Device and method for controlling heating or cooling rate of plate

Abstract

The invention provides a device and a method for controlling the heating or cooling rate of a plate. The control device comprises a first heat conduction block and a second heat conduction block, and the heat conduction face of the first heat conduction block and the heat conduction face of the second heat conduction block are used for being attached to the two sides of a to-be-treated plate correspondingly and are oppositely arranged. The temperature control structure is used for controlling the temperature of the first heat conduction block and the temperature of the second heat conduction block. The first heat conduction block is detachably arranged on the first mounting part, and the second heat conduction block is detachably arranged on the second mounting part; the second mounting part is used for bearing a to-be-treated plate; the first mounting part is movably arranged relative to the second mounting part so as to move to the avoiding position where the first heat conduction block and the to-be-treated plate can avoid each other or the attaching position where the first heat conduction block and the to-be-treated plate can be attached to each other. According to the technical scheme, the technical problem that in the prior art, the heat treatment rate of plate temperature control equipment is low can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of plate heat treatment, and in particular to a device and method for controlling the heating or cooling rate of a plate. Background Art

[0002] At present, in the process of industrial and laboratory heat treatment, the temperature control equipment of the plate generally adopts a box-type air heating furnace, a roller bottom heating furnace or a continuous air cushion heating furnace.

[0003] However, roller bottom heating furnace processing equipment mainly transfers heat through contact between air and plate, and the general heat transfer coefficient range is 40-120W / (m*℃), and its heating or cooling rate for plate is relatively low. The heat transfer coefficient of continuous air cushion heating furnace is 100-120W / (m*℃), and its heating rate is relatively fast, but its equipment is large and expensive, and it is difficult for laboratory environment to have the conditions for configuring this type of equipment. Existing laboratory environment is usually equipped with box-type air heating furnace as heat treatment equipment for plate, but the heat transfer coefficient of box-type air heating furnace is in the range of 10-30W / (m*℃), which cannot simulate the heating conditions of air cushion heating furnace and is difficult to meet experimental requirements. Summary of the invention

[0004] The main purpose of the present invention is to provide a device and method for controlling the heating or cooling rate of a plate, so as to solve the technical problem of low heat treatment rate of the temperature control equipment of the plate in the prior art.

[0005] In order to achieve the above object, according to one aspect of the present invention, a device for controlling the heating or cooling rate of a plate is provided, comprising:

[0006] A first heat-conducting block and a second heat-conducting block, wherein the heat-conducting surface of the first heat-conducting block and the heat-conducting surface of the second heat-conducting block are arranged opposite to each other; the heat-conducting surface of the first heat-conducting block and the heat-conducting surface of the second heat-conducting block are respectively used to be attached to two sides of the plate to be processed;

[0007] A temperature control structure, the first heat conducting block and the second heat conducting block are both connected to the temperature control structure, and the temperature control structure is used to control the temperature of the first heat conducting block and the temperature of the second heat conducting block;

[0008] The mounting assembly includes a first mounting portion and a second mounting portion that are interconnected, wherein the first heat conductive block is detachably disposed on the first mounting portion, and the second heat conductive block is detachably disposed on the second mounting portion; the second mounting portion is used to carry a plate to be processed; the first mounting portion is movably disposed relative to the second mounting portion to move to an avoidance position where the first heat conductive block and the plate to be processed avoid each other or to a fitting position where the first heat conductive block and the plate to be processed fit each other.

[0009] Further, the mounting assembly further comprises a connecting rod structure, one end of the connecting rod structure is rotatably connected to the first mounting portion, and the other end of the connecting rod structure is rotatably connected to the second mounting portion; and / or,

[0010] A first mounting groove is provided on a side of the first mounting portion close to the second mounting portion, and the first heat conducting block is detachably provided in the first mounting groove; a second mounting groove is provided on a side of the second mounting portion close to the first mounting portion, and the second heat conducting block is detachably provided in the second mounting groove; and / or,

[0011] The mounting assembly further comprises an operating portion, which is arranged on a side of the first mounting portion away from the first heat conducting block; the operating portion is arranged to protrude from the surface of the first mounting portion.

[0012] Further, the first heat-conducting block and the second heat-conducting block are made of the same material; or, the thermal conductivity of the first heat-conducting block and the thermal conductivity of the second heat-conducting block are different; and / or,

[0013] Along the direction from the first heat-conducting block to the second heat-conducting block, the ratio of the thickness of the first heat-conducting block to the thickness of the plate to be processed is greater than 4; and / or,

[0014] Along the direction from the first heat-conducting block to the second heat-conducting block, the ratio of the thickness of the second heat-conducting block to the thickness of the plate to be processed is greater than 4.

[0015] Furthermore, the first heat-conducting block is made of metal material, ceramic material or polymer material; and / or the second heat-conducting block is made of metal material, ceramic material or polymer material.

[0016] Furthermore, the control device also includes:

[0017] The pressure adjustment component, the first mounting part and the second mounting part are both connected to the pressure adjustment component, and the pressure adjustment component is used to adjust the contact pressure between the first heat conductive block and the plate to be processed and / or the contact pressure between the second heat conductive block and the plate to be processed.

[0018] Furthermore, the control device also includes:

[0019] The first temperature detection member and the second temperature detection member are both connected to the temperature control structure; the detection end of the first temperature detection member is arranged on the heat-conducting surface of the first heat-conducting block, and the detection end of the second temperature detection member is arranged on the heat-conducting surface of the second heat-conducting block, so as to adjust the temperature of the first heat-conducting block and the temperature of the second heat-conducting block according to the detection results of the first temperature detection member and the second temperature detection member;

[0020] The temperature recorder, the first temperature detection component and the second temperature detection component are both connected to the temperature recorder; the temperature recorder is connected to the temperature control structure.

[0021] Furthermore, the control device also includes:

[0022] A plurality of first pressure detecting parts and a plurality of second pressure detecting parts are all connected to the temperature control structure; the detecting ends of the plurality of first pressure detecting parts are evenly spaced on the heat-conducting surface of the first heat-conducting block and are all used to detect the contact pressure between the heat-conducting surface of the first heat-conducting block and the plate to be processed; the detecting ends of the plurality of second pressure detecting parts are evenly spaced on the heat-conducting surface of the second heat-conducting block and are all used to detect the contact pressure between the heat-conducting surface of the second heat-conducting block and the plate to be processed, so as to adjust the temperatures of the first heat-conducting block and the second heat-conducting block according to the detection results of the first pressure detecting parts and the second pressure detecting parts.

