Integrated strain gauge assembly and method of mounting strain gauge assembly onto strainable surface

Abstract

The present disclosure relates to an integrated strain gauge assembly and a method of mounting a strain gauge assembly onto a strainable surface. An integrated strain gauge assembly comprising: at least one strain gauge having an adhesive adhered to a surface thereof; and a flexible printed circuit board fixed to the at least one strain gauge. A method for mounting a strain gauge assembly onto a surface of an article desires to monitor and / or measure strain of the article.

Description

Technical Field

[0001] The present invention relates generally to strain gauges and, more particularly, to the construction and mounting of strain gauge assemblies. Background Art

[0002] As a strain gauge pre-mounted with a flexible printed circuit board, various types of strain gauges are known. Mounting such a strain gauge on an object whose strain is to be sensed is relatively complicated and time-consuming, and is a labor-intensive task. Summary of the invention

[0003] The present invention seeks to provide an improved strain gauge assembly which is relatively simple to mount to a strainable surface of an object in which strain is to be sensed, and a method of mounting the strain gauge assembly.

[0004] Therefore, according to a preferred embodiment of the present invention, there is provided an integrated strain gauge assembly including at least one strain gauge having an adhesive attached to a surface and a flexible printed circuit board secured to the at least one strain gauge.

[0005] According to a preferred embodiment of the present invention, the flexible printed circuit board is formed with at least one window, and the at least one window at least partially covers the at least one strain gauge.

[0006] Preferably, the flexible printed circuit board is formed with at least one conductor shaped as a partial contour of the pad. In addition, the integrated strain gauge assembly also includes at least one pad-defined metal deposit adhered to the flexible printed circuit board and partially surrounded by the at least one conductor shaped as a partial contour of the pad.

[0007] According to a preferred embodiment of the present invention, the integrated strain gauge assembly further comprises at least one circuit component mounted on the flexible printed circuit board.

[0008] Preferably, at least one circuit component comprises a temperature measurement circuit. Additionally or alternatively, at least one circuit component comprises a passive electronic component. Additionally or alternatively, at least one circuit component comprises an active electronic component. Additionally or alternatively, at least one circuit component comprises a battery. Additionally or alternatively, at least one circuit component comprises at least one integrated circuit. Additionally or alternatively, at least one circuit component comprises a flexible electronic component.

[0009] According to another preferred embodiment of the present invention, a method for mounting a strain gauge assembly onto a strainable surface is also provided, the method comprising: providing a strain gauge assembly, the strain gauge assembly comprising at least one strain gauge and a flexible printed circuit board, the at least one strain gauge having an adhesive adhered to a surface, the flexible printed circuit board being fixed to the at least one strain gauge; positioning the strain gauge assembly at a desired strain gauge assembly position on the strainable surface; and first fixing the strain gauge assembly at the desired strain gauge assembly position on the strainable surface.

[0010] Additionally, the method includes providing a stacked arrangement covering the strain gauge assembly and the strainable surface, applying pressure to the stacked arrangement, thereby applying pressure to the strain gauge assembly and the strainable surface, and bonding the strain gauge assembly to the strainable surface by activating an adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The present invention will be more fully appreciated and understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0012] Figure 1A , Figure 1B , Figure 1C and Figure 1D are simplified plan, exploded, and first and second cross-sectional views, respectively, of a strain gauge assembly constructed and operated in accordance with a preferred embodiment of the present invention;

[0013] Figure 2A , Figure 2B and Figure 2C are simplified plan, exploded and cross-sectional views, respectively, of a strain gauge assembly constructed and operated in accordance with another preferred embodiment of the present invention;

[0014] Figure 3A , Figure 3B , Figure 3C and Figure 3D are simplified plan, exploded, and first and second cross-sectional views, respectively, of a strain gauge assembly constructed and operated in accordance with yet another preferred embodiment of the present invention;

