All-in-one machine for installing, flipping and inspecting wafers and sealing rings

Abstract

The present invention discloses an integrated machine for installation, flipping and detection of wafers and sealing rings, which includes: a carrier; an assembly device; and a detection device. On the one hand, the present invention obtains the contour information of the sealing ring segment by segment while keeping the sealing ring in motion, and obtains a complete contour image of the sealing ring based on the piecing together of the contour information of each segment, thereby effectively reducing the interference of external factors and achieving high imaging quality. At the same time, image comparison and inspection can be performed simultaneously in the piecing together of multiple segments of images, thereby improving detection accuracy. On the other hand, through the cooperation of the optical path emitting component and the optical path reflecting component, a wider imaging range can be achieved in a narrow space, which is convenient for integration into any wafer processing equipment, thereby realizing rapid detection of the sealing ring. In addition, based on the layout of the carrier, the assembly device and the detection device, the wafer sealing ring can be continuously installed, flipped and detected, thereby greatly reducing the cumulative error and effectively improving the loading accuracy and loading efficiency.

Description

Technical Field

[0001] The invention belongs to the field of detection technology, and in particular relates to an integrated machine for installing, flipping and detecting a wafer and a sealing ring. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer. Further, a conductive metal layer is electroplated on the wafer, and the conductive metal layer is processed to make a conductive circuit.

[0003] At present, during the electroplating process, the wafer usually needs to be loaded on a wafer hanger and pressed against the edge of the wafer by a sealing ring to form a sealing and conductive effect. Therefore, in order to ensure the quality of electroplating and ensure that the sealing ring is loaded relative to the wafer in accordance with the loading requirements, it is particularly important to detect the loading status of the sealing ring before electroplating. The traditional operation steps are: first, adjust the center of the wafer to ensure that the center of the subsequent wafer is aligned with the center of the mounting groove on the hanger; then transfer the wafer to the suction cup, and drive the suction cup to flip and cooperate with the mounting groove on the hanger to transfer the wafer and adsorb it on the hanger; then, load the sealing ring into the mounting groove on the hanger and keep the sealing ring in contact with the edge of the wafer to form a seal, and lock it with the hanger as the seal rotates around its own center line; finally, transfer the hanger with the wafer and sealing ring loaded to the detection device, illuminate the surface of the sealing ring with a light beam, and obtain the overall image of the sealing ring in the illuminated area through a camera and analyze and judge the center position of the sealing ring through a processing system to determine whether the loading status of the sealing ring meets the requirements. When it is detected that the sealing ring and wafer loading meet the requirements, the wafer hanger is taken out for subsequent processing. If it does not meet the requirements, the wafer and sealing ring are removed and reloaded.

[0004] However, in the actual detection process, the existing technology is prone to the following defects:

[0005] 1. The space requirement is high. A large spacing is required to meet the imaging requirements of the camera to obtain the overall contour information of the sealing ring. As a result, the overall size of the detection device is large and can only be set up separately, and cannot be integrated with other equipment used in other processes, which affects the production efficiency of the wafer;

[0006] 2. By directly acquiring and analyzing the image of the overall contour of the sealing ring, it is easy to cause adverse effects on the acquired image under external interference (such as light interference, hanger vibration, etc.), and the detection data sample is single. The existing processing system is difficult to accurately determine the center position of the sealing ring, resulting in low detection accuracy;

[0007] 3. The wafer and the sealing ring need to go through multiple transfer steps, which can easily cause the assembly errors to gradually accumulate, resulting in poor assembly accuracy of the final wafer and sealing ring, low pass rate, cumbersome operation and low loading efficiency. Summary of the invention

[0008] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a new integrated machine for installing, flipping and detecting wafers and sealing rings.

[0009] In order to solve the above technical problems, the technical solution adopted by the present invention is as follows:

[0010] A wafer and sealing ring installation, flipping, and detection integrated machine, comprising:

[0011] Carrier;

[0012] An assembly device, comprising a wafer assembly unit and a sealing ring assembly unit, wherein the wafer assembly unit comprises a wafer carrier, an alignment power component that drives the wafer carrier and drives the wafer to adjust its own center, and a lifting power component; the sealing ring assembly unit comprises an assembly carrier that is arranged above the wafer carrier and is used for alignment and assembly of the sealing ring and the wafer, an assembly power component that drives the assembly carrier to rotate around its own axis, and a flipping power component that drives the assembly carrier to flip so that the wafer and the sealing ring are facing the carrier, wherein a wafer hanger is arranged on the carrier, and the wafer and the sealing ring flipped toward the wafer hanger are loaded or unloaded under the drive of the assembly power component;

[0013] The detection device includes an optical path unit and an image processing unit. The optical path unit includes a plurality of optical path emitting components distributed in a circular array, and an optical path reflecting component aligned with the center of the circular array, wherein the light beams emitted by the plurality of optical path emitting components form a light beam detection area; the image processing unit includes a visual camera and an image processor aligned with the center of the optical path reflecting component and located below the optical path reflecting component; the center line of the sealing ring is loaded on a wafer hanger in parallel with the center line of the circular array, the detection device also includes a shifter for driving the wafer hanger to move radially along the circular array, the sealing ring passes through the light beam detection area section by section, the optical path reflecting component obtains the contour information reflected by the sealing ring section by section, the visual camera converts the contour information into image information and summarizes it to the image processor to piece together the entire sealing ring contour, and detects the center position of the sealing ring based on the sealing ring contour image.

