Ceramic Laser Cutting Machine

Abstract

The present invention belongs to the field of laser cutting, and particularly relates to a ceramic laser cutting machine, which solves the problem in the prior art that dust cannot be collected and the chips generated by cutting cannot be cleaned in time, resulting in an overly thick recast layer. It includes a workbench surface and a ceramic chip component. On the other side of the top of the workbench surface, a laser processing structure is installed, and the laser processing structure includes a positioning preheating component and a laser cutting component. The laser cutting component is installed at the output end of the first telescopic rod, and the first telescopic rod drives the upper template to lift through transmission. A lower template is provided at the bottom end of the upper template, and the lower template and the upper template are combined to form a closed processing space. One side of the upper template is connected to a nitrogen delivery pipe, and the nitrogen delivery pipe delivers nitrogen; in the present invention, dust can be collected in time through the gas diversion port. This structure can not only extract dust in the air, but also collect the slag generated by the high-temperature gasification of the ceramic chip after laser cutting in time, reducing the thickness of the recast layer.

Description

Technical Field

[0001] The present invention relates to the technical field of laser cutting, and particularly to a ceramic laser cutting machine. Background Art

[0002] Laser processing of ceramic materials is mainly used in the chip microelectronics industry. Ceramic materials have good high-frequency performance, electrical performance, high thermal conductivity, chemical stability and thermal stability, and can be used in the production of large-scale integrated circuits and power electronic modules; when processing ceramic substrates, two methods of laser cutting and mechanical cutting can be adopted. Mechanical cutting shaves and saws the material by moving a physical tool, with low precision, many burrs and cracks, and high thermal influence. Laser cutting is non-contact and fast. It mainly uses the high temperature of a laser beam with a high energy density to instantaneously melt or vaporize the ceramic to achieve cutting. The cut is narrow and smooth, suitable for cutting microelectronic components and complex shapes;

[0003] The existing Chinese patent application with the publication number CN114147373B discloses a ceramic sheet laser cutting device, including a loading device, a conveying device, a laser cutting device, and a visual recognition device arranged at the loading device and the laser cutting device. The loading device and the laser cutting device are arranged on the front and rear opposite sides of the conveying device. The conveying device includes two linear modules and two carriers. The carriers are driven by the linear modules to travel back and forth between the loading device and the laser cutting device, and have a placement box for fixing the ceramic sheet. A transmissive glass is installed on the openable and closable lid of the placement box. The loading device alternately places and picks up the ceramic sheets in the two placement boxes, and adjusts the placement position of the ceramic sheets through the visual recognition device. The laser cutting device travels between the two linear modules, and its laser beam vertically passes through the transmissive glass in cooperation with the visual recognition device arranged coaxially therewith to cut the ceramic sheet in the placement box. During cutting, the carrier also blows air and removes dust from the ceramic sheet from the upper and lower opposite sides;

[0004] However, the ceramic sheet laser cutting device has the following defects in specific use:

[0005] It is not possible to collect dust and clean the debris generated by cutting in a timely manner. Not only the dust in the air, but also the ceramic chip laser cutting will generate debris. The debris is mainly the slag formed by being vaporized at high temperature during the laser cutting process. The traditional cleaning method is to centrally process the slag after processing. The slag separated from the main body is convenient to process through sweeping and vacuuming. However, the slag around the cutting area that is not processed in time will re-fuse with the ceramic main body due to the high temperature of the laser after cutting, increasing the thickness of the recast layer. The recast layer is very difficult to process. It is a layer of material formed by the surface of the material melting at high temperature and then quickly solidifying, which will affect the performance and use effect of the material. Therefore, measures need to be taken during cutting to reduce the generation of the recast layer. Direct cutting will damage the ceramic chip or even directly break it. Summary of the Invention

[0006] The technical problem solved by the present invention is the inability to collect dust and clean the debris generated by cutting in a timely manner, and a ceramic laser cutting machine is provided.

