Transformer connection inductor and preparation method thereof
By arranging and processing copper strips on the plate to form multiple sets of electrodes, it solves the problems of high cost and difficulty in achieving precision in inductor connection in transformer modules in the existing technology, and realizes a transformer with low impedance, high precision and high current adaptability. Connect the inductor.
Patent Information
- Application Number
- CN202411702605.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2025-01-21
AI Technical Summary
In the existing transformer module, the surface covering electrodes of multiple blocks are individually connected as multiple inductors, resulting in increased costs and difficulty in achieving high-precision overall size and high current adaptability.
The inductor is prepared by arranging multiple protruding and mutually symmetrical copper strips on the first and second sides of the plate, sputtering a metal layer on the outer surface, and forming multiple sets of electrodes by laser.
The preparation process of this method is simple, and the obtained transformer connection inductance has low impedance, can adapt to large currents, and has high precision, which reduces costs and improves overall performance.
Smart Images
Figure CN119340094A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a transformer connection inductor and a preparation method thereof, belonging to the technical field of inductance. Background Art
[0002] At present, in transformer modules, electrodes need to be covered on the surface of multiple blocks as multiple inductors connected separately, which also play a supporting and energizing role, which will increase the cost. At the same time, the overall size requires high precision and large current. When multiple inductors are connected one by one, due to the size tolerance and material composition, they cannot form an integrated structure, and it is difficult to achieve high requirements in terms of precision.
[0003] In view of this, it is indeed necessary to improve the existing transformer connection inductance to solve the above problems. Summary of the invention
[0004] The object of the present invention is to provide a method for preparing a transformer connection inductor. The preparation method has a simple process, and the prepared transformer connection inductor has low impedance, can adapt to large currents, and has high precision.
[0005] To achieve the above object, the present invention provides a method for preparing a transformer connection inductor, comprising:
[0006] Step S1, selecting a plate, cutting the plate to obtain a plate, wherein the plate is provided with a first surface and a second surface that are oppositely disposed, and two third surfaces that are oppositely disposed and connect the first surface and the second surface, wherein the first surface and the second surface are provided with a plurality of protruding and mutually symmetrical copper strips, and both ends of each copper strip extend to connect with the corresponding third surface;
[0007] Step S2, performing sputtering treatment on the outer surface of the plate to form a metal layer;
[0008] Step S3, laser lithography the metal layers on the first and second surfaces that are not covered with copper strips until the plate is exposed, and laser lithography the metal layers on the two third surfaces to form metal strips that are connected to the multiple copper strips in a one-to-one correspondence, so as to form multiple groups of electrodes on the outer surface of the plate;
[0009] Step S4, electroplating the multiple groups of electrodes to obtain inductors.
[0010] As a further improvement of the present invention, in step S1, the plurality of copper bars are evenly and spaced apart on both the first surface and the second surface along the extension direction of the plate.
[0011] As a further improvement of the present invention, in step S2, the metal layer completely covers the third surface of the plate together with the plurality of copper bars.
[0012] As a further improvement of the present invention, the metal layer is a Ni layer or a Cu layer.
[0013] As a further improvement of the present invention, the plate is further provided with two oppositely disposed fourth surfaces connecting the first surface and the second surface. In step S3, the metal layer on the fourth surface is laser-processed until the insulating plate is exposed.
[0014] As a further improvement of the present invention, two groups of metal strips are provided on each third surface, which are respectively connected to the copper strips on the first surface and the second surface, and the two groups of metal strips are arranged at intervals. The two copper strips symmetrical to each other on the first surface and the second surface and the metal strips connected to the two ends of each copper strip form a group of electrodes, and multiple groups of electrodes are provided on the plate.
[0015] As a further improvement of the present invention, step S4 specifically comprises: electroplating Cu, Ni and Sn in sequence at multiple groups of electrodes.
[0016] As a further improvement of the present invention, the method further comprises step S5 of testing and packaging the inductor.
[0017] Another object of the present invention is to provide a transformer connection inductor prepared by the above-mentioned preparation method, which not only has low impedance and can adapt to large current, but also has high precision.
[0018] To achieve the above object, the present invention provides a transformer connection inductor, which is prepared by the above preparation method.
[0019] As a further improvement of the present invention, it also includes a circuit board, which is located on the third surface and electrically connects the ends of the multiple groups of electrodes.
[0020] The beneficial effects of the present invention are as follows: the present invention arranges a plurality of protruding and mutually symmetrical copper strips on the first and second surfaces of the plate, and both ends of each copper strip extend to connect with the corresponding third surface, and at the same time sputters a metal layer on the outer surface of the plate, and lasers the metal layer not covered with the copper strips on the first and second surfaces to expose the plate, and lasers the metal layers on the two third surfaces to form metal strips connected one by one with the plurality of copper strips, so that a plurality of groups of electrodes can be formed on the outer surface of the plate, and an inductor can be obtained at this time. Compared with the prior art, the preparation method of the present invention has a simple process, and the transformer connection inductor prepared has a low impedance, can adapt to large currents, and has high precision. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a flow chart of a method for preparing a transformer connection inductor of the present invention.
