Circuit board detection needle bed packaging position detection method and device and storage medium

Abstract

The invention discloses a circuit board detection needle bed packaging position detection method and device and a storage medium, and the method comprises the steps: obtaining the bit number of each test point on a detected circuit board, and recording the bit number as a first bit number; when the needle bed is designed, marking the position number of each needle sleeve on the needle bed as a second position number, and establishing an association relationship between the second position number and the corresponding first position number; exporting position information of each first bit number on the tested circuit board through circuit board design software, and marking the position information as first position information; exporting position information of each second bit number on the needle bed through circuit board design software, and marking the position information as second position information; the first position information and the corresponding second position information are compared one by one according to the incidence relation, and whether the needle sleeves on the needle bed are omitted or not or whether the positions of the needle sleeves deviate or not is obtained. According to the invention, the efficiency and accuracy of sleeve position detection during needle bed design can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board testing, and in particular to a circuit board needle bed packaging position detection method, device and storage medium. Background Art

[0002] In the production test of circuit boards, in order to improve the efficiency of circuit board testing and reduce human errors, it is necessary to develop a test needle bed that matches the circuit board. The test needle bed is mainly composed of a test probe, a needle bed circuit board with a needle sleeve installed, and a mechanical fixture. During the test, the test-related interface socket pins and test point pads (hereinafter collectively referred to as test points) on the circuit board under test are contacted with the probe under the pressure of the fixture, and an electrical connection is established between the needle bed circuit board and the automated testing device to detect whether each circuit on the circuit board is normal. Therefore, the position accuracy of the needle sleeve used to install the probe in the needle bed circuit board determines whether the test probe can accurately contact each test point in the circuit board under test, which also determines the availability and stability of the needle bed. Therefore, how to ensure that the installation position of the needle sleeve on the needle bed circuit board is consistent with the position of the test point on the circuit board under test is the key to the development of the needle bed circuit board.

[0003] In the prior art, the mainstream practice is to use photo-drawing viewing software to overlap the relevant photo-drawing layer of the needle bed circuit board with the relevant photo-drawing layer of the circuit board of the circuit board under test during the development of the needle bed circuit board, and then observe whether the needle bed needle sleeve position is consistent with the test point position of the circuit board under test, so as to check whether there is a deviation in the needle sleeve packaging position on the needle bed circuit board. Although this method can screen out most of the needle sleeve position deviation, it is time-consuming and prone to missed detection due to human negligence. Summary of the invention

[0004] In view of the above problems, the present application provides a circuit board detection needle bed packaging position detection method for solving the technical problems of low needle sleeve position detection efficiency and easy missed detection of the above needle bed.

[0005] To achieve the above-mentioned purpose, the present application provides a circuit board detection needle bed packaging position detection method, the circuit board detection needle bed packaging position detection method comprising the following steps:

[0006] Obtaining the position number of each test point on the circuit board under test and recording it as the first position number; when designing the needle bed, recording the position number of each needle sleeve on the needle bed as the second position number, and establishing an association relationship between the second position number and the corresponding first position number;

[0007] Exporting the position information of each of the first bit numbers on the tested circuit board through circuit board design software, and marking it as first position information;

[0008] Export the position information of each of the second position numbers on the needle bed through circuit board design software and mark it as second position information;

[0009] The first position information and the corresponding second position information are compared one by one according to the association relationship to determine whether a needle sleeve on the needle bed is missing or the position is offset.

[0010] Further, the step of comparing the first position information with the corresponding second position information one by one according to the association relationship to determine whether a needle sleeve on the needle bed is missing or shifted includes:

[0011] According to the association relationship, it is determined whether the second bit number in the second position information includes all the first bit numbers in the first position information; if not, it is prompted to check whether the needle cover on the needle bed is missing.

[0012] Further, the prompting to check whether the needle cover on the needle bed is missing also includes:

[0013] The schematic diagram of the circuit board under test is compared with the schematic diagram of the needle bed, and a result interface of the comparison is displayed.

