Method for preparing liquid-repellent film based on sputtering, liquid-repellent film and liquid-repellent functional device

Abstract

The present disclosure provides a method for preparing a liquid-repellent film based on sputtering, a liquid-repellent film and a liquid-repellent functional device. The method for preparing a liquid-repellent film based on sputtering includes the following steps: a substrate is arranged on a carrier located in a sputtering chamber, a magnetic material target is arranged in the sputtering chamber, a magnetic field generating structure is arranged in the carrier, and the magnetic field generating structure is used to regulate the deposition area of ​​the magnetic material on the surface of the substrate. The magnetic material target is sputtered and deposited on the substrate to form a magnetic pattern layer, and a plurality of spaced protrusion structures are formed on the surface of the magnetic pattern layer away from the substrate; and carbon nanohorns are deposited on the protrusion structure of the magnetic pattern layer. The preparation method can directly prepare a magnetic pattern layer with a protrusion structure by setting a combination of a magnetic field generating structure and a magnetic material, without relying on micro-machining processes such as photolithography, and thus has higher production efficiency and lower production cost, which is conducive to large-scale production and application.

Description

Technical Field

[0001] The present invention relates to the technical field of sputtering coating, and in particular to a method for preparing a liquid-repellent film based on sputtering, a liquid-repellent film and a liquid-repellent functional device. Background Art

[0002] Lyophobicity refers to the property of the surface of a material to repel liquids, making it difficult for liquids to adhere to or penetrate into the material. When a liquid drops on a lyophobic surface, it forms a large contact angle and rolls easily without leaving any residue. Lyophobicity can generally be divided into hydrophobicity and oleophobicity. Lyophobicity is usually related to the chemical composition and microstructure of the material surface. In some common technologies, the surface of the substrate can be made hydrophobic by coating polystyrene composites, carbon nanotube materials, silica coatings and silicide coatings on the surface of the substrate. However, the durability and hydrophobicity of the lyophobic layer prepared based on the surface modification material are often poor.

[0003] By forming a specific microstructure on the surface of the substrate, better hydrophobicity can be achieved and it has a wider applicability, but the specific microstructure often needs to be prepared by micro-machining methods such as photolithography, which has high production costs and low efficiency. In addition, in actual use, the mechanical stability of the microstructure on the surface of the substrate is relatively poor, and it is easily damaged by friction, resulting in relatively poor durability of the microstructure. Summary of the invention

[0004] Based on this, it is necessary to provide a method for preparing a liquid-repellent film based on sputtering, which can reduce production costs, improve production efficiency and improve durability, in response to the problems in the above-mentioned background technology.

[0005] According to some embodiments of the present disclosure, a method for preparing a liquid-repellent film based on sputtering is provided, which comprises the following steps:

[0006] The substrate is placed on a carrier platform located in a sputtering chamber, wherein a magnetic material target is placed in the sputtering chamber, and a magnetic field generating structure is placed in the carrier platform, wherein the magnetic field generating structure is used to control the deposition area of ​​the magnetic material on the surface of the substrate;

[0007] sputtering and depositing the magnetic material target on the substrate to form a magnetic pattern layer, wherein a surface of the magnetic pattern layer away from the substrate is formed with a plurality of convex structures arranged at intervals; and

[0008] Carbon nanohorns are deposited on the protruding structures of the magnetic pattern layer.

[0009] In some embodiments of the present disclosure, the magnetic field generating structure includes a patterned permanent magnet, in which a plurality of protrusions protruding toward the surface of the support platform and groove areas recessed relative to the protrusions are provided, and the groove area is arranged between two adjacent protrusions and separates the two adjacent protrusions.

[0010] In some embodiments of the present disclosure, in the permanent magnet, the protrusion is in the shape of a hollow column.

[0011] In some embodiments of the present disclosure, the maximum radial dimension of the outer side wall of the protrusion is 1 μm to 100 μm; and / or,

[0012] The distance between two adjacent protrusions is 1 μm to 100 μm; and / or,

[0013] The maximum radial dimension of the holes in the protrusion is 500nm~50μm.

