Electrode structure, preparation method and electronic equipment

Abstract

The invention relates to the technical field of electronics, in particular to an electrode structure, a preparation method and electronic equipment. The electrode structure comprises an electrode body and a metal deposition layer deposited on the surface of the electrode body, a protrusion array is arranged on the side, facing the metal deposition layer, of the electrode body, and the protrusion array is formed by densely arranging protrusion structures which are equal in height or basically equal in height in an array mode. And the bulge structure is one of the following bulges: a conical bulge and a columnar bulge. The height of the protruding structure is one of the following orders of magnitude: centimeter, millimeter, micrometer and nanometer. And the bulge array is formed in an electro-deposition mode. According to the scheme, the problems that in the prior art, an electrode structure deposition layer is uneven in deposition and large in porosity can be solved, the space utilization rate of the electrode structure can be improved, and the occurrence probability of dendritic crystals can be reduced.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to an electrode structure, a preparation method and an electronic device. Background Art

[0002] In order to improve the conductivity and corrosion resistance of the electrode, a conductive layer and an anti-corrosion layer are generally deposited on the surface of the electrode.

[0003] However, the common electrode structure is very flat at the macroscopic level, but uneven at the microscopic level. Therefore, during the electrodeposition process, the raised parts of the electrode surface (such as Figure 1 The electric field of the conical protrusion shown in the figure is more concentrated, and the deposition rate is higher, which makes the deposition layer uneven and has a large porosity, thus affecting the space utilization of the electrode. In addition, when the deposition rate of the protrusion is too high, dendrites (referred to as dendrites) will appear. Summary of the invention

[0004] The embodiments of the present application at least provide an electrode structure, a preparation method and an electronic device to improve the problems of uneven deposition and large porosity of the electrode structure deposition layer in the prior art, which is beneficial to improving the space utilization of the electrode structure and reducing the probability of the occurrence of dendrites.

[0005] In a first aspect, an embodiment of the present application provides an electrode structure, which is prepared by the method described in any one of the first aspects, and the electrode structure includes an electrode body and a metal deposition layer deposited on the surface of the electrode body, wherein a protrusion array is provided on the side of the electrode body facing the metal deposition layer, and the protrusion array is composed of protrusion structures of equal or substantially equal heights densely arranged in an array.

[0006] In the above scheme, since the surface of the electrode body is provided with densely arranged array-arranged protrusion structures of equal or substantially equal heights, during the electrodeposition process, the deposition rates at the positions of the various protrusion structures are substantially the same, which makes the deposited layer more uniform and flat at the microscopic level, and the porosity of the deposited layer is smaller, thereby improving the problems of uneven deposition and large porosity of the deposited layer of the electrode structure in the prior art, which is beneficial to improving the space utilization of the electrode structure and reducing the probability of the occurrence of dendrites.

[0007] In an optional embodiment, the protrusion structure is one of the following protrusions: a conical protrusion and a columnar protrusion.

[0008] In an optional embodiment, the height of the protruding structure is one of the following orders of magnitude: centimeters, millimeters, micrometers and nanometers.

[0009] In an optional embodiment, the protrusion array is formed by electrodeposition.

[0010] In a second aspect, the present application also provides a method for preparing an electrode structure, comprising:

[0011] Providing an electrode body;

[0012] A protrusion array is formed on the surface of the electrode body, wherein the protrusion array is composed of protrusion structures of equal or substantially equal heights that are densely arranged in an array;

[0013] A metal deposition layer covering the protrusion array is deposited on the surface of the electrode body.

[0014] In the above scheme, since the surface of the electrode body is provided with densely arranged array-arranged protrusion structures of equal or substantially equal heights, during the electrodeposition process, the deposition rates at the positions of the various protrusion structures are substantially the same, which makes the deposited layer more uniform and flat at the microscopic level, and the porosity of the deposited layer is smaller, thereby improving the problems of uneven deposition and large porosity of the deposited layer of the electrode structure in the prior art, which is beneficial to improving the space utilization of the electrode structure and reducing the probability of the occurrence of dendrites.

[0015] In an optional embodiment, the protrusion structure is one of the following protrusions: a conical protrusion and a columnar protrusion.

[0016] In an optional embodiment, the height of the protruding structure is one of the following orders of magnitude: centimeters, millimeters, micrometers and nanometers.

[0017] In an optional embodiment, the protrusion array is formed by electrodeposition.

