Electrocaloric refrigeration system and household appliance

Abstract

The invention relates to the technical field of electronic equipment refrigeration, and discloses an electrocaloric refrigeration system. The electrocaloric refrigeration system comprises a heat exchange module, a driving module and a control module. The heat exchange module comprises a shell and an electric card element arranged in the shell, the interior of the shell is divided into a first heat transfer space and a second heat transfer space by the electric card element, and the electric card element absorbs heat or releases heat under the action of an external electric field. The driving module is communicated with the interior of the heat exchange module shell. The control module controls the driving module to move towards the first heat transfer space to be attached to the first inner end face of the shell when the electrocaloric element releases heat, or controls the driving module to move towards the second heat transfer space to be attached to the second inner end face of the shell when the electrocaloric element absorbs heat. The driving module communicates with the first heat transfer space and the second heat transfer space in the heat exchange module shell and can drive the electric card element to move in the two heat transfer spaces to be attached to different end faces when the electric card element is driven to release heat and absorb heat, and separation of cold energy and heat energy of the electric card element is achieved. The invention further discloses the household appliance.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment refrigeration, for example, to an electric card refrigeration system and household electrical appliances. Background Art

[0002] Compressor refrigeration products use fluorinated refrigerants, which will produce a greenhouse effect during production and use, and there is a risk of leakage and environmental pollution. With the development of modern society, the huge demand for refrigeration has exacerbated the global energy crisis, the frequent occurrence of extreme high temperature weather and natural disasters. The new refrigeration technology based on the electrocaloric effect does not need to use the compressor and refrigerant required by common refrigerators. However, the heat and cold of electrocaloric materials are concentrated, and they cannot be separated by themselves for practical application.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0004] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0005] The disclosed embodiment provides an electric card refrigeration system and a household appliance, wherein a driving module is connected to a first heat transfer space and a second heat transfer space in a heat exchange module housing, and can drive the electric card element to displace in the two heat transfer spaces to fit different end faces when releasing and absorbing heat, thereby realizing the separation of cooling and heating of the electric card element. Furthermore, the electric card element has a small movement resistance and is driven by an external driving force, and the control process is simple.

[0006] In some embodiments, the electric card refrigeration system includes a heat exchange module, a drive module and a control module. The heat exchange module includes a shell and an electric card element disposed in the shell. The electric card element divides the shell into a first heat transfer space and a second heat transfer space. The electric card element absorbs or releases heat under the action of an external electric field. The drive module is connected to the shell of the heat exchange module. The control module controls the drive module to move toward the first heat transfer space to fit the first inner end face of the shell when the electric card element releases heat, or to move toward the second heat transfer space to fit the second inner end face of the shell when the electric card element absorbs heat.

[0007] Optionally, the driving module includes an air pump assembly, a first ventilation pipe and / or a second ventilation pipe. The air pump assembly is used for pumping or inflating. One end of the first ventilation pipe is connected to the air pump assembly, and the other end is connected to the first heat transfer space. One end of the second ventilation pipe is connected to the air pump assembly, and the other end is connected to the second heat transfer space.

[0008] Optionally, when the driving module includes an air pump assembly and a first ventilation pipe, the air pump assembly draws air from the first heat transfer space through the first ventilation pipe, so that the electric card element is displaced toward the first heat transfer space to fit the first inner end surface of the shell, or the air pump assembly inflates air into the first heat transfer space through the first ventilation pipe, so that the electric card element is displaced toward the second heat transfer space to fit the second inner end surface of the shell. When the driving module includes an air pump assembly and a second ventilation pipe, the air pump assembly inflates air into the second heat transfer space through the second ventilation pipe, so that the electric card element is displaced toward the first heat transfer space to fit the first inner end surface of the shell, or the air pump assembly draws air from the second heat transfer space through the second ventilation pipe, so that the electric card element is displaced toward the second heat transfer space to fit the second inner end surface of the shell. When the driving module includes an air pump assembly, a first ventilation pipe and a second ventilation pipe, the air pump assembly draws air from the first heat transfer space through the first ventilation pipe, and / or inflates air into the second heat transfer space through the second ventilation pipe, so that the electric card element is displaced toward the first heat transfer space to fit the first inner end surface of the shell; or, the air pump assembly inflates air into the first heat transfer space through the first ventilation pipe, and / or draws air from the second heat transfer space through the second ventilation pipe, so that the electric card element is displaced toward the second heat transfer space to fit the second inner end surface of the shell.

[0009] Optionally, when the driving module includes a first ventilation pipe, the shell is provided with a first through hole corresponding to the first heat transfer space, and the first ventilation pipe passes through the first through hole and extends into the first heat transfer space. When the driving module includes a second ventilation pipe, the shell is provided with a second through hole corresponding to the second heat transfer space, and the second ventilation pipe passes through the second through hole and extends into the second heat transfer space.