[0014] Furthermore, the first position information and the second position information respectively include a position name, coordinates and a rotation angle;

[0015] The step of comparing the first position information with the corresponding second position information one by one according to the association relationship to determine whether a needle sleeve on the needle bed is missing or the position is offset includes:

[0016] Comparing the coordinate deviation value and the rotation angle deviation value in the first position information and the corresponding second position information according to the association relationship to see whether they exceed corresponding thresholds;

[0017] When any one of the deviation value of the coordinates and the deviation value of the rotation angle exceeds a corresponding threshold value, it is indicated that the needle sleeve is offset.

[0018] Furthermore, the step of exporting the position information of each of the first bit numbers on the tested circuit board through circuit board design software includes:

[0019] Export the coordinate text file of the device of the tested circuit board through the circuit board design software;

[0020] According to the device bit number names in the coordinate text file, the test points that need to be tested are screened out; the position information of each test point is the position information of each of the first bit numbers;

[0021] The method of exporting the position information of each second bit number on the needle bed by circuit board design software includes:

[0022] The bill of materials in the needle bed schematic diagram is exported through circuit board design software, and the bill of materials includes the position information of each of the second position numbers.

[0023] Furthermore, the circuit board design software includes any one of Altium Designer, Cadence, MentorGraphics, Synopsys, Eagle PCB Design, KiCAD, Proteus, and EasyEDA.

[0024] In order to solve the above technical problems, this application also provides another technical solution:

[0025] A circuit board detection needle bed packaging position detection device, comprising:

[0026] An association module is used to obtain the position number of each test point on the circuit board under test and record it as the first position number; when designing the needle bed, the position number of each needle sleeve on the needle bed is recorded as the second position number, and the second position number is associated with the corresponding first position number;

[0027] An acquisition module, used to export the position information of each of the first bit numbers on the tested circuit board through the circuit board design software, and mark it as the first position information; and to export the position information of each of the second bit numbers on the needle bed through the circuit board design software, and mark it as the second position information;

[0028] The comparison module is used to compare the first position information with the corresponding second position information one by one according to the association relationship to determine whether the needle sleeve on the needle bed is missing or the position is offset.

[0029] Further, the step of comparing the first position information with the corresponding second position information one by one according to the association relationship to determine whether a needle sleeve on the needle bed is missing or shifted includes:

[0030] According to the association relationship, it is determined whether the second bit number in the second position information includes all the first bit numbers in the first position information; if not, it is prompted to check whether the needle cover on the needle bed is missing.

[0031] Further, the step of comparing the first position information with the corresponding second position information one by one according to the association relationship to determine whether a needle sleeve on the needle bed is missing or shifted includes:

[0032] Comparing the coordinate deviation value and the rotation angle deviation value in the first position information and the corresponding second position information according to the association relationship to see whether they exceed corresponding thresholds;

[0033] When any one of the deviation value of the coordinates and the deviation value of the rotation angle exceeds a corresponding threshold value, it is indicated that the needle sleeve is offset.

[0034] In order to solve the above technical problems, this application also provides another technical solution:

[0035] A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the circuit board detection needle bed packaging position detection method described in any one of the above technical solutions is executed.

[0036] Different from the prior art, the above technical solution associates the second number of the needle sleeve with the first number of the socket interface and the test point on the circuit board to be tested (i.e., establishes an association relationship) when designing the needle bed, and then derives the first position information of each first number to be tested on the circuit board to be tested and the second position information of each needle sleeve on the needle bed through the circuit board design software; finally, the first position information and the second position information are automatically compared through the software according to the association relationship, so as to determine whether the needle sleeve is missing and whether the position of the needle sleeve is offset. This technical solution can greatly improve the efficiency and accuracy of checking the position of each needle sleeve on the needle bed after the needle bed is designed.

[0037] The above-mentioned records related to the invention content are only an overview of the technical solution of the present application. In order to enable ordinary technicians in the field to more clearly understand the technical solution of the present application, and then implement it according to the text of the specification and the contents recorded in the drawings, and to make the above-mentioned purpose and other purposes, features and advantages of the present application easier to understand, the following is an explanation in combination with the specific implementation mode and drawings of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The drawings are only used to illustrate the principles, implementation methods, applications, characteristics and effects of the specific embodiments of the present invention and other related contents, and shall not be considered as limiting the present application.

