Ceramic laser cutting machine

Abstract

The invention belongs to the field of laser cutting, and particularly relates to a ceramic laser cutting machine which solves the problem that in the prior art, dust cannot be collected in time, chippings generated by cutting cannot be cleaned in time, and consequently a recast layer is too thick, the ceramic laser cutting machine comprises a working table top and a ceramic chip element, and a laser machining structure is installed on the other side of the top end of the working table top. The laser machining structure comprises a positioning preheating assembly and a laser cutting assembly, the laser cutting assembly is installed at the output end of a first telescopic rod, the first telescopic rod drives an upper die plate to ascend and descend through transmission, a lower die plate is arranged at the bottom end of the upper die plate, and the lower die plate and the upper die plate are spliced to form a closed machining space. One side of the upper mold plate is connected with a nitrogen conveying pipe, and the nitrogen conveying pipe conveys nitrogen; dust can be collected in time through the gas flow guide opening, dust in air can be extracted through the structure, slag generated by high-temperature gasification after a ceramic chip is cut by laser can be collected in time, and the thickness of a recast layer is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of laser cutting, in particular to a ceramic laser cutting machine. Background Art

[0002] Laser processing of ceramic materials is mainly used in the chip microelectronics industry. Ceramic materials have good high-frequency performance, electrical properties, high thermal conductivity, chemical stability and thermal stability, and can be used to produce large-scale integrated circuits and power electronic modules. When processing ceramic substrates, laser cutting and mechanical cutting can be used. Mechanical cutting uses physical tool movement to cut and saw the material, with low precision, many burrs and cracks, and high thermal impact. Laser cutting is non-contact and fast. It mainly uses the high temperature of a high-energy-density laser beam to instantly melt or vaporize the ceramic to achieve cutting. The incision is narrow and smooth, which is suitable for cutting tiny electronic components and complex shapes. The existing Chinese patent application with publication number CN114147373B discloses a ceramic sheet laser cutting device, comprising a feeding device, a conveying device, a laser cutting device and a visual recognition device arranged at the feeding device and the laser cutting device. The feeding device and the laser cutting device are arranged at two opposite sides of the conveying device, the conveying device comprises two linear modules and two carriers, the carriers move back and forth between the feeding device and the laser cutting device under the drive of the linear modules, and have a placement box for fixing ceramic sheets, the openable and closable box cover of the placement box is provided with a transmission glass, the feeding device alternately places and takes and delivers the ceramic sheets in the two placement boxes, and adjusts the placement position of the ceramic sheets through the visual recognition device, the laser cutting device moves back and forth between the two linear modules, so that its laser beam, in cooperation with the visual recognition device arranged coaxially therewith, vertically passes through the transmission glass to cut the ceramic sheets in the placement box, and during cutting, the carriers also blow and remove dust from the ceramic sheets from the upper and lower opposite sides; However, the ceramic sheet laser cutting equipment has the following defects when used: Failure to collect dust and clean the debris generated by cutting in time is not only the dust in the air, but also the laser cutting of ceramic chips will produce debris. The debris is mainly due to the slag formed by high-temperature gasification during the laser cutting process. The traditional cleaning method is to centrally deal with the slag after processing. The slag separated from the main body is very convenient to deal with by sweeping and vacuuming, but the slag around the cutting point is not dealt with in time. After cutting, due to the high temperature of the laser, it will be re-fused with the ceramic main body to increase the thickness of the recast layer. The recast layer is difficult to deal with. It is a layer of material formed by the surface of the material melting due to high temperature and then rapidly solidifying. It will affect the performance and use effect of the material. Therefore, measures need to be taken during cutting to reduce the generation of the recast layer. Direct cutting will damage the ceramic chip or even directly break it. Summary of the invention

[0003] The technical problem solved by the invention is that it is impossible to collect dust and clean the debris generated by cutting in time, and a ceramic laser cutting machine is provided.

