Photoetching equipment operation control method and device, storage medium and equipment

Abstract

The invention provides a photoetching equipment operation control method and device, a storage medium and equipment, and the method comprises the steps: obtaining a photoetching task sent by a user side, and the photoetching task comprises substrate parameters and process parameters needing to be operated; comparing the substrate parameter in the photoetching task with a preset substrate parameter threshold value, and comparing the process parameter in the photoetching task with a preset process parameter threshold value; if the substrate parameter meets a substrate parameter threshold value and the process parameter meets a process parameter threshold value, sending an in-equipment real-time state parameter acquisition instruction to photoetching equipment; acquiring in-equipment real-time state parameters sent by the photoetching equipment; if the real-time state parameters in the equipment are matched with substrate parameters, needing to be operated, of a photoetching task, generating a plurality of photoetching equipment operation instructions according to the photoetching task, and sending the photoetching equipment operation instructions to the photoetching equipment according to a set sequence, and enabling the photoetching equipment to carry out first-stage processing on a substrate in the equipment according to the photoetching equipment operation instruction.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and in particular to a method, device, storage medium and equipment for controlling operation of lithography equipment. Background Art

[0002] Laser direct writing lithography equipment is one of the key equipment in the field of micro-nano processing and the preparation of electronic products. It uses one or more focused laser beams to expose photoresist and can manufacture micro-nano structures on a large area. Laser direct writing lithography equipment does not require the use of a mask and can directly control the laser beam to expose the photoresist to achieve rapid manufacturing of micro-nano architectures.

[0003] On the one hand, due to the complicated operation of existing laser direct writing lithography equipment, the lithography process requires multiple operation steps, and it is necessary to find the corresponding parameter input box in each operation step, enter the corresponding parameters and then operate; the operator must enter the correct process parameters in each step in a specific order and click the corresponding button to make the lithography task execute normally. Otherwise, a slight error in the order, an error in the process parameter input or clicking the wrong button can easily cause problems with the results, or the exposure setting may fail and the equipment may be damaged. On the other hand, unlike the relatively stable lithography process in semiconductor manufacturing companies, the scientific research lithography process involves different product requirements, requires different substrates, different photoresists and requires a variety of parameters. The experimental nature of scientific research and the cross-disciplinary nature of scientific researchers make the lithography process more prone to misoperation. Summary of the invention

[0004] Based on this, the present invention provides a method, device, storage medium and equipment for controlling the operation of lithography equipment. By extracting the data input by the user end and comprehensively processing the status information of the lithography equipment, specific operation data and operation steps are sent to the lithography equipment according to a preset process, thereby reducing the operator's direct operation of the complicated interface of the lithography equipment and avoiding errors caused by non-standard operations.

[0005] In a first aspect, the present invention provides a method for controlling operation of a lithography device, comprising:

[0006] Acquire a lithography task sent by a user terminal, wherein the lithography task includes substrate parameters and process parameters to be operated;

[0007] Comparing the substrate parameters in the photolithography task with the preset substrate parameter thresholds, and comparing the process parameters in the photolithography task with the preset process parameter thresholds;

[0008] If the substrate parameter satisfies the substrate parameter threshold and the process parameter satisfies the process parameter threshold, sending a real-time status parameter acquisition instruction in the device to the lithography device;

[0009] Obtaining real-time status parameters of the device sent by the lithography device;

[0010] If the real-time status parameters in the device match the substrate parameters that need to be operated in the lithography task, a number of lithography device operation instructions are generated according to the lithography task, and the lithography device operation instructions are sent to the lithography device in a set order, so that the lithography device performs the first stage of processing on the substrate in the device according to the lithography device operation instructions.

[0011] Furthermore,

[0012] Obtain the identity authentication information sent by the user, and obtain the group authority and user task authority for the lithography equipment of the user according to the identity authentication information;

[0013] Multiple levels of user task permissions within each level of group permissions for lithography equipment use, including:

[0014] When the lithography equipment use permission of the user terminal is the first permission, obtaining the lithography task sent by the user terminal and the historical lithography tasks within the upper group permission;

[0015] The lithography task sent by the user terminal is compared with the historical lithography tasks stored in the upper group authority, and if the lithography task is consistent with any historical lithography task, the lithography task is retained;

[0016] If the lithography task is inconsistent with any historical lithography task, a prompt indicating insufficient authority is returned to the user end;

[0017] When the lithography equipment use permission of the user terminal is the second permission, obtaining the lithography task sent by the user terminal, and if various parameters of the lithography task meet the maximum threshold of the lithography task within the upper group permission, retaining the lithography task;

[0018] If the parameters of the lithography task do not meet the maximum threshold of the lithography task within the upper group authority, a prompt indicating insufficient authority is returned to the user end;

[0019] When the user task authority level is the third level, the lithography task sent by the user terminal is obtained, and if the parameters of the lithography task meet the maximum threshold of the lithography task within the upper group authority, the lithography task is retained;

[0020] If the parameters of the lithography task do not meet the maximum threshold of the lithography task within the upper group authority, a permission application prompt is returned to the user terminal. Further, the lithography task also includes an exposure mode, and the exposure mode includes a first exposure mode and a second exposure mode;

[0021] When the exposure mode is the second exposure mode, the photolithography equipment control method further includes:

[0022] After receiving the first stage processing completion indication, sending an image acquisition instruction to the lithography equipment;

[0023] The marking coordinates of the substrate are determined according to the image information returned by the lithography equipment, and the marking coordinates and lithography process parameters are sent to the lithography equipment, so that the lithography equipment performs the second stage processing on the substrate in the equipment according to the marking coordinates and lithography process parameters.

[0024] Further, the marking coordinates of the substrate are determined according to the image information returned by the lithography equipment, and the marking coordinates and the lithography process parameters are sent to the lithography equipment, so that the lithography equipment performs the second stage processing on the substrate in the equipment according to the marking coordinates and the lithography process parameters, specifically:

[0025] Determining at least one target pattern on the substrate by image recognition in combination with image information returned by the lithography device;

[0026] If the target pattern is not located at the center point of the cursor in the field of view, an image movement instruction and an image acquisition instruction are sent to the lithography device until the target pattern in the image information returned by the lithography device is located at the center point of the cursor in the field of view;

[0027] When the target pattern is located at the center point of the cursor in the field of view, a target pattern coordinate acquisition instruction is sent to the lithography device to obtain the actual coordinates of the target pattern;

[0028] Compare the actual coordinates of the target pattern with the designed coordinates to obtain the displacement information of the first-stage lithography image;

[0029] A second-stage processing instruction is generated according to the displacement information of the first-stage lithography image and the lithography process parameters, and the second-stage processing instruction is sent to the lithography equipment to realize the second-stage processing of the substrate in the equipment.

[0030] Furthermore, the substrate parameters include the quantity, size, material, thickness and shape of the substrate to be processed;

[0031] The process parameters include exposure pattern, exposure front and back side selection, photoresist type and exposure dose.