[0039] In the drawings of the specification:

[0040] Figure 1 It is a flow chart of the circuit board detection needle bed packaging position detection method described in the specific implementation method;

[0041] Figure 2 It is a flow chart of the circuit board detection needle bed packaging position detection method described in the specific implementation method;

[0042] Figure 3 It is a module block diagram of the circuit board detection needle bed packaging position detection device described in the specific implementation method;

[0043] Figure 4 A schematic diagram of a computer-readable storage medium according to a specific embodiment;

[0044] The reference numerals in the above drawings are described as follows:

[0045] 300, circuit board detection needle bed packaging position detection device; 301, association module; 302, acquisition module; 303, comparison module;

[0046] 400. Computer readable storage medium; DETAILED DESCRIPTION

[0047] In order to explain in detail the possible application scenarios, technical principles, specific schemes that can be implemented, and the purposes and effects that can be achieved, the following is a detailed description of the specific embodiments listed in conjunction with the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0048] Reference to "embodiment" herein means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The term "embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or association with other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, the various technical features mentioned in the embodiments can be combined in any way to form a corresponding implementable technical solution.

[0049] Unless otherwise defined, the technical terms used in this document have the same meanings as those generally understood by those skilled in the art to which this application belongs; the use of relevant terms in this document is only for describing specific embodiments and is not intended to limit this application.

[0050] In the description of this application, the term "and / or" is an expression used to describe the logical relationship between objects, indicating that three relationships may exist, for example, A and / or B, which means: A exists, B exists, and A and B exist at the same time. In addition, the character " / " in this article generally indicates that the objects before and after are in an "or" logical relationship.

[0051] In the present application, terms such as “first” and “second” are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship of quantity, priority or sequence between these entities or operations.

[0052] Without further limitations, in this application, the words "include", "comprises", "has" or other similar open-ended expressions used in sentences are intended to cover non-exclusive inclusion. These expressions do not exclude the presence of additional elements in the process, method or product including the elements, so that the process, method or product including a series of elements may include not only those limited elements, but also other elements not explicitly listed, or also include elements inherent to such process, method or product.

[0053] Similar to the understanding in the Examination Guidelines, in this application, expressions such as "greater than", "less than", "exceed" and the like are understood to exclude the number itself; expressions such as "above", "below", "within" and the like are understood to include the number itself. In addition, in the description of the embodiments of this application, "multiple" means more than two (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups", "multiple times", etc., unless otherwise clearly and specifically limited.

[0054] In the description of the embodiments of the present application, space-related expressions used, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the specific embodiments or drawings, and are only for the convenience of describing the specific embodiments of the present application or facilitating the reader's understanding, and do not indicate or imply that the referred device or component must have a specific position, a specific orientation, or be constructed or operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0055] Unless otherwise expressly specified or limited, in the description of the embodiments of the present application, the terms such as "install", "connect", "connect", "fix", "set", etc. used should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integrated setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For technicians in the technical field to which the present application belongs, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0056] In the related art, the position of the needle sleeve on the needle bed is checked by using photo drawing viewing software, that is, the photo drawing layer of the needle bed circuit printed circuit board is overlapped with the photo drawing layer of the circuit printed circuit board of the circuit board under test by using the photo drawing viewing software, and then the needle sleeve position is compared with the test point position to see if they are consistent. This inspection method still requires manual inspection of the position of each needle sleeve, so there are still technical problems such as time-consuming inspection and easy omission.

[0057] Based on the problems existing in the above-mentioned related technologies, the present application proposes a circuit board detection needle bed package position detection method, device and storage medium, according to the association relationship, the needle sleeve package position number (i.e., the second position number) is matched one by one with the position number of the test point of the tested mainboard (i.e., the first position number), and then the position information of the needle sleeve (i.e., the second position information) and the position information of each test point on the tested circuit board (i.e., the first position information) are exported through the circuit board design software, and finally the position information of the needle sleeve is matched one by one with the position information of the test point through the above-mentioned association relationship and the position comparison is automatically performed through the software. The technical solution proposed in the present application can match the position information of the needle sleeve with the position information of the test point one by one through the circuit board design software, and can realize automatic position comparison, thereby greatly improving the efficiency and accuracy of the position inspection of each needle sleeve on the needle bed.