[0004] In order to solve the above technical problems, the present invention provides a ceramic laser cutting machine, comprising a work table and a ceramic chip element, a discharging assembly is installed on one side of the top of the work table, the discharging assembly adjusts the angle and position of the ceramic chip element, and an automatic material transport structure is installed on one side of the discharging assembly, the automatic material transport structure clamps the ceramic chip element, and the ceramic chip element is placed on the top of the supporting assembly, a laser processing structure is installed on the other side of the top of the work table, and the laser processing structure includes a first telescopic rod and a second telescopic rod installed on one side of the work table; A positioning preheating component is installed at the output end of the second telescopic rod, and the second telescopic rod drives the heating mold to rise and fall through transmission, and the heating mold preheats the ceramic chip element through heating; A laser cutting assembly is installed at the output end of a first telescopic rod, and the first telescopic rod drives the upper template to rise and fall through transmission, a lower template is provided at the bottom end of the upper template, and the lower template and the upper template are assembled to form a closed processing space, a nitrogen delivery pipe is connected to one side of the upper template, and the nitrogen delivery pipe delivers nitrogen.

[0005] Preferably, the supporting assembly includes a chip base, and a first support leg is provided on one side of the chip base, a second support leg is provided on the other side of the chip base, and a ceramic chip element is provided on the top of the chip base.

[0006] Preferably, the laser processing structure further comprises a supporting frame, and a first telescopic rod is installed on one side of the top of the supporting frame, and a second telescopic rod is installed on the other side of the top of the supporting frame. The bottom of the support frame is provided with an automatic moving slide rail, and the top of the automatic moving slide rail is provided with a lower template, and the top of the lower template is provided with a supporting component. The lower template has a lower mesh cover inside, the upper template has an upper mesh cover inside, and both the upper mesh cover and the lower mesh cover are in a semicircular mesh plate shape. A gas guide port is installed at the top of the upper net cover, and an input end of the gas guide port is connected to a nitrogen delivery pipe.

[0007] Preferably, lower positioning slots are inlaid on the four edges of the lower template, upper positioning slots are inlaid on the four edges of the upper template, and the upper positioning slots are aligned with the lower positioning slots. Among them, a connecting top plate is installed at the top of the upper template, and a working module is installed on one side of the connection between the connecting top plate and the upper template, and a sliding rod is installed on one side of the working module, and an elastic element is installed on the other side of the connection between the connecting top plate and the upper template.

[0008] Preferably, a laser power line is connected to one side of the upper template, and an output end of the laser power line is connected to a laser cutting port, and the laser cutting port uses laser to cut ceramics.

[0009] Preferably, the output end of the second telescopic rod is connected to a connecting base, and the bottom end of the connecting base is connected to a positioning connecting plate, grooves are provided on the four edges of the positioning connecting plate, and the bottom end of the positioning connecting plate is connected to the heating mold. Wherein, first connecting rods are installed on both sides of the bottom end of the connecting base, and the bottom end of the first connecting rod is hinged with a second connecting rod, and the second connecting rod is embedded in the grooves provided on the edges of the four sides of the positioning connecting plate.

[0010] Preferably, the heating mold is concave in the middle and has a comb-tooth shape on both sides, and the shape of the heating mold and the shape of the top of the ceramic chip element are matched and stuck to each other, and the heating mold controls the temperature.

[0011] Preferably, the discharging assembly includes a connecting base plate installed on the top of one side of the work surface, and a third motor is provided at the top of the connecting base plate, a transmission rod is installed at the output end of the third motor, and a shovel is installed on one side of the transmission rod, and the shovel has a shovel-shaped appearance.

[0012] Preferably, a support base is installed on the top of the work surface, and a connecting bracket is installed on one side of the support base, one side of the connecting bracket is hinged with a T-shaped connector, and one side of the T-shaped connector is connected to a support plate, and the top of the support plate is inlaid with a groove that matches the width of the shovel.

[0013] Preferably, the automatic material transport structure comprises a first motor, and the output end of the first motor is connected to a transmission screw, the bottom end of the transmission screw penetrates a moving slider, and the transmission screw and the moving slider are threadedly transmitted, and the other side of the moving slider is provided with a limit slider that slides in the groove of the back plate. Among them, a moving bracket is installed on one side of the moving slider, and a second motor is installed on one side of the moving bracket, the output end of the second motor is connected to the first gear, and a second gear is provided on one side of the first gear, the first gear and the second gear are meshingly transmitted, one side of the first gear is connected to the first clamping plate, and one side of the second gear is connected to the second clamping plate.

