Detection device for light-emitting diode wafer and light-emitting diode

Abstract

The present invention discloses a detection device for light-emitting diode wafers and a light-emitting diode, relating to the technical field of light-emitting diodes, including a clamping assembly, and a detection assembly is installed on the upper surface at the rear end of the clamping assembly; the clamping assembly includes a bottom plate, an outer protection frame is fixedly connected to the upper surface of the bottom plate, two clamping cylinders are fixedly installed on two side surfaces of the outer protection frame, and two U-shaped carriers are fixedly connected to one ends of the two clamping cylinders close to each other; firstly, the heat dissipation layer can conduct the heat generated on the substrate, thus completing the heat dissipation of the light-emitting diode in advance. Then, the combined use of the ventilation holes and the heat dissipation holes can promote the air circulation inside the heat dissipation layer, so that the replacement of the air inside the heat dissipation layer can be effectively completed, thereby further improving the heat dissipation rate of the light-emitting diode. At the same time, it also enables the light-emitting diode to have the function of self-heat dissipation, greatly improving the service life of the light-emitting diode.

Description

Technical Field

[0001] The present invention relates to the technical field of light-emitting diodes, and specifically to a detection device and a light-emitting diode for a light-emitting diode wafer. Background Art

[0002] A light-emitting diode wafer is a semiconductor light-emitting component composed of a semiconductor material. The light-emitting diode wafer is the main raw material of an LED and is the light-emitting core component of the LED. During the production and manufacturing process of the light-emitting diode wafer, parameters such as the brightness, thickness, and width of the semiconductor wafer need to be detected. At the same time, defects on the surface of the wafer are also detected.

[0003] Currently, in the existing light-emitting diode wafer detection device, the position of the light-emitting diode wafer is adjusted on the detection table by manual centering during use, which reduces the convenience of using the thickness detection of the light-emitting diode wafer. Moreover, most of the existing wafer detection devices only support the clamping of wafers of one shape, which is not conducive to the comparison of the detection results of wafers of various shapes and greatly reduces the collection efficiency of detection data. At the same time, the existing wafer detection device lacks a switching structure for various detection methods. Therefore, the accuracy of the detection results is reduced. Summary of the Invention

[0004] To solve the defects existing in the prior art, the present invention provides a detection device and a light-emitting diode for a light-emitting diode wafer.

[0005] To solve the above technical problems, the present invention provides the following technical solutions:

[0006] A detection device for a light-emitting diode wafer of the present invention includes a clamping assembly, and a detection assembly is installed on the upper surface at the rear end of the clamping assembly;

[0007] The clamping assembly includes a bottom plate, an outer protection frame is fixedly connected to the upper surface of the bottom plate, two clamping cylinders are fixedly installed on both side surfaces of the outer protection frame, two U-shaped carriers are fixedly connected to the ends of the two clamping cylinders close to each other, two guide rails are fixedly connected to the surfaces of the two U-shaped carriers close to each other, and two driven blocks are clamped outside the front end and the rear end of each guide rail.

[0008] As a preferred technical solution of the present invention, the clamping assembly further includes a main adjustment screw, the main adjustment screw is respectively threadedly connected to the inner cavities of the driven blocks away from the guide rails, and the front end and the rear end of the main adjustment screw are respectively embedded in the middle positions of the front and back surfaces of the U-shaped carriers through bearings. Two servo motors are fixedly installed at the top positions of the front surfaces of the two U-shaped carriers, and a liquid storage groove is opened on the upper surface of each driven block, and an oil guide hole is opened on the bottom surface of the inner cavity of each liquid storage groove.

[0009] As a preferred technical solution of the present invention, an outer fixing tube is fixedly connected to the upper surface of each driven clamping block. A corner claw is inserted into the inner cavity of each outer fixing tube. An oil inlet hole is opened in the middle position of the upper surface of each corner claw. A jack is opened on one side of each outer fixing tube close to the guide rail. A clamping groove is opened at the bottom of one side of each corner claw close to the guide rail.

