A fully automatic bonding machine

Abstract

The present invention relates to the technical field of bonding machines, and specifically discloses a fully automatic bonding machine, which includes a support frame. Inside the support frame, there are a calibration component, a spin coating component, a vacuum bonding component, and a robotic arm. The calibration component is located on the left side of the robotic arm, the spin coating component is located at the rear of the robotic arm, the vacuum bonding component is located on the right side of the robotic arm. At the front end of the support frame, there are two loading and unloading components. The robotic arm is located at the rear of the two loading and unloading components. At the left end of the spin coating component, there is a flipping component. On the vacuum bonding component, there is a curing component. The present invention can fully automatically carry out semiconductor automated production without manual intervention, improve the production speed, detect the bonding thickness value more accurately, and improve the bonding quality.

Description

Technical Field

[0001] The present invention relates to the technical field of bonding machines, and particularly to a fully automatic bonding machine. Background Art

[0002] A bonding machine is a key device for bonding chips or devices to substrate materials, and it plays an important role in modern microelectronics technology. Wafer bonding technology realizes three-dimensional short-distance interconnection of integrated circuits by stacking wafers, thereby improving the information transmission speed and reducing the device volume. Wafer bonding technology includes two categories: temporary bonding and permanent bonding. Among them, temporary bonding has higher flexibility, while permanent bonding tightly combines wafers through chemical and physical methods.

[0003] The bonding machine can complete a bonding process with high precision and high efficiency, connect devices made of different materials together, and provide important support for the electrical interconnection, function integration, and device packaging of microelectronic materials, optoelectronic materials, and their nano-scale microelectromechanical components. Such devices usually support a variety of bonding processes, such as anodic bonding, glass powder bonding, solder bonding, eutectic bonding, etc.

[0004] Currently, the existing technologies still have the following areas to be improved: Most of the existing bonding machines are manually operated and require the assistance of operators. The operation complexity is high, the requirements for operators are relatively high, and manual operation easily leads to poor consistency of bonding quality, a high defective product rate, and high costs, reducing the quality and reliability of products and decreasing the bonding precision and stability. Summary of the Invention

[0005] To solve the above problems existing in the prior art, the present invention provides a fully automatic bonding machine, which can perform semiconductor automated production fully automatically without manual intervention, improve the production speed, detect the bonding thickness value more accurately, and improve the bonding quality.

[0006] The object of the present invention can be achieved by the following technical solutions:

[0007] A fully automatic bonding machine includes a support frame. Inside the support frame, there are a calibration component, a spin coating component, a vacuum bonding component, and a robotic arm. The calibration component is located on the left side of the robotic arm, the spin coating component is located behind the robotic arm, the vacuum bonding component is located on the right side of the robotic arm. At the front end of the support frame, there are two loading and unloading components. The robotic arm is located behind the two loading and unloading components. At the left end of the spin coating component, there is a flipping component. On the vacuum bonding component, there is a curing component.

[0008] Furthermore, the support frame includes a support bracket, a vacuum bonding base, a robot base, a flip spin coating base, and a calibration base. Four feet are respectively and fixedly arranged at the four corners of the lower end of the support bracket. The robot base is located at the front side inside the support bracket. The calibration base is located on the left side of the robot base. The vacuum bonding base is located on the right side of the robot base. The flip spin coating base is located at the rear side of the robot base.

[0009] Furthermore, the vacuum bonding assembly is fixedly connected to the vacuum bonding base. The robotic arm is fixedly connected to the robot base. The calibration assembly is fixedly connected to the calibration base. The spin coating assembly is fixedly connected to the flip spin coating base.

[0010] Furthermore, the loading and unloading assembly includes a loading and unloading support frame, a loading and unloading platform, a loading and unloading bottom plate, and a loading and unloading vertical frame. The loading and unloading platform is fixedly connected to one side of the loading and unloading support frame. An installation frame is fixedly arranged on the side of the loading and unloading support frame away from the loading and unloading platform. The installation frame is fixedly connected to the support bracket.