[0014] The present invention also discloses a ceramic laser cutting machine, which adopts the ceramic laser cutting machine and comprises the following steps: Compared with the related art, the present invention has the following beneficial effects: 1. The gas flow port can collect dust in time. This structure can not only extract dust in the air, but also collect slag produced by high-temperature gasification after laser cutting of ceramic chips in time. Compared with the traditional method of centralized treatment of slag after processing, this mechanism can prevent the slag produced by high-temperature gasification after laser cutting from adhering to the ceramic chip to increase the thickness of the recast layer. The recast layer is mainly a layer of material formed by the rapid solidification of the material surface after high-temperature melting, which will affect the performance and use effect of the material. Therefore, measures need to be taken during cutting to reduce the generation of the recast layer. In addition, nitrogen is extracted and injected into the cavity through two sets of nitrogen delivery pipes, so that nitrogen can continue to flow after entering the cavity, thereby realizing gas convection. In addition, the high-speed airflow can also cool the ceramic chip components during laser cutting, further reducing the thickness of the recast layer. Due to the chemical inertness of nitrogen, it can inhibit excessive combustion in the cutting area during laser cutting, reduce oxidation reactions during cutting, and avoid yellowing of the cutting side end face. At the same time, it can help remove slag in the slit, improve cutting quality, and reduce the size of the heat-affected zone.

[0015] 2. The temperature control capability of the heating mold can be used to preheat the ceramic chip components before laser cutting, and the ceramic chip components can be cooled in time after laser cutting to reduce the thermal stress caused by temperature changes, thereby reducing the generation of cracks; and temperature control can further reduce the generation of recast layers. In addition, the design of the heating mold fitting the shape of the ceramic chip components can evenly heat the concave and convex positions of the ceramic chip components, and at the same time correct the position of the ceramic chip components at the top of the supporting component to avoid the ceramic chip components from deviating from their position during laser cutting; in addition, appropriate additives such as ceramic powder or rare earth elements can be added to the ceramic material to further improve the thermal expansion coefficient and crack resistance of the material, and the ceramic substrate can be pretreated in advance and an absorbent can be applied to further improve the material's absorption rate of the laser, thereby improving cutting efficiency and quality.

[0016] 3. The second clamping plate and the first clamping plate are driven by meshing transmission to clamp the ceramic chip component. The tightening force can be adjusted through cooperation. When grabbing and moving the ceramic chip component up, down, left, and right, the force can be adjusted appropriately. The first clamping plate and the second clamping plate are provided with embedded grooves on the side close to the ceramic chip component to facilitate more stable fixing of the ceramic chip component during operation, while avoiding excessive tightening that may cause the ceramic chip component to be distorted and excessive local force.

[0017] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of the first three-dimensional appearance structure of the present invention; Figure 2 It is a schematic diagram of the first three-dimensional appearance structure of the present invention; Figure 3 For the present invention Figure 2 The enlarged structural diagram at A in the middle; Figure 4 It is a three-dimensional schematic diagram of the automatic material transport structure of the present invention; Figure 5 It is a schematic diagram of the structure of the first clamping plate and the second clamping plate of the present invention; Figure 6 It is a schematic diagram of the structure of the first gear and the second gear of the present invention; Figure 7 It is a front view schematic diagram of the appearance structure of the present invention; Figure 8 It is a first three-dimensional appearance schematic diagram of the laser cutting assembly of the present invention; Fig. 9 A second three-dimensional schematic diagram of the appearance of the laser cutting assembly of the present invention; Fig.10 is a schematic diagram of the three-dimensional appearance of the supporting assembly of the present invention; Fig.11 This is a schematic diagram of the three-dimensional appearance of the positioning and preheating assembly of the present invention; Fig.12 This is a schematic diagram of the three-dimensional appearance of the heating mold of the present invention; Fig.13 It is a three-dimensional appearance schematic diagram of the ceramic chip component of the present invention.