[0007] To solve the above technical problems, the ceramic laser cutting machine provided by the present invention includes a workbench surface and a ceramic chip component. An unloading component is installed on one side of the top of the workbench surface. The unloading component adjusts the angle and position of the ceramic chip component, and an automatic material transporting structure is installed on one side of the unloading component. The automatic material transporting structure clamps the ceramic chip component, and the ceramic chip component is placed on the top of a supporting component. A laser processing structure is installed on the other side of the top of the workbench surface, and the laser processing structure includes a first telescopic rod and a second telescopic rod installed on one side of the workbench surface;

[0008] A positioning and preheating component, the positioning and preheating component is installed at the output end of the second telescopic rod, and the second telescopic rod drives the heating die to lift through transmission, and the heating die preheats the ceramic chip component through heating;

[0009] A laser cutting component, the laser cutting component is installed at the output end of the first telescopic rod, and the first telescopic rod drives the upper template to lift through transmission. A lower template is provided at the bottom end of the upper template, and the lower template and the upper template are combined to form a closed processing space. A nitrogen delivery pipe is connected to one side of the upper template, and the nitrogen delivery pipe delivers nitrogen.

[0010] Preferably, the supporting component includes a chip base, a first leg bracket is provided on one side of the chip base, a second leg bracket is provided on the other side of the chip base, and a ceramic chip component is provided on the top of the chip base.

[0011] Preferably, the laser processing structure further includes a support frame, a first telescopic rod is installed on one side of the top of the support frame, and a second telescopic rod is installed on the other side of the top of the support frame,

[0012] Wherein, an automatic moving slide rail is installed at the bottom end inside the support frame, a lower template is provided at the top of the automatic moving slide rail, and a supporting component is installed on the top of the lower template.

[0013] Wherein, a lower mesh cover is provided inside the lower template, an upper mesh cover is provided inside the upper template, and both the upper mesh cover and the lower mesh cover are in the shape of a semi-circular mesh plate.

[0014] A gas diversion port is installed at the top of the upper mesh cover, and the input end of the gas diversion port is connected to the nitrogen delivery pipe.

[0015] Preferably, lower positioning slots are inlaid at the four peripheral edges of the lower template, upper positioning slots are inlaid at the four peripheral edges of the upper template, and the upper positioning slots and the lower positioning slots are aligned.

[0016] Among them, a connecting top plate is installed at the top end of the upper template, a working module is installed on one side of the connection between the connecting top plate and the upper template, a sliding rod is installed on one side of the working module, and an elastic element is installed on the other side of the connection between the connecting top plate and the upper template.

[0017] Preferably, a laser power cord is connected to one side of the upper template, and the output end of the laser power cord is connected to a laser cutting port, and the laser cutting port uses laser to cut ceramics.

[0018] Preferably, the output end of the second telescopic rod is connected to a connecting base, the bottom end of the connecting base is connected to a positioning connecting plate, grooves are provided at the four peripheral edges of the positioning connecting plate, and the bottom end of the positioning connecting plate is connected to a heating mold.

[0019] Among them, first connecting rods are installed on both sides of the bottom end of the connecting base, and the bottom ends of the first connecting rods are hinged to second connecting rods, and the second connecting rods are embedded in the grooves provided at the four peripheral edges of the positioning connecting plate.

[0020] Preferably, the heating mold has a middle concave and comb-shaped outer shape on both sides, and the outer shape of the heating mold cooperates with and clamps the outer shape of the top of the ceramic chip element, and the heating mold controls the temperature.

[0021] Preferably, the discharging assembly includes a connecting bottom plate installed at the top end of one side of the workbench surface, a third motor is provided at the top end of the connecting bottom plate, a transmission rod is installed at the output end of the third motor, a material shoveling shovel is installed on one side of the transmission rod, and the material shoveling shovel has a shovel-shaped outer shape.

[0022] Preferably, a support base is installed at the top end of the workbench surface, a connecting bracket is installed on one side of the support base, a T-shaped connecting piece is hinged to one side of the connecting bracket, a support plate is connected to one side of the T-shaped connecting piece, and a groove matching the width of the material shoveling shovel is inlaid at the top end of the support plate.

[0023] Preferably, the automatic material transportation structure includes a first motor, the output end of the first motor is connected to a transmission screw rod, a moving slider penetrates through the bottom end of the transmission screw rod, and the transmission screw rod and the moving slider are in threaded transmission, and a limiting slider is arranged on the other side of the moving slider and slides in the groove of the back plate.

