A manifold microchannel heat sink and method of heat dissipation

Abstract

The present application belongs to the technical field of electronic equipment heat exchange, and discloses a manifold micro-channel type radiator and a heat dissipation method, which comprises a plurality of radiator modules arranged in a linear array, each radiator module comprising two symmetrically arranged heat dissipation units; the heat dissipation unit comprises a manifold distributor and a micro-channel; the manifold distributor is processed with a cold side manifold channel and a hot side manifold channel; the cold side manifold channel is a channel structure that decreases along the direction of coolant inflow, and the hot side manifold channel is an equal cross-section channel; the width of the hot side manifold channel is greater than the width of the inlet end of the cold side manifold channel; the micro-channel comprises a micro-channel substrate and a micro-channel body arranged on the micro-channel substrate; the micro-channel body comprises a cold side micro-channel region and a hot side micro-channel region; the hot side micro-channel region comprises a plurality of hot side micro-channels arranged in parallel, and each hot side micro-channel is provided with a plurality of linearly distributed needle fins; the present application realizes the purpose of effectively utilizing the cooling potential of the hot side manifold channel.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of heat exchange of electronic equipment, and particularly relates to a manifold micro-channel type radiator and a heat dissipation method. BACKGROUND

[0002] With the rapid development of artificial intelligence, highly integrated circuits and microelectronic devices have been widely used to make electronic equipment have more functions, better performance and smaller size; however, the high integration of electronic equipment leads to the emergence of high heat flow per unit area; according to existing research data, the heat flow density of traditional integrated circuits has reached 100 W / cm², and in some special electronic devices, the heat flow density can be as high as 500 W / cm², or even more than 1000 W / cm²; for example: advanced radars, high-power IGBT (Insulated Gate Bipolar Transistor) and high-power laser diode arrays; since the high working temperature of electronic equipment can easily reduce its safety, operating life and performance, the research on heat dissipation of electronic equipment has become an important direction of scientific and technological development.

[0003] Micro-channel radiators have become an important solution to the problem of heat management of high heat flow density electronic chips due to their compact structure, high efficiency, light weight, safety and other superior performance; however, traditional micro-channel radiators have been difficult to meet the requirements of the new generation of electronic equipment for heat management performance; specifically, in the existing micro-channel cooling technology, more attention is paid to the optimization of the cold manifold side, and less attention is paid to the hot manifold side; although the optimization of the cold manifold side can improve the cooling effect, in actual application, the cooling potential of the hot manifold side has not been fully tapped and utilized, which can easily lead to uneven cooling, complex structure and high pressure drop, limiting the efficiency and application range of the micro-channel radiator. SUMMARY

[0004] In view of the technical problems existing in the prior art, the present application provides a manifold micro-channel type radiator and a heat dissipation method to solve the technical problems that the traditional micro-channel radiator can easily lead to uneven cooling, complex structure and high pressure drop.

[0005] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is as follows:

[0006] The present application provides a manifold micro-channel type radiator, which comprises a plurality of radiator modules arranged in a linear array, each radiator module comprising two symmetrically arranged radiator units; the radiator unit comprises a manifold distributor and a micro-channel; the manifold distributor is arranged directly above the micro-channel;

[0007] The manifold distributor is machined with a cold side manifold channel and a hot side manifold channel; the cold side manifold channel is a channel structure that is reduced in the direction of coolant inflow, and the hot side manifold channel is an equal cross-section channel; wherein the width of the hot side manifold channel is greater than the width of the inlet end of the cold side manifold channel;

[0008] The microchannel includes a microchannel substrate and a microchannel body disposed on the microchannel substrate; the microchannel body includes a cold side microchannel region and a hot side microchannel region; the hot side microchannel region includes a plurality of parallel hot side microchannels, and each of the hot side microchannels is provided with a plurality of linearly distributed pin fins.

[0009] Further, the cold side microchannel region includes a plurality of parallel cold side microchannels, and the cold side microchannels are arranged parallel to the hot side microchannels; wherein the width of the cold side microchannel is less than the width of the hot side microchannel.