[0023] According to another aspect of the present invention, a method for controlling the heating or cooling rate of a plate is provided, which is applicable to the device for controlling the heating or cooling rate of a plate provided above. The method for controlling the heating or cooling rate of a plate comprises:

[0024] Placing the plate to be processed between the first heat-conducting block of the control device and the second heat-conducting block of the control device, and placing the heat-conducting surface of the first heat-conducting block and the heat-conducting surface of the second heat-conducting block on both sides of the plate to be processed respectively;

[0025] Adjusting the temperature of the first heat conducting block and the temperature of the second heat conducting block;

[0026] The temperatures of both sides of the plate to be processed are obtained, and the temperatures of the first heat conducting block and the second heat conducting block are adjusted according to the changes in the temperatures of both sides of the plate to be processed.

[0027] Furthermore, before placing the plate to be processed between the first heat-conducting block of the control device and the second heat-conducting block of the control device, the control method further comprises:

[0028] The first heat-conducting block is placed in a first initial temperature environment, and the second heat-conducting block is placed in a second initial temperature environment, so that the temperature of the first heat-conducting block reaches the first initial temperature and the temperature of the second heat-conducting block reaches the second initial temperature.

[0029] Further, the control device is the control device provided above; the control method further includes: obtaining the contact pressure between the heat conducting surface of the first heat conducting block and the plate to be processed and the contact pressure between the heat conducting surface of the second heat conducting block and the plate to be processed; after obtaining the contact pressure between the heat conducting surface of the first heat conducting block and the plate to be processed and the contact pressure between the heat conducting surface of the second heat conducting block and the plate to be processed, the control method further includes:

[0030] Determine the portion of the first heat-conducting block's heat-conducting surface where the contact pressure between the heat-conducting surface of the first heat-conducting block and the plate to be processed is greater than a preset pressure and the portion of the second heat-conducting block's heat-conducting surface where the contact pressure between the heat-conducting surface of the second heat-conducting block and the plate to be processed is greater than the preset pressure, so as to obtain the first portion to be adjusted; when the plate to be processed is subjected to heating treatment, the temperature of the first portion to be adjusted is lower than the target temperature; when the plate to be processed is subjected to cooling treatment, the temperature of the first portion to be adjusted is greater than the target temperature; and / or,

[0031] Determine the portion of the first heat-conducting block's heat-conducting surface where the contact pressure between the heat-conducting surface of the first heat-conducting block and the plate to be processed is less than a preset pressure and the portion of the second heat-conducting block's heat-conducting surface where the contact pressure between the heat-conducting surface of the second heat-conducting block and the plate to be processed is less than the preset pressure, so as to obtain the second portion to be adjusted; when the plate to be processed is subjected to heating treatment, the temperature of the second portion to be adjusted is made greater than the target temperature; when the plate to be processed is subjected to cooling treatment, the temperature of the second portion to be adjusted is made less than the target temperature.

[0032] By applying the technical solution of the present invention, the temperature of the plate during heating or cooling can be uniformly controlled, and the deformation or stress problem of the plate caused by uneven temperature can be effectively avoided. The plate is suitable for the heat treatment process of various plates, such as metal plates, ceramic plates, polymer plates, etc. This design not only improves the uniformity of plate treatment, but also makes the maintenance and replacement of the heat-conducting blocks more convenient due to the detachable setting of the first heat-conducting block and the second heat-conducting block, greatly improving the service life and economic benefits of the device, and heat-conducting blocks with different thermal conductivity coefficients can be selected according to the requirements of temperature control, so that the plate to be treated can be heated or cooled according to a certain temperature change rate. In practical applications, this device can significantly improve the heat treatment efficiency of the plate, reduce the damage to the plate caused by improper heat treatment, and is suitable for high-tech industries that require precise temperature control, such as aerospace, precision instrument manufacturing, etc. Therefore, through the technical solution of the present invention, the technical problem of low heat treatment rate of the temperature control equipment of the plate in the prior art can be solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0034] Figure 1 It shows a schematic structural diagram of a device for controlling the heating or cooling rate of a plate provided in accordance with the first embodiment of the present invention;

[0035] Figure 2A recorded curve diagram showing temperature changes of plates of different thicknesses using the plate heating or cooling rate control device provided in the first embodiment of the present invention;

[0036] Figure 3 A schematic diagram of the steps of a method for controlling the heating or cooling rate of a plate provided in accordance with the second embodiment of the present invention is shown.

[0037] The above drawings include the following reference numerals:

[0038] 1. Plates to be processed;

[0039] 11. a first heat conducting block; 12. a second heat conducting block;

[0040] 20. Install components;

[0041] 21. A first mounting portion;

[0042] 22. A second mounting portion;

[0043] 23. Connecting rod structure;

[0044] 24. Operation department;

[0045] 25. Support platform. DETAILED DESCRIPTION

[0046] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0047] like Figure 1 and Figure 2 As shown, the first embodiment of the present invention provides a control device for the heating or cooling rate of a plate, the control device comprises a first heat conducting block 11 and a second heat conducting block 12, the heat conducting surface of the first heat conducting block 11 and the heat conducting surface of the second heat conducting block 12 are arranged opposite to each other; the heat conducting surface of the first heat conducting block 11 and the heat conducting surface of the second heat conducting block 12 are respectively used to be attached to the two sides of the plate 1 to be processed. The control device also comprises a temperature control structure, the first heat conducting block 11 and the second heat conducting block 12 are both connected to the temperature control structure, and the temperature control structure is used to control the temperature of the first heat conducting block 11 and the temperature of the second heat conducting block 12. The control device also includes an installation component 20, which includes a first installation part 21 and a second installation part 22 that are connected to each other. The first heat-conducting block 11 is detachably arranged on the first installation part 21, and the second heat-conducting block 12 is detachably arranged on the second installation part 22; the second installation part 22 is used to carry the plate 1 to be processed; the first installation part 21 is movably arranged relative to the second installation part 22 to move to an avoidance position where the first heat-conducting block 11 and the plate 1 to be processed avoid each other or to a fitting position where the first heat-conducting block 11 and the plate 1 to be processed fit each other.

