A control method for curing lamp light

Abstract

The present invention relates to the technical field of curing lamp light control, and discloses a control method for curing lamp light, including: performing an experiment on recording the curing duration of an adhesive, and recording the curing duration when the adhesive is irradiated by the curing lamp at different curing distances; when the curing lamp irradiates the chip to be cured, performing a determination area determination strategy to obtain a determination area; performing a centralized curing prediction strategy, irradiating two side edges of the determination area with the curing lamp simultaneously, and recording the duration when the adhesives on the two side edges are cured completely, denoted as the first curing duration; performing a decentralized curing prediction strategy, irradiating the two side edges of the determination area with the curing lamp in sequence, and recording the total duration when the adhesives on the two side edges are cured completely, denoted as the second curing duration; comparing the first curing duration and the second curing duration, and selecting the curing strategy corresponding to the minimum curing duration to cure the determination area, so as to save the curing time and improve the curing efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of curing lamp light control, and specifically provides a control method for the light of a curing lamp. Background Art

[0002] The technology of using a curing lamp to cure the adhesive coated on the chip pins is mainly applied in the fields of electronic packaging and assembly. During the production process, in order to ensure a good connection between the chip pins and the circuit board, adhesives are usually used for bonding. Adhesives are usually photosensitive or thermosensitive materials. After being coated on the surface of the chip pins, they are irradiated by a curing lamp. Using ultraviolet light or light sources of other specific spectra, the adhesives undergo crosslinking curing, thereby improving the bonding strength and reliability. The advantage of the curing process is that the curing lamp can quickly and uniformly activate the adhesive, enabling it to reach the required curing strength in a short time, avoiding the long waiting time in the traditional thermal curing process. This method has the advantages of fast curing speed, process controllability, and relatively small thermal load on the chip itself, and is widely used in the manufacturing of precision electronic components such as semiconductors and sensors.

[0003] During the existing chip production process, in cases where space is limited, a point-source curing lamp is often used to irradiate the adhesive layer on the pins. Especially in multi-pin and micro-sized chips, this can avoid waste and cross-curing. However, when the distance between two chips allows for the simultaneous curing of both chips using a single point-source curing lamp, and the curing time is less than the time required to cure the two chips separately, if the two chips are still cured separately, it not only wastes time but also increases the movement path of the curing lamp, reducing efficiency.

[0004] Therefore, this solution proposes a control method for the light of a curing lamp, aiming to find a method that balances time savings and reduced path when only a single point-source curing lamp is used to cure the adhesive layer on the pins. Summary of the Invention

[0005] The present invention provides a control method for the light of a curing lamp to help solve the problems mentioned in the above background art.

[0006] The present invention provides the following technical solution: A control method for the light of a curing lamp, comprising:

[0007] Denote the thickness of the adhesive coated on the circuit board as the coating thickness;

[0008] Denote the distance between the curing lamp and the adhesive when irradiating the adhesive as the curing distance, where the curing distance is within the range of [minimum curing distance, maximum curing distance];

[0009] Denote the time from the start of curing the adhesive by the curing lamp to the completion of curing as the curing duration;

[0010] Obtain all coating thicknesses;

[0011] For the adhesive corresponding to each coating thickness;

[0012] Perform an experiment to record the curing duration of the adhesive, and record the curing duration when the curing lamp irradiates the adhesive at different curing distances;

[0013] Obtain the curing durations of the adhesives with all coating thicknesses at different curing distances to obtain a thickness-distance-time model;

[0014] Mark the chip with pins coated with adhesive on the circuit board as the chip to be cured. The shape of the chip to be cured mapped on the circuit board is rectangular, and mark the rectangle as the target rectangle;

[0015] The coating thickness of the adhesive at all pins on one chip to be cured is the same;

[0016] Mark the light spot formed on the circuit board when the curing lamp irradiates the circuit board as the curing light spot. Among them, the shape of the curing light spot is rectangular, and the area of the curing light spot increases with the increase of the curing distance;

[0017] When the curing lamp irradiates the chip to be cured at the maximum curing distance, execute the determination area determination strategy to determine whether the curing light spot simultaneously includes the sides of two target rectangles and these two sides are parallel to each other;

[0018] If the sides of two target rectangles are simultaneously included, mark the area between the two sides of the target rectangle as the determination area, and the shape of the determination area is rectangular;

[0019] Obtain all determination areas on the circuit board;

[0020] For any one determination area;

[0021] Execute the centralized curing prediction strategy, use the curing lamp to irradiate the two sides of the determination area simultaneously, and record the curing duration when the adhesives on the two sides are cured completely, which is recorded as the first curing duration;

[0022] Execute the decentralized curing prediction strategy, use the curing lamp to irradiate the two sides of the determination area in sequence, and record the total curing duration when the adhesives on the two sides are cured completely, which is recorded as the second curing duration;

[0023] Compare the first curing duration and the second curing duration, and select the curing strategy corresponding to the minimum curing duration to cure the determination area.

[0024] Optionally, the execution of the experiment to record the curing duration of the adhesive and record the curing duration when the curing lamp irradiates the adhesive at different curing distances includes:

[0025] Obtain the minimum curing distance, where the minimum curing distance is the smallest curing distance when curing the adhesive;

[0026] Obtain the maximum curing distance, where the maximum curing distance is the largest curing distance when curing the adhesive;

[0027] Set the test distance interval, where the test distance interval is the increment of the curing distance;

[0028] Calculate (maximum curing distance - minimum curing distance) / test distance interval + 1, and record the result as the test quantity a;

[0029] Calculate the minimum curing distance + test distance interval, and record the result as the first curing distance;

[0030] Calculate the minimum curing distance + test distance interval × 2, and record the result as the second curing distance... Calculate the minimum curing distance + test distance interval × (a - 1), and record the result as the maximum curing distance;

[0031] Cure the adhesive with the curing lamp successively at the minimum curing distance, the first curing distance... the maximum curing distance, and record the curing duration of the adhesive at each curing distance.