[0020] Numbers in the figure: 1. Work surface; 2. Automatic material transport structure; 201. First motor; 202. Drive screw; 203. Moving slider; 204. Moving bracket; 205. Second motor; 206. First gear; 207. Second gear; 208. First clamping plate; 209. Second clamping plate; 3. Discharging assembly; 301. Third motor; 302. Drive rod; 303. Connecting bottom plate; 304. Shovel; 305. Support base; 306. Connecting bracket; 307. T-shaped connector; 308. Support plate; 4. Laser processing structure; 401. Support frame; 402. First telescopic rod; 403. Second telescopic rod; 404. Automatic moving slide rail; 5. Positioning and preheating assembly ;501, connecting base; 502, positioning connecting plate; 503, first connecting rod; 504, second connecting rod; 505, heating mold; 6, laser cutting assembly; 601, connecting top plate; 602, upper template; 603, sliding rod; 604, elastic element; 605, working module; 606, nitrogen delivery pipe; 607, laser power line; 608, lower template; 609, lower mesh cover; 610, upper mesh cover; 611, gas flow guide port; 612, laser cutting port; 613, upper positioning slot; 614, lower positioning slot; 7, ceramic chip component; 8, supporting assembly; 801, chip base; 802, first support leg bracket; 803, second support leg bracket. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] See also Figure 1-Figure 13 The ceramic laser cutting machine comprises a work surface 1 and a ceramic chip component 7. A discharging assembly 3 is installed on one side of the top of the work surface 1. The discharging assembly 3 adjusts the angle and position of the ceramic chip component 7. The discharging assembly 3 includes a connecting base plate 303 installed at the top of one side of the work surface 1, and a third motor 301 is provided at the top of the connecting base plate 303, a transmission rod 302 is installed at the output end of the third motor 301, and a shovel 304 is installed at one side of the transmission rod 302, and the shovel 304 is in a shovel shape; A support base 305 is installed at the top of the work surface 1, and a connecting bracket 306 is installed on one side of the support base 305. A T-shaped connecting piece 307 is hinged on one side of the connecting bracket 306. The T-shaped connecting piece 307 turns around the connection of the connecting bracket 306, thereby driving the support plate 308 to turn at the top of the support base 305, so as to adjust the angle of the work surface, so as to facilitate the inspection of whether the appearance of the ceramic chip meets the standard after processing; A support plate 308 is connected to one side of the T-shaped connector 307. A groove matching the width of the shovel 304 is inlaid on the top of the support plate 308. The third motor 301 is started to drive the shovel 304 on one side of the transmission rod 302 to extend toward the support plate 308, and the supporting assembly 8 is lowered, so that the supporting assembly 8 can move in the groove at the top of the support plate 308. The width of the shovel 304 and the width of the groove at the top of the support plate 308 match each other. When the transmission rod 302 is extended, the supporting assembly 8 can be scooped up and lowered; An automatic material transport structure 2 is installed on one side of the discharge assembly 3. The automatic material transport structure 2 includes a first motor 201, and a transmission screw 202 is connected to the output end of the first motor 201. Then, the transmission screw 202 is driven to rotate by starting the first motor 201. A moving slider 203 is penetrated at the bottom end of the transmission screw 202. The transmission screw 202 and the moving slider 203 are threadedly transmitted. The transmission screw 202 drives the moving slider 203 to move up and down, thereby driving the ceramic chip component 7 to rise and fall. A limit slider is provided on the other side of the moving slider 203 to slide in the groove of the back plate. Among them, a moving bracket 204 is installed on one side of the moving slider 203, and a second motor 205 is installed on one side of the moving bracket 204, the output end of the second motor 205 is connected to the first gear 206, and a second gear 207 is provided on one side of the first gear 206, the first gear 206 and the second gear 207 are meshingly transmitted, a first clamping plate 208 is connected to one side of the first gear 206, and a second clamping plate 209 is connected to one side of the second gear 207; the second clamping plate 209 and the first clamping plate 208 are driven to clamp the ceramic chip component 7 through meshing transmission, and the tightening force can be adjusted through cooperation. When grabbing and moving the ceramic chip component 7 up, down, left, and right, the force can be appropriately adjusted, and the first clamping plate 208 and the second clamping plate 209 are provided with an embedded groove on one side close to the ceramic chip component 7, so as to fix the ceramic chip component 7 more stably during operation, and avoid excessive tightening causing the ceramic chip component 7 to be distorted and subjected to excessive local force; The automatic material transport structure 2 clamps the ceramic chip component 7, and the ceramic chip component 7 is placed on the top of the supporting component 8. The supporting assembly 8 includes a chip base 801. First, the ceramic chip component 7 is placed on the top of the chip base 801. A first support bracket 802 is provided on one side of the chip base 801, and a second support bracket 803 is provided on the other side of the chip base 801. The ceramic chip component 7 is provided on the top of the chip base 801. The support brackets on both sides of the ceramic chip component 7 are fixed by the first support bracket 802 and the second support bracket 803. A laser processing structure 4 is installed on the other side of the top of the work surface 1, and the laser processing structure 4 includes a first telescopic rod 402 and a second telescopic rod 403 installed on one side of the work surface 1; The positioning preheating component 5 is installed at the output end of the second telescopic rod 403, and the second telescopic rod 403 drives the heating mold 505 to rise and fall through transmission, and the heating mold 505 preheats the ceramic chip component 7 by heating; the shape of the heating mold 505 fits the shape of the ceramic chip component 7, and the heating mold 505 is heated to preheat the ceramic chip component 7; The output end of the second telescopic rod 403 is connected to a connecting base 501, and the bottom end of the connecting base 501 is connected to a positioning connecting plate 502. The positioning connecting plate 502 has grooves on its four edges, and the bottom end of the positioning connecting plate 502 is connected to a heating mold 505. Among them, the first connecting rods 503 are installed on both sides of the bottom end of the connecting base 