[0048] By using the plate heating or cooling rate control device provided in the first embodiment of the present invention, the temperature of the plate during the heating or cooling process can be uniformly controlled, and the deformation or stress problem of the plate caused by uneven temperature can be effectively avoided. It is suitable for the heat treatment process of various plates, such as metal plates, ceramic plates, polymer plates, etc. This design not only improves the uniformity of plate treatment, but also makes the maintenance and replacement of the heat conducting blocks more convenient due to the detachable setting of the first heat conducting block 11 and the second heat conducting block 12, greatly improving the service life and economic benefits of the device, and it is also possible to select heat conducting blocks with different thermal conductivity coefficients according to the requirements of temperature control, so that the plate 1 to be treated can be heated or cooled at a certain temperature change rate. In practical applications, this device can significantly improve the heat treatment efficiency of the plate, reduce the damage to the plate caused by improper heat treatment, and is suitable for high-tech industries that require precise temperature control, such as aerospace, precision instrument manufacturing, etc. Therefore, the plate heating or cooling rate control device provided in this embodiment can solve the technical problem of low heat treatment rate of the plate temperature control device in the prior art.

[0049] Specifically, the heat conducting surface of the first heat conducting block 11 and the heat conducting surface of the second heat conducting block 12 are both planes. The plate 1 to be processed is a plane structure. In this way, using a plane as a heat conducting surface can ensure that the plate 1 to be processed has the largest area of ​​contact with the first heat conducting block 11 and the second heat conducting block 12, thereby maximizing the heat conduction efficiency. The plane design also helps to achieve uniform surface temperature of the plate, avoids the temperature gradient of the plate caused by poor contact or uneven heat transfer, and ensures the consistency and uniformity of the heating or cooling process of the plate.

[0050] Specifically, the plate 1 to be processed can be a plate of a single material or a composite material. Specifically, the plate 1 to be processed is an aluminum alloy plate. With such a setting, the plate 1 to be processed can be made of a single material or a composite material, which expands the application scope of this embodiment and is suitable for different industrial fields and experimental needs.

[0051] Specifically, the outer dimensions of the plate 1 to be processed are smaller than or equal to the smaller one of the heat conducting surface dimensions of the first heat conducting block 11 and the second heat conducting block 12. With such a structural setting, it is possible to ensure that the plate 1 to be processed can be completely covered by the first heat conducting block 11 and the second heat conducting block 12 by specifying the outer dimensions of the plate 1 to be processed, which is conducive to close contact between the heat source and the plate, reduces energy loss during heat conduction, and improves the efficiency of the entire heating or cooling system.

[0052] Specifically, the thickness range of the plate 1 to be processed is 0-200 mm (excluding 0 mm and including 200 mm). In this way, setting the thickness range of the plate 1 to be processed can cover a variety of application scenarios from extremely thin plates to medium-thick plates, so that the device can adapt to the heating or cooling requirements of plates of different thicknesses, increasing the flexibility and practicality of the device.

[0053] Specifically, the mounting assembly 20 further includes a support platform 25, which is disposed on a side of the second mounting portion 22 close to the first mounting portion 21 and protrudes from the second mounting portion 22. The support platform 25 is used to support the first mounting portion 21 so as to form a gap between the first mounting portion 21 and the second mounting portion 22 for accommodating the plate 1 to be processed. When the first mounting portion 21 is in a evasive position so that the first heat conductive block 11 and the plate 1 to be processed avoid each other, the first mounting portion 21 is located on the support platform 25 and abuts against the support platform 25. With such a structural arrangement, a stable gap is ensured between the first mounting portion 21 and the second mounting portion 22, which facilitates the accurate placement of the plate 1 to be processed. This design helps to protect the first heat conductive block 11 and the second heat conductive block 12 and reduce the problem of structural instability caused by improper placement.

[0054] In this embodiment, the mounting assembly 20 further includes a connecting rod structure 23, one end of which is rotatably connected to the first mounting portion 21, and the other end of which is rotatably connected to the second mounting portion 22. With such a structural arrangement, the first heat conducting block 11 and the second heat conducting block 12 can quickly and stably contact or separate from the plate 1 to be processed through the rotatable connection design of the connecting rod structure 23, thereby improving the operating efficiency and safety. At the same time, this design allows the contact state between the plate and the heat conducting block to be dynamically adjusted during the heating or cooling process to adapt to the thermal expansion coefficient of plates of different materials, ensure good thermal contact, and avoid affecting the heat transfer effect due to thermal deformation of the plate.

[0055] Specifically, the connecting rod structure 23 is composed of a plurality of connecting rods, and the two ends of each connecting rod are respectively connected to the first mounting portion 21 and the second mounting portion 22, forming an adjustable multi-connecting rod system. The number of connecting rods is determined according to the size of the plate 1 to be processed and the control requirements of the heating / cooling rate. Generally speaking, the more the number, the more stable the system. However, for small specimens, 2-4 (including 2 and 4) connecting rods can meet the requirements.

[0056] Specifically, the first mounting portion 21 and the second mounting portion 22 are both connected to the connecting rod by bolts. In this way, the first mounting portion 21 and the second mounting portion 22 are firmly connected to the connecting rod by bolt connection. At the same time, this connection method allows for quick disassembly or adjustment when necessary, thereby improving the structural stability and flexibility of the entire control device. By adopting bolt connection, connecting rods of different lengths or materials can be easily replaced to adapt to different experimental conditions or production requirements, thereby enhancing the adaptability and versatility of the control device.

[0057] Specifically, the length of the connecting rod is greater than the thickness of the plate 1 to be processed. With such a configuration, the control device can process plates of different thicknesses without frequent replacement of the connecting rod, thereby improving the versatility and efficiency of the device.

[0058] Specifically, the length of the connecting rod is greater than 10 mm.

[0059] Specifically, the connecting rod is made of high-strength, high-temperature resistant materials, such as stainless steel, high-temperature alloy or ceramic composite materials, to ensure the stability and safety of the structure in high-temperature environments. The bolt material also has corresponding high-temperature resistance and tensile strength.

[0060] Specifically, a safety locking structure, such as an anti-loosening nut or a snap-on structure, is provided at the connection between the connecting rod structure 23 and the first mounting portion 21 and at the connection between the connecting rod structure 23 and the second mounting portion 22 to prevent the connecting rod from loosening or falling off due to vibration or thermal changes during heating or cooling.