[0010] Optionally, the electric card element includes a base layer, a refrigeration function layer, a first electrode layer and a second electrode layer. The base layer includes a support portion and a clamping portion arranged around the support portion. The refrigeration function layer is arranged on the support portion of the base layer. The first electrode layer is arranged between the base layer and the refrigeration function layer. The second electrode layer is arranged on the end surface of the refrigeration function layer away from the base layer. The first electrode layer and the second electrode layer are used to periodically apply an electric field to the refrigeration function layer so that the refrigeration function layer absorbs or releases heat.

[0011] Optionally, a clamping portion is provided on the circumference of the shell side wall of the heat exchange module, wherein the clamping portion of the electric card element is clamped in the clamping portion.

[0012] Optionally, a heat insulation layer is provided between the clamping portion of the shell side wall and the clamping portion of the electric card element.

[0013] Optionally, an insulating heat-conducting layer is provided on the inner end surface of the shell corresponding to the second electrode layer.

[0014] Optionally, the electric card refrigeration system also includes: a hot end heat sink, arranged on the outside of the first end of the shell, for dissipating the heat of the electric card element; and / or, a cold end heat sink, arranged on the outside of the second end of the shell, for dissipating the cold of the electric card element.

[0015] In some embodiments, the household appliance includes the aforementioned electric card refrigeration system.

[0016] Optionally, the household electrical appliance includes an air conditioner, a refrigerator or a freezer.

[0017] The electric card refrigeration system and household appliance provided by the embodiments of the present disclosure can achieve the following technical effects:

[0018] The electric card refrigeration system includes a heat exchange module, a drive module and a control module. The heat exchange module includes a shell and an electric card element arranged in the shell. The electric card element releases heat or absorbs heat under the stimulation of an external power source to provide heat or cold. The drive module is used to provide external force to drive the electric card element to move in the shell. The control module controls the driving frequency of the drive module so that the electric card element displaces to the first heat transfer space to fit the first inner end surface of the shell when releasing heat, or displaces to the second heat transfer space to fit the second inner end surface of the shell when absorbing heat, so as to separate the cold and heat of the electric card element. Furthermore, the electric card element has low movement resistance and is driven by an external driving force, and the control process is simple.

[0019] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:

[0021] Figure 1 is a schematic diagram of the structure of an electric card element provided by an embodiment of the present disclosure;

[0022] Figure 2 is another schematic diagram of the structure of an electric card element provided by an embodiment of the present disclosure;

[0023] Figure 3 is a structural schematic diagram of an electric card refrigeration system provided by an embodiment of the present disclosure;

[0024] Figure 4 is a structural schematic diagram of another electric card refrigeration system provided by an embodiment of the present disclosure;

[0025] Figure 5 is a structural schematic diagram of another electric card refrigeration system provided by an embodiment of the present disclosure;

[0026] Figure 6 is a structural schematic diagram of another electric card refrigeration system provided by an embodiment of the present disclosure;

[0027] Figure 7 is a structural schematic diagram of another electric card refrigeration system provided by an embodiment of the present disclosure;

[0028] Figure 8 is a structural schematic diagram of another electric card refrigeration system provided by an embodiment of the present disclosure;

[0029] Fig. 9 is a structural schematic diagram of another electric card refrigeration system provided by an embodiment of the present disclosure;

[0030] Fig.10 is a structural schematic diagram of another electric card refrigeration system provided by an embodiment of the present disclosure;

[0031] Fig.11 It is a structural schematic diagram of another electric card refrigeration system provided in an embodiment of the present disclosure.

[0032] Reference numerals:

[0033] 10: base layer; 11: support part; 12: clamping part;

[0034] 20: Refrigeration functional layer;

[0035] 30: first electrode layer;

[0036] 40: second electrode layer;

[0037] 101: electric card element; 102: housing; 103: first heat transfer space; 104: second heat transfer space;

[0038] 201: air pump assembly; 202: first ventilation pipe; 203: second ventilation pipe. DETAILED DESCRIPTION

[0039] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0040] The terms "first", "second", etc. in the specification and claims of the disclosed embodiments and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate to describe the disclosed embodiments here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0041] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0042] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0043] Unless otherwise stated, the term "plurality" means two or more.

[0044] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B indicates: A or B.

