Liquid metal liquid-cooled server and application method thereof

Abstract

The present invention discloses a liquid metal liquid-cooled server and an application method thereof. The server of the present invention comprises a chassis and a liquid cooling heat dissipation component, wherein a processor and a memory are arranged in the chassis; the liquid cooling heat dissipation component comprises a processor cooling element, a memory cooling element, a liquid metal circulation pipeline, a cooling water circulation pipe, a dual-fluid heat exchanger and a heat dissipation controller; the processor cooling element and the memory cooling element are connected through a liquid metal circulation pipeline to utilize liquid metal for circulation cooling; the liquid metal circulation pipeline and the cooling water circulation pipeline are both connected to the dual-fluid heat exchanger, and the cooling water in the cooling water circulation pipeline cools the liquid metal in the liquid metal circulation pipeline through the dual-fluid heat exchanger, and the circulation power of the liquid metal in the liquid metal circulation pipeline comes from an electromagnetic pump. The present invention aims to improve the heat dissipation performance of the server, especially to improve the heat dissipation performance of the high-density, long-time and high-load running server, so as to improve the stability and reliability of the server operation.

Description

Technical Field

[0001] The present invention relates to the field of servers, and in particular to a liquid metal liquid-cooled server and an application method thereof. Background Art

[0002] With the development of cloud computing industry, more and more data centers are being built. As the core equipment of data centers, servers have become important indicators for measuring the quality of servers due to their high performance, high availability and high cost performance. With the development of data centers, server performance is getting higher and higher, which leads to a significant increase in server power consumption. Due to the limited size of the server, many high-power electronic components are installed in it for a long time and high load operation. Whether the heat generated by the electronic components can be transferred to the outside in time is directly related to the stability of server operation. Therefore, the heat dissipation problem of the server has become a major obstacle to the development of the server.

[0003] Existing liquid-cooled servers mostly use water-cooled heat dissipation. When the temperature of the heat source in the server is too high, water is used as the heat dissipation fluid. The boiling point of water is low and the thermal conductivity is poor, resulting in the entire heat dissipation system having an insignificant heat dissipation effect. Liquid metal has an extremely high thermal conductivity and an extremely high boiling point, and can efficiently dissipate the heat generated by electronic devices. It is a very promising heat dissipation solution. If applied to servers, it can effectively improve the heat dissipation ability of the server and enhance the server performance. The Chinese patent application with publication number CN114258234A discloses a heat dissipation solution based on liquid metal, which implements a basic liquid metal heat dissipation solution. However, the solution has certain defects. First, the coolant is in direct contact with the liquid metal, which is unstable in long-term operation and poses a safety risk. In the heat exchange process between the coolant and the liquid metal, the two are separated by the density difference. Although they are in direct contact, the heat exchange area is difficult to expand and the heat exchange capacity is limited. In addition, there is no control strategy designed in the solution, and the power consumption of the server is often dynamically changing during operation. The lack of a control strategy will lead to low heat dissipation efficiency. Summary of the invention

[0004] Technical problem to be solved by the present invention: In view of the above-mentioned problems in the prior art, a liquid metal liquid-cooled server and an application method thereof are provided. The present invention aims to improve the heat dissipation performance of the server, especially the heat dissipation performance of the server running at high density, for a long time and with high load, so as to improve the stability and reliability of the server operation.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0006] A liquid metal liquid-cooled server comprises a chassis and a liquid cooling heat dissipation component, wherein a processor and a memory are arranged in the chassis; the liquid cooling heat dissipation component comprises a processor cooling element, a memory cooling element, a liquid metal circulation pipeline, a cooling water circulation pipeline, a dual-fluid heat exchanger and a heat dissipation controller; the processor cooling element and the memory cooling element are connected through a liquid metal circulation pipeline to utilize liquid metal for circulation cooling; the dual-fluid heat exchanger comprises a liquid metal cavity and a cooling water cavity which are isolated from each other and conduct heat through a heat-conducting inner wall, the cooling water cavity comprises a cylindrical inner cooling water flow channel and an outer cooling water flow channel which is sleeved on the outside of the inner cooling water flow channel and is concentrically arranged in a tubular structure, and the liquid metal cavity is arranged between the outer cooling water flow channel and the cooling water cavity. The interior of the heat-conducting inner wall between the inner cooling water flow channels is used to achieve all-round heat dissipation of the liquid metal cavity. The liquid metal circulation pipeline is connected to the liquid metal cavity of the dual-fluid heat exchanger, and the cooling water circulation pipeline is connected to the cooling water cavity of the dual-fluid heat exchanger. The cooling water in the cooling water circulation pipeline cools the liquid metal in the liquid metal circulation pipeline through the dual-fluid heat exchanger. The circulation power of the liquid metal in the liquid metal circulation pipeline comes from the electromagnetic pump, which is connected to one end of the dual-fluid heat exchanger. A liquid metal inlet valve and an electromagnetic pump are provided on the liquid metal circulation pipeline. The inverter control ends of the liquid metal inlet valve and the electromagnetic pump are respectively connected to the heat dissipation controller, and the heat dissipation controller is connected to the processor through a bus interface.

[0007] Optionally, the processor cooling element and the memory cooling element are connected in series via a liquid metal circulation pipeline, and the liquid metal in the liquid metal circulation pipeline flows through the processor cooling element and the memory cooling element in turn through a liquid metal inlet valve and then flows into a dual-fluid heat exchanger.