[0014] According to a specific implementation and preferred aspect of the present invention, the sealing ring is placed on an assembly carrier, the wafer is placed on a wafer carrier, and the alignment power component adjusts the center position of the wafer based on the center position of the sealing ring. Here, the wafer can be directly aligned with the sealing ring as a reference, and the wafer and the sealing ring can be accurately assembled during the lifting movement.

[0015] Preferably, the alignment power component includes a centering module for detecting the edge of the wafer to determine the center of the wafer, and an alignment module for driving the wafer carrier and driving the center of the wafer to align with the center of the sealing ring. Here, the center position of the wafer is determined by the edge of the wafer, and the centering accuracy is high.

[0016] Specifically, the centering module includes a plurality of detection cameras spaced around the wafer carrier. The wafer is placed flat on the wafer carrier and the corresponding portion on the edge is kept within the detection area formed by each detection camera. There are at least three detection cameras, that is, synchronous detection of at least three positions on the edge of the wafer is achieved, so as to accurately determine the center of the wafer.

[0017] Specifically, the wafer has a first radial direction and a second radial direction, wherein the first radial direction and the second radial direction are arranged perpendicularly, and the alignment module includes a first alignment power member driving the wafer carrier to reciprocate along the first radial direction, and a second alignment power member driving the wafer carrier to reciprocate along the second radial direction; the alignment module also includes a third alignment power member driving the wafer carrier to rotate around its own center line. Here, the movement of the wafer carrier in the first radial direction and the second radial direction perpendicular to the wafer can be quickly and accurately moved to the centering position; at the same time, the wafer carrier rotates around its own center line to synchronously realize edge finding and calibration of the wafer.

[0018] According to another specific implementation and preferred aspect of the present invention, the wafer carrier has a plurality of vacuum adsorption holes distributed in an annular pattern, and the wafer is placed flat and adsorbed on the wafer carrier through the plurality of vacuum adsorption holes; a lifting channel is arranged in the middle of the wafer carrier, and the lifting power component includes a lifting suction cup arranged in the lifting channel, and a lifting power component driving the lifting suction cup to move up and down along the lifting channel. When aligning, the lifting suction cup is in the lifting channel, and when assembling, the lifting suction cup is adsorbed on the bottom surface of the wafer and moves upward to drive the wafer to be assembled on the assembly carrier. Here, the wafer can be assembled with the sealing ring while being aligned with the sealing ring, and at the same time, the structure is simple, and it is easy to install and implement.

[0019] Preferably, the assembly carrier includes a carrier body, a first adsorption member and a second adsorption member that respectively form a first adsorption area and a second adsorption area on one side of the carrier body. During assembly, the sealing ring is adsorbed in the first adsorption area, and the wafer is adsorbed in the second adsorption area and keeps its edge against the surface of the sealing ring. Here, the sealing ring and the wafer are adsorbed and fixed respectively by using independent first and second adsorption members, and the wafer is kept in contact with the surface of the sealing ring at the same time, which greatly improves the adsorption stability of the wafer and the sealing ring.

[0020] Preferably, the rotation axis formed by the assembly power component and the rotation axis formed by the flip power component are arranged to intersect; and / or, the sealing ring assembly unit further includes a translational power component that drives the assembly carrier to reciprocate along its own centerline direction. Here, the two rotation axes intersect at one point, which can reduce the movement space required for the assembly carrier and facilitate improving the compactness of the structure.

[0021] Preferably, the light beam emitted by each light path emitting component is arranged perpendicular to the plane where the sealing ring is located. Under the irradiation of the vertical light beam, the formation of shadow parts is avoided, and the quality of the reflected image is effectively improved.

[0022] According to a specific implementation and preferred aspect of the present invention, the orientation of each optical path emitting component intersects or is arranged parallel to the extension direction of the center line of the annular array. In practical applications, when emitting a light beam, the existing optical path emitting component will inevitably produce refraction (the refraction angle is determined by the material of the light-transmitting element used). Therefore, the present application adjusts the orientation of the light beam emitting component according to the refraction of the light beam emitted by the optical path emitting component used to ensure that the light beam can be vertically emitted to the sealing ring.

[0023] Preferably, each optical path emitting component comprises an emitting body for emitting a light beam, and a light-transmitting cover arranged on the emitting body and capable of transmitting light, wherein a center line of the light-transmitting cover intersects with a center line of the annular array.

[0024] Specifically, the angle between the center line of the light-transmitting cover and the center line of the annular array is equal to the refraction angle formed by the light beam passing through the light-transmitting cover. Here, according to conventional optical calculations, the setting of the angle of the light-transmitting cover is determined to compensate for the refraction of the light beam passing through the light-transmitting cover, which is simple, convenient and accurate.

[0025] Furthermore, the light-transmitting cover is rectangular, and in the orthographic projection in the extension direction of the center line of the annular array, the inner side of the light-transmitting cover is located inside the sealing ring, and the outer side is located outside the sealing ring. Here, it is ensured that each section on the sealing ring is in the light beam detection area.