[0045] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0046] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0047] Compressor refrigeration products use fluorinated refrigerants, which will produce a greenhouse effect during production and use, and there is a risk of leakage and environmental pollution. With the development of modern society, the huge demand for refrigeration has exacerbated the global energy crisis, the frequent occurrence of extreme high temperature weather and natural disasters. The new refrigeration technology based on the electrocaloric effect does not need to use the compressor and refrigerant required for common refrigerators. When the electric field is applied or removed on the electrocaloric material, the material will absorb or release heat, which is the electrocaloric effect. The existing electrocaloric material film needs to be integrated with other components when used, and it cannot be used as a component.

[0048] The disclosed embodiment of the present invention discloses an electric card component 101 to componentize the electric card material and realize the direct application of the electric card material.

[0049] Combination Figure 1-2 As shown, the embodiment of the present disclosure provides an electric card element 101, including a substrate layer 10, a refrigeration function layer 20, a first electrode layer 30 and a second electrode layer 40. The substrate layer 10 includes a support portion 11 and a clamping portion 12 arranged around the support portion 11. The refrigeration function layer 20 is arranged on the support portion 11 of the substrate layer 10. The first electrode layer 30 is arranged between the substrate layer 10 and the refrigeration function layer 20. The second electrode layer 40 is arranged on the end surface of the refrigeration function layer 20 away from the substrate layer 10. Among them, the first electrode layer 30 and the second electrode layer 40 are used to periodically apply an electric field to the refrigeration function layer 20 so that the refrigeration function layer 20 absorbs or releases heat.

[0050] The electric card element 101 includes a base layer 10, a refrigeration function layer 20, a first electrode layer 30 and a second electrode layer 40. The base layer 10 serves as a base to provide support for the entire electric card element 101. The base layer 10 includes a support portion 11 and a clamping portion 12 arranged around the support portion 11. The support portion 11 is provided with a first electrode layer 30, a refrigeration function layer 20 and a second electrode layer 40 of a sandwich structure. The first electrode layer 30 and the second electrode layer 40 periodically apply an electric field to enable the refrigeration function layer 20 to excite the electric caloric effect to absorb or release heat. The clamping portion 12 arranged around the support portion 11 can be used to provide a connection area when an external structure is connected, so as to facilitate the application of the electric card element 101 in the device. By connecting the base layer 10, the refrigeration function layer 20, the first electrode layer 30 and the second electrode layer 40 to form the electric card element 101, the electric card material is partized.

[0051] Optionally, the number of the clamping parts 12 is one or more. When there is one clamping part 12 , it is circumferentially arranged around the support part 11 ; when there are multiple clamping parts 12 , the multiple clamping parts 12 surround the support part 11 and are symmetrically arranged about the center of the support part 11 .

[0052] The clamping part 12 is circumferentially arranged around the support part 11, so that the electric card component 101 can be clamped and installed from all sides when it is used in the refrigeration system. When there is one clamping part 12, it is circumferentially arranged around the support part 11; when there are multiple clamping parts 12, multiple clamping parts 12 surround the support part 11 and are symmetrically arranged about the center of the support part 11, which can be understood as the clamping part 12 being symmetrical about the center of the support part 11. This arrangement allows the clamping part 12 of the electric card component 101 to be evenly stressed during actual application, which can improve the overall fixing effect of the electric card component 101.

[0053] Optionally, the shape of the first electrode layer 30 is the same as that of the refrigeration functional layer 20 , and / or the shape of the second electrode layer 40 is the same as that of the refrigeration functional layer 20 .

[0054] The first electrode layer 30 and the second electrode layer 40 are periodically powered on or off, and an electric field is formed or removed inside to stimulate the electrocaloric effect of the refrigeration functional layer 20 to periodically absorb or release heat. The first electrode layer 30 and the second electrode layer 40 have the same shape to achieve a uniformly covered electric field. Correspondingly, the first electrode layer 30 has the same shape as the refrigeration functional layer 20, and / or the second electrode layer 40 has the same shape as the refrigeration functional layer 20, that is, the first electrode layer 30, the refrigeration functional layer 20 and the second electrode layer 40 form a sandwich structure, which can reduce the exposure of the electrode layer and increase the area of ​​the refrigeration functional layer 20 to stimulate the electrocaloric effect.

[0055] Optionally, the cross-sectional area of ​​the first electrode layer 30 is the same as the cross-sectional area of ​​the second electrode layer 40 .

[0056] The cross-sectional area of ​​the first electrode layer 30 is the same as that of the second electrode layer 40 to achieve a uniformly covered electric field. Optionally, the cross-sectional area of ​​the first electrode layer 30 is the same as that of the refrigeration functional layer 20, and / or the shape of the second electrode layer 40 is the same as that of the refrigeration functional layer 20. Similarly, the exposure of the electrode layer can be reduced and the area of ​​the refrigeration functional layer 20 that excites the electrocaloric effect can be increased.

