Display and electronic device including the same

Abstract

According to one embodiment of the present invention, a display may include: a display panel including a light emitting layer; a flexible printed circuit board extending from the display panel and at least partially disposed on a rear surface of the display panel; a display driver integrated circuit (DDI) disposed on one surface of the flexible printed circuit board and configured to drive the display panel; and a shielding film attached to the flexible printed circuit board while surrounding at least a portion of the DDI. In one embodiment, the flexible printed circuit board may include at least one through hole or at least one groove formed in an area to which the shielding film is attached. Various other embodiments may also be possible.

Description

Technical Field

[0001] One or more embodiments of the present disclosure relate to an electronic device, for example, a display and / or an electronic device including the display. Background Art

[0002] With the development of electronic, information or communication technology, various functions are included in a single electronic device. For example, a smart phone may include a function of a sound playback device, an imaging device or a digital diary in addition to a communication function, and more various functions may be implemented in the smart phone by installing additional applications. An electronic device may be provided with various pieces of information in real time by accessing a server or another electronic device in a wired or wireless manner and by executing an installed application or a stored file.

[0003] As the performance of electronic devices is improving and the size of electronic devices is shrinking, it has become possible for users to carry and use electronic devices every day. The development of information and communication technology has made it convenient to carry and use electronic devices by increasing the integration of electronic devices. As the integration of electronic devices increases, a stable operating environment can be provided inside the electronic device by suppressing mutual interference between components and protecting internal components from external causes (e.g., temperature and humidity changes or shocks caused by falling).

[0004] The above information is provided as background technology to assist in understanding the present disclosure. No statement or determination is made as to whether any of the above may be applicable as prior art related to the present disclosure. Summary of the invention

[0005] Technical Solution According to an embodiment of the present disclosure, a display may include: a display panel including a light emitting layer; a flexible printed circuit board extending from the display panel and at least partially disposed on a rear surface of the display panel; a display driver integrated circuit ("DDI") disposed on one surface of the flexible printed circuit board and configured to drive the display panel; and a shielding film attached to the flexible printed circuit board in a state of surrounding at least a portion of the DDI. In an embodiment, the flexible printed circuit board may include at least one through hole or at least one groove disposed in a region where the shielding film is attached.

[0006] According to an embodiment of the present disclosure, an electronic device may include: a housing including a first surface, a second surface facing a direction opposite to the first surface, and a side structure surrounding at least a portion of a space between the first surface and the second surface; a display disposed in a space at least partially surrounded by the side structure and configured to output a picture through at least a portion of the first surface; and a processor or a communication module configured to perform wireless communication by using at least a portion of the side structure (hereinafter referred to as a "radiation conductor"). In an embodiment, the display may include: a display panel including a light-emitting layer; a flexible printed circuit board extending from the display panel at a position adjacent to the radiation conductor and at least partially disposed on a rear surface of the display panel; a DDI disposed on one surface of the flexible printed circuit board and configured to drive the display panel; and a shielding film attached to the flexible printed circuit board in a state of surrounding at least a portion of the DDI. In an embodiment, the flexible printed circuit board may include at least one through hole or at least one groove disposed in an area to which the shielding film is attached. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The above or other aspects, configurations and / or advantages of embodiments of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings.

[0008] Figure 1 is a block diagram illustrating an electronic device according to an embodiment of the present disclosure within a network environment.

[0009] Figure 2 is a front perspective view of an electronic device according to an embodiment of the present disclosure.

[0010] Figure 3 yes Figure 2 0 is a rear perspective view of an electronic device according to an embodiment of the present disclosure shown in .

[0011] Figure 4 It is shown Figure 2 0 is a front exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0012] Figure 5 It is shown Figure 2 0 is a rear exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0013] Figure 6 is an exploded perspective view showing a display of an electronic device according to an embodiment of the present disclosure.

[0014] Figure 7 is a view showing a shielding film in a display of an electronic device according to an embodiment of the present disclosure.

[0015] Figure 8 The present invention is a diagram showing an embodiment of the present invention. Figure 7 View of the shielding film.

[0016] Fig. 9 It is shown along Figure 7 A view of a shielding film according to an embodiment of the present disclosure cut along line AA' in FIG.

[0017] Fig.10 is a perspective view illustrating a state in which a flexible printed circuit board is disposed on a display panel in a display of an electronic device according to an embodiment of the present disclosure.

[0018] Fig.11 is a perspective view illustrating a state in which a shielding film is provided on a flexible printed circuit board in a display of an electronic device according to an embodiment of the present disclosure.

[0019] Fig.12 is a view showing the arrangement of a side structure or a supporting member and a shielding film in an electronic device according to an embodiment of the present disclosure.

[0020] Fig.13 is a view showing an arrangement of through holes or grooves in a display of an electronic device according to an embodiment of the present disclosure.

[0021] Fig.14 is a view for explaining the arrangement of through holes or grooves in a display of an electronic device according to an embodiment of the present disclosure.

[0022] Fig.15 is a view showing an arrangement of through holes or slits in a display of an electronic device according to an embodiment of the present disclosure.

[0023] Fig.16 2 is a view for explaining the arrangement of through holes or slits in a display of an electronic device according to an embodiment of the present disclosure.

[0024] Fig.17 is a view illustrating an arrangement of slits in a display of an electronic device according to an embodiment of the present disclosure.

[0025] Fig.18 is a view for explaining arrangement of slits in a display of an electronic device according to an embodiment of the present disclosure.

[0026] Fig.19 is a view showing an arrangement of through holes or grooves in a display of an electronic device according to an embodiment of the present disclosure.

[0027] Fig. 20is a view for explaining the arrangement of through holes or grooves in a display of an electronic device according to an embodiment of the present disclosure.

[0028] Fig.21 is a view showing an arrangement of through holes or slits in a display of an electronic device according to an embodiment of the present disclosure.

[0029] Fig. 22 2 is a view for explaining the arrangement of through holes or slits in a display of an electronic device according to an embodiment of the present disclosure.

[0030] Throughout the drawings, like reference numerals may be assigned to like components, elements and / or structures. DETAILED DESCRIPTION

[0031] Due to the increase in the integration of electronic devices and / or the reduction in the size of electronic devices, the operating environment of various components inside the electronic device may be poor. For example, as the generation of electromagnetic waves increases in the operation of circuit devices such as various processors or communication modules, electronic interference may degrade the operating efficiency (e.g., power efficiency) of other circuit devices or cause failures. When multiple antennas corresponding to different communication protocols or antennas for transmitting / receiving wireless power are installed in a reduced-size electronic device, the wireless communication environment may become worse. In an electronic device, electromagnetic interference between various components can be suppressed by providing a structure or component for electromagnetic shielding between various components. However, when the shielding structure is arranged adjacent to the antenna, the radiation performance of the antenna will deteriorate. The change in the radiation performance of the antenna caused by the structure adjacent to the antenna may be caused by the manufacturing tolerance or assembly tolerance of the structure. For example, there may be deviations in the antenna radiation performance in a plurality of different products manufactured with the same specifications.

[0032] The embodiments of the present disclosure are intended to at least solve the above-mentioned problems and / or disadvantages and provide at least the following advantages, and are capable of providing a shielding structure capable of providing a stable wireless communication environment, a display including the shielding structure and / or an electronic device including the display.

[0033] Embodiments of the present disclosure may provide a display in which generation of manufacturing tolerance or assembly tolerance is suppressed and / or an electronic device including the display.

[0034] Technical problems to be solved by the present disclosure are not limited to those described above, and other technical problems not described above can be clearly understood by ordinary technicians in the relevant field to which the present disclosure belongs from the following description.

[0035] The following description with reference to the accompanying drawings can provide an understanding of various exemplary implementations of the present disclosure (including claims and their equivalents). The exemplary embodiments disclosed in the following description include various specific details to aid understanding, but are considered to be one of various exemplary embodiments. Therefore, those skilled in the art will understand that the various implementations described herein may be changed and modified differently without departing from the scope and spirit of the present disclosure. In addition, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0036] The terms and words used in the following description and claims are not limited to the bibliographic meanings, but may be used to clearly and consistently describe the embodiments of the present disclosure. Therefore, it will be clear to those skilled in the art that the following description of various implementations of the present disclosure is provided for illustration and not for limiting the disclosure which is limited to the scope of the claims and their equivalents.

[0037] It should be understood that the singular forms of “a”, “an” and “the” also include the plural meaning unless the context clearly indicates otherwise. Thus, for example, “a component surface” can be understood to include one or more surfaces of a component.

[0038] Figure 1 1 is a block diagram showing an electronic device 1001 in a network environment 1000 according to various embodiments. Figure 1 , the electronic device 1001 in the network environment 1000 may communicate with the electronic device 1002 via the first network 1098 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 1004 or the server 1008 via the second network 1099 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 1001 may communicate with the electronic device 1004 via the server 1008. According to an embodiment, the electronic device 1001 may include a processor 1020, a memory 1030, an input module 1050, a sound output module 1055, a display module 1060, an audio module 1070, a sensor module 1076, an interface 1077, a connection terminal 1078, a haptic module 1079, a camera module 1080, a power management module 1088, a battery 1089, a communication module 1090, a subscriber identification module (SIM) 1096, or an antenna module 1097. In some embodiments, at least one of the above components (e.g., the connection terminal 1078) may be omitted from the electronic device 1001, or one or more other components may be added to the electronic device 1001. In some embodiments, some of the above components (e.g., the sensor module 1076, the camera module 1080, or the antenna module 1097) may be implemented as a single component (e.g., the display module 1060).

