Application of composition and preparation method of polyolefin resin composition

Abstract

The invention discloses application of a composition and a preparation method of a polyolefin resin composition. The invention provides application of a composition in reducing the bubble content in polyolefin resin. The composition comprises a compound A, a compound B, a compound C and a compound D, the compound A, the compound B, the compound C and the compound D are different sorbitol compounds. The composition provided by the invention can effectively reduce the bubble content in the polyolefin resin composition.

Description

Technical Field

[0001] The invention relates to the use of a composition and a method for preparing a polyolefin resin composition. Background Art

[0002] Polyolefin resin is a thermoplastic synthetic resin with excellent performance, which has chemical resistance, heat resistance, electrical insulation, high strength mechanical properties and good high wear resistance processing performance.

[0003] CN106661256A discloses a composition for preparing polymer foam, comprising (i) at least substantially amorphous polymer resin selected from poly(methyl methacrylate), polyvinyl chloride, polystyrene, polystyrene, polystyrene copolymers, polycarbonate, polysulfone, polyethersulfone, poly(p-phenylene oxide), glycol-modified polyethylene terephthalate, and mixtures or blends thereof; and (ii) 1,3:2,4-bis-(benzylidene)-sorbitol derivatives and mixtures thereof. The obtained polyolefin product has a high content of bubbles.

[0004] CN105623105B discloses a composition with a low eutectic point, comprising 1,3:2,4-di-O-(p-chlorobenzylidene)-D-sorbitol and 1,3:2,4-di(3,4-dimethylbenzylidene)-D-sorbitol, wherein the weight ratio of 1,3:2,4-di-O-(p-chlorobenzylidene)-D-sorbitol and 1,3:2,4-di(3,4-dimethylbenzylidene)-D-sorbitol in the composition satisfies the low eutectic point of 240°C-245°C. The composition is used in polyolefin resin products and generates more bubbles. Summary of the invention

[0005] In view of this, one object of the present invention is to provide a use of a composition, which can reduce the bubble content in a polyolefin resin. Another object of the present invention is to provide a method for preparing a polyolefin resin composition. Still another object of the present invention is to provide a use of a composition, which can reduce the haze and processing temperature of a polyolefin resin.

[0006] The above object is achieved through the following scheme.

[0007] In one aspect, the present invention provides a composition for reducing the bubble content in a polyolefin resin, the composition comprising the following components:

[0008] (1) Compound A represented by formula (A):

[0009]

[0010] Among them, R 1 and R 2are each independently selected from halogen;

[0011] (2) Compound B represented by formula (B):

[0012]

[0013] Among them, R 3 ~R 6 Each independently selected from a C1 to C6 alkyl group;

[0014] (3) Compound C represented by formula (C):

[0015]

[0016] Among them, R 7 Selected from halogen, R 8 and R 9 Each independently selected from a C1 to C6 alkyl group;

[0017] (4) Compound D represented by formula (D):

[0018]

[0019] Among them, R 10 and R 11 are independently selected from C1 to C6 alkyl groups, R 12 Selected from halogen.

[0020] According to the use of the present invention, preferably, R 1 and R 2 are independently selected from F, Cl, Br and I, said R 1 Located at the para position of the benzene ring, the R 2 Located in the para position of the benzene ring;

[0021] R 3 ~R 5 Each of the following is independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl;

[0022] R 7 is selected from F, Cl, Br and I, R 8 and R 9 Each of the following is independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl;

[0023] R 10 and R 11 R are independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl; 12 Selected from F, Cl, Br and I.

[0024] According to the use of the present invention, preferably, based on the total mass of the composition, the total content of compound A and compound B is greater than or equal to 10 wt % and less than or equal to 90 wt %.

[0025] According to the use of the present invention, preferably, based on the total mass of the composition, the total content of the compound C and the compound D is greater than or equal to 10 wt %.

[0026] According to the use of the present invention, preferably, compound A is as shown in formula (I):

[0027]

[0028] Compound B is shown in formula (II):

[0029]

[0030] Compound C is shown in formula (III):

[0031]

[0032] Compound D is shown in formula (IV):

[0033]

[0034] According to the use of the present invention, preferably, based on the mass of the polyolefin resin, the amount of the composition is 0.1 to 0.5 wt%.

[0035] According to the use of the present invention, preferably, the polyolefin resin is selected from one or more of polyethylene, polypropylene and polybutene.