[0057] Optionally, the thickness of the first electrode layer 30 is greater than or equal to 90 nm and less than or equal to 110 nm.

[0058] The thickness of the first electrode layer 30 is greater than or equal to 90 nm and less than or equal to 110 nm, and the size of the electric card element 101 can be reduced on the basis of the first electrode layer 30 being energized by an external power source to form an electric field with the second electrode layer 40, so as to facilitate the use of the electric card element 101. Specifically, the thickness of the first electrode layer 30 can be 90 nm, 95 nm, 100 nm, 105 nm or 110 nm, etc.

[0059] Optionally, the thickness of the second electrode layer 40 is greater than or equal to 90 nm and less than or equal to 110 nm.

[0060] Similarly, the thickness of the second electrode layer 40 is greater than or equal to 90 nm and less than or equal to 110 nm, and the size of the electric card element 101 can be reduced on the basis of the second electrode layer 40 being energized by an external power source to form an electric field with the first electrode layer 30, so as to facilitate the use of the electric card element 101. Specifically, the thickness of the second electrode layer 40 can be 90 nm, 95 nm, 100 nm, 105 nm or 110 nm, etc.

[0061] Optionally, the thickness of the refrigeration functional layer 20 is greater than or equal to 8 μm and less than or equal to 20 μm.

[0062] The thickness of the refrigeration function layer 20 is set to micrometer level, increasing the volume of the refrigeration function layer 20 that excites the electrocaloric effect, so as to increase the heat release and heat absorption of the electrocaloric element 101. Specifically, the thickness of the refrigeration function layer 20 can be 8μm, 10μm, 13μm, 15μm, 18μm or 20μm, etc.

[0063] Optionally, the refrigeration functional layer 20 includes a barium strontium titanate film, a lead lanthanum zirconate titanate ceramic film or a PST ferroelectric film.

[0064] The electrocaloric effect is a cooling and heating effect of ferroelectric materials under an electric field. When an electric field is applied, heat is released, and when the electric field is removed, heat is absorbed. Ferroelectric thin films apply high electric fields through electrodes on both sides to stimulate the periodic electrocaloric effect. The research on solid-state electrocaloric refrigeration materials can be divided into three categories: inorganic, organic, and inorganic-organic composite materials. Barium strontium titanate (BST) film, lead lanthanum zirconate titanate (PLZT) ceramic film, and PST ferroelectric film are all inorganic ferroelectric materials.

[0065] On the one hand, compared with organic ferroelectric materials that require high voltage (e.g., kilovolts) to stimulate the electrocaloric effect, inorganic ferroelectric materials require a smaller voltage (e.g., hundreds of volts) to stimulate the electrocaloric effect. In addition, high voltages can easily break through the film, shortening the service life of the electrocaloric element 101, while low voltages can extend the service life of the electrocaloric element 101.

[0066] On the other hand, inorganic thin film ferroelectric materials have a large adiabatic temperature change and a wide ferroelectric phase transition temperature range, so they can be used for refrigeration applications with a wide temperature range and a large temperature difference. At the same time, the low-temperature crystallized ferroelectric thin film synthesis process can be compatible with semiconductor microelectromechanical (CMOS / MEMs) processes to achieve the integration of the refrigeration function layer 20 in the electric card element 101 on the base layer 10.

[0067] Optionally, the base layer 10 includes a silicon wafer.

[0068] As a semiconductor material, the silicon wafer provides support for the cooling function layer 20 on the one hand, and facilitates the preparation of the cooling function layer 20 on the other hand. The low temperature crystallized ferroelectric thin film synthesis process can be compatible with the semiconductor micro-electromechanical (CMOS / MEMs) process to achieve the integration of the cooling function layer 20 in the electric card element 101 on the base layer 10.

[0069] Optionally, the first electrode layer 30 includes a platinum electrode layer, and / or the second electrode layer 40 includes a platinum electrode layer.

[0070] In some embodiments, the preparation method of the electric card element 101 includes: depositing a first electrode layer 30 on the base layer 10; depositing a refrigeration function layer 20 on the first electrode layer 30; depositing a second electrode layer 40 on the refrigeration function layer 20; and etching edge portions of the second electrode layer 40, the refrigeration function layer 20 and the first electrode layer 30 to obtain the electric card element 101.

[0071] In order to separate the cooling capacity and heat of the electric card element 101, the embodiment of the present disclosure also provides an electric card refrigeration system and household appliance, wherein the driving module is connected to the first heat transfer space 103 and the second heat transfer space 104 in the heat exchange module housing 102, and can drive the electric card element 101 to move in the two heat transfer spaces to fit different end faces when releasing and absorbing heat, thereby separating the cooling capacity and heat of the electric card element 101. Furthermore, the electric card element 101 has low movement resistance and is driven by an external driving force, and the control process is simple.