[0011] A support platform is fixedly arranged at the upper end of the loading and unloading platform. The lower end of the loading and unloading platform is fixedly connected to the loading and unloading vertical frame. The lower end of the loading and unloading vertical frame is fixedly connected to the loading and unloading bottom plate. One side of the loading and unloading vertical frame is fixedly connected to one side of the loading and unloading support frame. A loading and unloading controller is fixedly arranged on the side of the loading and unloading vertical frame away from the loading and unloading support frame.

[0012] Furthermore, the calibration assembly includes a calibrator, a calibration support frame, and a calibration platform. Both the calibrator and the calibration platform are fixedly connected to the upper end of the calibration support frame. The calibrator is located at the front end of the calibration platform. A calibration controller is arranged inside the calibration support frame.

[0013] Furthermore, the spin coating assembly includes a weighing instrument, a weighing housing, a weighing bottom plate, and a first fixed end. The lower end of the weighing instrument is fixedly connected to the upper end of the weighing bottom plate. An upper wafer carrier is fixedly arranged at the upper end of the weighing instrument. Four elastic members are respectively and fixedly arranged at the four corners of the weighing bottom plate. The upper ends of the four elastic members are all fixedly connected to the upper end of the weighing housing.

[0014] The weighing instrument is located inside the weighing housing. The lower end of the weighing housing is fixedly connected to the upper end of the first fixed end. A placement hole is formed at the middle position of the first fixed end. A rotary moving member is fixedly arranged in the placement hole. A linear moving member is fixedly arranged at the lower end of the rotary moving member. A lower wafer carrier is fixedly arranged above the rotary moving member.

[0015] A first vacuum interface is fixedly arranged on the rotary moving part, an air outlet and a recovery interface are fixedly arranged on the first fixed end, the air outlet is located on the right side of the rotary moving part, a UV pre-curing lamp assembly is fixedly arranged on the weighing housing, and the UV pre-curing lamp assembly is located between the weighing bottom plate and the lower wafer carrier.

[0016] Furthermore, the flipping assembly includes a flipping support and a rotary cylinder. The flipping support is fixedly connected to the left end of the first fixed end, the rotary cylinder is fixedly connected to the inner side of the flipping support, and an adsorption carrier is slidably arranged on the rotary cylinder.

[0017] Furthermore, the vacuum bonding assembly includes a vacuum bonding support frame, an upper cover, a connecting plate and a vacuum cavity. A maintenance lifting cylinder is fixedly arranged at the upper end of the vacuum bonding support frame, the lower end of the maintenance lifting cylinder is fixedly connected to the upper end of the connecting plate, an opening lifting cylinder is fixedly arranged on the connecting plate, the lower end of the opening lifting cylinder is fixedly connected to the upper end of the upper cover, and a pressing cylinder and a side clamping cylinder are fixedly arranged above the upper cover.

[0018] Furthermore, the curing assembly includes a second fixed end and a planar irradiation lamp. The lower end of the vacuum bonding support frame is fixedly connected to the upper end of the second fixed end. A second vacuum interface and a wafer lifting cylinder are fixedly arranged in the cavity hole opened in the second fixed end. The second vacuum interface is located on the left side of the wafer lifting cylinder. The vacuum cavity is fixedly connected to the upper end of the second fixed end. A pick-and-place seat is fixedly arranged at the upper end of the wafer lifting cylinder. The pick-and-place seat is located inside the vacuum cavity. The second vacuum interface is communicated with the inside of the vacuum cavity. An auxiliary pick-and-place hand is arranged at the right end of the second fixed end.

[0019] Furthermore, a moving cylinder is fixedly arranged at the upper end of the second fixed end. The moving cylinder is parallel to the second fixed end. The upper end of the moving cylinder is fixedly connected with the planar irradiation lamp. A drag chain is fixedly arranged at the right end of the planar irradiation lamp. A push rod is slidably arranged on the moving cylinder. A universal joint bearing is arranged at the end of the push rod. The universal joint bearing is connected to the second fixed end. The lower end of the push rod is connected to the output shaft of a moving lifting cylinder.