[0010] As a preferred technical solution of the present invention, a limit post is inserted into the inner cavities of each jack and the clamping groove. A positioning spring is fixedly connected to the side of each limit post opposite to the outer fixing tube. The mutually remote ends of the two limit posts on the left side and the right side are fixedly connected with two telescopic rods. A middle support platform is fixedly connected to the middle position of the upper surface of the base plate.

[0011] As a preferred technical solution of the present invention, the detection assembly includes a main frame plate. The lower end of the main frame plate is fixedly connected to the upper surface of the rear end of the outer protection frame. A lifting cylinder is installed on the upper surface of the front end of the main frame plate. A stepping motor is installed at the lower end of the lifting cylinder. A track plate is fixedly connected to the end of the output shaft on the lower side of the stepping motor. A lower matching frame is sleeved outside the lower end of the track plate.

[0012] As a preferred technical solution of the present invention, a horizontal adjustment cylinder is fixedly installed on the right side surface of the track plate, and the left end of the horizontal adjustment cylinder is fixedly connected to the right side surface of the upper end of the lower matching frame. A rotary cylinder is fixedly installed on the right side surface of the lower end of the lower matching frame. The left end of the rotary cylinder is fixedly connected to an inner follower plate. A non-contact thickness gauge is fixedly installed on the upper surface of the inner follower plate. A camera is fixedly installed on the lower surface of the inner follower plate.

[0013] As a preferred technical solution of the present invention, a content groove is opened on the front surface of the upper end of the lower matching frame. An inner insertion plate is inserted into the inner cavity of the content groove. A sponge brush is bonded to the lower surface of the inner insertion plate. Upper fixing bolts are in threaded connection with the front surface of the inner insertion plate and the front surface of the upper end of the lower matching frame respectively.

[0014] As a preferred technical solution of the present invention, reverse threads are provided on the outer walls of the front end and the rear end of the main adjustment screw.

[0015] As a preferred technical solution of the present invention, an arc-shaped groove is opened at one end of each corner claw close to the middle support platform.

[0016] A light-emitting diode includes a light-emitting diode body. The light-emitting diode body includes a substrate. A wafer is installed in the middle position of the upper surface of the substrate. The outside of the wafer is covered with a transparent dielectric layer. A first electrode is provided on the lower surface of the left end of the substrate, and a second electrode is provided on the lower surface of the right end of the substrate. A heat dissipation layer is fixedly connected to the lower surface of the substrate. An air vent cavity communicating with each other is formed inside the heat dissipation layer, and heat dissipation holes communicating with the air vent cavity are respectively formed on the outer surface of the heat dissipation layer.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. For this light-emitting diode, through the provided heat dissipation layer, air vent cavity and heat dissipation holes, first of all, the heat dissipation layer can conduct the heat generated on the substrate, thus completing the heat dissipation of the light-emitting diode in the first step. Then, the combined use of the air vent holes and heat dissipation holes can promote the air circulation inside the heat dissipation layer, so that the replacement of the air inside the heat dissipation layer can be effectively completed, thereby further improving the heat dissipation rate of the light-emitting diode. At the same time, it also enables the light-emitting diode to have the function of self-heat dissipation, greatly improving the service life of the light-emitting diode.

[0019] 2. For the detection device for the wafer of the light-emitting diode and the light-emitting diode, through the provided clamping assembly, first, controlling the start of the two clamping cylinders can drive the driven blocks and claw fingers on both sides to move simultaneously in opposite directions. When the claw fingers on both sides contact the two end faces of the wafer, the preliminary fixation of the wafer is completed at this time. Then, controlling the forward rotation of the servo motor can drive the main adjustment screw to rotate forward. The forward rotation of the main adjustment screw can drive the outer fixing tubes and claw fingers in the front and rear directions to move simultaneously in opposite directions. When the claw fingers in the front and rear directions contact the front and rear end faces of the wafer, the secondary fixation of the wafer is quickly completed at this time. Through the two fixations of the wafer, the centering of the wafer is quickly completed, and this centering method is time-saving and labor-saving, greatly improving the user experience. Again, through the combined use of the clamping cylinders and the servo motor, it is convenient to clamp wafers of circular, square, rectangular and hemispherical shapes, so that it is convenient to compare and analyze the detection structures of wafers of various shapes, greatly improving the collection efficiency of detection data. Finally, controlling the two telescopic rods to pull in opposite directions can drive the two limit posts to move in opposite directions. When the two limit posts are fully separated from the inner cavity of the card slot, pulling up the claw fingers respectively at this time can quickly complete its disassembly, thus facilitating the replacement of new claw fingers, greatly improving the practicability of the entire device.

