Switching device and thermal management system
By designing a switching device including a gear-driven switching plate, the problem of requiring multiple drive parts in the existing thermal management system is solved, the function of a single drive part switching multiple modes is realized, and the system complexity and cost are reduced.
Patent Information
- Application Number
- CN202410722168.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-07-19
- Filing Date
- 2024-06-05
- Publication Date
- 2025-01-21
AI Technical Summary
In the conventional thermal management system, in order to increase the number of switchable modes, multiple flow path switching units need to be independently driven, resulting in the same number of drive units as the flow path switching units, which increases the complexity and cost of the system.
Design a switching device, which includes a first five-way switching part, a second five-way switching part and a driving unit, drives the switching plate through the first gear part and the second gear part, and uses a gear combination with a gear ratio of 2 or more to achieve a single The driver switches between multiple modes.
Through this switching device, the number of modes switched by a single driving part can be ensured, reducing the complexity and cost of the system, while improving the flexibility and efficiency of the thermal management system.
Smart Images

Figure CN119333990A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a switching device and a thermal management system. Background Art
[0002] For example, Japanese Patent Application Laid-Open No. 2021-154767 discloses a thermal management system, which includes: a first thermal circuit including a battery, a PCU, etc.; a second thermal circuit having a function of mainly cooling the air in the vehicle cabin; and a third thermal circuit having a function of mainly heating the air in the vehicle cabin. A switching valve for switching the flow path is provided in each circuit.
[0003] In the thermal management circuit described in Japanese Patent Application Laid-Open No. 2021-154767, a plurality of flow path switching parts (switching valves, etc.) are provided so that the thermal management circuit can be driven in a plurality of modes. In order to increase the number of switchable modes, it is conceivable to independently drive a plurality of flow path switching parts, but in this case, the same number of driving parts (motors, etc.) as the number of flow path switching parts is required. Summary of the invention
[0004] An object of the present disclosure is to provide a switching device and a thermal management system that can ensure the number of modes that can be switched by a single drive unit.
[0005] The switching device of the first mode of the present invention is a switching device that can be set in a thermal management circuit, wherein the switching device includes: a first five-way switching part; a second five-way switching part; and a driving unit that drives the first five-way switching part and the second five-way switching part, the first five-way switching part includes a first switching plate, the second five-way switching part includes a second switching plate, and the driving unit includes: a first gear part that can drive the first switching plate; a second gear part that can drive the second switching plate; and a driving part that drives the first gear part and the second gear part, and the gear ratio of the first gear part to the second gear part is greater than 2.
[0006] The second mode of thermal management system disclosed in the present invention is a thermal management system arranged in an electrical device, wherein the thermal management system includes: a switching device involved in the first mode; a first flow path, a second flow path, a third flow path and a fourth flow path, which can supply heat medium to circulate; a power storage device, which exchanges heat with the heat medium flowing in the first flow path; a driving device, which exchanges heat with the heat medium flowing in the second flow path to supply driving force to the electrical device; a radiator, which is arranged in the third flow path; and a cooler, which is arranged in the fourth flow path, and the first five-way switching part and the second five-way switching part in the switching device can switch the connection state of the first flow path, the second flow path, the third flow path and the fourth flow path.
[0007] According to the present disclosure, it is possible to provide a switching device and a heat management system that can ensure the number of modes that can be switched by a single drive unit. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Features, advantages, and technical and industrial significance of exemplary embodiments of the present invention will be described below with reference to the accompanying drawings, in which like symbols represent like elements, and in which:
[0009] Figure 1 is a diagram showing a structure of a thermal management circuit including a switching device in one embodiment of the present disclosure;
[0010] Figure 2 is an exploded perspective view schematically showing a switching device;
[0011] Figure 3A is a diagram schematically showing a first mode of a thermal management circuit;
[0012] Figure 3B is a diagram schematically showing the structure of a first five-way switching unit in a first mode;
[0013] Figure 3C is a diagram schematically showing the structure of the second five-way switching unit in the first mode;
[0014] Figure 4A is a diagram schematically showing a second mode of the thermal management circuit;
[0015] Figure 4B is a diagram schematically showing the structure of the first five-way switching unit in the second mode;
[0016] Figure 4C is a diagram schematically showing the structure of the second five-way switch in the second mode;
[0017] Figure 5A is a diagram schematically showing a third mode of the thermal management circuit;
[0018] Figure 5B is a diagram schematically showing the structure of the first five-way switching unit in the third mode;
[0019] Figure 5C is a diagram schematically showing the structure of the second five-way switch in the third mode;
[0020] Fig. 6A is a diagram schematically showing a fourth mode of the thermal management circuit;
[0021] Figure 6B is a diagram schematically showing the structure of the first five-way switching unit in the fourth mode;
[0022] Figure 6Cis a diagram schematically showing the structure of the second five-way switching unit in the fourth mode;
[0023] Fig. 7A is a diagram schematically showing a fifth mode of the thermal management circuit;
[0024] Figure 7B is a diagram schematically showing the structure of the first five-way switch in the fifth mode; and
[0025] Figure 7C 2 is a diagram schematically showing the structure of the second five-way switch in the fifth mode. DETAILED DESCRIPTION
[0026] Hereinafter, one embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and their description will not be repeated.