[0014] In some embodiments of the present disclosure, the step of depositing carbon nanohorns on the surface of the magnetic pattern layer includes:

[0015] placing the substrate in a sputtering chamber provided with a carbon target; and,

[0016] A carbon material is sputtered on the magnetic pattern layer to form the carbon nanohorns.

[0017] In some embodiments of the present disclosure, when sputtering the carbon material, the instantaneous sputtering power is controlled at 10 5 W or more, so that the sputtered carbon material directly forms the carbon nanohorn; or,

[0018] The step of sputtering carbon material on the magnetic pattern layer to form the carbon nanohorns includes: sputtering a carbon precursor layer on the surface of the magnetic pattern layer, and irradiating the carbon precursor layer on the protruding structure with a laser to form the carbon nanohorns from the carbon precursor layer.

[0019] In some embodiments of the present disclosure, after depositing the carbon nanohorns, the following steps are further included:

[0020] One or more of cubic boron nitride, silicon carbide, diamond-like carbon material, titanium carbide, aluminum nitride, titanium nitride, chromium nitride and zirconium nitride are deposited on the surface of the magnetic pattern layer on which the carbon nanohorns are deposited to form a protective layer.

[0021] Furthermore, the present disclosure also provides a liquid-repellent film, comprising:

[0022] Base material;

[0023] A magnetic pattern layer, wherein the magnetic pattern layer is disposed on the substrate, the material of the magnetic pattern layer comprises a magnetic material, and a surface of the magnetic pattern layer away from the substrate is provided with a plurality of protrusion structures disposed at intervals; and

[0024] Carbon nanohorns are disposed on the protruding structures of the magnetic pattern layer.

[0025] In some embodiments of the present disclosure, the height of each protrusion structure is 10 nm to 1000 nm; and / or,

[0026] The distance between two adjacent protrusion structures is 1 μm to 100 μm.

[0027] Furthermore, the present disclosure also provides a liquid-repellent functional device, which includes a device functional body and a liquid-repellent film arranged on the device functional body, and the liquid-repellent film is a liquid-repellent film prepared by the method for preparing a liquid-repellent film based on sputtering as described in any of the above embodiments, or the liquid-repellent film is a liquid-repellent film as described in any of the above embodiments.

[0028] In the method for preparing a liquid-repellent film of this embodiment, a support table provided with a magnetic field generating structure is used to support the substrate, and a magnetic material is sputtered onto the surface of the substrate. The magnetic field generating structure can regulate the deposition area of ​​the magnetic material on the surface of the substrate, thereby directly forming a magnetic pattern layer with a protruding structure during the deposition process, and the magnetic pattern layer can serve as the basic structure of the surface liquid-repellent structure. The carbon nanohorns further deposited on the protruding structure of the magnetic pattern layer can further improve the liquid-repellent property of the liquid-repellent film on the one hand, and on the other hand, can also play a role in improving the mechanical structure stability of the magnetic pattern layer, thereby forming a liquid-repellent film with good liquid-repellent property and stability. The preparation method can directly prepare a magnetic pattern layer with a protruding structure by setting a combination of a magnetic field generating structure and a magnetic material, without relying on micro-machining processes such as photolithography, and thus has higher production efficiency and lower production cost, which is conducive to large-scale production and application.

[0029] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, drawings of other embodiments can be obtained based on these drawings without creative work.

[0031] Figure 1 A schematic diagram of the steps of preparing a liquid-repellent film;

[0032] Figure 2 A schematic diagram of a top view of a magnetic field generating structure disposed in a supporting platform;

[0033] Figure 3 is a schematic cross-sectional structural diagram of a magnetic field generating structure disposed in a supporting platform;

[0034] Figure 4 For Figure 3 A schematic diagram of a structure in which a substrate is arranged on a supporting platform shown;

[0035] Figure 5 For Figure 4 A schematic diagram of a structure in which a magnetic pattern layer is formed on the basis of the structure shown;

[0036] Figure 6 For Figure 5 Schematic diagram of the structure of depositing carbon nanohorns on the basis of the structure shown;

[0037] Figure 7 For Figure 6 A schematic diagram of a structure in which a protective layer is formed on the basis of the structure shown;

[0038] Figure 8 A schematic diagram of the cross-sectional structure of a liquid-repellent membrane.