[0036] In another aspect, the present invention provides a method for preparing a polyolefin resin composition, comprising the steps of:

[0037] Provided is a composition comprising the following components:

[0038] (1) Compound A represented by formula (A):

[0039]

[0040] Among them, R 1 and R 2 are each independently selected from halogen;

[0041] (2) Compound B represented by formula (B):

[0042]

[0043] Among them, R 3 ~R 6Each independently selected from a C1 to C6 alkyl group;

[0044] (3) Compound C represented by formula (C):

[0045]

[0046] Among them, R 7 Selected from halogen, R 8 and R 9 Each independently selected from a C1 to C6 alkyl group;

[0047] (4) Compound D represented by formula (D):

[0048]

[0049] Among them, R 10 and R 11 are independently selected from C1 to C6 alkyl groups, R 12 is selected from halogen;

[0050] The raw material including the polyolefin resin and the composition is granulated to obtain polyolefin resin particles, and the polyolefin resin particles are injection molded at 150-350° C. to obtain a polyolefin resin composition; or the raw material including the polyolefin resin and the composition is extruded at 150-350° C. to obtain a polyolefin resin composition.

[0051] In another aspect, the present invention provides a composition for reducing the haze and / or processing temperature of a polyolefin resin, the composition comprising the following components:

[0052] (1) Compound A represented by formula (A):

[0053]

[0054] Among them, R 1 and R 2 are each independently selected from halogen;

[0055] (2) Compound B represented by formula (B):

[0056]

[0057] Among them, R 3 ~R 6 Each independently selected from a C1 to C6 alkyl group;

[0058] (3) Compound C represented by formula (C):

[0059]

[0060] Among them, R7 Selected from halogen, R 8 and R 9 are independently selected from C1 to C6 alkyl groups; (4) a compound D represented by formula (D):

[0061]

[0062] Among them, R 10 and R 11 are independently selected from C1 to C6 alkyl groups, R 12 Selected from halogen.

[0063] According to the use of the present invention, preferably, R 1 and R 2 are independently selected from F, Cl, Br and I, said R 1 Located at the para position of the benzene ring, the R 2 Located in the para position of the benzene ring;

[0064] R 3 ~R 5 Each of the following is independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl;

[0065] R 7 is selected from F, Cl, Br and I, R 8 and R 9 Each of the following is independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl;

[0066] R 10 and R 11 R are independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl; 12 Selected from F, Cl, Br and I.

[0067] The composition of the present invention can reduce bubbles generated during the processing and molding of polyolefin resin, and the obtained polyolefin resin composition does not contain bubbles. The composition of the present invention can reduce the haze and processing temperature of polyolefin resin. The composition of the present invention is applied to polyolefin resin, and can reduce the haze of polyolefin resin in a wide processing temperature range (150 to 350° C.), especially at a lower processing temperature. DETAILED DESCRIPTION

[0068] The present invention is further described below in conjunction with specific embodiments, but the protection scope of the present invention is not limited thereto.

[0069] <Use of reducing bubbles>

[0070] The present invention provides a use of a composition in reducing the bubble content in a polyolefin resin. The composition comprises compound A, compound B, compound C and compound D. In certain embodiments, the composition consists of compound A, compound B, compound C and compound D. These bubbles may be generated during the processing (e.g., injection molding, extrusion) of the polyolefin resin.

[0071] The compound A of the present invention is shown in formula (A):

[0072]

[0073] Among them, R 1 and R 2 are independently selected from halogen. 1 and R 2 R is independently selected from F, Cl, Br and I. 1 and R 2 can be the same or different. Preferably, R 1 and R 2 More preferably, R 1 and R 2 All are Cl.

[0074] R 1 It can be substituted at the meta or para position of the benzene ring. 1 Located in the para position of the benzene ring. 2 It can be substituted at the meta or para position of the benzene ring. 2 Located in the para position of the benzene ring.

[0075] According to one embodiment of the present invention, compound A is as follows:

[0076]

[0077] Specifically, compound A is represented by formula (I):

[0078]

[0079] The name of compound A is 1,3:2,4-bis-O-((4-chlorophenyl)methylene)-D-sorbitol.

[0080] The compound B of the present invention is shown in formula (B):

[0081]

[0082] Among them, R 3 ~R 6 are independently selected from C1 to C6 alkyl groups; preferably, R 3 ~R 6R are independently selected from C1 to C3 alkyl groups. 3 ~R 6 The propyl group may be independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl. Examples of propyl groups include, but are not limited to, n-propyl and isopropyl. Examples of butyl groups include, but are not limited to, n-butyl, isobutyl, sec-butyl and tert-butyl. Examples of pentyl groups include, but are not limited to, n-pentyl, 2-methylbutyl, 3-methylbutyl, 1-ethylpropyl, 2-ethylpropyl, 2,3-dimethylpropyl and 2,2-dimethylpropyl. Examples of hexyl groups include, but are not limited to, n-hexyl, 2-methylpentyl, 3-methylpentyl, 2,3-dimethylbutyl and 2,2-dimethylbutyl.