[0027] Figure 1 1 is a diagram showing the structure of a thermal management circuit including a switching device in one embodiment of the present disclosure. The thermal management circuit 1 is preferably applied to electrical equipment. As the electrical equipment, an electrified vehicle equipped with a battery 173 for driving can be cited. The electrified vehicle is, for example, a battery electric vehicle (BEV). The electrified vehicle can also be a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHEV), or a fuel cell electric vehicle (FCEV). However, the use of the thermal management circuit 1 in the present disclosure is not limited to vehicles.
[0028] <Overall Structure>
[0029] Figure 1 1 is a diagram showing the overall structure of a heat management circuit. The heat management circuit 1 is configured to allow a medium (water, etc.) for supplying and receiving heat to flow. The heat management circuit 1 includes, for example, a high temperature circuit 110, a radiator 120, a low temperature circuit 130, a condenser 140, a refrigeration cycle 150, a cooler 160, a battery circuit 170, and a switching device 200.
[0030] The high temperature circuit 110 includes a flow path 110a, a flow path 110b and a heat medium (water, etc.) not shown in the figure. The flow path 110a sequentially connects a water pump (W / P) 111, an electric heater 112, a three-way valve 113, a heater core 114, a liquid storage tank (R / T) 115, a water pump 111, an electric heater 112, a three-way valve 113, a liquid storage tank 115 and a water pump 111, and the flow path 110b sequentially connects the three-way valve 113, the heater core 114 and the liquid storage tank 115.
[0031] The water pump 111 delivers the heat medium flowing out of the reservoir tank 115 toward the electric heater 112. The electric heater 112 heats the heat medium. The heater core 114 heats the air supplied to the vehicle cabin (not shown) of the electric vehicle through the heat medium. The reservoir tank 115 maintains the pressure and amount of the heat medium in the high temperature circuit 110 by storing a part of the heat medium in the high temperature circuit 110.
[0032] like Figure 1 As shown, the high temperature circuit 110 is provided with a high temperature radiator 121 and a condenser 140. The high temperature radiator 121 is provided at a location downstream of the three-way valve 113 and upstream of the liquid storage tank 115 in the flow path 110a. The high temperature radiator 121 exchanges heat between the heat medium and the outside air. The condenser 140 is provided at a location downstream of the water pump 111 and upstream of the electric heater 112 in the flow path 110a. The condenser 140 exchanges heat between the heat medium and the working medium (water, a medium with a lower boiling point than water, etc.) in the refrigeration cycle 150.
[0033] The three-way valve 113 switches the flow path of the heat medium so that the heat medium flows through at least one of the first path and the second path. The first path is a path in which the heat medium circulates in the water pump 111-condenser 140-electric heater 112-three-way valve 113-high temperature radiator 121-liquid storage tank 115-water pump 111 in sequence. The second path is a path in which the heat medium circulates in the water pump 111-condenser 140-electric heater 112-three-way valve 113-heater core 114-liquid storage tank 115-water pump 111 in sequence.
[0034] The low-temperature circuit 130 includes, for example: a water pump 131; an electric power supply unit (ESU) 132; a power control unit (PCU) 133; an oil cooler (O / C) 134; a transmission drive axle 135; a liquid storage tank 136; circulation paths 130a, 130b, which connect the water pump 131, ESU132, PCU 133, oil cooler 134 and liquid storage tank 136 in sequence; and a heat medium (water, etc.) not shown in the figure.
[0035] The water pump 131 delivers the heat medium flowing out of the reservoir tank 136 to the ESU 132. The ESU 132 controls the charging and discharging of the battery 173, etc. The PCU 133 converts the DC power supplied from the battery 173 into AC power, and supplies the AC power to the motor (not shown) built into the transaxle 135. The oil cooler 134 circulates the lubricating oil of the motor using an electric oil pump (not shown). The oil cooler 134 cools the lubricating oil by exchanging heat between the heat medium flowing in the circulation flow path and the lubricating oil. Thus, the transaxle 135 is cooled. The ESU 132, the PCU 133, and the oil cooler 134 are cooled by the heat medium flowing in the circulation flow path. The reservoir tank 136 maintains the pressure and amount of the heat medium in the low-temperature circuit 130 by storing a part of the heat medium in the low-temperature circuit 130.