[0032] Furthermore, the process parameters in the lithography task are compared with a preset process parameter threshold, specifically:

[0033] Select and obtain historical data of photolithography process parameters according to the exposure pattern and the front and back exposure in the photolithography process parameters, wherein the historical data of photolithography process parameters includes the historical types of photoresists and the historical exposure doses corresponding to the exposure pattern and the front and back exposure;

[0034] If the photoresist type in the photolithography process parameters is consistent with the photoresist history type, determining whether the exposure dose meets the exposure dose condition;

[0035] If the exposure dose satisfies the first exposure dose condition, a request for obtaining the substrate state parameters in the device is sent to the lithography device, and the first exposure dose condition is a first exposure dose threshold obtained according to the exposure history dose and the exposure dose limit of the lithography device.

[0036] Furthermore, the comparison of the process parameters in the lithography task with a preset process parameter threshold value further includes:

[0037] If the photoresist type in the photolithography process parameters is inconsistent with the historical photoresist type, a prompt message is sent to the user terminal;

[0038] After receiving the confirmation information returned by the user end, if the photoresist type does not belong to the prohibited range of the photolithography equipment, determining whether the exposure dose meets the exposure dose condition;

[0039] If the exposure dose satisfies the second exposure dose condition, sending a request for obtaining a substrate state parameter in the device to the lithography device;

[0040] The second exposure dose condition is a second exposure dose threshold obtained according to an exposure dose limit of the lithography equipment.

[0041] Furthermore, the comparison of the process parameters in the lithography task with a preset process parameter threshold value further includes:

[0042] If the exposure dose does not meet the first exposure dose condition or the second exposure dose condition, an operation termination prompt message is sent to the user terminal.

[0043] Furthermore, the lithography equipment operation control method further includes:

[0044] If the exposure dose exceeds a first ratio of the first exposure dose condition or the second exposure dose condition, sending lithography exposure dose prompt information to the user terminal;

[0045] If the exposure dose exceeds the second ratio of the first exposure dose condition or the second exposure dose condition, sending a lithography exposure dose warning message to the user terminal, and sending a task termination instruction to the lithography equipment;

[0046] The first ratio is smaller than the second ratio.

[0047] Further, the substrate parameter in the lithography task is compared with a preset substrate parameter threshold, specifically:

[0048] If the size of the substrate exceeds the size limit range of the lithography equipment or the thickness of the substrate exceeds the thickness limit range of the lithography equipment, an operation termination prompt message is sent to the user terminal.

[0049] Furthermore, the real-time status parameters in the device include the real-time substrate size, the real-time number of substrates and the real-time pattern to be exposed in the device;

[0050] If the real-time substrate size in the device is inconsistent with the size of the substrate in the lithography task, the real-time pattern to be exposed is inconsistent with the exposure pattern in the lithography task, or the real-time number of substrates is inconsistent with the number of substrates to be processed in the lithography task, an operation termination prompt message is sent to the user end.

[0051] Furthermore, the lithography equipment operation control method further includes:

[0052] After the photolithography task is completed, the actual sample image information is obtained;

[0053] If the difference between the actual sample image information and the lithography image of the lithography task exceeds an acceptable threshold, an alarm message indicating that the yield of the processed sample is too low is sent to the user end.

[0054] In a second aspect, the present invention further provides a lithography equipment operation control device, comprising:

[0055] A task acquisition module is used to acquire a lithography task sent by a user terminal, wherein the lithography task includes substrate parameters and process parameters to be operated;

[0056] A rationality judgment module, used for comparing the substrate parameters in the photolithography task with the preset substrate parameter threshold, and comparing the process parameters in the photolithography task with the preset process parameter threshold;

[0057] A status instruction request module, configured to send a real-time status parameter acquisition instruction in the device to the lithography device if the substrate parameter satisfies the substrate parameter threshold and the process parameter satisfies the process parameter threshold;

[0058] The device status acquisition module is used to obtain the real-time status parameters of the device sent by the lithography device;

[0059] The substrate processing module is used to generate a plurality of lithography equipment operation instructions according to the lithography task if the real-time status parameters in the equipment match the substrate parameters to be operated in the lithography task, and send the lithography equipment operation instructions to the lithography equipment in a set order, so that the lithography equipment performs the first stage of processing on the substrate in the equipment according to the lithography equipment operation instructions.

[0060] In a third aspect, the present invention further provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of any one of the photolithography equipment operation control methods in the first aspect.

[0061] In a fourth aspect, the present invention further provides a computer device, comprising a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, it executes any one of the lithography device operation control methods in the first aspect.

[0062] The beneficial effects of adopting the above-mentioned technical solution are as follows: the lithography equipment operation control method provided in this embodiment breaks the existing mode of direct operation on the lithography equipment, avoids delay errors caused by human operation errors or input errors, avoids equipment damage, and greatly improves equipment training efficiency and utilization efficiency; and increases the verification steps for lithography tasks, improves the data rigor of lithography tasks, reduces unnecessary experimental errors, and improves the success rate of experiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0064] Figure 1 This is a schematic diagram of a method for controlling operation of a lithography device in one embodiment of the present application;

[0065] Figure 2 This is a schematic diagram of substrate identification in a slot of a lithography device in one embodiment of the present application;

[0066] Figure 3 This is a schematic diagram of the image acquisition operation of a lithography device in one embodiment of the present application;

[0067] Figure 4 A schematic diagram of obtaining substrate marking coordinates in one embodiment of the present application;

[0068] Figure 5 This is a schematic diagram of performing an overlay operation in combination with marking coordinates in one embodiment of the present application;

[0069] Figure 6 This is a schematic diagram of a lithography equipment operation control device in one embodiment of the present application. DETAILED DESCRIPTION

[0070] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. In order to explain the present invention in more detail, the lithography equipment operation control method, device, storage medium and equipment provided by the present invention are specifically described below in combination with the drawings.

[0071] Unless otherwise defined, the technical terms or scientific terms used in the disclosure of this application should be understood by people with ordinary skills in the field to which the present invention belongs. The "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate a quantitative limit, but indicate that there is at least one. Similar words such as "include" or "include" mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship can also change accordingly.

[0072] Laser direct writing lithography equipment is a precision processing equipment that uses a laser beam to directly expose the substrate. It is widely used in micro-nano manufacturing in the fields of microelectronics, micromechanics, biomedicine, etc. Compared with traditional optical lithography technology, laser direct writing lithography technology has the following characteristics: (1) Laser direct writing does not require the use of a mask. The laser beam is directly controlled by a computer to expose the photosensitive material, which can achieve the rapid production of any complex graphics. (2) By using short-wavelength lasers (such as ultraviolet lasers) and fine focusing technology, laser direct writing lithography equipment can achieve nanometer-level resolution, which is suitable for ultra-precision processing requirements. (3) Because it is digitally controlled, it is very easy to modify the design pattern, which is suitable for small-batch customized production or sample preparation in the R&D stage. (4) For small-batch production and personalized customization, laser direct writing avoids the expensive mask production costs in traditional lithography and reduces costs. (5) It can be used not only for hard materials such as silicon wafers, but also for the processing of flexible substrates, organic materials and other materials.