[0083] R 3 ~R 6 can be the same or different. Preferably, R 3 ~R 6 More preferably, R 3 ~R 6 All are methyl.

[0084] According to one embodiment of the present invention, compound B is as follows:

[0085]

[0086] Specifically, compound B is represented by formula (II):

[0087]

[0088] The name of compound B is 1,3:2,4-di(3,4-dimethylbenzylidene)-D-sorbitol.

[0089] In the composition of the present invention, the total content of compound A and compound B is greater than or equal to 10 wt % and less than or equal to 90 wt %.

[0090] In some embodiments, the total content of compound A and compound B is greater than or equal to 30 wt %. In other embodiments, the total content of compound A and compound B is greater than or equal to 50 wt %. In still other embodiments, the total content of compound A and compound B is greater than or equal to 60 wt %.

[0091] In some embodiments, the total content of compound A and compound B is less than or equal to 80wt%. In some embodiments, the total content of compound A and compound B is less than or equal to 70wt%. In other embodiments, the total content of compound A and compound B is less than or equal to 60wt%. In still other embodiments, the total content of compound A and compound B is less than or equal to 50wt%. In still other embodiments, the total content of compound A and compound B is less than or equal to 40wt%.

[0092] By controlling the contents of compound A and compound B within the above ranges, the bubble content in the molded polyolefin resin composition can be effectively reduced.

[0093] The mass ratio of compound A to compound B may be 1:(0.3-8); preferably 1:(0.5-6); more preferably 1:(0.8-5); and most preferably 1:(0.9-1.2).

[0094] The compound C of the present invention is shown in formula (C):

[0095]

[0096] Among them, R 7 Selected from halogen, R 8 and R 9 Each is independently selected from a C1 to C6 alkyl group.

[0097] Preferably, R 7 is selected from F, Cl, Br and I. According to one embodiment of the present invention, R 7 For Cl.

[0098] Preferably, R 8 and R 9 R are independently selected from C1 to C3 alkyl groups. 8 and R 9 R may be independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl. Examples of propyl include, but are not limited to, n-propyl and isopropyl. Examples of butyl include, but are not limited to, n-butyl, isobutyl, sec-butyl and tert-butyl. Examples of pentyl include, but are not limited to, n-pentyl, 2-methylbutyl, 3-methylbutyl, 1-ethylpropyl, 2-ethylpropyl, 2,3-dimethylpropyl and 2,2-dimethylpropyl. Examples of hexyl include, but are not limited to, n-hexyl, 2-methylpentyl, 3-methylpentyl, 2,3-dimethylbutyl and 2,2-dimethylbutyl. 8 and R 9 can be the same or different. Preferably, R 8 and R 9 More preferably, R 8 and R 9 All are methyl.

[0099] According to one embodiment of the present invention, compound C is as follows:

[0100]

[0101] Specifically, compound C is represented by formula (III):

[0102]

[0103] The name of compound C is 1,3-(3,4-dimethylbenzylidene)-2,4-p-chlorobenzylidene-D-sorbitol.

[0104] The compound D of the present invention is shown in formula (D):

[0105]

[0106] Among them, R 10 and R 11 are independently selected from C1 to C6 alkyl groups, R 12 Selected from halogen.

[0107] Preferably, R 12 is selected from F, Cl, Br and I. According to one embodiment of the present invention, R 12 For Cl.

[0108] Preferably, R 10 and R 11 R are independently selected from C1 to C3 alkyl groups. 10 and R 11 R may be independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl. Examples of propyl include, but are not limited to, n-propyl and isopropyl. Examples of butyl include, but are not limited to, n-butyl, isobutyl, sec-butyl and tert-butyl. Examples of pentyl include, but are not limited to, n-pentyl, 2-methylbutyl, 3-methylbutyl, 1-ethylpropyl, 2-ethylpropyl, 2,3-dimethylpropyl and 2,2-dimethylpropyl. Examples of hexyl include, but are not limited to, n-hexyl, 2-methylpentyl, 3-methylpentyl, 2,3-dimethylbutyl and 2,2-dimethylbutyl. 10 and R 11 can be the same or different. Preferably, R 10 and R 11 More preferably, R 10 and R 11 All are methyl.

[0109] According to one embodiment of the present invention, compound D is as follows:

[0110]

[0111] Specifically, compound D is represented by formula (IV):

[0112]

[0113] The name of compound D is 1,3-p-chlorobenzylidene-2,4-(3,4-dimethylbenzylidene)-D-sorbitol.