[0039] The reference numerals and their meanings are as follows:

[0040] 100, support platform; 110, magnetic field generating structure; 111, raised portion; 112, recessed area; 200, substrate; 210, magnetic pattern layer; 211, raised structure; 220, carbon nanohorns; 230, protective layer. DETAILED DESCRIPTION

[0041] To facilitate understanding of the present invention, a more comprehensive description of the present invention is provided below. The preferred embodiments of the present invention are given herein. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the content of the present invention more thorough and comprehensive.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this document pertains. The terms used herein in the specification of this document are only for describing specific embodiments and are not intended to limit this document.

[0043] It should be understood that when an element or layer is referred to as being "on, "adjacent to, "connected to, or "coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, "directly adjacent to, "directly connected to, or "directly coupled to" another element or layer, there may be no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion.

[0044] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein for ease of description to describe the relationship of one element or feature to other elements or features. It should be understood that the spatially relative terms are intended to also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, then the elements or features described as "under other elements" or "under" or "under" will be oriented as "over" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be otherwise oriented (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used may be interpreted accordingly.

[0045] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be a limitation of the present disclosure. When used herein, the singular forms "a", "an" and "the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0046] The present disclosure provides a method for preparing a liquid-repellent film based on sputtering, which comprises the following steps: placing a substrate on a carrier located in a sputtering chamber, a magnetic material target is arranged in the sputtering chamber, a magnetic field generating structure is arranged in the carrier, and the magnetic field generating structure is used to control the deposition area of ​​the magnetic material on the surface of the substrate. The magnetic material target is sputtered and deposited on the substrate to form a magnetic pattern layer, and a surface of the magnetic pattern layer away from the substrate is formed with a plurality of convex structures arranged at intervals; and carbon nanohorns are deposited on the convex structures of the magnetic pattern layer.

[0047] In the method for preparing a liquid-repellent film of this embodiment, a support table provided with a magnetic field generating structure is used to support the substrate, and a magnetic material is sputtered onto the surface of the substrate. The magnetic field generating structure can regulate the deposition area of ​​the magnetic material on the surface of the substrate, thereby directly forming a magnetic pattern layer with a protruding structure during the deposition process, and the magnetic pattern layer can serve as the basic structure of the surface liquid-repellent structure. The carbon nanohorns further deposited on the protruding structure of the magnetic pattern layer can further improve the liquid-repellent property of the liquid-repellent film on the one hand, and on the other hand, can also play a role in improving the mechanical structure stability of the magnetic pattern layer, thereby forming a liquid-repellent film with good liquid-repellent property and stability. The preparation method can directly prepare a magnetic pattern layer with a protruding structure by setting a combination of a magnetic field generating structure and a magnetic material, without relying on micro-machining processes such as photolithography, and thus has higher production efficiency and lower production cost, which is conducive to large-scale production and application.

[0048] Figure 1 Schematic diagram of the steps of preparing a liquid-repellent film disclosed in the present invention. Figure 1 As shown, the preparation process of the liquid-repellent film includes steps S1 to S3, which are specifically as follows.

[0049] In step S1 , a substrate 200 is disposed on a carrier 100 located in a sputtering chamber. A magnetic material target is disposed in the sputtering chamber, and a magnetic field generating structure 110 is disposed in the carrier 100 .

[0050] In this embodiment, the magnetic field generating structure 110 is used to regulate the deposition area of ​​the magnetic material on the surface of the substrate 200. The magnetic field generating structure 110 can generate a magnetic field in the area where the surface of the substrate 200 is located, and the magnetic field can guide the deposition area of ​​the sputtered magnetic material. By regulating the field intensity distribution of the magnetic field, the magnetic material can be selectively deposited on the surface of the substrate 200. Specifically, the distribution of the magnetic field at the position where the surface of the substrate 200 is located is uneven, for example, the magnetic field intensity of some areas on the surface of the substrate 200 is relatively high, and the magnetic field intensity of another area is relatively low. Then, when the magnetic material is sputtered onto the surface of the substrate 200, relatively less magnetic material is deposited in the area with relatively low magnetic field intensity, and more magnetic material can be deposited in the area with relatively high magnetic field intensity and correspondingly form a protruding structure 211.