[0036] like Figure 1 As shown, a low-temperature radiator 122 is provided in the low-temperature circuit 130. The low-temperature radiator 122 is provided at a location downstream of the oil cooler 134 and upstream of the liquid storage tank 136 in the circulation flow paths 130a and 130b. The low-temperature radiator 122 is arranged near the high-temperature radiator 121. The heat medium flowing in the low-temperature radiator 122 exchanges heat with the heat medium flowing in the high-temperature radiator 121. Figure 1 As shown, the high temperature radiator 121 and the low temperature radiator 122 constitute a single radiator 120. That is, the radiator 120 is connected to (ie, shared with) both the high temperature circuit 110 and the low temperature circuit 130.
[0037] Refrigeration cycle 150 is connected to condenser 140 and cooler 160. Refrigeration cycle 150 includes compressor 151, expansion valve 152, evaporator 153, evaporation pressure regulating valve (EPR) 154, expansion valve 155, and working medium (water, medium with a lower boiling point than water, etc.) not shown.
[0038] The compressor 151 compresses the working medium. The condenser 140 condenses the working medium by exchanging heat between the working medium in the gas phase discharged from the compressor 151 and the heat medium flowing in the high temperature circuit 110. The expansion valve 152 and the expansion valve 155 expand the working medium flowing out of the condenser 140. The evaporator 153 evaporates the working medium by exchanging heat between the working medium flowing out of the expansion valve 152 and the air supplied to the vehicle cabin in the electric vehicle. The evaporation pressure regulating valve 154 adjusts the pressure of the working medium flowing out of the evaporator 153. The cooler 160 evaporates the working medium by exchanging heat between the working medium flowing out of the expansion valve 155 and the heat medium flowing in the battery circuit 170. The gaseous working medium flowing out of the evaporation pressure regulating valve 154 and the cooler 160 flows into the compressor 151.
[0039] The battery circuit 170 includes, for example, a water pump 171, an electric heater 172, a battery 173, and circulation paths 170a and 170b that sequentially connect the water pump 171, the electric heater 172, and the battery 173. The battery 173 is an example of the "power storage device" in the present disclosure.
[0040] The water pump 171 circulates the heat medium in the battery circuit 170. The electric heater 172 heats the heat medium circulating in the circulation flow path. The battery 173 supplies power for running to the motor built into the transaxle. The battery 173 can be heated by the electric heater 172 or cooled by the cooler 160.
[0041] like Figure 1 As shown, a cooler 160 is connected to the battery circuit 170. The cooler 160 is connected to a portion of the circulation flow paths 170a and 170b that is downstream of the water pump 171 and upstream of the electric heater 172. The cooler 160 cools the heat medium circulating in the battery circuit 170 by exchanging heat between the working medium circulating in the refrigeration cycle 150 and the heat medium circulating in the battery circuit 170.
[0042] The switching device 200 is connected to the low temperature circuit 130 and the battery circuit 170. The switching device 200 includes a first five-way switching unit 210, a second five-way switching unit 220, a connecting flow path 200a, and a driving unit 230.
[0043] The first five-way switching part 210 has five ports P1 to P5. The second five-way switching part 220 has five ports P6 to P10. In the present embodiment, the first five-way switching part 210 and the second five-way switching part 220 are each composed of a five-way valve.
[0044] like Figure 1 As shown, the first five-way switching unit 210 is connected to a portion of the circulation flow path of the low-temperature circuit 130 downstream of the oil cooler 134 and upstream of the low-temperature radiator 122, and a portion of the circulation flow path of the battery circuit 170 downstream of the cooler 160 and upstream of the electric heater 172. The second five-way switching unit 220 is connected to a portion of the circulation flow path of the low-temperature circuit 130 downstream of the low-temperature radiator 122 and upstream of the reservoir tank 136, and a portion of the circulation flow path of the battery circuit 170 downstream of the battery 173 and upstream of the water pump 171.
[0045] Each of the five-way switching parts 210 and 220 is connected to the low-temperature circuit 130 and the battery circuit 170, whereby the circulation flow path of the low-temperature circuit 130 is divided into a flow path 130a that sequentially connects the first five-way switching part 210, the low-temperature radiator 122, and the second five-way switching part 220, and a flow path 130b that sequentially connects the second five-way switching part 220, the reservoir 136, the water pump 131, the ESU 132, the PCU 133, the oil cooler 134, and the first five-way switching part 210. The flow path 130b is in thermal contact with the ESU 132, the PCU 133, and the oil cooler 134. In addition, the flow path 130a is an example of the "third flow path" in the present disclosure, and the flow path 130b is an example of the "second flow path" in the present disclosure.