[0039] The processor 1020 may run, for example, software (e.g., program 1040) to control at least one other component (e.g., hardware component or software component) of the electronic device 1001 in combination with the processor 1020, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 1020 may store a command or data received from another component (e.g., sensor module 1076 or communication module 1090) in the volatile memory 1032, process the command or data stored in the volatile memory 1032, and store the resultant data in the non-volatile memory 1034. According to an embodiment, the processor 1020 may include a main processor 1021 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 1023 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 1021 in operation. For example, when the electronic device 1001 includes a main processor 1021 and an auxiliary processor 1023, the auxiliary processor 1023 may be adapted to consume less power than the main processor 1021, or adapted to be dedicated to a specific function. The auxiliary processor 1023 may be implemented separately from the main processor 1021, or as part of the main processor 1021.

[0040] When the main processor 1021 is in an inactive (e.g., sleep) state, the auxiliary processor 1023 (rather than the main processor 1021) may control at least some of the functions or states related to at least one component among the components of the electronic device 1001 (e.g., the display module 1060, the sensor module 1076, or the communication module 1090), or when the main processor 1021 is in an active state (e.g., running an application), the auxiliary processor 1023 may control at least some of the functions or states related to at least one component among the components of the electronic device 1001 (e.g., the display module 1060, the sensor module 1076, or the communication module 1090) together with the main processor 1021. According to an embodiment, the auxiliary processor 1023 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 1080 or a communication module 1090) that is functionally related to the auxiliary processor 1023. According to an embodiment, the auxiliary processor 1023 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model can be generated by machine learning. For example, such learning can be performed by the electronic device 1001 executing the artificial intelligence model or via a separate server (e.g., server 1008). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0041] The memory 1030 may store various data used by at least one component of the electronic device 1001 (e.g., the processor 1020 or the sensor module 1076). The various data may include, for example, software (e.g., the program 1040) and input data or output data for commands related thereto. The memory 1030 may include a volatile memory 1032 or a nonvolatile memory 1034.

[0042] The program 1040 may be stored as software in the memory 1030 , and may include, for example, an operating system (OS) 1042 , middleware 1044 , or an application 1046 .

[0043] The input module 1050 may receive a command or data to be used by another component (e.g., the processor 1020) of the electronic device 1001 from outside (e.g., a user) of the electronic device 1001. The input module 1050 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0044] The sound output module 1055 can output sound signals to the outside of the electronic device 1001. The sound output module 1055 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing records. The receiver may be used to receive an incoming call. Depending on the embodiment, the receiver may be implemented as being separated from the speaker, or as part of the speaker.

[0045] The display module 1060 may visually provide information to the outside of the electronic device 1001 (e.g., a user). The display module 1060 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 1060 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0046] The audio module 1070 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 1070 may obtain sound via the input module 1050, or output sound via the sound output module 1055 or an earphone of an external electronic device (e.g., electronic device 1002) directly (e.g., wired) or wirelessly coupled to the electronic device 1001.

[0047] The sensor module 1076 may detect an operating state (e.g., power or temperature) of the electronic device 1001 or an environmental state (e.g., a state of a user) outside the electronic device 1001, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 1076 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0048] The interface 1077 may support one or more specific protocols to be used to combine the electronic device 1001 with an external electronic device (e.g., the electronic device 1002) (e.g., wired) or wirelessly. According to an embodiment, the interface 1077 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0049] The connection end 1078 may include a connector, wherein the electronic device 1001 may be physically connected to an external electronic device (e.g., the electronic device 1002) via the connector. According to an embodiment, the connection end 1078 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0050] The haptic module 1079 may convert the electric signal into a mechanical stimulus (eg, vibration or movement) or an electric stimulus that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 1079 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0051] The camera module 1080 may capture a still image or a moving image. According to an embodiment, the camera module 1080 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0052] The power management module 1088 may manage power supply to the electronic device 1001. According to one embodiment, the power management module 1088 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0053] The battery 1089 may power at least one component of the electronic device 1001. According to an embodiment, the battery 1089 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0054] The communication module 1090 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 1001 and an external electronic device (e.g., electronic device 1002, electronic device 1004, or server 1008), and perform communication via the established communication channel. The communication module 1090 may include one or more communication processors capable of operating independently from the processor 1020 (e.g., an application processor (AP)), and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 1090 may include a wireless communication module 1092 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1094 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate via a first network 1098 (e.g., a short-range communication network such as Bluetooth TM, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 1099 (e.g., a long-distance communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN)))) to communicate with an external electronic device. These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 1092 may identify and authenticate the electronic device 1001 in a communication network (such as the first network 1098 or the second network 1099) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 1096.

[0055] The wireless communication module 1092 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low-latency communications (URLLC). The wireless communication module 1092 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 1092 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 1092 can support various requirements specified in the electronic device 1001, an external electronic device (e.g., electronic device 1004), or a network system (e.g., a second network 1099). According to an embodiment, the wireless communication module 1092 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane latency for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip).

[0056] The antenna module 1097 may transmit or receive a signal or power to or from the outside of the electronic device 1001 (e.g., an external electronic device). According to an embodiment, the antenna module 1097 may include an antenna including a radiation element, the radiation element being composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 1097 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 1098 or the second network 1099) may be selected from the plurality of antennas by, for example, the communication module 1090 (e.g., the wireless communication module 1092). A signal or power may then be transmitted or received between the communication module 1090 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiation element may be additionally formed as a part of the antenna module 1097.

[0057] According to various embodiments, the antenna module 1097 may form a millimeter wave (mmWave) antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, an RFIC, and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0058] At least some of the above components may be coupled to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0059] According to an embodiment, a command or data may be sent or received between the electronic device 1001 and the external electronic device 1004 via the server 1008 combined with the second network 1099. Each of the electronic device 1002 or the electronic device 1004 may be a device of the same type as the electronic device 1001, or a device of a different type from the electronic device 1001. According to an embodiment, all or some operations to be executed in the electronic device 1001 may be executed at one or more of the external electronic device 1002, the external electronic device 1004, or the server 1008. For example, if the electronic device 1001 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 1001 may request one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 1001 may request one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. One or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 1001. The electronic device 1001 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology, or client-server computing technology, for example, may be used. The electronic device 1001 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 1004 may include an Internet of Things (IoT) device. The server 1008 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 1004 or the server 1008 may be included in the second network 1099. The electronic device 1001 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or health care) based on 5G communication technology or IoT-related technologies.

[0060] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those described above.

[0061] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or replacement forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals and figure marks can be used to refer to similar or related elements. It will be understood that the noun corresponding to the item in the singular form can include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each phrase in the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" can include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" can be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled with”, “coupled to”, “connected with”, or “connected to” another element (e.g., the second element), with or without the terms “operably” or “communicatively” being used, it means that the element may be directly (e.g., wired) coupled to, wirelessly connected to, or coupled to another element via a third element.

[0062] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "component," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or part of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0063] The various embodiments set forth herein may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., an internal memory or an external memory) that can be read by a machine (e.g., an electronic device). For example, under the control of a processor (e.g., a processor) of a machine (e.g., an electronic device), the processor may call at least one of the one or more instructions stored in the storage medium and execute at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0064] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., PlayStore). TM ) the computer program product may be distributed (e.g., downloaded or uploaded) online, or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). If distributed online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, a server of an application store, or a forwarding server).

[0065] According to various embodiments, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be separately arranged in different components. According to various embodiments, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner as a corresponding one of the multiple components performing one or more functions before integration. According to various embodiments, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations may be run or omitted in a different order, or one or more other operations may be added.

[0066] Figure 2 is a front perspective view of an electronic device 100 according to an embodiment of the present disclosure. Figure 3 According to the embodiment of the present disclosure Figure 2 A rear perspective view of the electronic device 100 is shown.

[0067] Reference Figure 2 and Figure 3 According to the electronic device 100 of the embodiment (eg, Figure 1 The electronic device 1001 in the embodiment may include a housing 110, the housing 110 including a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface 110C surrounding a space between the first surface 110A and the second surface 110B. In an embodiment (not shown), the housing 110 may refer to a housing defining a Figure 2 The first surface 110A and Figure 3 The structure of some of the second surface 110B and the side surface 110C. According to an embodiment, at least a portion of the first surface 110A may be defined by a substantially transparent front surface plate 102 (e.g., a glass plate or a polymer plate including various coatings). The second surface 110B may be defined by a substantially opaque rear surface plate 111. For example, the rear surface plate 111 may be made of coated or tinted glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium), or a combination of two or more of these materials. The side surface 110C may be defined by a side structure (or "side frame structure") 118 that is bonded to the front surface plate 102 and the rear surface plate 111 and includes a metal and / or a polymer. In an embodiment, the rear surface plate 111 and the side structure 118 may be integrated with each other and may include the same material (e.g., a metal material such as aluminum).

[0068] Although not shown, the front surface plate 102 may include one or more regions extending seamlessly from at least a portion of the edge toward the rear surface plate 111. In an embodiment, the front surface plate 102 (or the rear surface plate 111) may include only one of the regions that is bent at one side edge of the first surface 110A and extends toward the rear surface plate 111 (or the front surface plate 102). According to an embodiment, the front surface plate 102 or the rear surface plate 111 may be in a substantially flat plate shape, and in this case, the bending and extension regions may not be included. When the bending and extension regions are included, the thickness of the electronic device 100 in the portion including the bending and extension regions may be less than the thickness of other portions.