[0020] The beneficial effects of the present invention are as follows:

[0021] (1) By setting up the loading and unloading component and the calibration component, the achievable technical effects are as follows: the loading and unloading platform is fixedly connected to one side of the loading and unloading support frame. On the side of the loading and unloading support frame away from the loading and unloading platform, there is a fixedly installed mounting frame, and the mounting frame is fixedly connected to the support bracket. On the upper end of the loading and unloading platform, there is a fixedly installed support platform. At the lower end of the loading and unloading platform, there is a fixedly connected loading and unloading vertical frame. At the lower end of the loading and unloading vertical frame, there is a fixedly connected loading and unloading bottom plate. One side of the loading and unloading vertical frame is fixedly connected to one side of the loading and unloading support frame. On the side of the loading and unloading vertical frame away from the loading and unloading support frame, there is a fixedly installed loading and unloading controller;

[0022] Start the robotic arm, pick up the wafer from one support platform, move the wafer to the calibration platform. The calibration platform drives the wafer to rotate, and at the same time, the calibrator conducts calibration detection on the wafer. The bonding machine can fully automate semiconductor automated production without manual intervention, improving the production speed, making the detection of the bonding thickness value more accurate, improving the bonding quality. The loading and unloading components are respectively used for loading the wafer and the glass and unloading the bonding sheet.

[0023] (2) By setting up the spin coating component and the flipping component, the achievable technical effects are as follows: the lower end of the weighing instrument is fixedly connected to the upper end of the weighing bottom plate. On the upper end of the weighing instrument, there is a fixedly installed upper wafer carrier. At the four corners of the weighing bottom plate, there is respectively a fixedly installed elastic member, and the upper ends of the four elastic members are all fixedly connected to the upper end of the weighing housing. The weighing instrument is located inside the weighing housing. The lower end of the weighing housing is fixedly connected to the upper end of the first fixed end. The flipping support member is fixedly connected to the left end of the first fixed end. Inside the flipping support member, there is a fixedly installed rotary cylinder, and an adsorption carrier is slidably arranged on the rotary cylinder;

[0024] The robotic arm drives the wafer to move to the upper wafer carrier for weighing, and then moves the wafer to the lower wafer carrier. Start the linear motion member and the rotary motion member for spin coating. Move the lower wafer carrier upward and rotate. The glue applicator moves to apply the adhesive to the central area of the wafer for glue coating treatment. After completion, the lower wafer carrier descends and rotates at different orders and speeds to evenly spread the adhesive on the surface of the wafer. The lower wafer carrier rises. The robotic arm drives the wafer to move to the upper wafer carrier for weighing, and then drives the wafer to move to the pick - and - place seat. The spin coating component and the flipping component can accurately control the dosage of the coating and make the glue coating on the wafer more uniform, without manual operation, making the operation more automated.

[0025] (3) By setting up a vacuum bonding component and a curing component, the achievable technical effect is that a maintenance lifting cylinder is fixedly arranged at the upper end of the vacuum bonding support frame. The lower end of the maintenance lifting cylinder is fixedly connected to the upper end of a connecting plate. An opening lifting cylinder is fixedly arranged on the connecting plate. The lower end of the opening lifting cylinder is fixedly connected to the upper end of an upper cover. A pressing cylinder and a side clamping cylinder are fixedly arranged above the upper cover. The lower end of the vacuum bonding support frame is fixedly connected to the upper end of a second fixed end. A second vacuum interface and a wafer lifting cylinder are fixedly arranged in the cavity hole opened in the second fixed end;

[0026] Start the pressing cylinder to perform pressing treatment on the wafer and the glass. Start the opening lifting cylinder and close the side clamping cylinder. The bonded sheet after pressing is located on the pick-and-place base. After starting the planar irradiation lamp to cure the bonded sheet, the robotic arm moves the bonded sheet to the adsorption carrier for flipping, and then the robotic arm moves the bonded sheet to the support platform for blanking. The vacuum bonding component and the curing component can mechanically cure the wafer, reduce the operation actions, improve the working speed, and operate in a vacuum cavity to reduce or eliminate bubbles, improving the pressing quality and material properties. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] For the convenience of those skilled in the art to understand, the present invention will be further described below with reference to the accompanying drawings.