[0051] Figure 2 is a schematic diagram of a top view of a magnetic field generating structure 110 disposed in a supporting platform 100, Figure 3 FIG. 1 is a schematic cross-sectional view of a magnetic field generating structure 110 disposed in the support platform 100. Figure 2 and Figure 3As shown, as an example of this embodiment, the magnetic field generating structure 110 includes a permanent magnet arranged in a pattern. The permanent magnet is provided with a plurality of protrusions 111 protruding toward the surface of the carrier platform 100 and a groove area that is concave relative to the protrusion 111. The groove area is arranged between two adjacent protrusions 111 and spaced apart from the two adjacent protrusions 111. The permanent magnet can form a relatively stable and lasting magnetic field without the need for an external energy source. The field intensity distribution of the magnetic field generated by the permanent magnet is related to its shape. Therefore, the use of a permanent magnet arranged in a pattern is a method that is easy to prepare and can significantly change the field intensity distribution.

[0052] As an example of this embodiment, the patterned permanent magnet can be obtained by patterning a flat permanent magnet material. The patterning method can be selected from etching, such as wet etching, dry etching or laser etching.

[0053] The present disclosure may not specifically limit the material of the permanent magnet. As an example of this embodiment, the permanent magnet may be a neodymium iron boron magnet, which can provide a higher magnetic field strength.

[0054] It can be understood that this embodiment uses a permanent magnet as the magnetic field generating structure 110. However, in other embodiments, an electromagnet with a specific structural design can also be used as the magnetic field generating structure 110, as long as it can generate a magnetic field with a similar distribution.

[0055] Figure 4 For Figure 3 The structural diagram of the substrate 200 is shown in FIG. Figure 3 and Figure 4 As shown, it can be understood that the top of the protrusion 111 is closer to the substrate 200, so the magnetic field strength on the surface of the substrate 200 directly above the protrusion 111 is higher, and the magnetic field strength on the surface of the substrate 200 directly above the recessed area 112 is relatively lower.

[0056] Reference Figure 2~Figure 4 As shown, as an example of this embodiment, in the permanent magnet, the raised portion 111 is in the shape of a hollow column. Setting the raised portion 111 as a hollow column can reduce the magnetic field strength in the central area of ​​the raised portion 111. When sputtering the magnetic material, the top surface of the raised structure 211 formed can be made relatively flat or even concave, which can further improve the lyophobicity of the formed lyophobic film. If the raised portions 111 in the permanent magnet are all solid structures, the top of the raised structure 211 in the formed magnetic pattern layer 210 is pointed and the side walls are relatively inclined, and this structure will have an adverse effect on the lyophobicity. The present application found during the research process that the raised portion 111 designed with a hollow columnar shape can better avoid this adverse effect.

[0057] Reference Figure 2~Figure 3 As shown, in this embodiment, the outer wall of the protrusion 111 is cylindrical. In other embodiments, the outer wall of the protrusion 111 may also be prism-shaped or elliptical-shaped.

[0058] The protrusion 111 is in the shape of a hollow column, that is, there is a hole inside the protrusion 111. Figure 2~Figure 3 As shown, as an example of this embodiment, the hole inside the protrusion 111 is cylindrical. In other embodiments, the hole inside the protrusion 111 may also be prism-shaped or elliptical-shaped. Further, the shape of the hole inside the protrusion 111 is similar to the shape of the outer side wall of the protrusion 111, so that the thickness of the protrusion 111 is evenly distributed.