[0069] According to an embodiment, the electronic device 100 may include at least one of the following: a display 101, an audio module (e.g., a microphone hole 103, an external speaker hole 107, and a call receiver hole 114), a sensor module (e.g., a first sensor module 104, a second sensor module (not shown), and a third sensor module 119), a camera module (e.g., a first camera device 105, a second camera device 112, and a flash 113), a key input device 117, a light emitting element 106, and a connector hole (e.g., a first connector hole 108 and a second connector hole 109). In an embodiment, in the electronic device 100, at least one component (e.g., the key input device 117 or the light emitting element 106) may be omitted, or other components may be additionally included.

[0070] The display 101 may output a picture or may be visually exposed through, for example, a substantial portion of the first surface 110A (e.g., the front surface plate 102). In an embodiment, at least a portion of the display 101 may be visually exposed through the front surface plate 102 defining the first surface 110A or through a portion of the side surface 110C. In an embodiment, the periphery of the display 101 may be configured to be substantially the same shape as the periphery of the front surface plate 102 adjacent thereto. In an embodiment (not shown), the distance between the periphery of the display 101 and the periphery of the front surface plate 102 may be substantially constant so as to expand the visual exposure area of ​​the display 101.

[0071] In an embodiment (not shown), a groove or opening may be provided in some portions of the screen display area of ​​the display 101, and one or more of an audio module (e.g., a call receiver hole 114), a sensor module (e.g., a first sensor module 104), a camera module (e.g., a first camera module 105), and a light emitting element 106 may be aligned with the groove or opening. In an embodiment (not shown), a rear surface of the screen display area of ​​the display 101 may include at least one of an audio module (e.g., a call receiver hole 114), a sensor module (e.g., a first sensor module 104), a camera module (e.g., a first camera device 105), a fingerprint sensor (not shown), and a light emitting element 106. In an embodiment (not shown), the display 101 may be coupled to or disposed adjacent to a touch-sensitive circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer configured to detect an electromagnetic field type stylus. In an embodiment, at least some of the sensor modules (eg, the first sensor module 104 and the third sensor module 119 ) and / or at least some of the key input devices 117 may be disposed in the first region 110D and / or the second region 110E.

[0072] The audio modules 103, 107, and 114 may include a microphone hole 103 and a speaker hole (e.g., an external speaker hole 107 and a call receiver hole 114). The microphone hole 103 may include a microphone disposed therein to obtain external sound, and in an embodiment, a plurality of microphones may be disposed therein to be able to detect the direction of the sound. The speaker hole may include an external speaker hole 107 and a call receiver hole 114. In an embodiment, the speaker hole (e.g., the external speaker hole 107 and the call receiver hole 114) and the microphone hole 103 are implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without a speaker hole (e.g., the external speaker hole 107 and the call receiver hole 114).

[0073] The sensor module may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 100. The sensor module may include, for example, a first sensor module 104 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the first surface 110A of the housing 110, and / or a third sensor module 119 disposed on the second surface 110B of the housing 110. The second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed not only on the first surface 110A (e.g., the display 101) of the housing 110, but also on the second surface 110B or the side surface 110C of the housing 110. The electronic device 100 may further include, for example, at least one of a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor 104.

[0074] The camera module may include a first camera device 105 disposed on a first surface 110A of the electronic device 100 and a second camera device 112 and / or a flash 113 disposed on a second surface 110B of the electronic device 100. The camera devices (e.g., the first camera device 105 and the second camera device 112) may include one or more lenses, image sensors, and / or image signal processors. The flash 113 may include, for example, a light emitting diode or a xenon lamp. In an embodiment, one or more lenses (e.g., an infrared camera lens, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 100. In an embodiment, the flash 113 may emit infrared rays, and the infrared light emitted by the flash 113 and reflected by the subject may be received by the third sensor module 119. The electronic device 100 or a processor of the electronic device 100 (e.g., Figure 1 The processor 1020 in the image processing module 100 may detect depth information of the object based on a time point when the infrared ray is received by the third sensor module 119.

[0075] The key input device 117 may be provided on the side surface 110C of the housing 110. In an embodiment, the electronic device 100 may not include some or all of the key input devices 117 mentioned above, and the key input device 117 not included may be implemented in other forms (such as soft keys on the display 101). In an embodiment, the key input device may include a sensor module provided on the second surface 110B of the housing 110.

[0076] The light emitting element 106 may be disposed, for example, on the first surface 110A of the housing 110. For example, the light emitting element 106 may provide status information of the electronic device 100 in an optical form. In an embodiment, the light emitting element 106 may provide a light source that is interrelated with the operation of, for example, a camera module (e.g., the first camera device 105). The light emitting element 106 may include, for example, an LED, an IRLED, and a xenon lamp.

[0077] The connector holes (eg, first connector hole 108 and second connector hole 109) may include a first connector hole 108 and / or a second connector hole (eg, headphone jack) 109, the first connector hole 108 being capable of accommodating a headphone jack configured to connect to an external electronic device (eg, Figure 1 electronic device 1002) to transmit power and / or data to / from an external electronic device (e.g., Figure 1 The second connector hole 109 can accommodate a connector for transmitting / receiving audio signals to / from an external electronic device.

[0078] Figure 4 It is shown Figure 2 2 is a front exploded perspective view of an electronic device 200 according to an embodiment of the present disclosure. Figure 5 It is shown Figure 2 2 is a rear exploded perspective view of an electronic device 200 according to an embodiment of the present disclosure.

[0079] Reference Figure 4 and Figure 5 , the electronic device 200 (eg, Figure 1 , Figure 2 or Figure 3 The electronic device 1001, 1002, 1004 or 100 in the embodiment may include a side structure 210, a first support member 211 (eg, a bracket), a front surface plate 220 (eg, Figure 1 , the front surface panel 102 in the display 230 (e.g., Figure 1 101 in the display), a printed circuit board (or substrate assembly) 240, a battery 250, a second support member 260 (eg, a rear case), an antenna, a camera assembly 207, and a rear surface plate 280 (eg, Figure 3 In an embodiment, in the electronic device 200, at least one component (eg, the first support member 211 or the second support member 260) may be omitted, or other components may be additionally included. At least one component of the electronic device 200 may be Figure 2 or Figure 3 At least one component of the electronic device 100 is the same or similar, and a redundant description thereof will be omitted below.

[0080] The first support member 211 may be provided inside the electronic device 200 to be connected to the side structure 210 or may be integrated with the side structure 210. The first support member 211 may be made of, for example, a metal material and / or a non-metallic (e.g., polymer) material. When at least partially made of a metal material, a portion of the side structure 210 or a portion of the first support member 211 may be used as an antenna. The first support member 211 may include one surface to which the display 230 is coupled and another surface to which the printed circuit board 240 is coupled. The processor (e.g., Figure 1 processor 1020 in the processor 1020), memory (e.g., Figure 1 1030) and / or an interface (e.g., Figure 1 The interface 1077 in the example may be mounted on the printed circuit board 240. The processor may include, for example, at least one of a central processing unit, an application processor, a graphics processor, an image signal processor, a sensor hub processor, or a communication processor.

[0081] According to various embodiments, the first support member 211 and the side structure 210 may be combined to be referred to as a front housing or case 201. According to an embodiment, the case 201 may be generally understood as a structure for accommodating, protecting or setting a printed circuit board 240 or a battery 250. In an embodiment, it may be understood that the case 201 includes structures that a user may visually or tactilely recognize on the outside of the electronic device 200, such as the side structure 210, the front surface plate 220, and / or the rear surface plate 280. In an embodiment, the “front surface or rear surface of the case 201” may be understood as Figure 2 The first surface 110A or Figure 3 In an embodiment, the first support member 211 may be disposed on the front surface plate 220 (eg, Figure 2 The first surface 110A in the embodiment of the present invention is connected to the rear surface plate 280 (for example, Figure 3 The second surface 110B in the figure may be used as a structure on which an electrical / electronic component such as a printed circuit board 240 or a camera assembly 207 is disposed.

[0082] The display 230 may include a display panel 231 and a flexible printed circuit board 233 extending from the display panel 231. For example, the flexible printed circuit board 233 may be understood as being electrically connected to the display panel 231 while being at least partially disposed on the rear surface of the display panel 231. In an embodiment, reference numeral "231" may be understood as indicating a protective sheet disposed on the rear surface of the display panel. For example, unless otherwise clarified in the following detailed description, the protective sheet may be understood as a part of the display panel 231. In an embodiment, the protective sheet may act as a buffer structure (e.g., a low-density elastic material such as a sponge) or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)) that absorbs external forces. According to an embodiment, the display 230 may be disposed on the inner surface of the front surface plate 220, and may include a light-emitting layer to transmit light through the front surface plate 220. Figure 2 The display 230 can output the picture through at least a portion of the first surface 110A or the front surface plate 220. As mentioned above, the display 230 can be Figure 2 The image is outputted on substantially the entire area of ​​the first surface 110A or the front surface plate 220 .

[0083] The memory may include, for example, volatile memory or non-volatile memory.