[0032] Optionally, when the curing lamp irradiates the to-be-cured chip at the maximum curing distance, execute the determination area determination strategy to determine whether the curing light spot simultaneously includes the sides of two target rectangles and these two sides are parallel to each other, including:

[0033] Obtain all the target rectangles;

[0034] Select each target rectangle in turn, and record the selected target rectangle as the execution rectangle;

[0035] Record any one side of the execution rectangle as the execution side;

[0036] Execute the determination area determination strategy on the execution side, specifically:

[0037] Make a line segment that coincides with the execution side, and record it as the coincident line segment;

[0038] Obtain the length of the curing light spot corresponding to the maximum curing distance, and record it as the first length;

[0039] Move the coincident line segment on the plane where the circuit board is located in a direction perpendicular to the execution side away from the execution rectangle, and the maximum distance of movement is the first length;

[0040] During the process of the coincident line segment moving away from the execution rectangle, record the target rectangle where the side of the target rectangle that coincides with the coincident line segment is located as the determination rectangle;

[0041] For any one determination rectangle;

[0042] Obtain the side that coincides with the first and overlapping line segments, and denote it as the judgment side;

[0043] Obtain the line segment on the judgment side that coincides with the overlapping line segment, and denote it as the second overlapping line segment;

[0044] Project the second overlapping line segment onto the execution side in a direction perpendicular to the execution side, and denote the line segment projected by the second overlapping line segment on the execution side as the first overlapping line segment;

[0045] Draw two parallel line segments, denoted as the first parallel line segment and the second parallel line segment respectively;

[0046] Connect the two endpoints of the first overlapping line segment and the second overlapping line segment with the first parallel line segment;

[0047] Connect the two endpoints of the first overlapping line segment and the second overlapping line segment with the second parallel line segment;

[0048] Denote the rectangular area formed by the first parallel line segment, the second parallel line segment, the first overlapping line segment and the second overlapping line segment as the judgment area.

[0049] Optionally, the execution set solidifies the prediction strategy, and uses the solidification lamp to irradiate the two sides of the judgment area simultaneously, including:

[0050] Measure the length of the first parallel line segment in the judgment area, and denote it as the second length;

[0051] Denote the solidification light spot with a length value equal to the second length as the first test light spot;

[0052] Denote any direction parallel to the first overlapping line segment on the circuit board as the solidification direction;

[0053] Use the first test light spot to evenly divide the judgment area into multiple rectangles along the solidification direction, and denote the divided rectangles as positioning rectangles;

[0054] Obtain the number of positioning rectangles, and denote it as the first quantity.

[0055] Optionally, the execution set solidifies the prediction strategy, and uses the solidification lamp to irradiate the two sides of the judgment area simultaneously, including:

[0056] Obtain the chip corresponding to the first overlapping line segment in the judgment area, and denote it as the first chip;

[0057] Obtain the chip corresponding to the second overlapping line segment in the judgment area, and denote it as the second chip;

[0058] Measure the coating thickness of the adhesive at the pins on the first chip, and denote it as the first thickness;

[0059] Measure the coating thickness of the adhesive at the pins on the second chip, denoted as the second thickness;

[0060] Obtain the curing distance at which the curing lamp irradiates the circuit board to form the first test light spot, denoted as the first test distance;

[0061] According to the thickness-distance-time model, obtain the curing duration when the coating thickness is equal to the first thickness and the curing distance is equal to the first test distance, denoted as the first duration;

[0062] According to the thickness-distance-time model, obtain the curing duration when the coating thickness is equal to the second thickness and the curing distance is equal to the first test distance, denoted as the second duration;

[0063] Compare the magnitude relationship between the first duration and the second duration;

[0064] If the first duration ≥ the second duration;

[0065] The first curing duration is equal to the first duration × the first quantity;

[0066] If the first duration < the second duration;

[0067] The first curing duration is equal to the second duration × the first quantity.

[0068] Optionally, when executing the decentralized curing prediction strategy, irradiate the two sides of the determination area with the curing lamp in sequence, including:

[0069] Obtain the width of the adhesive around the first chip mapped on the circuit board, denoted as the first width;

[0070] Obtain the width of the adhesive around the second chip mapped on the circuit board, denoted as the second width;

[0071] Calculate the second length - the first width - the second width, and denote the result as the third width;

[0072] Set the division quantity b for executing the decentralized curing prediction strategy;

[0073] Divide the third width into division quantity width intervals;

[0074] Select the first width, the first width + the width interval... the first width + the width interval × b as the third length in sequence, and conduct a curing experiment on the first overlapping line segment. Specifically:

[0075] Denote the curing light spot with a length value equal to the third length as the second test light spot;

[0076] Obtain the width value of the second test light spot, denoted as the first division length;

[0077] Divide the first overlapping line segment into units of the first division length to obtain multiple first test line segments;

[0078] Obtain the number of the first test line segments, denoted as the second quantity;

[0079] Obtain the curing distance at which the curing lamp irradiates the circuit board to form the second test light spot, denoted as the second test distance;

[0080] According to the thickness-distance-time model, obtain the curing duration when the coating thickness is equal to the first thickness and the curing distance is equal to the second test distance, denoted as the third duration;

[0081] Calculate the third duration × the second quantity, and the result is used as the total duration for curing the adhesive on the first overlapping line segment, denoted as the first dispersion duration;

[0082] Obtain the first dispersion duration for each third length, compare all the first dispersion durations, and obtain the minimum first dispersion duration, denoted as the first target duration.