[0018] In a third aspect, an embodiment of the present application further provides an electronic device, comprising the electrode structure described in any one of the first aspects.

[0019] In the above scheme, the electronic device includes an electrode structure. Since the surface of the electrode body of the electrode structure is provided with densely and array-arranged raised structures of equal or substantially equal heights, the deposition rates at the positions of the raised structures are substantially consistent during the electrodeposition process, which makes the deposited layer more uniform and flat at the microscopic level, and the porosity of the deposited layer is smaller, thereby improving the problems of uneven deposition and large porosity of the deposited layer of the electrode structure in the prior art, which is beneficial to improving the space utilization of the electrode structure and reducing the probability of the occurrence of dendrites.

[0020] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. The drawings herein are incorporated into the specification and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and are used together with the specification to illustrate the technical solutions of the present application. It should be understood that the following drawings only illustrate certain embodiments of the present application and should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can also be obtained based on these drawings without creative work.

[0022] Figure 1 A schematic diagram of electrodeposition on a conical protrusion on the electrode surface is shown;

[0023] Figure 2 A schematic diagram of an electrode structure provided in an embodiment of the present application is shown;

[0024] Figure 3 A schematic diagram of the structure of the test sample provided in the embodiment of the present application is shown;

[0025] Figure 4 The surface of the deposited layer of the test sample provided in the embodiment of the present application is shown;

[0026] Figure 5 The surface of the deposited layer of the control sample provided in the embodiment of the present application is shown;

[0027] Figure numerals: 1. electrode body; 2. protrusion array; 3. metal deposition layer. DETAILED DESCRIPTION

[0028] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0029] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0030] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] An embodiment of the present application provides an electrode structure, which can improve the problems of uneven deposition and large porosity of the electrode structure deposition layer in the prior art, and is beneficial to improving the space utilization of the electrode structure and reducing the probability of the occurrence of dendrites.

[0034] refer to Figure 2 The electrode structure of the embodiment of the present application comprises an electrode body 1 and a metal deposition layer 3 deposited on the surface of the electrode body 1, wherein a protrusion array 2 is provided on the side of the electrode body 1 facing the metal deposition layer 3, and the protrusion array 2 is composed of protrusion structures of equal or substantially equal heights densely arranged in an array. In a specific configuration, the protrusion structure may be a conical protrusion or a columnar protrusion.

[0035] In some embodiments, the protrusion structure may be one of the following protrusions: a cone-shaped protrusion and a columnar protrusion, etc. In a specific implementation, the protrusion type of the protrusion structure may be selected according to actual conditions. This is not specifically limited in the embodiments of the present application.

[0036] In some embodiments, the height of the protruding structure can be one of the following orders of magnitude: centimeters, millimeters, micrometers, and nanometers. In specific implementations, the order of magnitude of the height of the protruding structure can be selected according to actual conditions. This is not specifically limited in the embodiments of the present application.

[0037] In some embodiments, the protrusion array 2 may be formed by electrodeposition. It should be understood that, in a specific implementation, the protrusion array 2 may also be formed by other methods, such as physical vapor deposition or chemical vapor deposition.

[0038] In the above scheme, since the surface of the electrode body 1 is provided with densely arranged and arrayed raised structures of equal or substantially equal heights, the deposition rates at the positions of the various raised structures are substantially consistent during the electrodeposition process, which makes the deposited layer more uniform and flat at the microscopic level, and the porosity of the deposited layer is smaller, thereby improving the problems of uneven deposition and large porosity of the deposited layer of the electrode structure in the prior art, which is beneficial to improving the space utilization of the electrode structure and reducing the probability of the occurrence of dendrites.

[0039] In order to verify the feasibility of the above solution, an example is given below to illustrate.

[0040] Test sample: a flat nickel sheet electrode on which a cone-shaped micron protrusion array 2 is electrodeposited, such as Figure 3 shown.

[0041] Control sample: flat nickel sheet electrode.

[0042] Verification method: The test sample and the control sample were placed in 1M zinc chloride aqueous solution respectively, and electrodeposition was performed for 1 hour at 20mA cm-2 current density.

[0043] The verification results show that the electrodeposited layer on the surface of the test sample is dense and flat, and no dendrites appear. Figure 4 The electrodeposited layer on the surface of the control sample is uneven and has dendrites, as shown in Figure 5 shown.