[0073] The key parts of the laser direct writing lithography equipment include the equipment front-end module (EFEM), which is used for the automatic loading and unloading process of the substrate. It includes three major components: substrate loading system, substrate transport robot and substrate aligner, to realize operations such as substrate upper limit, offline, and batching before process. Operators can choose different robots and substrate loading platforms to meet production needs.

[0074] In this regard, the present invention provides a method for controlling the operation of a lithography device, which extracts data input by a user terminal and comprehensively processes the status information of the lithography device, and sends specific operation data and operation steps to the lithography device according to a preset process, thereby reducing the direct operation of the operator on the complicated interface of the lithography device and avoiding errors caused by irregular operations. Figure 1 A schematic diagram of a method for controlling operation of a lithography device is shown.

[0075] The embodiment of the present application provides an application scenario of the method for controlling the operation of a lithography device, and the application scenario includes the terminal device provided in the embodiment, and the terminal device includes but is not limited to a smart phone and a computer device, wherein the computer device can be at least one of a desktop computer, a portable computer, a laptop computer, a mainframe computer, a tablet computer, etc. The terminal device obtains the lithography task sent by the user end, and then sends the operation instructions of each step corresponding to the lithography task to the lithography device. For the specific process, please refer to the embodiment of the method for controlling the operation of the lithography device.

[0076] It should be noted that the application environment of the lithography equipment operation control method of this embodiment includes a user end, an intelligent process automation processor and a lithography equipment; wherein the user end is an execution end where the user uploads or sends the lithography task, and the parameters related to each step of the user's lithography task can be uploaded at one time, or can be adjusted according to the instructions returned by the intelligent process automation processor; the intelligent process automation processor is a processor that integrates artificial intelligence (AI), machine learning and robotic process automation (RPA) functions, and can perform rationality verification on the lithography tasks uploaded by the user, and generate specific operation instructions to send the parameters and operation buttons required to be input for each step in the lithography task to the lithography equipment to execute the lithography task. At the same time, it can also compare the device status information returned by the lithography equipment with the lithography task, mark and locate the substrate that needs to be overlaid in the lithography equipment, and improve the success rate of the execution of the lithography task; the lithography equipment of this embodiment is a laser direct writing lithography equipment, which is used to perform laser lithography operations on the substrate to be processed.

[0077] The following is an explanation of the steps of applying the lithography equipment operation control method to the intelligent process automation processor:

[0078] Step S101, obtaining a lithography task sent by a user terminal, wherein the lithography task includes substrate parameters and process parameters to be operated.

[0079] Specifically, the substrate parameters include the number, size, material, thickness and shape of the substrate to be processed; the process parameters include exposure pattern, exposure front and back side selection, photoresist type and exposure dose.

[0080] Step S102, comparing the substrate parameters in the lithography task with a preset substrate parameter threshold, and comparing the process parameters in the lithography task with a preset process parameter threshold.

[0081] Specifically, after obtaining the lithography task sent by the user end, step S102 needs to judge the rationality of the lithography task, including the rationality judgment of substrate parameters and the rationality judgment of process parameters. The rationality judgment of substrate parameters is specifically to compare the substrate parameters in the lithography task with the preset substrate parameter threshold, including:

[0082] If the size of the substrate exceeds the size limit range of the lithography equipment or the thickness of the substrate exceeds the thickness limit range of the lithography equipment, an operation termination prompt message is sent to the user terminal.

[0083] It should be noted that the size limit range and thickness limit range of the lithography equipment in this embodiment are set according to the specific model of the lithography equipment, and the limit ranges corresponding to different models of lithography equipment may be different. This step is set to avoid damage to the lithography equipment or waste of exposure substrates. When the size of the substrate exceeds the limit range, the substrate cannot be placed in the card slot of the lithography equipment; when the thickness of the substrate exceeds the upper limit of the thickness of the lithography equipment, the substrate will collide with the exposure lens and damage the equipment. When the thickness of the substrate is lower than the thickness of the lithography equipment, it will exceed the exposure range of the exposure lens, resulting in the inability to form an exposure pattern; when the shape of the substrate does not match the shape detected by the actual equipment, such as a large flat edge, a small flat edge, a notch, or a circle, resulting in a slight change in the placement direction of the wafer, it will affect the accuracy of the overlay.

[0084] In addition, the rationality of process parameters is specifically judged by comparing the process parameters in the lithography task with the preset process parameter thresholds, including:

[0085] Step S401, selecting and acquiring photolithography process parameter history data according to the exposure pattern and the exposure front and back surfaces in the photolithography process parameters, wherein the photolithography process parameter history data includes the history types of photoresists and the history exposure doses corresponding to the exposure pattern and the exposure front and back surfaces.

[0086] The intelligent process automation processor of this embodiment is internally provided with a storage module to form a corresponding process parameter database. When a lithography task is received, it can be compared with the specific parameters of the existing or executed lithography tasks in the database to determine whether the process parameters of the lithography task are achievable. The index of the database historical parameters is the exposure pattern and the exposure front and back side selection. The first historical parameter with the same exposure pattern and exposure front and back side selection as the current lithography task is found from the database historical parameters, and then the rationality of other process parameters is judged based on the first historical parameter.

[0087] Step S402: If the photoresist type in the photolithography process parameters is consistent with the photoresist history type, it is determined whether the exposure dose meets the exposure dose condition.

[0088] Step S403: If the exposure dose satisfies the first exposure dose condition, a request for obtaining the substrate state parameters in the device is sent to the lithography device. The first exposure dose condition is a first exposure dose threshold obtained according to the exposure history dose and the exposure dose limit of the lithography device.

[0089] Among them, in this embodiment, for the type of photoresist recorded in the historical parameters, a specific exposure dose condition can be set according to the minimum value, average value or preset ratio of the historical exposure dose. At the same time, it is also necessary to consider the exposure dose limit of the lithography equipment itself while considering the historical parameters. In this embodiment, it can be determined whether the exposure dose meets the exposure dose limit of the lithography equipment first, and then whether the exposure dose meets the minimum value, average value or preset ratio of the historical exposure dose.

[0090] Step S404: If the photoresist type in the photolithography process parameters is inconsistent with the historical photoresist type, a prompt message is sent to the user terminal.

[0091] Step S405, after receiving the confirmation information returned by the user end, if the photoresist type does not belong to the unsuitable range of the photolithography equipment, it is determined whether the exposure dose meets the exposure dose condition.

[0092] Step S406: If the exposure dose satisfies the second exposure dose condition, a request for obtaining the substrate state parameters in the device is sent to the lithography device; wherein the second exposure dose condition is a second exposure dose threshold obtained according to the exposure dose limit of the lithography device.