[0114] In the composition of the present invention, the total content of compound C and compound D is greater than or equal to 10 wt %.

[0115] In certain embodiments, the total content of compound C and compound D is greater than or equal to 30wt%. In other embodiments, the total content of compound C and compound D is greater than or equal to 40wt%. In still other embodiments, the total content of compound C and compound D is greater than or equal to 50wt%. In still other embodiments, the total content of compound C and compound D is greater than or equal to 60wt%.

[0116] In some embodiments, the total content of compound C and compound D is less than or equal to 90wt%. In some embodiments, the total content of compound C and compound D is less than or equal to 80wt%. In other embodiments, the total content of compound C and compound D is less than or equal to 70wt%. In still other embodiments, the total content of compound C and compound D is less than or equal to 60wt%. In still other embodiments, the total content of compound C and compound D is less than or equal to 50wt%.

[0117] By controlling the contents of compound C and compound D within the above ranges, the bubble content in the molded polyolefin resin composition can be effectively reduced.

[0118] The mass ratio of compound C to compound D is 1:(0.5-2); preferably 1:(0.8-1.5); more preferably 1:(0.9-1.2).

[0119] The composition of the invention can reduce bubbles generated in the processing of polyolefin resin, and the obtained polyolefin resin composition does not contain bubbles.

[0120] The polyolefin resin of the present invention can be selected from one or more of polyethylene, polypropylene, and polybutene. Preferably, the polyolefin resin is a polypropylene resin. The polypropylene resin can be isotactic polypropylene, atactic polypropylene, or syndiotactic polypropylene. Polypropylene has better compatibility with the composition of the present invention and can better play the role of the composition.

[0121] Based on the mass of the polyolefin resin, the amount of the composition can be 0.1 to 0.5 wt %; preferably 0.15 to 0.4 wt %; more preferably 0.2 to 0.35 wt %.

[0122] <Method for preparing polyolefin composition>

[0123] The preparation method of the polyolefin composition of the present invention comprises the steps of: molding the raw material containing the composition and the polyolefin resin to obtain the polyolefin resin composition. In some embodiments, the raw material may also contain one or more of a pigment and an antioxidant. The composition and dosage of the composition are as described above and will not be repeated here. Injection molding or extrusion molding process may be adopted. The polyolefin resin composition prepared by the method of the present invention does not contain bubbles.

[0124] The pigment of the present invention can be selected from one or more of quinacridone, perylene, dioxazine pigments, isoindolinone, dione pyrrolopyrrole, phthalocyanine blue and ultramarine blue.

[0125] Based on the polyolefin resin, the amount of the pigment used can be 0.005 to 0.2 wt %; preferably 0.008 to 0.1 wt %; more preferably 0.01 to 0.05 wt %.

[0126] Injection molding

[0127] Injection molding includes the steps of granulation and injection molding. Specifically, the raw materials including the polyolefin resin and the above composition are granulated to obtain polyolefin resin particles; and the polyolefin resin particles are injection molded to obtain the polyolefin resin composition.

[0128] The raw materials including the polyolefin resin and the composition can be mixed to obtain a mixture. The mixture is melted and kneaded, and then granulated. In certain embodiments, before the composition is mixed with the polyolefin resin, the components in the composition need to be mixed uniformly.

[0129] The granulation temperature may be 150 to 350° C. In certain embodiments, the granulation temperature is preferably 200 to 300° C.

[0130] The injection molding temperature may be 150 to 350°C; preferably 170 to 300°C; more preferably 180 to 200°C.

[0131] Extrusion

[0132] The raw material including the polyolefin resin and the composition is extruded at 150-350°C to obtain the polyolefin resin composition. Preferably, the raw material including the polyolefin resin and the composition is extruded at 200-300°C.

[0133] <Applications for reducing haze and / or processing temperature>

[0134] The present invention provides a use of a composition in reducing the haze and / or processing temperature in a polyolefin resin. The composition comprises compound A, compound B, compound C and compound D. In certain embodiments, the composition consists of compound A, compound B, compound C and compound D. The composition of the present invention can achieve a good haze reduction effect at a wider processing temperature after being added to a polyolefin resin. In particular, the composition of the present invention can achieve a good haze reduction effect at a lower processing temperature after being added to a polyolefin resin. The processing temperature may be 150 to 350°C; preferably 170 to 300°C. In certain embodiments, the processing temperature is 180 to 200°C. The processing temperature may be a molding processing temperature. For example, injection molding temperature, extrusion temperature, etc.