[0022] Figure 2 It is a schematic diagram of Example 1 of a method for preparing a transformer connection inductor according to the present invention.
[0023] Figure 3 yes Figure 1 Schematic diagram of embodiment 1 of step S1 in FIG.
[0024] Figure 4 yes Figure 1 Schematic diagram of embodiment 1 of step S2 in FIG.
[0025] Figure 5 yes Figure 1 Schematic diagram of embodiment 1 of step S3 in FIG.
[0026] Figure 6 It is a schematic diagram of Embodiment 2 of the method for preparing the transformer connection inductor of the present invention. DETAILED DESCRIPTION
[0027] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.
[0028] See also Figure 1 and Figure 5 As shown, the present invention discloses a method for preparing a transformer connection inductor. The preparation method has a simple process, and the transformer connection inductor 100 prepared by the preparation method has a low impedance, can adapt to large current, and has high precision.
[0029] Combination Figure 2-5 As shown, the first embodiment of the method for preparing the transformer connection inductor of the present invention specifically includes:
[0030] Step S1, selecting a plate (unnumbered), cutting the plate to obtain plate 1.
[0031] The plate 1 is preferably rectangular, and the size of the plate 1 can be obtained by cutting as needed. In this embodiment, the plate is cut by laser to ensure that the plate 1 has high precision. The plate 1 is provided with a first surface 11 and a second surface (not shown) arranged opposite to each other, and two third surfaces 12 arranged opposite to each other connecting the first surface 11 and the second surface. The first surface 11 and the second surface are provided with a plurality of protruding and mutually symmetrical copper bars 2, and the copper bars 2 play a conductive role. Both ends of each copper bar 2 extend to connect with the corresponding third surface 12, and each copper bar 2 is arranged perpendicular to the corresponding third surface 12. The plurality of copper bars 2 are evenly and spacedly arranged on the first surface 11 and the second surface along the extension direction of the plate 1.
[0032] The plate 1 is further provided with two oppositely disposed fourth surfaces 13 connecting the first surface 11 and the second surface, and the fourth surfaces 13 are parallel to the plurality of copper strips 2. In this embodiment, the plurality of copper strips 2 are pressed onto the plate, which is an insulating material, and the plate is cut to obtain the plate 1 with the copper strips 2, such as Figure 3 shown.
[0033] Step S2, performing sputtering treatment on the outer surface of the plate 1 to form a metal layer 3.
[0034] The metal layer 3 completely covers the third surface 12 of the plate 1 together with the plurality of copper strips 2. The metal layer 3 is a Ni layer or a Cu layer, which can increase the conductivity of the copper strips 2. Figure 4 shown.
[0035] In step S3, the metal layer 3 on the first surface 11 and the second surface that is not covered with the copper strips 2 is laser blasted until the plate 1 is exposed, and at the same time, the metal layer 3 on the two third surfaces 12 is laser blasted to form metal strips 31 that are connected to the multiple copper strips 2 in a one-to-one correspondence, so as to form multiple groups of electrodes 4 on the outer surface of the plate 1.
[0036] Preferably, in step S2, the first surface 11, the second surface and the two third surfaces 12 of the plate 1 are subjected to sputtering treatment to form the metal layer 3. On the first surface 11 and the second surface, only the copper strip 2 is subjected to sputtering treatment. However, even if the copper strip 2 is blocked by auxiliary tools such as baffles during the sputtering treatment, the metal layer 3 may still spread onto the plate 1. Therefore, in step S3, the metal layer 3 on the first surface 11 and the second surface that does not cover the copper strip 2, i.e., the spread metal layer 3, needs to be lasered until the plate 1 is exposed. Since the fourth surface 13 is not subjected to sputtering treatment in step S2, the fourth surface 13 does not need to be lasered in step S3.
[0037] Optionally, in step S2, the metal layer 3 may be sputtered on all outer surfaces of the plate 1. In this case, in step S3, the metal layers on the first surface 11 and the second surface not covered with the copper strip 2 and the metal layer 3 on the fourth surface 13 need to be laser-treated until the plate 1 is exposed.
[0038] like Figure 5As shown, two groups of metal strips 31 are provided on each third surface 12, which are respectively connected to the copper strips 2 on the first surface 11 and the second surface, and have good conductivity. The two groups of metal strips 31 are arranged at intervals. The two copper strips 2 symmetrical to each other on the first surface 11 and the second surface and the metal strips 31 connected to the two ends of each copper strip 2 form a group of electrodes 4, and multiple groups of electrodes 4 are provided on the plate 1. The preparation method of the present invention integrates multiple groups of electrodes 4 on the same plate 1, replacing the solution that requires multiple plates 1, saving costs, and because the plate 1 is thicker and has lower impedance, the copper layer is not deformed, has good conductivity, and can adapt to large currents. The number of groups of electrodes 4 on the plate 1 can be set according to actual needs, and there is no restriction on this.