[0046] Each of the five-way switching parts 210 and 220 is connected to the low-temperature circuit 130 and the battery circuit 170, whereby the circulation flow path of the battery circuit 170 is divided into a flow path 170a that sequentially connects the second five-way switching part 220, the water pump 171, the cooler 160, and the first five-way switching part 210, and a flow path 170b that sequentially connects the first five-way switching part 210, the electric heater 172, the battery 173, and the second five-way switching part 220. The flow path 170b is in thermal contact with the battery 173. In addition, the flow path 170a is an example of the "fourth flow path" in the present disclosure, and the flow path 170b is an example of the "first flow path" in the present disclosure.
[0047] The switching device 200 can switch the connection states of the flow path 170 b (first flow path), the flow path 130 b (second flow path), the flow path 130 a (third flow path), and the flow path 170 a (fourth flow path).
[0048] Figure 2 is an exploded perspective view schematically showing a switching device. Figure 2 As shown, the first five-way switching portion 210 has a bottom body 212 , a top body 214 and a first switching plate 216 .
[0049] The bottom body 212 has three spaces S2, S3, and S5, and has a shape that opens the three spaces S2, S3, and S5 upward. Specifically, the bottom body 212 has a bottom wall 212a, an outer peripheral wall 212b, an inner peripheral wall 212c, and a partition wall 212d.
[0050] The bottom wall 212 a is formed in a disk shape and has an insertion hole formed in the center portion of the bottom wall 212 a for inserting a first shaft (not shown).
[0051] The outer peripheral wall 212b stands up from the peripheral edge of the bottom wall 212a. The outer peripheral wall 212b is formed in a cylindrical shape. The second port P2, the third port P3, and the fifth port P5 are connected to the outer peripheral wall 212b.
[0052] The inner peripheral wall 212c rises from the area around the insertion hole in the bottom wall 212a. The inner peripheral wall 212c is formed in a cylindrical shape. The first shaft is inserted into the inner side of the inner peripheral wall 212c.
[0053] The partition wall 212d divides the space between the outer peripheral wall 212b and the inner peripheral wall 212c into three spaces, namely, a second space S2, a third space S3, and a fifth space S5. The second space S2 is a space connected to the second port P2. The third space S3 is a space connected to the third port P3. The fifth space S5 is a space connected to the fifth port P5. The second space S2, the third space S3, and the fifth space S5 are arranged in a circumferential direction of the outer peripheral wall 212b.
[0054] The top body 214 has two spaces S1 and S4 and has a shape that opens the two spaces S1 and S4 downward. Specifically, the top body 214 has a top wall 214a, an outer peripheral wall 214b, an inner peripheral wall 214c, and a partition wall 214d.
[0055] The top wall 214a is formed in a disk shape. An insertion hole h14 for inserting the first shaft is formed in the center of the top wall 214a.
[0056] The outer peripheral wall 214b extends downward from the peripheral edge of the top wall 214a. The outer peripheral wall 214b is formed in a cylindrical shape. The first port P1 and the fourth port P4 are connected to the outer peripheral wall 214b.
[0057] The inner peripheral wall 214c extends downward from a portion around the insertion hole h14 in the top wall 214a. The inner peripheral wall 214c is formed in a cylindrical shape. The first shaft is inserted into the inner side of the inner peripheral wall 214c.
[0058] The partition wall 214d divides the space between the outer peripheral wall 214b and the inner peripheral wall 214c into two spaces, namely, a first space S1 and a fourth space S4. The first space S1 is a space connected to the first port P1. The fourth space S4 is a space connected to the fourth port P4. The fourth space S4 is arranged on the inner side of the first space S1 in the radial direction of the outer peripheral wall 214b.
[0059] The first switching plate 216 switches the connection state from the first port P1 to the fifth port P5. The first switching plate 216 is arranged between the bottom body 212 and the top body 214. The first switching plate 216 is formed in a circular plate shape. In the central part of the first switching plate 216, a shaft connecting portion 216a connected to the first shaft is provided in a manner that rotates together with the first shaft in a state where the first shaft is inserted. The first switching plate 216 is driven by the driving unit 230 via the first shaft. A groove 216b for releasing pressure is formed on the lower surface of the first switching plate 216.
[0060] A first communication port h1 and a fourth communication port h4 are formed in the first switching plate 216. The first communication port h1 is formed at a position connected to the first space S1 in the first switching plate 216. The fourth communication port h4 is formed at a position connected to the fourth space S4 in the first switching plate 216. The phase difference between the first communication port h1 and the fourth communication port h4 is set to 210 degrees.
[0061] The second five-way switching portion 220 has a bottom body 222 , a top body 224 and a second switching plate 226 .
