealing ring are aligned and attached to the sealing ring based on the negative pressure, and then the wafer and the sealing ring are rotated synchronously to be assembled on the hanger by twisting; finally, the hanger gradually sends the entire sealing ring to the light beam detection area along the radial direction of the annular array, and continuously images the contour information of the sealing ring on the light path emitting component in the reflection of the light beam, and then the visual camera obtains the picture to piece together the imaged outer contour sample and the outer contour pair sample formed by all the sealing rings located in the light beam detection area, and at the same time, the outer contour sample and the outer contour pair sample are formed by the outer contour sample and the outer contour pair sample. This comparison and analysis is used to calibrate the center position of the sealing ring. Therefore, compared with the prior art, the present invention, on the one hand, is based on the fact that the sealing ring and the wafer are kept synchronized and self-center aligned under zero torque to complete the assembly of the wafer, the sealing ring and the hanger, so as to reduce the sealing failure rate caused by the separation of the sealing ring and the wafer; on the other hand, the reflection imaging principle formed by the light beam is adopted, and the entire sealing ring is gradually sent to the light beam detection area along the radial direction of the annular array in combination with the hanger, so as to more accurately piece together the imaged outer contour sample and the outer contour pair sample formed by all the sealing rings located in the light beam detection area, and at the same time, the concentric alignment of the inner and outer contours of the sealing ring is judged based on the outer contour sample to form a preliminary judgment, and then the outer contour sample and the outer contour pair sample are compared and analyzed to calibrate the center position of the sealing ring to form a verification judgment, so as to obtain a more accurate detection result.

[0074] The above detailed description of the present invention is intended to enable persons familiar with the art to understand the contents of the present invention and implement them. It does not limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A detection process for assembly and alignment of a wafer and a sealing ring, comprising the following steps: S1. Assembly of wafer and sealing ring Press the wafer and the sealing ring onto the assembly carrier from the edge, flip the assembly carrier to a vertical state, and then twist the assembly carrier to assemble the wafer and the sealing ring onto the hanger; S2. Image alignment calibration (1) Image acquisition (2) Image analysis Based on the object obtained in step (1), a comparison is performed to calibrate the posture and center position of the sealing ring, characterized in that: In step S1, the wafer is aligned with the sealing ring and attached to the sealing ring based on negative pressure, and then the wafer and the sealing ring are rotated synchronously to be assembled on the hanger; In step S2, the optical path unit used includes a plurality of optical path emitting components distributed in a circular array, and an optical path reflecting component aligned with the center of the circular array, wherein the light beams emitted by the plurality of the optical path emitting components form a light beam detection area; the image processing unit used includes a visual camera aligned with the center of the optical path reflecting component and located below the optical path reflecting component, and an image processor. In step (1) image acquisition, the entire sealing ring is gradually sent to the light beam detection area along the radial direction of the circular array by the hanger, and the contour information of the sealing ring is continuously imaged on the optical path emitting component during the reflection of the light beam, and then the visual camera acquires the image to piece together the imaged outer contour sample and the outer contour pair sample formed by all the sealing rings located in the light beam detection area; in step (2) image analysis, the concentric alignment of the inner and outer contours of the sealing ring is first determined by the outer contour sample, and then the outer contour sample and the outer contour pair sample are compared and analyzed to calibrate the center position of the sealing ring.

2. The detection process for assembly and alignment of wafer and sealing ring according to claim 1, characterized in that: In step S1 , the wafer is sucked and pressed onto the sealing ring based on negative pressure.

3. The detection process for assembly and alignment of wafer and sealing ring according to claim 2, characterized in that: The sealing ring is also installed on the assembly carrier by negative pressure adsorption.

4. The detection process for assembling and aligning the wafer and the sealing ring according to claim 3, characterized in that: The assembly carrier includes a carrier body having an assembly surface, a first adsorption ring and a second adsorption ring formed on the assembly surface, wherein the first adsorption ring and the second adsorption ring are concentric, and the first adsorption ring is located at the outer periphery of the second adsorption ring, the first adsorption ring is used for adsorbing a sealing ring, and the second adsorption ring is used for adsorbing a wafer.