[0008] Optionally, the dual-fluid heat exchanger includes a shell and a cylindrical heat exchange element, the shell is provided with a cooling water inlet and a cooling water outlet; the cylindrical heat exchange element includes a cylindrical barrel, the inner and outer sides of the cylindrical barrel are provided with fins, a liquid metal flow channel is provided in the cylindrical heat exchange element, the cylindrical heat exchange element is arranged in the shell, and cooling water flow channels are formed between the outer side of the cylindrical barrel and the shell and inside the cylindrical barrel; wherein, liquid metal inlet and liquid metal outlet are respectively provided at both ends of the cylindrical heat exchange element, and the liquid metal inlet and liquid metal outlet are both communicated with the liquid metal flow channel; the cooling water inlet and cooling water outlet are both communicated with the cooling water flow channel; the liquid metal flow channel and the cooling water flow channel are isolated from each other.

[0009] Optionally, the cylindrical heat exchanger also includes an inlet cover plate and an outlet cover plate, the inlet cover plate is fixedly connected to the first end of the cylindrical body; the inlet cover plate is provided with a liquid metal inlet, a liquid metal hole and a cooling water hole, the liquid metal inlet is connected to the liquid metal flow channel through the liquid metal hole; the cooling water inlet is connected to the cooling water flow channel through the cooling water hole; the outlet cover plate is fixedly connected to the second end of the cylindrical body; the outlet cover plate is provided with a liquid metal outlet and a liquid metal hole, the liquid metal outlet is connected to the liquid metal flow channel through the liquid metal hole.

[0010] Optionally, the fins on the inner and outer sides of the cylindrical body extend in the radial direction, and a plurality of liquid metal flow channels are evenly arranged in the cylindrical body along the circumferential direction, and each liquid metal flow channel extends in the axial direction.

[0011] Optionally, the inlet cover plate is disc-shaped, and the liquid metal inlet is arranged at the center of one side of the inlet cover plate and extends axially outward; a plurality of liquid metal holes are evenly arranged around the circumference of the inlet cover plate, and each liquid metal hole is connected to each liquid metal flow channel; a plurality of cooling water holes are evenly arranged around the circumference of the inlet cover plate, and each cooling water hole is arranged as a long hole extending along the radial direction, which is respectively connected to the cooling water flow channel between the outer side of the cylindrical body and the shell and the cooling water flow channel inside the cylindrical body, and each cooling water hole is staggered and arranged circumferentially with each liquid metal hole.

[0012] Optionally, the outlet cover plate is disc-shaped, and the liquid metal outlet is arranged at the center of one side of the outlet cover plate and extends axially outward; a plurality of liquid metal holes are evenly arranged around the circumference of the outlet cover plate, and each liquid metal hole is connected to each liquid metal flow channel.

[0013] Optionally, the inlet cover plate is connected to a first end of the shell where a cooling water inlet is arranged, and the cooling water inlet is communicated with each cooling water hole.

[0014] Optionally, the electromagnetic pump is driven by external power supply or by direct power supply from a server circuit board. The liquid metal liquid-cooled server includes a plurality of processor cooling elements, and the plurality of processor cooling elements are connected to a liquid metal circulation pipeline through cascade-connected diverters to utilize liquid metal for circulation cooling. Each diverter includes two outputs, one of which is allocated to a corresponding processor cooling element and the other is allocated to subsequent processor cooling elements of each stage. The diverter is an adjustable diverter, and a control end of the adjustable diverter is connected to a heat dissipation controller.

[0015] In addition, the present invention also provides an application method of the aforementioned liquid metal liquid-cooled server, comprising: adjusting the driving current I of the electromagnetic pump and the valve opening of the liquid metal inlet valve according to the size of the power consumption P of the server, and the size of the driving current I and the valve opening of the liquid metal inlet valve are both positively correlated with the value of the power consumption P of the server; at the same time, respectively obtaining the utilization rate of each processor, and dynamically adjusting the diversion ratio of each level of diverters to 1a / ((ni)b) so that the liquid metal flow rate sent to each processor cooling part is adaptive to the utilization rate of the processor, wherein a is the utilization rate of the processor corresponding to the diverter of this level, and b is the utilization rate of the processor corresponding to the diverter of subsequent levels of diverters of this level. The average value of n is the total number of diverter stages, and i is the number of diverters of this stage; respectively obtain the measured temperature of each processor, query the usage rate of each processor with a preset usage rate-reference temperature mapping table to obtain the reference temperature of the processor, calculate the temperature difference between the measured temperature and the reference temperature, obtain the liquid metal pressure difference between the liquid metal inlet valve and the liquid metal outlet valve, use the temperature difference between the measured temperature and the reference temperature to obtain a first control quantity by using a PID controller, obtain the liquid metal pressure difference between the liquid metal inlet valve and the liquid metal outlet valve by using a PID controller to obtain a second control quantity, and sum the first control quantity and the second control quantity as the total control quantity to dynamically control the speed of the electromagnetic pump.