[0026] According to a specific implementation and preferred aspect of the present invention, the light beam detection area can cover the entire sealing ring, and as the wafer hanger moves, the sealing ring can remain partially or entirely within the light beam detection area.

[0027] Preferably, the movement process of the sealing ring is divided into a first stage, a second stage and a third stage, wherein in the first stage, a part of the sealing ring is in the light beam detection area and keeps its center line gradually approaching the center line of the annular array; in the second stage, the sealing ring is in the light beam detection area as a whole; in the third stage, another part of the sealing ring is in the light beam detection area and keeps its center line gradually away from the center line of the annular array, and the image processor acquires images segment by segment in the first stage and the third stage and pieces together to obtain a first overall contour image, acquires images in the second stage and obtains a second overall contour image, and detects the center position of the sealing ring based on the comparison between the first overall contour image and the second overall contour image. Here, by comprehensively comparing and verifying the first overall contour image obtained by piecing together the segmented images of the sealing ring acquired in the first and third stages with the second overall contour image directly acquired in the second stage, not only sufficient sample data is ensured for the image processor to analyze, but also the detection results can be further verified under the comparison of the two overall contour images, thereby ensuring the accuracy of the detection results.

[0028] Preferably, in the direction of movement of the sealing ring, the center line of the sealing ring is aligned with the center line of the annular array, and in the second stage, when the center line of the sealing ring coincides with the center line of the annular array, the image processor obtains a second overall contour image. The overall contour image obtained at this position has uniform illumination distribution and high image quality.

[0029] According to another specific implementation and preferred aspect of the present invention, the optical path unit further comprises a bracket formed with a detection window, wherein a plurality of optical path emitting components are distributed around the detection window; the optical path reflecting component comprises a plane mirror mounted on the bracket and extending up and down in an inclined manner, wherein the plane mirror can obtain partial or entire contour information reflected by the sealing ring through the detection window. Here, the structure is simple, and it is easy to install and implement.

[0030] Preferably, the upper side of the plane mirror passes through the detection window and emerges from the light path emitting component in the direction close to the sealing ring. Here, the light beam emitted by the light path emitting component is prevented from mistakenly entering the plane mirror under refraction to form reflection, thereby reducing interference with the image information obtained by the visual camera.

[0031] Preferably, the detection device further comprises a guide module, wherein a guide channel extending vertically and matching with the wafer hanger is formed on the guide module, the wafer hanger is inserted in the guide channel, and the transfer device drives the wafer hanger to move up and down along the guide channel. Here, it is ensured that the sealing ring moves smoothly to ensure the imaging quality of the sealing ring in dynamic state.

[0032] In addition, the wafer and the sealing ring are loaded into the mounting groove on the wafer hanger; the image processor compares the contours of each segment of the sealing ring with the edge of the mounting groove to detect whether the center of the wafer and the sealing ring is aligned with the center of the mounting groove.

[0033] Due to the implementation of the above technical solution, the present invention has the following advantages compared with the prior art:

[0034] The existing technology has high space requirements and requires a large spacing to meet the imaging needs of the camera to obtain the overall contour information of the sealing ring, resulting in a large overall size of the detection device. It can only be set up separately and cannot be integrated with equipment used in other processes, which affects the production efficiency of the wafer; and by directly acquiring and analyzing the image of the overall contour of the sealing ring, it is easy to cause adverse effects on the acquired image under external interference (such as light interference, hanger vibration, etc.), and the detection data sample is single, and it is difficult for the existing processing system to accurately determine the center position of the sealing ring, resulting in low detection accuracy; in addition, the wafer and the sealing ring need to undergo multiple transfer steps, which can easily cause the assembly error to gradually accumulate and increase, resulting in poor assembly accuracy of the final wafer and sealing ring, low pass rate, cumbersome operation, and low loading efficiency; the present application comprehensively designs the structure of the integrated machine for installation, flipping, and detection of the wafer and the sealing ring, cleverly solving the shortcomings and defects of the existing technology. After adopting the integrated machine, the first First, the sealing ring and the wafer are placed on the assembly carrier and the wafer carrier respectively; then, the wafer carrier is driven by the alignment power component to adjust the center of the wafer itself and align it with the sealing ring, and the wafer is loaded onto the assembly carrier under the drive of the lifting power component; then, the assembly carrier is driven to flip by the flipping power component to turn the wafer and the sealing ring toward the wafer hanger in the carrier, and the wafer and the sealing ring are loaded onto the wafer hanger under the drive of the assembly power component; during detection, the center line of the sealing ring is kept parallel to the center line of the annular array formed by multiple optical path emitting components; when the transfer device drives the wafer hanger to move radially along the annular array, the sealing ring passes through the light beam detection area formed by the light beams emitted by the multiple optical path emitting components section by section, at this time, the optical path reflecting component obtains the contour information reflected by the sealing ring section by section, the visual camera converts the contour information into image information and summarizes it to the image processor to piece together the entire sealing ring contour, and detects the center position of the sealing ring based on the complete contour image of the sealing ring. Therefore, compared with the prior art, the present invention, on the one hand, obtains the contour information of the sealing ring segment by segment while keeping the sealing ring in motion, and obtains a complete contour image of the sealing ring based on the piecing together of the contour information of each segment, thereby effectively reducing the interference of external factors and achieving high imaging quality. At the same time, image comparison and inspection can be performed simultaneously in the piecing together of multiple image segments, thereby improving detection accuracy. On the other hand, through the cooperation of the optical path emitting component and the optical path reflecting component, a wider imaging range can be achieved in a narrow space, which is convenient for integration into any wafer processing equipment to achieve rapid detection of the sealing ring. In addition, based on the layout of the carrier, the assembly device and the detection device, continuous installation, flipping and detection of the wafer sealing ring are achieved, which greatly reduces the cumulative error and effectively improves the loading accuracy and loading efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a front view schematic diagram of the integrated machine for installing, flipping and testing wafers and sealing rings of the present invention (assembly carrier is horizontal);