[0093] In this embodiment, if the photoresist type does not appear in the photoresist history types in the database, the user is first required to confirm whether to use the photoresist type, which can be confirmed by sending a prompt message to the user end. When the user end confirms to use the photoresist type, it is necessary to further determine whether the photoresist type is in the inapplicable range of the photolithography equipment of this model. If it is in the inapplicable range of the photolithography equipment of this model, the photolithography equipment needs to send a warning message to the user and terminate the execution of the photolithography task.

[0094] Furthermore, when the type of photoresist used does not exist in the historical data, the second threshold value of the exposure dose can only be defined according to the exposure limit of the lithography equipment.

[0095] It should be noted that when the type of photoresist used does not exist in the historical data, in order to better determine the optimal exposure dose range for the photoresist type, reference documents related to the photoresist or the exposure limit of the photolithography equipment can be collected to generate an exposure dose test task, thereby determining the second threshold value of the photoresist type. Specifically:

[0096] Obtain the instructions or related documents of the photoresist, obtain the recommended exposure dose range of the photoresist from the instructions or related documents, and set multiple test exposure doses according to the recommended exposure dose range. For example, according to the instructions of photoresist A, the recommended exposure range of the photoresist is 600-900mj, and multiple test exposure doses can be set for this, 600mj, 650mj, 700mj, 750mj, 800mj, 850mj and 900mj. It should be noted that when the number of instructions and related documents of the photoresist exceeds one, the recommended exposure dose range is the union of the exposure dose ranges mentioned in all instructions or related documents. For example, the exposure dose range mentioned in the specification of photoresist A is 600-900mj, and the exposure dose range mentioned in the relevant literature of photoresist A is 500-800mj. At this time, the recommended exposure range of photoresist A is 500-900mj. Multiple test exposure doses can be set, 500mj, 550mj, 600mj, 650mj, 700mj, 750mj, 800mj, 850mj and 900mj.

[0097] In addition, multiple test exposure doses can be set directly according to the exposure limit of the lithography equipment. For example, if the exposure limit of the lithography equipment is 1000mj, test exposure doses of 50mj, 100mj, 150mj, ..., 850mj, 900mj and 1000mj are set. Multiple dose test tasks are issued according to the above multiple test exposure doses to determine the optimal exposure dose range of the photoresist, and the optimal exposure dose range is sent to the lithography equipment database and the user end.

[0098] Step S407: If the exposure dose does not meet the first exposure dose condition or the second exposure dose condition, an operation termination prompt message is sent to the user terminal.

[0099] Specifically, after receiving the operation termination prompt information, the user terminal can re-execute the photolithography task by adjusting the exposure dose, or delete the photolithography task.

[0100] Furthermore, for whether the exposure dose meets the exposure dose limit of the lithography equipment, a first exposure dose warning value and a second exposure dose warning value can be set based on the exposure dose limit to make corresponding prompts or warning operations. For example, the exposure dose limit of AZ4620 photoresist in the laser direct writing lithography equipment of model XX is The upper limit of the exposure dose is The lower limit of exposure dose is When the exposure dose is or , an alarm message is issued to remind that the exposure dose is at the edge of the exposure dose limit. The first exposure dose alarm value can be set to the first proportion of the exposure dose limit. For example, if the first proportion is set to 20%, then the first exposure dose alarm value is 20% exceeding the upper limit of the exposure dose or 20% exceeding the lower limit of the exposure dose, that is, the exposure dose is higher than or below , a prompt message is sent to the user to let the user know that the exposure dose exceeds the limit. The second exposure dose warning value can be set to a second proportion of the exposure dose limit. For example, if the second proportion is set to 50%, the second exposure dose warning value is 50% of the upper limit of the exposure dose or 50% of the lower limit of the exposure dose, that is, the exposure dose exceeds or below At this time, an alarm message is sent to the user, and the exposure operation of the lithography equipment is stopped, or a confirmation menu is popped up, and exposure can only continue after confirmation by the user or administrator.

[0101] Furthermore, considering the changes in the lithography environment or the problem of machine wear and tear, the first thresholds of exposure doses of various photoresists stored in the intelligent process automation processor are not fixed. The intelligent process automation processor collects feedback information of historical lithography tasks on the photoresist exposure dose exceeding the first threshold of exposure dose according to preset time, including the user adjusting the photoresist exposure dose to within the first threshold range of exposure dose after the photoresist exposure dose of the historical lithography tasks exceeds the first threshold of exposure dose, or the user not adjusting the photoresist exposure dose after the photoresist exposure dose of the historical lithography tasks exceeds the first threshold of exposure dose, and when the proportion of users not adjusting the photoresist exposure dose in the historical lithography tasks exceeds the third threshold, the first threshold of exposure dose of the photoresist is adjusted in combination with the photoresist exposure dose in the historical lithography tasks.

[0102] For example, when the proportion of users not adjusting the photoresist exposure dose in historical lithography tasks exceeds 50%, and statistics show that the cases in which users do not adjust the photoresist exposure dose are all cases in which the photoresist exposure dose exceeds the upper limit of the first threshold of the exposure dose, the upper limit and lower limit of the first threshold of the exposure dose of the photoresist are increased. When the proportion of users not adjusting the photoresist exposure dose in historical lithography tasks exceeds 50%, and statistics show that the cases in which users do not adjust the photoresist exposure dose are all cases in which the photoresist exposure dose exceeds the lower limit of the first threshold of the exposure dose, the upper limit and lower limit of the first threshold of the exposure dose of the photoresist are reduced. When the proportion of users not adjusting the photoresist exposure dose in historical lithography tasks exceeds 50%, and statistics show that the cases in which users do not adjust the photoresist exposure dose include cases in which the photoresist exposure dose exceeds the upper limit or lower limit of the first threshold of the exposure dose, an exposure dose test task for the photoresist is generated, and the upper limit and lower limit of the first threshold of the exposure dose are re-determined.

[0103] It should be noted that in the above process parameter rationality judgment stage, the intelligent process automation processor obtains the pattern to be exposed of the photolithography task and determines the key dimensions of the pattern to be exposed, such as length, width, minimum line width, maximum line width, minimum circle diameter and maximum circle diameter. According to the key dimensions of the pattern to be exposed, the subsequent photoresist type and exposure dose data can be adjusted.

[0104] Step S103: If the substrate parameter satisfies the substrate parameter threshold and the process parameter satisfies the process parameter threshold, a real-time status parameter acquisition instruction is sent to the lithography device.

[0105] Step S104, obtaining the real-time status parameters of the device sent by the lithography device.

[0106] Specifically, the real-time internal state parameters of the device include the real-time substrate size, the real-time number of substrates and the real-time pattern to be exposed in the device.