[0016] Compared with the prior art, the present invention mainly has the following advantages: the liquid metal liquid-cooled server of the present invention adopts a liquid cooling heat dissipation component, the liquid cooling heat dissipation component uses a liquid metal circulation pipeline to connect the processor cooling element and the memory cooling element, and uses liquid metal to circulate and cool the processor and the memory; the cooling water in the cooling water circulation pipeline cools the liquid metal in the metal circulation pipeline through a dual-fluid heat exchanger. Liquid metal has a thermal conductivity much higher than that of water, air and many non-metallic media, so the liquid metal radiator can achieve more efficient heat transport and extreme heat dissipation capacity compared with traditional water cooling, and combines the advantages of water as a heat dissipation fluid and liquid metal as a heat dissipation fluid to cool the liquid metal, thereby improving the heat dissipation performance of the server, especially improving the heat dissipation performance of high-density, long-term, and high-load running servers, so as to improve the stability and reliability of the server operation. Furthermore, the design of the cylindrical heat exchanger in the fluid heat exchanger in the liquid metal liquid-cooled server of the present invention greatly reduces the volume of the device under the same contact area compared with the existing rectangular heat exchanger, improves the heat dissipation efficiency, and makes the device structure more compact. Furthermore, fins are provided on the inner and outer sides of the cylindrical barrel in the cylindrical heat exchange element. By providing fins on both the inner and outer sides, the heat exchange area can be further increased and the heat exchange efficiency can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings illustrate exemplary implementations of embodiments of the present invention and, together with the description, are used to explain the principles of embodiments of the present invention. These drawings are included to provide a further understanding of the embodiments of the present invention and are included in and constitute a part of this specification.

[0018] Figure 1 Schematic diagram of the structure of the liquid cooling heat dissipation component in an embodiment of the present invention.

[0019] Figure 2 Schematic diagram of the connection between the dual-fluid heat exchanger and the electromagnetic pump in an embodiment of the present invention.

[0020] Figure 3 Schematic diagram of the exploded structure of the dual-fluid heat exchanger in an embodiment of the present invention.

[0021] Figure 4 Schematic diagram of the axial cross-sectional structure of a dual-fluid heat exchanger in an embodiment of the present invention.

[0022] Figure 5 Schematic diagram of the structure of a cylindrical barrel in a dual-fluid heat exchanger in an embodiment of the present invention.

[0023] Figure 6 Schematic diagram of the structure of the inlet cover plate in the dual-fluid heat exchanger in an embodiment of the present invention.

[0024] The accompanying drawings are marked as follows: 10. Dual-fluid heat exchanger; 1. Shell; 11. Cooling water inlet; 12. Cooling water outlet; 13. External cooling water flow channel; 14. Internal cooling water flow channel; 2. Cylindrical barrel; 21. Fins; 22. Liquid metal flow channel; 3. Inlet cover; 31. Liquid metal inlet; 32. Liquid metal hole; 33. Cooling water hole; 4. Outlet cover; 41. Liquid metal outlet; 5. Bolt; 6. Electromagnetic pump; 20. Processor cooling element; 30. Memory cooling element; 40. Liquid metal circulation pipeline; 50. Liquid metal inlet valve; 60. Liquid metal outlet valve. DETAILED DESCRIPTION

[0025] The embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings and implementation methods. It is to be understood that the specific implementation methods described herein are only used to explain the relevant content, rather than to limit the embodiments of the present invention. It should also be noted that, for ease of description, only the parts related to the embodiments of the present invention are shown in the accompanying drawings. It should be noted that, in the absence of conflict, the implementation methods and features in the embodiments of the present invention can be combined with each other. The embodiments of the present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the implementation methods. It should be noted that the step numbers in the text are only for the convenience of explanation of the specific embodiments and do not serve to limit the order in which the steps are executed.

[0026] Existing liquid-cooled servers mostly use water-cooling for heat dissipation. When the temperature of the heat source in the server is too high, water is used as the heat dissipation fluid. The boiling point of water is low and the thermal conductivity is poor, resulting in the technical problem that the heat dissipation effect of the entire heat dissipation system is not obvious. The embodiment of the present invention provides a liquid metal liquid-cooled server to solve the above-mentioned technical problems existing in the prior art. The liquid metal liquid-cooled server of this embodiment includes a chassis and a liquid-cooled heat dissipation component. A processor and a memory are arranged in the chassis. In addition, various other functional chips are usually arranged in the chassis of the server. During the operation of the server, the processor (such as CPU) and memory (such as DDR, ROM, RAM, etc.) will emit very high heat, and other functional chips are also the main heat generating bodies. The function of the liquid-cooled heat dissipation component is mainly to dissipate the heat source in the server. This application mainly describes the heat dissipation method of the processor and memory. Those skilled in the art can understand how the heat dissipation method can be extended to other functional chips.