[0058] See also Figure 1 This embodiment provides a circuit board needle bed packaging position detection method, the circuit board needle bed packaging position detection method comprises the following steps:

[0059] S101. Obtain the position number of each test point on the circuit board under test and record it as the first position number; when designing the needle bed, record the position number of each needle sleeve on the needle bed as the second position number, and establish an association relationship between the second position number and the corresponding first position number.

[0060] S102: Export the position information of each of the first bit numbers on the tested circuit board through circuit board design software, and mark it as first position information.

[0061] S103, exporting the position information of each of the second position numbers on the needle bed through circuit board design software, and marking it as second position information.

[0062] S104: Compare the first position information and the corresponding second position information one by one according to the association relationship to determine whether a needle sleeve on the needle bed is missing or the position is offset.

[0063] In S101, the test points can be selected according to the test needs of the circuit board, and circuit boards with different functions, types and specifications can select different numbers and positions of test points as needed. The test points are used to contact the probes on the test needle bed, so that the local circuit on the tested circuit board establishes an electrical connection with the automated testing device through the needle bed circuit board, thereby detecting whether this part of the circuit is normal (for example, whether it is open or short-circuited). The test points can be pads on the tested circuit board for soldering electronic components, and the test points can also be interface socket pins for plugging electronic components, sub-circuit boards or circuit connectors (such as serial port connectors, parallel port connectors, HDMI connectors, SUB connectors, etc.). In some circuit boards without interface sockets, the test points may only have pad test points, but no test points corresponding to the interface sockets; in some circuit boards, the test points may include both interface socket pins and test points corresponding to component pads.

[0064] The association relationship refers to the mapping relationship between the position number of each test point and the position of the needle sleeve. Through the mapping relationship, the position number of the needle sleeve corresponding to the position number of each test point can be obtained, that is, a test point has only one unique position number name, and the position number name has only one corresponding needle sleeve position number name.

[0065] Since the circuit board to be tested is designed first, and the position numbers of the test points on the circuit board to be tested are also determined, when designing the needle bed, the association relationship can be determined first, and then the position numbers of the needle sleeves on the needle bed can be named according to the association relationship. Therefore, the association relationship can be preset when the needle bed is designed, and then the position numbers of the needle sleeves can be named according to the association relationship, so that the position numbers of the test points correspond to the position numbers of the needle sleeves one by one. The association relationship includes the position number of the needle sleeve adopting the same position number name as the test point position number, or adding a prefix or suffix to the same name; of course, the above-mentioned association relationship in this application is not limited to the use of the same position number name or prefix and suffix.

[0066] In step S102, the circuit board design software can be the EDA design software commonly used in the field of circuit board design. The full name of the EDA design software is Electronic Design Automation (abbreviated as EDA), which is a design method that uses computer-aided design (CAD) software to complete the functional design, synthesis, verification, physical design (including layout, wiring, layout, design rule checking, etc.) of integrated circuit (VLSI) chips. The circuit board design software includes any one of Altium Designer, Cadence, Mentor Graphics, Synopsys, Eagle PCB Design, KiCAD, Proteus, and EasyEDA. In step S102, the information of all the bit numbers on the tested circuit board can be first derived, and then the position information of the first bit number corresponding to each test point position can be screened out. Step S103 can derive the position information of the second bit number in the same way as S102.

[0067] In step S104, after the first position information and the second position information are obtained through steps S102 and S103, the first position information and the second position information are first matched one-to-one according to the above-mentioned association relationship, and then it is determined whether the position of the needle sleeve and the test point is offset according to the specific value of the position information. The above-mentioned determination of whether the position of the needle sleeve and the test point is offset according to the specific value of the position information can be achieved by designing a corresponding numerical comparison program, without the need for manual one-to-one comparison.

[0068] In the above embodiment, the test point and the needle sleeve can be matched one by one through the association relationship, and then the position information of the two can be automatically compared to determine whether the needle sleeve is aligned with the test point. There is no need to export the photolithography files of the circuit board and the needle bed respectively through the photolithography software, and then overlap the two for manual position comparison. Therefore, the efficiency and accuracy of the needle sleeve position inspection during the needle bed design can be greatly improved.