5. The detection process for assembly and alignment of a wafer and a sealing ring according to any one of claims 1 to 4, characterized in that: In step S1, the sealing ring assembly unit used also includes an assembly power component that drives the assembly carrier to rotate around its own axis, and a flipping power component that drives the assembly carrier to flip so that the wafer and the sealing ring are facing the carrier, wherein a wafer hanger is provided on the carrier, and the wafer and the sealing ring flipped toward the wafer hanger are loaded or unloaded under the drive of the assembly power component.

6. The detection process for assembly and alignment of wafer and sealing ring according to claim 5, characterized in that: The rotation axis formed by the assembly power component and the rotation axis formed by the flipping power component are arranged to intersect each other; and / or, the sealing ring assembly unit further includes a translation power component that drives the assembly carrier to reciprocate along its own center line direction.

7. The detection process for assembling and aligning the wafer and the sealing ring according to claim 5, characterized in that: A guide channel extending vertically and matching with the wafer hanger is formed on the carrier, the wafer hanger is inserted in the guide channel, and a transfer device is used to drive the wafer hanger to move up and down along the guide channel.

8. The detection process for assembly and alignment of wafer and sealing ring according to claim 7, characterized in that: The wafer and the sealing ring are loaded in the mounting groove on the wafer hanger; the image processor detects whether the center of the wafer and the sealing ring is aligned with the center of the mounting groove based on the edge comparison between the sealing ring and the mounting groove.

9. The wafer and sealing ring assembly and alignment detection process according to claim 1, characterized in that: In step (2) of image analysis, the outer contour sample is formed by continuous dynamic stitching or segmented image stitching.

10. The wafer and sealing ring assembly and alignment detection process according to claim 1, characterized in that: In step (2) of image analysis, the outer contour pair sample is acquired by the visual camera based on the alignment of the center of the sealing ring with the center of the light beam detection area.

11. The wafer and sealing ring assembly and alignment detection process according to claim 1, characterized in that: Each of the optical path emitting components includes an emitting body for emitting a light beam, and a light-transmitting cover arranged on the emitting body and capable of transmitting light, wherein the center line of the light-transmitting cover is arranged to intersect with the center line of the annular array; the angle between the center line of the light-transmitting cover and the center line of the annular array is equal to the refraction angle formed by the light beam passing through the light-transmitting cover.

12. The wafer and sealing ring assembly and alignment detection process according to claim 11, characterized in that: The light beams formed by the light-transmitting covers are spliced ​​in the annular circumferential direction to form the light beam detection area, and the light beam detection area is annular, and the center of the sealing ring and the center of the light beam detection area are located on the same straight line.

13. The detection process for assembly and alignment of wafer and sealing ring according to claim 12, characterized in that: The inner and outer contours of the sealing ring are both located within the light beam detection area.

14. The wafer and sealing ring assembly and alignment detection process according to claim 1, characterized in that: In step S1 , the wafer assembly unit used includes a wafer carrier, an alignment power component that drives the wafer carrier and drives the wafer to adjust its own center, and a lifting power component.

15. The detection process for assembly and alignment of wafer and sealing ring according to claim 14, characterized in that: The alignment power component includes a centering module for detecting the edge of the wafer to determine the center of the wafer, and an alignment module for driving the wafer carrier and aligning the center of the wafer with the center of the sealing ring; the centering module includes a plurality of detection cameras circumferentially spaced around the wafer carrier, the wafer is placed flat on the wafer carrier and the corresponding part on the edge is kept within the detection area formed by each of the detection cameras; and / or the wafer has a first radial direction and a second radial direction, wherein the first radial direction and the second radial direction are arranged perpendicular to each other, the alignment module includes a first alignment power component for driving the wafer carrier to reciprocate along the first radial direction, and a second alignment power component for driving the wafer carrier to reciprocate along the second radial direction; the alignment module also includes a third alignment power component for driving the wafer carrier to rotate around its own center line direction.

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