[0107] It should be noted that, in this embodiment, the real-time status parameters in the device also include the slot numbers of the substrates placed in the device, and the specific codes of the substrates in each slot. The substrate to be operated in the lithography device is determined based on the consistency between the specific codes of the substrates and the codes of the lithography tasks, and the lithography operation of the substrate is performed based on the slot codes and the status of whether the substrate is placed in the slots. For example, according to the code of the lithography task, substrate A is found, and substrate A is in slot 1. The lithography task operation can only be performed when the lithography device recognizes that a substrate is placed in slot 1, as shown in the attached figure. Figure 2 In the case where the green light is on in slot 1; if the lithography equipment cannot recognize that a substrate is placed in slot 1, the lithography task cannot be performed. At this time, an alarm message needs to be sent to the user end to check whether the lithography equipment slot recognition is incorrect or the substrate is not placed in the correct slot.

[0108] Step S105: If the real-time status parameters in the device match the substrate parameters to be operated in the lithography task, generate a number of lithography device operation instructions according to the lithography task, and send the lithography device operation instructions to the lithography device in a set order, so that the lithography device performs the first stage of processing on the substrate in the device according to the lithography device operation instructions.

[0109] If the real-time substrate size in the device is inconsistent with the size of the substrate in the lithography task, the real-time pattern to be exposed is inconsistent with the exposure pattern in the lithography task, or the real-time number of substrates is inconsistent with the number of substrates to be processed in the lithography task, an alarm message is sent to the user end.

[0110] After verifying that the parameters of the lithography task are reasonable, before sending the lithography equipment operation instructions, it is also necessary to check whether the real-time status parameters in the lithography equipment are consistent with the parameters of the lithography task. Only when the two are completely consistent can the lithography task be executed, otherwise a corresponding alarm message needs to be issued. For example, when the substrate size in the lithography task is 4 inches, and the real-time substrate size in the equipment is 8 inches; the number of substrates to be processed in the lithography task is 10 pieces, and the real-time number of substrates is 25 pieces; the exposure pattern in the lithography task includes four patterns ABCD, and the real-time pattern to be exposed only displays three patterns ABD; the size of the exposure pattern in the lithography task is 100mm*100mm, and the real-time pattern to be exposed is only 80mm*80mm, etc., these are all situations where the real-time status parameters in the equipment do not match the substrate parameters to be operated in the lithography task. At this time, it is necessary to send an alarm message to the user end to check the lithography equipment.

[0111] It should be noted that in the present embodiment, the user terminal may input a complete lithography task, and the intelligent process automation processor needs to split the complete lithography task, divide it into several lithography equipment operation instructions in combination with the operating system of the lithography equipment, and send them to the lithography equipment in a set order, so as to input the corresponding parameters into the operating system of the lithography equipment in the set order or click on specific operation buttons, etc.

[0112] In addition, since the lithography equipment of this embodiment is open to the public, the users include enterprise users, on-campus users, off-campus users, etc., among which the users are mostly managed in the form of project groups. However, considering that different users in the project group have different rights in equipment use or material allocation, before obtaining the lithography task sent by the user end, a verification process of user rights is also included:

[0113] Step S201, obtaining identity authentication information sent by the user terminal, and obtaining group permissions and user task permissions used by the lithography equipment according to the identity authentication information, wherein each level of group permissions used by the lithography equipment includes multiple levels of user task permissions.

[0114] Multiple levels of user task permissions within each level of group permissions for lithography equipment use, including:

[0115] Step S202, if the level of the user task authority is the first level, obtain the lithography task sent by the user terminal and the historical lithography tasks within the upper group authority, traverse and compare the lithography task sent by the user terminal with the historical lithography tasks saved in the upper group authority, if the lithography task is consistent with any historical lithography task, retain the lithography task; if the lithography task is inconsistent with any historical lithography task, return a prompt of insufficient authority to the user terminal.

[0116] Step S203, if the level of user task authority is the second level, obtain the lithography task sent by the user end, if the various parameters of the lithography task meet the maximum threshold of the lithography task within the upper group authority, retain the lithography task; if the various parameters of the lithography task do not meet the maximum threshold of the lithography task within the upper group authority, return a prompt of insufficient authority to the user end.

[0117] Step S204: if the user task authority level is the third level, obtain the lithography task sent by the user end, and if the parameters of the lithography task meet the maximum threshold of the lithography task within the upper group authority, retain the lithography task; if the parameters of the lithography task do not meet the maximum threshold of the lithography task within the upper group authority, return a permission application prompt to the user end.

[0118] Among them, the various parameters of the above-mentioned lithography tasks include but are not limited to the use time of the lithography equipment, the materials required for the lithography task, and the materials required for the lithography task include but are not limited to the material, size and exposure time of the substrate, and the type and capacity of the photoresist used.

[0119] To better understand the above settings for group permissions and user task permissions, a specific example is provided:

[0120] The photolithography equipment itself is set with group permissions according to the nature of the user. The group permissions are mostly displayed in the form of a research group or project group. The specific display form of the research group or project group can be a laboratory research group, an enterprise project group, etc. Each group permission has different limits on the use time of the photolithography equipment or the substrate material used, exposure time, etc. The lower-level management of each project group or research group includes multiple users, each of which corresponds to different user task permissions. This embodiment divides user task permissions into three categories: lithography task manager, lithography task designer, and lithography task executor, as follows:

[0121] Taking the enterprise project team as an example, the enterprise project team includes enterprise operators, enterprise technicians and enterprise managers. Each user task authority can observe the same content of the lithography equipment, but each user task authority leads to different operations performed on the lithography equipment. Among them, the user task authority of the enterprise operator is the first level, which means that the enterprise operator can only expose the existing processes in the database, cannot modify or create new processes, and can report and view problems encountered in the operation. Therefore, it is necessary to compare the lithography tasks sent by the enterprise operator with the historical lithography tasks that have been executed by the enterprise project team one by one. Only when the sent lithography tasks are consistent with the historical lithography tasks can the lithography tasks continue to be released; The user task authority of the enterprise technician is at the second level, which means that the enterprise technician has higher flexibility and room for maneuver, and can execute the lithography task within the maximum threshold range of the lithography task corresponding to the enterprise project group. For example, the operation time threshold of the lithography task of the enterprise project group is 50 hours. When the operation time of the lithography task released by the enterprise technician does not exceed 50 hours, the lithography task can be released; the user task authority of the enterprise manager is at the third level, which means that the enterprise manager has higher operation authority. For example, when the operation time of the released lithography task exceeds the operation time threshold of the enterprise project group, the manager can send a permission application to the equipment administrator to increase the operation time threshold of the enterprise project group.

[0122] Similarly, the setting of the above-mentioned user task permissions can be equivalent to the laboratory project group. For example, the laboratory project group includes tutors, senior students and junior students. Junior students can only issue lithography tasks for existing processes in the database, senior students can issue lithography tasks under the conditions that meet the maximum threshold of the lithography tasks of the laboratory project group, and tutors can send permission applications to the equipment administrator to modify the maximum threshold conditions when the parameters of the lithography tasks exceed the maximum threshold conditions of the lithography tasks of the laboratory project group.

[0123] Furthermore, since the lithography task includes a single lithography task or an overlay task, the lithography task in this embodiment is also configured to include an exposure mode, and the exposure mode includes a first exposure mode and a second exposure mode, wherein the first exposure mode is a single lithography mode and the second exposure mode is an overlay mode.