[0084] The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect, for example, the electronic device 200 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0085] The second support member 260 may include, for example, an upper support member 260a and a lower support member 260b. In an embodiment, the upper support member 260a may be arranged to surround the printed circuit board 240 together with a portion of the first support member 211. A circuit device implemented in the form of an integrated circuit chip (e.g., a processor, a communication module, or a memory) or various electrical / electronic components may be arranged on the printed circuit board 240, and in some embodiments, the printed circuit board 240 may be provided with an electromagnetic shielding environment with the upper support member 260a. In an embodiment, the lower support member 260b may be used as a structure on which electrical / electronic components such as a speaker module and an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged. In an embodiment, electrical / electronic components such as a speaker module and an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on another printed circuit board (not shown). In this case, the lower support member 260b may be arranged to surround the other printed circuit board together with the other portions of the first support member 211. The speaker module or interface provided on an additional printed circuit board (not shown) or the lower support member 260b may be provided to correspond to Figure 2 An audio module (eg, a microphone hole 103 or a speaker hole (eg, an external speaker hole 107 and a call receiver hole 114)) or a connector hole (eg, a first connector hole 108 and a second connector hole 109).

[0086] The battery 250 is a device for supplying power to at least one component of the electronic device 200, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 250 may be disposed on substantially the same plane as, for example, the printed circuit board 240. The battery 250 may be integrally disposed inside the electronic device 200, or may be disposed to be detachable from the electronic device 200.

[0087] Although not shown, the antenna may include a conductor pattern implemented on the surface of the second support member 260 by, for example, a laser direct structuring method. In an embodiment, the antenna may include a printed circuit pattern provided on the surface of the film, and the film-type antenna may be provided between the rear surface plate 280 and the battery 250. The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may perform short-range communication with, for example, an external device, or may wirelessly transmit the power required for charging to / receive the power required for charging from an external device. In an embodiment, another antenna structure may be provided by a portion of the side structure 210 and / or a portion of the first support member 211, or a combination thereof.

[0088] The camera assembly 207 may include at least one camera module. Inside the electronic device 200, the camera assembly 207 may receive at least some of the light incident through the optical holes or camera windows 212, 213, and 219. In an embodiment, the camera assembly 207 may be disposed on the first support member 211 at a position adjacent to the printed circuit board 240. In an embodiment, at least one camera module of the camera assembly 207 may be substantially aligned with one of the camera windows 212, 213, and 219, and may be at least partially surrounded by the second support member 260 (e.g., the upper support member 260a).

[0089] Figure 6 is a diagram showing an electronic device (eg, Figures 1 to 5 The display 300 (eg, Figure 1 The display module 1060 or Figure 2 , Figure 4 and Figure 5 An exploded perspective view of a display 101 or 230 ). Figure 7 is a view showing a shielding film 304 in a display 300 of an electronic device 200 according to an embodiment of the present disclosure. Figure 8 The present invention is a diagram showing an embodiment of the present invention. Figure 7 A view of the shielding film 304. Fig. 9 It is shown along Figure 7 FIG. 1 is a view of a shielding film 304 according to an embodiment of the present disclosure, cut along line AA′ in FIG. Fig.10 2 is a perspective view showing a state in which a flexible printed circuit board 303 is disposed on a display panel 301 in a display 300 of an electronic device 200 according to an embodiment of the present disclosure. Fig.11 3 is a perspective view showing a state in which a shielding film 304 is provided on a flexible printed circuit board 303 in a display 300 of an electronic device according to an embodiment of the present disclosure.

[0090] Reference Figures 6 to 11 , the display 300 (eg, Figure 5 The display 230 may include a display panel 301, a flexible printed circuit board 303 and / or a shielding film 304. The display panel 301 outputs a picture by including, for example, a light emitting layer and may be disposed on a front surface plate (eg, Figure 4 or Figure 5 In an embodiment, the display panel 301 may include a protective sheet 311 disposed on a rear surface thereof. By including, for example, a low-density elastic member or a metal sheet (e.g., a copper sheet), the protective sheet 311 may suppress or mitigate external force from being directly applied to the light emitting layer, or may suppress external electromagnetic waves from interfering with the interior of the protective sheet 311.

[0091] According to an embodiment, the flexible printed circuit board 303 may include at least one electrical / electronic component (eg, a display driver integrated circuit (DDI) 331) disposed on one surface. The DDI 331 may be provided by, for example, a processor (eg, Figure 1 The flexible printed circuit board 303 is controlled by the processor 120 to drive the display panel 301. Although not indicated by reference numerals, the flexible printed circuit board 303 may further include other electrical / electronic components such as a connector or an integrated circuit chip.

[0092] According to an embodiment, the display 300 may further include an adhesive layer 319 disposed between the display panel 301 (e.g., the protective sheet 311) and the flexible printed circuit board 303. The adhesive layer 319 may be, for example, a double-sided tape or an adhesive. In an embodiment, the adhesive layer 319 may maintain at least a portion of the flexible printed circuit board 303 in a determined form by attaching at least a portion of the flexible printed circuit board 303 to the display panel 301 (e.g., the rear surface). Inside the electronic device 200, the flexible printed circuit board 303 may be disposed between the display panel 301 and the support member (e.g., Figure 3 or Figure 4 between the first supporting member 211).

[0093] According to an embodiment, the shielding film 304 may be attached to one surface of the flexible printed circuit board 303 in a state of surrounding at least a portion of the DDI 331. For example, the shielding film 304 may at least suppress the DDI 331 from being exposed to external electromagnetic interference. In an embodiment, the shielding film 304 may be electrically connected to the flexible printed circuit board 303. For example, the shielding film 304 may be electrically connected to the ground conductor of the flexible printed circuit board 303 to implement an electromagnetic shielding structure and act as a ground conductor providing a reference potential. In an embodiment, the flexible printed circuit board 303 may include at least one escape area 339 that exposes the ground conductor to the external space so that the shielding film 304 can be electrically connected to the ground conductor.

[0094] According to an embodiment, the shielding film 304 may include a shielding layer 341 and an insulating layer 343 provided on one surface of the shielding layer 341. In an embodiment, the insulating layer 343 may provide an adhesive function for attaching the shielding layer 341 to the flexible printed circuit board 303. In an embodiment, the shielding film 304 may further include an adhesive material in addition to the insulating layer 343, and the insulating layer 343 and / or the shielding layer 341 may be attached to the flexible printed circuit board 303 by the adhesive material. In an embodiment, the shielding layer 341 may be in a shape further extending to the outside of the insulating layer 343, and a portion of the shielding layer 341 further extending to the outside of the insulating layer 343 may be in direct contact with a ground conductor of the flexible printed circuit board 303 when passing through the escape area 339.

[0095] Fig.12 2 is a view showing the arrangement of a side structure 210 or a support member (eg, a first support member 211 ) and a shielding film 304 in the electronic device 200 according to an embodiment of the present disclosure.

[0096] Reference Fig.12 , the side structure 210 and / or the first support member 211 may be at least partially made of metal or a conductive material, and may be used in electronic devices (e.g., Figures 1 to 5 For example, the processor (e.g., Figure 1 processor 120) or a communication module (e.g., Figure 1 The communication module 190 of the embodiment may perform wireless communication using at least a portion of the side structure 210 or the first support member 211. The portion of the side structure 210 or the first support member 211 used for wireless communication may be partially insulated from other conductive materials.

[0097] According to an embodiment, in Fig.12 The portions indicated by solid lines in the side structure 210 or the first support member 211 in the figure may be conductive material portions, and the portion indicated by reference numeral “211a” may be an example of an insulating material portion or a synthetic material portion in the side structure 210 or the first support member 211. For example, in the side structure 210, at least a portion indicated by reference numeral “210a” or “210b” (hereinafter, referred to as “first radiation conductor 210a” or “second radiation conductor 210b”) may be electrically connected to a processor (e.g., Figure 1 processor 120) or a communication module (e.g., Figure 1 In an embodiment, the side structure 210 is generally in the shape of a frame surrounding the periphery of the first support member 211, and a conductive material portion of the side structure may be partially separated to be insulated from another conductive material portion (e.g., a portion indicated by reference numeral "210c" or "210d"), thereby providing a first radiation conductor 210a or a second radiation conductor 210b.

[0098] According to an embodiment, the insulating material portion or the synthetic resin material portion 211a may be provided to surround at least a portion of the conductive material portion (e.g., the first radiation conductor 210a or the second radiation conductor 210b), and may connect the conductive material portion to another conductive material portion (e.g., the first support material 211, or a portion denoted by reference numeral "210c" or "210d" in the side structure 210). In an embodiment, the insulating material portion or the synthetic resin material portion 211a may be substantially understood as a portion of the first support member 211 or the side structure 210. For example, when the side structure 210 is divided into a plurality of portions 210a, 210b, 210c, and 210d to provide the first radiation conductor 210a or the second radiation conductor 210b, the insulating material portion or the synthetic resin material portion 211a may be provided to the slot portion 210e between the conductive portions (e.g., the first radiation conductor 210a or the second radiation conductor 210b) of the side structure 210 to provide a mechanical connection structure.