[0036] Figure 2 It is a front view schematic diagram of the wafer and sealing ring installation, flipping and detection integrated machine of the present invention (the assembly carrier is vertical);

[0037] Figure 3 It is a three-dimensional structural schematic diagram of the integrated machine for installing, flipping and detecting wafers and sealing rings of the present invention;

[0038] Figure 4 for Figure 3 A schematic diagram of the main view of the detection device;

[0039] Figure 5 for Figure 4 Schematic diagram of the cross section along the Ⅰ-Ⅰ axis;

[0040] Figure 6 A schematic diagram of an image obtained when the wafer sealing ring is in the first stage;

[0041] Figure 7 A schematic diagram of an image obtained when the wafer sealing ring is in the second stage;

[0042] Figure 8 A schematic diagram of an image obtained when the wafer sealing ring is in the third stage;

[0043] Among them: A, carrier; A0, guide channel;

[0044] B, assembly device; B0, wafer assembly unit; B00, wafer carrier; t, lifting channel; B01, alignment power component; a, centering module; a0, detection camera; b, alignment module; b1, first alignment power component; b11, first base; b12, second base; b2, second alignment power component; b20, third base; b3, third alignment power component; b30, rotating seat; b31, third power component; B02, lifting power component; c, lifting suction cup; d, lifting power component; B1, sealing ring assembly unit; B10, assembly carrier; f, carrier body; B11, assembly power component; B12, flipping power component; B13, translation power component;

[0045] C, detection device; 1, carrier transfer device; 2, optical path unit; 20, bracket; k, detection window; 21, optical path emitting component; 210, emitting body; 211, light-transmitting cover; 22, optical path reflecting component; 220, plane mirror; 3, image processing unit; 30, visual camera;

[0046] H, sealing ring; Y, wafer; J, wafer hanger. DETAILED DESCRIPTION

[0047] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0048] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0049] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0050] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0051] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0052] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0053] like Figures 1 to 8 As shown, the integrated machine for installing, flipping and inspecting wafers and sealing rings of this embodiment includes a carrier A, an assembly device B and an inspection device C, wherein the inspection device C and the assembly device B are arranged up and down and are located on one side of the carrier A.

[0054] Specifically, a guide channel A0 extending vertically and matching with the wafer hanger J is formed on the carrier A, and the wafer hanger J is inserted into the guide channel A0.

[0055] In this example, the assembly device B includes a wafer assembly unit B0 and a sealing ring assembly unit B1, wherein the wafer assembly unit B0 includes a horizontally arranged wafer carrier B00, an alignment power component B01 that drives the wafer carrier B00 and drives wafer Y to adjust its own center, and a lifting power component B02; the sealing ring assembly unit B1 includes an assembly carrier B10 that is arranged above the wafer carrier B00 and is used for alignment and assembly of the sealing ring H and wafer Y, an assembly power component B11 that drives the assembly carrier B10 to rotate around its own axis, and a flipping power component B12 that drives the assembly carrier B10 to flip so as to turn the sealing ring H and wafer Y toward the carrier A, wherein the sealing ring H and wafer Y flipped toward the wafer hanger J are loaded or unloaded under the drive of the assembly power component B11.

[0056] For the convenience of implementation, before installation, the assembly carrier B10 is horizontal and forms an assembly surface from the bottom surface, the sealing ring H is horizontally positioned on the bottom surface of the assembly carrier B10, the wafer Y is placed on the wafer carrier B00, and the alignment power component B01 adjusts the center position of the wafer Y based on the center position of the sealing ring H. Here, the wafer can be directly aligned with the sealing ring as a reference, and the wafer and the sealing ring can be accurately assembled during the lifting movement.

[0057] In some specific embodiments, the alignment power component B01 includes a centering module a for detecting the edge of wafer Y to determine the center of the wafer, and an alignment module b for driving the wafer carrier B00 and driving the center of wafer Y to align with the center of the sealing ring H. The centering module a includes three detection cameras a0 distributed circumferentially around the wafer carrier B00, and the wafer Y is placed flat on the wafer carrier B00, and the edge of the wafer Y emerges from the wafer carrier B00 and keeps the corresponding part on the edge within the detection area formed by the three detection cameras a0, and the center position of the wafer Y is automatically found through the linkage of the three detection cameras a0.