[0028] Figure 1 It is a top view of the present invention;

[0029] Figure 2 It is a front view of the support frame in the present invention;

[0030] Figure 3 It is a top view of the support frame in the present invention;

[0031] Figure 4 It is a front view of the calibration component in the present invention;

[0032] Figure 5 It is a left view of the calibration component in the present invention;

[0033] Figure 6 It is a top view of the loading and unloading component in the present invention;

[0034] Figure 7 It is a front view of the loading and unloading component in the present invention;

[0035] Figure 8 It is a right view of the loading and unloading component in the present invention;

[0036] Figure 9 It is a top view of the spin coating component and the flipping component in the present invention;

[0037] Figure 10This is the right view of the spin coating component and the flipping component in the present invention;

[0038] Figure 11 This is the rear view of the spin coating component and the flipping component in the present invention;

[0039] Figure 12 This is the right view of the vacuum bonding component in the present invention;

[0040] Figure 13 This is the left view of the vacuum bonding component in the present invention;

[0041] Figure 14 This is the left view of the curing component in the present invention;

[0042] Main element symbol description:

[0043] In the figure: 1. Loading and unloading component; 11. Mounting rack; 12. Loading and unloading support frame; 13. Loading and unloading platform; 14. Support platform; 15. Loading and unloading vertical frame; 16. Loading and unloading controller; 17. Loading and unloading bottom plate;

[0044] 2. Robot arm;

[0045] 3. Calibration component; 31. Calibrator; 32. Calibration support frame; 33. Calibration controller; 34. Calibration platform;

[0046] 4. Support frame; 41. Support bracket; 42. Vacuum bonding base; 43. Robot base; 44. Floor foot; 45. Calibration base; 46. Flipping and spin coating base;

[0047] 5. Spin coating component; 51. Upper wafer carrier; 52. Weighing instrument; 53. Elastic member; 54. Weighing housing; 55. Weighing bottom plate; 56. UV pre-curing lamp assembly; 57. Lower wafer carrier; 58. First fixed end; 59. First vacuum interface; 510. Linear motion member; 511. Rotary motion member; 512. Exhaust port; 513. Recycling interface; 514. Glue applicator;

[0048] 6. Vacuum bonding component; 61. Maintenance lifting cylinder; 62. Cover opening lifting cylinder; 63. Pressing cylinder; 64. Side clamping cylinder; 65. Upper cover; 66. Second vacuum interface; 67. Wafer lifting cylinder; 68. Vacuum chamber; 69. Pick-and-place seat; 610. Auxiliary pick-and-place hand; 611. Vacuum bonding support frame; 612. Connecting plate;

[0049] 7. Flipping component; 71. Adsorption carrier; 72. Rotary cylinder; 73. Flipping support;

[0050] 8. Curing component; 81. Planar irradiation lamp; 82. Drag chain; 83. Moving cylinder; 84. Second fixed end; 85. Moving lifting cylinder. Detailed implementation manners

[0051] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application; obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.

[0052] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "top / bottom end", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0053] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "provided with", "sheathed / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0054] Refer to Figures 1 to 12 , a fully automatic bonding machine disclosed in the present invention, including a support frame 4. A calibration component 3, a spin coating component 5, a vacuum bonding component 6 and a robotic arm 2 are arranged inside the support frame 4. The calibration component 3 is located on the left side of the robotic arm 2, the spin coating component 5 is located behind the robotic arm 2, the vacuum bonding component 6 is located on the right side of the robotic arm 2. Two loading and unloading components 1 are arranged at the front end of the support frame 4. The robotic arm 2 is located behind the two loading and unloading components 1. A flipping component 7 is arranged at the left end of the spin coating component 5. A curing component 8 is arranged on the vacuum bonding component 6.