[0061] Specifically, a first mounting groove is provided on one side of the first mounting portion 21 close to the second mounting portion 22, and the first heat conducting block 11 is detachably provided in the first mounting groove; a second mounting groove is provided on one side of the second mounting portion 22 close to the first mounting portion 21, and the second heat conducting block 12 is detachably provided in the second mounting groove. With such a setting, the first heat conducting block 11 and the second heat conducting block 12 can be easily replaced by the design of the detachable heat conducting block, which means that heat conducting blocks of different materials, different thicknesses or with different surface treatments can be used to meet the heating or cooling requirements of various plates. This design greatly improves the flexibility of the device, enabling it to handle plates with different thermal properties from metals, ceramics to polymer materials, etc., to meet the needs of different experiments and industrial applications. In addition, the heat conducting block is stably fixed on the first mounting portion 21 and the second mounting portion 22 through the mounting groove, ensuring good contact between the plate and the heat conducting block, thereby improving the stability and uniformity of heat transfer. This is crucial to ensure the consistency of temperature changes during the heating or cooling of the plate, and helps to avoid degradation or deformation of the plate performance due to local overheating or insufficient cooling.

[0062] Specifically, the structure of the first heat conducting block 11 and the second heat conducting block 12 is a detachable standard module design, and the length of the standard module is 300 mm and the width is 200 mm. A plurality of standard modules can be combined and stacked for use. Specifically, a portion of the plurality of standard modules is made of different materials, and another portion of the plurality of standard modules is made of the same material. Specifically, a portion of the plurality of standard modules has a surface film layer made of different materials.

[0063] Specifically, the mounting assembly 20 further includes an operating portion 24, which is disposed on a side of the first mounting portion 21 away from the first heat conducting block 11; the operating portion 24 is disposed protruding from the surface of the first mounting portion 21. With such a structural arrangement, the arrangement of the operating portion 24 further simplifies the operating process, allowing the operator to quickly and accurately control the movement of the first heat conducting block 11, thereby improving work efficiency.

[0064] Specifically, the operating portion 24 is a handle structure. The handle structure includes a first operating member, a second operating member, and a third operating member connected in sequence, the first operating member and the third operating member are arranged opposite to each other, and the second operating member is arranged at a distance from the first mounting portion 21. In this way, the first mounting portion 21 can be easily moved by the handle structure.

[0065] Specifically, the first heat conducting block 11 and the second heat conducting block 12 are made of the same material. With such a setting, the selection of heat conducting blocks of the same material can ensure that the heat conduction characteristics between the two heat conducting blocks and the plate are consistent during the heat treatment process, which helps to maintain the temperature balance of the upper and lower surfaces of the plate, avoid the generation of temperature gradients, and thus ensure the uniformity of the heating or cooling process of the plate. This has an important impact on the organizational structure and mechanical properties of the plate, and helps to improve the quality of the final product.

[0066] Specifically, the thermal conductivity of the first heat-conducting block 11 is different from the thermal conductivity of the second heat-conducting block 12. With such a structural setting, the thermal conductivity of the two heat-conducting blocks is different. Such a design can be used to simulate or adjust the temperature distribution on the surface of the plate, and by controlling the rate and direction of heat transfer, the complex temperature curve can be precisely controlled to meet specific process requirements, such as achieving gradient heating or cooling in different areas of the plate, which is crucial for manufacturing plates with specific performance requirements or conducting experiments under relevant specific conditions.

[0067] Specifically, along the direction from the first heat-conducting block 11 to the second heat-conducting block 12, the ratio of the thickness of the first heat-conducting block 11 to the thickness of the plate 1 to be processed is greater than 4. With such a structural setting, increasing the thickness of the first heat-conducting block 11 can significantly improve its heat capacity and thermal stability, ensuring that the heat-conducting block can provide or absorb sufficient heat when contacting the plate, thereby accelerating the heating or cooling rate of the plate. In addition, the thick heat-conducting block can also reduce the poor contact caused by the thermal expansion or contraction of the plate, improve the heat transfer efficiency, and play an important role in ensuring the consistency of the temperature change of the plate during the heating or cooling process.

[0068] Specifically, along the direction from the first heat-conducting block 11 to the second heat-conducting block 12, the ratio of the thickness of the second heat-conducting block 12 to the thickness of the plate 1 to be treated is greater than 4. Such a structural setting ensures that the thickness of the second heat-conducting block 12 is large enough, and can also improve its heat capacity and thermal stability, so that the heat-conducting block can effectively transfer heat when in contact with the plate. This is particularly important for achieving rapid and stable heating or cooling of the plate. At the same time, a larger thickness ratio also helps to maintain the flatness of the plate during the heat treatment process and prevent the plate from deforming due to temperature changes.

[0069] Specifically, the first heat-conducting block 11 is made of a single material or a composite material. The second heat-conducting block 12 is made of a single material or a composite material. In this way, the heat-conducting block made of a single material has stable and predictable thermal conductivity, and can provide a consistent benchmark for the heating or cooling rates of different plates. This is conducive to the design and preset heating or cooling rate of the heat treatment process, ensuring an accurate temperature change curve, and improving the repeatability and consistency of the heat treatment. The heat-conducting block made of a composite material combines the characteristics of multiple materials and can achieve different thermal conductivity coefficients or thermal expansion coefficients in a single heat-conducting block, which makes it possible to achieve a gradient change in the surface temperature of the plate. The heat-conducting block made of a composite material can be designed to have different thermal characteristic areas according to the material and thickness of the plate, as well as the required heating or cooling rate, so as to accurately control the temperature change of the plate and meet specific heat treatment requirements.

[0070] Specifically, the first heat-conducting block 11 is made of metal material, ceramic material or polymer material. With such a setting, selecting the first heat-conducting block 11 made of different materials can significantly affect the heat exchange efficiency and temperature control accuracy during the heat treatment process. Metal materials can transfer heat quickly due to their high thermal conductivity, and are suitable for scenes requiring high heating or cooling rates, such as aluminum alloys, which can increase the upper limit of the speed of temperature change of the plate. Although the thermal conductivity of ceramic materials is relatively low, they have good high-temperature stability and are suitable for high-temperature heating processes, which can ensure the stability of the heat treatment environment. Polymer materials usually have lower thermal conductivity, but because of their light weight and insulating properties, they may be used in specific situations where low-temperature cooling or heat transfer needs to be reduced, such as avoiding excessive stress on the plate during the cooling process.