501, and then the supporting assembly 8 is placed on the top of the lower template 608, and then the second telescopic rod 403 is started to drive the first connecting rod 503 to press down, and the bottom end of the first connecting rod 503 is hinged with the second connecting rod 504, and the second connecting rod 504 is embedded in the grooves provided at the edges of the positioning connecting plate 502; the positioning connecting plate 502 is pressed down, so that the heating mold 505 and the ceramic chip component 7 are in contact; the left and right of the first connecting rod 503 and the second connecting rod 504 are auxiliary to stabilize the positioning connecting plate 502 so that the force exerted by the heating mold 505 on the ceramic chip component 7 is more uniform; The heating mold 505 is concave in the middle and has a comb-shaped shape on both sides. The shape of the heating mold 505 and the shape of the top of the ceramic chip element 7 are matched and stuck to each other, and the heating mold 505 controls the temperature. The temperature control capability of the heating mold 505 is used to preheat the ceramic chip element 7 in advance by contacting the ceramic chip element 7 before laser cutting, and the ceramic chip element 7 is cooled in time after laser cutting, so as to reduce the thermal stress caused by temperature change, thereby reducing the generation of cracks; and the temperature control can further reduce the generation of the recast layer. In addition, the design of the heating mold 505 that fits the shape of the ceramic chip element 7 can evenly heat the concave and convex positions of the ceramic chip element 7, and at the same time correct the position of the ceramic chip element 7 at the top of the supporting component 8, so as to avoid the ceramic chip element 7 from deviating from the position during the laser cutting process; in addition, appropriate additives such as ceramic powder or rare earth elements can be added to the ceramic material, which can also further improve the thermal expansion coefficient and crack resistance of the material, and the ceramic substrate can be pretreated in advance and an absorbent can be applied to further improve the material's absorption rate of the laser, thereby improving the cutting efficiency and quality; The laser cutting assembly 6 is installed at the output end of the first telescopic rod 402, and the first telescopic rod 402 drives the upper template 602 to rise and fall through the transmission. The bottom end of the upper template 602 is provided with a lower template 608, and the lower template 608 and the upper template 602 are assembled to form a closed processing space. One side of the upper template 602 is connected to a nitrogen delivery pipe 606, and the nitrogen delivery pipe 606 delivers nitrogen; The laser processing structure 4 also includes a support frame 401, and a first telescopic rod 402 is installed on one side of the top of the support frame 401, and a second telescopic rod 403 is installed on the other side of the top of the support frame 401. The bottom of the supporting frame 401 is provided with an automatic moving slide rail 404, and the top of the automatic moving slide rail 404 is provided with a lower template 608, and the top of the lower template 608 is provided with a supporting component 8. The lower template 608 is provided with a lower mesh cover 609 inside, and the upper template 602 is provided with an upper mesh cover 610 inside, and both the upper mesh cover 610 and the lower mesh cover 609 are in a semicircular mesh plate shape. The function of the upper mesh cover 610 and the lower mesh cover 609 is to place the ceramic chip component 7 without hindering the flow of nitrogen inside the space. The function of the laser cutting port 612 is to cut the ceramic chip component 7 by manufacturing the laser. A gas guide port 611 is installed on the top of the net cover 610, and dust can be collected in time through the gas guide port 611. This structure can not only extract dust in the air, but also can collect slag produced by high-temperature gasification after the ceramic chip is laser cut in time. Compared with the traditional method of centrally processing the slag after processing, this mechanism can prevent the slag produced by high-temperature gasification after laser cutting from adhering to the ceramic chip and increasing the thickness of the recast layer. The recast layer is mainly a layer of material formed on the surface of the material due to high-temperature melting and rapid solidification, which will affect the performance and use effect of the material. Therefore, measures need to be taken during cutting to reduce the generation of the recast layer, and the gas The input end of the body flow guide port 611 is connected to the nitrogen delivery pipe 606; nitrogen is drawn and injected into the cavity through two groups of nitrogen delivery pipes 606, so that the nitrogen can continue to flow after entering the cavity, thereby realizing gas convection. In addition, the high-speed airflow can also cool the ceramic chip element 7 during laser cutting, further reducing the thickness of the recast layer. Due to the chemical inertness of nitrogen, it can inhibit excessive combustion in the cutting area during the laser cutting process, reduce the oxidation reaction during the cutting process, avoid yellowing of the cutting side end face, and help remove the slag in the cutting seam, improve the cutting quality, and reduce the size of the heat-affected zone. The lower template 608 is inlaid with lower positioning slots 614 at the four edges, and the upper template 602 is inlaid with upper positioning slots 613 at the four edges, and the upper positioning slots 613 and the lower positioning slots 614 are aligned. After the ceramic chip component 7 is heated, the automatic moving slide rail 404 at the bottom of the lower template 608 is started to drive the ceramic chip component 7 to the bottom of the upper template 602, and the first telescopic rod 402 is started to drive the connecting top plate 601 to press down. At this time, the lower positioning slots 614 and the upper positioning slots 613 are aligned, so that the upper template 602 and the lower template 608 are spliced ​​to form a closed processing space; Among them, a connecting top plate 601 is installed at the top of the upper template 602, and a working module 605 is installed on one side of the connection between the connecting top plate 601 and the upper template 602, and a sliding rod 603 is installed on one side of the working module 605, and an elastic element 604 is installed on the other side of the connection between the connecting top plate 601 and the upper template 602; One side of the upper template 602 is connected to a laser power line 607 , and the output end of the laser power line 607 is connected to a laser cutting port 612 , and the laser cutting port 612 uses laser to cut ceramics.