[0069] In one embodiment, the step of comparing the first position information with the corresponding second position information one by one according to the association relationship to determine whether a needle sleeve on the needle bed is missing or shifted includes:

[0070] According to the association relationship, it is determined whether the second bit number in the second position information includes all the first bit numbers in the first position information; if not, it is prompted to check whether the needle cover on the needle bed is missing.

[0071] In this embodiment, when it is detected that there are some test point positions without corresponding needle sleeve positions, it is considered that the needle bed has omitted the needle sleeves corresponding to these test points during design, so these test points will be missed during testing. In this embodiment, it is possible to determine whether the needle sleeves are missed or wrongly set through the association relationship, thereby avoiding missing the test points on the circuit board under test during testing.

[0072] In one embodiment, the prompting to check whether the needle cover on the needle bed is missing further includes:

[0073] The schematic diagram of the circuit board under test is compared with the schematic diagram of the needle bed, and a result interface of the comparison is displayed.

[0074] In this embodiment, when it is detected that the needle sleeve is missing or incorrectly set when designing the needle bed, the schematic diagram of the circuit board under test and the schematic diagram of the needle bed can be automatically compared, so that it is possible to find out in a timely and convenient manner which test points correspond to the missing needle sleeves, and make targeted adjustments to the needle bed circuit schematic.

[0075] In one embodiment, the first position information and the second position information respectively include a position name, coordinates, and a rotation angle. The step of comparing the first position information with the corresponding second position information one by one according to the association relationship to determine whether the needle sleeve on the needle bed is missing or the position is offset includes:

[0076] Comparing the coordinate deviation value and the rotation angle deviation value in the first position information and the corresponding second position information according to the association relationship to see whether they exceed corresponding thresholds;

[0077] The first position information includes the position information of all test points, and the second position information includes the position information of all needle sleeves. By comparing the associated first position information and second position information one by one, it is determined whether the coordinates and rotation angles of each needle sleeve in the second position information are offset, and the specific deviation value. When any one of the deviation values ​​of the coordinates and the deviation values ​​of the rotation angle exceeds the corresponding threshold, it is indicated that the needle sleeve is offset. Among them, the threshold can be set according to the different design requirements of the circuit board under test. In some circuit boards with higher precision requirements, the range of the threshold is correspondingly narrower, and vice versa.

[0078] In this embodiment, the horizontal and vertical coordinates and the rotation angle of the needle sleeve are compared to ensure that the needle sleeve can be accurately aligned with the corresponding test point.

[0079] In one embodiment, the exporting of the position information of each first bit number on the tested circuit board through circuit board design software includes:

[0080] Export the coordinate text file of the device of the tested circuit board through the circuit board design software;

[0081] According to the device bit number names in the coordinate text file, the test points that need to be tested are screened out; the position information of each test point is the position information of each of the first bit numbers;

[0082] The method of exporting the position information of each second bit number on the needle bed by circuit board design software includes:

[0083] The bill of materials in the needle bed schematic diagram is exported through circuit board design software, and the bill of materials includes the position information of each of the second position numbers.

[0084] like Figure 2 FIG. 1 is a flow chart of a circuit board needle bed packaging position detection method in a specific embodiment. The circuit board needle bed packaging position detection method includes the following steps:

[0085] S201, arranging the position numbers of the needle sleeves on the needle bed according to the association relationship, so that the position numbers of the needle sleeves on the needle bed correspond to the test points on the circuit board under test one by one.

[0086] S202. Export the device coordinate text file of the circuit board under test through EDA software.

[0087] S203, filter out the test points that need to be tested from the device coordinate text file, the location information of each test point being the location information of the first bit number. Specifically, the program can judge the device bit number name prefix in the coordinate text file, thereby filtering out the coordinate information belonging to the test point, deleting the lines that are not related to the test point, renaming the processed coordinate file to "ouput1" and saving it to the path preset by the program.