[0024] Among them, a moving bracket is installed on one side of the moving slider, a second motor is installed on one side of the moving bracket, the output end of the second motor is connected to a first gear, a second gear is provided on one side of the first gear, the first gear and the second gear are in meshing transmission, a first clamping plate is connected to one side of the first gear, and a second clamping plate is connected to one side of the second gear.

[0025] The present invention also discloses a ceramic laser cutting machine. Using the above-mentioned ceramic laser cutting machine, the following steps are included:

[0026] Compared with the related art, the present invention has the following beneficial effects:

[0027] 1. Dust can be collected in a timely manner through the gas diversion port. This structure can not only extract dust in the air, but also collect the slag generated by the high-temperature gasification of the ceramic chip after laser cutting in a timely manner. Compared with the traditional method of concentrating and treating the slag after processing, this mechanism can avoid the slag generated by the high-temperature gasification after laser cutting from adhering to the ceramic chip and increasing the thickness of the recast layer. The recast layer is mainly a layer of material formed by the surface of the material melting due to high temperature and then rapidly solidifying, which will affect the performance and use effect of the material. Therefore, measures need to be taken during cutting to reduce the generation of the recast layer. In addition, nitrogen is respectively pumped and injected into the cavity through two groups of nitrogen delivery pipes, so that the nitrogen can continue to flow after entering the cavity, thereby realizing gas convection. In addition, the high-speed flowing air flow can also cool the ceramic chip components during laser cutting, further reducing the thickness of the recast layer. And due to the chemical inertness of nitrogen, it can play a role in suppressing excessive combustion in the cutting area during laser cutting, reducing the oxidation reaction during cutting, avoiding the yellowing of the cut side end face, and at the same time helping to remove the slag in the cut seam, improving the cutting quality, and reducing the size of the heat-affected zone.

[0028] 2. The temperature control ability of the heating mold preheats the ceramic chip components in advance before laser cutting and cools the ceramic chip components in a timely manner after laser cutting, reducing the thermal stress caused by temperature changes, thereby reducing the generation of cracks. And the temperature control can further reduce the generation of the recast layer. In addition, the design of the heating mold fitting the shape of the ceramic chip components can uniformly heat the concave and convex positions of the ceramic chip components, and at the same time play a role in correcting the position of the ceramic chip components at the top of the supporting component, avoiding the deviation of the ceramic chip components during laser cutting. In addition, appropriate additives, such as ceramic powder or rare earth elements, can be added to the ceramic material, which can also further improve the thermal expansion coefficient and anti-cracking performance of the material, and the ceramic substrate can be pretreated by applying an absorbent to further improve the absorption rate of the material to laser, thereby improving the cutting efficiency and quality.

[0029] 3. The second clamping plate and the first clamping plate are driven by a ratchet drive to clamp the ceramic chip components. The tightening force can be adjusted through cooperation. When grasping and moving the ceramic chip components up, down, left, and right, the force can be appropriately adjusted. And the inner side of the first clamping plate and the second clamping plate close to the ceramic chip components is provided with an embedded groove, which is convenient for more stable fixing of the ceramic chip components during the operation process, and at the same time avoids the distortion of the ceramic chip components and excessive local stress caused by over-tightening.

[0030] To make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following provides preferred embodiments in conjunction with the accompanying drawings and describes them in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention or in the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0032] Figure 1 is a schematic diagram of the first three-dimensional external structure of the present invention;

[0033] Figure 2 is a schematic diagram of the first three-dimensional external structure of the present invention;

[0034] Figure 3 is of the present invention Figure 2 is an enlarged schematic diagram of part A;

[0035] Figure 4 is a three-dimensional schematic diagram of the automatic material conveying structure of the present invention;

[0036] Figure 5 is a schematic diagram of the structure of the first clamping plate and the second clamping plate of the present invention;

[0037] Figure 6 is a schematic diagram of the structure of the first gear and the second gear of the present invention;

[0038] Figure 7 is a front view external structure schematic diagram of the present invention;

[0039] Figure 8 is a first three-dimensional external view schematic diagram of the laser cutting assembly of the present invention;

[0040] Figure 9 is a second three-dimensional external view schematic diagram of the laser cutting assembly of the present invention;

[0041] Figure 10 is a three-dimensional external view schematic diagram of the supporting assembly of the present invention;

[0042] Figure 11 is a three-dimensional external view schematic diagram of the positioning and preheating assembly of the present invention;

[0043] Figure 12 is a three-dimensional external view schematic diagram of the heating mold of the present invention;

[0044] Figure 13 is a three-dimensional external view schematic diagram of the ceramic chip element of the present invention.