[0023] Working principle: first, place the ceramic chip component 7 on the top of the chip base 801, fix the automatic material transport structure 2 of the legs on both sides of the ceramic chip component 7 through the first leg bracket 802 and the second leg bracket 803, then place the supporting assembly 8 on the top of the lower template 608, and then start the second telescopic rod 403 to drive the first connecting rod 503 to press down, and the positioning connecting plate 502 to press down, so that the heating mold 505 and the ceramic chip component 7 are in contact, and the shape of the heating mold 505 and the shape of the ceramic chip component 7 are in fit, and the heating mold 505 is heated to preheat the ceramic chip component 7. The left and right of the first connecting rod 503 and the second connecting rod 504 are to assist in stabilizing the positioning connecting plate 502 so that the force exerted by the heating mold 505 on the ceramic chip component 7 is more uniform. After the ceramic chip element 7 is heated, the automatic moving slide rail 404 at the bottom of the lower template 608 is started to drive the ceramic chip element 7 to the bottom of the upper template 602, and the first telescopic rod 402 is started to drive the connecting top plate 601 to be pressed down. At this time, the lower positioning slot 614 and the upper positioning slot 613 are aligned, so that the upper template 602 and the lower template 608 are assembled to form a closed processing space, and nitrogen is transported and output through the nitrogen delivery pipe 606, and nitrogen is injected into the space through the gas guide port 611, so that nitrogen flows in the closed space. The role of the upper mesh cover 610 and the lower mesh cover 609 is to not hinder the flow of nitrogen inside the space under the premise that the ceramic chip element 7 can be placed, and the role of the laser cutting port 612 is to cut the ceramic chip element 7 by manufacturing laser; Then, the first motor 201 is started to drive the transmission screw 202 to rotate, and the transmission screw 202 drives the movable slider 203 to move up and down, thereby driving the ceramic chip component 7 to move up and down. The second motor 205 is started to drive the first clamping plate 208 and the second clamping plate 209 to flip and clamp the ceramic chip component 7 in opposite directions through the meshing transmission of the first gear 206 and the second gear 207. Finally, start the third motor 301 to drive the shovel 304 on one side of the transmission rod 302 to extend toward the support plate 308, and put down the supporting assembly 8, so that the supporting assembly 8 can move in the groove at the top of the support plate 308. The width of the shovel 304 and the width of the groove at the top of the support plate 308 match each other. When the transmission rod 302 is extended, the supporting assembly 8 can be scooped up and put down. The T-shaped connecting piece 307 flips around the connection at the connecting bracket 306, thereby driving the support plate 308 to flip at the top of the support base 305, thereby adjusting the angle of the work surface, which is convenient for detecting whether the appearance of the ceramic chip meets the standard after processing.