[0099] According to an embodiment, the flexible printed circuit board 303 or the shielding film 304 of the display 300 may be disposed adjacent to the first radiation conductor 210a or the second radiation conductor 210b. For example, the first radiation conductor 210a may extend at a position at least partially adjacent to the DDI 331 or be disposed parallel to the display 300. In an embodiment, the shielding film 304 may provide an electromagnetic shielding environment between the DDI 331 and the first radiation conductor 210a or between the DDI 331 and the second radiation conductor 210b. For example, even when disposed adjacent to an antenna (e.g., the first radiation conductor 210a or the second radiation conductor 210b), an electromagnetic shielding environment may be provided to the DDI 331, and the first radiation conductor 210a or the second radiation conductor 210b may perform stable wireless communication in a state where the influence of the DDI 331 is suppressed.

[0100] According to an embodiment, the DDI 331 or the shielding film 304 may be disposed adjacent to the first radiation conductor 210a or the second radiation conductor 210b of the side structure 210. For example, in the process of performing wireless communication or when the display 300 is operating, electromagnetic interference may be caused between the DDI 331 and the first radiation conductor 210a (or the second radiation conductor 210b). By being disposed to substantially surround the DDI 331, the shielding film 304 may provide an electromagnetic shielding environment between the DDI 331 and the first radiation conductor 210a (or the second radiation conductor 210b). For example, even if wireless communication and driving of the display 300 are performed simultaneously, the shielding film 304 may provide a stable operating environment for the DDI 331 and the radiation conductors 210a and 210b.

[0101] According to an embodiment, the shielding film 304 has a specified degree of flexibility while being disposed on one surface of the flexible printed circuit board 303 on which the DDI 331 is disposed, so that the shielding film 304 can be deformed on one surface of the flexible printed circuit board 303 to correspond to the bending caused by the DDI 331. For example, when attached to one surface of the flexible printed circuit board 303, the shielding film 304 can be stably in close contact with the surface of the flexible printed circuit board 303 and the surface of the DDI 331. In an embodiment, since the shielding film 304 has flexibility, when air is left in the attachment area during the process of attaching the shielding film to the flexible printed circuit board 303, the shielding film 304 forms an air pocket. Here, the term "attachment area" may refer to an area on the flexible printed circuit board 303 to which the shielding film 304 is attached, for example, Figure 6 or Fig.12 The shielding film 304 shown in FIG. 1 corresponds to the shape of the area on one surface of the flexible printed circuit board 303. For example, Fig.12 The area denoted by reference numeral ' 304 ' in FIG. 1 may show a position where the attachment area of ​​the flexible printed circuit board 303 is substantially disposed on the first supporting member 211 or the side structure 210 .

[0102] According to an embodiment, when disposed in an electromagnetic field, the shielding film 304 may change the distribution of the electromagnetic field or may form a capacitive (or inductive) coupling with an adjacent conductive structure or component. For example, when a wireless signal is transmitted / received via the first radiation conductor 210a or the second radiation conductor 210b, the shielding film 304 may form a capacitive coupling with the first radiation conductor 210a or the second radiation conductor 210b. In an embodiment, when forming a capacitive coupling with the first radiation conductor 210a or the second radiation conductor 210b, the shielding film 304 may form an additional capacitive coupling with another adjacent conductive structure (e.g., a metal structure of a conductive portion of the first support member 211 or a fastening boss embedded in the synthetic resin material portion 211a).

[0103] According to the embodiment, in the design or arrangement of the shielding film 304, (one or more) such capacitive coupling may be considered. For example, considering that capacitive coupling is generated when the first radiation conductor 210a or the second radiation conductor 210a and the shielding film 304 are arranged adjacent to each other, the reduction in wireless communication performance may be suppressed or compensated by using additional capacitive coupling. In the embodiment of the present disclosure, a configuration is disclosed in which capacitive coupling is generated according to the arrangement of the shielding film 304, but it is noted that one or more embodiments of the present disclosure are not limited thereto. For example, as mentioned above, depending on the arrangement of the shielding film, inductive coupling may be generated, or the distribution of the electromagnetic field may be changed.

[0104] According to an embodiment, when attaching the shielding film 304 to the flexible printed circuit board 303, it may be difficult to predict whether air pockets are generated and the position or size of the air pockets. When air pockets are generated in the process of attaching the shielding film 304, the shielding film 304 may be set to be substantially different from the design specification. For example, in the arrangement of the shielding film 304, the distance (or relative position) to the radiating conductors 210a and 210b or other adjacent conductive structures may be different from the design. In an embodiment, when the shielding film 304 is arranged at a distance different from the design specification relative to the conductive structure, the capacitive coupling or inductive coupling considered in the design process or the distribution change of the electromagnetic field due to the arrangement of the shielding film 304 may not be realized in the actually completed electronic device 200. In this case, in wireless communication, the radiating conductors 210a and 210b may not achieve the wireless communication performance required by the electronic device 200. According to one or more embodiments of the present disclosure, by suppressing the generation of air pockets when the shielding film 304 is set on the flexible printed circuit board 303, the arrangement of the shielding film 304 in the electronic device 200 or the wireless communication performance can meet the design specifications. Reference will be made to Figures 13 to 22 A configuration is described in which the generation of air pockets is suppressed when the shielding film 304 is attached to the flexible printed circuit board 303 .

[0105] Fig.13 is a diagram showing an electronic device (eg, Figures 1 to 5 The display 300 (eg, Figure 1 The display module 1060 or Figure 2 , Figure 4 and Figure 5 FIG. 2 is a diagram showing an arrangement of through holes 331a and 319a or grooves 311a in a display 101 or 230). Fig.14 3 is a view for explaining the arrangement of through holes 331 a and 319 a or the groove 311 a in the display 300 of the electronic device 200 according to an embodiment of the present disclosure.

[0106] Reference Fig.13 and Fig.14 The display 300 and / or the electronic device 200 may include an attachment area disposed on the flexible printed circuit board 303 (eg, where a Figure 6 , Fig.12 or Fig.14 As will be described later, the display 300 and / or the electronic device 200 may further include at least one groove (eg, Fig.14 The groove 311a in the embodiment of the present invention) or at least one slit (for example, a groove 311a in the embodiment of the present invention will be described later) Fig.15slit 319b). For example, at least one groove 311a or at least one slit 319b may be set to cross the edge of the attachment area or be exposed at the edge of the attachment area. For example, at least one groove 311a or at least one slit 319b may extend from the inside of the attachment area to the outside of the attachment area across the edge of the attachment area. In an embodiment, when the shielding film 304 is attached to the flexible printed circuit board 303, the through holes 331a and 319a, at least one groove 311a and / or at least one slit 319b may act as an exhaust channel. For example, when the shielding film 304 is disposed on the flexible printed circuit board 303, the generation of air pockets may be suppressed. After the shielding film 304 is disposed on the flexible printed circuit board 303, the through holes 331a and 319a, at least one groove 311a and / or at least one slit 319b may be surrounded by an adhesive material or the shielding film 304 itself. For example, after the attachment process, there may be substantially no air between the shielding film 304 and the flexible printed circuit board 303. In an embodiment, after the attachment process, there may be a certain amount of air on the attachment area, but this is air present in the space realized by the through holes 331a and 319a, at least one groove 311a and / or at least one slit 319b. Therefore, there may be substantially no air between the shielding film 304 and the flexible printed circuit board 303.

[0107] According to an embodiment, the display 300 and / or the electronic device 200 may include a protective sheet 311 disposed on the rear surface of the display panel 301. In an embodiment, the flexible printed circuit board 303 may be attached to the rear surface (e.g., protective sheet 311) of the display panel 301 by an adhesive layer 319 at the edge of the display panel 301. In the illustrated embodiment, two through holes 331a may be disposed in the attachment area through the flexible printed circuit board 303. However, one or more embodiments of the present disclosure are not limited thereto, and considering the attachment area of ​​the shielding film 304 and the arrangement of the electrical / electronic components (e.g., DDI 331) in the attachment area, a smaller or larger number of through holes 331a may be disposed through the flexible printed circuit board 303.

[0108] According to an embodiment, the number of through holes may be an even number. According to an embodiment, the through holes may be of the same shape. According to an embodiment, the through holes may have the same size. According to an embodiment, the through holes are arranged symmetrically with respect to a center line extending parallel to the long side of the display (electronic device). Such a symmetrical arrangement allows efficient exhaust of air.

[0109] Depending on the embodiment, the number, location and size of the through holes should be selected to be large enough to allow air to be effectively discharged yet small enough to maintain a sufficiently large attachment (contact) area (between the shielding film and the printed circuit board) (or between the printed circuit board and the adhesive layer) (or between the protective sheet and the adhesive layer).

[0110] According to an embodiment, the total size (surface area) of all through holes (in any one of the printed circuit board, the protective sheet, and the adhesive layer) ranges between 0.1% and 30% of the total surface area of ​​(the corresponding one of the printed circuit board, the protective sheet, and the adhesive layer) overlapping with the shielding film, more preferably between 0.3% and 20%, more preferably between 0.5% and 15%, and more preferably between 1% and 10%. Overlap means the overlap of the shielding film projected onto the corresponding one of the printed circuit board, the protective sheet, and the adhesive layer along an axis perpendicular to the flat top surface of the shielding film. These surface area ratios allow efficient exhaust of air.

[0111] According to an embodiment, the above-mentioned considerations regarding the arrangement, number, location, size and surface area ratio of the through holes also apply to the slits in the same manner.