[0062] The bottom body 222 has six spaces S6, S6a, S8, S8a, S10, and S10a, and has a shape in which the six spaces S6, S6a, S8, S8a, S10, and S10a are opened upward. The structure of the bottom body 222 is similar to that of the bottom body 212. Specifically, the shape of the partition wall 222d of the bottom body 222 is different from the shape of the partition wall 212d of the bottom body 212. The partition wall 222d divides the space between the outer peripheral wall 222b and the inner peripheral wall 222c into six spaces, namely, the sixth space S6, the tenth relative space S10a, the eighth space S8, the sixth relative space S6a, the tenth space S10, and the eighth relative space S8a. In more detail, the partition wall 222d divides the space between the outer peripheral wall 222b and the inner peripheral wall 222c in such a manner that the sixth space S6, the tenth relative space S10a, the eighth space S8, the sixth relative space S6a, the tenth space S10 and the eighth relative space S8a are arranged in sequence along the circumferential direction. The sixth relative space S6a is opposite to the sixth space S6 across the second axis (not shown). The eighth relative space S8a is opposite to the eighth space S8 across the second axis. The tenth relative space S10a is opposite to the tenth space S10 across the second axis. The central angle of the sixth space S6 is set to be three times the central angle of the sixth relative space S6a. The same applies to the eighth space S8 and the tenth space S10.
[0063] The outer peripheral wall 222 b is connected to a sixth port P6 connected to the sixth space S6 , an eighth port P8 connected to the eighth space S8 , and a tenth port P10 connected to the tenth space S10 .
[0064] The top body 224 has two spaces S7 and S9, and has a shape that opens the two spaces S7 and S9 downward. The structure of the top body 224 is the same as that of the top body 214. The outer peripheral wall 224b is connected to a seventh port P7 connected to the seventh space S7 and a ninth port P9 connected to the ninth space S9.
[0065] The second switching plate 226 switches the connection state of the sixth port P6 to the tenth port P10. The structure of the second switching plate 226 is similar to that of the first switching plate 216. The second switching plate 226 is formed with a shaft connection portion 226a, a groove 226b for releasing pressure, a pair of seventh communication ports h7, and a ninth communication port h9.
[0066] Each seventh communication port h7 is formed at a position connected to the seventh space S7 in the second switching plate 226. The phase difference between a pair of seventh communication ports h7 is set to 180 degrees. Figure 2 In the example shown, one seventh communication port h7 connects the seventh space S7 with the eighth space S8, and another seventh communication port h7 connects the seventh space S7 with the eighth relative space S8a. In this case, the eighth space S8 and the eighth relative space S8a are connected to each other via the seventh space S7, so the seventh space S7, the eighth space S8 and the eighth relative space S8a form a single space. Therefore, the heat medium flowing in from the eighth port P8 flows out from the seventh port P7. The ninth communication port h9 is formed at a position connected to the ninth space S9 in the second switching plate 226. The phase difference between each seventh communication port h7 and the ninth communication port h9 is set to 90 degrees.
[0067] The connecting flow path 200a connects the second port P2 and the sixth port P6. Figure 2 As shown, the heat medium flows from the second port P2 toward the sixth port P6.
[0068] The driving unit 230 drives the first five-way switching portion 210 and the second five-way switching portion 220. The driving unit 230 has a first gear portion 232, a second gear portion 234, and a single driving portion 236.
[0069] The first gear portion 232 can drive the first switching plate 216. The first gear portion 232 meshes with the first shaft. That is, the first gear portion 232 can drive the first switching plate 216 via the first shaft.
[0070] The second gear portion 234 can drive the second switching plate 226. The second gear portion 234 meshes with the second shaft. That is, the second gear portion 234 can drive the second switching plate 226 via the second shaft. The gear ratio of the first gear portion 232 to the second gear portion 234 is 2 or more. In this embodiment, the gear ratio is set to 2.
[0071] The driving unit 236 drives the first gear unit 232 and the second gear unit 234. As the driving unit 236, for example, a motor can be cited. When the driving unit 236 is driven, the first gear unit 232 and the second gear unit 234 are driven synchronously as a whole. In this embodiment, the gear ratio is set to 2, so when the first shaft and the first switching plate 216 rotate by a predetermined angle due to the drive of the driving unit 236, the second shaft and the second switching plate 226 rotate by twice the angle.
[0072] <mode>
[0073] Next, a description will be given of a plurality of modes in the heat management circuit 1 formed by switching the switching device 200. The switching of the switching device 200 (driving of the driving unit 236) is performed by a control unit (ECU, etc.) not shown in the figure.
[0074] [First Mode]
[0075] FIG. 3A to FIG. 3C The first mode of the thermal management circuit 1 including the switching device 200 is schematically shown. FIG. 3A to FIG. 3C In FIG. 2 , the driving unit 230 is omitted. Figure 4A The same will be true in the future.