[0071] Specifically, the second heat-conducting block 12 is made of metal material, ceramic material or polymer material. With such a setting, the material selection of the second heat-conducting block 12 also affects the heat treatment effect. By adjusting the material of the second heat-conducting block 12, the temperature change curve of the plate can be further optimized to achieve more complex or more sophisticated temperature control. For example, in a heat treatment that requires a temperature gradient to be formed on the surface of the plate, the first heat-conducting block 11 and the second heat-conducting block 12 can be made of different materials. Through the difference in their thermal conductivity, the non-uniform change of the surface temperature of the plate can be achieved, thereby affecting the heat conduction and organizational structure changes inside the plate to meet specific manufacturing requirements. In addition, the choice of material can also affect the weight and structure of the heat-conducting block, and indirectly affect the stability of the plate during heating or cooling.

[0072] In this embodiment, the control device further includes a pressure adjustment component, and the first mounting portion 21 and the second mounting portion 22 are both connected to the pressure adjustment component, and the pressure adjustment component is used to adjust the contact pressure between the first heat-conducting block 11 and the plate to be processed 1 and / or the contact pressure between the second heat-conducting block 12 and the plate to be processed 1. With such a setting, the adjustment of the contact pressure directly affects the heat conduction efficiency between the heat-conducting block and the plate. A higher contact pressure can reduce the air gap and reduce the thermal resistance, thereby accelerating the heat transfer speed and increasing the heating or cooling rate; a lower contact pressure is suitable for situations where the heat transfer speed needs to be controlled to achieve a milder temperature change. Through the pressure adjustment component, the operator can accurately set the contact pressure according to the plate material, thickness and heat treatment process requirements, thereby achieving fine-tuning of the heat transfer process to meet specific temperature change requirements. And the existence of the pressure adjustment component enables the control device to adapt to a wider range of plate types, whether it is metal, ceramic, polymer material, or thin plate or thick plate, effective heat treatment can be achieved by adjusting the contact pressure. In addition, the pressure adjustment component can ensure that the contact state between the heat-conducting block and the plate is stable during the heat treatment process. This is crucial to prevent the sheet from warping or deforming when the temperature changes, helps maintain the flatness of the sheet, avoids affecting the heat transfer efficiency due to sheet deformation, and ensures the stability of the heat treatment process and the quality of the sheet after heat treatment.

[0073] Specifically, the pressure adjustment assembly may include one or more pneumatic cylinders, which may be fixed on the side or top of the first mounting portion 21 and the second mounting portion 22. Each pneumatic cylinder is connected to the first heat conductive block 11 or the second heat conductive block through a piston rod to achieve vertical pressure control of the heat conductive block. The pressure adjustment assembly also includes a precision air pressure regulating valve for controlling the air pressure in the pneumatic cylinder. By adjusting the air pressure, the air pressure regulating valve can change the thrust or pull of the piston rod, thereby adjusting the contact pressure between the heat conductive block and the plate to meet the heat treatment requirements of different plates. The pressure adjustment assembly can be designed as a manual adjustment mode, in which the operator manually adjusts the air pressure regulating valve to change the air pressure; it can also be designed as an automatic control mode, in which the air pressure regulating valve is automatically controlled by a preset program or an external signal to achieve fine-tuning of the pressure during automated heat treatment.

[0074] Specifically, the control device also includes a first temperature detection member and a second temperature detection member, both of which are connected to the temperature control structure; the detection end of the first temperature detection member is set on the heat-conducting surface of the first heat-conducting block 11, and the detection end of the second temperature detection member is set on the heat-conducting surface of the second heat-conducting block 12, so as to adjust the temperature of the first heat-conducting block 11 and the temperature of the second heat-conducting block 12 according to the detection results of the first temperature detection member and the second temperature detection member. The control device also includes a temperature recorder, and both the first temperature detection member and the second temperature detection member are connected to the temperature recorder; the temperature recorder is connected to the temperature control structure. In this way, through the setting of the first temperature detection member, the second temperature detection member and the recorder, the device can monitor and record the temperature changes on both sides of the plate in real time, provide data support for the subsequent optimization of heat treatment parameters, and is suitable for the plate heat treatment process that requires temperature curve analysis and optimization. By monitoring and recording the temperature changes on both sides of the plate in real time, the heat treatment process can be controlled more accurately, avoiding the degradation of plate performance caused by temperature fluctuations. This design is particularly important for industries that require accurate temperature curve analysis and optimization of heat treatment parameters. For example, in the manufacture of new energy batteries, the heat treatment process of battery materials needs to be strictly controlled to ensure the performance and safety of the battery. Through the cooperation of temperature detection components and recorders, heat treatment parameters can be adjusted in real time, heat treatment processes can be optimized, and the heat treatment effect of battery materials can be improved.

[0075] Specifically, a thermocouple is installed in a hole in the first heat-conducting block 11, and the thermocouple is connected to a temperature recorder so that the thermocouple contacts the surface of the plate 1 to be processed, and the surface temperature of one side of the plate 1 to be processed is measured and the change process is recorded. A thermocouple is installed in a hole in the second heat-conducting block 12, and the thermocouple is connected to a temperature recorder so that the thermocouple contacts the surface of the plate 1 to be processed, and the surface temperature of the other side of the plate 1 to be processed is measured and the change process is recorded.

[0076] Specifically, the control device further includes a plurality of first pressure detection members and a plurality of second pressure detection members, and the plurality of first pressure detection members and the plurality of second pressure detection members are connected to the temperature control structure; the detection ends of the plurality of first pressure detection members are evenly spaced on the heat-conducting surface of the first heat-conducting block 11 and are all used to detect the contact pressure between the heat-conducting surface of the first heat-conducting block 11 and the plate 1 to be processed; the detection ends of the plurality of second pressure detection members are evenly spaced on the heat-conducting surface of the second heat-conducting block 12 and are all used to detect the contact pressure between the heat-conducting surface of the second heat-conducting block 12 and the plate 1 to be processed, so as to adjust the temperature of the first heat-conducting block 11 and the second heat-conducting block 12 according to the detection results of the first pressure detection member and the second pressure detection member. In this way, by setting the pressure detection member, the local temperature in the process of heating or cooling the plate can be accurately controlled, the problem of uneven temperature caused by uneven local pressure can be effectively avoided, the accuracy and efficiency of plate processing can be improved, and it is suitable for plate heat treatment processes that require local temperature control, such as thermoforming, heat straightening, etc. During the hot forming and hot straightening process, local areas of the sheet need to withstand different pressures and temperatures. This design can accurately control the temperature of these local areas, thereby achieving accurate forming and straightening of the sheet, avoiding sheet deformation and precision reduction caused by uneven temperature. In microelectronics manufacturing and precision casting, this precise temperature and pressure control is even more essential, which can ensure the dimensional accuracy and surface quality of the product, and improve production efficiency and product competitiveness.