[0055] The support frame 4 includes a support bracket 41, a vacuum bonding base 42, a robotic arm base 43, a flipping and spin coating base 46 and a calibration base 45. A floor foot 44 is fixedly arranged at each of the four corners at the lower end of the support bracket 41. The robotic arm base 43 is located at the front side inside the support bracket 41. The calibration base 45 is located on the left side of the robotic arm base 43. The vacuum bonding base 42 is located on the right side of the robotic arm base 43. The flipping and spin coating base 46 is located behind the robotic arm base 43.

[0056] The vacuum bonding assembly 6 is fixedly connected to the vacuum bonding base 42, the robotic arm 2 is fixedly connected to the robotic arm base 43, the calibration assembly 3 is fixedly connected to the calibration base 45, and the spin coating assembly 5 is fixedly connected to the flipping spin coating base 46.

[0057] The loading and unloading assembly 1 includes a loading and unloading support frame 12, a loading and unloading platform 13, a loading and unloading bottom plate 17, and a loading and unloading vertical frame 15. The loading and unloading platform 13 is fixedly connected to one side of the loading and unloading support frame 12. An installation frame 11 is fixedly arranged on the side of the loading and unloading support frame 12 away from the loading and unloading platform 13, and the installation frame 11 is fixedly connected to the support bracket 41.

[0058] A support platform 14 is fixedly arranged at the upper end of the loading and unloading platform 13. The lower end of the loading and unloading platform 13 is fixedly connected to the loading and unloading vertical frame 15. The lower end of the loading and unloading vertical frame 15 is fixedly connected to the loading and unloading bottom plate 17. One side of the loading and unloading vertical frame 15 is fixedly connected to one side of the loading and unloading support frame 12, and a loading and unloading controller 16 is fixedly arranged on the side of the loading and unloading vertical frame 15 away from the loading and unloading support frame 12.

[0059] The calibration assembly 3 includes a calibrator 31, a calibration support frame 32, and a calibration platform 34. Both the calibrator 31 and the calibration platform 34 are fixedly connected to the upper end of the calibration support frame 32. The calibrator 31 is located at the front end of the calibration platform 34, and a calibration controller 33 is arranged inside the calibration support frame 32.

[0060] The whole bonding machine can fully automatically carry out semiconductor automated production without manual intervention, improving the production speed, making the detection of the bonding thickness value more accurate, improving the bonding quality. The loading and unloading assembly 1 is respectively used for loading wafers and glass and unloading bonding chips.

[0061] The spin coating assembly 5 includes a weighing instrument 52, a weighing housing 54, a weighing bottom plate 55, and a first fixed end 58. The lower end of the weighing instrument 52 is fixedly connected to the upper end of the weighing bottom plate 55. An upper wafer carrier 51 is fixedly arranged at the upper end of the weighing instrument 52. Elastic members 53 are respectively fixedly arranged at the four corners of the weighing bottom plate 55, and the upper ends of the four elastic members 53 are all fixedly connected to the upper end of the weighing housing 54.

[0062] The weighing instrument 52 is located inside the weighing housing 54. The lower end of the weighing housing 54 is fixedly connected to the upper end of the first fixed end 58. A placement hole is opened at the middle position of the first fixed end 58, and a rotary moving member 511 is fixedly arranged in the placement hole. A linear moving member 510 is fixedly arranged at the lower end of the rotary moving member 511, and a lower wafer carrier 57 is fixedly arranged above the rotary moving member 511.

[0063] A first vacuum interface 59 is fixedly arranged on the rotary moving part 511, an air outlet 512 and a recovery interface 513 are fixedly arranged on the first fixed end 58, the air outlet 512 is located on the right side of the rotary moving part 511, a UV pre-curing lamp assembly 56 is fixedly arranged on the weighing housing 54, and the UV pre-curing lamp assembly 56 is located between the weighing bottom plate 55 and the lower wafer carrier 57.