[0010] Further, the sum of the width of the cold side microchannel and the width of the cold side microchannel spacing is equal to the sum of the width of the hot side microchannel and the width of the hot side microchannel spacing; wherein the cold side microchannel spacing is the spacing between adjacent cold side microchannels, and the hot side microchannel spacing is the spacing between adjacent hot side microchannels.

[0011] Further, the arrangement direction of the plurality of pin fins on the hot side microchannel is perpendicular to the flow direction of the coolant in the hot side manifold channel.

[0012] Further, the cross-section of the pin fin is a circular structure.

[0013] Further, the cold side manifold channel and the hot side manifold channel are separated by a rib wall body.

[0014] Further, the end of the cold side manifold channel is further provided with a first end rib wall connected to the first side wall of the rib wall body, and the inlet end of the hot side manifold channel is further provided with a second end rib wall connected to the second side wall of the rib wall body.

[0015] Further, the inlet end width of the cold side manifold channel is 150μm, and the end width of the cold side manifold channel is 50μm; the inlet end and end width of the hot side manifold channel are both 175μm.

[0016] Further, the width of the cold side microchannel is 30μm, and the width of the hot side microchannel is 40μm; the sum of the width of the cold side microchannel and the width of the cold side microchannel spacing and the sum of the width of the hot side microchannel and the width of the hot side microchannel spacing are both 60μm.

[0017] The application further provides a heat dissipation method, comprising:

[0018] The manifold micro-channel heat sink is installed on the electronic equipment to be cooled; wherein the outer surface of the micro-channel substrate is connected with the electronic equipment to be cooled;

[0019] When the electronic equipment to be cooled is running, the coolant enters into the micro-channel body through the cold-side manifold channel, and flows out through the hot-side manifold channel after heat exchange in the micro-channel body.

[0020] Compared with the prior art, the application has the following beneficial effects:

[0021] The manifold micro-channel heat sink provided by the application designs the hot-side manifold channel as an equal cross-section channel, and designs the width of the hot-side manifold channel to be greater than the width of the inlet end of the cold-side manifold channel, so that the coolant can be more uniformly distributed in the whole hot-side manifold channel, thereby significantly reducing the wall surface temperature, improving the temperature uniformity, avoiding the hot spot problem, achieving the purpose of effectively utilizing the cooling potential of the hot-side manifold channel, and enhancing the overall cooling effect; secondly, by additionally arranging the pin fins in the hot-side micro-channel, the direct convection heat exchange in the hot-side micro-channel is changed into the flow of the outer-sweeping single-row tube bundle, which not only effectively increases the heat exchange surface area of the hot-side micro-channel, but also can destroy the formation of the flow interface layer in the micro-channel based on the tube bundle, thereby greatly strengthening the convection heat exchange, greatly improving the hot spot temperature and the temperature uniformity of the heat exchange surface, and further enhancing the cooling effect; by optimizing the structure of the hot manifold side, the application reduces the flow resistance in the hot-side manifold channel, thereby reducing the pressure drop of the overall system and significantly improving the performance of the micro-channel heat sink, not only realizing efficient heat dissipation, but also reducing the system pressure drop, thereby providing a new solution for the heat dissipation of high heat flux density electronic equipment; the heat sink can dissipate a heat flux density of up to 1425W / cm 2 under a pressure drop of 9762.9Pa, thereby significantly improving the performance of the micro-channel cooling technology. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without any creative effort.

[0023] Fig. 1 The overall structure schematic diagram of the manifold micro-channel heat sink provided for the embodiment 1 is shown in the figure.

[0024] Fig. 2 The three-dimensional structure schematic diagram of the heat dissipation unit in the embodiment 1 is shown in the figure.

[0025] Fig. 3 A top view of the heat dissipation unit in Example 1.