[0135] The compound A of the present invention is shown in formula (A):

[0136]

[0137] Among them, R 1 and R 2 are independently selected from halogen. 1 and R 2 R is independently selected from F, Cl, Br and I. 1 and R 2 can be the same or different. Preferably, R 1 and R 2 More preferably, R 1 and R 2 All are Cl.

[0138] R 1 It can be substituted at the meta or para position of the benzene ring. 1 Located in the para position of the benzene ring. 2 It can be substituted at the meta or para position of the benzene ring. 2 Located in the para position of the benzene ring.

[0139] According to one embodiment of the present invention, compound A is as follows:

[0140]

[0141] Specifically, compound A is represented by formula (I):

[0142]

[0143] The name of compound A is 1,3:2,4-bis-O-((4-chlorophenyl)methylene)-D-sorbitol.

[0144] The compound B of the present invention is shown in formula (B):

[0145]

[0146] Among them, R 3 ~R 6 are independently selected from C1 to C6 alkyl groups; preferably, R 3 ~R 6 R are independently selected from C1 to C3 alkyl groups. 3 ~R 6 The propyl group may be independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl. Examples of propyl groups include, but are not limited to, n-propyl and isopropyl. Examples of butyl groups include, but are not limited to, n-butyl, isobutyl, sec-butyl and tert-butyl. Examples of pentyl groups include, but are not limited to, n-pentyl, 2-methylbutyl, 3-methylbutyl, 1-ethylpropyl, 2-ethylpropyl, 2,3-dimethylpropyl and 2,2-dimethylpropyl. Examples of hexyl groups include, but are not limited to, n-hexyl, 2-methylpentyl, 3-methylpentyl, 2,3-dimethylbutyl and 2,2-dimethylbutyl.

[0147] R 3 ~R 6 can be the same or different. Preferably, R 3 ~R 6 More preferably, R 3 ~R 6 All are methyl.

[0148] According to one embodiment of the present invention, compound B is as follows:

[0149]

[0150] Specifically, compound B is represented by formula (II):

[0151]

[0152] The name of compound B is 1,3:2,4-di(3,4-dimethylbenzylidene)-D-sorbitol.

[0153] In the composition of the present invention, the total content of compound A and compound B is greater than or equal to 10 wt % and less than or equal to 90 wt %.

[0154] In some embodiments, the total content of compound A and compound B is greater than or equal to 30 wt %. In other embodiments, the total content of compound A and compound B is greater than or equal to 50 wt %. In still other embodiments, the total content of compound A and compound B is greater than or equal to 60 wt %.

[0155] In some embodiments, the total content of compound A and compound B is less than or equal to 80wt%. In some embodiments, the total content of compound A and compound B is less than or equal to 70wt%. In other embodiments, the total content of compound A and compound B is less than or equal to 60wt%. In still other embodiments, the total content of compound A and compound B is less than or equal to 50wt%. In still other embodiments, the total content of compound A and compound B is less than or equal to 40wt%.

[0156] By controlling the contents of compound A and compound B within the above ranges, the haze and processing temperature of the polyolefin resin can be effectively reduced.

[0157] The mass ratio of compound A to compound B may be 1:(0.3-8); preferably 1:(0.5-6); more preferably 1:(0.8-5); and most preferably 1:(0.9-1.2).

[0158] The compound C of the present invention is shown in formula (C):

[0159]

[0160] Among them, R 7 Selected from halogen, R 8 and R 9 Each is independently selected from a C1 to C6 alkyl group.

[0161] Preferably, R 7 is selected from F, Cl, Br and I. According to one embodiment of the present invention, R 7 For Cl.

[0162] Preferably, R 8 and R 9 R are independently selected from C1 to C3 alkyl groups. 8 and R 9 R may be independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl. Examples of propyl include, but are not limited to, n-propyl and isopropyl. Examples of butyl include, but are not limited to, n-butyl, isobutyl, sec-butyl and tert-butyl. Examples of pentyl include, but are not limited to, n-pentyl, 2-methylbutyl, 3-methylbutyl, 1-ethylpropyl, 2-ethylpropyl, 2,3-dimethylpropyl and 2,2-dimethylpropyl. Examples of hexyl include, but are not limited to, n-hexyl, 2-methylpentyl, 3-methylpentyl, 2,3-dimethylbutyl and 2,2-dimethylbutyl. 8 and R 9 can be the same or different. Preferably, R 8 and R 9 More preferably, R 8 and R 9 All are methyl.