[0015] Figure 4A , Figure 4B , Figure 4C and Figure 4D are simplified plan, exploded, and first and second cross-sectional views, respectively, of a strain gauge assembly constructed and operated in accordance with yet another preferred embodiment of the present invention;

[0016] 5A-1 and 5A-2 together depict a simplified illustration of a first prior art method of mounting a strain gauge to a strainable surface;

[0017] 5B-1 and 5B-2 together depict a simplified illustration of a prior art method of mounting a strain gauge pre-mounted on a flexible printed circuit board to a strainable surface; and

[0018] Figure 6 is a simplified diagram depicting a method of mounting a strain gauge assembly to a strainable surface in accordance with an embodiment of the present invention. DETAILED DESCRIPTION

[0019] Reference now Figure 1A , Figure 1B , Figure 1C and Figure 1D , which are simplified plan view, exploded view, and first and second cross-sectional views, respectively, of the construction and operation of a strain gauge assembly according to a preferred embodiment of the present invention.

[0020] like Figures 1A to 1D As shown, a strain gauge assembly 100 is provided, preferably including a plurality of strain gauges 102, which are mounted, such as by soldering, on a rear surface 104 of a flexible printed circuit board 106. The strain gauge 102 can be any suitable strain gauge, an example of which is model MMF404432 (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD). The flexible printed circuit board 106 can be any suitable flexible printed circuit board, an example of which is model W291842ASH116 (commercially available from PCBWay.Com).

[0021] The strain gauges 102 each include a rear surface 108 and a front surface 110. Figure 1A and Figure 1B It can be clearly seen that the front surface 110 of each strain gauge 102 is formed with a patterned conductor 111 and at least two pads 112. A particular feature of an embodiment of the present invention is that at least one of the strain gauges 102, and preferably all, is a self-bonding strain gauge, such as model MMF404432 (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD), wherein the back surface 108 of each strain gauge 102 is preformed with an adhesive 113 (the adhesive is preferably M-bond43-B commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD), which is preferably applied by spin coating.

[0022] Preferably, the strain gauges 102 are each aligned with a window 116 cut out of the flexible printed circuit board 106 such that the front surface 110 of each strain gauge 102 is visible from the front surface 118 of the flexible printed circuit board 106 .

[0023] Preferably, the front surface 118 of the printed circuit board 106 is formed with a patterned conductor 120. Preferably, adjacent at least one edge of each window 116, the patterned conductor 120 defines a partial outline 122 of a pad in a raised shape, here shown as a semicircle.

[0024] exist Figures 1A to 1D In the illustrated embodiment, there may also be flexible components, such as a temperature measurement circuit 124, such as MMF006911 (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD), which may include a resistance temperature detector (RTD) that may be mounted to the back surface 104 of the flexible printed circuit board 106 in a manner similar to the mounting of the strain gauge 102. As can be seen in the illustrated embodiment, the temperature measurement circuit 124 may also include an adhesive layer 125. The adhesive layer 125 may also be excluded.

[0025] In the illustrated embodiment, a window 126 cut out of the flexible printed circuit board 106 is provided so that the temperature measurement circuit 124 is visible from the front surface 118 of the flexible printed circuit board 106. As shown, preferably at at least one edge adjacent to the window 126, the patterned conductor 120 defines a partial outline 128 of the pad in a raised shape, here shown as a semicircle.

[0026] According to a preferred embodiment of the present invention, a plurality of metal deposits 132 defining pads, such as solder balls, are adhered to the flexible printed circuit board 106 and are partially surrounded by the partial outlines 122 and the partial outlines 128. A particular feature of the present invention is that the partial outlines 122 and the partial outlines 128 enable the metal deposits to be easily arranged so that they simultaneously conductively engage both the patterned conductors 120 of the flexible printed circuit board 106 and the at least one pad 112 or the temperature measurement circuit 124 of each strain gauge 102.

[0027] Reference now Figure 2A , Figure 2B and Figure 2C , which are simplified plan view, exploded view and cross-sectional view respectively showing the structure and operation of a strain gauge assembly according to another preferred embodiment of the present invention.