[0076] like FIG. 3A to FIG. 3C As shown, in the first mode, the first communication port h1 of the first switching plate 216 connects the first space S1 with the second space S2, and the fourth communication port h4 connects the fourth space S4 with the fifth space S5. In addition, the seventh communication port h7 of the second switching plate 226 connects the seventh space S7 with the eighth space S8, and the ninth communication port h9 connects the ninth space S9 with the sixth space S6.
[0077] In this state, the heat medium flowing into the first space S1 from the first port P1 flows out from the second port P2 via the first connecting port h1 and the second space S2. The heat medium flowing out from the second port P2 flows into the sixth space S6 from the sixth port P6 through the connecting flow path 200a, and flows out from the ninth port P9 via the ninth connecting port h9 and the ninth space S9. The heat medium flowing out from the ninth port P9 exchanges heat with the working medium flowing in the cooler 160 when the refrigeration cycle 150 is working, and then flows toward the fourth port P4. The heat medium flowing into the fourth space S4 from the fourth port P4 flows out from the fifth port P5 via the fourth connecting port h4 and the fifth space S5. The heat medium flowing out from the fifth port P5 flows toward the eighth port P8 via the low-temperature radiator 122. The heat medium flowing into the eighth space S8 from the eighth port P8 flows out from the seventh port P7 via the seventh connecting port h7 and the seventh space S7.
[0078] That is, in the first mode, if Figure 3AAs shown, a circuit is formed in which the heat medium circulates in the flow path 130 b , the connecting flow path 200 a , the flow path 170 a , and the flow path 130 a in sequence, and the flow path 170 b (battery 173 ) is cut off from the circuit.
[0079] [Function of the first mode]
[0080] In the first mode, by reducing the waste heat of the PCU 133 and the like and the operating efficiency of the PCU 133 and the like, the heat (created heat) generated in the PCU 133 and the like can be used for heating the cabin of the electric vehicle. In addition, since the battery 173 is disconnected from the above-mentioned circuit, for example, during the temperature increase process of the battery 173 including the self-temperature increase of the battery 173, the battery 173 is suppressed from being cooled by the heat medium flowing in the above-mentioned circuit. In addition, the excess heat generated by the PCU 133 and the like is released to the outside air in the low-temperature radiator 122. In addition, the heat recovered by the low-temperature radiator 122 can also be supplied to the cooler 160 (outside air heat pump).
[0081] [Second Mode]
[0082] FIG. 4A to FIG. 4C The second mode of the thermal management circuit 1 including the switching device 200 is schematically shown. FIG. 4A to FIG. 4C As shown, in the second mode, the first communication port h1 of the first switching plate 216 connects the first space S1 with the second space S2, and the fourth communication port h4 connects the fourth space S4 with the fifth space S5. In addition, the seventh communication port h7 of the second switching plate 226 connects the seventh space S7 with the sixth space S6, and the ninth communication port h9 connects the ninth space S9 with the eighth space S8.
[0083] In the second mode, if Figure 4A As shown, a first circuit 21 in which the heat medium circulates in the flow path 130 b and the connecting flow path 200 a in sequence and a second circuit 22 in which the heat medium circulates in the flow path 170 a and the flow path 130 a in sequence are formed, and the flow path 170 b (battery 173 ) is disconnected from the first circuit 21 and the second circuit 22 .
[0084] In addition, the first circuit 21 and the second circuit 22 are connected through the groove 216b. Through this connection, the pressure of the first circuit 21 and the pressure of the second circuit 22 are equalized without the heat medium passing through the groove 216b.
[0085] [Function of the second mode]
[0086] In the second mode, in the first circuit 21, waste heat of the PCU 133 and the like is stored in the heat medium, while in the second circuit 22, heat recovered by the low-temperature radiator 122 can be supplied to the cooler 160 (external air heat pump). In addition, for example, in the temperature increase process of the battery 173 including the self-temperature increase of the battery 173, cooling of the battery 173 by the heat medium is suppressed.
[0087] [Third Mode]
[0088] FIG. 5A to FIG. 5C The third mode of the thermal management circuit 1 including the switching device 200 is schematically shown. FIG. 5A to FIG. 5C As shown, in the third mode, the first communication port h1 of the first switching plate 216 connects the first space S1 with the fifth space S5, and the fourth communication port h4 connects the fourth space S4 with the second space S2. In addition, the seventh communication port h7 of the second switching plate 226 connects the seventh space S7 with the eighth space S8, and the ninth communication port h9 connects the ninth space S9 with the sixth space S6.
[0089] In the third mode, if Figure 5A As shown, a first circuit 31 in which the heat medium circulates in the flow paths 130a and 130b in sequence and a second circuit 32 in which the heat medium circulates in the flow path 170a and the connecting flow path 200a in sequence are formed, and the flow path 170b (battery 173) is disconnected from the first circuit 31 and the second circuit 32.