[0026] Wherein, 1 manifold distributor, 2 microchannel; 11 cold side manifold channel, 12 hot side manifold channel, 13 rib wall main body, 14 first end rib wall, 15 second end rib wall; 21 microchannel substrate, 22 microchannel main body; 221 cold side microchannel region, 222 hot side microchannel region, 223 cold side microchannel, 224 hot side microchannel, 225 pin fin. DETAILED DESCRIPTION

[0027] In order to make the technical problems, technical solutions and beneficial effects solved in the present application more clearly understood, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application; obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0028] Example 1

[0029] As shown in the accompanying drawings, Figs. 1-3 Example 1 of the present application provides a manifold microchannel heat sink, which includes a plurality of heat sink modules arranged in a linear array, each heat sink module including two symmetrically arranged heat dissipation units; the heat dissipation unit includes a manifold distributor 1 and a microchannel 2; the manifold distributor 1 is arranged directly above the microchannel 2.

[0030] The manifold distributor 1 is machined with a cold side manifold channel 11 and a hot side manifold channel 12; the cold side manifold channel 11 is a channel structure that decreases in the direction of coolant inflow, and the hot side manifold channel 12 is an equal cross-section channel; wherein the width of the hot side manifold channel 12 is greater than the width of the inlet end of the cold side manifold channel 11;

[0031] In Example 1, the cold side manifold channel 11 and the hot side manifold channel 12 are separated by a rib wall main body 13; the end of the cold side manifold channel 11 is also provided with a first end rib wall 14, and the first end rib wall 14 is connected to the first side wall of the rib wall main body 13; the inlet end of the hot side manifold channel 12 is also provided with a second end rib wall 15, and the second end rib wall 15 is connected to the second side wall of the rib wall main body 13.

[0032] The microchannel 2 comprises a microchannel substrate 21 and a microchannel body 22 arranged on the microchannel substrate 21; the microchannel body 22 comprises a cold side microchannel region 221 and a hot side microchannel region 222; the cold side microchannel region 221 is located directly below the cold side manifold channel 11, and the hot side microchannel region 222 is located directly below the hot side manifold channel 12; the cold side microchannel region 221 comprises a plurality of cold side microchannels 223 arranged in parallel, and the hot side microchannel region 222 comprises a plurality of hot side microchannels 224 arranged in parallel; the cold side microchannels 223 and the hot side microchannels 224 are arranged in parallel with each other; a plurality of needle fins 225 are arranged in a linear distribution on each hot side microchannel 224, and the arrangement direction of the plurality of needle fins 225 on the hot side microchannel 224 is perpendicular to the flow direction of the coolant in the hot side manifold channel 12; the cross section of the needle fin 225 is a circular structure.

[0033] The width of the cold side microchannel 223 is less than the width of the hot side microchannel 224; the sum of the width of the cold side microchannel 223 and the width of the cold side microchannel spacing is equal to the sum of the width of the hot side microchannel 224 and the width of the hot side microchannel spacing; wherein the cold side microchannel spacing is the spacing between two adjacent cold side microchannels 223, and the hot side microchannel spacing is the spacing between two adjacent hot side microchannels 224.

[0034] It should be noted that the cold side microchannels 223 in the cold side microchannel region 221 and the hot side microchannels 224 in the hot side microchannel region 222 are in one-to-one correspondence and communication; when the coolant enters the microchannel body 22, it successively flows through the cold side microchannel 223 and the hot side microchannel 224, and then flows out from the hot side manifold channel 12.

[0035] Dimensional characteristics:

[0036] The thickness of the microchannel substrate is h b =50μm, the height of the manifold distributor and the height of the microchannel are h div =275μm and h c =125μm; the length of the manifold L ) is 1.2mm, and the length of the microchannel W is 0.4mm; the width of the cold manifold inlet W c1 =150μm, and the width of the cold manifold end W c2 =50μm. The width of the hot manifold inlet W h1 =175μm, and the width of the hot manifold end Wh2 =175μm. Microchannel inlet and outlet width. w c,in and w c,out The sizes are 30μm and 40μm, respectively. w c,in and w f,in The sum and w c,out and w f,out The total diameter is 60 μm. There are 5 needle fins on the side of the heat manifold, and the diameter of each needle fin is 14 μm.