[0028] like FIG. 2A to FIG. 2CAs shown, a strain gauge assembly 200 is provided, preferably including a strain gauge 202, which is mounted, such as by soldering, on a top edge surface 204 and a rear surface 205 of a flexible printed circuit board 206. The strain gauge 202 can be any suitable strain gauge, an example of which is model MMF404432 (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD). The flexible printed circuit board 206 is preferably a flexible circuit board commercially available from PCBWay.Com.

[0029] The strain gauge 202 includes a rear surface 208 and a front surface 210. Figure 2A and Figure 2B It can be clearly seen that the front surface of the strain gauge 202 is formed with a patterned conductor 211 and at least two pads 212. A particular feature of an embodiment of the present invention is that the strain gauge 202 is a self-adhesive strain gauge, such as model MMF404432 (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD), wherein the back surface 208 of the strain gauge 202 is preformed with an adhesive 213, preferably a layer of M-bond 43-B (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD), which is preferably applied by spin coating.

[0030] Preferably, the front surface 218 of the flexible printed circuit board 206 is formed with a patterned conductor 220. Preferably, adjacent at least one edge of the printed circuit board, preferably adjacent the strain gauge 202, the patterned conductor 220 defines a partial outline 222 of a pad in a raised shape, here shown as a semicircle.

[0031] exist FIG. 2A to FIG. 2C In the illustrated embodiment, a plurality of circuit components 224 (shown here as resistors) are also preferably provided and may be mounted to the front surface 218 of the flexible printed circuit board 206 in a conventional manner.

[0032] According to a preferred embodiment of the present invention, a plurality of metal deposits 232 defining pads, such as solder balls, are adhered to the flexible printed circuit board 206 and are partially surrounded by the partial outline 222. A particular feature of the present invention is that the partial outline 222 enables the metal deposits to be easily arranged so that they conductively engage both the patterned conductor 220 of the flexible printed circuit board 206 and the at least one pad 212 of the strain gauge 202 simultaneously.

[0033] Reference now Figure 3A , Figure 3B , Figure 3C and Figure 3D, which are simplified plan view, exploded view, and first and second cross-sectional views, respectively, of the construction and operation of a strain gauge assembly according to yet another preferred embodiment of the present invention.

[0034] like FIG. 3A to FIG. 3D As seen in FIG. 1 , a strain gauge assembly 300 is provided, preferably including at least one strain gauge 302, mounted, such as by soldering, to a rear surface 304 of a flexible printed circuit board 306, preferably, as can be seen in the illustrated embodiment, at a top edge 307 of the flexible printed circuit board. The at least one strain gauge 302 may be any suitable strain gauge, an example of which is model MMF404432 (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD). The flexible printed circuit board 306 is preferably a flexible circuit board commercially available from PCBWay.Com.

[0035] Each of the at least one strain gauge 302 includes a rear surface 308 and a front surface 310. Figure 3A and Figure 3B It can be clearly seen that the front surface 310 of each strain gauge 302 is formed with a patterned conductor 311 and at least two pads 312. A particular feature of an embodiment of the present invention is that at least one of the at least one strain gauge is a self-bonding strain gauge, such as model MMF404432 (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD), wherein the back surface 308 of each of the at least one strain gauge 302 is preformed with an adhesive 313, preferably a layer of M-bond 43-B (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD), which is preferably applied by spin coating.

[0036] Preferably, the front surface 318 of the printed circuit board 306 is formed with a patterned conductor 320. Preferably, adjacent at least two edges of the printed circuit board 306, the patterned conductor 320 defines a portion of the outline 122 of the pad in a raised shape, shown here as a semicircle.