[0045] Reference numerals in the figure:

[0046] 1. Workbench surface; 2. Automatic material conveying structure; 201. First motor; 202. Transmission screw; 203. Moving slider; 204. Moving bracket; 205. Second motor; 206. First gear; 207. Second gear; 208. First clamping plate; 209. Second clamping plate; 3. Discharge component; 301. Third motor; 302. Transmission rod; 303. Connecting bottom plate; 304. Shoveling shovel; 305. Support base; 306. Connecting bracket; 307. T-shaped connecting piece; 308. Support plate; 4. Laser processing structure; 401. Support frame; 402. First telescopic rod; 403. Second telescopic rod; 404. Automatic moving slide rail; 5. Positioning and preheating component; 501. Connecting base; 502. Positioning connecting plate; 503. First connecting rod; 504. Second connecting rod; 505. Heating die; 6. Laser cutting component; 601. Connecting top plate; 602. Upper template; 603. Sliding rod; 604. Elastic element; 605. Working module; 606. Nitrogen delivery pipe; 607. Laser power cord; 608. Lower template; 609. Lower mesh cover; 610. Upper mesh cover; 611. Gas diversion port; 612. Laser cutting port; 613. Upper positioning slot; 614. Lower positioning slot; 7. Ceramic chip element; 8. Supporting component; 801. Chip base; 802. First foot bracket; 803. Second foot bracket. Detailed implementation manners

[0047] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0048] Please refer to Figures 1 - 13 , a ceramic laser cutting machine, including a workbench surface 1 and a ceramic chip element 7. A discharge component 3 is installed on one side of the top of the workbench surface 1. The discharge component 3 adjusts the angle and position of the ceramic chip element 7.

[0049] The discharge component 3 includes a connecting bottom plate 303 installed on the top of one side of the workbench surface 1. A third motor 301 is provided at the top of the connecting bottom plate 303. The output end of the third motor 301 is installed with a transmission rod 302. A shoveling shovel 304 is installed on one side of the transmission rod 302. The shoveling shovel 304 has a shoveling shape.

[0050] A support base 305 is installed at the top of the workbench surface 1, and a connecting bracket 306 is installed on one side of the support base 305. A T-shaped connecting piece 307 is hinged on one side of the connecting bracket 306. The T-shaped connecting piece 307 rotates around the connection point of the connecting bracket 306, thereby driving the support plate 308 to flip on the top of the support base 305, so as to adjust the angle of the workbench surface, facilitating the inspection of whether the appearance of the ceramic chip meets the standard after processing;

[0051] One side of the T-shaped connecting piece 307 is connected to a support plate 308. A groove matching the width of the material shoveling shovel 304 is inlaid at the top of the support plate 308. The third motor 301 is started to drive the material shoveling shovel 304 on one side of the transmission rod 302 to extend towards the support plate 308. The supporting component 8 is lowered so that the supporting component 8 can move in the groove at the top of the support plate 308. The width of the material shoveling shovel 304 matches the width of the groove at the top of the support plate 308. When the transmission rod 302 extends, the supporting component 8 can be shoveled up and put down;

[0052] And an automatic material transportation structure 2 is installed on one side of the discharging component 3. The automatic material transportation structure 2 includes a first motor 201, and the output end of the first motor 201 is connected to a transmission screw rod 202. Then, by starting the first motor 201 to drive the transmission screw rod 202 to rotate, the bottom end of the transmission screw rod 202 penetrates through a moving slider 203, and the transmission screw rod 202 and the moving slider 203 are in threaded transmission. The transmission screw rod 202 drives the moving slider 203 to move up and down, thereby driving the ceramic chip element 7 to lift and lower. A limiting slider is arranged on the other side of the moving slider 203 to slide in the groove of the back plate,