[0090] [Function of the third mode]
[0091] In the third mode, in the first circuit 31, waste heat from the PCU 133 and the like is released through the low-temperature radiator 122, and cooling of the battery 173 by the heat medium is suppressed during the temperature increase process of the battery 173, including the self-temperature increase of the battery 173. In addition, in the third mode, the water pump 171 may be stopped.
[0092] [Fourth Mode]
[0093] FIG. 6A to FIG. 6C A fourth mode of the thermal management circuit 1 including the switching device 200 is schematically shown. FIG. 6A to FIG. 6C As shown, in the third mode, the first communication port h1 of the first switching plate 216 connects the first space S1 with the third space S3, and the fourth communication port h4 connects the fourth space S4 with the second space S2. In addition, the seventh communication port h7 of the second switching plate 226 connects the seventh space S7 with the tenth space S10, and the ninth communication port h9 connects the ninth space S9 with the sixth space S6.
[0094] In the fourth mode, if Fig. 6AAs shown, a first circuit 41 in which the heat medium circulates in the flow path 130 b and the flow path 170 b in sequence and a second circuit 42 in which the heat medium circulates in the flow path 170 a and the connecting flow path 200 a in sequence are formed, and the flow path 130 a (low-temperature radiator 122 ) is cut off from the first circuit 41 and the second circuit 42 .
[0095] [Function of the fourth mode]
[0096] In the fourth mode, waste heat from PCU 133 and the like is used to increase the temperature of battery 173 in first circuit 41, and is suppressed from being released through low-temperature radiator 122. In the fourth mode, water pump 171 may be stopped.
[0097] [Fifth Mode]
[0098] FIG. 7A to FIG. 7C A fifth mode of the thermal management circuit 1 including the switching device 200 is schematically shown. FIG. 7A to FIG. 7C As shown, in the fifth mode, the first communication port h1 of the first switching plate 216 connects the first space S1 with the second space S2, and the fourth communication port h4 connects the fourth space S4 with the third space S3. In addition, the seventh communication port h7 of the second switching plate 226 connects the seventh space S7 with the sixth space S6, and the ninth communication port h9 connects the ninth space S9 with the tenth space S10.
[0099] In the fifth mode, if Fig. 7A As shown, a first circuit 51 in which the heat medium circulates in the flow path 130 b and the connecting flow path 200 a in sequence and a second circuit 52 in which the heat medium circulates in the flow paths 170 a and 170 b in sequence are formed, and the flow path 130 a (low-temperature radiator 122 ) is cut off from the first circuit 51 and the second circuit 52 .
[0100] [Function of the fifth mode]
[0101] In the fifth mode, waste heat from PCU 133 and the like is stored in heat medium in first circuit 51, while heat generated by battery 173 is released through cooler 160 in second circuit 52. Heat dissipation in low-temperature radiator 122 is suppressed.
[0102] [Other modes]
[0103] Although not shown in the figure, the switching device 200 can also switch the heat management circuit 1 to a mode different from the above-mentioned modes. As such a mode, for example, the following modes can be mentioned.
[0104] [Sixth Mode]
[0105] In the sixth mode, the first communication port h1 of the first switching plate 216 connects the first space S1 with the fifth space S5, and the fourth communication port h4 connects the fourth space S4 with the third space S3. In addition, the seventh communication port h7 of the second switching plate 226 connects the seventh space S7 with the eighth space S8, and the ninth communication port h9 connects the ninth space S9 with the tenth space S10.
[0106] [Function of the sixth mode]
[0107] In the sixth mode, for example, waste heat from PCU 133 or the like is released through low-temperature radiator 122 , and heat generated by battery 173 is released through cooler 160 .
[0108] [Seventh Mode]
[0109] In the seventh mode, the first communication port h1 of the first switching plate 216 connects the first space S1 with the second space S2, and the fourth communication port h4 connects the fourth space S4 with the third space S3. In addition, the seventh communication port h7 of the second switching plate 226 connects the seventh space S7 with the tenth space S10, and the ninth communication port h9 connects the ninth space S9 with the sixth space S6.
[0110] [Function of the seventh mode]
[0111] In the seventh mode, for example, waste heat from PCU 133 and the like and heat generated by battery 173 are released through cooler 160. In addition, waste heat from PCU 133 and the like can be used to increase the temperature of battery 173 when refrigeration cycle 150 is not operating.
[0112] [Eighth Mode]
[0113] In the eighth mode, the first communication port h1 of the first switching plate 216 connects the first space S1 with the third space S3, and the fourth communication port h4 connects the fourth space S4 with the fifth space S5. In addition, the seventh communication port h7 of the second switching plate 226 connects the seventh space S7 with the tenth space S10, and the ninth communication port h9 connects the ninth space S9 with the eighth space S8.