[0037] exist FIG. 3A to FIG. 3D In the illustrated embodiment, there may also be a flexible component, such as a temperature measurement circuit 323, such as MMF006911 (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD), which may include a resistance temperature detector (RTD) that may be mounted to the back surface 304 of the flexible printed circuit board 306 in a manner similar to the mounting of the at least one strain gauge 302. As can be seen in the illustrated embodiment, the temperature measurement circuit 323 may also include an adhesive layer 324. The adhesive layer 324 may also be excluded.

[0038] and Figures 1A to 1D In contrast to the embodiment of the present invention, a window 126 cut out from the flexible printed circuit board 106 is provided so that the temperature measurement circuit 124 can be seen from the front surface 118 of the flexible printed circuit board 106. FIG. 3A to FIG. 3D In the embodiment of the present invention, the temperature measurement circuit 323 is preferably mounted on the edge 325 of the printed circuit board 306. As shown, preferably adjacent to the edge 325 of the printed circuit board 306, the patterned conductor 320 defines a portion of the outline 128 of the pad in a raised shape, shown here as a semicircle.

[0039] exist FIG. 3A to FIG. 3D In the illustrated embodiment, a plurality of circuit components 328 (shown here as resistors) are preferably also provided, and the plurality of circuit components may be mounted to the front surface 318 of the flexible printed circuit board 306 in a conventional manner.

[0040] According to a preferred embodiment of the present invention, a plurality of metal deposits 332 defining pads, such as solder balls, are adhered to the flexible printed circuit board 306 and are partially surrounded by the partial outlines 322 and 326. A particular feature of the present invention is that the partial outlines 322 and 326 enable the metal deposits to be easily arranged so that they simultaneously conductively engage both the patterned conductors 320 of the flexible printed circuit board 306 and at least one pad 312 or temperature measurement circuit 323 of each strain gauge 302.

[0041] Reference now Figure 4A , Figure 4B , Figure 4C and Figure 4D , which are respectively a simplified plan view, an exploded view, and a first cross-sectional view and a second sectional view of the structure and operation of a strain gauge assembly according to another preferred embodiment of the present invention.

[0042] As in FIG. 4A to FIG. 4D As seen in FIG. 4 , a strain gauge assembly 400 is provided that preferably includes a plurality of strain gauges 402 mounted, such as by soldering, to a rear surface 404 of a flexible printed circuit board 406. The strain gauge 402 may be any suitable strain gauge, an example of which is model MMF404432 (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD). The flexible printed circuit board 406 is preferably a flexible circuit board commercially available from PCBWay.Com.

[0043] The strain gauges 402 each include a rear surface 408 and a front surface 410. Figure 4A and Figure 4BIt can be clearly seen that the front surface 410 of each strain gauge 402 is formed with a patterned conductor 411 and at least two pads 412. A particular feature of an embodiment of the present invention is that at least one and preferably all of the strain gauges 402 are self-bonding strain gauges, such as model MMF404432 (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD), wherein the back surface 408 of each strain gauge 402 is preformed with an adhesive 413, preferably an M-bond 43-B layer (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD), which is preferably applied by spin coating.

[0044] Preferably, the strain gauges 402 are each aligned with a window 416 cut out of the flexible printed circuit board 406 such that a front surface 410 of each strain gauge 402 is visible from a front surface 418 of the flexible printed circuit board 406 .

[0045] Preferably, the front surface 418 of the printed circuit board 406 is formed with a patterned conductor 420. Preferably, at at least one edge adjacent to each window, the patterned conductor 420 defines a partial outline 422 of a pad in a convex shape, here shown as a semicircle.

[0046] exist FIG. 4A to FIG. 4D In the illustrated embodiment, there may also be a flexible component, such as a temperature measurement circuit 424, such as MMF006911 (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD), which may include a resistance temperature detector (RTD) that may be mounted to the back surface 404 of the flexible printed circuit board 406 in a manner similar to the mounting of the strain gauge 402. As can be seen in the illustrated embodiment, the temperature measurement circuit 424 may also include an adhesive layer 425. The adhesive layer 425 may also be excluded.