[0083] Optionally, when executing the dispersion curing prediction strategy, irradiate the two side edges of the determination area with the curing lamp in sequence, including:

[0084] Select the second width, the second width + the width interval... the second width + the width interval × b as the fourth length in sequence, and conduct a curing experiment on the second overlapping line segment. Specifically:

[0085] Denote the curing light spot with a length value equal to the fourth length as the third test light spot;

[0086] Obtain the width value of the third test light spot, denoted as the second division length;

[0087] Divide the second overlapping line segment into units of the second division length to obtain multiple second test line segments;

[0088] Obtain the number of the second test line segments, denoted as the third quantity;

[0089] Obtain the curing distance at which the curing lamp irradiates the circuit board to form the third test light spot, denoted as the third test distance;

[0090] According to the thickness-distance-time model, obtain the curing duration when the coating thickness is equal to the second thickness and the curing distance is equal to the third test distance, denoted as the fourth duration;

[0091] Calculate the fourth duration × the third quantity, and the result is used as the total duration for curing the adhesive on the second overlapping line segment, denoted as the second dispersion duration;

[0092] Obtain the second dispersion duration for each fourth length, compare all the second dispersion durations, and obtain the minimum second dispersion duration, denoted as the second target duration;

[0093] Obtain the first target duration and the second target duration, calculate the sum, and use the result as the second curing duration.

[0094] Optionally, the comparing the first curing duration and the second curing duration, selecting the curing strategy corresponding to the minimum curing duration, and curing the determination area includes:

[0095] When the first curing duration ≤ the second curing duration;

[0096] Obtain the first test light spot corresponding to the first curing duration;

[0097] When the curing lamp irradiates the determination area, adjust the curing light spot of the curing lamp to the first test light spot, and align the first test light spot with each positioning rectangle in sequence;

[0098] Among them, when the first duration ≥ the second duration, irradiate each positioning rectangle for the first duration;

[0099] When the first duration < the second duration, irradiate each positioning rectangle for the second duration.

[0100] Optionally, the comparing the first curing duration and the second curing duration, selecting the curing strategy corresponding to the minimum curing duration, and curing the determination area includes:

[0101] When the first curing duration > the second curing duration;

[0102] When the curing lamp irradiates the pins on the first overlapping line segment of the determination area;

[0103] Obtain the second test light spot corresponding to the second curing duration;

[0104] Obtain all the first test line segments on the first overlapping line segment;

[0105] Adjust the curing light spot of the curing lamp to the second test light spot, align the width of the formed second test light spot with each first test line segment in sequence, and irradiate each first test line segment for the third duration;

[0106] When the curing lamp irradiates the pins on the second overlapping line segment of the determination area;

[0107] Obtain the third test light spot corresponding to the second curing duration;

[0108] Obtain all the second test line segments on the second overlapping line segment;

[0109] Adjust the curing light spot of the curing lamp to the third test light spot, align the width of the formed third test light spot with each second test line segment in sequence, and irradiate each second test line segment for the fourth duration.

[0110] The present invention has the following beneficial effects:

[0111] 1. For the control method of the curing lamp light, by setting the minimum curing distance and the maximum curing distance, while ensuring that the curing effect of the curing lamp is within the required curing effect, the curing distance is allowed to change within the interval. Each curing distance corresponds to a curing light spot, and thus multiple curing light spots with different lengths and widths are obtained, which is convenient for subsequently finding the curing light spot with the shortest curing determination area time among multiple curing light spots, and then determining the most efficient way to cure the adhesive using a point source curing lamp, thereby improving production efficiency.

[0112] 2. For the control method of the curing lamp light, by performing the experiment of recording the curing duration of the adhesive, a thickness-distance-time model is obtained, establishing a corresponding relationship with thickness and distance as two variables and time as the dependent variable, which is convenient for subsequently obtaining the curing time when the coating thickness and curing distance are known; by the magnitude relationship of the curing time, the most time-saving curing method is determined to improve the curing efficiency; the existence of the thickness-distance-time model provides quantitative support for decision-making, making the decision more persuasive.

[0113] 3. For the control method of the curing lamp light, by setting the test distance interval, which is used as the increment of the curing distance each time, multiple curing distances are obtained in this way. Using multiple curing distances as the experimental conditions for performing the experiment of recording the curing duration of the adhesive, multiple curing durations can be obtained for an adhesive with a certain coating thickness. When the test distance interval is large, the curing distances for performing the recording experiment decrease, saving measurement time; when the test distance interval is small, the curing distances for performing the recording experiment increase, and the more the number of recorded time data, the finer the overall thickness-distance-time model, providing accurate data sources for operators who need a fine model and improving production efficiency.

[0114] 4. For the control method of the curing lamp light, by implementing the determination area determination strategy, it is determined whether there are two target rectangles corresponding to the chips to be cured on the circuit board that can be cured simultaneously. The specific method is that when the curing distance is set to the maximum curing distance to irradiate the circuit board, the curing light spot is the largest and the area that can be covered is the largest. If the mutually parallel sides of two target rectangles can be simultaneously included in the curing light spot, it is determined that these two target rectangles can be cured simultaneously. Since the chip being exposed to the curing light will cause the program to be erased. Ultraviolet light will damage the internal charge distribution, causing the stored charges to be released and the data to be cleared, resulting in a deletion effect. Therefore, during the irradiation process, the chip surface should be avoided from being irradiated. So when selecting the side of the determination rectangle, the side that coincides with the first and the overlapping line segment is selected to avoid the curing light from irradiating the chip surface, reducing the risk hazards during the curing process and improving the product qualification rate.

[0115] 5. For the control method of the curing lamp light, when implementing the centralized curing strategy, the curing lamp is used to irradiate the adhesives on the first overlapping line segment and the second overlapping line segment simultaneously, and the chip surface should be avoided as much as possible. Therefore, the length of the curing light spot is equal to the second length. The first test light spot is determined according to the second length, and the determination area is evenly divided into multiple positioning rectangles along the curing direction by the first test light spot. The number of positioning rectangles is the number of times the determination area needs to be irradiated. Since the adhesives of two thicknesses are irradiated simultaneously, the longest curing time of the adhesives must be used as the standard to compare the magnitude relationship between the first duration and the second duration, and the maximum duration is used as the duration of a single curing. The total duration of centralized curing is the duration of unit curing multiplied by the number of curing times. Compared with decentralized curing, centralized curing can reduce the time of secondary curing. If the time of centralized curing is less than that of decentralized curing, it can achieve the effect of saving time and effort and improve production efficiency.