[0072] Combination Figure 3-11 As shown, an embodiment of the present disclosure provides an electric card refrigeration system, including a heat exchange module, a drive module and a control module. The heat exchange module includes a shell 102 and an electric card element 101 disposed in the shell 102. The electric card element 101 divides the shell 102 into a first heat transfer space 103 and a second heat transfer space 104. The electric card element 101 absorbs or releases heat under the action of an external electric field. The drive module is connected to the heat exchange module shell 102. The control module controls the drive module to move toward the first heat transfer space 103 to fit the first inner end surface of the shell 102 when the electric card element 101 releases heat, or to move toward the second heat transfer space 104 to fit the second inner end surface of the shell 102 when the electric card element 101 absorbs heat.

[0073] The electric card refrigeration system includes a heat exchange module, a drive module and a control module. The heat exchange module includes a shell 102 and an electric card element 101 arranged in the shell 102. The electric card element 101 releases heat or absorbs heat under the stimulation of an external power source to provide heat or cold. The drive module is used to provide external force drive for the electric card element 101 to move in the shell 102. The control module controls the operation and driving frequency of the drive module so that the electric card element 101 displaces to the first heat transfer space 103 to fit the first inner end surface of the shell 102 when releasing heat, or displaces to the second heat transfer space 104 to fit the second inner end surface of the shell 102 when the electric card element 101 absorbs heat, so as to achieve the separation of cold and heat of the electric card element 101. Furthermore, the electric card element 101 has small movement resistance and is driven by an external driving force, and the control process is simple.

[0074] Among them, the first heat transfer space 103 and the second heat transfer space 104 are air chambers with a certain vacuum degree, and the vacuum degree of the first heat transfer space 103 and the second heat transfer space 104 is the same. The vacuum degree refers to the rarefaction degree of the gas in a vacuum state. The vacuum degree can reduce the thermal conductivity of the first heat transfer space 103 and the second heat transfer space 104, and reduce the internal heat transfer loss of heat and cold of the electric card element 101. The vacuum degree means that there is still air in the first heat transfer space 103 and the second heat transfer space 104, which can be used to evacuate air, change the air pressure on both sides of the electric card element 101, and then move the electric card element 101 to both ends. The vacuum degree of the first heat transfer space 103 and the second heat transfer space 104 is the same, so that the initial state of the electric card element 101 is parallel to the cross section of the shell 102, which facilitates the electric card element 101 to move to both ends.

[0075] Optionally, the driving module includes an air pump assembly 201, a first ventilation pipe 202 and / or a second ventilation pipe 203. The air pump assembly 201 is used for pumping or inflating. One end of the first ventilation pipe 202 is connected to the air pump assembly 201, and the other end is connected to the first heat transfer space 103. One end of the second ventilation pipe 203 is connected to the air pump assembly 201, and the other end is connected to the second heat transfer space 104.

[0076] The first heat transfer space 103 and the second heat transfer space 104 are air chambers with a certain degree of vacuum, and air can be evacuated from the first heat transfer space 103 or the second heat transfer space 104 to reduce the air pressure in the first heat transfer space 103 or the second heat transfer space 104, or air can be inflated into the first heat transfer space 103 or the second heat transfer space 104 to increase the air pressure in the first heat transfer space 103 or the second heat transfer space 104. The operation process of driving the electric card element 101 to move by air pressure is simple.

[0077] Optionally, when the driving module includes an air pump assembly 201 and a first ventilation pipe 202, the air pump assembly 201 draws air from the first heat transfer space 103 through the first ventilation pipe 202 to cause the electric card element 101 to displace toward the first heat transfer space 103 to fit the first inner end surface of the shell 102, or, the air pump assembly 201 inflates the first heat transfer space 103 through the first ventilation pipe 202 to cause the electric card element 101 to displace toward the second heat transfer space 104 to fit the second inner end surface of the shell 102. When the driving module includes an air pump assembly 201 and a second ventilation pipe 203, the air pump assembly 201 inflates the second heat transfer space 104 through the second ventilation pipe 203, so that the electric card element 101 is displaced toward the first heat transfer space 103 to fit the first inner end surface of the shell 102, or the air pump assembly 201 extracts air from the second heat transfer space 104 through the second ventilation pipe 203, so that the electric card element 101 is displaced toward the second heat transfer space 104 to fit the second inner end surface of the shell 102. When the driving module includes an air pump assembly 201, a first ventilation pipe 202 and a second ventilation pipe 203, the air pump assembly 201 extracts air from the first heat transfer space 103 through the first ventilation pipe 202, and / or charges air into the second heat transfer space 104 through the second ventilation pipe 203, so that the electric card element 101 is displaced toward the first heat transfer space 103 to fit the first inner end surface of the shell 102; alternatively, the air pump assembly 201 charges air into the first heat transfer space 103 through the first ventilation pipe 202, and / or extracts air from the second heat transfer space 104 through the second ventilation pipe 203, so that the electric card element 101 is displaced toward the second heat transfer space 104 to fit the second inner end surface of the shell 102.