[0047] In the illustrated embodiment, a window 426 cut out of the flexible printed circuit board 406 is provided so that the temperature measurement circuit 424 is visible from the front surface 418 of the flexible printed circuit board 406. As shown, preferably at at least one edge adjacent to the window 426, the patterned conductor 420 defines a partial outline 427 of the pad in a raised shape, here shown as a semicircle.

[0048] exist FIG. 4A to FIG. 4D In the illustrated embodiment, additional components 428 and additional components 430 (such as passive electronic components, active electronic components, batteries, integrated circuits) are preferably additionally provided, and these components can be mounted on the front surface 418 of the flexible printed circuit board 406 .

[0049] According to a preferred embodiment of the present invention, metal deposits 432 (such as solder balls) defining pads are adhered to the flexible printed circuit board 406 and are partially surrounded by partial outlines 422 and partial outlines 427. A particular feature of the present invention is that partial outlines 422 and partial outlines 427 enable the metal deposits to be easily arranged so that they simultaneously conductively engage both the patterned conductor 420 of the flexible printed circuit board 406 and at least one pad 412 of the strain gauge 402 or the temperature measurement circuit 424.

[0050] Reference is now made to Figures 5A-1 and 5A-2, which together show a simplified illustrative flow chart of the prior art for mounting a strain gauge 502 onto a strainable surface, where a strainable surface is defined as the surface of an item (such as a transducer of an aircraft or a wing bracket or a boom of a crane) whose strain is desired to be monitored and / or measured.

[0051] Before mounting the strain gauge 502 on the strainable surface, the strainable surface is typically first cleaned and provided with alignment marks for marking the desired strain gauge position on the strainable surface.

[0052] As seen in step 1 , in the prior art, a separate glass surface 504 is provided and cleaned, such as using isopropyl alcohol or another suitable cleaning material, as shown.

[0053] As seen in step 2, in the prior art, as shown, the strain gauge 502 is placed on the glass surface 504 and attached to the glass surface 504 by applying a length of Mylar® tape 506 over the strain gauge 502, ensuring that the Mylar tape 506 covers the pads of the strain gauge 502 and ensuring that the elongated axis of the Mylar tape 506 is aligned with the elongated axis of the strain gauge 502.

[0054] As seen in step 3, in the prior art, the Mylar® tape 506 with the strain gauge 502 attached is removed from the glass surface 504 as shown.

[0055] As seen in step 4, in the prior art, a strain gauge 502 adhered to a Mylar® tape 506 is positioned on a strainable surface 508 as shown.

[0056] As seen in step 5, in the prior art, while the strain gauge 502 is adhered to the Mylar® tape 506, as shown, the strain gauge 502 is subsequently removed from the strainable surface 508 by lifting the end 510 of the Mylar® tape 506 adjacent to the strain gauge 502 at a shallow angle relative to the strainable surface 508.

[0057] As seen in step 6 , in the prior art, an adhesive such as M-bond 43-B or M-Bond 610 (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD) is applied to the back surface 512 of the strain gauge 502 as shown.

[0058] As seen in step 7 , in the prior art, an adhesive such as M-bond 43-B or M-Bond 610 (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD) is applied to the location on the strainable surface 508 that will be located below the strain gauge 502 as shown.

[0059] As seen in step 8, these adhesives are typically allowed to set for 5 to 30 minutes.

[0060] As seen at step 9 , in the prior art, excess adhesive is removed from the rear surface 512 of the strain gauge 502 , and the strain gauge is secured to the strainable surface 508 , as shown.

[0061] As seen in step 10, in the prior art, steps 1 to 9 above are repeated for each strain gauge mounted to the strainable surface.

[0062] As seen at step 11, in the prior art, a stacked arrangement of Teflon® layers and rubber covering the strain gauges and strainable surface 508 is provided as shown.

[0063] As seen in step 12, in the prior art, a stacked arrangement of Teflon® layers and rubber covering the strain gauge 502 and the strainable surface 508 is clamped as shown so as to apply pressure to the strain gauge 502 against the strainable surface 508.