[0077] like Figure 3 As shown, embodiment 2 of the present invention provides a method for controlling the heating or cooling rate of a plate, which is applicable to the device for controlling the heating or cooling rate of a plate in embodiment 1. The method for controlling the heating or cooling rate of a plate comprises: placing a plate to be processed between a first heat-conducting block 11 of the control device and a second heat-conducting block 12 of the control device, and making the heat-conducting surface of the first heat-conducting block 11 and the heat-conducting surface of the second heat-conducting block 12 respectively attached to both sides of the plate 1 to be processed; adjusting the temperature of the first heat-conducting block 11 and the temperature of the second heat-conducting block 12; obtaining the temperatures of both sides of the plate 1 to be processed, and adjusting the temperatures of the first heat-conducting block 11 and the second heat-conducting block 12 according to the changes in the temperatures of both sides of the plate 1 to be processed.

[0078] By adopting the control method of the heating or cooling rate of the plate provided in the second embodiment of the present invention, the temperature of the plate during the heating or cooling process can be uniformly controlled, and the deformation or stress problem of the plate caused by uneven temperature can be effectively avoided. It is suitable for the heat treatment process of various plates, such as metal plates, ceramic plates, polymer plates, etc. This design not only improves the uniformity of plate treatment, but also makes it more convenient to maintain and replace the heat-conducting blocks due to the detachable setting of the first heat-conducting block 11 and the second heat-conducting block 12, thereby improving the service life and economic benefits of the device. In addition, heat-conducting blocks with different thermal conductivity coefficients can be selected according to the requirements of temperature control, so that the plate 1 to be treated can be heated or cooled at a certain temperature change rate. In practical applications, this device can significantly improve the heat treatment efficiency of the plate, reduce the damage to the plate caused by improper heat treatment, and is suitable for high-tech industries that require precise temperature control, such as aerospace, precision instrument manufacturing, etc. Therefore, the control method of the heating or cooling rate of the plate provided in this embodiment can solve the technical problem of low heat treatment rate of the temperature control device of the plate in the prior art.

[0079] Specifically, before placing the plate to be processed between the first heat-conducting block 11 of the control device and the second heat-conducting block 12 of the control device, the control method further includes: placing the first heat-conducting block 11 in a first initial temperature environment, and placing the second heat-conducting block 12 in a second initial temperature environment, so that the temperature of the first heat-conducting block 11 reaches the first initial temperature, and the temperature of the second heat-conducting block 12 reaches the second initial temperature. With such a setting, by presetting the initial temperature of the heat-conducting block, the temperature fluctuation during the heating or cooling process of the plate can be reduced, and the stability and consistency of the heat treatment can be improved, which is suitable for heat treatment processes that require rapid response, such as rapid prototyping, emergency heat treatment, etc. Presetting the initial temperature of the heat-conducting block can significantly reduce the temperature fluctuation during the heating or cooling process of the plate, and improve the stability and consistency of the heat treatment. In scenarios that require rapid response, such as rapid prototyping and emergency heat treatment, this method can quickly adjust the temperature of the plate to meet production needs and avoid product defects and production delays caused by temperature fluctuations.

[0080] Specifically, the control method further includes: obtaining the contact pressure between the heat-conducting surface of the first heat-conducting block 11 and the plate 1 to be processed and the contact pressure between the heat-conducting surface of the second heat-conducting block 12 and the plate 1 to be processed. After obtaining the contact pressure between the heat-conducting surface of the first heat-conducting block 11 and the plate 1 to be processed and the contact pressure between the heat-conducting surface of the second heat-conducting block 12 and the plate 1 to be processed, the control method further includes: determining the portion of the heat-conducting surface of the first heat-conducting block 11 where the contact pressure between the heat-conducting surface of the first heat-conducting block 11 and the plate 1 to be processed is greater than a preset pressure and the portion of the heat-conducting surface of the second heat-conducting block 12 where the contact pressure between the heat-conducting surface of the second heat-conducting block 12 and the plate 1 to be processed is greater than the preset pressure, so as to obtain the first portion to be adjusted; in the case of heating the plate 1 to be processed, making the temperature of the first portion to be adjusted lower than the target temperature; in the case of cooling the plate 1 to be processed, making the temperature of the first portion to be adjusted higher than the target temperature. In this way, by obtaining the contact pressure between the heat-conducting surface of the first heat-conducting block 11 and the second heat-conducting block 12 and the plate 1 to be treated in real time, it is possible to ensure that the plate maintains a stable contact state during the heating or cooling process, which is crucial for accurately controlling the temperature change rate of the plate. The contact pressure directly affects the heat transfer efficiency. Monitoring and adjusting the contact pressure helps to maintain the temperature uniformity and heating / cooling rate consistency on both sides of the plate, thereby achieving more accurate control of the heat treatment process. Determine the part where the contact pressure is greater than the preset pressure (the first part to be adjusted), and lower the temperature of the part during the heating treatment, or increase the temperature of the part during the cooling treatment. This mechanism can effectively avoid local overheating or insufficient cooling of the plate caused by excessive pressure. By fine-tuning the temperature of these parts, it can be ensured that the temperature curve of the heat treatment process meets expectations, while preventing the surface of the plate from being deformed or damaged due to uneven force, thereby improving the quality of the plate after heat treatment.