[0114] [Function of the eighth mode]
[0115] In the eighth mode, for example, waste heat from PCU 133 and the like can be used to increase the temperature of battery 173. In addition, heat recovered by low-temperature radiator 122 can be supplied to cooler 160 (outside air heat pump).
[0116] [Ninth Mode]
[0117] In the ninth mode, the first communication port h1 of the first switching plate 216 connects the first space S1 with the third space S3, and the fourth communication port h4 connects the fourth space S4 with the fifth space S5. In addition, the seventh communication port h7 of the second switching plate 226 connects the seventh space S7 with the eighth space S8, and the ninth communication port h9 connects the ninth space S9 with the tenth space S10.
[0118] [Function of the ninth mode]
[0119] In the ninth mode, for example, waste heat of the PCU 133 and the like and heat generated by the battery 173 are released through the cooler 160 and the low-temperature radiator 122. In addition, the heat recovered by the low-temperature radiator 122, the waste heat of the PCU 133 and the like and heat generated by the battery 173 can be supplied to the cooler 160 (external air heat pump).
[0120] As described above, in the switching device 200 of this embodiment, the gear ratio of the first gear portion 232 to the second gear portion 234 is 2, so the combinations of phases of the switching plates 216 and 226 increase. Therefore, the number of modes that can be switched by a single drive unit 236 can be ensured.
[0121] In addition, the switching device 200 may include the first five-way switching portion 210 and the second five-way switching portion 220 in a single housing. In this case, the connecting flow path 200a may be formed of a groove or a flow path provided in the housing.
[0122] Those skilled in the art will appreciate that the above exemplary embodiments are specific examples of the following aspects.
[0123] [Method 1]
[0124] A switching device can be arranged in a thermal management circuit, wherein: The switching device comprises: A first five-way switching unit; a second five-way switching portion; and a driving unit, driving the first five-way switching part and the second five-way switching part, The first five-way switching portion includes a first switching plate, The second five-way switching portion includes a second switching plate, The driving unit comprises: a first gear unit capable of driving the first switching plate; a second gear portion capable of driving the second switching plate; and a driving unit, driving the first gear unit and the second gear unit, A gear ratio of the first gear portion to the second gear portion is 2 or more.
[0125] In this switching device, since the gear ratio of the first gear portion to the second gear portion is greater than 2, the combinations of phases of the switching plates increase. Therefore, the number of modes that can be switched by a single drive unit (motor, etc.) can be ensured.
[0126] [Method 2]
[0127] A thermal management system is provided in an electrical device, wherein: The thermal management system comprises: The switching device described in method 1; The first flow path, the second flow path, the third flow path and the fourth flow path are capable of allowing the heat medium to flow; an electric storage device for exchanging heat with the heat medium flowing in the first flow path; a driving device that exchanges heat with the heat medium flowing in the second flow path and supplies driving force to the electrical device; a radiator, disposed in the third flow path; and A cooler is provided in the fourth flow path, The first five-way switching portion and the second five-way switching portion in the switching device can switch the connection states of the first flow path, the second flow path, the third flow path, and the fourth flow path.
[0128] It should be noted that the embodiments disclosed this time should be understood in all aspects as illustrative rather than restrictive. The scope of the present invention is not shown by the description of the above embodiments but by the claims, and includes all changes within the meaning and scope equivalent to the claims.
Claims
1. A switching device, which can be arranged in a thermal management circuit, wherein: The switching device comprises: A first five-way switching unit; a second five-way switching portion; and a driving unit, driving the first five-way switching part and the second five-way switching part, The first five-way switching portion includes a first switching plate, The second five-way switching portion includes a second switching plate, The driving unit comprises: a first gear unit capable of driving the first switching plate; a second gear portion capable of driving the second switching plate; and a driving unit, driving the first gear unit and the second gear unit, A gear ratio of the first gear portion to the second gear portion is 2 or more.
2. A thermal management system, provided in an electrical device, wherein: The thermal management system comprises: The switching device according to claim 1; The first flow path, the second flow path, the third flow path and the fourth flow path are capable of allowing the heat medium to flow; an electric storage device for exchanging heat with the heat medium flowing in the first flow path; a driving device that exchanges heat with the heat medium flowing in the second flow path and supplies driving force to the electrical device; a radiator, disposed in the third flow path; and A cooler is provided in the fourth flow path, The first five-way switching portion and the second five-way switching portion in the switching device can switch the connection states of the first flow path, the second flow path, the third flow path, and the fourth flow path.
Citation Information
Patent Citations
Thermal management system for electric car
JP2021154767A