[0064] As seen at step 13, in the prior art, one or more adhesives bonding the strain gauge 502 to the strainable surface 508 are activated by applying heat, such as in an oven.

[0065] As seen at step 14 , in the prior art, a flexible printed circuit board is mounted to the front surface 524 of the strain gauge 502 and over the strainable surface 508 as shown.

[0066] Reference is now made to FIGS. 5B-1 and 5B-2 , which together are simplified illustrations of a prior art method of mounting a strain gauge 552 pre-mounted on a flexible printed circuit board 554 to a strainable surface 555 .

[0067] Before mounting the strain gauge 552 on the strainable surface 555 , the strainable surface 555 is typically first cleaned and provided with alignment marks for marking the desired strain gauge location on the strainable surface 555 .

[0068] As seen in step 1, in the prior art, a separate glass surface 556 is provided and cleaned, such as using isopropyl alcohol or another suitable cleaning material, as shown.

[0069] As seen in step 2, in the prior art, a length of Mylar® tape 557 is applied to the strain gauge 552 and the flexible printed circuit board 554 in a manner as shown so as to ensure that the Mylar tape covers the pads of the strain gauge 552 and that the elongated axis of the Mylar tape 557 is aligned with the elongated axis of the strain gauge 552.

[0070] As seen in step 3, in the prior art, the Mylar® tape 557 with the strain gauge 552 and flexible printed circuit board 554 attached is removed from the glass surface 556 as shown.

[0071] As seen in step 4, in the prior art, a strain gauge 552 and a flexible printed circuit board 554 adhered to Mylar® tape 557 are positioned on a strainable surface 555 as shown.

[0072] As seen in step 5, in the prior art, the strain gauge 552 and flexible printed circuit 554 are adhered to the Mylar® tape 557 as shown and then removed from the strainable surface 555 by lifting the end 560 of the Mylar® tape 557 adjacent to the strain gauge 552 at a shallow angle relative to the strainable surface 508.

[0073] As seen in step 6 , in the prior art, an adhesive such as M-Bond 43-B or M-Bond 610 (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD) is applied to the rear surface 562 of the strain gauge 552 as shown.

[0074] As seen in step 7 , in the prior art, an adhesive such as M-Bond 43-B or M-Bond 610 (commercially available from VISHAY ADVANCED TECHNOLOGIES, LTD) is applied to the locations on the strainable surface 555 that will be located beneath each strain gauge 552 as shown.

[0075] As seen in step 8, these adhesives are typically allowed to set for 5 to 30 minutes.

[0076] As seen in step 9 , in the prior art, excess adhesive is removed from the rear surface 562 of the strain gauge 552 , and the strain gauge 552 and flexible printed circuit board 554 are secured to the strainable surface 555 , as shown.

[0077] As seen in step 10, in the prior art, a stacked arrangement of Teflon® layers and rubber covers the strain gauge 552 and flexible printed circuit board 554 and strainable surface 555 as shown.

[0078] As seen in step 11, in the prior art, a stacked arrangement of Teflon® layers and rubber covering strain gauge 552, flexible printed circuit board 554, and strainable surface 555 is clamped as shown so as to apply pressure to strain gauge 552 against strainable surface 555.

[0079] As seen at step 12, in the prior art, one or more adhesives bonding the strain gauge 552 to the strainable surface 555 are activated by applying heat or in any other suitable manner.

[0080] Reference now Figure 6 , Figure 6 The present invention is a preferred embodiment of the present invention showing the technique of mounting the strain gauge assembly 600 on the strainable surface 610 (such as Figures 1A to 4D ), the strainable surface being defined as the surface of an item (such as a transducer of an aircraft or a wing strut or a boom of a crane) whose strain is desired to be monitored and / or measured.