[0024] The above are only embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A ceramic laser cutting machine, comprising a work surface (1) and a ceramic chip element (7), characterized in that: A discharge assembly (3) is installed on one side of the top of the work surface (1), the discharge assembly (3) adjusts the angle and position of the ceramic chip component (7), and an automatic material transport structure (2) is installed on one side of the discharge assembly (3), the automatic material transport structure (2) clamps the ceramic chip component (7), and the ceramic chip component (7) is placed on the top of the supporting assembly (8), and a laser processing structure (4) is installed on the other side of the top of the work surface (1), and the laser processing structure (4) includes a first telescopic rod (402) and a second telescopic rod (403) installed on one side of the work surface (1); A positioning preheating component (5), wherein the positioning preheating component (5) is installed at the output end of the second telescopic rod (403), and the second telescopic rod (403) drives the heating mold (505) to move up and down through transmission, and the heating mold (505) preheats the ceramic chip element (7) through heating; A laser cutting assembly (6) is installed at the output end of a first telescopic rod (402), and the first telescopic rod (402) drives an upper template (602) to rise and fall through transmission, a lower template (608) is provided at the bottom end of the upper template (602), and the lower template (608) and the upper template (602) are assembled to form a closed processing space, and a nitrogen delivery pipe (606) is connected to one side of the upper template (602), and the nitrogen delivery pipe (606) delivers nitrogen.