[0124] When the exposure task is the first exposure mode, the intelligent process automation processor only needs to execute the above step S105 to complete the photolithography task.

[0125] When the exposure task is the second exposure mode, considering that the patterns of multiple lithography need to be positioned and aligned during the overlay process, the lithography equipment control method further includes the following steps:

[0126] In step S301 of the lithography equipment, an image acquisition instruction is sent to the lithography equipment according to the received indication of completion of the first stage of processing.

[0127] Step S302, determining the marking coordinates of the substrate according to the image information returned by the lithography equipment, and sending the marking coordinates and lithography process parameters to the lithography equipment, so that the lithography equipment performs the second stage processing on the substrate in the equipment according to the marking coordinates and lithography process parameters.

[0128] For details, the image acquisition instruction sent to the lithography equipment can be found in the attached Figure 3 As shown in FIG. 1 , including operation instructions such as “turn on the light source”, “turn on the micromirror”, and “turn on the camera”, the substrate mark is found from the image field of view, and the marker coordinates of the substrate are obtained, as shown in FIG. Figure 4 As shown, the lithography equipment can accurately position the substrate and perform the overlay step by combining the marking coordinates and specific lithography process parameters, see the attached Figure 5 .

[0129] Before the first stage of processing, the intelligent process automation processor obtains the initial exposure position based on the key size of the pattern to be exposed in the lithography task and the coordinates of the center position of the exposure platform returned by the lithography equipment. The specific expression is:

[0130] , ,

[0131] in,( , ) is the initial exposure position coordinate, ( , ) is the exposure platform center coordinate, is the width of the pattern to be exposed, is the length of the pattern to be exposed.

[0132] Furthermore, considering that the graphics of the first processing stage and the second processing stage need to be matched with high precision during the overlay process, and the first layer of exposure graphics is deformed or shifted due to various reasons after the first processing stage, resulting in a difference between the ideal coordinates and the actual coordinates of the graphics to be exposed in the first processing stage, in order to correct the above coordinate deviation, the deviation correction is performed by confirming the marked coordinates of the substrate, which is specifically manifested as the above step S302 including the following steps:

[0133] Step S501, combining the image information returned by the lithography equipment, and determining at least one target pattern on the substrate through image recognition, wherein the target pattern is generally set to a special shape, such as a circle, a triangle, a diamond, etc.

[0134] Step S502, if the target pattern is not located at the center point of the cursor in the field of view, an image movement instruction and an image acquisition instruction are sent to the lithography device until the target pattern in the image information returned by the lithography device is located at the center point of the cursor in the field of view.

[0135] Step S503, when the target pattern is located at the center point of the cursor in the field of view, a target pattern coordinate acquisition instruction is sent to the lithography equipment to obtain the actual coordinates of the target pattern.

[0136] It should be noted that the field of view cursor of the lithography device is similar to the function of a mouse. For any point within the field of view of the lithography device, it needs to be placed at the center point of the field of view cursor to obtain specific coordinate information.

[0137] Step S504 , comparing the actual coordinates of the target pattern with the designed coordinates to obtain the displacement information of the first-stage lithography image.

[0138] It should be noted that the design coordinates of the target pattern are recorded in the photolithography task, which are the ideal coordinates of the target pattern when no deformation or displacement occurs in the first stage of processing.

[0139] Step S505, generating a second-stage processing instruction according to the displacement information of the first-stage lithography image and the lithography process parameters, and sending the second-stage processing instruction to the lithography equipment to implement the second-stage processing of the substrate in the equipment.

[0140] Specifically, the overlay pattern processed in the second stage is processed accordingly in combination with the displacement information of the first-stage lithography image and the lithography process parameters. For example, when the first-stage lithography image is displaced, the corresponding displacement information needs to be added when generating the second-stage processing instructions so that the lithography image processed in the second stage can be accurately nested with the lithography image processed in the first stage.

[0141] Regarding the determination of at least one target pattern on the substrate by image recognition in the above step S501, it should be noted that due to various reasons, there is a situation where the image information returned by the lithography equipment does not contain the target pattern. The corresponding solution steps are as follows:

[0142] Step S601: If the target pattern does not exist in the image information returned by the lithography device, a field of view movement instruction is generated and sent to the lithography device until the target pattern appears in the image information returned by the lithography device.

[0143] The field of view movement instruction includes but is not limited to moving the field of view horizontally or vertically within a range of 1mm*1mm based on the image center coordinates returned by the current lithography device.

[0144] Step S602: If the number of times the visual field is moved exceeds the adjustment number threshold, a sample thickness check instruction is sent to the user terminal to determine whether the actual sample thickness does not meet the set sample thickness of the first processing stage.

[0145] Step S603: If the user terminal feedback indicates that the actual sample thickness meets the set sample thickness in the first processing stage, a target pattern recognition algorithm traversal instruction is sent to determine whether the executed target pattern recognition algorithm is inconsistent with the target pattern.

[0146] Step S604, if the executed target pattern recognition algorithm is consistent with the target pattern, obtain the RGB value of the image returned by the lithography device. If the RGB value of the image includes a value other than 0 or 255, return to step S301 to re-acquire the image information.

[0147] Step S605: If the RGB value of the image only includes 0 or 255, a lithography equipment parameter reading instruction is sent to determine whether the first layer drawing is selected when the lithography equipment acquires image information.

[0148] In addition, since the lithography equipment of this embodiment is located in a semiconductor laboratory, the semiconductor laboratory also has a label positioning system, a sample handling system, a glue coating device and a developing device. The various devices or systems in the laboratory can realize information interaction through an intelligent process automation processor, specifically:

[0149] In combination with the label positioning system, the photolithography equipment control method further includes:

[0150] Acquire lithography equipment operator information sent by a tag positioning system, wherein the tag positioning system is a UWB tag positioning system;

[0151] If the operator information of the lithography equipment is inconsistent with the identity information of the user who issued the lithography task, a task stop instruction is sent to the lithography equipment, and an alarm message is sent to the equipment management terminal.

[0152] By combining with the tag positioning system, it can ensure that the actual operator of the lithography equipment is the same as the user who issues the lithography task, thereby avoiding identity theft on the user side.

[0153] In combination with the sample handling system, the photolithography equipment control method further includes:

[0154] Obtaining sample handling information and handling equipment movement information sent by the sample handling system;

[0155] If the transported sample information is inconsistent with the substrate specific code of the lithography task, a task stop instruction is sent to the lithography device, and an alarm message is sent to the device management terminal;

[0156] If the transport equipment movement information includes rapid deceleration information of the transport equipment, rapid acceleration information of the transport equipment, or severe vibration information of the transport equipment, a sample integrity check instruction is generated and sent to the lithography equipment.

[0157] The specific parameter thresholds of the rapid deceleration information, rapid acceleration information and severe vibration information of the transport equipment are set according to the substrate edge integrity requirements of the experimenter or equipment manager. The sample integrity check instruction includes a sample edge integrity check and a sample overall integrity check.