[0059] As an example of this embodiment, the maximum radial dimension of the outer wall of the protrusion 111 is 1 μm to 100 μm. For example, the maximum radial dimension of the outer wall of the protrusion 111 is 1 μm, 2 μm, 3 μm, 5 μm, 7 μm, 10 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, or the maximum radial dimension of the outer wall of the protrusion 111 can also be between any two of the above dimensions. It can be understood that the maximum radial dimension of the outer wall of the protrusion 111 is related to the radial dimension of the corresponding protrusion structure 211 formed in the magnetic pattern layer 210. The above-mentioned size design can make the radial dimension of the protrusion structure 211 formed moderate, which is more suitable for ensuring the liquid-repellent performance of the liquid-repellent film.

[0060] As an example of this embodiment, the spacing between two adjacent protrusions 111 is 1 μm to 100 μm. For example, the spacing between two adjacent protrusions 111 can be 1 μm, 2 μm, 3 μm, 5 μm, 7 μm, 10 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, or the spacing between two adjacent protrusions 111 can also be between any two of the above spacings. Among them, the spacing between two adjacent protrusions 111 refers to the shortest distance between the two. The above-mentioned size design can make it more difficult for liquid to penetrate between two adjacent protrusions 111.

[0061] As an example of this embodiment, the maximum radial dimension of the inner side wall of the protrusion 111 is 500nm~50μm. For example, the maximum radial dimension of the inner side wall of the protrusion 111 is 500nm, 700nm, 1μm, 5μm, 10μm, 20μm, 30μm, 40μm, 50μm, or the maximum radial dimension of the inner side wall of the protrusion 111 can also be between any two of the above dimensions.

[0062] In step S2 , a magnetic material target is sputtered and deposited on the substrate 200 to form a magnetic pattern layer 210 .

[0063] Reference Figure 4 As shown, as an example of this embodiment, the substrate 200 and the permanent magnet can be arranged on two sides of the surface of the carrier 100 opposite to each other.

[0064] As an example of this embodiment, the substrate 200 can be selected according to the actual application scenario of the liquid-repellent film. Further, the material of the substrate 200 can include one or more of polymer materials, inorganic glass, sapphire, metal and quartz.

[0065] Figure 5 For Figure 4 A schematic diagram of a structure of forming a magnetic pattern layer 210 based on the structure shown in FIG. Figure 5 As shown, a plurality of spaced convex structures 211 are formed on the surface of the magnetic pattern layer 210 away from the substrate 200. It can be understood that the magnetic pattern layer 210 is formed by sputtering and depositing a magnetic material target, so the material of the magnetic pattern layer 210 is the same as that of the magnetic material target.

[0066] As an example of this embodiment, the material of the magnetic material target is selected from a material having magnetism. As a further example, the material of the magnetic material target is selected from a metal magnetic material, for example, the material of the magnetic material target is selected from one or more of iron, iron alloy, cobalt, cobalt alloy, nickel and nickel alloy. The metal material in the magnetic pattern layer 210 can be used as a catalyst for the subsequent deposition of the carbon nanohorns 220, which is conducive to simplifying the preparation process of preparing the carbon nanohorns 220 on the magnetic pattern layer 210.

[0067] As an example of this embodiment, in the formed magnetic pattern layer 210, the height of each protruding structure 211 is 10nm~1000nm. For example, the height of each protruding structure 211 can be 10nm, 20nm, 50nm, 100nm, 200nm, 500nm, 700nm, 1000nm, or the height of each protruding structure 211 can also be between any two of the above heights. It can be understood that the height of the protruding structure 211 refers to the distance between the top of the protruding structure 211 and its bottom. The height of the protruding structure 211 can be controlled by combining the sputtering rate and controlling the sputtering time and other parameters.

[0068] As an example of this embodiment, in the formed magnetic pattern layer 210, the spacing between two adjacent protruding structures 211 is 1 μm to 100 μm. For example, the spacing between two adjacent protruding structures 211 can be 1 μm, 2 μm, 3 μm, 5 μm, 7 μm, 10 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, or the spacing between two adjacent protruding structures 211 can also be between any two of the above spacings. It can be understood that the spacing between two adjacent protruding structures 211 can be controlled by adjusting the magnetic field distribution.