2. The ceramic laser cutting machine according to claim 1, characterized in that: The supporting assembly (8) comprises a chip base (801), wherein a first support leg bracket (802) is provided on one side of the chip base (801), a second support leg bracket (803) is provided on the other side of the chip base (801), and a ceramic chip element (7) is provided on the top of the chip base (801).

3. The ceramic laser cutting machine according to claim 1, characterized in that: The laser processing structure (4) further comprises a supporting frame (401), wherein a first telescopic rod (402) is mounted on one side of the top end of the supporting frame (401), and a second telescopic rod (403) is mounted on the other side of the top end of the supporting frame (401). The bottom end of the support frame (401) is equipped with an automatic moving slide rail (404), and the top end of the automatic moving slide rail (404) is provided with a lower template (608), and the top end of the lower template (608) is equipped with a supporting component (8). The lower template (608) is provided with a lower mesh cover (609) inside, and the upper template (602) is provided with an upper mesh cover (610) inside, and both the upper mesh cover (610) and the lower mesh cover (609) are in the shape of a semicircular mesh plate. A gas guide port (611) is installed at the top of the upper net cover (610), and an input end of the gas guide port (611) is connected to a nitrogen delivery pipe (606).

4. The ceramic laser cutting machine according to claim 3, characterized in that: The lower template (608) is inlaid with lower positioning slots (614) at the four edges of the lower template (608), and the upper positioning slots (613) are inlaid with upper positioning slots (613) at the four edges of the upper template (602), and the upper positioning slots (613) and the lower positioning slots (614) are aligned. A connecting top plate (601) is installed at the top of the upper template (602), a working module (605) is installed on one side of the connection between the connecting top plate (601) and the upper template (602), a sliding rod (603) is installed on one side of the working module (605), and an elastic element (604) is installed on the other side of the connection between the connecting top plate (601) and the upper template (602).

5. The ceramic laser cutting machine according to claim 4, characterized in that: One side of the upper template (602) is connected to a laser power line (607), and the output end of the laser power line (607) is connected to a laser cutting port (612), and the laser cutting port (612) uses laser to cut ceramics.

6. The ceramic laser cutting machine according to claim 1, characterized in that: The output end of the second telescopic rod (403) is connected to a connecting base (501), and the bottom end of the connecting base (501) is connected to a positioning connecting plate (502), the positioning connecting plate (502) is provided with grooves at the edges of the four sides, and the bottom end of the positioning connecting plate (502) is connected to a heating mold (505). Wherein, first connecting rods (503) are installed on both sides of the bottom end of the connecting base (501), and the bottom end of the first connecting rod (503) is hinged with a second connecting rod (504), and the second connecting rod (504) is embedded in the grooves provided on the four edges of the positioning connecting plate (502).

7. The ceramic laser cutting machine according to claim 6, characterized in that: The heating mold (505) is concave in the middle and has a comb-tooth shape on both sides, and the shape of the heating mold (505) and the shape of the top of the ceramic chip element (7) are matched and stuck to each other, and the heating mold (505) controls the temperature.

8. The ceramic laser cutting machine according to claim 1, characterized in that: The material discharging assembly (3) comprises a connecting base plate (303) mounted on the top of one side of the work surface (1), and a third motor (301) is provided at the top of the connecting base plate (303), a transmission rod (302) is installed at the output end of the third motor (301), and a shovel (304) is installed on one side of the transmission rod (302), and the shovel (304) has a shovel-shaped appearance.

9. The ceramic laser cutting machine according to claim 8, characterized in that: A support base (305) is installed at the top of the work surface (1), and a connecting bracket (306) is installed on one side of the support base (305); a T-shaped connecting piece (307) is hinged on one side of the connecting bracket (306), and a support plate (308) is connected to one side of the T-shaped connecting piece (307); a groove matching the width of the shovel (304) is inlaid on the top of the support plate (308).

10. The ceramic laser cutting machine according to claim 1, characterized in that: The automatic material transport structure (2) comprises a first motor (201), and the output end of the first motor (201) is connected to a transmission screw (202), a moving slider (203) penetrates the bottom end of the transmission screw (202), and the transmission screw (202) and the moving slider (203) are threadedly driven, and a limit slider is provided on the other side of the moving slider (203) to slide in a groove of a back plate. A movable bracket (204) is installed on one side of the movable slider (203), and a second motor (205) is installed on one side of the movable bracket (204); an output end of the second motor (205) is connected to a first gear (206), and a second gear (207) is provided on one side of the first gear (206); the first gear (206) and the second gear (207) are meshingly driven; a first clamping plate (208) is connected to one side of the first gear (206), and a second clamping plate (209) is connected to one side of the second gear (207).

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