[0027] like Figure 1 and Figure 2As shown, the liquid cooling heat dissipation assembly in this embodiment includes a processor cooling element 20, a memory cooling element 30, a liquid metal circulation pipeline 40, a cooling water circulation pipeline (omitted in the figure), a dual-fluid heat exchanger 10 and a heat dissipation controller (omitted in the figure); the processor cooling element 20 and the memory cooling element 30 are connected through the liquid metal circulation pipeline 40, and the liquid metal is used for circulation cooling. For example, the processor cooling element 20 and the memory cooling element 30 are both provided with a liquid metal inlet, a cavity and a liquid metal outlet. The liquid metal enters the cavity from the liquid metal inlet to perform heat exchange with the corresponding processor and memory bar, and flows out from the outlet after absorbing heat. The liquid metal circulation pipeline 40 and the cooling water circulation pipeline are both connected to the dual-fluid heat exchanger 10. The dual-fluid heat exchanger 10 includes a liquid metal cavity and a cooling water cavity that are isolated from each other and conduct heat through a heat-conducting inner wall. The cooling water cavity includes a cylindrical inner cooling water channel 14 and an outer cooling water channel 13 that is sleeved on the outside of the inner cooling water channel 14 and has a tubular structure and is concentrically arranged. The liquid metal cavity is arranged inside the heat-conducting inner wall between the outer cooling water channel 13 and the inner cooling water channel 14 to achieve all-round heat dissipation of the liquid metal cavity. The liquid metal circulation pipeline is connected to the liquid metal cavity of the dual-fluid heat exchanger 10, and the cooling water circulation pipeline is connected to the cooling water cavity of the dual-fluid heat exchanger 10. The cooling water in the cooling water circulation pipeline cools the liquid metal in the liquid metal circulation pipeline 40 through the dual-fluid heat exchanger 10. The liquid metal circulation pipeline 40 is provided with a liquid metal inlet valve 50 and an electromagnetic pump 6. The inverter control ends of the liquid metal inlet valve 50 and the electromagnetic pump 6 are respectively connected to the heat dissipation controller, and the heat dissipation controller is connected to the processor through the bus interface. The liquid metal that has absorbed the heat flows into the dual-fluid heat exchanger 10, and after heat exchange with the cooling water, the cooled liquid metal circulates into the processor cooling element 20 and the memory cooling element 30 for cooling. See Figure 2 The circulation power of the liquid metal in the liquid metal circulation pipeline 40 comes from the electromagnetic pump 6, and the electromagnetic pump 6 is connected to one end of the dual fluid heat exchanger 10. The electromagnetic pump 6 is directly connected to the dual fluid heat exchanger 10, making the structure more compact. In this embodiment, the liquid metal liquid-cooled server adopts a liquid cooling heat dissipation component. The liquid cooling heat dissipation component uses the liquid metal circulation pipeline 40 to connect the processor cooling element 20 and the memory cooling element 30, and uses liquid metal to circulate and cool the processor and memory; the cooling water in the cooling water circulation pipeline cools the liquid metal in the metal circulation pipeline through the dual fluid heat exchanger 10. Liquid metal has a thermal conductivity much higher than that of water, air and many non-metallic media, so the liquid metal radiator can achieve more efficient heat transfer and extreme heat dissipation capacity compared to traditional water cooling. And combined with the use of water as a heat dissipation fluid to cool the liquid metal, it combines the advantages of water as a heat dissipation fluid and liquid metal as a heat dissipation fluid.

[0028] In one embodiment of the present invention, the processor cooling element 20 and the memory cooling element 30 are connected in series via a liquid metal circulation pipeline 40; the liquid metal in the liquid metal circulation pipeline 40 flows through the processor cooling element 20 and the memory cooling element 30 in sequence through the liquid metal inlet valve 50 and then flows into the dual-fluid heat exchanger 10. Figure 1 The embodiment of the series connection is adopted, and the liquid metal flows through the two CPUs in sequence through the liquid metal inlet valve 50, then flows through the memory stick, and then is collected at the liquid metal outlet valve 60 and flows into the dual-fluid heat exchanger 10 for cooling. The series connection is only one embodiment, and a combination of parallel or series connection can also be adopted, which will not be listed one by one.

[0029] In one embodiment of the present invention, see Figure 3 and Figure 4 As shown, the dual-fluid heat exchanger 10 includes a shell 1 and a cylindrical heat exchanger. The shell 1 is provided with a cooling water inlet 11 and a cooling water outlet 12, and the cooling water inlet 11 and the cooling water outlet 12 can be respectively arranged at the two ends of the shell 1, so as to increase the length of the cooling water flow channel and improve the heat exchange efficiency. The shell 1 is preferably a columnar body, such as a cylindrical shell 1. The cylindrical heat exchanger is the main heat exchange component, and the cylindrical heat exchanger includes a cylindrical barrel 2, and fins 21 are arranged on the inner and outer sides of the cylindrical barrel 2, that is, the cylindrical barrel 2 has a certain wall thickness, and the fins 21 are arranged on the inner and outer walls of the cylindrical barrel 2. By arranging the fins 21 on both the inside and the outside, the heat exchange area can be increased and the heat exchange efficiency can be improved. A liquid metal flow channel 22 is arranged in the cylindrical heat exchanger, and the cylindrical heat exchanger is arranged in the shell 1. Preferably, the axis of the cylindrical heat exchanger coincides with or is arranged in parallel with the axis of the shell 1. After the cylindrical heat exchanger is installed in the shell 1, a gap will be left between the outer side of the cylindrical barrel 2 and the shell 1. The gap between the outer side of the cylindrical barrel 2 and the shell 1 forms a cooling water channel, which can be called an external cooling water channel 13. At the same time, because the cylindrical barrel 2 is a hollow sleeve, a cooling water channel is also formed on the inner side of the cylindrical barrel 2, which can be called an internal cooling water channel 14. The cooling water cavity includes a cylindrical internal cooling water channel 14 and an external cooling water channel 13 which is a tubular structure and concentrically arranged on the outside of the internal cooling water channel 14. The liquid metal cavity is arranged inside the heat-conducting inner wall between the external cooling water channel 13 and the internal cooling water channel 14 to achieve all-round heat dissipation of the liquid metal cavity, which can increase the heat exchange area while isolating the two media and improve the heat exchange capacity.

[0030] Among them, the two ends of the cylindrical heat exchanger are respectively provided with a liquid metal inlet 31 and a liquid metal outlet 41, and the liquid metal inlet 31 and the liquid metal outlet 41 are both connected to the liquid metal flow channel 22. The cooling water inlet 11 and the cooling water outlet 12 on the shell 1 are both connected to the cooling water flow channel, that is, the cooling water flows in from the cooling water inlet 11, and flows out through the outer cooling water flow channel 13 and the inner cooling water flow channel 14 to the cooling water outlet 12. The liquid metal flow channel 22 is isolated from the cooling water flow channel.