[0039] Step S4, electroplating the plurality of electrodes 4 to obtain the inductor 100. Specifically, Cu, Ni and Sn are electroplated in sequence on the plurality of electrodes 4 to increase the solderability, solder resistance and adhesion of the electrodes 4.
[0040] Step S5, testing and packaging the inductor 100. Testing the size, insulation resistance and Rdc of the product to eliminate products with poor size and performance, and packaging good products.
[0041] Combination Figure 6 As shown, the second embodiment of the method for preparing the transformer connection inductor of the present invention is different from the first embodiment in that, in step S1, the plate can be directly selected as a PCB substrate, and the PCB substrate is not provided with a plurality of the copper strips 2. At this time, the PCB substrate is cut into required substrate blocks, a metal layer 3 is directly sputtered on the outer surface of the substrate block, and the metal layer 3 on the first surface 11 and the second surface of the substrate block is lasered to form a plurality of uniform and spaced conductive strips, and at the same time, the metal layer 3 on the two third surfaces is lasered to form metal strips 31 connected to the plurality of conductive strips in a one-to-one correspondence, and the two conductive strips symmetrically on the first surface 11 and the second surface and the metal strips 31 connected at both ends of each conductive strip form a group of electrodes 4, and a plurality of groups of electrodes 4 are formed on the substrate block.
[0042] The transformer connection inductor 100 of the present invention also includes a circuit board (not shown), which is a two-piece circuit board located on the two third surfaces 12 respectively, electrically connecting the ends of multiple groups of electrodes 4, and the metal strips 31 in each group of electrodes 4 are connected to the circuit board to achieve conduction.
[0043] In summary, the preparation method of the transformer connection inductor of the present invention is to set a plurality of protruding and mutually symmetrical copper strips 2 on the first surface 11 and the second surface of the plate 1, and both ends of each copper strip 2 extend to connect with the corresponding third surface 12, and at the same time, sputter the metal layer 3 on the outer surface of the plate 1, and laser the metal layer 3 on the first surface 11 and the second surface that is not covered with the copper strips 2 to expose the plate 1, and laser the metal layer 3 on the two third surfaces 12 to form metal strips 31 connected to the plurality of copper strips 2 in a one-to-one correspondence, and then form a plurality of groups of electrodes 4 on the outer surface of the plate 1, and then the inductor 100 can be obtained. Compared with the prior art, the preparation method of the present invention has a simple process, and the prepared transformer connection inductor 100 has a low impedance, can adapt to large currents, and has high precision.
[0044] The above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention.
Claims
1. A method for preparing a transformer connection inductor, characterized in that: include: Step S1, selecting a plate, cutting the plate to obtain a plate, wherein the plate is provided with a first surface and a second surface that are oppositely disposed, and two third surfaces that are oppositely disposed and connect the first surface and the second surface, wherein the first surface and the second surface are provided with a plurality of protruding and mutually symmetrical copper strips, and both ends of each copper strip extend to connect with the corresponding third surface; Step S2, performing sputtering treatment on the outer surface of the plate to form a metal layer; Step S3, laser lithography the metal layers on the first and second surfaces that are not covered with copper strips until the plate is exposed, and laser lithography the metal layers on the two third surfaces to form metal strips that are connected to the multiple copper strips in a one-to-one correspondence, so as to form multiple groups of electrodes on the outer surface of the plate; Step S4, electroplating the multiple groups of electrodes to obtain inductors.
2. The preparation method according to claim 1, characterized in that: In step S1, the plurality of copper bars are arranged evenly and at intervals on both the first surface and the second surface along the extension direction of the plate.
3. The preparation method according to claim 1, characterized in that: In step S2, the metal layer completely covers the third surface of the plate together with the plurality of copper strips.
4. The preparation method according to claim 3, characterized in that: The metal layer is a Ni layer or a Cu layer.
5. The preparation method according to claim 1, characterized in that: The plate is further provided with two fourth surfaces which are oppositely arranged and connect the first surface and the second surface. In step S3, the metal layer on the fourth surface is laser-processed until the plate is exposed.
6. The preparation method according to claim 1, characterized in that: Two groups of metal strips are provided on each third surface, which are respectively connected to the copper strips on the first surface and the second surface, and the two groups of metal strips are arranged at intervals. The two copper strips symmetrical to each other on the first surface and the second surface and the metal strips connected to the two ends of each copper strip form a group of electrodes, and multiple groups of electrodes are provided on the plate.
7. The preparation method according to claim 6, characterized in that: Step S4 specifically includes: electroplating Cu, Ni and Sn in sequence at the multiple groups of electrodes.
8. The preparation method according to claim 1, characterized in that: The method further comprises step S5 of testing and packaging the inductor.
9. A transformer connection inductor, characterized in that: The preparation method is applied to obtain the product according to any one of claims 1 to 8.
10. The transformer connection inductor according to claim 9, characterized in that: It also includes a circuit board, which is located on the third surface and electrically connects the ends of the multiple groups of electrodes.