[0078] Combination Figure 6-8 As shown, the driving module includes an air pump assembly 201 and a first ventilation pipe 202. Figure 9-11 As shown, the driving module includes an air pump assembly 201 and a second ventilation pipe 203. Figure 3-5 As shown, the driving module includes an air pump assembly 201, a first ventilation pipe 202 and a second ventilation pipe 203. Inflation or deflation of a single cavity can achieve displacement of the electric card element 101, and simultaneous inflation and deflating of two cavities can also achieve displacement of the electric card element 101, thereby separating the cooling and heating of the electric card element 101.

[0079] When the first electrode layer 30 and the second electrode layer 40 of the electric card element 101 are energized to apply an electric field to the refrigeration function layer 20, the refrigeration function layer 20 excites the electrocaloric effect to release heat. By controlling the air pressure of the first heat transfer space 103 to be lower than the air pressure of the second heat transfer space 104, the electric card element 101 moves toward the first heat transfer space 103 to fit the first inner end surface of the shell 102. Figure 4 , 7, as shown in FIG. 10. At this time, the first end of the housing 102 is the hot end, which conducts the heat of the electric card element 101. Controlling the air pressure of the first heat transfer space 103 to be lower than the air pressure of the second heat transfer space 104 can be achieved by the air pump assembly 201 exhausting air from the first heat transfer space 103 through the first ventilation pipe 202, or by charging air into the second heat transfer space 104 through the second ventilation pipe 203, or by exhausting air from the first heat transfer space 103 and charging air into the second heat transfer space 104 at the same time.

[0080] When the electric field between the first electrode layer 30 and the second electrode layer 40 of the electric card element 101 is removed and the first electrode layer 30 and the second electrode layer 40 are powered off, the refrigeration function layer 20 stimulates the electrocaloric effect to absorb heat, and the air pressure of the first heat transfer space 103 is controlled to be greater than the air pressure of the second heat transfer space 104, so that the electric card element 101 moves toward the second heat transfer space 104 to fit the second inner end surface of the shell 102. Figure 5 , 8 , as shown in 11. At this time, the second end of the shell 102 is the cold end, which conducts the coldness of the electric card element 101. Controlling the air pressure of the first heat transfer space 103 to be greater than the air pressure of the second heat transfer space 104 can be performed by the air pump assembly 201 to inflate the first heat transfer space 103 through the first ventilation pipe 202, or to exhaust air from the second heat transfer space 104 through the second ventilation pipe 203, or to inflate the first heat transfer space 103 and exhaust air from the second heat transfer space 104 at the same time.

[0081] It should be understood that a periodic electric field is required to excite the electrocaloric effect of the cooling functional layer 20. In order to achieve the electric card element 101 to heat up and attach to the hot end and absorb heat to attach to the cold end to separate the hot and cold, the air pressure change frequency of the air pump component 201 needs to be consistent with the periodic frequency of the cooling electric field.

[0082] Optionally, the air pump assembly 201 includes one or more air pumps, which are respectively connected to the first heat transfer space 103 and / or the second heat transfer space 104. Since the air inlet and outlet holes of the air pump are fixed, a solenoid valve is set in the air circuit of the air pump, for example, a two-position four-way solenoid valve is designed, and the switching of the air flow direction is achieved by controlling the solenoid valve to change different positions, so that the air pump can be inflated and exhausted through a ventilation pipe connected to the first heat exchange space or the second heat exchange space.

[0083] Optionally, when the driving module includes a first ventilation pipe 202, the housing 102 is provided with a first through hole corresponding to the first heat transfer space 103, and the first ventilation pipe 202 passes through the first through hole and extends into the first heat transfer space 103. When the driving module includes a second ventilation pipe 203, the housing 102 is provided with a second through hole corresponding to the second heat transfer space 104, and the second ventilation pipe 203 passes through the second through hole and extends into the second heat transfer space 104.

[0084] The shell 102 is provided with a first through hole and a second through hole corresponding to the first heat transfer space 103 and the second heat transfer space 104 respectively, so that the first ventilation pipe 202 and the second ventilation pipe 203 extend into the shell 102 to evacuate or inflate the first heat transfer space 103 and the second heat transfer space 104 .