[0037] Working principle:

[0038] In the manifold distributor, the hot manifold and cold manifold are located on opposite sides of the microchannel body. Coolant enters the lower microchannels through the cold manifold to fully exchange heat with the heat exchange surface, thus removing heat from the heating surface. The hot manifold side employs a uniformly wide manifold design, which significantly reduces the overall pressure drop compared to a tapered or expanding structure on the hot manifold side. The microchannel body comprises multiple microchannels of uniform width with narrow inlets and wide outlets, used in conjunction with fins to enhance cooling performance. The arrangement of the microchannels ensures that the coolant is evenly distributed across the entire hot manifold side, significantly reducing wall temperature, improving temperature uniformity, and preventing hotspots.

[0039] The manifold microchannel radiator described in Embodiment 1 consists of a manifold distributor on the upper layer and a microchannel body on the lower layer. This radiator employs a uniformly wide microchannel design on the hot manifold side, rather than increasing the manifold width along the overall flow direction. This design significantly improves the cooling efficiency on the hot manifold side and reduces the overall system pressure drop. Furthermore, the invention adds pin fins within the microchannels on the hot manifold side to further enhance the cooling effect, and uses a narrow inlet and wide outlet design for the microchannel inlet to accommodate the pin fins on the hot manifold side. Typically, coolant flows from the cold manifold into the lower microchannel, where it undergoes concentrated heat exchange with the heat exchange surface, and then flows out from the hot manifold. In practical applications, this invention can dissipate up to 1425 W / cm² at a pressure drop of 9762.9 Pa. 2 The increased heat flux density significantly improves the performance of microchannel cooling technology. In the optimized design of the heat manifold, the width and arrangement of the microchannels are precisely calculated to ensure uniform coolant distribution, thereby improving overall cooling efficiency and reducing system energy consumption. This innovative design approach is not only suitable for the heat dissipation needs of current high heat flux density electronic chips but also provides new ideas for more efficient and energy-saving thermal management solutions in the future.

[0040] Example 2

[0041] The manifold micro-channel radiator provided in this embodiment 2 has substantially the same structure and principle as the manifold micro-channel radiator described in the above embodiment 1, and the difference is that:

[0042] In this embodiment 2, a cover plate is further included; the cover plate is provided with a coolant inlet and a coolant outlet, the coolant inlet is used to be connected with the inlet end of the cold-side manifold channel 11, and the coolant outlet is used to be connected with the end of the hot-side manifold channel 12; wherein the coolant inlet on the cover plate serves as an inflow channel of the coolant, and the coolant outlet serves as an outlet channel of the heat-exchanged coolant.

[0043] Embodiment 3

[0044] The heat dissipation method provided in this embodiment 3 utilizes the manifold micro-channel radiator described in the above embodiment 1 or embodiment 2, and includes the following steps:

[0045] The manifold micro-channel radiator is installed on the electronic device to be cooled; wherein the outer surface of the micro-channel substrate 21 is connected with the electronic device to be cooled.

[0046] When the electronic device to be cooled is running, the coolant enters into the micro-channel main body 22 through the cold-side manifold channel 11, and flows out through the hot-side manifold channel 12 after heat exchange in the micro-channel main body 22; wherein when the coolant enters into the micro-channel main body 22, it successively flows through the cold-side micro-channel 223 and the hot-side micro-channel 224, and is fully heat-exchanged in the process of flowing through the cold-side micro-channel 223 and the hot-side micro-channel 224.

[0047] In the present application, the consistent and wide manifold design is adopted on the hot manifold side, so that the coolant can be more uniformly distributed in the whole hot manifold side, thereby significantly reducing the wall temperature, improving the temperature uniformity, and avoiding the hot spot problem. This design effectively utilizes the cooling potential of the hot manifold side, enhances the overall cooling effect; by optimizing the structure design of the hot manifold side, the flow resistance is reduced in the wide hot manifold side, thereby reducing the pressure drop of the overall system. This design not only improves the cooling efficiency, but also reduces the energy consumption of the cooling system, and is suitable for high-efficiency and energy-saving heat dissipation requirements; the present application can dissipate a heat flux of up to 1425W / cm 2 under a pressure drop of 9762.9Pa, which significantly improves the performance of the micro-channel cooling technology.