[0031] The dual-fluid heat exchanger 10 of this embodiment uses two cooling medium fluids, cooling water and liquid metal, for heat exchange. Liquid metal has a thermal conductivity much higher than that of water, air and many non-metallic media. Therefore, using a liquid metal radiator to cool the cooled part can achieve more efficient heat transfer and extreme heat dissipation capacity. At the same time, cooling water is used to cool the liquid metal in the dual-fluid heat exchanger 10, that is, the cylindrical heat exchanger is a component for heat exchange between cooling water and liquid metal. The heat carried by the liquid metal is transferred to the cooling water through the cylindrical heat exchanger to cool the liquid metal, so that the liquid metal circulates to continuously cool the cooled part. The cooling water is then circulated and cooled through a condenser, etc., thereby forming dual-fluid heat dissipation.

[0032] Since the dual-fluid heat exchanger 10 of this embodiment adopts the design of a cylindrical heat exchanger, compared with the existing rectangular heat exchanger, the device volume is greatly reduced under the same contact area, the heat dissipation efficiency is improved, and the device structure is more compact. In addition, fins 21 are provided on the inner and outer sides of the cylindrical barrel 2 in the cylindrical heat exchanger, and grooves are provided between adjacent fins 21 to increase the heat exchange area between the cooling medium and the liquid metal. By providing fins 21 on both the inner and outer sides, the heat exchange area can be further increased and the heat exchange efficiency can be improved.

[0033] In one embodiment of the present invention, the cylindrical heat exchanger comprises an inlet cover plate 3, a cylindrical barrel 2 and an outlet cover plate 4. The inlet cover plate 3 is fixedly connected to the first end of the cylindrical barrel 2; the outlet cover plate 4 is fixedly connected to the second end of the cylindrical barrel 2.

[0034] The inlet cover plate 3 is provided with a liquid metal inlet 31, a liquid metal hole 32 and a cooling water hole 33. The liquid metal inlet 31 is connected to the liquid metal flow channel 22 through the liquid metal hole 32; the cooling water inlet 11 is connected to the cooling water flow channel through the cooling water hole 33. The function of the inlet cover plate 3 is to distribute the cooling water entering from the cooling water inlet 11 and the liquid metal entering from the liquid metal inlet 31. The cooling water enters the cooling water flow channel through the cooling water hole 33; the liquid metal enters the liquid metal flow channel 22 through the liquid metal hole 32.

[0035] The outlet cover plate 4 is provided with a liquid metal outlet 41 and a liquid metal hole 32, and the liquid metal outlet 41 is connected to the liquid metal flow channel 22 through the liquid metal hole 32. The function of the outlet cover plate 4 is to collect liquid metal, and the liquid metal in the liquid metal flow channel 22 is collected to the liquid metal outlet 41 through the liquid metal hole 32.

[0036] In one embodiment of the present invention, see Figure 5 As shown, the fins 21 arranged on the inner and outer sides of the cylindrical body 2 extend radially. That is, the plane where each fin 21 is located is the radial extension plane of the cylindrical body 2. This arrangement can arrange relatively dense fins 21 in a smaller volume, increase the heat exchange area between the cylindrical body 2 and the cooling water, and increase the heat exchange efficiency.

[0037] In one embodiment of the present invention, a plurality of liquid metal flow channels 22 are evenly arranged along the circumference in the cylindrical body 2, and each liquid metal flow channel 22 extends along the axial direction. That is, the plurality of liquid metal flow channels 22 are arranged in the side wall of the cylindrical body 2, evenly distributed along the circumference, and axially penetrate the side wall of the cylindrical body 2.

[0038] In one embodiment of the present invention, see Figure 6 As shown, the inlet cover plate 3 is disc-shaped, which is convenient for matching with the cylindrical barrel 2. The liquid metal inlet 31 is set at the center of one side of the inlet cover plate 3 and extends outward along the axial direction; a plurality of liquid metal holes 32 are evenly arranged along the circumference of the inlet cover plate 3, and each liquid metal hole 32 is correspondingly connected to each liquid metal flow channel 22. The liquid metal inlet 31 is arranged on the outward side of the inlet cover plate 3 to connect with the liquid metal pipeline, and the openings of the plurality of liquid metal holes 32 are arranged on the side of the inlet cover plate 3 facing the cylindrical barrel 2 to communicate with the corresponding liquid metal flow channel 22. A plurality of cooling water holes 33 are evenly arranged along the circumference of the inlet cover plate 3, and each cooling water hole 33 is set as a long hole extending along the radial direction, which is respectively connected to the cooling water flow channel (external cooling water flow channel 13) between the outer side of the cylindrical barrel 2 and the shell 1 and the cooling water flow channel (internal cooling water flow channel 14) inside the cylindrical barrel 2. The opening of the cooling water hole 33 is also arranged on the side of the inlet cover plate 3 facing the cylindrical barrel 2 so as to be connected with the corresponding cooling water flow channel.

[0039] The structure of the inlet cover plate 3 plays the following role: the cooling water entering from the cooling water inlet 11 and the liquid metal entering from the liquid metal inlet 31 are distributed, and the cooling water enters the inner cooling water channel 14 and the outer cooling water channel 13 respectively through the cooling water holes 33; the liquid metal enters each liquid metal channel 22 respectively through the liquid metal holes 32.

[0040] Preferably, each cooling water hole 33 and each liquid metal hole 32 are arranged at intervals and staggered along the circumferential direction, so as to increase the efficiency of heat exchange between the cooling water and the liquid metal.