[0085] Optionally, the electric card element 101 includes a substrate layer 10, a refrigeration function layer 20, a first electrode layer 30 and a second electrode layer 40. The substrate layer 10 includes a support portion 11 and a clamping portion 12 arranged around the support portion 11. The refrigeration function layer 20 is arranged on the support portion 11 of the substrate layer 10. The first electrode layer 30 is arranged between the substrate layer 10 and the refrigeration function layer 20. The second electrode layer 40 is arranged on the end surface of the refrigeration function layer 20 away from the substrate layer 10. The first electrode layer 30 and the second electrode layer 40 are used to periodically apply an electric field to the refrigeration function layer 20 so that the refrigeration function layer 20 absorbs or releases heat.

[0086] The electric card element 101 includes a base layer 10, a cooling function layer 20, a first electrode layer 30 and a second electrode layer 40. The base layer 10 serves as a base to provide support for the entire electric card element 101. The base layer 10 includes a support portion 11 and a clamping portion 12 arranged around the support portion 11. The support portion 11 is provided with a first electrode layer 30, a cooling function layer 20 and a second electrode layer 40 of a sandwich structure. The first electrode layer 30 and the second electrode layer 40 periodically apply an electric field to enable the cooling function layer 20 to stimulate the electric caloric effect to absorb or release heat. The clamping portion 12 arranged around the support portion 11 can be used to provide a connection area when an external structure is connected, so that the electric card element 101 is conveniently arranged in a heat exchange module.

[0087] Optionally, a clamping portion is provided on the circumference of the side wall of the shell 102 of the heat exchange module, wherein the clamping portion 12 of the electric clamp element 101 is clamped in the clamping portion.

[0088] The side wall of the shell 102 of the heat exchange module is provided with a clamping part in the circumferential direction, and the clamping part is used to clamp the clamping part 12 of the electric card element 101 to fix the electric card element 101. The circumferentially arranged clamping part applies a uniform force to the electric card element 101, which can improve the overall fixing effect of the electric card element 101.

[0089] Optionally, a heat insulation layer is provided between the clamping portion of the side wall of the housing 102 and the clamping portion 12 of the electric card element 101 .

[0090] A heat insulation layer is provided between the clamping portion and the clamping portion 12 , which can, on the one hand, insulate and prevent heat loss from the clamping portion, and on the other hand, can also enhance the clamping firmness of the electric card element 101 .

[0091] Optionally, an insulating heat-conducting layer 105 is provided on the inner end surface of the shell 102 corresponding to the second electrode layer 40 .

[0092] Combination Figure 3-11As shown, the second electrode layer 40 is energized to form an electric field with the first electrode layer 30, thereby stimulating the electrocaloric effect of the refrigeration function layer 20. The first electrode layer 30 is located between the base layer 10 and the refrigeration function layer 20, and the second electrode layer 40 is exposed, which is easy to cause current leakage and affect the operation of the electrocaloric refrigeration system. Therefore, an insulating heat-conducting layer 105 is provided on the inner end surface of the housing 102 corresponding to the second electrode layer 40 to prevent the current of the second electrode layer 40 from leaking.

[0093] Optionally, the electric card refrigeration system also includes: a hot end heat sink, arranged on the outside of the first end of the shell 102, for dissipating the heat of the electric card element 101; and / or, a cold end heat sink, arranged on the outside of the second end of the shell 102, for dissipating the cold of the electric card element 101.

[0094] The hot-end heat sink is arranged outside the first end of the housing 102, and is used to dissipate the heat of the electric card element 101. For example, a fan can be used as the hot-end heat sink. The cold-end heat sink is arranged outside the second end of the housing 102, and is used to dissipate the cold of the electric card element 101. For example, a fan can be used as the hot-end heat sink. The arrangement of the hot-end heat sink and the cold-end heat sink can improve the dissipation of heat and cold of the electric card element 101.

[0095] Optionally, the shell 102 includes a rigid shell having a certain strength and is not affected by changes in air pressure when the first heat transfer space 103 and the second heat transfer space 104 are evacuated or inflated.

[0096] Optionally, a sealant layer is provided on the first ventilation pipe 202 and the first through hole. The sealant layer isolates the inside and outside of the housing 102, that is, ensures the independent airtightness of the first heat transfer space 103 and the second heat transfer space 104, so that the air pump assembly 201 can act on the first heat transfer space 103 and the second heat transfer space 104 to change the air pressure. Furthermore, it can also prevent the heat or cold of the electric card element 101 from being lost through the gap.

[0097] Optionally, a thermal interface layer is provided between the hot end heat sink and the first end of the shell, and between the cold end heat sink and the second end of the shell. For example, a silicone grease layer or a thermal pad may be provided.