[0053] Wherein, a moving bracket 204 is installed on one side of the moving slider 203, and a second motor 205 is installed on one side of the moving bracket 204. The output end of the second motor 205 is connected to a first gear 206, and a second gear 207 is arranged on one side of the first gear 206. The first gear 206 and the second gear 207 are in meshing transmission. A first clamping plate 208 is connected to one side of the first gear 206, and a second clamping plate 209 is connected to one side of the second gear 207; The second clamping plate 209 and the first clamping plate 208 are driven to clamp the ceramic chip element 7 through meshing transmission. The fastening force can be adjusted through cooperation. When grasping and moving the ceramic chip element 7 up, down, left and right, the force can be appropriately adjusted. And an embedded groove is arranged on the side of the first clamping plate 208 and the second clamping plate 209 close to the ceramic chip element 7, which is convenient for more stable fixation of the ceramic chip element 7 during the operation process, and at the same time avoids the ceramic chip element 7 being distorted and locally overstressed due to excessive fastening;

[0054] The automatic material transportation structure 2 clamps the ceramic chip element 7, and the ceramic chip element 7 is placed on the top of the supporting component 8,

[0055] The supporting component 8 includes a chip base 801. First, place the ceramic chip component 7 on the top of the chip base 801. One side of the chip base 801 is provided with a first leg bracket 802, and the other side of the chip base 801 is provided with a second leg bracket 803. The ceramic chip component 7 is arranged on the top of the chip base 801, and the automatic feeding structure 2 of the two sides of the ceramic chip component 7 is fixed by the first leg bracket 802 and the second leg bracket 803.

[0056] On the other side of the top of the workbench surface 1, a laser processing structure 4 is installed. The laser processing structure 4 includes a first telescopic rod 402 and a second telescopic rod 403 installed on one side of the workbench surface 1.

[0057] The positioning and preheating component 5 is installed at the output end of the second telescopic rod 403. The second telescopic rod 403 drives the heating mold 505 to lift and lower through transmission, and the heating mold 505 preheats the ceramic chip component 7 by heating; the outer shape of the heating mold 505 fits the outer shape of the ceramic chip component 7. When the heating mold 505 is heated, it plays a role in preheating the ceramic chip component 7.

[0058] The output end of the second telescopic rod 403 is connected with a connecting base 501. The bottom end of the connecting base 501 is connected with a positioning connecting plate 502. Grooves are arranged at the four peripheral edges of the positioning connecting plate 502, and the bottom end of the positioning connecting plate 502 is connected with the heating mold 505.

[0059] Among them, two sides of the bottom end of the connecting base 501 are installed with first connecting rods 503. Then place the supporting component 8 on the top of the lower template 608. Then start the second telescopic rod 403 to drive the first connecting rods 503 to press down. The bottom end of the first connecting rod 503 is hinged with a second connecting rod 504, and the second connecting rod 504 is embedded in the grooves arranged at the four peripheral edges of the positioning connecting plate 502; when the positioning connecting plate 502 is pressed down, the heating mold 505 contacts the ceramic chip component 7; the first connecting rod 503 and the second connecting rod 504 are used to assist in stably positioning the connecting plate 502 so that the force exerted by the heating mold 505 on the ceramic chip component 7 is more uniform.

[0060] The heating mold 505 has a middle concave and two-side comb-shaped outer shape, and the outer shape of the heating mold 505 cooperates with the outer shape of the top of the ceramic chip component 7 to be stuck. The heating mold 505 controls the temperature.

[0061] Preheat the ceramic chip component 7 in advance by the temperature control ability of heating the mold 505 before laser cutting, and cool the ceramic chip component 7 in time after laser cutting the ceramic chip component 7, reducing the thermal stress caused by temperature change, thereby reducing the generation of cracks; and the temperature control can further reduce the generation of the recast layer. In addition, the design of the heating mold 505 that fits the shape of the ceramic chip component 7 can uniformly heat the concave and convex positions of the ceramic chip component 7, and at the same time play a role in correcting the position of the ceramic chip component 7 at the top of the supporting component 8, avoiding the deviation of the ceramic chip component 7 during laser cutting; in addition, appropriate additives such as ceramic powder or rare earth elements can be added to the ceramic material, which can also further improve the thermal expansion coefficient and anti-cracking performance of the material, and the ceramic substrate can be pretreated in advance by applying an absorbent to further improve the laser absorption rate of the material, thereby improving the cutting efficiency and quality;