[0041] In one embodiment of the present invention, see Figure 3 As shown, the outlet cover plate 4 is disc-shaped, which is convenient for matching with the cylindrical barrel 2. The liquid metal outlet 41 is set at the center of one side of the outlet cover plate 4 and extends outward along the axial direction; a plurality of liquid metal holes 32 are evenly arranged along the circumference of the outlet cover plate 4, and each liquid metal hole 32 is correspondingly connected to each liquid metal flow channel 22. That is, the liquid metal outlet 41 is arranged on the side of the outlet cover plate 4 facing outward so as to be connected to the liquid metal pipeline, and the openings of the plurality of liquid metal holes 32 are arranged on the side of the inlet cover plate 3 facing the cylindrical barrel 2 so as to be connected to the corresponding liquid metal flow channel 22. The structure of the outlet cover plate 4 plays the following role: the liquid metal in each liquid metal flow channel 22 is collected to the liquid metal outlet 41 through the liquid metal hole 32.

[0042] In one embodiment of the present invention, the inlet cover plate 3 is connected to the first end of the housing 1 where the cooling water inlet 11 is provided, and the cooling water inlet 11 is communicated with each cooling water hole 33. For example, the inlet cover plate 3 is fixed to the first end of the housing 1 through a connecting member, and the cooling water inlet 11 provided at the first end of the housing 1 is communicated with each cooling water hole 33.

[0043] In one embodiment of the present invention, the outlet cover plate 4 is fixedly connected to the second end of the housing 1 by bolts 5 .

[0044] Preferably, the shell 1, the cylindrical body 2, the inlet cover plate 3 and the outlet cover plate 4 are made of copper. The inlet cover plate 3 is welded and fixed to the first end of the cylindrical body 2, and the outlet cover plate 4 is welded and fixed to the second end of the cylindrical body 2.

[0045] The use process and principle of the dual-fluid heat exchanger 10 are as follows: first, the inlet cover plate 3, the outlet cover plate 4 and the cylindrical barrel 2 are welded to form a cylindrical heat exchanger; the cylindrical heat exchanger is placed in the cavity of the shell 1 in an axial direction parallel to the axial direction of the shell 1; the shell 1 and the outlet cover plate 4 are connected by bolts 5 to form a closed cavity. The cooling water inlet 11 and the cooling water outlet 12 on the shell 1 are connected to the external cooling water circulation pipeline; the liquid metal inlet 31 on the inlet cover plate 3 is connected to the external liquid metal circulation pipeline 40, and the liquid metal outlet 41 on the outlet cover plate 4 is connected to the external liquid metal circulation pipeline 40. After the liquid metal cools the cooled component, the liquid metal carrying heat is distributed to each liquid metal flow channel 22 in the cylindrical barrel 2 through the liquid metal inlet 31 and the liquid metal hole 32 on the inlet cover plate 3. At the same time, the cooling water enters the inner cooling water channel 14 and the outer cooling water channel 13 through the cooling water inlet 11 on the shell 1 and the cooling water hole 33 on the inlet cover plate 3, respectively. The liquid metal exchanges heat with the cooling water through the inner fins 21 and the outer fins 21 of the cylindrical barrel 2, and transfers heat to the cooling water. The cooling liquid after the temperature drops is collected to the liquid metal outlet 41 through the liquid metal hole 32 on the outlet cover plate 4, and re-enters the liquid metal circulation pipeline 40 to cool the cooled parts. The cooling water after the temperature rises is collected into the cooling water outlet 12 on the shell 1 through the inner cooling water channel 14 and the outer cooling water channel 13 and enters the cooling water circulation pipeline. A refrigeration device such as a condenser can be set in the external cooling water circulation pipeline to cool the cooling water. The cooled cooling water re-enters the cooling water channel of the dual-fluid heat exchanger 10 through the cooling water circulation pipeline and the cooling water inlet 11 to cool the metal liquid, and the heat exchange is repeated in this way. That is, the liquid metal loop cools the component to be cooled, and the cooling water circulation loop cools the liquid metal in the liquid metal loop, so that the liquid metal circulates to cool the component to be cooled. The liquid metal-water solution dual fluid is driven to circulate by an electromagnetic pump 6, and the electromagnetic pump 6 is connected to one end of the dual fluid heat exchanger 10.

[0046] In addition, the liquid cooling heat dissipation component in this embodiment also includes a heat dissipation controller, the liquid metal inlet valve 50 is an adjustable diverter valve, the frequency converter of the electromagnetic pump 6 and the control end of the liquid metal inlet valve 50 are respectively connected to the heat dissipation controller; in this embodiment, the driving voltage V of the electromagnetic pump 6 is 1~2V, and the driving current I is 20~60A. The electromagnetic pump 6 is driven by external power supply or directly driven by power supply from the server circuit board. The liquid metal liquid-cooled server includes multiple processor cooling parts, and the multiple processor cooling parts are connected to the liquid metal circulation pipeline through cascade-connected diverters to utilize liquid metal for circulation cooling. Each diverter includes two outputs, one of which is allocated to the corresponding processor cooling part, and the other output is allocated to the processor cooling parts of subsequent stages, and the diverter is an adjustable diverter.