[0158] In combination with the glue coating device, the photolithography device control method further includes:

[0159] Obtain glue coating parameters such as glue dripping amount and rotation speed of the glue coating equipment when the substrate is processed by the glue coating equipment;

[0160] If the coating parameters are lower than the set coating parameters, including but not limited to the glue drop amount being less than the set glue drop amount and the rotation speed being higher than the set rotation speed, reducing the photoresist exposure dose;

[0161] If the coating parameters are higher than the set coating parameters, including but not limited to the glue drop amount being greater than the set glue drop amount and the rotation speed being lower than the set rotation speed, the photoresist exposure dose is increased.

[0162] In combination with the developing device, the photolithography device control method further includes:

[0163] Obtaining the actual minimum line width of the substrate after the lithography task is executed;

[0164] The developing time or baking temperature of the developing task is adjusted according to the actual minimum line width and the designed minimum line width of the substrate.

[0165] Furthermore, after the lithography task is completed, the intelligent process automation processor obtains actual sample image information and compares the actual sample image information with the lithography image of the lithography task. If the difference between the actual sample image information and the lithography image of the lithography task exceeds the acceptable threshold, an alarm message indicating that the yield of the processed sample is too low is sent to the user end, reminding the user to perform a yield analysis on the lithography task or re-enter the lithography image of the lithography task.

[0166] It should be understood that although the Figure 1 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Figure 1At least part of the steps may include multiple sub-steps or sub-stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least part of the sub-steps or stages of other steps.

[0167] The above embodiments of the present invention describe in detail the method for controlling the operation of a lithography device. The above method disclosed in the present invention can be implemented using various devices. Therefore, the present invention also discloses a device for controlling the operation of a lithography device. Figure 6 , specific embodiments are given below to explain in detail.

[0168] The task acquisition module 701 is used to acquire the lithography task sent by the user end, wherein the lithography task includes substrate parameters and process parameters to be operated;

[0169] A rationality judgment module 702 is used to compare the substrate parameters in the photolithography task with the preset substrate parameter thresholds, and to compare the process parameters in the photolithography task with the preset process parameter thresholds;

[0170] The status instruction request module 703 is used to send a real-time status parameter acquisition instruction in the device to the lithography device if the substrate parameter meets the substrate parameter threshold and the process parameter meets the process parameter threshold;

[0171] The device status acquisition module 704 is used to acquire the real-time status parameters of the device sent by the lithography device;

[0172] The substrate processing module 705 is used to generate a plurality of lithography equipment operation instructions according to the lithography task if the real-time status parameters in the equipment match the substrate parameters to be operated in the lithography task, and send the lithography equipment operation instructions to the lithography equipment in a set order, so that the lithography equipment performs the first stage of processing on the substrate in the equipment according to the lithography equipment operation instructions.

[0173] For the lithography equipment operation control device, all the above-mentioned methods can be referred to, and no further details will be given here. Each module in the above-mentioned device can be implemented in whole or in part by software, hardware, and a combination thereof. Each of the above-mentioned modules can be embedded in or independent of the processor of the terminal device in the form of hardware, or can be stored in the memory of the terminal device in the form of software, so that the processor can call and execute the operations corresponding to each of the above modules.

[0174] In one embodiment, the present invention further provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program implements the steps of the above-mentioned lithography equipment operation control method when executed by a processor.

[0175] The computer-readable storage medium may be an electronic memory such as a flash memory, an EEPROM (electrically erasable programmable read-only memory), an EPROM (erasable programmable read-only memory), a hard disk or a ROM. Optionally, the computer-readable storage medium includes a non-transitory computer-readable storage medium. The computer-readable storage medium has a storage space for program codes for executing any method step of the above method. These program codes may be read from or written into one or more computer program products, and the program codes may be compressed in an appropriate form.

[0176] In one embodiment, the present invention provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the above-mentioned lithography device operation control method when executing the computer program.

[0177] The computer device includes a memory, a processor, and one or more computer programs, wherein the one or more computer programs can be stored in the memory and configured to be executed by one or more processors, and the one or more application programs are configured to execute the above-mentioned lithography device operation control method.

[0178] The processor may include one or more processing cores. The processor uses various interfaces and lines to connect the various parts of the entire computer device, and executes various functions of the computer device and processes data by running or executing instructions, programs, code sets or instruction sets stored in the memory, and calling data stored in the memory. Optionally, the processor can be implemented in at least one hardware form of digital signal processing (Digital Signal Processing, DSP), field programmable gate array (Field-Programmable Gate Array, FPGA), and programmable logic array (Programmable Logic Array, PLA). The processor can integrate one or more combinations of a central processing unit (Central Processing Unit, CPU), a reporting verifier (Graphics Processing Unit, GPU) for buried data, and a modem. Among them, the CPU mainly processes the operating system, user interface, and application programs; the GPU is responsible for rendering and drawing display content; and the modem is used to process wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor, but may be implemented separately through a communication chip.

[0179] The memory may include a random access memory (RAM) or a read-only memory (ROM). The memory may be used to store instructions, programs, codes, code sets or instruction sets. The memory may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for implementing at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the above-mentioned various method embodiments, etc. The data storage area may also store data created by the terminal device during use, etc.

[0180] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for controlling operation of a lithography device, characterized in that: include: Acquire a lithography task sent by a user terminal, wherein the lithography task includes substrate parameters and process parameters to be operated; Comparing the substrate parameters in the photolithography task with the preset substrate parameter thresholds, and comparing the process parameters in the photolithography task with the preset process parameter thresholds; If the substrate parameter satisfies the substrate parameter threshold and the process parameter satisfies the process parameter threshold, sending a real-time status parameter acquisition instruction in the device to the lithography device; Obtaining real-time status parameters of the device sent by the lithography device; If the real-time status parameters in the device match the substrate parameters that need to be operated in the lithography task, a number of lithography device operation instructions are generated according to the lithography task, and the lithography device operation instructions are sent to the lithography device in a set order, so that the lithography device performs the first stage of processing on the substrate in the device according to the lithography device operation instructions.

2. The method for controlling operation of a lithography device according to claim 1, wherein: Before obtaining the lithography task sent by the user, it also includes: Obtain the identity authentication information sent by the user, and obtain the group authority and user task authority for the lithography equipment of the user according to the identity authentication information; Multiple levels of user task permissions within each level of group permissions for lithography equipment use, including: When the lithography equipment use permission of the user terminal is the first permission, obtaining the lithography task sent by the user terminal and the historical lithography tasks within the upper group permission; The lithography task sent by the user terminal is compared with the historical lithography tasks stored in the upper group authority, and if the lithography task is consistent with any historical lithography task, the lithography task is retained; If the lithography task is inconsistent with any historical lithography task, a prompt indicating insufficient authority is returned to the user end; When the lithography equipment use permission of the user terminal is the second permission, obtaining the lithography task sent by the user terminal, and if various parameters of the lithography task meet the maximum threshold of the lithography task within the upper group permission, retaining the lithography task; If the parameters of the lithography task do not meet the maximum threshold of the lithography task within the upper group authority, a prompt indicating insufficient authority is returned to the user end; When the user task authority level is the third level, the lithography task sent by the user terminal is obtained, and if the parameters of the lithography task meet the maximum threshold of the lithography task within the upper group authority, the lithography task is retained; If the parameters of the lithography task do not meet the maximum threshold of the lithography task within the upper group authority, a prompt for permission application is returned to the user end.