[0064] The flipping assembly 7 includes a flipping support 73 and a rotary cylinder 72. The flipping support 73 is fixedly connected to the left end of the first fixed end 58, the inner side of the flipping support 73 is fixedly connected to the rotary cylinder 72, and an adsorption carrier 71 is slidably arranged on the rotary cylinder 72.

[0065] The spin coating assembly 5 and the flipping assembly 7 can accurately control the dosage of the coating and make the glue coating on the wafer more uniform, without manual operation, making the operation more automated.

[0066] The vacuum bonding assembly 6 includes a vacuum bonding support frame 611, an upper cover 65, a connecting plate 612 and a vacuum chamber 68. A maintenance lifting cylinder 61 is fixedly arranged at the upper end of the vacuum bonding support frame 611, the lower end of the maintenance lifting cylinder 61 is fixedly connected to the upper end of the connecting plate 612, an open cover lifting cylinder 62 is fixedly arranged on the connecting plate 612, the lower end of the open cover lifting cylinder 62 is fixedly connected to the upper end of the upper cover 65, and a pressing cylinder 63 and a side clamping cylinder 64 are fixedly arranged above the upper cover 65.

[0067] The curing assembly 8 includes a second fixed end 84 and a planar irradiation lamp 81. The lower end of the vacuum bonding support frame 611 is fixedly connected to the upper end of the second fixed end 84. A second vacuum interface 66 and a wafer lifting cylinder 67 are fixedly arranged in the cavity hole opened in the second fixed end 84. The second vacuum interface 66 is located on the left side of the wafer lifting cylinder 67. The vacuum chamber 68 is fixedly connected to the upper end of the second fixed end 84. A pick-and-place seat 69 is fixedly arranged at the upper end of the wafer lifting cylinder 67, and the pick-and-place seat 69 is located inside the vacuum chamber 68. The second vacuum interface 66 is communicated with the inside of the vacuum chamber 68, and an auxiliary pick-and-place hand 610 is arranged at the right end of the second fixed end 84.

[0068] A moving cylinder 83 is fixedly arranged at the upper end of the second fixed end 84. The moving cylinder 83 is parallel to the second fixed end 84. The upper end of the moving cylinder 83 is fixedly connected to a planar irradiation lamp 81. A drag chain 82 is fixedly arranged at the right end of the planar irradiation lamp 81. A push rod is slidably arranged on the moving cylinder 83. A universal bearing is arranged at the end of the push rod, and the universal bearing functions as a hinge. The universal bearing is connected to the second fixed end 84, and the lower end of the push rod is connected to the output shaft of a moving lifting cylinder 85.

[0069] The vacuum bonding assembly 6 and the curing assembly 8 can mechanically cure the wafer, reducing the operation actions and increasing the working speed. Operating within the vacuum chamber 68 can reduce or eliminate bubbles, improving the bonding quality and material properties.

[0070] The working principle and usage process of the present invention: Start the robotic arm 2, pick up the wafer from a support platform 14, move the wafer to the calibration platform 34. The calibration platform 34 drives the wafer to rotate, and at the same time, the calibrator 31 performs calibration detection on the wafer.

[0071] The robotic arm 2 drives the wafer to move to the upper wafer carrier 51 for weighing, and then moves the wafer to the lower wafer carrier 57. Start the linear motion part 510 and the rotary motion part 511 for spin coating. Move the lower wafer carrier 57 upward and rotate it. The glue applicator 514 moves to apply the adhesive to the central area of the wafer for glue application treatment. After completion, the lower wafer carrier 57 descends and rotates at different orders and speeds to evenly spread the adhesive on the wafer surface. The lower wafer carrier 57 rises. The robotic arm 2 drives the wafer to move to the upper wafer carrier 51 for weighing, and then drives the wafer to move to the pick - and - place seat 69.