[0058] At the same time, the wafer has a first radial direction and a second radial direction, wherein the first radial direction and the second radial direction are arranged perpendicularly, and the alignment module b includes a first alignment power member b1 driving the wafer carrier B00 to reciprocate along the first radial direction, a second alignment power member b2 driving the wafer carrier B00 to reciprocate along the second radial direction, and a third alignment power member b3 driving the wafer carrier B00 to rotate around its own center line. Here, the movement of the wafer carrier in the first radial direction and the second radial direction perpendicular to the wafer can be quickly and accurately moved to the centering position; at the same time, the wafer carrier rotates around its own center line to synchronously realize edge finding and calibration of the wafer.

[0059] The first alignment power member b1 includes a first base b11, a second base b12 connected to the first base b11 along a first radial direction, and a first power member driving the second base b12 to reciprocate along the first radial direction, and three detection cameras a0 are fixed on the first base b11; the second power member b2 includes a third base b20 connected to the second base b12 along a second radial direction, and a second power member driving the third base b20 to reciprocate along the second radial direction; the third alignment power member b3 includes a rotating seat b30 rotatably set on the third base b20 and extending vertically, and a third power member b31 fixedly set on the third base b20 and used to drive the rotating seat b30 to rotate around the vertical center line, wherein the upper end of the rotating seat b30 is fixedly connected to the bottom of the wafer carrier B00. In some specific embodiments, the first power member and the second power member can be any conventional linear drive mechanism, and the third power member b31 is belt-driven.

[0060] In this example, the wafer carrier B00 has a plurality of vacuum adsorption holes distributed in a circular pattern. The wafer Y is placed flat and adsorbed on the wafer carrier B00 through the plurality of vacuum adsorption holes. A lifting channel t is provided in the middle of the wafer carrier B00. The lifting power component B02 includes a lifting suction cup c provided in the lifting channel t and a lifting power component d driving the lifting suction cup c to move up and down along the lifting channel t. During alignment, the lifting suction cup c is in the lifting channel t. During assembly, the lifting suction cup c is adsorbed on the bottom surface of the wafer Y and moves upward to drive the wafer to be assembled on the assembly carrier B10. Here, the wafer can be assembled with the sealing ring while being aligned with the sealing ring. At the same time, the structure is simple and easy to install and implement.

[0061] In some specific embodiments, the assembly carrier B10 includes a carrier body f, a first adsorbent and a second adsorbent that form a first adsorption area and a second adsorption area on one side of the carrier body f, respectively. During assembly, the sealing ring H is adsorbed in the first adsorption area, and the wafer Y is adsorbed in the second adsorption area and keeps its edge against the surface of the sealing ring H; the first adsorbent and the second adsorbent both use conventional vacuum mechanisms, and a first annular vacuum chamber and a second annular vacuum chamber that are connected to the first adsorbent and the second adsorbent are formed in the carrier body f. Here, the sealing ring and the wafer are adsorbed and fixed respectively by using independent first and second adsorbents, and the adsorption stability of the wafer and the sealing ring is greatly improved based on the synchronous keeping of the wafer against the surface of the sealing ring.

[0062] The rotation axis formed by the assembly power component B11 and the rotation axis formed by the flip power component B12 are arranged to intersect; the sealing ring assembly unit B1 also includes a translation power component B13 that drives the assembly carrier B10 to reciprocate along its own center line direction. Here, the two rotation axes intersect at one point, which can reduce the movement space required for the assembly carrier and facilitate the improvement of the compactness of the structure.

[0063] In this example, the detection device C includes a transfer device 1 , an optical path unit 2 , and an image processing unit 3 .

[0064] Specifically, the transfer device 1 drives the wafer hanger J to move up and down along the guide channel A0. The transfer device 1 can be any conventional power mechanism.

[0065] In this example, the optical path unit 2 includes a bracket 20 with a detection window k, a plurality of optical path emitting components 21 mounted on the bracket 20 and distributed in a circular array around the detection window k, and an optical path reflecting component 22 aligned with the center of the circular array as a reference, wherein the light beams emitted by the plurality of optical path emitting components 21 form a light beam detection area; the center lines of the wafer Y and the sealing ring H loaded on the wafer hanger J are parallel to the center line of the circular array, wherein the light beam detection area can cover the entire sealing ring H, and as the wafer hanger J moves, the wafer hanger J moves synchronously radially along the circular array, and the sealing ring H can remain partially or wholly within the light beam detection area.

[0066] For further convenience of implementation, the light beam emitted by each light path emitting component 21 is arranged perpendicular to the plane where the sealing ring H is located. Under the irradiation of the vertical light beam, the formation of shadow parts is avoided, and the quality of the reflected image is effectively improved.

[0067] At the same time, the orientation of each optical path emitting component 21 intersects or is arranged parallel to the extension direction of the center line of the annular array. In practical applications, when emitting a light beam, the existing optical path emitting component will inevitably produce refraction (the refraction angle is determined by the material of the light-transmitting element used). Therefore, the present application adjusts the orientation of the light beam emitting component according to the refraction of the light beam emitted by the optical path emitting component used to ensure that the light beam can be vertically emitted to the sealing ring.