[0112] According to an embodiment, the adhesive layer 319 may define a groove or a second through hole 319a that is set to at least partially correspond to the through hole 331a. The second through hole 319a may be connected to, for example, the through hole 331a to act as a part of the exhaust channel. In an embodiment, the protective sheet 311 may at least partially define at least one groove 311a (or slit) that at least partially corresponds to the through hole 331a and / or the second through hole 319a. The at least one groove 311a defined by the protective sheet 311 may be set across the edge of the attachment area, for example, by being connected to the through hole 331a and / or the second through hole 319a at one end thereof and extending in a predetermined direction. The description "set across the edge of the attachment area" may be understood to include a state in which at least one groove 311a is opened or exposed to the outside at the edge of the attachment area. For example, while the shielding film 304 is being attached to the flexible printed circuit board 303, air existing between the shielding film 304 and the flexible printed circuit board 303 can be discharged to the outside in sequence through the through hole 331a, the second through hole 319a and / or the groove 311a. As a result, even when the shielding film 304 is attached to the flexible printed circuit board 303, the generation of air pockets can be suppressed in the attachment area, and even when the shielding film 304 is disposed adjacent to the radiation conductor (e.g., the first radiation conductor 210a and the second radiation conductor 210a), because the shielding film 304 has been disposed on the flexible printed circuit board 303 to meet the design specifications, the radiation conductor (e.g., the second radiation conductor 210a) can be suppressed. Fig.12 The degradation of the wireless signal transmission / reception performance of the first radiation conductor 210a and the second radiation conductor 210b in FIG.

[0113] According to an embodiment, the second through hole 319a and / or the groove 311a may be omitted from the structure in which the shielding film 304 is already attached to the flexible printed circuit board 303 before the flexible printed circuit board 303 is attached to the rear surface of the display panel 301. In an embodiment, even when the shielding film 304 is already attached to the flexible printed circuit board 303 before the flexible printed circuit board 303 is attached to the back surface of the display panel 301, since the second through hole 319a and / or the groove 311a are arranged, the generation of air pockets between the flexible printed circuit board 303 and the display panel 301 may be suppressed. For example, regardless of before and after attachment, since the through hole 331a, the second through hole 319a and / or the groove 311a are provided in the attachment area of ​​the shielding film 304 and the flexible printed circuit board 303 and / or the attachment area of ​​the flexible printed circuit board 303 and the display panel 301, the generation of air pockets in the attachment area may be suppressed, and wireless communication performance that meets the design specification may be achieved.

[0114] Fig.15 is a diagram showing an electronic device (eg, Figures 1 to 5 The display 300 (eg, Figure 1 The display module 1060 or Figure 2 , Figure 4 and Figure 5 2 is a view of the arrangement of through holes 331a and slits 319b in the display 101 or 230). Fig.16 3 is a view for explaining the arrangement of the through holes 331 a or the slits 319 b in the display 300 of the electronic device 200 according to an embodiment of the present disclosure.

[0115] Reference Fig.15 and Fig.16 , the display 300 may be located in a groove in the protective sheet (e.g., Fig.13 The groove 311a) or the slit in the adhesive layer 319 is omitted and the slit 319b is provided in the adhesive layer 319 in a structure different from that in the adhesive layer 319. Fig.13 and / or Fig.14 For example, Fig.15 and Fig.16 As shown, the slit 319b may extend from a position corresponding to the through hole 331a across the edge of the attachment area (e.g., the attachment area of ​​the adhesive layer 319). In an embodiment, one end of the slit 319b may be opened to the outside at the edge of the adhesive layer 319. In an embodiment, one end of the slit 319b may be opened to the outside space approximately at the edge of the flexible printed circuit board 303.

[0116] According to the embodiment, while the shielding film 304 is being attached to the flexible printed circuit board 303, the air existing between the shielding film 304 and the flexible printed circuit board 303 can be sequentially discharged to the outside through the through holes 331a and / or the slits 319b. As a result, even when the shielding film 304 is attached to the flexible printed circuit board 303, the generation of air pockets in the attachment area can be suppressed, and even when the shielding film 304 is attached to the radiation conductor (e.g., Fig.12 When the first radiation conductor 210a and the second radiation conductor 210b are arranged adjacent to each other, the radiation conductor (for example, Fig.12 The degradation of the wireless signal transmission / reception performance of the first radiation conductor 210a and the second radiation conductor 210b in FIG.

[0117] According to an embodiment, the slit 319b may be omitted from a structure in which the shielding film 304 is already attached to the flexible printed circuit board 303 before the flexible printed circuit board 303 is attached to the rear surface of the display panel 301. For example, the order of attaching the shielding film 304, the flexible printed circuit board 303, and / or the display panel 301 may be appropriately selected depending on whether the slit 319b is included. The order of attachment or whether the slit 319b is included may be related to the structure in which the shielding film 304 is attached to the flexible printed circuit board 303. Fig.13 and / or Fig.14 The embodiments are similar to those in the embodiments, and therefore a detailed description thereof will be omitted.

[0118] Fig.17 is a diagram showing an electronic device (eg, Figures 1 to 5 The display 300 (eg, Figure 1 The display module 1060 or Figure 2 , Figure 4 and Figure 5 2 is a view of an arrangement of through slits 331 b in a display 101 or 230 ). Fig.18 2 is a view for explaining the arrangement of slits 331 b in the display 300 of the electronic device 200 according to an embodiment of the present disclosure.

[0119] Reference Fig.17 and Fig.18 , can be omitted Figures 13 to 16 The second through hole 319a, the groove 311a and / or the slit 319b are provided in the flexible printed circuit board 303, and the display 300 may include a second slit 331b provided in the flexible printed circuit board 303. In an embodiment, when the second slit 331b is provided in the flexible printed circuit board 303, the through hole (for example, Fig.13 or Fig.14The through hole 331a), and the second slit 331b itself can be arranged to extend through both surfaces of the flexible printed circuit board 303, thereby including Fig.13 or Fig.14 Although not shown, in an embodiment, the second slit 331b may be implemented as a groove provided on one surface of the flexible printed circuit board 303 without extending through both surfaces of the flexible printed circuit board 303. In this case, even if the Fig.13 or Fig.14 In addition to the through hole 331a, a channel for exhausting air may be provided in one surface of the flexible printed circuit board 303 as the second slit 331b itself.

[0120] According to an embodiment, the second slit 331b may be formed from a through hole (eg, Fig.13 The second slit 331b may extend through any one of the through holes 331a). For example, the second slit 331b may be provided in another surface of the flexible printed circuit board 303, may be connected to the through hole in the attachment area, and may extend across the edge of the attachment area. In an embodiment, the second slit 331b may have an open end at one edge of the flexible printed circuit board 303. However, it is noted that one or more embodiments of the present disclosure are not limited to this. For example, when the shielding film 304 has a smaller size than the flexible printed circuit board 303 so that the edge of the attachment area is spaced apart from the edge of the flexible printed circuit board 303 by a predetermined distance, the second slit 331b may be implemented so that its opposite ends are substantially covered by the flexible printed circuit board 303 by providing one end of the second slit 331b outside the attachment area and the other end inside the attachment area on the flexible printed circuit board 303.

[0121] According to an embodiment, although not shown, the flexible printed circuit board 303 may include a wiring line electrically connecting the DDI 331 and the display panel 301. The number, position, or width of the second slits 331b may be determined in consideration of an area in which the wiring line is disposed or a trace of the wiring line extends on the flexible printed circuit board 303. Figures 13 to 16 Compared with the embodiment of the present invention, there are some limitations when providing a groove or a slit (e.g., the second slit 331b) in the flexible printed circuit board 303 itself. According to the embodiment, by providing the second slit 331b, the generation of air pockets in the attachment area between the shielding film 304 and the flexible printed circuit board 303 or the attachment area between the flexible printed circuit board 303 and the display panel 301 can be suppressed. For example, the radiation conductor (e.g., Fig.12The first radiation conductor 210a and the second radiation conductor 210b) can provide wireless signal transmission / reception performance that meets the design specifications even when the flexible printed circuit board 303 or the shielding film 304 is disposed adjacent thereto.

[0122] Fig.19 is a diagram showing an electronic device (eg, Figures 1 to 5 The display 300 (eg, Figure 1 The display module 1060 or Figure 2 , Figure 4 and Figure 5 2 is a view of an arrangement of through holes 331a and grooves 331c in a display 101 or 230). Fig. 20 3 is a view for explaining the arrangement of the through holes 331 a or the grooves 331 c in the display 300 of the electronic device 200 according to an embodiment of the present disclosure.

[0123] Reference Fig.19 and Fig. 20 , the display 300 may include at least one through hole 331a formed in the flexible printed circuit board 303 and at least one second groove 331c extending from the at least one through hole 331a. By setting the at least one second groove 331c in a surface (e.g., a surface represented by the reference numeral "303b") of the flexible printed circuit board 303 opposite to the surface (e.g., a surface represented by the reference numeral "303b") on which the shielding film 304 is provided, the at least one second groove 331c may serve as a channel for exhausting air between the shielding film 304 and the flexible printed circuit board 303 even when the shielding film 304 is provided. When setting the at least one second groove 331c, the track or position of the wiring line of the flexible printed circuit board 303 may be considered. In an embodiment, although not shown, the at least one second groove 331c may be omitted, and the at least one mesh structure may be provided to correspond to the position or track of the at least one second groove 331c. The mesh structure is, for example, a mesh structure, and may be interposed between the flexible printed circuit board 303 and the adhesive layer 319 (or the display panel 301) to form a predetermined gap or maintain a predetermined gap. For example, by maintaining a predetermined gap between the flexible printed circuit board 303 and the adhesive layer 319 (or the display panel 301) while being connected to the through hole 331a, at least one second groove 331c or at least one mesh structure may serve as a channel for exhausting air together with the through hole 331a. In an embodiment, at least one second groove 331c or at least one mesh structure may be exposed to the external space substantially at the edge of the flexible printed circuit board 303 or the adhesive layer 319.