[0081] Prior to mounting the strain gauge assembly 600 on the strainable surface 610 , the strainable surface 610 is typically first cleaned and provided with alignment marks for marking the desired strain gauge assembly location on the strainable surface 610 .

[0082] As seen in step 1 , strain gauge assembly 600 is positioned on strainable surface 610 at a desired strain gauge assembly location.

[0083] As seen in step 2, the strain gauge assembly 600 is first secured to the strainable surface 610 at the desired strain gauge assembly location by affixing the strain gauge assembly 600 to the strainable surface 610 as shown. Alternatively, the strain gauge assembly 600 may be first secured to the strainable surface 610 by gluing a flexible printed circuit board forming part of the strain gauge assembly 600 to the strainable surface 610.

[0084] As seen in step 3, as shown, there is a stacked arrangement of Teflon® layers and rubber covering the strain gauge assembly 600 and the strainable surface 610.

[0085] As seen in step 4, the stacked arrangement of Teflon® layers and rubber covering the strain gauge assembly 600 and the strainable surface 610 is clamped as shown so as to apply pressure to the strain gauge assembly 600 against the strainable surface 610.

[0086] As seen in step 5, the adhesive bonding strain gauge assembly 600 to strainable surface 610 is activated by applying heat or in any other suitable manner.

[0087] According to FIG. 5A-1, FIG. 5A-2, FIG. 5B-1, FIG. 5B-2 and Figure 6 From the above description, we can see that Figure 6 Compared with the prior art method, Figure 6 The installation method is overall more efficient and less labor-intensive and less time-intensive.

[0088] It will be appreciated by those skilled in the art that the present invention is not limited to what has been specifically described above. Rather, the scope of the present invention is limited only by the preceding claims.

Claims

1. An integrated strain gauge assembly comprising: at least one strain gauge having an adhesive adhered to a surface; as well as A flexible printed circuit board is secured to the at least one strain gauge.

2. The integrated strain gauge assembly of claim 1, and wherein: The flexible printed circuit board is formed with at least one window, and the at least one window at least partially covers the at least one strain gauge.

3. The integrated strain gauge assembly of claim 1 , and wherein: The flexible printed circuit board is formed with at least one conductor shaped as a partial outline of a pad.

4. The integrated strain gauge assembly of claim 3, further comprising: At least one pad-defining metal deposit is adhered to the flexible printed circuit board and is partially surrounded by the at least one conductor shaped to a partial contour of a pad.

5. The integrated strain gauge assembly according to any one of claims 1 to 4, further comprising: At least one circuit component is mounted to the flexible printed circuit board.

6. The integrated strain gauge assembly of claim 5, and wherein: The at least one circuit component includes a temperature measurement circuit.

7. The integrated strain gauge assembly of claim 5, and wherein: The at least one circuit component includes a passive electronic component.

8. The integrated strain gauge assembly of claim 5, and wherein: The at least one circuit component includes an active electronic component.

9. The integrated strain gauge assembly of claim 5, and wherein: The at least one circuit component includes a battery.

10. The integrated strain gauge assembly of claim 5, and wherein: The at least one circuit component includes at least one integrated circuit.

11. The integrated strain gauge assembly of claim 5, and wherein: The at least one circuit component includes a flexible electronic component.

12. A method of mounting a strain gauge assembly to a strainable surface, the method comprising: providing a strain gauge assembly, the strain gauge assembly comprising at least one strain gauge and a flexible printed circuit board, the at least one strain gauge having an adhesive adhered to a surface, the flexible printed circuit board being secured to the at least one strain gauge; positioning the strain gauge assembly at a desired strain gauge assembly location on the strainable surface; as well as The strain gauge assembly is first secured to the strainable surface at a desired strain gauge assembly location.

13. The method according to claim 12, further comprising: providing a stacking arrangement covering the strain gauge assembly and the strainable surface; applying pressure to the stacked arrangement, thereby applying pressure to the strain gauge assembly and the strainable surface; as well as The strain gauge assembly is bonded to the strainable surface by activating the adhesive.

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