[0068] In some specific embodiments, each optical path emitting component 21 includes an emitting body 210 for emitting a light beam, and a light-transmitting cover 211 disposed on the emitting body 210 and capable of transmitting light, wherein the center line of the light-transmitting cover 211 is disposed to intersect with the center line of the annular array; the angle between the center line of the light-transmitting cover 211 and the center line of the annular array is equal to the refraction angle formed by the light beam passing through the light-transmitting cover 211. Here, according to conventional optical calculations, the setting of the tilt angle of the light-transmitting cover is determined to compensate for the refraction of the light beam passing through the light-transmitting cover, which is simple, convenient, and highly accurate.

[0069] Furthermore, the light-transmitting cover 211 is rectangular, and in the orthographic projection in the extension direction of the center line of the annular array, the inner side of the light-transmitting cover 211 is located inside the sealing ring H, and the outer side is located outside the sealing ring H. Here, it is ensured that each section on the sealing ring is in the light beam detection area.

[0070] In some specific embodiments, the optical path reflection component 22 includes a plane mirror 220 mounted on the bracket 20 and extending up and down, wherein the plane mirror 220 can obtain partial or entire contour information reflected by the sealing ring H through the detection window k. Here, the structure is simple, easy to install and implement. It should be noted that the plane mirror 220 can be a circular, rectangular or other polygonal reflector, as long as it can cover the entire sealing ring in the orthographic projection in the extension direction of the center line of the annular array.

[0071] At the same time, the upper side of the plane mirror 220 passes through the detection window k and emerges from the light path emitting component 21 in the direction close to the sealing ring H. Here, the light beam emitted by the light path emitting component is prevented from entering the plane mirror by mistake to form a reflection under refraction, thereby reducing the interference with the image information obtained by the visual camera.

[0072] In this example, the image processing unit 3 includes a visual camera 30 aligned with the center of the light path reflecting component 22 and located below the light path reflecting component 22, and an image processor (not shown in the figure, but it is not difficult to imagine). As the wafer hanger J moves, the sealing ring H passes through the light beam detection area segment by segment, and the light path reflecting component 22 obtains the contour information reflected by the sealing ring H segment by segment. The visual camera 30 converts the contour information into image information and summarizes it to the image processor to piece together the entire sealing ring contour, and detects the center position of the sealing ring based on the sealing ring contour image.

[0073] In some specific embodiments, the movement process of the sealing ring H is divided into a first stage, a second stage, and a third stage. In this embodiment, the sealing ring H moves from bottom to top along with the wafer hanger J, and sequentially experiences the first, second, and third stages. Therefore, in the first stage, a part of the sealing ring H is in the light beam detection area and keeps its own center line gradually approaching the center line of the annular array; in the second stage, the sealing ring H is in the light beam detection area as a whole; in the third stage, another part of the sealing ring H is in the light beam detection area and keeps its own center line gradually away from the center line of the annular array. The image processor acquires images segment by segment in the first stage and the third stage and pieces together to obtain a first overall contour image, acquires images in the second stage and obtains a second overall contour image, and detects the center position of the sealing ring based on the comparison between the first overall contour image and the second overall contour image. Here, by comprehensively comparing and verifying the first overall contour image obtained by piecing together the sealing ring segmented images obtained in the first and third stages and the second overall contour image directly obtained in the second stage, not only is sufficient sample data ensured for image processor analysis, but also the detection results can be further verified by comparing the two overall contour images, thereby ensuring the accuracy of the detection results.

[0074] At the same time, in the moving direction of the sealing ring H, the center line of the sealing ring H is aligned with the center line of the annular array, and in the second stage, when the center line of the sealing ring H coincides with the center line of the annular array, the image processor obtains a second overall contour image. The overall contour image obtained at this position has uniform illumination distribution and high image quality.

[0075] In addition, wafer Y and sealing ring H are loaded in the mounting groove on wafer hanger J. After the image processor determines the center position of sealing ring H, it can also compare and analyze the edge of sealing ring H in each segment contour image with the edge of mounting groove on wafer hanger J to determine whether the center of wafer and sealing ring is aligned with the center of mounting groove.