[0116] 6. For the control method of the curing lamp light, when curing the circuit board in a decentralized manner, since the adhesive has a width and the curing light should be avoided from irradiating the adhesives on other chips while curing one chip, and there is a gap between the adhesives on adjacent chips, the length of the gap can be used to adjust the length of the curing light spot. When the curing light spot is larger, the number of curing times is less and the time required for a single curing is longer. When the curing light spot is smaller, the number of curing times is more and the time required for a single curing is shorter. However, the total curing time is the number of curing times multiplied by the time of a single curing. Therefore, among the total curing durations of multiple curing light spots, the shortest curing duration is selected, which has the highest efficiency, as the total curing duration of decentralized curing to obtain the second curing duration. By using the test model to obtain an adjustable curing light spot and selecting the curing light spot with the shortest curing time in each tested curing light spot, the curing time is reduced and the production efficiency is improved.

[0117] 7. For the control method of the curing lamp light, when the first curing duration is less than or equal to the second curing duration, the first test light spot corresponding to the first curing duration and the positioning rectangle for evenly dividing the determination area are of the same size. Aligning the first test light spot with the positioning rectangle can cure the adhesives on both sides of the determination area. The curing duration of the adhesive with the thickest thickness is selected as the duration of a single curing on the single curing duration, ensuring that the adhesives on both sides of the determination area can be cured simultaneously in one curing, which not only reduces the curing time but also avoids passing through the determination area twice, thus improving production efficiency.

[0118] 8. For the control method of the curing lamp light, when the first curing duration is greater than or equal to the second curing duration, during dispersed curing, the second test light spot is used to irradiate the adhesive on the first overlapping line segment, and the third test light spot is used to irradiate the adhesive on the second overlapping line segment. And to avoid irradiating the chip, the width of the second test light spot is aligned with the first test line segment, and the width of the third test light spot is aligned with the second test line segment, and then irradiate for the required curing duration respectively to achieve the purpose of dispersed curing. The effect of dispersed curing is strong adjustability, flexible control, and convenient curing. BRIEF DESCRIPTION OF THE DRAWINGS

[0119] Figure 1 It is a schematic diagram of the determination area of the present invention.

[0120] Figure 2 It is a schematic diagram of the positioning rectangle during centralized curing of the present invention.

[0121] Figure 3 It is a schematic diagram of the first test line segment during dispersed curing of the present invention.

[0122] Figure 4 It is a schematic diagram of the second test line segment during dispersed curing of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0123] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0124] Embodiment 1, a control method for the curing lamp light, includes:

[0125] Record the thickness of the adhesive coated on the circuit board as the coating thickness;

[0126] Record the distance between the curing lamp and the adhesive when irradiating the adhesive as the curing distance, where the curing distance is within the interval of [minimum curing distance, maximum curing distance];

[0127] By setting the minimum curing distance and the maximum curing distance, while ensuring that the curing effect of the curing lamp is within the required curing effect, the curing distance is allowed to change within the interval. Each curing distance corresponds to a curing light spot, and then multiple curing light spots with different lengths and widths are obtained, which is convenient for subsequently finding a curing light spot with the shortest curing determination area time among the multiple curing light spots, and then determining the most efficient way to cure the adhesive using a point-source curing lamp, thereby improving production efficiency.

[0128] Record the time from the start of curing the adhesive to the completion of curing by the curing lamp as the curing duration;

[0129] Obtain all the coating thicknesses;

[0130] For the adhesive corresponding to each coating thickness;

[0131] Perform an experiment to record the curing duration of the adhesive, and record the curing duration when the adhesive is irradiated by the curing lamp at different curing distances;

[0132] Obtain the curing durations of the adhesives with all coating thicknesses at different curing distances, and obtain a thickness-distance-time model;

[0133] By performing an experiment to record the curing duration of the adhesive, a thickness-distance-time model is obtained, establishing a corresponding relationship with thickness and distance as bivariate variables and time as the dependent variable, which is convenient for obtaining the curing time when the coating thickness and curing distance are known. By the magnitude relationship of the curing time, the most time-saving curing method is determined to improve the curing efficiency. The existence of the thickness-distance-time model provides quantitative support for decision-making, making the decision more persuasive.

[0134] Record the chip on the circuit board where the pins coated with the adhesive are located as the chip to be cured. The shape of the chip to be cured mapped on the circuit board is rectangular, and the rectangle is denoted as the target rectangle;

[0135] The coating thickness of the adhesive at all pins on one chip to be cured is the same;

[0136] Record the light spot formed on the circuit board when the curing lamp irradiates the circuit board as the curing light spot. Among them, the shape of the curing light spot is rectangular, and the area of the curing light spot increases with the increase of the curing distance;

[0137] When the curing lamp irradiates the chip to be cured at the highest curing distance, execute the determination area determination strategy to judge whether the curing light spot simultaneously includes two sides of the target rectangle and these two sides are parallel to each other;

[0138] If it simultaneously includes two sides of the target rectangle, then record the area between these two sides of the target rectangle as the determination area, and the shape of the determination area is rectangular;

[0139] Obtain all the determination areas on the circuit board;

[0140] For any one determination area;

[0141] Execute the centralized curing prediction strategy, use the curing lamp to irradiate the two sides of the determination area simultaneously, and record the duration when the adhesives on the two sides are cured completely, which is denoted as the first curing duration;

[0142] Execute the dispersion curing prediction strategy, irradiate the two side edges of the determination area with the curing lamp in sequence, and record the total duration for the adhesive bonding and curing to complete on the two side edges, which is denoted as the second curing duration;

[0143] Compare the first curing duration and the second curing duration, select the curing strategy corresponding to the minimum curing duration, and cure the determination area.