[0069] It is understandable that for the sake of convenience, Figure 5 The shape of the protruding structure 211 of the magnetic pattern layer 210 is simplified as a columnar shape. However, the protruding structure 211 actually prepared may be of an irregular shape, and the sidewall of the protruding structure 211 may also have a certain inclination angle relative to the plane, which will not be described in detail here.

[0070] As an example of this embodiment, in the step of sputtering and depositing the magnetic material target on the substrate 200 , the sputtering power may be controlled to be 100W-500W.

[0071] As an example of this embodiment, in the step of sputtering and depositing the magnetic material target on the substrate 200, the temperature of the substrate 200 may be controlled to be 50°C to 200°C.

[0072] Step S3 , depositing carbon nanohorns 220 on the protrusion structures 211 of the magnetic pattern layer 210 .

[0073] Figure 6 For Figure 5 The structure schematic diagram of depositing carbon nanohorns 220 on the basis of the structure shown. Figure 6 As shown, carbon nanohorns 220 may be disposed on the top and sidewalls of the protrusion structure 211. In some other examples, carbon nanohorns 220 may also be disposed on the surface of the magnetic pattern layer 210 between adjacent protrusion structures 211.

[0074] The carbon nanohorn 220 is a special carbon nanostructure with a size at the nanometer level, and its shape is similar to a cone or an horn, with a unique geometric structure and excellent physical and chemical properties. The present application proposes to set the carbon nanohorn 220 on the magnetic pattern layer 210 to form a fractal structure, which can further enhance the lyophobicity of the lyophobic film. Not only that, the carbon nanohorn 220 deposited on the magnetic pattern layer 210 can also assist in enhancing the mechanical stability of the protruding structure 211 and improve its service life. In some examples, when the material of the magnetic pattern layer 210 includes a metal material, the metal material can also serve as a catalyst for depositing the carbon nanohorn 220, so that the carbon nanohorn 220 can grow directly based on the magnetic pattern layer 210, and at this time, the carbon nanohorn 220 and the magnetic pattern layer 210 also have a strong bonding strength.

[0075] As an example of this embodiment, the step of depositing carbon nanohorns 220 on the surface of the magnetic pattern layer 210 includes: placing the substrate 200 in a sputtering chamber provided with a carbon target; and sputtering carbon material on the magnetic pattern layer 210 to form carbon nanohorns 220. The carbon target and the magnetic material target can be arranged in the same sputtering chamber or in different sputtering chambers. When the two are arranged in different sputtering chambers, a step of transferring the substrate 200 is required between step S2 and step S3.

[0076] As a further example of this embodiment, the material of the carbon target may include graphite.

[0077] In this embodiment, the carbon nanohorns 220 may be directly formed during the process of sputtering the carbon material, or the carbon material may be first sputtered to form a carbon film, and then the carbon film may be processed to form the carbon nanohorns 220 .

[0078] As an example of this embodiment, when sputtering carbon material, the instantaneous sputtering power is controlled at 10 5 W or more, so that the sputtered carbon material directly forms carbon nanohorns 220. Further, the instantaneous sputtering power can be controlled to be 10 5 W~10 7 W. Among them, the use of high-power pulsed magnetron sputtering equipment can make the instantaneous sputtering power between 10 5 W or more. By adjusting the specific sputtering power and sputtering time, the sputtered carbon atoms can form carbon nanohorns 220. However, this method can not only form carbon nanohorns 220, but also produce other nanostructured carbon. In addition, the area between adjacent protrusion structures 211 will also have nanostructured carbon materials, resulting in relatively poor surface performance.

[0079] As another example of this embodiment, the step of sputtering carbon material on the magnetic pattern layer 210 to form carbon nanohorns 220 includes: sputtering a carbon precursor layer on the surface of the magnetic pattern layer 210, and using a laser to irradiate the carbon precursor layer on the protruding structure 211, so that the carbon precursor layer forms carbon nanohorns 220. The laser irradiation method can make the carbon atoms of the local carbon precursor layer evaporate and form plasma, and by controlling the power density and scanning time of the laser, the carbon precursor layer can be converted into carbon nanohorns 220. The laser irradiation method can realize the selective deposition of carbon nanohorns 220 on the surface of the protruding structure 211, and can also obtain carbon nanohorn 220 material with higher purity, thereby obtaining relatively good surface properties.