[0062] The laser cutting assembly 6 is installed at the output end of the first telescopic rod 402, and the first telescopic rod 402 drives the upper template 602 to lift through transmission. A lower template 608 is provided at the bottom end of the upper template 602, and the lower template 608 and the upper template 602 are combined to form a closed processing space. A nitrogen delivery pipe 606 is connected to one side of the upper template 602, and the nitrogen delivery pipe 606 delivers nitrogen;

[0063] The laser processing structure 4 further includes a support frame 401, and a first telescopic rod 402 is installed on one side of the top end of the support frame 401, and a second telescopic rod 403 is installed on the other side of the top end of the support frame 401,

[0064] Among them, an automatic moving slide rail 404 is installed at the bottom end inside the support frame 401, and a lower template 608 is provided at the top end of the automatic moving slide rail 404. A supporting component 8 is installed at the top end of the lower template 608,

[0065] Among them, a lower mesh cover 609 is provided inside the lower template 608, and an upper mesh cover 610 is provided inside the upper template 602. Both the upper mesh cover 610 and the lower mesh cover 609 are in the shape of a semicircular mesh plate. The function of the upper mesh cover 610 and the lower mesh cover 609 is to allow the flow of nitrogen inside the space without hindering the placement of the ceramic chip component 7. The function of the laser cutting port 612 is to cut the ceramic chip component 7 by laser,

[0066] At the top of the upper dust cover 610, a gas diversion port 611 is installed. Through the gas diversion port 611, dust can be collected in a timely manner. This structure can not only extract dust in the air, but also collect the slag generated by the high-temperature gasification of the ceramic chip after laser cutting in a timely manner. Compared with the traditional method of processing and then centrally treating the slag, this mechanism can avoid the slag generated by the high-temperature gasification after laser cutting from adhering to the ceramic chip and increasing the thickness of the recast layer. The recast layer is mainly a layer of material formed by the surface of the material melting due to high temperature and then rapidly solidifying, which will affect the performance and use effect of the material. Therefore, measures need to be taken during cutting to reduce the generation of the recast layer. And the input end of the gas diversion port 611 is connected to the nitrogen delivery pipe 606; through two groups of nitrogen delivery pipes 606, nitrogen is respectively pumped and injected into the cavity, so that the nitrogen can continue to flow after entering the cavity, thereby realizing gas convection. In addition, the high-speed flowing air can also cool the ceramic chip element 7 during laser cutting, further reducing the thickness of the recast layer. And due to the chemical inertness of nitrogen, it can play a role in suppressing excessive combustion in the cutting area during laser cutting, reducing the oxidation reaction during cutting, avoiding the yellowing of the cut side end face, and at the same time helping to remove the slag in the cut seam, improving the cutting quality and reducing the size of the heat affected zone;

[0067] At the four peripheral edges of the lower template 608, lower positioning slots 614 are inlaid. At the four peripheral edges of the upper template 602, upper positioning slots 613 are inlaid, and the upper positioning slots 613 and the lower positioning slots 614 are aligned. After the ceramic chip element 7 is heated, start the automatic moving slide rail 404 at the bottom of the lower template 608 to drive the ceramic chip element 7 to reach the bottom of the upper template 602. Start the first telescopic rod 402 to drive the connecting top plate 601 to press down. At this time, the lower positioning slots 614 and the upper positioning slots 613 are aligned, so that the upper template 602 and the lower template 608 are joined together to form a closed processing space;

[0068] Among them, at the top of the upper template 602, a connecting top plate 601 is installed. On one side of the connection between the connecting top plate 601 and the upper template 602, a working module 605 is installed. On one side of the working module 605, a sliding rod 603 is installed. On the other side of the connection between the connecting top plate 601 and the upper template 602, an elastic element 604 is installed;

[0069] One side of the upper template 602 is connected to a laser power cord 607, and the output end of the laser power cord 607 is connected to a laser cutting port 612. The laser cutting port 612 uses laser to cut ceramics.