[0081] Specifically, the control method further includes: obtaining the contact pressure between the heat-conducting surface of the first heat-conducting block 11 and the plate 1 to be processed and the contact pressure between the heat-conducting surface of the second heat-conducting block 12 and the plate 1 to be processed. After obtaining the contact pressure between the heat-conducting surface of the first heat-conducting block 11 and the plate 1 to be processed and the contact pressure between the heat-conducting surface of the second heat-conducting block 12 and the plate 1 to be processed, the control method further includes: determining the portion of the heat-conducting surface of the first heat-conducting block 11 where the contact pressure between the heat-conducting surface of the first heat-conducting block 11 and the plate 1 to be processed is less than a preset pressure and the portion of the heat-conducting surface of the second heat-conducting block 12 where the contact pressure between the heat-conducting surface of the second heat-conducting block 12 and the plate 1 to be processed is less than the preset pressure, so as to obtain the second portion to be adjusted; in the case of heating the plate 1 to be processed, making the temperature of the second portion to be adjusted greater than the target temperature; in the case of cooling the plate 1 to be processed, making the temperature of the second portion to be adjusted less than the target temperature. By adopting such a method, by obtaining the contact pressure between the heat-conducting surface of the first heat-conducting block 11 and the second heat-conducting block 12 and the plate 1 to be treated in real time, it is possible to ensure that the plate maintains a stable contact state during the heating or cooling process, which is crucial for accurately controlling the temperature change rate of the plate. The contact pressure directly affects the heat transfer efficiency. Monitoring and adjusting the contact pressure helps to maintain the temperature uniformity and heating / cooling rate consistency on both sides of the plate, thereby achieving more accurate control of the heat treatment process. Monitoring the part where the contact pressure is less than the preset pressure (the second part to be adjusted), and increasing its temperature during the heating treatment, or reducing its temperature during the cooling treatment, can compensate for the lack of heat transfer caused by poor contact. This ensures that even when the contact pressure is not completely uniform, the control device can still achieve accurate control of the overall temperature of the plate through dynamic adjustment of the temperature, meeting the needs of high-precision heat treatment processes.

[0082] It should be noted that the target temperature refers to the heat treatment temperature expected to be reached at the portion of the heat conductive block whose contact pressure meets the preset pressure requirement during the heat treatment process.

[0083] Specifically, the method for controlling the heating or cooling rate of the plate includes: processing the plate 1 to be processed into a sample of a target shape; placing the first heat-conducting block 11 and the second heat-conducting block 12 in an environment with a temperature of T0 to make it reach the target temperature T0; placing the sample between the first heat-conducting block 11 and the second heat-conducting block 12 at a temperature of T0; contacting the first heat-conducting block 11 and the second heat-conducting block 12 with the upper and lower surfaces of the sample; exchanging heat with the sample through the first heat-conducting block 11 and the second heat-conducting block 12, so that the sample temperature reaches the temperature T0 according to the designed change rate. The method for controlling the heating or cooling rate of the plate also includes: before placing the sample, controlling the sample to reach an initial temperature T1 through a heating or cooling device. Specifically, the environment with a temperature of T0 is a gas heating device, a cooling device or a natural atmospheric environment.

[0084] Specifically, in the following experimental examples of the present invention, different sizes, materials and structural design parameters of the plate 1 to be processed, the first heat-conducting block 11 and the second heat-conducting block 12 are provided. Through the control device for the plate heating or cooling rate provided in Example 1 and the control method provided in Example 2, different heating or cooling rate controls for different plates are achieved, and the temperature change curves are recorded, as shown in Table 1.

[0085] Table 1 Control method parameters for different plate heating or cooling rates

[0086]

[0087]

[0088] Figure 2 The temperature change curves of the plates in Experimental Examples 1 to 3 are shown in FIG. The maximum heating or cooling rate of the industrial air heat treatment equipment is about 10-20°C / s, and the maximum heating or cooling rate of the plate in Experimental Example 1 is about 42°C / s, which is significantly higher than that of the industrial heat treatment equipment. The average heating or cooling rate of the 1.8 mm plate in the industrial air cushion furnace is 4.0°C / s, and the heating or cooling rate of the plate in Experimental Example 1 is equivalent to that of the industrial air cushion furnace. Therefore, the technical solution can achieve the effect of simulating the industrial production process in the laboratory.

[0089] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0090] (1) The present invention transfers heat through the contact between the solid heat conductive block and the plate, and its heat transfer coefficient can be increased to more than 1000W / (m·℃), which far exceeds the heat transfer rate of the existing heat treatment technology, and can achieve a higher heating or cooling rate, tissue uniformity or gradient of the plate;

[0091] (2) The present invention controls different heat transfer coefficient conditions by designing heat conductive blocks of different materials or composite materials to achieve different heating or cooling rate processes of the plate;

[0092] (3) The present invention can realize continuous simulation of air cushion furnace heating conditions in the laboratory by configuring a temperature control device of a solid heat conductive block in the box-type heating furnace; it can also realize heating and cooling of plate samples with different temperature histories by presetting different sample temperatures T1 and heat conductive block temperatures T0 in accordance with different equipment and conditions;

[0093] (4) The thermal stability of the solid heat conductive block in the present invention is better than that of air, and it is not easily affected by the cold / hot shock during the opening of the furnace door; its thermal uniformity is better than that of air, and the heating process of the plate sample is more uniform and consistent; the solid solution heat conductive block has a certain dead weight, and the plate sample is easy to deform under high temperature conditions, and the leveling effect of the plate sample can be achieved during the heat treatment process.

[0094] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0095] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the application. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to actual proportional relationships. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0096] In the description of the present application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0097] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0098] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0099] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A device for controlling the heating or cooling rate of a plate, characterized in that: include: A first heat-conducting block (11) and a second heat-conducting block (12), wherein the heat-conducting surface of the first heat-conducting block (11) and the heat-conducting surface of the second heat-conducting block (12) are arranged opposite to each other; the heat-conducting surface of the first heat-conducting block (11) and the heat-conducting surface of the second heat-conducting block (12) are respectively used to be attached to two sides of a plate (1) to be processed; a temperature control structure, the first heat conducting block (11) and the second heat conducting block (12) being both connected to the temperature control structure, the temperature control structure being used to control the temperature of the first heat conducting block (11) and the temperature of the second heat conducting block (12); The mounting assembly (20) comprises a first mounting portion (21) and a second mounting portion (22) which are connected to each other, wherein the first heat conductive block (11) is detachably arranged on the first mounting portion (21), and the second heat conductive block (12) is detachably arranged on the second mounting portion (22); the second mounting portion (22) is used to support the plate (1) to be processed; the first mounting portion (21) is movably arranged relative to the second mounting portion (22) so as to move to an avoidance position where the first heat conductive block (11) and the plate (1) to be processed avoid each other or to a fitting position where the first heat conductive block (11) and the plate (1) to be processed fit each other.