[0088] S204, exporting a text file of the bill of materials of the needle bed schematic diagram, namely, a BOM list, through EDA software. The bill of materials contains the position number information of all components of the needle bed schematic diagram, namely, the bill of materials contains the position information of each second position number.

[0089] S205, compare the bill of materials text file and the device coordinate text file to determine whether the needle sleeve is missing. The program compares the device number of "ouput1" with the number string of the BOM list in the first column line by line. If there is a number that does not exist in the BOM list, it is updated to the schematic comparison result interface of the tool to remind the developer to check the needle bed schematic diagram.

[0090] S206. The coordinate text file of the needle bed PCB device is exported through EDA.

[0091] S207, compare the positions of the corresponding components in the device coordinate text file of the needle bed schematic diagram and the device coordinate text file of the circuit board under test, and check whether the needle sleeve position is offset. Among them, the program uses the first column of the position number information in each line of information of "ouput1" (that is, the name of the position number of the test point) to match the first column of the position number information in each line of the needle bed PCB device coordinate text file (the name of the position number of the needle sleeve), and the devices with the same position number are matched with their second, third, and fourth columns of data. The second, third, and fourth columns of data are respectively X coordinates, Y coordinates, and device rotation angles. If there are differences in coordinate and rotation angle information, the deviation value is calculated and updated to the PCB comparison result interface of the tool to remind the developer to check the needle bed PCB.

[0092] like Figure 3 As shown, in one embodiment, a circuit board needle bed packaging position detection device 300 is provided. The circuit board needle bed packaging position detection device 300 includes: an association module 301, an acquisition module 302 and a comparison module 303.

[0093] The association module 301 is used to obtain the position number of each test point on the tested circuit board and record it as the first position number; when designing the needle bed, the position number of each needle sleeve on the needle bed is recorded as the second position number, and the second position number is associated with the corresponding first position number.

[0094] The acquisition module 302 is used to export the position information of each first position number on the tested circuit board through the circuit board design software and mark it as the first position information; and to export the position information of each second position number on the needle bed through the circuit board design software and mark it as the second position information.

[0095] The comparison module 303 is used to compare the first position information and the corresponding second position information one by one according to the association relationship to determine whether the needle cover on the needle bed is missing or the position is offset.

[0096] Among them, the test points can be selected according to the test needs of the circuit board, and circuit boards with different functions, types and specifications can select different numbers and positions of test points as needed. The test points are used to contact the probes on the test needle bed, so that the local circuit on the tested circuit board establishes an electrical connection with the automated testing device through the needle bed circuit board, thereby detecting whether this part of the circuit is normal (for example, whether it is open or short-circuited). The test points can be pads for soldering electronic components on the tested circuit board, and the test points can also be interface socket pins for plugging electronic components, sub-circuits or circuit connectors (such as serial port connectors, parallel port connectors, HDMI connectors, SUB connectors, etc.). In some circuit boards without interface sockets, the test points may only have pad test points, but no test points corresponding to the interface sockets; while in some circuit boards, the test points may include both the interface socket pins and the test points corresponding to the component pads. The association relationship can be preset in advance when designing the needle bed, and then the names of the position numbers of each needle sleeve are named according to the association relationship, so that the position numbers of the test points correspond to the position numbers of the needle sleeves one by one. The association relationship includes that the position number of the trocar adopts the same position number name as the test point position number, or adds a prefix or suffix to the same name; of course, the above association relationship in this application is not limited to using the same position number name or prefix and suffix.

[0097] The association relationship refers to the mapping relationship between the position number of each test point and the position of the needle sleeve. Through the mapping relationship, the position number of the needle sleeve corresponding to the position number of each test point can be obtained, that is, a test point has only one unique position number name, and the position number name has only one corresponding needle sleeve position number name.

[0098] In the acquisition module 202, the circuit board design software involved can be the EDA design software commonly used in the field of circuit board design. The full name of the EDA design software is Electronic Design Automation (abbreviated as EDA), which is a design method that uses computer-aided design (CAD) software to complete the functional design, synthesis, verification, physical design (including layout, wiring, layout, design rule checking, etc.) of integrated circuit (VLSI) chips. The circuit board design software includes any one of Altium Designer, Cadence, Mentor Graphics, Synopsys, Eagle PCBDesign, KiCAD, Proteus, and EasyEDA. In step S102, the information of all the bit numbers on the tested circuit board can be first derived, and then the position information of the first bit number corresponding to each test point position can be screened out. Step S103 can derive the position information of the second bit number in the same way as S102.