[0124] According to the embodiment, while the shielding film 304 is being attached to the flexible printed circuit board 303, the air existing between the shielding film 304 and the flexible printed circuit board 303 can be sequentially discharged to the outside through the through hole 331a and / or the second groove 331c (or the mesh structure). As a result, even when the shielding film 304 is attached to the flexible printed circuit board 303, the generation of air pockets in the attachment area can be suppressed, and even when the shielding film 304 is attached to the radiation conductor (for example, Fig.12 When the first radiation conductor and the second radiation conductor in the embodiment are arranged adjacent to each other, the radiation conductor (for example, Fig.12 Deterioration of the wireless signal transmission / reception performance of the first radiation conductor and the second radiation conductor in the embodiment.

[0125] According to an embodiment, the second groove 331c or the mesh structure may be omitted from a structure in which the shielding film 304 is already attached to the flexible printed circuit board 303 before the flexible printed circuit board 303 is attached to the rear surface of the display panel 301. The structure for suppressing the generation of air pockets between the shielding film 304 and the flexible printed circuit board 303 or between the flexible printed circuit board 303 and the display panel 301 may be similar to the structure in which the shielding film 304 is attached to the flexible printed circuit board 303 before the flexible printed circuit board 303 is attached to the rear surface of the display panel 301. Fig.13 and / or Fig.14 The structure in the embodiment is similar, so its detailed description will be omitted.

[0126] Fig.21 is a diagram showing an electronic device (eg, Figures 1 to 5 The display 300 (eg, Figure 1 The display module 1060 or Figure 2 , Figure 4 and Figure 5 2 is a view of an arrangement of through holes 331a and slits 311b in a display 101 or 230). Fig. 22 3 is a view for explaining the arrangement of through holes 331 a and 319 a or slits 311 b in the display 300 of the electronic device 200 according to an embodiment of the present disclosure.

[0127] Reference Fig.21 and Fig. 22 , the display 300 and Fig.13 or Fig.14The display in the embodiment of the present invention is similar, but the third groove or the third slit 311b may be defined by the protective sheet 311, and the opposite ends of the third slit 311b may be closed by the protective sheet 311. In an embodiment, the third slit 311b may substantially extend through both surfaces of the protective sheet 311 and may be provided to partially correspond to the through hole 331a in the attachment area. In an embodiment, the third slit 311b may be provided across the edge of the attachment area and / or the edge of the flexible printed circuit board 303. For example, the third slit 331b is substantially covered by the flexible printed circuit board 303, but at least a portion of the third slit 311b may be exposed to the external space instead of being substantially covered by the flexible printed circuit board 303. In a structure in which the third slit 311b is provided in the display panel 301 or the protective sheet 311, the adhesive layer 319 may provide a second through hole 319a corresponding to the through hole 331a. For example, when the shielding film 304 is attached to the flexible printed circuit board 303, the through hole 331a, the second through hole 319a and / or the third slit 311b can serve as an exhaust passage for air. As a result, when the shielding film 304 is provided on the flexible printed circuit board 303, the generation of air pockets can be suppressed, and the radiation conductor (e.g., Fig.12 The degradation of the wireless signal transmission / reception performance of the first radiation conductor 210a and the second radiation conductor 210b in FIG.

[0128] According to one or more embodiments of the present disclosure, the generation of air pockets in the attachment area of ​​the shielding film 304 and the flexible printed circuit board 303 can be suppressed. When the flexible printed circuit board 303 including at least one electric / electronic component (e.g., a display driver integrated circuit (DDI) 331) is attached to a conductive member such as a radiation conductor (e.g., Fig.12 When the structures generating electromagnetic fields of the first radiation conductor 210a and the second radiation conductor 210b are arranged adjacent to each other, the shielding film 304 may cause capacitive coupling or inductive coupling, or may change the distribution of the generated electromagnetic fields. For example, the wireless signal transmission / reception environment may be changed according to the arrangement of the shielding film 304. In an embodiment, by suppressing the generation of air pockets during the attachment process of the shielding film 304, the wireless signal transmission / reception environment may be suppressed from changing to be different from the design specification. When an electronic device (e.g., Figures 1 to 5 When the electronic device 1001, 1002, 1004, 100 or 200 in the embodiment is reduced in size, the variation of the wireless communication environment increases depending on the arrangement of the shielding film 304. One or more embodiments of the present disclosure can improve the antenna or the radiating conductor (for example, Fig.12 The degree of freedom in design and arrangement of the first radiation conductor 210a and the second radiation conductor 210b in FIG.

[0129] Effects that can be obtained by the present disclosure are not limited to those described above, and other effects not described above can be clearly understood by a person of ordinary skill in the technical field to which the present disclosure pertains based on the following description.

[0130] As described above, according to the embodiment, a display (e.g., Figure 1 The display module 1060 or Figure 2 , Figures 4 to 6 , Fig.10 , Fig.11 and Figures 13 to 21 The display module 101, 230 or 300 in the embodiment may include: a display panel (eg, Figure 6 , Fig.10 , Fig.11 and Figures 13 to 21 The display panel 301 includes a light-emitting layer; a flexible printed circuit board (eg, Figure 6 , Fig.10 , Fig.11 and Figures 13 to 21 A flexible printed circuit board 303 in the display panel, the flexible printed circuit board extending from the display panel and at least partially disposed on the rear surface of the display panel; a display driver integrated circuit ("DDI") ( Figure 6 or Fig.13 The display driver integrated circuit 331 in the flexible printed circuit board is provided on one surface of the flexible printed circuit board and is configured to drive the display panel; and a shielding film (eg, Figures 6 to 9 , Fig.10 and Figures 11 to 21 The shielding film 304 in the DDI is attached to the flexible printed circuit board in a state of surrounding at least a portion of the DDI. In an embodiment, the flexible printed circuit board may include at least one through hole (e.g., Figures 13 to 21 through hole 331a or slit 331b) or at least one groove (eg, Fig.19 or Fig. 20 groove 331c in the bottom surface of the substrate.

[0131] According to an embodiment, the above display may further include a second groove (eg, Fig.14 The groove 311a or Fig.15 or Fig.21 In an embodiment, the second groove may extend from a position corresponding to the at least one through hole and may be disposed to cross over an edge of the attachment area or be exposed at an edge of the attachment area.

[0132] According to an embodiment, the above-mentioned display may further include a protective sheet (eg, Figures 13 to 21In an embodiment, at least a portion of the second groove may be surrounded by a protective sheet.

[0133] According to an embodiment, the above-mentioned display may further include an adhesive layer (eg, Figures 13 to 21 The adhesive layer 319 in the second groove is provided on the rear surface of the display panel to attach the flexible printed circuit board to the rear surface of the display panel. In an embodiment, at least a portion of the second groove may be surrounded by the adhesive layer.

[0134] According to an embodiment, the flexible printed circuit board may include at least one through hole and at least one groove extending from the at least one through hole across the edge of the attachment area on the other surface of the flexible printed circuit board (eg, Fig.19 and Fig. 20 groove 331c in the bottom surface of the substrate.

[0135] According to an embodiment, the flexible printed circuit board may include at least one groove extending from the inside of the attachment area across the edge of the attachment area on one surface of the flexible printed circuit board (eg, replacing the groove Fig.17 and Fig.18 The groove of the slit 331b in the figure).

[0136] According to an embodiment, the flexible printed circuit board may further include a slit (eg, Fig.17 and Fig.18 The slit 331b in FIG.

[0137] According to an embodiment, the slit is arranged to extend through both surfaces of the flexible printed circuit board.

[0138] According to an embodiment, the shielding film may include an insulating layer (eg, Figure 8 or Fig. 9 The insulating layer 343 in the DDI) and the shielding layer (eg, Figures 7 to 9 The shielding layer 341 in the DDI is provided with the insulating layer interposed between the shielding layer and at least a portion of the DDI. In an embodiment, the shielding layer may be electrically connected to the flexible printed circuit board.

[0139] According to an embodiment, the shielding layer may be electrically connected to a ground conductor of the flexible printed circuit board.

[0140] According to an embodiment of the present disclosure, an electronic device (eg, Figures 1 to 5 The electronic device 1001, 1002, 1004, 100 or 200) in may include the above-mentioned display.