[0163] According to one embodiment of the present invention, compound C is as follows:

[0164]

[0165] Specifically, compound C is represented by formula (III):

[0166]

[0167] The name of compound C is 1,3-(3,4-dimethylbenzylidene)-2,4-p-chlorobenzylidene-D-sorbitol.

[0168] The compound D of the present invention is shown in formula (D):

[0169]

[0170] Among them, R 10 and R 11 are independently selected from C1 to C6 alkyl groups, R 12 Selected from halogen.

[0171] Preferably, R 12 is selected from F, Cl, Br and I. According to one embodiment of the present invention, R 12 For Cl.

[0172] Preferably, R 10 and R 11 R are independently selected from C1 to C3 alkyl groups. 10 and R 11 R may be independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl. Examples of propyl include, but are not limited to, n-propyl and isopropyl. Examples of butyl include, but are not limited to, n-butyl, isobutyl, sec-butyl and tert-butyl. Examples of pentyl include, but are not limited to, n-pentyl, 2-methylbutyl, 3-methylbutyl, 1-ethylpropyl, 2-ethylpropyl, 2,3-dimethylpropyl and 2,2-dimethylpropyl. Examples of hexyl include, but are not limited to, n-hexyl, 2-methylpentyl, 3-methylpentyl, 2,3-dimethylbutyl and 2,2-dimethylbutyl. 10 and R 11 can be the same or different. Preferably, R 10 and R 11 More preferably, R 10 and R 11 All are methyl.

[0173] According to one embodiment of the present invention, compound D is as follows:

[0174]

[0175] Specifically, compound D is represented by formula (IV):

[0176]

[0177] The name of compound D is 1,3-p-chlorobenzylidene-2,4-(3,4-dimethylbenzylidene)-D-sorbitol.

[0178] In the composition of the present invention, the total content of compound C and compound D is greater than or equal to 10 wt %.

[0179] In certain embodiments, the total content of compound C and compound D is greater than or equal to 30wt%. In other embodiments, the total content of compound C and compound D is greater than or equal to 40wt%. In still other embodiments, the total content of compound C and compound D is greater than or equal to 50wt%. In still other embodiments, the total content of compound C and compound D is greater than or equal to 60wt%.

[0180] In some embodiments, the total content of compound C and compound D is less than or equal to 90wt%. In some embodiments, the total content of compound C and compound D is less than or equal to 80wt%. In other embodiments, the total content of compound C and compound D is less than or equal to 70wt%. In still other embodiments, the total content of compound C and compound D is less than or equal to 60wt%. In still other embodiments, the total content of compound C and compound D is less than or equal to 50wt%.

[0181] By controlling the contents of compound C and compound D within the above ranges, the haze and processing temperature of the polyolefin resin can be effectively reduced.

[0182] The mass ratio of compound C to compound D is 1:(0.5-2); preferably 1:(0.8-1.5); more preferably 1:(0.9-1.2).

[0183] The haze of the polyolefin composition of the present invention is less than or equal to 11%, preferably less than or equal to 8.5%, more preferably less than or equal to 5.5%. In certain embodiments, the haze is 3% to 11%, preferably 4% to 9%, more preferably 5% to 6%. The haze is measured using a haze meter in accordance with GB / T 2410-2008, and the sample is a sheet with a thickness of 1 mm.

[0184] The polyolefin resin of the present invention can be selected from one or more of polyethylene, polypropylene, and polybutene. Preferably, the polyolefin resin is a polypropylene resin. The polypropylene resin can be isotactic polypropylene, atactic polypropylene, or syndiotactic polypropylene. Polypropylene has better compatibility with the composition of the present invention and can better play the role of the composition.

[0185] Based on the mass of the polyolefin resin, the amount of the composition can be 0.1 to 0.5 wt %; preferably 0.15 to 0.4 wt %; more preferably 0.2 to 0.35 wt %; most preferably 0.3 to 0.35 wt %.

[0186] Here are the raw materials:

[0187] Polypropylene resin: MT20 powder produced by Sinopec Zhongyuan Petrochemical Co., Ltd. has a melt index of 18-22g / 10min and an ethylene content of less than 5%.

[0188] Preparation Example 1

[0189] 18.2 g of sorbitol powder, 13.4 g of 3,4-dimethylbenzaldehyde, 14.3 g of p-chlorobenzaldehyde, 200 mL of cyclohexane, 50 mL of methanol and 2.0 g of p-toluenesulfonic acid were added to a reaction tank, the temperature was raised, and the generated water and methanol were discharged out of the system under reflux. The reaction was carried out for 1.5 hours, and then cooled, neutralized, washed with water, filtered and dried to obtain a composition.