[0044] An embodiment of the present application provides a method for preparing an electrode structure, and the method can be used to prepare the electrode structure described above.

[0045] The method for preparing the electrode structure provided in the embodiment of the present application includes:

[0046] Step S100, providing an electrode body 1;

[0047] Step S200, forming a protrusion array 2 on the surface of the electrode body 1, wherein the protrusion array 2 is composed of protrusion structures of equal or substantially equal heights that are densely arranged in an array;

[0048] Step S300 , depositing a metal deposition layer 3 covering the protrusion array 2 on the surface of the electrode body 1 .

[0049] In the above scheme, since the surface of the electrode body 1 is provided with densely arranged and arrayed raised structures of equal or substantially equal heights, the deposition rates at the positions of the various raised structures are substantially consistent during the electrodeposition process, which makes the deposited layer more uniform and flat at the microscopic level, and the porosity of the deposited layer is smaller, thereby improving the problems of uneven deposition and large porosity of the deposited layer of the electrode structure in the prior art, which is beneficial to improving the space utilization of the electrode structure and reducing the probability of the occurrence of dendrites.

[0050] In some embodiments, the protrusion structure may be one of the following protrusions: a cone-shaped protrusion and a columnar protrusion, etc. In a specific implementation, the protrusion type of the protrusion structure may be selected according to actual conditions. This is not specifically limited in the embodiments of the present application.

[0051] In some embodiments, the height of the protruding structure can be one of the following orders of magnitude: centimeters, millimeters, micrometers, and nanometers. In specific implementations, the order of magnitude of the height of the protruding structure can be selected according to actual conditions. This is not specifically limited in the embodiments of the present application.

[0052] In some embodiments, the protrusion array 2 may be formed by electrodeposition. It should be understood that, in a specific implementation, the protrusion array 2 may also be formed by other methods, such as physical vapor deposition or chemical vapor deposition.

[0053] An embodiment of the present application also provides an electronic device, comprising the electrode structure described above.

[0054] The electronic device of the embodiment of the present application may be a battery or an electrical device, such as a touch device, a detection device or a display device, etc. This embodiment of the present application does not specifically limit this.

[0055] In the above scheme, the electronic device includes an electrode structure. Since the surface of the electrode body 1 of the electrode structure is provided with densely and array-arranged protrusion structures of equal or substantially equal heights, the deposition rates at the positions of the various protrusion structures are substantially consistent during the electrodeposition process, which makes the deposited layer more uniform and flat at the microscopic level, and the porosity of the deposited layer is smaller, thereby improving the problems of uneven deposition and large porosity of the deposited layer of the electrode structure in the prior art, which is beneficial to improving the space utilization of the electrode structure and reducing the probability of the occurrence of dendrites.

[0056] One or more embodiments of this specification are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of one or more embodiments of this specification should be included in the scope of protection of this application.

[0057] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electrode structure, characterized in that: It comprises an electrode body and a metal deposition layer deposited on the surface of the electrode body, wherein a protrusion array is arranged on the side of the electrode body facing the metal deposition layer, and the protrusion array is composed of protrusion structures of equal or substantially equal heights densely arranged in an array.

2. The electrode structure according to claim 1, characterized in that: The protrusion structure is one of the following protrusions: a cone-shaped protrusion and a columnar protrusion.

3. The electrode structure according to claim 1, characterized in that: The height of the protruding structure is one of the following orders of magnitude: centimeters, millimeters, micrometers and nanometers.

4. The electrode structure according to claim 1, characterized in that: The protrusion array is formed by electrodeposition.

5. A method for preparing an electrode structure, characterized in that: include: Providing an electrode body; A protrusion array is formed on the surface of the electrode body, wherein the protrusion array is composed of protrusion structures of equal or substantially equal heights that are densely arranged in an array; A metal deposition layer covering the protrusion array is deposited on the surface of the electrode body.

6. The method according to claim 5, characterized in that The protrusion structure is one of the following protrusions: a cone-shaped protrusion and a columnar protrusion.

7. The method according to claim 5, characterized in that The height of the protruding structure is one of the following orders of magnitude: centimeters, millimeters, micrometers and nanometers.

8. The method according to claim 5, characterized in that The protrusion array is formed by electrodeposition.

9. An electronic device, characterized in that: The invention comprises the electrode structure as described in any one of claims 1 to 4.

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