[0080] Furthermore, in the process of irradiating the carbon precursor layer with laser, the spot size of the laser may be greater than or equal to the cross-sectional area of ​​a single protrusion structure 211. For example, the spot size of the laser may be 1 μm to 100 μm.

[0081] Furthermore, during the process of laser irradiation on the carbon precursor layer, the power density of the laser can be controlled to be 10 W / mm 2 ~1000W / mm 2 .

[0082] It can be understood that, through the above two examples, the deposition of the carbon nanohorns 220 on the magnetic pattern layer 210 can be completed.

[0083] As an example of this embodiment, after depositing the carbon nanohorns 220 , a step of preparing a protective layer 230 is further included. Figure 7 For Figure 6 A schematic diagram of a structure in which a protective layer 230 is formed on the basis of the structure shown in FIG. Figure 7 As shown, the protective layer 230 is entirely covered on the magnetic pattern layer 210 and the carbon nanohorns 220. The step of preparing the protective layer 230 includes: depositing one or more of cubic boron nitride, silicon carbide, diamond-like carbon material, titanium carbide, aluminum nitride, titanium nitride, chromium nitride and zirconium nitride on the surface of the magnetic pattern layer 210 on which the carbon nanohorns 220 are deposited to form the protective layer 230. The protective layer 230 is used to further improve the overall structural stability of the liquid-repellent film.

[0084] As a further example of this embodiment, when forming the protective layer 230, physical vapor deposition or chemical vapor deposition may be used to deposit the material. Optionally, the protective layer 230 is formed by magnetron sputtering.

[0085] As a further example of this embodiment, the thickness of the protective layer 230 is 10 nm to 1000 nm. For example, the thickness of the protective layer 230 can be 10 nm, 20 nm, 30 nm, 40 nm, 50 nm, 70 nm, 90 nm, 100 nm, or the thickness of the protective layer 230 can be between any two of the above thicknesses.

[0086] Furthermore, the present disclosure also provides a liquid-repellent film. Figure 8 Schematic diagram of the cross-sectional structure of the liquid-repellent film. Figure 8 As shown, the liquid-repellent film includes: a substrate 200, a magnetic pattern layer 210 and carbon nanohorns 220. The magnetic pattern layer 210 is disposed on the substrate 200, the material of the magnetic pattern layer 210 includes a magnetic material, and a plurality of spaced protrusion structures 211 are disposed on the surface of the magnetic pattern layer 210 away from the substrate 200. The carbon nanohorns 220 are disposed on the protrusion structures 211 of the magnetic pattern layer 210.

[0087] As an example of this embodiment, the height of each protrusion structure 211 is 10 nm to 1000 nm. For example, the height of each protrusion structure 211 can be 10 nm, 20 nm, 50 nm, 100 nm, 200 nm, 500 nm, 700 nm, 1000 nm, or the height of each protrusion structure 211 can also be between any two of the above heights.

[0088] As an example of this embodiment, the spacing between two adjacent protrusion structures 211 is 1 μm to 100 μm. For example, the spacing between two adjacent protrusion structures 211 can be 1 μm, 2 μm, 3 μm, 5 μm, 7 μm, 10 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, or the spacing between two adjacent protrusion structures 211 can also be between any two of the above spacings.

[0089] It can be understood that the lyophobic film relies on its microscopic surface structure to achieve lyophobicity, and its lyophobic effect is not limited to water repellency, but can also be used to increase the contact angle of other liquids, which can be achieved by correspondingly adjusting the height of the protruding structure 211 and the spacing between adjacent protruding structures 211.

[0090] As an example of this embodiment, the liquid-repellent film also includes a protective layer 230, which is disposed on the surface of the magnetic pattern layer 210, and the protective layer 230 covers the magnetic pattern layer 210 and the carbon nanohorns 220, and the material of the protective layer 230 is selected from one or more of cubic boron nitride, silicon carbide, diamond-like carbon material, titanium carbide, aluminum nitride, titanium nitride, chromium nitride and zirconium nitride.