[0072] Pick up the glass from another support platform 14. The robotic arm 2 drives the glass to move to the upper cover 65. At this time, start the side clamping cylinder 64 to clamp the glass.

[0073] Start the pressing cylinder 63 to perform pressing treatment on the wafer and the glass. Start the opening and closing lifting cylinder 62 and close the side clamping cylinder 64. The bonded chip after pressing is located on the pick - and - place seat 69. After starting the planar irradiation lamp 81 to cure the bonded chip, the robotic arm 2 moves the bonded chip to the adsorption carrier 71 for flipping, and then the robotic arm 2 moves the bonded chip to the support platform 14 for unloading.

[0074] The above - mentioned are only the preferred embodiments of the present invention, and do not impose any form of limitation on the present invention. Although the present invention has been disclosed as above with the preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to equivalent embodiments by using the disclosed technical content within the scope of the technical solution of the present invention. However, as long as it does not depart from the content of the technical solution of the present invention, any brief modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. An automatic bonding machine, characterized in that: It includes a support frame (4), inside which there are arranged a calibration component (3), a spin coating component (5), a vacuum bonding component (6) and a robotic arm (2). The calibration component (3) is located on the left side of the robotic arm (2), the spin coating component (5) is located at the rear side of the robotic arm (2), the vacuum bonding component (6) is located on the right side of the robotic arm (2), and at the front end of the support frame (4) there are arranged two loading and unloading components (1). The robotic arm (2) is located at the rear side of the two loading and unloading components (1). At the left end of the spin coating component (5) there is arranged a flipping component (7), and on the vacuum bonding component (6) there is arranged a curing component (8); The vacuum bonding component (6) includes a vacuum bonding support frame (611), an upper cover (65), a connecting plate (612) and a vacuum cavity (68). At the upper end of the vacuum bonding support frame (611) there is fixedly arranged a maintenance lifting cylinder (61), and at the lower end of the maintenance lifting cylinder (61) there is fixedly connected to the upper end of the connecting plate (612). On the connecting plate (612) there is fixedly arranged an open cover lifting cylinder (62), and at the lower end of the open cover lifting cylinder (62) there is fixedly connected to the upper end of the upper cover (65). Above the upper cover (65) there are fixedly arranged a pressing cylinder (63) and a side clamping cylinder (64); The spin coating component (5) includes a weighing instrument (52), a weighing housing (54), a weighing bottom plate (55) and a first fixed end (58). At the lower end of the weighing instrument (52) there is fixedly connected to the upper end of the weighing bottom plate (55). At the upper end of the weighing instrument (52) there is fixedly arranged an upper wafer carrier (51). At the four corners of the weighing bottom plate (55) there are respectively fixedly arranged an elastic member (53), and the upper ends of the four elastic members (53) are all fixedly connected to the upper end of the weighing housing (54); The weighing instrument (52) is located inside the weighing housing (54). At the lower end of the weighing housing (54) there is fixedly connected to the upper end of the first fixed end (58). At the middle position of the first fixed end (58) there is formed a placement hole, and in the placement hole there is fixedly arranged a rotary moving member (511). At the lower end of the rotary moving member (511) there is fixedly arranged a linear moving member (510). Above the rotary moving member (511) there is fixedly arranged a lower wafer carrier (57); On the rotary moving member (511) there is fixedly arranged a first vacuum interface (59). On the first fixed end (58) there are fixedly arranged an air exhaust port (512) and a recovery interface (513). The air exhaust port (512) is located on the right side of the rotary moving member (511). On the weighing housing (54) there is fixedly arranged a UV pre-curing lamp assembly (56), and the UV pre-curing lamp assembly (56) is located between the weighing bottom plate (55) and the lower wafer carrier (57).

2. The fully automatic bonding machine according to claim 1, characterized in that: The support frame (4) includes a support bracket (41), a vacuum bonding base (42), a manipulator base (43), a flip spin coating base (46), and a calibration base (45). At the four corners of the lower end of the support bracket (41), a floor footing (44) is fixedly provided respectively. The manipulator base (43) is located at the front side inside the support bracket (41). The calibration base (45) is located on the left side of the manipulator base (43). The vacuum bonding base (42) is located on the right side of the manipulator base (43). The flip spin coating base (46) is located at the rear side of the manipulator base (43).