[0099] In the comparison module, the first position information is first matched with the second position information one by one according to the above association relationship, and then it is determined whether the position of the needle sleeve and the test point is offset according to the specific value of the position information. The above determination of whether the position of the needle sleeve and the test point is offset according to the specific value of the position information can be achieved by designing a corresponding numerical comparison program without manual one-to-one comparison.

[0100] In the above embodiment, the test point and the needle sleeve can be matched one by one through the association relationship, and then the position information of the two can be automatically compared to determine whether the needle sleeve is aligned with the test point. There is no need to export the photolithography files of the circuit board and the needle bed respectively through the photolithography software, and then overlap the two for manual position comparison. Therefore, the efficiency and accuracy of the needle sleeve position inspection during the needle bed design can be greatly improved.

[0101] In some embodiments, comparing the first position information and the corresponding second position information one by one according to the association relationship to obtain whether the needle sleeve on the needle bed is missing or the position is offset includes:

[0102] According to the association relationship, it is determined whether the second bit number in the second position information includes all the first bit numbers in the first position information; if not, it is prompted to check whether the needle cover on the needle bed is missing.

[0103] In some embodiments, comparing the first position information and the corresponding second position information one by one according to the association relationship to obtain whether the needle sleeve on the needle bed is missing or the position is offset includes:

[0104] Comparing the coordinate deviation value and the rotation angle deviation value in the first position information and the corresponding second position information according to the association relationship to see whether they exceed corresponding thresholds;

[0105] When any one of the deviation value of the coordinates and the deviation value of the rotation angle exceeds a corresponding threshold value, it is indicated that the needle sleeve is offset.

[0106] like Figure 4 As shown, this embodiment provides a computer-readable storage medium 400. The computer-readable storage medium 400 stores a computer program, and when the computer program is executed by a processor, the circuit board detection needle bed packaging position detection method described in any one of the above embodiments is executed.

[0107] The computer-readable storage medium may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. The non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), a ferromagnetic random access memory (FRAM), a flash memory, a magnetic surface memory, an optical disk, or a compact disc read-only memory (CD-ROM); the magnetic surface memory may be a disk memory or a tape memory.

[0108] The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example but not limitation, many forms of RAM are available, such as static random access memory (SR AM), synchronous static random access memory (SSR AM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), direct memory bus random access memory (DRRAM). The computer-readable storage medium described in the embodiments of the present invention is intended to include these and any other suitable types of memory.

[0109] In some embodiments, the processor can be implemented by software, hardware, firmware or a combination thereof, and can use circuits, single or multiple application specific integrated circuits (Application Specific Integrated Circuit, ASIC), digital signal processors (Digital Signal Processor, DSP), digital signal processing devices (Digital Signal Processing Device, DSPD), programmable logic devices (Programmable Logic Device, PLD), field programmable gate arrays (Field Programmable Gate Array, FPGA), central processing units (Central Processing Unit, CPU), controllers, microcontrollers, at least one of microprocessors, so that the processor can execute some or all of the steps in the circuit board detection needle bed packaging position detection method in each embodiment of the present application, or any combination of the steps therein.

[0110] Finally, it should be noted that although the above embodiments have been described in the specification and drawings of this application, this does not limit the scope of patent protection of this application. All technical solutions generated by replacing or modifying equivalent structures or equivalent processes based on the essential concept of this application using the contents recorded in the specification and drawings of this application, as well as directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, are included in the scope of patent protection of this application.

Claims

1. A circuit board needle bed packaging position detection method, characterized in that: The following steps are involved: Obtaining the position number of each test point on the circuit board under test and recording it as the first position number; when designing the needle bed, recording the position number of each needle sleeve on the needle bed as the second position number, and establishing an association relationship between the second position number and the corresponding first position number; Exporting the position information of each of the first bit numbers on the tested circuit board through circuit board design software, and marking it as first position information; Export the position information of each of the second position numbers on the needle bed through circuit board design software and mark it as second position information; The first position information and the corresponding second position information are compared one by one according to the association relationship to determine whether a needle sleeve on the needle bed is missing or the position is offset.