[0098] The improved electric card refrigeration system of the disclosed embodiment changes the air pressure on both sides of the electric card element 101 through the air pump assembly 201 to move the electric card element 101 to both ends to achieve hot and cold separation of the electric card element 101. The drive does not rely on gravity, and space refrigeration in a microgravity environment can be achieved.

[0099] In some embodiments, the household appliance includes the aforementioned electric card refrigeration system.

[0100] Optionally, the household electrical appliance includes an air conditioner, a refrigerator or a freezer.

[0101] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electric card refrigeration system, characterized in that: include: The heat exchange module comprises a shell and an electric card element arranged in the shell, wherein the electric card element divides the shell into a first heat transfer space and a second heat transfer space, and the electric card element absorbs or releases heat under the action of an external electric field; A driving module is connected to the heat exchange module housing; The control module controls the driving module to move toward the first heat transfer space to fit the first inner end surface of the shell when the electric card element releases heat, or to move toward the second heat transfer space to fit the second inner end surface of the shell when the electric card element absorbs heat.

2. The electric card refrigeration system according to claim 1, characterized in that: The driver module includes: An air pump assembly, used for pumping or inflating air; A first ventilation pipe, one end of which is connected to the air pump assembly, and the other end of which is connected to the first heat transfer space; and / or, One end of the second ventilation pipe is connected to the air pump assembly, and the other end is connected to the second heat transfer space.

3. The electric card refrigeration system according to claim 2, characterized in that: When the driving module includes an air pump assembly and a first ventilation pipe, the air pump assembly extracts air from the first heat transfer space through the first ventilation pipe, so that the electric card element moves toward the first heat transfer space to fit the first inner end surface of the shell, or the air pump assembly inflates air into the first heat transfer space through the first ventilation pipe, so that the electric card element moves toward the second heat transfer space to fit the second inner end surface of the shell; or, When the driving module includes an air pump assembly and a second ventilation pipe, the air pump assembly inflates air into the second heat transfer space through the second ventilation pipe, so that the electric card element moves toward the first heat transfer space to fit the first inner end surface of the shell, or the air pump assembly extracts air from the second heat transfer space through the second ventilation pipe, so that the electric card element moves toward the second heat transfer space to fit the second inner end surface of the shell; or, When the driving module includes an air pump assembly, a first ventilation pipe and a second ventilation pipe, the air pump assembly draws air from the first heat transfer space through the first ventilation pipe, and / or inflates air into the second heat transfer space through the second ventilation pipe, so that the electric card element is displaced toward the first heat transfer space to fit the first inner end surface of the shell; or, the air pump assembly inflates air into the first heat transfer space through the first ventilation pipe, and / or draws air from the second heat transfer space through the second ventilation pipe, so that the electric card element is displaced toward the second heat transfer space to fit the second inner end surface of the shell.

4. The electric card refrigeration system according to claim 2, characterized in that: When the driving module includes a first ventilation pipe, the shell is provided with a first through hole corresponding to the first heat transfer space, and the first ventilation pipe passes through the first through hole and extends into the first heat transfer space; When the driving module includes a second ventilation pipe, the shell is provided with a second through hole corresponding to the second heat transfer space, and the second ventilation pipe passes through the second through hole and extends into the second heat transfer space.

5. The electric card refrigeration system according to claim 1, characterized in that: The electrical card components include: The base layer comprises a supporting portion and a clamping portion arranged around the supporting portion; A refrigeration functional layer is arranged on the support portion of the base layer; A first electrode layer is disposed between the base layer and the refrigeration function layer; The second electrode layer is arranged on the end surface of the refrigeration functional layer away from the base layer, The first electrode layer and the second electrode layer are used to periodically apply an electric field to the refrigeration functional layer so that the refrigeration functional layer absorbs or releases heat.

6. The electric card refrigeration system according to claim 5, characterized in that: The shell side wall of the heat exchange module is provided with a clamping part in the circumferential direction. Wherein, the clamping portion of the electric card element is clamped on the clamping portion.

7. The electric card refrigeration system according to claim 6, characterized in that: A heat insulation layer is arranged between the clamping portion of the shell side wall and the clamping portion of the electric card element.

8. The electric card refrigeration system according to any one of claims 1 to 7, characterized in that: Also includes: A hot end heat sink, disposed outside the first end of the housing, for dissipating heat from the electrical card component; and / or, The cold end heat sink is arranged outside the second end of the shell and is used to dissipate the cold of the electric card component.

9. A household appliance, characterized in that: It comprises the electric card refrigeration system as described in any one of claims 1 to 8.

10. The household appliance according to claim 9, characterized in that: Household appliances include air conditioners, refrigerators or freezers.

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