[0070] Working principle: First, place the ceramic chip component 7 on the top of the chip base 801, and fix the automatic feeding structure 2 of the two side legs of the ceramic chip component 7 through the first leg bracket 802 and the second leg bracket 803. Then, place the supporting component 8 on the top of the lower template 608. Then, start the second telescopic rod 403 to drive the first connecting rod 503 to press down, and the positioning connecting plate 502 presses down, so that the heating mold 505 contacts the ceramic chip component 7, and the outer shape of the heating mold 505 fits the outer shape of the ceramic chip component 7. The heating mold 505 is heated to preheat the ceramic chip component 7. The functions of the first connecting rod 503 and the second connecting rod 504 are to assist in stably positioning the connecting plate 502 so that the force exerted by the heating mold 505 on the ceramic chip component 7 is more uniform.

[0071] After the ceramic chip component 7 is heated, start the automatic moving slide rail 404 at the bottom of the lower template 608 to drive the ceramic chip component 7 to reach the bottom of the upper template 602. Start the first telescopic rod 402 to drive the connecting top plate 601 to press down. At this time, the lower positioning slot 614 and the upper positioning slot 613 are aligned, so that the upper template 602 and the lower template 608 are joined together to form a closed processing space. Nitrogen is transported and output through the nitrogen delivery pipe 606, and nitrogen is injected into the space through the gas diversion port 611, so that nitrogen flows in the closed space. The functions of the upper mesh cover 610 and the lower mesh cover 609 are to allow the flow of nitrogen inside the space without hindering the placement of the ceramic chip component 7. The function of the laser cutting port 612 is to cut the ceramic chip component 7 by laser manufacturing;

[0072] Then, start the first motor 201 to drive the transmission screw 202 to rotate. The transmission screw 202 drives the moving slider 203 to move up and down, thereby driving the ceramic chip component 7 to lift and lower. Start the second motor 205 to drive the first clamping plate 208 and the second clamping plate 209 to flip and clamp the ceramic chip component 7 in opposite directions through the meshing transmission of the first gear 206 and the second gear 207.

[0073] Finally, start the third motor 301 to drive the shoveling shovel 304 on one side of the transmission rod 302 to extend towards the support plate 308, and lower the supporting component 8, so that the supporting component 8 can move in the groove at the top of the support plate 308. The width of the shoveling shovel 304 matches the width of the groove at the top of the support plate 308. When the transmission rod 302 extends, it can shovel up and lower the supporting component 8. The T-shaped connecting piece 307 flips around the connection point of the connecting bracket 306, thereby driving the support plate 308 to flip on the top of the support base 305, so as to adjust the angle of the workbench surface, facilitating the inspection of whether the appearance of the ceramic chip meets the standard after processing.

[0074] The above are only embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural or equivalent process transformations made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are similarly included in the patent protection scope of the present invention.

Claims

1. A ceramic laser cutting machine, comprising a work surface (1) and a ceramic chip element (7), characterized in that: A discharge assembly (3) is installed on one side of the top of the work surface (1), the discharge assembly (3) adjusts the angle and position of the ceramic chip component (7), and an automatic material transport structure (2) is installed on one side of the discharge assembly (3), the automatic material transport structure (2) clamps the ceramic chip component (7), and the ceramic chip component (7) is placed on the top of the supporting assembly (8), and a laser processing structure (4) is installed on the other side of the top of the work surface (1), and the laser processing structure (4) includes a first telescopic rod (402) and a second telescopic rod (403) installed on one side of the work surface (1); A positioning preheating component (5), wherein the positioning preheating component (5) is installed at the output end of the second telescopic rod (403), and the second telescopic rod (403) drives the heating mold (505) to move up and down through transmission, and the heating mold (505) preheats the ceramic chip element (7) through heating; The output end of the second telescopic rod (403) is connected to a connecting base (501), and the bottom end of the connecting base (501) is connected to a positioning connecting plate (502), the positioning connecting plate (502) is provided with grooves at the edges of the four sides, and the bottom end of the positioning connecting plate (502) is connected to a heating mold (505). Wherein, first connecting rods (503) are installed on both sides of the bottom end of the connecting base (501), and the bottom end of the first connecting rod (503) is hinged with a second connecting rod (504), and the second connecting rod (504) is embedded in the grooves provided on the four edges of the positioning connecting plate (502); A laser cutting assembly (6) is installed at the output end of a first telescopic rod (402), and the first telescopic rod (402) drives an upper template (602) to rise and fall through transmission, a lower template (608) is provided at the bottom end of the upper template (602), and the lower template (608) and the upper template (602) are assembled to form a closed processing space, and a nitrogen delivery pipe (606) is connected to one side of the upper template (602), and the nitrogen delivery pipe (606) delivers nitrogen.