[0020] 3. The detection device for light-emitting diode wafers and the light-emitting diode can drive the camera to move downward to the shooting height by controlling the lifting cylinder to start through the provided detection component. Then, by controlling the horizontal adjustment cylinder to start, it can drive the lower mounting rack and the camera to move leftward simultaneously, so that the observation diameter of the camera for the wafer can be quickly adjusted. By controlling the stepping motor to start, it can drive the camera at the adjusted height to rotate, enabling the camera to photograph the wafer in all directions, thus effectively improving the work efficiency of the staff in detecting the surface defects of the wafer. By controlling the rotating cylinder to start, it can drive the inner follower plate to rotate 180° clockwise. When the inner follower plate rotates 180°, it can drive the non-contact thickness gauge to flip to directly below. At this time, by controlling the lifting cylinder to start, it can drive the detection end of the non-contact thickness gauge to approach the wafer, facilitating the completion of the thickness detection of the wafer. Finally, by controlling the horizontal adjustment cylinder and the stepping motor to start, it can drive the non-contact thickness gauge to perform all-round thickness detection on the wafer, greatly improving the detection rate. At the same time, it has the function of quickly switching between multiple detection methods, greatly improving the accuracy of the detection results. Brief Description of the Drawings

[0021] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention. In the drawings:

[0022] Figure 1 is the structural schematic diagram of the present invention;

[0023] Figure 2 is the structural schematic diagram of the right side view of the present invention;

[0024] Figure 3 is the front cross-sectional view of the present invention;

[0025] Figure 4 is of the present invention Figure 3 three-dimensional view;

[0026] Figure 5 is the side cross-sectional view of the present invention;

[0027] Figure 6 is the side cross-sectional view of the corner claw and the driven chuck of the present invention;

[0028] Figure 7 is the front cross-sectional view of the corner claw and the driven chuck of the present invention;

[0029] Figure 8 is the structural schematic diagram of the light-emitting diode body of the present invention;

[0030] Figure 9 is of the present invention Figure 8 front cross-sectional view;

[0031] Figure 10 is a cross-sectional view of the bottom of the heat dissipation layer of the present invention;

[0032] Figure 11 is a schematic structural view of the clamping of wafers with different shapes by the corner claws of the present invention;

[0033] Figure 12 is of the present invention Figure 4 an enlarged view of part A in;

[0034] Figure 13 is of the present invention Figure 5 an enlarged view of part B in;

[0035] Figure 14 is of the present invention Figure 6 an enlarged view of part C in;

[0036] Figure 15 is of the present invention Figure 7 an enlarged view of part D in.

[0037] In the figure: 1, light-emitting diode body; 101, substrate; 102, wafer; 103, transparent dielectric layer; 104, first electrode; 105, second electrode; 106, heat dissipation layer; 107, ventilation cavity; 108, heat dissipation hole; 2, clamping assembly; 201, bottom plate; 202, outer protection frame; 203, clamping cylinder; 204, U-shaped carrier; 205, guide rail; 206, driven block; 207, main adjustment screw; 208, servo motor; 209, liquid storage tank; 210, oil guide hole; 211, outer fixed pipe; 212, corner claw; 213, oil inlet hole; 214, jack; 215, clamping groove; 216, limit post; 217, positioning spring; 218, telescopic rod; 219, middle support platform; 3, detection assembly; 301, main frame plate; 302, lifting cylinder; 303, stepping motor; 304, track plate; 305, lower matching frame; 306, horizontal adjustment cylinder; 307, rotary cylinder; 308, inner follower plate; 309, non-contact thickness gauge; 310, camera; 311, content groove; 312, inner insertion plate; 313, sponge brush; 314, upper fixing bolt. Specific Embodiments

[0038] The following is a description of the preferred embodiments of the present invention with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only for the purpose of illustrating and explaining the present invention, and are not intended to limit the present invention.