[0190] The composition was analyzed by gas chromatography. The composition consisted of 52 wt% of a mixture of 1,3-(3,4-dimethylbenzylidene)-2,4-p-chlorobenzylidene-D-sorbitol and 1,3-p-chlorobenzylidene-2,4-(3,4-dimethylbenzylidene)-D-sorbitol, 23 wt% of 1,3:2,4-di(3,4-dimethylbenzylidene)-D-sorbitol and 25 wt% of 1,3:2,4-bis-O-((4-chlorophenyl)methylene)-D-sorbitol.

[0191] Example 1

[0192] 0.2 parts by weight of the composition of Preparation Example 1, 0.01 parts by weight of ultramarine blue and 100 parts by weight of polypropylene resin were uniformly mixed to obtain a mixture. The mixture was added to an extruder, and the temperature of the extruder was set to 240° C. The mixture was melted in the extruder and flowed out from the extruder die, and was formed by cooling with cold water to obtain a polyolefin resin composition (a linear object with a diameter of about 3 to 5 mm). The obtained polyolefin resin composition was observed to see whether it contained bubbles. The results are shown in Table 1.

[0193] Comparative Example 1

[0194] Except that the composition of Preparation Example 1 was replaced by 1,3:2,4-di(3,4-dimethylbenzylidene)-D-sorbitol, the rest was the same as Example 1. The polyolefin resin composition was observed to see whether it contained bubbles. The results are shown in Table 1.

[0195] Comparative Example 2

[0196] Except that the composition of Preparation Example 1 was replaced by 1,3:2,4-bis-O-((4-chlorophenyl)methylene)-D-sorbitol, the rest was the same as Example 1. The polyolefin resin composition was observed to see whether it contained bubbles. The results are shown in Table 1.

[0197] Table 1

[0198] Serial number Whether it contains bubbles Example 1 — Comparative Example 1 + Comparative Example 2 +

[0199] Note: “—” indicates no bubbles, and “+” indicates bubbles.

[0200] It can be seen from Table 1 that the composition of the present invention can significantly reduce the content of bubbles in the polyolefin resin composition, and the obtained polyolefin resin composition has no bubbles.

[0201] Example 2

[0202] 100 parts by weight of polypropylene resin, 0.2 parts by weight of the composition of Preparation Example 1 and 0.01 parts by weight of ultramarine blue were uniformly mixed in a stirrer to obtain a mixture, which was melted and kneaded, and then granulated at 220° C. to obtain polyolefin resin particles.

[0203] The polyolefin resin pellets were injection-molded in an injection molding machine to obtain a polyolefin resin composition (sheet having a thickness of 1 mm). The temperature of the injection molding machine was set to 190°C.

[0204] The haze was tested according to the method specified in GB / T 2410-2008, and the results are shown in Table 2.

[0205] Example 3

[0206] Except that the temperature of the injection molding machine was set to 230° C., the rest was the same as in Example 1. The haze was tested according to the method specified in GB / T2410-2008, and the results are shown in Table 2.

[0207] Comparative Example 3

[0208] Except that the composition of Preparation Example 1 is replaced by 1,3:2,4-di(3,4-dimethylbenzylidene)-D-sorbitol, the rest is the same as Example 1. The haze is tested according to the method specified in GB / T 2410-2008, and the results are shown in Table 2.

[0209] Comparative Example 4

[0210] Except that the temperature of the injection molding machine is set to 230° C., the rest is the same as that of Comparative Example 3. The haze is tested according to the method specified in GB / T2410-2008, and the results are shown in Table 2.

[0211] Comparative Example 5

[0212] Except that the composition of Preparation Example 1 was replaced by 1,3:2,4-bis-O-((4-chlorophenyl)methylene)-D-sorbitol, the rest was the same as Example 1. The haze was tested according to the method specified in GB / T 2410-2008, and the results are shown in Table 2.

[0213] Comparative Example 6

[0214] Except that the temperature of the injection molding machine is set to 230° C., the rest is the same as that of Comparative Example 5. The haze is tested according to the method specified in GB / T2410-2008, and the results are shown in Table 2.

[0215] Comparative Example 7

[0216] 100 parts by weight of a polypropylene resin was melted and kneaded, and then granulated at 220° C. to obtain polyolefin resin pellets.

[0217] The polyolefin resin pellets were injection molded in an injection molding machine to obtain a polyolefin resin sheet (thickness: 1 mm). The temperature of the injection molding machine was set to 190°C.

[0218] The haze was tested according to the method specified in GB / T 2410-2008, and the results are shown in Table 2.