2. The circuit board needle bed packaging position detection method according to claim 1, characterized in that: The step of comparing the first position information with the corresponding second position information one by one according to the association relationship to determine whether a needle sleeve on the needle bed is missing or the position is offset includes: According to the association relationship, it is determined whether the second bit number in the second position information includes all the first bit numbers in the first position information; if not, it is prompted to check whether the needle cover on the needle bed is missing.

3. The circuit board needle bed packaging position detection method according to claim 2, characterized in that: The prompting to check whether the needle sleeve on the needle bed is missing also includes: The schematic diagram of the circuit board under test is compared with the schematic diagram of the needle bed, and a result interface of the comparison is displayed.

4. The circuit board needle bed packaging position detection method according to claim 1, characterized in that: The first position information and the second position information respectively include a position name, coordinates and a rotation angle; The step of comparing the first position information with the corresponding second position information one by one according to the association relationship to determine whether a needle sleeve on the needle bed is missing or the position is offset includes: Comparing the coordinate deviation value and the rotation angle deviation value in the first position information and the corresponding second position information according to the association relationship to see whether they exceed corresponding thresholds; When any one of the deviation value of the coordinates and the deviation value of the rotation angle exceeds a corresponding threshold value, it is indicated that the needle sleeve is offset.

5. The circuit board needle bed packaging position detection method according to claim 1, characterized in that: The step of exporting the position information of each of the first bit numbers on the tested circuit board through the circuit board design software includes: Export the coordinate text file of the device of the tested circuit board through the circuit board design software; According to the device bit number names in the coordinate text file, the test points that need to be tested are screened out; the position information of each test point is the position information of each of the first bit numbers; The method of exporting the position information of each second bit number on the needle bed by circuit board design software includes: The bill of materials in the needle bed schematic diagram is exported through circuit board design software, and the bill of materials includes the position information of each of the second position numbers.

6. The circuit board needle bed packaging position detection method according to claim 1, characterized in that: The circuit board design software includes any one of Altium Designer, Cadence, Mentor Graphics, Synopsys, Eagle PCBDesign, KiCAD, Proteus, and EasyEDA.

7. A circuit board needle bed packaging position detection device, characterized in that: include: An association module is used to obtain the position number of each test point on the circuit board under test and record it as the first position number; when designing the needle bed, the position number of each needle sleeve on the needle bed is recorded as the second position number, and the second position number is associated with the corresponding first position number; An acquisition module, used for exporting the position information of each of the first bit numbers on the tested circuit board through circuit board design software, and marking it as first position information; And exporting the position information of each of the second position numbers on the needle bed through circuit board design software, and marking it as second position information; The comparison module is used to compare the first position information with the corresponding second position information one by one according to the association relationship to determine whether the needle sleeve on the needle bed is missing or the position is offset.

8. The circuit board needle bed packaging position detection device according to claim 7, characterized in that: The step of comparing the first position information with the corresponding second position information one by one according to the association relationship to determine whether a needle sleeve on the needle bed is missing or the position is offset includes: According to the association relationship, it is determined whether the second bit number in the second position information includes all the first bit numbers in the first position information; if not, it is prompted to check whether the needle cover on the needle bed is missing.

9. The circuit board needle bed packaging position detection device according to claim 7, characterized in that: The step of comparing the first position information with the corresponding second position information one by one according to the association relationship to determine whether a needle sleeve on the needle bed is missing or the position is offset includes: Comparing the coordinate deviation value and the rotation angle deviation value in the first position information and the corresponding second position information according to the association relationship to see whether they exceed corresponding thresholds; When any one of the deviation value of the coordinates and the deviation value of the rotation angle exceeds a corresponding threshold value, it is indicated that the needle sleeve is offset.

10. A computer-readable storage medium having a computer program stored therein, characterized in that: When the computer program is executed by the processor, the circuit board detection needle bed packaging position detection method according to any one of claims 1 to 6 is executed.

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