3. The fully automatic bonding machine according to claim 2, wherein: The vacuum bonding assembly (6) is fixedly connected to the vacuum bonding base (42). The robotic arm (2) is fixedly connected to the manipulator base (43). The calibration assembly (3) is fixedly connected to the calibration base (45). The spin coating assembly (5) is fixedly connected to the flip spin coating base (46).

4. The fully automatic bonding machine according to claim 2, characterized in that: The loading and unloading assembly (1) includes a loading and unloading support frame (12), a loading and unloading platform (13), a loading and unloading bottom plate (17), and a loading and unloading vertical frame (15). The loading and unloading platform (13) is fixedly connected to one side of the loading and unloading support frame (12). On the side of the loading and unloading support frame (12) away from the loading and unloading platform (13), a mounting frame (11) is fixedly provided. The mounting frame (11) is fixedly connected to the support bracket (41). At the upper end of the loading and unloading platform (13), a support platform (14) is fixedly provided. At the lower end of the loading and unloading platform (13), the loading and unloading vertical frame (15) is fixedly connected. At the lower end of the loading and unloading vertical frame (15), the loading and unloading bottom plate (17) is fixedly connected. One side of the loading and unloading vertical frame (15) is fixedly connected to one side of the loading and unloading support frame (12). On the side of the loading and unloading vertical frame (15) away from the loading and unloading support frame (12), a loading and unloading controller (16) is fixedly provided.

5. A fully automatic bonding machine according to claim 1, characterized in that: The calibration assembly (3) includes a calibrator (31), a calibration support frame (32), and a calibration platform (34). Both the calibrator (31) and the calibration platform (34) are fixedly connected to the upper end of the calibration support frame (32). The calibrator (31) is located at the front end of the calibration platform (34). Inside the calibration support frame (32), a calibration controller (33) is provided.

6. The fully automatic bonding machine according to claim 1, characterized in that: The flipping assembly (7) includes a flipping support member (73) and a rotating cylinder (72). The flipping support member (73) is fixedly connected to the left end of the first fixed end (58). Inside the flipping support member (73), the rotating cylinder (72) is fixedly connected. An adsorption carrier plate (71) is slidably arranged on the rotating cylinder (72).

7. A fully automatic bonding machine according to claim 1, characterized in that: The curing component (8) includes a second fixed end (84) and a planar irradiation lamp (81). The lower end of the vacuum bonding support frame (611) is fixedly connected to the upper end of the second fixed end (84). A second vacuum interface (66) and a wafer lifting cylinder (67) are fixedly arranged in the cavity hole opened in the second fixed end (84). The second vacuum interface (66) is located on the left side of the wafer lifting cylinder (67). The vacuum chamber (68) is fixedly connected to the upper end of the second fixed end (84). The upper end of the wafer lifting cylinder (67) is fixedly provided with a pick-and-place seat (69). The pick-and-place seat (69) is located inside the vacuum chamber (68). The second vacuum interface (66) is communicated with the inside of the vacuum chamber (68). An auxiliary pick-and-place hand (610) is arranged at the right end of the second fixed end (84).

8. The fully automatic bonding machine according to claim 7, wherein: A moving cylinder (83) is fixedly arranged at the upper end of the second fixed end (84). The moving cylinder (83) is parallel to the second fixed end (84). The upper end of the moving cylinder (83) is fixedly connected to the planar irradiation lamp (81). A drag chain (82) is fixedly arranged at the right end of the planar irradiation lamp (81). A push rod is slidably arranged on the moving cylinder (83). A universal bearing is arranged at the end of the push rod. The universal bearing is connected to the second fixed end (84). The lower end of the push rod is connected to the output shaft of a moving and lifting cylinder (85).

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