[0076] In summary, after adopting the all-in-one machine, the sealing ring and the wafer are first placed on the assembly carrier and the wafer carrier respectively; then the wafer carrier is driven by the alignment power component to adjust the center of the wafer itself and align it with the sealing ring, and the wafer is loaded onto the assembly carrier under the drive of the lifting power component; then the assembly carrier is driven to flip by the flipping power component to turn the wafer and the sealing ring toward the wafer hanger in the carrier, and the wafer and the sealing ring are loaded onto the wafer hanger under the drive of the assembly power component; during detection, the center line of the sealing ring is kept parallel to the center line of the annular array formed by multiple optical path emitting components; when the transfer device drives the wafer hanger to move radially along the annular array, the sealing ring passes through the light beam detection area formed by the light beams emitted by the multiple optical path emitting components section by section, at this time, the optical path reflecting component obtains the contour information reflected by the sealing ring section by section, the visual camera converts the contour information into image information and summarizes it to the image processor to piece together the entire sealing ring contour, and detects the center position of the sealing ring based on the complete contour image of the sealing ring.Therefore, compared with the prior art, the present invention, on the one hand, effectively reduces the interference of external factors by obtaining the contour information of the sealing ring segment by segment while keeping the sealing ring in motion, and obtains a complete contour image of the sealing ring based on the patchwork of each segment of contour information, and has high imaging quality. At the same time, image comparison and inspection can be performed simultaneously in the patchwork of multiple segments of images, thereby improving detection accuracy. On the other hand, through the cooperation of the optical path emitting component and the optical path reflecting component, a wider imaging range can be achieved in a narrow space, which is convenient for integration into any wafer processing equipment to realize rapid detection of the sealing ring. In addition, based on the layout of the carrier, the assembly device and the detection device, continuous installation, flipping and detection of the wafer sealing ring can be realized. , greatly reducing the cumulative error, effectively improving the loading accuracy and loading efficiency; thirdly, the wafer can be directly adjusted based on the sealing ring, and the wafer and the sealing ring can be accurately assembled during the lifting movement; fourthly, the movement of the wafer carrier in the first radial direction and the second radial direction perpendicular to the wafer can quickly and accurately move to the center position; at the same time, the wafer carrier rotates around its own center line to synchronously realize edge finding and calibration of the wafer; fifthly, the first and second independent adsorption parts are used to adsorb and fix the sealing ring and the wafer respectively, and at the same time, based on the synchronous contact of the wafer with the surface of the sealing ring, the adsorption stability of the wafer and the sealing ring is greatly improved; sixthly , the two rotation axes intersect at one point, which can reduce the movement space required for assembling the vehicle and facilitate improving the compactness of the structure; seventh, under the irradiation of the vertical light beam, the shadow part is avoided, and the quality of the reflected image is effectively improved. At the same time, in practical applications, the existing light path emitting components will inevitably produce refraction when emitting light beams (the refraction angle is determined by the material of the transparent element used). Therefore, the present application adjusts the direction of the light beam emitting component according to the refraction of the light beam emitted by the light path emitting component used to ensure that the light beam can be vertically emitted to the sealing ring; eighth, the first overall contour image is obtained by piecing together the segmented images of the sealing ring obtained in the first and third stages Comprehensive comparison and verification with the second overall contour image directly obtained in the second stage not only ensures sufficient sample data for image processor analysis, but also can further verify the detection results under the comparison of the two overall contour images, so as to ensure the accuracy of the detection results; ninthly, it avoids the light beam emitted by the optical path emitting component from mistakenly entering the plane mirror to form a reflection under refraction, thereby reducing the interference with the image information obtained by the visual camera; tenthly, after determining the center position of the sealing ring, it is also possible to compare and analyze the edge of the sealing ring in each segment of the contour image with the edge of the mounting groove on the wafer hanger to determine whether the center of the wafer and the sealing ring is aligned with the center of the mounting groove.

[0077] The above detailed description of the present invention is intended to enable persons familiar with the art to understand the contents of the present invention and implement them. It does not limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A machine for installing, flipping and testing wafers and sealing rings, characterized in that: It includes: Carrier; An assembly device, comprising a wafer assembly unit and a sealing ring assembly unit, wherein the wafer assembly unit comprises a wafer carrier, an alignment power component that drives the wafer carrier and drives the wafer to adjust its own center, and a lifting power component; the sealing ring assembly unit comprises an assembly carrier arranged above the wafer carrier and used for aligning and assembling the sealing ring and the wafer, an assembly power component that drives the assembly carrier to rotate around its own axis, and a flipping power component that drives the assembly carrier to flip so that the wafer and the sealing ring are facing the carrier, wherein a wafer hanger is provided on the carrier, and the wafer and the sealing ring flipped toward the wafer hanger are loaded or unloaded under the drive of the assembly power component; The detection device includes an optical path unit and an image processing unit, wherein the optical path unit includes a plurality of optical path emitting components distributed in an annular array, and an optical path reflecting component aligned with the center of the annular array, wherein the light beams emitted by the plurality of the optical path emitting components form a light beam detection area; the image processing unit includes a visual camera and an image processor aligned with the center of the optical path reflecting component and located below the optical path reflecting component; the center line of the sealing ring is loaded on a wafer hanger in parallel with the center line of the annular array, the detection device also includes a shifter for driving the wafer hanger to move radially along the annular array, the sealing ring passes through the light beam detection area section by section, the optical path reflecting component obtains the contour information reflected by the sealing ring section by section, the visual camera converts the contour information into image information and summarizes it to the image processor to piece together the entire sealing ring contour, and detects the center position of the sealing ring based on the sealing ring contour image.

2. The integrated machine for installing, flipping and detecting wafers and sealing rings according to claim 1, characterized in that: The sealing ring is placed on the assembly carrier, the wafer is placed on the wafer carrier, and the alignment power component adjusts the center position of the wafer based on the center position of the sealing ring.

3. The integrated machine for installing, flipping and detecting wafers and sealing rings according to claim 2, characterized in that: The alignment power component includes a centering module for detecting the edge of the wafer to determine the center of the wafer, and an alignment module for driving the wafer carrier and driving the center of the wafer to align with the center of the sealing ring.

4. The integrated machine for installing, flipping and detecting wafers and sealing rings according to claim 3, characterized in that: The centering module includes a plurality of inspection cameras circumferentially spaced around the wafer carrier, the wafer is placed flat on the wafer carrier and the corresponding portion on the edge is kept within the inspection area formed by each of the inspection cameras; and / or the wafer has a first radial direction and a second radial direction, wherein the first radial direction and the second radial direction are arranged perpendicular to each other, the alignment module includes a first alignment power component driving the wafer carrier to reciprocate along the first radial direction, and a second alignment power component driving the wafer carrier to reciprocate along the second radial direction; the alignment module also includes a third alignment power component driving the wafer carrier to rotate around its own center line direction.