[0039] Embodiment: As Figure 1-15 shown, a detection device for light-emitting diode wafers according to the present invention includes a clamping assembly 2, and a detection assembly 3 is installed on the upper surface at the rear end of the clamping assembly 2;

[0040] The clamping assembly 2 includes a bottom plate 201. The upper surface of the bottom plate 201 is fixedly connected with an outer protection frame 202. Two clamping cylinders 203 are fixedly installed on the two side surfaces of the outer protection frame 202. Two U-shaped carriers 204 are fixedly connected to the ends of the two clamping cylinders 203 that are close to each other. Two guide rails 205 are fixedly connected to the surfaces of the two U-shaped carriers 204 that are close to each other. Two driven clamping blocks 206 are clamped to the outside of the front end and the rear end of each guide rail 205; the clamping assembly 2 further includes a main adjustment screw 207. The main adjustment screw 207 is threadedly connected to the inner cavities of the driven clamping blocks 206 that are far away from one end of the guide rails 205, and the front end and the rear end of the main adjustment screw 207 are respectively embedded in the middle positions of the front and back surfaces of the U-shaped carriers 204 through bearings. Two servo motors 208 are fixedly installed at the top positions of the front surfaces of the two U-shaped carriers 204. A liquid storage tank 209 is opened on the upper surface of each driven clamping block 206. An oil guide hole 210 is opened on the bottom surface of the inner cavity of each liquid storage tank 209; an outer fixed tube 211 is fixedly connected to the upper surface of each driven clamping block 206. A corner claw 212 is inserted into the inner cavity of each outer fixed tube 211. An oil inlet hole 213 is opened at the middle position of the upper surface of each corner claw 212. A jack 214 is opened on the surface of each outer fixed tube 211 that is close to the guide rail 205. A clamping groove 215 is opened at the bottom of the surface of each corner claw 212 that is close to the guide rail 205; a limit post 216 is inserted into the inner cavities of each jack 214 and the clamping groove 215. A positioning spring 217 is fixedly connected to the surface of each limit post 216 that is opposite to the outer fixed tube 211. The ends of the two limit posts 216 on the left and the right that are far away from each other are fixedly connected with two telescopic rods 218. A middle support platform 219 is fixedly connected to the middle position of the upper surface of the bottom plate 201.

[0041] Among them, through the set clamping assembly 2, first controlling the start of two clamping cylinders 203 can drive the two U-shaped carriers 204 to move in opposite directions. When the two U-shaped carriers 204 move in opposite directions, they can drive the driven blocks 206 and the corner claws 212 on both sides to move in opposite directions at the same time. When the corner claws 212 on both sides contact the two end faces of the wafer 102, the preliminary fixation of the wafer 102 is completed at this time. Then, controlling the forward rotation of the servo motor 208 can drive the main adjustment screw 207 to rotate forward. When the main adjustment screw 207 rotates forward, it can drive the driven blocks 206 at the front and rear to move in opposite directions. When the driven blocks 206 at the front and rear move in opposite directions, they can drive the outer fixing tubes 211 and the corner claws 212 at the front and rear to move in opposite directions at the same time. When the corner claws 212 at the front and rear contact the front and rear end faces of the wafer 102, the secondary fixation of the wafer 102 is quickly completed at this time. Through the two fixations of the wafer 102, the centering of the wafer 102 is quickly completed. Moreover, this centering method saves time and effort and greatly improves the user experience. By the combined use of the clamping cylinder 203 and the servo motor 208, it is convenient to clamp wafers 102 of circular, square, rectangular, and hemispherical shapes. In this way, it is convenient to compare and analyze the detection structures of wafers 102 of various shapes, and the collection efficiency of detection data is greatly improved.