[0091] Furthermore, the present disclosure also provides a liquid-repellent functional device, which includes a device body and a liquid-repellent film covering at least a partial surface of the device body. The liquid-repellent film is the liquid-repellent film in the above embodiment, or is a liquid-repellent film prepared by the method for preparing a liquid-repellent film in the above embodiment.

[0092] As an example of this embodiment, the device body in the liquid-repellent functional device can be but is not limited to a mobile phone, a sensor, a battery, a car glass, a photovoltaic module, etc.

[0093] Please note that the above embodiments are for illustrative purposes only and are not meant to be limiting of this document.

[0094] It should be understood that, unless otherwise specified herein, there is no strict order restriction for the execution of the steps, and the steps may be executed in other orders. Moreover, at least a portion of the steps in the preparation process may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but may be executed at different times, and the execution order of these sub-steps or stages is not necessarily sequential, but may be executed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

[0095] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0096] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

Claims

1. A method for preparing a liquid-repellent film based on sputtering, characterized in that: The steps include: The substrate is placed on a carrier platform located in a sputtering chamber, wherein a magnetic material target is placed in the sputtering chamber, and a magnetic field generating structure is placed in the carrier platform, wherein the magnetic field generating structure is used to control the deposition area of ​​the magnetic material on the surface of the substrate; sputtering and depositing the magnetic material target on the substrate to form a magnetic pattern layer, wherein a surface of the magnetic pattern layer away from the substrate is formed with a plurality of convex structures arranged at intervals; as well as, depositing carbon nanohorns on the protruding structures of the magnetic pattern layer; The magnetic field generating structure includes a patterned permanent magnet, in which a plurality of protrusions protruding toward the surface of the support platform and a groove area recessed relative to the protrusions are provided. The groove area is arranged between two adjacent protrusions and separates the two adjacent protrusions.

2. The method for preparing a liquid-repellent film based on sputtering according to claim 1, characterized in that: In the permanent magnet, the protrusion is in the shape of a hollow column.

3. The method for preparing a liquid-repellent film based on sputtering according to claim 2, characterized in that: The maximum radial dimension of the outer side wall of the protrusion is 1 μm to 100 μm.

4. The method for preparing a liquid-repellent film based on sputtering according to claim 2, characterized in that: The distance between two adjacent protrusions is 1 μm to 100 μm.

5. The method for preparing a liquid-repellent film based on sputtering according to claim 2, characterized in that: The maximum radial dimension of the holes in the protrusion is 500nm~50μm.

6. The method for preparing a liquid-repellent film based on sputtering according to any one of claims 1 to 5, characterized in that: The step of depositing carbon nanohorns on the surface of the magnetic pattern layer comprises: placing the substrate in a sputtering chamber provided with a carbon target; and, A carbon material is sputtered on the magnetic pattern layer to form the carbon nanohorns.

7. The method for preparing a liquid-repellent film based on sputtering according to claim 6, characterized in that: When sputtering the carbon material, the instantaneous sputtering power is controlled at 10 5 W or more, so that the sputtered carbon material directly forms the carbon nanohorn.

8. The method for preparing a liquid-repellent film based on sputtering according to claim 6, characterized in that: The step of sputtering carbon material on the magnetic pattern layer to form the carbon nanohorns includes: sputtering a carbon precursor layer on the surface of the magnetic pattern layer, and irradiating the carbon precursor layer on the protruding structure with a laser to form the carbon nanohorns from the carbon precursor layer.

9. The method for preparing a liquid-repellent film based on sputtering according to any one of claims 1 to 5 and 7 to 8, characterized in that: After depositing the carbon nanohorns, the method further comprises the following steps: One or more of cubic boron nitride, silicon carbide, diamond-like carbon material, titanium carbide, aluminum nitride, titanium nitride, chromium nitride and zirconium nitride are deposited on the surface of the magnetic pattern layer on which the carbon nanohorns are deposited to form a protective layer.

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