[0144] Perform the experiment of recording the adhesive curing duration, and record the curing duration when irradiating the adhesive with the curing lamp at different curing distances, including:

[0145] Obtain the lowest curing distance, which is the minimum curing distance when curing the adhesive;

[0146] Obtain the highest curing distance, which is the maximum curing distance when curing the adhesive;

[0147] Set the test distance interval, which is the increment of the curing distance;

[0148] Calculate (highest curing distance - lowest curing distance) / test distance interval + 1, and denote the result as the test quantity a;

[0149] Calculate the lowest curing distance + test distance interval, and denote the result as the first curing distance;

[0150] Calculate the lowest curing distance + test distance interval × 2, and denote the result as the second curing distance... Calculate the lowest curing distance + test distance interval × (a - 1), and denote the result as the highest curing distance;

[0151] Irradiate the adhesive with the curing lamp in sequence at the lowest curing distance, the first curing distance... the highest curing distance, and record the curing duration of the adhesive at each curing distance.

[0152] By setting the test distance interval, which is used as the increment for increasing the curing distance each time, multiple curing distances are obtained. Using these multiple curing distances as the experimental conditions for performing the experiment of recording the adhesive curing duration, multiple curing durations can be obtained for an adhesive with a coating thickness. When the test distance interval is large, the curing distances for performing the recording experiment decrease, saving measurement time; when the test distance interval is small, the curing distances for performing the recording experiment increase, and the more the number of recorded time data, the finer the overall thickness-distance-time model, providing accurate data sources for operators who need a fine model and improving production efficiency.

[0153] When the curing lamp irradiates the chip to be cured at the highest curing distance, execute the determination area determination strategy to judge whether the curing light spot simultaneously includes the side edges of two target rectangles and these two side edges are parallel to each other, including:

[0154] Obtain all target rectangles;

[0155] Select each target rectangle in sequence, and denote the selected target rectangle as the execution rectangle;

[0156] Denote any one side of the execution rectangle as the execution side;

[0157] Execute the determination area determination strategy for the execution side. Specifically:

[0158] Make a line segment that coincides with the execution side, and denote it as the coincident line segment;

[0159] Obtain the length of the curing light spot corresponding to the highest curing distance, and denote it as the first length;

[0160] On the plane where the circuit board is located, move the coincident line segment away from the execution rectangle along the direction perpendicular to the execution side, and the maximum distance of movement is the first length;

[0161] During the process of the coincident line segment moving away from the execution rectangle, denote the target rectangle where the side of the target rectangle that has coincided with the coincident line segment is located as the determination rectangle;

[0162] For any one determination rectangle;

[0163] Obtain the side that first coincides with the coincident line segment, and denote it as the determination side;

[0164] Obtain the line segment on the determination side that coincides with the coincident line segment, and denote it as the second coincident line segment;

[0165] Project the second coincident line segment onto the execution side in the direction perpendicular to the execution side, and denote the line segment of the second coincident line segment projected on the execution side as the first coincident line segment;

[0166] Make two parallel line segments, and denote them as the first parallel line segment and the second parallel line segment respectively;

[0167] Connect the two endpoints of the first coincident line segment and the second coincident line segment with the first parallel line segment;

[0168] Connect the two endpoints of the first coincident line segment and the second coincident line segment with the second parallel line segment;

[0169] Denote the rectangular area formed by the first parallel line segment, the second parallel line segment, the first coincident line segment and the second coincident line segment as the determination area.

[0170] In this embodiment, refer to Figure 1 , there is a determination area between the execution rectangle and the determination rectangle. The determination area contains the pins on the execution rectangle and the determination rectangle, and the pins are coated with adhesives.

[0171] By implementing the determination area determination strategy, it is determined whether there are two target rectangles corresponding to the chips to be cured on the circuit board that can be cured simultaneously. Specifically, when the curing distance is set to the maximum curing distance to irradiate the circuit board, the curing light spot is the largest and the area it can cover is the largest. If the parallel sides of two target rectangles can be simultaneously included in the curing light spot, it is determined that these two target rectangles can be cured simultaneously. Since exposing the chip to the curing light will cause the program to be erased. Ultraviolet light will damage the internal charge distribution, causing the stored charges to be released, the data to be cleared, and having a deletion effect. Therefore, during the irradiation process, the chip surface should be avoided from being irradiated. So when selecting the side of the determination rectangle, the side that coincides with the first and overlapping line segments is selected to avoid the curing light from irradiating the chip surface, reduce the potential risks during the curing process, and improve the product qualification rate.

[0172] The implementation of the centralized curing prediction strategy, irradiating two sides of the determination area simultaneously with a curing lamp, includes:

[0173] Measure the length of the first parallel line segment in the determination area, denoted as the second length;

[0174] Denote the curing light spot with a length value equal to the second length as the first test light spot;

[0175] On the circuit board, denote any direction parallel to the first overlapping line segment as the curing direction;

[0176] Use the first test light spot to evenly divide the determination area into multiple rectangles along the curing direction, and denote the divided rectangles as positioning rectangles;

[0177] Obtain the number of positioning rectangles, denoted as the first quantity.

[0178] The implementation of the centralized curing prediction strategy, irradiating two sides of the determination area simultaneously with a curing lamp, includes:

[0179] Obtain the chip corresponding to the first overlapping line segment in the determination area, denoted as the first chip;

[0180] Obtain the chip corresponding to the second overlapping line segment in the determination area, denoted as the second chip;

[0181] Measure the coating thickness of the adhesive at the pins on the first chip, denoted as the first thickness;

[0182] Measure the coating thickness of the adhesive at the pins on the second chip, denoted as the second thickness;

[0183] Obtain the curing distance when the curing lamp irradiates the circuit board to form the first test light spot, denoted as the first test distance;

[0184] According to the thickness-distance-time model, obtain the curing duration when the coating thickness is equal to the first thickness and the curing distance is equal to the first test distance, and record it as the first duration;

[0185] According to the thickness-distance-time model, obtain the curing duration when the coating thickness is equal to the second thickness and the curing distance is equal to the first test distance, and record it as the second duration;

[0186] Compare the magnitude relationship between the first duration and the second duration;

[0187] If the first duration ≥ the second duration;

[0188] The first curing duration is equal to the first duration × the first quantity;

[0189] If the first duration < the second duration;

[0190] The first curing duration is equal to the second duration × the first quantity.