2. The ceramic laser cutting machine according to claim 1, characterized in that: The supporting assembly (8) comprises a chip base (801), wherein a first support leg bracket (802) is provided on one side of the chip base (801), a second support leg bracket (803) is provided on the other side of the chip base (801), and a ceramic chip element (7) is provided on the top of the chip base (801).

3. The ceramic laser cutting machine according to claim 1, characterized in that: The laser processing structure (4) further comprises a supporting frame (401), wherein a first telescopic rod (402) is mounted on one side of the top end of the supporting frame (401), and a second telescopic rod (403) is mounted on the other side of the top end of the supporting frame (401). The bottom end of the support frame (401) is equipped with an automatic moving slide rail (404), and the top end of the automatic moving slide rail (404) is provided with a lower template (608), and the top end of the lower template (608) is equipped with a supporting component (8). The lower template (608) is provided with a lower mesh cover (609) inside, and the upper template (602) is provided with an upper mesh cover (610) inside, and both the upper mesh cover (610) and the lower mesh cover (609) are in the shape of a semicircular mesh plate. A gas guide port (611) is installed at the top of the upper net cover (610), and an input end of the gas guide port (611) is connected to a nitrogen delivery pipe (606).

4. The ceramic laser cutting machine according to claim 3, characterized in that: The lower template (608) is inlaid with lower positioning slots (614) at the four edges of the lower template (608), and the upper positioning slots (613) are inlaid with upper positioning slots (613) at the four edges of the upper template (602), and the upper positioning slots (613) and the lower positioning slots (614) are aligned. A connecting top plate (601) is installed at the top of the upper template (602), a working module (605) is installed on one side of the connection between the connecting top plate (601) and the upper template (602), a sliding rod (603) is installed on one side of the working module (605), and an elastic element (604) is installed on the other side of the connection between the connecting top plate (601) and the upper template (602).

5. The ceramic laser cutting machine according to claim 4, characterized in that: One side of the upper template (602) is connected to a laser power line (607), and the output end of the laser power line (607) is connected to a laser cutting port (612), and the laser cutting port (612) uses laser to cut ceramics.

6. The ceramic laser cutting machine according to claim 5, characterized in that: The heating mold (505) is concave in the middle and has a comb-tooth shape on both sides, and the shape of the heating mold (505) and the shape of the top of the ceramic chip element (7) are matched and stuck to each other, and the heating mold (505) controls the temperature.

7. The ceramic laser cutting machine according to claim 1, characterized in that: The material discharging assembly (3) comprises a connecting base plate (303) mounted on the top of one side of the work surface (1), and a third motor (301) is provided at the top of the connecting base plate (303), a transmission rod (302) is installed at the output end of the third motor (301), and a shovel (304) is installed on one side of the transmission rod (302), and the shovel (304) has a shovel-shaped appearance.

8. The ceramic laser cutting machine according to claim 7, characterized in that: A support base (305) is installed at the top of the work surface (1), and a connecting bracket (306) is installed on one side of the support base (305); a T-shaped connecting piece (307) is hinged on one side of the connecting bracket (306), and a support plate (308) is connected to one side of the T-shaped connecting piece (307); a groove matching the width of the shovel (304) is inlaid on the top of the support plate (308).

9. The ceramic laser cutting machine according to claim 1, characterized in that: The automatic material transport structure (2) comprises a first motor (201), and the output end of the first motor (201) is connected to a transmission screw (202), a moving slider (203) penetrates the bottom end of the transmission screw (202), and the transmission screw (202) and the moving slider (203) are threadedly driven, and a limit slider is provided on the other side of the moving slider (203) to slide in a groove of a back plate. A movable bracket (204) is installed on one side of the movable slider (203), and a second motor (205) is installed on one side of the movable bracket (204); an output end of the second motor (205) is connected to a first gear (206), and a second gear (207) is provided on one side of the first gear (206); the first gear (206) and the second gear (207) are meshingly driven; a first clamping plate (208) is connected to one side of the first gear (206), and a second clamping plate (209) is connected to one side of the second gear (207).

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