[0219] Comparative Example 8

[0220] Except that the temperature of the injection molding machine is set to 230° C., the rest is the same as that of Comparative Example 7. The haze is tested according to the method specified in GB / T2410-2008, and the results are shown in Table 2.

[0221] Table 2

[0222] Haze(%) Example 2 10.3 Example 3 10.6 Comparative Example 3 22.1 Comparative Example 4 11.4 Comparative Example 5 13.6 Comparative Example 6 13.8 Comparative Example 7 40.4 Comparative Example 8 41.3

[0223] As shown in Table 2, the composition of the present invention can effectively reduce the haze of polypropylene resin, especially the haze of polyolefin resin composition obtained under low temperature injection molding conditions, and the haze can be reduced by more than 70%.

[0224] The present invention is not limited to the above-mentioned embodiments. Without departing from the essential content of the present invention, any deformation, improvement and substitution that can be conceived by those skilled in the art shall fall within the scope of the present invention.

Claims

1. Use of a composition for reducing the bubble content in a polyolefin resin, characterized in that: The composition comprises the following components: (1) Compound A represented by formula (A): Wherein, R1 and R2 are independently selected from halogen; (2) Compound B represented by formula (B): Wherein, R3 to R6 are independently selected from C1 to C6 alkyl groups; (3) Compound C represented by formula (C): wherein R7 is selected from halogen, and R8 and R9 are independently selected from C1 to C6 alkyl groups; (4) Compound D represented by formula (D): Among them, R 10 and R 11 are independently selected from C1 to C6 alkyl groups, R 12 Selected from halogen.

2. The use according to claim 1, characterized in that R1 and R2 are independently selected from F, Cl, Br and I, said R1 is located at the para position of the benzene ring, and said R2 is located at the para position of the benzene ring; R3 to R5 are independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl; R7 is selected from F, Cl, Br and I, R8 and R9 are independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl; R 10 and R 11 R are independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl; 12 Selected from F, Cl, Br and I.

3. The use according to claim 1, characterized in that Based on the total mass of the composition, the total content of compound A and compound B is greater than or equal to 10 wt % and less than or equal to 90 wt %.

4. The use according to claim 1, characterized in that Based on the total mass of the composition, the total content of the compound C and the compound D is greater than or equal to 10 wt %.

5. The use according to claim 1, characterized in that: Compound A is shown in formula (I): Compound B is shown in formula (II): Compound C is shown in formula (III): Compound D is shown in formula (IV):

6. The use according to any one of claims 1 to 5, characterized in that: Based on the mass of the polyolefin resin, the amount of the composition is 0.1-0.5 wt%.

7. The use according to claim 6, characterized in that The polyolefin resin is selected from one or more of polyethylene, polypropylene and polybutene.

8. A method for preparing a polyolefin resin composition, characterized in that: The steps include: Provided is a composition comprising the following components: (1) Compound A represented by formula (A): Wherein, R1 and R2 are independently selected from halogen; (2) Compound B represented by formula (B): Wherein, R3 to R6 are independently selected from C1 to C6 alkyl groups; (3) Compound C represented by formula (C): wherein R7 is selected from halogen, and R8 and R9 are independently selected from C1 to C6 alkyl groups; (4) Compound D represented by formula (D): Among them, R 10 and R 11 are independently selected from C1 to C6 alkyl groups, R 12 is selected from halogen; The raw material including the polyolefin resin and the composition is granulated to obtain polyolefin resin particles, and the polyolefin resin particles are injection molded at 150-350° C. to obtain a polyolefin resin composition; or the raw material including the polyolefin resin and the composition is extruded at 150-350° C. to obtain a polyolefin resin composition.

9. Use of a composition for reducing the haze and / or processing temperature of a polyolefin resin, characterized in that: The composition comprises the following components: (1) Compound A represented by formula (A): Wherein, R1 and R2 are independently selected from halogen; (2) Compound B represented by formula (B): Wherein, R3 to R6 are independently selected from C1 to C6 alkyl groups; (3) Compound C represented by formula (C): wherein R7 is selected from halogen, and R8 and R9 are independently selected from C1 to C6 alkyl groups; (4) Compound D represented by formula (D): Among them, R 10 and R 11 are independently selected from C1 to C6 alkyl groups, R 12 Selected from halogen.

10. The use according to claim 9, characterized in that R1 and R2 are independently selected from F, Cl, Br and I, said R1 is located at the para position of the benzene ring, and said R2 is located at the para position of the benzene ring; R3 to R5 are independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl; R7 is selected from F, Cl, Br and I, R8 and R9 are independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl; R 10 and R 11 R are independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl; 12 Selected from F, Cl, Br and I.

Images