[0191] When implementing the centralized curing strategy, use the curing lamp to irradiate the adhesives on the first overlapping line segment and the second overlapping line segment simultaneously, and try to avoid irradiating the chip surface. Therefore, the length of the curing light spot is equal to the second length. Determine the first test light spot according to the second length, and use the first test light spot to evenly divide the determination area into multiple positioning rectangles along the curing direction. The number of positioning rectangles is the number of times needed to irradiate the determination area. Since the adhesives of two thicknesses are irradiated simultaneously, it is necessary to use the adhesive with the longest curing time as the standard, compare the magnitude relationship between the first duration and the second duration, and use the maximum duration as the duration for single curing. The total duration of centralized curing is the duration of unit curing multiplied by the number of curing times; compared with decentralized curing, centralized curing can reduce the time of secondary curing. If the time of centralized curing is less than that of decentralized curing, then the effect of saving time and effort can be achieved, and the production efficiency can be improved.

[0192] When implementing the decentralized curing prediction strategy, use the curing lamp to irradiate the two side edges of the determination area in sequence, including:

[0193] Obtain the width of the adhesive around the first chip mapped on the circuit board, and record it as the first width;

[0194] Obtain the width of the adhesive around the second chip mapped on the circuit board, and record it as the second width;

[0195] Calculate the second length - the first width - the second width, and record the result as the third width;

[0196] Set the division quantity b for implementing the decentralized curing prediction strategy;

[0197] Divide the third width into division quantity width intervals;

[0198] Select the first width, the first width + width interval... the first width + width interval × b as the third length in sequence, and conduct a curing experiment on the first overlapping line segment. Specifically:

[0199] Record the curing light spot with a length value equal to the third length as the second test light spot;

[0200] Obtain the width value of the second test light spot, and record it as the first division length;

[0201] Divide the first overlapping line segment into units of the first division length to obtain multiple first test line segments;

[0202] Obtain the number of the first test line segments, and record it as the second quantity;

[0203] Obtain the curing distance when the curing lamp irradiates the circuit board to form the second test light spot, and record it as the second test distance;

[0204] According to the thickness-distance-time model, obtain the curing duration when the coating thickness is equal to the first thickness and the curing distance is equal to the second test distance, and record it as the third duration;

[0205] Calculate the third duration × the second quantity, and use the result as the total duration for curing the adhesive on the first overlapping line segment, and record it as the first dispersion duration;

[0206] Obtain the first dispersion duration for each third length, compare all the first dispersion durations, and obtain the minimum first dispersion duration, which is recorded as the first target duration.

[0207] The execution of the dispersion curing prediction strategy, irradiating the two side edges of the determination area with the curing lamp in sequence, includes:

[0208] Select the second width, the second width + width interval... the second width + width interval × b as the fourth length in sequence, and conduct a curing experiment on the second overlapping line segment. Specifically:

[0209] Record the curing light spot with a length value equal to the fourth length as the third test light spot;

[0210] Obtain the width value of the third test light spot, and record it as the second division length;

[0211] Divide the second overlapping line segment into units of the second division length to obtain multiple second test line segments;

[0212] Obtain the number of the second test line segments, and record it as the third quantity;

[0213] Obtain the curing distance when the curing lamp irradiates the circuit board to form the third test light spot, and record it as the third test distance;

[0214] According to the thickness-distance-time model, obtain the curing duration when the coating thickness is equal to the second thickness and the curing distance is equal to the third test distance, and record it as the fourth duration;

[0215] Calculate the fourth duration × the third quantity, and use the result as the total duration of the adhesive on the second overlapping line segment, and record it as the second dispersion duration;

[0216] Obtain the second dispersion duration of each fourth length, compare all the second dispersion durations, and obtain the minimum second dispersion duration, which is recorded as the second target duration;

[0217] Obtain the first target duration and the second target duration, calculate the sum, and use the result as the second curing duration.

[0218] When dispersively curing the circuit board, since the adhesive has a width and curing light should be avoided from irradiating the adhesive on other chips while curing one chip, and there are gaps between the adhesives on adjacent chips, the length of the gaps can be used to adjust the length of the curing light spot. When the curing light spot is larger, the number of curing times is less and the time required for each single curing is longer. When the curing light spot is smaller, the number of curing times is more and the time required for each single curing is shorter. However, the total curing time is the number of curing times multiplied by the time of each single curing. Therefore, among the total durations of curing with multiple curing light spots, select the shortest curing duration, which has the highest efficiency, as the total curing duration of the dispersive curing to obtain the second curing duration; obtain an adjustable-size curing light spot through the test model, and select the curing light spot with the shortest curing time in each tested curing light spot, which reduces the curing time and improves the production efficiency.

[0219] The comparison of the first curing duration and the second curing duration and the selection of the curing strategy corresponding to the minimum curing duration to cure the determination area include:

[0220] When the first curing duration ≤ the second curing duration;

[0221] Obtain the first test light spot corresponding to the first curing duration;

[0222] When the curing lamp irradiates the determination area, adjust the curing light spot of the curing lamp to the first test light spot, and align the first test light spot with each positioning rectangle in turn;

[0223] Among them, when the first duration ≥ the second duration, irradiate each positioning rectangle for the first duration;

[0224] When the first duration < the second duration, irradiate each positioning rectangle for the second duration.

[0225] In this embodiment, refer to Figure 2, align the first test light spot with the positioning rectangles in sequence, and cure for the first duration or the second duration at each positioning rectangle, where the curing duration is based on the maximum of the first duration and the second duration.

[0226] When the first curing duration is less than or equal to the second curing duration, the size of the first test light spot corresponding to the first curing duration is the same as that of the positioning rectangle in the equal division determination area. Aligning the first test light spot with the positioning rectangle can cure the adhesives on both sides in the determination area. Select the curing duration of the adhesive with the thickest thickness in the single curing duration as the single curing duration, ensuring that the adhesives on both sides of the determination area can be cured simultaneously in one curing, which not only reduces the curing time but also avoids passing through the determination area twice, improving production efficiency.