2. The device for controlling the heating or cooling rate of a plate according to claim 1, characterized in that: The mounting assembly (20) further comprises a connecting rod structure (23), one end of the connecting rod structure (23) being rotatably connected to the first mounting portion (21), and the other end of the connecting rod structure (23) being rotatably connected to the second mounting portion (22); and / or, A first mounting groove is provided on a side of the first mounting portion (21) close to the second mounting portion (22), and the first heat conducting block (11) is detachably arranged in the first mounting groove; a second mounting groove is provided on a side of the second mounting portion (22) close to the first mounting portion (21), and the second heat conducting block (12) is detachably arranged in the second mounting groove; and / or, The mounting assembly (20) further comprises an operating portion (24), wherein the operating portion (24) is arranged on a side of the first mounting portion (21) away from the first heat conducting block (11); the operating portion (24) is arranged to protrude from a surface of the first mounting portion (21).

3. The device for controlling the heating or cooling rate of a plate according to claim 1, characterized in that: The first heat-conducting block (11) and the second heat-conducting block (12) are made of the same material; or the thermal conductivity of the first heat-conducting block (11) and the thermal conductivity of the second heat-conducting block (12) are different; and / or, Along the direction from the first heat-conducting block (11) to the second heat-conducting block (12), the ratio of the thickness of the first heat-conducting block (11) to the thickness of the plate (1) to be processed is greater than 4; and / or, Along the direction from the first heat-conducting block (11) to the second heat-conducting block (12), the ratio of the thickness of the second heat-conducting block (12) to the thickness of the plate (1) to be processed is greater than 4.

4. The device for controlling the heating or cooling rate of a plate according to claim 1, characterized in that: The first heat conducting block (11) is made of metal material, ceramic material or polymer material; and / or the second heat conducting block (12) is made of metal material, ceramic material or polymer material.

5. The device for controlling the heating or cooling rate of a plate according to claim 1, characterized in that: The control device also includes: A pressure adjustment component, wherein the first mounting portion (21) and the second mounting portion (22) are both connected to the pressure adjustment component, and the pressure adjustment component is used to adjust the contact pressure between the first heat-conducting block (11) and the plate to be processed (1) and / or the contact pressure between the second heat-conducting block (12) and the plate to be processed (1).

6. The device for controlling the heating or cooling rate of a plate according to claim 1, characterized in that: The control device also includes: A first temperature detection member and a second temperature detection member are both connected to the temperature control structure; a detection end of the first temperature detection member is arranged on a heat-conducting surface of the first heat-conducting block (11), and a detection end of the second temperature detection member is arranged on a heat-conducting surface of the second heat-conducting block (12), so as to adjust the temperature of the first heat-conducting block (11) and the temperature of the second heat-conducting block (12) according to the detection results of the first temperature detection member and the second temperature detection member; A temperature recorder, wherein the first temperature detection component and the second temperature detection component are both connected to the temperature recorder; and the temperature recorder is connected to the temperature control structure.

7. The device for controlling the heating or cooling rate of a plate according to claim 1, characterized in that: The control device also includes: A plurality of first pressure detection components and a plurality of second pressure detection components are all connected to the temperature control structure; the detection ends of the plurality of first pressure detection components are evenly spaced on the heat-conducting surface of the first heat-conducting block (11) and are all used to detect the contact pressure between the heat-conducting surface of the first heat-conducting block (11) and the plate (1) to be processed; the detection ends of the plurality of second pressure detection components are evenly spaced on the heat-conducting surface of the second heat-conducting block (12) and are all used to detect the contact pressure between the heat-conducting surface of the second heat-conducting block (12) and the plate (1) to be processed, so as to adjust the temperatures of the first heat-conducting block (11) and the second heat-conducting block (12) according to the detection results of the first pressure detection components and the second pressure detection components.

8. A method for controlling the heating or cooling rate of a plate, characterized in that: A device for controlling the heating or cooling rate of a plate material according to any one of claims 1 to 7, wherein the method for controlling the heating or cooling rate of the plate material comprises: Placing the plate to be processed between the first heat-conducting block of the control device and the second heat-conducting block of the control device, and placing the heat-conducting surface of the first heat-conducting block and the heat-conducting surface of the second heat-conducting block on both sides of the plate to be processed respectively; adjusting the temperature of the first heat-conducting block and the temperature of the second heat-conducting block; The temperatures of both sides of the plate to be processed are obtained, and the temperatures of the first heat-conducting block and the second heat-conducting block are adjusted according to the changes in the temperatures of both sides of the plate to be processed.

9. The method for controlling the heating or cooling rate of a plate according to claim 8, characterized in that: Before placing the plate to be processed between the first heat-conducting block of the control device and the second heat-conducting block of the control device, the control method further includes: The first heat-conducting block is placed in a first initial temperature environment, and the second heat-conducting block is placed in a second initial temperature environment, so that the temperature of the first heat-conducting block reaches the first initial temperature and the temperature of the second heat-conducting block reaches the second initial temperature.

10. The method for controlling the heating or cooling rate of a plate according to claim 8, characterized in that: The control device is the control device in claim 7; the control method further comprises: obtaining the contact pressure between the heat-conducting surface of the first heat-conducting block and the plate to be processed and the contact pressure between the heat-conducting surface of the second heat-conducting block and the plate to be processed; after obtaining the contact pressure between the heat-conducting surface of the first heat-conducting block and the plate to be processed and the contact pressure between the heat-conducting surface of the second heat-conducting block and the plate to be processed, the control method further comprises: Determine the portion of the first heat-conducting block's heat-conducting surface where the contact pressure between the heat-conducting surface of the first heat-conducting block and the plate to be processed is greater than a preset pressure and the portion of the second heat-conducting block's heat-conducting surface where the contact pressure between the heat-conducting surface of the second heat-conducting block and the plate to be processed is greater than the preset pressure, so as to obtain a first portion to be adjusted; when the plate to be processed is heated, the temperature of the first portion to be adjusted is lower than a target temperature; when the plate to be processed is cooled, the temperature of the first portion to be adjusted is greater than the target temperature; and / or, Determine a portion of the first heat-conducting block's heat-conducting surface where the contact pressure between the heat-conducting surface of the first heat-conducting block and the plate to be processed is less than a preset pressure, and a portion of the second heat-conducting block's heat-conducting surface where the contact pressure between the heat-conducting surface of the second heat-conducting block and the plate to be processed is less than the preset pressure, so as to obtain a second portion to be adjusted; when the plate to be processed is subjected to heating treatment, the temperature of the second portion to be adjusted is made greater than a target temperature; when the plate to be processed is subjected to cooling treatment, the temperature of the second portion to be adjusted is made less than the target temperature.

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