5. The integrated machine for installing, flipping and detecting wafers and sealing rings according to any one of claims 1 to 4, characterized in that: The wafer carrier is provided with a plurality of vacuum adsorption holes distributed in a ring-like manner. The wafer is placed flat and adsorbed on the wafer carrier through the plurality of vacuum adsorption holes. A lifting channel is arranged in the middle of the wafer carrier. The lifting power component comprises a lifting suction cup arranged in the lifting channel and a lifting power component driving the lifting suction cup to move up and down along the lifting channel. During alignment, the lifting suction cup is located in the lifting channel. During assembly, the lifting suction cup is adsorbed on the bottom surface of the wafer and moves upward to drive the wafer to be assembled onto the assembly carrier.

6. The integrated machine for installing, flipping and testing wafers and sealing rings according to claim 1, characterized in that: The assembly carrier includes a carrier body, a first adsorption member and a second adsorption member which respectively form a first adsorption area and a second adsorption area on a side of the carrier body. During assembly, the sealing ring is adsorbed in the first adsorption area, and the wafer is adsorbed in the second adsorption area and keeps its edge against the surface of the sealing ring.

7. The integrated machine for installing, flipping and testing wafers and sealing rings according to claim 1, characterized in that: The rotation axis formed by the assembly power component and the rotation axis formed by the flipping power component are arranged to intersect each other; and / or, the sealing ring assembly unit further includes a translation power component that drives the assembly carrier to reciprocate along its own center line direction.

8. The integrated machine for installing, flipping and testing wafers and sealing rings according to claim 1, characterized in that: The light beam emitted by each light path emitting component is arranged perpendicular to the plane where the sealing ring is located.

9. The integrated machine for installing, flipping and detecting wafers and sealing rings according to claim 1 or 8, characterized in that: The orientation of each of the light path emitting components intersects with or is arranged parallel to the extension direction of the center line of the annular array.

10. The integrated machine for installing, flipping and testing wafers and sealing rings according to claim 9, characterized in that: Each of the optical path emitting components includes an emitting body for emitting a light beam, and a light-transmitting cover arranged on the emitting body and capable of transmitting light, wherein the center line of the light-transmitting cover is arranged to intersect with the center line of the annular array; the angle between the center line of the light-transmitting cover and the center line of the annular array is equal to the refraction angle formed by the light beam passing through the light-transmitting cover; the light-transmitting cover is rectangular, and in the orthographic projection in the extension direction of the center line of the annular array, the inner side edge of the light-transmitting cover is located on the inner side of the sealing ring, and the outer side edge is located on the outer side of the sealing ring.

11. The integrated machine for installing, flipping and testing wafers and sealing rings according to claim 1, characterized in that: The light beam detection area can cover the entire sealing ring, and as the wafer hanger moves, the sealing ring can remain partially or entirely within the light beam detection area; the movement process of the sealing ring is divided into a first stage, a second stage, and a third stage, wherein in the first stage, a portion of the sealing ring is within the light beam detection area and keeps its center line gradually approaching the center line of the annular array; in the second stage, the sealing ring is entirely within the light beam detection area; in the third stage, another portion of the sealing ring is within the light beam detection area and keeps its center line gradually away from the center line of the annular array, the image processor acquires images segment by segment in the first stage and the third stage and pieces together to obtain a first overall contour image, acquires images in the second stage and obtains a second overall contour image, and detects the center position of the sealing ring based on the comparison between the first overall contour image and the second overall contour image.

12. The integrated machine for installing, flipping and testing wafers and sealing rings according to claim 11, characterized in that: In the movement direction of the sealing ring, the center line of the sealing ring is aligned with the center line of the annular array, and in the second stage, when the center line of the sealing ring coincides with the center line of the annular array, the image processor obtains the second overall contour image.

13. The integrated machine for installing, flipping and testing wafers and sealing rings according to claim 1, characterized in that: The optical path unit also includes a bracket formed with a detection window, wherein a plurality of the optical path emitting components are distributed around the detection window; the optical path reflecting component includes a plane mirror mounted on the bracket and extending up and down at an angle, wherein the plane mirror can obtain partial or entire contour information reflected by the sealing ring through the detection window; the upper side edge of the plane mirror passes through the detection window in a direction close to the sealing ring and emerges from the optical path emitting component.

14. The integrated machine for installing, flipping and testing wafers and sealing rings according to claim 1, characterized in that: A guide channel extending vertically and matching the wafer hanger is formed on the carrier, the wafer hanger is inserted in the guide channel, and the transfer device drives the wafer hanger to move up and down along the guide channel.

15. The integrated machine for installing, flipping and testing wafers and sealing rings according to claim 1, characterized in that: The wafer and the sealing ring are loaded in the mounting groove on the wafer hanger; the image processor detects whether the center of the wafer and the sealing ring is aligned with the center of the mounting groove based on the comparison of the contours of each segment of the sealing ring with the edge of the mounting groove.

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