[0227] Comparing the first curing duration and the second curing duration, and selecting the curing strategy corresponding to the minimum curing duration to cure the determination area includes:

[0228] When the first curing duration > the second curing duration;

[0229] When the curing lamp irradiates the pins on the first overlapping line segment of the determination area;

[0230] Obtain the second test light spot corresponding to the second curing duration;

[0231] Obtain all the first test line segments on the first overlapping line segment;

[0232] In this embodiment, refer to Figure 3 , the width of the second test light spot is equal to that of the first test line segment. Align the width of the second test light spot with the first test line segment to obtain 5 rectangles, and irradiate these 5 rectangles with the third test light spot in sequence, and the irradiation duration is equal to the third duration.

[0233] Adjust the curing light spot of the curing lamp to the second test light spot, align the width of the formed second test light spot with each first test line segment in sequence, and irradiate for the third duration at each first test line segment;

[0234] When the curing lamp irradiates the pins on the second overlapping line segment of the determination area;

[0235] Obtain the third test light spot corresponding to the second curing duration;

[0236] Obtain all the second test line segments on the second overlapping line segment;

[0237] Adjust the curing light spot of the curing lamp to the third test light spot, align the width of the formed third test light spot with each second test line segment in sequence, and irradiate for the fourth duration at each second test line segment.

[0238] In this embodiment, refer to Figure 4, the width of the third test light spot is equal to that of the second test line segment. Align the width of the third test light spot with the second test line segment to obtain 6 rectangles, and irradiate these 6 rectangles with the third test light spot in sequence. The duration of each single irradiation is equal to the fourth duration.

[0239] When the first curing duration is greater than or equal to the second curing duration, during dispersed curing, the second test light spot is used to irradiate the adhesive on the first overlapping line segment, and the third test light spot is used to irradiate the adhesive on the second overlapping line segment. And in order to avoid irradiating the chip, the width of the second test light spot should be aligned with the first test line segment, and the width of the third test light spot should be aligned with the second test line segment, and then irradiate for the required curing duration respectively to achieve the purpose of dispersed curing. The effect of dispersed curing is strong adjustability, flexible control and convenient curing.

[0240] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprises", "comprising" or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device.

[0241] The above are only the preferred embodiments of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and refinements can still be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A method for controlling the light of a curing lamp, characterized in that: include: The thickness of the adhesive applied on the circuit board is recorded as the coating thickness; The distance from the adhesive when the curing light is irradiated is recorded as the curing distance, wherein the curing distance is in the interval of [minimum curing distance, maximum curing distance]; the time from the start of curing of the adhesive to the completion of curing is recorded as the curing time; all coating thicknesses are obtained; for each adhesive corresponding to the coating thickness; an adhesive curing time recording experiment is performed to record the curing time when the adhesive is irradiated with the curing light at different curing distances; the curing time of adhesives of all coating thicknesses at different curing distances is obtained to obtain a thickness-distance-time model; the chip where the pins coated with the adhesive on the circuit board are located is recorded as the chip to be cured, and the shape of the chip to be cured is mapped on the circuit board as a rectangle, and the rectangle is recorded as the target rectangle; the coating thickness of the adhesive at all pins on a chip to be cured is the same; the light spot formed on the circuit board when the curing light is irradiated is recorded as the curing light spot, wherein the shape of the curing light spot is a rectangle, and the area of the curing light spot increases with the increase of the curing distance; When the curing lamp irradiates the chip to be cured at the highest curing distance, the judgment area judgment strategy is executed to determine whether the curing spot contains two sides of the target rectangle at the same time and the two sides are parallel to each other; obtain all target rectangles; select each target rectangle in turn, and record the selected target rectangle as the execution rectangle; record any side of the execution rectangle as the execution side; execute the judgment area judgment strategy on the execution side, specifically: make a line segment that coincides with the execution side, and record it as the coincident line segment; obtain the length of the curing light spot corresponding to the highest curing distance, and record it as the first length; move the coincident line segment away from the execution rectangle gradually along the direction perpendicular to the execution side on the plane where the circuit board is located, and the maximum distance away is the first length; in the process of the coincident line segment moving away from the execution rectangle, it will overlap with the coincident line segment. The target rectangle where the side of the target rectangle passing through is located is recorded as the determination rectangle; for any determination rectangle; obtain the side that coincides with the coincident line segment for the first time, and record it as the determination side; obtain the line segment on the determination side that coincides with the coincident line segment, and record it as the second coincident line segment; project the second coincident line segment onto the execution side in a direction perpendicular to the execution side, and record the line segment where the second coincident line segment is projected on the execution side as the first coincident line segment; draw two parallel line segments, respectively recorded as the first parallel line segment and the second parallel line segment; connect the two endpoints of the first coincident line segment and the second coincident line segment with the first parallel line segment; connect the two endpoints of the first coincident line segment and the second coincident line segment with the second parallel line segment; record the rectangular area formed by the first parallel line segment, the second parallel line segment, the first coincident line segment and the second coincident line segment as the determination area; If the sides of two target rectangles are included at the same time, the area between the two target rectangles is recorded as the determination area, and the shape of the determination area is a rectangle; Get all the judgment areas on the circuit board; For any judgment area; Execute a centralized curing prediction strategy, use a curing light to illuminate the two sides of the judgment area at the same time, record the time it takes for the adhesive on the two sides to be cured, and record it as the first curing time; measure the length of the first parallel line segment in the judgment area, and record it as the second length; record the curing light spot with a length equal to the second length as the first test light spot; record any direction parallel to the first coincident line segment on the circuit board as the curing direction; use the first test light spot to divide the judgment area into multiple rectangles along the curing direction, and record the divided rectangles as positioning rectangles; obtain the number of positioning rectangles, and record it as the first number; obtain the chip corresponding to the first coincident line segment in the judgment area, and record it as the first chip; obtain the chip corresponding to the second coincident line segment in the judgment area, and record it as the second chip; measure the number of the first chip on the first chip The coating thickness of the adhesive at the pin is recorded as the first thickness; the coating thickness of the adhesive at the pin on the second chip is measured and recorded as the second thickness; the curing distance of the first test light spot formed by the curing lamp irradiating the circuit board is obtained and recorded as the first test distance; according to the thickness distance time model, the curing time when the coating thickness is equal to the first thickness and the curing distance is equal to the first test distance is obtained and recorded as the first time; according to the thickness distance time model, the curing time when the coating thickness is equal to the second thickness and the curing distance is equal to the first test distance is obtained and recorded as the second time; the relationship between the first time and the second time is compared; if the first time ≧ the second time; the first curing time is equal to the first time × the first quantity; if the first time < the second time; the first curing time is equal to the second time × the first quantity; Execute the dispersed curing prediction strategy, use the curing light to illuminate the two sides of the judgment area in turn, record the total time for the adhesive curing on the two sides, and record it as the second curing time; specifically, obtain the width of the adhesive surrounding the first chip mapped on the circuit board, and record it as the first width; obtain the width of the adhesive surrounding the second chip mapped on the circuit board, and record it as the second width; calculate the second length - the first width - the second width, and record the result as the third width; set the number of divisions b for executing the dispersed curing prediction strategy; divide the third width into the number of width intervals; select the first width, the first width + the width interval... the first width + the width interval × b in turn The first coincident line segment is a third length, and a curing experiment is performed on the first coincident line segment, specifically: the curing spot with a length equal to the third length is recorded as the second test spot; the width of the second test spot is obtained and recorded as the first division length; the first coincident line segment is divided into a plurality of first test line segments by the first division length; the number of the first test line segments is obtained and recorded as the second number; the curing distance of the circuit board formed by the curing light irradiating the circuit board is obtained and recorded as the second test distance; according to the thickness distance time model, the curing time when the coating thickness is equal to the first thickness and the curing distance is equal to the second test distance is obtained and recorded as the third time; the third time is calculated multiplied by the second number, and the result is expressed as The total time for curing the adhesive on the first coincident line segment is recorded as the first dispersion time; the first dispersion time of each third length is obtained, all the first dispersion time lengths are compared, and the minimum first dispersion time length is obtained, which is recorded as the first target time length; the second width, the second width + width interval... the second width + width interval × b are selected in sequence as the fourth length, and a curing experiment is performed on the second coincident line segment, specifically: the curing spot with a length equal to the fourth length is recorded as the third test spot; the width of the third test spot is obtained and recorded as the second division length; the second coincident line segment is divided into multiple second test line segments by the second division length; the second test line segment is obtained. The number of line segments is recorded as the third number; the curing distance of the third test light spot formed by the curing lamp on the circuit board is obtained, which is recorded as the third test distance; based on the thickness-distance-time model, the curing time when the coating thickness is equal to the second thickness and the curing distance is equal to the third test distance is obtained, which is recorded as the fourth time; the fourth time is calculated multiplied by the third number, and the result is used as the total time for curing the adhesive on the second coincident line segment, which is recorded as the second dispersion time; the second dispersion time of each fourth length is obtained, all the second dispersion time are compared, and the minimum second dispersion time is obtained, which is recorded as the second target time; the first target time and the second target time are obtained, and the sum is calculated and used as the second curing time; The first curing time is compared with the second curing time, a curing strategy corresponding to the minimum curing time is selected, and the determined area is cured.