[0047] In addition, in order to dynamically adjust the heat dissipation capacity according to the load of the server to ensure that the cooling always remains efficient, the present embodiment also provides an application method of a liquid metal liquid-cooled server, including: adjusting the driving current I of the electromagnetic pump 6 and the valve opening of the liquid metal inlet valve 50 according to the power consumption P of the server, and the size of the driving current I and the valve opening of the liquid metal inlet valve 50 are both positively correlated with the value of the power consumption P of the server; at the same time, respectively obtaining the utilization rate of each processor, and dynamically adjusting the diversion ratio of each level of diverters to 1a / ((ni)b) so that the liquid metal flow rate sent to each processor cooling element 20 is adaptive to the utilization rate of the processor, wherein a is the utilization rate of the processor corresponding to the diverter of this level, and b is the utilization rate of the subsequent levels of the diverter of this level. The average value of the usage rate of the processor corresponding to the diverter 41, n is the total number of diverter stages, i is the number of diverters at this stage; the measured temperature of each processor is obtained respectively, the usage rate of each processor is queried in a preset usage rate-reference temperature mapping table to obtain the reference temperature of the processor, the temperature difference between the measured temperature and the reference temperature is calculated, the liquid metal pressure difference between the liquid metal inlet valve 50 and the liquid metal outlet valve 60 is obtained, the temperature difference between the measured temperature and the reference temperature is used to obtain a first control quantity by a PID controller, the liquid metal pressure difference between the liquid metal inlet valve 50 and the liquid metal outlet valve 60 is obtained by a PID controller to obtain a second control quantity, the first control quantity and the second control quantity are summed up as the total control quantity to dynamically control the speed of the electromagnetic pump 6.

[0048] When adjusting the driving current I of the electromagnetic pump 6 and the valve opening of the liquid metal inlet valve 50 according to the power consumption P of the server, the valve opening of the liquid metal inlet valve 50 corresponding to the power consumption P of the current server can be obtained by reading the preset mapping table of the power consumption P of the server and the valve opening of the liquid metal inlet valve 50, and the driving current I of the electromagnetic pump 6 corresponding to the power consumption P of the current server can be obtained by reading the preset mapping table of the power consumption P of the server and the driving current I of the electromagnetic pump 6. In addition, considering that the power consumption P of the server is usually determined by the power consumption of components such as the processor and the graphics card, when it is difficult to obtain a better estimate of the power consumption P of the server, the power consumption P of the server can also be indirectly estimated based on the working status of the components. For example, the main frequency of the processor, the IO amount of the memory, the IO amount of the hard disk, the traffic size of the network card, and the frequency of the graphics card in the server are obtained, and these component information are normalized according to the full load information of the component and then multiplied by the full load power consumption of the component to obtain the estimated power consumption of a single component. The estimated power consumption of a single component is then summed to obtain the estimated power consumption P of the server. On this basis, the preset server power consumption P and the valve opening of the liquid metal inlet valve 50 mapping table can be read to obtain the valve opening of the liquid metal inlet valve 50 corresponding to the power consumption P of the current server, and the preset server power consumption P and the driving current I of the electromagnetic pump 6 mapping table can be read to obtain the driving current I of the electromagnetic pump 6 corresponding to the power consumption P of the current server.

[0049] In the description of this specification, the description of reference terms such as "one embodiment / mode", "some embodiments / modes", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment / mode or example are included in at least one embodiment / mode or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment / mode or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments / modes or examples. In addition, those skilled in the art can combine and combine the different embodiments / modes or examples described in this specification and the features of different embodiments / modes or examples without contradiction. In addition, the terms "first" and "second" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the embodiments of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. Meanwhile, in the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0050] Those skilled in the art should understand that the above embodiments are only for the purpose of clearly illustrating the embodiments of the present invention, and are not intended to limit the scope of the embodiments of the present invention. For those skilled in the art, other changes or modifications may be made based on the above disclosure, and these changes or modifications should also be regarded as the protection scope of the present invention.

Claims

1. An application method of a liquid metal liquid-cooled server, characterized in that: The liquid metal liquid-cooled server includes a chassis and a liquid cooling heat dissipation component, wherein a processor and a memory are arranged in the chassis; the liquid cooling heat dissipation component includes a processor cooling element, a memory cooling element, a liquid metal circulation pipeline, a cooling water circulation pipeline, a dual-fluid heat exchanger and a heat dissipation controller; the processor cooling element and the memory cooling element are connected through a liquid metal circulation pipeline to utilize liquid metal for circulation cooling; the dual-fluid heat exchanger includes a liquid metal cavity and a cooling water cavity which are isolated from each other and conduct heat through a heat-conducting inner wall, and the cooling water cavity includes a cylindrical inner cooling water flow channel and a tubular structure which is sleeved outside the inner cooling water flow channel and is concentrically arranged. The outer cooling water flow channel, the liquid metal cavity is arranged inside the heat-conducting inner wall between the outer cooling water flow channel and the inner cooling water flow channel to achieve all-round heat dissipation of the liquid metal cavity, the liquid metal circulation pipeline is connected to the liquid metal cavity of the dual-fluid heat exchanger, the cooling water circulation pipeline is connected to the cooling water cavity of the dual-fluid heat exchanger, the cooling water in the cooling water circulation pipeline cools the liquid metal in the liquid metal circulation pipeline through the dual-fluid heat exchanger, the circulation power of the liquid metal in the liquid metal circulation pipeline comes from the electromagnetic pump, the electromagnetic pump is connected to one end of the dual-fluid heat exchanger, and the liquid metal circulation pipeline is provided with a liquid metal inlet valve and an electromagnetic pump. The inverter control ends of the liquid metal inlet valve and the electromagnetic pump are respectively connected to the heat dissipation controller, and the heat dissipation controller is connected to the processor through a bus interface; the liquid metal liquid-cooled server includes a plurality of processor cooling parts, and the plurality of processor cooling parts are connected to the liquid metal circulation pipeline through cascade-connected diverters to utilize liquid metal for circulation cooling, each diverter includes two outputs, one of which is allocated to the corresponding processor cooling part and the other is allocated to the processor cooling parts of subsequent stages, and the diverter is an adjustable diverter, and the control end of the adjustable diverter is connected to the heat dissipation controller; the application method includes: according to the server The driving current I of the electromagnetic pump and the valve opening of the liquid metal inlet valve are adjusted according to the power consumption P, and the driving current I and the valve opening of the liquid metal inlet valve are positively correlated with the power consumption P of the server; at the same time, the utilization rate of each processor is obtained respectively, and the diversion ratio of each level of diverters is dynamically adjusted to 1a / ((ni)b) so that the liquid metal flow rate sent to each processor cooling part is adaptive to the utilization rate of the processor, wherein a is the utilization rate of the processor corresponding to the diverter of this level, b is the average utilization rate of the processor corresponding to the diverters of subsequent levels of the diverter of this level, n is the total number of diverters, and i is the number of diverters of this level;The measured temperature of each processor is obtained respectively, and the usage rate of each processor is queried in a preset usage rate-reference temperature mapping table to obtain the reference temperature of the processor, the temperature difference between the measured temperature and the reference temperature is calculated, and the pressure difference of the liquid metal between the liquid metal inlet valve and the liquid metal outlet valve is obtained. The temperature difference between the measured temperature and the reference temperature is obtained by using a PID controller to obtain a first control quantity, and the pressure difference of the liquid metal between the liquid metal inlet valve and the liquid metal outlet valve is obtained by using a PID controller to obtain a second control quantity, and the first control quantity and the second control quantity are summed as a total control quantity to dynamically control the speed of the electromagnetic pump; the estimation of the size of the power consumption P of the server includes: obtaining the main frequency of the processor, the IO amount of the memory, the IO amount of the hard disk, the flow size of the network card, and the frequency of the graphics card in the server, normalizing these component information according to the full load information of the component and then multiplying it by the full load power consumption of the component to obtain the estimated power consumption of a single component, and then summing the estimated power consumption of the single component to obtain the estimated power consumption P of the server. ; 2. The application method of the liquid metal liquid-cooled server according to claim 1, characterized in that: The processor cooling element and the memory cooling element are connected in series through a liquid metal circulation pipeline. The liquid metal in the liquid metal circulation pipeline flows through the processor cooling element and the memory cooling element in turn through a liquid metal inlet valve and then flows into a dual-fluid heat exchanger.