[0141] According to an embodiment, an electronic device (eg, Figures 1 to 5The electronic device 1001, 1002, 1004, 100 or 200 in the embodiment may include: a housing (eg, Figure 4 and / or Figure 5 The housing 201 in the embodiment includes a first surface (eg, Figure 2 a first surface 110A in the middle), a second surface facing in a direction opposite to the first surface (eg, Figure 3 The second surface 110B in the first surface and the second surface) and the side structure (for example, Figure 3 , Figure 4 and / or Fig.12 side structure 210 in the display (eg, Figure 1 Display 1060 or Figure 2 , Figures 4 to 6 , Fig.10 , Fig.11 and Figures 13 to 21 The display 101, 230 or 300 in the embodiment of the present invention is provided in a space at least partially surrounded by the side structure and is configured to output a picture through at least a portion of the first surface; and a processor (e.g., Figure 1 processor 1020 in the embodiment of the present invention) or a communication module (e.g., Figure 1 The communication module 1090 in the processor or the communication module is configured to transmit the radiation to the receiver by using at least a portion of the side structure (hereinafter referred to as "radiating conductor") (for example, Fig.12 The first radiation conductor 210a or the second radiation conductor 210b in the embodiment can be used to perform wireless communication. In an embodiment, the display can include: a display panel (eg, Figure 6 , Fig.10 , Fig.11 and Figures 13 to 21 The display 301 in the embodiment includes a light-emitting layer; a flexible printed circuit board (eg, Figure 6 , Fig.10 , Fig.11 and Figures 13 to 21 A flexible printed circuit board 303 in the display panel, the flexible printed circuit board extending from the display panel at a position adjacent to the radiation conductor and at least partially disposed on the rear surface of the display panel; a DDI (eg, Figure 6 or Fig.13 331 in the flexible printed circuit board), which is disposed on one surface of the flexible printed circuit board and is configured to drive the display panel; and a shielding film (eg, Figures 6 to 9 , Fig.10 and Figures 11 to 21The shielding film 304 in the DDI is attached to the flexible printed circuit board in a state of surrounding at least a portion of the DDI. In an embodiment, the flexible printed circuit board may include at least one through hole (e.g., Figures 13 to 21 through hole 331a or slit 331b) or at least one groove (eg, Fig.19 or Fig. 20 groove 331c in the bottom surface of the substrate.

[0142] According to an embodiment, the side structure may include a radiation conductor disposed adjacent to the flexible printed circuit board or the DDI and extending at least partially parallel to the display panel, and an insulating member (eg, Fig.12 The insulating material portion or the synthetic resin material portion indicated by “211a” in the figure).

[0143] According to an embodiment, the electronic device may further include a supporting member (eg, Figure 4 , Figure 5 or Fig.12 In an embodiment, the flexible printed circuit board may be at least partially disposed between the display panel and the supporting member.

[0144] According to an embodiment, the display may further include a second groove (eg, Fig.14 The groove 311a or Fig.15 or Fig.21 In an embodiment, the second groove may extend from a position corresponding to the at least one through hole and may be disposed to cross over an edge of the attachment area or be exposed at an edge of the attachment area.

[0145] According to an embodiment, the display may further include a protective sheet (eg, Figures 13 to 21 In an embodiment, at least a portion of the second groove may be surrounded by the protection sheet.

[0146] According to an embodiment, the display may further include an adhesive layer (eg, Figures 13 to 21 The adhesive layer 319 in the second groove is provided on the rear surface of the display panel to attach the flexible printed circuit board to the rear surface of the display panel. In an embodiment, at least a portion of the second groove may be surrounded by the adhesive layer.

[0147] According to an embodiment, the shielding film may include an insulating layer (eg, Figure 8 or Fig. 9The insulating layer 343 in the DDI) and the shielding layer (eg, Figures 7 to 9 The shielding layer 341 in the DDI is provided with the insulating layer interposed between the shielding layer and at least a portion of the DDI. In an embodiment, the shielding layer may be electrically connected to the flexible printed circuit board.

[0148] According to an embodiment, the shielding layer may be electrically connected to a ground conductor of the flexible printed circuit board.

[0149] According to an embodiment, the shielding layer may be configured to provide an electromagnetic shielding structure between the DDI and the radiating conductor.

[0150] Although the present disclosure has been described with reference to the embodiments as examples, it should be understood that the embodiments are intended to be illustrative and not limiting of the present disclosure. It will be clear to those skilled in the art that various changes can be made in form and detail without departing from the overall scope of the present disclosure (including the appended claims and their equivalents). For example, the grooves or slits shown in different figures may be replaced or combined with each other, and the grooves or slits provided on the adhesive layer (or protective layer) may be combined differently depending on the number and position of the through holes provided in the flexible printed circuit board.

Claims

1. A display (1060; 101; 230; 300), the display (1060; 101; 230; 300) comprises: A display panel (231; 301), wherein the display panel (231; 301) comprises a light-emitting layer; a flexible printed circuit board (233; 303), the flexible printed circuit board (233; 303) extending from the display panel (231; 301) and at least partially disposed on a rear surface of the display panel (231; 301); A display driver integrated circuit (331) is disposed on one surface of the flexible printed circuit board (233; 303) and is configured to drive the display panel (231; 301); and a shielding film (304) attached to the flexible printed circuit board (233; 303) in a state of surrounding at least a portion of the display driver integrated circuit (331), Wherein, the flexible printed circuit board (233; 303) comprises at least one through hole (331a; 331b) or at least one groove (331c) arranged in an attachment area to which the shielding film (304) is attached.

2. The display (1060; 101; 230; 300) according to claim 1, further comprising a second groove (311a; 319b; 311b) provided on the rear surface of the display panel (231; 301), in, The second groove (311a; 319b; 311b) extends from a position corresponding to the at least one through hole (319a; 331a) and is arranged to cross an edge of the attachment area or be exposed at the edge of the attachment area.

3. The display (1060; 101; 230; 300) according to claim 2, the display (1060; 101; 230; 300) further comprising a protective sheet (311) attached to the rear surface of the display panel (231; 301), in, At least a portion of the second groove (311a; 319b; 311b) is surrounded by the protection sheet (311).

4. The display (1060; 101; 230; 300) according to any one of claims 2 to 3, further comprising an adhesive layer (319) disposed on the rear surface of the display panel (231; 301) to attach the flexible printed circuit board (233; 303) to the rear surface of the display panel (231; 301), in, At least a portion of the second groove (311a; 319b; 311b) is surrounded by the adhesive layer (319).

5. A display according to one of the preceding claims (1060; 101; 230; 300), of which, The flexible printed circuit board (233; 303) comprises: The at least one through hole (331a); as well as The at least one groove (331c) extends from the at least one through hole (331a) across the edge of the attachment area on the other surface of the flexible printed circuit board (233; 303).

6. The display (1060; 101; 230; 300) according to one of the preceding claims, wherein: The flexible printed circuit board (233; 303) comprises at least one groove (331c) extending from the inside of the attachment area across the edge of the attachment area on the one surface of the flexible printed circuit board (233; 303).

7. The display (1060; 101; 230; 300) according to one of the preceding claims, wherein The flexible printed circuit board (233; 303) further comprises a slit (331b) extending from the at least one through hole across the edge of the attachment area.

8. The display (1060; 101; 230; 300) according to claim 7, wherein: The slit (319b) is configured to extend through two surfaces of the flexible printed circuit board (233; 303).

9. A display according to one of the preceding claims (1060; 101; 230; 300), of which, The shielding film comprises: an insulating layer (343), the insulating layer (343) being arranged to surround at least a portion of the display driver integrated circuit; and a shielding layer (341), the shielding layer (341) being arranged to correspond to at least a portion of the display driver integrated circuit, the insulating layer (343) being interposed between the shielding layer (341) and the at least a portion of the display driver integrated circuit, and Wherein, the shielding layer (341) is electrically connected to the flexible printed circuit board (233; 303).

10. The display (1060; 101; 230; 300) according to claim 9, wherein The shielding layer (341) is electrically connected to a ground conductor of the flexible printed circuit board (233; 303).

11. An electronic device (1001; 1002; 1004; 100; 200) comprising a display (1060; 101; 230; 300) according to one of the preceding claims.

12. The electronic device (1001; 1002; 1004; 100; 200) according to claim 11, the electronic device (1001; 1002; 1004; 100; 200) further comprising: A shell (110; 201), the shell (110; 201) comprising a first surface (110A), a second surface (110B) facing in a direction opposite to the first surface (110A), and a side structure (118; 210) at least partially surrounding a space between the first surface (110A) and the second surface (110B), wherein the display (1060; 101; 230; 300) is disposed in the space at least partially surrounded by the side structure (118; 210) and is configured to output images through at least a portion of the first surface (110A); and a processor (1020) or a communication module (1090), the processor (1020) or the communication module (1090) being configured to perform wireless communication by using a radiating conductor (210a; 210b) formed by at least a portion of the side structure (118; 210), The flexible printed circuit board (233; 303) extends from the display panel (231; 301) at a position adjacent to the radiation conductor (210a; 210b).

13. The electronic device (100; 200; 1001; 1002; 1004) according to claim 12, wherein: The side structure (118; 210) comprises: the radiating conductor (210a; 201b), the radiating conductor (210a; 201b) being disposed adjacent to the flexible printed circuit board (233; 303) or the display driver integrated circuit and extending to be at least partially parallel to the display panel (231; 301); and An insulating member (211a) is provided to surround at least a portion of the radiation conductor (210a; 210b).

14. The electronic device (100; 200; 1001; 1002; 1004) according to any one of claims 12 and 13, the electronic device (100; 200; 1001; 1002; 1004) further comprising a support member (211) disposed between the first surface (110A) and the second surface (110B), in, The flexible printed circuit board (233; 303) is at least partially arranged between the display panel (231; 301) and the support member (211).

15. The electronic device (100; 200; 1001; 1002; 1004) according to any one of claims 11 to 14, wherein: The shielding layer (341) is configured to provide an electromagnetic shielding structure between the display driver integrated circuit and the radiating conductor (210a; 210b).

Images