2. The method for controlling the light of a curing lamp according to claim 1, wherein: The adhesive curing time recording experiment is performed to record the curing time of the adhesive when the curing lamp is used to irradiate the adhesive at different curing distances, including: Obtaining a minimum curing distance, where the minimum curing distance is the minimum curing distance when curing the adhesive; Obtaining a maximum curing distance, where the maximum curing distance is the maximum curing distance when curing the adhesive; Setting a test distance interval, wherein the test distance interval is an increase in the curing distance; Calculate (highest curing distance - lowest curing distance) / test distance interval + 1, and record the result as the test quantity a; Calculate the minimum curing distance + test distance interval, and record the result as the first curing distance; Calculate the lowest curing distance + test distance interval × 2, and record the result as the second curing distance... Calculate the lowest curing distance + test distance interval × (a-1), and record the result as the highest curing distance; Set the curing lamp to cure the adhesive at the lowest curing distance, the first curing distance, and the highest curing distance in sequence, and record the curing time of the adhesive at each curing distance.

3. The method for controlling the light of a curing lamp according to claim 1, wherein: The comparing the first curing time with the second curing time, selecting a curing strategy corresponding to the minimum curing time, and curing the determined area includes: When the first curing time is less than or equal to the second curing time; Obtaining a first test light spot corresponding to a first curing time; When the curing light illuminates the determination area, adjust the curing light spot of the curing light to the first test light spot, and align the first test light spot with each positioning rectangle in turn; When the first duration is greater than or equal to the second duration, the first duration is illuminated in each positioning rectangle; When the first duration is less than the second duration, each positioning rectangle is illuminated for the second duration.

4. The method for controlling the light of a curing lamp according to claim 3, wherein: The comparing the first curing time with the second curing time, selecting a curing strategy corresponding to the minimum curing time, and curing the determined area includes: When the first curing time is greater than the second curing time; When the curing light illuminates the pins on the first coincident line segment of the determination area; Obtaining a second test light spot corresponding to a second curing time; Obtain all first test line segments on the first coincident line segment; Adjusting the curing light spot of the curing lamp to a second test light spot, aligning the width of the formed second test light spot with each first test line segment in turn, and irradiating each first test line segment for a third time; When the curing light illuminates the pins on the second coincident line segment of the determination area; Obtaining a third test light spot corresponding to the second curing time; Obtain all second test line segments on the second coincident line segment; The curing light spot of the curing lamp is adjusted to a third test light spot, the width of the formed third test light spot is aligned with each second test line segment in sequence, and each second test line segment is irradiated for a fourth time period.

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