[0042] The detection assembly 3 includes a main frame plate 301. The lower end of the main frame plate 301 is fixedly connected to the upper surface of the rear end of the outer protection frame 202. An elevating cylinder 302 is installed on the upper surface of the front end of the main frame plate 301. A stepping motor 303 is installed at the lower end of the elevating cylinder 302. A track plate 304 is fixedly connected to the end of the output shaft on the lower side of the stepping motor 303. The outer part of the lower end of the track plate 304 is sleeved with a lower matching frame 305; a horizontal adjustment cylinder 306 is fixedly installed on the right side surface of the track plate 304, and the left end of the horizontal adjustment cylinder 306 is fixedly connected to the right side surface of the upper end of the lower matching frame 305. A rotary cylinder 307 is fixedly installed on the right side surface of the lower end of the lower matching frame 305. The left end of the rotary cylinder 307 is fixedly connected to an inner follower plate 308. A non-contact thickness gauge 309 is fixedly installed on the upper surface of the inner follower plate 308, and a camera 310 is fixedly installed on the lower surface of the inner follower plate 308; a content groove 311 is opened on the front surface of the upper end of the lower matching frame 305. An inner insertion plate 312 is inserted into the inner cavity of the content groove 311. A sponge brush 313 is adhered to the lower surface of the inner insertion plate 312. Upper fixing bolts 314 are threadedly connected to the front surface of the inner insertion plate 312 and the front surface of the upper end of the lower matching frame 305.

[0043] Among them, through the provided detection component 3, first, controlling the start of the lifting cylinder 302 can drive the stepping motor 303 and the track plate 304 to move downward simultaneously. The downward movement of the track plate 304 can drive the lower matching frame 305 and the rotating cylinder 307 to move downward simultaneously. The downward movement of the rotating cylinder 307 can drive the inner follower plate 308 and the camera 310 to move downward simultaneously. In this way, the camera 310 can be controlled to move downward to the shooting height. Then, controlling the start of the horizontal adjustment cylinder 306 can drive the lower matching frame 305 and the camera 310 to move leftward simultaneously. In this way, the observation diameter of the camera 310 for the wafer 102 can be quickly adjusted. Then, controlling the start of the stepping motor 303 can drive the adjusted-height camera 310 to rotate. In this way, the camera 310 can be promoted to shoot the wafer 102 in all directions, thereby effectively improving the working efficiency of the staff in detecting the surface defects of the wafer 102. Then, controlling the start of the rotating cylinder 307 can drive the inner follower plate 308 to rotate forward by 180°. The 180° forward rotation of the inner follower plate 308 can drive the non-contact thickness gauge 309 to flip to directly below. At this time, controlling the start of the lifting cylinder 302 can drive the detection end of the non-contact thickness gauge 309 to approach the wafer 102, thus facilitating the completion of the thickness detection of the wafer 102. Among them, the rotation angles of the camera 310 and the non-contact thickness gauge 309 are up to 360°. After rotating 360°, the stepping motor 303 will control the camera 310 and the non-contact thickness gauge 309 to rotate reversely by 360°, which can effectively avoid the entanglement of the connection lines.

[0044] Reverse threads are provided on the outer walls of the front end and the rear end of the main adjustment screw 207.

[0045] An arc-shaped groove is provided at one end of each corner claw 212 close to the middle support platform 219.

[0046] Among them, the arc-shaped groove can facilitate the clamping of the circular wafer 102.

[0047] A light-emitting diode includes a light-emitting diode body 1. The light-emitting diode body 1 includes a substrate 101. A wafer 102 is installed at the middle position of the upper surface of the substrate 101. The outside of the wafer 102 is covered with a transparent dielectric layer 103. A first electrode 104 is provided on the lower surface of the left end of the substrate 101. A second electrode 105 is provided on the lower surface of the right end of the substrate 101. A heat dissipation layer 106 is fixedly connected to the lower surface of the substrate 101. A ventilation cavity 107 communicating with each other is provided inside the heat dissipation layer 106. Heat dissipation holes 108 communicating with the ventilation cavity 107 are respectively provided on the outer surface of the heat dissipation layer 106.