3. The method for controlling operation of a lithography device according to claim 2, wherein: The photolithography task also includes an exposure mode, and the exposure mode includes a first exposure mode and a second exposure mode; When the exposure mode is the second exposure mode, the photolithography equipment control method further includes: After receiving the first stage processing completion indication, sending an image acquisition instruction to the lithography equipment; The marking coordinates of the substrate are determined according to the image information returned by the lithography equipment, and the marking coordinates and lithography process parameters are sent to the lithography equipment, so that the lithography equipment performs the second stage processing on the substrate in the equipment according to the marking coordinates and lithography process parameters.

4. The method for controlling operation of a lithography device according to claim 3, wherein: The step of determining the marking coordinates of the substrate according to the image information returned by the lithography device, and sending the marking coordinates and lithography process parameters to the lithography device, so that the lithography device performs the second stage processing on the substrate in the device according to the marking coordinates and lithography process parameters, is specifically as follows: Determining at least one target pattern on the substrate by image recognition in combination with image information returned by the lithography device; If the target pattern is not located at the center point of the cursor in the field of view, an image movement instruction and an image acquisition instruction are sent to the lithography device until the target pattern in the image information returned by the lithography device is located at the center point of the cursor in the field of view; When the target pattern is located at the center point of the cursor in the field of view, a target pattern coordinate acquisition instruction is sent to the lithography device to obtain the actual coordinates of the target pattern; Compare the actual coordinates of the target pattern with the designed coordinates to obtain the displacement information of the first-stage lithography image; A second-stage processing instruction is generated according to the displacement information of the first-stage lithography image and the lithography process parameters, and the second-stage processing instruction is sent to the lithography equipment to realize the second-stage processing of the substrate in the equipment.

5. The method for controlling operation of a lithography device according to claim 4, wherein: The substrate parameters include the quantity, size, material, thickness and shape of the substrate to be processed; The process parameters include exposure pattern, exposure front and back side selection, photoresist type and exposure dose.

6. The method for controlling operation of a lithography device according to claim 4, wherein: The process parameters in the lithography task are compared with the preset process parameter thresholds, specifically: Select and obtain historical data of photolithography process parameters according to the exposure pattern and the front and back exposure in the photolithography process parameters, wherein the historical data of photolithography process parameters includes the historical types of photoresists and the historical exposure doses corresponding to the exposure pattern and the front and back exposure; If the photoresist type in the photolithography process parameters is consistent with the photoresist history type, determining whether the exposure dose meets the exposure dose condition; If the exposure dose satisfies the first exposure dose condition, a request for obtaining the substrate state parameters in the device is sent to the lithography device, and the first exposure dose condition is a first exposure dose threshold obtained according to the exposure history dose and the exposure dose limit of the lithography device.

7. The method for controlling operation of a lithography device according to claim 6, wherein: The process parameter in the lithography task is compared with a preset process parameter threshold, and further includes: If the photoresist type in the photolithography process parameters is inconsistent with the historical photoresist type, a prompt message is sent to the user terminal; After receiving the confirmation information returned by the user end, if the photoresist type does not belong to the unsuitable range of the photolithography equipment, determining whether the exposure dose meets the exposure dose condition; If the exposure dose satisfies the second exposure dose condition, sending a request for obtaining a substrate state parameter in the device to the lithography device; The second exposure dose condition is a second exposure dose threshold obtained according to an exposure dose limit of the lithography equipment.

8. The method for controlling operation of a lithography device according to claim 7, wherein: The process parameter in the lithography task is compared with a preset process parameter threshold, and further includes: If the exposure dose does not meet the first exposure dose condition or the second exposure dose condition, an operation termination prompt message is sent to the user terminal.

9. The method for controlling operation of a lithography device according to claim 8, wherein: Also includes: If the exposure dose exceeds a first ratio of the first exposure dose condition or the second exposure dose condition, sending lithography exposure dose prompt information to the user terminal; If the exposure dose exceeds the second ratio of the first exposure dose condition or the second exposure dose condition, sending a lithography exposure dose warning message to the user terminal, and sending a task termination instruction to the lithography equipment; The first ratio is smaller than the second ratio.

10. The method for controlling operation of a lithography device according to claim 9, wherein: Compare the substrate parameters in the lithography task with the preset substrate parameter threshold, specifically: If the size of the substrate exceeds the size limit range of the lithography equipment or the thickness of the substrate exceeds the thickness limit range of the lithography equipment, an operation termination prompt message is sent to the user terminal.

11. The method for controlling operation of a lithography device according to claim 10, wherein: The real-time status parameters in the device include the real-time substrate size, the real-time number of substrates and the real-time pattern to be exposed in the device; If the real-time substrate size in the device is inconsistent with the size of the substrate in the lithography task, the real-time pattern to be exposed is inconsistent with the exposure pattern in the lithography task, or the real-time number of substrates is inconsistent with the number of substrates to be processed in the lithography task, an operation termination prompt message is sent to the user end.

12. The method for controlling operation of a lithography device according to claim 11, wherein: Also includes: After the photolithography task is completed, the actual sample image information is obtained; If the difference between the actual sample image information and the lithography image of the lithography task exceeds an acceptable threshold, an alarm message indicating that the yield of the processed sample is too low is sent to the user end.

13. A photolithography equipment operation control device, characterized in that: include: A task acquisition module is used to acquire a lithography task sent by a user terminal, wherein the lithography task includes substrate parameters and process parameters to be operated; A rationality judgment module, used for comparing the substrate parameters in the photolithography task with the preset substrate parameter threshold, and comparing the process parameters in the photolithography task with the preset process parameter threshold; A status instruction request module, configured to send a real-time status parameter acquisition instruction in the device to the lithography device if the substrate parameter satisfies the substrate parameter threshold and the process parameter satisfies the process parameter threshold; The device status acquisition module is used to obtain the real-time status parameters of the device sent by the lithography device; The substrate processing module is used to generate a plurality of lithography equipment operation instructions according to the lithography task if the real-time status parameters in the equipment match the substrate parameters to be operated in the lithography task, and send the lithography equipment operation instructions to the lithography equipment in a set order, so that the lithography equipment performs the first stage of processing on the substrate in the equipment according to the lithography equipment operation instructions.

14. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method for controlling operation of a lithographic apparatus according to any one of claims 1 to 12 are implemented.

15. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, it performs the lithography equipment operation control method according to any one of claims 1 to 12.

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