3. The application method of the liquid metal liquid-cooled server according to claim 2, characterized in that: The dual-fluid heat exchanger includes a shell and a cylindrical heat exchange element, and a cooling water inlet and a cooling water outlet are provided on the shell; the cylindrical heat exchange element includes a cylindrical barrel, and fins are provided on the inner and outer sides of the cylindrical barrel, and a liquid metal flow channel is provided in the cylindrical heat exchange element. The cylindrical heat exchange element is arranged in the shell, and cooling water flow channels are formed between the outer side of the cylindrical barrel and the shell and on the inner side of the cylindrical barrel; wherein, liquid metal inlets and liquid metal outlets are respectively provided at both ends of the cylindrical heat exchange element, and the liquid metal inlets and liquid metal outlets are both communicated with the liquid metal flow channel; the cooling water inlet and the cooling water outlet are both communicated with the cooling water flow channel; the liquid metal flow channel and the cooling water flow channel are isolated from each other.

4. The application method of the liquid metal liquid-cooled server according to claim 3, characterized in that: The cylindrical heat exchanger also includes an inlet cover plate and an outlet cover plate, wherein the inlet cover plate is fixedly connected to the first end of the cylindrical body; the inlet cover plate is provided with a liquid metal inlet, a liquid metal hole and a cooling water hole, the liquid metal inlet is connected to the liquid metal flow channel through the liquid metal hole; the cooling water inlet is connected to the cooling water flow channel through the cooling water hole; the outlet cover plate is fixedly connected to the second end of the cylindrical body; the outlet cover plate is provided with a liquid metal outlet and a liquid metal hole, and the liquid metal outlet is connected to the liquid metal flow channel through the liquid metal hole.

5. The application method of the liquid metal liquid-cooled server according to claim 4, characterized in that: The fins on the inner and outer sides of the cylindrical barrel extend in the radial direction, and a plurality of liquid metal flow channels are evenly arranged in the cylindrical barrel along the circumferential direction, and each liquid metal flow channel extends in the axial direction.

6. The application method of the liquid metal liquid-cooled server according to claim 5, characterized in that: The inlet cover plate is disc-shaped, and the liquid metal inlet is arranged at the center of one side of the inlet cover plate and extends outward in the axial direction; a plurality of liquid metal holes are evenly arranged around the circumference of the inlet cover plate, and each liquid metal hole is connected to each liquid metal flow channel; a plurality of cooling water holes are evenly arranged around the circumference of the inlet cover plate, and each cooling water hole is arranged as a long hole extending along the radial direction, which is respectively connected to the cooling water flow channel between the outer side of the cylindrical body and the shell and the cooling water flow channel inside the cylindrical body, and each cooling water hole is staggered and arranged circumferentially with each liquid metal hole.

7. The application method of the liquid metal liquid-cooled server according to claim 6, characterized in that: The outlet cover plate is disc-shaped, and the liquid metal outlet is arranged at the center of one side of the outlet cover plate and extends outward in the axial direction; a plurality of liquid metal holes are evenly arranged around the circumference of the outlet cover plate, and each liquid metal hole is connected to each liquid metal flow channel.

8. The application method of the liquid metal liquid-cooled server according to claim 7, characterized in that: The inlet cover plate is connected to the first end of the shell where a cooling water inlet is arranged, and the cooling water inlet is communicated with each cooling water hole.

9. The application method of the liquid metal liquid-cooled server according to claim 1, characterized in that: The electromagnetic pump is driven by taking power externally or directly taking power from a server circuit board.

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