[0048] During operation, first, controlling the start of two clamping cylinders 203 can drive the two U-shaped carriers 204 to move in opposite directions. The movement of the two U-shaped carriers 204 in opposite directions can drive the driven blocks 206 and the corner claws 212 on both sides to move in opposite directions simultaneously. When the corner claws 212 on both sides come into contact with the two end faces of the wafer 102, the preliminary fixation of the wafer 102 is completed at this time. Then, controlling the forward rotation of the servo motor 208 can drive the main adjustment screw 207 to rotate forward. The forward rotation of the main adjustment screw 207 can drive the driven blocks 206 at the front and rear to move in opposite directions. The movement of the driven blocks 206 at the front and rear in opposite directions can drive the outer fixing tubes 211 and the corner claws 212 at the front and rear to move in opposite directions simultaneously. When the corner claws 212 at the front and rear come into contact with the front and rear end faces of the wafer 102, the secondary fixation of the wafer 102 is quickly completed at this time. Through the two fixations of the wafer 102, the centering of the wafer 102 is quickly completed, and this centering method saves time and effort, greatly improving the user experience. Moreover, through the combined use of the clamping cylinders 203 and the servo motor 208, it is convenient to clamp wafers 102 of circular, square, rectangular, and hemispherical shapes. Finally, controlling the two telescopic rods 218 to pull in opposite directions can drive the two limit posts 216 to move in opposite directions. When the two limit posts 216 are fully disengaged from the inner cavity of the card slot 215, pulling the corner claws 212 upward respectively at this time can quickly complete their disassembly, thus facilitating the replacement of new corner claws 212, as Figure 11 shown;

[0049] Detection of the wafer 102: First, control the lifting cylinder 302 to start, which can drive the stepping motor 303 and the track plate 304 to move downward simultaneously. When the track plate 304 moves downward, it can drive the lower matching frame 305 and the rotating cylinder 307 to move downward simultaneously. When the rotating cylinder 307 moves downward, it can drive the inner follower plate 308 and the camera 310 to move downward simultaneously. In this way, the camera 310 can be controlled to move downward to the shooting height. Then, control the horizontal adjustment cylinder 306 to start, which can drive the lower matching frame 305 and the camera 310 to move leftward simultaneously. In this way, the observation diameter of the camera 310 for the wafer 102 can be quickly adjusted. Then, control the stepping motor 303 to start, which can drive the camera 310 at the adjusted height to rotate. In this way, the camera 310 can be promoted to shoot the wafer 102 in all directions, thus effectively improving the work efficiency of the staff in detecting the surface defects of the wafer 102. Then, control the rotating cylinder 307 to start, which can drive the inner follower plate 308 to rotate 180° clockwise. When the inner follower plate 308 rotates 180° clockwise, it can drive the non-contact thickness gauge 309 to flip to directly below. At this time, control the lifting cylinder 302 to start, which can drive the detection end of the non-contact thickness gauge 309 to approach the wafer 102, so as to facilitate the completion of the thickness detection of the wafer 102. Among them, the maximum rotation angle of the camera 310 and the non-contact thickness gauge 309 is 360°. After rotating 360°, the stepping motor 303 will control the camera 310 and the non-contact thickness gauge 309 to rotate counterclockwise by 360°, which can effectively avoid the entanglement of the connecting wires. According to the above principle, finally, control the horizontal adjustment cylinder 306 and the stepping motor 303 to start, which can drive the non-contact thickness gauge 309 to perform all-round thickness detection on the wafer 102. After the detection of the wafer 102 is completed, control the rotating cylinder 307 to start. When the rotating cylinder 307 starts, it can drive the inner follower plate 308 to rotate 180° counterclockwise. At this time, the reset of the camera 310 and the non-contact thickness gauge 309 is quickly completed, so that the device can be continuously used. At the same time, through the forward and reverse rotation of the camera 310, the surface of its imaging end can be automatically rubbed against the sponge brush 313, so as to effectively complete the automatic cleaning of the camera 310. Then, control the upper fixing bolt 314 to rotate counterclockwise. When the upper fixing bolt 314 disengages from the inside of the lower matching frame 305, at this time, pulling the inner insertion plate 312 outward can quickly complete the disassembly and replacement of the sponge brush 313;

[0050] Lubrication of the transmission structure: First, introduce the lubricating oil into the inside of the oil inlet hole 213. The oil inlet hole 213 will transmit the lubricating oil to the inside of the liquid storage tank 209. Then, the oil guiding hole 210 will transmit the lubricating oil to the surface of the main adjustment screw 207. Finally, the servo motor 208 controls the main adjustment screw 207 to rotate forward and backward, which can drive the oil guiding hole 210 to automatically coat the lubricating oil on the surface of the main adjustment screw 207. In this way, the automatic lubrication of the main adjustment screw 207 is effectively completed.