[0048] The application significantly improves the performance of the micro-channel heat sink by optimizing the structure of the hot manifold side, not only realizes high-efficiency heat dissipation, but also reduces the system pressure drop, and provides a new solution for heat dissipation of high heat flux density electronic equipment. Under the background of rapid development of big data and artificial intelligence, this innovative design has important application prospect and market value, and can effectively cope with the increasing electronic equipment power consumption and heat dissipation challenges.

[0049] The above embodiment is only one of the implementation manners of the technical scheme of the application, and the scope of the application claimed by the application is not limited to the embodiment, but also includes any changes, substitutions and other implementation manners easily thought of by those skilled in the art within the technical scope disclosed by the application.

Claims

1. A manifold microchannel heat sink, comprising: The heat sink module includes two symmetrically arranged heat sink units; the heat sink unit includes a manifold distributor (1) and a microchannel (2); the manifold distributor (1) is arranged directly above the microchannel (2); The manifold distributor (1) is machined with a cold side manifold channel (11) and a hot side manifold channel (12); the cold side manifold channel (11) is a channel structure that decreases in the direction of coolant inflow, and the hot side manifold channel (12) is an equal cross-section channel; wherein the width of the hot side manifold channel (12) is greater than the width of the inlet end of the cold side manifold channel (11); The microchannel (2) includes a microchannel substrate (21) and a microchannel body (22) arranged on the microchannel substrate (21); the microchannel body (22) includes a cold side microchannel region (221) and a hot side microchannel region (222); the hot side microchannel region (222) includes a plurality of parallel hot side microchannels (224), each of which is provided with a plurality of linearly distributed pin fins (225); The cold side microchannel region (221) includes a plurality of parallel cold side microchannels (223), which are arranged parallel to the hot side microchannels (224); wherein the width of the cold side microchannel (223) is less than the width of the hot side microchannel (224); The cold side microchannels (223) in the cold side microchannel region (221) and the hot side microchannels (224) in the hot side microchannel region (222) are in one-to-one correspondence and communication.

2. The manifolded microchannel heat exchanger of claim 1, wherein, The width of the cold side microchannel (223) and the width of the cold side microchannel spacing are equal to the width of the hot side microchannel (224) and the width of the hot side microchannel spacing; wherein the cold side microchannel spacing is the spacing between adjacent two cold side microchannels (223), and the hot side microchannel spacing is the spacing between adjacent two hot side microchannels (224).

3. The manifold microchannel heat sink of claim 1 wherein, The arrangement direction of the plurality of pin fins (225) on the hot side microchannel (224) is perpendicular to the flow direction of the coolant in the hot side manifold channel (12).

4. The manifold microchannel heat sink of claim 3 wherein, The cross section of the pin fin (225) is a circular structure.

5. The manifold microchannel heat sink of claim 1 wherein, The cold side manifold channel (11) and the hot side manifold channel (12) are separated by a rib wall body (13).

6. A manifold microchannel heat sink according to claim 5, wherein, The end of the cold side manifold channel (11) is also provided with a first end rib wall (14), and the first end rib wall (14) is connected with the first side wall of the rib wall body (13); the inlet end of the hot side manifold channel (12) is also provided with a second end rib wall (15), and the second end rib wall (15) is connected with the second side wall of the rib wall body (13).

7. The manifold microchannel heat sink of claim 1 wherein, The inlet end width of the cold side manifold channel (11) is 150μm, and the end width of the cold side manifold channel (11) is 50μm; the inlet end and end width of the hot side manifold channel (12) are both 175μm.

8. The manifold microchannel heat sink of claim 2 wherein, The width of the cold side microchannel (223) is 30 μm, and the width of the hot side microchannel (224) is 40 μm; the sum of the width of the cold side microchannel (223) and the width of the cold side microchannel interval and the sum of the width of the hot side microchannel (224) and the width of the hot side microchannel interval are both 60 μm.

9. A heat dissipation method, characterized by, Comprising: mounting the manifold microchannel heat sink as claimed in any one of claims 1-8 on an electronic device to be cooled; wherein the outer surface of the microchannel substrate (21) is connected to the electronic device to be cooled; when the electronic device to be cooled is in operation, the coolant enters the microchannel main body (22) through the cold side manifold channel (11), exchanges heat in the microchannel main body (22), and then flows out through the hot side manifold channel (12).

Images