[0051] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A detection device for light-emitting diode wafers, comprising a clamping assembly (2), characterized in that, The clamping assembly (2) is provided with a detection assembly (3) on the upper surface of its rear end; The clamping assembly (2) includes a bottom plate (201). The upper surface of the bottom plate (201) is fixedly connected with an outer protection frame (202). Two clamping cylinders (203) are fixedly installed on the two side surfaces of the outer protection frame (202). One end of the two clamping cylinders (203) close to each other is fixedly connected with two U-shaped carriers (204). Two guide rails (205) are fixedly connected to the surfaces of the two U-shaped carriers (204) close to each other. Two driven clamping blocks (206) are clamped to the outside of the front end and the rear end of each guide rail (205); The clamping assembly (2) further includes a main adjustment screw rod (207). The main adjustment screw rod (207) is respectively in threaded connection with the inner cavities of the driven clamping blocks (206) away from one end of the guide rails (205). The front end and the rear end of the main adjustment screw rod (207) are respectively embedded in the middle positions of the front and rear surfaces of the U-shaped carriers (204) through bearings. Two servo motors (208) are fixedly installed at the top positions of the front surfaces of the two U-shaped carriers (204). A liquid storage tank (209) is opened on the upper surface of each driven clamping block (206). An oil guide hole (210) is opened on the bottom surface of the inner cavity of each liquid storage tank (209); An outer fixed pipe (211) is fixedly connected to the upper surface of each driven clamping block (206). A corner claw (212) is inserted into the inner cavity of each outer fixed pipe (211). An oil inlet hole (213) is opened at the middle position of the upper surface of each corner claw (212). A jack (214) is opened on the surface of each outer fixed pipe (211) close to the guide rail (205). A clamping groove (215) is opened at the bottom of the surface of each corner claw (212) close to the guide rail (205); A limit post (216) is inserted into the inner cavities of each jack (214) and the clamping groove (215). A positioning spring (217) is fixedly connected to the surface of each limit post (216) opposite to the outer fixed pipe (211). One end of the two limit posts (216) on the left and right away from each other is fixedly connected with two telescopic rods (218). A middle support platform (219) is fixedly connected to the middle position of the upper surface of the bottom plate (201); The detection assembly (3) includes a main frame plate (301). The lower end of the main frame plate (301) is fixedly connected with the upper surface of the rear end of the outer protection frame (202). A lifting cylinder (302) is installed on the upper surface of the front end of the main frame plate (301). A stepping motor (303) is installed at the lower end of the lifting cylinder (302). A track plate (304) is fixedly connected to the end of the output shaft on the lower side of the stepping motor (303). A lower matching frame (305) is sleeved on the outside of the lower end of the track plate (304); A horizontal adjustment cylinder (306) is fixedly installed on the right side surface of the track pad (304), and the left end of the horizontal adjustment cylinder (306) is fixedly connected to the right side surface of the upper end of the lower mounting frame (305). A rotary cylinder (307) is fixedly installed on the right side surface of the lower end of the lower mounting frame (305). The left end of the rotary cylinder (307) is fixedly connected to an inner follower plate (308). A non-contact thickness gauge (309) is fixedly installed on the upper surface of the inner follower plate (308), and a camera (310) is fixedly installed on the lower surface of the inner follower plate (308). A content groove (311) is opened on the front surface of the upper end of the lower mounting frame (305). An inner insertion plate (312) is inserted into the inner cavity of the content groove (311). A sponge brush (313) is adhered to the lower surface of the inner insertion plate (312). Upper fixing bolts (314) are threadedly connected to the front surface of the inner insertion plate (312) and the front surface of the upper end of the lower mounting frame (305).

2. The detection device for light-emitting diode wafers according to claim 1, wherein, Reverse threads are provided on the outer walls of the front end and the rear end of the main adjustment screw rod (207).

3. The detection device for light-emitting diode wafers according to claim 1, characterized in that, An arc-shaped groove is provided at one end of each corner claw (212) close to the middle support platform (219).

Images